Resin sealing device and resin sealing method

Abstract

The present invention provides a resin sealing device and a resin sealing method. The resin sealing device supplies an appropriate amount of sheet resin to each workpiece, thereby preventing the generation of resin dust, improving the molding quality, and preventing the generation of useless resin in the molded product. The present invention comprises: a resin supply unit (14) for cutting out an appropriate amount of sheet resin (R) in a single compression molding process from an elongated resin sheet (R0) formed into a certain width and thickness according to the required resin amount for each workpiece (W); and a conveying unit (E) for conveying the appropriate amount of sheet resin (R) supplied by the resin supply unit (14) to a sealing mold (2).

Description

Technical Field

[0001] The present invention relates to a resin sealing device and a resin sealing method for supplying an appropriate amount of sheet-shaped resin to each workpiece in which electronic components are mounted on a plate-shaped member and performing compression molding. Background Art

[0002] As a method of using thermosetting resin to resin-seal a workpiece equipped with a semiconductor chip or electronic components, there are two molding methods: transfer molding and compression molding. Transfer molding mainly involves filling a heated and molten resin using a mini tablet (solid resin) into a mold cavity through a runner and a gate. In addition, in compression molding, liquid resin, granular resin, and sheet resin are used. At present, in terms of cost and processing, liquid resin and granular resin are mostly used (see Patent Document 1 and Patent Document 2). In addition, sheet resin or powder resin used for compression molding is in the development stage and has not yet been mass-produced in the field of resin sealing of semiconductor devices.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-208967

[0006] [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-179507 Summary of the Invention

[0007] [Problems to be solved by the invention]

[0008] In recent years, the thickness of the packaging part (resin sealing part) has become thinner. In particular, when resin sealing is performed on workpieces with semiconductor chips wired thereto, compression molding with a movable lower mold cavity, which is almost free of resin flow, has become the mainstream compared to compression molding with a movable upper mold cavity. In addition, even in compression molding with a movable lower mold cavity, there is an increasing demand for compression molding with an appropriate amount of resin, where the resin usage is set to 100% without any excess resin. The reason for this is that depending on the workpiece, there are areas where the semiconductor chip is not mounted on the substrate, and the amount of semiconductor chips mounted on each workpiece varies, requiring the resin supply to be increased or decreased to achieve an appropriate amount of supply each time. In order to perform appropriate molding, there is also a method of anticipating excess resin in advance and allowing the excess resin to overflow into an overflow cavity for molding. However, if the resin is discharged across the substrate, a problem such as longitudinal resin burrs will occur on the side of the substrate. In addition, an overflow cavity is sometimes provided on the substrate, but this requires providing an excess resin area on the substrate, which increases the cost of the substrate.

[0009] Resins used in compression molding come in various forms, including powdered resin, granular resin, and liquid resin. However, powdered resin is difficult to handle due to dust generation, while liquid resin has a high viscosity, making it difficult to consistently supply the resin to the mold, which can lead to poor molding. Granular resins are easy to supply in appropriate quantities, eliminating waste and the cost of discarding unused resin.

[0010] However, the outer diameter of granular resin particles varies, causing some variation, making it difficult to make minute adjustments. Furthermore, the varying sizes of the particles can easily lead to variations in the distribution of the particles. When falling from the trough, the particles can get stuck or splash after falling, making it difficult to distribute the particles evenly and thinly.

[0011] Furthermore, when the thickness of the package (resin seal) decreases and the amount of resin supplied to the cavity decreases, large resin particle sizes require sparse, spaced-apart distribution, making it difficult to evenly distribute the resin. Furthermore, when supplying granular resin, the resin is dispersed by vibrating a parts feeder while being dropped from a groove aligned with the cavity shape. This causes the granular resin to rub against each other, causing dust to fly. Even with air extraction or an ionizer, it's difficult to completely remove the fine dust. If this dust adheres to the component and solidifies, it can cause malfunctions, or if it adheres to the substrate, it can cause dents in the sealing mold.

[0012] [Technical means to solve the problem]

[0013] The present invention has been made in view of the above situation, and its object is to provide a resin sealing device and a resin sealing method that can supply an appropriate amount of sheet resin to each workpiece, thereby improving the molding quality without generating resin dust and preventing waste resin from being generated in the molded product.

[0014] A resin sealing device is provided for conveying a workpiece having electronic components mounted on a plate-like member and a sheet of resin into a sealing mold for compression molding. The resin sealing device comprises: a resin supply unit for cutting out an appropriate amount of sheet resin in a prescribed shape according to the form of the workpiece, from a slender resin sheet formed to a predetermined thickness in accordance with the required resin amount for each workpiece, so as to ensure that there is neither excess nor deficiency in a single compression molding, and for supplying the sheet resin; and a conveying unit for conveying the appropriate amount of sheet resin supplied by the resin supply unit to the sealing mold.

[0015] As described above, the resin supply unit forms an elongated resin sheet of a certain thickness according to the required amount of resin for each workpiece on which electronic components are mounted on a plate-like member, and cuts out an appropriate amount of sheet resin in a prescribed shape according to the shape of the workpiece (rectangular, circular, irregular shape, etc.) so as not to cause excess or deficiency in a single compression molding. Therefore, an appropriate amount of resin can be supplied to workpieces with different amounts of electronic components mounted and workpieces with different shapes of plate-like members, without generating resin dust or generating useless resin in the molded product.

[0016] A resin sealing device is provided for conveying a workpiece having electronic components mounted on a plate-like member and a sheet of resin into a sealing mold for compression molding. The resin sealing device comprises: a resin supply unit for cutting out a predetermined length of sheet resin suitable for compression molding from an elongated resin sheet having a predetermined width and thickness according to the required resin quantity for each workpiece; and a conveying unit for conveying the suitable amount of sheet resin supplied by the resin supply unit to the sealing mold.

[0017] As described above, the resin supply unit cuts out an appropriate amount of sheet resin of a specified length from a slender resin sheet of a certain width and thickness formed according to the required amount of resin for each workpiece equipped with electronic components on a plate-like member, and supplies the sheet resin so that there will be neither excess nor deficiency in a single compression molding. Therefore, no resin dust is generated and no useless resin is generated in the molded product.

[0018] A resin sealing device is provided for conveying a workpiece having electronic components mounted on a circular plate-shaped member and a sheet of resin into a sealing mold for compression molding. The resin sealing device comprises: a resin supply unit for cutting out an appropriate amount of sheet resin at a predetermined radius from an elongated resin sheet formed to a predetermined thickness according to the required resin amount for each workpiece during compression molding, and a conveying unit for conveying the appropriate amount of sheet resin supplied by the resin supply unit to the sealing mold.

[0019] As described above, the resin supply unit cuts out an appropriate amount of sheet resin at a specified radius from a slender resin sheet of a certain thickness formed according to the required amount of resin for each workpiece on which electronic components are mounted on a circular plate-shaped member, and supplies the sheet resin so that there will be neither excess nor deficiency in a single compression molding. Therefore, no resin dust is generated and no useless resin is produced in the molded product.

[0020] The resin supply unit may cut out an appropriate amount of sheet-shaped resin according to the mounting ratio of electronic components mounted on the plate-shaped member.

[0021] Specifically, the resin amount required to mount 100% of electronic components on the plate member may be used as a reference. If there is a shortfall due to the mounting rate of electronic components, an appropriate amount of resin may be added to cut out the appropriate amount of resin sheet.

[0022] Thus, the resin supply unit can supply an appropriate amount of sheet-shaped resin to each workpiece so as not to cause excess or deficiency during a single compression molding operation.

[0023] The resin supply unit may cut out an appropriate amount of sheet-shaped resin according to the total volume of the electronic components mounted on the plate-shaped member.

[0024] Specifically, the required resin volume can be calculated by subtracting the total volume of the electronic components mounted on the plate-shaped member from the volume of the empty cavity of the sealing mold, and an appropriate amount of sheet-shaped resin can be cut out.

[0025] Thus, the resin supply unit can supply an appropriate amount of sheet-shaped resin to each workpiece so as not to cause excess or deficiency during a single compression molding operation.

[0026] Alternatively, for each workpiece having electronic components mounted on a rectangular plate-shaped member, a resin volume corresponding to a required resin amount may be calculated, and a resin sheet of a predetermined length may be cut from an elongated resin sheet formed into a predetermined width and thickness in the resin supply unit.

[0027] As described above, for each workpiece having electronic components mounted on a rectangular plate-shaped member, the resin volume corresponding to the required resin amount can be calculated, and a sheet of resin having a predetermined length without excess or deficiency can be cut from an elongated resin sheet formed to a predetermined width and thickness for supply.

[0028] The sealing mold may include a compression molding mold having a movable lower mold cavity, and an appropriate amount of sheet-shaped resin supplied by the resin supply unit may be supplied into the lower mold cavity via a single film.

[0029] This allows a compression mold in which the lower mold cavity is movable to supply an appropriate amount of sheet-shaped resin into the lower mold cavity via the single-sheet supply film.

[0030] The sealing mold may include a compression molding mold having a movable upper mold cavity, and an appropriate amount of sheet-shaped resin supplied by the resin supply unit is placed on a workpiece and supplied to a lower mold facing the upper mold cavity.

[0031] This allows an appropriate amount of sheet-like resin to be supplied to the compression mold with a movable upper mold cavity together with the workpiece.

[0032] The sheet-like resin may be a resin formed into a porous state at a certain density or a sheet-like resin having a plurality of through-holes at a certain density.

[0033] This prevents air from being caught in the sheet-like resin supplied to the film or the workpiece, thereby suppressing the generation of voids.

[0034] A resin sealing method, wherein a workpiece having electronic components mounted on a plate-like member and sheet resin are moved into a sealing mold and compression-molded, the resin sealing method comprising: a step of obtaining workpiece information related to the electronic component mounting rate or the total volume of the electronic components mounted on the plate-like member for each workpiece supplied from a workpiece supply unit; a step of calculating the amount of resin required for each workpiece based on the workpiece information; a resin supply step of cutting an appropriate amount of sheet resin into a prescribed shape, which will not be excessive or insufficient in one compression molding, from a slender resin sheet drawn out from the resin supply unit and formed into a certain thickness, according to the shape of the workpiece, and supplying the resin; and a step of moving the workpiece and the appropriate amount of sheet resin into the sealing mold, clamping them and performing compression molding.

[0035] As described above, the required amount of resin for each workpiece with electronic components mounted on a plate-like member is calculated, and a thin, elongated resin sheet of a certain thickness is formed. Based on the workpiece's shape (rectangular, circular, or irregular), an appropriate amount of sheet resin is cut into a predetermined shape to ensure that neither excess nor deficiency is achieved during a single compression molding process. This prevents the scattering of resin dust during resin supply, and allows for the supply of an appropriate amount of resin to workpieces with varying amounts of electronic components mounted or with varying plate-like member shapes.

[0036] A resin sealing method, wherein a workpiece having electronic components mounted on a plate-like member and sheet resin are moved into a sealing mold and compression-molded, the resin sealing method comprising: a step of obtaining workpiece information related to the electronic component mounting rate or the volume of the electronic components mounted on the plate-like member for each workpiece supplied from a workpiece supply unit; a step of calculating the amount of resin required for each workpiece based on the workpiece information; a resin supply step of cutting an appropriate amount of sheet resin in a predetermined length for each workpiece during a one-time compression molding process from an elongated resin sheet drawn out from the resin supply unit and formed into a predetermined width and a predetermined thickness, and supplying the resin; and a step of moving the workpiece and the appropriate amount of sheet resin into the sealing mold and clamping them for compression molding.

[0037] According to the resin sealing method, workpiece information related to the electronic component loading rate or electronic component volume is obtained for each workpiece supplied from a workpiece supply unit. For each workpiece having electronic components mounted on a plate-like member, an appropriate amount of sheet resin is cut to a predetermined length for a single compression molding process. This allows for compression molding by supplying an appropriate amount of resin to the sealing mold without excess or deficiency for each workpiece. Consequently, resin dust is prevented from scattering during resin supply, and an appropriate amount of resin can be supplied to each workpiece for resin sealing. This improves molding quality and prevents the generation of unnecessary resin in the molded product.

[0038] A resin sealing method, wherein a workpiece having electronic components mounted on a circular plate-shaped member and sheet resin are moved into a sealing mold and compression-molded. The resin sealing method comprises: a step of obtaining workpiece information related to the electronic component mounting rate or the total volume of the electronic components mounted on the circular plate-shaped member for each workpiece supplied from a workpiece supply unit; a step of calculating the amount of resin required for each workpiece based on the workpiece information; a resin supply step of cutting out an appropriate amount of sheet resin in a single compression molding process at a specified radius from a slender resin sheet drawn out from the resin supply unit and formed into a certain thickness, and supplying the resin; and a step of moving the workpiece and the appropriate amount of sheet resin into the sealing mold and clamping them for compression molding.

[0039] According to the resin sealing method, workpiece information related to the electronic component loading rate or electronic component volume is obtained for each workpiece supplied from a workpiece supply unit. For each workpiece having electronic components mounted on a circular plate-shaped member, an appropriate amount of sheet resin is cut out at a predetermined radius for a single compression molding process. This allows for compression molding by supplying an appropriate amount of resin to the sealing mold for each workpiece. Consequently, resin dust is prevented from scattering during resin supply, and an appropriate amount of resin, neither excessive nor insufficient, can be supplied to each workpiece for resin sealing. This improves molding quality and prevents the formation of unnecessary resin in the molded product.

[0040] If there is a shortage due to the loading rate of electronic components on the plate-like member, the corresponding amount of resin can be added to cut out an appropriate amount of sheet resin. Alternatively, the total volume of the electronic components carried on the plate-like member or circular plate-like member can be subtracted from the volume of the empty mold cavity of the sealing mold to calculate the required resin volume and cut out an appropriate amount of sheet resin.

[0041] This allows for cutting out an appropriate amount of sheet-shaped resin for each workpiece having a different amount of electronic components mounted thereon, without causing excess or deficiency in a single compression molding operation.

[0042] Furthermore, a metering step of metering an appropriate amount of the flake-shaped resin may be included.

[0043] Thus, by measuring the sheet-shaped resin cut out by the resin supply unit and performing feedback, the supply accuracy of the sheet-shaped resin can be improved.

[0044] [Effects of the Invention]

[0045] According to the present invention, a resin sealing device and a resin sealing method can be provided, which can improve the molding quality by supplying an appropriate amount of sheet resin to each workpiece without generating resin dust and preventing waste resin from being generated in the molded product. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1This is a layout diagram showing an example of a compression molding device with a movable lower mold cavity.

[0047] Figure 2 yes Figure 1 An enlarged layout diagram of the resin supply unit.

[0048] Figure 3(a) and Figure 3(b) are Figure 2 Plan view and right side view of the resin supply unit.

[0049] Figure 4 (a) and Figure 4 (b) show Figure 1 Schematic diagram of the relationship between the chip mounting rate in the workpiece and the supply amount of sheet resin.

[0050] Figures 5A to 5C It is an explanatory diagram showing an example of cutting a sheet-like resin.

[0051] Figures 6A to 6D These are explanatory diagrams showing different examples of cutting a sheet-like resin.

[0052] Figure 7 This is an explanatory diagram showing another different cutting example of the sheet-like resin.

[0053] FIG8(a) and FIG8(b) are explanatory diagrams showing an example of cutting of a sheet-like resin and a layout in a conveyor for supplying the cut sheet-like resin.

[0054] Figure 9 This is a layout diagram of the resin supply unit for another example of a workpiece.

[0055] Figure 10(a) to Figure 10(f) This is a process diagram showing a process of supplying a sheet-shaped resin.

[0056] Figure 11 This is a layout diagram showing an example of a compression molding device with a movable upper mold cavity.

[0057] [Explanation of Symbols]

[0058] 1: Compression molding device

[0059] 2: Sealing the mold

[0060] 2a, 2b: mold cavity

[0061] 3: Workpiece loader

[0062] 3a, 3b: Workpiece holding part

[0063] 3A: First holding part

[0064] 3c, 3d: Molded product holding part

[0065] 3B: Second holding part

[0066] 4: Resin loader

[0067] 4a: Transport member holding portion

[0068] 4b: Remove the film holding part

[0069] 5.35: Supply box

[0070] 6, 6a, 6b: Supply track

[0071] 7: Relay track

[0072] 8: Workpiece measuring device

[0073] 9: Supply Pickup

[0074] 10: Workpiece heater

[0075] 11: First Storage Pickup

[0076] 12: Second storage pickup

[0077] 13: Guide roller

[0078] 14: Resin supply unit

[0079] 15a, 15b, 15c: Resin rolls

[0080] 16: Cut off the platform

[0081] 17a, 17b, 17c: Sheet pulling mechanism

[0082] 17d: Sheet fixing part

[0083] 17e: Sheet pressing member

[0084] 18: Slice cutter

[0085] 18a, 18b: Cutter blade

[0086] 18A: Movable blade cutter

[0087] 18c: Rotation axis

[0088] 18d: Rotating arm

[0089] 19: Prepare the platform

[0090] 20: Moving parts

[0091] 20a, 20b, 20c: Resin injection holes

[0092] 21: Transport parts picker

[0093] 22: Membrane Platform

[0094] 24a, 24b, 24d: Film rolls

[0095] 24c: Film cutting mechanism

[0096] 25: Resin supply platform

[0097] 26, 26a, 26b, 26c: Metering platform

[0098] 27: Protective film

[0099] 28a, 28b: Film winding rolls

[0100] 29: Slicer blade

[0101] 30: Sprinkler

[0102] 33: Fixed clamp

[0103] 33a: Movable clamping part

[0104] 34: Suppression device

[0105] 34a: Stamping

[0106] 34b: Stripper plate

[0107] 34c: Punch

[0108] 34d: die hole

[0109] 36: Workpiece supply platform

[0110] 37: Loader

[0111] 38: Unloader

[0112] 39: Molded product removal platform

[0113] 40: Storage box

[0114] 41: Rail Department

[0115] A: Workpiece processing unit

[0116] B: Workpiece conveying unit

[0117] C, J: pressing unit

[0118] D, I: Resin supply unit

[0119] E: Resin transfer department

[0120] F: Membrane

[0121] G: Membrane Processor

[0122] G1: Resin Processor

[0123] H: Workpiece supply unit

[0124] K: Molded product storage unit

[0125] R0: Resin sheet

[0126] R: Flake resin

[0127] R1: Residual resin

[0128] W: workpiece

[0129] Wb: Plate-like member

[0130] Wt: electronic parts

[0131] Wp: Molded product DETAILED DESCRIPTION

[0132] (Overall structure)

[0133] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 The layout structure of a resin sealing device according to an embodiment of the present invention will be described. The resin sealing device will be exemplified by a compression molding device 1 of the movable lower mold cavity type, and the workpiece W will be exemplified by a case where electronic components Wt are mounted in a matrix on a plate-shaped member Wb. In the figures illustrating the various embodiments, components having the same function may be designated by the same reference numerals, and duplicate descriptions thereof will be omitted.

[0134] The compression molding device 1 moves the workpiece W supplied from the workpiece processing unit A (including the workpiece supply unit and the workpiece storage unit) into and out of the sealing mold 2 of the pressing unit C through the workpiece conveying unit B, and moves an appropriate amount of sheet resin R together with the film F from the resin supply unit D (resin supply unit) into the sealing mold 2 through the resin conveying unit E. The pressing unit C moves the workpiece W and the appropriate amount of sheet resin R into the sealing mold 2 (compression molding mold) with a movable lower mold cavity, and clamps them for compression molding. The workpiece processing unit A mainly supplies the workpiece W and stores the molded product Wp after resin sealing. The pressing unit C mainly performs compression molding on the workpiece W to form the molded product Wp. The resin supply unit D mainly supplies the appropriate amount of film F and sheet resin R, and disposes the used film F after resin sealing to the film processor (film disposer) G.

[0135] First, a workpiece W as a formed product is provided with a plurality of electronic components Wt in a matrix on a plate-like member Wb. More specifically, it is not limited to a resin substrate, a ceramic substrate, a metal substrate, or a substrate with wiring formed in a long strip shape, and examples thereof include plate-like components such as a carrier plate, a lead frame, and a semiconductor wafer as a base material (hereinafter collectively referred to as "plate-like member Wb"). In addition, examples of electronic components Wt include semiconductor chips, micro-electro-mechanical system (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. In addition, as described later, as a plate-like member Wb, in particular, device variations that can correspond to the case of using rectangular or circular components can also be considered. In addition, in addition to carrying a plurality of electronic components Wt on the plate-like member Wb by flip-chip mounting, wire bonding mounting, etc., the workpiece W can also attach the electronic components Wt to the carrier using a heat-peelable adhesive tape or a UV-curing resin that is cured by UV irradiation.

[0136] On the other hand, as an example of sheet resin R, a thermosetting resin (e.g., a filler-containing epoxy resin or silicone resin) formed into a film or sheet with a certain width and thickness is used. Sheet resin R refers to a resin obtained by cutting a predetermined size from a wound resin roll, wherein one or both sides of the sheet resin R0 are sandwiched between protective films. In addition, sheet resin R may also be a resin formed into a porous shape with a certain density or a resin having a plurality of through-holes with a certain density.

[0137] In addition, examples of the film (release film) F are preferably films having excellent heat resistance, ease of peeling, flexibility, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. As the film F, for example, a film for forming a long workpiece having a size corresponding to the long workpiece W can be used.

[0138] The following, Figure 1 The schematic structure of each part of the compression molding device 1 shown in FIG.

[0139] In this embodiment, a compression molding apparatus 1 is described as an example in which two cavities 2a and 2b are provided in the lower mold of the sealing mold 2, two workpieces W are arranged and resin-sealed at the same time, and two molded products Wp are obtained simultaneously.

[0140] like Figure 1 As shown, the workpiece handling unit A, pressing unit C, and resin supply unit D are arranged in series and in parallel in the order described. Furthermore, an arbitrary number of guide rails (not shown) are provided linearly between the various processing units. A workpiece loader 3 (workpiece transport unit B) that transports workpieces W and the like, and a resin loader 4 (resin transport unit E) that transports film F and sheet resin R and the like, are arranged to be movable between the various processing units along the guide rails (not shown). Furthermore, the workpiece loader 3 not only loads workpieces W and the like into the sealing mold 2 but also removes molded products Wp from the sealing mold 2, thus also functioning as an offloader.

[0141] By changing the structure of each unit, the structure of the compression molding device 1 can be changed. For example, Figure 1 The illustrated configuration is an example of a configuration in which three pressing units C are provided. However, a configuration in which only one pressing unit C is provided, or a configuration in which two, four, or more pressing units are connected, is also possible. Furthermore, other units may be provided. For example, a unit for supplying resin such as web resin or liquid resin, or a unit for supplying a component to be assembled with the workpiece W within the mold (not shown) may be provided separately from the resin supply unit D.

[0142] (Workpiece processing unit A)

[0143] In the workpiece processing unit A, a supply magazine 5 for storing a plurality of workpieces W and a storage magazine (not shown) for storing a plurality of molded products Wp are arranged in an overlapping manner. Each magazine is configured to be able to be raised and lowered by an elevator mechanism (not shown). The supply magazine 5 and the storage magazine (not shown) use well-known stacking magazines, slit magazines, etc., and in the present embodiment, both respectively store the workpieces W and the molded products Wp with the mounting surface of the electronic components facing downward. In addition, from the viewpoint of electronic component protection, it is preferred to use a slit magazine that inserts the two ends of the workpiece W into the recessed portions facing each other on the inner side of the magazine frame to hold the upper and lower workpieces W separately from each other. In addition, by using an elevator mechanism (not shown) to hold the supply magazine 5 and to lift it, the workpiece W can be supplied from a specified position. Similarly, by using an elevator mechanism (not shown) to hold the storage magazine and to lift it, the molded products Wp can be stored at a specified position.

[0144] In front of the supply box 5 ( Figure 1The workpieces W are extruded one by one from the supply cassette 5 (see upper portion). A supply track 6 is provided on which the workpieces W are loaded. In this embodiment, a relay track 7 is provided between the supply cassette 5 and the supply track 6 to allow the workpieces W to pass through. However, a configuration in which the relay track 7 is omitted is also possible. Furthermore, a known pusher or the like (not shown) is used to move the workpieces W from the supply cassette 5 to the supply track 6.

[0145] Here, the supply rail 6 avoids the placement position of the electronic components and supports the long side of the workpiece W from below, and extends laterally in the front-back direction ( Figure 1 The supply rails 6 guide the workpieces W in the vertical direction (in the vertical direction). Furthermore, the supply rails 6 include a movable mechanism (not shown) that positions two workpieces W in parallel in the horizontal direction (6a and 6b in the figure) along the short side, and is movable in the horizontal direction. Thus, after a workpiece W removed from the supply cassette 5 is placed in one row (e.g., 6a), the supply rails 6a and 6b are moved in either a predetermined left or right direction (e.g., rightward), allowing the next workpiece W to be placed in the other row (e.g., supply rail 6b).

[0146] A workpiece measuring device 8 is also provided below the supply rail 6. The workpiece measuring device 8 measures the thickness of the workpiece W from the bottom side (the side on which the electronic components are mounted) as it moves forward, backward, and left and right on the supply rail 6. Specifically, the workpiece measuring device 8 includes two thickness sensors for measuring the thickness of the two workpieces W on the two rows of supply rails 6a and 6b. A laser displacement meter or a camera (single-lens camera or compound-eye camera) is used as the thickness sensor, and the thickness of the workpiece W is measured based on the output data from these sensors. The "thickness measurement" referred to herein includes necessary measurements such as the presence or absence of electronic components Wt mounted on the plate-like member Wb, the mounting height of the electronic components Wt, the positional offset of the mounted electronic components, and the number of electronic components Wt mounted. Based on the results of the "thickness measurement," the total volume of electronic components to be mounted on the workpiece W is calculated based on, for example, the presence or absence of electronic components and the mounting height. By adjusting the supply amount of sheet resin R to an appropriate amount that does not exceed or fall short during the primary compression molding process, as described later, the thickness of the molded product can be controlled with high precision. The workpiece measuring device 8 is fixed and measures the workpiece W as it moves. However, the workpiece measuring device 8 can also be used to scan the workpiece W in a forward, backward, left, and right direction while the workpiece W is stationary. Alternatively, a single thickness sensor can be used to sequentially measure two workpieces W in a single, predetermined scan. Furthermore, if the amount of electronic components loaded on the workpiece W is separately input to the compression molding apparatus via a control unit, the workpiece measuring device 8 can be omitted.

[0147] Furthermore, the workpiece measuring device 8 can be configured to read not only the thickness of the workpiece W but also identification information (e.g., a QR code) attached to the workpiece W. Furthermore, a code reader capable of reading the QR code of the workpiece W can be installed at any location above or below the relay track 7. By attaching this identification information to the workpiece W as a sequential number or a unique code, for example, the workpiece W can be identified. By recording detailed resin sealing conditions and the like in association with this identification information, traceability can be improved.

[0148] The workpiece W placed on the supply rail 6 is held by the supply picker 9 and transported to a predetermined position. In addition, as a mechanism for holding the workpiece W, there is a well-known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown). The supply picker 9 is configured to be movable in the left and right and up and down directions. Thus, by holding the workpiece W placed on the supply rail 6 and performing an ascending action, it can eventually be handed over to the workpiece loader 3 described later. The supply picker 9 is configured so that a holding mechanism is arranged side by side in the left and right directions at a position corresponding to the two workpieces W on the supply rails 6a and 6b. Thus, the two workpieces W on the two rows of supply rails 6a and 6b can be held and transported at the same time in a state of being side by side in the left and right directions.

[0149] Between the supply box 5 and the supply track 6, that is, at the position of the relay track 7, a workpiece heater 10 is provided for heating the workpiece W from the lower surface side. A well-known heating mechanism (such as an electric heating wire heater, an infrared heater, etc.) (not shown) is provided on the upper surface of the workpiece heater 10. The workpiece heater 10 is configured to be able to move forward and backward relative to the lower surface side of the workpiece W held in the state of the supply picker 9 above the supply track 6. Thus, by preheating the workpiece W before it is moved into the sealing mold 2 and heated, the elongation of the workpiece W in the sealing mold 2 is suppressed. In addition, the workpiece heater 10 may also be provided on the workpiece loader 3 instead of at the position of the relay track 7.

[0150] The workpiece loader 3 includes a front side ( Figure 1 The first holding portion 3A having two rows of workpiece holding portions 3a and 3b on the left and right sides is integrally included on the rear side ( Figure 1 The second holding unit 3B (above) includes two rows of molded product holding units 3c and 3d. This not only simplifies and miniaturizes the device structure, but also enables simultaneous transport of workpieces W and molded products Wp, two by two, thus shortening the process time. Furthermore, a loader equipped with the first holding unit 3A and a loader equipped with the second holding unit 3B can be configured independently.

[0151] In the first holding portion 3A, the supply rail 6 is moved to the side (for example, Figure 1 When the workpiece W is in the position (to the right), the workpiece W transported by the supply picker 9 is placed. When the workpiece W is handed over, the supply picker 9 further rises on the supply rail 6 after a preheating process, and then moves to the right, thereby handing it over to the first holding part 3A located on the right side of the supply rail 6. The first holding part 3A includes two workpiece holding parts 3a and 3b that hold the placed workpiece W. Each workpiece holding part has a well-known holding mechanism (for example, a structure with holding claws for clamping, a structure with a suction hole connected to a suction device for adsorption, etc.).

[0152] The two workpiece holders 3a and 3b included in the first holding portion 3A are arranged in two rows in the horizontal direction at positions corresponding to the two workpieces W held by the supply picker 9. In other words, the workpieces W can be held side by side with their longitudinal directions parallel. This allows the two workpieces W held side by side in the horizontal direction by the supply picker 9 to be simultaneously placed on the workpiece holders 3a and 3b in their original arrangement and transported to the sealing mold 2 without the need for sorting.

[0153] Furthermore, the workpiece loader 3, which holds the workpiece W using the first holding portion 3A, is configured to be movable in the front-to-back, left-to-right, and up-to-down directions. This left-to-right movement enables the workpiece W to be transported from the workpiece processing unit A to the pressing unit C. Furthermore, this forward-to-back movement enables the workpiece W to be transported from the exterior to the interior of the sealed mold 2 (i.e., between the upper and lower molds in the open mold state). Furthermore, this vertical movement enables the workpiece W to be transported (handed over) within the sealed mold 2 to a predetermined holding position within the upper mold.

[0154] Next, the second holding portion 3B for transporting the molded product Wp from the sealing mold 2 to a predetermined position outside the mold includes a molded product holding portion 3c and a molded product holding portion 3d for holding the molded product Wp. Each molded product holding portion has a well-known holding mechanism (for example, a structure having holding claws for clamping, a structure having suction holes connected to a suction device for adsorption, etc.). The second holding portion 3B is configured to arrange the molded product holding portion 3c and the molded product holding portion 3d side by side in the left-right direction at positions corresponding to the two molded products Wp held in the sealing mold 2 after resin sealing. Thus, the two molded products Wp held side by side in the left-right direction by the sealing mold 2 (upper mold) can be simultaneously placed on the molded product holding portion 3c and the molded product holding portion 3d in the original configuration and transported to the outside of the sealing mold 2 without sorting.

[0155] The workpiece handling unit A also includes a first receiving and picking up device 11 for holding the molded article Wp placed on the second holding portion 3B and transporting it to a predetermined position, and a second receiving and picking up device 12 for placing the molded article Wp held by the first receiving and picking up device 11 and transporting it to a predetermined position within the workpiece handling unit. Both devices have a known holding mechanism (e.g., a mechanism having holding claws for gripping, a mechanism having suction holes connected to a suction device for suction, or a mechanism that simply places the article Wp) (not shown) as a mechanism for holding the molded article Wp.

[0156] The first storage picker 11 of this embodiment is configured to be movable in the left-right direction. Thus, the molded product Wp placed on the second holding portion 3B is held and transported to the second storage picker 12. Here, the molded product Wp can also be placed on standby by clamping it at the junction of the first storage picker 11 and the second storage picker 12, so that it can be flattened and cooled at the same time to prevent the warping or deformation of the molded product Wp. The first storage picker 11 is configured so that the holding mechanism is arranged in two rows in parallel in the left-right direction at positions corresponding to the two molded products Wp placed on the second holding portion 3B (two rows of molded product holding portions 3c and 3d). The second storage picker 12 is capable of moving in the up-down direction and holds the molded product Wp placed on the second storage picker 12 and transports it to a storage rail not shown in the figure. The molded product Wp is pressed from the storage rail not shown in the figure into the storage box by a known push rod or the like (not shown) for storage.

[0157] (Pressing unit)

[0158] The structure of the pressing unit C of the compression molding device 1 is described in detail. The pressing unit C first includes a sealed mold 2, which has a pair of molds that can be opened and closed (for example, a mold assembled with multiple mold blocks, mold plates, mold columns, etc. containing alloy tool steel or other components). In this embodiment, in a pair of molds, one mold on the upper side in the vertical direction is set as the upper mold, and the other mold on the lower side is set as the lower mold. The sealed mold 2 is closed and opened by approaching and separating the upper mold and the lower mold. That is, the vertical direction is the mold opening and closing direction.

[0159] The sealed mold 2 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars or columns) that bridge the pair of platens, a drive source (e.g., an electric motor) that moves (raises and lowers) the platens, and a drive transmission mechanism (e.g., a toggle link) (all driving mechanisms not shown).

[0160] Here, the sealed mold 2 is positioned between a pair of platens in the mold opening and closing mechanism. In this embodiment, the upper mold, which serves as the fixed mold, is assembled to the fixed platen (a platen fixed to the connecting mechanism), and the lower mold, which serves as the movable mold, is assembled to the movable platen (a platen that rises and falls along the connecting mechanism). However, this configuration is not limiting; the upper mold may be a movable mold and the lower mold a fixed mold, or both the upper and lower molds may be movable.

[0161] The pressing unit C is a device that uses a sealing mold 2 to supply a workpiece (molded article) W for compression molding. The sealing mold 2 holds the workpiece W with the upper mold, covers the cavities 2a and 2b provided in the lower mold with a film F, supplies a sheet of resin R, and clamps the upper and lower molds to immerse the workpiece W in the molten resin R for resin sealing. The sealing mold 2, which is movable in the lower mold cavity, can be supplied with an appropriate amount of sheet of resin R together with the film F. Alternatively, in a device in which the upper mold has a cavity, as described later, the sheet of resin R is supplied to the workpiece W and placed in the lower mold, and compression molding is performed by covering the upper mold cavity with the film F.

[0162] Furthermore, as another example of the pressing unit C, a compression molding device 1 may be provided in which a cavity is provided in a lower mold, a workpiece W (for example, a circular semiconductor wafer or a square or rectangular substrate is assumed to be used as a substrate), and resin sealing is performed to obtain a molded product. Furthermore, a transfer robot including a robot hand may be provided in place of the workpiece handling unit A to remove the workpiece W from the supply magazine 5 or to store the molded product Wp in the storage magazine.

[0163] (Resin supply unit)

[0164] The structure of the resin supply unit D included in the compression molding device 1 will be described in detail, along with the operation of supplying the film F and the sheet-like resin R. As described above, the resin supply unit D is a unit that supplies the film F and the sheet-like resin R. In this embodiment, a rectangular frame-shaped conveying member 20 is used as a fixture for holding and conveying the film F and the sheet-like resin R to the sealing mold 2. That is, by using the conveying member 20, the sheet-like resin R can be held on the film F and conveyed by the resin loader 4. In addition, the conveying member 20 can hold the film F in parallel with its longitudinal direction.

[0165] As shown in Figures 3(a) and 3(b), the resin supply unit 14 includes a pair of resin rolls 15a and 15b on which a slender resin sheet R0 is wound. The slender resin sheet R0 is assumed to be a flexible resin state formed in a sheet shape with uniform width and uniform thickness in advance. A cutting platform 16, a sheet pulling mechanism 17a, a sheet pulling mechanism 17b and a sheet cutter 18 are respectively provided above the resin rolls 15a and 15b. The front end portion of the slender resin sheet R0 pulled out from the resin rolls 15a and 15b is pulled out to the cutting platform 16 via the guide roller 13, and is clamped or adsorbed on the sheet fixing portion 17d of the sheet pulling mechanism 17a and the sheet pulling mechanism 17b, and is pulled out to a specified length on the cutting platform 16. The sheet cutter 18 is based on the workpiece measuring device 8 (refer to Figure 1 ) detects the loading rate of electronic components Wt on the plate-shaped member Wb or the total volume of electronic components Wt, calculates the required amount of resin for each workpiece W, and cuts out an appropriate amount of sheet resin R for supply in a single compression molding from a resin sheet R0 formed in an elongated shape with a certain width and a certain thickness according to the resin volume corresponding to the required resin amount.

[0166] Specifically, the resin amount Z (volume conversion amount) required when 100% of the electronic component Wt is mounted on the plate-shaped member Wb as shown in FIG. 4 (a) is used as a reference, according to the workpiece measuring device 8 (reference Figure 1 ) The mounting rate of the electronic component Wt is detected, and the sheet-shaped resin R is cut out with a resin amount corresponding thereto.

[0167] As shown in FIG4(b), if the loading rate of electronic components Wt is 80%, for example, a corresponding amount of resin, 1.2Z (volume conversion), is added to the resin sheet R. The resin sheet R has a resin amount (volume conversion) determined by the cut length of the elongated resin sheet R0 having a constant width and thickness. Furthermore, the resin amount can be fine-tuned to determine the desired amount, taking into account factors such as the resin's shrinkage rate.

[0168] Thus, the resin supply unit 14 can supply an appropriate amount of sheet-shaped resin R to each workpiece W so as not to cause excess or deficiency during a single compression molding operation.

[0169] Furthermore, the resin supply unit 14 may cut out an appropriate amount of resin sheet R based on the volume of the electronic component Wt mounted on the plate-shaped member Wb. Specifically, the required resin volume may be calculated by subtracting the volume of the electronic component Wt mounted on the plate-shaped member Wb from the volume of the cavities 2a and 2b of the sealing mold 2, and the appropriate amount of resin sheet R may be cut out.

[0170] As shown in FIG. 4( a ), the resin volume (PQ) is calculated by subtracting the total volume Q of the electronic components Wt from the cavity volume P when 100% of the electronic components Wt are mounted on the plate-shaped member Wb, and an appropriate amount of sheet-shaped resin R is cut out.

[0171] As shown in Figure 4(b), if the loading rate of electronic components Wt in the workpiece W is 80%, the resin volume (P - 0.8Q) is calculated, adding the 20% shortfall, and the appropriate amount of resin sheet R is cut. The volume of resin sheet R supplied to the mold cavities 2a and 2b is determined by the cut length of the elongated resin sheet R0, which has a constant width and thickness. Furthermore, the resin volume can be fine-tuned to account for factors such as the resin's shrinkage rate, as needed.

[0172] The sheet cutter 18 uses the cutter blade 18a to cut the resin sheet R0 pulled out by the sheet pulling mechanism 17a and the sheet pulling mechanism 17b onto the cutting platform 16 to a specified length. The pulled-out length of the resin sheet R0 is accurately measured and then cut out. For example, it is also possible to accurately move the moving length of the resin sheet R0 pulled out (including feeding out a slender film from a film roll described later) by using a single-axis robot or a linear actuator, or to directly measure the length from the front end of the pulled-out resin sheet R0 to the cutting position using a linear encoder or a linear scale for cutting. Furthermore, it is also possible to perform image processing measurement using a projection area while taking pictures using a camera. In this way, the resin supply unit 14 can supply an appropriate amount of sheet resin R to each workpiece W so that it will not be excessive or insufficient in one compression molding.

[0173] Furthermore, if the loading rate or volume of electronic components Wt on the workpiece W is determined as data in a previous step, the appropriate amount of resin is calculated based on this data. This data can be transmitted to the control unit of the compression molding apparatus 1 or read by a reader from a QR code or the like attached to each workpiece W.

[0174] Alternatively, the resin rolls 15a and 15b may use a resin sheet R0 having a protective film 27 on one or both sides. In these cases, a step of peeling off the protective film 27 is required before cutting into the sheet-shaped resin R. The protective films 27 peeled off on both sides from the leading end portions of the resin sheets pulled out from the resin rolls 15a and 15b are connected to the winding cores of the film winding rolls 28a and 28b and wound up respectively.

[0175] A rectangular frame-shaped transport member 20, not holding the film F and the sheet of resin R, is placed on the preparation platform 19 and properly cleaned. For example, if the transport member 20 is removed from the sealing mold 2 and has resin R attached to it, it may cause malfunction. Therefore, malfunction can be prevented by cleaning the surface, including the through-holes described later, with a brush or suction mechanism (neither shown).

[0176] On the preparation platform 19, a mechanism for holding the conveying member 20, which includes a conveying member picker 21 that holds the conveying member 20 and transports it between multiple specified positions (platforms), has a well-known holding mechanism (for example, a structure with holding claws for clamping, a structure with suction holes connected to a suction device for adsorption, etc.) (not shown). Alternatively, a structure can be adopted in which concave and convex parts are provided on the outer peripheral portion of the conveying member 20, and the concave and convex parts are hooked on the holding claws erected downward from the lower surface of the conveying member picker 21 to hold and transport it. The conveying member picker 21 is configured to be able to move in the front and back, left and right, and up and down directions. In this way, the conveying member 20 placed on the preparation platform 19 can be held and transported to the film platform 22 and the resin supply platform 25 described later.

[0177] The conveying member 20 has two rows of film holding portions, each of which is formed into a rectangular frame shape and holds a pair of films F cut into long strips. At positions corresponding to each film F (positions for holding each film F), a pair of resin injection holes 20a, 20b are provided in the through hole so that each film F is exposed when viewed from the upper surface. The resin injection holes 20a, 20b are formed corresponding to the shapes of the mold cavities 2a, 2b. With the film F as the bottom, the sheet resin R is supplied to the sealing mold 2 (mold cavity 2a, mold cavity 2b) while being dropped into the resin injection holes 20a, 20b of the conveying member 20.

[0178] A pair of film rolls 24a and 24b, which are used to roll an elongated film F, are provided on the film platform 22. This allows two films F of the same shape to be supplied to the film platform 22 simultaneously. The film platform 22 is positioned above the film rolls 24a and 24b (in this embodiment, diagonally above). The film F drawn from the film rolls 24a and 24b is cut into strips of a predetermined length and held. For example, the film platform 22 and the film rolls 24a and 24b are configured to transport the film in a vertical direction, thereby reducing the installation area of the device.

[0179] In addition, when the film rolls 24a and 24b are delivered to the film platform 22, a structure in which the film rolls are pulled out by clamping the ends, or a structure in which the film rolls are delivered by a driven roller arranged in front of the film platform 22, etc., can also be provided. In addition, as a mechanism for cutting the elongated film F, there is a well-known film cutting mechanism 24c (for example, a fixed blade cutter, a hot melt cutter, etc.) (not shown). In addition, as a mechanism for holding the two films F, there is a well-known holding mechanism (for example, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown). On the film platform 22, the conveying member 20 is placed on top of the film F cut there.

[0180] A plurality of suction holes (not shown) are provided around the resin injection holes 20a and 20b of the conveying member 20 to generate a suction force to hold the film F. In addition, the suction holes are configured to transmit the suction force generated by the suction device (not shown) via (communicated with) a suction hole (not shown) provided on the conveying member picker 21. According to the structure, it is possible to hold two films F in a state of being sucked side by side in the left-right direction on the lower surface of the conveying member 20 conveyed by the conveying member picker 21. In addition, a structure can also be provided in which the outer periphery of the film F is clamped by a retaining claw to hold it.

[0181] A resin supply platform 25 is provided on the side (right side, for example) of the film platform 22. The resin supply platform 25 includes a known holding mechanism (e.g., a structure having holding claws for clamping, a structure having suction holes connected to a suction device for adsorption, etc.) (not shown) as a mechanism for holding the conveying member 20 placed on the pair of films F. The resin supply platform 25 is not essential; the conveying member 20 may be supplied to the film platform 22, and the sheet-like resin R may be supplied to the films F through the resin injection holes 20a and 20b.

[0182] Here, refer to Figure 2 An example of the operation of supplying the sheet-shaped resin R will be described.

[0183] The resin supply unit 14 determines the appropriate amount of resin (volume conversion amount) for each workpiece W so that it will not be excessive or insufficient during a single compression molding process, based on the loading rate of the electronic components Wt or the volume of the electronic components Wt obtained by the workpiece measuring device 8. The cutting length of the resin sheet with a certain width and thickness is determined relative to the appropriate amount of resin for each workpiece W. For example, based on the result of "thickness measurement", the volume of the electronic components Wt mounted on the workpiece W is calculated according to whether or not the electronic components Wt are mounted or the mounting height, and the volume obtained by subtracting the total volume of the electronic components Wt from the packaging volume (empty mold cavity volume P) without the electronic components Wt mounted is the volume of the appropriate amount of resin required for molding. Since the width and thickness of the elongated resin sheet R0 are constant, the volume of the appropriate amount of resin can be calculated by adjusting the length. The sheet cutter 18 cuts the resin sheet R0 pulled out by the sheet pulling mechanism 17a and the sheet pulling mechanism 17b onto the cutting platform 16 to a specified length. Furthermore, since the amounts of resin required for the two workpieces W to be molded at one time are different from each other, the sheet pulling-out mechanism 17 a and the sheet pulling-out mechanism 17 b can each independently cut the workpieces into predetermined lengths.

[0184] The cut appropriate amount of sheet resin R is transferred to the metering platform 26a and the metering platform 26b by the resin picking mechanism not shown in the figure. The metering platform 26a and the metering platform 26b are used to measure the amount of resin corresponding to the appropriate amount of resin. After measurement, it is determined whether the sheet resin R is cut into the target appropriate amount. The sheet resin R outside the appropriate range is discarded in the resin waste box (BOX) (not shown), and the resin supply unit 14 is used again to cut the appropriate amount of sheet resin R. The appropriate amount of sheet resin R is respectively put into the resin input hole 20a of the conveying member 20 placed on the film F placed on the resin supply platform 25 by the resin picking mechanism. The conveying member 20, the film F and the sheet resin R placed on the resin supply platform 25 are transported to the sealing mold 2 (lower mold) by the resin loader 4 as described later.

[0185] Furthermore, the cut length of the resin sheet R can be fine-tuned through feedback control based on the resin amount (volume-converted amount) of the molded product Wp, measured or formed on the metering platform 26. In addition to adjusting the cut length of the resin sheet R for each workpiece W based on molded product information (such as the molded product thickness), the control unit can also make adjustments on a batch-by-batch basis. This improves the accuracy of resin supply for each batch. Furthermore, by storing data such as the cut length in association with workpiece information including workpiece W thickness information, it is possible to supply the appropriate amount of resin to each workpiece W, thereby improving molding quality.

[0186] If the resin supply unit D is used, the sheet resin R can be supplied and conveyed without generating dust. Even if the amount of electronic components loaded on each workpiece W changes, the resin corresponding to the volume of the insufficient portion can be replenished, so that an appropriate amount of resin can be supplied for compression molding.

[0187] In this case, the sheet resin R may be porous at a certain density or have a plurality of through holes at a certain density. This prevents air from being trapped between the sheet resin R supplied to the film F and the lower mold, thereby suppressing the generation of voids.

[0188] In addition, as the sheet cutter 18, in addition to using the cutter blade 18a, it is also possible to use Figure 5A As shown, a device for cutting using a dicer blade 29 is used, such as Figure 5B As shown, a device for cutting using a laser or a water jet 30 is used, such as Figure 5C As shown, any of the devices for cutting using a wire cutter 31 is used.

[0189] Alternatively, the sheet cutter 18 may be Figure 6AAs shown, the sheet-like resin R is cut by scanning the cutter blade 18a, or it can be cut by scissors (not shown). Figure 6B As shown in FIG. 1 , the cutter blade 18 a is moved up and down along the cutting line of the sheet-like resin R, thereby pressing the sheet-like resin R. As shown in FIG.

[0190] In addition, you can also Figure 6C As shown, using Figure 6A 、 Figure 6B After the cutting blade of the cutter forms a shallow groove on the removal line, the sheet resin R is clamped by a pair of upper and lower fixed clamps (clamps) 33 and the cut portion is clamped by a movable clamp 33a. Figure 6D As shown, the movable clamp 33a is changed from a horizontal posture to an inclined posture, and the sheet-like resin R is removed so as to be folded along the cutting line.

[0191] You can also Figure 7 As shown, a pressing device 34 is used as the sheet cutter 18 to cut the resin sheet R0. Alternatively, a predetermined length of the sheet-like resin R can be cut by pressing a punch 34c toward a die hole 34d while pressing the resin sheet R0 placed on a die 34a with a stripper plate 34b.

[0192] FIG8(a) is an explanatory diagram showing the form of a sheet of resin R, and FIG8(b) is a diagram showing the arrangement of the sheet of resin R introduced into the resin injection holes 20a and 20b (cavities 2a and 2b) of the conveying member 20. The sheet of resin R is preferably arranged in the center of the resin injection holes 20a and 20b of the conveying member 20 by adjusting its position by XY movement to minimize the flow of molten resin within the cavities 2a and 2b.

[0193] Next, refer to Figure 1 The structure of the resin loader 4 is described. The resin loader 4 receives the conveying member 20 placed on the resin supply platform 25 together with the film F and the sheet resin R at the conveying member holding portion 4a on its lower surface. After conveying it to the sealing mold 2 (lower mold), the resin loader 4 only conveys the conveying member 20 to the preparation platform 19. In addition, the resin loader 4 has a known holding mechanism (for example, a structure with holding claws for clamping, a structure with suction holes connected to a suction device for adsorption, etc.) as the conveying member holding portion 4a for holding the conveying member 20. It also has a suction hole that is connected to the suction hole of the conveying member 20 held at a specified position to generate (transmit) the suction force generated by the suction device (not shown). It may also have holding claws that clamp the outer periphery of the two films F on the lower surface of the conveying member 20 for holding.

[0194] The resin loader 4 also includes a film-carrying holder 4b that holds the film (used film) F remaining in the lower mold after the resin-sealed molded product Wp is removed from the sealing mold 2 (here, the upper mold) and transports it to a predetermined location (a film processor G described later). The film-carrying holder 4b includes a known holding mechanism for holding the used film F (e.g., a structure having a suction hole connected to a suction device for suction, etc.).

[0195] The resin loader 4 of this embodiment is configured to be movable in the front-to-back, left-to-right, and up-to-down directions. By moving in the left-to-right direction, the conveying member 20 (holding two films F, each loaded with a sheet of resin R) can be transported from the resin supply platform 25 to the pressing unit C. Furthermore, by moving in the front-to-back direction, the conveying member 20 (holding two films F, each loaded with a sheet of resin R) can be transported from the outside of the sealing mold 2 to the inside (i.e., between the upper and lower molds in the open mold state).

[0196] Furthermore, the unloading film holding portion 4b is configured to be disposed in parallel in the left-right direction at positions corresponding to the two cavities 2a and 2b of the sealing mold 2 (lower mold). This allows the two used films F held in parallel in the left-right direction by the sealing mold 2 (lower mold) to be simultaneously held and transported in parallel in the left-right direction after resin sealing.

[0197] Furthermore, by integrally including the transport member holding portion 4a and the unloaded film holding portion 4b in the resin loader 4, the resin loader 4 is configured to be movable in the front-back, left-right, and up-down directions. Furthermore, as a modified example, a resin loader may be provided that independently includes the transport member holding portion 4a and the unloaded film holding portion 4b.

[0198] The film processor G is formed in a box shape with an open top (upper surface portion). Thus, when the unloading film holding portion 4b that carries the used film F reaches a position directly above the film processor G, the unloading film holding portion 4b releases the holding of the used film F, allowing the used film F to fall and be stored in the film processor G.

[0199] With this configuration, the resin supply unit D can convey an appropriate amount of sheet-shaped resin R to the sealing mold 2 during compression molding according to the amount of electronic components loaded on each workpiece W. Therefore, dust is not dispersed during resin supply, and compression molding can be performed by supplying an appropriate amount of resin to each workpiece without excess or deficiency. This improves molding quality and prevents the formation of unnecessary resin in the molded product.

[0200] Regarding the resin supply unit D, the case where an appropriate amount of sheet resin R is supplied to a rectangular plate-shaped member Wb (strip substrate) for compression molding has been described. However, the plate-shaped member Wb may also be a device that supplies an appropriate amount of sheet resin R to a circular semiconductor wafer for compression molding. Figure 2 The same reference numerals are given to the same components of the resin supply unit D as shown, and the description thereof is referred to. In addition, the workpiece W is assumed to have an electronic component Wt mounted on a plate-like member Wb (semiconductor wafer shape).

[0201] exist Figure 9 In the embodiment, the compression molding device 1 is constructed such that a cavity is provided for a lower mold in a pressing unit C and a workpiece W is arranged for compression molding to obtain a molded product Wp. In the case described, as the film F supplied from the film roll 24d to the film platform 22 and cut by the film cutting mechanism 24c, a film having a width wider than the film F used as the film for forming the workpiece in the shape of an elongated strip is used. As the wide-width film, it is simple to use a square or rectangular single-piece film F having a width wider than the film for forming the workpiece in the shape of an elongated strip. However, as the wide-width film, if the width is wider than the film for forming the workpiece in the shape of an elongated strip, a circular single-piece film F may also be used. In addition, the conveying member 20 supplied by the preparation platform 19 is preferably a conveying member having a rectangular outer shape and a resin injection hole (circular hole) 20c provided in the central portion, but the outer shape may also be circular.

[0202] like Figure 9As shown, the resin supply unit 14 includes a resin roll 15c on which an elongated resin sheet R0 is wound. The resin roll 15c uses a resin sheet R0 with a protective film 27 on both sides or one side, so the process of peeling off the protective film 27 before cutting into the sheet-like resin R is the same as Figures 3(a) and 3(b). However, in the case of the sheet-like resin R that does not require the protective film 27, the peeling process does not have to be performed. The elongated resin sheet R0 is assumed to be a flexible resin sheet formed in advance with a uniform thickness. A cutting platform 16, a sheet pulling mechanism 17c, and a sheet cutter 18 are provided above the resin roll 15c. The sheet cutter 18 quantitatively cuts the resin sheet R0 pulled onto the cutting platform 16 according to the workpiece W. In addition, the movable sheet cutter 18A is provided so as to be movable between a standby position outside the cutting platform 16 and a cutting position that is approximately the center of the cutting platform 16. The movable sheet cutter 18A is equipped with a cutter blade 18b at the tip of a rotating arm 18d that rotates about a rotation axis 18c. The length of the rotating arm 18d is configured to be retractable. As described later, the required amount of resin for each workpiece W is calculated, and the length of the rotating arm 18d is adjusted to achieve a volume corresponding to the required amount of resin. The sheet pulling mechanism 17c is equipped with a sheet pressing member 17e. This sheet pressing member 17e presses the resin sheet R0 when circularly cutting the resin sheet R0 and also presses the rear end of the cut at the quantitative cutting position.

[0203] A rectangular frame-shaped conveying tool 20 in a state where the film F and the sheet-shaped resin R are not held is placed on the preparation stage 19 and appropriately cleaned.

[0204] The preparation stage 19 includes a transport member picker 21 that holds the transport member 20 and transports it between a plurality of predetermined positions (stages).

[0205] The conveying member 20 is provided with a resin injection hole 20c formed as a through-hole so that the film F is exposed when viewed from the top. The resin injection hole 20c is formed to correspond to the shape of the mold cavity. With the film F as the bottom, the resin sheet R is dropped into the resin injection hole 20c of the conveying member 20 to supply resin to the sealing mold 2.

[0206] A film roll 24d, which is used to roll a slender film F, is provided on the film platform 22. This allows the film F to be supplied to the film platform 22. The film platform 22 cuts the film F drawn from the film roll 24d into predetermined lengths and holds them. Furthermore, a known film cutting mechanism 24c (e.g., a fixed blade cutter, a hot melt cutter, etc.) (not shown) is provided as a mechanism for cutting the slender film F. The conveying member 20 is placed on top of the cut film F on the film platform 22.

[0207] A plurality of suction holes (not shown) are provided around the resin injection hole 20c of the conveying member 20 to generate suction force to hold the film F. Furthermore, the suction holes are similarly configured to transmit the suction force generated by the suction device (not shown) via (communicate with) the suction holes (not shown) provided on the conveying member picker 21.

[0208] A resin supply platform 25 is provided on the side (right side, for example) of the film platform 22. The resin supply platform 25 includes a known holding mechanism (e.g., a structure having holding claws for clamping, a structure having suction holes connected to a suction device for adsorption, etc.) (not shown) as a mechanism for holding the conveying member 20 placed on the pair of films F. The resin supply platform 25 is not essential; the conveying member 20 may be supplied to the film platform 22, and the sheet-shaped resin R may be supplied to the film F through the resin injection hole 20c.

[0209] The metering platform 26c measures the amount of resin in the appropriate amount of sheet resin R cut by the resin supply unit 14. The sheet resin R is transferred from the cutting platform 16 to the metering platform 26c by a resin pickup mechanism (not shown). The metering platform 26c measures the amount of resin corresponding to the appropriate amount of resin. After measurement, it is determined whether the sheet resin R has been cut to the target appropriate amount. The sheet resin R outside the appropriate amount is discarded in a resin waste box (BOX) (not shown), and the resin supply unit 14 is used to cut the appropriate amount of sheet resin R again. The resin pickup mechanism then drops the appropriately measured sheet resin R into the resin injection hole 20c of the conveyor 20 on the resin supply platform 25.

[0210] In addition, if Figure 9 As shown, a resin processor G1 is provided separately from the film processor G and near the standby position of the sheet cutter 18. This processor discards excess resin R1 after the cut resin sheet R is removed. When the sheet resin R is cut into a circular shape from the elongated resin sheet R0, excess resin R1 forms around the cut resin sheet. The excess resin R1 removed by the sheet cutter 18 is transported to the resin processor G1 by a resin pickup mechanism (not shown) and discarded.

[0211] Here, refer to Figure 10(a) to Figure 10(f) The supply operation of the resin supply unit 14 will be described. In Figure 10(a), the leading end of an elongated resin sheet R0 drawn from a resin roll 15c (see Figure 3(b)) is drawn onto the cutting platform 16 via the guide roller 13 (see Figure 3(b)). There, the leading end is clamped or attracted to the sheet fixing portion 17d of the sheet drawing mechanism 17c, and drawn to a predetermined length on the cutting platform 16. Figure 10(b) shows the state in which the resin sheet R0 has been drawn onto the cutting platform 16.

[0212] Next, in FIG10(c), the front end position of the resin sheet R0 pulled out to the cutting platform 16 is pressed by the sheet fixing portion 17d, and the rear end position is pressed by the sheet pressing member 17e. In addition, the movable sheet cutter 18A enters onto the resin sheet R0 pulled out from the standby position outside the cutting platform 16. At this time, the movable sheet cutter 18A enters a position where the rotating shaft 18c becomes the approximate center of the cutting platform 16. The movable sheet cutter 18A is adjusted according to the workpiece measuring device 8 (refer to FIG10(c)). Figure 1 ) is obtained by calculating the loading rate of electronic components Wt on the semiconductor chip or the total volume of electronic components Wt, calculating the required amount of resin for each workpiece W, and adjusting the length of the rotating arm 18d so as to obtain a resin volume corresponding to the required resin amount.

[0213] Next, as shown in FIG10( d ), the cutter blade 18b provided at the front end of the rotating arm 18d is kept inserted into the resin sheet R0 and rotated in a predetermined radius, for example, in a clockwise direction, to cut the circular sheet of resin R. From the elongated resin sheet R0 formed to a predetermined thickness, an appropriate amount of sheet of resin R is cut out in a single compression molding.

[0214] In Figure 10(e), the movable sheet cutter 18A returns to its standby position from the cutting platform 16 upon completion of the cutting operation. The sheet cutter 18 then cuts the resin sheet R0 into a fixed quantity. The circularly cut resin sheet R is transported to the metering platform 26c by a resin pickup mechanism (not shown), where the resin quantity is measured. The remaining resin R1 is then transported to the resin processor G1 by the resin pickup mechanism and discarded.

[0215] In FIG. 10( f ), the sheet fixing portion 17 d of the sheet pulling mechanism 17 c moves to the leading end position of the quantitatively cut resin sheet R0 and clamps or adsorbs it to fix it in preparation for cutting the next sheet-shaped resin R.

[0216] An appropriate amount of sheet resin R measured by the metering platform 26c is fed by a resin pickup mechanism (not shown) into the resin feed hole 20c of the conveying member 20 placed on the film F placed on the resin supply platform 25. The conveying member 20, the film F, and the sheet resin R placed on the resin supply platform 25 are then transferred to the sealing mold 2 (lower mold) by the resin loader 4.

[0217] As described above, by measuring the volume of the electronic component Wt for each workpiece W or adjusting the cutting radius in the case of a circular workpiece W based on data on the loading rate of the electronic component Wt, an appropriate amount of sheet resin R can be supplied without excess or deficiency.

[0218] Here, the resin sealing method is described. For each workpiece supplied from the workpiece processing unit A (workpiece supply unit), workpiece information related to the loading rate or total volume of electronic components Wt is obtained. Based on this workpiece information, the required amount of resin (volume-converted amount) is calculated for each workpiece W. Specifically, the resin volume is calculated by subtracting the total volume of the electronic components from the empty cavity volume, and the volume of the sheet resin R is calculated, taking into account factors such as the resin shrinkage rate as needed.

[0219] From the elongated resin sheet R0 of a certain width and thickness drawn out by the resin supply unit 14, an appropriate amount of sheet resin R is cut out for each workpiece W according to the required amount of resin (volume conversion amount) so that there will not be too much or too little in one compression molding. Specifically, in the case of a rectangular workpiece W, there is no need to make the cutting length constant, and in the case of a circular workpiece W, there is no need to make the width of the resin sheet R0 constant, as long as the width passing through the cutting radius is ensured. By adjusting the cutting radius during cutting, an appropriate amount of sheet resin R is supplied to each workpiece W. Furthermore, in the case of any rectangular or irregular workpiece W, an appropriate amount of sheet resin R can be cut into a specified shape from a resin sheet R0 of a certain thickness throughout the entire circumference. The workpiece W is transported to the sealing mold 2 (upper mold) by the workpiece loader 3, and an appropriate amount of sheet resin R and film F are transported to the sealing mold 2 by the resin loader 4. The sealing mold 2 clamps the workpiece W for compression molding. In addition, the sheet resin R and film F can also be transported to the sealing mold 2 independently.

[0220] According to the resin sealing method, workpiece information related to the electronic component loading rate is obtained for each workpiece W supplied from the workpiece supply unit. Based on the loading rate of the electronic components Wt, an appropriate amount of sheet-shaped resin R is cut out for each workpiece W, ensuring that neither excess nor deficiency is achieved during a single compression molding process. Consequently, an appropriate amount of resin can be supplied to the sealing mold 2 for each workpiece W to perform compression molding. This allows for the supply of an appropriate amount of resin to workpieces W having varying loading rates of electronic components Wt or workpieces W having different plate-shaped members Wb. Furthermore, resin dust is prevented from scattering during resin supply, and an appropriate amount of resin can be supplied to each workpiece W for resin sealing. This improves molding quality and prevents the generation of unnecessary resin in the molded product Wp.

[0221] In addition, a membrane platform 22 may also be included, which can switch the supply Figure 1 The narrow strip-shaped workpiece forming film shown Figure 9 In this case, the resin supply unit 14 also needs to switch between supplying film rolls 24a, 24b, and 24d. Furthermore, the transport member 20 prepared on the preparation platform 19 needs to be switched between a strip substrate type and a semiconductor wafer type. Furthermore, the sheet cutter 18 needs to be switched between rectangular and circular resins.

[0222] Alternatively, the compression molding apparatus 1 may include a resin supply unit D provided on one side of the press unit C specifically configured to supply sheet resin R corresponding to the amount of electronic components loaded to the sealing mold 2. In this case, it is preferable to provide a film transport device on the press unit C to transport the film covering the cavity surface in and out.

[0223] While the workpieces in this embodiment are described as strip-shaped and circular, they can also be large rectangular (quadrilateral) blocks. In this case, as long as the resin sheets R are also quadrilateral, they can be cut into predetermined lengths, similar to the strip-shaped workpieces, and then supplied as needed. Furthermore, multiple sheets of resin R can be supplied to the resin injection holes 20a, 20b, and 20c of the conveying member 20, either overlapping or in parallel, as needed.

[0224] This embodiment describes a compression molding apparatus 1 with a movable lower mold cavity. However, the present invention is also applicable to a compression molding apparatus 1 with a movable upper mold cavity that can transport an appropriate amount of sheet resin R to the sealing mold 2 together with the workpiece W, so as not to cause excess or deficiency in a single compression molding process.

[0225] Figure 11 A compression molding device 1 having a sealed mold 2 of the upper mold movable cavity type is illustrated. As an example, the compression molding device 1 is shown to have a structure in which a workpiece supply unit H, a resin supply unit I, a pressing unit J, and a molded product storage unit K are arranged in parallel laterally as separable units. In addition, it is also possible to have a device structure in which these units are integrated. In the workpiece supply unit H, the workpiece W before forming (a plate-like component equipped with electronic components, a semiconductor chip, etc.) is inserted and stored in a slit in a supply box 35, and is taken out onto a workpiece supply platform 36. The workpiece W is transported to the resin supply unit I by a loader 37. A resin supply section 14 for supplying sheet resin R is provided in the resin supply unit I. A sheet pulling mechanism is used to pull out a resin sheet wound with a slender resin sheet of uniform width and thickness from a resin roll to a cutting platform, and a sheet cutter is used to cut the resin sheet into a specified length or a specified radius for each workpiece W according to the loading rate of the electronic components Wt on the plate-like component Wb or the total volume of the electronic components Wt. The cut sheet-shaped resin R is supplied onto the workpiece W by a resin picker (not shown).

[0226] The loader 37 transports the workpiece W carrying the sheet resin R to the pressing unit J and moves it into the lower mold facing the upper mold cavity of the sealing mold 2. The workpiece W after compression molding is taken out from the open sealing mold 2 by the unloader 38 and moved out to the molded product storage unit K. A molded product removal platform 39 is provided in the molded product storage unit K, and the molded workpiece W is taken out by the unloader 38. There is no useless resin in the molded workpiece W, and it is stored in the storage box 40 from the molded product removal platform 39 by the molded product picker (not shown). The loader 37 and the unloader 38 are arranged to move back and forth using a common rail part 41 that is erected throughout the workpiece supply unit H, the resin supply unit I, the pressing unit J, and the molded product storage unit K.

[0227] According to the above configuration, an appropriate amount of sheet-like resin R can be supplied together with the workpiece W to the compression molding die having a movable upper mold cavity so as to avoid excess or deficiency during primary compression molding.

[0228] In this embodiment, the weight of the resin sheet R is measured after the appropriate amount of resin is cut. However, this is not always necessary. Since the thickness of the resin sheet R is constant, a camera imaging stage can be provided instead of the measuring stage 26. In this case, the volume of the resin sheet R is calculated based on the area of the resin sheet R captured by the camera.

Claims

1. A resin sealing device that carries a workpiece having an electronic component mounted on a long plate-like member and a sheet of resin into a sealing mold and performs compression molding, the resin sealing device comprising: a workpiece measuring device for measuring the presence or absence of electronic components mounted on the plate-like member or the height of the electronic components mounted thereon when the workpiece is supplied, and for calculating the mounting rate or total volume of the electronic components measured; A resin supply unit cuts out a sheet of resin of a predetermined length from an elongated resin sheet having a predetermined width and a predetermined thickness according to the required amount of resin for each workpiece during primary compression molding and supplies the sheet; and The conveying unit conveys an appropriate amount of sheet-shaped resin supplied by the resin supply unit to the sealing mold. The resin supply unit includes a resin roll on which the elongated resin sheet is wound, a sheet pulling mechanism for pulling the front end of the resin roll onto a cutting platform, and a sheet cutter for cutting the resin sheet pulled onto the cutting platform into a predetermined length. The resin sealing device calculates the required amount of resin for each workpiece based on the loading rate or total volume of electronic components on the plate-like component detected by the workpiece measuring device, and the sheet cutter cuts out an appropriate amount of sheet resin in a specified length from the resin sheet formed into a slender shape of a certain width and a certain thickness in one compression molding according to the resin volume corresponding to the required resin amount.

2. A resin sealing device that carries a workpiece having an electronic component mounted on a circular plate-shaped member and a sheet of resin into a sealing mold and performs compression molding, the resin sealing device comprising: a workpiece measuring device for measuring the presence or absence of electronic components on the circular plate-shaped member or the height of the electronic components when the workpiece is supplied, and calculating the loading rate or total volume of the electronic components; A resin supply unit cuts out an appropriate amount of sheet-shaped resin at a predetermined radius during primary compression molding from an elongated resin sheet formed to a predetermined thickness, according to the required amount of resin for each workpiece, and supplies the sheet-shaped resin; and The conveying unit conveys an appropriate amount of sheet-shaped resin supplied by the resin supply unit to the sealing mold. The resin supply unit includes a resin roll on which the elongated resin sheet is wound, a sheet pulling mechanism for pulling the front end of the resin roll onto a cutting platform, and a sheet cutter for cutting the resin sheet pulled onto the cutting platform into a predetermined radius using a cutter blade provided at the front end of a retractable rotary arm. The resin sealing device calculates the required amount of resin for each workpiece based on the loading rate or total volume of electronic components on the circular plate-shaped component detected by the workpiece measuring device, and the sheet cutter cuts out an appropriate amount of sheet resin in a single compression molding process from the resin sheet formed into a slender shape of a certain thickness at a specified radius based on the resin volume corresponding to the required resin amount.

3. The resin sealing device according to claim 1 or 2, wherein the resin amount required when 100% of the electronic components are mounted on the plate-like member is used as a reference, and if there is a shortage due to the mounting rate of the electronic components, an appropriate amount of sheet resin is cut out by adding a corresponding amount of resin.

4. The resin sealing device according to claim 1 or 2, wherein the required resin volume is calculated by subtracting the total volume of the electronic components mounted on the plate-like member from the volume of the empty cavity of the sealing mold, and an appropriate amount of sheet-like resin is cut out.

5. The resin sealing device according to claim 1 or 2, wherein the sealing mold includes a compression molding mold having a movable lower mold cavity, and an appropriate amount of sheet resin supplied by the resin supply unit is supplied into the lower mold cavity via a single film.

6. The resin sealing device according to claim 1 or 2, wherein the sealing mold includes a compression molding mold with a movable upper mold cavity, and an appropriate amount of sheet resin supplied by the resin supply unit is placed on the workpiece and supplied to the lower mold facing the upper mold cavity. 7 . The resin sealing device according to claim 1 , wherein the sheet-shaped resin is a resin formed into a porous shape at a certain density or a resin having a plurality of through holes at a certain density.

8. A resin sealing method, comprising: placing a workpiece having an electronic component mounted on a long plate-like member and a sheet of resin into a sealing mold and performing compression molding, the resin sealing method comprising: a step of acquiring workpiece information related to the electronic component mounting ratio or the total volume of electronic components mounted on the plate-shaped member in a workpiece measuring device for each workpiece supplied from the workpiece supply unit; A step of calculating the amount of resin required for each workpiece based on the workpiece information and the mounting rate or total volume of electronic components on the plate-like member detected by the workpiece measuring device; a resin supplying step of cutting an appropriate amount of sheet-like resin in primary compression molding into a predetermined length corresponding to a required amount of resin by a sheet cutter from an elongated resin sheet drawn out from a resin supplying section and formed into a predetermined width and thickness, and supplying the sheet-like resin; and The workpiece and an appropriate amount of sheet-shaped resin are placed in the sealing mold and clamped to perform compression molding.

9. A resin sealing method, comprising: placing a workpiece having an electronic component mounted on a circular plate-shaped member and a sheet of resin into a sealing mold and performing compression molding, the resin sealing method comprising: a step of acquiring workpiece information related to the electronic component mounting ratio or the total volume of electronic components mounted on the circular plate-shaped member in a workpiece measuring device for each workpiece supplied from the workpiece supply unit; A step of calculating the amount of resin required for each workpiece based on the workpiece information and the mounting rate or total volume of electronic components on the circular plate-shaped member detected by the workpiece measuring device; In a resin supply step, a cutter blade provided at the front end of a retractable rotary arm cuts an appropriate amount of sheet-like resin in a predetermined radius corresponding to the required amount of resin from an elongated resin sheet drawn out from a resin supply unit and formed into a predetermined thickness, and supplies the sheet-like resin in a primary compression molding process; and The workpiece and an appropriate amount of sheet-shaped resin are placed in the sealing mold and clamped to perform compression molding.

10. The resin sealing method according to claim 8 or 9, wherein if there is a shortage due to the mounting ratio of electronic components mounted on the plate-like member, an appropriate amount of resin is added to cut out the sheet-like resin.

11. The resin sealing method according to claim 8 or 9, wherein the required resin volume is calculated by subtracting the total volume of the electronic components mounted on the plate-like member from the volume of the empty cavity of the sealing mold, and an appropriate amount of resin sheet is cut out.

12. The resin sealing method according to claim 8 or 9, comprising a metering step of metering an appropriate amount of the sheet-like resin.

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