Plate-shaped connector, dual-ring serial connector, and chip test assembly

Abstract

The present invention discloses a plate-shaped connector, a double-ring serial connector and a chip test assembly. The plate-shaped connector includes a plurality of double-ring serial connectors spaced apart from each other and an insulating layer. Each double-ring serial connector includes two carrying rings, two cantilevers extending from the two carrying rings and arranged in a coplanar manner, two abutment posts extending from the two cantilevers in opposite directions, and a bridge section connecting the two carrying rings. The insulating layer connects the carrying rings of the plurality of double-ring serial connectors, and the two abutment posts of each double-ring serial connector protrude from opposite sides of the insulating layer, respectively. Each double-ring serial connector abuts against two plates, respectively, through its two abutment posts. Accordingly, the chip test assembly can be more easily disassembled from each other by adopting the plate-shaped connector, so as to facilitate subsequent inspection and maintenance.

Description

Technical Field

[0001] The invention relates to a testing assembly, in particular to a plate-shaped connector and its double-ring serial connection piece and a chip testing assembly. Background Art

[0002] The conventional wafer testing device includes a testing circuit board electrically coupled to the testing machine and a signal transmission board disposed on the testing circuit board, and the signal transmission board is welded and fixed to the testing circuit board in the conventional wafer testing device. However, during the welding and fixing process of the signal transmission board and the testing circuit board, the conventional wafer testing device is easily damaged by thermal shock. Moreover, the signal transmission board and the testing circuit board welded and fixed to each other are not conducive to subsequent inspection and maintenance of the same.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a plate-shaped connector and a double-ring serial connection member and a wafer testing assembly, which can effectively improve the defects that may occur in the existing wafer testing device.

[0005] The embodiment of the present invention discloses a chip test assembly, which includes a signal transmission board, a test circuit board and a plate-shaped connector. The signal transmission board includes a plurality of connection pads, and the signal transmission board is used to connect to a probe head; a test circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to electrically couple to a test machine; a plate-shaped connector is clamped between the signal transmission board and the test circuit board; wherein the plate-shaped connector includes a plurality of double-ring serial connectors and an insulating layer. The plurality of double-ring serial connectors are arranged at intervals from each other and each includes a first abutting section, a second abutting section and a bridging section. The first abutment section includes a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first abutment column formed by extending from the first cantilever along a first direction; a second abutment section includes a second supporting ring, a second cantilever extending from the inner side wall of the supporting ring, and a second abutment column formed by extending from the second cantilever along a second direction opposite to the first direction; and a bridging section connecting the first supporting ring and the second supporting ring; and an insulating layer connecting the first supporting ring and the second supporting ring of a plurality of dual-ring series connectors, and the first abutment column and the second abutment column of each dual-ring series connector protrude from opposite sides of the insulating layer respectively; wherein the first abutment columns of the plurality of dual-ring series connectors respectively abut against a plurality of connection pads of the signal transmission board, and the second abutment columns of the plurality of dual-ring series connectors respectively abut against a plurality of metal pads of the test circuit board; wherein the signal transmission board and the test circuit board can be electrically coupled to each other through a plate-shaped connector.

[0006] Preferably, in any double-ring series connection component, the first cantilever includes a first lever arm portion connected to the corresponding inner side wall and a first free end portion extending from the first lever arm portion, the first top support column is integrally connected to the first free end portion, and the first top support column and the inner side wall portion to which it extends are spaced apart by a distance between 100 microns (μm) and 600 microns; and the second cantilever includes a second lever arm portion connected to the inner side wall and a second free end portion extending from the second lever arm portion, the second top support column is integrally connected to the second free end portion, and the second top support column and the inner side wall portion to which it extends are spaced apart by a distance between 100 microns and 600 microns.

[0007] Preferably, in any double-ring serial connection member, the first arm portion is formed with a first adjustment hole extending from the first free end portion to the corresponding inner side wall and penetrating therethrough.

[0008] Preferably, in any double-ring serial connector, the first top support column has a first height compared to the first free end, and the first height is 100% to 300% of the thickness of the first free end, and the second top support column has a second height compared to the second free end, and the second height is 100% to 300% of the thickness of the second free end.

[0009] Preferably, the chip testing assembly further includes a screw set, and the signal transmission board, the plate-shaped connector and the test circuit board are fixed through the screw set to maintain relative positions with each other; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved by any welding material.

[0010] Preferably, the insulating layer is formed with a plurality of through-holes, each double-ring serial connector includes at least one first residual arm extending from the outer side wall of the first supporting ring, and the free end of at least one first residual arm of each double-ring serial connector is exposed in a truncated hole.

[0011] Preferably, the bridge section of each double-ring series connector is buried in the insulating layer.

[0012] Preferably, in any double-ring serial connector, the signal transmission board and the test circuit board are pressed against the first top support column and the second top support column of the plate-shaped connector so that the first cantilever and the second cantilever are elastically bent, so that the two ends of any one of the first top support column and the second top support column protrude from opposite sides of the insulating layer respectively.

[0013] An embodiment of the present invention also discloses a plate-like connector, which is used to be clamped between two plates so that they can be electrically coupled to each other. The plate-like connector includes: a plurality of double-ring serial connectors, which are arranged at intervals from each other and each includes: a first abutment section, which includes a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first top abutment column formed by extending from the first cantilever along a first direction; a second abutment section, which includes a second supporting ring, a second cantilever extending from the inner side wall of the supporting ring, and a second top abutment column formed by extending from the second cantilever along a second direction opposite to the first direction; and a bridging section, connecting the first supporting ring and the second supporting ring; and an insulating layer, connecting the first supporting ring and the second supporting ring of the plurality of double-ring serial connectors, and the first top abutment column and the second top abutment column of each double-ring serial connector respectively protrude from opposite sides of the insulating layer; wherein the first top abutment columns of the plurality of double-ring serial connectors abut against one of the two plates, and the second top abutment columns of the plurality of double-ring serial connectors abut against the other of the two plates.

[0014] An embodiment of the present invention further discloses a double-ring serial connector of a plate-like connector, which is used to be clamped between two plates so that they can be electrically coupled to each other. The double-ring serial connector includes: a first abutment section, including a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first top abutment column formed by extending from the first cantilever along a first direction; a second abutment section, including a second supporting ring, a second cantilever extending from the inner side wall of the supporting ring, and a second top abutment column extending from the second cantilever along a second direction opposite to the first direction; and a bridging section connecting the first supporting ring and the second supporting ring; wherein the first top abutment column of the double-ring serial connector abuts against one of the two plates, and the second top abutment columns of multiple double-ring serial connectors abut against the other of the two plates.

[0015] In summary, the plate-shaped connector, its double-ring serial connector, and the chip test assembly disclosed in the embodiment of the present invention use the first abutting column and the second abutting column to be respectively matched with the first cantilever and the second cantilever to elastically abut against two plates (such as the signal transmission board and the test circuit board), so there is no need to use welding. Furthermore, since the double-ring serial connector is detachably crimped to the two plates, the components of the chip test assembly can be easily disassembled from each other, so as to facilitate the subsequent inspection and maintenance of the chip test assembly.

[0016] Furthermore, in the plate-like connector and its dual-ring serial connector and chip testing assembly disclosed in the embodiments of the present invention, the first cantilever and the second cantilever are structurally designed to be coplanar with the first supporting ring and the second supporting ring respectively, which not only helps to improve the production yield, but also when the first cantilever (or the second cantilever) is bent under force, the stress will be evenly dispersed in the first cantilever (or the second cantilever), thereby effectively reducing the probability of the first cantilever or the second cantilever breaking from the first supporting ring or the second supporting ring.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 4 is a cross-sectional schematic diagram of a wafer testing assembly according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 The exploded diagram of the probe head is omitted.

[0020] Figure 3 for Figure 1 An enlarged schematic diagram of site III.

[0021] Figure 4 for Figure 3 An enlarged schematic diagram of another method.

[0022] Figure 5 FIG. 4 is a schematic three-dimensional diagram of a plate-shaped connector according to an embodiment of the present invention.

[0023] Figure 6 for Figure 5 Schematic top view of .

[0024] Figure 7 for Figure 5 A partial three-dimensional schematic diagram of .

[0025] Figure 8 FIG. 1 is a three-dimensional schematic diagram of another implementation of the plate-shaped connector according to an embodiment of the present invention.

[0026] Fig. 9 FIG. 1 is a schematic top view of another implementation of the plate-shaped connector according to an embodiment of the present invention.

[0027] Fig.10 It is a three-dimensional schematic diagram of another implementation manner of the plate-shaped connector according to the embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following is an explanation of the implementation methods of the "plate-shaped connector and its dual-ring serial connector and chip test assembly" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0029] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0030] See also Figures 1 to 10 As shown, it is an embodiment of the present invention. Among them, Figures 1 to 10 The dimensions of the components shown in the figure are for illustration only and may be adjusted according to design requirements (eg, the length of the components may be extended outwards) and are not limited to those shown in the drawings.

[0031] like Figures 1 to 4 As shown, this embodiment discloses a chip testing assembly 100, which includes a signal transmission board (space transformer) 1, a test circuit board 2 spaced apart from the signal transmission board 1, a plate-shaped connector 3 located between the signal transmission board 1 and the test circuit board 2, a probe head 4 connected to the signal transmission board 1, and a screw set 5.

[0032] In this embodiment, the signal transmission board 1, the plate-shaped connector 3 and the test circuit board 2 are fixed by the screw group 5 to maintain relative positions with each other, so that any electrical transmission path between the test circuit board 2, the plate-shaped connector 3 and the signal transmission board 1 can be achieved without any welding material, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the chip test assembly 100 can also omit the screw group 5 or replace the screw group 5 with other components (such as: the various components of the chip test assembly 100 are fixed by bonding).

[0033] It should be noted that, although the plate-shaped connector 3 is described in this embodiment in combination with the signal transmission board 1, the test circuit board 2, the probe head 4 and the screw group 5, the present invention is not limited thereto. For example, in other embodiments of the present invention, the plate-shaped connector 3 can also be used alone (e.g., sold) or used in combination with other components (e.g., the plate-shaped connector 3 is used to clamp between two boards so that the two boards can be electrically coupled to each other). The following will introduce the structure of each component of the chip test assembly 100 in this embodiment and its connection relationship.

[0034] like Figure 1 and Figure 2 As shown, the signal transmission board 1 has a top surface 11 and a bottom surface 12 located on opposite sides, and the top surface 11 of the signal transmission board 1 is used to connect to the probe head 4, and the bottom surface 12 of the signal transmission board 1 faces the plate-shaped connector 3. The signal transmission board 1 is provided with a plurality of connection pads 13 on the bottom surface 12, and the plurality of connection pads 13 can be electrically coupled to the probe head 4. In addition, in other embodiments not shown in the present invention, the signal transmission board 1 can also be a multi-layer structure, for example: the signal transmission board 1 can further include a functional board with an impedance matching effect.

[0035] The test circuit board 2 is used to be electrically coupled to a test machine (not shown), and the test circuit board 2 has a surface (e.g. Figure 2 The top surface of the test circuit board 2 in the figure includes a plurality of metal pads 21 arranged at intervals, and the arrangement of the plurality of metal pads 21 of the test circuit board 2 roughly corresponds to the arrangement of the plurality of connection pads 13 of the signal transmission board 1, but the present invention is not limited to this. Accordingly, the plurality of metal pads 21 are electrically coupled to the test machine to analyze the signal received by the test circuit board 2 through the test machine. It should be noted that the electrical coupling method between the test circuit board 2 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 2 can also be directly integrated into the test machine.

[0036] The plate-shaped connector 3 is clamped between the signal transmission board 1 and the test circuit board 2, so that the signal transmission board 1 and the test circuit board 2 can be electrically coupled to each other through the plate-shaped connector 3. The force of clamping the plate-shaped connector 3 by the signal transmission board 1 and the test circuit board 2 can be adjusted by the screw group 5; that is, the distance between the signal transmission board 1 and the test circuit board 2 can be adjusted by the screw group 5, so as to control the force of clamping the plate-shaped connector 3.

[0037] In more detail, Figures 2 to 4 As shown, the plate-shaped connector 3 includes a plurality of double-ring serial connectors 31 spaced apart from each other and an insulating layer 32 for fixing the plurality of double-ring serial connectors 31. It should be noted that the plate-shaped connector 3 in this embodiment is illustrated by a plurality of the double-ring serial connectors 31 in combination with the insulating layer 32, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the double-ring serial connector 31 may also be used alone (e.g., sold) or used in combination with other components (e.g., the double-ring serial connector 31 may be used in combination with serial connectors of different structures; or, the double-ring serial connector 31 may be used to be clamped between two plates so that the two plates can be electrically coupled to each other).

[0038] Furthermore, since the structures of the plurality of double-ring type serial connectors 31 are substantially the same in this embodiment, for the sake of convenience, the following only introduces the structure of one of the double-ring type serial connectors 31, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the structures of the plurality of double-ring type serial connectors 31 may also be different. The following will first describe the structure of the double-ring type serial connector 31 when it is not subjected to external force.

[0039] like Figures 5 to 7 As shown, the double-ring series connector 31 in this embodiment is an integrally formed single-piece conductive component, and the outer surface of the double-ring series connector 31 is preferably plated with a nickel-gold layer, but the present invention is not limited thereto. The double-ring series connector 31 includes a first abutting section 31a, a second abutting section 31b, and a bridge section 31c connecting the first abutting section 31a and the second abutting section 31b.

[0040] The first contact section 31a includes a first supporting ring 311a, a first cantilever 312 extending from the inner side wall 3111a of the first supporting ring 311a, a first top supporting column 314 extending from the first cantilever 312, and at least one first residual arm 316a extending from the first supporting ring 311a (outer side wall). Furthermore, the second contact section 31b includes a second supporting ring 311b, a second cantilever 313 extending from the inner side wall 3111b of the second supporting ring 311b, a second top supporting column 315 extending from the second cantilever 313, and at least one second residual arm 316b extending from the second supporting ring 311b (outer side wall). In addition, the bridge section 31c connects the first supporting ring 311a and the second supporting ring 311b (adjacent portions to each other), so that the first contact section 31a and the second contact section 31b can be electrically coupled to each other through the bridge section 31c, but the present invention is not limited to the above.

[0041] For example, in other embodiments not shown in the present invention, the double-ring serial connection element 31 may also omit at least one of the first residual arm 316a and / or at least one of the second residual arm 316b, and the first supporting ring 311a and / or the second supporting ring 311b may be a non-square ring structure. Figure 8 As shown, the first cantilever 312 and the second cantilever 313 may be connected to the inner side walls 3111a and 3111b at the same side (eg: Figure 8 The left side of the first carrier ring 311a and the left side of the second carrier ring 311b).

[0042] It should be noted that in a corresponding case which is different from the present invention and not shown, a supporting ring is angularly connected to at least one inclined cantilever. When at least one of the inclined cantilever is bent under force, stress will be concentrated at the connection point between at least one of the inclined cantilever and the supporting ring, which may easily cause at least one of the inclined cantilever to break from the above-mentioned connection point.

[0043] However, in this embodiment, if Figures 5 to 7 As shown, the first cantilever 312 and the second cantilever 313 are defined to be coplanar with the first supporting ring 311a and the second supporting ring 311b respectively; that is, the upper surface of the first cantilever 312 and the upper surface of the second cantilever 313 are coplanar with the upper surface of the first supporting ring 311a and the upper surface of the second supporting ring 311b respectively, and the lower surface of the first cantilever 312 and the lower surface of the second cantilever 313 are coplanar with the lower surface of the first supporting ring 311a and the lower surface of the second supporting ring 311b respectively.

[0044] Accordingly, the first cantilever 312 and the second cantilever 313 in this embodiment are designed to be coplanar with the first carrier ring 311a and the second carrier ring 311b respectively, which can not only help improve the production yield, but also when the first cantilever 312 (or the second cantilever 313) is bent by force, the stress will be evenly distributed in the first cantilever 312 (or the second cantilever 313), thereby effectively reducing the probability of the first cantilever 312 or the second cantilever 313 breaking from the first carrier ring 311a or the second carrier ring 311b. In other words, any cantilever that is not coplanar with the carrier ring is different from the first cantilever 312 or the second cantilever 313 referred to in this embodiment.

[0045] In more detail, Figures 5 to 7As shown, the first cantilever 312 and the second cantilever 313 are arranged opposite to each other in this embodiment (e.g., the first cantilever 312 and the second cantilever 313 are respectively connected to the opposite sides of the inner sidewalls 3111a and 3111b), and the first cantilever 312 and the second cantilever 313 are arranged along a straight line, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first cantilever 312 and the second cantilever 313 can have different lengths according to design requirements; or, as Fig. 9 As shown, the first cantilever 312 and the second cantilever 313 may not be arranged along any straight line direction.

[0046] Furthermore, if Figures 5 to 7 As shown, the first top support column 314 is formed by extending from (the upper surface of) the first cantilever 312 along a first direction D1, and the second top support column 315 is formed by extending from (the lower surface of) the second cantilever 313 along a second direction D2 opposite to the first direction D1, and the outer shape of the first top support column 314 and the outer shape of the second top support column 315 are substantially equal in this embodiment, but the present invention is not limited to this.

[0047] Furthermore, in order to enable the dual-ring serial connector 31 to correspond to the signal transmission board 1 and the test circuit board 2 and have better mechanical properties and electrical transmission effects, the dual-ring serial connector 31 preferably meets at least one of the following conditions, but the present invention is not limited thereto. That is to say, in other embodiments not shown in the present invention, the dual-ring serial connector 31 may not meet any of the following conditions.

[0048] The first cantilever 312 has an equal thickness and includes a first lever portion 3121 connected to the corresponding inner side wall 3111a and a first free end portion 3122 extending from the first lever portion 3121, and the first lever portion 3121 is formed with a first adjustment hole 3123 extending from the first free end portion 3122 to the corresponding inner side wall 3111a and penetrating therethrough, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first adjustment hole 3123 may also be spaced a distance from the first free end portion 3122 (or the corresponding inner side wall 3111a).

[0049] Accordingly, the first arm portion 3121 is divided into two arms by the first adjustment hole 3123, thereby providing a better balance for the first free end portion 3122. Furthermore, the first arm portion 3121 can effectively control the elasticity performance it can provide by changing the size and shape of the first adjustment hole 3123, thereby meeting different design requirements.

[0050] The first top support column 314 is integrally connected to the first free end portion 3122, and the first top support column 314 is spaced from the inner side wall 3111a portion from which it extends by a distance D314 ranging from 100 μm to 600 μm; that is, the length of the first force arm portion 3121 can be approximately between 100 μm and 600 μm, but the present invention is not limited thereto. Furthermore, the first top support column 314 has a first thickness T1 compared to the first free end portion 3122, and the first thickness T1 is 100% to 300% of the thickness T3122 of the first free end portion 3122.

[0051] The second cantilever 313 has an equal thickness and includes a second lever portion 3131 connected to the corresponding inner side wall 3111b and a second free end portion 3132 extending from the second lever portion 3131. The second lever portion 3131 is formed with a second adjustment hole 3133 extending from the second free end portion 3132 to the corresponding inner side wall 3111b and penetrating therethrough, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the second adjustment hole 3133 may also be separated from the second free end portion 3132 (or the corresponding inner side wall 3111b) by a distance.

[0052] Accordingly, the second arm portion 3131 is divided into two arms by the second adjustment hole 3133, thereby providing a better balance for the second free end portion 3132. Furthermore, the second arm portion 3131 can effectively control the elasticity performance it can provide by changing the size and shape of the second adjustment hole 3133, thereby meeting different design requirements.

[0053] The second top support column 315 is integrally connected to the second free end portion 3132, and the second top support column 315 is separated from the inner side wall 3111b portion from which it extends by a distance D315 ranging from 100 microns to 600 microns; that is, the length of the second force arm portion 3131 can be approximately between 100 microns and 600 microns, but the present invention is not limited thereto. The second top support column 315 has a second thickness T2 compared to the second free end portion 3132, and the second thickness T2 is 100% to 300% of the thickness T3132 of the second free end portion 3132.

[0054] In addition, the double-ring serial connector 31 can be respectively pressed against two boards (such as the signal transmission board 1 and the test circuit board 2) through the first pressing column 314 and the second pressing column 315, and the end edge of the first pressing column 314 and the end edge of the second pressing column 315 used to press against the above two boards are arc surfaces in this embodiment, but they can be adjusted and changed according to design requirements and are not limited to this embodiment. For example, in other embodiments not shown in the present invention, the end edge of the first pressing column 314 (or the second pressing column 315) can be a slope; or, as Fig.10 As shown, the end edge of the first abutting column 314 (or the second abutting column 315) may include a plurality of protrusion structures.

[0055] The insulating layer 32 is made of a high temperature resistant material in this embodiment, for example, the insulating layer 32 can be made of a plastic that can withstand temperatures above 300 degrees Celsius. The insulating layer 32 is connected to (or embedded with) the first carrier ring 311a, the second carrier ring 311b, the bridge section 31c, at least one first residual arm 316a, and at least one second residual arm 316b of each of the double-ring serial connectors 31.

[0056] In this embodiment, the insulating layer 32 can be connected to each of the double-ring serial connectors 31 by molding or gluing, so that the first supporting ring 311a, the second supporting ring 311b, the bridging section 31c, at least one first residual arm 316a, and at least one second residual arm 316b of each of the double-ring serial connectors 31 are equivalent to being buried in the insulating layer 32. Furthermore, the first top support column 314 and the second top support column 315 of each of the double-ring serial connectors 31 protrude from opposite sides of the insulating layer 32, respectively.

[0057] In more detail, the insulating layer 32 is formed with a plurality of through-shaped truncation holes 321, and there is a truncation hole 321 between any two adjacent double-ring serial connectors 31, and the free end of at least one of the first residual arms 316a and the free end of at least one of the second residual arms 316b of each of the double-ring serial connectors 31 are exposed in one of the truncation holes 321. To put it another way, before the multiple cut-off holes 321 are formed in the insulating layer 32 of the plate-like connector 3, at least two of the residual arms of any two adjacent double-ring serial connectors 31 (such as the adjacent first residual arms 316a and the second residual arms 316b) are connected to each other, so as to facilitate the production of multiple double-ring serial connectors 31; and then, by forming multiple cut-off holes 321 in the insulating layer 32, at least two of the residual arms of any two adjacent double-ring serial connectors 31 (such as the adjacent first residual arms 316a and the second residual arms 316b) are disconnected from each other and electrically isolated from each other.

[0058] The above is a structural description of the signal transmission board 1, the test circuit board 2 and the plate-shaped connector 3. The following is an introduction to the connection relationship between the signal transmission board 1, the test circuit board 2 and the plate-shaped connector 3. Among them, the first abutting columns 314 of the plurality of the double-ring serial connectors 31 respectively abut against the plurality of the connection pads 13 of the signal transmission board 1, and the second abutting columns 315 of the plurality of the double-ring serial connectors 31 respectively abut against the plurality of the metal pads 21 of the test circuit board 2. In other words, the first abutting column 314 of any of the double-ring serial connectors 31 abuts against one of the two plates, and the second abutting column 315 of any of the double-ring serial connectors 31 abuts against the other of the two plates.

[0059] Furthermore, in any of the double-ring serial connectors 31 of the present embodiment, the signal transmission board 1 and the test circuit board 2 are pressed against the first top support column 314 and the second top support column 315 of the plate-shaped connector 3, so that the first cantilever 312 and the second cantilever 313 are elastically bent, and the two ends of any one of the first top support column 314 and the second top support column 315 protrude from the opposite sides of the insulating layer 32 (e.g., Figure 4 ), thereby effectively reducing the overall thickness of the plate-shaped connector 3, but the present invention is not limited thereto. For example, the force of the plate-shaped connector 3 being pressed by the signal transmission board 1 and the test circuit board 2 can be adjusted according to design requirements (e.g.: Figure 3 ).

[0060] like Figure 1As shown, the probe head 4 is disposed on the top surface 11 of the signal transmission board 1, and the probe head 4 can be electrically coupled to the test circuit board 2 through the signal transmission board 1 and the plate-shaped connector 3. The probe head 4 includes a positioning seat 41 and a plurality of conductive probes 42 passing through and set in the positioning seat 41. One end of each conductive probe 42 (e.g.: Figure 1 The bottom end of the conductive probe 42 in the conductive probe 42 passes through the positioning seat 41 and abuts against the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 42 (such as: Figure 1 The top end of the conductive probe 42 in the conductive probe 42 passes through the positioning base 41 and is used to abut against an object to be tested (such as a semiconductor chip).

[0061] It should be noted that the conductive probe 42 in this embodiment is a conductive and flexible long strip structure, but the conductive probe 42 of the present invention is not limited to a rectangular conductive probe, a circular conductive probe, or a conductive probe of other structures. In addition, the probe head 4 in this embodiment is described as a vertical probe head, but the specific structure of the probe head 4 can be adjusted and changed according to design requirements, and the present invention is not limited here.

[0062] [Technical Effects of Embodiments of the Invention]

[0063] In summary, in the plate-shaped connector and its double-ring serial connector and wafer test assembly disclosed in the embodiment of the present invention, the first abutting column and the second abutting column are respectively matched with the first cantilever and the second cantilever to elastically abut against two plates (such as the signal transmission board and the test circuit board), so there is no need to use welding. Furthermore, since the double-ring serial connector is detachably crimped to the two plates, the components of the wafer test assembly can be easily disassembled from each other, so as to facilitate the subsequent inspection and maintenance of the wafer test assembly.

[0064] Furthermore, in the plate-like connector and its dual-ring serial connector and chip testing assembly disclosed in the embodiments of the present invention, the first cantilever and the second cantilever are structurally designed to be coplanar with the first supporting ring and the second supporting ring respectively, which not only helps to improve the production yield, but also when the first cantilever (or the second cantilever) is bent under force, the stress will be evenly dispersed in the first cantilever (or the second cantilever), thereby effectively reducing the probability of the first cantilever or the second cantilever breaking from the first supporting ring and the second supporting ring.

[0065] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A wafer testing assembly, characterized in that: The wafer testing assembly comprises: a signal transmission board including a plurality of connection pads, and the signal transmission board is used to connect to a probe head; A test circuit board includes a plurality of metal pads arranged at intervals, and the test circuit board is used to be electrically coupled to a test machine; and A plate-shaped connector, clamped between the signal transmission board and the test circuit board; wherein the plate-shaped connector includes: A plurality of double-ring series connection members are arranged at intervals from each other and each comprises: A first abutting section includes a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first abutting column extending from the first cantilever along a first direction; a second abutment section, comprising a second supporting ring, a second cantilever extending from the inner side wall of the supporting ring, and a second abutment column extending from the second cantilever along a second direction opposite to the first direction; and a bridging section connecting the first supporting ring and the second supporting ring; and an insulating layer, connecting the first supporting ring and the second supporting ring of a plurality of the double-ring series-connecting elements, and the first top supporting column and the second top supporting column of each of the double-ring series-connecting elements protrude from opposite sides of the insulating layer respectively; The first abutting columns of the plurality of double-ring series connectors abut against the plurality of connection pads of the signal transmission board respectively, and the second abutting columns of the plurality of double-ring series connectors abut against the plurality of metal pads of the test circuit board respectively; The signal transmission board and the test circuit board can be electrically coupled to each other through the plate-shaped connector.

2. The wafer testing assembly according to claim 1, characterized in that: In any of the double-ring series-connecting parts, the first cantilever includes a first lever arm portion connected to the corresponding inner side wall and a first free end portion extending from the first lever arm portion, the first top support column is integrally connected to the first free end portion, and the first top support column is spaced apart from the inner side wall portion to which it extends by a distance between 100 microns and 600 microns; and the second cantilever includes a second lever arm portion connected to the inner side wall and a second free end portion extending from the second lever arm portion, the second top support column is integrally connected to the second free end portion, and the second top support column is spaced apart from the inner side wall portion to which it extends by a distance between 100 microns and 600 microns.

3. The wafer testing assembly according to claim 2, characterized in that: In any of the double-ring serial connecting parts, the first arm portion is formed with a first adjustment hole extending from the first free end portion to the corresponding inner side wall and penetrating therethrough.

4. The wafer testing assembly according to claim 2, wherein: In any of the double-ring serial connectors, the first top support column has a first height compared to the first free end, and the first height is 100% to 300% of the thickness of the first free end; the second top support column has a second height compared to the second free end, and the second height is 100% to 300% of the thickness of the second free end.

5. The wafer testing assembly according to claim 1, wherein: The chip testing assembly further includes a screw set, and the signal transmission board, the plate-shaped connector and the test circuit board are fixed through the screw set to maintain relative positions with each other; any electrical transmission path between the test circuit board, the plate-shaped connector and the signal transmission board is not achieved by any welding material.

6. The wafer testing assembly according to claim 1, wherein: The insulating layer is formed with a plurality of through-holes, each of the double-ring serial connectors includes at least one first residual arm extending from the outer side wall of the first supporting ring, and a free end of at least one first residual arm of each double-ring serial connector is exposed in one of the cut-off holes.

7. The wafer testing assembly according to claim 1, wherein: The bridge section of each of the double-ring series connectors is buried in the insulating layer.

8. The wafer testing assembly according to claim 1, wherein: In any one of the double-ring serial connectors, the signal transmission board and the test circuit board press on the first top support column and the second top support column of the plate-shaped connector so that the first cantilever and the second cantilever are elastically bent, and the two ends of any one of the first top support column and the second top support column protrude from the opposite sides of the insulating layer respectively.

9. A plate-shaped connector, characterized in that: The plate-shaped connector is used to be clamped between two plates so that they can be electrically coupled to each other, and the plate-shaped connector includes: A plurality of double-ring series connection members are arranged at intervals from each other and each comprises: A first abutting section includes a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first abutting column extending from the first cantilever along a first direction; a second abutment section, comprising a second supporting ring, a second cantilever extending from the inner side wall of the supporting ring, and a second abutment column extending from the second cantilever along a second direction opposite to the first direction; and a bridging section connecting the first supporting ring and the second supporting ring; and an insulating layer, connecting the first supporting ring and the second supporting ring of a plurality of the double-ring series-connecting elements, and the first top supporting column and the second top supporting column of each of the double-ring series-connecting elements protrude from opposite sides of the insulating layer respectively; Wherein, the first abutting columns of the plurality of double-ring serial connectors abut against one of the two plates, and the second abutting columns of the plurality of double-ring serial connectors abut against the other of the two plates.

10. A double-ring serial connection piece of a plate-shaped connector, characterized in that: The double-ring serial connector of the plate-shaped connector is used to be clamped between two plates so that they can be electrically coupled to each other. The double-ring serial connector includes: A first abutting section includes a first supporting ring, a first cantilever extending from the inner side wall of the first supporting ring, and a first abutting column extending from the first cantilever along a first direction; a second abutment section, comprising a second supporting ring, a second cantilever extending from an inner side wall of the supporting ring, and a second abutment column extending from the second cantilever along a second direction opposite to the first direction; and a bridging section, connecting the first carrying ring and the second carrying ring; Wherein, the first abutting column of the double-ring serial connection member abuts against one of the two plates, and the second abutting columns of the plurality of double-ring serial connection members abut against the other of the two plates.

Images