Substrate processing apparatus and method

Abstract

This invention provides a substrate processing apparatus and method. In an embodiment of the invention, the substrate processing apparatus includes: a worktable on which a substrate is placed; a nozzle for applying liquid to the substrate placed on the worktable; a nozzle driving unit for moving the nozzle between a waiting position and an application position; a liquid tank for receiving liquid discharged from the nozzle at the waiting position; a foreign object detection unit for detecting foreign objects on the substrate placed on the worktable; a moving component for moving the foreign object detection unit on the worktable; and a controller; wherein the controller controls the nozzle, the foreign object detection unit, and the moving component to cause the foreign object detection unit to perform foreign object detection on the substrate while the nozzle is performing pre-liquid application at the waiting position; the waiting position is the position where the nozzle is detached from the substrate placed on the worktable, and the application position is the position where the nozzle is positioned in an area corresponding to the substrate placed on the worktable.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of Korean Patent Application No. 10-2020-0159556, filed with the Korean Intellectual Property Office on November 25, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a substrate processing apparatus and method for applying liquid to a substrate. Background Technology

[0004] Generally speaking, flat panel display devices refer to liquid crystal displays (LCDs), plasma display panels (Plasma Display Panels), organic light-emitting diodes (OLEDs), etc. These flat panel display devices are manufactured by repeatedly photographing, diffusing, depositing, etching, and ion implanting processes on a substrate.

[0005] In the repetitive manufacturing process, the photographic process forms a fine pattern on the substrate by sequentially performing a process of applying photoresist to the substrate, an exposure process to form a micro-pattern on the photoresist, and a development process to develop the photoresist. Specifically, in the process of applying photoresist to the substrate surface, the substrate is placed on a process stage, and a slit nozzle supplying photoresist moves at a constant speed across the substrate surface to apply the photoresist. At this time, to uniformly form the photoresist on the substrate surface, the slit nozzle must be adjusted to be parallel to the substrate surface before applying the photoresist. This photoresist application process is performed with great precision. The distance between the slit nozzle applying the photoresist and the substrate must be controlled within a few... The level of precision of the unit.

[0006] However, the presence of dust or foreign objects on the substrate will affect the moving slit nozzle. That is, the dust or foreign objects exert physical resistance on the substrate and the slit nozzle, causing damage to both. Figure 1 This is a perspective view of a conventional photoresist application apparatus. Figure 2 To indicate Figure 1 An oblique view of a slit nozzle. (e.g.) Figure 1 As shown, the photoresist application apparatus 10 includes a stage 100 supporting a substrate G and a nozzle unit 300 for supplying photoresist to the substrate G placed on the stage 100.

[0007] like Figure 2As shown, the nozzle unit 300 comprises a first body 310, a second body 320, and a slit nozzle having a discharge port 360. To determine whether foreign objects are present on the substrate when liquid is supplied from the slit nozzle, a cutting plate 350 and a vibration sensor 380 for detecting the vibration of the cutting plate are provided. The cutting plate 350 vibrates upon impact with a foreign object on the substrate G, and the vibration sensor 380 detects the vibration to determine whether a foreign object is present on the substrate G. Additionally, the nozzle unit 300 provides a light irradiation component 370 that irradiates light onto the substrate G and determines the presence or absence of a foreign object based on the degree of light transmission. Because the cutting plate 350, the vibration sensor 380, and the light irradiation component 370 are all mounted on the nozzle unit 300, if the nozzle unit 300 is deviated from its accurate position, it becomes difficult to determine the presence or absence of a foreign object. Furthermore, regardless of the operation of the nozzle unit 300, it is impossible to determine the presence or absence of a foreign object. Additionally, the increased weight of the nozzle unit 300 reduces the vibration detection capability of the vibration sensor 380. Summary of the Invention

[0008] Technical problems to be solved

[0009] The purpose of this invention is to provide a substrate processing apparatus and method for preventing nozzle contamination and damage.

[0010] In addition, the present invention aims to provide a substrate processing apparatus and method that can improve process efficiency.

[0011] The purpose of this invention is not limited thereto, and other purposes not mentioned will become more apparent to those skilled in the art from the following description.

[0012] Technical means to solve technical problems

[0013] This invention provides a substrate processing apparatus. In one embodiment, the substrate processing apparatus includes a worktable on which a substrate is placed; a nozzle for applying liquid to the substrate on the worktable; a nozzle driving unit for moving the nozzle between a waiting position and an application position; a liquid tank for receiving liquid discharged from the nozzle at the waiting position; a foreign object detection unit for detecting foreign objects on the substrate on the worktable; a moving component for moving the foreign object detection unit on the worktable; and a controller. The controller controls the nozzle, the foreign object detection unit, and the moving component to cause the foreign object detection unit to perform foreign object detection on the substrate while the nozzle is performing pre-liquid application at the waiting position. The waiting position is the position where the nozzle is detached from the substrate on the worktable, and the application position is the position where the nozzle is positioned in a region corresponding to the area on the substrate on the worktable.

[0014] In one embodiment, the foreign object detection unit may include: a light-emitting part that irradiates light in a direction parallel to the top surface of a substrate placed on a worktable; and a light-receiving part that collects the light irradiated from the light-emitting part.

[0015] In one embodiment, when viewed from a direction parallel to the top of the substrate, the light irradiated from the light-emitting portion may overlap with a portion of the substrate.

[0016] In one embodiment, the foreign object detection unit may further include: a damping plate that can contact a foreign object on the substrate; and a vibration sensor mounted on the damping plate to detect the vibration of the damping plate.

[0017] In one embodiment, the foreign object detection unit may include a light detection component and a vibration detection component; the light detection component includes: a light-emitting part that irradiates light in a direction parallel to the top surface of a substrate placed on a worktable; and a light-receiving part that collects the light irradiated from the light-emitting part; the vibration detection component includes: a damping plate that can contact a foreign object on the substrate; and a vibration sensor mounted on the damping plate to detect the vibration of the damping plate.

[0018] In one embodiment, the vibration detection component and the light detection component may be arranged sequentially along the travel direction of the foreign object detection unit.

[0019] In one embodiment, the light detection component and the vibration detection component may be arranged sequentially along the travel direction of the foreign object detection unit.

[0020] In one embodiment, the nozzle driving unit may further include: a gantry component supporting the nozzle; a guide rail mounting the gantry component; a driver that moves the gantry component mounted on the guide rail between a waiting position and an application position; and a moving component that moves a foreign object detection unit on the guide rail. In one embodiment, the nozzle may be a slit nozzle.

[0021] In one embodiment, the stage can hold a substrate.

[0022] In one embodiment, the liquid may be a high-viscosity liquid.

[0023] In another embodiment, a substrate processing apparatus may include: a worktable on which a substrate is placed; a slit nozzle that applies liquid photoresist to the substrate placed on the worktable; a nozzle driving unit that moves the slit nozzle between a waiting position and an application position; a foreign object detection unit that detects foreign objects on the substrate placed on the worktable; and a moving component that moves the foreign object detection unit on the worktable.

[0024] In one embodiment, the foreign object detection unit may include a light detection component; the light detection component includes: a light-emitting part that irradiates light in a direction parallel to the top surface of a substrate placed on a worktable; and a light-receiving part that collects the light irradiated from the light-emitting part.

[0025] In one embodiment, the foreign object detection unit may further include a vibration detection component; the vibration detection component includes: a damping plate that can contact a foreign object on the substrate; and a vibration sensor mounted on the damping plate to detect the vibration of the damping plate.

[0026] In one embodiment, the substrate processing apparatus may include: a liquid tank, in a waiting position, containing liquid discharged from a slit nozzle; and a controller, which controls the apparatus; wherein the controller controls the slit nozzle, a foreign object detection unit, and a moving component to cause the foreign object detection unit to perform foreign object detection on the substrate while the slit nozzle is performing pre-liquid addition in the waiting position; the waiting position is the position where the slit nozzle is detached from the substrate placed on the worktable, and the application position is the position where the slit nozzle is positioned in a region corresponding to the area on the substrate placed on the worktable.

[0027] In one embodiment, the nozzle driving unit may further include: a gantry component supporting a slit nozzle; a guide rail mounting the gantry component; a driver that moves the gantry component mounted on the guide rail between a waiting position and an application position; and a moving component that moves a foreign object detection unit on the guide rail.

[0028] In one embodiment, the liquid may be a high-viscosity liquid.

[0029] In addition, the present invention provides a substrate processing method. In one embodiment, the substrate processing method includes a foreign matter detection unit performing foreign matter detection on the substrate while the slit nozzle is in a waiting position performing pre-liquid addition.

[0030] In one embodiment, the foreign object detection unit may include a light detection component and a vibration detection component; the light detection component includes: a light-emitting part that irradiates light in a direction parallel to the top surface of a substrate placed on a worktable; and a light-receiving part that collects the light irradiated from the light-emitting part; the vibration detection component includes: a damping plate that can contact a foreign object on the substrate; and a vibration sensor that is mounted on the damping plate to detect the vibration of the damping plate.

[0031] In one embodiment, the liquid may be a high-viscosity liquid.

[0032] Technical effects of the present invention

[0033] This invention can prevent nozzle contamination and damage.

[0034] In addition, the present invention can improve the process effect.

[0035] The effects of the present invention are not limited to those described. Effects not mentioned can be clearly understood by those skilled in the art through this specification and the accompanying drawings. Attached Figure Description

[0036] Figure 1 An oblique view showing a conventional photoresist application apparatus;

[0037] Figure 2 To indicate Figure 1 A perspective view of the slit nozzle;

[0038] Figure 3 This is a perspective view of a substrate processing apparatus according to an embodiment of the present invention;

[0039] Figure 4 for Figure 3 Cross-sectional view of the nozzle and liquid tank;

[0040] Figures 5 to 9 This is a schematic diagram illustrating the substrate processing method of the present invention in sequence;

[0041] Figure 10 and Figure 11 Each is a perspective view of a substrate processing apparatus according to another embodiment of the present invention. Detailed Implementation

[0042] The embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. The purpose of these embodiments is to help those skilled in the art to better understand the present invention. Therefore, the shapes of the elements in the drawings are exaggerated to more clearly emphasize the illustration.

[0043] The apparatus of this embodiment can be used to perform photolithography processes on substrates such as semiconductor substrates or flat panel display panels. In one example, the apparatus of this embodiment can be connected to an exposure apparatus to perform application and development processes on the substrate. The following description uses a display substrate as an example.

[0044] Below, in conjunction with Figures 3 to 4 The substrate processing apparatus of the present invention will be described in detail below. Figure 3 This is a perspective view of a substrate processing apparatus 100 according to an embodiment of the present invention. Figure 4 for Figure 3 Cross-sectional view of nozzle 3000 and liquid tank 2500. (See diagram below.) Figure 3 As shown, a substrate processing apparatus 100 according to an embodiment of the present invention includes a worktable 1000, a nozzle 3000, a liquid tank 2500 and a foreign object detection unit 5000.

[0045] The stage 1000 forms a mounting surface for mounting the substrate G. The stage 1000 is maintained in a horizontal state to uniformly apply photoresist to the substrate G. In one example, the stage 1000 may include a fixing means (not shown) for fixing the substrate G. In another example, the stage 1000 fixes the substrate G by adsorption. For example, the stage 1000 may include a vacuum adsorption means for adsorbing the substrate G using vacuum pressure.

[0046] A nozzle 3000 applies liquid to a substrate G. In one example, the liquid is photoresist. In another example, the liquid is a high-viscosity photoresist. The nozzle 3000 is located on a stage 1000. While moving on the stage 1000 in a balanced state, the nozzle 3000 uniformly applies photoresist to the substrate G. In one example, the nozzle 3000 is formed with a length equal to the width W of the substrate G to which the photoresist is applied. In another example, the nozzle 3000 applies photoresist at a certain thickness while moving from one end of the substrate G to the other end.

[0047] like Figure 4 As shown, the nozzle 3000 includes a first body 3100, a second body 3200, a buffer section 3300, and an outlet 3600. In one example, the nozzle 3000 is a slit nozzle. The first body 3100 and the second body 3200 are combined to form the body of the nozzle 3000. A buffer section 3300 is formed between the first body 3100 and the second body 3200. The buffer section 3300 serves a buffering function to ensure that the photoresist ejected through the nozzle 3000 is ejected at a constant pressure. The photoresist flowing into the nozzle 3000 through the photoresist supply port 3700 flows out through the buffer section 3300 and exits from the outlet 3600. The outlet 3600 serves as a channel for the photoresist to be discharged to the outside of the nozzle 3000, and is formed in a long, slit shape along a direction perpendicular to the direction of movement of the nozzle 3000. The photoresist temporarily stored in the buffer section 3300 flows out through the outlet 3600 to the outside of the nozzle 3000 under constant pressure, and is applied to the substrate G in a uniform amount through the outlet 3600. The photoresist sprayed through the outlet 3600 is continuously discharged to form an application surface on the substrate G.

[0048] The nozzle 3000 moves between a waiting position and an application position via a nozzle drive unit. In one example, the waiting position may be the position where the nozzle 3000 is detached from the substrate G placed on the worktable 1000, while the application position may be the position where the nozzle 3000 is positioned in a region corresponding to the substrate G placed on the worktable 1000. The nozzle drive unit includes a gantry component 2000, guide rails 4000a and 4000b, and a driver (not shown).

[0049] A nozzle 3000 is fixed on a gantry component 2000. In one example, the gantry component 2000 includes a fixing plate 2300, a first support 2100a, and a second support 2100b. The nozzle 3000 is fixed to the fixing plate 2300, which elongates across the worktable 1000. The first support 2100a and the second support 2100b are located on both sides of the fixing plate 2300. The first support 2100a and the second support 2100b are each slidable on a first guide rail 4000a and a second guide rail 4000b, respectively. In one example, the first support 2100a and the second support 2100b may each have a mounting portion 2150 mounted on the guide rails 4000a and 4000b. A driver (not shown) provides power for moving the mounting portions 2150 on the guide rails 4000a and 4000b.

[0050] Guide rails 4000a and 4000b are located on both sides of the worktable 1000, including a first guide rail 4000a and a second guide rail 4000b for moving the nozzle 3000. The first guide rail 4000a and the second guide rail 4000b allow the nozzle 3000 to move in a horizontal direction parallel to the substrate G. As described above, the first guide rail 4000a and the second guide rail 4000b enable the nozzle 3000 to precisely apply photoresist while maintaining a constant distance from the substrate G.

[0051] The nozzle 3000 and the worktable 1000 can move in parallel relative to each other via the nozzle drive unit. Alternatively, without providing a nozzle drive unit, the worktable 1000 can be moved in parallel after the nozzle 3000 is fixed in a certain position.

[0052] The liquid tank 2500 contains liquid discharged from the nozzle 3000, which is in a waiting position. In one example, the nozzle 3000 may perform pre-liquidation of liquid into the liquid tank 2500 while in the waiting position before discharging liquid onto the substrate G. In another example, the nozzle 3000 may be cleaned within the liquid tank 2500.

[0053] Foreign object detection unit 5000 detects foreign objects on substrate G installed on worktable 1000.

[0054] In one example, the foreign object detection unit 5000 includes light detection components 5400a and 5400b and a vibration detection component 5800. The light detection components 5400a and 5400b include a light-emitting portion 5400b and a light-receiving portion 5400a. The light-emitting portion 5400b irradiates light in a direction parallel to the top surface of the substrate G placed on the worktable 1000. The light-receiving portion 5400a collects the light irradiated from the light-emitting portion 5400b. In one example, the light-emitting portion 5400b is located on one side of the worktable 1000, while the light-receiving portion 5400a is located on the other side of the worktable 1000, opposite to the light-emitting portion 5400b. In one example, the light-emitting portion 5400b irradiates a laser. The light-receiving portion 5400a can determine the presence and size of a foreign object on the substrate G by measuring the amount of light irradiated from the light-emitting portion 5400b.

[0055] The vibration detection component 5800 includes a damping plate 5200 and a vibration sensor 5300. The damping plate 5200 vibrates upon contact with a foreign object on the substrate G when the foreign object detection unit 5000 moves on the substrate G. In one example, the damping plate 5200 is elongated along a direction parallel to the outlet 3600 of the nozzle 3000. In another example, the length of the damping plate 5200 is greater than the width of the substrate G. Therefore, the damping plate 5200 can determine the presence and size of a foreign object across the entire substrate G. The damping plate 5200 possesses sufficient rigidity to prevent damage from foreign objects on the substrate G. The vibration sensor 5300 determines the presence and size of a foreign object by measuring the vibration of the damping plate 5200. The damping plate 5200 has a vibration frequency with a fixed amplitude. When the damping plate 5200 is physically affected by contact with a foreign object, the amplitude changes. The vibration sensor 5300 detects this change to determine the presence and size of the foreign object.

[0056] The light-receiving part 5400a and the light-emitting part 5400b have sufficient height to detect foreign objects on the substrate G. In one example, when viewed from a direction parallel to the top of the substrate G, the light irradiated from the light-emitting part 5400b can overlap with a portion of the substrate G. In one example, the damping plate 5200 is formed at a height lower than or equal to the height of the outlet 3600 of the nozzle 3000. That is, the distance between the damping plate 5200 and the substrate G is less than or equal to the distance between the end of the nozzle 3000 and the substrate G. Therefore, damage to the end of the nozzle 3000 by foreign objects can be prevented.

[0057] In one example, the foreign object detection unit 5000 can move independently of the nozzle 3000. In another example, the foreign object detection unit 5000 is positioned on the worktable 1000 in the opposite direction to the nozzle 3000, which is mounted in a waiting position. In yet another example, the foreign object detection unit 5000 can be moved independently of the nozzle 3000 by a moving component. In one example, the moving component includes a base plate 5100 on which the light detection components 5400a, 5400b and the vibration detection component 5800 are mounted, and a connecting component 5500 on which the base plate 5100 is mounted on guide rails 4000a, 4000b. By means of the moving component, the foreign object detection unit 5000 moves parallel to the substrate G along the guide rails 4000a, 4000b.

[0058] A foreign object detection unit 5000, which moves on a substrate G via a moving component, uses optical detection components 5400a and 5400b and a vibration detection component 5800 to determine the presence and size of foreign objects on the substrate G. The optical detection components 5400a and 5400b and the vibration detection component 5800 can complement each other in determining the presence and size of foreign objects on the substrate G. In one example, depending on the type of foreign object, it may be detected by the optical detection components 5400a and 5400b but not by the vibration detection component 5800. Conversely, there may be foreign objects that can be detected by the vibration detection component 5800 but not by the optical detection components 5400a and 5400b.

[0059] In one example, the vibration detection component 5800 and the optical detection components 5400a and 5400b can be arranged sequentially along the travel direction of the foreign object detection unit 5000. Therefore, the optical detection components 5400a and 5400b can perform a secondary detection of foreign objects that cannot be detected by the vibration detection component 5800. Optionally, the optical detection components 5400a and 5400b and the vibration detection component 5800 can be arranged sequentially along the travel direction of the foreign object detection unit 5000. Therefore, the vibration detection component 5800 can perform a secondary detection of foreign objects that cannot be detected by the optical detection components 5400a and 5400b.

[0060] Furthermore, regardless of the order in which the vibration detection unit 5800 and the optical detection units 5400a and 5400b are present, the error range of the foreign object information can be reduced by comparing the information of the foreign object detected by the vibration detection unit 5800 with the information of the foreign object detected by the optical detection units 5400a and 5400b.

[0061] Below, in conjunction with Figures 5 to 9 The substrate processing method of the present invention will be described in detail below. A controller controls the substrate G processing apparatus to execute the substrate processing method of the present invention. For example... Figure 5As shown, during the pre-filling process of the nozzle 3000 in the liquid tank, the foreign object detection unit 5000 moves on the substrate G while simultaneously confirming the presence or absence of foreign objects on the substrate G. In one example, the foreign object detection unit 5000 may move once from one side of the substrate G to the other to determine the foreign object information on the substrate G. Optionally, the foreign object detection unit 5000 may move back and forth between one side and the other of the substrate G to determine the foreign object information on the substrate G. Alternatively, the foreign object detection unit 5000 may move several times on the substrate G to determine the foreign object information on the substrate G.

[0062] The following description uses an example where the vibration detection component 5800 and the light detection components 5400a and 5400b are arranged sequentially along the travel direction of the foreign object detection unit 5000. When the damping plate 5200 encounters dust or foreign objects on the substrate G, the damping plate 5200 will come into physical contact with the dust or foreign objects. Therefore, as Figure 6 As shown, the damping plate 5200 vibrates slightly due to the foreign object P1, and the vibration sensor 5300 will detect this vibration. When the size of the foreign object P1 is sufficiently large, such as Figure 7 As shown, the light irradiated from the light-emitting unit 5400b is completely cut off by the foreign object P1. The foreign object detection unit 5000 determines the presence and size of the foreign object P1 by combining the information about the foreign object obtained from the vibration detection unit 5800 and the light detection units 5400a and 5400b.

[0063] Figures 8 to 9 This indicates that the size of the foreign object P2 is smaller than, for example... Figures 6 to 7 The situation with foreign object P1 is shown. Figure 8 As shown, when the size of the foreign object P2 is small, it can be detected by the vibration monitoring component 5800, and as... Figure 9 As shown, all or part of the light emanating from the light-emitting unit 5400b can reach the light-receiving unit 5400a. In one example, when the light detection units 5400a and 5400b are completely unable to determine the presence or absence of a foreign object, the vibration detection unit 5800 can supplement the information used by the light detection units 5400a and 5400b to determine the presence or absence of a foreign object. Conversely, depending on the type of foreign object, information about foreign objects that cannot be detected by the vibration detection unit 5800 but can be detected by the light detection units 5400a and 5400b can also be determined.

[0064] In one example, when the light irradiated from the light-emitting part 5400b reaches the light-receiving part 5400a and the vibration sensor 5300 detects vibration, the information about the foreign object can be reduced by combining the foreign object information detected by the light detection components 5400a and 5400b and the information detected by the vibration detection component 5800.

[0065] In the example described above, the vibration detection component 5800 and the light detection components 5400a and 5400b are combined with the base plate 5100. However, unlike this, as... Figure 10 As shown, the vibration detection component 5800 and the light detection components 5400a and 5400b can be supported by additional support components 5500a and 5500b and can move independently on the guide rails 4000a and 4000b.

[0066] In the example described, the vibration detection component 5800 and the light detection components 5400a and 5400b are arranged sequentially along the travel direction of the foreign object detection unit 5000. However, alternatively, as... Figure 11 As shown, the light detection components 5400a and 5400b and the vibration detection component 5800 can be arranged sequentially along the travel direction of the foreign object detection unit 5000.

[0067] In the example described above, the moving component is used to move the foreign object detection unit 5000 on the guide rails 4000a and 4000b. However, unlike this, the moving component can move the foreign object detection unit 5000 without it being mounted on the guide rails 4000a and 4000b.

[0068] According to the present invention, it has the advantage of forming a foreign object detection unit 5000 separately from the nozzle 3000, and the foreign object is independent of the action detection substrate G of the nozzle 3000.

[0069] According to the present invention, it has the advantages of forming a foreign object detection unit 5000 separately from the nozzle 3000, reducing the weight of the foreign object detection unit 5000, and improving the sensitivity of the vibration sensor 5300.

[0070] According to the present invention, the foreign object detection unit 500 detects foreign objects on the substrate G during the pre-liquid application process performed by the nozzle 3000, thereby shortening the process time. Furthermore, detecting foreign objects before applying liquid to the substrate G has the advantage that the process does not need to be interrupted for replacing the substrate G during the liquid application process from the nozzle 3000 to the substrate G.

[0071] The detailed description provided is an example of the present invention. Furthermore, the description only illustrates preferred embodiments of the invention, which can be used in various other combinations and variations. Changes or modifications can be made within the scope of the invention's concept, description, and equivalents, and / or within the scope of the art or knowledge provided. The embodiments illustrate the optimal state for users to implement the technical ideas of the invention, but various modifications can be made as needed for the specific application areas and uses of the invention. Therefore, the detailed description of the invention is not intended to limit the invention. Additionally, the appended claims should be understood to include other embodiments.

Claims

1. A substrate processing apparatus comprising: a stage on which a substrate is placed; a nozzle that applies a liquid to the substrate placed on the stage; a nozzle drive unit that moves the nozzle between a waiting position and an application position; a liquid tank that accommodates the liquid discharged from the nozzle in the waiting position; a foreign matter detection unit that detects a foreign matter on the substrate placed on the stage; a moving member that moves the foreign matter detection unit on the stage; a controller; wherein the controller controls the nozzle, the foreign matter detection unit, and the moving member to cause the foreign matter detection unit to perform foreign matter detection on the substrate during pre-liquid application by the nozzle in the waiting position; the waiting position is a position in which the nozzle is separated from the substrate placed on the stage, and the application position is a position in which the nozzle is disposed in a region corresponding to the substrate placed on the stage.

2. The substrate processing apparatus according to claim 1, characterized by: the foreign matter detection unit includes: an emission section that emits light in a direction parallel to an upper surface of the substrate placed on the stage; a light receiving section that collects the light emitted from the emission section.

3. The substrate processing apparatus according to claim 2, characterized by: the light emitted from the emission section overlaps with a partial region of the substrate when viewed in a direction parallel to the upper surface of the substrate.

4. The substrate processing apparatus of claim 1, wherein: the foreign matter detection unit further includes: a damping plate that can come into contact with a foreign matter on the substrate; a vibration sensor that is installed on the damping plate to detect vibration of the damping plate.

5. The substrate processing apparatus of claim 1, wherein: the foreign matter detection unit includes a light detection section and a vibration detection section; the light detection section includes: an emission section that emits light in a direction parallel to an upper surface of the substrate placed on the stage; and a light receiving section that collects the light emitted from the emission section; the vibration detection section includes: a damping plate that can come into contact with a foreign matter on the substrate; and a vibration sensor that is installed on the damping plate to detect vibration of the damping plate.

6. The substrate processing apparatus according to claim 5, characterized by: the vibration detection section and the light detection section are arranged in this order in a traveling direction of the foreign matter detection unit.

7. The substrate processing apparatus of claim 5, wherein: the light detection section and the vibration detection section are arranged in this order in a traveling direction of the foreign matter detection unit.

8. The substrate processing apparatus of claim 1, wherein: the nozzle drive unit further includes: a gantry section that supports the nozzle; a guide rail that carries the gantry section; a driver that moves the gantry section carried on the guide rail between the waiting position and the application position; the moving member moves the foreign matter detection unit on the guide rail.

9. The substrate processing apparatus of claim 1, wherein: the nozzle is a slit nozzle.

10. The substrate processing apparatus of claim 1, wherein: the stage is configured to adsorb the substrate.

11. The substrate processing apparatus according to any one of claims 1 to 10, characterized by: the liquid is a high-viscosity liquid.

12. A substrate processing apparatus comprising: a stage on which a substrate is placed; a slit nozzle that applies a photoresist liquid to the substrate placed on the stage; a nozzle drive unit that moves the slit nozzle between a standby position and an application position; a foreign matter detection unit that detects foreign matter on the substrate placed on the stage; a moving member that moves the foreign matter detection unit on the stage; and a liquid tank that accommodates the liquid discharged from the slit nozzle in the standby position; a controller that controls the substrate processing apparatus; wherein the controller controls the slit nozzle, the foreign matter detection unit, and the moving member to cause the foreign matter detection unit to perform foreign matter detection on the substrate during a pre-liquid application by the slit nozzle in the standby position; the standby position is a position where the slit nozzle is separated from the substrate placed on the stage, and the application position is a position where the slit nozzle is disposed in a region corresponding to the substrate placed on the stage. the foreign matter detection unit includes a light detection member; 13. The substrate processing apparatus of claim 12, wherein: the light detection member includes: a light emitting portion that emits light in a direction parallel to an upper surface of the substrate placed on the stage; and a light receiving portion that collects light emitted from the light emitting portion. the foreign matter detection unit further includes a vibration detection member; 14. The substrate processing apparatus of claim 13, wherein: the vibration detection member includes: a damping plate that can contact foreign matter on the substrate; and a vibration sensor that is installed on the damping plate to detect vibration of the damping plate. the nozzle drive unit further includes:

15. The substrate processing apparatus of claim 12, wherein: a gantry member that supports the slit nozzle; a guide rail that carries the gantry member; a driver that moves the gantry member carried on the guide rail between the standby position and the application position; the moving member moves the foreign matter detection unit on the guide rail. the liquid is a high-viscosity liquid.

16. The substrate processing apparatus of claim 12, wherein:

17. A substrate processing method using a substrate processing apparatus, characterized by: the substrate processing apparatus includes: a stage on which a substrate is placed; a slit nozzle that applies a resist liquid to the substrate placed on the stage; a nozzle drive unit that moves the slit nozzle between a standby position and an application position; a foreign matter detection unit that detects foreign matter on the substrate placed on the stage; and a moving member that moves the foreign matter detection unit on the stage; a liquid tank that accommodates the liquid discharged from the slit nozzle in the standby position; and a controller that controls the substrate processing apparatus; the substrate processing method includes: during a pre-liquid application by the slit nozzle in the standby position, the foreign matter detection unit performs foreign matter detection on the substrate; wherein the standby position is a position where the slit nozzle is separated from the substrate placed on the stage, and the application position is a position where the slit nozzle is disposed in a region corresponding to the substrate placed on the stage. ​ 18. The substrate processing method of claim 17, wherein: The foreign matter detection unit includes a light detection member and a vibration detection member; The light detection member includes: a light emitting portion that emits light in a direction parallel to the upper surface of the substrate placed on the stage; and a light receiving portion that collects the light emitted from the light emitting portion; The vibration detection member includes: a damping plate that can contact a foreign matter on the substrate; and a vibration sensor that is installed on the damping plate to detect vibration of the damping plate.

19. The substrate processing method according to either one of claims 17 or 18, characterized by: The liquid is a high-viscosity liquid.

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