An anti-falling device for silicon wafer coating

Abstract

The present invention discloses a anti-falling device for silicon wafer coating, comprising: a pin; a serrated pressing block disposed on the pin; a clamping device disposed on an external grasping device, which moves together with the external grasping device to insert the pin into a pin hole on a carrier plate or to disengage the pin from the pin hole. The invention uses a pin to replace the traditional cover plate structure, simplifies the mechanism for fixing the silicon wafer, and increases the convenience of automation implementation; the serrated design of the pressing block minimizes the area of pressing the silicon wafer, thereby increasing the overall coating area of the silicon wafer, invisibly increasing the power generation of each silicon battery, and thus increasing the final power generation; the overall circular non-angle design allows it to be placed at any angle, facilitating picking and placing; an electromagnet is used to firmly fix the silicon wafer, prevent the silicon wafer from falling or tilting at a large angle, and reduce the damage rate.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, and in particular to a anti-falling device for silicon wafer coating. Background Art

[0002] The current vertical coating equipment - hot wire CVD equipment, which is used for coating crystal silicon solar cells. For the silicon wafer used as the substrate for coating, generally, the way of using a cover plate (a large piece of material with holes opened according to product requirements) is adopted. Because the area of the cover plate is large, the cumulative error of each opening is relatively large. To maintain a good fixing effect, the designed area of the cover plate covering the silicon wafer will be large, resulting in waste of a part of the area of the silicon wafer. Summary of the Invention

[0003] The purpose of the present invention is to solve the above technical problems and provide an anti-falling device for silicon wafer coating.

[0004] The technical solution of the present invention: An anti-falling device for silicon wafer coating, comprising:

[0005] A pin;

[0006] A serrated pressure block, arranged on the pin;

[0007] A clamping device, arranged on an external grasping device, and moves together with the external grasping device to insert the pin into the pin hole on the carrier plate or to disengage the pin from the pin hole.

[0008] Preferably, the pin is composed of an upper positioning pin and a lower positioning pin, and the upper positioning pin is detachably connected to the lower positioning pin through a bolt.

[0009] Preferably, the bottom of the lower positioning pin is chamfered to be arc-shaped.

[0010] Preferably, the pin is a stainless steel pin.

[0011] Preferably, the clamping device includes a sleeve rod and an electromagnet. The bottom of the sleeve rod is open and penetrates to the middle of the sleeve rod, and the electromagnet is arranged inside the sleeve rod.

[0012] Preferably, the opening of the sleeve rod is chamfered to be arc-shaped.

[0013] The beneficial effects of the present invention are as follows: The present invention uses a pin to replace the traditional cover plate structure, simplifies the mechanism for fixing the silicon wafer, and increases the convenience of automation implementation; the serrated design of the pressing block minimizes the area of pressing the silicon wafer, thereby increasing the overall coating area of the silicon wafer, virtually increasing the power generation of each silicon cell, and thus increasing the final power generation; the overall circular and non-angled design allows for placement at any angle, facilitating picking and placing; the use of an electromagnet can firmly fix the silicon wafer, prevent the silicon wafer from falling or tilting at a large angle, and reduce the damage rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a three-dimensional view of the overall structure of a preferred embodiment of the present invention;

[0015] Figure 2 is a cross-sectional view of the pin in a preferred embodiment of the present invention;

[0016] Figure 3 is a cross-sectional view of the sleeve rod in a preferred embodiment of the present invention;

[0017] Figure 4 is a schematic diagram of preventing the silicon wafer from falling in a preferred embodiment of the present invention.

[0018] Reference numerals: pin 10, upper positioning pin 101, lower positioning pin 102, serrated pressing block 2, clamping device 3, sleeve rod 31, electromagnet 32. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0020] Refer to Figures 1 to 4 , an anti-falling device for silicon wafer coating, comprising:

[0021] Pin 10;

[0022] Serrated pressing block 2, arranged on the pin 10;

[0023] The clamping device 3 is arranged on an external grasping device and moves together with the external grasping device to insert the pin 10 into the pin hole on the carrier plate or to disengage the pin 10 from the pin hole. In the present invention, when the silicon wafer is vertically coated, several clamping devices 3 move together with the external grasping device to insert the pin 10 into the pin hole on the carrier plate. The clamping device 3 is disengaged from the pin 10, and several pins 10 are respectively left in the pin holes. The distance between one side of the end face of the serrated pressing block 2 and one side of the silicon wafer is about 0.2 mm, so that the tooth pressing block 2 does not completely adhere to the silicon wafer, ensuring that the silicon wafer will not fall off the carrier plate while not affecting the coating of the silicon wafer.

[0024] As a preferred embodiment of the present invention, it may further have the following additional technical features:

[0025] In this embodiment, the pin 10 is composed of an upper positioning pin 101 and a lower positioning pin 102. The upper positioning pin 101 is detachably connected to the lower positioning pin 102 by a bolt. Specifically, annular grooves are provided on both the upper positioning pin 101 and the lower positioning pin 102, and the serrated pressing block 2 is sleeved on the annular groove. By removing the bolt, the serrated pressing block 2 can be installed or removed.

[0026] In this embodiment, the bottom of the lower positioning pin 102 is chamfered to be arc-shaped, which is convenient for the lower positioning pin 102 to be inserted into the pin hole of the carrier plate.

[0027] In this embodiment, the pin 10 is a stainless steel pin, and a magnet is arranged in the pin hole of the carrier plate. The magnet and the electromagnet 32 can attract the pin 10 and are not easy to rust at the same time.

[0028] In this embodiment, the clamping device 3 includes a sleeve rod 31 and an electromagnet 32. The bottom of the sleeve rod 31 is open and penetrates to the middle of the sleeve rod 31. The electromagnet 32 is arranged in the sleeve rod 31. The sleeve rod 31 is arranged on the external grasping device. After the pin 10 is inserted into the pin hole of the carrier plate and is attracted by the magnet, the electromagnet 32 is powered off, and the sleeve rod 31 moves away from the carrier plate together with the external grasping device, and the pin 10 remains in the pin hole. When the pin 10 needs to be removed, one end of the pin 10 is inserted into the sleeve rod 31, the electromagnet 32 is powered on to attract the pin 10, and it can move together with the external grasping device.

[0029] In this embodiment, the opening of the sleeve rod 31 is chamfered to be arc-shaped, which is convenient for the pin 10 to be inserted into the sleeve rod 31.

[0030] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An anti-falling device for silicon wafer coating, characterized in that, Comprising: A pin (10), the pin (10) being composed of an upper positioning pin (101) and a lower positioning pin (102), and the upper positioning pin (101) being detachably connected to the lower positioning pin (102) by bolts; A serrated pressing block (2), arranged on the pin (10), and one side of the end face of the serrated pressing block being 0.2 mm away from one side of the silicon wafer during vertical coating of the silicon wafer; A clamping device (3), arranged on an external grasping device, moving together with the external grasping device to insert the pin (10) into a pin hole on a carrier plate or to disengage the pin (10) from the pin hole. The clamping device (3) includes a sleeve rod (31) and an electromagnet (32). The bottom of the sleeve rod (31) is open and penetrates to the middle of the sleeve rod (31), and the electromagnet (32) is arranged inside the sleeve rod (31).

2. The anti-falling device for silicon wafer coating according to claim 1, wherein: The bottom of the lower positioning pin (102) is chamfered to be arc-shaped.

3. The anti-falling device for silicon wafer coating according to claim 1, wherein: The pin (10) is a stainless steel pin.

4. The anti-falling device for silicon wafer coating according to claim 1, characterized in that: The opening of the sleeve rod (31) is chamfered to be arc-shaped.

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