Lens module and electronic device

Abstract

The application provides a lens module, which comprises a circuit board, a photosensitive chip, a filter, a support seat and a lens device, the circuit board is provided with a first receiving groove for receiving the photosensitive chip, the support seat is installed on the circuit board and covers the photosensitive chip, the filter is installed in the support seat and is located above the photosensitive chip, and the lens device is installed on the support seat and communicates with the inside of the support seat; the lens device can communicate with the filter and the photosensitive chip through the inside of the support seat; the circuit board is provided with a dustproof piece for adsorbing dust and impurities, the dustproof piece is arranged around the four edges of the first receiving groove and surrounds the photosensitive chip. The lens module provided by the application can prevent dust and improve the shooting effect of the module. The application also provides an electronic device using the lens module.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic and optical devices, in particular to a lens module and an electronic device. BACKGROUND

[0002] Under the background of the rapid development of smart phones, the demand for lens modules is increasing. In this context, most lens modules use precision components to achieve high-quality imaging. The existing lens module includes a circuit board, a photosensitive chip, a filter, a lens seat, and a lens. The photosensitive chip is mounted on the circuit board, the filter is mounted above the photosensitive chip through a support, and the lens seat carrying the lens is mounted on the circuit board. Since the photosensitive chip, resistance-capacitance devices, driving, etc. on the circuit board are in the same internal space, once dust and impurities adhere to the photosensitive chip, the image captured by the camera module will have black spots, which seriously affects the imaging quality of the camera module. SUMMARY

[0003] Therefore, the present application provides a lens module that can solve the above problems, prevent dust, and improve the shooting effect of the module.

[0004] In addition, it is necessary to provide an electronic device with the lens module.

[0005] The present application provides a lens module, which includes a circuit board, a photosensitive chip, a filter, a support seat, and a lens device. The circuit board is provided with a first receiving groove for receiving the photosensitive chip. The support seat is mounted on the circuit board and covers the photosensitive chip. The filter is mounted inside the support seat and is located above the photosensitive chip. The lens device is mounted on the support seat and the interiors of the two are communicated. The lens device allows light to pass through the interior of the support seat and communicate with the filter and the photosensitive chip. The circuit board is provided with a dustproof member for adsorbing dust and impurities. The dustproof member is arranged around the four edges of the first receiving groove and surrounds the photosensitive chip.

[0006] Optionally, the dustproof member is a whole film adhesive layer, the dustproof member is provided with a first through hole penetrating through the entire length direction, the photosensitive chip protrudes out of the first through hole, and the edge of the dustproof member is arranged around the periphery of the first receiving groove.

[0007] Optionally, the circuit board is provided with electronic components, the electronic components form two columns of electronic component groups, which are oppositely arranged on the circuit board and adjacent to the two opposite sides of the first receiving groove. The dustproof member is further provided with two second receiving grooves, and the electronic component groups are embedded in the second receiving grooves during installation.

[0008] Optionally, the size of the photosensitive chip is smaller than the first receiving groove, and a gap is formed between the four edges of the photosensitive chip and the first receiving groove, and a dustproof member is arranged in the gap.

[0009] Optionally, the dustproof member is a water-based protective film.

[0010] Optionally, the circuit board comprises a first hard plate part, a second hard plate part, and a soft plate part, the soft plate part is connected between the first hard plate part and the second hard plate part, the first receiving groove, the photosensitive chip, and the dustproof member are arranged on the first hard plate part.

[0011] Optionally, the support seat comprises a first surface and a first side wall vertically extending downward from the four edges of the first surface, the first surface and the first side wall form a first receiving space, the first side wall is fixed on the first hard plate part of the circuit board through an adhesive layer, and the first receiving space receives the electronic component group, the photosensitive chip, and the optical filter on the circuit board.

[0012] Optionally, the first surface is recessed downward to form a third receiving groove, a second through hole is formed in the third receiving groove, the optical filter is arranged on the second through hole, and the edge of the optical filter is arranged on the third receiving groove.

[0013] Optionally, the lens device comprises a base and a lens, the lens is arranged on the base, the base is provided with a second receiving space, and the second receiving space corresponds to the optical filter. The lens communicates with the second receiving space, and then corresponds to the optical filter and the photosensitive chip.

[0014] The application also provides an electronic device using the lens module.

[0015] The lens module provided by the application has the dustproof member arranged on the circuit board and surrounding the periphery of the photosensitive chip, so as to adsorb the falling pollutants, solder resist, ink, etc., and improve the shooting effect of the module. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a perspective view of a lens module according to a preferred embodiment of the application.

[0017] Figure 2 is Figure 1 is an exploded view of the lens module shown in FIG. 1.

[0018] Figure 3 is Figure 1 is a perspective view of a circuit board.

[0019] Figure 4 is a cross-sectional view of the lens module along the line IV-IV shown in FIG. 4. Figure 1

[0020] ​Figure 5 This is a schematic diagram of an electronic device using the lens module in an embodiment of this application.

[0021] Explanation of main component symbols

[0022]

[0023]

[0024] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0028] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the lens module provided by this application will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0029] Please see Figure 1 and Figure 2 This application provides a preferred embodiment of a lens module 100, which includes a circuit board 1, a photosensitive chip 2, a filter 3, a support base 4, and a lens assembly 5. The photosensitive chip 2 is mounted on the circuit board 1, and the filter 3 is mounted on the support base 4. The support base 4 is mounted on the circuit board 1, and the filter 3 is disposed above the photosensitive chip 2 and spaced apart from it. When the support base 4 is mounted on the circuit board 1, it covers a portion of the circuit board 1 and houses the photosensitive chip 2. The lens assembly 5 is mounted on the support base 4.

[0030] In the embodiment, the circuit board 1 is a soft board, a hard board or a rigid-flexible combined board. Preferably, the circuit board 1 is a rigid-flexible combined board, which comprises a first hard board part 10, a second hard board part 12 and a soft board part 14 connected between the first hard board part 10 and the second hard board part 12.

[0031] Please refer to Figure 4 The first hard board part 10 is in the shape of a rectangular frame, and a first receiving groove 104 in the shape of a square is formed in the center of a first surface 102 of the first hard board part 10. The first receiving groove 104 is used to fix and receive the photosensitive chip 2. The photosensitive chip 2 is slightly smaller than the first receiving groove 104, and there is a gap (not shown in the figure) between the four edges of the photosensitive chip 2 and the four edges of the first receiving groove 104. A plurality of electronic elements 16 are arranged on the first hard board part 10, and the electronic elements 16 are arranged in two columns of electronic element groups 17, which are arranged on the two opposite sides of the first receiving groove 104.

[0032] A dustproof member 18 is arranged on the first hard board part 10, which is arranged on the first surface 102 of the first hard board part 10 according to the structure of the first hard board part 10. The dustproof member 18 is in the shape of a hollow frame, which comprises a first surface 180 and a second surface (not shown in the figure) opposite to the first surface 180. A first through hole 182 is formed in the dustproof member 18, which extends through the length direction of the dustproof member 18. Two protrusions 183 are arranged on the first surface 180, which are adjacent to the two opposite sides of the first through hole 182. A second receiving groove 181 is formed in the second surface, which is adjacent to the two opposite sides 1820 of the first through hole 182. The second receiving groove 181 is in the shape of a strip, and the direction of the groove is towards the electronic element groups 17 during installation. The electronic element groups 17 are embedded in the second receiving groove 181. The first through hole 182 is arranged on the four edges of the first receiving groove 104, and the photosensitive chip 2 protrudes out of the first through hole 182. The dustproof member 18 can also be arranged in the gap between the photosensitive chip 2 and the first receiving groove 104. In this case, the dustproof member 18 is only a film layer, which can be sprayed or formed as a whole film and arranged in the first receiving groove 104.

[0033] The dustproof member 18 can be a dustproof adhesive layer, which can be sprayed or formed as a whole film and arranged on the first hard board part 10 by means of double-sided adhesive tape. The dustproof member 18 can adsorb the contaminants, dust and solder resist, etc. that fall into the dustproof member 18 when the lens module 100 is shaken or dropped. The dustproof member 18 can adsorb the impurities, so as to prevent the dust and impurities from adhering to the photosensitive chip, and improve the imaging quality of the camera module.

[0034] The dustproof member 18 can be a whole film that only protects the photosensitive chip 2. The dustproof member 18 is a whole film provided with a first through hole 182 for the photosensitive chip 2 to protrude, and the edge is arranged outside the periphery of the first receiving groove 104. The dustproof member 18 is arranged outside the periphery of the first receiving groove 104, and surrounds the photosensitive chip 2. The dustproof member 18 can also be arranged outside the periphery of the first receiving groove 104 by spraying to form the dustproof member 18. The dustproof member 18 can adsorb the falling contaminants, solder resist, ink, etc. to protect the photosensitive chip 2 and prevent dust impurities from falling on the photosensitive chip 2 to affect the imaging quality. In the embodiment, the dustproof member 18 is a film layer that protects the electronic element 16 and the photosensitive chip 2. The second receiving groove 181 on the dustproof member 18 receives the electronic element 16, and the film layer outside the periphery of the first receiving groove 104 protects the photosensitive chip 2 to prevent dust impurities from falling on the electronic element 16 and the photosensitive chip 2 on the circuit board 1 to affect the imaging quality.

[0035] The dustproof member 18 is a water-based protective film. The water-based film forms a dense and durable protective film layer that can adsorb suspended dust impurities, fibers, etc. to purify the air.

[0036] Please refer to Figure 5 The second hard plate portion 12 is provided with an electrical connection portion (not shown in the figure). When the lens module 100 is applied to the electronic device 200, the electrical connection portion is used to realize signal transmission between the lens module 100 and other elements of the electronic device 200. The electrical connection portion can be a connector or a gold finger. The photosensitive chip 2, the electronic element 16, and the electrical connection portion are all located on the same surface of the circuit board 1.

[0037] In the embodiment, the photosensitive chip 2 is in the shape of a rectangle. The electronic element 16 can be a passive element such as a resistor, a capacitor, a diode, a triode, a relay, an electrically erasable programmable read-only memory (EEPROM), etc.

[0038] Please refer to Figure 3 and Figure 4The support seat 4 is a square frame structure fixed on the circuit board 1. The support seat 4 comprises a first surface 40 and a first side wall 42 vertically extending downward from four sides of the first surface 40, and the first surface 40 and the first side wall 42 form a first receiving space 44. The first side wall 42 is mounted on the first hard plate part 10 of the circuit board 1 by a glue layer cover, and the first receiving space 44 receives the electronic element 16, the photosensitive chip 2 and the optical filter 3 on the circuit board 1. The first surface 40 is centrally recessed to form a third receiving groove 45, and a square second through hole 46 is formed in the center of the third receiving groove 45, the second through hole 46 corresponds to the installation of the optical filter 3, and the edge of the optical filter 3 is fixedly installed on the third receiving groove 45. The optical filter 3 is arranged above the photosensitive chip 2. The first receiving space 44 plays a role of protecting the circuit board 1, preventing dust and impurities from entering the lens module and affecting the imaging quality.

[0039] The material of the support seat 4 is metal or plastic. Preferably, the material of the support seat 4 is aluminum alloy.

[0040] The lens device 5 is fixedly installed on the support seat 4 by a glue layer 50, and the lens device 5 comprises a base 52 and a lens 54, the lens 54 is installed on the base 52, and the base 52 is a square frame body provided with a second receiving space 56 corresponding to the installation of the optical filter 3. The lens 54 is on the base 52 and communicates with the second receiving space 56, thereby communicating with the optical filter 3, realizing that the light enters the lens 54, then passes through the optical filter 3 and enters the photosensitive chip 2.

[0041] The lens 54 of the lens device 5 and the base 52 are assembled or integrally formed. In this embodiment, the lens 54 and the base 52 are integrally formed. The lens 54 comprises a first lens part 540 and a second lens part 542. The first lens part 540 and the second lens part 542 are integrally formed, and the diameter of the second lens part 542 is slightly smaller than that of the first lens part 540. The first lens part 540 is connected with the optical filter 3, and a protective film 58 is installed on the top of the first lens part 540 to protect the lens 54.

[0042] The lens module 100 can be applied to various electronic devices 200 with camera modules, such as mobile phones, wearable devices, computer devices, vehicles or monitoring devices, etc.

[0043] The lens module 100 has the following beneficial effects: the dustproof member 18 is arranged on the circuit board 1 and surrounds the periphery of the first accommodating groove 104 in which the photosensitive chip 2 is arranged, so that the dust, solder resist, ink and the like that fall off can be adsorbed, the photosensitive chip 2 is protected, the dust and impurities falling on the photosensitive chip 2 are prevented, the imaging quality is improved, and the shooting effect of the module is improved; the dustproof member 18 can also protect the electronic element 16 and the photosensitive chip 2, the electronic element 16 is accommodated in the second accommodating groove 181, the film layer in the periphery of the first accommodating groove 104 protects the photosensitive chip 2, the dust and impurities falling on the electronic element 16 and the photosensitive chip 2 on the circuit board 1 are prevented, the imaging quality is improved, and the shooting effect of the module is improved.

[0044] The above description is only a specific embodiment of the lens module, but in the actual application process, it cannot be limited to this embodiment. Other modifications and changes made according to the technical concept of the present application by those skilled in the art should belong to the protection scope of the claims of the present application.

Claims

1. A lens module, comprising a circuit board, a photosensitive chip, a filter, a support base, and a lens assembly, wherein the circuit board has a first receiving slot for receiving the photosensitive chip, the support base is mounted on the circuit board and covers the photosensitive chip, the filter is mounted inside the support base and positioned above the photosensitive chip, and the lens assembly is mounted on the support base, with the two internally communicating; the lens assembly allows light to pass through the interior of the support base and communicate with the filter and the photosensitive chip; characterized in that... The circuit board is provided with a dustproof component that adsorbs dust and impurities. The dustproof component surrounds the four edges of the first receiving groove and encloses the photosensitive chip. The size of the photosensitive chip is smaller than the first receiving groove, and there is a gap between the four sides of the two. The dustproof component is provided in the gap. The circuit board is provided with electronic components, which are arranged in two rows on the circuit board and adjacent to the two opposite sides of the first receiving slot; the dustproof component is also provided with two second receiving slots, and the electronic component groups are embedded in the second receiving slots during installation. The circuit board includes a first rigid board portion, a second rigid board portion, and a flexible board portion, wherein the flexible board portion is connected between the first rigid board portion and the second rigid board portion; the first receiving slot, the photosensitive chip, and the dustproof component are disposed on the first rigid board portion. The support includes a first surface and a first sidewall extending vertically downward from the four sides of the first surface. The first surface and the first sidewall form a first receiving space. The first sidewall is fixed to a first rigid part of the circuit board by an adhesive layer. The first receiving space receives electronic component groups, photosensitive chips and filters on the circuit board.

2. The lens module as described in claim 1, characterized in that, The dustproof component is an integral film adhesive layer. The dustproof component has a first through hole that runs through its entire length. The photosensitive chip protrudes outside the first through hole. The edge of the dustproof component surrounds the first receiving groove.

3. The lens module as described in claim 1, characterized in that, The dustproof component is a water-based protective membrane.

4. The lens module as described in claim 1, characterized in that, The first surface is recessed downward to form a third receiving groove, the third receiving groove has a second through hole, the filter is installed on the second through hole, and the edge of the filter is installed on the third receiving groove.

5. The lens module as described in claim 4, characterized in that, The lens device includes a base and a lens. The lens is mounted on the base. The base is provided with a second receiving space, which corresponds to the receiving of a filter. The lens communicates with the second receiving space and, in turn, communicates with the filter and the photosensitive chip.

6. An electronic device that uses the lens module according to any one of claims 1 to 5.

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