Sensor components and valve devices

Abstract

A sensor assembly and valve device includes a temperature sensing unit, a pressure sensing unit, a circuit unit, a housing, and a connector. The housing is fixedly connected to the connector housing. The pressure sensing unit and the circuit unit are located between the bottom wall of the housing and the inner sidewall of the connector housing. This simplifies the structure and reduces production costs.

Description

Technical Field

[0001] This application relates to the field of detection technology, and more specifically, to a sensor assembly and a valve device using the sensor assembly. Background Technology

[0002] like Figure 24 As shown, the sensor assembly 100 in the related art includes a pressure sensor element 130, an electronic circuit board 120, and a temperature sensor element 170. The sensor assembly 100 delivers fluid to the surface of the pressure sensor element 130 through an inlet opening 175 of an open, liquid-tight channel, and isolates the temperature sensor 170 and the wire 160 from the fluid through a closed, liquid-tight channel. The wire 160 extends within an elongated tubular element 165 and passes laterally through a hole in the base to connect to the electronic circuit board 120.

[0003] The sensor assembly of this structure has many components, a complex assembly process, and high production costs. Summary of the Invention

[0004] The purpose of this application is to provide a sensor assembly and valve device with a simple structure that helps reduce production costs.

[0005] To achieve the above objectives, this application adopts the following technical solution: a sensor assembly, including a housing, a temperature sensing unit, a pressure sensing unit, and a circuit unit. Both the temperature sensing unit and the pressure sensing unit are electrically connected to the circuit unit. The temperature sensing unit includes a temperature sensing element, and the pressure sensing unit includes a pressure sensing element. The sensor assembly has a detection channel, and the temperature sensing element is located within the detection channel. The temperature sensing element can convert the temperature within the detection channel into an electrical signal, and the pressure sensing element can convert the pressure within the detection channel into an electrical signal. The temperature sensing unit further includes a conductive element, which electrically connects the temperature sensing element and the circuit unit. The sensor assembly further includes a connector, which includes a pin and a connector housing. The pin is electrically connected to the circuit unit and can electrically connect the circuit unit to an external power source. The pin is injection molded to the connector housing, and the outer shell is fixedly connected to the connector housing. The pressure sensing unit is located between the bottom wall of the outer shell and the inner side wall of the connector housing. The connector housing includes a limiting part that can abut against the upper end face of the pressure sensing unit.

[0006] This application also discloses a valve device, including a valve body and a sensor assembly, wherein the valve body has a fluid channel, the detection channel is in communication with the fluid channel, and the sensor assembly is the sensor assembly described above.

[0007] The sensor assembly and valve device of this application include a pressure sensing unit, a temperature sensing unit, a circuit unit, and a connector. The housing and the connector housing are fixedly connected. The pressure sensing unit and the circuit unit are located between the bottom wall of the housing and the inner side wall of the connector housing. This helps to reduce the number of parts, simplify the structure, and reduce production costs. Attached Figure Description

[0008] Figure 1 This is a three-dimensional structural schematic diagram of the sensor assembly according to the first embodiment of this application;

[0009] Figure 2 yes Figure 1 A schematic diagram of the exploded structure of a sensor assembly;

[0010] Figure 3 yes Figure 1 A front view schematic diagram of the sensor assembly;

[0011] Figure 4 yes Figure 3 A schematic diagram of the AA cross-sectional structure in the diagram;

[0012] Figure 5 yes Figure 2 A three-dimensional structural diagram of the middle sealing assembly and the first section assembly from one perspective;

[0013] Figure 6 yes Figure 2 A three-dimensional structural diagram of the middle sealing assembly and the first section assembly from another perspective;

[0014] Figure 7 yes Figure 5 A top-view structural diagram;

[0015] Figure 8 yes Figure 7 A schematic diagram of the AA cross-sectional structure in the diagram;

[0016] Figure 9 yes Figure 2 A three-dimensional structural diagram of the combination of the middle base and the second section from one perspective;

[0017] Figure 10 yes Figure 2 A three-dimensional structural diagram of a connector;

[0018] Figure 11 This is a cross-sectional structural schematic diagram of the sensor assembly according to the second embodiment of this application;

[0019] Figure 12 yes Figure 11 A three-dimensional structural diagram of the central base from one perspective;

[0020] Figure 13 yes Figure 11 An enlarged schematic diagram of a partial structure of the central base;

[0021] Figure 14 This is a cross-sectional structural schematic diagram of the first embodiment of the pressure sensing unit of this application;

[0022] Figure 15 This is a cross-sectional structural schematic diagram of the sensor assembly according to the third embodiment of this application;

[0023] Figure 16 yes Figure 15 A three-dimensional structural diagram of the central base from one perspective;

[0024] Figure 17 yes Figure 16 A schematic diagram of the structure of the central base from below;

[0025] Figure 18 yes Figure 17 A schematic diagram of the AA cross-sectional structure in the diagram;

[0026] Figure 19 This is a cross-sectional structural schematic diagram of a second embodiment of the pressure sensing unit of this application;

[0027] Figure 20 This is a cross-sectional structural schematic diagram of the sensor assembly according to the fourth embodiment of this application;

[0028] Figure 21 This is an exploded structural diagram of the sensor assembly according to the fifth embodiment of this application;

[0029] Figure 22 This is a cross-sectional structural schematic diagram of the sensor assembly according to the fifth embodiment of this application;

[0030] Figure 23 yes Figure 22 A partially enlarged structural diagram of part B in the diagram;

[0031] Figure 24 This is a schematic diagram of one implementation of a sensor assembly in the prior art. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0033] It should be understood that the terms "first," "second," and similar terms used in the specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish features. Similarly, the terms "an" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise stated, the terms "front," "back," "left," "right," "upper," "lower," and similar terms appearing in this application are for ease of explanation only and are not limited to a specific location or spatial orientation. The terms "comprising" or "including" are an open-ended expression, meaning that the element preceding "comprising" or "including" covers the element following "comprising" or "including" and its equivalents, but this does not preclude the element preceding "comprising" or "including" from including other elements. In this application, the term "several" means two or more.

[0034] See Figures 1 to 16 This application provides a sensor assembly 100, including a pressure sensing unit 1, a temperature sensing unit 2, a circuit unit 4, a connector 5, a sealing assembly 6, and a housing 9; the circuit unit 4 is located on one side of the pressure sensing unit 1, and the sealing assembly 6 is located on the other side of the pressure sensing unit 1. Figures 1 to 10In this assembly, circuit unit 4 is located above pressure sensing unit 1, sealing assembly 6 is located below pressure sensing unit 1, temperature sensing unit 2 and pressure sensing unit 2 are both electrically connected to circuit unit 4, housing 9 and connector 5 are fixedly connected to form receiving cavity 59, pressure sensing unit 1 and circuit unit 4 are located in receiving cavity 59, and sensor assembly 100 has detection channel 101; temperature sensing unit 2 includes temperature sensing part 21, at least part of temperature sensing part 21 is located in detection channel 101, temperature sensing part 21 can convert the temperature in detection channel 101 into an electrical signal, temperature sensing part 21 can be a thermistor, the type of temperature sensing part 21 in this application is not limited to this; pressure sensing unit 1 includes pressure sensing part 20 and body part 10, body part 10 can be a ceramic substrate, pressure sensing part 20 and body part 10 The pressure sensing unit 20 can convert the pressure in the detection channel 101 into an electrical signal. The receiving cavity 59 includes an electronically controlled cavity 591, and the circuit unit 4 is located in the electronically controlled cavity 591. The electronically controlled cavity 591 is isolated from the detection channel 101. In this embodiment, the sealing assembly 6 is located between the outer shell 9 and the pressure sensing unit 1. The sealing assembly 6 includes a sealing part 61, which is pressed between the pressure sensing unit 1 and the outer shell 9. The sealing part 61 is in sealing contact with the pressure sensing unit 1 and the outer shell 9, so that the working medium of the detection channel 101 cannot enter the electronically controlled cavity 591. The space where the circuit unit is located is sealed by a sealing assembly, so that the circuit unit will not come into contact with the measured working medium, ensuring reliable sealing performance while keeping the structure simple.

[0035] The temperature sensing unit 2 also includes a conductive part 22 and a base 3. The conductive part 22 is electrically connected to the temperature sensing part 21 and the circuit unit 4. At least a portion of the conductive part 22 is injection molded to the base 3. At least a portion of the sealing part 61 is located between the base 3 and the pressure sensing unit 1.

[0036] See Figures 5 to 8 In this embodiment, the sealing assembly 6 includes a sealing part 61 and a metal skeleton 62. The main material of the sealing part 61 is rubber. The sealing part 61 is injection molded with the metal skeleton 62 as an insert. The metal skeleton 62 is annular. Along the radial direction of the sealing assembly 6, the outer edge of the metal skeleton 62 is aligned with the outer edge of the sealing part 61. Along the height direction of the sealing assembly 6, the sealing part 61 protrudes from the surface of the metal skeleton 62. In this way, after the pressure sensing unit 1 compresses the sealing part 61, it can contact the metal skeleton 62, and the metal skeleton 62 presses the sealing part 61 against the bottom wall of the outer casing 9.

[0037] The sealing assembly 6 has a first through hole 63. The temperature sensing part 21 is electrically connected to the circuit unit 4 through the conductive part 22. The conductive part 22 includes a first segment 221. One end of the first segment 221 passes through the first through hole 63 and is electrically connected to the circuit unit 4. The other end of the first segment 221 forms a first flange 23. The outer diameter of the first flange 23 is larger than the diameter of the first through hole 63. This forms a labyrinth structure between the sealing part and the first segment of the conductive part, improving the sealing performance.

[0038] The conductive part 22 also includes a second segment 222 and a third segment 223. The second segment 222 is located between the first segment 221 and the third segment 223, and the second segment 222 is electrically connected to the first segment 221 and the third segment 223. In this embodiment, the second segment 222 is injection molded to the base 3, and the second segment 222 is elastically contacted and electrically connected to the first segment 221. In this embodiment, an arc-shaped protrusion 220 is formed at one end of the second segment by bending or stamping. The arc-shaped protrusion 220 has a certain elasticity. A flat portion 230 is formed at the other end of the second segment. The first flange portion 23 of the first segment 221 abuts against and is electrically connected to the arc-shaped protrusion 220. The third segment 223 is welded to the flat portion 230. A through hole can be formed in the flat portion. After the third segment 223 is inserted into the through hole, it is welded to fix it. The flat portion 230 extends into the corresponding area of ​​the inner cavity of the base. In this way, the insertion end of the third segment 223 can be straight, and the structure is simple. The third segment 223 is fixedly connected to the temperature sensing part 21, and the temperature sensing part 21 is connected at one end of the third segment 223.

[0039] Combination Figure 4 and Figure 9 Part of the second segment 222 is injection molded and fixed to the base 3. The base 3 has a second flange portion 31 and a cylindrical portion 32. The outer edge dimension of the second flange portion 31 is larger than the outer edge dimension of the cylindrical portion 32. The second flange portion 31 protrudes from the cylindrical portion 32. The upper end face of the second flange portion 31 abuts against the lower end face of the sealing assembly 6, and the lower end face of the second flange portion 31 contacts the bottom wall of the outer casing 9. The upper end face of the sealing assembly 6 abuts against and seals the lower end face of the pressure sensing unit 1. The cylindrical portion 32 has a notch portion 321. The height of the notch portion 321 corresponds to the height of the temperature sensing portion 21. The notch portion 321 communicates with the inner cavity of the base 3, or the detection channel 101, so that the working medium can enter the detection channel 101 through the notch portion 321. In this embodiment, there are four notches 321, evenly distributed along the circumference of the cylindrical portion 31; the arc-shaped protrusions 220 and the flat surface 230 both protrude from the upper end surface of the second flange portion 31, and both the arc-shaped protrusions 220 and the flat surface 230 are exposed on the upper end surface of the second flange portion 31. The cylindrical portion 32 forms part of the sidewall of the detection channel 101.

[0040] See also Figure 4The outer casing 9 has a first stepped portion 91 and a second stepped portion 92, which are located on the bottom wall of the outer casing 9. The first stepped portion 91 has a first stepped surface 911, and the second stepped portion 92 has a second stepped surface 922. The first stepped surface 911 is closer to the pressure sensing unit 1 than the second stepped surface 922. The lower end face of the sealing portion 61 is sealed to the first stepped surface 911. The first flange portion 23 of the first segment 221 can abut against the first stepped surface 911 to limit it, preventing the first flange portion 23 from crushing the arc-shaped protrusion. The second stepped portion 92 has a mounting hole 923. The second flange portion 31 abuts against the second stepped surface 922 for axial limitation. The second flange portion 32 is laterally limited by the side wall of the second stepped portion 92. The cylindrical portion 32 of the base 3 is located inside the mounting hole 923, and at least the notch portion 321 is exposed outside the outer casing 9. In this embodiment, the outer shell 9 also has a third stepped surface 93, and the metal frame 62 abuts against the third stepped surface 93, which can prevent the metal frame 62 from compressing the sealing part 61 by too much deformation, or even crushing it.

[0041] See also Figure 4 and Figure 10 The connector 5 includes a pin 52 and a connector housing 51. The pin 52 is electrically connected to the circuit unit 4 and can electrically connect the circuit unit 4 to an external power source. The pin 52 is injection molded to the connector housing 51, and the outer shell 9 is fixedly connected to the connector housing 51. In this embodiment, the outer shell 9 and the connector housing 51 are fixedly connected by riveting. The connector housing 51 includes a limiting part 511, which can abut against the upper end face of the pressure sensing unit 1. In one embodiment, in order to prevent the sealing performance of the sensor assembly from being affected due to deformation of the components caused by temperature changes, the limiting part 511 does not directly abut against the circuit board where the circuit unit is located. The limiting part 511 avoids the circuit board where the circuit unit is located and abuts against the pressure sensing unit 1. Thus, the limiting part 511 can be a limiting post or an annular part with a notch. See reference. Figure 10 The limiting part 511 is an annular part with a notch. The outer shell 9 is fixedly connected to the plug-in shell 51. The limiting part 511 abuts against the pressure sensing unit 1. The lower end face of the pressure sensing unit 1 abuts against the upper end of the sealing component 6. The lower end face of the sealing component 6 abuts against the upper end face of the second flange 31 and the first step surface 911 of the outer shell 9. The lower end face of the second flange 31 contacts the bottom wall of the outer shell 9. In this way, the circuit unit 4 is sealed in the electrical control cavity 591 by fixing the outer shell 9 to the plug-in shell 51. The installation is convenient. Compared with the solution that requires the installation of two sealing rings, since this application has only one sealing part, the structure is simple. The sealing part is integrally formed, the material is the same, the temperature consistency is better, and the sealing reliability is improved.

[0042] Figures 11-13This is a second embodiment of the sensor assembly 100. The main difference between the second embodiment and the first embodiment is that the connection method of the first segment 221 and the second segment 222 of the conductive part 22 is different. In this embodiment, the first segment 221 and the second segment 222 of the conductive part are fixedly connected, which is a rigid connection, specifically welding. In this embodiment, the second segment 222 is injection molded to the base 3. One end of the second segment 222 has an extension 224 that protrudes from the base 3. The extension 224 forms a first groove 225, which is a blind hole. The end of the first segment 221 extends into the first groove 225 for axial positioning or serves as a reference for assembly positioning. The first segment and the second segment are connected by welding. The first segment 221 and the second segment 222 are electrically connected. The outer edge of the extension 224 is larger than the diameter of the first through hole 63. The upper end face of the extension 224 is in sealing contact with the sealing part 61, and the lower end face of the extension 224 is injection molded to the base 3.

[0043] Figures 15-18 This is a third embodiment of the sensor assembly 100. The main difference from the first embodiment is that in this embodiment, the sealing assembly 6 does not include a metal frame. The sealing part has a first through hole 63, and the pressure sensing unit 1 has a second through hole 64. The first segment 221 of the conductive part 22 passes through the first through hole 63 of the sealing part and the second through hole 64 of the pressure sensing unit and is mechanically connected to the circuit unit 4 and can be electrically connected. The upper end face of the first flange 23 of the first segment 221 abuts against the lower end face of the sealing part 61, and the lower end face of the first flange 23 is limitedly connected to the base 3. The second segment 222 includes a vertical segment 226, which abuts against and is electrically connected to the first flange 23. The pressure sensing unit of this embodiment can also be used in the sensor assembly 100 of the first embodiment. Compared with the first embodiment, the metal frame is saved, which is beneficial to further reduce costs. In this embodiment, the base 3 also includes a limiting ring 33, the upper end face of the limiting ring 33 has a gap with the lower end face of the pressure sensing unit 1, and the sealing part 61 is annular, located between the limiting ring 33 and the side wall of the outer shell 9.

[0044] See Figure 14 and Figure 19 The pressure sensing unit 1 includes a main body 10 and a pressure sensing part 20. The pressure sensing part 20 is fixedly connected to the main body 10, and the limiting part abuts against the upper end of the main body.

[0045] exist Figure 14In this embodiment, the pressure sensing unit 1 can be a ceramic capacitive sensor. The pressure sensing unit 1 includes a body portion 10 and a pressure sensing portion 20. The body portion 10 includes a first end portion 11, and the pressure sensing portion 20 includes a second end portion 12. The first end portion 11 and the second end portion 12 are located on opposite sides of the thickness direction of the pressure sensing unit 1. A circuit unit 4 is located above the first end portion 11. In this embodiment, the circuit unit 4 is located on a circuit board, which is located above the first end portion 11. The pressure sensing portion is located at the second end portion 12. The second end portion 12 includes a first region 121 and a second region 122. The first region 121 is a pressure-sensitive area, and the second region 122 surrounds the outer edge of the first region 121. The first region 121 is exposed in the detection channel and is used to convert the fluid pressure signal into an electrical signal. The main body 10 has a second groove 113 extending along the thickness direction of the pressure sensing unit 1. The second groove 1113 corresponds to the first region. The pressure sensing unit 1 also includes a conductive needle. One end of the conductive needle is located in the second groove 113. The conductive needle corresponds to the first region 121 and converts the pressure signal in the detection channel into an electrical signal. The pressure sensing unit 1 also includes a conductive post 14. The conductive post 14 is electrically connected to the first region 121 and the circuit unit 4 and is used to transmit the electrical signal of the first region 121 to the circuit unit 4.

[0046] The above pressure sensors can be used in Figure 15 In one embodiment, the pressure sensing unit 1 has a second through hole 64. The first segment 221 of the conductive part 22 passes through the first through hole 63 of the sealing assembly and the second through hole 64 of the pressure sensing unit, and is mechanically connected to the circuit unit 4 and can be electrically connected. The upper end face of the first flange of the first segment 221 abuts against and seals the lower end face of the sealing part. The pressure sensing unit 1 of this embodiment can also be used in the sensor assembly 100 of the first embodiment, combined with Figure 4 The lower end face of the first flange portion 23 of the first segment 221 can elastically abut and electrically connect with the arc-shaped protrusion 220. Of course, the pressure sensing unit of this embodiment can also be used in the sensor assembly 100 of the second embodiment, in combination with... Figures 11 to 13 In this embodiment, the second segment 222 is injection molded to the base 3. One end of the second segment 222 has an extension 224 protruding from the base. The extension 224 forms a first groove 225, which is a blind hole. The end of the first segment 221 extends into the first groove 225 for axial positioning or serves as a reference for assembly positioning. The first segment 221 and the second segment 222 are connected by welding. The first segment 221 and the second segment 222 are electrically connected. The outer edge of the extension 224 is larger than the diameter of the first through hole 63, so that the extension can cover the first through hole 63. The upper end face of the extension 224 is in sealing contact with the sealing part 61, and the lower end face of the extension 224 is injection molded to the base 3. Figure 19In this design, the pressure sensing unit 1 is a MEMS (Micro-Electro-Mechanical Systems) pressure sensor, which is divided into two types: piezoresistive and capacitive, and is manufactured based on bulk micromachining technology and sacrificial layer technology, respectively. The pressure sensing part 20 is a single chip integrating the sensing element with signal processing, calibration, compensation, and microcontroller. The pressure sensing unit 1 includes a first end 11 and a second end 12, which are located on opposite sides of the thickness direction of the pressure sensing unit 1. The circuit unit 4 is located above the first end 11. The body part 10 has a third through hole 65. The pressure sensing part 20 is located on one side of the first end 11. Through the third through hole 65, the pressure sensing part can detect the pressure of the fluid in the detection channel. The pressure sensor can be used in the sensor assembly 100 of the third embodiment. The pressure sensing unit 1 has a second through hole 64. The first segment 221 of the conductive part passes through the first through hole 63 of the sealing assembly and the second through hole 64 of the pressure sensing unit and is mechanically connected to the circuit unit 4 and can be electrically connected. The upper end face of the first flange of the first segment abuts against and seals the lower end face of the sealing part. The detection channel 101 communicates with the third through hole, and the sensing membrane of the pressure sensing part 20 is exposed in the third through hole. Of course, the pressure sensing unit can also be used in the first and second embodiments. The base 3 is formed by injection molding with the second segment 222 of the conductive part as an injection molding insert to seal and fix the second segment 222 in the base 3.

[0047] Figure 20 This is the fourth embodiment of the sensor assembly. The main difference from the third embodiment is that, in this embodiment, the conductive part 22 of the temperature sensing unit further includes an elastic part 227. The first segment 221 is electrically connected to the circuit unit 4 through the elastic part 227. In this embodiment, the elastic part 227 is a spring. The circuit unit 4 is printed on the circuit board 42. The elastic part 227 abuts against the circuit board 41 and the first segment 221. The circuit board 42 is provided with pads. The first segment 221 is provided with a stepped portion 2211. The elastic part 227 abuts against the pads and the stepped portion 2211. The elastic part 227 is in a compressed state between the pads and the stepped portion. Of course, the elastic part can also be soldered to one of the pads or the stepped portion and abut against the other. The second segment 222 is fixedly connected to the first segment 221. The lower end of the first flange portion 23 of the first segment 221 is welded or pressed to the upper end face of the second segment. The main body 10 of the pressure sensing unit 1 is a ceramic substrate with a second through hole 64. The elastic part 227 is located inside the second through hole 64, which helps to increase the guiding stability of the elastic part.

[0048] Figures 21-23This is a schematic diagram of the fifth embodiment of the sensor assembly. In this embodiment, the sensor assembly 100 includes a housing 9, a temperature sensing unit 2, a pressure sensing unit 1, and a circuit unit 4. The temperature sensing unit 2 and the pressure sensing unit 1 are both electrically connected to the circuit unit 4. The temperature sensing unit 2 includes a temperature sensing part 21, and the pressure sensing unit 1 includes a pressure sensing part 11 and a body part 10. The body part 10 is a ceramic substrate. The temperature sensing part 21 can convert the temperature in the detection channel 101 into an electrical signal, and the pressure sensing part 11 can convert the pressure in the detection channel 101 into an electrical signal. The pressure sensing unit 1 also includes a metal layer 228, which is sealed to the ceramic substrate. The pressure sensing part 11 is limited to the ceramic substrate. The circuit unit 4 is formed on the ceramic substrate. The conductive part 22 of the temperature sensing unit 2 is electrically connected to the temperature sensing part 21 and the circuit unit 4. The conductive part 22 is welded and fixed to the metal layer 228. The circuit unit is formed directly using the ceramic substrate, eliminating the need for a separate circuit board.

[0049] In this embodiment, the pressure sensing unit is a MEMS pressure sensor. The pressure sensing unit 11 includes a MEMS sensing unit 111 and a transmission unit 112. The MEMS sensing unit 111 is electrically connected to the circuit unit 4 through the transmission unit 112. The ceramic substrate and metal layer 228 have a second through hole 64. One end of the first segment 221 passes through the second through hole 64 and is electrically connected to the circuit unit 4. The other end of the first segment 221 has a first flange 23. The outer diameter of the first flange 23 is larger than the diameter of the second through hole 64. The upper end face of the first flange 23 can cover the second through hole 64 and is welded and fixed to the metal layer 228. The lower end face of the first flange 23 is electrically connected to the second segment 222. The sensor assembly 100 can be installed on a component with a flow channel. The component can be an electronic expansion valve for refrigerant flow control in a vehicle air conditioning system to achieve refrigerant throttling. The sensor assembly 100, as an integrated temperature and pressure sensor, can be used to detect the pressure and temperature of the refrigerant passing through the flow channel. Of course, the components can also be four-way valves, heat exchangers, fluid piping thermal management system components, etc., which can measure the pressure and temperature of the refrigerant within the thermal management system components. The similarities to the third implementation method will not be repeated here.

[0050] A valve device includes a valve body and a sensor assembly 100. The sensor assembly 100 is fixedly installed on the valve body. The valve body includes a flow channel. The detection channel 101 of the sensor assembly 100 is connected to the flow channel. A pressure sensing unit 1 can detect the pressure of the fluid in the flow channel, and a temperature sensing unit 2 can detect the temperature of the fluid in the flow channel.

[0051] It should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present invention. All technical solutions and improvements that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A sensor assembly, comprising a housing, a temperature sensing unit, a pressure sensing unit, and a circuit unit, wherein the temperature sensing unit and the pressure sensing unit are both electrically connected to the circuit unit, the temperature sensing unit includes a temperature sensing element, the pressure sensing unit includes a pressure sensing element, the sensor assembly has a detection channel, the temperature sensing element is located within the detection channel, the temperature sensing element is capable of converting the temperature within the detection channel into an electrical signal, and the pressure sensing element is capable of converting the pressure within the detection channel into an electrical signal; characterized in that: The temperature sensing unit further includes a conductive part, which electrically connects the temperature sensing part to the circuit unit. The sensor assembly further includes a connector, which includes a pin and a connector housing. The pin is electrically connected to the circuit unit and can electrically connect the circuit unit to an external power source. The pin is injection molded to the connector housing, and the outer shell is fixedly connected to the connector housing. The pressure sensing unit is located between the bottom wall of the outer shell and the inner side wall of the connector housing. The connector housing includes a limiting part that can abut against the upper end face of the pressure sensing unit. The temperature sensing unit further includes a base, which is limitedly connected to the outer shell. The conductive part includes a first segment, a second segment, and a third segment. The first segment is directly connected to the circuit unit. The second segment is injection molded to the base and elastically contacts and is electrically connected to the first segment. The third segment is fixedly connected to the temperature sensing part and welded to the second segment.

2. The sensor assembly according to claim 1, characterized in that: The sensor assembly further includes a sealing assembly located between the housing and the pressure sensing unit; the sealing assembly is located between the bottom wall of the housing and the inner side wall of the connector housing, the sealing assembly includes a sealing portion, the sealing portion is pressed between the pressure sensing unit and the housing, the sealing portion is in sealing contact with the pressure sensing unit, and the sealing portion is in sealing contact with the housing.

3. The sensor assembly according to claim 2, characterized in that: The temperature sensing part is located in the inner cavity formed by the base, the detection channel includes the inner cavity formed by the base, and the outer shell is riveted and fixed to the connector housing.

4. The sensor assembly according to claim 3, characterized in that: The sealing assembly has a first through hole, the pressure sensing unit has a second through hole, one end of the first segment of the conductive part passes through the first through hole and the second through hole and is electrically connected to the circuit unit, and the other end of the first segment forms a first flange portion, the outer diameter of the first flange portion is larger than the diameter of the first through hole, and the first flange can cover the first through hole.

5. The sensor assembly according to claim 4, characterized in that: The pressure sensing unit further includes a body portion, which is fixedly connected to the pressure sensing portion. The body portion includes a ceramic substrate and a metal layer. The metal layer is sealed to the ceramic substrate. The pressure sensing portion is limited to the ceramic substrate. The circuit unit is formed on the ceramic substrate. The first segment of the conductive portion is welded and fixed to the metal layer.

6. The sensor assembly according to claim 5, characterized in that: The pressure sensing unit is a MEMS pressure sensing unit. The pressure sensing part includes a MEMS sensing part and a transmission part. The MEMS sensing part is electrically connected to the circuit unit through the transmission part. The conductive part includes a first segment and a second segment. The ceramic substrate and the metal layer have through holes. One end of the first segment passes through the through hole and is electrically connected to the circuit unit. The other end of the first segment has a first flange. The outer diameter of the first flange is larger than the diameter of the through hole. The upper end face of the first flange can cover the through hole and is welded and fixed to the metal layer. The lower end face of the first flange is electrically connected to the second segment.

7. The sensor assembly according to claim 6, characterized in that: The outer shell is riveted to the connector housing. The base has a second flange portion. The upper end face of the second flange portion abuts against the lower end face of the sealing assembly. The lower end face of the second flange portion contacts the bottom wall of the outer shell. The upper end face of the sealing assembly abuts against the lower end face of the body portion of the pressure sensing unit.

8. The sensor assembly according to claim 7, characterized in that: The housing has a first stepped portion and a second stepped portion, which are located on the bottom wall of the housing. The first stepped portion has a first stepped surface, and the second stepped portion has a second stepped surface. The first stepped surface is closer to the pressure sensing unit than the second stepped surface. The lower end face of the sealing portion is sealed to the first stepped surface. The second stepped portion has a mounting hole. The second flange portion abuts against the second stepped surface. The second flange portion is limited by the side wall of the second stepped portion. Part of the base is located in the mounting hole.

9. The sensor assembly according to claim 8, characterized in that: The base also includes a limiting ring, the upper end face of which has a gap with the lower end face of the pressure sensing unit, and the sealing part is annular and located between the limiting ring and the side wall of the housing.

10. A valve device comprising a valve body and a sensor assembly, the valve body having a fluid passage, the detection passage being in communication with the fluid passage, and the sensor assembly being the sensor assembly according to any one of claims 1-9.

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