A sintering fixture for multi-bar packaged semiconductor laser array

Abstract

The present invention relates to the field of semiconductor laser technology, and specifically discloses a sintering fixture for a multi-bar packaged semiconductor laser array. The sintering fixture comprises: a mounting base, a fixing seat, a slope, an edge positioning member, a cover plate, a vertical gravity member, and an inclined surface gravity member. Wherein: slope members are symmetrically fixed on the left and right sides of the upper surface of the fixing seat, and edge positioning members are fixed on the front and rear sides of the upper surface of the fixing seat, and the slope members and the edge positioning members surround to form a bar setting area. The cover plate is arranged above the slope member and the edge positioning member, and the lower end face of the vertical gravity member passes through the cover plate vertically and is pressed on the bar setting area. The inclined surface gravity member is placed on the inclined surface of the slope member, and the inner side face of the inclined surface gravity member is pressed against one end of the bar array under the action of its own weight. The sintering fixture of the present invention can ensure that the heat conduction path of each bar is equal, thereby ensuring the consistency of sintering quality.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, and in particular to a sintering fixture for a multi-bar packaged semiconductor laser array. Background Art

[0002] The information disclosed in the background of the invention is only intended to enhance understanding of the overall background of the invention and should not necessarily be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art.

[0003] Semiconductor lasers are widely used in laser radar, material modification, laser processing, solid-state laser pumping, military research and other fields due to their advantages of high energy density, high power density, high directivity and easy long-distance transmission. With the expansion and development of application fields, the output power requirements of semiconductor lasers are getting higher and higher. The packaging quality of the laser is the main factor affecting the development of the module. The welding between the laser and the heat sink is required to be firm, free of voids, with good thermal conductivity and high consistency.

[0004] At present, semiconductor laser packaging generally adopts a separate sintering process. First, the semiconductor laser bar and the heat sink are stacked and packaged into a bar array using hard solder. Then, the bar array is sintered with the module heat sink, electrodes, etc. using low-temperature solder. Among them, the packaging quality of the bar array is a key step that affects the product qualification rate. Summary of the Invention

[0005] The present invention provides a sintering fixture for a multi-bar packaged semiconductor laser array. The sintering fixture can ensure that the heat conduction path of each bar is equal, thereby ensuring consistent sintering quality. To achieve the above objectives, the present invention discloses the following technical solutions.

[0006] A sintering fixture for a multi-bar packaged semiconductor laser array comprises: a mounting base, a fixing base, a slope, an edge positioning member, a cover plate, a vertical gravity member, and an inclined surface gravity member. The fixing base is placed obliquely on the mounting base. Slopes are symmetrically fixed to the left and right sides of the upper surface of the fixing base, and edge positioning members are fixed to the front and rear sides of the upper surface of the fixing base. The slopes and edge positioning members surround and form a bar setting area. The cover plate is placed above the slope and edge positioning member, and the lower end face of the vertical gravity member passes vertically through the cover plate and presses on the bar setting area. The inclined surface gravity member is placed on the inclined surface of the slope member, and the inner side of the inclined surface gravity member contacts the outer side of the bar array located in the bar setting area under the action of its own weight.

[0007] Furthermore, the width of the lower end surface of the vertical weight member is not greater than the width of the bar setting area. Preferably, the widths of the two are the same. The vertical weight member can press the heat sink located in the bar setting area into the setting area to ensure that the horizontality of the heat sink array remains consistent.

[0008] Furthermore, the mounting base has an inclined right-angled triangular groove, the front side of the triangular groove is open, and the right-angled triangular groove is inclined backward. The fixing seat is placed obliquely in the triangular groove.

[0009] Furthermore, the slope member includes any one of a right-angled triangle block and a right-angled trapezoidal block. Wherein: the inclined surface gravity member is placed on the inclined surface of the slope member.

[0010] Furthermore, a positioning groove is provided on the inclined surface of the ramp member, and the ramp member is fixed on the fixing seat by a positioning member in the positioning groove.

[0011] Furthermore, the cover plate is supported above the slope member and the edge positioning member by a support, wherein the lower end of the support is fixed on a fixing seat, and the cover plate is detachably fixed on the support.

[0012] Furthermore, the cover plate is provided with a through hole, and the lower end of the vertical gravity member passes through the through hole and enters the bottom of the cover plate.

[0013] Furthermore, the cover plate is detachably fixed to the upper end surface of the pillar by means of components such as bolts or screws.

[0014] Furthermore, the side positioning member is detachably fixed to the fixing seat by means of components such as bolts or screws, so as to facilitate the positioning and installation of the side positioning member.

[0015] Furthermore, the fixing base has a limit platform at each of the four corners of its upper surface, with limit slots formed between adjacent limit platforms. The two ramps are respectively limited in the limit slots on the left and right sides of the fixing base; and the two side positioning members are respectively limited in the limit slots on the front and rear sides of the fixing base, to better ensure the installation accuracy of the ramps and side positioning members.

[0016] Furthermore, the inclined gravity member comprises any one of a triangular block and a right-angled trapezoidal block, one side of which is in close contact with the inclined surface of the ramp member, and the other side of which is in close contact with the heat sink array in the bar setting area.

[0017] Furthermore, the slope angle of the ramp member is preferably controlled between 10 and 80 degrees. If the angle is too small, the automatic sliding of the ramp gravity member is not easy. If the angle is too large, the horizontal thrust on the heat sink array is too small, and when the solder melts, it will cause a cavity between the bar and the heat sink.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] Currently, the packaging of bar arrays is often done by arranging them on an inclined fixture and then sintering them as a whole. However, the present inventors have discovered that due to the different heat conduction paths in each array, the solder melting time varies at different locations. Furthermore, when there are a large number of bars, the bar cavity surfaces may not be in the same plane. These factors affect the sintering quality and, consequently, the packaging quality of the bar array. To overcome these issues, the present inventors have implemented the following measures:

[0020] (1) The present invention places the fixing seat on the mounting base for fixture assembly. The fixing seat is placed in a right-angled triangular groove of the mounting base. The side and bottom surfaces of the fixing seat are respectively in close contact with the side walls and bottom surfaces of the triangular groove, thereby tilting the fixing seat in two directions: rightward and upward, and backward. Through the action of gravity, the rightward and upward tilt can ensure horizontal consistency when the bar, welding piece, and tungsten copper heat sink are periodically arranged and assembled into an array. The backward tilt can ensure alignment of one end of the array.

[0021] (2) The vertical weight blocks ensure that the heat sink array is level, avoiding bending of the array caused by horizontal forces. At the same time, the inclined weights ensure that the heat sink array is evenly stressed on both sides, and the heat capacity is symmetrically distributed on both sides, which helps to improve the consistency of sintering quality.

[0022] (3) The sintering fixture of the present invention allows the heat sink array to be placed horizontally on the fixture. The distance between each array and the hot plate is equal, and the surrounding contact parts are symmetrically distributed, ensuring that the heat conduction path of each bar is equal and the surrounding heat field is symmetrically distributed. This avoids the problem of different solder melting times at different positions due to different heat conduction paths of each array, ensures the consistency of sintering quality, and improves the overall reliability of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0024] Figure 1 4 is a cross-sectional view of a sintering fixture for a multi-bar packaged semiconductor laser array in an embodiment.

[0025] Figure 2 Schematic diagram of the structure of the multi-bar packaged semiconductor laser array sintering fixture in the embodiment.

[0026] Figure 3 Schematic diagram of the structure of the ramp in the embodiment.

[0027] Figure 4Schematic diagram of the structure of the fixing seat in the embodiment.

[0028] Figure 5 Schematic diagram of the structure of the installation base in the embodiment.

[0029] The numbers in the figure represent: 1-fixed seat, 2-slope part, 3-side positioning part, 4-cover plate, 5-vertical gravity part, 6-inclined gravity part, 7-mounting base, 8-triangular groove, 801-inclined inner wall, 802-inclined bottom surface, 9-positioning groove, 10-pillar, 11-positioning part, 12-limiting platform, 13-limiting slot, 14-heat sink array. DETAILED DESCRIPTION

[0030] It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used in the present invention have the same meaning as commonly understood by those skilled in the art to which the present invention belongs.

[0031] For ease of description, the words "upper," "lower," "left," and "right" appearing in this disclosure merely indicate the same orientation as in the accompanying drawings and do not limit the structure. These are intended solely to facilitate and simplify the description of the present invention and do not indicate or imply that the device or component referred to requires a specific orientation, construction, or operation. Therefore, they should not be construed as limiting the present invention. The present invention will now be further described with reference to the accompanying drawings and specific embodiments.

[0032] A multi-bar packaged semiconductor laser array sintering fixture mainly includes: a fixing seat 1, a slope member 2, a side positioning member 3, a cover plate 4, a vertical gravity member 5 and an inclined gravity member 6. Among them:

[0033] by Figure 1For example, the figure illustrates the sintering fixture of this embodiment, which has been assembled and is ready for sintering. At this point, the fixed base 1 is a horizontally positioned rectangular plate. The ramp member 2 is a right-angled triangular block, symmetrically positioned on the left and right sides of the upper surface of the fixed base 1. The inclined surfaces of the ramp members 2 face inwardly of the fixed base 1, facilitating the sliding of the inclined weight member 6 toward the inner side of the fixed base 1. Alternatively, the ramp member 2 can be a right-angled trapezoidal block. The difference between the ramp member 2 and the right-angled triangular block is that there is a flat surface between the inclined surface and the bottom surface. In the right-angled triangular block, the bottom surface and the inclined surface of the ramp member 2 are in direct contact, and the flat surface further helps to strengthen the constraint of the ramp member 2 on the heat sink array 14. The inclination angle of the ramp member 2 should not be too large or too small. A too small angle would hinder the automatic downward movement of the inclined weight member 6. A too large angle would reduce the horizontal thrust of the heat sink array 14, resulting in voids between the solder strip and the heat sink when it melts. Therefore, the inclination angle can be controlled between 10 and 80°, such as 10°, 18°, 20°, 25°, 30°, 35°, 40°, 44°, 50°, 56°, 60°, 62°, 70°, 75°, 80°, etc., and can be selected according to needs.

[0034] refer to Figure 1 and Figure 2 ,in, Figure 2 The sintering fixture of this embodiment is shown after assembly but before removal from the mounting base 7. In this state, edge locators 3 are fixed to the front and rear sides of the upper surface of the mounting base 1. These edge locators 3 are rectangular blocks fastened to the upper surface of the mounting base 1 by bolts, facilitating removal and installation. The two ramps 2 and the two edge locators 3 together form a square bar mounting area. The heat sink array 14 is located within this bar mounting area.

[0035] The cover plate 4 is supported above the slope member 2 and the edge positioning member 3 by four pillars 10. The lower ends of the pillars 10 are threadedly fixed to the four corners of the upper surface of the fixing seat 1, and the cover plate 4 is detachably fixed to the upper end surface of the pillars 10 by means of components such as bolts or screws. A square through-hole is provided on the cover plate 4, and the vertical gravity member 5 is a rectangular block, the lower end of which passes through the through-hole 11 and enters the bottom of the cover plate 4. The cover plate 4 can play a role in positioning and restraining the vertical gravity member 5, ensuring that the vertical gravity member 5 can be vertical to the upper surface of the fixing seat 1, so as to facilitate the positioning of the heat sink array 14 located in the bar setting area, ensure that the heat sink array is horizontal, avoid bending caused by the array being too long, and help improve the consistency of the sintering quality. Therefore, it should be understood that the vertical gravity member 5 can also be a cylindrical, elliptical, trapezoidal or other structure, and its lower end surface should be guaranteed to be flat.

[0036] The inclined weight member 6 is a right-angled trapezoidal block placed on the inclined surface of the ramp member 2. The bottom surface of the inclined weight member 6 is in close contact with the inclined surface of the ramp member 2. When a heat sink array 14 is installed in the bar installation area, the lower plane of the inclined edge of the inclined weight member 6, under the action of its own gravity, closely contacts one end of the heat sink array 14, so that the left and right ends of the bar array are subjected to equal force. When the heat sink array 14 is installed in the bar installation area, the lower portion of the inclined edge of the inclined weight member 6 contacts the heat sink array 14, exerting a strong force on the left and right sides of the heat sink array 14. When the solder melts, this force squeezes the array, evenly distributing the solder and reducing the voids between the bar and the heat sink. Due to the left and right forces, when the array is too long, a bulge will appear in the middle, causing the array to bend. The vertical weight member 5 ensures that the level of the heat sink array 14 remains consistent, ensuring sintering quality.

[0037] In addition, the inclined plane gravity member 6 can also be a triangular block, such as a right-angled triangle block, a non-right-angled triangle block, etc., which has a similar function to the right-angled trapezoidal block-shaped inclined plane gravity member 6 in this embodiment.

[0038] The sintering fixture of this embodiment makes the components in contact with the heat sink array 14 symmetrically distributed, ensuring that the heat conduction path of each bar is equal, avoiding the problem of different solder melting times at different positions due to different heat conduction paths in each array, and helping to ensure the consistency of sintering quality.

[0039] refer to Figure 1 and Figure 3 In another embodiment, a positioning groove 9 is provided on the inclined surface of the ramp member 2. The bottom surface of the positioning groove 9 has a positioning hole. A positioning member 11 (such as a bolt or screw) is inserted through the positioning hole to removably secure the ramp member 2 to the fixing base 1. At the same time, because the positioning member 11 is hidden in the positioning groove 9, it avoids affecting the inclined surface weight member 6 on the inclined surface of the ramp member 2. In addition, this positioning ensures the installation accuracy of the ramp member 2 and prevents the ramp member 2 from shifting during the installation of other components or the transportation of the sintering fixture, which could affect the sintering quality of the heat sink array 14.

[0040] refer to Figure 1 、 Figure 2 and Figure 4In another embodiment, the top surface of the fixing base 1 includes a square-shaped stopper 12 at each corner. Stopper slots 13 are formed between adjacent stoppers 12, forming four total stopper slots. Each stopper slot 13 is provided with a screw hole. The ramp members 2 and side locators 3 are removably secured in the stopper slots 13 using screws or bolts. The two ramp members 2 are respectively retained in the stopper slots 13 on the left and right sides of the fixing base 1; the two side locators 3 are respectively retained in the stopper slots 13 on the front and rear sides of the fixing base 1. Together, the two ramp members 2 and the two side locators 3 form a square bar installation area. The stopper slots 13 formed by the stopper 12 ensure precise installation of the ramp members 2 and side locators 3, improving installation efficiency. This design also ensures a symmetrical distribution of contacting components around the heat sink array 14, ensuring an equal heat conduction path for each bar, which helps improve sintering quality consistency. It should be noted that the lower end of the support 10 is in the shape of a screw, which is threadedly fixedly connected to a screw hole on the upper surface of the limit platform 12. Other methods can also be used to detachably fix the lower end of the support 10 to the limit platform 12, such as inserting the lower end of the support 10 into a socket on the limit platform 12.

[0041] refer to Figure 2 and Figure 5 In another embodiment, the multi-bar packaged semiconductor laser array sintering fixture further includes a mounting base 7 having an inclined right-angled triangular groove 8 on the mounting base 7. The front side of the right-angled triangular groove 8 is open and inclined backward. The fixing base 1 is placed obliquely in the right-angled triangular groove 8, and the left wall of the fixing base 1 is in parallel contact with the inclined inner wall 801 on the left side of the triangular groove 8, the bottom surface of the fixing base 1 is in parallel contact with the inclined bottom surface 802 of the triangular groove 8, and the rear wall of the fixing base 1 is in parallel contact with the rear wall of the triangular groove 8. When the fixing base 1 is placed in the triangular groove 8 of the mounting base, the left side wall, rear side wall, and bottom surface of the fixing base 1 are in close contact with the left wall, rear wall, and bottom surface of the right-angled triangular groove 8, respectively, thereby causing the fixing base 1 to tilt in both the right-upward and backward directions. Through the action of gravity, tilting to the right and upward can ensure the horizontal consistency when the bars, solder pieces, and tungsten-copper heat sinks are periodically arranged and assembled into an array, and tilting backward can ensure the alignment of one end of the array.

[0042] The method for positioning a bar array using the multi-bar packaged semiconductor laser array sintering fixture of the above embodiment includes the following steps:

[0043] (1) The fixing seat 1 is placed obliquely in the triangular groove 8 of the mounting base 7, and the left wall surface of the fixing seat 1 is in parallel contact with the oblique inner wall 801 on the left side of the triangular groove 8, the bottom surface of the fixing seat 1 is in parallel contact with the oblique bottom surface 802 of the triangular groove 8, and the rear wall surface of the fixing seat 1 is in parallel contact with the rear wall surface of the triangular groove 8.

[0044] (2) Fix a ramp member 2 in the limiting groove 13 on the left surface of the fixing base 1. Fix a side positioning member 3 in the limiting groove 13 on the rear surface of the fixing base 1.

[0045] (3) Connect the support 10 to the fixing base 1, and place the required sintered hard solder sheets, bar bars, heat sink array 14, etc. in the bar bar setting area, with the bar bar cavity facing up or down; or first place the required sintered hard solder sheets, bar bars, heat sink array 14, etc. in the bar bar setting area.

[0046] (4) Secure the other ramp member 2 in the limiting groove 13 on the right surface of the fixing base 1, and ensure that the ramp member 2 is in light contact with the heat sink array 14 to prevent the heat sink array 14 from being displaced by contact. Similarly, secure the other side positioning member 3 in the limiting groove 13 on the front surface of the fixing base 1, and ensure that the side positioning member 3 is in light contact with the heat sink array 14 to prevent the heat sink array 14 from being displaced by contact.

[0047] (5) Fix the cover plate 4 to the upper end surface of the pillar 10, remove the assembled fixture from the mounting base 7 and place it on a horizontal table. Pass the vertical weight block 5 through the square through-hole on the cover plate 4 and gently press it on the heat sink array 14. Then place the inclined weight block 6 on the inclined surface of the ramp member 2, and slide the ramp member 2 down the inclined surface until it lightly contacts the heat sink array 14. The assembly of the sintering fixture is completed. Please refer to Figure 1 The materials of the ramp member 2 and the inclined surface gravity block 6 can be selected from tungsten steel, brass or 304 steel.

[0048] (6) Finally, the sintering fixture assembled in step (5) is placed in a vacuum reflow soldering device, and the set sintering curve is loaded for sintering.

[0049] Finally, it should be noted that any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention. Although the above description of the specific embodiments of the present invention is combined with the accompanying drawings, it is not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations made by those skilled in the art on the basis of the technical solution of the present invention without expending creative effort are still within the scope of protection of the present invention.

Claims

1. A multi-bar packaged semiconductor laser array sintering fixture, wherein: include: Install the base; ramp pieces; A fixing seat, the fixing seat being placed obliquely on the mounting base; the ramp members being symmetrically fixed on the left and right sides of the upper surface of the fixing seat; Side positioning members are fixed on both the front and rear sides of the upper surface of the fixing seat; the slope member and the side positioning members surround and form a bar setting area; a cover plate, the cover plate being arranged above the slope member and the edge positioning member; A vertical gravity member, the lower end surface of which vertically passes through the cover plate and presses on the bar setting area; An inclined surface gravity member is placed on the inclined surface of the ramp member, and an inner surface of the inclined surface gravity member contacts the outer side of the bar array located in the bar setting area under the action of its own weight.

2. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The width of the lower end surface of the vertical gravity member is not greater than the width of the bar setting area.

3. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The width of the lower end surface of the vertical gravity member is the same as the width of the bar setting area.

4. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: A positioning groove is provided on the inclined surface of the ramp member, and the ramp member is fixed on the fixing seat through a positioning member in the positioning groove.

5. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The cover plate is supported above the slope member and the edge positioning member by a support column; the lower end of the support column is fixed on a fixing seat, and the cover plate is detachably fixed on the support column.

6. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The cover plate is provided with a through hole, and the lower end of the vertical gravity member passes through the through hole and enters the lower side of the cover plate.

7. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The cover plate is detachably fixed to the upper end surface of the pillar by bolts or screws.

8. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The edge positioning piece is detachably fixed to the fixing seat by bolts or screws.

9. The multi-bar packaged semiconductor laser array sintering fixture according to claim 1, characterized in that: The fixing seat has a limit platform at each of the four corners of its upper surface, and a limit groove is formed between adjacent limit platforms; wherein: the two ramp members are respectively limited in the limit grooves on the left and right sides of the fixing seat; the two side positioning members are respectively limited in the limit grooves on the front and rear sides of the fixing seat.

10. The multi-bar packaged semiconductor laser array sintering fixture according to any one of claims 1 to 9, characterized in that: The slope member includes any one of a right-angled triangle block and a right-angled trapezoidal block; the inclined surface gravity member is placed on the inclined surface of the slope member.

11. The multi-bar packaged semiconductor laser array sintering fixture according to any one of claims 1 to 9, characterized in that: The inclined gravity member includes any one of a triangular block and a right-angled trapezoidal block; one side of the inclined gravity member is in close contact with the inclined surface of the ramp member, and the other side of the inclined gravity member is in close contact with the heat sink array in the bar setting area.

12. The multi-bar packaged semiconductor laser array sintering fixture according to any one of claims 1 to 9, characterized in that: The inclination angle of the slope member is controlled between 10° and 80°.

13. The multi-bar packaged semiconductor laser array sintering fixture according to any one of claims 1 to 9, characterized in that: The mounting base is provided with an inclined right-angled triangular groove, the front side of the triangular groove is open, and the right-angled triangular groove is inclined backward; the fixing seat is placed in the triangular groove at an angle.

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