Resin curing device for nanoimprinting

By using a light shielding part and a collimating lens in the nanoimprinting device to block the light diffusion area, combined with the inclined design of the light irradiation part, the problem of uneven curing of resin is solved, and the uniformity of the degree of curing of resin and the reliability of mold release is achieved.

CN114578653BActive Publication Date: 2025-07-25GIGALANE CO LTD
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Patent Information

Application Number
CN202110900270.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-12-01
Filing Date
2021-08-06
Publication Date
2025-07-25
Estimated Expiration
2041-08-06

AI Technical Summary

Technical Problem

In the nanoimprinting process, the light irradiated by the light irradiation part overlaps the direct and diffused irradiation areas on the resin, resulting in uneven curing of the resin, affecting the separation of the substrate and the mold, and may lead to poor substrates.

Method used

A light-shielding part and a collimating lens are arranged in front of the light-irradiation part to shield the overlapping irradiation of the light-diffusion area, and combined with the inclined design of the light-irradiation part, to ensure the uniformity of the curing degree of the resin.

Benefits of technology

By shielding the overlapping irradiation of the light diffusion region, the resin curing degree remains constant, avoiding substrate defects and improving the success rate of the mold release process.

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Abstract

The present invention relates to a resin curing device for nanoimprinting, comprising: a light irradiation unit that irradiates light in such a manner as to cure a resin having a transferred pattern; and a light shielding unit that is disposed protruding from the light irradiation unit to shield light that is overlappedly irradiated onto the resin due to diffusion of the light irradiated onto the resin.
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Description

Technical Field

[0001] The present invention relates to a resin curing device for nanoimprinting. Background Art

[0002] Recently, in display processes and semiconductor processes, in order to form patterns (e.g., structured formed patterns and mask patterns for etching or evaporation) on the surface of a substrate (e.g., a display panel, a wafer, etc.), a nanoimprint process is being utilized.

[0003] The nanoimprint process, which forms fine patterns of nanometer to micrometer size on the surface of a substrate in an imprint form, pressurizes (molds) and separates (demolds) a substrate coated with resin on one side and a mold having a pattern formed on one side to transfer the pattern to the resin.

[0004] At this time, as a means of pressurizing the substrate and the mold, there can be a plate-to-plate type that pressurizes the substrate and the mold with plates, a roll-to-plate type that pressurizes the substrate and the mold with a roll and a plate, and a roll-to-roll type that pressurizes the substrate and the mold with rolls.

[0005] The resin on which the pattern is transferred by pressurizing the substrate and the mold is a photocurable resin that is cured by light irradiated from a light irradiation unit (e.g., a UV lamp, etc.).

[0006] The light irradiated by such a light irradiation unit to the resin can form an irradiation area where the light reaches the resin.

[0007] The irradiation area can be composed of a direct irradiation area where the light directly generated by the light emitting part of the light source of the light irradiation unit reaches the resin and a diffusion irradiation area where the light diffuses around the direct irradiation area and reaches the resin.

[0008] The area of the resin where the light irradiation is completed through the direct irradiation area of the light irradiation unit may irradiate light overlappingly through the diffusion irradiation area.

[0009] At this time, the degree of curing of the area of the resin irradiated with overlapping light will be different.

[0010] For example, the side of the resin where the light irradiation by the light irradiation unit starts is irradiated with more overlapping light through the diffusion irradiation area than the other side of the resin where the light irradiation ends, so the degree of curing may be higher.

[0011] The difference in the degree of curing caused by such overlapping of light irradiation affects the separation of the substrate and the mold, so there is a problem of substrate defects. Summary of the Invention

[0012] Technical Problem

[0013] An object of the present invention is to provide a resin curing device for nanoimprinting.

[0014] Technical Solution

[0015] The resin curing device for nanoimprinting according to an embodiment of the present invention includes: a light irradiation unit that irradiates light in such a manner as to cure a resin having a transferred pattern; and a light shielding unit that is disposed to protrude from the light irradiation unit to shield light that is overlapped and irradiated onto the resin due to diffusion of the light irradiated onto the resin.

[0016] The resin curing device for nanoimprinting according to an embodiment of the present invention includes: a light irradiation unit that irradiates light in such a manner as to cure a resin having a transferred pattern; and a collimating lens that is disposed in front of a light emitting portion of the output light of the light irradiation unit to shield light that is overlapped and irradiated onto the resin due to diffusion of the light irradiated onto the resin.

[0017] According to an embodiment, the irradiation direction of the light irradiation unit is inclined toward one side with the lower side direction as a reference.

[0018] According to an embodiment, the light irradiation unit includes an irradiation direction guiding unit that guides the irradiation direction to be inclined within 10 degrees to 80 degrees.

[0019] According to an embodiment, the light irradiation unit moves in one direction so as to irradiate from one end of the resin to the other end.

[0020] According to an embodiment, the resin moves in such a manner as to sequentially pass through the light irradiated by the light irradiation unit from one end to the other end.

[0021] Advantages of the Invention

[0022] First, the light shielding unit and the collimating lens shield the light that is overlapped and irradiated onto the resin in the diffusion irradiation region, so that the degree of curing of the resin is constant, thereby not affecting the demolding process, and thus having the effect of preventing defects on the substrate.

[0023] In addition, the irradiation direction guiding unit has the effect of guiding in such a manner that the slope of the light irradiation direction of the light irradiation unit can be changed within a limited value according to the purpose. Brief Description of the Drawings

[0024] Figures 1 to 4 It is a diagram of a resin curing device for nanoimprinting according to an embodiment of the present invention.

[0025] Figure 5 It is a diagram of a means for pressing a substrate and a mold according to an embodiment of the present invention.

[0026] Symbol Explanation

[0027] 1: Substrate, 2: Mold, 100: Light Irradiation Unit, 110: Light Emitting Unit, 120: Irradiation Direction Guide Unit, 130: Protrusion, 140: Guide Groove, 150: Fixing Unit, 200: Light Shielding Unit, 300: Collimating Lens. Detailed Embodiment

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art to which the present invention pertains can easily implement it.

[0029] The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0030] Recently, in display processes and semiconductor processes, in order to form patterns (e.g., structured formed patterns and mask patterns for etching or evaporation) on the surface of a substrate (e.g., a display panel and a wafer, etc.), a nano imprint process is being utilized.

[0031] The nano imprint process that forms nano- to micro-sized fine patterns on the surface of a substrate in an imprint form pressurizes (molds) and separates (demolds) a substrate coated with resin on one side and a mold having a pattern formed on one side to transfer the pattern to the resin.

[0032] At this time, as a means of pressurizing the substrate and the mold, there can be a plate-to-plate type that pressurizes the substrate and the mold with a plate and a plate, a roll-to-plate type that pressurizes the substrate and the mold with a roll and a plate, and a roll-to-roll type that pressurizes the substrate and the mold with a roll and a roll.

[0033] The resin on which the pattern is transferred by pressurizing the substrate and the mold is a photocurable resin that is cured by light, and is cured by light irradiated from a light irradiation unit (e.g., a UV lamp, etc.).

[0034] The light irradiated by such a light irradiation unit to the resin can form an irradiation area where the light reaches the resin.

[0035] The irradiation area can be composed of a direct irradiation area where the light generated by the light emitting unit, which is the light source of the light irradiation unit, directly reaches the resin and a diffusion irradiation area where the light diffuses around the direct irradiation area and reaches the resin.

[0036] The area where the resin is irradiated with light through the direct irradiation area of the light irradiation unit may irradiate light overlappingly through the diffusion irradiation area.

[0037] At this time, the degree of curing of the region of the resin irradiated with overlapping light will be different.

[0038] For example, one side of the resin where the light irradiation unit starts light irradiation is irradiated with more overlapping light through the diffusion irradiation region than the other side of the resin where the light irradiation ends, so the degree of curing may be higher.

[0039] The difference in the degree of curing caused by such overlapping of light irradiation affects the separation of the substrate and the mold, so there is a problem of substrate defects.

[0040] To solve such problems, as Figure 1 shown, the resin curing device for nanoimprinting according to an embodiment of the present invention may include a light irradiation unit 100 and a light shielding unit 200.

[0041] The light irradiation unit 100 can irradiate light generated by the light emitting unit 110 as a light source onto the resin transferred with a pattern.

[0042] The resin may be coated on one side of the substrate 1.

[0043] The mold 2 having a pattern formed on one side and the substrate 1 may be pressed together to transfer the pattern to the resin.

[0044] At this time, the resin may be a photocurable resin that can be cured by light.

[0045] In addition, the light irradiated by the light irradiation unit 100 onto the resin may be ultraviolet light.

[0046] That is, the resin can be cured by the light irradiated by the light irradiation unit 100.

[0047] The light shielding unit 200 may be disposed protruding from the light irradiation unit 100 to shield the light that is irradiated onto the resin overlappingly due to the diffusion of the light irradiated onto the resin.

[0048] At this time, as Figure 2 shown, a collimating lens 300 may be applied instead of the light shielding unit 200 to shield the light that is irradiated onto the resin overlappingly due to the diffusion of the light irradiated onto the resin.

[0049] Such a collimating lens 300 may be disposed in front of the light emitting unit 110 of the output light of the light irradiation unit 100.

[0050] The light shielding unit 200 may be configured such that the irradiation region of the light irradiation unit 100 is located between the light shielding unit 200 and the substrate 1.

[0051] The light-shielding portion 200 may have a width larger than that of the light-emitting portion 110 of the light-irradiating portion 100 and have a protruding length within a range that does not interfere with the movement of the light-irradiating portion 100 or the substrate 1. For example, as Figure 3 shown, the light-shielding portion 200 may be formed in a plate shape and disposed on the light-irradiating portion 100.

[0052] In this way, the light-shielding portion 200 and the collimating lens 300 shield the diffusely irradiated area from overlappingly irradiating light, so that the degree of curing of the resin is constant, thus having no influence on the demolding process, and having the effect of preventing defects on the substrate 1.

[0053] As Figure 4 shown, as a specific description of the embodiment, the irradiation direction of the light-irradiating portion 100 may be inclined toward one side with the lower side direction as a reference to form an inclination angle AG.

[0054] The inclination angle AG of the light-irradiating portion 100 may be formed as a slope for immediately irradiating light on the substrate 1 pressed against the mold 2. That is, the resin formed with a pattern can be immediately cured.

[0055] The inclination angle AG of the light-irradiating portion 100 may be formed as a slope of 10 degrees to 80 degrees with the downward direction defined as 0 degrees and the direction toward one side defined as 90 degrees as references.

[0056] As Figure 3 and Figure 4 shown, as a specific description of the embodiment, the light-irradiating portion 100 may include an irradiation direction guiding portion 120.

[0057] The irradiation direction guiding portion 120 may guide the irradiation direction to be inclined within 10 degrees to 80 degrees with the lower side direction as 0 degrees and the one side direction as 90 degrees as references.

[0058] As an embodiment, as Figure 3 shown, the irradiation direction guiding portion 120 may be a structure of a fixing portion 150 fixed in a guiding groove 140 in a manner that the slope of the irradiation direction is not changed. The guiding groove 140 is formed in a curved shape having a length in a manner of guiding the movement of a protruding portion 130 protruding from the light-irradiating portion 100 that can rotate to guide the slope of the light irradiation direction.

[0059] As another embodiment, although not shown, the irradiation direction guiding portion 120 may be a structure that changes the slope of the light irradiation direction through an actuator.

[0060] In this way, the irradiation direction guiding portion 120 has the effect of guiding the slope of the light irradiation direction of the light-irradiating portion 100 to be changeable within a limited value according to the purpose.

[0061] The light irradiation unit 100 can be moved or fixed according to the means of the pressure-applied substrate 1 and the mold 2.

[0062] For example, as Figure 5 (a) shown, in the case of a roll-to-plate type in which the substrate 1 and the mold 2 are pressed by a roll and a plate, the light irradiation unit 100 can move in one direction in such a manner as to irradiate the resin from one end to the other end.

[0063] In addition, as Figure 5 (b) shown, in the case of a roll-to-roll type in which the substrate 1 and the mold 2 are pressed by a roll and a roll, the resin can move in such a manner as to sequentially pass through the light irradiated by the light irradiation unit 100 from one end to the other end.

[0064] Although the present invention has been described in detail above by way of preferred embodiments, the present invention is not limited thereto and can be variously implemented within the scope of the claims.

Claims

1. A resin curing device for nanoimprinting, characterized in that, Comprising: A light irradiation unit that irradiates light in such a manner as to cure a resin with a transferred pattern; A light shielding unit that is disposed protruding from the light irradiation unit to shield light that overlaps and irradiates the resin due to light diffusion of the light irradiated onto the resin; And An irradiation direction guiding unit that changes the slope of the light irradiation direction of the light irradiation unit, The irradiation direction guiding unit includes: A protruding portion that protrudes from the light irradiation unit; A guide groove that is formed in a curved shape so as to guide the movement of the protruding portion; and A fixing portion that is coupled to the protruding portion to fix the protruding portion, The irradiation direction guiding unit guides the light irradiation unit in such a manner that the irradiation direction is inclined within 10 degrees to 80 degrees.

2. A resin curing device for nanoimprinting, characterized in that, Comprising: A light irradiation unit that irradiates light in such a manner as to cure a resin with a transferred pattern; A collimating lens that is disposed in front of the light emitting portion of the output light of the light irradiation unit to shield light that overlaps and irradiates the resin due to light diffusion of the light irradiated onto the resin; And An irradiation direction guiding unit that changes the slope of the light irradiation direction of the light irradiation unit, The irradiation direction guiding unit includes: A protruding portion that protrudes from the light irradiation unit; A guide groove that is formed in a curved shape so as to guide the movement of the protruding portion; and A fixing portion that is coupled to the protruding portion to fix the protruding portion, The irradiation direction guiding unit guides the light irradiation unit in such a manner that the irradiation direction is inclined within 10 degrees to 80 degrees.

3. The resin curing device for nanoimprinting according to claim 1 or 2, characterized in that The light irradiation unit moves in one direction in such a manner as to irradiate from one end of the resin to the other end.

4. The resin curing device for nanoimprinting according to claim 1 or 2, characterized in that The resin moves in such a manner as to sequentially pass through the light irradiated by the light irradiation unit from one end to the other end.

Citation Information

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