Camera device

Abstract

The present invention discloses a camera device, comprising an outer cover, a lens, a circuit board and a dustproof sheet. The outer cover comprises an axial hole and a first end and a second end axially opposite to each other. The lens is arranged at the first end of the outer cover. The circuit board is arranged at the second end of the outer cover, and the circuit board comprises an inner surface located in the axial hole, the inner surface having a photosensitive area and a non-photosensitive area, and the photosensitive area is provided with a photosensitive module corresponding to the lens. The dustproof sheet is arranged in the axial hole of the outer cover, and the dustproof sheet covers the non-photosensitive area of ​​the inner surface of the circuit board.

Description

Technical Field

[0001] The present invention relates to an optical device, in particular to a camera device. Background Art

[0002] With the development of technology, camera devices are increasingly used in personal electronic products, automotive fields, medical fields, etc. to capture external images. For example, a camera device can be installed on a vehicle to capture images outside the vehicle for driving assistance.

[0003] Most camera devices use photosensitive elements to sense and obtain external images. In order to ensure the image quality, the photosensitive element is installed inside the housing. Although this can prevent dust outside the camera device from entering the housing and adhering to the photosensitive element, it cannot prevent the camera device from raising dust on the internal element when it is installed on other components or in operation, thereby affecting the photosensitivity and image quality of the photosensitive element. Summary of the invention

[0004] In view of the above, in one embodiment, a camera device is provided, including an outer cover, a lens, a circuit board and a dustproof sheet. The outer cover includes an axial hole and a first end and a second end axially opposite to each other. The lens is arranged at the first end of the outer cover. The circuit board is arranged at the second end of the outer cover, and the circuit board includes an inner surface located in the axial hole, the inner surface has a photosensitive area and a non-photosensitive area, and the photosensitive area is provided with a photosensitive module to correspond to the lens. The dustproof sheet is arranged in the axial hole of the outer cover, and the dustproof sheet covers the non-photosensitive area of ​​the inner surface of the circuit board.

[0005] In summary, the camera device according to the embodiment of the present invention can prevent dust on the surface of components (such as electronic components or circuits) in the non-photosensitive area from adhering to the photosensitive module by covering the non-photosensitive area on the inner surface of the circuit board with a dustproof sheet, thereby ensuring the imaging quality of the photosensitive module and further enhancing the waterproof and dustproof effects of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a stereoscopic diagram of the first embodiment of the camera device of the present invention.

[0007] Figure 2 It is an exploded perspective view of the first embodiment of the camera device of the present invention.

[0008] Figure 3 FIG. 4 is a cross-sectional view of a first embodiment of a camera device according to the present invention.

[0009] Figure 4 FIG. 4 is a cross-sectional view of a second embodiment of a camera device according to the present invention.

[0010] Figure 5 It is a cross-sectional view of a third embodiment of a camera device according to the present invention.

[0011] Figure 6 FIG. 4 is a cross-sectional view of a fourth embodiment of a camera device according to the present invention.

[0012] Wherein, the reference numerals are:

[0013] 1 Camera device

[0014] 10 Outer cover

[0015] 11 First End

[0016] 12 Second End

[0017] 121 Outer Ring

[0018] 122 ring groove

[0019] 13 Axis hole

[0020] 20 shots

[0021] 30 Circuit Boards

[0022] 31Inner surface

[0023] 32 photosensitive areas

[0024] 33 Non-photosensitive area

[0025] 34First Assembly Department

[0026] 35 photosensitive module

[0027] 36 Frame

[0028] 37 Photosensitive element

[0029] 40 dustproof sheet

[0030] 41 annular connection part

[0031] 42 Second Assembly Department

[0032] 43,43' through hole

[0033] 45 sealing ring

[0034] 50 base

[0035] B bolt

[0036] C Conductive circuit

[0037] E1~E3 electronic components

[0038] L Curing glue layer

[0039] G glue layer DETAILED DESCRIPTION

[0040] Various embodiments are presented below for detailed description. However, the embodiments are only used as examples and do not limit the scope of the invention. In addition, some components are omitted in the drawings of the embodiments to clearly show the technical features of the invention. The same reference numerals will be used to represent the same or similar components in all drawings of the embodiments.

[0041] Figure 1 is a stereoscopic diagram of a first embodiment of a camera device according to the present invention, Figure 2 is an exploded perspective view of a first embodiment of a camera device according to the present invention, Figure 3 FIG. 2 is a cross-sectional view of a first embodiment of a camera device according to the present invention. Figures 1 to 3 As shown, in this embodiment, the camera device 1 includes an outer cover 10, a lens 20, a circuit board 30 and a dustproof sheet 40. In some embodiments, the camera device 1 can be applied to various electronic products to capture images around the electronic products. For example, the camera device 1 can be applied to electronic products such as automotive products (such as driving recorders, reversing imaging systems or surround image systems), mobile devices (such as smart phones, tablet computers or notebook computers) or cameras.

[0042] like Figures 1 to 3 As shown, the outer cover 10 includes an axial hole 13 and a first end 11 and a second end 12 axially opposite to each other. In the present embodiment, the axial hole 13 passes through the first end 11 and the second end 12 of the outer cover 10, so that the outer cover 10 is annular and hollow, wherein the shape of the axial hole 13 can be a circular hole, an elliptical hole, a square hole or other irregular holes, which is not limited.

[0043] like Figures 1 to 3 As shown, the lens 20 is disposed at the first end 11 of the outer cover 10 to correspond to one end of the shaft hole 13. In the present embodiment, the lens 20 is fixed to the first end 11 of the outer cover 10 by means of adhesion, and a partial area of ​​the lens 20 further extends into the shaft hole 13. For example, during the assembly process of the lens 20, a photocurable adhesive layer may be provided around the first end 11 of the outer cover 10. After the lens 20 is placed on the photocurable adhesive layer and the focal length is adjusted, the photocurable adhesive layer may be irradiated with a specific light. For example, when the photocurable adhesive layer is an ultraviolet light-curable adhesive layer, the photocurable adhesive layer is irradiated with ultraviolet light to pre-cure the photocurable adhesive layer to prevent the lens 20 from shifting. Finally, the pre-cured lens 20 is baked to thermally cure the photocurable adhesive layer to form a cured adhesive layer L to fix the lens 20 to the first end 11 of the outer cover 10. However, this is not limited to the present invention, and the lens 20 may also be fixed to the outer cover 10 by means of a general adhesive.

[0044] In some embodiments, the lens 20 may also be fixed to the first end 11 of the outer cover 10 by other means such as snap-fit, screw-lock or welding.

[0045] like Figures 1 to 3 As shown, the circuit board 30 is disposed at the second end 12 of the outer cover 10 to cover the other end of the shaft hole 13. The circuit board 30 includes an inner surface 31 located in the shaft hole 13. The inner surface 31 has a photosensitive area 32 and a non-photosensitive area 33. The photosensitive area 32 is provided with a photosensitive module 35 to correspond to the lens 20, so that the external light can pass through the shaft hole 13 and focus on the photosensitive module 35 after entering from the lens 20, so that the photosensitive module 35 can sense and obtain an image. The non-photosensitive area 33 can be other areas of the inner surface 31 relative to the photosensitive area 32. For example, in this embodiment, the photosensitive area 32 is located at the center of the inner surface 31 of the circuit board 30. The non-photosensitive area 33 is other areas outside the photosensitive area 32 and surrounds the photosensitive area 32. A plurality of conductive circuits C and electronic components E1-E3 (such as a microprocessor, a resistor or a capacitor, etc.) can be provided on the non-photosensitive area 33.

[0046] In some embodiments, the photosensitive module 35 may be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a complementary metal-oxide semiconductor active pixel sensor (CMOS active pixel sensor).

[0047] like Figures 1 to 3 As shown, the dustproof sheet 40 is disposed in the shaft hole 13 of the outer cover 10, and the dustproof sheet 40 covers the non-photosensitive area 33 of the inner surface 31 of the circuit board 30. In this way, the dustproof sheet 40 can prevent the dust inside the lens 20 from affecting the photosensitive module 35, that is, the dustproof sheet 40 can prevent the dust on the surface of each component (such as the above-mentioned conductive circuit C and electronic components E1-E3) on the non-photosensitive area 33 of the inner surface 31 from being lifted up when the camera device 1 is installed to other components or actuated, so as to prevent the dust inside the camera device 1 from adhering to the photosensitive module 35 to ensure the imaging quality of the photosensitive module 35. In addition, since the conductive circuit C and the electronic components E1-E3 on the circuit board 30 are covered by the dustproof sheet 40, the waterproof and dustproof effects of the circuit board 30 can be further enhanced, and the dustproof sheet 40 can contact the circuit board 30, so that the heat energy generated by the circuit board 30 can be conducted through the dustproof sheet 40 to achieve the effect of helping heat dissipation.

[0048] In some embodiments, the dustproof sheet 40 may be a sheet made of materials such as plastic, rubber, silicone or paper.

[0049] In some embodiments, the dustproof sheet 40 can be fixed on the non-photosensitive area 33 of the inner surface 31 of the circuit board 30. For example, the dustproof sheet 40 can be fixed on the non-photosensitive area 33 by means of buckles, stoppers, screws or adhesives, so as to prevent the dustproof sheet 40 from shifting and affecting the waterproof and dustproof effects.

[0050] As above, Figures 1 to 3 As shown, in this embodiment, the circuit board 30 and the dustproof sheet 40 are locked together at the second end 12 of the outer cover 10. Specifically, the circuit board 30 has at least one first assembly portion 34 (here, two first assembly portions 34, but the number of the first assembly portions 34 is not limited), wherein the two first assembly portions 34 can be locking holes or through holes and are respectively adjacent to two opposite corners of the circuit board 30. The dustproof sheet 40 has at least one second assembly portion 42 (here, two second assembly portions 42, but the number of the second assembly portions 42 is not limited), wherein the two second assembly portions 42 may be lock holes or through holes respectively and are respectively adjacent to two opposite corners of the dustproof sheet 40, and the two first assembly portions 34 respectively correspond to the two second assembly portions 42 and are fixed to the second end 12 of the outer cover 10 together. For example, in the present embodiment, during the assembly process of the circuit board 30 and the dustproof sheet 40, two bolts B are respectively passed through the two first assembly portions 34 of the circuit board 30 and the two second assembly portions 42 of the dustproof sheet 40 and are correspondingly screwed and fixed to the second end 12 of the outer cover 10, so that the circuit board 30 and the dustproof sheet 40 are locked together at the second end 12 of the outer cover 10. In some embodiments, the circuit board 30 and the dustproof sheet 40 may also be fixed to the outer cover 10 by different fixing methods respectively, which is not limited.

[0051] For example Figures 1 to 3 As shown, in this embodiment, the photosensitive module 35 includes an outer frame 36 and a photosensitive element 37 located in the outer frame 36, and the photosensitive element 37 corresponds to the lens 20. The dustproof sheet 40 includes a through hole 43, and the through hole 43 corresponds to the photosensitive element 37, so that the photosensitive element 37 is exposed through the through hole 43 to expose the dustproof sheet 40 to sense the light entering from the lens 20. In addition, the dustproof sheet 40 is a flexible sheet (such as a rubber sheet or a silicone sheet) and is pressed against the outer frame 36. Specifically, the size of the through hole 43 of the dustproof sheet 40 can be roughly the same as the size of the photosensitive element 37 (for example, the size of the through hole 43 is equal to or slightly larger than the size of the photosensitive element 37). When the dustproof sheet 40 is covered on the circuit board 30 and the through hole 43 corresponds to the photosensitive element 37, based on the flexibility of the dustproof sheet 40, the local area of ​​the dustproof sheet 40 adjacent to the through hole 43 can be pressed against the outer frame 36, and the other areas of the dustproof sheet 40 cover the non-photosensitive area 33 of the circuit board 30, thereby further preventing dust on the outer frame 36 from adhering to the photosensitive element 37.

[0052] Or, if Figure 4, which is a cross-sectional view of a second embodiment of the camera device of the present invention. The difference between this embodiment and the first embodiment is at least that the dustproof sheet 40 and the non-photosensitive area 33 of the circuit board 30 are fixed to each other by a glue layer G. Thus, the glue layer G can not only achieve the effect of fixing the dustproof sheet 40 and the circuit board 30, but also further prevent dust on the surface of each component in the non-photosensitive area 33 from adhering to the photosensitive module 35. In some embodiments, the glue layer G can be a thermally conductive glue layer or a thermally conductive paste layer, so that the circuit board 30 can further conduct heat through the glue layer G to achieve the effect of heat dissipation.

[0053] Or, if Figure 5 , which is a cross-sectional view of the third embodiment of the camera device of the present invention. The difference between this embodiment and the first embodiment is at least that the size of the through hole 43' of the dustproof sheet 40 is larger than the size of the entire photosensitive module 35, whereby when the dustproof sheet 40 covers the circuit board 30 and the through hole 43' corresponds to the photosensitive module 35, the entire photosensitive module 35 can be located in the through hole 43' and the dustproof sheet 40 is exposed, that is, the photosensitive module 35 will not be covered by the dustproof sheet 40 to sense the light entering from the lens 20, and the dustproof sheet 40 can also cover the non-photosensitive area 33 of the inner surface 31 of the circuit board 30 evenly.

[0054] like Figures 1 to 3 As shown, in this embodiment, the camera device 1 further includes a base 50, and the second end 12 of the outer cover 10 has an outer ring 121, wherein the outer ring 121 is not fixed to the circuit board 30, and the outer ring 121 is fixed to the base 50, and there is an annular groove 122 between the base 50 and the outer ring 121, and a sealing ring 45 is provided in the annular groove 122, so that a completely sealed space is formed between the outer cover 10 and the base 50 to prevent external dust from entering the camera device 1 and affecting the photosensitive module 35. In some embodiments, the annular groove 122 can be recessed at the second end 12 of the outer cover 10 (such as Figure 3 As shown) or on the base 50, but this is not limited.

[0055] In some embodiments, the sealing ring 45 may be made of materials such as plastic, rubber or silicone.

[0056] For example Figures 1 to 3 As shown, in this embodiment, the dust-proof sheet 40 and the sealing ring 45 are an integrally formed structure, for example, the dust-proof sheet 40 and the sealing ring 45 can be made of rubber or silicone material and are integrally injection molded, so that the dust-proof sheet 40 and the sealing ring 45 can be manufactured and assembled together, thereby reducing the process and assembly procedures and saving costs. In addition, there is an annular connecting portion 41 between the dust-proof sheet 40 and the sealing ring 45, and the second end 12 of the outer cover 10 is pressed against the annular connecting portion 41, so that the dust-proof sheet 40 can firmly cover the non-photosensitive area 33 and enhance the dust-proof effect to the outside.

[0057] Or, if Figure 6 The difference between this embodiment and the first embodiment is at least that the dustproof sheet 40 and the sealing ring 45 are separate structures, so that the dustproof sheet 40 and the sealing ring 45 can be made of different materials according to different needs.

[0058] In summary, the camera device according to the embodiment of the present invention can prevent dust on the surface of components (such as electronic components or circuits) in the non-photosensitive area from adhering to the photosensitive module by covering the non-photosensitive area on the inner surface of the circuit board with a dustproof sheet, thereby ensuring the imaging quality of the photosensitive module and further enhancing the waterproof and dustproof effects of the circuit board.

[0059] Although the technical contents of the present invention have been disclosed in the above content with preferred embodiments, it is not used to limit the present invention. Slight changes and modifications made by technical personnel in this field without departing from the spirit of the present invention should all be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the contents defined in the appended claims.

Claims

1. A camera device, characterized in that: The camera device comprises: An outer cover, comprising an axial hole and a first end and a second end axially opposite to each other, wherein the second end of the outer cover has an outer circumference; A lens, disposed at the first end of the outer cover; A circuit board is disposed at the second end of the outer cover, the circuit board comprises an inner surface located in the shaft hole, the inner surface has a photosensitive area and a non-photosensitive area, and the photosensitive area is provided with a photosensitive module to correspond to the lens; and A dustproof sheet is disposed in the shaft hole of the outer cover, and the dustproof sheet contacts and covers the non-photosensitive area of ​​the inner surface of the circuit board; The base is fixed on the base, and there is an annular groove between the base and the outer annular groove, a sealing ring is arranged in the annular groove, an annular connecting part is arranged between the dustproof sheet and the sealing ring, the annular connecting part is integrally connected to the dustproof sheet and the sealing ring, and the second end of the outer cover is pressed against the annular connecting part.

2. The imaging device according to claim 1, wherein: The dustproof sheet is fixed on the non-photosensitive area.

3. The imaging device according to claim 2, wherein: The dustproof sheet and the non-photosensitive area are fixed to each other by a glue layer.

4. The imaging device according to claim 2, wherein: The circuit board has a first assembly part, the dustproof sheet has a second assembly part, the first assembly part and the second assembly part correspond to each other and are fixed to the second end of the outer cover together.

5. The imaging device according to claim 1, wherein: The photosensitive module includes an outer frame and a photosensitive element located in the outer frame, and the dustproof sheet includes a through hole, and the through hole corresponds to the photosensitive element to expose the photosensitive element.

6. The imaging device according to claim 5, wherein: The dustproof sheet is a flexible sheet and is pressed against the outer frame.

7. The imaging device according to claim 1, wherein: The dustproof sheet includes a through hole, and the photosensitive module is located in the through hole.

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