Intelligent power modules, electronic control components and air conditioners

Abstract

The present invention discloses an intelligent power module, an electric control component and an air conditioner, wherein the intelligent power module comprises: a mounting substrate, having a relatively arranged strong current pin mounting side and a weak current pin mounting side on both sides along the length direction of the mounting substrate; a plurality of mounting positions are arranged on the surface of the mounting substrate; an inverter power module and a driver chip are mounted on corresponding mounting positions, and the inverter power module is electrically connected to the driver chip; and a low voltage reference pin, a current detection pin and a single point grounding pin are arranged on the strong current pin mounting side; wherein the low voltage reference pin is connected to the output end of the inverter power module, and the low voltage reference pin is also used to connect to the single point grounding pin via an external current detection resistor; the current detection pin is electrically connected to the low voltage reference pin; and the single point grounding pin is connected to the grounding end of the driver chip. The present invention solves the problem that the overcurrent protection of the intelligent power module is easily triggered by mistake, resulting in poor reliability of the intelligent power module.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuits, and in particular to an intelligent power module, an electric control component and an air conditioner. Background Art

[0002] In an intelligent power module, usually only one ground pin of the driver chip is set, and it is usually located on the low-voltage side, while the ground end of the power switch tube is usually located on the high-voltage side. In the power module, each switch tube, such as the IGBT emitter, is set on the high-voltage side. Therefore, when single-point grounding is implemented, the ground pins on the low-voltage side and the high-voltage side are far apart. In addition, in an intelligent power module with a current detection pin, the current detection pin is set on the low-voltage side, and an external lead is required to be connected to the IGBT emitter, resulting in too long wiring, increased parasitic inductance, and even false triggering. Summary of the invention

[0003] The main purpose of the present invention is to provide an intelligent power module, an electric control component and an air conditioner, aiming to improve the reliability of the intelligent power module.

[0004] To achieve the above object, the present invention provides an intelligent power module, the intelligent power module comprising:

[0005] A mounting substrate, wherein two sides along the length direction of the mounting substrate have a strong current pin mounting side and a weak current pin mounting side that are arranged oppositely; a surface of the mounting substrate is provided with a plurality of mounting positions;

[0006] An inverter power module and a driver chip are installed on the corresponding installation positions, and the inverter power module is electrically connected to the driver chip; and,

[0007] The low voltage reference pin, the current detection pin and the single point ground pin are arranged on the installation side of the high voltage pin; wherein,

[0008] The low voltage reference pin is connected to the output end of the inverter power module, and the low voltage reference pin is also used to connect to the single-point ground pin via an external current detection resistor;

[0009] The current detection pin is electrically connected to the low voltage reference pin;

[0010] The single-point grounding pin is connected to the grounding terminal of the driving chip.

[0011] Optionally, the low voltage reference pin, the current detection pin and the single point ground pin are arranged adjacent to each other on the installation side of the high current pin.

[0012] Optionally, the mounting substrate has a first end and a second end opposite to each other in its length direction;

[0013] The weak current pin installation side of the installation substrate is provided with a weak current grounding pin, a driving chip power supply pin, a UH driving signal pin, a VH driving signal pin, a WH driving signal pin, a UL driving signal pin, a VL driving signal pin and a WL driving signal pin in sequence from the first end to the second end;

[0014] The high-voltage power supply positive pin, W-phase output pin, W-phase floating power supply pin, V-phase output pin, V-phase floating power supply pin, U-phase output pin, U-phase floating power supply pin, the low voltage reference pin, the high-voltage grounding pin, the current detection pin and the single-point grounding pin are arranged in sequence on the high-voltage pin installation side of the mounting substrate from the first end to the second end.

[0015] Optionally, the inverter power module includes a three-phase upper bridge arm switch tube and a three-phase lower bridge arm switch tube, and a plurality of driving ends of the driving chip are connected to the gates of the three-phase upper bridge arm switch tube and the three-phase lower bridge arm switch tube in a one-to-one correspondence;

[0016] The collectors of the three-phase upper bridge arm switch tubes are used to access the DC bus; the emitters of the three-phase upper bridge arm switch tubes are connected one-to-one with the collectors of the three-phase lower bridge arm switch tubes; the emitters of the three-phase lower bridge arm switch tubes are connected to the low voltage reference pin.

[0017] The present invention further provides an electric control component, comprising a low-voltage power supply, a high-voltage power supply, a current detection resistor and the above-mentioned intelligent power module, wherein:

[0018] One end of the current detection resistor is connected to the low voltage reference pin of the intelligent power module and is connected to the current detection pin through a voltage drop resistor, and the other end of the current detection resistor is connected to the single-point ground pin of the intelligent power module;

[0019] The low voltage reference pin is also connected to the negative terminal of the high voltage power supply via an external current detection resistor;

[0020] The single-point grounding pin is also connected to the negative terminal of the low-voltage power supply.

[0021] Optionally, the electronic control component further includes:

[0022] The electric control board is provided with a circuit wiring layer, the current detection resistor and the intelligent power module are installed on the electric control board, and the current detection resistor and the intelligent power module are electrically connected through leads corresponding to the circuit wiring layer.

[0023] Optionally, a lead length between the low voltage reference pin and the current detection resistor is no more than 20 mm.

[0024] Optionally, a voltage-dropping resistor is further provided on the electric control board, and the voltage-dropping resistor is arranged in series between the low voltage reference pin and the current detection pin.

[0025] Optionally, the lead length between the low voltage reference pin and the current detection pin is not greater than 40 mm.

[0026] The present invention also provides an air conditioner, comprising the intelligent power module as described above;

[0027] Alternatively, it includes an electronic control assembly as described above.

[0028] The technical solution of the present invention sets the low voltage reference pin, the current detection pin and the single point grounding pin on the installation side of the strong current pin, the current detection pin is electrically connected to the driver chip through the routing and binding wires on the internal circuit wiring layer of the intelligent power module, and the single point grounding pin is also electrically connected to the low voltage power supply of the driver chip through the routing and binding wires on the internal circuit wiring layer of the intelligent power module. When the external power supply supplies power to the driver chip, the low voltage power supply arranged on the installation side of the weak current pin can be electrically connected to the single point grounding pin. When the low voltage reference pin is also electrically connected to the high voltage power supply of the external power supply through the external current detection resistor, it is also electrically connected to the single point grounding pin through the external current detection resistor. That is, the strong power ground (lower bridge IGBT emitter output) of the external power supply and the weak power ground (COM pin) are single-point grounded on the single point grounding pin of the intelligent power module, and there is no need to set a single point grounding point on the electric control board, which can shorten the routing distance between the strong power ground and the weak power ground. Moreover, when the PCB wiring of the electric control board is performed, the external current detection resistor is arranged on the periphery of the strong current pin installation side of the intelligent power module, and the current detection foot is also arranged on the strong current pin installation side, which can shorten the wiring distance between the current detection foot and the external current detection resistor, thereby reducing the parasitic inductance on the wiring. Due to the reduction of parasitic inductance, the problem of false triggering of the intelligent power module can be solved. In addition, in this embodiment, the common point for realizing single-point grounding is set on the intelligent power module, and the high-voltage side ground passes through the single-point grounding foot and passes through the inside of the module to reach the low-voltage side ground, forming a convenient single-point grounding, reducing the length of the ground wire. In this way, the wiring when the strong current ground and the weak current ground are realized at the single point grounding can be shortened, and the grounding end of the inverter power module on the strong current installation side does not need to be connected with the weak current grounding foot on the weak current installation side. There is no need to find a grounding point on the electric control board, and there is no need to consider the safety requirements of the wiring, which can facilitate the wiring of the peripheral electric control of the intelligent power module, thereby reducing the wiring difficulty of the electric control board of the electrical equipment, which is conducive to improving the reliability of the intelligent power module. The present invention solves the problem that the overcurrent protection of the intelligent power module is easily mistriggered, resulting in poor reliability of the intelligent power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the internal circuit structure of an embodiment of an intelligent power module of the present invention;

[0031] Figure 2 A schematic diagram of the circuit structure of an embodiment of an electric control component of the present invention;

[0032] Figure 3 It is a structural schematic diagram of another embodiment of the electric control component of the present invention.

[0033] Description of Figure Numbers:

[0034] Label name Label name 100 Intelligent Power Module UVW- Low voltage reference pin 101 Driver chip Csc Current sensing pin 102 Inverter power module COM2 Single point ground pin 201 Current Sense Resistor 301 High voltage power supply 202 Dropping resistor 302 Low voltage power supply 203 Voltage Divider Resistors

[0035] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The present invention provides an intelligent power module.

[0038] Reference Figures 1 to 3 In one embodiment of the present invention, the intelligent power module 100 includes:

[0039] A mounting substrate (not shown), having opposite strong current pin mounting sides and weak current pin mounting sides along the length direction of the mounting substrate; a plurality of mounting positions are arranged on the surface of the mounting substrate;

[0040] The inverter power module 102 and the driver chip 101 are installed on the corresponding installation positions, and the inverter power module 102 is electrically connected to the driver chip 101; and,

[0041] The low voltage reference pin UVW-, the current detection pin Csc and the single point ground pin COM2 are arranged on the side where the high voltage pin is installed; wherein,

[0042] The low voltage reference pin UVW- is connected to the output end of the inverter power module 102, and the low voltage reference pin UVW- is also used to connect to the single-point ground pin COM2 via an external current detection resistor 201;

[0043] The current detection pin Csc is electrically connected to the low voltage reference pin UVW-;

[0044] The single-point ground pin COM2 is connected to the ground terminal of the driving chip 101 .

[0045] In this embodiment, the mounting substrate can be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate or a copper alloy substrate. The mounting substrate is a mounting carrier for the power switch tube and the driver device. The shape of the mounting substrate can be determined according to the specific position, quantity and size of the power switch tube. It can be square, but not limited to square. A circuit wiring layer is provided on the mounting substrate. The circuit wiring layer forms corresponding circuits and corresponding mounting positions for installing each electronic component in the power switch tube, i.e., pads, on the mounting substrate according to the circuit design of the intelligent power module 100.

[0046] When the mounting substrate is implemented by using an aluminum nitride ceramic mounting substrate, the aluminum nitride ceramic mounting substrate includes an insulating heat dissipation layer and a circuit wiring layer formed on the insulating heat dissipation layer. When a mounting substrate made of a metal material is used, the mounting substrate includes a heat dissipation layer, an insulating layer laid on the heat dissipation layer, and a circuit wiring layer formed on the insulating layer. In this embodiment, the mounting substrate can be optionally a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer and the metal mounting substrate. The insulating layer is used to achieve electrical isolation and electromagnetic shielding between the circuit wiring layer and the metal mounting substrate, as well as to reflect external electromagnetic interference, thereby preventing external electromagnetic radiation from interfering with the normal operation of the power switch tube and reducing the interference effect of electromagnetic radiation in the surrounding environment on the electronic components in the intelligent power module 100. The insulating layer can be optionally made of materials such as thermoplastic glue or thermosetting glue to achieve fixed connection and insulation between the mounting substrate and the circuit wiring layer. The insulating layer can be implemented by a high thermal conductivity insulating layer made of a mixture of one or more materials such as epoxy resin, alumina, and a high thermal conductivity filling material. In the process of manufacturing the mounting substrate, after the insulating layer is provided on the mounting substrate, the copper foil is laid on the insulating layer, and the copper foil is etched according to a preset circuit design, thereby forming a circuit wiring layer.

[0047] The power switch tube in the inverter power module 102 and the driver chip 101 can be a surface-mount electronic component or a bare die wafer. The circuit wiring layer includes circuit wiring that forms a current loop and pads formed by the circuit wiring. The driver chip 101 and the power switch tube in the inverter power module 102 are arranged on corresponding pads. The driver chip 101 and the power switch tube can be electrically connected through circuit wiring, metal binding wires, etc.

[0048] The number of driver chips 101 can be one, for example, an HVIC driver chip 101, which is an integrated chip, in which a four-way, six-way or seven-way driving circuit for driving a power switch tube (with integrated PFC drive) is integrated, and can be specifically integrated according to the number of driven power switch tubes. The number of driver chips 101 can also correspond to the number of power switch tubes, that is, each driver chip 101 corresponds to driving a power switch tube to work. The driver chip 101 is used to output a corresponding control signal when the intelligent power module 100 is working, so as to control the corresponding power switch tube to turn on, thereby outputting driving power to drive a load such as a motor to work. When the power switch tube is driven to turn on, a charging current is provided to the power switch tube so that the gate-source voltage of the power switch tube rises rapidly to the required value to ensure that the power switch tube switch can be turned on quickly. And during the conduction of the power switch tube, the gate-source voltage of the power switch tube is ensured to remain stable so that the power switch tube can be reliably turned on. The driver chip 101 can also be provided with two driver chips 101, namely an upper bridge arm driver chip (HVIC) 101 and a lower bridge arm driver chip (LVIC) 101, and respectively drive the upper bridge arm power device and the lower bridge arm power device in the inverter power module 102 to work, and the inverter power module 102 and the driver chip 101 can be electrically connected through circuit wiring and metal leads to form a current loop. When a driver chip 101 is used to implement, the driver chip 101 integrates a high-voltage side drive unit and a low-voltage side drive circuit, and the high-voltage side drive unit and the low-voltage side drive unit are respectively used to drive the upper bridge arm power device and the lower bridge arm power device in the inverter power module 102 to work. The input end of the driver chip 101 is connected to the main controller in the inverter or air conditioner, that is, MCU. The MCU integrates a logic controller, a memory, a data processor, etc., and a software program and / or module stored in the memory and can be run on the data processor. The MCU outputs a corresponding control signal to the driver chip 101 by running or executing the software program and / or module stored in the memory, and calling the data stored in the memory, so as to drive the power switch tube in the inverter power module 102 to turn on / off according to the control signal of the main controller, thereby driving the load such as the fan, compressor, and motor to work. The main controller can be independent of the intelligent power module 100, or it can be integrated into the intelligent power module 100. In actual application, the main controller and the intelligent power module 100 are arranged on the electric control board and are electrically connected through circuit wiring or wires. Of course, in other embodiments, the main controller can be integrated into the intelligent power module 100 to improve the integration of the intelligent power module 100.

[0049] The power module 20 includes a plurality of power devices, and the plurality of power devices may be gallium nitride (GaN) power devices, Si-based power devices or SiC-based power devices. The number of power devices may be one or more. When set to be multiple, it may include four of the power devices or six of the power devices. The six power devices form an inverter circuit, which is applied to electrical equipment such as inverter power supplies, frequency converters, refrigeration equipment, metallurgical machinery and equipment, and electric traction equipment, especially frequency conversion household appliances. When the intelligent power module 100 is working, the driver chip 101 outputs a corresponding PWM control signal to drive and control the corresponding power device to turn on / off, thereby outputting driving power to drive loads such as motors to work. It can be understood that, according to different types of power devices, for example, when the power device is implemented using IGBT, FRD (Fast Recovery Diode) can also be adaptively set.

[0050] Reference Figure 3In this embodiment, IGBTs are used in the inverter power module 102, and the driver chip 101 is an HVIC chip. The VCC end of the HVIC tube 101 is used as the positive end VDD of the low-voltage power supply of the intelligent power module 100, and VDD is generally 15V; the HIN1 end of the HVIC tube 101 is used as the U-phase upper bridge arm input end UHIN of the intelligent power module 100; the HIN2 end of the HVIC tube 101 is used as the V-phase upper bridge arm input end VHIN of the intelligent power module 100; the HIN3 end of the HVIC tube 101 is used as the W-phase upper bridge arm input end WHIN of the intelligent power module 100; the LIN1 end of the HVIC tube 101 is used as the U-phase lower bridge arm input end ULIN of the intelligent power module 100; the HVIC tube 101 is used as the W-phase upper bridge arm input end WHIN of the intelligent power module 100; the LIN2 end of the HVIC tube 101 is used as the U-phase lower bridge arm input end ULIN of the intelligent power module 100; the LIN3 end of the HVIC tube 101 is used as the W-phase upper bridge arm input end WHIN of the intelligent power module 100; the LIN1 end of the HVIC tube 101 is used as the U-phase lower bridge arm input end ULIN of the intelligent power module 100; the LIN2 end of the HVIC tube 101 is used as the W-phase upper ... 1 is used as the V-phase lower bridge arm input terminal VLIN of the intelligent power module 100; the LIN3 terminal of the HVIC tube 101 is used as the W-phase lower bridge arm input terminal WLIN of the intelligent power module 100; here, the six inputs of the U, V, and W phases of the intelligent power module 100 receive 0-5V input signals; the GND terminal of the HVIC tube 101 is used as the negative terminals COM1 and COM2 of the low-voltage area power supply of the intelligent power module 100, wherein the COM1 pin is at the logic end, adjacent to the low-voltage pins such as VDD, and the COM2 pin is at the high-voltage side, adjacent to the UVW- and Csc pins; the Csc terminal of the HVIC tube 101 is used as the The overcurrent protection detection terminal COM2 of the intelligent power module 100; the VB1 terminal of the HVIC tube 101 is used as the positive terminal UVB of the U-phase high-voltage area power supply of the intelligent power module 100; the HO1 terminal of the HVIC tube 101 is connected to the gate of the U-phase upper bridge arm IGBT tube 121; the VS1 terminal of the HVIC tube 101 is connected to the emitter of the IGBT tube 121, the anode of the FRD tube 111, the collector of the U-phase lower bridge arm IGBT tube 124, and the cathode of the FRD tube 114, and serves as the negative terminal UVS of the U-phase high-voltage area power supply of the intelligent power module 100; the VB2 terminal of the HVIC tube 101 is used as the positive terminal UVB of the U-phase high-voltage area power supply of the intelligent power module 100 The positive terminal VVB of the U-phase high-voltage area power supply of the intelligent power module 100; the HO3 terminal of the HVIC tube 101 is connected to the gate of the V-phase upper bridge arm IGBT tube 123; the VS2 terminal of the HVIC tube 101 is connected to the emitter of the IGBT tube 122, the anode of the FRD tube 112, the collector of the V-phase lower bridge arm IGBT tube 125, and the cathode of the FRD tube 115, and serves as the negative terminal VVS of the W-phase high-voltage area power supply of the intelligent power module 100; the VB3 terminal of the HVIC tube 101 serves as the positive terminal WVB of the W-phase high-voltage area power supply of the intelligent power module 100; the HO3 terminal of the HVIC tube 101 is connected to the gate of the W-phase upper bridge arm IGBT tube 123;The VS3 end of the HVIC tube 101 is connected to the emitter of the IGBT tube 123, the anode of the FRD tube 113, the collector of the W-phase lower bridge arm IGBT tube 126, and the cathode of the FRD tube 116, and serves as the negative end WVS of the W-phase high-voltage area power supply of the intelligent power module 100; the LO1 end of the HVIC tube 101 is connected to the gate of the IGBT tube 124; the LO2 end of the HVIC tube 101 is connected to the gate of the IGBT tube 125; the LO3 end of the HVIC tube 101 is connected to the gate of the IGBT tube 126; the LO3 end of the HVIC tube 101 is connected to the gate of the IGBT tube 126; the emitter of the IGBT tube 124 is connected to the anode of the FRD tube 114, And it serves as the three-phase low voltage reference pin UVW- of the intelligent power module 100; the emitter of the IGBT tube 125 is connected to the anode of the FRD tube 115, and serves as the three-phase low voltage reference pin UVW- of the intelligent power module 100; the emitter of the IGBT tube 126 is connected to the anode of the FRD tube 116, and serves as the three-phase low voltage reference pin UVW- of the intelligent power module 100; the collector of the IGBT tube 121, the cathode of the FRD tube 111, the collector of the IGBT tube 122, the cathode of the FRD tube 112, the collector of the IGBT tube 123, and the cathode of the FRD tube 113 are connected, and serve as the high voltage input terminal P of the intelligent power module 100, and P is generally connected to 300V. The function of the HVIC tube 101 is to transmit the 0-5V logic signals of the input terminals HIN1, HIN2, HIN3 and LIN1, LIN2, LIN3 to the output terminals HO1, HO2, HO3 and LO1, LO2, LO3, respectively, where HO1, HO2, HO3 are logic signals of VS-VS+15V, and LO1, LO2, LO3 are logic signals of 0-15V. The current outputted by UVW- is detected by Csc to realize overcurrent protection. ;

[0051] Each pin installed on the high-voltage pin installation side and the low-voltage pin installation side can be implemented by gull-wing pins or straight-insert pins. Each pin is welded to a pad position corresponding to the installation position on the installation substrate, and is electrically connected to the driver chip 101 and the inverter power module 102 through metal wires and circuit wiring layers.

[0052] It should be noted that in order to avoid damaging the motor and the intelligent power module 100 when the motor is overcurrent, an overcurrent protection function is integrated in the intelligent power module 100. Specifically, an overcurrent detection pin (referred to as Itrip or Csc) can be set on the mounting substrate of the intelligent power module 100 to detect the voltage drop on the external current detection resistor 201. When the voltage drop exceeds a certain threshold, the level on the overcurrent detection pin Itrip is reversed, for example, from a high level to a low level, or from a low level to a high level, thereby triggering the protection function of the IC inside the IPM, and the module stops working to play a protective role. In addition, when the intelligent power module 100 is applied to electrical equipment such as air conditioners, refrigerators, washing machines, or applied to inverters, the intelligent power module 100 and the external sampling resistor are both installed on the electric control board (such as a PCB board). In the wiring of the electric control board PCB, it is required to be grounded at a single point as much as possible, especially the strong ground (lower bridge IGBT emitter output) and the weak ground (VSS or COM pin of the IPM, and the ground terminal of the MCU) should be connected through a single point, usually a single-point grounding point is set on the electric control board. Moreover, in actual wiring, the line will introduce parasitic inductance, and in current detection, the parasitic inductance will have a greater impact on the detection. However, the lower bridge emitter pin is generally placed together with the high-voltage pin to make the high-voltage and high-current routing shorter; the current detection pin Csc and the logic ground pin are generally placed together with other low-voltage logic pins to shorten the distance from other logic pins to the logic ground. Therefore, setting the pins of the intelligent power module 100 in this way, as well as the wiring of the electric control board PCB, will increase the routing distance between the intelligent power module 100 and external devices, which is likely to increase parasitic inductance, resulting in inaccurate overcurrent protection, or the logic ground is susceptible to the influence of high voltage ground.

[0053] To this end, in this embodiment, the low voltage reference pin UVW-, the current detection pin Csc and the single point ground pin COM2 are arranged on the side where the strong current pin is installed. The current detection pin Csc is electrically connected to the driver chip 101 through the routing and binding wires on the internal circuit wiring layer of the intelligent power module 100. The single point ground pin COM2 is also electrically connected to the low voltage power supply of the driver chip 101 through the routing and binding wires on the internal circuit wiring layer of the intelligent power module 100. When the external power supply supplies power to the driver chip 101, the low voltage power supply 302 arranged on the side where the weak current pin is installed can be electrically connected to the single point ground pin COM2. When the low voltage reference pin UVW- is electrically connected to the high voltage power supply 301 of the external power supply through the external current detection resistor 201, it is also electrically connected to the single point ground pin COM2 through the external current detection resistor 201. That is, the strong power ground (lower bridge IGBT emitter output) and the weak power ground (COM pin) of the external power supply are single-point grounded on the single-point grounding pin COM2 of the intelligent power module 100, and there is no need to set a single-point grounding point on the electric control board, which can shorten the wiring distance between the strong power ground and the weak power ground. In addition, when the electric control board PCB wiring is performed, the external current detection resistor 201 is set on the periphery of the strong power pin installation side of the intelligent power module 100, and the current detection pin Csc is also set on the strong power pin installation side, which can shorten the wiring distance between the current detection pin Csc and the external current detection resistor 201, thereby reducing the parasitic inductance on the wiring. Due to the reduction of parasitic inductance, the problem of false triggering of the intelligent power module 100 can be solved. In addition, in this embodiment, the common point for realizing single-point grounding is set on the intelligent power module 100, and the high-voltage side ground passes through the single-point grounding pin COM2, passes through the inside of the module to reach the low-voltage side ground COM1, forming a convenient single-point grounding, reducing the length of the ground line. In this way, the wiring of the strong power ground and the weak power ground can be shortened when the single-point grounding is realized. The grounding terminal of the inverter power module 102 on the strong power installation side does not need to be connected with the weak power grounding pin COM1 on the weak power installation side. There is no need to find a grounding point on the electric control board, and there is no need to consider the safety requirements of the wiring. It can facilitate the wiring of the peripheral electric control of the intelligent power module 100, thereby reducing the wiring difficulty of the electric control board of the electrical equipment, which is conducive to improving the reliability of the intelligent power module. The present invention solves the problem that the overcurrent protection of the intelligent power module is easily triggered by mistake, resulting in poor reliability of the intelligent power module.

[0054] It can be understood that the driving current of the fan inverter power module flows from the driving end of the fan driver chip 30 to the fan low voltage reference pin of the fan inverter power module, and then from the fan low voltage reference pin to the single-point grounding pin VSS3 outside the intelligent power module, and then from the single-point grounding pin on the high-voltage side of the fan driver chip 30 back to the gate to form a driving loop. In this way, on the side where the high-voltage pin is installed, the distance between the two is small, which can shorten the current loop.

[0055] The present invention can also shorten the routing of the driving current loop, thereby reducing the parasitic inductance on the routing and increasing the switching speed of the switch tube in the power module 20. Moreover, due to the reduction of parasitic inductance, the problem of false triggering of the intelligent power module can also be solved.

[0056] Reference Figures 1 to 3 In one embodiment, the low voltage reference pin UVW-, the current detection pin Csc and the single-point ground pin COM2 are adjacently arranged on the weak current pin installation side.

[0057] It should be noted that, refer to Figure 3 In the figure, Ls1~Ls4 represent the equivalent parasitic inductance in the circuit. When the wiring between the current sensing pin Csc and the external current sensing resistor 201 and the lower bridge emitter pin is connected at point A (close to the lower bridge emitter pin), the voltage of the current sensing pin Csc will be affected by Ls1 above the wiring resistance. The resistance of the wiring reduces the jump level because it is equivalent to adding a series resistor to the shunt resistor (current sensing resistor 201). Ls1 will generate a voltage spike when the reverse recovery current flows through it, which is easy to cause false triggering. Therefore, it is necessary to set the connection point at point B in the figure, that is, close to (external current sensing resistor 201). At this time, Ls1 is equivalent to a filter with a large time constant, which can filter out voltage spikes and minimize the noise impact of Ls1 through the wiring of the current sensing pin Csc. To this end, in this embodiment, the lower bridge emitter pin (UVW-), the current detection pin (Itrip or Csc), and the logic ground pin (VSS or COM) are arranged close to each other, so that the wiring distance can be shortened as much as possible on the IPM external electrical control wiring, that is, when the peripheral electrical control wiring is made, the wiring distances from UVW- to the sampling resistor, the external sampling resistor to the current detection pin Csc, the current detection pin Csc to the ground, and the external current detection resistor 201 to the ground are all shortened to the shortest. Ls2-Ls4 are minimized as much as possible, thereby reducing the influence of parasitic inductance on current detection, ensuring that current detection is not interfered with, so as to obtain reliable current protection and measurement performance.

[0058] Reference Figures 1 to 3 In one embodiment, the mounting substrate has a first end and a second end opposite to each other in a length direction thereof;

[0059] The weak current pin installation side of the installation substrate is provided with a weak current ground pin COM1, a driver chip power supply pin VCC, a UH drive signal pin HIN1, a VH drive signal pin HIN2, a WH drive signal pin HIN3, a UL drive signal pin LIN1, a VL drive signal pin LIN2 and a WL drive signal pin LIN3 in sequence from the first end to the second end;

[0060] The high-voltage power supply positive pin, W-phase output pin, W-phase floating power supply pin, V-phase output pin, V-phase floating power supply pin, U-phase output pin, U-phase floating power supply pin, the low voltage reference pin UVW-, the high-voltage ground pin, the current detection pin Csc and the single-point ground pin COM2 are arranged in sequence on the high-voltage pin installation side of the mounting substrate from the first end to the second end.

[0061] In this embodiment, the U-phase output pin U, the V-phase output pin V, and the W-phase output pin W are respectively used to access the three-phase winding of the motor. The UH drive signal pin HIN1, the VH drive signal pin HIN2, the WH drive signal pin HIN3, the UL drive signal pin LIN1, the VL drive signal pin LIN2, and the WL drive signal pin LIN3 are respectively used to access the UH drive signal, the VH drive signal, and the WH drive signal input by the external controller, as well as the UL drive signal, the VL drive signal, and the WL drive signal, and convert the logic drive signal into an analog drive signal to drive the corresponding power switch tube to work. Since the three pins of the low voltage reference pin UVW-, the current detection pin Csc, and the single-point grounding pin COM2 are adjacent, the wiring distances between the low voltage reference pin UVW- to the external current detection resistor 201, the external current detection resistor 201 to the current detection pin Csc, the current detection pin Csc to the single-point grounding pin COM2, and the external current detection resistor 201 to the single-point grounding pin can be shortened to the shortest, which can reduce the influence of parasitic inductance and ensure that the current detection is not interfered.

[0062] Reference Figures 1 to 3 In one embodiment, the inverter power module 102 includes a three-phase upper bridge arm switch tube and a three-phase lower bridge arm switch tube, and the multiple driving ends of the driver chip 101 are connected to the gates of the three-phase upper bridge arm switch tube and the three-phase lower bridge arm switch tube in a one-to-one correspondence;

[0063] The collectors of the three-phase upper bridge arm switch tubes are used to access the DC bus; the emitters of the three-phase upper bridge arm switch tubes are connected one-to-one with the collectors of the three-phase lower bridge arm switch tubes; the emitters of the three-phase lower bridge arm switch tubes are connected to the low voltage reference pin UVW-.

[0064] In this embodiment, the three-phase upper bridge arm switch tube (and the three-phase lower bridge arm switch tube are turned on when receiving a high-level drive signal, and turned off when receiving a low-level drive signal, and in the same phase bridge arm circuit, the upper bridge arm switch tube and the lower bridge arm switch tube will not be turned on at the same time. That is, when the upper bridge arm switch tube is turned on, the lower bridge arm switch tube is turned off. The common end of the three-phase upper bridge arm switch tube (and the three-phase lower bridge arm switch tube is the output end of the intelligent power module 100, and is connected to the winding corresponding to the motor, thereby driving the motor to work. Among them, the three-phase upper bridge arm switch tube (and the three-phase lower bridge arm switch tube can be fully or partially implemented by IGBT. When the IGBT is working, the emitter UVW- of the IGBT and the single-point grounding pin COM2 are both arranged on the installation side of the high-voltage pin, and the distance between the two is small, which can shorten the current loop.

[0065] The present invention further proposes an electric control component, including a low-voltage power supply 302, a high-voltage power supply 301, a current detection resistor 201 and the above-mentioned intelligent power module 100. The detailed structure of the intelligent power module 100 can refer to the above-mentioned embodiment, which will not be repeated here; it can be understood that since the above-mentioned intelligent power module 100 is used in the electric control component of the present invention, the embodiment of the electric control component of the present invention includes all technical solutions of all embodiments of the above-mentioned intelligent power module 100, and the technical effects achieved are also exactly the same, which will not be repeated here. Among them,

[0066] One end of the current detection resistor 201 is connected to the low voltage reference pin UVW- of the intelligent power module 100, and is connected to the current detection pin Csc through the voltage drop resistor 202, and the other end of the current detection resistor 201 is connected to the single-point ground pin COM2 of the intelligent power module 100;

[0067] The low voltage reference pin UVW- is also connected to the high voltage power supply 301 via an external current detection resistor 201;

[0068] The single-point ground pin COM2 is also connected to the low-voltage power supply 302 .

[0069] In this embodiment, the current detection resistor 201 is arranged in series between the low voltage reference pin UVW- and the single-point ground pin COM2, which can detect the current flowing through the three-phase lower bridge arm switch tube and convert the current into a voltage signal, thereby realizing current detection of the motor.

[0070] Reference Figures 1 to 3 In one embodiment, the electronic control component further comprises:

[0071] An electric control board (not shown) is provided with a circuit wiring layer, the current detection resistor 201 and the intelligent power module 100 are mounted on the electric control board, and the current detection resistor 201 and the intelligent power module 100 are electrically connected through the leads corresponding to the circuit wiring layer.

[0072] In this embodiment, the electric control components include but are not limited to a rectifier bridge stack, a PFC circuit, a DC bus capacitor, and an intelligent power module 100. The rectifier bridge stack, the PFC circuit, and the intelligent power module 100 are connected in sequence, and the DC bus capacitor is connected in parallel to the output end of the PFC circuit, wherein the PFC circuit includes a PFC power switch and a PFC inductor. The rectifier bridge stack, the PFC circuit, the DC bus capacitor, and the pads of the intelligent power module 100 can be formed on the electric control board, and the rectifier bridge stack, the PFC circuit, the DC bus capacitor, and the intelligent power module 100 are electrically connected through the leads on the circuit wiring layer. Among them, the current detection resistor 201 is set on the same side as the installation side of the strong current pin of the intelligent power module 100, so that in the intelligent power module 100, when the low voltage reference pin UVW- is connected to the single-point grounding pin through the external current detection resistor 201, the distance between the two can be shortened, and the current detection pin Csc is also set on the installation side of the strong current pin, so that the distance between the low voltage reference pin UVW- and the current detection pin Csc can be shortened.

[0073] Reference Figures 1 to 3 In one embodiment, the lead length between the low voltage reference pin UVW- and the current detection resistor 201 is no more than 20 mm.

[0074] In this embodiment, since the three pins of the low voltage reference pin UVW-, the current detection pin Csc and the single-point ground pin COM2 are adjacent, the wiring distances between the low voltage reference pin UVW- and the sampling resistor, the sampling resistor and the current detection pin Csc, the current detection pin Csc and the single-point ground pin, and the sampling resistor and the single-point ground pin can be shortened to the shortest, so that the lead length between the low voltage reference pin UVW- and the current detection resistor 201 is not more than 20 mm, and the lead length between the low voltage reference pin UVW- and the current detection pin Csc is not more than 40 mm. In this way, the wiring between the current detection pin Csc and the external current detection resistor 201 can be shortened, and the parasitic inductance on the wiring can be reduced. Due to the reduction of parasitic inductance, the problem of false triggering of the intelligent power module 100 can be solved. In addition, UVW- is connected to the high-voltage power supply 301 and the single-point ground pin COM2 after passing through the current detection resistor 201. The single-point ground pin COM2 is connected to the high-voltage power supply negative pin COM1 inside the intelligent power module 100, forming a unique connection path between the high-voltage ground and the low-voltage logic ground, thereby realizing a single-point connection.

[0075] Reference Figures 1 to 3In one embodiment, a voltage-dropping resistor 202 is further provided on the electric control board, and the voltage-dropping resistor 202 is arranged in series between the low voltage reference pin UVW- and the current detection pin Csc.

[0076] It can be understood that in order to avoid the voltage output to the current detection pin Csc being too large and burning the driver chip 101, the present embodiment sets the voltage-dropping resistor 202 in series between the low voltage reference pin UVW- and the current detection pin Csc. When the current detection resistor 201 detects the current flowing through the low voltage reference pin UVW- and converts it into a voltage, it is output to the current detection pin Csc through the voltage-dropping resistor 202, thereby realizing the current detection of the motor. In the present embodiment, a voltage-dividing resistor 203 can also be set, one end of the voltage-dividing resistor 203 is connected to the first DC power supply 302, and the first DC power supply 302 can be the power supply of the driver chip 101, and the other end of the voltage-dividing resistor 203 is connected to the voltage-dropping resistor 202, thereby forming a voltage-dividing circuit with the voltage-dropping resistor 202, and the overcurrent protection trigger is realized by changing the level of the current detection pin Csc. It can be understood that the overcurrent protection trigger circuit of the present embodiment, which is composed of three discrete resistors, namely, the current detection resistor 201, the voltage drop resistor 202, and the voltage divider resistor 203, can realize overcurrent protection for the intelligent power module 100 and the motor through hardware settings, and the circuit is simple and easy to implement. When applied to the intelligent power module 100, the logic analysis and signal processing of the driver chip 101 can be reduced, thereby improving the response speed of the overcurrent protection of the intelligent power module 100.

[0077] The present invention also provides an air conditioner, comprising the intelligent power module as described above;

[0078] Alternatively, it includes an electronic control assembly as described above.

[0079] The detailed structure of the electronic control component and the intelligent power module can be referred to the above-mentioned embodiments, which will not be described in detail here; it can be understood that since the above-mentioned electronic control components and intelligent power modules are used in the air conditioner of the present invention, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned electronic control components and intelligent power modules, and the technical effects achieved are also exactly the same, which will not be described in detail here.

[0080] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. An intelligent power module, characterized in that: The intelligent power module comprises: A mounting substrate, wherein two sides along the length direction of the mounting substrate have a strong current pin mounting side and a weak current pin mounting side that are arranged oppositely; a surface of the mounting substrate is provided with a plurality of mounting positions; An inverter power module and a driver chip are installed on the corresponding installation positions, and the inverter power module is electrically connected to the driver chip; and, The low voltage reference pin, the current detection pin and the single point ground pin are arranged on the installation side of the high voltage pin; wherein, The low voltage reference pin is connected to the output end of the inverter power module, and the low voltage reference pin is also used to connect to the single-point ground pin via an external current detection resistor; The current detection pin is electrically connected to the low voltage reference pin; The single-point grounding pin is connected to the grounding terminal of the driving chip.

2. The intelligent power module according to claim 1, characterized in that: The low voltage reference pin, the current detection pin and the single point ground pin are arranged adjacent to each other on the installation side of the high voltage pin.

3. The intelligent power module according to claim 2, characterized in that: The mounting substrate has a first end and a second end opposite to each other in the length direction thereof; The weak current pin installation side of the installation substrate is provided with a weak current grounding pin, a driving chip power supply pin, a UH driving signal pin, a VH driving signal pin, a WH driving signal pin, a UL driving signal pin, a VL driving signal pin and a WL driving signal pin in sequence from the first end to the second end; The high-voltage power supply positive pin, W-phase output pin, W-phase floating power supply pin, V-phase output pin, V-phase floating power supply pin, U-phase output pin, U-phase floating power supply pin, the low-voltage reference pin, high-voltage grounding pin, current detection pin and single-point grounding pin are arranged in sequence on the high-voltage pin installation side of the mounting substrate from the first end to the second end.

4. The intelligent power module according to any one of claims 1 to 3, characterized in that: The inverter power module includes a three-phase upper bridge arm switch tube and a three-phase lower bridge arm switch tube, and a plurality of driving ends of the driving chip are connected to the gates of the three-phase upper bridge arm switch tube and the three-phase lower bridge arm switch tube in a one-to-one correspondence; The collectors of the three-phase upper bridge arm switch tubes are used to access the DC bus; the emitters of the three-phase upper bridge arm switch tubes are connected one-to-one with the collectors of the three-phase lower bridge arm switch tubes; the emitters of the three-phase lower bridge arm switch tubes are connected to the low voltage reference pin.

5. An electric control component, characterized in that: It comprises a low voltage power supply, a high voltage power supply, a current detection resistor and an intelligent power module as claimed in any one of claims 1 to 4, wherein: One end of the current detection resistor is connected to the low voltage reference pin of the intelligent power module and is connected to the current detection pin through a voltage drop resistor, and the other end of the current detection resistor is connected to the single-point ground pin of the intelligent power module; The low voltage reference pin is also connected to the negative terminal of the high voltage power supply via an external current detection resistor; The single-point grounding pin is also connected to the negative terminal of the low-voltage power supply.

6. The electronic control assembly according to claim 5, characterized in that: The electronic control assembly also includes: The electric control board is provided with a circuit wiring layer, the current detection resistor and the intelligent power module are installed on the electric control board, and the current detection resistor and the intelligent power module are electrically connected through leads corresponding to the circuit wiring layer.

7. The electronic control assembly according to claim 6, characterized in that: The lead length between the low voltage reference pin and the current detection resistor is no longer than 20 mm.

8. The electronic control assembly according to claim 6, characterized in that: The electric control board is also provided with a voltage-dropping resistor, which is connected in series between the low voltage reference pin and the current detection pin.

9. The electronic control assembly according to claim 8, characterized in that: The lead length between the low voltage reference pin and the current detection pin is not greater than 40 mm.

10. An air conditioner, characterized in that: Comprising the intelligent power module according to any one of claims 1 to 4; Alternatively, it comprises an electronic control component as described in any one of claims 5 to 9.

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