Substrate processing apparatus and substrate processing method

Abstract

This invention relates to a substrate processing apparatus and a substrate processing method. The footprint of the substrate processing apparatus is reduced. The substrate processing apparatus includes: a carrier module that holds a carrier for housing a substrate; a processing module that transports a substrate from the carrier module to the processing module; another processing module that overlaps with the processing module and transports a substrate from the other processing module to the carrier module; a lifting and transfer mechanism having a laterally extending shaft and a support surface opposite to and supporting the substrate, such that the shaft and support surface move up and down between a position for transferring a substrate relative to a first processing module transport mechanism and a position for transferring a substrate relative to a second processing module; and a rotation mechanism that rotates the support surface about the shaft such that when the lifting and transfer mechanism is located in a first region and a second region, the support surface is in a first orientation, and when the lifting and transfer mechanism moves up and down between the first region and the second region, the support surface is in a second orientation with an inclination greater than the first orientation relative to the horizontal plane.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] In the manufacturing process of semiconductor devices, semiconductor wafers (hereinafter referred to as wafers) are transported between various processing components to undergo various processes such as liquid processing and heat processing. Patent Document 1 describes a coating apparatus including processing modules, each processing module comprising: multiple unit modules, each having multiple processing components stacked on top of each other; and a main arm disposed in each unit module for transporting wafers between the processing components. In this example, the unit modules for forming a SOC film, an anti-reflective film, and a resist film are each stacked with two layers from the bottom layer side. Furthermore, it is described that the wafers are transported from the bottom layer to the top layer in the order of the unit modules for forming the SOC film, the unit modules for forming the anti-reflective film, and the unit modules for forming the resist film, and the three films are stacked to form a film.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-208004 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a technique for reducing the footprint of a substrate processing apparatus.

[0008] Solution for solving the problem

[0009] The substrate processing apparatus of this technical solution includes:

[0010] A carrier module, which serves as a carrier for storing the substrate;

[0011] A processing module for conveying the substrate from the carrier module to the processing module, the processing module comprising: a plurality of first processing components for processing the substrate respectively; and a first conveying mechanism for conveying the substrate together with the plurality of first processing components;

[0012] Another processing module, which overlaps with the first processing module and transports the substrate from the other processing module to the carrier module, includes: a plurality of second processing components that respectively process the substrate; and a second transport mechanism that is used together for transporting the substrate by the plurality of second processing components.

[0013] A lifting and transferring mechanism includes: a shaft extending laterally; and a support portion having a support surface opposite to and supporting the substrate, the support portion extending from the shaft in a direction intersecting the extending direction of the shaft, such that the shaft and the support portion are lifted and lowered between a first position for transferring the substrate relative to a first conveying mechanism and a second position for transferring the substrate relative to a second conveying mechanism; and

[0014] A rotating mechanism that causes the support portion to rotate about the axis so that the orientation of the support portion changes between a first orientation and a second orientation, the first orientation being used to intersect the substrate at the first position and the second position respectively, the second orientation having a greater inclination of the support surface relative to the horizontal plane than the first orientation, so as to move between the first position and the second position.

[0015] The effects of the invention

[0016] This disclosure can reduce the footprint of the substrate processing apparatus. Attached Figure Description

[0017] Figure 1 This is a cross-sectional top view of a substrate processing apparatus according to an embodiment of the present disclosure.

[0018] Figure 2 This is a longitudinal sectional front view of the substrate processing apparatus.

[0019] Figure 3 This is a longitudinal sectional front view of the substrate processing apparatus.

[0020] Figure 4 This is a left-side view of the substrate processing apparatus.

[0021] Figure 5 This is a longitudinal sectional side view of the substrate processing apparatus.

[0022] Figure 6 This is a longitudinal sectional side view of the substrate processing apparatus.

[0023] Figure 7 This is a side view showing the lifting and transfer mechanism provided in the substrate processing apparatus.

[0024] Figure 8 This is a top view showing the lifting and transferring mechanism.

[0025] Figure 9 This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0026] Figure 10 This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0027] Figure 11This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0028] Figure 12 This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0029] Figure 13 This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0030] Figure 14 This is an explanatory diagram illustrating the operation of the lifting and transferring mechanism.

[0031] Figure 15 This is a schematic diagram of the transport path in the substrate processing apparatus.

[0032] Figure 16 This is a cross-sectional top view of a substrate processing apparatus, which is another example of an embodiment of this disclosure.

[0033] Figure 17 This is a longitudinal sectional front view of the substrate processing apparatus.

[0034] Figure 18 This is an explanatory diagram showing another configuration example of the lifting and transferring mechanism. Detailed Implementation

[0035] Refer to each Figure 1 Cross-sectional top view, Figure 2 , Figure 3 The longitudinal sectional front view illustrates an example of the substrate processing apparatus 1 according to an embodiment of the present disclosure. Figure 2 , Figure 3 Cross-sections of the apparatus at different locations are shown. In the substrate processing apparatus 1, the carrier module D1, the first processing module D2, and the second processing module D3 are arranged in a straight line in the transverse direction in this order, and adjacent modules are connected to each other. These modules (carrier module, first processing module, and second processing module) D1 to D3 are each divided by a housing, and a transport area for the wafer W, which serves as the substrate, is formed inside each housing.

[0036] In the following description, the arrangement of these modules D1 to D3 will be set to left-right, with the carrier module D1 side designated as the left and the second processing module D3 as the right. Furthermore, regarding the front-back orientation of the device, the side closest to the carrier module D1 when viewed from the left side will be designated as the front, and the side inside will be designated as the rear.

[0037] Before describing each module D1 to D3 in detail, a general structure of the substrate processing apparatus 1 will be described. For example, a wafer W is transported to the substrate processing apparatus 1 in a carrier C called a FOUP (Front Opening Unify Pod). The substrate processing apparatus 1 includes processing units that perform various processes such as coating film formation and heating of the wafer W after coating film formation. The coating film is formed by coating the wafer W with various coating liquids as a liquid treatment.

[0038] The first processing module D2 and the second processing module D3 are each divided into two parts vertically. The lower and upper sides of the first processing module D2, thus divided in this way, are designated as the first lower processing module D21 and the first upper processing module D22, respectively. Similarly, the lower and upper sides of the second processing module D3, also divided in this way, are designated as the second lower processing module D31 and the second upper processing module D32, respectively. Therefore, the first lower processing module D21 and the first upper processing module D22 are stacked on top of each other, and the second lower processing module D31 and the second upper processing module D32 are stacked on top of each other. Consequently, the first lower processing module D21 and the first upper processing module D22 are adjacent to each other, and the second lower processing module D31 and the second upper processing module D32 are adjacent to each other.

[0039] The wafer W is transported in the following order: carrier module D1 → first lower processing module D21 → second lower processing module D31 → second upper processing module D32 → first upper processing module D22 → carrier module D1. Therefore, with carrier module D1 as the reference, the first lower processing module D21 and the second lower processing module D31 form the forward path of the wafer W, and the first upper processing module D22 and the second upper processing module D32 form the return path of the wafer W. Sometimes, the lower processing modules constituting the forward path are uniformly referred to as lower processing module G1, and the upper processing modules constituting the return path are uniformly referred to as upper processing module G2.

[0040] Thus, by transporting the wafer W along the forward and return paths, three coating films are sequentially formed and stacked on top of each other. The topmost film of these coating films is a resist film, the film below it is referred to as the intermediate film, and the film below that is referred to as the lower film. The lower film is formed in the processing assembly along the forward path, while the intermediate film and the resist film are formed in the processing assembly along the return path. Furthermore, an assembly refers to a location where the wafer W is placed, excluding the transport mechanism. The assembly that processes the wafer W as described above is referred to as a processing assembly, and this processing also includes obtaining images for inspection.

[0041] The following also refers to Figure 4The side view illustrates the carrier module D1. A carrier transport mechanism (external transport mechanism), not shown, installed in the cleanroom where the substrate processing apparatus 1 is installed, feeds the carrier C into and out of the carrier module D1. The carrier module D1 is the module that feeds and sends the wafer W into and out of the carrier C.

[0042] The housing that constitutes the carrier module D1 is designated as 11. This housing 11 is square, with its lower side protruding to the left to form a support platform 12. Furthermore, two longitudinally separated portions of the left side of the housing 11, located above the support platform 12, protrude to the left to form support platforms 13 and 14, respectively. The lower support platform and the upper support platform are designated as 13 and 14, respectively.

[0043] Support platforms 12-14, for example, can each hold four carriers C spaced apart in the front-to-back direction, and are provided with stages for holding the carriers C in this manner. When viewed from the left, these stages are arranged in a 3×4 matrix, for example. Furthermore, the left end of support platform 12 protrudes to the left of support platforms 13 and 14, and the stages of support platform 12 are located on the right side of support platform 12 and below support platforms 13 and 14. The interior of support platform 12 is a storage area for bottles, which, as described above, store the processing liquid for liquid treatment in the first processing module D2 and the second processing module D3.

[0044] Using the carrier transfer mechanism 21 described later, the carrier C can be transferred between the various stages. Regarding each stage, the two stages on the front side of each of the support stages 12 and 13 are configured as movable stages 15 for loading and unloading the carrier C relative to the device. Therefore, when viewed from the left, the movable stages 15 are arranged in a 2×2 matrix. These movable stages 15 move between the loading position on the right side for loading and unloading the wafer W and the unloading position on the left side for transferring the carrier C to the carrier transfer mechanism 21. In this example, the movable stage 15 of the support stage 12 serves as a stage (loading member) for loading the carrier C to deliver unprocessed wafers W into the device, while the movable stage 15 of the support stage 13 serves as a stage (unloading member) for loading the carrier C to receive wafers W that have been processed by the device. Their uses are thus differentiated. However, a mobile platform 15 can also be used as both a loading and unloading component.

[0045] Regarding the other platforms, the two platforms on the rear side of support platforms 12 and 13 and the two platforms on support platform 14 constitute a temporary platform 16. Additionally, the other two platforms on support platform 14 constitute an infeed platform 17 and an outfeed platform 18. For example, the platform on the rear end side and the platform on the front end side of support platform 14 are the infeed platform 17 and the outfeed platform 18, respectively. These infeed platforms 17 and outfeed platforms 18 are platforms for placing the carrier C so that the aforementioned external conveying mechanism can respectively feed and discharge the carrier C relative to the substrate processing apparatus 1.

[0046] The carrier C is transferred in the following order: input platform 17 → moving platform 15 of support platform 12 → moving platform 15 of support platform 13 → output platform 18. When transferring the carrier C between the platforms in this way, if the platform to which the transfer is to be made is not available (occupied by other carrier C), the carrier C is placed on the temporary platform 16 and left to standby until the platform to which the transfer is to be made available.

[0047] A carrier transfer mechanism 21 is provided above the left side of the support platform 12. The carrier transfer mechanism 21 includes: a multi-joint arm 22, which is capable of holding the held part located on the upper part of the carrier C; and a moving mechanism 23, which is capable of moving the multi-joint arm 22 up and down and moving it back and forth. The carrier transfer mechanism 21 can transfer the carrier C between the platforms as described above.

[0048] A conveying port 24 for feeding and unloading wafer W is formed on the left side wall of the housing 11. The conveying ports 24 are arranged in a 2×2 matrix corresponding to the configuration of the movable stage 15. Each conveying port 24 is provided with a door 25. The door 25 can hold the cover of the carrier C on the movable stage 15 at the loading position, and can move while holding the cover to open and close the conveying port 24.

[0049] The aforementioned transport port 24 faces the transport area 31 of the wafer W formed within the housing 11. This transport area 31 is formed as a straight line with a relatively long front-to-back length when viewed from above. A transport mechanism 32 is provided on the front side of this transport area 31. The transport mechanism 32 includes a base that can move back and forth freely, move up and down freely, and rotate freely about a vertical axis, and a holding part for the wafer W that can move forward and backward on the base. The transport mechanism 32 can approach the carrier C on the movable stage 15 at the aforementioned loading position, the component stack T1 described later, and the pre-processing inspection component 41 described later, and perform the transfer of the wafer W.

[0050] The carrier module D1 is equipped with a pre-processing inspection component 41, which takes an image of the surface of the wafer W before processing by the substrate processing apparatus 1. The image data is sent to the control unit 10 (described later), which determines the presence or absence of abnormalities in the wafer W based on the image data. The pre-processing inspection component 41 is configured as a long and flat cuboid shape, with the right side located at the center of the front and rear of the transport area 31, and the left side protruding outward through the left side wall of the housing 11.

[0051] The pre-processing inspection assembly 41 includes: a stage 42 that can move freely left and right within the assembly; a semi-transparent mirror 43 disposed above the movement path of the stage 42; an illumination unit 44 that illuminates downwards by means of the semi-transparent mirror 43; and a camera 45 disposed to the left of the semi-transparent mirror 43 (see reference). Figure 3 The wafer W is transferred relative to the stage 42 located on the right side of the assembly using the transport mechanism 32. As the stage 42, which is transferred to the wafer W in this way, moves to the left and passes under the semi-transparent mirror 43, light is irradiated by the illumination unit 44, and the wafer W reflected on the semi-transparent mirror 43 is photographed by the camera 45 to obtain the image data described above.

[0052] Moreover, such as Figure 1 As shown, a transport mechanism 33 is provided in the transport area 31, located behind the pre-processing inspection assembly 41 when viewed from above. The transport mechanism 33 includes a base that can be raised and lowered and rotated about a vertical axis, and a holding part for the wafer W that can move back and forth on the base. The transport mechanism 33 is capable of transferring the wafer W relative to the assembly stack T1 described later.

[0053] Next, the component stack T1 will be described. This component stack T1 is constructed by longitudinally overlapping a temperature adjustment component SCPL and a temporary wafer-mounting junction component TRS. The component stack T1 is located at the center of the front and rear of the transport area 31. Therefore, when viewed from above, the component stack T1 is sandwiched between transport mechanisms 32 and 33 in the front-rear direction, and is arranged overlapping with the pre-processing inspection component 41 on the right side of the pre-processing inspection component 41. The junction component TRS, for example, includes a plurality of pins arranged laterally, and the wafer W is transferred relative to these pins by the lifting and lowering action of the transport mechanism. The SCPL, for example, is configured to connect a refrigerant flow path to the plate on which the wafer W is mounted, thereby cooling the mounted wafer W, and the wafer W is transferred relative to the plate by the lifting and lowering action of the transport mechanism.

[0054] In addition, SCPLs are also located in modules other than carrier module D1, and the SCPLs in these modules have the same structure as those in carrier module D1. Furthermore, TRSs are also located in modules other than D1. From this point forward, numbers will be added after SCPLs and TRSs to distinguish them from each other. Moreover, multiple TRSs and SCPLs may be stacked in various locations. That is, multiple TRSs and SCPLs with the same number may be provided, but only one is shown for illustration purposes. Furthermore, in this specification, a stack of components refers to components that are arranged overlappingly when viewed from above; these components can be separated from each other or in contact with each other.

[0055] A portion of the components constituting the component stack T1 is located below the pre-processing inspection component 41, and another portion is located above the pre-processing inspection component 41. For example, arranged from bottom to top in the order of TRS1, TRS2, SCPL1, TRS3, with the pre-processing inspection component 41 located between SCPL1 and TRS3 (see reference). Figure 3 Furthermore, for example, TRS1, TRS2, and SCPL1 are located at the height of the first lower processing module D21, and TRS3 is located at the height of the first upper processing module D22. The conveying mechanism 33 can access each of these components constituting the component stack T1, and the conveying mechanism 32 can access TRS1 and TRS2.

[0056] TRS1 and TRS2 are used for the transfer of wafers W between transport mechanisms 32 and 33. SCPL1 is used for the transfer of wafers W between the first lower processing module D21 and the carrier module D1. Therefore, the transport mechanism 6A of the first lower processing module D21, described later, can also access SCPL1. Additionally, TRS3 is used for the transfer of wafers W between the first upper processing module D22 and the carrier module D1. Therefore, the transport mechanism 6B of the first upper processing module D22, described later, can also access TRS3.

[0057] A hydrophobication treatment assembly 30 is provided behind the conveying mechanism 33. This assembly supplies processing gas to the wafer W to perform hydrophobication treatment before the coating film is formed. For example, the hydrophobication treatment assembly 30 is stacked at the height of the second upper processing module D32, and the wafer W is transferred relative to the hydrophobication treatment assembly 30 by the conveying mechanism 33. The hydrophobication treatment assembly 30 includes a hot plate that holds the wafer W, similar to the hot plate 55 provided in the heating assembly 54 described later, and a liftable cover that covers the hot plate. The wafer W is hydrophobized by supplying processing gas to the sealed space formed by the cover on the hot plate.

[0058] Next, also refer to the side view as a longitudinal section. Figure 5The first processing module D2 is described below. The front side of the first processing module D2 is divided vertically into eight layers, each designated as E1 to E8 from bottom to top. The lower layers E1 to E4 are contained within the first lower processing module D21, and the upper layers E5 to E8 are contained within the first upper processing module D22. Each layer constitutes an area where liquid processing components can be installed.

[0059] First, the first upper processing module D22 will be explained. Resist coating assemblies 51 are provided as liquid treatment assemblies in layers E5 to E8. Each resist coating assembly 51 includes a nozzle (not shown) and two cups 52 arranged side-by-side to hold the wafer W. A pump (not shown) supplies resist liquid from the aforementioned cups to the surface of the wafer W for processing.

[0060] A wafer transport area 53 is provided behind layers E5 to E8. This transport area 53 extends from the left end to the right end of the upper processing module D22, forming a straight line when viewed from above. Therefore, the extension direction of the transport area 53 is orthogonal to the extension direction of the transport area 31 of the carrier module D1. Furthermore, the transport area 53 is formed from the height of layer E5 to the height of layer E8. That is to say, the transport area 53 is not divided into units for each layer E5 to E8.

[0061] Furthermore, behind the conveying area 53, the processing components are arranged in seven layers, for example, stacked longitudinally, with two stacked processing components arranged side by side. That is, the stacked processing components and the aforementioned cup 52 are respectively arranged along the extension direction of the conveying area 53.

[0062] The stack of the processing components arranged side-by-side described above is designated as the rear-side processing unit 50. The processing components constituting this rear-side processing unit 50 include multiple heating components 54. The heating components 54 in the first upper processing module D22 are components for removing solvent from the coating film, including a hot plate 55 for placing and heating the wafer W and a cooling plate 56 for adjusting the temperature of the wafer W. The cooling plate 56 can move between a front position where the wafer W is transferred using the lifting action of the transport mechanism 6B (described later) and a rear position overlapping with the hot plate 55. The wafer W is transferred between the hot plate 55 and the cooling plate 56 through the cooperation of the lifting action of a pin (not shown) on the hot plate 55 and this movement of the cooling plate 56.

[0063] The transport area 53, which serves as the main transport path, is equipped with the aforementioned transport mechanism 6B, which is the main transport mechanism. The transport mechanism 6B includes a base 61 that can move freely left and right, move freely up and down, and rotate freely about a vertical axis, and a holding part 62 that can move freely forward and backward on the base 61. In addition, each transport mechanism in the substrate processing apparatus 1, including the transport mechanism 6B, has two holding parts, which can move independently on the base.

[0064] A moving mechanism 63 for moving the base 61 of the aforementioned transport mechanism 6B left and right is provided below the rear-side processing unit 50. The transport mechanism 6B is capable of transferring wafers W relative to the processing components within the first upper processing module D22, the TRS3 of the carrier module D1, and the SCPL of the second upper processing module D32 (described later). Therefore, the transport mechanism 6B is used for all these components.

[0065] Next, the first lower processing module D21 will be described. This first lower processing module D21 has a structure substantially the same as the first upper processing module D22 described above. The following description will focus on the differences between it and the first upper processing module D22. No liquid treatment assembly is provided in layer E1, but a liquid coating assembly 47 for applying the solution for forming the lower film is provided in layers E2 to E4 as a liquid treatment assembly. The liquid coating assembly 47 has the same structure as the resist coating assembly 51, except that the solution for forming the lower film is supplied from the nozzle instead of the resist.

[0066] The main conveying mechanism located in the conveying area 53 is designated as conveying mechanism 6A, and has the same structure as the conveying mechanism 6B described above. This conveying mechanism 6A delivers wafers W to each processing component of the first lower processing module D21, the SCPL1 of the aforementioned component stack T1, and the SCPL of the second lower processing module D31, which will be described later.

[0067] Next, the second processing module D3 will be described. This second processing module D3 has a structure largely the same as the first processing module D2; the following description will focus on the differences from the first processing module D2. Firstly, the second upper processing module D32 does not have a processing component in layer E5, but has a liquid coating assembly 48 for intermediate film formation as a liquid treatment assembly in layers E6 to E8. The liquid coating assembly 48 has the same structure as the resist coating assembly 51, except that it has a nozzle for supplying the liquid for intermediate film formation instead of supplying the resist from the nozzle. The main transport mechanism of the second upper processing module D32 is a transport mechanism 6D. This transport mechanism 6D can transfer wafers W relative to the various components, including SCPL and TRS (described later), provided within the second upper processing module D32.

[0068] Next, the second lower processing module D31 will be described. No liquid processing assembly is provided in the second lower processing module D31. Furthermore, the rear processing section 50, including the heating assembly 54, is provided in the same manner as the other processing modules D21, D22, and D32. The heating assembly 54 of this second lower processing module D31 is used to heat the lower film in stages, together with the heating assembly 54 of the first lower processing module D21, to solidify the lower film. The main transport mechanism of the second lower processing module D31 is designated as the transport mechanism 6C. This transport mechanism 6C performs wafer W transfer relative to the various components provided within the second lower processing module D31, including the SCPL and TRS (described later).

[0069] Furthermore, the left side of each liquid processing component in the first lower processing module D21, the first upper processing module D22, the second lower processing module D31, and the second upper processing module D32 described above constitutes an auxiliary equipment mounting area 91 for the liquid processing component. This auxiliary equipment mounting area 91 is located in front of the conveying area 53 of each processing module D21, D22, D31, and D32, and is provided from the lower part of the lower processing module G1 to the upper part of the upper processing module G2. Therefore, auxiliary equipment mounting areas 91 are provided in the first processing module D2 and the second processing module D3 respectively. Figure 6 The longitudinal sectional side view shows the auxiliary equipment installation area 91 of the second processing module D3. The auxiliary equipment installation areas 91 of the first processing module D2 and the second processing module D3 are provided with exhaust passages, liquid drainage passages, and power supply cables that are connected to the liquid treatment components in each processing module.

[0070] Furthermore, the left side of the rear processing section 50 of each of the processing modules D21, D22, D31, and D32, and the rear side of the conveying area 53, constitutes an auxiliary equipment installation area 92. Therefore, the auxiliary equipment installation area 92, like the auxiliary equipment installation area 91, is respectively provided in the first processing module D2 and the second processing module D3, extending from the lower part of the lower processing module G1 to the upper part of the upper processing module G2. The upper part of the auxiliary equipment installation area 92 constitutes an area for installing various electrical devices (electrical apparatuses) to operate the processing components in the processing module where the auxiliary equipment installation area 92 is located. Furthermore, the lower part of the auxiliary equipment installation area 92, like the support platform 12 of the carrier module D1, constitutes an area for installing a liquid treatment bottle, from which coating liquid is supplied to each liquid treatment component in the processing module where the auxiliary equipment installation area 92 is located.

[0071] The layout of the liquid treatment components, the rear-side processing unit 50, and the auxiliary equipment installation areas 91 and 92 between each processing module D21, D22, D31, and D32 is the same, except that the second lower-side processing module D31 does not have a liquid treatment component. Additionally, as... Figure 3 , Figure 6 As shown, SCPL3 and SCPL4 are located at the upper left end of the transport area 53 of the second upper processing module D32. Additionally, SCPL2 is located at the lower left end of the transport area 53 of the second lower processing module D31.

[0072] TRS11 and TRS12 are provided between SPCL2 and SCPL3 and SCPL4. TRS11, which serves as the first substrate mounting part, is located in the second lower processing module D31, and TRS12, which serves as the second substrate mounting part, is located in the second upper processing module D32. These SCPL2 to SCPL4, TRS11, and TRS12 overlap each other to form a stack when viewed from above. This stack is located between the attached equipment mounting areas 91 and 92 from the front and back.

[0073] Furthermore, the lifting and transfer mechanism 7 for transporting wafer W from TRS11 to TRS12, i.e., from the second lower processing module D31 to the second upper processing module D32, is located on the front side of the auxiliary equipment installation area 92. Referring also to the following... Figure 7 Side view, Figure 8 The top view illustrates the lifting and transferring mechanism 7. The lifting and transferring mechanism 7 includes, for example, two supports 72, a rotating shaft 73, a support 74, and a rotating mechanism 75. The two supports 72 are arranged side by side in front of the auxiliary equipment setting area 92, near the auxiliary equipment setting area 92 (i.e., the rear end of the conveying area 53), and extend in the vertical direction.

[0074] A rotating shaft 73 extends horizontally, i.e., laterally, from one support column 72 toward another. A rotating mechanism 75 is connected to one end of the rotating shaft 73. The rotating mechanism 75 includes a motor or the like, causing the rotating shaft 73 to rotate about its axis. The other end of the rotating shaft 73 is connected, for example, to a bearing 76. The rotating mechanism 75 and the bearing 76 are, for example, respectively located inside the support column 72, which is configured as a lifting mechanism that causes the rotating mechanism 75 and the bearing 76 to move up and down together in the vertical direction.

[0075] like Figure 7As shown by the solid line, the plate-shaped support portion 74 is formed extending horizontally from the rotation axis 73 in a forward direction (the front-to-back side). Therefore, the support portion 74 is arranged to extend in a direction intersecting the axial direction of the rotation axis 73. Midway through its extension, the support portion 74 bifurcates, forming a symmetrical fork shape. Regarding the support portion 74, the top portion formed by this branching is designated 77, and the base portion closer to the rotation axis 73 than the top portion 77 is designated 76. Furthermore, the upper surface of the support portion 74 forms a support surface 74A that supports the wafer W opposite to its lower surface (back side).

[0076] The orientation of the support portion 74 described above is designated as a first orientation, in which the support surface 74A is horizontal, and the wafer W is supported horizontally. Using the aforementioned rotation mechanism 75, the support portion 74 rotates about the rotation axis 73, as follows... Figure 7 As shown by the dashed line, this becomes the second orientation, with the top end of the support 74 facing upwards. Therefore, the base end side (rotation shaft 73 side) of the support surface 74A is positioned downwards relative to the top end side. Thus, the orientation of the support 74 switches between the first and second orientations. When the support 74 is in this second orientation, the support surface 74A is inclined such that its top end side is positioned slightly forward of the base end side. Therefore, the support surface 74A is positioned relative to the vertical plane (in... Figure 7 The support surface 74A is tilted (represented by a double-dotted line), and the tilt angle θ of the support surface relative to the vertical surface is, for example, less than 30°, so as to transport the wafer W as described later.

[0077] On the aforementioned support surface 74A, suction holes 81 are respectively provided at each top end 77 and base 76 for suctioning the peripheral portion of the back side of the wafer W. Even if the support portion 74 is in the second orientation described above, the wafer W can be adsorbed and held on the support surface 74A. Figure 7 As shown, each suction port 81 is connected to a suction passage 82 formed inside the support portion 74. The downstream side of the suction passage 82 extends outward from the support portion 74 and is connected to a suction portion 83 that vents air from the suction passage 82. Outside the support portion 74, a valve V82 is provided in the suction passage 82. By opening and closing the valve V82, the suction state and the non-suction state of suction from the suction port 81 are switched. When the back side of the wafer W is supported on the support portion 74, it is in the suction state, and the wafer W is adsorbed onto the support surface 74A.

[0078] Furthermore, a pressure detection unit 84 is provided in the suction passage 82, which sends a detection signal corresponding to the pressure in the suction passage 82 to the control unit 10 (described later). Based on this detection signal, the control unit 10, which serves as a holding abnormality detection unit, determines whether there is an abnormality in the holding of the wafer W. More specifically, when the valve V82 is opened to enter the suction state as described above, if the wafer W falls off the support 74 or is not properly supported, the detected pressure will be relatively high due to the suction of gas from the suction port 81. Therefore, by comparing the detected pressure value with a preset threshold, the presence or absence of the aforementioned abnormality can be determined.

[0079] Furthermore, an anti-fall portion 85 is formed at the base 76 of the support portion 74. This anti-fall portion 85 is formed by a bulge on the outer side of the support surface 74A in the support portion 74 relative to the support surface 74A. When the support portion 74 is in the second orientation, the anti-fall portion 85 is located below the wafer W. By providing this anti-fall portion 85 and tilting the support surface 74A relative to the vertical plane when in the second orientation as described above, even if there is a problem with the suction from the suction hole 81, it is possible to prevent the wafer W from sliding towards the base side of the support portion 74 and falling from the support portion 74 and breaking.

[0080] Reference Figure 8 Further explanation is provided regarding the TRS11 and TRS12 used in the aforementioned lifting and transfer mechanism 7. When the support portion 74 of the lifting and transfer mechanism 7 is positioned in the aforementioned horizontal first orientation, these TRS11 and TRS12, when viewed from above, are configured to be housed in a recess surrounded by the base portion 76 and two top portions 77, and to support the center portion of the wafer W. Furthermore, in Figure 8 Only TRS11 is shown representatively in the diagram. With this structure, each TRS11 and TRS12 can connect to the wafer W in a non-interfering manner relative to the support 74 which is raised and lowered in the first orientation.

[0081] Next, refer to Figures 9-14 The transport of wafer W using the lifting and transfer mechanism 7 will be described sequentially. The support portion 74, with its top facing upwards (a second orientation), moves from above the TRS 11 on which the wafer W is placed towards a position lower than the TRS. By adopting this second orientation, the support portion 74 does not interfere with the wafer W. Figure 9 Then, the support 74 becomes horizontal in the first orientation ( Figure 10 Furthermore, the support portion 74 is lowered to a position where it does not interfere with the wafer W by changing its orientation. Next, the support portion 74 is moved upwards and downwards from the TRS11 on which the wafer W is placed, and the wafer W is transferred from the TRS11 to the support portion 74. Figure 11 ).

[0082] Next, the support portion 74 is oriented in a second orientation and moved to a position above the TRS12. At this time, due to the second orientation, the wafer W on the support portion 74 does not interfere with the TRS12. Figure 12 Then, the support 74 is oriented in the first direction ( Figure 13 ), and move the support portion 74 downward from above the TRS12, transferring the wafer W from the support portion 74 to the TRS12. Then, align the support portion 74 in the second orientation and move it downward ( Figure 14 Furthermore, the support 74 is lowered to a position that does not interfere with the wafer W placed on TRS12 by this orientation change, and this orientation change is also performed at a position above TRS11 in a manner that also does not interfere with the subsequent wafer W placed on TRS11. Furthermore, the height position of TRS11 corresponds to the first position, and the height position of TRS12 corresponds to the second position.

[0083] Afterwards, the lifting and transferring mechanism 7 repeats... Figures 9-14 The operation shown involves sequentially transferring the wafer W from TRS11 to TRS12. Furthermore, the suction of the self-supporting portion 74 through the suction hole 81 and the pressure detection of the suction passage 82 are performed after the supporting portion 74 receives the wafer W from TRS11 and before transferring the wafer W to TRS12.

[0084] Additionally, the substrate processing apparatus 1 includes a control unit 10 (see reference 10). Figure 1 The control unit 10 is a computer, including a program, memory, and CPU. The program is structured with steps to execute a series of actions within the substrate processing apparatus 1. It detects any abnormalities in the holding of the wafer W. Furthermore, using this program, the control unit 10 outputs control signals to each part of the substrate processing apparatus 1, thereby controlling the operation of each part. Specifically, it controls the operation of the transport mechanisms 6A-6D, the lifting and transfer mechanism 7, and each processing component. This enables the transport and processing of the wafer W, as described later. Additionally, the program detects the presence or absence of holding abnormalities based on the pressure of the suction passage 82, and detects abnormalities based on the obtained image of the wafer W. The program is stored, for example, on a storage medium such as an optical disc, hard disk, or DVD, and loaded into the control unit 10.

[0085] Furthermore, each processing component of the first lower processing module D21 (a left-side processing module) and the second lower processing module D31 (a right-side processing module) is a first processing component, and the solution coating component 47 for forming the lower film (first coating film) is a first coating film forming component. The heating component 54 of processing modules D21 and D31 that heats the wafer W on which the lower film is formed is a first heating component. Moreover, the transport mechanisms 6A and 6C of these processing modules D21 and D31 are first transport mechanisms, and the transport area 53 of these processing modules D21 and D31 is a first transport area. Each processing component of the first upper processing module D22 (another right-side processing module) and the second upper processing module D32 (another right-side processing module) is a second processing component. Furthermore, the solution coating assembly 48 and the resist coating assembly 51, which form the intermediate film and the resist film (second coating film), are second coating film forming assemblies. The heating assembly 54 of the processing modules D22 and D32, which heats the wafer W on which these intermediate films and resist films are formed, is a second heating assembly. In addition, the transport mechanisms 6B and 6D of these processing modules D22 and D32 are second transport mechanisms, and the transport area 53 of these processing modules D22 and D32 is a second transport area.

[0086] Furthermore, the first lower processing module D21 and the first upper processing module D22 constituting the first processing module D2 are arranged as one group of processing modules, and the second lower processing module D31 and the second upper processing module D32 constituting the second processing module D3 are arranged as another group of processing modules. As described above, the carrier module D1 is arranged along these groups, and the aforementioned lifting and transfer mechanism 7 is located in another group (the second lower processing module D31 and the second upper processing module D32) further away from the carrier module D1. Moreover, in the second lower processing module D31 and the second upper processing module D32, the front side of the position where the rotation shaft 73 of the lifting and transfer mechanism 7 is located is the conveying area 53, which extends to the right (left or right side). The processing component is arranged along the extension direction of this conveying area.

[0087] Next, refer to the outline indicating the transport path. Figure 15 This describes the processing and transport of wafer W in substrate processing apparatus 1. Figure 15In the diagram, the transport mechanism used for transporting wafer W is shown on or near the arrow indicating a portion of the transport of wafer W between components. First, the transport mechanism 32 sends wafer W from the carrier C placed on the movable stage 15 of the support platform 12 to the pre-processing inspection component 41 to obtain image data and determine the presence or absence of anomalies. Then, wafer W is transported to TRS1. Next, the transport mechanism 33 sends wafer W to the hydrophobication treatment component 30 for hydrophobication treatment, and then to SCPL1. Then, the transport mechanism 6A receives wafer W into the first lower processing module D21 and transports it in the order of solution coating component 47 → heating component 54, transporting wafer W to SPCL2 of the second lower processing module D31 with a lower film formed on it.

[0088] Then, the wafer W is conveyed to the heating assembly 54 of the second lower processing module D31 by the conveyor mechanism 6C for heating processing. After that, the wafer W is conveyed to TRS11, as in... Figures 9-14 As described above, the wafer W is transported to TRS12 of the second upper processing module D32 using the lifting and transfer mechanism 7. Then, the wafer W is transported to SCPL4 in the order of SCPL3 → chemical coating assembly 48 → heating assembly 54 using the transport mechanism 6D in the second upper processing module D32, with the wafer W having an intermediate film formed.

[0089] Then, the wafer W is received into the first upper processing module D22 using the transport mechanism 6B, and transported in the order of resist coating assembly 51 → heating assembly 54, so that the wafer W, with a resist film formed, is transported to the TRS3 of the carrier module D1. Afterwards, the wafer W is transported in the order of transport mechanism 33 → TRS2 → transport mechanism 32, and stored on the carrier C on the movable stage 15 of the support platform 13.

[0090] As described above, the substrate processing apparatus 1 is provided with a lifting and transfer mechanism 7 for transporting wafer W from the second lower processing module D31 to the second upper processing module D32. Furthermore, the support portion 74 of the lifting and transfer mechanism 7 holding the wafer W rotates in a manner that switches between a horizontal first orientation and an upright second orientation. Assuming that a transport mechanism (i.e., the same transport mechanism as transport mechanisms 6A to 6D) is provided instead of the lifting and transfer mechanism 7, in which the holding portion of the wafer W can move freely forward and backward relative to the substrate and the substrate can be raised and lowered freely, the wafer W is transported between TRS11 and TRS12. However, in this case, a lifting space for the transport mechanism needs to be provided on the front or rear side relative to TRS11 and TRS12, and the front-to-back width of this lifting space is a size comparable to the front-to-back width of the transport mechanism. Therefore, the rear processing unit 50 and the auxiliary equipment mounting area 92, or the liquid coating assembly 48 and the auxiliary equipment mounting area 91, are offset to the right from the aforementioned position by an amount corresponding to the left and right width of the lifting space, to ensure the lifting space. Therefore, the left and right length of the second processing module D3 is relatively large, increasing the floor area (occupied area) of the substrate processing apparatus 1.

[0091] However, since the lifting and transfer mechanism 7 has a structure that allows the support 74 to rotate as described above, the front-to-back width required to avoid interference with the wafers W mounted on each TRS11 can be reduced. Therefore, it can be installed in the space in front of the additional equipment installation area 92. Thus, according to the substrate processing apparatus 1, the left and right lengths of the second processing module D3 equipped with the lifting and transfer mechanism 7 are reduced, thereby reducing the floor space of the substrate processing apparatus 1. Furthermore, when the substrate processing apparatus 1 is installed in a limited space, by reducing the floor space in this way without reducing the number of processing components mounted on the substrate processing apparatus 1, the substrate processing apparatus 1 can be installed in that space. Therefore, the substrate processing apparatus 1 also has the effect of ensuring a sufficient number of processing components and preventing a decrease in productivity.

[0092] Furthermore, by providing the aforementioned lifting and transfer mechanism 7 as a dedicated transport mechanism between the lower processing module (one processing module) G1 and the upper processing module G2 (another processing module), the load on the transport mechanisms 6A to 6D of each processing module is reduced. Therefore, the transport mechanisms 6A to 6D can quickly transfer wafers W relative to the processing components that are provided in each processing module. Thus, from this viewpoint, the substrate processing apparatus 1 can also achieve higher productivity.

[0093] Furthermore, as described above, the lifting and transfer mechanism 7 is located in the conveying area 53 in front of the auxiliary equipment setting area 92. That is, it is arranged so as to face the area where no processing components are set. Because of this configuration, the number of processing components is not reduced due to the installation of this lifting and transfer mechanism 7, thus more reliably preventing a decrease in productivity.

[0094] Furthermore, since the lifting and transfer mechanism 7 only performs lifting and rotating actions, the drive mechanism is simpler compared to a case where a conveyor mechanism with a structure like the conveyor mechanisms 6A to 6D described above is used instead of the lifting and transfer mechanism 7. Therefore, it is possible to reduce the manufacturing cost of the device.

[0095] Furthermore, as a second orientation, it is not limited to having the top of the support portion 74 facing upwards; it can also face downwards. However, with the top of the support portion 74 facing upwards, even assuming a malfunction in the suction from the suction hole 81, the wafer W will be supported by the support pillar 72 as it slips towards the rear. Therefore, damage to the wafer W caused by falling onto the processing module's surface can be prevented. Furthermore, as described above, an anti-fall portion 85 is provided in this example, thus more reliably preventing damage to the wafer W caused by falling.

[0096] Alternatively, when transporting wafer W in the order of second lower processing module D31 → second upper processing module D32 as described above, a liquid processing component can also be provided in the second lower processing module D31. After processing with this liquid processing component, wafer W is transported to the second upper processing module D32. Alternatively, a heating component 54 can be provided only in one of the first lower processing module D21 or the second lower processing module D31. In this case, after the lower film is formed using the liquid coating component 47 of the first lower processing module D21, processing is performed only once using the heating component 54, and the wafer W is transported to the upper processing module G2 using the lifting and transfer mechanism 7. Furthermore, if the heating component 54 is only provided in the first lower processing module D21, the area in the second lower processing module D31 where the heating component 54 is provided can also be used as an area for providing additional equipment.

[0097] Furthermore, the substrate processing apparatus can be configured such that the components located in the lower processing module G1 are located in the upper processing module G2, and the components located in the upper processing module G2 are located in the lower processing module G1. That is, in this substrate processing apparatus, the wafer W is transported along the upper processing module G2 as the forward path and the lower processing module G1 as the return path, and the lifting transfer mechanism 7 transports the wafer W from TRS12 towards TRS11. Therefore, the lifting transfer mechanism 7 can also be a structure that transports the wafer W from top to bottom. Furthermore, the component used by the lifting transfer mechanism 7 to transfer the wafer W is not limited to TRS; for example, it can also be a structure that transfers the wafer W to SCPL. Moreover, the lifting transfer mechanism 7 is not limited to a structure that transfers the wafer W relative to a component; for example, it can directly transfer the wafer W relative to the transport mechanisms 6B and 6D. However, considering that the conveying mechanisms 6B and 6D do not transport the wafer W and have a long standby time for such handover, the lifting and transfer mechanism 7 is preferably used to hand over the component, as described above.

[0098] Alternatively, the substrate processing apparatus may also have a structure that only has a first processing module D2 and omits the second processing module D3. (Refer to...) Figure 16 Top view, Figure 17 The front view illustrates the structure of the substrate processing apparatus 8. This substrate processing apparatus 8 utilizes a first processing module D2 to sequentially form an anti-reflective film and a resist film on a wafer W. The solution coating assembly 48 of the first lower processing module D21 supplies the anti-reflective film forming solution to the wafer W in place of the solution for forming the lower layer film.

[0099] In this substrate processing apparatus 8, the lifting and transfer mechanism 7 and TRS11, TRS12 are located to the right of the rear processing section 50 in a manner that does not obstruct the transfer of the wafer W between the component stack T1 and the transport mechanisms 6A, 6B. Corresponding to this configuration, the additional equipment installation areas 91, 92 are also located at the right end of the first processing module D2.

[0100] In this substrate processing apparatus 8, similar to the substrate processing apparatus 1, a wafer W is transported from the carrier module D1 to the first lower processing module D21 via the SCPL1 of the component stack T1, and an anti-reflective film is formed by transporting it in the order of solution coating component 48 → heating component 54. Then, the wafer W is transported sequentially via TRS11, lifting and transfer mechanism 7, and TRS12 to the first upper processing module D22, and a resist film is formed by transporting it in the order of SCPL at the height of the first upper processing module D22 in the component stack T1 → resist coating component 51 → heating component 54. Afterwards, the wafer W is returned to the carrier C from the carrier module D1 in the same manner as the substrate processing apparatus 1. Thus, the structure of the apparatus is not limited to two processing modules connected on the left and right sides. Moreover, the positions of the lifting and transfer mechanism 7 and the TRS11 and TRS12 used for the lifting and transfer mechanism 7 can be appropriately set according to the structure of the processing modules.

[0101] The lifting and transferring mechanism 7 is not limited to a structure where the support 74 extends forward from the rotation shaft 73, as in the example described above. Figure 18 As shown, the structure can also be as follows: a support column 72 is provided on the front side of the conveying area 53, near the auxiliary equipment installation area 91, a rotating shaft 73 extends from the support column 72 in the left-right direction, and a support portion 74 extends from the rotating shaft 73 toward the rear of the conveying area 53. Additionally, in Figure 17 The substrate processing apparatus 8 described herein may also have the following structure: a support column 72 is provided at the right end of the transport area 53, a rotating shaft 73 extends back and forth from the support column 72 in the transport area 53, and a support portion 74 extends to the left from the rotating shaft 73.

[0102] In addition, Figures 9-14 The diagram shows that in the height region near TRS11 (first region) and the height region near TRS12, the support portion 74 is oriented in a first orientation, and in the region between the first and second regions, the support portion 74 is oriented in a second orientation. Alternatively, in this intermediate region, the support portion 74 can also be oriented in a first orientation within a range that does not obstruct the transport of the wafer W. That is, during the lifting and lowering process between TRS11 and TRS12, the support portion 74 is not limited to continuously being oriented in a second orientation. Furthermore, regarding the second orientation, if the inclination of the support surface 74A relative to the horizontal plane is relatively small, the wafer W can be held in place by the friction between the support surface 74A and the back surface of the wafer W even without the suction hole 81. In addition, multiple pressing mechanisms are provided on the support portion 74. Each pressing mechanism is configured to press the wafer W from the outside towards the center of the wafer W, thereby holding the wafer W on the support portion 74 under the action of each pressing mechanism. Therefore, the support portion 74 is not limited to a structure with a suction hole 81.

[0103] Furthermore, while the first orientation of the support portion 74 is horizontal, it can be inclined relative to the horizontal plane as long as it can support the wafer W. Additionally, a structure is shown where the wafer W is supported in contact with the upper surface of the plate-shaped support portion 74. However, a support member for the wafer W can also be provided on the upper surface of the support portion 74, which faces the lower surface of the wafer W and supports it in contact. In this case, the member forms the support surface of the wafer W.

[0104] The liquid processing performed in the apparatus is not limited to the examples described above. It may also include the formation of a coating film different from the coating film described above by applying a chemical solution, the coating process of an adhesive for bonding wafers W together, and a cleaning process for cleaning by supplying cleaning solution to the surface or back side of wafers W. In addition, it may include a development process. For example, after the cleaning process following exposure using the lower processing module G1, a development process may be performed using the upper processing module G2. Furthermore, as the coating film described above, specifically, for example, an insulating film or a protective film stacked on a resist film may also be formed. In addition, the processing assembly provided in the rear processing unit 50 may be equipped with components other than a heating assembly. For example, a peripheral exposure assembly for exposing the periphery of the resist film may be provided, and an inspection assembly with the same structure as the pre-processing inspection assembly 41 may be provided to inspect the surface of the wafer W after the film has been formed.

[0105] Furthermore, the arrangement of the carrier module D1 and the processing module can be reversed horizontally, and the layout of the structural elements of each module can also be reversed front to back. Moreover, it should be considered that the embodiments disclosed herein are illustrative in all respects and are not restrictive. The above-described embodiments can also be omitted, substituted, modified, and combined in various forms without departing from the scope and spirit of the appended claims.

Claims

1. A substrate processing apparatus, wherein the substrate processing apparatus includes: a carrier module on which a carrier that accommodates a substrate is placed; one processing module to which the substrate is transported from the carrier module, the one processing module including: a plurality of first processing units that respectively process the substrate; and a first transport mechanism that transports the substrate in common for the plurality of first processing units; another processing module that overlaps the one processing module and from which the substrate is transported to the carrier module, the another processing module including: a plurality of second processing units that respectively process the substrate; and a second transport mechanism that transports the substrate in common for the plurality of second processing units; a lift transfer mechanism that includes: a shaft that extends in a lateral direction; and a support portion that has a support surface that supports the substrate opposite the support surface and that extends from the shaft in a direction that intersects the extending direction of the shaft, the shaft and the support portion being raised and lowered between a first position for handing over the substrate with respect to the first transport mechanism and a second position for handing over the substrate with respect to the second transport mechanism; and a rotation mechanism that rotates the support portion around the shaft to change the orientation of the support portion between a first orientation for handing over the substrate at the first position and the second position, respectively, and a second orientation in which the inclination of the support surface with respect to the horizontal plane is greater than in the first orientation to move between the first position and the second position, the one processing module includes a first substrate placement portion that places the substrate to hand over the substrate with respect to the first transport mechanism, the another processing module includes a second substrate placement portion that places the substrate to hand over the substrate with respect to the second transport mechanism, the first position and the second position are positions at which the substrate is handed over with respect to the first substrate placement portion and the second substrate placement portion, respectively, the one processing module has a first temperature adjustment unit that is provided in a region that overlaps the first substrate placement portion and the lift transfer mechanism in plan view and adjusts the temperature of the substrate by transport of the substrate by the first transport mechanism, the another processing module has a second temperature adjustment unit that is provided in a region that overlaps the second substrate placement portion and the lift transfer mechanism in plan view and adjusts the temperature of the substrate by transport of the substrate by the second transport mechanism, the first temperature adjustment unit is located below the first substrate placement portion, and the second temperature adjustment unit is located above the second substrate placement portion.

2. The substrate processing apparatus according to claim 1, wherein the second orientation is an orientation in which the base end side of the support surface as the shaft side is located below the top end side and is inclined with respect to the vertical plane.

3. The substrate processing apparatus according to claim 2, wherein The support portion has a fall-preventing portion that prevents the substrate from falling from the base end side of the support surface, by being raised from the base end side of the support surface with respect to the support surface.

4. The substrate processing apparatus according to claim 1, wherein The support surface has a suction hole for suctioning and holding the substrate.

5. The substrate processing apparatus according to claim 4, wherein The substrate processing apparatus includes a suction passage connected to the suction hole, a pressure detecting portion that detects a pressure of the suction passage, and a holding abnormality detecting portion that detects presence or absence of an abnormality in holding of the substrate based on the detected pressure.

6. The substrate processing apparatus according to claim 1, wherein The support portion extends from one side of the axis in the front-rear direction, A first conveyance region in which the substrate is conveyed by the first conveyance mechanism extends toward one side in the left-right direction with respect to the axis, and the plurality of first processing assemblies are arranged along an extension direction of the first conveyance region, A second conveyance region in which the substrate is conveyed by the second conveyance mechanism extends toward one side in the left-right direction with respect to the axis, and the plurality of second processing assemblies are arranged along an extension direction of the second conveyance region.

7. The substrate processing apparatus according to claim 6, wherein On the other side in the front-rear direction with respect to the axis, an additional device of the first processing assembly or the second processing assembly is arranged.

8. The substrate processing apparatus according to claim 1, wherein The one processing module is composed of one left processing module and one right processing module, and each of the one left processing module and the one right processing module has the plurality of first processing assemblies and the first conveyance mechanism, and is arranged to the left and right of each other so as to be capable of transferring the substrate to each other, The other processing module is composed of another left processing module and another right processing module, and each of the another left processing module and the another right processing module has the plurality of second processing assemblies and the second conveyance mechanism, and is arranged to the left and right of each other so as to be capable of transferring the substrate to each other, The one left processing module and the another left processing module overlap each other, and the one right processing module and the another right processing module overlap each other.

9. The substrate processing apparatus according to claim 8, wherein The carrier module is arranged along arrangement of one group composed of the one left processing module and the another left processing module, and another group composed of the one right processing module and the another right processing module, and the lift transfer mechanism is arranged in the group farther from the carrier module among the one group and the another group.

10. The substrate processing apparatus according to claim 1, wherein The plurality of first processing assemblies include a first coating film forming assembly that supplies a coating liquid to the substrate to form a first coating film, and a first heating assembly that heats the substrate on which the first coating film is formed, The plurality of second processing units includes a second coating film forming unit that supplies a coating liquid to the substrate to form a second coating film laminated on the first coating film, and a second heating unit that heats the substrate on which the second coating film is formed.

11. A substrate processing method, wherein The substrate processing method includes the following steps: a carrier module is provided to hold a carrier for receiving a substrate; the substrate is transported from the carrier module to one processing module, which includes a plurality of first processing units that respectively process the substrate, and a first transport mechanism that transports the substrate commonly for the plurality of first processing units; the substrate is transported from another processing module that overlaps the one processing module to the carrier module, which includes a plurality of second processing units that respectively process the substrate, and a second transport mechanism that transports the substrate commonly for the plurality of second processing units; a lifting transfer mechanism is caused to lift between a first position for handing over the substrate with respect to the first transport mechanism and a second position for handing over the substrate with respect to the second transport mechanism, the lifting transfer mechanism including a shaft that extends in a lateral direction, and a support portion that has a support surface that supports the substrate opposite to the support surface and extends from the shaft in a direction that intersects the extending direction of the shaft; the support portion is caused to rotate around the shaft by a rotating mechanism; an orientation of the support portion is caused to change between a first orientation for handing over the substrate at the first position and the second position, respectively, and a second orientation in which the support surface has a larger inclination with respect to a horizontal plane than the first orientation to move between the first position and the second position; the substrate is placed on a first substrate placement portion provided in the one processing module to hand over the substrate with respect to the first transport mechanism; and the substrate is placed on a second substrate placement portion provided in the other processing module to hand over the substrate with respect to the second transport mechanism, wherein the first position and the second position are positions for handing over the substrate with respect to the first substrate placement portion and the second substrate placement portion, respectively, the substrate processing method further includes the following steps: the substrate is transported to a first temperature adjustment unit by the first transport mechanism to adjust the temperature of the substrate, the first temperature adjustment unit being provided in the one processing module in a region that overlaps the first substrate placement portion and the lifting transfer mechanism in a plan view; and the substrate is transported to a second temperature adjustment unit by the second transport mechanism to adjust the temperature of the substrate, the second temperature adjustment unit being provided in the other processing module in a region that overlaps the second substrate placement portion and the lifting transfer mechanism in a plan view, the first temperature adjustment unit is located below the first substrate placement portion, and the second temperature adjustment unit is located above the second substrate placement portion.

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