Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a stage to which a substrate is supplied, an inkjet head disposed on the stage and supplying a chemical liquid to the substrate, a housing having a lower surface in which a chemical liquid discharge groove into which the inkjet head is inserted is formed, and a cover provided to the housing and capable of moving to a lower portion of the inkjet head to close the chemical liquid discharge groove.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] To manufacture semiconductor devices or liquid crystal displays, various processes are performed, including photolithography, etching, ion implantation, deposition, and cleaning, which involve supplying solutions to a substrate. In these processes, photolithography forms the desired pattern on the substrate.

[0003] Photolithography includes a coating process in which a photoresist or other photosensitive liquid is applied to a substrate; an exposure process in which a specific pattern is formed on the coated photosensitive film; and a development process in which specific areas are removed from the exposed photosensitive film. In the coating process, the reagent is discharged from a nozzle onto the substrate while the substrate is being transported in one direction.

[0004] The substrate is moved while the support member provides air pressure and vacuum pressure to the lower surface of the substrate, thus suspending the substrate in the air. In this case, the nozzles become dry due to the air pressure and vacuum pressure, resulting in reduced inkjet head life and process defects caused by nozzle clogging. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a substrate processing apparatus and a substrate processing method that selectively opens the nozzles only when the substrate is on the stage, thereby preventing the inkjet head from drying out and causing inkjet head clogging, resulting in reduced inkjet head life and process defects.

[0006] Another technical problem to be solved by the present invention is to provide a substrate processing apparatus and substrate processing method that, when the liquid discharge tank is closed, stores a small amount of liquid discharged through the inkjet head into the liquid discharge storage unit through the liquid discharge pipe, thereby preventing inkjet head clogging and thus preventing reduced inkjet head life and process defects.

[0007] The technical problems to be solved by the present invention are not limited to those mentioned above. Those skilled in the art will clearly understand other technical problems not mentioned through the following description.

[0008] One aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a stage on which a substrate is provided; an inkjet head disposed on the stage and providing a liquid to the substrate; a housing having a liquid discharge groove formed on the lower surface of the housing for insertion of the inkjet head; and a cover disposed in the housing and movable toward the lower part of the inkjet head to close the liquid discharge groove.

[0009] Another aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a stage for suspending a substrate using air pressure and vacuum pressure, and including a loading section for loading the substrate, a coating section for supplying a liquid solution to the substrate, and a loading section for unloading the substrate; a nozzle disposed on the stage for supplying the liquid solution to the substrate, and opening when the substrate is disposed on the stage and closing when the substrate is not disposed on the stage; an air hole formed on the stage for supplying the air pressure to the substrate; and an air suction hole formed on the stage for supplying the vacuum pressure to the substrate.

[0010] One aspect of the substrate processing method of the present invention for solving the above-mentioned technical problems includes the following steps: loading a substrate on a stage; opening a nozzle arranged on the stage; applying a liquid coating to the substrate through the nozzle; and closing the nozzle, wherein the nozzle includes: an inkjet head for supplying the liquid coating to the substrate; a housing having a liquid coating discharge groove formed on the lower surface of the housing for insertion of the inkjet head; and a cover disposed on the housing and movable towards the lower part of the inkjet head to close the liquid coating discharge groove.

[0011] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0012] Figure 1 This is a perspective view used to illustrate a substrate processing apparatus according to some embodiments of the present invention.

[0013] Figure 2 This is a plan view illustrating a substrate processing apparatus according to some embodiments of the present invention.

[0014] Figure 3 It is along Figure 2 A sectional view taken by the A-A' line.

[0015] Figure 4 This is a diagram illustrating the lower surface of a nozzle in a substrate processing apparatus according to some embodiments of the present invention.

[0016] Figure 5 It is along Figure 4 A sectional view taken by the B-B' line.

[0017] Figure 6 and Figure 7 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to some embodiments of the present invention, wherein... Figure 6 This is a diagram used to illustrate the lower surface of the nozzle, and Figure 7 It is along Figure 6 A sectional view taken by the B-B' line.

[0018] Figure 8This is a flowchart illustrating a substrate processing method according to some embodiments of the present invention.

[0019] Figure 9 This is a flowchart illustrating a substrate processing method according to other embodiments of the present invention.

[0020] Figure 10 and Figure 11 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to other embodiments of the present invention.

[0021] Figure 12 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to yet another embodiment of the present invention.

[0022] Figure 13 and Figure 14 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, and is along... Figure 12 A sectional view taken along the C-C' line.

[0023] Figure 15 and Figure 16 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, and is along... Figure 12 A sectional view taken along the C-C' line.

[0024] Figure 17 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to yet another embodiment of the present invention.

[0025] Figure 18 It is along Figure 17 A sectional view taken along line D-D'.

[0026] Figure 19 and Figure 20 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, wherein... Figure 19 This is a diagram used to illustrate the lower surface of the nozzle, and Figure 20 It is along Figure 19 A sectional view taken along line D-D'. Detailed Implementation

[0027] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained below with reference to the accompanying drawings. Figure 1The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0028] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of that element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. An element may also be oriented in another direction, thus allowing the spatial relative terms to be interpreted according to orientation.

[0029] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0030] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0031] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0033] The following is for reference Figures 1 to 7 This describes a substrate processing apparatus according to some embodiments of the present invention.

[0034] Figure 1 This is a perspective view used to illustrate a substrate processing apparatus according to some embodiments of the present invention. Figure 2 This is a plan view illustrating a substrate processing apparatus according to some embodiments of the present invention. Figure 3 It is along Figure 2 A sectional view taken by the A-A' line. Figure 4 This is a diagram illustrating the lower surface of a nozzle in a substrate processing apparatus according to some embodiments of the present invention. Figure 5 It is along Figure 4 A sectional view taken by the B-B' line. Figure 6 and Figure 7 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to some embodiments of the present invention, wherein... Figure 6 This is a diagram used to illustrate the lower surface of the nozzle, and Figure 7 It is along Figure 6 A sectional view taken by the B-B' line.

[0035] Reference Figures 1 to 7 According to some embodiments of the present invention, a substrate processing apparatus includes a stage 100, a plurality of holes 110, a clamping part 120, a first guide rail 125, a nozzle 130, a second guide rail 141, a vertical frame 142, a support 143, a gas supply part 150, a gas supply line 155, a gas suction part 160, and a gas suction line 165.

[0036] Stage 100 can extend along a first horizontal direction DR1. Substrate W can be provided onto stage 100. Stage 100 can suspend substrate W.

[0037] For example, the table 100 may include an infeed section 101, a coating section 102, and an outfeed section 103. The infeed section 101, the coating section 102, and the outfeed section 103 may be arranged adjacent to each other in the first horizontal direction DR1. However, the technical concept of the present invention is not limited thereto. In some other embodiments, the infeed section 101, the coating section 102, and the outfeed section 103 may each be constituted by a separate table.

[0038] The substrate W can be loaded into the loading section 101. The coating solution 10 can be supplied to the substrate W in the coating section 102. The substrate W can be unloaded from the stage 100 via the unloading section 103. The substrate W moved to the unloading section 103 can be moved using a separate transport unit.

[0039] The stage 100 may have a plurality of holes 110 extending through its interior. For example, the loading section 101, the coating section 102, and the unloading section 103 may each have a plurality of holes 110 extending through their interiors. The plurality of holes 110 may be arranged spaced apart from each other on a plane defined by a first horizontal direction DR1 and a second horizontal direction DR2 perpendicular to the first horizontal direction DR1.

[0040] The plurality of holes 110 may include an air hole 111, an air intake hole 112, and an air exhaust hole 113. Air pressure can be supplied to the upper part of the stage 100 through the air hole 111. Vacuum pressure can be supplied to the upper part of the stage 100 through the air intake hole 112. That is, gas present in the upper part of the stage 100 can be drawn in through the air intake hole 112. Gas present in the upper part of the stage 100 can be discharged to the lower part of the stage 100 through the air exhaust hole 113.

[0041] Air vents 111 can be formed in each of the loading section 101, coating section 102, and unloading section 103. Air pressure can be continuously supplied to the upper part of the stage 100 from before the substrate W is loaded onto the stage 100 until the substrate W is unloaded from the stage 100.

[0042] The suction hole 112 may be formed in the coating section 102. For example, the suction hole 112 may not be formed in each of the loading section 101 and the unloading section 103. However, the technical concept of the present invention is not limited thereto. In other embodiments, the suction hole 112 may also be formed in each of the loading section 101 and the unloading section 103.

[0043] From the time the substrate W is loaded onto the stage 100 until it is unloaded from the stage 100, a vacuum pressure can be supplied to the upper part of the stage 100 through the suction port 112. That is, from the time the substrate W is loaded onto the stage 100 until it is unloaded from the stage 100, gas present in the upper part of the stage 100 can be drawn in through the suction port 112.

[0044] Vent 113 may be formed in each of the loading section 101 and the unloading section 103. From the time the substrate W is loaded onto the stage 100 until the substrate W is unloaded from the stage 100, the gas present in the upper part of the stage 100 can be continuously discharged to the lower part of the stage 100 through the vent 113.

[0045] The first guide rail 125 can be arranged on both sides of the second horizontal direction DR2 of the platform 100. The first guide rail 125 can extend in the first horizontal direction DR1.

[0046] The clamping part 120 can be connected to the first guide rail 125. The clamping part 120 can be arranged on both sides of the stage 100 in the second horizontal direction DR2. The clamping part 120 can move along the first guide rail 125 in the first horizontal direction DR1. The clamping part 120 can be arranged on both sides of the stage 100 in the second horizontal direction DR2.

[0047] The clamping part 120 may include a first portion 121 connected to the first guide rail 125 and a second portion 122 protruding from the first portion 121 toward the stage 100. The substrate W loaded onto the stage 100 can be clamped onto the stage 100 by the clamping part 120. The substrate W can move in the first horizontal direction DR1 while being clamped by the clamping part 120.

[0048] The second guide rail 141 can be arranged on both sides of the stage 100 in the second horizontal direction DR2. The first guide rail 125 can be arranged between the second guide rail 141 and the stage 100. The second guide rail 141 can extend in the first horizontal direction DR1.

[0049] Vertical frames 142 can be arranged on both sides of the platform 100 in the second horizontal direction DR2. Vertical frames 142 can be connected to the second guide rail 141. Vertical frames 142 can move along the second guide rail 141 in the first horizontal direction DR1. Support 143 can be connected between the two vertical frames 142. Support 143 can extend on the platform 100 along the second horizontal direction DR2.

[0050] The gas supply unit 150 can be connected to the gas port 111 via the gas supply line 155. The gas supply unit 150 can supply air pressure to the upper part of the platform 100 via the gas port 111.

[0051] The gas intake unit 160 can be connected to the suction port 112 via the gas intake line 165. The gas intake unit 160 can provide vacuum pressure to the upper part of the stage 100 via the suction port 112.

[0052] The platform 100 can use the air pressure provided by the gas supply unit 150 and the vacuum pressure provided by the gas intake unit 160 to suspend the substrate W.

[0053] Nozzles 130 can be arranged spaced upwards from stage 100 in the vertical direction DR3. For example, nozzles 130 can be arranged on coating section 102. Nozzles 130 can be connected to support 143. Nozzles 130 can move along support 143 in the second horizontal direction DR2. Nozzles 130 can be connected to support 143 so as to move along second guide rail 141 in the first horizontal direction DR1.

[0054] The nozzle 130 can supply the solution 10 to the substrate W located on the coating section 102. For example, the solution 10 can be a photosensitive liquid used in a photolithography process. However, the technical concept of the present invention is not limited thereto.

[0055] The nozzle 130 may include a housing 131, a liquid discharge channel 132, an inkjet head 133, and a cover 134.

[0056] The housing 131 can be connected to the bracket 143. The housing 131 can function as an external frame in which multiple components are arranged.

[0057] The liquid discharge groove 132 can be formed on the lower surface 131a of the facing platform 100 of the housing 131. The liquid discharge groove 132 can be formed to be recessed from the lower surface 131a of the housing 131 in the vertical direction DR3.

[0058] Multiple liquid discharge tanks 132 can be formed. For example, each of the liquid discharge tanks 132 can be spaced apart from each other in the first horizontal direction DR1 and the second horizontal direction DR2. However, the technical concept of the present invention is not limited thereto.

[0059] For example, the liquid discharge tank 132 may include a first liquid discharge tank 132_1 and a second liquid discharge tank 132_2 spaced apart from the first liquid discharge tank 132_1 in the second horizontal direction DR1. The first liquid discharge tanks 132_1 may be aligned with each other at a distance in the first horizontal direction DR1. The second liquid discharge tanks 132_2 may be aligned with each other at a distance in the first horizontal direction DR1.

[0060] Each inkjet head 133 can be inserted into the liquid discharge tank 132. Multiple inkjet heads 133 can be inserted into a single liquid discharge tank 132. Although Figure 4 and Figure 5 Five inkjet heads 133 are shown inserted into a liquid discharge tank 132, but this is just an example and the number of inkjet heads 133 inserted into a liquid discharge tank 132 is not limited.

[0061] For example, the inkjet head 133 may include a first inkjet head 133_1 and a second inkjet head 133_2. The first inkjet head 133_1 may be inserted into a first liquid discharge tank 132_1. The second inkjet head 133_2 may be inserted into a second liquid discharge tank 132_2.

[0062] The lower surface of the inkjet head 133 can be formed to be higher than the lower surface 131a of the housing 131. That is, the lower surface of the inkjet head 133 can be formed to be closer to the support 143 than the lower surface 131a of the housing 131. The inkjet head 133 can discharge liquid 10. The liquid 10 discharged from the inkjet head 133 can be provided to the substrate W.

[0063] The cover 134 may be disposed on the housing 131. For example, the cover 134 may be inserted into the interior of the housing 131. The cover 134 may be moved in the opposite direction of the second horizontal direction DR2 or in the second horizontal direction DR2 to open or close the liquid discharge channel 132. For example, the cover 134 may have a flat plate shape. However, the technical concept of the present invention is not limited thereto.

[0064] For example, cover 134 may include a first cover 134_1 and a second cover 134_2. The first cover 134_1 may be aligned with each other spaced apart in a first horizontal direction DR1. The second cover 134_2 may be aligned with each other spaced apart in the first horizontal direction DR1.

[0065] The first cover 134_1 can be moved to the lower part of the first inkjet head 133_1 to close the first liquid discharge slot 132_1. For example, the first cover 134_1 can be moved in the opposite direction of the second horizontal direction DR2 to close the first liquid discharge slot 132_1. The first cover 134_1 can be moved in the second horizontal direction DR2 to open the first liquid discharge slot 132_1.

[0066] The second cover 134_2 can be moved to the lower part of the second inkjet head 133_2 to close the second liquid discharge slot 132_2. For example, the second cover 134_2 can be moved in the second horizontal direction DR2 to close the second liquid discharge slot 132_2. The second cover 134_2 can be moved in the opposite direction of the second horizontal direction DR2 to open the second liquid discharge slot 132_2.

[0067] When the substrate W is placed on the stage 100, the cover 134 can be moved horizontally to open the liquid discharge tank 132. Alternatively, when the substrate W is not placed on the stage 100, the cover 134 can be moved horizontally to close the liquid discharge tank 132.

[0068] The following is for reference Figures 1 to 8 This describes a substrate processing method according to some embodiments of the present invention.

[0069] Figure 8 This is a flowchart illustrating a substrate processing method according to some embodiments of the present invention.

[0070] Reference Figures 1 to 8 In a substrate processing method according to some embodiments of the present invention, a substrate W can be loaded onto the loading section 101 of the stage 100 (S110). Next, the cover 134 of the nozzle 130 can be moved in the horizontal direction to open the liquid discharge tank 132 (S120). As a result, the inkjet head 133 can be exposed through the liquid discharge tank 132.

[0071] Next, the substrate W can be moved onto the coating section 102 of the stage 100 (S130). Next, the liquid 10 discharged from the inkjet head 133 can be applied to the substrate W located on the coating section 102 of the stage 100 (S140).

[0072] Next, the substrate W coated with the medicine solution 10 can be moved onto the transfer section 103 of the stage 100 (S150). Next, the substrate W coated with the medicine solution 10 can be unloaded from the transfer section 103 of the stage 100 (S160). Next, the cover 134 of the nozzle 130 can be moved in the horizontal direction to close the medicine discharge tank 132 (S170).

[0073] In the substrate processing apparatus and substrate processing method according to some embodiments of the present invention, the nozzle 130 is selectively opened only when the substrate W is located on the stage 100, thereby preventing the inkjet head 133 from becoming dry and causing clogging, resulting in reduced lifespan of the inkjet head 133 and process defects.

[0074] The following is for reference Figures 1 to 7 as well as Figure 9 The following describes a substrate processing method according to other embodiments of the present invention.

[0075] Figure 9 This is a flowchart illustrating a substrate processing method according to other embodiments of the present invention.

[0076] Reference Figures 1 to 7 as well as Figure 9 In a substrate processing method according to other embodiments of the present invention, the substrate W can be loaded onto the loading section 101 of the stage 100 (S210). Then, the substrate W can be moved onto the coating section 102 of the stage 100 (S220).

[0077] Next, the cover 134 of the nozzle 130 can be moved horizontally to open the liquid discharge groove 132 (S230). As a result, the inkjet head 133 can be exposed through the liquid discharge groove 132.

[0078] Next, the liquid medicine 10 discharged from the inkjet head 133 can be applied to the substrate W on the coating section 102 located on the stage 100 (S240). Next, the cover 134 of the nozzle 130 can be moved in the horizontal direction to close the liquid medicine discharge channel 132 (S250).

[0079] Next, the substrate W coated with the medicine solution 10 can be moved onto the transfer section 103 of the stage 100 (S260). Next, the substrate W coated with the medicine solution 10 can be unloaded from the transfer section 103 of the stage 100 (S270).

[0080] The following is for reference Figure 10 and Figure 11A substrate processing apparatus according to other embodiments of the present invention will be described. The main description will be related to... Figures 1 to 7 The differences shown are in the substrate processing apparatus.

[0081] Figure 10 and Figure 11 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to other embodiments of the present invention.

[0082] Reference Figure 10 and Figure 11 In a substrate processing apparatus according to other embodiments of the present invention, a cover 234_1 can open or close the first liquid discharge tank 132_1, and a cover 234_2 can open or close the second liquid discharge tank 132_2.

[0083] For example, two covers 234_1 and 234_2 can be arranged on the nozzle 230. Cover 234 can include a first cover 234_1 and a second cover 234_2. A first cover 234_1 can move in the opposite direction of the second horizontal direction DR2 to close the first liquid discharge channel 132_1. A first cover 234_1 can move in the second horizontal direction DR2 to open the first liquid discharge channel 132_1.

[0084] Additionally, a second cover 234_2 can move in the second horizontal direction DR2 to close the second liquid discharge tank 132_2. A second cover 234_2 can also move in the opposite direction of the second horizontal direction DR2 to open the second liquid discharge tank 132_2.

[0085] The following is for reference Figures 12 to 14 A substrate processing apparatus according to further embodiments of the present invention will be described. The main description will be related to... Figures 1 to 7 The differences shown are in the substrate processing apparatus.

[0086] Figure 12 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to yet another embodiment of the present invention. Figure 13 and Figure 14 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, and is along... Figure 12 A sectional view taken along the C-C' line.

[0087] Reference Figures 12 to 14 In a substrate processing apparatus according to some other embodiments of the present invention, the nozzle 330 may include a drain storage section 370 and a drain pipe 375.

[0088] The drain storage section 370 may be provided in the housing 131. For example, the drain storage section 370 may be connected to the lower side wall of the housing 131. For example, the drain storage section 370 may be connected to two side walls on the second horizontal direction DR2 of the housing 131 respectively.

[0089] The liquid discharge storage unit 370 can store the liquid 10 discharged from the inkjet head 133 when the liquid discharge tank 132 is closed. For example, the liquid discharge storage unit 370 connected to the side wall of the housing 131 adjacent to the first liquid discharge tank 132_1 can store the liquid 10 discharged from the first inkjet head 133_1. In addition, the liquid discharge storage unit 370 connected to the side wall of the housing 131 adjacent to the second liquid discharge tank 132_2 can store the liquid 10 discharged from the second inkjet head 133_2.

[0090] The drain pipe 375 can penetrate the side wall of the housing 131 and connect between each of the liquid discharge tanks 132 and the liquid storage section 370. For example, the drain pipe 375 can connect between the first liquid discharge tank 132_1 and the liquid storage section 370, which is connected to the side wall of the housing 131 adjacent to the first liquid discharge tank 132_1. Alternatively, the drain pipe 375 can connect between the second liquid discharge tank 132_2 and the liquid storage section 370, which is connected to the side wall of the housing 131 adjacent to the second liquid discharge tank 132_2.

[0091] The end of the drain pipe 375 exposed in the liquid discharge tank 132 can be positioned between the inkjet head 133 and the cover 134. For example, the end of the drain pipe 375 exposed in the first liquid discharge tank 132_1 can be positioned between the first inkjet head 133_1 and the first cover 134_1. Additionally, the end of the drain pipe 375 exposed in the second liquid discharge tank 132_2 can be positioned between the second inkjet head 133_2 and the second cover 134_2.

[0092] The drain pipe 375 may have an inclined profile. For example, the drain pipe 375 may have an inclined profile that is closer to the lower surface 131a of the housing 131 the closer it is to the drain storage section 370. However, the technical concept of the present invention is not limited thereto. In other embodiments, the drain pipe 375 may be formed parallel to the lower surface 131 of the housing 131.

[0093] exist Figure 8 and Figure 9 In the substrate processing method shown, when the nozzle 130 is closed, the liquid 10 discharged from the inkjet head 133 can be effectively stored in the liquid storage section 370 through the liquid discharge pipe 375 with an inclined profile.

[0094] In a substrate processing apparatus and substrate processing method according to some other embodiments of the present invention, when the liquid discharge tank 132 is closed, a small amount of liquid 10 discharged through the inkjet head 133 is stored in the liquid discharge storage section 370 through the liquid discharge pipe 375, thereby preventing the inkjet head 133 from becoming clogged and thus preventing a reduction in the lifespan of the inkjet head 133 and process defects.

[0095] The following is for reference Figure 15 and Figure 16 A substrate processing apparatus according to further embodiments of the present invention will be described. The main description will be related to... Figures 12 to 14 The differences shown are in the substrate processing apparatus.

[0096] Figure 15 and Figure 16 This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, and is along... Figure 12 A sectional view taken along the C-C' line.

[0097] Reference Figure 15 and Figure 16 In a substrate processing apparatus according to some embodiments of the present invention, the caps 434_1 and 434_2 provided on the nozzle 430 may be arranged to form an acute angle with the lower surface of the housing 131.

[0098] For example, the first cover 434_1 may have an inclined profile where the liquid storage portion 370, which is located closer to the side of the first liquid discharge tank 132_1, is closer to the lower surface 131a of the housing 131. The first cover 434_1 may form an acute angle with the lower surface 131a of the housing 131.

[0099] Furthermore, the second cover 434_2 may have an inclined profile where the drain storage portion 370, which is located closer to the side of the second liquid discharge tank 132_2, is closer to the lower surface 131a of the housing 131. The second cover 434_2 may form an acute angle with the lower surface 131a of the housing 131. The first cover 434_1 and the second cover 434_2 may be arranged symmetrically to each other.

[0100] The following is for reference Figures 17 to 20 This describes a substrate processing apparatus according to further embodiments of the present invention. The main description will be related to... Figures 1 to 7 The differences shown are in the substrate processing apparatus.

[0101] Figure 17 This is a diagram illustrating the lower surface of the nozzle of a substrate processing apparatus according to yet another embodiment of the present invention. Figure 18 It is along Figure 17 A sectional view taken along line D-D'. Figure 19 and Figure 20This is a diagram illustrating the operation of the nozzles of a substrate processing apparatus according to further embodiments of the present invention, wherein... Figure 19 This is a diagram used to illustrate the lower surface of the nozzle, and Figure 20 It is along Figure 19 A sectional view taken along line D-D'.

[0102] Reference Figures 17 to 20 In a substrate processing apparatus according to further embodiments of the present invention, a cover 534 disposed on the nozzle 530 may be provided on the lower surface 131a of the housing 131. The cover 534 may move horizontally along the lower surface 131a of the housing 131 to open or close the liquid discharge tank 132.

[0103] For example, cover 534 may include a first cover 534-1 and a second cover 534-2. The first cover 534-1 may move along the lower surface 131a of the housing 131 in the opposite direction of the second horizontal direction DR2 to close the first liquid discharge channel 132_1. The first cover 534-1 may move along the lower surface 131a of the housing 131 in the second horizontal direction DR2 to open the first liquid discharge channel 132_1.

[0104] Additionally, the second cover 534-2 can move along the lower surface 131a of the housing 131 in the second horizontal direction DR2 to close the second liquid discharge tank 132_2. The second cover 534-2 can also move along the lower surface 131a of the housing 131 in the opposite direction of the second horizontal direction DR2 to open the second liquid discharge tank 132_2.

[0105] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus comprising: a stage on which a substrate is provided; an inkjet head disposed on the stage and providing a chemical liquid to the substrate; a housing whose lower surface is formed with a chemical liquid discharge groove into which the inkjet head is inserted; and a cover provided to the housing and capable of moving to a lower portion of the inkjet head to close the chemical liquid discharge groove, wherein the inkjet head includes a first inkjet head and a second inkjet head, and the chemical liquid discharge groove includes a first chemical liquid discharge groove into which the first inkjet head is inserted and a second chemical liquid discharge groove into which the second inkjet head is inserted, wherein the cover includes a first cover and a second cover which are located adjacent to a middle region between the first inkjet head and the second inkjet head, wherein the first cover is capable of moving between the middle region and a lower portion of the first inkjet head to open or close the first chemical liquid discharge groove, and the second cover is capable of moving between the middle region and a lower portion of the second inkjet head to open or close the second chemical liquid discharge groove.

2. The substrate processing apparatus according to claim 1, wherein the cover has a flat plate shape and is capable of moving in a horizontal direction to close the chemical liquid discharge groove.

3. The substrate processing apparatus according to claim 1, wherein the cover is inserted into an inside of the housing.

4. The substrate processing apparatus according to claim 1, further comprising: a drain storage portion provided to the housing and for storing the chemical liquid; and a drain pipe which penetrates the housing and is connected between the chemical liquid discharge groove and the drain storage portion.

5. The substrate processing apparatus according to claim 4, wherein the drain pipe exposed to the chemical liquid discharge groove is disposed between the inkjet head and the cover.

6. The substrate processing apparatus according to claim 4, wherein the drain pipe has a sloped profile which gets closer to a lower surface of the housing as it gets closer to the drain storage portion.

7. The substrate processing apparatus according to claim 1, wherein the cover is disposed to form an acute angle with the lower surface of the housing.

8. The substrate processing apparatus according to claim 1, wherein the cover is provided to a lower surface of the housing and is capable of moving in a horizontal direction along the lower surface of the housing to close the chemical liquid discharge groove.

9. The substrate processing apparatus according to claim 1, further comprising: an air hole formed in the stage and providing an air pressure to the substrate; and a suction hole formed in the stage and providing a vacuum pressure to the substrate, wherein the substrate is levitated on the stage by the air pressure and the vacuum pressure.

10. A substrate processing apparatus comprising: a stage on which a substrate is provided and which levitates the substrate by an air pressure and a vacuum pressure, and includes a carrying-in portion which carries the substrate, a coating portion which provides a chemical liquid to the substrate, and a carrying-out portion which unloads the substrate; a nozzle disposed on the stage and providing the chemical liquid to the substrate, and which is opened when the substrate is disposed on the stage and is closed when the substrate is not disposed on the stage; an air hole formed in the stage and providing the air pressure to the substrate; and a suction hole formed in the stage and providing the vacuum pressure to the substrate. ​ ​ ​ A suction port is formed on the stage and provides the vacuum pressure to the substrate. The nozzle includes: The inkjet head supplies the liquid medicine to the substrate; A housing, the lower surface of which is formed with a liquid discharge groove for inserting the inkjet head; and A cover, disposed on the housing, is movable towards the lower part of the inkjet head to close the liquid discharge slot. The inkjet head includes a first inkjet head and a second inkjet head, and The liquid discharge tank includes a first liquid discharge tank for inserting the first inkjet head and a second liquid discharge tank for inserting the second inkjet head. The cover includes a first cover and a second cover located adjacent to each other in the intermediate region between the first inkjet head and the second inkjet head. The first cover is movable between the middle region and the lower part of the first inkjet head to open or close the first liquid discharge slot, and the second cover is movable between the middle region and the lower part of the second inkjet head to open or close the second liquid discharge slot.

11. The substrate processing apparatus according to claim 10, wherein, The cover has a flat plate shape and moves horizontally to close the liquid discharge slot.

12. The substrate processing apparatus according to claim 10, further comprising: A liquid discharge storage unit is provided in the housing and stores the liquid medicine when the liquid medicine discharge tank is closed; as well as A drain pipe extends through the housing and connects the liquid discharge tank and the liquid storage section.

13. The substrate processing apparatus according to claim 12, wherein, The drain pipe exposed to the liquid discharge tank is arranged between the inkjet head and the cover.

14. A substrate processing method, comprising the following steps: Load the substrate onto the stage; Turn on the nozzles arranged on the platform; The liquid medicine is applied to the substrate through the nozzle; as well as Close the nozzle. The nozzle includes: The inkjet head supplies the liquid medicine to the substrate; A housing, the lower surface of which is formed with a liquid discharge groove for inserting the inkjet head; and A cover, disposed on the housing, is movable towards the lower part of the inkjet head to close the liquid discharge slot. The inkjet head includes a first inkjet head and a second inkjet head, and The liquid discharge tank includes a first liquid discharge tank for inserting the first inkjet head and a second liquid discharge tank for inserting the second inkjet head. The cover includes a first cover and a second cover located adjacent to each other in the intermediate region between the first inkjet head and the second inkjet head. The first cover is movable between the middle region and the lower part of the first inkjet head to open or close the first liquid discharge slot, and the second cover is movable between the middle region and the lower part of the second inkjet head to open or close the second liquid discharge slot.

15. The substrate processing method according to claim 14, wherein, The platform includes an infeed section for loading the substrate, a coating section for supplying the liquid medicine to the substrate, and an outfeed section for unloading the substrate. The cover opens the nozzle after the substrate is loaded into the loading section, and The cover closes the nozzle after the substrate is unloaded from the ejector section.

16. The substrate processing method according to claim 14, wherein, The platform includes an infeed section for loading the substrate, a coating section for supplying the liquid medicine to the substrate, and an outfeed section for unloading the substrate. The nozzle is opened after the cover moves onto the coating section, and The cover closes the nozzle before the substrate moves onto the delivery section.

17. The substrate processing method according to claim 14, wherein, The nozzle also includes: A liquid discharge storage unit is provided in the housing and stores the liquid medicine when the liquid discharge tank is closed; and A drain pipe extends through the housing and connects the liquid discharge tank and the liquid storage section.

Images