Inductor devices, circuit systems, inductor assemblies, manufacturing methods, and storage hardware

Abstract

According to one configuration, the inductor device includes a first conductive path (131); a second conductive path (132), the first conductive path being electrically insulated from the second conductive path; a first material (141) for spacing the first conductive path from the second conductive path; and a second material (142). The second material has a magnetic permeability substantially higher than that of the first material. The assembly including the first conductive path, the second conductive path, and the first material is located within a core of the second material.

Description

Technical Field

[0001] This invention relates to the field of electronics, and more particularly to inductor devices and their implementation. Background Technology

[0002] Conventional switching power supply circuits sometimes include energy storage components such as inductors to generate an output voltage that supplies power to the load. For example, to keep the output voltage amplitude within a desired range, the controller uses one or more inductors to control the switching of the input current.

[0003] Typically, a conventional inductor is a component comprising wires or other conductive material shaped into coils or helices to increase the magnetic flux through the corresponding circuit path. Winding the wires into multiple turns of coil increases the number of corresponding magnetic flux lines in the corresponding inductor component, thereby increasing the magnetic field and thus increasing the total inductance of the corresponding inductor component.

[0004] In some cases, conventional electronic devices include multiple magnetically coupled inductor devices called transformers. Mutual inductance refers to the magnetic flux coupling of two or more inductors such that the voltage induced in one coil is proportional to the rate of change of current in the other coil. Therefore, a transformer is an inductor device consisting of two or more inductors and driven by changing the current, which results in an AC voltage across the second inductor. Summary of the Invention

[0005] Compared to conventional techniques, the embodiments described herein provide a novel and improved method for manufacturing inductor components.

[0006] For example, in one embodiment, the manufacturer fabricates an inductor device (i.e., an electronic device including one or more inductors) comprising a first conductive path and a second conductive path. The manufacturer spaces the first conductive path and the second conductive path of the inductor device apart by a first material (e.g., a spacer or insulating material). The first material electrically insulates the first conductive path from the second conductive path in the inductor device. Additionally, the manufacturer applies a second material to the assembly comprising the first conductive path, the second conductive path, and the first material. In one embodiment, the second material has a magnetic permeability substantially higher than that of the first material. In this case, the current flowing through the first conductive path generates magnetic flux. The density of magnetic flux generated in the second material is substantially higher than the density of magnetic flux in the first material.

[0007] According to a further embodiment, current flow through the first conductive path and high-density magnetic flux in the second material cause current flow through the second conductive path.

[0008] According to a further embodiment, the inductor device manufacturer manufactures a first conductive path as a first tubular structure extending along the axial length of the inductor device from a first end to a second end of the inductor device; in addition, the manufacturer manufactures a second conductive path as a second tubular structure extending along the axial length of the inductor device from the first end to the second end.

[0009] Another embodiment of this invention involves arranging a first tubular structure within a second tubular structure. In one embodiment, a first material is concentrically spaced from the second tubular structure relative to the first tubular structure. The fabricator arranges a second material outside the second tubular structure.

[0010] In one embodiment, the first material has a permeability of approximately 1. The second material has a permeability much greater than 1. In other words, in one embodiment, the first material has a permeability substantially lower than that of the second material.

[0011] In another embodiment, the higher permeability of the second material results in a magnetic flux density in the second material that is substantially greater than the magnetic flux density in the first material caused by the current flowing through the first conductive path.

[0012] In another embodiment, the first conductive path is a first portion of a separable tubular structure extending along the axial length of the sensor device; and the second conductive path is a second portion of a separable tubular structure extending along the axial length of the sensor device. In this case, the first material is located in the space between the cavity of the first portion of the tubular structure and the cavity of the second portion of the tubular structure. As previously discussed, the first material can be configured to have a magnetic permeability substantially lower than that of the second material.

[0013] According to another embodiment, the tubular structure divided into a first portion and a second portion is a first tubular structure arranged in the inductor device. Embodiments herein also include manufacturing the inductor device as a second tubular structure including a third conductive path, the third conductive path being a second tubular structure extending along the axial length of the inductor device from a first end to a second end. In one embodiment, the third conductive path (the second tubular structure) is arranged between the first conductive path and the second conductive path.

[0014] In another example embodiment, the fabricator creates a layer of a third material on top of the second material. The magnetic permeability of the third material is greater than that of the second material. As previously discussed, the magnetic permeability of the second material is substantially greater than that of the first material.

[0015] Another embodiment of this invention includes arranging a second material by a fabrication device to extend a first distance along the axial length of the inductor device; and arranging a third material to extend a second distance along the axial length of the inductor device, the second distance being smaller than the first distance. Variations in distance control parameters of the inductor device (e.g., magnetic induction).

[0016] According to another embodiment, the manufacturer manufactures the inductor device to include a third conductive path; the third conductive path surrounds or encloses an assembly including a first conductive path, a second conductive path, a first material, and a second material.

[0017] These and other more specific embodiments, including a method for designing a novel coaxial power transformer with ideal characteristics required for high-frequency applications, namely near-zero leakage inductance, no air gap, and low magnetization inductance, will be disclosed in more detail below. These applications include adapters, where the market introduction of wide-gap devices has pushed switching frequencies to higher levels. In this application, the popular flyback topology suffers from the drawback of dissipating energy stored in the leakage inductance during each switching cycle, which prevents full utilization of the high-frequency capabilities of GaN switches. Simultaneously, as the switching frequency increases, the application requires very low magnetization inductance values ​​to enable power transmission at these frequencies. Low magnetization inductance has traditionally been achieved through air gaps that cause magnetic flux leakage. Furthermore, EMI (electromagnetic interference) compliance requirements necessitate a completely sealed core design (i.e., shielding) without any air gaps to prevent any magnetic field coupling into EMI filters. The proposed transformer / inductor device described herein provides all of the features mentioned above.

[0018] Note that any resources implemented in the systems discussed herein (e.g., a manufacturer) may include one or more computerized devices, controllers, mobile communication devices, handheld or laptop computers, etc., to perform and / or support any or all of the methods disclosed herein. In other words, one or more computerized devices or processors may be programmed and / or configured to operate as described herein to perform the different implementations as illustrated herein.

[0019] Other embodiments of this document include software programs for performing the steps and operations outlined above and detailed below. One such embodiment includes a computer program product comprising a non-transitory computer-readable storage medium (i.e., any computer-readable hardware storage medium) on which software instructions are encoded for subsequent execution. When executed in a computerized device (hardware) having a processor, the instructions and / or program cause the processor (hardware) to perform the operations disclosed herein. Such arrangements are typically provided as software, code, instructions, and / or other data (e.g., data structures) arranged or encoded on firmware in a non-transitory computer-readable storage medium such as an optical medium (e.g., a CD-ROM), floppy disk, hard disk, memory stick, storage device, etc., or as application-specific integrated circuits (ASICs), etc. Software or firmware or other such configurations may be installed on a computerized device to cause the computerized device to perform the techniques described herein.

[0020] Therefore, the embodiments described herein are for methods, systems, computer program products, etc., that support the operations discussed herein.

[0021] One embodiment of this document includes a manufacturing apparatus, such as a computer-readable storage medium and / or system having instructions stored thereon for manufacturing an inductor device. These instructions, when executed by computer processor hardware, cause the computer processor hardware (e.g., one or more co-located or dissimilar processor devices or hardware) to perform the following operations: manufacturing the inductor device including a first conductive path and a second conductive path; spacing the first conductive path and the second conductive path of the inductor device apart by a first material, the first conductive path being electrically insulated from the second conductive path; and manufacturing a second material to surround (encircle, encapsulate, etc.) an assembly including the combination of the first conductive path, the second conductive path, and the first material.

[0022] For clarity, the order of the steps above has been added. Note that any processing steps as discussed in this article can be performed in any suitable order.

[0023] Other embodiments of this disclosure include software programs and / or corresponding hardware to perform any of the method implementation steps and operations outlined above and detailed below.

[0024] It should be understood that the systems, methods, devices, instructions on computer-readable storage media discussed herein can also be strictly implemented as software programs, firmware, a mixture of software, hardware and / or firmware, or as separate hardware, for example, within a processor (hardware or software), within an operating system, or within a software application.

[0025] Furthermore, it should be noted that while the implementations discussed herein are applicable to switching power supplies, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0026] Furthermore, it should be noted that although each of the different features, techniques, configurations, etc., described herein may be discussed in different places within this disclosure, it is intended that each of these concepts may optionally be implemented independently of each other or in combination with each other, where appropriate. Therefore, one or more of the inventions described herein can be practiced and observed in many different ways.

[0027] Additionally, it should be noted that this preliminary discussion of the embodiments herein does not intentionally designate every embodiment and / or novel aspect of this disclosure or the claimed invention. Instead, this disclosure presents only general embodiments and corresponding points of novelty relative to conventional techniques. For additional details and / or possible perspectives (alternatives) of the invention, the reader will be directed to the “Detailed Description” section (which is an overview of the embodiments) and the corresponding drawings of this disclosure, as further discussed below. Attached Figure Description

[0028] Figure 1 This is an example diagram illustrating an inductor device according to an embodiment of this document.

[0029] Figure 2 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0030] Figure 3 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0031] Figure 4 This is an example diagram illustrating an inductor device implemented as a transformer according to an embodiment of this document.

[0032] Figure 5 This is an example diagram illustrating an inductor device manufactured in a transformer circuit according to an embodiment described herein.

[0033] Figure 6 These are example diagrams illustrating different implementations of an inductor assembly comprising multiple inductor devices according to embodiments described herein.

[0034] Figure 7 This is an example diagram illustrating the implementation of several inductor devices according to embodiments described herein.

[0035] Figure 8 This is an example diagram showing a cross-sectional view of an elliptical inductor device according to an embodiment of this document.

[0036] Figure 9 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document.

[0037] Figure 10 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document.

[0038] Figure 11 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0039] Figure 12 This is an example diagram showing a 3D view of an inductor device according to an embodiment of this document.

[0040] Figure 13 This is an example diagram illustrating an example computer architecture (manufacturing system, hardware, etc.) operable to perform one or more methods according to the embodiments described herein.

[0041] Figure 14 This is an example diagram illustrating a method according to an embodiment of this document.

[0042] Figure 15 This is an example diagram illustrating a circuit assembly including one or more inductor devices according to an embodiment of this document.

[0043] As illustrated in the accompanying drawings, the foregoing and other objectives, features, and advantages of the embodiments described herein will become apparent from the more detailed description below, in which similar reference numerals refer to the same parts throughout different views. The drawings are not necessarily drawn to scale, but are intended to illustrate embodiments, principles, concepts, etc. Detailed Implementation

[0044] According to one configuration, the inductor device includes a first conductive path and a second conductive path. The first conductive path is electrically insulated from and spaced apart from the second conductive path by a spacer material. A second material surrounds the second conductive path. For example, an assembly of the first conductive path, the second conductive path, and the first material is located within a core of the second material.

[0045] In one embodiment, the second material has a substantially higher permeability than the first material. The second material with higher permeability is used to limit (guide, carry, transmit, position, etc.) the corresponding magnetic flux generated by the current flowing through the corresponding conductive path in the inductor device. Therefore, the magnetic flux density of the magnetic flux generated by the current through the first or second conductive path in the second material is substantially greater than the magnetic flux density in the first material.

[0046] Now, referring to the attached diagram, Figure 1 This is an example diagram illustrating an inductor device according to an embodiment of this document.

[0047] like Figure 1 As shown, the fabricator 140 fabricates the inductor device 120 to include a first conductive path 131 (e.g., made of metal or other suitable material) and a second conductive path 132 (e.g., made of metal or other suitable metal).

[0048] The first conductive path 131 and the second conductive path 132 can take any suitable shape.

[0049] In one embodiment, the inductor device 120 is generally cylindrical. A first conductive path 131 is a tubular structure extending from a first end 151 of the inductor device 120 along its axial length (y-axis) to a second end 152. The fabricator 140 fabricates a second conductive path 132 as a second tubular structure extending from the first end 151 to the second end 152 along the axial length (y-axis) of the inductor device 120.

[0050] In one embodiment, the first conductive path 131 is arranged within the second conductive path 132.

[0051] The fabricator 140 provides and fills the gap between the first conductive path 131 and the second conductive path 132 using a first material 141 (e.g., a so-called spacer material or insulating material). The first material 141 (e.g., having a magnetic permeability of about 1 or other suitable value) electrically insulates the first conductive path 131 and the second conductive path 132 in the inductor device 120.

[0052] If desired, the core (hollow center) of the inductor device 120 (e.g., conductive path 131) can be filled with a material such as the first material 141. Alternatively, the core of the conductive path 131 can be filled with air.

[0053] According to another embodiment, the manufacturer 140 arranges the first tubular structure (e.g., conductive path 131) within the second tubular structure (e.g., conductive path 132).

[0054] In one embodiment, as previously discussed, the first material 141 is concentrically spaced from the second tubular structure relative to the first tubular structure (conductive path 131) (from a cross-sectional view along the y-axis).

[0055] In another embodiment, the fabricator 140 also arranges the second material 142 outside the second tubular structure (conductive path 132). More specifically, as further shown, the fabricator 140 applies the second material 142 to the assembly including the first conductive path 131, the second conductive path 132, and the first material 141.

[0056] Therefore, the space between the outer surface of conductive path 131 and the inner surface of conductive path 132 is filled with material 141. The space between the outer surface of conductive path 132 and the inner surface of conductive path 133 is filled with material 142.

[0057] In one embodiment, the second material 142 has a magnetic permeability μ that is substantially higher than that of the first material 141. r For example, the magnetic permeability μ of the first material 141 r It could be, for example, a value of approximately 1; the permeability μ of the second material 142 r It can be a value greater than 5 (e.g., in the range between 5 and 1500 or other suitable values ​​outside that range).

[0058] As further discussed herein, in one embodiment, the current flowing through the first conductive path 131 from the first end 151 to the second end 152 generates magnetic flux (according to the right-hand rule).

[0059] Since the permeability of material 142 is substantially greater than that of material 141, the density of magnetic flux in material 142 (associated with the current flowing through the first conductive path 131) is substantially higher than the density of magnetic flux in the first material 141.

[0060] In one embodiment, current flow through the first conductive path 131 and high-density magnetic flux in the second material 142 cause current flow through the second conductive path 132.

[0061] Alternatively, the current flow through the second conductive path 132 and the corresponding high-density magnetic flux generated in the second material 142 result in the current flow through the first conductive path 131.

[0062] Note that, as further discussed herein, the leakage inductance (Lk) associated with the inductor device 120 can be adjusted by setting the radii R1, R2, and R3 and selecting the materials 141 and 142. Additionally, parameters of the inductor device 120, such as the capacitance between conductive paths 131 and 132 and the magnetizing inductance, can be adjusted by setting R1, R2, and R3 and selecting the materials (permeability). Other embodiments described herein include designing the geometry of the first material 141 to control the parasitic inductance and capacitance between the first conductive path 131 and the second conductive path 132. Yet another embodiment described herein includes designing the geometry of the second material 142 to control the magnetizing inductance of the inductor device 120.

[0063] Therefore, typically, the conductive path 131 (e.g., similar to a primary transformer winding) in the inductor device 120 is coaxially surrounded by the conductive path 132 (e.g., similar to a second inductor or transformer winding). A spacer material 141 (e.g., insulating material) is disposed between the first conductive path 131 and the second conductive path 132.

[0064] In one embodiment, the inductor device 120 functions as a transformer device. For example, a second conductive path 132 is magnetically coupled to a first conductive path 131; current flow through conductive path 131 causes current flow through the second conductive path 132. As previously discussed, conductive path 132 (e.g., similar to a secondary winding) is surrounded by material 142 (e.g., core material).

[0065] In another embodiment, the first conductive path 131 is located at a radius R1 (e.g., 0.5 mm) from the central axis (Y-axis) of the inductor device 120; the second conductive path 132 is located at a radius R2 (e.g., 2 mm) from the central axis (Y-axis) of the inductor device 120; and the third conductive path 133 is located at a radius R3 (e.g., 5 mm) from the central axis (Y-axis) of the inductor device 120.

[0066] It should also be noted that the inductor device 120 can be configured to include an outer layer of metallic material (conductive path 133) in contact with the outer surface of the magnetically conductive material 142. The third conductive path 133 surrounds or encloses the assembly including the first conductive path 131, the second conductive path 132, the first material 141, and the second material 142. If desired, the conductive path 133 (e.g., an external shield made of a metallic layer, which may be tubular in shape) can be attached to the secondary or primary side ground as required by the application.

[0067] Figure 2 This is an example diagram showing a cross-sectional view (viewed along the y-axis) of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0068] Control of leakage inductance associated with inductor devices —In one embodiment, as previously discussed, the inductor device 120 and the corresponding one or more components are cylindrical (tubular), which allows for several degrees of design freedom, for example:

[0069] i) The radial distance (e.g., R2-R1) between conductive path 132 and conductive path 131 can be used to adjust the leakage inductance (Lk) of the magnetically coupled inductor device 120. For example, by increasing the radial spacing between the second conductive path 132 and the first conductive path 131, the leakage inductance Lk also increases because the inductive coupling between the first conductive path 131 and the second conductive path 132 decreases. Note that some embodiments herein include providing low leakage (Lk) through an inductor device 120 without an air gap.

[0070] ii) Another parameter used to adjust the leakage inductance Lk associated with the inductor device 120 (e.g., a transformer) is the selection of the insulating material 141 present in the inductor device 120 between conductive paths 131 and 132. As previously discussed, the magnitude of the permeability of the insulating material 132 affects leakage in such a way that increasing the permeability of the material 132 increases the leakage Lk associated with the inductor device 120. This is because the magnetic flux induced in the insulating material 141 by the conductive path 131 (primary) is not associated with the conductive path 132 (secondary). Here, assuming the insulating material 141 is a material such as plastic, the leakage inductance from the primary (conductive path 131) is 10 nH. By increasing the radius of the conductive path 131 (inner primary) from 0.5 mm to 0.8 mm, while keeping everything else the same, the leakage Lk associated with the inductor device 120 is reduced to 7.16 nH.

[0071] In one embodiment, to reduce leakage to a bare physical minimum, the positions of the primary conductive path 131 and the secondary conductive path 132 can be interchanged, such that the secondary conductive path 132 is within the primary conductive path 131. More specifically, in one embodiment, conductive path 131 is analogous to a secondary winding, while conductive path 132 is analogous to the primary winding of a corresponding transformer. In this case, all magnetic flux generated by the current through the primary winding (e.g., the current through conductive path 132) is coupled to the secondary winding (conductive path 131), and therefore theoretically, no leakage occurs. Based on FEM (finite element method) simulations, utilizing... Figure 1 With the same physical dimensions as the inductor device 120, the leakage inductance is reduced to 138 pH (almost zero), and therefore can be ignored in practical applications.

[0072] Control of magnetizing inductance associated with inductor device —Based on FEM simulation, Figure 1 The inductor device 120 in Figure 1 The dimensions shown are used to simulate this. In this example embodiment, the core material 142 has μ... r =1100 (e.g., Hitachi) TMThe permeability of ML95S is much greater than 1, while the insulating material 141 has a permeability of approximately μ. r The permeability is 1. Therefore, the first material 141 has a substantially lower permeability than the second material 142.

[0073] In this case, the higher permeability of the second material 142 results in a magnetic flux density in the second material 142 that is substantially greater than the magnetic flux density in the first material caused by the current flowing through the first conductive path. See curve 210.

[0074] In one implementation, the thickness of each conductive path is set to 200 μm (micrometers), although this thickness can be any suitable value. As a result, in this example implementation, the primary and secondary side magnetizing inductance (Lm) associated with the inductor device 120 is 7.2 μH. Figure 2 Curve 210 shows the magnetic flux density inside the core material 142, which is based on a peak current of 4 amperes through the conductive path 131 and is well below the saturation limit of 430 mT (millitalas). Based on the formula for calculating the inductance (L) of the magnetic structure, the magnetizing inductance Lm of the inductor device 120 is inversely proportional to the magnetoresistance Rm:

[0075]

[0076] The magnetic reluctance of the inductor device 120 can be changed in various ways, such as by changing the permeability of the core material 142, by changing the height (H) of the inductor device 120 from the first end 151 to the second end 152, or by changing the width of the core material 142 (or the radius associated with the core material 142), etc.

[0077] For example, increasing the height (H) of the inductor device 120 typically reduces the magnetic reluctance and thus increases the magnetizing inductance (Lm) of the inductor device 120.

[0078] As further discussed herein, the use of spacer material 141 and the provision of a corresponding gap between the first conductive path 131 and the second conductive path 132 (via spacer material 141) enable control of the corresponding capacitance between the first conductive path 131 and the second conductive path 132.

[0079] Figure 3 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0080] Controllable inter-winding capacitance—In the alternative design of inductor device 120, where the target magnetizing inductance Lm of inductor device 140 is 2μH (microhenries), the dimensions of inductor device 120 can be changed to R1 = 0.5mm, R2 = 2mm, R3 = 3mm and h = 30mm (refer to...) Figure 3 ), in order to achieve the desired Lm value.

[0081] Using the primary winding (conductive path 132) as the outer ring of the inductor device 120, the leakage inductance is 107 pH (picohenry), which is almost zero inductance. In such a design with a circular gap of 1.5 mm (e.g., R2-R1)... Figure 3 In this circuit, the inter-winding capacitance between the primary (conducting path) and secondary (conducting path) windings is 3.58 pF, which is significantly lower than the commercially available target inter-winding capacitance of 100 pF for prior art adapters. This is useful because it completely eliminates the touch current problem. The inter-winding capacitance (Cpara) associated with the combination of conductive paths 131 and 132 of the inductor device 120 is calculated as follows:

[0082]

[0083] Based on this formula, it is shown how changing the geometry (e.g., R1, R2, height H, etc.) and / or characteristics of the insulating materials 141, 142, etc., affects the inter-winding capacitance associated with the inductor device 120.

[0084] Figure 4 This is an example diagram illustrating an inductor device implemented as a transformer according to an embodiment of this document. In this example embodiment, the inductor device 120 is implemented in a corresponding circuit 420. The inductor device 120 converts the input voltage (V41) into an output voltage (V42) based on a 1:1 ratio provided by the inductor device 120.

[0085] Figure 5 This is an example diagram illustrating an inductor device manufactured in a transformer circuit according to an embodiment described herein.

[0086] Note that all the inductor devices 120 mentioned above are designed to provide a 1:1 turns ratio.

[0087] To achieve a turns ratio different from 1:1, one can, as follows: Figure 5 The diagram shows multiple inductor devices 120 arranged in corresponding matrix components 510. This means that, for example, the primary-side terminals (conductive paths 131-1 and 131-2) of two corresponding inductor devices 120-1 and 120-2 can be arranged as follows: Figure 5 The series connection is shown, and the secondary side terminals (conductive paths 132-1 and 132-2) can also be connected as shown. Figure 5 The parallel connection is shown.

[0088] This implementation allows designs to provide conversion rates for integers N, i.e., N:1 or 1:N (where N=2 in this case).

[0089] In this case, based on the 2:1 ratio associated with component 510 and corresponding circuit 520, the output voltage V52 is half of the input voltage V51.

[0090] In one implementation, as shown in the figure, it is advantageous to place the series-connected windings (e.g., a combination of conductive paths 131-1 and 131-2) inside their output parallel-connected windings (e.g., conductive paths 132-1 and 132-2). This facilitates easier access to the parallel-connected windings (132-1 and 132-2) as they are the external tubular structures associated with conductive paths 131-1 and 131-2.

[0091] Figure 6 These are example diagrams illustrating different implementations of an inductor device according to embodiments described herein.

[0092] When implemented as a matrix arrangement of inductor device assemblies, the corresponding inductor assemblies do not necessarily have to be stacked as shown by assembly 610 (e.g., including inductor device 120-1, inductor device 120-2, inductor device 120-3 and inductor device 120-4).

[0093] For example, Figure 6 Examples of inductor devices 120 (e.g., including inductor devices 120-1, 120-2, 120-3, and 120-4) may be arranged adjacent to each other in small interconnected stacks (e.g., shown by component 620), or in smaller stacks (including stacks of inductor devices 120-1 and 120-2, stacks including inductor devices 120-3 and 120-4), or individually connected as shown in component 630.

[0094] Therefore, any instance of the multiple instances of inductor device 120 can be connected in parallel, in series, or in a combination of series and parallel. This allows the use of inductor devices and corresponding components of multiple inductor devices in space- or height-constrained applications, such as ultra-flat adapters.

[0095] Figure 7 This is an example diagram illustrating the implementation of several inductor devices according to embodiments described herein.

[0096] In this example implementation, the inductor device in component 720 supports a high-frequency flyback adapter application in which the current input to component 720 generates a corresponding output current.

[0097] Typically, component 720 utilizes five inductor devices (inductor devices 120-1, 120-2, 120-3, 120-4, and 120-5), each providing a 1:1 conversion ratio. As shown, four inductor devices 120 (i.e., inductor devices 120-1, 120-2, 120-3, and 120-4) are connected with a 4:1 buck ratio to convert an input voltage (V1) such as 5V to an output voltage (V2) of 1V. Inductor device 120-5 (e.g., an auxiliary winding) generates a separate output voltage V3 to power control electronics or other circuitry.

[0098] In this case, component 720 is characterized by very low leakage inductance and low magnetization inductance, and is therefore very suitable for use in high-frequency flyback converters.

[0099] Figure 8 This is an example diagram showing a cross-sectional view of an elliptical inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0100] Note that inductor devices can be configured into any suitable geometry. For example... Figure 8 As shown, when viewed along axis Y (perpendicular to the page), the shape and corresponding cross-sectional view of the inductor device 120 can be elliptical.

[0101] In this example embodiment, the inductor device 120-8 is generally elliptical. A first conductive path 131-8 is a tubular structure extending from a first end 151 of the inductor device 120-8 along its axial length (y-axis) to a second end 152. The fabricator 140 fabricates a second conductive path 132-8 as a second tubular structure extending along the axial length (y-axis) of the inductor device 120-8.

[0102] In one implementation, such as Figure 8 As shown, the first conductive path 131-8 is arranged within the second conductive path 132-8.

[0103] The fabricator 140 provides and fills the gap between the first conductive path 131-8 and the second conductive path 132-8 using a first material 141-8 (e.g., a so-called spacer material or insulating material). In the inductor device 120-8, the first material 141-8 (e.g., having a permeability of about 1 or other suitable value) electrically insulates the first conductive path 131-8 from the second conductive path 132-8.

[0104] Material 142-8 fills the gap between conductive path 132-8 and conductive path 133-8.

[0105] If desired, the core (hollow center) of the inductor device 120-8 (e.g., conductive path 131-8) may be filled with a material such as the first material 141-8. Alternatively, the core or center of the conductive path 131-8 may be filled with air.

[0106] In this example embodiment, the elliptical inductor device 120-8 has a magnetizing inductance of Lm = 2 μH. In this case, assuming that conductive path 131-8 is the primary winding located within conductive path 132-8, the leakage inductance (Lk) associated with inductor device 120-8 is 3.16 nH, and the inter-winding capacitance is 10 pF. Note that other embodiments described herein include so-called stadium geometry and elongated stadium shapes, which have the effect of reducing Lm and increasing the corresponding inter-winding capacitance.

[0107] Figure 9 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document.

[0108] According to another implementation method, such as Figure 9 The inductor device 120-9 shown can be configured to include a separable toroidal structure, wherein the corresponding primary conductive path and secondary conductive path are located in the same circle (cross-sectional view), but are divided into two (or more) parts (e.g., an arc of any angle A).

[0109] More specifically, in this example embodiment, the first conductive path 131-9 is a first portion of a separable tubular structure extending along the axial length of the inductor device 120-9 (along the y-axis perpendicular to the page); the second conductive path 132-9 is a second portion of a separable tubular structure extending along the axial length of the inductor device 120-9 (along the y-axis perpendicular to the page).

[0110] Conductive path 131-9 is electrically insulated from conductive path 132-9 by material 141-9. In this example embodiment, the first material 141-9 (e.g., having μ...) r The first material 141-9 (with a permeability of 1) is located in the space between the cavity of the first part (conductive path 131-9) of the separable tubular structure and the cavity of the second part (conductive path 132-9) of the separable tubular structure. As previously discussed, the first material 141-9 can be configured to have a permeability substantially lower than that of the second material 142-9 (e.g., a permeability greater than 50).

[0111] An example of a separable ring design with Lm = 2μH is given, where the winding radius associated with conductive paths 131-9 and 132-9 is 2mm and the core radius is 3mm. In such a case, with Figure 3In comparison, the inter-winding capacitance associated with the conductive path becomes even lower at 2.64 pF. This arrangement is also advantageous if easier access to the windings is required.

[0112] Figure 10 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document.

[0113] In another embodiment where the primary conductive path lies within the secondary conductive path, the secondary conductive path is divided into two half-loops, as shown in inductor device 120-10. This results in a center-tapped transformer, commonly used in high-current applications to reduce synchronous rectifier losses. In one embodiment, only one secondary half-loop conducts current at any given time. The leakage inductance value is essentially the same as in the case of a single secondary loop.

[0114] Note that the two parts of the separable ring (conductive paths 132-10A and 132-10B) do not necessarily belong to the same terminals of the inductor device 120-10. It is also possible that a portion of the separable ring belongs, for example, to an auxiliary winding having different division ratios of the circle. Those skilled in the art can readily derive further combinations of separable rings and enclosed windings not mentioned herein.

[0115] More specifically, in this example embodiment, the separable tubular structure arranged in the inductor device 120-10 includes a first portion (e.g., conductive path 132-10A) and a second portion (conductive path 132-10B), the separable tubular structure being a first tubular structure (which is separable) in the inductor device 120-10. Embodiments herein also include manufacturing the inductor device 120-10 to include, for example, a third conductive path 131-10 at the center of the first tubular structure.

[0116] In one embodiment, the third conductive path 131-10 is a second tubular structure extending along the axial length (along the y-axis) of the inductor device 120-10 from a first end of the inductor device 120-10 to a second end of the inductor device 120-10. The third conductive path 131-10 (the second tubular structure) is arranged between the first conductive path 132-10A and the second conductive path 132-10B.

[0117] Figure 11 This is an example diagram showing a cross-sectional view of an inductor device according to an embodiment of this document and the corresponding magnetic flux density.

[0118] In another exemplary embodiment, the fabricator 140 fabricates a layer of a third material 143 on the second material 142. The magnetic permeability of the third material 143 is greater than that of the second material 142.

[0119] As previously discussed, the permeability of the second material 142 is substantially greater than that of the first material 141 (e.g., at least 10% greater). The permeability of the third material 143 is substantially greater than that of the second material 142 (e.g., at least 10% greater).

[0120] In one embodiment, material 141 has μ r The permeability is 1; material 142 has a permeability of μ. r =1100 permeability; material 143 has μ r The permeability is 1500. Note that these values ​​are given for illustrative purposes only; the permeability of a material can be any suitable value.

[0121] exist Figure 11 In the example case, the Lm of inductor device 120-11 is from 2μH (for Figure 1 The single external magnetic permeable layer in the middle increases to 2.4 μH (for Figure 11 (Multiple external magnetic layers in the inductor). Also note that, as shown in curve 1110, the maximum magnetic flux is no longer concentrated at the edge of the outer winding (the outer surface of conductive paths 131-2), but rather in material 143 of inductor device 120-11. Note that inductor device 120-11 can be configured to include any number of layers of different magnetically conductive materials outside conductive paths 132.

[0122] Figure 12 This is an example diagram showing a 3D view of an inductor device according to an embodiment of this document.

[0123] Furthermore, it should be noted that Lm can be modified using different heights for two core geometries. For example, as... Figure 12 As shown, the height (distance) of the outer core (e.g., a layer of material 143) can be reduced from 30 mm to 20 mm, and thus Lm can be reduced from 2.4 μH to 1.7 μH, while keeping all other dimensions the same. Therefore, the desired Lm can be modified by adding or removing the toroidal core of small "cells" in the inductor device.

[0124] Therefore, the embodiments described herein include arranging a second material 142 by a fabrication apparatus 140 to extend a first distance (H1) along the axial length (along axis Y) of the sensor device 120-12; and arranging a third material 143 to extend a second distance (H2) along the axial length of the sensor device 120-12, wherein the distance H2

[0125] ​ Figure 13 This is a diagram illustrating an example computer architecture operable to perform one or more methods according to the embodiments described herein.

[0126] As previously discussed, any resources discussed herein (such as manufacturer 140, etc.) can be configured to include computer processor hardware and / or corresponding executable instructions to perform the different operations discussed herein.

[0127] As shown, the computer system 1300 of this example includes an interconnect 1311 that couples a computer-readable storage medium 1312 (e.g., a non-transitory type of medium (which may be any suitable type of hardware storage medium capable of storing and retrieving digital information)), a processor 1313 (e.g., computer processor hardware of one or more processor devices), an I / O interface 1314, and a communication interface 1317.

[0128] I / O interface 1314 supports connection to external hardware 1399 (e.g., manufacturing equipment), such as keyboard, display, storage library, etc.

[0129] The computer-readable storage medium 1312 can be any hardware storage device, such as a memory, optical storage, hard disk drive, floppy disk, etc. In one embodiment, the computer-readable storage medium 1312 stores instructions and / or data.

[0130] As shown, the computer-readable storage medium 1312 may be encoded with a manufacturer application 140-1 (e.g., including instructions) to perform any operation as discussed herein.

[0131] During operation in one implementation, processor 1313 accesses computer-readable storage medium 1312 via interconnect 1311 to initiate, run, execute, interpret, or otherwise perform instructions in manufacturer application 140-1 stored on computer-readable storage medium 1312. Execution of manufacturer application 140-1 produces manufacturer process 140-2 to perform any operations and / or processes as discussed herein.

[0132] Those skilled in the art will understand that computer system 1300 may include other processes and / or software and hardware components, such as an operating system that controls the allocation and use of hardware resources to execute manufacturer application 140-1.

[0133] Depending on the implementation, note that the computer system can reside in any of a variety of devices, including but not limited to: power supplies, switched-capacitor converters, power converters, mobile computers, personal computer systems, wireless devices, wireless access points, base stations, telephone devices, desktop computers, laptop computers, notebook computers, netbook computers, mainframe computers, handheld computers, workstations, network computers, application servers, storage devices, consumer electronics devices (e.g., cameras, camcorders, set-top boxes, mobile devices, video game consoles, handheld video game devices), peripheral devices (e.g., switches, modems, routers, set-top boxes, content management devices, handheld remote controls), any type of computing or electronic device, etc. The computer system 1300 can reside anywhere or can be included in any suitable resource in any network environment to achieve the functions discussed herein.

[0134] pass Figure 14 The flowcharts below are used to discuss the functionality supported by one or more resources described in this article. Note that the steps in the flowcharts below can be performed in any suitable order.

[0135] Figure 14 This is a flowchart 1400 illustrating an example method according to an embodiment of this document. Note that there will be some repetition of the concepts discussed above.

[0136] In processing operation 1410, the manufacturer 140 manufactures the inductor device 120 to include a first conductive path 131 and a second conductive path 132.

[0137] In processing operation 1420, the fabricator 140 uses a first material 141 to space or isolate the first conductive path 131 from the second conductive path 132.

[0138] In processing operation 1430, the fabricator 140 fabricates the second material 142 into an assembly that includes the first conductive path 131, the second conductive path 132, and the first material 141.

[0139] Figure 15 This is an example diagram illustrating the manufacture of a circuit board according to an embodiment of this document.

[0140] In this example embodiment, the fabricator 1540: accommodates a substrate 1510 (e.g., a circuit board); and attaches a power system 100 (e.g., a power supply and corresponding components) to the substrate 1510.

[0141] The fabricator 1540 also attaches the power converter 195 to the substrate 1510. The fabricator 1540 couples the power system 100 to the power converter 195 via a circuit path 1521 (e.g., one or more traces, etc.). The fabricator 1540 couples the power converter 195 to the load 1518 via a circuit path 1522 (e.g., one or more traces, etc.). In one embodiment, the circuit path 1521 transmits the output voltage 123 generated from the power source 100 to the power converter 195. The power converter 195 converts the received output voltage 123 into a target voltage to drive the load 1518 via components (e.g., inductor device 120 and / or component 610 or 620 or 630).

[0142] Therefore, embodiments of this document include a system comprising: a substrate 1510 (e.g., a circuit board, a stand-alone board, a motherboard, a stand-alone board intended to be coupled to a motherboard, etc.); a power system 100 including a power converter 150 as described herein; and a load 1518 powered based on energy or power supplied by an output voltage transmitted via circuit path 1522. For example, a power converter 195 converts an input voltage from the power system 100 into a suitable secondary output voltage to power the load 1518. The load 1518 can be any suitable circuitry or hardware that may be located on the substrate 1510, such as one or more CPUs (Central Processing Units), GPUs (Graphics Processing Units), and ASICs (Application-Specific Integrated Circuits, such as ASICs including one or more artificial intelligence accelerators).

[0143] It should be noted again that the techniques described herein are well-suited for the manufacture of inductor devices. However, it should be understood that the embodiments described herein are not limited to such applications, and the techniques discussed herein are also well-suited for other applications.

[0144] Although the invention has been specifically shown and described with reference to preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as defined by the appended claims. Such changes are intended to be covered by the scope of this application. Thus, the foregoing description of embodiments of this application is not intended to be limiting. Rather, any limitations on the invention are presented in the appended claims.

Claims

1. An inductor device, comprising: First conductive path (131); Second conductive path (132); A first material (141) is used to separate the first conductive path (131) from the second conductive path (132), and the first material (141) electrically insulates the second conductive path (132) in the inductor device (120) from the first conductive path (131). The second material (142) is a magnetically conductive material, and the components including the first conductive path (131), the second conductive path (132), and the first material (141) are arranged in the core of the second material (142). Wherein, the first material (141) has a first relative permeability, and the second material (142) has a second relative permeability greater than the first relative permeability; as well as A third material (143) surrounds an assembly comprising the first conductive path (131), the second conductive path (132), the first material (141), and the second material (142), the third material (143) having a third relative permeability.

2. The inductor device according to claim 1, wherein, The first conductive path (131) is a first tubular structure extending along the axial length of the inductor device (120) from a first end (151) of the inductor device (120) to a second end (152) of the inductor device (120); as well as The second conductive path (132) is a second tubular structure that extends from the first end (151) to the second end (152) along the axial length of the inductor device (120).

3. The inductor device according to claim 2, wherein, The first tubular structure is located within the second tubular structure.

4. The inductor device according to claim 3, wherein, The first material (141) provides a concentric spacing between the second tubular structure and the first tubular structure; and The second material (142) is arranged as a material layer outside the second tubular structure.

5. The inductor device according to any one of claims 1 to 4, wherein, The second material (142) has a relative permeability greater than 1.

6. The inductor device according to any one of claims 1 to 4, wherein, The current through the first conductive path (131) generates magnetic flux; and Wherein, the first density of magnetic flux in the first material (141) is less than the second density of magnetic flux in the second material (142).

7. The inductor device according to claim 1, wherein, The first conductive path (131) is a first portion of a separable tubular structure extending along the axial length of the inductor device (120); and The second conductive path (132) is the second part of the divisible tubular structure that extends along the axial length of the inductor device (120).

8. The inductor device according to claim 7, wherein, The first material (141) is located in the space between the cavity of the first part of the divisible tubular structure and the cavity of the second part of the divisible tubular structure; as well as The current through the first conductive path (131) generates magnetic flux, and the density of magnetic flux in the first material (141) is less than the density of magnetic flux in the second material (142).

9. The inductor device according to claim 7, wherein, The separable tubular structure is a first tubular structure, and the inductor device further includes: The third conductive path (131-10) is a second tubular structure extending along the axial length of the inductor device (120).

10. The inductor device according to claim 9, wherein, The third conductive path (131-10) is located between the first conductive path (131) and the second conductive path (132).

11. The inductor device according to claim 1, wherein, The third relative permeability is greater than the second relative permeability.

12. The inductor device according to claim 1 or 11, wherein, The second material (142) extends a first distance along the axial length of the inductor device (120); and The third material (143) extends a second distance along the axial length of the inductor device (120), the second distance being less than the first distance.

13. The inductor device according to claim 12, further comprising: A third conductive path (131-10) surrounds the second material (142).

14. A circuit system comprising: Circuit board (1510); The inductor device (120) according to any one of claims 1 to 13 is arranged in a circuit fixed to the circuit board (1510).

15. An inductor assembly, comprising: A first inductor device manufactured according to any one of claims 1 to 13; and A second inductor device manufactured according to any one of claims 1 to 13, The first inductor device and the second inductor device are connected in series.

16. An inductor assembly, comprising: A first inductor component manufactured according to any one of claims 1 to 13; and A second inductor component manufactured according to any one of claims 1 to 13, The first inductor component and the second inductor component are connected in parallel.

17. A method of manufacturing an inductor device, comprising: The inductor device (120) is manufactured to include a first conductive path (131) and a second conductive path (132). The first conductive path (131) and the second conductive path (132) of the inductor device (120) are separated by a first material (141), the separation insulating the first conductive path (131) from the second conductive path (132); The assembly comprising the first conductive path (131), the second conductive path (132), and the first material (141) is surrounded by a layer of a second material (142), wherein the second material (142) is magnetically conductive. Wherein, the first material (141) has a first relative permeability, and the second material (142) has a second relative permeability greater than the first relative permeability; as well as A layer of a third material (143) is arranged on top of the second material (142), the third material (143) having a third relative permeability.

18. The method of claim 17, further comprising: The first conductive path (131) is manufactured as a first tubular structure extending along the axial length of the inductor device (120) from a first end (151) of the inductor device (120) to a second end (152) of the inductor device (120); and The second conductive path (132) is manufactured as a second tubular structure extending from the first end (151) to the second end (152) along the axial length of the inductor device (120).

19. The method of claim 18, further comprising: The first tubular structure is arranged inside the second tubular structure, and the first material (141) spacees the second tubular structure concentrically from the first tubular structure.

20. The method of claim 19, further comprising: The second material (142) is arranged on the outside of the second tubular structure.

21. The method according to any one of claims 17 to 20, wherein, The second material (142) has a relative permeability greater than 1.

22. The method according to claim 17, wherein, The first conductive path (131) is a first portion of a separable tubular structure extending along the axial length of the inductor device (120); and The second conductive path (132) is the second part of the divisible tubular structure that extends along the axial length of the inductor device (120).

23. The method according to claim 22, wherein, The first material (141) is located in the space between the cavity of the first part of the divisible tubular structure and the cavity of the second part of the divisible tubular structure.

24. The method according to claim 22 or 23, wherein, The divisible tubular structure is a first tubular structure, and the method further includes: The inductor device is manufactured to include a third conductive path (131-10), which is a second tubular structure extending along the axial length of the inductor device (120) from a first end (151) of the inductor device (120) to a second end (152) of the inductor device (120).

25. The method according to claim 17, wherein, The third relative permeability is greater than the second relative permeability.

26. The method of claim 17, further comprising: The second material (142) is arranged to extend a first distance along the axial length of the inductor device (120); as well as The third material (143) is arranged to extend a second distance along the axial length of the inductor device (120), the second distance being less than the first distance.

27. The method according to any one of claims 17 to 20, further comprising: The inductor device (120) is manufactured to include a third conductive path (131-10) that surrounds an assembly including a first conductive path (131), a second conductive path (132), a first material (141), and a second material (142).

28. The method according to any one of claims 17 to 20, further comprising: The geometry of the first material (141) is designed to control the parasitic inductance and capacitance between the first conductive path (131) and the second conductive path (132).

29. The method according to any one of claims 17 to 20, further comprising: The geometry of the second material (142) is designed to control the magnetization inductance of the inductor device (120).

30. A manufacturing method, comprising: To accommodate circuit components; The inductor device according to any one of claims 1 to 13 is manufactured into the circuit assembly.

31. A computer-readable storage hardware having instructions stored thereon, which, when executed by computer processor hardware, cause the computer processor hardware to perform the method according to any one of claims 17 to 29.

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