Antenna Package and Image Display Device

Abstract

An antenna package and an image display device are provided. The antenna package includes an antenna device having an antenna unit and a flexible printed circuit board electrically connected to the antenna unit. The flexible printed circuit board includes a core layer having a first surface and a second surface facing each other, a circuit wiring layer provided on the first surface of the core layer and including signal wirings electrically connected to the antenna unit, and a ground layer provided on the second surface of the core layer to cover the circuit wiring layer in a plan view. The ground layer partially includes a mesh structure.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority of Korean Patent Application No. 10 - 2020 - 0174205, filed with the Korean Intellectual Property Office (KIPO) on December 14, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board, and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi - Fi and Bluetooth are combined with image display devices in the form of smartphones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] According to the development of mobile communication technology, an antenna capable of implementing communication in a high - frequency band or an ultra - high - frequency band, for example, is required in a display device.

[0006] A circuit board for feeding and controlling signal transmission can be connected to an antenna for radiation driving of the antenna. If the driving frequency of the antenna increases, signal loss may increase. As the length of the transmission path through the circuit board increases, signal loss may further increase.

[0007] The circuit board can be bent, for example, to be connected to a driving integrated circuit chip. In this case, circuit wiring damage and bonding failure with the antenna may occur due to bending stress.

[0008] Recently, as the thickness of the image display device coupled with the antenna has been increasingly reduced, the degree of bending of the circuit board may also increase. In this case, the above - mentioned bending defects may be further deteriorated. Therefore, an antenna package structure that realizes the bending of the circuit board and the reliability of circuit connection while maintaining or improving the radiation characteristics of the antenna is required.

[0009] For example, Korean Patent Publication No. 2013 - 0095451 discloses an antenna integrated into a display panel, but does not teach an effective circuit connection as described above. Summary of the Invention

[0010] According to one aspect of the present invention, there is provided an antenna package having improved mechanical reliability and signal efficiency.

[0011] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved mechanical reliability and signal efficiency.

[0012] (1) An antenna package, comprising: an antenna device including an antenna element; and a flexible circuit board electrically connected to the antenna element, wherein the flexible circuit board includes: a core layer having a first surface and a second surface facing each other; a circuit wiring layer provided on the first surface of the core layer, the circuit wiring layer including signal wirings electrically connected to the antenna element; and a ground layer provided on the second surface of the core layer to cover the circuit wiring layer in a plan view, the ground layer partially including a mesh structure.

[0013] (2) The antenna package according to (1) above, wherein the flexible circuit board has a bonding area bonded to the antenna device, a bending area, and a main body area, and the bending area is located between the bonding area and the main body area, wherein the ground layer includes a bent portion provided on a portion of the core layer located in the bending area, and the bent portion has a mesh structure.

[0014] (3) The antenna package according to (2) above, wherein the ground layer includes a first solid portion provided on a portion of the core layer located in the bonding area and a second solid portion provided on a portion of the core layer located in the main body area.

[0015] (4) The antenna package according to (3) above, wherein the bent portion includes a mesh pattern formed by the mesh structure and a solid pattern.

[0016] (5) The antenna package according to (4) above, wherein the solid pattern overlaps with the signal wiring in a plan view.

[0017] (6) The antenna package according to (3) above, wherein the antenna element includes a radiator, a transmission line extending from the radiator, a signal pad connected to one end of the transmission line, and a ground pad provided around the signal pad, and the circuit wiring layer of the flexible circuit board further includes a ground pattern provided around one end of the signal wiring to overlap with the ground pad in a plan view.

[0018] (7) The antenna package according to (6) above, further comprising a via structure passing through the core layer and connecting the ground pattern and the first solid portion of the ground layer to each other.

[0019] (8) The antenna package according to (2) above, wherein the antenna device includes a plurality of antenna elements, and

[0020] the signal wirings of the circuit wiring layer include a plurality of signal wirings, and each of the signal wirings is independently connected to each of the plurality of antenna elements.

[0021] (9) The antenna package according to (8) above, wherein the signal wiring includes a zigzag portion, and the zigzag portion is provided on a portion of the core layer located in the bonding area.

[0022] (10) According to the antenna package of (9) above, wherein a plurality of signal lines continuously extend along the length direction of the flexible circuit board in the bending region and the main body region of the core layer.

[0023] (11) According to the antenna package of (9) above, it further includes an antenna driving integrated circuit chip disposed below the antenna device, and the flexible circuit board is bent below the antenna device through the bending region to be electrically connected to the antenna driving integrated circuit chip through the main body region.

[0024] (12) According to the antenna package of (11) above, it further includes an intermediate circuit board on which the antenna driving integrated circuit chip is mounted, wherein the intermediate circuit board is connected to the main body region of the flexible circuit board.

[0025] (13) An image display device, comprising: a display panel; and an antenna package according to the above-described embodiment disposed on the display panel.

[0026] (14) According to the image display device of (13) above, it further includes an antenna driving integrated circuit chip disposed below the display panel, wherein a portion of the flexible circuit board in the antenna package including a mesh structure is bent to be electrically connected to the antenna driving integrated circuit chip.

[0027] In the antenna package according to an exemplary embodiment of the present invention, the flexible circuit board connected to the antenna device may include a circuit wiring layer and a ground layer formed on the bottom surface and the top surface of the core layer of the flexible circuit board, respectively. The ground layer may overlap with the signal wiring included in the circuit wiring layer in a plan view to promote the generation of an electric field. Therefore, signal loss generated by the flexible circuit board can be suppressed and the feeding efficiency for the antenna device can be improved.

[0028] In an exemplary embodiment, the ground layer of the flexible circuit board may partially include a mesh structure. The mesh structure may be disposed in the bending region of the flexible circuit board to improve the bending stability of the flexible circuit board.

[0029] The mesh structure may be included in the bent portion of the flexible circuit board, and the bent portion may further include a solid pattern portion together with the mesh structure. The solid pattern portion may overlap with the signal wiring in a plan view to promote the formation of an electric field in the bent portion, thereby suppressing signal loss caused by the introduction of the mesh structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figures 1 to 3 is a schematic cross-sectional view and a top plan view showing an antenna package according to an exemplary embodiment.

[0031] Figure 4is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to an exemplary embodiment.

[0032] Figure 5 and Figure 6 is a schematic top plan view showing a flexible printed circuit board included in an antenna package according to some exemplary embodiments.

[0033] Figure 7 and Figure 8 are a schematic top plan view and a schematic cross-sectional view showing a flexible printed circuit board included in an antenna package according to some exemplary embodiments, respectively.

[0034] Figure 9 is a schematic cross-sectional view showing an image display device including an antenna package according to an exemplary embodiment. Detailed Description

[0035] According to an exemplary embodiment of the present invention, there is provided an antenna package including a combination of an antenna device and a flexible printed circuit board having a ground layer. According to an exemplary embodiment of the present invention, there is also provided an image display device including the antenna package.

[0036] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that these embodiments described with reference to the accompanying drawings are for further understanding the spirit of the present invention and are not intended to limit the subject matter to be protected disclosed in the detailed description and the appended claims.

[0037] Terms such as "first", "second", "upper", "lower", "top", "bottom", etc. used in the text do not represent absolute positions but are used relatively to distinguish different elements or different positions.

[0038] Figures 1 to 3 is a schematic cross-sectional view and a top plan view showing an antenna package according to an exemplary embodiment. Specifically, Figure 1 is a schematic cross-sectional view showing the antenna package. Figure 2 is a schematic top plan view showing the antenna device included in the antenna package. Figure 3 is a schematic top plan view showing the flexible printed circuit board included in the antenna package. Figure 3 is a top plan view in which the circuit wiring layer and the ground layer of the flexible printed circuit board are projected together.

[0039] Referring to Figure 1, the antenna package may include an antenna device 100 and a flexible circuit board 200 (e.g., a flexible printed circuit board (FPCB)). The flexible circuit board 200 may include a core layer 210 and a conductive layer formed on the surface of the core layer 210. The conductive layer may include, for example, a metal plating layer, such as a copper plating layer.

[0040] The conductive layer may include a circuit wiring layer 220 and a ground layer 230. In an exemplary embodiment, the core layer 210 may include a first surface 210a (e.g., a bottom surface) and a second surface 210b (e.g., a top surface) facing each other. The circuit wiring layer 220 and the ground layer 230 may be formed on the first surface 210a and the second surface 210b of the core layer 210, respectively.

[0041] For example, the core layer 210 may include a flexible resin, such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. The core layer 210 may include an inner insulating layer included in the circuit board 200.

[0042] Referring to Figure 2 , the antenna device 100 may include an antenna dielectric layer 110 and an antenna unit 120 disposed on the antenna dielectric layer 110.

[0043] The antenna dielectric layer 110 may include polyester resins, such as polyethylene terephthalate, poly(ethylene isophthalate), polyethylene naphthalate, and poly(butylene terephthalate); cellulose resins, such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins, such as poly(methyl)methacrylate and poly(ethyl)methacrylate; styrene resins, such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins, such as polyethylene, polypropylene, cycloolefin, or polyolefin having a norbornene structure and ethylene-propylene copolymer; vinyl chloride resins; amide resins, such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allylated resins; polyformaldehyde resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. They may be used alone or in combination of two or more.

[0044] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the antenna dielectric layer 110. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0045] In some embodiments, the dielectric constant of the antenna dielectric layer 110 can be adjusted to a range of approximately 1.5 to approximately 12. When the dielectric constant exceeds approximately 12, the driving frequency may be excessively reduced, so that it may not be possible to achieve driving at a desired high frequency band or ultra-high frequency band.

[0046] The antenna unit 120 can be formed on the top surface of the antenna dielectric layer 110. For example, a plurality of antenna units 120 can be arranged in an array form along the width direction of the antenna dielectric layer 110 or the antenna package to form a horizontal row of antenna patterns.

[0047] The antenna unit 120 can include a radiator 122 and a transmission line 124. The radiator 122 can have a shape such as a polygonal flat plate, and the transmission line 124 can extend from a side portion of the radiator 122. The transmission line 124 can be formed as a single member substantially integral with the radiator 122 and the width can be smaller than the width of the radiator 122.

[0048] The antenna unit 120 can further include a signal pad 126. The signal pad 126 can be connected to one end of the transmission line 124. In one embodiment, the signal pad 126 can be formed as a member substantially integral with the transmission line 124, and the end portion of the transmission line 124 can be used as the signal pad 126.

[0049] In some embodiments, a ground pad 128 can be provided around the signal pad 126. For example, a pair of ground pads 128 can be provided to face each other with the signal pad 126 interposed therebetween.

[0050] For example, the ground pad 128 can be electrically and physically separated from the transmission line 124 and the signal pad 126. The ground pad 128 can be used as a bonding pad to improve the bonding stability with the conductive bonding structure 150.

[0051] In an exemplary embodiment, the antenna unit or the radiator 122 can be designed to have a resonant frequency corresponding to a high frequency band or an ultra-high frequency band of, for example, a 3G, 4G, 5G or higher frequency band. In a non-limiting example, the resonant frequency of the antenna unit can be above approximately 10 GHz, or from approximately 20 GHz to 40 GHz (for example, approximately 28 GHz or approximately 38 GHz).

[0052] The antenna unit 120 can include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca) or an alloy containing at least one of these metals. They can be used alone or in combination.

[0053] In one embodiment, the antenna unit 120 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa)) to achieve a low resistance and a thin linewidth pattern.

[0054] In some embodiments, the antenna unit 120 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0055] In some embodiments, the antenna unit 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a bilayer structure of a transparent conductive oxide layer - metal layer, or a trilayer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, flexibility can be improved by the metal layer, and the signal transmission speed can be increased by the low resistance of the metal layer. Corrosion resistance and transparency can be improved by the transparent conductive oxide layer.

[0056] In some embodiments, the radiator 122 and the transmission line 124 may have a mesh pattern structure to improve the light transmittance. In this case, a dummy mesh electrode (not shown) may be formed around the radiator 122 and the transmission line 124.

[0057] Considering the reduction of the feeding resistance, the noise absorption efficiency, etc., the signal pad 126 and the ground pad 128 may be solid patterns formed of the above-mentioned metal or alloy. In one embodiment, at least a part of the transmission line 124 may include a solid structure.

[0058] The antenna unit 120 may include a blackened portion, so that the reflectance of the surface of the antenna unit 120 can be reduced to suppress the visual recognition of the antenna unit due to light reflection.

[0059] In one embodiment, the surface of the metal layer included in the antenna unit 120 may be converted into a metal oxide or a metal sulfide to form a blackened layer. In one embodiment, a blackened layer, such as a black material coating or plating, may be formed on the antenna unit 120 or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one of them.

[0060] Considering the reflection reduction effect and the antenna radiation characteristics, the composition and thickness of the blackened layer can be adjusted.

[0061] In some embodiments, the antenna ground layer 130 may be formed on the bottom surface of the antenna dielectric layer 110. The antenna ground layer 130 may overlap with the radiator 122 of the antenna element 120 in the thickness direction. An electric field or inductance may be generated between the radiator 122 and the antenna ground layer 130, thereby enabling an antenna with substantially vertical radiation to be realized.

[0062] In one embodiment, the antenna ground layer 130 may completely cover the radiator in a plan view and may not overlap with the pads 126 and 128.

[0063] The antenna ground layer 130 may include the above-mentioned metal and / or alloy. In some embodiments, the antenna ground layer 130 may be included as an independent element of the antenna device 100. In some embodiments, the conductive member of the image display device employing the antenna device 100 may be used as the antenna ground layer 130.

[0064] The conductive member may include, for example, the gate electrode of a thin film transistor (TFT), various wirings such as scan lines or data lines, or various electrodes such as pixel electrodes and common electrodes.

[0065] In one embodiment, various structures including a conductive material provided under the display panel may be used as the antenna ground layer 130. For example, a metal plate (e.g., a stainless steel plate, e.g., a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digital converter, etc. may be used as the antenna ground layer 130.

[0066] In one embodiment, the ground layer 230 of the flexible printed circuit board 200 may face the antenna element 110. In this case, the ground layer 230 may be formed on the first surface 210a of the core layer 210, and the circuit wiring layer 220 may be formed on the second surface 210b of the core layer 210.

[0067] For example, the circuit wiring layer 220 may be electrically connected to the antenna element 120 through a via structure or a contact penetrating the core layer 210.

[0068] Referring to Figure 3 , the flexible printed circuit board 200 may include a bonding region I, a bending region II, and a main body region III. The bonding region I may be a region where the signal pad 126 of the antenna device 100 and the circuit wiring layer 220 of the flexible printed circuit board 200 are electrically connected or bonded to each other.

[0069] As described above, the circuit wiring layer 220 may be formed on the first surface 210a of the core layer 210. The circuit wiring layer 220 may include signal wirings 222, 224, and 226.

[0070] In some embodiments, at least two antenna units 120 may be coupled through signal wirings 222, 224, and 226. For example, signal wirings 222, 224, and 226 may include a combined wiring 222 and 224 and a drive signal wiring 226.

[0071] The combined wiring 222 and 224 may include a first combined wiring 222 and a second combined wiring 224. The first combined wiring 222 may be joined to a signal pad 126 of the antenna unit 120. For example, two radiators 120 may be coupled through the first combined wiring 222 to form a radiation group. The second combined wiring 224 may be connected to a plurality of first combined wirings 222, thereby coupling the plurality of radiation groups to each other.

[0072] One end of the drive signal wiring 226 may branch from the second combined wiring 224. The drive signal wiring 226 may extend on a part of the core layer 210 in the main body region III, and the other end of the drive signal wiring 226 may be electrically connected to an antenna drive integrated circuit (IC) chip.

[0073] In some embodiments, the first combined wiring 222 extends on a part of the core layer 210 in the bending region II, and the second combined wiring 224 may extend on the parts of the core layer 210 in the entire bending region II and the main body region III.

[0074] As described above, one end of a signal wiring (e.g., the first combined wiring 222) may be joined to the signal pad 126 of the antenna unit 120 in the joining region I.

[0075] For example, a conductive joining structure 150 (e.g., an anisotropic conductive film (ACF)) may be provided on pads 126 and 128 of the antenna unit 120, and the joining region I of the flexible circuit board 200 may be attached to the conductive joining structure 150. Thereafter, an electrical connection between the signal wirings 222, 224, and 226 and the signal pad 126 may be achieved through a joining process including a heating / pressurizing process.

[0076] In one embodiment, a joining pad 223 may be formed at each end portion of the first combined wiring 222. In this case, the joining pad 223 and the signal pad 126 may be electrically connected to each other. In one embodiment, one end of the first combined wiring 222 may be directly provided as the joining pad 223.

[0077] In one embodiment, the circuit wiring layer 220 may further include a ground pattern 225. For example, the ground pattern 225 may be provided around the end portion of the first combined wiring 222 or the joining pad 223.

[0078] The ground pattern 225 may be aligned above the ground pad 128 of the antenna device 100. The ground pattern 225 may also be electrically connected to the ground pad 128 of the antenna device 100 through the conductive bonding structure 150.

[0079] As described above, the ground layer 230 may be formed on the second surface 210b of the core layer 210. In an exemplary embodiment, the portion of the ground layer 230 included in the bending region II may include a mesh structure. Thus, the ground layer 230 may include a bent portion 235 having a mesh structure.

[0080] The remaining region of the ground layer 230 other than the bending region II may have a solid structure. For example, the ground layer 230 may include a first solid portion 232 included in the bonding region I and a second solid portion 234 included in the main body region III. The bent portion 235 having a mesh structure may be located between the first solid portion 232 and the second solid portion 234 in a plan view.

[0081] The ground layer 230 may be substantially completely superimposed above the circuit wiring layer 220 in a plan view. In some embodiments, the first solid portion 232 may cover the bonding pad 223 and the ground pattern 225 of the circuit wiring layer 220 in a plan view. The bent portion 235 may cover the first combined wiring 222 and may also partially cover the second combined wiring 224 in a plan view. The second solid portion 226 may completely cover the drive signal wiring 226 and may also partially cover the second combined wiring 224 in a plan view.

[0082] For example, the flexible circuit board 200 may be bent through the bent portion 235 of the flexible circuit board 200 to connect the antenna driving IC chip disposed under the display panel and the drive signal wiring 226 to each other. As described above, the bent portion 235 may include a mesh structure to have relatively high flexibility.

[0083] In addition, the ground layer 220 may completely cover the signal wirings 222, 224, and 226 in a plan view, so that an electric field may be generated between the signal wirings 222, 224, and 226 and the ground layer 220 to improve the feeding efficiency for the antenna unit 120. The portion of the ground layer 220 other than the bent portion 235 may have a solid structure, so that the generation of an electric field by coupling with the signal wirings 222, 224, and 226 may be promoted.

[0084] Figure 4 is a schematic top plan view showing a flexible circuit board included in an antenna package according to an exemplary embodiment.

[0085] Refer to Figure 4, the circuit wiring layer 220 may include signal wirings 227 that are individually and independently connected to each antenna unit 120. One end of each signal wiring 227 may be respectively joined to the signal pad 126 of the antenna unit 120, and the other end of the signal wiring 227 may be respectively electrically connected to the antenna driving IC chip at the end of the main body region III of the flexible circuit board 200.

[0086] Therefore, the feeding and control signals can be applied from the antenna driving IC chip to each antenna unit 120 through each signal wiring 227.

[0087] In some embodiments, the signal wiring 227 may include meandering portions 227a and 227b shown by the dotted circles. The signal wiring 227 can be assembled at a narrower interval using the meandering portions 227a and 227b, so as to extend over a part of the core layer 210 in the main body region III.

[0088] For example, the meandering portions 227a and 227b may include a first meandering portion 227a and a second meandering portion 227b. The signal wiring 227 can branch from the bonding pad 223 in the length direction, and then extend in the width direction through the first meandering portion 227a. The signal wiring 227 can extend again in the length direction through the second meandering portion 227b.

[0089] In some embodiments, the bent portion 235 and the second solid portion 234 of the ground layer 230 may overlap with an extending portion 227c extending in the length direction of the signal wiring 227 in a plan view.

[0090] As described above, the bent portion 235 may have a mesh structure and can improve the bending stability of the flexible circuit board 200. In addition, the meandering portions 227a and 227b can be excluded from the bending region II, and mechanical damage to the signal wiring 227 caused by the bending stress of the flexible circuit board 200 can be suppressed.

[0091] Figure 5 and Figure 6 are schematic top plan views showing a flexible circuit board included in an antenna package according to some exemplary embodiments.

[0092] Referring to Figure 5 and Figure 6 , the bent portion 235 included in the ground layer 230 of the flexible circuit board 200 may include a solid structure as well as a mesh structure. For example, the bent portion 235 may include a mesh pattern 235a and a solid pattern 235b.

[0093] In an exemplary embodiment, the solid pattern 235b may overlap with the signal wiring of the circuit wiring layer 220 in a plan view.

[0094] As Figure 5 shown, the solid pattern 235b may overlap, for example, with the first merged wiring 222. As Figure 6 shown, the solid pattern 235b may overlap with the extension portion 227c of the signal wiring 227.

[0095] A solid structure may be introduced into the region of the bent portion 235 that overlaps with the signal wiring, thereby further facilitating the generation of an electric field through the ground layer 230. In addition, the region of the bent portion 235 other than the solid pattern 235b may include a mesh pattern 235a, thereby improving the bending characteristics in the bent region II.

[0096] Figure 7 And Figure 8 are a schematic top plan view and a schematic cross-sectional view, respectively, showing a flexible circuit board included in an antenna package according to some exemplary embodiments. For example, Figure 7 is a partially enlarged plan view of a region of the flexible circuit board 200 around the ground pattern 225.

[0097] Referring to Figure 7 and Figure 8 , a via structure 240 may be formed to electrically connect the ground layer 230 and the ground pattern 225 included in the circuit wiring layer 220 to each other. In an exemplary embodiment, the via structure 240 may contact the ground pattern 225 and the first solid portion 232.

[0098] For example, a via penetrating the core layer 210 may be formed, and the via structure 240 may be formed by filling the via with metal through an electroplating process. The via may also penetrate the ground layer 230.

[0099] In one embodiment, the via structure 240 may be formed only in the via, for example, by a button plating process. Therefore, an increase in the thickness of the ground layer 230 caused, for example, when the plating extends outside the via can be prevented.

[0100] In one embodiment, the ground layer 230 may have a reduced thickness, for example, by a semi-etching process. In one embodiment, the thickness of the ground layer 230 may be less than the thickness of the circuit wiring layer 220.

[0101] As described above, using the mesh structure included in the bent portion 235 can reduce the thickness of the ground layer 230 to further enhance the bending characteristics.

[0102] Figure 9 is a schematic cross-sectional view showing an image display device including an antenna package according to an exemplary embodiment. For ease of description, Figure 9The illustration of the detailed components and structure of the flexible printed circuit board 200 is omitted.

[0103] The image display device may include a display panel 250 and an antenna package disposed on the display panel 250 according to the above exemplary embodiment.

[0104] The display panel 250 may include, for example, an OLED panel or an LCD panel, and preferably may be an OLED panel. The antenna device 100 may be disposed on the display panel 250. The radiator 122 of the antenna unit 120 may be disposed, for example, on the display panel 250 or in the display area of the image display device. In this case, the radiator 122 may include a mesh structure to increase the light transmittance and suppress the visual recognition of the antenna unit 120.

[0105] The signal pad 126 of the antenna unit 120 may be disposed in the bezel area or the outer peripheral area of the image display device or the display panel 250. The flexible printed circuit board 200 may be joined to the signal pad 126 through the joining area I, and may be bent under the display panel 250 through the bending area II.

[0106] As described above, the bending area II may include a mesh structure, so that the flexible printed circuit board 200 can provide improved bending stability. The main body area III may enter the rear part under the display panel 250 through the bending area II.

[0107] The signal wiring included in the main body area III may be electrically connected to the antenna driving IC chip 270 via the intermediate circuit board 260. The intermediate circuit board 260 may include, for example, a main board, a package board, or a rigid printed circuit board.

[0108] The antenna driving IC chip 270 may be mounted on the intermediate circuit board 260 to supply power to the antenna unit 120 through the flexible printed circuit board 200 and control the antenna radiation.

Claims

1. An antenna package, characterized in that, It includes: An antenna device, which includes an antenna dielectric layer and antenna elements disposed on the antenna dielectric layer; And A flexible circuit board electrically connected to the antenna elements, wherein the flexible circuit board includes: A core layer having a first surface and a second surface facing each other; A circuit wiring layer disposed on the first surface of the core layer, the circuit wiring layer including signal wirings electrically connected to the antenna elements; and A ground layer disposed on the second surface of the core layer to cover the circuit wiring layer in a plan view, the ground layer partially including a mesh structure, The antenna elements include a radiator, a transmission line extending from the radiator, a signal pad connected to one end of the transmission line, and a ground pad disposed around the signal pad, and The circuit wiring layer of the flexible circuit board further includes a ground pattern disposed around one end of the signal wiring to overlap the ground pad in a plan view.

2. The antenna package according to claim 1, characterized in that, The flexible circuit board has a bonding area, a bending area, and a main body area bonded to the antenna device, and the bending area is located between the bonding area and the main body area, Wherein the ground layer includes a bent portion disposed on a portion of the core layer located in the bending area, and the bent portion has the mesh structure.

3. The antenna package according to claim 2, characterized in that, The ground layer includes a first solid portion disposed on a portion of the core layer located in the bonding area and a second solid portion disposed on a portion of the core layer located in the main body area.

4. The antenna package according to claim 3, characterized in that, The bent portion includes a mesh pattern and a solid pattern formed by the mesh structure.

5. The antenna package according to claim 4, characterized in that, The solid pattern overlaps the signal wiring in a plan view.

6. The antenna package according to claim 3, characterized in that, It further includes a via structure passing through the core layer and connecting the ground pattern and the first solid portion of the ground layer to each other.

7. The antenna package according to claim 2, characterized in that, The antenna device includes a plurality of antenna elements, and The signal wirings of the circuit wiring layer include a plurality of the signal wirings, wherein each of the signal wirings is independently connected to each of the plurality of antenna elements.

8. The antenna package according to claim 7, characterized in that, The signal wiring includes a zigzag portion, and the zigzag portion is disposed on a portion of the core layer located in the bonding area.

9. The antenna package according to claim 8, characterized in that, The plurality of signal wirings continuously extend along the length direction of the flexible circuit board on the bending area and the main body area of the core layer.

10. The antenna package according to claim 8, characterized in that, It further includes an antenna driving integrated circuit chip disposed below the antenna device, and The flexible circuit board is bent below the antenna device through the bending area to be electrically connected to the antenna driving integrated circuit chip through the main body area.

11. The antenna package according to claim 10, characterized in that, It further includes an intermediate circuit board on which the antenna driving integrated circuit chip is mounted, wherein the intermediate circuit board is connected to the main body area of the flexible circuit board.

12. An image display device, characterized in that, It includes: A display panel; And The antenna package according to claim 1 disposed on the display panel.

13. The image display device according to claim 12, characterized in that, It further includes an antenna driving integrated circuit chip disposed below the display panel, Wherein a portion of the flexible circuit board in the antenna package including the mesh structure is bent to be electrically connected to the antenna driving integrated circuit chip.

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