Radiator and vehicle

Abstract

The embodiment of the present application provides a heat dissipation device and a vehicle. The heat dissipation device includes: a liquid storage tank, a liquid pump, a first heat exchanger and a second heat exchanger connected in sequence by pipelines, and a heat dissipation fan; wherein the liquid storage tank is used to store liquid working fluid, the liquid pump is used to extract liquid working fluid from the liquid storage tank, pressurize the liquid working fluid, and make the liquid working fluid circulate in the order of the liquid storage tank, the first heat exchanger and the second heat exchanger; the first heat exchanger is used to contact with the heat source, absorb heat from the heat source, and transfer the heat to the liquid working fluid; the heat dissipation fan is used to generate cooling wind for the second heat exchanger, accelerate the air flow around the second heat exchanger; the second heat exchanger is used to absorb heat from the liquid working fluid and volatilize the heat into the air. The heat dissipation device can be used to dissipate heat for the vehicle's autonomous driving computing platform, and its heat dissipation fan can be installed on the outside of the vehicle, occupying a small space in the vehicle, facilitating the installation of the autonomous driving computing platform in the vehicle, and will not affect the vehicle's NVH indicators.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation device and a vehicle. Background Art

[0002] The control system of an autonomous vehicle, especially a high-level autonomous vehicle, generally includes an autonomous driving computing platform (or on-board computing module), such as a mobile data center (DMC). The autonomous driving computing platform can sense the surrounding environment through on-board sensors such as cameras, lidar, millimeter-wave radar, and ultrasound, make decisions based on the information obtained, and formulate corresponding strategies based on appropriate working models, such as predicting the movement status of the vehicle and other vehicles, pedestrians, etc. in the future, and planning collision-avoidance paths.

[0003] The autonomous driving computing platform will generate heat during operation. The higher the level of autonomous driving, the higher the power of the autonomous driving computing platform and the higher the heat generated. If it is not equipped with effective heat dissipation measures, the autonomous driving computing platform will affect normal operation due to overheating.

[0004] At present, in traditional fuel vehicles, the autonomous driving computing platform generally adopts air cooling. Since the front cabin of traditional fuel vehicles is full of engines, reduction gearboxes, batteries and other components, and the temperature is high, it is not suitable for placing the autonomous driving computing platform. Therefore, the autonomous driving computing platform can generally only be placed inside the cockpit.

[0005] However, the air-cooled autonomous driving computing platform is large in size and difficult to find a suitable installation location in the cockpit. In addition, the fan noise of the air-cooled autonomous driving computing platform placed in the cockpit will inevitably cause the vehicle's noise, vibration, and harshness (NVH) indicators to deteriorate, affecting the passengers' riding comfort. Summary of the invention

[0006] An embodiment of the present application provides a heat dissipation device that can be used to dissipate heat for an autonomous driving platform. This can reduce the size of the autonomous driving platform, facilitate the installation of the autonomous driving platform in the vehicle, and will not affect the NVH indicators of the vehicle.

[0007] In the first aspect, an embodiment of the present application provides a heat dissipation device, including: a liquid storage tank, the liquid storage tank stores liquid working fluid; a liquid pump, the liquid pump is connected to the liquid storage tank through a first liquid cooling pipe; a first heat exchanger, the first heat exchanger is connected to the liquid pump through a first extension pipeline; a second heat exchanger, the second heat exchanger is connected to the first heat exchanger through a second extension pipeline, and the second heat exchanger is connected to the liquid storage tank through a second liquid cooling pipe; a cooling fan, the cooling fan is arranged facing the second heat exchanger; the liquid pump is used to extract liquid working fluid from the liquid storage tank, pressurize the liquid working fluid, and make the liquid working fluid circulate in the order of the liquid storage tank, the first heat exchanger, and the second heat exchanger; the first heat exchanger is used to contact with a heat source, absorb heat from the heat source, and transfer the heat to the liquid working fluid; the cooling fan is used to generate cooling wind for the second heat exchanger, and accelerate the air flow around the second heat exchanger; the second heat exchanger is used to absorb heat from the liquid working fluid and evaporate the heat into the air.

[0008] The heat dissipation device provided in the embodiment of the present application is used to dissipate heat for the vehicle's autonomous driving computing platform, wherein the first heat exchanger of the heat dissipation device can be arranged inside the vehicle and contact the heating element of the autonomous driving computing platform, and the liquid storage tank, liquid pump, second heat exchanger and cooling fan of the heat dissipation device can be extended to the outside of the vehicle through the first extension pipeline and the second extension pipeline. When the heat dissipation device is working, the first heat exchanger absorbs the heat generated by the autonomous driving computing platform and transfers the heat to the liquid working medium flowing through the first heat exchanger; the liquid working medium flows to the outside of the vehicle under the pressure of the liquid pump, and transfers the heat it carries to the second heat exchanger located outside the vehicle; the heat in the second heat exchanger is quickly released to the air outside the vehicle under the cooling wind of the cooling fan. It can be seen that since the heat dissipation device provided in the embodiment of the present application only needs to install a heat exchanger on the autonomous driving computing platform, and does not need to install other components such as fans, the size of the autonomous driving computing platform can be reduced, and since the cooling fan that can generate noise is arranged outside the vehicle, the passengers in the vehicle will not feel the noise of the cooling fan, so the heat dissipation device of the embodiment of the present application will not affect the NVH index of the vehicle, which is conducive to improving the riding comfort of the passengers.

[0009] In one implementation, the heat dissipation device further includes: a housing; a liquid storage tank, a liquid pump, a heat dissipation fan and a second heat exchanger are arranged inside the housing; and a first heat exchanger is arranged outside the housing and is arranged independently of the housing. In this way, when the heat dissipation device is installed on a vehicle, it is only necessary to install the first heat exchanger inside the vehicle and the housing outside the vehicle, which saves time and effort.

[0010] In one implementation, the first heat exchanger includes a heat exchange plate and a first heat conduction pipeline arranged inside the heat exchange plate; both ends of the first heat conduction pipeline are located on the surface of the heat exchange plate, one end is the liquid inlet of the first heat exchanger, and the other end is the liquid outlet of the first heat exchanger; the heat exchange plate is used to contact with the heat source, absorb heat from the heat source, and transfer the heat to the liquid working medium in the first heat conduction pipeline.

[0011] In one implementation, the heat exchange plate includes a first plate surface, the first plate surface is a planar structure, and the first plate surface is used to contact with a heat source.

[0012] In one implementation, the heat exchange plate further includes a second plate surface, the second plate surface is opposite to the first plate surface, and the second plate surface includes a plurality of heat sinks arranged at intervals. In this way, the heat exchange plate can form a larger contact area with the air through the heat sinks, thereby having a certain heat dissipation performance.

[0013] In one implementation, the second heat exchanger includes a fin structure and a second heat-conducting pipeline; the fin structure is composed of a plurality of stacked metal sheets, with a gap between two adjacent metal sheets; the second heat-conducting pipeline shuttles back and forth between the plurality of metal sheets, one end of the second heat-conducting pipeline is the liquid inlet of the second heat exchanger, and the other end is the liquid outlet of the second heat exchanger; the fin structure is used to absorb the heat of the liquid working fluid in the second heat-conducting pipeline and evaporate the heat into the air.

[0014] In one implementation, the metal sheets are arranged parallel to the air duct direction of the heat dissipation fan, so that the cooling air generated by the heat dissipation fan can pass through the gaps between the metal sheets, taking away the heat on the metal sheets and preventing the heat from accumulating near the metal sheets.

[0015] In one implementation, the first extension pipe includes: a third liquid cooling pipe and a first extension pipe; one end of the third liquid cooling pipe is connected to a liquid pump; one end of the first extension pipe is connected to a liquid inlet of a first heat exchanger; the other end of the third liquid cooling pipe and the other end of the first extension pipe are both provided with a quick connector, and the third liquid cooling pipe and the first extension pipe are connected via the quick connector. In this way, through the quick structure, the third liquid cooling pipe and the first extension pipe can realize quick connection and disconnection of the pipes, and can prevent leakage when the pipes are disconnected.

[0016] In one implementation, the quick connector of the third liquid cooling pipe is disposed on the shell and is located outside the shell.

[0017] In one implementation, the second extension pipe includes: a fourth liquid cooling pipe and a second extension pipe; one end of the fourth liquid cooling pipe is connected to the liquid inlet of the second heat exchanger; one end of the second extension pipe is connected to the liquid inlet of the first heat exchanger; the other end of the fourth liquid cooling pipe and the other end of the second extension pipe are both provided with a quick connector, and the fourth liquid cooling pipe and the second extension pipe are connected by the quick connector. In this way, through the quick structure, the fourth liquid cooling pipe and the second extension pipe can realize the quick connection and disconnection of the pipes, and can prevent leakage when the pipes are disconnected.

[0018] In one implementation, the quick connector of the fourth liquid cooling pipe is disposed on the shell and is located outside the shell.

[0019] In one implementation, the second heat exchanger is part of the housing.

[0020] In one implementation, the heat source includes a printed circuit board of an autonomous driving computing platform, the printed circuit board includes at least one heating element, and the first heat exchanger is used to contact the at least one heating element.

[0021] In a second aspect, an embodiment of the present application provides a vehicle, comprising: an autonomous driving computing platform and a heat dissipation device provided by the above-mentioned first aspect and its various implementation methods; the autonomous driving platform and the first heat exchanger of the heat dissipation device are arranged inside the vehicle body, and the liquid storage tank, liquid pump, second heat exchanger and cooling fan of the heat dissipation device are arranged outside the vehicle body; the autonomous driving platform includes a printed circuit board, the printed circuit board includes at least one heating element, and the first heat exchanger is in contact with the at least one heating element.

[0022] The vehicle provided in the embodiment of the present application can reduce the size of the autonomous driving computing platform because the heat dissipation device only needs to install a heat exchanger on the autonomous driving computing platform, and does not need to install other components such as fans. In addition, since the cooling fan that can generate noise is arranged outside the vehicle, the passengers in the vehicle will not feel the noise of the cooling fan. Therefore, the heat dissipation device of the embodiment of the present application will not affect the NVH index of the vehicle, which is beneficial to improving the riding comfort of the passengers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the air-cooling heat dissipation structure of the current autonomous driving computing platform;

[0024] Figure 2 The installation scenario of the autonomous driving computing platform in a vehicle is shown;

[0025] Figure 3 is a schematic diagram of the structure of the heat dissipation device provided in an embodiment of the present application;

[0026] Figure 4 is a structural schematic diagram of a first extension pipeline provided in an embodiment of the present application;

[0027] Figure 5 is a structural schematic diagram of a second extension pipeline provided in an embodiment of the present application;

[0028] Figure 6 It is a schematic diagram of a pipeline connection method shown in an embodiment of the present application;

[0029] Figure 7 It is a schematic diagram of another pipe connection method shown in an embodiment of the present application;

[0030] Figure 8 is a structural schematic diagram of a first heat exchanger shown in an embodiment of the present application;

[0031] Fig. 9 is a cross-sectional view of the first heat exchanger shown in the embodiment of the present application along the direction of A;

[0032] Fig.10 It is a schematic diagram of the installation of the first heat exchanger and the PCB of the autonomous driving computing platform provided in an embodiment of the present application;

[0033] Fig.11 is a structural schematic diagram of another first heat exchanger shown in an embodiment of the present application;

[0034] Fig.12 is a schematic diagram of the cross-sectional shape of the first heat transfer pipeline shown in an embodiment of the present application;

[0035] Fig.13 is a schematic structural diagram of a second heat exchanger provided in an embodiment of the present application;

[0036] Fig.14 is a schematic structural diagram of a heat dissipation device with a housing provided in an embodiment of the present application;

[0037] Fig.15 is a schematic diagram of a heat dissipation device according to an embodiment of the present application installed in a vehicle;

[0038] Fig.16 It is a schematic diagram of an integrated structure of a heat dissipation device and an autonomous driving computing platform provided in an embodiment of the present application.

[0039] Among them: 10-heat dissipation device, 21-autopilot computing platform, 100-liquid storage tank, 110-liquid working medium, 120-first liquid cooling pipe, 200-liquid pump, 230-first extension pipe, 231-third liquid cooling pipe, 232-first extension pipe, 233-pipe joint, 234-pipe joint, 300-first heat exchanger, 330-joint, 340-second extension pipe, 341-fourth liquid cooling pipe, 342-second extension pipe, 343-pipe joint Head, 344-pipe joint, 345-clamp, 350-heat exchange plate, 351-first plate surface, 352-second plate surface, 353-heat sink, 360-first heat conduction pipeline, 361-plane pipe wall, 400-heat exchanger, 410-second liquid cooling pipe, 450-metal sheet, 460-second heat conduction pipeline, 500-cooling fan, 610-heating element, 620-heat conducting medium, 700-shell, 710-shell bottom, 720-shell side. DETAILED DESCRIPTION

[0040] Autonomous vehicles (autonomous vehicles; self-piloting automobile), also known as driverless cars, computer-driven cars or wheeled mobile robots, are unmanned ground vehicles with transportation power. As an automated vehicle, an autonomous vehicle can sense its environment and navigate without human operation. An autonomous vehicle can sense its environment using technologies such as radar, optical radar, global navigation satellite system (GNSS) and computer vision. The control system equipped with an autonomous vehicle can convert the sensing data into appropriate navigation roads, obstacles and related signs to update map information, track its own position in real time, and control or assist the driver in controlling the vehicle's driving behavior in real time.

[0041] The control system of an autonomous vehicle, especially a high-level autonomous vehicle, generally includes an autonomous driving computing platform (or on-board computing module), such as a mobile data center (MDC). The autonomous driving computing platform can sense the surrounding environment through on-board sensors such as cameras, lidar, millimeter-wave radar, and ultrasound, make decisions based on the information obtained, and formulate corresponding strategies based on appropriate working models, such as predicting the movement status of the vehicle and other vehicles, pedestrians, etc. in the future, and planning collision-avoidance paths.

[0042] Currently, the National Highway Traffic Safety Administration (NHTSA) of the United States divides autonomous driving into 6 levels, which are as follows from low to high:

[0043] L0: No automation configuration, the driver is the only one driving the vehicle, and there is no active safety configuration.

[0044] L1: Driving assistance. The vehicle has certain functions to assist the driver in performing specific tasks of lateral or longitudinal vehicle movement (but it cannot complete complex tasks such as merging and overtaking at the same time). The driver bears most of the vehicle control capabilities.

[0045] L2: Advanced driving assistance. The vehicle has a certain ability to assist the driver in performing lateral and longitudinal vehicle movement tasks (the vehicle can autonomously perform specific complex tasks), but the driver needs to monitor the vehicle in real time to complete these tasks.

[0046] L3: Autonomous driving in specific scenarios. With the owner's consent, the autonomous driving system can fully intervene in the vehicle's driving. Of course, the owner can correct the errors that occur during the vehicle's autonomous driving at any time.

[0047] L4: Advanced autonomous driving. All operations of the vehicle are realized through the autonomous driving system. In the execution scenario, the vehicle has no illogical performance (no errors), and no operator intervention is required.

[0048] L5: Regardless of whether it is in a specific execution scenario, the vehicle can reach the destination through automatic driving without the owner's operation.

[0049] It can be seen that from L1 to L5, the number of driving behaviors completed autonomously by the vehicle is increasing, and the computing power demand of the autonomous driving computing platform is correspondingly greater. As the computing power of the autonomous driving computing platform increases, the power consumption of the autonomous driving computing platform also gradually increases, from a low of a few watts to tens of watts or even hundreds of watts. The increase in the power consumption of the autonomous driving computing platform also brings about an increase in heat generation, which puts higher requirements on the heat dissipation capacity of the autonomous driving computing platform.

[0050] For autonomous driving computing platforms, the available cooling methods mainly include natural cooling (i.e. passive cooling), air cooling and water cooling. Natural cooling refers to the use of the autonomous driving computing platform itself and the environment for heat exchange. This method has low cooling efficiency and a maximum cooling capacity of about 20 watts (W), which cannot meet the cooling requirements of autonomous driving computing platforms at levels L3 and above. Therefore, autonomous driving computing platforms at levels L3 and above mainly use air cooling and water cooling.

[0051] At present, the air cooling and water cooling of the autonomous driving computing platform can generally be achieved with the help of the thermal management system of the car. However, there are also differences in the available cooling methods for cars with different power types.

[0052] For example, the thermal management system of new energy vehicles generally includes four parts: battery cooling system, air conditioning system, motor cooling system and reducer cooling system. Among them, the battery cooling system and motor cooling system use water cooling, and the maximum water temperature is about 45°C and 64°C respectively. Therefore, in new energy vehicles, the battery cooling system or motor cooling system can also be used for water cooling of the autonomous driving computing platform, which has a natural advantage in achieving the heat dissipation of the autonomous driving computing platform.

[0053] Unlike new energy vehicles, the thermal management system of traditional fuel vehicles generally consists of two parts: the air conditioning thermal management system and the engine thermal management system. Among them, the air conditioning thermal management system has no liquid cooling pipeline, while the water temperature of the engine thermal management system can be as high as 90°C or above. Such a high water temperature makes it impossible to use water cooling to dissipate heat for the autonomous driving computing platform. Therefore, in traditional fuel vehicles, air cooling is generally used for high-computing autonomous driving computing platforms.

[0054] The front cabin of a traditional fuel vehicle is filled with components such as the engine, gearbox, and battery, and there is generally not enough space to install autonomous driving computing platform equipment. In addition, the operating temperature of the front cabin of a traditional fuel vehicle is generally between -40℃ and 140℃, facing extreme cold or high temperatures. Therefore, except for some small-sized, low-power, high-specification on-board electronic devices such as the electronic control unit (ECU), other on-board electronic devices are basically not considered for placement, and it is not suitable for placing large-sized, high-power on-board electronic devices, such as autonomous driving computing platforms.

[0055] It can be seen that due to the limitations of installation space and environmental factors, even air-cooled autonomous driving computing platforms are not suitable for placement in the front cabin of traditional fuel vehicles. Therefore, in traditional fuel vehicles, the autonomous driving computing platform can only be set up inside the cockpit.

[0056] Figure 1 This is a schematic diagram of the air-cooling structure of the current autonomous driving computing platform. Figure 1 As shown, the air-cooled heat dissipation structure includes a housing 11, the mainboard of the autonomous driving computing platform is arranged in the housing 11, and the heating element 13 on the mainboard 12 is connected to the housing 11 through a heat-conducting medium 14. The portion of the housing 11 connected to the heating element 13 includes a radiator 15. A fan 16 is arranged on the top of the housing 11 above the heating element 13 to supply air to the inside of the housing 11. Generally speaking, the fan 16 can be arranged in the center of the top of the housing 11 so that after the air flow reaches the side close to the heating element 13, it is diverted to both sides of the housing 11 along the radiator 15, forming a heat dissipation structure as shown in FIG. Figure 1 In the air duct shown, the heat generated by each heating element 13 on the mainboard 12 is transferred to the heat sink 15 and then diffused into the air under the action of the airflow in the air duct.

[0057] However, for example Figure 1 The air-cooled autonomous driving computing platform shown in the figure has the following problems in practical applications:

[0058] 1. Poor system reliability. If a fan in the system fails, the air cooling capacity will drop sharply, causing the chip overheating and frequency reduction, overheating self-protection triggering, and component overheating damage on the autonomous driving computing platform. In severe cases, the autonomous driving computing platform may crash.

[0059] 2. The fan pressure loss is large. Inside the shell of the autonomous driving computing platform, due to the change in wind direction and structural resistance, the pressure loss of the air duct can generally only meet the heat dissipation requirements of the 100W power level, and cannot meet the heat dissipation requirements of future autonomous driving computing platforms above L4 level.

[0060] 3. The device is large in size. After the autonomous driving computing platform is equipped with an air-cooled heat dissipation structure, the size of the device will become larger due to the addition of components such as the housing, radiator, and fan, making it difficult to find an accommodating installation location in the vehicle body.

[0061] 4. In addition, the vehicle's noise, vibration, and harshness (NVH) is an important indicator for evaluating the vehicle's ride comfort, and it is also an important indicator that major automobile manufacturers strive to improve. However, if the air-cooled autonomous driving computing platform is placed in the cockpit, its fan noise will inevitably cause the NVH index to deteriorate.

[0062] To solve the above problems, an embodiment of the present application provides a heat dissipation device, which is independent of the vehicle's thermal management system and can be used to dissipate heat from various types of vehicle-mounted heating modules including autonomous driving computing platforms, and can be used in both new energy vehicles and traditional fuel vehicles.

[0063] In order to facilitate those skilled in the art to deeply understand the technical solution of this application, Figure 2 The figure shows the installation scenario of the autonomous driving computing platform in the vehicle. Figure 2As shown, the autonomous driving computing platform 21 is generally installed in the vehicle body, such as in the center console or under the seat. In coordination with the autonomous driving computing platform 21, the vehicle is also equipped with various types of sensors, such as a laser radar 22, a camera 23, a millimeter wave radar 24, etc., to detect the environment in which the vehicle is located, the vehicle's own state, etc., and feed back the detected data to the autonomous driving computing platform 21. The autonomous driving computing platform 21 uses its built-in artificial intelligence (AI) chip, such as a neural network processing unit (NPU), to perform real-time reasoning operations on the received data, and generates operation instructions based on the operation results and sends them to the vehicle control unit (VCU) 25. The VCU controls the vehicle braking according to the operation instructions, such as braking, deceleration, etc., to achieve various levels of autonomous driving functions. The computing module can also upload data to the cloud data center at the back end of the network through the vehicle communication terminal (telematics box, T-BOX) 26. Generally speaking, the autonomous driving computing platform 21 and the camera 23 can transmit information through a gigabit multimedia serial link (GMSL); the autonomous driving computing platform 21 and the lidar 22 can transmit information through an on-board Ethernet link; the autonomous driving computing platform 21 and the VCU 25 or the motor control unit (MCU) and the battery management system (BMS) can transmit information through the controller area network (CAN) bus; the autonomous driving computing platform 21 and the millimeter wave radar 24 can transmit information through the CAN bus; the autonomous driving computing platform 21 and the ultrasonic radar ( Figure 2 Information can be transmitted between the autonomous driving computing platform 21 and T-BOX 26 through an Ethernet link.

[0064] Figure 3 Schematic diagram of the structure of the heat dissipation device provided in the embodiment of the present application. Figure 3As shown, the heat dissipation device may include: a liquid storage tank 100, a liquid pump 200, a first heat exchanger 300, a second heat exchanger 400 and a heat dissipation fan 500. The liquid storage tank 100 stores a liquid working medium 110, the liquid pump 200 is connected to the liquid storage tank 100 through a first liquid cooling pipe 120, the first heat exchanger 300 is connected to the liquid pump 200 through a first extension pipe 230, the second heat exchanger 400 is connected to the first heat exchanger 300 through a second extension pipe 340, and the liquid storage tank 100 is connected to the second heat exchanger 400 through a second liquid cooling pipe 410. Therefore, through the above-mentioned pipeline connection relationship, the heat dissipation device forms a circulation loop in which the liquid working medium 110 flows from the liquid storage tank 100 through the first liquid cooling pipe 120 to the liquid pump 200, then flows to the first heat exchanger 300 through the first extension pipe 230, flows to the second heat exchanger 400 through the second extension pipe 340, and then flows back into the liquid storage tank 100 through the second liquid cooling pipe 410.

[0065] The following further combines Figure 3 The structures and functions of the components of the heat dissipation device of the embodiment are described.

[0066] The liquid storage tank 100 can be a closed hollow tank body, and the liquid storage tank 100 can be made into various shapes, such as cubic, spherical, cylindrical, etc., which is not limited in the embodiment of the present application. The liquid storage tank 100 can be made of metal, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc., or can be made of heat-resistant non-metal, which is not limited in the embodiment of the present application. The liquid storage tank 100 may include at least one liquid inlet 130 and at least one liquid outlet 140, wherein the liquid inlet 130 of the liquid storage tank 100 is used for the liquid working medium 110 of the second heat exchanger 400 to flow into the liquid storage tank 100, and the liquid outlet 140 of the liquid storage tank 100 is used for the liquid working medium 110 in the liquid storage tank 100 to flow into the liquid pump 200.

[0067] In the embodiment of the present application, the liquid working medium 110 can be, for example, substances such as Freon, ammonia, acetone, methanol, ethanol, heptane and water, and combinations of the above substances, which is not limited in the embodiment of the present application.

[0068] The liquid pump 200 in the embodiment of the present application includes at least one liquid inlet 210 and at least one liquid outlet 220. The liquid inlet 210 of the liquid pump 200 is connected to the liquid outlet 140 of the liquid storage tank 100 through the first liquid cooling pipe 120. The liquid pump 200 is used to extract the liquid working medium 110 from the liquid storage tank 100 through the first liquid cooling pipe 120, and the liquid working medium 110 is pressurized so that the liquid working medium 110 flows out from the liquid outlet 220 of the liquid pump 200 to the first extension pipeline 230 under the action of pressure.

[0069] The embodiment of the present application does not specifically limit the type of the liquid pump 200. For example, the liquid pump 200 can be a volumetric pump or a dynamic pump. Among them, the volumetric pump can, for example, include reciprocating pumps (such as plunger pumps), rotor pumps (such as screw liquid pumps), etc. of various structures, and the dynamic pump can, for example, include centrifugal pumps and vortex pumps of various structures. Considering that the heat dissipation device of the embodiment of the present application can be applied to the automatic driving computing platform of the vehicle, and the vehicle generally has an easier access to a DC power supply as the power source of the liquid pump 200, the liquid pump 200 of the embodiment of the present application preferably adopts a centrifugal pump driven by a DC motor to facilitate the implementation of the solution.

[0070] The first heat exchanger 300 of the embodiment of the present application can be made of metal materials with excellent thermal conductivity, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc. The first heat exchanger 300 includes at least one liquid inlet 310 and at least one liquid outlet 320. The liquid inlet 310 of the first heat exchanger 300 is connected to the liquid outlet 220 of the liquid pump 200 through the first extension pipeline 230, and the first heat exchanger 300 is provided with an internal pipeline or cavity for accommodating the liquid working medium 110 between its liquid inlet 310 and the liquid outlet 320. The liquid working medium 110 flowing out of the liquid outlet 220 of the liquid pump 200 passes through the first extension pipeline 230 under the pressure of the liquid pump 200, flows from the liquid inlet 310 of the first heat exchanger 300 into the internal pipeline or cavity of the first heat exchanger 300, and flows out from the liquid outlet 320 of the first heat exchanger 300 to the second extension pipeline 340.

[0071] The second heat exchanger 400 of the embodiment of the present application can be made of metal materials with excellent thermal conductivity, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc. The second heat exchanger 400 includes at least one liquid inlet 420 and at least one liquid outlet 430. The liquid inlet 420 of the second heat exchanger 400 is connected to the liquid outlet 320 of the first heat exchanger 300 through the second extension pipeline 340, and the liquid outlet 430 of the second heat exchanger 400 is connected to the liquid inlet 130 of the liquid storage tank 100 through the second liquid cooling pipe 410. The second heat exchanger 400 is provided with an internal pipeline or cavity for accommodating the liquid working medium 110 between its liquid inlet 420 and the liquid outlet 430, and the second heat exchanger 400 can also be provided with a heat sink outside the internal pipeline or cavity, and the heat sink is, for example, a heat sink of a fin-type structure. The liquid working medium 110 flowing out from the liquid outlet 320 of the first heat exchanger 300 passes through the second extension pipeline 340 under the pressure of the liquid pump 200, flows into the internal pipeline or cavity of the second heat exchanger 400 from the liquid inlet 420 of the second heat exchanger 400, and flows out from the liquid outlet 430 of the second heat exchanger 400 to the second liquid cooling pipe 410, and finally flows back to the liquid storage tank 100 through the second liquid cooling pipe 410.

[0072] The cooling fan 500 in the embodiment of the present application may include a single fan, or include a fan group consisting of multiple fans. When the cooling fan 500 includes multiple fans, the multiple fans can be arranged in parallel so that the wind direction of the cooling wind they generate is the same. The second heat exchanger 400 is arranged in the downstream direction of the air duct of the cooling fan 500, so that when the cooling fan 500 is working, the cooling wind it generates blows directly to the second heat exchanger 400, which can accelerate the air flow around the second heat exchanger 400 and take away heat. The heat dissipation device of the embodiment of the present application can be applied to the autonomous driving computing platform of the vehicle, and the vehicle is generally easier to obtain a DC power supply, so the cooling fan 500 can be powered by the DC power supply of the vehicle.

[0073] Figure 4 2 is a schematic diagram of the structure of the first extension pipeline 230 provided in the embodiment of the present application. Figure 4 As shown, the first extension pipeline 230 includes a third liquid cooling pipe 231 and a first extension pipe 232. One end of the third liquid cooling pipe 231 is connected to the liquid outlet of the liquid pump 200, and the other end is provided with a pipe joint 233. The first extension pipe 232 is preferably made of a freely bendable hose material, which can be a metal material or a non-metallic material. One end of the first extension pipe 232 is connected to the liquid inlet 310 of the first heat exchanger 300, and the other end is provided with a pipe joint 234 that can be docked with the pipe joint 233 of the third liquid cooling pipe 231. The third liquid cooling pipe 231 and the first extension pipe 232 are connected by docking the pipe joint 233 with the pipe joint 234.

[0074] Figure 5 3 is a schematic diagram of the structure of the second extension pipeline 340 provided in the embodiment of the present application. Figure 5 As shown, the second extension pipeline 340 includes a fourth liquid cooling pipe 341 and a second extension pipe 342. One end of the fourth liquid cooling pipe 341 is connected to the liquid inlet 420 of the second heat exchanger 400, and the other end is provided with a pipe joint 343. The second extension pipe 342 is preferably made of a freely bendable hose material, which can be a metal material or a non-metallic material. One end of the second extension pipe 342 is connected to the liquid outlet 320 of the first heat exchanger 300, and the other end is provided with a pipe joint 344 that can be docked with the pipe joint 343 of the fourth liquid cooling pipe 341. The fourth liquid cooling pipe 341 and the second extension pipe 342 are connected by docking the pipe joint 343 with the pipe joint 344.

[0075] In the embodiment of the present application, the first liquid cooling tube 120, the second liquid cooling tube 410, the third liquid cooling tube 231 and the fourth liquid cooling tube 341 are preferably made of metal, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc. The tube body shape can be a round tube or other special-shaped tube body, such as: flat tube, elliptical tube, rectangular tube, corrugated tube, etc. The embodiment of the present application does not specifically limit the tube body shape of the above-mentioned liquid cooling tubes.

[0076] In the embodiment of the present application, the pipe joint 233 of the third liquid cooling pipe 231, the pipe joint 343 of the fourth liquid cooling pipe 341, the pipe joint 234 of the first extension pipe 232, and the pipe joint 344 of the second extension pipe 342 are preferably quick connectors. A quick connector, also known as a quick connector, is a connector that can connect or disconnect a pipe without tools. When the quick connector is in an unconnected state, the quick connector can close the pipe through its internal valve and other structures to prevent leakage. When the quick connector is in a connected state, the quick connector can connect the pipe and allow liquid to flow in the pipe.

[0077] In the embodiment of the present application, the first liquid cooling tube 120 and the liquid outlet 140 of the liquid storage tank 100, the first liquid cooling tube 120 and the liquid inlet 210 of the liquid pump 200, the second liquid cooling tube 410 and the liquid inlet 130 of the liquid storage tank 100, the second liquid cooling tube 410 and the liquid outlet 430 of the second heat exchanger 400, the third liquid cooling tube 231 and the liquid outlet 220 of the liquid pump 200, the first extension tube 232 and the liquid inlet 310 of the first heat exchanger 300, the second extension tube 342 and the liquid outlet 320 of the first heat exchanger 300, and the fourth liquid cooling tube 341 and the liquid inlet 420 of the second heat exchanger 400 can be connected using any achievable pipeline connection method.

[0078] As an optional implementation method, any two components to be connected can be connected by welding, which is preferably applicable to the scenario where both components to be connected are made of metal, such as the connection between the first liquid cooling pipe 120 and the liquid outlet 140 of the liquid storage tank 100. Welding can be performed by processes such as gas welding, arc welding (such as argon shielded welding), resistance welding, laser welding, and induction welding, which are not limited in the present embodiment.

[0079] As an optional implementation, a joint (such as a quick joint) may be provided at the connection point of any two components that need to be connected, so that they are connected through the joint.

[0080] As an optional implementation, the connection between any two components to be connected can be provided with matching internal and external threads to achieve threaded connection. Figure 6 As shown, one end of the second liquid cooling tube 410 used for connection with the second heat exchanger 400 can be provided with a connector 411 with an internal thread, and the liquid outlet 430 of the second heat exchanger 400 can also be provided with a connector 440 with an external thread that matches the connector 411. In this way, the second liquid cooling tube 410 and the liquid outlet of the second heat exchanger 400 can be threadedly connected.

[0081] As an optional implementation method, any two components to be connected can be connected by a pipe through a clamp. This method is preferably suitable for the scenario where the two components to be connected are made of hose materials. Take the second extension pipe 342 and the liquid outlet 320 of the first heat exchanger 300 as an example. Figure 7 As shown, when the second extension tube 342 is a hose, the liquid outlet 320 of the first heat exchanger 300 can be provided with a joint 330 that matches the inner diameter of the second extension tube 342, and the second extension tube 342 can be sleeved on the joint 330 to form an interference fit or a clearance fit, and then the second extension tube 342 and the joint 330 are fixed and sealed by the clamp 345.

[0082] Figure 8 Schematic diagram of the structure of the first heat exchanger 300 shown in the embodiment of the present application. Figure 8 As shown, the first heat exchanger 300 includes a heat exchange plate 350. The heat exchange plate 350 is preferably a flat plate structure, including a first plate surface 351 for contacting a heat source, and a second plate surface 352 arranged opposite to the first plate surface 351. The first plate surface 351 is a smooth and flat plane structure, and the second plate surface 352 is provided with a heat dissipation structure, which may include, for example, a plurality of heat dissipation fins 353 arranged at intervals on the second plate surface 352. In this way, the heat exchange plate 350 can form a large contact area with the air through the heat dissipation fins 353, thereby having a certain heat dissipation performance.

[0083] The heat exchange plate 350 can be made of metal materials with good thermal conductivity, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc., preferably lightweight metals, such as aluminum, aluminum-magnesium alloy, etc., to reduce weight.

[0084] Fig. 9 2 is a cross-sectional view of the first heat exchanger 300 shown in the embodiment of the present application along the A axis. Fig. 9 As shown, the heat exchange plate 350 is preferably a solid structure. A first heat conduction pipeline 360 ​​is arranged inside the heat exchange plate 350. Both ends of the first heat conduction pipeline 360 ​​are located on the surface of the heat exchange plate 350, one end forms the liquid inlet 310 of the first heat exchanger 300, and the other end forms the liquid outlet 320 of the first heat exchanger 300. The first heat conduction pipeline 360 ​​is arranged in a serpentine reciprocating manner inside the first heat exchanger 300, so that the first heat conduction pipeline 360 ​​is longer inside the heat exchange plate 350, so that a larger contact area can be formed with the heat exchange plate 350, which is beneficial for the heat exchange plate 350 to transfer heat to the liquid working medium 110 in the first heat conduction pipeline 360.

[0085] In the embodiment of the present application, the shape and size of the heat exchange plate 350 can be determined according to the area of ​​the heat source, so that the first plate surface 351 of the heat exchange plate 350 can be in full contact with the heat source. In a specific application, the heat source can be a semiconductor chip, resistor, capacitor or other heating element on a printed circuit board (PCB) of an autonomous driving computing platform.

[0086] Fig.10 FIG. 1 is a schematic diagram of the installation of the first heat exchanger 300 and the PCB of the autonomous driving computing platform provided in the embodiment of the present application. Figure 4 As shown, the first heat exchanger 300 is arranged on a side of the PCB where the heating element 610 is installed, and can be fixed on the PCB by means of screws, clamps or snap connections, so that the first board surface 351 of the heat exchange plate 350 is attached to the heating element 610. In this way, the heat generated by the heating element 610 can be conducted to the heat exchange plate 350, and then conducted by the heat exchange plate 350 to the liquid working medium in the first heat conduction pipeline 360.

[0087] It is understandable that when a plurality of heating elements 610 are mounted on the PCB, the heights of these heating elements 610 may be different, so there may be gaps between some heating elements 610 and the first heat exchanger 300. Therefore, in order to fill the gaps and improve the heat transfer efficiency between the heating element 610 and the first heat exchanger 300, those skilled in the art may add a heat-conducting medium 620 on the heating element 610 before fixing the first heat exchanger 300 on the PCB, for example, apply a heat-conducting paste, such as heat-conducting silicone grease, liquid metal, etc., on the heating element 610, or place a heat-conducting pad, such as paraffin or silicone resin, etc., on the heating element 610 to fill the gaps. In this way, after the first heat exchanger 300 is fixed on the PCB, the first board surface 351 can be attached to the heating element 610 through the heat-conducting medium 620, and the heat generated by the heating element 610 can be transferred to the first heat exchanger 300 through the heat-conducting medium 620.

[0088] Fig.11 FIG. 2 is a schematic diagram of the structure of another first heat exchanger 300 shown in an embodiment of the present application. Fig.11 As shown, a part or all of the tube wall of the first heat-conducting pipeline 360 ​​can be exposed on the first plate surface 351. In this way, the tube wall of the first heat-conducting pipeline 360 ​​exposed on the first plate surface 351 can directly contact the heat source, thereby directly transferring the heat of the heat source to the liquid working medium, thereby improving the efficiency of heat transfer from the heat source to the liquid working medium 110.

[0089] In addition, further Fig.12As shown, the first heat conducting pipe 360 ​​can preferably be configured as a flat tube, which can be formed by a round tube through pressure extrusion. Compared with the round tube, under the condition of the same tube wall circumference, the flat tube can include a plane tube wall 361 with a width close to half of the tube wall circumference. The plane tube wall 361 of the first heat conducting pipe 360 ​​can be exposed on the first plate surface 351 and can be in the same plane as the first plate surface 351. In this way, the plane tube wall 361 of the first heat conducting pipe 360 ​​can form a larger contact area with the heat source, which is conducive to further improving the efficiency of heat transfer from the heat source to the liquid working medium 110.

[0090] Fig.13 Schematic diagram of the structure of the second heat exchanger 400 provided in the embodiment of the present application. Fig.13 As shown, the second heat exchanger 400 includes a fin structure and a second heat-conducting pipe 460. The fin structure is formed by stacking a plurality of metal sheets 450, and there is a certain gap between two adjacent metal sheets 450. One end of the second heat-conducting pipe 460 is the liquid inlet 420 of the second heat exchanger 400, and the other end is the liquid outlet 430 of the second heat exchanger 400. The second heat-conducting pipe 460 shuttles back and forth between the plurality of metal sheets 450 in a serpentine shape, so that heat can be transferred to the plurality of metal sheets 450. In addition, the metal sheets 450 are preferably parallel to the air duct direction of the heat dissipation fan 500, so that the cooling wind generated by the heat dissipation fan 500 can pass through the gaps between the metal sheets 450, take away the heat on the metal sheets 450, and avoid heat accumulation near the metal sheets 450.

[0091] In one embodiment, Fig.14 As shown, the heat dissipation device may also include a shell 700 for accommodating some components of the heat dissipation device, such as a liquid storage tank 100, a liquid pump 200, a first liquid cooling tube 120, a second liquid cooling tube 410, a third liquid cooling tube 231, a fourth liquid cooling tube 341 and a cooling fan 500. Other components, such as the first heat exchange plate 300, the first extension tube 232, and the second extension tube 342 are arranged outside the shell 700. The shell 700 can be made into various shapes, which is not limited to the embodiments of the present application. Taking a rectangular shell as an example, it may include a shell bottom surface 710 and a shell side surface 720 arranged around the shell bottom surface 710. Among them, the liquid storage tank 100, the liquid pump 200, and the cooling fan 500 can be fixed to the shell bottom surface 710 or the shell side surface 720 by screws, snaps, adhesives, etc. For example, in Fig.13 In the structure shown, the liquid pump 200 is disposed on the bottom surface 710 of the housing, and the liquid storage tank 100 and the cooling fan 500 are disposed on the side surface 720 of the housing.

[0092] In one implementation, the second heat exchanger 400 can be disposed inside the shell 700 . For example, the second heat exchanger 400 can be fixed to the shell side 720 by screws, snaps, adhesives, etc., and is located in the downstream direction of the air duct of the cooling fan 500 .

[0093] In one implementation, the second heat exchanger 400 may also be provided with the shell 700 to form an integral structure and become a part of the shell 700 . For example, the second heat exchanger 400 may become a part of the side surface 720 of the shell.

[0094] When the heat dissipation device includes a shell 700, the pipe joint 233 is arranged on the shell 700 and is located outside the shell 700, and is connected to the third liquid cooling pipe 231 arranged inside the shell 700, so that the first extension pipe 232 can be connected to the third liquid cooling pipe 231 outside the shell 700 through the pipe joint 233; in addition, the pipe joint 343 is arranged on the shell 700 and is located outside the shell 700, and is connected to the fourth liquid cooling pipe 341 arranged inside the shell 700, so that the second extension pipe 342 can be connected to the fourth liquid cooling pipe 341 outside the shell 700 through the pipe joint 343.

[0095] When the heat dissipation device includes a shell 700, the first extension tube 232, the second extension tube 342 and the first heat exchanger 300 can be arranged outside the shell 700, so that the first heat exchanger 300 can be arranged away from the shell 700 at any place where there is a heat source, that is, the heat source and the shell 700 can be arranged separately.

[0096] Combination Figure 3-Figure 14 As shown, when the heat dissipation device provided in the embodiment of the present application is working, the liquid working medium 110 forms a cycle along the order of liquid storage tank 100 → first liquid cooling pipe 120 → liquid pump 200 → first extension pipeline 230 → first heat exchanger 300 → second extension pipeline 340 → second heat exchanger 400 → second liquid cooling pipe 410 → liquid pump 200 → liquid storage tank 100 under the pressure of the liquid pump 200. At the first heat exchanger 300, the first heat exchanger 300 absorbs the heat generated by the heat source, a small part of the heat is transferred to the air through the first heat exchanger 300, and the rest of the heat is transferred to the liquid working medium 110 flowing through the first heat exchanger 300, so that the temperature of the liquid working medium 110 increases. When the liquid working medium 110 with increased temperature flows through the second heat exchanger 400, it can transfer the heat it carries to the second heat exchanger 400, so that the temperature of the liquid working medium 110 decreases, and flows back to the liquid storage tank 100 to continue to participate in the cycle. The heat in the second heat exchanger 400 is rapidly volatilized into the air under the effect of the cooling wind from the heat dissipation fan 500 .

[0097] The heat dissipation device of the embodiment of the present application can be used to dissipate heat for an autonomous driving computing platform. Fig.15FIG. 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present application installed in a vehicle. Fig.15 As shown, the autonomous driving computing platform is installed under the seat in the vehicle, and includes at least one PCB. The first heat exchanger 300 of the heat dissipation device is arranged on the side of the PCB of the autonomous driving computing platform where the chip and other heating elements are arranged, and is fitted with the heating elements. The housing of the heat dissipation device and other components inside the housing are arranged outside the vehicle, for example, under the chassis of the vehicle, and other components inside the housing are connected to the first heat exchanger 300 through the first extension pipeline 230 and the second extension pipeline 340. In this way, when the heat dissipation device is working, the first heat exchanger 300 absorbs the heat generated by the autonomous driving computing platform and transfers the heat to the liquid working medium flowing through the first heat exchanger 300; the liquid working medium flows to the outside of the vehicle under the pressure of the liquid pump, and transfers the heat it carries to the second heat exchanger 400 located on the outer housing of the vehicle; the heat in the second heat exchanger 400 is quickly released to the air outside the vehicle under the cooling wind of the cooling fan.

[0098] Therefore, the heat dissipation device of the embodiment of the present application realizes the transfer and release of the heat generated by the autonomous driving computing platform from inside the vehicle to outside the vehicle, which is similar to, for example, Figure 1 Compared with the traditional heat dissipation solution shown in the figure, the heat dissipation device of the embodiment of the present application has the following technical effects:

[0099] 1. Water cooling and distributed structure design are adopted to transfer some components of the heat dissipation device to the outside of the vehicle. Only one heat exchanger needs to be installed in the autonomous driving computing platform inside the vehicle, and there is no need to install additional components that occupy space inside the vehicle such as fan lights. Therefore, the heat dissipation device of the embodiment of the present invention reduces the module size of the autonomous driving computing platform while meeting the heat dissipation requirements of the autonomous driving computing platform for high-level autonomous driving, making it easier to find the installation space for the autonomous driving computing platform inside the vehicle body, and reducing the difficulty of designing the vehicle body structure.

[0100] 2. The cooling fan that can generate noise is arranged outside the vehicle, and passengers in the vehicle will not feel the noise of the cooling fan. Therefore, the cooling device of the embodiment of the present application will not affect the NVH index of the vehicle, which is beneficial to improving the riding comfort of passengers.

[0101] 3. The heat generated by the autonomous driving computing platform is transferred from inside the vehicle to outside the vehicle. Since the air flow outside the vehicle is better, it is more conducive to heat dissipation and will not cause heat accumulation. Therefore, the heat dissipation performance of the heat dissipation device in the embodiment of the present application is better.

[0102] 4. The heat generated by the autonomous driving computing platform is transferred from inside the car to outside the car, and the heat will not accumulate inside the car, thereby reducing the overall temperature inside the car and its surroundings, so that the autonomous driving computing platform will not experience chip overheating and frequency reduction, trigger overheating self-protection, or overheating damage to components, thereby improving system reliability.

[0103] In other embodiments, the heat dissipation device and the autonomous driving computing platform may also be designed in an integrated structure. Fig.16 As shown, the various components of the heat sink 10 and the components such as the PCB of the autonomous driving computing platform 21 can be arranged in the same housing, or the housing of the heat sink 10 and the housing of the autonomous driving computing platform 21 can be fixedly connected together. The integrated structural design of the heat sink 10 and the autonomous driving computing platform 21 can be applied to vehicles with low requirements for NVH indicators, such as trucks, construction machinery, etc.

[0104] The embodiment of the present application further provides a vehicle, which includes the heat dissipation device provided in the above embodiments of the present application, and is used to use the above heat dissipation device to dissipate heat for any heating element or module in the vehicle, such as: autonomous driving computing platform, ECU, VCU, etc. The vehicle includes but is not limited to fuel-powered vehicles, hybrid vehicles, pure electric vehicles, engineering machinery with driving capabilities, automatic guided vehicles AGV, robots with driving capabilities, etc.

[0105] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that: include: Fluid storage tank; A liquid pump, wherein the liquid pump is connected to the liquid storage tank via a first liquid cooling pipe; A first heat exchanger, wherein the first heat exchanger is connected to the liquid pump via a first extension pipeline; a second heat exchanger, wherein the second heat exchanger is connected to the first heat exchanger via a second extension pipeline, and the second heat exchanger is connected to the liquid storage tank via a second liquid cooling pipe; a cooling fan, wherein the cooling fan is arranged facing the second heat exchanger; A housing, wherein the liquid storage tank, the liquid pump and the cooling fan are arranged in the housing, and the second heat exchanger is arranged in or on the housing; The first heat exchanger is arranged outside the shell and is independently arranged from the shell; The first heat exchanger is used to contact with a heat source, absorb heat from the heat source, and transfer the heat to the liquid working medium flowing therethrough; The heat dissipation fan is used to generate cooling wind for the second heat exchanger to speed up the air flow around the second heat exchanger; The second heat exchanger is used to absorb heat from the liquid working medium flowing through it and volatilize the heat into the air; When the heat dissipation device is used to dissipate heat for a heat source inside a vehicle, the shell and the liquid storage tank, the liquid pump, the cooling fan, and the second heat exchanger therein are arranged below the chassis of the vehicle, the liquid pump, the cooling fan, and the second heat exchanger are laid along a first direction so that the cooling fan blows cooling air to the second heat exchanger along the first direction, the first direction is parallel to the chassis of the vehicle, the first heat exchanger is located on a side of the chassis of the vehicle away from the shell, and the heat source is located between the first heat exchanger and the chassis of the vehicle; The first heat exchanger includes a heat exchange plate and a first heat conduction pipeline arranged inside the heat exchange plate; The heat exchange plate includes a first plate surface and a second plate surface, the first plate surface is a planar structure, and is used to contact the heat source to absorb heat from the heat source and transfer the heat to the liquid working medium in the first heat conduction pipeline, the second plate surface is opposite to the first plate surface, and the second plate surface includes a plurality of heat sinks arranged at intervals; Both ends of the first heat conduction pipeline are located on the side of the heat exchange plate, one end is the liquid inlet of the first heat exchanger, and the other end is the liquid outlet of the first heat exchanger.

2. The heat dissipation device according to claim 1, characterized in that: The second heat exchanger includes a fin structure and a second heat conducting pipeline; The fin structure is composed of a plurality of stacked metal sheets, and there is a gap between two adjacent metal sheets; The second heat-conducting pipeline shuttles back and forth between the plurality of metal sheets, one end of the second heat-conducting pipeline is the liquid inlet of the second heat exchanger, and the other end is the liquid outlet of the second heat exchanger; The fin structure is used to absorb the heat of the liquid working medium in the second heat conduction pipeline and evaporate the heat into the air.

3. The heat dissipation device according to claim 2, characterized in that: The metal sheet is arranged parallel to the air duct direction of the heat dissipation fan.

4. The heat dissipation device according to claim 1, characterized in that: The first extension pipeline includes: a third liquid cooling pipe and a first extension pipe; One end of the third liquid cooling pipe is connected to the liquid pump; One end of the first extension tube is connected to the liquid inlet of the first heat exchanger; The other end of the third liquid cooling tube and the other end of the first extension tube are both provided with a quick connector, and the third liquid cooling tube and the first extension tube are connected via the quick connector.

5. The heat dissipation device according to claim 4, characterized in that: The quick connector of the third liquid cooling pipe is arranged on the shell and is located outside the shell.

6. The heat dissipation device according to claim 2 or 3, characterized in that: The second extension pipeline includes: a fourth liquid cooling pipe and a second extension pipe; One end of the fourth liquid cooling tube is connected to the liquid inlet of the second heat exchanger; One end of the second extension tube is connected to the liquid inlet of the first heat exchanger; The other end of the fourth liquid cooling tube and the other end of the second extension tube are both provided with a quick connector, and the fourth liquid cooling tube and the second extension tube are connected via the quick connector.

7. The heat dissipation device according to claim 6, characterized in that: The quick connector of the fourth liquid cooling pipe is arranged on the shell and is located outside the shell.

8. The heat dissipation device according to claim 1, characterized in that: The second heat exchanger is part of the shell.

9. The heat dissipation device according to claim 1, characterized in that: The heat source includes a printed circuit board of an autonomous driving computing platform, the printed circuit board includes at least one heating element, and the first heat exchanger is used to contact the at least one heating element.

10. The heat dissipation device according to claim 1, characterized in that: The liquid pump is used to extract liquid working medium from the liquid storage tank, pressurize the liquid working medium, and make the liquid working medium circulate along the liquid storage tank, the first heat exchanger and the second heat exchanger in sequence.

11. A vehicle, characterized in that: include: An autonomous driving computing platform and a heat dissipation device as described in any one of claims 1 to 10; The automatic driving platform and the first heat exchanger of the heat dissipation device are arranged inside the vehicle body, and the liquid storage tank, the liquid pump, the second heat exchanger and the heat dissipation fan of the heat dissipation device are arranged outside the vehicle body; The autonomous driving platform includes a printed circuit board, the printed circuit board includes at least one heating element, and the first heat exchanger is in contact with the at least one heating element.

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