Stretchable display panel

Abstract

A stretchable display panel includes a first stretchable film, a first transparent optical adhesive, a patterned organic layer, a plurality of light-emitting elements, and a plurality of conductive lines. The first transparent optical adhesive is located on the first stretchable film. The patterned organic layer includes a plurality of first island portions and a plurality of first bridging portions. Adjacent first island portions are connected via corresponding first bridging portions. The light-emitting elements are located above the first island portions. The first transparent optical adhesive is located between the light-emitting elements and the first stretchable film. A first surface of the patterned organic layer faces away from the light-emitting elements. An angle between the first surface and a first side surface of the first island portion is greater than 90 degrees. The conductive lines are located above the first bridging portions.

Description

Technical Field

[0001] The present invention relates to a stretchable display panel. Background Art

[0002] With the highly developed electronic technology, electronic products are constantly updated. In order to enable electronic products to be applied in various different fields, the characteristics of stretchability, thinness and lightness, and unrestricted appearance have gradually been emphasized. That is to say, electronic products are gradually required to have different appearances according to different application methods and application environments. Therefore, electronic products need to have stretchability. For example, a stretchable display device can be integrated on a spherical surface to obtain a spherical display device. Summary of the Invention

[0003] The present invention provides a stretchable display panel, which can improve the problem of breakage after stretching.

[0004] At least one embodiment of the present invention provides a stretchable display panel. The stretchable display panel includes a first stretchable film, a first transparent optical adhesive, a patterned organic layer, a plurality of light-emitting elements, and a plurality of conductive lines. The first transparent optical adhesive is located on the first stretchable film. The patterned organic layer includes a plurality of first island-shaped portions and a plurality of first bridging portions. Adjacent first island-shaped portions are connected via corresponding first bridging portions. The light-emitting elements are located above the first island-shaped portions. The first transparent optical adhesive is located between the light-emitting elements and the first stretchable film. The first surface of the patterned organic layer faces away from the light-emitting elements. The angle between the first surface and the first side surface of the first island-shaped portion is greater than 90 degrees. The conductive lines are located above the first bridging portions. Description of the Drawings

[0005] Figure 1A FIG. Figure 1B is a partial top view of a stretchable display panel according to an embodiment of the present invention.

[0006] Figure 2A FIG. Figure 1A is a schematic cross-sectional view taken along line a-a' of

[0007] Figure 2B FIG. Figure 1A is a schematic cross-sectional view taken along line b-b' of

[0008] Figures 3A to 3G is a schematic cross-sectional view of a manufacturing method of a stretchable display panel according to an embodiment of the present invention.

[0009] Figure 4 is a top view of a stretchable display panel according to an embodiment of the present invention.

[0010] Figure 5 is a schematic cross-sectional view of a stretchable display panel according to an embodiment of the present invention.

[0011] Description of the reference numerals:

[0012] 10, 20: Stretchable display panel

[0013] 100: First stretchable film

[0014] 110: First transparent optical adhesive

[0015] 120’: Organic layer

[0016] 120: Patterned organic layer

[0017] 122: First surface

[0018] 124: Second surface

[0019] 126: First side

[0020] 128: Second side

[0021] 130: Patterned insulating structure

[0022] 132: Bottom surface

[0023] 140: Second stretchable film

[0024] 150: Second transparent optical adhesive

[0025] BF: Barrier layer

[0026] BP1: First buffer layer

[0027] BP2: Second buffer layer

[0028] BP3: Third buffer layer

[0029] BP4: Fourth buffer layer

[0030] CC: Connection structure

[0031] CH: Semiconductor channel layer

[0032] CS Carrier board

[0033] D: Drain

[0034] E: Electrode

[0035] E1: First direction

[0036] E2: Second direction

[0037] F: Arrow

[0038] GE: Gate

[0039] GI: Gate insulating layer

[0040] H: Hole

[0041] ILD: Interlayer Dielectric Layer

[0042] L1, L2: Distance

[0043] LD: Light Emitting Device

[0044] M1: First Conductive Layer

[0045] M2: Second Conductive Layer

[0046] M3: Third Conductive Layer

[0047] O: Opening

[0048] OC: Overlay

[0049] PL1: First Insulating Layer

[0050] PL2: Second Insulating Layer

[0051] PL3: Third Insulating Layer

[0052] PR: Patterned Mask Layer

[0053] S: Source

[0054] SL: Signal Line

[0055] SL1: First Signal Line

[0056] SL1a, SL2a: Transmission Portion

[0057] SL1b, SL2b: Connection Portion

[0058] SL2: Second Signal Line

[0059] T1, T2, T3, T4: Thickness

[0060] TFT: Thin Film Transistor

[0061] TH1: Through Hole

[0062] TP1: First Island Portion

[0063] TP2: Second Island Portion

[0064] TS, TS’: Temporary Substrate

[0065] V1, V2: Via Hole

[0066] W1, W2, W3, W4: Width

[0067] WP1: First Bridging Portion

[0068] WP2: Second Bridging Portion

[0069] α, β, γ, θ1, θ2: included angles Detailed implementation manners

[0070] Figure 1A and Figure 1B is a partial top view of a stretchable display panel according to an embodiment of the present invention, wherein Figure 1B is Figure 1A the state of the stretchable display panel after being stretched in the direction of arrow F. Figure 2A is along Figure 1A a schematic cross-sectional view taken along line a-a' of Figure 2B is along Figure 1A a schematic cross-sectional view taken along line b-b' of Figure 1A and Figure 1B show a first stretchable film 100, a patterned organic layer 120, a patterned insulating structure 130, and a light-emitting element LD, and other components are omitted from being shown.

[0071] Please refer to Figure 1A , Figure 1B , Figure 2A and Figure 2B , the stretchable display panel 10 includes a first stretchable film 100, a first transparent optical adhesive 110, a patterned organic layer 120, a plurality of light-emitting elements LD, and a plurality of conductive lines SL. In this embodiment, the stretchable display panel 10 further includes a patterned insulating structure 130, a second stretchable film 140, a second transparent optical adhesive 150, and a cover layer OC.

[0072] The patterned organic layer 120 includes a plurality of first island-shaped portions TP1 and a plurality of first bridging portions WP1. Adjacent first island-shaped portions TP1 are connected via corresponding first bridging portions WP1. The width W1 of each first bridging portion WP1 is smaller than the width W2 of each first island-shaped portion TP1. In Figure 1A the embodiment of Figure 1AIn an embodiment, the width W2 of the first island-shaped portion TP1 is parallel to the side of the light-emitting element LD. The first island-shaped portions TP1 are arranged in an array along a first direction E1 and a second direction E2. Both ends of at least a part of the first bridging portion WP1 are respectively connected to two corresponding first island-shaped portions TP1. At least two of the first island-shaped portions TP1 are separated by a through hole TH1. In this embodiment, each through hole TH1 is surrounded by four corresponding ones of the first island-shaped portions TP1 and four corresponding ones of the first bridging portions WP1. In this embodiment, the through hole TH1 of the patterned organic layer 120 is dumbbell-shaped, a part of the through hole TH1 extends along the first direction E1, and another part of the through hole TH1 extends along the second direction E2. The part of the through hole TH1 extending along the first direction E1 and the other part of the through hole TH1 extending along the second direction E2 are alternately arranged, thereby improving the stretchability of the stretchable display panel 10.

[0073] In some embodiments, the material of the patterned organic layer 120 includes polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES), or polyarylate, or a combination thereof, or other suitable materials. In some embodiments, the patterned organic layer 120 is selected from materials that can withstand the temperature of the thin-film transistor process. In some embodiments, the thickness T1 of the patterned organic layer 120 is 0.5 micrometers to 10 micrometers.

[0074] The patterned insulating structure 130 is located on the patterned organic layer 120. In this embodiment, the patterned insulating structure 130 includes a first insulating layer PL1, a second insulating layer PL2, and a third insulating layer PL3, and selectively includes a first buffer layer BP1, a second buffer layer BP2, and a third buffer layer BP3.

[0075] The first insulating layer PL1 is located above the patterned organic layer 120. In some embodiments, a first buffer layer BP1 is selectively included between the first insulating layer PL1 and the patterned organic layer 120.

[0076] The second insulating layer PL2 is located above the first insulating layer PL1. In some embodiments, a second buffer layer BP2 is selectively included between the second insulating layer PL2 and the first insulating layer PL1.

[0077] The third insulating layer PL3 is located above the second insulating layer PL2. In some embodiments, a third buffer layer BP3 is selectively included between the third insulating layer PL3 and the second insulating layer PL2.

[0078] In some embodiments, the patterned insulating structure 130 includes organic and inorganic insulating materials, and the method of forming the patterned insulating structure 130 includes a photolithography process and an etching process. For example, the first insulating layer PL1, the second insulating layer PL2, and the third insulating layer PL3 all include cured photoresist materials, and the first buffer layer BP1, the second buffer layer BP2, and the third buffer layer BP3 include cured photoresist materials or inorganic materials etched to form a pattern. In other words, the patterned insulating structure 130 includes a stack of multiple layers of cured photoresist layers and multiple layers of inorganic layers.

[0079] In this embodiment, the patterned insulating structure 130 includes a plurality of second island portions TP2 and a plurality of second bridging portions WP2. Adjacent second island portions TP2 are connected via corresponding second bridging portions WP2. The width W3 of each second bridging portion WP2 is smaller than the width W4 of each second island portion TP2. In Figure 1A the embodiment, the width W3 of the second bridging portion WP2 is parallel to the side of the light-emitting element LD. In Figure 1A the embodiment, the width W4 of the second island portion TP2 is parallel to the side of the light-emitting element LD. The second island portions TP2 are arranged in an array along a first direction E1 and a second direction E2. At least one end of at least some of the second bridging portions WP2 is respectively connected to two corresponding second island portions TP2. At least two of the second island portions TP2 are separated by vias TH2. In this embodiment, each via TH2 is surrounded by four corresponding ones of the second island portions TP2 and four corresponding ones of the second bridging portions WP2. In this embodiment, the via TH2 of the patterned insulating structure 130 is dumbbell-shaped, some of the vias TH2 extend along the first direction E1, and some of the other vias TH2 extend along the second direction E2. The vias TH2 extending along the first direction E1 and the other vias TH2 extending along the second direction E2 are arranged alternately, thereby improving the stretchability of the stretchable display panel 10. In this embodiment, the via TH2 of the patterned insulating structure 130 overlaps the via TH1 of the patterned organic layer 120, and the size of the via TH2 of the patterned insulating structure 130 is larger than the size of the via TH1 of the patterned organic layer 120. In other words, the area of the vertical projection of the patterned insulating structure 130 is smaller than the area of the vertical projection of the patterned organic layer 120.

[0080] In this embodiment, the first insulating layer PL1, the first buffer layer BP1, the second insulating layer PL2, the second buffer layer BP2, the third insulating layer PL3, and the third buffer layer BP3 of the patterned insulating structure 130 are located in the second island portion TP2, and the first insulating layer PL1, the first buffer layer BP1, the second insulating layer PL2, the second buffer layer BP2, the third insulating layer PL3, and the third buffer layer BP3 selectively extend into the second bridging portion WP2. In some embodiments, the thickness of the second bridging portion WP2 is less than the thickness of the second island portion TP2. For example, the second island portion TP2 includes more insulating layers and / or more buffer layers than the second bridging portion WP2, but the present invention is not limited thereto. In this embodiment, the second island portion TP2 includes multiple inorganic insulating layers (i.e., the first buffer layer BP1, the second buffer layer BP2, and the third buffer layer BP3), and the aforementioned inorganic insulating layers do not extend into the second bridging portion WP2 (i.e., the second bridging portion WP2 does not include the first buffer layer BP1, the second buffer layer BP2, and the third buffer layer BP3), thereby improving the problem of breakage of the second bridging portion WP2 after stretching.

[0081] In this embodiment, the patterned organic layer 120 has a first surface 122 and a second surface 124, where the first surface 122 faces the second surface 124. The second surface 124 of the patterned organic layer 120 faces the patterned insulating structure 130. In some embodiments, the area of the bottom surface 132 of the patterned insulating structure 130 in contact with the patterned organic layer 120 is less than the area of the second surface 124 of the patterned organic layer 120 facing the patterned insulating structure 130. In this embodiment, the width of the second bridging portion WP2 is less than the width of the first bridging portion WP1. In some embodiments, each second bridging portion WP2 is located on a corresponding one of the first bridging portions WP1, and the side surface of each second bridging portion WP2 is offset from the side surface of the corresponding one of the first bridging portions WP1. Specifically, the distance L1 between one side surface of the second bridging portion WP2 and the first bridging portion WP1 is greater than the distance L2 between the second bridging portion WP2 and the other side surface of the first bridging portion WP1. In Figure 1A an embodiment, the distance L1 and the distance L2 are parallel to the side of the light-emitting element LD. By offsetting the second bridging portion WP2 above the first bridging portion WP1, the problem of breakage of the wire SL in the second bridging portion WP2 caused by stress concentration can be avoided. Although in this embodiment, the second bridging portion WP2 is offset above the first bridging portion WP1, the present invention is not limited thereto. In other embodiments, the second bridging portion WP2 is aligned with the middle of the first bridging portion WP1. In other words, the distance L1 can selectively be equal to the distance L2.

[0082] The first conductive layer M1, the second conductive layer M2, and the third conductive layer M3 are located in the patterned insulating structure 130. In this embodiment, the first conductive layer M1 is located above the patterned organic layer 120 and selectively above the first buffer layer BP1. The second conductive layer M2 is located above the first insulating layer PL1 and selectively above the second buffer layer BP2, and the second conductive layer M2 is selectively electrically connected to the first conductive layer M1. For example, a part of the second conductive layer M2 is electrically connected to the first conductive layer M1 through the via hole V1 in the first insulating layer PL1. The second conductive layer M2 and the via hole V1 are formed together, for example. The third conductive layer M3 is located above the second insulating layer PL2 and selectively above the third buffer layer BP3, and the third conductive layer M3 is selectively electrically connected to the second conductive layer M2. For example, a part of the third conductive layer M3 is electrically connected to the second conductive layer M2 through the via hole V2 in the second insulating layer PL2. The third conductive layer M3 and the via hole V2 are formed together, for example.

[0083] In this embodiment, at least one of the first conductive layer M1, the second conductive layer M2, and the third conductive layer M3 includes a wire SL. The wire SL is located above the first bridging portion WP1 of the patterned organic layer 120 and in the second bridging portion WP2 of the patterned insulating structure 130. In some embodiments, some or all of the wire SL extends from the second bridging portion WP2 of the patterned insulating structure 130 into the second island portion TP2. In other words, the wire SL extends from above the first bridging portion WP1 into above the first island portion TP1.

[0084] In this embodiment, the first conductive layer M1, the second conductive layer M2, and the third conductive layer M3 all include a wire SL, and a part of the wire SL (the wire SL of the first conductive layer M1) directly contacts the patterned organic layer 120.

[0085] In this embodiment, the opening O of the third insulating layer PL3 overlaps the third conductive layer M3. In other words, the opening O exposes a part of the third conductive layer M3. A plurality of electrodes E are formed in the opening O and cover the third conductive layer M3 at the bottom of the opening O. In some embodiments, the electrode E includes a metal oxide, such as indium tin oxide, but the present invention is not limited thereto. The electrode E may include other conductive materials suitable for protecting the part of the third conductive layer M3 exposed by the opening O.

[0086] The light-emitting element LD is located above the first island portion TP1. The first surface 122 of the patterned organic layer 120 faces away from the light-emitting element LD. In this embodiment, the light-emitting element LD is located above the second island portion TP2 and is electrically connected to the electrode E through the conductive connection structure CC. In some embodiments, the conductive connection structure CC includes, for example, indium, tin, bismuth, conductive adhesive, a combination of the above materials, or other suitable materials. In some embodiments, the light-emitting element LD is placed on the electrode E through a mass transfer process. The light-emitting element LD is electrically connected to the third conductive layer M3 through the electrode E and is further electrically connected to the wires SL of the third conductive layer M3, the second conductive layer M2, and / or the first conductive layer M1 located in the second bridging portion WP2. In some embodiments, the light-emitting element LD includes an organic light-emitting diode, a micro light-emitting diode, or other light-emitting elements. The light-emitting element LD is electrically connected to the electrode E, for example, by eutectic bonding, conductive adhesive bonding, soldering, or other similar methods. In this embodiment, different color light-emitting elements LD are provided above each second island portion TP2 to form a color pixel. For example, a red display element, a green display element, and a blue display element are provided above each second island portion TP2.

[0087] In this embodiment, a plurality of cover layers OC are located on the plurality of second island portions TP2, and each cover layer OC is located on a corresponding second island portion TP2. The cover layer OC covers and encapsulates the corresponding light-emitting element LD. The cover layer OC is, for example, a transparent optical adhesive (or a transparent encapsulation adhesive) and is suitable for protecting the light-emitting element LD. In some embodiments, the cover layer OC is formed by inkjet printing or other suitable methods.

[0088] In some embodiments, the material of the first stretchable film 100 includes a thermoplastic polymer, such as thermoplastic polyurethane (TPU), silicone polymer, epoxy resin, or other suitable materials. In some embodiments, the thickness T2 of the first stretchable film 100 is 50 micrometers to 1000 micrometers.

[0089] The first transparent optical adhesive 110 is located on the first stretchable film 100. The first transparent optical adhesive 110 is located between the light-emitting element LD and the first stretchable film 100. In this embodiment, the first transparent optical adhesive 110 contacts the cover layer OC, and the first transparent optical adhesive 110 selectively contacts the second island portion TP2 and the second bridging portion WP2 of the patterned insulating structure 130. In some embodiments, the first transparent optical adhesive 110 is formed over the entire surface of the first stretchable film 100.

[0090] In some embodiments, the first transparent optical adhesive 110 is an optical clear adhesive, an acrylic adhesive, an ultraviolet curable adhesive, or other suitable adhesive materials. In some embodiments, the thickness of the first transparent optical adhesive 110 is 10 microns or more.

[0091] In some embodiments, the first stretchable film 100 and the first transparent optical adhesive 110 have a structure that is a whole surface and does not have through holes. In other words, the first stretchable film 100 and the first transparent optical adhesive 110 overlap the through holes TH1 of the patterned organic layer 120 and the through holes TH2 of the patterned insulating structure 130. In other embodiments, the first stretchable film 100 and the first transparent optical adhesive 110 can be a mesh structure, thereby enhancing the stretchability of the first stretchable film 100 and the first transparent optical adhesive 110.

[0092] In this embodiment, the angle θ1 between the first surface 122 of the patterned organic layer 120 and the first side surface 126 of the first island portion TP1 is greater than 90 degrees, as Figure 2A shown. In this embodiment, the angle θ1 between each side surface of the first island portion TP1 and the first surface 122 is greater than 90 degrees. In some embodiments, the angle θ2 between the first surface 122 of the patterned organic layer 120 and the second side surface 128 of the first bridging portion WP1 is greater than 90 degrees, as Figure 2B shown. In this embodiment, the angle θ2 between each side surface of the first bridging portion WP1 and the first surface 122 is greater than 90 degrees. Since the angle θ1 and the angle θ2 are greater than 90 degrees, the area of the second surface 124 of the patterned organic layer 120 close to the light-emitting element LD is larger than the area of the first surface 122 of the patterned organic layer 120 facing away from the light-emitting element LD.

[0093] In this embodiment, through the setting of the angle θ1 and the angle θ2, the patterned organic layer 120 can be more easily removed from the temporary substrate ( Figure 1A , Figure 2A and Figure 2B not shown). The description of the temporary substrate will be given in the following embodiments.

[0094] In some embodiments, the material of the second stretchable film 140 includes a thermoplastic polymer, such as thermoplastic polyurethane (TPU), silicone, epoxy resin, or other suitable materials. The material of the second stretchable film 140 and the material of the first stretchable film 100 can be the same or different from each other. In some embodiments, the thickness T3 of the second stretchable film 140 is 50 microns to 1000 microns.

[0095] The second transparent optical adhesive 150 is located on the second stretchable film 140. The second transparent optical adhesive 150 is located between the patterned organic layer 120 and the second stretchable film 140. In this embodiment, the second transparent optical adhesive 150 contacts the first surface 122 of the patterned organic layer 120. In some embodiments, the second transparent optical adhesive 150 is formed on the entire surface of the second stretchable film 140.

[0096] In some embodiments, the second transparent optical adhesive 150 is optical clear adhesive, acrylic adhesive, UV curable adhesive or other suitable adhesive materials. In some embodiments, the thickness of the second transparent optical adhesive 150 is 10 micrometers to 1000 micrometers. The thickness of the first transparent optical adhesive 110 and the thickness of the second transparent optical adhesive 150 are the same or different from each other.

[0097] In some embodiments, the second stretchable film 140 and the second transparent optical adhesive 150 are a whole surface without a through hole structure. In other words, the second stretchable film 140 and the second transparent optical adhesive 150 overlap the through hole TH1 of the patterned organic layer 120 and the through hole TH2 of the patterned insulating structure 130. In other embodiments, the second stretchable film 140 and the second transparent optical adhesive 150 can be a mesh structure to improve the stretchability of the second stretchable film 140 and the second transparent optical adhesive 150. In some embodiments, the second transparent optical adhesive 150 and the first transparent optical adhesive 110 are connected to each other or separated from each other in the through hole TH1 of the patterned organic layer 120. For example, Figure 2A and Figure 2B The first transparent optical adhesive 110 is shown filling the through hole TH1 and contacts the second transparent optical adhesive 150. In other embodiments, the first transparent optical adhesive 110 is not filled into the through hole TH1 of the patterned organic layer 120, the second transparent optical adhesive 150 is separated from the first transparent optical adhesive 110, and an air gap exists between the second transparent optical adhesive 150 and the first transparent optical adhesive 110.

[0098] Figures 3A to 3G is a cross-sectional schematic diagram of a method for manufacturing a stretchable display panel according to an embodiment of the present invention. It must be noted here that: Figures 3A to 3E The implementation examples are used Figure 1A , Figure 2A and Figure 2B The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here. Figures 3A to 3GTaking one of the vias TH1 and one of the vias TH2 of the stretchable display panel as an example for illustration, however, in fact, the patterned insulating structure 130 of the stretchable display panel may include a plurality of vias TH1 and a plurality of vias TH2.

[0099] Please refer to Figure 3A , and a temporary substrate TS is formed on the carrier substrate CS. The carrier substrate CS is, for example, a glass carrier substrate, a semiconductor carrier substrate, a metal carrier substrate, or other applicable carrier substrates. In some embodiments, the material of the temporary substrate TS may include polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES), or polyarylate, other suitable materials, or a combination of at least two of the foregoing materials, but the present invention is not limited thereto. In some embodiments, the thickness T4 of the temporary substrate TS is 5 micrometers to 50 micrometers.

[0100] Please refer to Figure 3B , and an organic layer 120' is formed on the temporary substrate TS. The material of the organic layer 120' includes polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonates, polyether sulfone, or polyarylate, or a combination thereof, or other suitable materials. In some embodiments, the organic layer 120' and the temporary substrate TS are selected from materials that can withstand the temperature of the thin-film transistor process. In some embodiments, the thickness T1 of the organic layer 120' is 0.5 micrometers to 10 micrometers.

[0101] In some embodiments, the organic layer 120' and the temporary substrate TS contain the same organic material (for example, both contain polyimide), but different elements, different groups, or different dopants are added to the foregoing organic material to make the organic layer 120' and the temporary substrate TS have different properties. For example, the organic layer 120' and the temporary substrate TS have different etching rates. In other embodiments, the organic layer 120' and the temporary substrate TS contain different organic materials.

[0102] Please refer to Figure 3C , and a patterned insulating structure 130, a light-emitting element LD, a cover layer OC, and a wire (not shown) are formed on the organic layer 120'. The patterned insulating structure 130 includes a second bridging portion (not shown) and a second island portion TP2.

[0103] Please refer to Figure 3D, a patterned mask layer PR is formed on the organic layer 120'. The patterned mask layer PR is, for example, a photoresist, and the patterned mask layer PR covers the patterned insulating structure 130, the light-emitting element LD, the cover layer OC, and a wire (not shown). In this embodiment, the patterned mask layer PR selectively coats the side surfaces of the patterned insulating structure 130. In other words, the patterned mask layer PR selectively fills the vias TH2 of the patterned insulating structure 130. However, the patterned mask layer PR exposes a part of the organic layer 120' at the bottom of the via TH2.

[0104] Please refer to Figure 3E , using the patterned mask layer PR as a mask, an etching process is performed to remove a part of the organic layer 120' and the temporary substrate TS, and a patterned organic layer 120 and a temporary substrate TS' are obtained. The patterned organic layer 120 includes a plurality of vias TH1.

[0105] In some embodiments, the etching process includes dry etching or wet etching, such as plasma etching. In some embodiments, the gas used in the plasma etching includes O2, Ar, CF4, SF6, or other suitable gases. In some embodiments, the etching rate of the organic layer 120' in the foregoing etching process is greater than the etching rate of the temporary substrate TS. Therefore, an included angle appears at the junction of the patterned organic layer 120 and the temporary substrate TS'. Specifically, the hole H formed by etching includes the via TH1 of the patterned organic layer 120 and the opening of the temporary substrate TS' overlapping the via TH1. On the side wall of the foregoing hole H, there is an included angle α between the side surface of the patterned organic layer 120 and the side surface of the temporary substrate TS'. Therefore, an included angle β greater than 90 degrees appears between the side surface and the bottom surface of the patterned organic layer 120, where the included angle β is Figure 2A the included angle θ1 or Figure 2B the included angle θ2. At the same time, an included angle γ greater than 90 degrees appears between the side surface and the top surface of the temporary substrate TS'.

[0106] Please refer to Figure 3F , the first stretchable film 100 and the first transparent optical adhesive 110 are bonded to the cover layer OC and selectively bonded to the patterned insulating structure 130. The structure on the temporary substrate TS' is lifted from the top surface of the temporary substrate TS' by bonding the first stretchable film 100 and the first transparent optical adhesive 110 to the cover layer OC. In this embodiment, since the included angle β between the side surface and the bottom surface of the patterned organic layer 120 is greater than 90 degrees, the patterned organic layer 120 can be easily lifted from the top surface of the temporary substrate TS'. In this embodiment, the first transparent optical adhesive 110 does not fill the vias TH1 and the vias TH2, but the present invention is not limited thereto. In other embodiments, the first transparent optical adhesive 110 fills the vias TH1 and the vias TH2.

[0107] In this embodiment, the carrier CS can be removed without laser lift-off process, thereby saving manufacturing cost. In addition, the thickness of the patterned organic layer 120 is smaller than the thickness of the temporary substrate TS', and removing the temporary substrate TS' helps to reduce the overall thickness of the device.

[0108] Please refer to Figure 3G , the second stretchable film 140 and the second transparent optical adhesive 150 are bonded to the patterned organic layer 120 , and now the stretchable display panel 10 is substantially completed.

[0109] Figure 4 is a top view of a stretchable display panel according to an embodiment of the present invention, wherein Figure 4 The patterned organic layer 120, the patterned insulating structure 130, the second conductive layer M2, the third conductive layer M3 and the light emitting element LD are shown, and other components are omitted. It must be explained here that Figure 4 The implementation examples are used Figure 1A , Figure 2A and Figure 2B The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0110] Please refer to Figure 4 The stretchable display panel 20 includes a first stretchable film ( Figure 4 Omitted from illustration), the first transparent optical adhesive ( Figure 4 ), a patterned organic layer 120, a patterned insulating structure 130, a plurality of light emitting elements LD, and a plurality of wires. In this embodiment, the second conductive layer M2 and the third conductive layer M3 include wires. In this embodiment, the wires include a plurality of first wires SL1 and a plurality of second wires SL2.

[0111] A plurality of first conductive lines SL1 extend along the first direction E1 and are electrically connected to the display elements LD on the second island TP2 arranged in the first direction E1. For example, in the present embodiment, the first conductive line SL1 includes a transmission portion SL1a belonging to the second conductive layer M2 and a connection portion SL1b belonging to the third conductive layer M3. The transmission portion SL1a is located in the second bridge portion WP2 of the patterned insulating structure 130 and extends into the second island TP2 of the patterned insulating structure 130. The connection portion SL1b is located in the second island TP2 of the patterned insulating structure 130 and is electrically connected to the transmission portion SL1a through the via V2.

[0112] In some embodiments, at least three corresponding light-emitting elements LD on each second island portion TP2 are electrically connected to the same corresponding first wire SL1. For example, the third insulating layer has three openings overlapping the connecting portion SL1b ( Figure 4 not shown), and three electrodes ( Figure 4 not shown) are respectively formed in the three openings. The three light-emitting elements LD are electrically connected to the connecting portion SL1b through the three electrodes. The first wire SL1 is, for example, suitable for transmitting a ground voltage signal or a common voltage signal.

[0113] A plurality of second wires SL2 extend along the second direction E2 and are electrically connected to the light-emitting elements LD on the second island portions TP2 arranged in the second direction E2. For example, in the present embodiment, the second wire SL2 includes a transmission portion SL2a belonging to the second conductive layer M2 and a connecting portion SL2b belonging to the third conductive layer M3. The transmission portion SL2a is located in the second bridging portion WP2 of the patterned insulating structure 130 and extends into the second island portion TP2 of the patterned insulating structure 130. The connecting portion SL2b is located in the second island portion TP2 of the patterned insulating structure 130 and is electrically connected to the transmission portion SL2a through a via hole V2. In the present embodiment, the width of the first wire SL1 is greater than the width of the second wire SL2.

[0114] In some embodiments, at least three corresponding light-emitting elements LD on each second island portion TP2 are respectively electrically connected to at least three corresponding second wires SL2. For example, the third insulating layer has three openings overlapping the connecting portion SL2b ( Figure 4 not shown), and three electrodes ( Figure 4 not shown) are respectively formed in the three openings. The three light-emitting elements LD are electrically connected to the connecting portion SL2b through the three electrodes.

[0115] It should be noted that Figure 4 the stretchable display panel 20 is a passive display device, and no active elements are provided in the patterned insulating structure 130, but the present invention is not limited thereto. In other embodiments, active elements are provided in the patterned insulating structure of the stretchable display panel, and the stretchable display panel is an active display device.

[0116] Figure 5 is a cross-sectional schematic view of a stretchable substrate according to an embodiment of the present invention. It must be noted here that Figure 5 the embodiment of Figure 1A , Figure 2A and Figure 2BElement numbers and partial content of the embodiments, where the same or similar numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, reference can be made to the foregoing embodiments and will not be elaborated here.

[0117] Please refer to Figure 5 , in this embodiment, the stretchable display panel 30 further includes an active element TFT. The active element TFT is located in the patterned insulating structure 130a and is electrically connected to the light-emitting element LD.

[0118] In this embodiment, the patterned insulating structure 130a includes a barrier layer BF, a gate insulating layer GI, an interlayer dielectric layer ILD, a first insulating layer PL1, a second insulating layer PL2, and a third insulating layer PL3. In this embodiment, the patterned insulating structure 130a selectively includes a first buffer layer BP1, a second buffer layer BP2, a third buffer layer BP3, and a fourth buffer layer BP4.

[0119] In some embodiments, the barrier layer BF, the gate insulating layer GI, the interlayer dielectric layer ILD, the first buffer layer BP1, the first insulating layer PL1, the second buffer layer BP2, the second insulating layer PL2, the third buffer layer BP3, the third insulating layer PL3, and the fourth buffer layer BP4 include organic or inorganic insulating materials. In some embodiments, the thicknesses of the first insulating layer PL1, the second insulating layer PL2, and the third insulating layer PL3 are each, for example, from 1 micron to 5 microns, and the thicknesses of the first buffer layer BP1, the second buffer layer BP2, the third buffer layer BP3, and the fourth buffer layer BP4 are each, for example, from 100 angstroms to 10,000 angstroms, but the present invention is not limited thereto. In some embodiments, the total thickness of the barrier layer BF, the gate insulating layer GI, and the interlayer dielectric layer ILD is from 0.5 micron to 5 microns, for example, about 1.8 microns, but the present invention is not limited thereto.

[0120] The barrier layer BF is located on the patterned organic layer 120. The semiconductor channel layer CH is located on the barrier layer BF. The gate insulating layer GI is located on the semiconductor channel layer CH. The gate GE in the first conductive layer M1 is located on the gate insulating layer GI and overlaps the semiconductor channel layer CH. The interlayer dielectric layer ILD is located on the first conductive layer M1 and the gate insulating layer GI. The drain D and the source S of the second conductive layer M2 are located on the interlayer dielectric layer ILD and are electrically connected to the semiconductor channel layer CH. In this embodiment, the active element TFT includes a gate G, a semiconductor channel layer CH, a drain D, and a source S. In this embodiment, the active element TFT is a top-gate thin-film transistor, but the present invention is not limited thereto. In other embodiments, the active element TFT is a bottom-gate thin-film transistor or other types of thin-film transistors.

[0121] The first buffer layer BP1, the first insulating layer PL1, and the second buffer layer BP2 are located on the second conductive layer M2 and the interlayer dielectric layer ILD. The third conductive layer M3 is located on the second buffer layer BP2, and at least a part of the third conductive layer M3 is electrically connected to the active element TFT. The second insulating layer PL2 and the third buffer layer BP3 are located on the third conductive layer M3 and the second buffer layer BP2. The fourth conductive layer M4 is located on the third buffer layer BP3, and at least a part of the fourth conductive layer M4 is electrically connected to the third conductive layer M3. The third insulating layer PL3 and the fourth buffer layer BP4 are located on the fourth conductive layer M4. The electrode E is located on the fourth buffer layer BP4, and at least a part of the electrode E is electrically connected to the active element TFT through the fourth conductive layer M4 and the third conductive layer M3. The light-emitting element LD is electrically connected to the electrode E through the conductive connection structure CC. In some embodiments, the conductive connection structure CC includes, for example, indium, tin, bismuth, conductive glue, a combination of the above materials, or other suitable materials.

[0122] The cover layer OC is located on the light-emitting element LD. The first stretchable film 100 is adhered to the cover layer OC through the first transparent optical glue 110. In some embodiments, the first stretchable film 100 is also adhered to the patterned insulating structure 130a through the first transparent optical glue 110. The second stretchable film 140 is adhered to the patterned organic layer 120 through the second transparent optical glue 150.

[0123] In summary, in the stretchable display panel according to the embodiments of the present invention, by designing an angle greater than 90 degrees in the patterned organic layer, the patterned organic layer can be easily torn off from the temporary substrate, thereby reducing the manufacturing cost and the overall device thickness.

Claims

1. A stretchable display panel, comprising: A first stretchable film; A first transparent optical adhesive located on the first stretchable film; A patterned organic layer, comprising: A plurality of first island portions; and A plurality of first bridging portions, wherein adjacent ones of the first island portions are connected via corresponding ones of the first bridging portions; A plurality of light-emitting elements located above the first island portions, wherein the first transparent optical adhesive is located between the light-emitting elements and the first stretchable film, and wherein a first surface of the patterned organic layer faces away from the light-emitting elements, and an angle between the first surface and a first side surface of the first island portions is greater than 90 degrees; and A plurality of conductive lines located above the first bridging portions.

2. The stretchable display panel according to claim 1, further comprising: A second stretchable film; And A second transparent optical adhesive located on the second stretchable film and contacting the first surface of the patterned organic layer.

3. The stretchable display panel according to claim 2, wherein the first stretchable film and the second stretchable film do not have through holes.

4. The stretchable display panel according to claim 1, further comprising: A plurality of cover layers covering the light-emitting elements, wherein the first transparent optical adhesive contacts the cover layers.

5. The stretchable display panel according to claim 1, wherein the patterned organic layer comprises polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, polyarylate or a combination thereof.

6. The stretchable display panel according to claim 1, further comprising: A patterned insulating structure located on the patterned organic layer and comprising a plurality of cured photoresist layers, and wherein the patterned insulating structure comprises: A plurality of second island portions located on the first island portions; and A plurality of second bridging portions located on the first bridging portions, and wherein adjacent ones of the second island portions are connected via corresponding ones of the second bridging portions.

7. The stretchable display panel according to claim 6, wherein widths of the second bridging portions are smaller than widths of the first bridging portions.

8. The stretchable display panel according to claim 6, further comprising: A plurality of active elements located in the second island portions, and the conductive lines are located in the second bridging portions, The active elements include thin film transistors.

9. The stretchable display panel according to claim 6, wherein each of the second island portions further comprises at least one inorganic insulating layer, and the at least one inorganic insulating layer does not extend into the second bridging portions.

10. The stretchable display panel according to claim 6, wherein thicknesses of the second bridging portions are smaller than thicknesses of the second island portions.

11. The stretchable display panel according to claim 6, wherein each of the second bridging portions is located on a corresponding one of the first bridging portions, and a side surface of each of the second bridging portions is offset from a side surface of the corresponding one of the first bridging portions.

12. The stretchable display panel according to claim 6, wherein an area of the patterned insulating structure contacting a bottom surface of the patterned organic layer is smaller than an area of a second surface of the patterned organic layer facing the patterned insulating structure.

13. The stretchable display panel according to claim 1, wherein some of the wires are in direct contact with the patterned organic layer.

14. The stretchable display panel according to claim 1, wherein the thickness of the patterned organic layer is from 0.5 micrometers to 10 micrometers.

15. The stretchable display panel according to claim 1, wherein the thickness of the first stretchable film is from 50 micrometers to 1000 micrometers.

16. The stretchable display panel according to claim 1, wherein the angle between the first surface of the patterned organic layer and a second side surface of the first bridging portions is greater than 90 degrees.

17. The stretchable display panel according to claim 1, wherein the area of a second surface of the patterned organic layer close to the light-emitting elements is larger than the area of the first surface.

18. The stretchable display panel according to claim 1, wherein the patterned organic layer has a plurality of through holes, each of the through holes being surrounded by corresponding four of the first island portions and corresponding four of the first bridging portions, and wherein the first stretchable film overlaps the through holes.

19. The stretchable display panel according to claim 1, wherein the material of the first stretchable film comprises thermoplastic polyurethane.

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