Electronic device and method for manufacturing a support plate

Abstract

The disclosure relates to an electronic device including a foldable area configured to fold with respect to a folding axis extending in a first direction, and a non-foldable area spaced apart from each other with the foldable area located therebetween, a display module, and a support plate disposed under the display module and in which an opening pattern corresponding to the foldable area is formed. The support plate includes a top surface adjacent to the display module and a bottom surface facing the top surface, and the opening pattern includes an opening passing through the support plate from the top surface to the bottom surface and a plurality of support portions around the opening. In addition, in a cross section, the support portion includes at least one first support portion including a first curved edge located at one side of the top surface and a second curved edge located at one side of the bottom surface, the second curved edge facing the first curved edge in a diagonal direction.

Description

[0001] Cross-references to related applications

[0002] This patent application claims priority to Korean Patent Application No. 10-2020-0164311, filed on November 30, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to methods for manufacturing a support plate and electronic devices including the support plate, and more specifically, to flexible electronic devices and methods for manufacturing a support plate provided in a flexible electronic device. Background Technology

[0004] Various types of electronic devices can provide image information. With technological advancements, display devices, including foldable and bendable flexible display panels, have been developed. Unlike rigid display devices, flexible display devices can be folded, rolled, or bent into various shapes, making them portable regardless of screen size.

[0005] Flexible display devices should have support members for supporting the display panel without hindering folding or bending operations, and require flexible support members whose mechanical properties will not deteriorate over time. Summary of the Invention

[0006] Embodiments of this disclosure provide a method for manufacturing a support plate having good mechanical strength and improved flatness.

[0007] Embodiments of this disclosure also provide an electronic device with improved external flatness and good bending characteristics.

[0008] An embodiment of the present invention provides an electronic device comprising: a foldable region configured to fold relative to a folding axis extending in a first direction; and non-foldable regions spaced apart from each other, with the foldable region located between the non-foldable regions; a display module; and a support plate disposed below the display module, wherein an opening pattern is formed in the support plate at a position corresponding to the foldable region. The support plate includes a top surface adjacent to the display module and a bottom surface facing the top surface. The opening pattern includes an opening extending through the support plate from the top surface to the bottom surface and a plurality of support portions surrounding the opening. In cross-section, each of the plurality of support portions includes at least one first support portion, the at least one first support portion including a first curved edge located on one side of the top surface and a second curved edge located on one side of the bottom surface, the second curved edge facing the first curved edge in a diagonal direction.

[0009] In one embodiment, the at least one first support portion includes a first flat top surface adjacent to the first curved edge and a first flat bottom surface adjacent to the second curved edge, and each of the first flat top surface and the first flat bottom surface is inclined relative to a virtual extension surface, the virtual extension surface being parallel to the surface of the support plate corresponding to the non-foldable region.

[0010] In an embodiment, the first angle between the first flat top surface and the virtual extended surface and the second angle between the first flat bottom surface and the virtual extended surface are each greater than 0 degrees and less than approximately 15 degrees.

[0011] In one embodiment, the first support portion includes a first sub-support portion and a second sub-support portion adjacent to each other, and the opening is located between the first sub-support portion and the second sub-support portion. The first flat top surface of the first sub-support portion is inclined in a counterclockwise direction relative to the virtual extension surface, and the first flat top surface of the second sub-support portion is inclined in a clockwise direction relative to the virtual extension surface.

[0012] In one embodiment, the first flat top surface of the first sub-support portion and the first flat top surface of the second sub-support portion are symmetrical about each other with respect to the center of the opening between the first sub-support portion and the second sub-support portion.

[0013] In one embodiment, in the cross-section, the support plate further includes a second support portion, the second support portion including a third curved edge located on one side of the top surface and a fourth curved edge located on the other side of the top surface and spaced apart from the third curved edge.

[0014] In one embodiment, the second support portion includes a second flat top surface disposed between the third and fourth curved edges. The second flat top surface is inclined relative to the virtual extension surface, which is parallel to the surface of the support plate corresponding to the non-foldable region.

[0015] In one embodiment, on a plane, the width of the opening in the first direction is greater than the width of the opening in a second direction perpendicular to the first direction.

[0016] In one embodiment, the support plate has a flatness of approximately 0.15 mm or less, and the flatness may correspond to the difference between the maximum and minimum heights of the top surface of the support plate relative to a virtual reference surface parallel to the bottom surface of the display module.

[0017] In one embodiment, the support plate includes: a foldable portion configured to fold relative to the folding axis, and a first non-foldable portion and a second non-foldable portion spaced apart from each other, the foldable portion being located between the first non-foldable portion and the second non-foldable portion. The angle between the extended surface of the first non-foldable portion and the extended surface of the second non-foldable portion is in the range of approximately 120 degrees to approximately 180 degrees.

[0018] An embodiment of the present invention provides a method for manufacturing a support plate, the method comprising: providing a component to be processed, wherein the component to be processed includes a top surface and a bottom surface facing each other, and dividing the component to be processed into a foldable portion and a non-foldable portion; in a first pressing process, forming a first opening pattern on the foldable portion from the direction of the top surface of the component to be processed using a first pressing member; and in a second pressing process, forming a second opening pattern on the foldable portion from the direction of the bottom surface of the component to be processed using a second pressing member.

[0019] In one embodiment, the first opening pattern includes an opening extending from the top surface to the bottom surface through the member to be processed and a plurality of preliminary support portions spaced apart from each other, the opening being located between the plurality of preliminary support portions, and each of the preliminary support portions including a curved edge on the top surface adjacent to the opening.

[0020] In one embodiment, the second pressing process includes patterning at least one of the initial support portions using the second pressing member.

[0021] In an embodiment, the second pressing process forms the opening in at least one of the preliminary support portions, and the second pressing process includes forming a first support portion adjacent to the opening, wherein the first support portion includes a first curved edge located on one side of the top surface and a second curved edge located on one side of the bottom surface, the second curved edge facing the first curved edge in a diagonal direction.

[0022] In an embodiment, the method further includes a reversal process that reverses the orientation of the top surface and the bottom surface of the component to be processed between the first pressing process and the second pressing process.

[0023] In one embodiment, the first pressing process forms a plurality of non-overlapping openings parallel to a first direction in the foldable portion, and in a plane, the first width of each of the openings in the first direction may be greater than the second width of each of the openings in a second direction perpendicular to the first direction.

[0024] In an embodiment, the first pressing process may form a plurality of first openings spaced apart from each other in the second direction in each of a plurality of first pattern regions spaced apart from each other along the first direction.

[0025] In an embodiment, the first pressing process further includes at least one of the following: a process of forming a plurality of second openings spaced apart by a second interval in the first pattern region or in a second pattern region disposed between the first pattern regions; or a process of forming a plurality of third openings spaced apart by a third interval, wherein each of the plurality of third openings passes through a portion of the first pattern region and a portion of the second pattern region that are adjacent to each other.

[0026] In an embodiment, the second pressing process includes forming a plurality of fourth openings spaced a fourth interval from each other, wherein each of the plurality of fourth openings passes through a portion of the first patterned region and a portion of the second patterned region that are adjacent to each other.

[0027] In an embodiment, the second pressing process includes forming a plurality of fifth openings spaced a fifth interval apart from each other in the first pattern region or in a second pattern region located between the first pattern regions. Attached Figure Description

[0028] Figure 1A This is a perspective view of an electronic device unfolded according to an embodiment.

[0029] Figure 1B According to the embodiments Figure 1A A perspective view of the folding process inside an electronic device.

[0030] Figure 1C It is an inwardly folded type according to the embodiment. Figure 1A A floor plan of the electronic device.

[0031] Figure 1D This is a perspective view of the process of folding the electronic device according to an embodiment outward.

[0032] Figure 2A This is a perspective view of an electronic device unfolded according to an embodiment.

[0033] Figure 2B According to the embodiments Figure 2A A perspective view of the folding process inside an electronic device.

[0034] Figure 3 This is an exploded perspective view of an electronic device according to an embodiment.

[0035] Figure 4 This is a cross-sectional view of an electronic device according to an embodiment.

[0036] Figure 5 This is a perspective view of the support plate according to an embodiment.

[0037] Figure 6 This is a plan view of a portion of the support plate according to an embodiment.

[0038] Figure 7 This is a flowchart illustrating a method for manufacturing a support plate according to an embodiment.

[0039] Figure 8 This is a flowchart of a method for manufacturing a support plate according to an embodiment.

[0040] Figure 9 This is a schematic diagram illustrating a method for manufacturing a support plate according to an embodiment.

[0041] Figure 10 The process of providing a component to be processed according to an embodiment is illustrated.

[0042] Figure 11A A first pressing process for forming a first opening pattern according to an embodiment is shown.

[0043] Figure 11B This is a cross-sectional view of the component to be processed after the first pressing process according to the embodiment, and Figure 11B It is along Figure 11A The cross-sectional view taken from line III-III'.

[0044] Figure 12A A second pressing process for forming a second opening pattern according to an embodiment is shown.

[0045] Figure 12B This is a cross-sectional view of the component to be processed after the second pressing process according to the embodiment, and Figure 12B It is along Figure 12A The cross-sectional view taken from line IV-IV'.

[0046] Figure 13A and Figure 13B The machining shape of the component is shown according to the insertion direction and insertion sequence of the pressed parts.

[0047] Figure 13C The machining shape of the component is shown according to the insertion direction and insertion sequence of the pressed parts.

[0048] Figure 14A A portion of the process for manufacturing a support plate according to an embodiment is shown.

[0049] Figure 14B A portion of the process for manufacturing a support plate according to an embodiment is shown.

[0050] Figure 15 A portion of a method for manufacturing a support plate according to an embodiment is shown.

[0051] Figure 16 A method for manufacturing a support plate according to an embodiment is shown.

[0052] Figure 17A A portion of a method for manufacturing a support plate according to an embodiment is shown.

[0053] Figure 17B A portion of a method for manufacturing a support plate according to an embodiment is shown.

[0054] Figure 18 This is a perspective view of a part of a method for manufacturing a support plate according to an embodiment.

[0055] Figure 19A and Figure 19B This is a cross-sectional view of the support plate according to an embodiment.

[0056] Figure 20A This is a cross-sectional view of the support plate according to an embodiment, and Figure 20B yes Figure 20A A magnified cross-sectional view of a portion of the image.

[0057] Figure 21AIt is a graph showing the results obtained by evaluating the flatness of the support plate according to the comparison example and the example.

[0058] Figure 21B It is a graph showing the results obtained by evaluating the flatness of the support plate according to the comparison example and the example.

[0059] Figure 21C This is a schematic diagram illustrating a method for evaluating the flatness of a support plate according to an example.

[0060] Figure 22 It is a graph showing the change in the bending angle of the support plate according to the number of times the second pressing process is performed, based on the comparative example and the example. Detailed Implementation

[0061] Because this disclosure can have different modified embodiments, specific embodiments are shown in the accompanying drawings and described in the detailed description of the inventive concept. However, this does not limit the inventive concept to the specific embodiments, and it should be understood that the inventive concept encompasses all modifications, equivalents, and substitutions within the spirit and scope of the inventive concept.

[0062] In this specification, it will also be understood that when a component (or region, layer, portion) is referred to as being "on" another component, "connected to" or "coupled to" another component, the component may be directly disposed on / directly connected to / directly coupled to the other component, or there may be an intervening third component.

[0063] The same reference numerals may always refer to the same elements. The directions indicated by the direction axes shown in the drawings and those described in this specification are relative concepts and may therefore be different directions.

[0064] Here, when a value is described as approximately equal to another value, such as “the width can range from approximately 0.1 mm to approximately 1 mm”, it will be understood that these values ​​are equal to each other within the measurement error, or if they are not measurably equal, then, as a person skilled in the art will understand, these values ​​are close enough in value to be functionally equal to each other.

[0065] In the following description, an electronic device according to an embodiment of the present invention and a method for manufacturing a support plate according to an embodiment will be described with reference to the accompanying drawings.

[0066] Figure 1A This is a perspective view of an electronic device unfolded according to an embodiment. Figure 1B According to the embodiments Figure 1A A perspective view of the folding process inside an electronic device. Figure 1C It is an inwardly folded type according to the embodiment. Figure 1A A floor plan of the electronic device. Figure 1D This is a perspective view of the process of folding the electronic device according to an embodiment outward.

[0067] The electronic device ED according to the embodiment is activated by an electrical signal. For example, the electronic device ED may be a mobile phone, tablet PC, car navigation system, game console, or wearable device, but the embodiments of the present invention are not limited thereto. Figure 1A In the embodiment of the inventive concept shown, the electronic device ED is a mobile phone.

[0068] Reference Figure 1A and Figure 1B An electronic device ED according to an embodiment includes a first display surface FS extending along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED displays an image IM to a user via the first display surface FS. The electronic device ED according to an embodiment displays the image IM on a third direction DR3, which is perpendicular to the plane defined by the first direction DR1 and the second direction DR2. In this specification, a front surface (or top surface) and a rear surface (or bottom surface) of the components of the electronic device ED are defined based on the orientation of the displayed image IM. The front and rear surfaces may be opposite each other on the third direction DR3. The normal direction of each of the front and rear surfaces is parallel to the third direction DR3.

[0069] An electronic device ED according to an embodiment may include a first display surface FS and a second display surface RS. The first display surface FS includes a first active region F-AA and a first peripheral region F-NAA. An electronic module region EMA is included in the first active region F-AA. The second display surface RS is a surface opposite to at least a portion of the first display surface FS. That is, the second display surface RS is a portion of the rear surface of the electronic device ED.

[0070] According to an embodiment, the electronic device ED can sense externally applied inputs (i.e., external inputs). External inputs include various types of external inputs. For example, the electronic device ED can sense contact from adjacent objects less than a predetermined distance away from the electronic device ED and from a part of the human body (such as a user's hand). In addition, external inputs include force, pressure, temperature, light, etc.

[0071] According to an embodiment, as described above, the first display surface FS of the electronic device ED may include a first active region F-AA and a first peripheral region F-NAA. The first active region F-AA is activated by an electrical signal. The electronic device ED displays an image IM through the first active region F-AA. Additionally, various types of external input can be sensed on the first active region F-AA. The first peripheral region F-NAA is adjacent to the first active region F-AA. The first peripheral region F-NAA may have a predetermined color. The first peripheral region F-NAA surrounds the first active region F-AA. Therefore, the shape of the first active region F-AA is substantially defined by the first peripheral region F-NAA. However, the embodiment is not limited to this, and in other embodiments, the first peripheral region F-NAA may be configured to be adjacent only to one side of the first active region F-AA, or it may be omitted. The first active region F-AA of the electronic device ED may have one of various shapes, but is not limited to a particular embodiment.

[0072] According to an embodiment, the electronic device ED includes a foldable region FA1 and non-foldable regions NFA1 and NFA2. The electronic device ED also includes a plurality of non-foldable regions NFA1 and NFA2. The electronic device ED includes a first non-foldable region NFA1 and a second non-foldable region NFA2, with the foldable region FA1 disposed between the first non-foldable region NFA1 and the second non-foldable region NFA2. Figures 1A to 1D An example of an electronic device ED including a foldable region FA1 is shown, but the embodiments are not limited thereto. For example, the electronic device ED may have multiple foldable regions.

[0073] Reference Figure 1B According to an embodiment, the electronic device ED can be folded about a first folding axis FX1. The first folding axis FX1 is a virtual axis extending in a first direction DR1, and the first folding axis FX1 is parallel to the long side of the electronic device ED. The first folding axis FX1 extends along the first direction DR1 on the first display surface FS.

[0074] In this embodiment, non-foldable regions NFA1 and NFA2 are positioned adjacent to foldable region FA1, with foldable region FA1 located between non-foldable regions NFA1 and NFA2. For example, the first non-foldable region NFA1 is positioned on one side of foldable region FA1 in the second direction DR2, and the second non-foldable region NFA2 is positioned on the other side of foldable region FA1 in the second direction DR2.

[0075] In an embodiment, the electronic device ED can be folded relative to the first folding axis FX1 and thus deformed into an inward folded state, in which a region of the first display surface FS that overlaps with the first non-foldable region NFA1 faces another region of the first display surface FS that overlaps with the second non-foldable region NFA2.

[0076] Reference Figure 1C In this embodiment, in its inward-folded state, the second display surface RS is visually recognizable by the user. The second display surface RS includes a second active region R-AA for displaying images and a second peripheral region R-NAA adjacent to the second active region R-AA. The second active region R-AA is activated by an electrical signal. The second active region R-AA can display images and sense various types of external input. The second peripheral region R-NAA can have a predetermined color. The second peripheral region R-NAA surrounds the second active region R-AA. Additionally, although not shown, the second display surface RS may also include an electronic module region on which electronic modules comprising various types of components are disposed, but the embodiment is not limited thereto.

[0077] Reference Figure 1D In this embodiment, the electronic device ED can be folded outward relative to the first folding axis FX1. In the outward folded state, a region of the second display surface RS that overlaps with the first non-foldable region NFA1 faces another region of the second display surface RS that overlaps with the second non-foldable region NFA2. The second display surface RS is a surface that faces at least a portion of the first display surface FS. That is, the second display surface RS is part of the rear surface of the electronic device ED.

[0078] However, the embodiments are not limited thereto. For example, the electronic device ED can be folded relative to multiple folding axes, such that a portion of the first display surface FS and a portion of the second display surface RS face each other. Here, the number of folding axes and the number of non-foldable areas are not specifically limited.

[0079] In this embodiment, various electronic modules may be disposed in the electronic module region EMA. For example, the electronic module may include at least one of a camera, a speaker, an optical sensing sensor, and a thermal sensing sensor. The electronic module region EMA may sense external objects through a first display surface FS or a second display surface RS, or output sound signals such as speech through the first display surface FS or the second display surface RS. The electronic module may include multiple components, but the embodiment is not limited thereto.

[0080] In one embodiment, the electronic module region EMA is surrounded by a first active region F-AA and a first peripheral region F-NAA. However, the embodiments of the present invention are not limited thereto. For example, in other embodiments, the electronic module region EMA may be disposed within the first peripheral region F-NAA, or between the first active region F-AA and the first peripheral region F-NAA.

[0081] Figure 2A This is a perspective view of an electronic device unfolded according to an embodiment. Figure 2B This illustrates the implementation of the embodiments. Figure 2A A perspective view of the folding process inside an electronic device.

[0082] According to an embodiment, the electronic device ED-a can be folded relative to a second folding axis FX2 extending parallel to the first direction DR1. Figure 2B The illustration shows the case where the extension direction of the second folding axis FX2 is parallel to the short side of the electronic device ED-a. However, embodiments of the present invention are not limited to this.

[0083] The electronic device ED-a according to an embodiment includes at least one foldable region FA2 and a plurality of non-foldable regions NFA3 and NFA4 extending from the foldable region FA2. The non-foldable regions NFA3 and NFA4 are spaced apart from each other in a second direction DR2 intersecting a first direction DR1, and the foldable region FA2 is positioned between the non-foldable regions NFA3 and NFA4.

[0084] In one embodiment, when folded, the foldable region FA2 has a predetermined curvature and a predetermined radius of curvature. In another embodiment, when the electronic device ED-a is folded inward, the first non-foldable region NFA3 and the second non-foldable region NFA4 face each other, such that the first display surface FS is not exposed to the outside.

[0085] Additionally, in one embodiment, the electronic device ED-a can be folded outwards, exposing the first display surface FS to the outside. In another embodiment, in the electronic device ED-a, the first display surface FS is visible to the user in its unfolded state, and the second display surface RS is visible to the user in its folded-in state. The second display surface RS includes an electronic module region EMA, in which electronic modules comprising various types of components can be disposed.

[0086] The electronic device ED-a according to an embodiment includes a second display surface RS, and the second display surface RS is opposite at least a portion of a first display surface FS. In an inwardly folded state, the second display surface RS is visible to the user. In this embodiment, an image is displayed via the second display surface RS.

[0087] In one embodiment, electronic devices ED and ED-a are configured such that an inward folding operation or an outward folding operation can be repeated relative to each other, but the embodiment is not limited thereto. In another embodiment, electronic devices ED and ED-a may be configured to perform one of the folding operations, such as an inward folding operation or an outward folding operation.

[0088] Figure 3 This is an exploded perspective view of an electronic device according to an embodiment, and Figure 4 This is a cross-sectional view of an electronic device according to an embodiment. Figure 3 According to the embodiments Figure 1A An exploded perspective view of the electronic device. Figure 4 Is with Figure 3 The cross-sectional view corresponding to line I-I'.

[0089] Reference Figure 3 and Figure 4 The electronic device ED according to an embodiment includes a display module DM and a support plate MP disposed below the display module DM. The electronic device ED according to an embodiment also includes a lower module SM and a protective layer PF.

[0090] The electronic device ED according to an embodiment further includes a window member WM disposed on a display module DM, and the window member WM covers the entire exterior of the display module DM. The window WM has a shape corresponding to the shape of the display module DM. In addition, the electronic device ED includes a housing HAU that houses the display module DM and a support plate MP. The housing HAU is coupled to the window member WM. In addition, the housing HAU also includes a hinge structure to facilitate folding or bending.

[0091] According to an embodiment, the window component WM includes a window WP and an adhesive layer AP. The window WP includes an optically transparent insulating material. The window WP can be a glass substrate or a polymer substrate. For example, the window WP is a tempered glass substrate.

[0092] According to an embodiment, the adhesive layer AP is disposed between the display module DM and the window WP. The adhesive layer AP can be an optically clear adhesive (OCA) film or an optically clear adhesive resin (OCR) layer. In an embodiment, the adhesive layer AP can be omitted.

[0093] According to an embodiment, the display module DM displays an image based on electrical signals and can send or receive information based on external input. The display module DM includes a display area DP-DA and a non-display area DP-NDA. The display area DP-DA displays the image received from the display module DM.

[0094] According to an embodiment, the non-display area DP-NDA is adjacent to the display area DP-DA. For example, the non-display area DP-NDA surrounds the display area DP-DA. However, this is merely an example, and the embodiment is not limited thereto. For example, in other embodiments, the non-display area DP-NDA may have various other shapes. According to an embodiment, the display area DP-DA of the display module DM is adjacent to the first active area F-AA (see...). Figure 1A At least a part of it corresponds to.

[0095] According to an embodiment, the display module DM includes a display panel DP and an input sensor IS disposed on the display panel DP. Additionally, the display module DM also includes an optical layer disposed on the input sensor IS. The optical layer can reduce the reflection of external light. For example, the optical layer may include a polarizing layer or a color filter layer.

[0096] According to an embodiment, the display panel DP includes a substrate layer, a circuit element layer disposed on the substrate layer, a display element layer disposed on the circuit element layer, and a thin film encapsulation layer disposed on the display element layer. The substrate layer includes a polymer material. For example, the substrate layer includes polyimide.

[0097] According to an embodiment, the circuit element layer includes an organic layer, an inorganic layer, a semiconductor pattern, a conductive pattern, and signal lines. The organic layer, inorganic layer, semiconductor layer, and conductive layer are formed on a substrate layer by methods such as coating or deposition. Subsequently, the organic layer, inorganic layer, semiconductor layer, and conductive layer are selectively patterned using multiple photolithography processes to form semiconductor patterns, conductive patterns, and signal lines.

[0098] According to an embodiment, the display element layer includes a light-emitting element. The light-emitting element is electrically connected to at least one transistor. A thin-film encapsulation layer is disposed on the display element layer to seal the display element layer. The thin-film encapsulation layer includes an inorganic layer, an organic layer, and an inorganic layer sequentially stacked. The stacking structure of the thin-film encapsulation layer is not specifically limited.

[0099] According to an embodiment, the input sensor IS includes a plurality of sensing electrodes capable of sensing external input. The input sensor IS may be a capacitive sensor, but the embodiments are not specifically limited to this. When manufacturing the display panel DP, the input sensor IS is formed directly on the thin-film encapsulation layer through a continuous process. However, embodiments of the inventive concept are not limited to this, and the input sensor IS can be provided as a panel independent of the display panel DP and can be attached to the display panel DP via an adhesive layer.

[0100] According to an embodiment, the display module DM includes a foldable display portion FA-D and non-foldable display portions NFA1-D and NFA2-D. The foldable display portion FA-D and the foldable region FA1 (see...) Figure 1ACorrespondingly, the non-foldable display portions NFA1-D and NFA2-D correspond to the non-foldable areas NFA1 and NFA2 (see...). Figure 1A Corresponding to.

[0101] According to an embodiment, the foldable display portion FA-D can be folded or bent relative to the first folding axis FX1. The display module DM includes a first non-foldable display portion NFA1-D and a second non-foldable display portion NFA2-D, and the first non-foldable display portion NFA1-D and the second non-foldable display portion NFA2-D are spaced apart from each other in a second direction DR2, with the foldable display portion FA-D located between the first non-foldable display portion NFA1-D and the second non-foldable display portion NFA2-D.

[0102] According to an embodiment, a support plate MP is disposed below the display module DM. In an embodiment, the support plate MP comprises metal or polymer. For example, the support plate MP is made of stainless steel, aluminum, and alloys thereof. Alternatively, the support plate MP is made of polymer.

[0103] According to an embodiment, a plurality of openings OP are formed in a support plate MP. The support plate MP includes an opening pattern OP-PT, and the opening pattern OP-PT includes a plurality of openings OP.

[0104] According to the embodiments, the thickness of the support plate MP varies taking into account the mechanical design characteristics and mechanical properties of the electronic device ED. For example, the thickness of the support plate MP is approximately 150 μm, but the embodiments are not limited to this.

[0105] Reference Figure 3 and Figure 4 According to an embodiment, a protective layer PF is disposed between the display module DM and the support plate MP. The protective layer PF is disposed below the display module DM to protect the rear surface of the display module DM. The protective layer PF overlaps the entire display module DM. The protective layer PF comprises a polymer. For example, the protective layer PF may be a polyimide film or a polyethylene terephthalate film. However, the embodiment is not limited to this, and in other embodiments, the material of the protective layer PF may be changed.

[0106] The electronic device ED according to an embodiment further includes a lower module SM. The lower module SM includes a support member SPM and a filling portion SAP. The support member SPM overlaps with a large portion of the display module DM. The filling portion SAP is disposed outside the support member SPM and overlaps with the outer periphery of the display module DM.

[0107] According to an embodiment, the lower module SM includes at least one of a support layer SP and a buffer layer CP. Additionally, the lower module SM also includes at least one of a shielding layer EMP and an interlayer bonding layer ILP.

[0108] For example, according to an embodiment, the support layer SP comprises a metal or a polymer. The support layer SP is disposed below the support plate MP. The support layer SP is a thin metal substrate. When the support layer SP is a thin metal substrate, the support layer SP may comprise stainless steel, aluminum, or alloys thereof. The support layer SP can dissipate heat or shield electromagnetic radiation.

[0109] exist Figure 4 In the embodiment shown, a buffer layer CP is disposed below the support layer SP. The buffer layer CP prevents the support plate MP from being squeezed and deformed due to external impacts and forces. The buffer layer CP improves the impact resistance of the electronic device ED. The buffer layer CP may comprise sponge, foam, or an elastomer such as polyurethane resin. Alternatively, the buffer layer CP may comprise at least one of acrylic polymers, urethane polymers, silicone polymers, and imide polymers. However, embodiments of the inventive concept are not limited thereto.

[0110] exist Figure 4 In the accompanying drawings, the buffer layer CP is disposed below the support layer SP, but the embodiments are not limited thereto. For example, in other embodiments, the buffer layer CP is disposed above the support layer SP.

[0111] In the electronic device ED according to the embodiments, the configuration of the lower module SM varies depending on the size and shape of the electronic device ED or the operating characteristics of the electronic device ED. For example, in one embodiment, the lower module SM includes multiple support layers SP and multiple buffer layers CP. Alternatively, in another embodiment, one of the support layers SP and the buffer layers CP is omitted from the lower module SM, such that the lower module SM includes only the support layers SP or only the buffer layers CP.

[0112] According to an embodiment, the support layer SP includes a first sub-support layer SP1 and a second sub-support layer SP2 spaced apart from each other in a second direction DR2. The first sub-support layer SP1 and the second sub-support layer SP2 are spaced apart from each other via portions corresponding to a first folding axis FX1. A gap is formed between the first sub-support layer SP1 and the second sub-support layer SP2 at the portions corresponding to the first folding axis FX1. The support layers SP are spaced apart from each other in the foldable region FA1, and are thus provided as the first sub-support layer SP1 and the second sub-support layer SP2 to improve the folding or bending characteristics of the electronic device ED.

[0113] Additionally, according to an embodiment, the buffer layer CP includes a first sub-buffer layer CP1 and a second sub-buffer layer CP2 spaced apart from each other in the second direction DR2. The first sub-buffer layer CP1 and the second sub-buffer layer CP2 are spaced apart from each other at portions corresponding to the first folding axis FX1. A gap is formed between the first sub-buffer layer CP1 and the second sub-buffer layer CP2 at portions corresponding to the first folding axis FX1. The gap between the first sub-buffer layer CP1 and the second sub-buffer layer CP2 corresponds to the gap between the first sub-support layer SP1 and the second sub-support layer SP2. The buffer layers CP are spaced apart from each other in the foldable region FA1, and are thus provided as the first sub-buffer layer CP1 and the second sub-buffer layer CP2 to improve the folding or bending characteristics of the electronic device ED. The positions of the first sub-buffer layer CP1 and the second sub-buffer layer CP2 correspond to the positions of the first sub-support layer SP1 and the second sub-support layer SP2, respectively.

[0114] According to an embodiment, the lower module SM further includes a shielding layer EMP. The shielding layer EMP is an electromagnetic shielding layer or a heat dissipation layer. Additionally, the shielding layer EMP can function as a bonding layer. The lower module SM and the housing HAU are coupled to each other through the shielding layer EMP. Figure 4 The accompanying drawings show a shielding layer EMP disposed below the buffer layer CP, but the embodiments are not limited thereto.

[0115] According to an embodiment, the lower module SM further includes an interlayer bonding layer ILP disposed below the support plate MP. The interlayer bonding layer ILP bonds the support plate MP to the lower module SM. The interlayer bonding layer ILP has the form of a bonding resin layer or adhesive tape. The interlayer bonding layer ILP overlaps with the entire foldable display portion FA-D. However, the embodiment is not limited thereto, and in other embodiments, the portion overlapping with the foldable display portion FA-D is removed.

[0116] According to an embodiment, the filling portion SAP is disposed outside the support layer SP and the buffer layer CP. The filling portion SAP is disposed between the support plate MP and the housing HAU. The filling portion SAP fills the space between the support plate MP and the housing HAU and fixes the support plate MP.

[0117] Additionally, the electronic device ED according to the embodiment further includes at least one of adhesive layers AP1 and AP2. For example, the first adhesive layer AP1 is disposed between the display module DM and the protective layer PF, and the second adhesive layer AP2 is disposed between the protective layer PF and the support plate MP. At least one of the adhesive layers AP1 and AP2 is an optically clear adhesive (OCA) film or an optically clear adhesive resin (OCR) layer. However, the embodiment is not limited thereto, and in other embodiments, at least one of the adhesive layers AP1 and AP2 has a transmittance of approximately 80% or less.

[0118] Additionally, the electronic device ED according to the embodiment also includes an adhesive layer disposed between the support layer SP and the buffer layer CP.

[0119] In addition, although Figure 3 The accompanying drawings show the case where the folding axis FX1 is parallel to the long side of the electronic device ED, but the embodiments are not limited thereto. For example, in an electronic device according to another embodiment, the folding axis is parallel to the short side of the electronic device.

[0120] Figure 5 This is a perspective view of the support plate according to an embodiment. Figure 6 This is a plan view of a portion of the support plate according to an embodiment, and Figure 6 still Figure 5 An enlarged plan view of area "AA".

[0121] Reference Figure 5 and Figure 6 According to an embodiment, the support plate MP includes a foldable portion FA-MP and non-foldable portions NFA1-MP and NFA2-MP. The foldable portion FA-MP and the foldable region FA1 (see...) Figure 1A Correspondingly, the non-foldable portions NFA1-MP and NFA2-MP correspond to the non-foldable regions NFA1 and NFA2 (see...). Figure 1A Correspondingly, the foldable portion FA-MP of the support plate MP corresponds to the foldable display portion FA-D (see...). Figure 3 The non-foldable portions NFA1-MP and NFA2-MP of the support plate MP overlap with the non-foldable display portions NFA1-D and NFA2-D (see...). Figure 3 )overlapping.

[0122] According to an embodiment, the foldable portion FA-MP can be folded or bent relative to the first folding axis FX1. The first non-foldable portion NFA1-MP and the second non-foldable portion NFA2-MP are spaced apart from each other in the second direction DR2, and the foldable portion FA-MP is positioned between the first non-foldable portion NFA1-MP and the second non-foldable portion NFA2-MP.

[0123] According to an embodiment, a plurality of openings OP are formed in the foldable portion FA-MP of the support plate MP. When viewed in a plane defined by a first direction DR1 and a second direction DR2, the width W of each of the openings OP in the first direction DR1 is... Y1 The width W of each of the openings OP in the second direction DR2 is greater than the width of each of them. X1 The width W of the opening OP in the first direction DR1 parallel to the folding axis FX1. Y1The width W of the opening OP in the second direction DR2 perpendicular to the folding axis FX1 is greater than that of the opening OP. X1 .

[0124] For example, in an embodiment, the opening width W in the first direction DR1 Y1 The opening width W in the second direction DR2 is approximately 5.50 mm. X1 It can be approximately 0.15 mm. However, this is merely an example, and the embodiments are not limited to this. For example, in other embodiments, the width of the opening varies depending on the desired mechanical properties and flexibility.

[0125] Additionally, according to an embodiment, the foldable portion FA-MP of the support plate MP includes a support portion RI disposed between adjacent openings OP. The support portion RI corresponds to a lip retained after the opening OP is formed. The opening OP is defined by the support portion RI.

[0126] In the embodiment, the width W of the support portion RI in the first direction DR1 Y2 The width W of the support portion RI in the second direction DR2 is greater than that of the support portion RI. X2 For example, in an embodiment, the width W of the support portion RI in the first direction DR1 Y2 It is approximately 0.20 mm, and the width W of the support portion RI in the second direction DR2 is... X2 It is approximately 0.10 mm. However, this is merely an example, and the embodiments are not limited thereto. For example, in other embodiments, the width of the opening OP varies depending on the desired mechanical properties and flexibility. The width W of the support portion RI in the first direction DR1 Y2 Corresponding to the spacing between the openings OP in the first direction DR1, and the width W of the supporting portion RI in the second direction DR2. X2 This corresponds to the spacing between the openings OP in the second direction DR2.

[0127] In the embodiments, the number of openings OP formed in the foldable portion FA-MP of the support plate MP, the size of each of the openings OP, and the shape of each of the openings OP vary taking into account the mechanical design characteristics of the electronic device ED, the mechanical properties of the electronic device ED, and the folding characteristics of the foldable region, and are not limited to those shown in this specification.

[0128] In this embodiment, the first non-foldable portion NFA1-MP and the second non-foldable portion NFA2-MP are spaced apart from each other, and the foldable portion FA-MP, which can be folded relative to the first folding axis FX1, is positioned between the first non-foldable portion NFA1-MP and the second non-foldable portion NFA2-MP. The angle between the virtual extension surface IMA1 of the first non-foldable portion NFA1-MP and the virtual extension surface IMA2 of the second non-foldable portion NFA2-MP is greater than or equal to approximately 120° and less than or equal to approximately 180°. That is, the bending angle θ of the support plate MP based on the foldable portion FA-MP. FA Greater than or equal to approximately 120° and less than or equal to approximately 180°. Bending angle θ FA The virtual extension surface IMA1 of the first non-foldable portion NFA1-MP and the virtual extension surface IMA2 of the second non-foldable portion NFA2-MP are defined. According to an embodiment, the bending angle θ corresponds to the angle between the first non-foldable portion NFA1-MP and the second non-foldable portion NFA2-MP. FA With values ​​of approximately 120° or greater and approximately 180° or less, the support plate MP exhibits good flatness characteristics.

[0129] The support plate MP according to the embodiment will now be described in more detail.

[0130] In the following text, reference will be made to Figures 7 to 18 A method for manufacturing a support plate according to an embodiment is described.

[0131] Figure 7 and Figure 8 This is a flowchart of a method for manufacturing a support plate according to an embodiment. Figure 9 This is a schematic diagram illustrating a method for manufacturing a support plate according to an embodiment.

[0132] The method S10 for manufacturing a support plate according to an embodiment includes a process S100 of providing a component to be processed (hereinafter referred to as a processing component), a first pressing process S300 of forming a first opening pattern, and a second pressing process S500 of forming a second opening pattern.

[0133] In this embodiment, the process S100 of providing the processed component includes providing the processed component P-MP to the supply unit SU. The supply unit SU includes a supply roller SR, on which a base roller for processing the component P-MP is mounted. Due to the rotation of the supply roller SR, the processed component P-MP is displaced in the machine direction MD. The machine direction MD is the direction of the processing of the component P-MP and the direction in which the base roller of the component P-MP unfolds.

[0134] Figure 10A process S100 for providing a processed component according to an embodiment is shown. (Refer to...) Figure 10 The processed component P-MP includes a top surface MP-US and a bottom surface MP-BS that are opposite each other. Additionally, the processed component P-MP includes a foldable portion FA-MP and non-foldable portions NFA1-MP and NFA2-MP. The process S100 for providing the processed component includes a process for providing the processed component P-MP.

[0135] According to an embodiment, the processed component P-MP extends in one direction. (Refer to...) Figure 10 The machining component P-MP extends along the machine direction MD. The machining component P-MP comprises multiple machined areas PMA (hereinafter referred to as machining areas) adjacent to each other along the machine direction MD. Each of the multiple machining areas PMA includes a foldable portion FA-MP and non-foldable portions NFA1-MP and NFA2-MP. Each of the machining areas PMA is machined into a support plate MP (see...). Figure 5 ).

[0136] According to embodiments, the processed component P-MP may comprise a metal or a polymer. In embodiments, the processed component P-MP comprises at least one of stainless steel, aluminum, and a polymer resin. For example, the processed component P-MP comprises stainless steel, aluminum, or alloys thereof.

[0137] According to an embodiment, a guide hole GH is formed on the exterior of the machining member P-MP. The guide hole GH senses the position of the machining member P-MP during the support plate machining process or guides the arrangement of the machining member P-MP in the manufacturing equipment. In an embodiment, the guide hole GH passes through the machining member P-MP from the top surface MP-US to the bottom surface MP-BS. However, the embodiment is not limited to this. For example, in other embodiments, the guide hole GH enters the machining member P-MP from the top surface MP-US but does not extend through to the bottom surface MP-BS, or the guide hole GH enters the machining member P-MP from the bottom surface MP-BS but does not extend through to the top surface MP-US. In an embodiment, multiple guide holes GH are formed on both sides of the machining member P-MP.

[0138] Refer again Figures 7 to 9 The method S10 for manufacturing a support plate according to an embodiment includes the step of pressing the provided processing member. The method S10 for manufacturing a support plate according to an embodiment includes a first pressing process S300 for forming a first opening pattern and a second pressing process S500 for forming a second opening pattern.

[0139] Additionally, refer to Figure 8According to an embodiment, the method S10 for manufacturing a support plate further includes a process S200 for flattening the processing component before the first pressing process S300. The process S200 for flattening the processing component is performed before the first pressing process S300. The process S200 for flattening the processing component is performed in a flattening unit FU including flattening rollers FTR. The processing component P-MP received from the supply unit SU includes a curved portion, and the processing component P-MP is supplied to the flattening unit FU, where the curved portion of the processing component P-MP is flattened by passing between the flattening rollers FTR.

[0140] In an embodiment, the processing component P-MP can be supplied directly from the supply unit SU to the first pressing unit PU1, or it can be supplied from the supply unit SU to the leveling unit FU, and then processed in the first pressing unit PU1.

[0141] In an embodiment, the first pressing process S300 forms a first opening pattern in the foldable portion by using a first pressing element PS-U in the direction of the top surface MP-US of the processed component P-MP. The processed component P-MP received from the supply unit SU is provided to the first pressing unit PU1. The first pressing unit PU1 includes a support base ST on which the processed component P-MP is placed and a first pressing element PS-U for processing the processed component P-MP.

[0142] Reference Figure 9 In one embodiment, the bottom surface MP-BS of the processing component P-MP is placed on the support base ST, and the first pressing component PS-U is placed on the top surface MP-US of the processing component P-MP.

[0143] Figure 11A A first pressing process S300 for forming a first opening pattern according to an embodiment is shown. Figure 11B This is a cross-sectional view of the processed component after the first pressing process S300 according to the embodiment.

[0144] Reference Figure 9 , Figure 11A and Figure 11B In an embodiment, the first pressing process S300 forms a first opening pattern OP-PT1 in the foldable portion FA-MP by using a first pressing member PS-U in the direction of the top surface MP-US of the processing member P-MP (e.g., in the direction from the top surface MP-US of the processing member P-MP toward the bottom surface MP-BS of the processing member P-MP).

[0145] In one embodiment, the first opening pattern OP-PT1 includes an opening OP-a extending from the top surface MP-US to the bottom surface MP-BS through the processing member P-MP, and a plurality of preliminary support portions P-SMP spaced apart from each other, with the opening OP-a located between the plurality of preliminary support portions P-SMP. Each of the preliminary support portions P-SMP includes a curved edge CS on the top surface MP-US adjacent to each of the openings OP-a. The curved edge CS of each of the preliminary support portions P-SMP is formed during the process using the first pressing member PS-U.

[0146] In an embodiment, such as Figure 11A As shown, the plurality of openings OP include a first opening OP-S1 and a second opening OP-S2, and Figure 11B The opening OP-a shown corresponds to the first opening OP-S1. However, this disclosure is not limited thereto, and the opening OP-a may also correspond to the second opening OP-S2. In an embodiment, the first pressing member PS-U includes a first sub-pressing member PS-U1 forming the first opening OP-S1 and a second sub-pressing member PS-U2 forming a second opening OP-S2 that does not overlap with the first opening OP-S1. The first pressing member PS-U operates toward the top surface MP-US of the processing member P-MP in a fourth direction DR4 opposite to the third direction DR3, that is, the first pressing member PS-U operates toward the top surface MP-US of the processing member P-MP in the pressing direction PD.

[0147] In this embodiment, the first sub-pressing member PS-U1 and the second sub-pressing member PS-U2 are arranged sequentially in the machine direction MD. In addition to the first sub-pressing member PS-U1 and the second sub-pressing member PS-U2, the first pressing member PS-U also includes a plurality of sub-pressing units arranged sequentially. The plurality of sub-pressing units are arranged sequentially in the machine direction MD, and each of the plurality of sub-pressing units is arranged to correspond to each of the adjacent processing areas PMA. As the processing member P-MP moves in the machine direction MD, a processing area PMA is sequentially processed by the first sub-pressing member PS-U1 and the second sub-pressing member PS-U2.

[0148] In this embodiment, the multiple openings are formed by multiple sub-pressing units. The multiple openings may be formed on the first direction DR1 between multiple first openings OP-S1 and / or on the first direction DR1 between multiple second openings OP-S2, or on the second direction DR2 between multiple first openings OP-S1 and / or on the second direction DR2 between multiple second openings OP-S2.

[0149] Additionally, in this embodiment, the first pressed member PS-U includes a plurality of sub-pressed members that are adjacent to each other in the second direction DR2. In this case, the width of each of the adjacent sub-pressed members in the second direction DR2 is smaller than the width of the foldable portion FA-MP in the second direction DR2, and the total width of the adjacent sub-pressed members in the second direction DR2 corresponds to the total width of the foldable portion FA-MP. Within a processing area PMA, the adjacent sub-pressed members correspond to each other. The adjacent sub-pressed members can pattern a processing area PMA simultaneously, or can pattern different portions of a processing area PMA sequentially.

[0150] In an embodiment, Figure 11A and Figure 11B Two preliminary support portions P-SMPs formed in the first pressing process are shown, but this is merely an example for ease of description. In other embodiments, the first opening pattern OP-PT1 includes three or more preliminary support portions P-SMPs, or includes one preliminary support portion P-SMP.

[0151] The first opening pattern OP-PT1 formed by the first pressing member PS-U is not limited to the above arrangement, and the first opening pattern OP-PT1 may include various openings formed by the first pressing member PS-U positioned on the top surface MP-US of the processing member P-MP. The first opening pattern OP-PT1 may be formed differently depending on the number of openings, the shape of each of the openings, and the arrangement of the openings in the support plate ultimately used in the electronic device.

[0152] In an embodiment, the first opening pattern OP-PT1 includes a preliminary support portion P-SMP, which includes a curved edge CS located at the edge of the top surface MP-US, and the preliminary support portion P-SMP is formed by pressing a first pressing member PS-U through the processing member P-MP from the top surface MP-US to the bottom surface MP-BS.

[0153] The method for manufacturing a support plate according to an embodiment includes a second pressing process S500 for forming a second opening pattern. Figure 12A A second pressing process S500 for forming a second opening pattern according to an embodiment is shown. Figure 12B This is a cross-sectional view of the processed component after the second pressing process S500 according to the embodiment.

[0154] Reference Figure 9 , Figure 12A and Figure 12BIn the method for manufacturing a support plate according to an embodiment, a processed member P-MP received from a first pressing unit PU1 is provided to a second pressing unit PU2. The second pressing unit PU2 includes a support base ST on which the processed member P-MP is placed, and a second pressing member PS-B for processing the processed member P-MP. A second pressing process S500, forming a second opening pattern, forms a second opening pattern OP-PT2 in the foldable portion FA-MP using the second pressing member PS-B in the direction of the bottom surface MP-BS of the processed member P-MP (e.g., in the direction from the bottom surface MP-BS of the processed member P-MP toward the top surface MP-US of the processed member P-MP). The second pressing process S500 also patterns at least one of the preliminary support portions P-SMP in the first opening pattern OP-PT1 formed in the first pressing process S300 using the second pressing member PS-B.

[0155] In the patterning process according to an embodiment using a second pressing member PS-B, an opening OP-b is formed in at least one of the preliminary support portions P-SMP. Additionally, a first support portion RI is formed by patterning the preliminary support portion P-SMP using the second pressing member PS-B. In an embodiment, each of the first support portions RI includes a first curved edge CS-Ra on one side of the top surface and a second curved edge CS-Rb on one side of the bottom surface and facing the first curved edge CS-Ra in a diagonal direction.

[0156] In an embodiment, the second opening pattern OP-PT2 includes an opening OP-b extending from the bottom surface MP-BS to the top surface MP-US through the processing member P-MP, and a plurality of support portions RI spaced apart from each other. Each opening OP-b is located between a pair of first sub-support portions RI-a and second sub-support portions RI-b constituting the first support portion RI. The opening OP-b in the second opening pattern OP-PT2 is formed by using a second pressing member PS-B to extend from the bottom surface MP-BS to the top surface MP-US through the processing member P-MP.

[0157] That is, in the embodiment, the second opening pattern OP-PT2 is formed by machining the member P-MP in a direction opposite to the direction used to form the first opening pattern OP-PT1. The opening OP-b in the second opening pattern OP-PT2 is relative to the direction used to form the first opening pattern OP-PT1 (see...). Figure 11B The opening OP-a is formed in a separate process. The first opening pattern OP-PT1 (see...) Figure 11BThe opening OP-a in the second opening pattern OP-PT2 is formed by using the first pressing member PS-U to penetrate the processing member P-MP from the top surface MP-US to the bottom surface MP-BS, and the opening OP-b in the second opening pattern OP-PT2 is formed by using the second pressing member PS-B to penetrate the processing member P-MP from the bottom surface MP-BS to the top surface MP-US.

[0158] In this embodiment, the second pressing member PS-B is positioned on the bottom surface MP-BS of the processed member P-MP. The second opening pattern OP-PT2 is formed by inserting the second pressing member PS-B into the bottom surface MP-BS of the processed member P-MP.

[0159] Reference Figure 9 According to the embodiment and other accompanying drawings, the top surface MP-US of the processed component P-MP supplied to the second pressing unit PU2 is mounted on the support base ST, and the second pressing component PS-B is positioned on the bottom surface MP-BS of the processed component P-MP. With the top surface MP-US and the bottom surface MP-BS reversed, the processed component P-MP, processed by the first pressing unit PU1, is supplied to the second pressing unit PU2.

[0160] Reference Figure 8 and Figure 9 The method S10 for manufacturing a support plate according to an embodiment includes a process S400 in which the orientation of the top and bottom surfaces of a processed component is reversed between a first pressing process S300 and a second pressing process S500. A reversing section RL is disposed between a first pressing unit PU1 and a second pressing unit PU2. The reversing section RL flips the processed surfaces of the processed component P-MP. The reversing section RL may be a separate component of the embodiment, but the embodiment is not limited thereto. In the reversing section RL, except for the guide roller (not shown), the top surface MP-US and bottom surface MP-BS of the processed component P-MP are gradually reversed as it advances in the machine direction MD.

[0161] Refer again Figure 12A and Figure 12B According to the embodiments, Figure 12A The accompanying drawings illustrate a second pressing member PS-B, but the embodiment is not limited thereto. For example, in other embodiments, the second pressing member PS-B includes multiple sub-pressing members. When the second pressing member PS-B includes multiple sub-pressing members, it is similar to... Figure 11A In the case shown, multiple sub-presses are arranged sequentially in the machine direction MD to correspond to each of the processing areas PMA. In this case, the multiple sub-presses included in the second press PS-B process the processing areas PMA sequentially.

[0162] Alternatively, in other embodiments, the second pressing member PS-B includes a plurality of sub-pressing members that are adjacent to each other in the second direction DR2. In this case, the adjacent sub-pressing members can pattern a processing area PMA simultaneously, or pattern different portions of a processing area PMA sequentially.

[0163] Reference Figure 12B According to an embodiment, the first support portion RI in the second opening pattern OP-PT2 includes a first sub-support portion RI-a and a second sub-support portion RI-b adjacent to each other, with the opening OP-b located between the first sub-support portion RI-a and the second sub-support portion RI-b. The first sub-support portion RI-a and the second sub-support portion RI-b define the opening OP-b formed by the second pressing member PS-B. The top surfaces of the first sub-support portion RI-a and the second sub-support portion RI-b are inclined relative to a plane defined by a first direction DR1 and a second direction DR2. The inclination directions of the top surfaces of the first sub-support portion RI-a and the second sub-support portion RI-b are different from each other. The top surface of the first sub-support portion RI-a is inclined in one direction relative to the plane defined by the first direction DR1 and the second direction DR2, said direction being opposite to the inclination direction of the top surface of the second sub-support portion RI-b relative to the plane defined by the first direction DR1 and the second direction DR2.

[0164] The support plate manufactured by the method S10 for manufacturing a support plate according to the embodiment includes both a first pressing process that processes the processing member from the top surface of the processing member and a second pressing process that processes the processing member from the bottom surface of the processing member, in order to improve the flatness of the final formed opening pattern.

[0165] Figures 13A to 13C The machining shape of the component is shown according to the insertion direction and insertion sequence of the pressed parts.

[0166] Figure 13A An example is shown where a pressing member PS moves sequentially in one direction (e.g., machine direction MD) while a processing member P-MP is processed to form an opening OP. The pressing direction PD, which is the operating direction of the pressing member PS, is the direction in which the pressing member PS moves from the top surface MP-US to the bottom surface MP-BS of the processing member P-MP. In this case, the finally processed support plate MP'-1 only includes the edge of the curved portion on the top surface MP-US where the pressing member PS is inserted. Additionally, the finally processed support plate MP'-1 includes the support portion RI'-1, which has already rotated in a rotational direction RD.

[0167] Figure 13BA method is shown in which multiple pressed pieces PS are simultaneously inserted into the top surface MP-US of a machined member P-MP to form an opening OP. In a first process (step 1), the machined member P-MP is machined simultaneously using three pressed pieces PS to form the opening OP, and then in a second process (step 2), the remaining portion not machined in the first process (step 1) is machined to form a support plate MP'-2 with an additional opening OP. Even when... Figure 13B When manufacturing the support plate MP'-2 using the method shown, since the pressing member PS is inserted only in the direction from the top surface MP-US toward the bottom surface MP-BS, the edge of the curved portion is only provided on the top surface of the support portion RI'-2. When combined with... Figure 13A Compared to the support plate MP'-1 manufactured using a continuous process shown in the figure, by Figure 13B The support plate MP'-2 shown in the figure, manufactured by the same stamping process, includes other support parts RI'-2 that have been rotated in different rotation directions RD.

[0168] Figure 13C A portion of the process of a method for manufacturing a support plate according to an embodiment is shown, as well as an example of the shape of the support plate formed by the portion of the process of the method for manufacturing a support plate according to an embodiment. Figure 13C The process shown includes both a first process (step 1) and a second process (step 2). In the first process (step 1), the pressed part PS-U is inserted into the top surface MP-US of the machined component P-MP to perform simultaneous stamping. In the second process (step 2), the pressed part PS-B is inserted into the bottom surface MP-BS of the machined component P-MP to perform simultaneous stamping. (See reference...) Figure 13C The support plate MP manufactured according to the embodiment, by means of the method for manufacturing a support plate according to the embodiment, includes a curved edge on one side of the top surface and a curved edge on one side of the bottom surface facing the curved edge in a diagonal direction. By means of the method according to the embodiment... Figure 13C The manufacturing method produces a support plate MP that also provides a support portion RI that has already rotated in different rotational directions RD.

[0169] When the support plates MP'-1 and MP'-2 are processed by using a press insert inserted in only one direction (i.e., only from the direction of the top surface), the support portion RI of the support plate MP manufactured according to the embodiment has improved flatness of the processed area, wherein the method for manufacturing the support plate MP according to the embodiment includes at least one reverse stamping process, i.e., a pressing process from the direction of the bottom surface.

[0170] That is, the method for manufacturing a support plate according to the embodiment includes a pressing process from the direction of the top surface of the processing member and a pressing process from the direction of the bottom surface of the processing member at least once, so as to facilitate the processing of the opening and improve the flatness of the processing support plate.

[0171] A method for manufacturing a support plate according to an embodiment includes a first pressing process and a second pressing process. The first pressing process includes a plurality of opening patterning processes, and the second pressing process includes at least one opening patterning process.

[0172] Figure 14A and Figure 14B A portion of the process for manufacturing a support plate according to an embodiment is shown. Figure 14A and Figure 14B A processing area PMA is shown (see Figure 10 Part of it, to show the variation in the arrangement of openings according to the opening patterning process.

[0173] exist Figure 14A and Figure 14B In the text, "Step A" and "Step B" are related to the first pressing process S300 (see...). Figure 7 The opening patterning process corresponds to the second pressing process S500 (see [link]). Figure 7 The opening patterning process corresponds to that of the ).

[0174] Reference Figure 14A The method for manufacturing a support plate according to an embodiment includes a first pressing process S300 (see...). Figure 7 The method for manufacturing a support plate according to an embodiment includes a process of forming a plurality of first openings spaced apart by a first interval (step A) (hereinafter referred to as the first opening defining process) and a process of forming a plurality of second openings spaced apart by a second interval (step B) (hereinafter referred to as the second opening defining process).

[0175] According to an embodiment, the first opening defining process (step A) forms a plurality of first openings OP1 in each of a plurality of first patterned regions PTA1 spaced apart from each other along a second direction DR2, spaced apart by a first interval D1. This is achieved by using a first pressing member PS-U (see...). Figure 9 Perform the first opening definition process (step A) from the direction of the top surface of the component.

[0176] In an embodiment, the second opening defining process (step B) forms a plurality of second openings OP2 spaced apart from each other by a second interval D2 in each of the first patterned regions PTA1 or in each of the second patterned regions PTA2 disposed between the first patterned regions PTA1. That is, the second opening defining process (step B) forms second openings OP2 that do not overlap with the first openings OP1, and is formed by the first pressing member PS-U (see...). Figure 9 Perform the second opening limiting process (step B) from the direction of the top surface of the processed component.

[0177] According to an embodiment, Figure 14A The illustration shows a second opening defining process (step B) for forming a plurality of second openings OP2 spaced apart from each other by a second interval D2 in a second patterned region PTA2, but the embodiments are not limited thereto. In other embodiments, the second opening defining process (step B) includes forming second openings OP2 in a first patterned region PTA1 so as not to overlap with first openings OP1. Additionally, the second openings formed by the second opening defining process (step B) may include an opening above the first patterned region PTA1 and the second patterned region PTA2.

[0178] A method for manufacturing a support plate according to an embodiment includes a first pressing process S300 (see...). Figure 7 The second pressing process S500, which is performed afterward (see...), is another process. Figure 7 The second pressing process S500 (see...) Figure 7 This includes one or more opening patterning processes.

[0179] According to the embodiment, the second pressing process S500 (see...) Figure 7 The process includes at least one process of forming a plurality of openings that pass through a portion of a first patterned region PTA1 and a portion of a second patterned region PTA2 and are spaced apart from each other in a second direction DR2, or a process of forming a plurality of openings that are spaced apart from each other in a second direction DR2 in a first patterned region PTA1 or a second patterned region PTA2 disposed between the first patterned regions PTA1.

[0180] exist Figure 14A In the embodiment shown, the second pressing process S500 (see...) Figure 7 This includes penetrating a portion of the first patterned region PTA1 and a portion of the second patterned region PTA2 to form a plurality of fourth openings OP4 spaced apart from each other by a fourth interval D4 (hereinafter referred to as the fourth opening defining process). This is achieved by using a second pressing piece PS-B (see...). Figure 9 Perform the fourth opening limiting process (step C) from the direction of the bottom surface of the processed component. Figure 14AThe embodiment shown also includes a process S400 of reversing the processed component between the second opening defining process (step B) and the fourth opening defining process (step C).

[0181] Figure 14A The second pressing process S500 (see [link]) is shown as the fourth opening-limiting process (step C). Figure 7 The opening patterning process in the example is not limited to this. In the fourth opening defining process (step C), the fourth opening OP4 can be formed in the... Figure 14A The positions shown are at different locations.

[0182] Reference Figure 14B The method for manufacturing a support plate according to an embodiment includes a first pressing process S300 (see...). Figure 7 The method for manufacturing a support plate according to an embodiment includes a process for forming a plurality of first openings spaced apart by a first interval (step A) (hereinafter referred to as the first opening defining process) and a process for forming a plurality of third openings spaced apart by a third interval (step B) (hereinafter referred to as the third opening defining process).

[0183] like Figure 14B As shown, in accordance with the embodiment Figure 14B In the method for manufacturing a support plate, a first opening defining process (step A) forms a plurality of first openings OP1 spaced apart from each other in a plurality of first patterned regions PTA1 spaced apart along a first direction DR1 and spaced apart from each other by a first interval D1 in a second direction DR2. This is achieved by using a first pressing member PS-U (see...). Figure 9 Perform the first opening definition process (step A) in the direction from the top surface of the processed component.

[0184] In an embodiment, the third opening defining process (step B) forms a plurality of third openings OP3 that are spaced apart from each other by a third interval D3, passing through a portion of the first patterned region PTA1 and a portion of the second patterned region PTA2. That is, the third opening defining process (step B) forms the third openings OP3 so as not to overlap with the first openings OP1, and through the first pressing member PS-U (see...). Figure 9 Perform the third opening limiting process (step B) from the direction of the top surface of the processed component.

[0185] Figure 14B The third opening defining process (step B) shown is merely an example, and therefore the embodiments are not limited thereto. In the third opening defining process (step B), the third opening OP3 can be formed in conjunction with... Figure 14B The positions shown are at different locations.

[0186] A method for manufacturing a support plate according to an embodiment includes a first pressing process S300 (see...). Figure 7 The second pressing process S500, which is performed afterward (see...), is another process. Figure 7 Second pressing process S500 (see...) Figure 7 This includes one or more opening patterning processes.

[0187] In the embodiment, the second pressing process S500 (see...) Figure 7 Multiple openings spaced apart from each other in the second direction DR2 can be formed in the first pattern region PTA1 or the second pattern region PTA2.

[0188] exist Figure 14B In the embodiment shown, the second pressing process S500 (see...) Figure 7 This includes the process (step C) of forming a plurality of fifth openings OP5 spaced apart from each other by a fifth interval D5 in the second pattern region PTA2 (hereinafter referred to as the fifth opening defining process).

[0189] In this embodiment, a second pressing element PS-B (see...) is used... Figure 9 Perform the fifth opening limiting process (step C) from the direction of the bottom surface of the processed component. Figure 14B The embodiment shown also includes a process S400 in which the processed component is reversed between the third opening defining process (step B) and the fifth opening defining process (step C).

[0190] Figure 14B The second pressing process S500 (see [reference]) is shown as the fifth opening-limiting process (step C). Figure 7 The opening patterning process in the embodiment is not limited to this. In the fifth opening defining process (step C), the fifth opening OP5 can be formed in the... Figure 14B The positions shown are at different locations.

[0191] exist Figure 14A and Figure 14B For ease of explanation, the first pressing process S300 (see...) Figure 7 This includes two opening patterning processes, and a second pressing process S500 (see...). Figure 7 It has an opening patterning process, but the embodiments are not limited to this.

[0192] The method for manufacturing a support plate according to an embodiment may include n opening patterning processes to form a plurality of openings in the support plate, where n is a non-negative integer. In the n opening patterning processes, a second pressing process performed from the direction of the bottom surface of the processing member includes m opening patterning processes, where m is a non-negative integer and m is less than n, and a first pressing process performed from the direction of the top surface of the processing member includes nm opening patterning processes.

[0193] For example, according to an embodiment, when performing a patterning process with 25 openings, the first pressing process performed from the direction of the top surface of the processed member can be repeated 24 times, and the second pressing process performed from the direction of the bottom surface of the processed member can be performed only once, i.e., once. However, embodiments of the inventive concept are not limited thereto. In a patterning process with 25 openings, the second pressing process performed from the direction of the bottom surface of the processed member can be performed two or more times.

[0194] Furthermore, in the method for manufacturing a support plate according to the embodiment, the number of first pressing processes performed from the direction of the top surface of the processing member is greater than the number of second pressing processes performed from the direction of the bottom surface of the processing member. Specifically, the number of first pressing processes is greater than the number of second pressing processes. However, the embodiment is not limited to this, and the combination of the number of first pressing processes and the number of second pressing processes varies depending on the shape and size of the formed opening pattern and the arrangement of the openings.

[0195] exist Figure 14A and Figure 14B In this embodiment, after a first pressing process performed from the direction of the top surface of the processed component, a second pressing process performed from the direction of the bottom surface of the processed component is sequentially performed, but the embodiment is not limited to this. For example, the first pressing process performed from the direction of the top surface of the processed component may be performed further after the second pressing process.

[0196] Figure 15 A portion of a method for manufacturing a support plate according to an embodiment is shown. Figure 15 A PMA is shown in a processing area (see Figure 10 An example of a process for forming an opening in a [structure / process]. Figure 15 In this process, the opening patterning process is executed sequentially from the first process (step 1) to the eighth process (step 8).

[0197] According to an embodiment, the first opening OP-S1 to the eighth opening OP-S8 are formed during different processes so that they do not overlap. For example, in a first process (step 1), the first opening OP-S1 is formed in a region spaced apart from each other along the first direction DR1, and then in a second process (step 2), the second opening OP-S2 is formed in a region located between the first openings OP-S1 spaced apart from each other along the first direction DR1. Additionally, in a third process (step 3), the third opening OP-S3 is formed in a region located between the second openings OP-S2 spaced apart from each other along the second direction DR2. In subsequent processes (steps 4 to 8), openings OP-S4, OP-S5, OP-S6, OP-S7, and OP-S8 are further formed in regions that do not overlap.

[0198] According to an embodiment, the second pressing process is performed in the direction from the bottom surface of the processed component. Figure 15 At least one of the first process (step 1) to the eighth process (step 8) shown. For example, the eighth process (step 8) may be performed in the second pressing process, but the embodiments are not limited thereto. At least one of the second process (step 2) to the eighth process (step 8) includes an opening patterning process performed in the second pressing process.

[0199] Figure 16 A method for manufacturing a support plate according to an embodiment is shown. In the embodiment, after process S100 of providing the processing component P-MP, a first pressing process S300 and a second pressing process S500 are performed to process the processing component P-MP into a support plate MP.

[0200] According to an embodiment, after the first pressing process S300, the processed member P-MP provided in process S100 can be bent in the direction of the first pressed member PS-U. That is, after the first pressing process S300, the processed member can be bent such that the top surface MP-US has a first bending angle θ. FA-1 .

[0201] Following the first pressing process S300, according to an embodiment, a second pressing process S500 is performed, and the top surface MP-US of the processed component has a bending angle greater than the first bending angle θ. FA-1 The second bending angle θ FA-2 That is, after the first pressing process S300, and after machining the component from the bottom surface MP-BS direction, the flatness of the component increases. Subsequently, the final support plate MP has improved flatness.

[0202] Reference Figure 8The method S10 for manufacturing a support plate according to an embodiment further includes a process S600 for flattening the processed component. After the processed component is processed using the second pressing member PS-B, an additional pressing process is performed using a correcting pressing member, such that a portion of the curved portion formed during the first pressing process S300 and the second pressing process S500 is flattened.

[0203] Figure 17A and Figure 17B A portion of a method for manufacturing a support plate according to an embodiment is shown. Figure 17A An example is shown where a machining component is provided such that the folding axis FX1 of the support plate is perpendicular to the machine direction MD, and Figure 17B An example is shown where a machining component is provided such that the folding axis FX1 of the support plate is parallel to the machine direction MD.

[0204] exist Figure 17A In the embodiment shown, adjacent processing areas PMA in the machine direction MD are sequentially processed in the pressing unit PU while traveling along the machine direction MD. The number of openings increases as the processing member P-MP moves along the machine direction MD. In this embodiment, the folding axis FX1 of the support plate MP is perpendicular to the machine direction MD, which is the extending direction of the processing member P-MP.

[0205] According to the embodiments Figure 17A In a method for manufacturing a support plate, pressing units PU cover adjacent processing areas PMA in the machine direction MD. According to an embodiment... Figure 17A In the method for manufacturing a support plate, openings are sequentially formed according to the movement of the processing component P-MP in order to improve the productivity of processing the support plate MP.

[0206] exist Figure 17B In the embodiment shown, the pressing unit PU and a processing area PMA correspond to each other. In a stationary state, the processing member P-MP does not move in the machine direction MD and has multiple openings formed in a processing area PMA. The multiple openings are formed by performing a patterning process on a processing area PMA. In this embodiment, the folding axis FX1 of the support plate MP is parallel to the machine direction MD, which is the extending direction of the processing member P-MP.

[0207] According to the embodiments Figure 17B In a method for manufacturing a support plate, a pressing unit PU covers a processing area PMA. According to an embodiment... Figure 17B In the method for manufacturing a support plate, the patterning of openings is performed sequentially while the processing component P-MP is fixed, thereby improving the dimensional accuracy of the formed openings.

[0208] in addition, Figure 17A and Figure 17B The pressing unit PU includes both a first pressing component PS-U and a second pressing component PS-B. That is, even when... Figure 17A and Figure 17B In the embodiment shown, MP-US is performed from the top surface of the machined component (see [reference]). Figure 9 The first pressing process forms an opening in the direction of the MP-BS (see) component bottom surface (see) Figure 9 The second pressing process forms an opening in the direction of the two.

[0209] Figure 18 This is a perspective view of a portion of a method for manufacturing a support plate according to an embodiment. (Refer to...) Figure 8 and Figure 18 The method S10 for manufacturing a support plate according to an embodiment includes a process S700 for cutting a processing area. In the method S10 for manufacturing a support plate according to an embodiment, the process S700 for cutting the processing area is performed after a second pressing process S500. For example, in the method S10 for manufacturing a support plate according to an embodiment, the process S700 for cutting the processing area is performed sequentially after the second pressing process S500. Alternatively, in the embodiment, the second pressing process S500, the process S600 for correcting the flatness of the processing member, and the process S700 for cutting the processing area are performed sequentially.

[0210] In an embodiment, process S700 of cutting the processing area corresponds to molding the processing area PMA into an electronic device ED using a cutting fixture CT. Figure 3 The process for shaping the support plate MP in the () is described. Refer to Figure 9 The cutting unit CU includes a cutting fixture CT and a support base ST on which the machining component P-MP is placed. The machining component P-MP is processed in the second pressing unit PU2 and then provided to the cutting unit CU, where the cutting fixture CT cuts the machining component P-MP to correspond to the shape of the support plate MP. Figure 9 In this embodiment, the top surface MP-US of the machining component P-MP is placed on the support base ST, and the bottom surface MP-BS of the machining component P-MP points towards the cutting fixture CT, but the embodiment is not limited to this. For example, in other embodiments, the reversing portion RL is further disposed between the second pressing unit PU2 and the cutting unit CU. In this case, the bottom surface MP-BS of the machining component P-MP is placed on the support base ST, and the top surface MP-US of the machining component P-MP points towards the cutting fixture CT.

[0211] In this embodiment, after being processed in the cutting unit CU, the support plate MP is mounted on the movable substrate CVB and provided to the cleaning unit WU. After being cleaned in the cleaning unit WU, the support plate MP is provided to the external irradiation unit IU, which evaluates the quality, such as the size and shape of the opening pattern in the support plate MP.

[0212] The method for manufacturing a support plate according to an embodiment processes the support plate by using a pressing element and includes at least one reverse stamping process to improve the flatness of the portion forming the opening and to provide excellent patterning quality of the opening.

[0213] In the following text, reference will be made to Figures 19A to 20B An electronic device according to an embodiment is described. In the following description of the electronic device according to an embodiment, reference will not be repeated. Figures 1A to 18 The description will focus on the differences.

[0214] Refer again Figure 3 and Figure 4 According to an embodiment, the electronic device ED includes a display module DM and a support plate MP disposed below the display module DM. The support plate MP includes a top surface adjacent to the display module DM and a bottom surface opposite to the top surface. An opening pattern OP-PT is formed in the support plate MP and corresponds to a foldable region FA1. The opening pattern OP-PT includes an opening OP passing through the top and bottom surfaces and a plurality of support portions RI around the opening OP (see [link to relevant documentation]). Figure 6 ).

[0215] Figure 19A and Figure 19B This is a cross-sectional view of the support plate according to an embodiment. Figure 19B yes Figure 19A A magnified cross-sectional view of a portion of the image. Figure 19A It shows the relationship with Figure 6 The part corresponding to line II-II'.

[0216] Reference Figure 19A and Figure 19B According to an embodiment, the support plate MP includes a plurality of first support portions RI-1. The first support portions RI-1 and an opening OP located between the first support portions RI-1 are included in a foldable portion FA-MP. The width W of the opening OP in the second direction DR2 is... X1 It is approximately 0.15mm, and the width W of the first support portion RI-1 in the second direction DR2 is... X2 It is approximately 0.10 mm. However, the embodiments of the present invention are not limited thereto.

[0217] In an embodiment, each of the first support portions RI-1 includes a first curved edge CS-Ra on one side of the top surface and a second curved edge CS-Rb on one side of the bottom surface, the second curved edge CS-Rb facing the first curved edge CS-Ra diagonally. The first support portion RI-1 includes first flat top surfaces US-Ra and US-Rb adjacent to the first curved edge CS-Ra and first flat bottom surfaces BS-Ra and BS-Rb adjacent to the second curved edge CS-Rb. The first flat top surfaces US-Ra and US-Rb and the first flat bottom surfaces BS-Ra and BS-Rb of the first support portion RI-1 are inclined relative to virtual extension surfaces H-UL, H-BL, and PLL, respectively, which are parallel to the surfaces of the non-foldable portions NFA1-MP and NFA2-MP of the support plate. The virtual extension surfaces H-UL, H-BL, and PLL are also parallel to a plane defined by a first direction DR1 and a second direction DR2. The first flat top surfaces US-Ra and US-Rb or the first flat bottom surfaces BS-Ra and BS-Rb are tilted at an angle greater than approximately 0 degrees and less than approximately 15 degrees relative to the virtual extended surfaces H-UL, H-BL, and PLL.

[0218] Reference Figure 19A and Figure 19B According to an embodiment, the support plate MP includes a first sub-support portion RI-a and a second sub-support portion RI-b adjacent to each other, and an opening OP is located between the first sub-support portion RI-a and the second sub-support portion RI-b. The opening OP between the first sub-support portion RI-a and the second sub-support portion RI-b is formed by performing a pressing process from the bottom surface of the support plate MP.

[0219] In one embodiment, the first sub-support portion RI-a and the second sub-support portion RI-b are partially rotated in opposite directions. For example, in one embodiment, the first flat top surface US-Ra of the first sub-support portion RI-a is inclined counterclockwise relative to the virtual extension surface H-UL, and the first flat top surface US-Rb of the second sub-support portion RI-b is inclined clockwise relative to the virtual extension surface H-UL. The angle θ between the first flat top surface US-Ra of the first sub-support portion RI-a and the virtual extension surface H-UL is... U1 And the angle θ between the first flat top surface US-Rb of the second sub-support portion RI-b and the virtual extension surface H-UL U2 Each is independently greater than 0 degrees and less than approximately 15 degrees. Furthermore, the angle θ between the first flat bottom surface BS-Ra of the first sub-support portion RI-a and the virtual extended surface PLL... B1And the angle θ between the first flat bottom surface BS-Rb of the second sub-support portion RI-b and the virtual extension surface PLL B2 Each is independently greater than 0 degrees and less than approximately 15 degrees.

[0220] In one embodiment, the first flat top surface US-Ra of the first sub-support portion RI-a and the first flat top surface US-Rb of the second sub-support portion RI-b are symmetrical about each other with respect to the center of the opening OP between the first sub-support portion RI-a and the second sub-support portion RI-b. However, embodiments of the present invention are not limited thereto.

[0221] Figure 20A This is a cross-sectional view of the support plate according to an embodiment. Figure 20B yes Figure 20A A magnified cross-sectional view of a portion of the image. Figure 20A It shows the relationship with Figure 6 The part corresponding to line II-II'.

[0222] Reference Figure 20A and Figure 20B According to an embodiment, the support plate MP-1 includes a first support portion RI-1 and a second support portion RI-2. That is, compared with the reference... Figure 19A and Figure 19B Compared to the support plate MP described in the embodiment, the support plate MP-1 according to the embodiment further includes a second support portion RI-2.

[0223] In the support plate MP-1 according to the embodiment, each of the first support portions RI-1 includes a first curved edge CS-Ra on one side of the top surface (see Figure 19B ) and the second curved edge CS-Rb on one side of the bottom surface (see Figure 19B ), second curved edge CS-Rb (see Figure 19B Facing the first curved edge CS-Ra in the diagonal direction (see...) Figure 19B Furthermore, in the cross-section, each of the second support portions RI-2 includes a third curved edge CS-Rc on one side of the top surface and a fourth curved edge CS-Rd on the other side of the top surface, the fourth curved edge CS-Rd being spaced apart from the third curved edge CS-Rc.

[0224] According to an embodiment, the second support portion RI-2 includes second flat top surfaces US-Rc and US-Rd disposed between the third curved edge CS-Rc and the fourth curved edge CS-Rd, and second flat bottom surfaces BS-Rc and BS-Rd respectively opposite to the second flat top surfaces US-Rc and US-Rd. The second flat top surfaces US-Rc and US-Rd and the second flat bottom surfaces BS-Rc and BS-Rd of the second support portion RI-2 are inclined relative to virtual extension surfaces H-UL, H-BL, and PLL, which are parallel to a plane defined by a first direction DR1 and a second direction DR2 and parallel to the surface of one of the non-folded portions NFA1-MP and NFA2-MP of the support plate. The angle of inclination of the second flat top surfaces US-Rc and US-Rd or the second flat bottom surfaces BS-Rc and BS-Rd relative to the virtual extension surfaces H-UL, H-BL, and PLL is greater than approximately 0 degrees and less than approximately 15 degrees.

[0225] Reference Figure 20A and Figure 20B According to an embodiment, the support plate MP-1 includes a first sub-support portion RI-a and a second sub-support portion RI-b adjacent to each other, and a third sub-support portion RI-c and a fourth sub-support portion RI-d adjacent to each other. An opening OP-b is located between the first sub-support portion RI-a and the second sub-support portion RI-b, and an opening OP-a is located between the third sub-support portion RI-c and the fourth sub-support portion RI-d. The opening OP-b between the first sub-support portion RI-a and the second sub-support portion RI-b is formed by pressing from the bottom surface of the support plate. The opening OP-a between the third sub-support portion RI-c and the fourth sub-support portion RI-d is formed by pressing from the top surface of the support plate.

[0226] In one embodiment, the adjacent third sub-support portions RI-c and fourth sub-support portions RI-d are partially rotated in opposite directions, with the opening OP-a located between the third sub-support portions RI-c and the fourth sub-support portions RI-d. For example, in one embodiment, the second flat top surface US-Rc of the third sub-support portion RI-c is inclined counterclockwise relative to the virtual extension surface H-UL, and the second flat top surface US-Rd of the fourth sub-support portion RI-d is inclined clockwise relative to the virtual extension surface H-UL. The angle θ between the second flat top surface US-Rc of the third sub-support portion RI-c and the virtual extension surface H-UL is... U3 And the angle θ between the second flat top surface US-Rd of the fourth sub-support portion RI-d and the virtual extended surface H-UL U4Each is independently greater than 0 degrees and less than approximately 15 degrees. Additionally, the angle θ between the second flat bottom surface BS-Rc of the third sub-support portion RI-c and the virtual extension surface PLL... B3 And the angle θ between the second flat bottom surface BS-Rd of the fourth sub-support portion RI-d and the virtual extension surface PLL B4 Each is independently greater than 0 degrees and less than approximately 15 degrees.

[0227] In one embodiment, the second flat top surface US-Rc of the third sub-support portion RI-c and the second flat top surface US-Rd of the fourth sub-support portion RI-d are symmetrical about each other with respect to the center of the opening OP-a between the third sub-support portion RI-c and the fourth sub-support portion RI-d. However, embodiments of the present invention are not limited thereto.

[0228] Reference has been made to the embodiments Figures 1A to 1D The electronic device shown is described according to reference Figures 3 to 20B The embodiments described are components of an electronic device, but the embodiments are not limited thereto. According to reference... Figures 3 to 20B The components of the electronic device described in the embodiments can be incorporated into the electronic device according to the reference. Figure 2A and Figure 2B In the described embodiment of the electronic device ED-a, that is, even when the folding axis FX2 is parallel to the short side of the electronic device ED-a, the aforementioned support plate can still be incorporated according to the reference. Figure 2A and Figure 2B The electronic device ED-a described in the embodiment.

[0229] Figure 21A and Figure 21B It is a graph showing the results obtained by evaluating the flatness of a support plate manufactured according to the example and by the method for manufacturing the support plate of the example according to the concept of the present invention, and a support plate manufactured according to the comparative example and by a method different from the method of the example. Figure 21A The foldable portion FA-MP of the support plate is shown by measurement (see...). Figure 5 The results obtained by evaluating the flatness of the NFA1-MP (including the non-foldable portion) are shown in Figure 21b. Figure 3 ) and NFA2-MP (see Figure 3 ) and the foldable part FA-MP (see Figure 5 The result was obtained by assessing the flatness of the entire support plate. Figure 21C This is a schematic diagram illustrating a method for evaluating the flatness of a support plate according to an example. Figure 21A and Figure 21BIn the graph shown, the “points” on the X-axis represent measurement points, and the “height” on the Y-axis represents the relative height of the support plate at each point measured by the measuring instrument.

[0230] exist Figure 21A In the examples, Comparative Example 1 corresponds to the case of forming an opening pattern on a foldable portion in an etching process, and Comparative Example 2 corresponds to the case of forming an opening pattern on a foldable portion by a pressing method. Comparative Example 2 also corresponds to the case of forming an opening pattern by pressing in only one direction (such as the upward direction). Figure 21A The example in the text corresponds to the case where an opening pattern is formed by performing a first pressing process from the direction of the top surface of the processed component and a second pressing process from the direction of the bottom surface of the processed component. Figure 21A In the results shown, Comparative Example 2 corresponds to a support plate that forms an opening pattern by pressing 20 times only from the direction of the top surface of the processed component, and the example corresponds to a support plate that forms an opening pattern by pressing 5 times from the direction of the bottom surface of the processed component through a second pressing process.

[0231] Reference Figure 21A In Comparative Example 1, the difference between the minimum and maximum height corresponds to approximately 0.07 mm, and thus, a relatively flat support plate can be observed. However, when forming the opening pattern on the support plate by etching, there are limitations due to differences in the cross-sectional shape of the opening pattern. When comparing the flatness according to Comparative Example 2 and the Example, in Comparative Example 2, the difference between the minimum and maximum height corresponds to approximately 0.26 mm, but in the Example, the difference corresponds to approximately 0.11 mm, and thus, it can be seen that the flatness of the Example is improved compared to Comparative Example 2. (Refer to...) Figure 21B In Comparative Example 2, which corresponds to a support plate whose opening pattern is formed by pressing 20 times only from the top surface of the processed component, the difference between the minimum and maximum height of the entire support plate is approximately 0.16 mm. In contrast, in the example where the opening pattern is formed by performing a first pressing process 15 times and then a second pressing process 5 times, the difference between the minimum and maximum height is approximately 0.02 mm, and therefore, it can be seen that the support plate manufactured in the example has improved flatness characteristics.

[0232] In the support plate according to the example, flatness refers to the relative flatness characteristics of the top surface MP-US or the bottom surface MP-BS of the support plate MP. In this specification, the height deviation of the top surface MP-US of the support plate MP based on a virtual surface has been described as a measure of flatness. That is, in this specification, the maximum height h of the top surface MP-US of the support plate MP based on the virtual surface IMP parallel to the plane defined by the first direction DR1 and the second direction DR2 is... max and minimum height h min The difference between (h) max -h min It is defined as flatness.

[0233] Reference Figures 21A to 21C The flatness of the support plate MP according to the example is approximately 0.15 mm or less. That is, the support plate according to the example is manufactured by a method including a second pressing process corresponding to the reverse stamping process, and therefore, it can be seen that the thickness deviation within a plane (whether it is the top surface or the bottom surface) has excellent flatness characteristics.

[0234] Figure 22 The bending angle of the support plate in its final state is shown according to the number of times a second pressing process, performed from the direction of the bottom surface of the processed component, is carried out according to the comparative example and the example. Figure 22 The comparative examples correspond to a support plate whose opening pattern is formed by performing 20 presses only from the direction of the top surface of the processed component. Examples 1 to 6 correspond to support plates manufactured by performing the first pressing process and the second pressing process shown in Table 1 below.

[0235] [Table 1]

[0236] Classification Number of press cycles in the first pressing process / Number of press cycles in the second pressing process Example 1 10 / 10 Example 2 12 / 8 Example 3 13 / 7 Example 4 15 / 5 Example 5 16 / 4 Example 6 17 / 3

[0237] Reference Figure 22 In the comparative example, the bending angle corresponds to approximately 118°, and in the case of an example where the support plate is formed by performing a second pressing process corresponding to the reverse stamping process, it can be seen that the bending angle increases compared to the comparative example.

[0238] The bending angle of the support plate according to the example is greater than or equal to about 120° and less than or equal to about 180°. That is, when compared with the comparative example, the support plate manufactured by the method for manufacturing the support plate according to the example, which includes a second pressing process corresponding to the reverse stamping process, has improved flatness characteristics.

[0239] An electronic device according to an embodiment includes a support plate disposed below a display module and having an opening pattern. The opening pattern includes at least one support portion having a first curved edge on one side of a top surface and a second curved edge on one side of a bottom surface facing the first curved edge diagonally, to improve appearance quality. The electronic device according to an embodiment has improved flatness characteristics of the display surface.

[0240] Additionally, the method for manufacturing a support plate according to the embodiment provides a support plate by including at least one reverse stamping process in the pressing method, the support plate having high opening size stability, good mechanical properties and improved flatness.

[0241] The electronic device according to an embodiment is flexible and substantially flat in the foldable region by means of openings including top and bottom surfaces pressed toward the foldable region.

[0242] The method for manufacturing a support plate according to an embodiment includes a pressing process toward the bottom surface of the component to be processed, and therefore the method is used to manufacture a support plate with improved flatness.

[0243] It will be apparent to those skilled in the art that various modifications and deviations can be made to the embodiments of the inventive concept. Therefore, the embodiments of this disclosure are intended to cover modifications and deviations from the inventive concept, provided they fall within the scope of the claims and their equivalents.

[0244] Therefore, the technical scope of the embodiments of the present invention should not be limited to the content described in the detailed description of the specification, but should be determined by the scope of the claims.

Claims

1. An electronic device, wherein, The electronic device includes: The foldable region is configured to fold relative to a folding axis extending in a first direction; and the non-foldable regions are spaced apart from each other, with the foldable region located between the non-foldable regions. Display module; and A support plate is disposed below the display module, and an opening pattern is formed in the support plate at a position corresponding to the foldable area. The support plate includes a top surface adjacent to the display module and a bottom surface facing the top surface. The opening pattern includes an opening extending from the top surface to the bottom surface through the support plate and a plurality of support portions surrounding the opening, and In the cross-section, each of the plurality of support portions includes at least one first support portion, the at least one first support portion including a first curved edge located on one side of the top surface and a second curved edge located on one side of the bottom surface, the second curved edge facing the first curved edge in a diagonal direction. Wherein, the at least one first support portion includes a first flat top surface adjacent to the first curved edge and a first flat bottom surface adjacent to the second curved edge, and Each of the first flat top surface and the first flat bottom surface is inclined relative to the virtual extension surface, which is parallel to the surface of the support plate corresponding to the non-foldable region.

2. The electronic device according to claim 1, wherein, The first angle between the first flat top surface and the virtual extended surface and the second angle between the first flat bottom surface and the virtual extended surface are each greater than 0 degrees and less than or equal to 15 degrees.

3. The electronic device according to claim 1, wherein, The first support portion includes a first sub-support portion and a second sub-support portion that are adjacent to each other, and the opening is located between the first sub-support portion and the second sub-support portion. The first flat top surface of the first sub-support portion is inclined in a counterclockwise direction relative to the virtual extension surface, and The first flat top surface of the second sub-support portion is inclined in a clockwise direction relative to the virtual extension surface.

4. The electronic device according to claim 3, wherein, The first flat top surface of the first sub-support portion and the first flat top surface of the second sub-support portion are symmetrical to each other with respect to the center of the opening between the first sub-support portion and the second sub-support portion.

5. The electronic device according to claim 1, wherein, In the cross-section, the support plate further includes a second support portion, the second support portion including a third curved edge located on one side of the top surface and a fourth curved edge located on the other side of the top surface and spaced apart from the third curved edge.

6. The electronic device according to claim 5, wherein, The second support portion includes a second flat top surface located between the third curved edge and the fourth curved edge, and The second flat top surface is inclined relative to the virtual extension surface, which is parallel to the surface of the support plate corresponding to the non-foldable region.

7. The electronic device according to claim 1, wherein, On a plane, the width of the opening in the first direction is greater than the width of the opening in a second direction perpendicular to the first direction.

8. The electronic device according to claim 1, wherein, The support plate has a flatness of 0.15 mm or less, and The flatness corresponds to the difference between the maximum and minimum heights of the top surface of the support plate relative to the virtual reference surface, which is parallel to the bottom surface of the display module.

9. The electronic device according to claim 1, wherein, The support plate includes: a foldable portion configured to fold relative to the folding axis, and a first non-foldable portion and a second non-foldable portion spaced apart from each other, the foldable portion being located between the first non-foldable portion and the second non-foldable portion, and The angle between the extended surface of the first non-foldable portion and the extended surface of the second non-foldable portion is in the range of 120 degrees to 180 degrees.

10. A method for manufacturing a support plate, wherein, The method includes: A component to be processed is provided, wherein the component to be processed includes a top surface and a bottom surface facing each other, and the component to be processed is divided into a foldable portion and a non-foldable portion; In the first pressing process, a first opening pattern is formed in the foldable portion from the direction of the top surface of the component to be processed using a first pressing member; and In the second pressing process, a second opening pattern is formed in the foldable portion from the direction of the bottom surface of the component to be processed using a second pressing element. The first opening pattern includes a first opening extending from the top surface to the bottom surface through the component to be processed, and a plurality of preliminary support portions spaced apart from each other. The first opening is located between the plurality of preliminary support portions. Each of the plurality of preliminary support portions includes a curved edge on the top surface adjacent to the first opening.

11. The method according to claim 10, wherein, The second pressing process includes: patterning at least one of the plurality of preliminary support portions using the second pressing element.

12. The method according to claim 11, wherein, The second opening pattern includes a second opening extending from the top surface to the bottom surface through the member to be processed. The second pressing process forms the second opening in at least one of the plurality of preliminary support portions, and the second opening does not overlap with the first opening. The second pressing process includes: forming a first support portion adjacent to the second opening, wherein the first support portion includes a first curved edge located on one side of the top surface and a second curved edge located on one side of the bottom surface, the second curved edge facing the first curved edge in a diagonal direction.

13. The method according to claim 12, wherein, The first support portion includes a first flat top surface adjacent to the first curved edge and a first flat bottom surface adjacent to the second curved edge, and Each of the first flat top surface and the first flat bottom surface is inclined relative to the virtual extension surface, which is parallel to the surface of the component to be processed corresponding to the non-foldable portion.

14. The method of claim 10, wherein, The method further includes a reversal process that reverses the orientation of the top surface and the bottom surface of the component to be processed between the first pressing process and the second pressing process.

15. The method according to claim 10, wherein, The first pressing process forms a plurality of first openings in the foldable portion that do not overlap and are parallel to the first direction, and On a plane, the first width of each of the plurality of first openings in the first direction is greater than the second width of each of the plurality of first openings in a second direction perpendicular to the first direction.

16. The method according to claim 15, wherein, The first pressing process forms a plurality of first openings spaced apart by a first interval in each of a plurality of first pattern regions spaced apart from each other along the first direction.

17. The method according to claim 16, wherein, The first pressing process further includes at least one of the following: A process of forming a plurality of third openings spaced apart from each other by a second interval in the plurality of first pattern regions or in a second pattern region disposed between the plurality of first pattern regions; or A process for forming a plurality of fourth openings spaced apart from each other by a third interval, wherein each of the plurality of fourth openings passes through a portion of a first pattern region and a portion of a second pattern region that are adjacent to each other.

18. The method according to claim 16, wherein, The second pressing process includes forming a plurality of second openings spaced a fourth interval from each other, wherein each of the plurality of second openings passes through a portion of a first pattern region and a portion of a second pattern region that are adjacent to each other.

19. The method of claim 16, wherein, The second pressing process includes forming a plurality of fifth openings spaced apart from each other in the plurality of first pattern regions or in the second pattern regions located between the plurality of first pattern regions.

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