Temperature control apparatus for integrated circuit manufacturing and integrated circuit manufacturing system

Abstract

The application discloses a temperature control device and a system for integrated circuit manufacturing. The temperature control device comprises at least two circulating flow channels connected to a load to provide circulating liquid to the load; a semiconductor refrigerating sheet group for cooling or heating the circulating liquid in the circulating flow channels; a pump for pressurizing and conveying the circulating liquid; an information acquisition unit for acquiring physical quantity data of the circulating liquid; a control center for issuing adjustment instructions according to the physical quantity data and preset temperature values; a control valve group for connecting corresponding circulating flow channels to the load according to the adjustment instructions; and an adjustable direct-current power supply for controlling the working mode and output temperature of the semiconductor refrigerating sheet group according to the adjustment instructions.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of industrial production temperature control, in particular to a temperature control device for integrated circuit manufacturing and an integrated circuit manufacturing system. BACKGROUND

[0002] A wafer is a basic semiconductor material used to manufacture integrated circuits. In the manufacturing process of integrated circuits, especially in the etching process, the etching equipment releases a large amount of heat energy, causing the temperature at the wafer to rise sharply, and the temperature value can reach several hundred or even thousands of degrees Celsius. Higher temperature can affect the performance of the wafer and affect the yield of the wafer. If the original wafer in the integrated circuit has defects, then the final output integrated circuit will also have defects.

[0003] The integrated circuit manufacturing process includes multiple process steps, such as etching processes including inspection, cleaning, oil spraying, developing, oil sealing, etching, and quality inspection. Different process steps require different environmental temperatures, and the temperature in the operating environment needs to be controlled and adjusted during the etching process.

[0004] Therefore, in order to ensure that the integrated circuit manufacturing process is not affected by the heat generated by the load (such as the main process equipment for manufacturing integrated circuits) during operation, and to make the temperature at the load meet the required temperature environment in the process step, the temperature of the load in the integrated circuit manufacturing process needs to be controlled.

[0005] At present, the temperature control device is often connected with the load in the integrated circuit manufacturing process to adjust the temperature of the load in the integrated circuit manufacturing process. For example, a common temperature control device is a compression refrigeration machine, which relies on a compressor to increase the pressure of the refrigerant to realize a refrigeration cycle. SUMMARY

[0006] The present application discloses a temperature control device for integrated circuit manufacturing and an integrated circuit control system.

[0007] According to an aspect of the present application, a temperature control device for integrated circuit manufacturing is provided, comprising: at least two circulation channels connected to a load to provide circulating liquid to the load; a semiconductor cooling plate group comprising a first end, the first end being arranged in the circulation channels to cool or heat the circulating liquid in the circulation channels; a pump arranged in the circulation channels to pressurize and transport the circulating liquid; an information acquisition unit arranged in a circulation channel section between the semiconductor cooling plate group and the load to acquire physical quantity data of the circulating liquid; a control center receiving the acquired physical quantity data of the information acquisition unit and issuing adjustment instructions according to the physical quantity data and a preset temperature value; a control valve group arranged in the circulation channels to receive the adjustment instructions and connect corresponding circulation channels to the load according to the adjustment instructions; and an adjustable direct current power supply receiving the adjustment instructions and controlling the working mode and output temperature of the semiconductor cooling plate group according to the adjustment instructions.

[0008] According to some embodiments of the present application, the circulation channels comprise a first inlet and a first outlet, the circulation channels being connected to the load through the first inlet and the first outlet; the information acquisition unit comprises: a first temperature sensor acquiring a temperature value of the circulating liquid at the first inlet; a second temperature sensor acquiring a temperature value of the circulating liquid at the first outlet; and a flow sensor acquiring flow data of the circulating liquid.

[0009] According to some embodiments of the present application, the at least two circulation channels comprise a first circulation channel and a second circulation channel, and the control valve group comprises: at least four control valves, a first control valve, a second control valve, a third control valve, and a fourth control valve; the first control valve and the second control valve are arranged in the circulation channels on both sides of the load, and the first control valve and the second control valve are connected by a common circulation channel section of the first circulation channel and the second circulation channel; the third control valve is arranged in a circulation channel section between the semiconductor cooling plate group of the first circulation channel and the first outlet; and the fourth control valve is arranged in a circulation channel section between the semiconductor cooling plate group of the second circulation channel and the first outlet.

[0010] According to some embodiments of the present application, the control center issues a heating adjustment instruction when the temperature value of the circulating liquid at the first inlet is less than the preset temperature value, and issues a cooling adjustment instruction when the temperature value of the circulating liquid at the first inlet is greater than or equal to the preset temperature value; the adjustable direct current power supply adjusts the current direction of the semiconductor cooling plate group so that the first end of the semiconductor cooling plate group is in a heating mode according to the heating adjustment instruction; and the adjustable direct current power supply adjusts the current direction of the semiconductor cooling plate group so that the first end of the semiconductor cooling plate group is in a cooling mode according to the cooling adjustment instruction.

[0011] According to some embodiments of the present application, the output temperature of the semiconductor refrigeration fin group of the first circulation flow channel comprises a first output temperature range, and the output temperature of the semiconductor refrigeration fin group of the second circulation flow channel comprises a second output temperature range; wherein the first output temperature range is -10℃-40℃, and the second output temperature range is 41℃-80℃.

[0012] According to some embodiments of the present application, when the preset temperature value is in the first output temperature range, the control center sends a first adjustment instruction to control the control valve group to connect the first circulation flow channel to the load; and when the preset temperature value is in the second output temperature range, the control center sends a second adjustment instruction to control the control valve group to connect the second circulation flow channel to the load.

[0013] According to some embodiments of the present application, the temperature control device further comprises a cooling flow channel; and the semiconductor refrigeration fin group further comprises a second end, which is arranged in the cooling flow channel, wherein the cooling flow channel is used to cool the second end.

[0014] According to some embodiments of the present application, the temperature control device further comprises a liquid tank, which is arranged in the circulation flow channel and is used to store the circulating liquid.

[0015] According to some embodiments of the present application, the semiconductor refrigeration fin group further comprises a heat sink, which is used to dissipate heat for the semiconductor refrigeration fin group; and a heat exchanger, which exchanges heat with the circulating liquid.

[0016] According to another aspect of the present application, an integrated circuit manufacturing system is also provided, which comprises the temperature control device for integrated circuit manufacturing as described above.

[0017] The temperature control device for integrated circuit manufacturing provided by the present application can provide circulating liquid of corresponding temperature ranges for a load (such as a main process equipment of integrated circuit manufacturing) through a plurality of circulation flow channels. The control center controls the circulation flow channels of corresponding temperature ranges to connect to the load according to the temperature value of the circulating liquid required by the load, so as to realize the rapid switching of the circulating liquid temperature at the load. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0019] Figure 1 A structural schematic diagram of a temperature control device for integrated circuit manufacturing according to an example embodiment of the present application is shown.

[0020] MARKED FOR EXPLANATION:

[0021] Temperature control device 1; load 2;

[0022] First circulation flow channel 11; second circulation flow channel 12; semiconductor refrigeration fin group 13; first end 131; second end 133; heat sink 135; heat exchanger 137; pump 14; information acquisition unit 15; first temperature sensor 151; second temperature sensor 153; flow sensor 155; control center 16; adjustable direct current power supply 17; cooling flow channel 18; liquid tank 19;

[0023] First inlet in1; first outlet out1;

[0024] First control valve S1; second control valve S2; third control valve and S3; fourth control valve S4. DETAILED DESCRIPTION

[0025] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, however, can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the several views of the drawings, and description of the same elements will not be repeated.

[0026] The described features, structures, or characteristics can be combined in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the technology can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In these instances, well-known structures, methods, devices, implementations, materials, and so forth can not be described in detail.

[0027] In addition, the term "comprising" and "containing" are used herein to mean including at least the recited elements, but not excluding others. For example, processes, methods, articles, or apparatuses that "comprise" or "contain" an item are not to be construed as being limited to the corresponding item without additional recitation. For example, a process that comprises an element is not to be construed as being limited to the corresponding process without additional recitation.

[0028] The terms "first", "second", and the like, herein do not denote any order, quantity, combination, or important / primary / secondary / tertiary distinction, but are used to identify different objects and are used for the purpose of description and explanation in the specification.

[0029] With reference to the drawings of the embodiments of the present application, the technical solutions of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0030] An integrated circuit is a microstructure with required circuit functions by adopting a certain manufacturing process to interconnect transistors, resistors, capacitors, inductors and other components required in a circuit.

[0031] An integrated circuit manufacturing process is a means for realizing an integrated circuit. The integrated circuit manufacturing process includes processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation. Photolithography is an important process in integrated circuit manufacturing. Photolithography uses exposure and development to draw a combined pattern structure on a photoresist layer, and then transfers the pattern on the photomask to the carrier wafer of the integrated circuit through an etching process.

[0032] In the photolithography process, the etching equipment releases a large amount of heat energy. The release of a large amount of heat energy can cause the temperature of the load (such as the main process equipment for manufacturing integrated circuits) in the integrated circuit process to rise sharply, affecting the yield of the integrated circuit. Therefore, temperature control in the integrated circuit process is of great significance.

[0033] One of the commonly used temperature control devices in the prior art is a compression chiller. The compression chiller can control the temperature of the load in the integrated circuit process by refrigerant refrigeration.

[0034] However, the inventors have found that the temperature control of the load in the integrated circuit process by such a temperature control device has the following problems.

[0035] 1. The load in the integrated circuit process has different temperature requirements according to different process flows. The temperature adjustment of the conventional compression chiller needs to be gradually increased and decreased, and the temperature response is slow, and the adjustment temperature required by the load cannot be switched immediately.

[0036] 2. The compression chiller device has many components and occupies a large area.

[0037] 3. The compression chiller needs to use refrigerant during operation, and the noise during operation is large, which is not conducive to energy saving and environmental protection.

[0038] Therefore, the present application provides a temperature control device for integrated circuit process and an integrated circuit process system, which is used for rapid temperature control of the load (such as the main process equipment for manufacturing integrated circuits) in the integrated circuit process.

[0039] The technical solutions provided by the present application will be described in detail below with reference to the drawings of the specification.

[0040] Figure 1 Fig. 1 shows a schematic diagram of a temperature control device for integrated circuit manufacturing according to an example embodiment of the present application.

[0041] According to an example embodiment, the temperature control device 1 for integrated circuit manufacturing provided by the present application comprises at least two circulation channels connected to the load 2 to provide circulating liquid to the load 2.

[0042] For example, the load 2 is an etching device used in the photolithography process in the integrated circuit manufacturing, which releases a large amount of heat energy when in operation. Moreover, different process flows require different temperatures of the etching device. Therefore, the etching device needs to adjust the temperature when performing different process flows.

[0043] Optionally, the at least two circulation channels of the temperature control device 1 comprise a first circulation channel and a second circulation channel.

[0044] For example Figure 1 As shown, the temperature control device 1 comprises a first circulation channel 11 and a second circulation channel 12. The first circulation channel 11 and the second circulation channel 12 are connected to the load 2 respectively, and the first circulation channel 11 and the second circulation channel 12 provide circulating liquid to the load 2 to control the temperature at the load 2.

[0045] Optionally, the circulation channel comprises a first inlet in1 and a first outlet out1, and the circulation channel is connected to the load 2 through the first inlet in1 and the first outlet out1.

[0046] For example, referring to Figure 1 The first outlet out1 of the first circulation channel 11 is connected to one end of the load 2, and the first inlet in1 is connected to the other end of the load 2, so as to establish a closed circulation path between the first circulation channel 11 and the load 2.

[0047] The circulating liquid in the first circulation channel 11 flows out from the first outlet out1, enters the load 2, flows through the load 2 and reenters the first circulation channel 11 from the first inlet in1, forming a circulation of the circulating liquid.

[0048] According to an example embodiment, when the temperature control device 1 is in operation, the temperature of the circulating liquid in the first circulation channel 11 is lower than the temperature at the load 2. Therefore, according to the heat transfer principle, the circulating liquid in the first circulation channel 11 can absorb the heat at the load 2, so as to achieve the purpose of cooling the load 2.

[0049] Similarly, the second circulation flow channel 12 is connected with the load 2 through the first outlet out1 and the first inlet in1 on the second circulation flow channel 12, so that the circulating liquid of the second circulation flow channel 12 cools the load 2, and the specific principle and process are not described in detail here.

[0050] The temperature control device 1 provided in the present application includes at least two circulation flow channels, and the structures of the plurality of circulation flow channels are the same. Therefore, the structure of the temperature control device 1 will be described in detail below by taking the first circulation flow channel 11 as an example.

[0051] According to an example embodiment, the temperature control device 1 further includes a semiconductor refrigeration piece group 13, and the semiconductor refrigeration piece group 13 includes a first end 131, which is arranged on the circulation flow channel and cools or heats the circulating liquid in the circulation flow channel.

[0052] The semiconductor refrigeration piece group 13 is composed of a plurality of semiconductor refrigeration pieces stacked in series. The semiconductor refrigeration piece is also called a thermoelectric refrigeration piece, which is a kind of accessory with cooling / heating function composed of semiconductor materials.

[0053] The semiconductor refrigeration piece has the characteristic of current transduction type piece. When the semiconductor refrigeration piece is electrified, one end absorbs heat and the other end releases heat. Therefore, the semiconductor refrigeration piece can both cool and heat.

[0054] Since the semiconductor refrigeration piece group 13 is composed of a plurality of semiconductor refrigeration pieces stacked in series, the semiconductor refrigeration piece group 13 can both cool and heat its receptor.

[0055] For example Figure 1 As shown, the semiconductor refrigeration piece group 13 includes a first end 131 arranged on the first circulation flow channel 11. The physical properties of the semiconductor refrigeration piece make one end of the semiconductor refrigeration piece group 13 be the heat absorption end and the other end be the heat release end when the semiconductor refrigeration piece group 13 is electrified. Therefore, the first end 131 can be controlled to be the heat absorption end or the heat release end by controlling the direction of the current of the semiconductor refrigeration piece group 13.

[0056] When the first end 131 is the heat absorption end, the semiconductor refrigeration piece group 13 cools the circulating liquid in the first circulation flow channel 11.

[0057] When the first end 131 is the heat release end, the semiconductor refrigeration piece group 13 heats the circulating liquid in the first circulation flow channel 11.

[0058] Through the above embodiment, the temperature control equipment 1 adopts the semiconductor refrigeration fin group 13 as the temperature control source, and the semiconductor refrigeration fin group 13 has the characteristics of simple structure and small space occupation. Moreover, the semiconductor refrigeration fin group 13 does not need any refrigerant, has no mechanical transmission parts and sliding parts, and cannot produce pollution and noise. Therefore, compared with the traditional compressor refrigeration machine, the temperature control equipment 1 provided by the application has the characteristics of energy saving and environmental protection.

[0059] The thermal inertia of the semiconductor refrigeration fin group 13 is very small, and the refrigeration and heating time is very fast. In the case that the heat dissipation of the hot end is good and the cold end is empty, the refrigeration fin can reach the maximum temperature difference in less than one minute after power-on. In this way, the temperature adjustment rate of the temperature control equipment 1 provided by the application is fast, the working efficiency is improved, and the effect of saving energy is achieved.

[0060] Optionally, the semiconductor refrigeration fin group 13 further comprises a heat sink 135 for heat dissipation of the semiconductor refrigeration fin group 13.

[0061] Optionally, the semiconductor refrigeration fin group 13 further comprises a heat exchanger 137 for exchanging heat with the circulating liquid.

[0062] For example, referring to Figure 1 , the semiconductor refrigeration fin group 13 is provided with the heat sink 135 and the heat exchanger 137. The heat sink 135 is used for heat dissipation of the semiconductor refrigeration fin group 13.

[0063] The heat exchanger 137 is arranged at the first end 131, and exchanges heat between the semiconductor refrigeration fin first end 131 and the circulating liquid of the first circulating flow channel 11.

[0064] When the first end 131 is a heating end, the heat exchanger 137 transmits the heat of the first end 131 to the circulating liquid of the first circulating flow channel 11.

[0065] When the first end 131 is a cooling end, the heat exchanger 137 transmits the heat of the circulating liquid of the first circulating flow channel 11 to the first end 131.

[0066] Optionally, the temperature control equipment 1 further comprises a pump 14 arranged on the circulating flow channel and used for pressurizing and conveying the circulating liquid.

[0067] The pump 14 is a mechanical part for conveying fluid or pressurizing fluid. The pump 14 is used to transmit the mechanical energy of a prime mover or other external energy to the circulating liquid.

[0068] For example, referring to Figure 1 , the first circulating flow channel 11 is provided with the pump 14. The pump 14 is used for pressurizing the circulating liquid on the first circulating flow channel 11, so as to ensure the flow of the circulating liquid on the first circulating flow channel 11.

[0069] According to an example embodiment, the temperature control device 1 further comprises an information acquisition unit 15, which is arranged in the circulation flow path section between the semiconductor refrigeration fin group 13 and the load, and is configured to acquire physical quantity data of the circulating liquid.

[0070] For example, the physical quantity data of the circulating liquid can be temperature data and flow data of the circulating liquid. The working state of the temperature control device 1 and the speed of the circulating liquid flow can be known according to the temperature data and the flow data of the circulating liquid.

[0071] Optionally, the information acquisition unit 15 comprises a first temperature sensor 151 and a second temperature sensor 153. The first temperature sensor 151 acquires the temperature data of the circulating liquid at the first inlet in1, and the second temperature sensor 153 acquires the temperature data of the circulating liquid at the first outlet out1.

[0072] For example, referring to Figure 1 , the information acquisition unit 15 comprises a first temperature sensor 151, a second temperature sensor 153 and a flow sensor 155.

[0073] When the temperature control device 1 is in the working state, the circulating liquid of the first circulation flow path 11 enters the load 2 from the first outlet out1.

[0074] The circulating liquid of the first circulation flow path 11 flows through the load 2 and absorbs a certain amount of heat at the load 2 according to the heat transfer principle, and then flows into the first circulation flow path 11 again from the first inlet in1 of the first circulation flow path 11. The first temperature sensor 151 acquires the temperature value of the circulating liquid at the first inlet in1 of the first circulation flow path 11.

[0075] The circulating liquid flowing into the first circulation flow path 11 again from the first inlet in1 continues to circulate in the first circulation flow path 11 under the pressure control of the pump 14. When the circulating liquid flows through the semiconductor refrigeration fin group 13, the first end 131 of the semiconductor refrigeration fin group 13 cools the circulating liquid.

[0076] After the circulating liquid is cooled by the semiconductor refrigeration fin group 13, it continues to circulate in the first circulation flow path 11 under the pressure control of the pump 14, and enters the first position 101 of the load through the first outlet out1 of the first circulation flow path 11, thereby cooling the load. The second temperature sensor 153 acquires the temperature value of the circulating liquid at the first outlet out1.

[0077] According to an example embodiment, the information acquisition unit 15 further comprises a flow sensor 153, which acquires flow data of the circulating liquid.

[0078] For example, referring to Figure 1 , the flow sensor 153 is arranged in the adjacent area of the first outlet out1 of the first circulation flow path 11, and acquires the flow value of the circulating liquid in the first circulation flow path 11.

[0079] The information collection unit 15 sends the temperature value of the circulating liquid at the first inlet in1, the temperature value of the circulating liquid at the first outlet out1, and the flow value of the circulating liquid in the first circulating flow channel 11 to the control center 16 of the temperature control device 1.

[0080] According to an example embodiment, the temperature control device 1 further comprises a control center 16. The control center 16 receives the collected physical quantity data of the information collection unit 15. The control center 16 issues an adjustment instruction according to the physical quantity data and a preset temperature value.

[0081] For example, the physical quantity data comprises the temperature value of the first outlet out1, the temperature value of the first inlet in1, and the flow value of the circulating liquid in the first circulating flow channel 11. The preset temperature value is the temperature value of the circulating liquid required by the preset load 2.

[0082] Alternatively, the control center 16 determines that the temperature value of the circulating liquid at the first inlet in1 is less than the preset temperature value, and issues a heating adjustment instruction.

[0083] For example, the control center 16 receives the temperature value of the first inlet in1 and the preset temperature value. If the temperature value of the first inlet in1 is less than the preset temperature value, the control center 16 issues a heating adjustment instruction, so that the first end 131 of the semiconductor refrigeration sheet group 13 is in a heating state, and the circulating liquid in the first circulating flow channel 11 is heated.

[0084] The principle is that when the temperature control device 1 is in an idle state, the temperature of the circulating liquid in each circulating flow channel in the temperature control device 1 is the same as the indoor temperature. Therefore, when the temperature control device 1 is just in a working state, there is a certain temperature difference between the temperature value of the circulating liquid and the preset temperature value of the circulating liquid required by the load 2.

[0085] For example, in winter or in a cold season, the temperature of the circulating liquid is low. For example, the temperature of the first inlet in1 collected by the first temperature sensor 151 is 0℃, and the preset temperature value of the circulating liquid required by the load 2 is 30℃.

[0086] Therefore, when the temperature control device 1 is just in a working state, the temperature of the circulating liquid at the first inlet in1 is less than the preset temperature value. At this time, the circulating liquid needs to be heated to make the temperature value of the circulating liquid connected to the load 2 at the first outlet out1 reach the preset temperature value.

[0087] Alternatively, the control center 16 determines that the temperature value of the circulating liquid at the first inlet in1 is greater than or equal to the preset temperature value, and issues a cooling adjustment instruction.

[0088] For example, the control center 16 receives the temperature value of the first outlet out1, the temperature value of the first inlet in1, and the preset temperature value.

[0089] If the temperature value of the first inlet in1 is greater than the preset temperature value, the control center 16 sends a heating adjustment instruction, so that the first end 131 of the semiconductor refrigeration fin group 13 is in a cooling state, and the circulating liquid of the first circulating flow channel 11 is cooled.

[0090] The principle is that the temperature value of the first inlet in1 is greater than the preset temperature value, that is, the temperature control device 1 is in a normal working state. The circulating liquid connected to the load 2 from the first outlet out1 absorbs heat at the load 2, so that the temperature of the circulating liquid rises. Therefore, the circulating liquid entering the first circulating flow channel 11 from the first inlet in1 needs to be cooled, so that the temperature value of the circulating liquid connected to the load 2 at the first outlet out1 is reduced to the preset temperature value.

[0091] According to an example embodiment, the control center 16 compares the first outlet out1 with the preset temperature value detected by the second temperature sensor 153 to verify whether the actual circulating liquid temperature of the first outlet out1 reaches the preset temperature value.

[0092] According to an example embodiment, the control center 16 controls the pump pressure of the pump 14 according to the actual flow value of the circulating liquid, so as to ensure that the pump 14 outputs circulating liquid with a stable flow value.

[0093] For example, the flow value of the circulating liquid of the first circulating flow channel 11 is 15LPM-20LPM.

[0094] Through the above embodiment, the control center 16 selects the corresponding working mode (heating mode or cooling mode) of the first end 131 of the semiconductor refrigeration fin group 13 according to the physical quantity data of the circulating flow channel collected by the information acquisition unit 15, and adaptively completes the heating or cooling of the circulating liquid.

[0095] According to an example embodiment, the temperature control device 1 further comprises an adjustable direct current power supply 17. The adjustable direct current power supply 17 receives an adjustment instruction and controls the working mode and output temperature of the semiconductor refrigeration fin group 13 according to the adjustment instruction.

[0096] The adjustable direct current power supply 17 adjusts the current direction of the semiconductor refrigeration fin group 13 according to the heating adjustment instruction, so that the first end 131 of the semiconductor refrigeration fin group 13 is in a heating mode.

[0097] For example, the control center 16 calculates an adjustment value according to the temperature value of the first inlet in1 and the preset temperature value. The control center 16 sends a heating adjustment instruction to the adjustable direct current power supply 17 according to the adjustment value. The adjustable direct current power supply 17 adjusts the voltage value of the adjustable direct current power supply 17 according to the heating adjustment instruction to adjust the heating amount, so that the actual temperature value at the first outlet out1 is consistent with the preset temperature value.

[0098] And, the adjustable DC power supply 17 adjusts the current direction of the semiconductor cooling fin group 13 according to the refrigeration adjustment instruction, so that the first end 131 of the semiconductor cooling fin group 13 is in the heating mode.

[0099] For example, the control center 16 calculates the adjustment value according to the temperature value of the first inlet in1 and the preset temperature value. The control center 16 sends the refrigeration adjustment instruction to the adjustable DC power supply 17 according to the adjustment value. The adjustable DC power supply 17 adjusts the voltage value of the adjustable DC power supply 17 according to the refrigeration adjustment instruction to adjust the refrigeration capacity, so that the actual temperature value at the first outlet out1 and the preset temperature value are consistent.

[0100] According to the example embodiment, the adjustable DC power supply 17 also controls the output temperature of the semiconductor cooling fin group 13 according to the refrigeration adjustment instruction / heat adjustment instruction.

[0101] Optionally, the output temperature of the semiconductor cooling fin group 13 of the first circulating flow channel 11 includes a first output temperature interval, and the first output temperature interval is -10℃-40℃.

[0102] The output temperature of the semiconductor cooling fin group 13 of the second circulating flow channel 12 includes a second output temperature interval, and the second output temperature interval is 41℃-80℃.

[0103] For example, the adjustable DC power supply 17 controls the heating capacity and the refrigeration capacity of the semiconductor cooling fin group 13, so that the first circulating flow channel 11 can output circulating liquid with a temperature of -10℃-40℃, and the second circulating flow channel 12 can output circulating liquid with a temperature of 41℃-80℃.

[0104] Through the above embodiment, the adjustable DC power supply 17 controls the output temperature of the semiconductor cooling fin group 13 according to the refrigeration adjustment instruction / heat adjustment instruction. So that the circulating flow channel can output the temperature value in the preset temperature interval, and meet the temperature demand of the integrated circuit process.

[0105] Optionally, the temperature control device 1 further comprises a control valve group, which is arranged in the circulating flow channel and receives the adjustment instruction, and connects the corresponding circulating flow channel to the load 2 according to the adjustment instruction.

[0106] For example, the temperature control device 1 determines the temperature interval where the temperature demand is located according to the actual temperature demand required by the load 2, so as to select the first circulating flow channel 11 to be connected to the load 2 to provide circulating liquid with a temperature value in the first output temperature interval. Or select the second circulating flow channel 12 to be connected to the load 2 to provide circulating liquid with a temperature value in the second output temperature interval.

[0107] Optionally, the control valve group includes at least four control valves, i.e., a first control valve S1, a second control valve S2, a third control valve S3, and a fourth control valve S4.

[0108] For example, referring to Figure 1 The first control valve S1, the second control valve S2, the third control valve S3 and the fourth control valve S4 constitute a control valve group of the temperature control device 1.

[0109] According to an example embodiment, the first control valve S1 and the second control valve S2 are respectively arranged on the circulating flow channels on both sides of the load 2. And the first control valve S1 and the second control valve S2 are common circulating flow channel sections of the first circulating flow channel 11 and the second circulating flow channel 12.

[0110] The third control valve S3 is arranged on the circulating flow channel section between the semiconductor refrigeration fin group 13 of the first circulating flow channel 11 and the first outlet out1.

[0111] The fourth control valve S4 is arranged on the circulating flow channel section between the semiconductor refrigeration fin group 13 of the second circulating flow channel 12 and the first outlet out1.

[0112] According to an example embodiment, the control valve is an electromagnetic three-way valve. The three-way valve refers to a valve device with three ports, one inlet and two outlets. The electromagnetic three-way valve is an automatic component that can control the flow of fluid by electromagnetic control.

[0113] The electromagnetic three-way valve can control the opening and closing of the three-port valve according to the circuit instructions, and control the flow path of the fluid.

[0114] For example, referring to Figure 1 The first control valve S1, the second control valve S2, the third control valve S3 and the fourth control valve S4 are all electromagnetic three-way valves.

[0115] The electromagnetic three-way valve includes three ports. In the electromagnetic three-way valve in Figure 1 The symbol A represents the first port, the symbol B represents the second port, and the symbol C represents the third port.

[0116] Optionally, the control center 16 issues a regulation instruction according to the physical quantity data collected by the information acquisition unit 15 and the preset temperature value. When the preset temperature value is in the first output temperature interval, the control center 16 issues a first regulation instruction, and the control center 16 connects the first circulating flow channel 11 to the load 2 through the control valve group.

[0117] For example, the first control valve S1, the second control valve S2, the third control valve S3 and the fourth control valve S4 all receive the first regulation instruction of the control center 16.

[0118] When the control valve group receives the first adjustment instruction from the control center 16, the third control valve S3 opens port A, closes port B, and opens port C, the first control valve S1 opens port A, closes port B, and opens port C, the second control valve S2 opens port A, opens port B, and closes port C, and the fourth control valve S4 opens port A, opens port B, and closes port C.

[0119] At this time, the circulation path of the first circulation flow channel 11 is: the circulating liquid flows through the semiconductor assembly 13 of the first circulation flow channel 11, the pump 14, the second temperature sensor 153, the flow sensor 155, the first outlet out1, the load 2, the first inlet in1, the first temperature sensor 151, the liquid tank 19, and the semiconductor assembly 13.

[0120] The circulation path of the second circulation flow channel 12 is: the circulating liquid flows through the semiconductor assembly 13 of the second circulation flow channel 12, the pump 14, the second temperature sensor 153, the flow sensor 155, the first temperature sensor 151, the liquid tank 19, and the semiconductor assembly 13. The second circulation flow channel 12 is not connected to the load 2.

[0121] Therefore, according to the first adjustment instruction, the control valve group controls the opening / closure of the ports in the first control valve S1, the second control valve S2, the third control valve S3, and the fourth control valve S4, so that the first circulation flow channel 11 flows through the load 2, and the second circulation flow channel 12 does not flow through the load 2. Thus, the purpose of connecting the first circulation flow channel 11 to the load 2 is achieved.

[0122] Alternatively, the control center 16 issues an adjustment instruction according to the physical quantity data collected by the information collection unit 15 and the preset temperature value. When the preset temperature value is in the second output temperature interval, the control center 16 issues a second adjustment instruction, and the control center 16 connects the second circulation flow channel 12 to the load 2 through the control valve group.

[0123] For example, the first control valve S1, the second control valve S2, the third control valve S3, and the fourth control valve S4 all receive the second adjustment instruction from the control center 16.

[0124] When the control valve group receives the second adjustment instruction from the control center 16, the third control valve S3 opens port A, opens port B, and closes port C, the first control valve S1 closes port A, opens port B, and opens port C, the second control valve S2 opens port A, closes port B, and opens port C, and the fourth control valve S4 opens port A, closes port B, and opens port C.

[0125] At this time, the circulation path of the first circulation flow channel 11 is: the circulating liquid flows through the semiconductor assembly 13 of the first circulation flow channel 11, the pump 14, the second temperature sensor 153, the flow sensor 155, the first temperature sensor 151, the liquid tank 19, and the semiconductor assembly 13. The first circulation flow channel 11 is not connected to the load 2.

[0126] The circulation path of the second circulation flow channel 12 is: the circulating liquid flows through the semiconductor assembly 13 of the second circulation flow channel 12, the pump 14, the second temperature sensor 153, the flow sensor 155, the first outlet out1, the load 2, the first inlet in1, the first temperature sensor 151, the liquid tank 19, and the semiconductor assembly 13.

[0127] Therefore, according to the second adjustment instruction, the control valve group controls the opening / closing of the ports of the first control valve S1, the second control valve S2, the third control valve S3, and the fourth control valve S4, so that the second circulation flow channel 12 flows through the load 2, and the first circulation flow channel 11 does not flow through the load 2. Thus, the purpose of connecting the second circulation flow channel 11 to the load 2 is achieved.

[0128] Through the above embodiment, according to the adjustment instruction of the control center 16, the control valve group selects the circulation flow channel corresponding to the temperature interval of the preset temperature value to connect the circulation flow channel to the load 2.

[0129] When the first circulation flow channel 11 is connected to the load 2, the second circulation flow channel 12 is not connected to the load 2, but the second circulation flow channel 12 is still in the working mode, and the temperature of the circulating liquid of the second circulation flow channel 12 is still in the second output temperature interval.

[0130] When the second circulation flow channel 12 is connected to the load 2, the first circulation flow channel 11 is not connected to the load 2, but the first circulation flow channel 11 is still in the working mode, and the temperature of the circulating liquid of the first circulation flow channel 11 is still in the first output temperature interval.

[0131] Therefore, when the control center 16 issues an adjustment instruction according to a preset temperature value, the control valve group connects the circulation flow channel corresponding to the preset temperature value to the load 2 according to the adjustment instruction (the first adjustment instruction / the second adjustment instruction).

[0132] No matter whether the first circulation flow channel 11 and the second circulation flow channel 12 are connected to the load 2 or not, the output temperature is in the output temperature interval. Therefore, when the flow channel switching of the first circulation flow channel 11 and the second circulation flow channel 12 is performed, the circulating liquid of the corresponding temperature can be provided instantaneously, so that the temperature value of the circulating liquid at the load 2 can be adjusted quickly to meet the working requirements at the load.

[0133] Optionally, the temperature control device 1 further comprises a cooling flow channel 18. The semiconductor refrigeration sheet group 13 further comprises a second end 133, and the second end 133 is arranged in the cooling flow channel 18, and the cooling flow channel 18 is used to cool the second end 133.

[0134] For example, referring to Figure 1 The temperature control device 1 further comprises a cooling flow channel 18. When the first end 131 of the semiconductor refrigeration sheet group 13 is the heat absorption end, the corresponding second end 133 is the heat dissipation end.

[0135] Therefore, the second end 133 is arranged on the cooling flow channel 18, and the cooling flow channel 18 is arranged with a cooling liquid to cool the second end 133. In this way, the performance of the semiconductor refrigeration sheet group 13 can be prevented from being damaged due to the excessively high temperature when the second end 133 is used as the heat dissipation end, thereby protecting the semiconductor refrigeration sheet group 13.

[0136] Generally, water can be selected as the cooling liquid, and the cooling flow channel 18 is connected to the factory water system to provide stable cooling liquid for the second end 133.

[0137] Optionally, the temperature control device 1 further comprises a liquid tank 19 arranged in the circulation flow channel and used to store the circulating liquid.

[0138] For example, referring to Figure 1 The first circulation flow channel 11 is arranged with the liquid tank 19. After the circulating liquid in the first circulation flow channel 11 enters the first inlet in1 again, the circulating liquid enters the liquid tank 19.

[0139] The liquid tank 19 is used to store the circulating liquid, so that the first circulation flow channel 11 has sufficient circulating liquid for circulation.

[0140] According to another aspect of the present application, an integrated circuit process system is provided. The integrated circuit process system comprises the temperature control device for integrated circuit process as described above.

[0141] Through the above embodiment, the integrated circuit process device provided by the present application uses the semiconductor refrigeration sheet group 13 as a temperature control source to heat or cool the circulating liquid in the circulation flow channel. The control center 16 controls the corresponding circulation flow channel to be connected to the load 2 according to the temperature requirement of the load 2, so as to realize rapid switching of the temperature of the circulating liquid at the load 2, thereby realizing rapid temperature adjustment at the load 2.

[0142] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature control device for integrated circuit manufacturing processes, characterized in that, The application relates to a semiconductor refrigeration system, comprising: at least two circulating flow channels connected to a load to provide circulating liquid to the load; a semiconductor refrigeration plate group comprising a first end arranged in the circulating flow channel to cool or heat the circulating liquid in the circulating flow channel; a pump arranged in the circulating flow channel to pressurize and transport the circulating liquid; an information acquisition unit arranged in a circulating flow channel section between the semiconductor refrigeration plate group and the load to acquire physical quantity data of the circulating liquid; a control center receiving the physical quantity data acquired by the information acquisition unit and issuing an adjustment instruction according to the physical quantity data and a preset temperature value; a control valve group arranged in the circulating flow channel to receive the adjustment instruction and connect corresponding circulating flow channels to the load according to the adjustment instruction; an adjustable direct-current power supply receiving the adjustment instruction and controlling the working mode and output temperature of the semiconductor refrigeration plate group according to the adjustment instruction; the at least two circulating flow channels comprise a first circulating flow channel and a second circulating flow channel, and the control valve group comprises: at least four control valves, namely a first control valve, a second control valve, a third control valve and a fourth control valve; the first control valve and the second control valve are arranged in the circulating flow channels on both sides of the load, and a common circulating flow channel section of the first circulating flow channel and the second circulating flow channel is arranged between the first control valve and the second control valve; the third control valve is arranged in a circulating flow channel section between the semiconductor refrigeration plate group and the first outlet of the first circulating flow channel; the fourth control valve is arranged in a circulating flow channel section between the semiconductor refrigeration plate group and the first outlet of the second circulating flow channel; the output temperature of the semiconductor refrigeration plate group of the first circulating flow channel comprises a first output temperature interval, and the output temperature of the semiconductor refrigeration plate group of the second circulating flow channel comprises a second output temperature interval; when the first circulating flow channel is connected to the load, the second circulating flow channel is not connected to the load, but the second circulating flow channel is still in the working mode, and the temperature of the circulating liquid of the second circulating flow channel is still in the second output temperature interval; when the second circulating flow channel is connected to the load, the first circulating flow channel is not connected to the load, but the first circulating flow channel is still in the working mode, and the temperature of the circulating liquid of the first circulating flow channel is still in the first output temperature interval.

2. The temperature-controlled device of claim 1, wherein, the circulating flow channel comprises a first inlet and a first outlet, and the circulating flow channel is connected to the load through the first inlet and the first outlet; the information acquisition unit comprises: a first temperature sensor acquiring the temperature value of the circulating liquid at the first inlet; a second temperature sensor acquiring the temperature value of the circulating liquid at the first outlet; a flow sensor acquiring the flow data of the circulating liquid.

3. Temperature control apparatus according to claim 2, characterised in that the control center issues a heating adjustment instruction when the temperature value of the circulating liquid at the first inlet is less than the preset temperature value, and issues a refrigeration adjustment instruction when the temperature value of the circulating liquid at the first inlet is greater than or equal to the preset temperature value. The adjustable direct current power supply adjusts the current direction of the semiconductor refrigeration fin group according to the heating regulation instruction, so that the first end of the semiconductor refrigeration fin group is in a heating mode. The adjustable direct current power supply adjusts the current direction of the semiconductor refrigeration fin group according to the cooling regulation instruction, so that the first end of the semiconductor refrigeration fin group is in a cooling mode.

4. Temperature control apparatus according to claim 3, characterised in that The first output temperature interval is -10℃~40℃, and the second output temperature interval is 41℃~80℃.

5. Temperature control apparatus according to claim 4, characterised in that The preset temperature value is in the first output temperature interval, and the control center sends a first regulation instruction to control the control valve group to connect the first circulating flow channel to the load. The preset temperature value is in the second output temperature interval, and the control center sends a second regulation instruction to control the control valve group to connect the second circulating flow channel to the load.

6. The temperature-controlled device of claim 1, wherein, Further comprising: a cooling flow channel; The semiconductor refrigeration fin group further comprises a second end, and the second end is arranged in the cooling flow channel, wherein the cooling flow channel is used to cool the second end.

7. The temperature-controlled device of claim 1, wherein, Further comprising: a liquid tank arranged in the circulating flow channel and used to store the circulating liquid.

8. The temperature-controlled device of claim 1, wherein, The semiconductor refrigeration fin group further comprises: a heat sink for dissipating heat of the semiconductor refrigeration fin group; a heat exchanger for exchanging heat with the circulating liquid.

9. An integrated circuit manufacturing system, comprising: The temperature control device for integrated circuit process comprises any one of the temperature control devices according to claims 1~8.

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