Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment

Abstract

Embodiments of the present invention provide semiconductor strip cutting and sorting equipment, package drying device and conveying device. The package drying device according to the embodiment of the present invention is used to dry individual packages in the semiconductor strip cutting and sorting equipment, wherein the package drying device comprises: a turning table, which absorbs the package and can be rotated to face upward or downward; a chamber, which is arranged below the turning table and contains water vapor scattered from the package; an upper jet unit, which is configured to be able to move in the horizontal direction inside the chamber and spray air toward the package; and a suction unit, which is arranged at the lower end of the chamber and sucks the water vapor.

Description

Technical Field

[0001] The present invention relates to a package drying device in a semiconductor strip cutting and sorting device, and more particularly to a device for rapidly and effectively drying singulated packages. Background Art

[0002] Semiconductor manufacturing processes are processes for manufacturing semiconductor elements on wafers, including exposure, evaporation, etching, ion implantation, cleaning, etc. Semiconductor strip cutting and sorting equipment cuts a strip with multiple packages into individual packages, cleans, dries, and inspects each package, and then sorts and loads it into a final storage container, i.e., a tray, into normal or defective states.

[0003] Inspection of each package is performed using a visual inspection device such as a camera. For precise inspection, each package needs to be free of foreign matter that may hinder the inspection. The cleaning liquid used to clean the cut package may also become an obstacle during the inspection process, so it is necessary to manage it so that no cleaning liquid remains on the package. Summary of the invention

[0004] Therefore, embodiments of the present invention provide a package drying device capable of quickly and effectively removing a cleaning liquid remaining in singulated semiconductor packages and a semiconductor strip cutting and sorting apparatus including the package drying device.

[0005] The problems to be solved by the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned can be clearly understood by those skilled in the art from the following description.

[0006] A package drying device according to an embodiment of the present invention is used to dry individual packages in a semiconductor strip cutting and sorting device, wherein the package drying device includes: a flip table, which adsorbs the package and can be rotated to face upward or downward; a chamber, which is arranged below the flip table to accommodate water vapor scattered from the package; an upper jet unit, which is configured to be able to move in a horizontal direction inside the chamber and spray air toward the package; and a suction unit, which is arranged at the lower end of the chamber to suck the water vapor.

[0007] According to an embodiment of the present invention, the flip table may suck the package body in an upward state, and rotate downward in the state of sucking the package body to guide the water vapor of the package body to fall into the chamber.

[0008] According to an embodiment of the present invention, the flip table may have a first length along a first horizontal direction and a second length longer than the first length along a second horizontal direction orthogonal to the first horizontal direction, and the upper jet unit may be configured to move along the first horizontal direction.

[0009] According to an embodiment of the present invention, the upper jet unit may include: a shell; an air inlet formed on one side of the shell; a heater arranged around the air inlet inside the shell; a thermally conductive film that transfers heat energy generated by the heater; and an exhaust port formed on the other side of the shell.

[0010] According to an embodiment of the present invention, the exhaust port may include: a first exhaust port, formed in a vertical direction perpendicular to the horizontal direction upward; a second exhaust port, formed in a direction inclined at a certain angle from the vertical direction to the first horizontal direction; and a third exhaust port, formed in a direction inclined at a certain angle from the vertical direction to the opposite direction of the first horizontal direction.

[0011] According to an embodiment of the present invention, the package drying device may further include: side air injection units respectively disposed on two side surfaces of the chamber to inject air downward.

[0012] According to an embodiment of the present invention, the package drying device may further include: a separation wall located above the suction unit in the chamber.

[0013] According to an embodiment of the present invention, a chamber for accommodating water vapor is arranged below the inverting table where the package is sucked, and an upper air injection unit and a suction unit are formed inside the chamber, so that the water vapor of the package can be removed quickly and effectively.

[0014] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention is shown.

[0016] Figure 2 as well as Figure 3 The inversion table is shown in a state where the package is sucked.

[0017] Figure 4 A package drying device according to an embodiment of the present invention is shown.

[0018] Figure 5 as well as Figure 6 The arrangement and moving direction of the package drying device according to the embodiment of the present invention are shown.

[0019] Figure 7a as well as Figure 7b An upper jetting unit according to an embodiment of the present invention is shown.

[0020] Figure 8 A package drying device according to another embodiment of the present invention is shown.

[0021] Figures 9 to 12 The drying and inspection process of the package according to the embodiment of the present invention is shown.

[0022] Fig.13 A drying process of a package according to yet another embodiment of the present invention is shown.

[0023] (Explanation of Reference Numerals)

[0024] 100: Loading unit 200: Cutting unit

[0025] 205: Temporary storage unit 210: Strip picker

[0026] 220: Pick up 230: Guide frame

[0027] 240: Chuck 250: Cutter

[0028] 260: Cleaning unit 300: Sorting unit

[0029] 310: Turning table 320: Drying unit

[0030] 330B: Ball inspection unit 330M: Mark inspection unit

[0031] 340: First pallet fixture driving component 341: First pallet fixture stage

[0032] 345: Second pallet fixture driving component 346: Second pallet fixture stage

[0033] 350: First transport tray driving component 351: First transport tray

[0034] 352: Second unloading tray 355: Unloading tray driving component

[0035] 356: Second transport tray 360: Inspection section

[0036] 370: Sorting picker 380: Sorting picker drive component

[0037] 800: Classification Section P: Semiconductor Package

[0038] S:Semiconductor strip DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0040] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the entire specification.

[0041] In addition, among the multiple embodiments, the same reference numerals are used for components having the same structure and only a representative embodiment is described, and in the remaining embodiments, only the structure different from the representative embodiment is described.

[0042] Throughout the specification, when it is stated that a part is "connected (or coupled)" to another part, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other components placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may be included rather than excluded.

[0043] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the relevant technology, and will not be ideally or excessively interpreted as formal meanings unless explicitly defined in this application.

[0044] Figure 1 FIG. 2 shows a schematic structure of a semiconductor strip cutting and sorting device 10 according to an embodiment of the present invention. Figure 1 , a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 , a cutting unit 200 , and a sorting unit 300 .

[0045] The semiconductor strip cutting and sorting apparatus 10 according to the embodiment of the present invention includes a loading unit 100 for loading a semiconductor strip S configured with a plurality of packages, a cutting unit 200 for cutting the semiconductor strip S and transferring singulated packages P, and a sorting unit 300 for drying and inspecting the packages P and storing them in a tray.

[0046] The loading unit 100 transfers the semiconductor strip S sent from the outside to the temporary storage unit 205 of the cutting unit 200. Figure 1 As shown in detail, the loading unit 100 may include a magazine for loading the semiconductor strips S and a pusher for pushing and delivering the semiconductor strips S. The semiconductor strips S supplied to the loading unit 100 may be located in the temporary storage unit 205 .

[0047] The strip picker 210 holds the semiconductor strip S located in the temporary storage unit 205 and transfers it to the chuck 240. The package picker 220 holds the package P cut by the cutter 250 and transferred by the chuck 240 by vacuum adsorption and transfers it to the cleaning unit 260 and the turning table 310. The guide frame 230 provides a path for the strip picker 210 and the package picker 220 to move in the X-axis direction. The guide frame 230 can be combined with a driving unit for moving the strip picker 210 and the package picker 220.

[0048] The chuck 240 can transfer the semiconductor strip S and the package P between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220, respectively. The chuck 240 can move in the Y-axis direction and can rotate around the Z-axis direction, and can place the semiconductor strip S. The chuck 240 adsorbs the semiconductor strip S transferred by the strip picker 210 and transfers it to the cutter 250. In addition, the chuck 240 transfers a plurality of packages P cut by the cutter 250 to the package picker 220. That is, the chuck 240 can reciprocate between the cutter 250 and the first guide frame 230. It can be that the package picker 220 adsorbs the semiconductor package P cleaned in the cleaning unit 260 and transfers it to the flip table 310, and the semiconductor package P transferred to the flip table 310 is dried by the drying unit 320. The flip table 310 can move along the second guide frame 315.

[0049] The classification unit 300 classifies the semiconductor packages P according to the inspection results of the semiconductor packages P. The classification unit 300 may be referred to as a transport device for transporting the individual packages P. More specifically, the classification unit 300 independently picks up the semiconductor packages P loaded on the first and second travel jig stages 341 and 346 after the inspection by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360, and classifies them in sequence according to the inspection results and transports them to other locations. The first travel jig stage 341 and the second travel jig stage 346 may be moved by the first travel jig driving component 340 and the second travel jig driving component 345, respectively.

[0050] The sorting unit 300 for this purpose may include a sorting picker 370 , a sorting picker driving part 380 , a first carry-out tray 351 , a second carry-out tray 356 , a first carry-out tray driving part 350 , and a second carry-out tray driving part 355 .

[0051] The sorting picker 370 picks up the semiconductor package P that has been inspected by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and is loaded on the first accompanying fixture table 341 and the second accompanying fixture table 346 respectively, and transfers it to the first carry-out tray 351 and the second carry-out tray 356 to be described later.

[0052] The sorting picker driving part 380 may be formed in a guide rail shape and arranged along the X-axis direction, and a part thereof is arranged adjacent to the alignment inspection unit 360. The sorting picker driving part 380 moves the sorting picker 370 in the X-axis direction. For this purpose, the sorting picker driving part 380 may be equipped with a driving tool for moving the sorting picker 370.

[0053] The first unloading tray 351 and the second unloading tray 356 can be loaded with qualified semiconductor packages P and unqualified semiconductor packages P respectively and unloaded to other locations. Different from this, the first unloading tray 351 and the second unloading tray 356 can also evaluate the grade of the semiconductor packages P according to the manufacturing status and load them respectively according to the grade. For example, the first unloading tray 351 can be loaded with semiconductor packages P of grade A, and the second unloading tray 356 can be loaded with semiconductor packages P of grade B whose manufacturing status is lower than grade A.

[0054] When the sorting picker 370 picks up the semiconductor packages P from the first accompanying fixture table 341 and the second accompanying fixture table 346 and loads them all on the first carrying tray 351 or the second carrying tray 356, the first carrying tray 351 or the second carrying tray 356 moves in the Y-axis direction to transfer the semiconductor packages P to other locations.

[0055] The first output tray driving part 350 moves the first output tray 351. The first output tray driving part 350 may have a built-in driving means for moving the first output tray 351.

[0056] The second output tray driving part 355 moves the second output tray 356. The second output tray driving part 355 may have a built-in driving means for moving the second output tray 356.

[0057] The semiconductor strip cutting and sorting device 10 can cut, clean, dry, inspect, and sort the semiconductor strips S as described above and discharge them to other locations. On the other hand, the package picker 220 according to the embodiment of the present invention is not limited to being included in the semiconductor strip cutting and sorting device 10, and can be applied to a general semiconductor package manufacturing system. Hereinafter, an apparatus and method for quickly and effectively drying the package P in the drying unit 320 using a cleaning liquid in the cleaning unit 260 will be described.

[0058] Generally, the semiconductor strip S and the package P are composed of a spherical surface B formed with a ball (Ball) for electrical connection and a marking surface M engraved with a mark of each package P. On the other hand, the state in which the spherical surface B of the package P faces upward and the marking surface M faces downward is referred to as a dead bug, and the state in which the marking surface M of the package P faces upward and the spherical surface B faces downward is referred to as a live bug. The cutting and cleaning processes in the cutting unit 200 are performed in the dead bug state in which the spherical surface B faces upward, and each package P is transferred to the flip table 310 through the package picker 220 in the dead bug state.

[0059] Reference Figure 2 (a) and Figure 3 (a), the flip table 310 includes: a peripheral frame 311 that can move in the horizontal direction; an adsorption table 312 that adsorbs and fixes the package P; and a rotation axis 313 that allows the adsorption table 312 to rotate relative to the peripheral frame 311. The adsorption table 312 can rotate around the rotation axis 313 in a state of sucking the marking surface M of the package P. Figure 2 As in (a), the spherical surface B of the package P faces upward. Alternatively, Figure 3 As shown in (b), the spherical surface B of the package P faces downward.

[0060] According to an embodiment of the present invention, in Figure 3 In this way, the package P is facing downward, and drying is performed while air is sprayed from the bottom to the top, so that the cleaning liquid remaining in the package P is separated from the package P by gravity and air pressure. In addition, according to an embodiment of the present invention, a container for accommodating the cleaning liquid separated from the package P is arranged below and the cleaning liquid is sucked at the lower end, so that the cleaning liquid can be quickly and effectively collected and discharged. The drying device of the package P according to an embodiment of the present invention is described in detail below.

[0061] Figure 4 FIG. 2 shows a package drying device according to an embodiment of the present invention. Figure 4 In the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention, the package drying device for drying the individualized package P includes: a flip table 310 capable of adsorbing the package P and rotating it to face upward or downward; a chamber 3210 arranged below the flip table to accommodate water vapor scattered from the package; an upper jet unit 3220 configured to be able to move in a horizontal direction (for example, x direction) inside the chamber 3210 and spray air toward the package P; and a suction unit 3230 arranged at the lower end of the chamber 3210 to suck water vapor.

[0062] like Figure 2 as well as Figure 3As shown in FIG. 1 , the flip table 310 includes: a peripheral frame 311 that can move in the horizontal direction; an adsorption table 312 that adsorbs and fixes the package P; and a rotation axis 313 that allows the adsorption table 312 to rotate relative to the peripheral frame 311. The adsorption table 312 can rotate around the rotation axis 313 in a state of sucking the marking surface M of the package P. Figure 2 As in (a), the spherical surface B of the package P faces upward. Alternatively, Figure 3 As shown in (b), the spherical surface B of the package P faces downward.

[0063] According to an embodiment of the present invention, the flip table 310 can suck the package body P in an upward state, and rotate downward in the state of sucking the package body P to guide the water vapor of the package body P to fall toward the chamber 3210. Figure 2 Compared with the case where drying is performed with the spherical surface B of the package P facing upward, the cleaning liquid can be removed more effectively because the cleaning liquid falls into the chamber 3210 due to gravity.

[0064] The chamber 3210, as a container for accommodating water vapor from the package body P, may be provided in a shape that narrows from top to bottom. The upper end of the chamber 3210 may be provided in an open state in order to accommodate the cleaning liquid, and the lower end of the chamber 3210 may be connected to a suction unit 3230 for sucking in the cleaning liquid and a discharge line for discharging the cleaning liquid. On the other hand, a guide (not shown) for moving the upper jet unit 3220 in a horizontal direction may be formed in the chamber 3210.

[0065] According to an embodiment of the present invention, the package drying device (drying unit 320) may further include side jet units 3240 respectively disposed on both sides of the chamber 3210 and jetting air downward. The air jetted by the side jet units 3240 guides the water vapor in the chamber 3210 downward, so that the water vapor remaining in the chamber 3210 does not splash upward but can be sucked by the suction unit 3230 at the lower side.

[0066] In addition, the package drying device (drying unit 320) may further include a partition wall 3250 located above the suction unit 3230 inside the chamber 3210. The partition wall 3250 may include Figure 4 In this way, a partition wall is formed vertically in the middle area of ​​the chamber 3210 and a blocking wall is formed above the partition wall. The air ejected by the side jet unit 3240 forms a vortex through the partition wall and the blocking wall. The vortex formed by the partition wall and the blocking wall can guide the water vapor in the chamber 3210 to prevent it from splashing upward and being sucked by the suction unit 3230.

[0067] Figure 5 as well as Figure 6 The arrangement and moving direction of the package drying device according to the embodiment of the present invention are shown.

[0068] According to an embodiment of the present invention, the flip table 310 may have a first length (e.g., 230 mm) along a first horizontal direction (e.g., x direction) and a second length (e.g., 330 mm) longer than the first length along a second horizontal direction (e.g., y direction) orthogonal to the first horizontal direction. Figure 5 As shown, the turning stage 310 may have a shape that is long in the y direction.

[0069] Here, the upper jet unit 3220 may be configured to move along a first horizontal direction (eg, x direction). The upper jet unit 3220 may move along a guide disposed inside the chamber 3210, or may move along with the movement of the chamber 3210. Figure 5 as well as Figure 6 As shown, the drying unit 320 is long along the second horizontal direction (e.g., y direction) and can reciprocate along the first horizontal direction (e.g., x direction), represented by the chamber 3210 and the jet unit 3220. Therefore, compared with the case of moving along the second horizontal direction (e.g., y direction), the reciprocating movement path can be made shorter, which can shorten the time required for drying.

[0070] On the other hand, the turning table 310 can be configured as a plurality of turning tables. When drying is performed by one drying unit 320, the turning table 310 can be configured as follows. Fig.13 In this way, the drying unit 320 (chamber 3210) reciprocates in the first direction (e.g., x direction) to dry the package P. In this case, the chamber 3210 and the upper jet unit 3220 are moved in the first direction (e.g., x direction) which is shorter than the case of moving in the second direction (e.g., y direction), so that the drying time can also be shortened.

[0071] Figure 7a as well as Figure 7b The upper jet unit 3220 according to an embodiment of the present invention is shown. Figure 7a As shown, the upper jet unit 3220 according to an embodiment of the present invention may include a shell 3221, an air inlet 3222 formed on one side of the shell 3221, a heater 3223 arranged around the air inlet 3222 inside the shell 3221, a thermal conductive film 3224 for transferring heat energy generated from the heater 3223, and an exhaust port 3225 formed on the other side of the shell 3221.

[0072] The housing 3221 may be formed long along the second direction (e.g., y direction) inside the chamber 3210, and may be configured to be movable in combination with a guide for moving along the first direction (e.g., x direction). An air inlet 3222 formed on one side of the housing 3221 is connected to a pipeline for inflowing air, and the air inflowing through the air inlet 3222 is supplied to the inside of the housing 3221. The heater 3223 applies thermal energy to the air supplied through the air inlet 3222, and the thermal conductive film 3224 uniformly transfers the thermal energy released by the heater 3223 to the space inside the housing 3221. Through the thermal energy, the high-temperature air can be discharged through the exhaust port 3225 to remove water vapor from the package P. According to an embodiment of the present invention, the upper jet unit 3220 sprays high-temperature air toward the package P, and the thermal energy of the high-temperature air, like a hair dryer, can evaporate and remove the water vapor of the package P, so that the package P can be dried more quickly and effectively.

[0073] According to an embodiment of the present invention, Figure 7b As shown, the exhaust port 3225 includes: a first exhaust port (3225A) formed in a vertical direction (e.g., z direction) perpendicular to the horizontal direction (e.g., x, y direction) upward; a second exhaust port 3225B formed in a direction inclined at a certain angle from the vertical direction (e.g., z direction) to the first horizontal direction (e.g., x direction); and a third exhaust port 3225C formed in a direction inclined at a certain angle from the vertical direction (e.g., z direction) to the opposite direction of the first horizontal direction (e.g., -x direction). Figure 7b As shown, the upper air injection unit 3220 injects air not only in the vertical direction but also in the oblique direction through the exhaust port 3225, so that air is also injected into the space where water vapor often condenses, such as the side surface of the package body P, so that the water vapor can be effectively removed.

[0074] Figure 8 A package drying device according to another embodiment of the present invention is shown. Figure 8 The package drying device further includes an air curtain forming unit 3260 formed on both sides of the chamber 3210 and forming an air curtain by spraying air upward. The air curtain forming unit 3260 discharges air in a vertical direction (e.g., z direction) to form an air curtain so that the cleaning liquid dropped by the air sprayed by the upper jet unit 3220 does not escape to the outside. The cleaning liquid is not separated to the outside but is contained in the chamber 3210, so that water vapor can be prevented from scattering to devices around the drying unit 320, such as the ball inspection unit 330B.

[0075] In addition, in the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention, the package conveying device for conveying individualized packages P includes: a flip table 310, which adsorbs the marking surface M of the package P from below when the spherical surface B of the package P faces upward, and rotates the spherical surface B of the package P to face downward; a drying unit 320, which is located below the flip table 310 to dry the package P; a ball inspection unit 330B, which is located below the flip table 310 to inspect the spherical surface B of the package P; accompanying fixture tables 341, 346, which receive the package P from the flip table 310 when the spherical surface B faces downward; and a mark inspection unit 330M, which is located above the accompanying fixture tables 341, 346 to inspect the mark surface M of the package P. Here, the drying unit 320 may include: a chamber 3210, which is arranged below the flip table 310 to accommodate water vapor scattered from the package P; an upper jet unit 3220, which is configured to be able to move in a horizontal direction inside the chamber 3210 and spray air toward the package P; and a suction unit 3230, which is arranged at the lower end of the chamber 3210 to suck water vapor.

[0076] The semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a loading unit 100 for loading a semiconductor strip S with a plurality of packages arranged thereon; a cutting unit 200 for cutting the semiconductor strip S and transferring individual semiconductor packages; and a sorting unit 300 for drying and inspecting the semiconductor packages P and storing them in trays 351 and 356. The sorting unit 300 includes: a turning table 310 for sucking the marking surface M of the package P from below in a state where the spherical surface B of the package P faces upward, and rotating the package P so that the spherical surface B of the package P faces downward; a drying unit 320 for drying the package P under the turning table 310; a ball inspection unit 330B for inspecting the spherical surface B of the package P under the turning table 310; portable jig tables 341 and 346 for receiving the package P from the turning table 310 in a state where the spherical surface B faces downward; and a mark inspection unit 330M for inspecting the mark surface M of the package P over the portable jig tables 341 and 346. Here, the drying unit 320 may include: a chamber 3210, which is arranged below the flip table 310 to accommodate water vapor scattered from the package P; an upper jet unit 3220, which is configured to be able to move in a horizontal direction inside the chamber 3210 and spray air toward the package P; and a suction unit 3230, which is arranged at the lower end of the chamber 3210 to suck water vapor.

[0077] Figures 9 to 12 FIG. 2 shows a drying and inspection process of a package body P according to an embodiment of the present invention. Fig. 9As described above, the package P is transferred to the flip table 310, and the spherical surface B of the package P adsorbed by the flip table 310 faces downward due to the rotation of the flip table 310. As described above, the drying unit 320 is located below the flip table 310 to remove moisture from the package P.

[0078] Afterwards, if Fig.10 In this way, the package P is inspected by the ball inspection unit 330B located below the inverting table 310. If the inspection is completed, Fig.11 In this way, the inverting table 310 is located above the pallet tables 341 and 346. After that, the inverting table 310 is lowered or the pallet tables 341 and 346 are raised and the pallet tables 341 and 346 are in contact with the package P, the vacuum adsorption of the inverting table 310 is released and the package P is placed on the pallet tables 341 and 346. At this time, the package P placed on the pallet tables 341 and 346 is in a live state, and the marking surface M faces upward. After that, the pallet tables 341 and 346 on which the package P is placed are moved by the pallet driving parts 340 and 345, and at the same time, the marking inspection unit 330M located above performs inspection.

[0079] According to the embodiment of the present invention, the drying unit 320 and the inspection unit 330B are performed together in sequence. According to the embodiment of the present invention, by performing the inspection and drying at one time, the package P can be transported more quickly, and the processing efficiency of the package P can be increased.

[0080] Although in Figure 1 2 illustrates a case where there is one inverting stage 310, but the inverting stage 310 may be provided in plurality, such as the first inverting stage 310-1 and the second inverting stage 310-2. Fig.13 As shown, the drying unit 320 may reciprocate along a first direction (eg, x direction) and dry the package body P adsorbed on the first inversion stage 310 - 1 and the second inversion stage 310 - 2 .

[0081] This embodiment and the drawings attached to this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of rights of the present invention.

[0082] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, but rather to the appended claims. All concepts that are equivalent to or equivalently modified to the claims belong to the scope of the concept of the present invention.

Claims

1. A package drying device for drying singulated packages in a semiconductor strip cutting and sorting device, wherein: The package drying device comprises: A turning table, which absorbs the package and can be rotated to face upward or downward; a chamber disposed below the inverting stage to contain water vapor scattered from the package body; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and to inject air toward the package body; and A suction unit is disposed at the lower end of the chamber to suck the water vapor. The inverting stage sucks the package while being located above the chamber and rotates from an upward state to a downward state, thereby guiding water vapor of the package to fall into the chamber.

2. The package drying device according to claim 1, characterized in that: The turning table has a first length along a first horizontal direction and a second length along a second horizontal direction orthogonal to the first horizontal direction that is longer than the first length. The upper air injection unit is configured to move along the first horizontal direction.

3. The package drying device according to claim 1, characterized in that: The upper jet unit comprises: case; an air inlet formed on one side of the housing; A heater is arranged inside the housing around the air inlet; a thermally conductive film that transfers heat energy generated from the heater; and An exhaust port is formed at the other side of the shell.

4. The package drying device according to claim 3, characterized in that: The exhaust port comprises: A first discharge port is formed in a vertical direction perpendicular to the horizontal direction upward; A second discharge port is formed in a direction inclined at a certain angle from the vertical direction to the first horizontal direction; and The third discharge port is formed in a direction inclined at a certain angle from the vertical direction to the opposite direction of the first horizontal direction.

5. The package drying device according to claim 1, characterized in that: The package drying device also includes: The side air injection units are respectively arranged on both side surfaces of the chamber to inject air downward.

6. The package drying device according to claim 1, characterized in that: The package drying device also includes: A separating wall is located inside the chamber above the suction unit.

7. A package handling device for handling individual packages in a semiconductor strip cutting and sorting device, wherein: The package handling device comprises: The turning table is configured to suck the marked surface of the package body from below with the spherical surface of the package body facing upward, and rotate the spherical surface of the package body to face downward; A drying unit, located below the turning table and used to dry the package; A ball inspection unit, located below the flip table and inspecting the spherical surface of the package; A portable fixture table receives the package from the flip table with the spherical surface facing downward; and A marking inspection unit is located above the portable fixture table and inspects the marking surface of the package body. The drying unit comprises: a chamber disposed below the inverting stage to contain water vapor scattered from the package body; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and to inject air toward the package body; and A suction unit is disposed at the lower end of the chamber to suck the water vapor. The inverting stage sucks the package while being located above the chamber and rotates from an upward state to a downward state, thereby guiding water vapor of the package to fall into the chamber.

8. The package transport device according to claim 7, characterized in that: The turning table has a first length along a first horizontal direction and a second length along a second horizontal direction orthogonal to the first horizontal direction that is longer than the first length. The upper air injection unit is configured to move along the first horizontal direction.

9. The package transport device according to claim 7, characterized in that: The upper jet unit comprises: case; an air inlet formed on one side of the housing; A heater is arranged inside the housing around the air inlet; a thermally conductive film that transfers heat energy generated from the heater; and An exhaust port is formed at the other side of the shell.

10. The package transport device according to claim 9, characterized in that: The exhaust port comprises: A first discharge port is formed in a vertical direction perpendicular to the horizontal direction upward; A second discharge port is formed in a direction inclined at a certain angle from the vertical direction to the first horizontal direction; and The third discharge port is formed in a direction inclined at a certain angle from the vertical direction to the opposite direction of the first horizontal direction.

11. The package transport device according to claim 7, characterized in that: The drying unit further comprises: The side air injection units are respectively arranged on both side surfaces of the chamber to inject air downward.

12. The package transporting device according to claim 7, characterized in that: The drying unit further comprises: A separating wall is located inside the chamber above the suction unit.

13. A semiconductor strip cutting and sorting device, comprising: A loading unit for loading a semiconductor strip equipped with a plurality of packages; a cutting unit for cutting the semiconductor strip and transferring singulated semiconductor packages; as well as a sorting unit, drying and inspecting the semiconductor packages and storing the semiconductor packages in a tray, The taxonomic units include: The turning table is configured to suck the marked surface of the package body from below with the spherical surface of the package body facing upward, and rotate the spherical surface of the package body to face downward; A drying unit, located below the turning table and used to dry the package; A ball inspection unit, located below the flip table and inspecting the spherical surface of the package; A portable fixture table receives the package from the flip table with the spherical surface facing downward; and A marking inspection unit is located above the portable fixture table and inspects the marking surface of the package body. The drying unit comprises: a chamber disposed below the inverting stage to contain water vapor scattered from the package body; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and to inject air toward the package body; and A suction unit is disposed at the lower end of the chamber to suck the water vapor. The inverting stage sucks the package while being located above the chamber and rotates from an upward state to a downward state, thereby guiding water vapor of the package to fall into the chamber.

14. The semiconductor strip cutting and sorting equipment according to claim 13, characterized in that: The turning table has a first length along a first horizontal direction and a second length along a second horizontal direction orthogonal to the first horizontal direction that is longer than the first length. The upper air injection unit is configured to move along the first horizontal direction.

15. The semiconductor strip cutting and sorting equipment according to claim 13, characterized in that: The upper jet unit comprises: case; an air inlet formed on one side of the housing; A heater is arranged inside the housing around the air inlet; a thermally conductive film that transfers heat energy generated from the heater; and An exhaust port is formed at the other side of the shell.

16. The semiconductor strip cutting and sorting equipment according to claim 15, characterized in that: The exhaust port comprises: A first discharge port is formed in a vertical direction perpendicular to the horizontal direction upward; A second discharge port is formed in a direction inclined at a certain angle from the vertical direction to the first horizontal direction; and The third discharge port is formed in a direction inclined at a certain angle from the vertical direction to the opposite direction of the first horizontal direction.

17. The semiconductor strip cutting and sorting equipment according to claim 13, characterized in that: The drying unit further comprises: Side jet units are respectively arranged on both sides of the chamber to jet air downward; and A separating wall is located inside the chamber above the suction unit.

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