Crystal grain sorting device

Abstract

The application provides a kind of crystal grain sorting device, including feeding assembly, clamping assembly, wafer table assembly, thimble assembly, turnover assembly, detection assembly, turret assembly and receiving assembly, feeding assembly obtains wafer box, and multiple wafers are loaded in wafer box, clamping assembly respectively clamps multiple wafers in wafer box to wafer table assembly, wafer table assembly expands film to wafer, thimble assembly lifts up the wafer on the wafer after expanding film, turnover assembly absorbs crystal grain, detection assembly includes first detection camera, and first detection camera is used to detect the first surface of crystal grain, and turnover assembly rotates the first surface of crystal grain and is aligned with turret assembly, so that turret assembly absorbs the first surface of crystal grain, and detection assembly further includes multiple detection cameras, and multiple surfaces of crystal grain are detected respectively, and turret assembly rotates the qualified crystal grain to receiving assembly and is received.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection, and in particular to a die sorting device. BACKGROUND

[0002] With the increasing integration of semiconductor industry components (wafers), the production process is becoming more and more complex. After production and manufacturing are completed, detection, sorting, and banding and packaging processes need to be performed.

[0003] In the prior art, wafers are produced by manual detection and transfer, which not only has low detection efficiency and accuracy, but also affects the packaging quality of the next process. Single-arm die bonding equipment has low transfer speed due to its mechanical structure, and cannot meet the requirements of high-speed and high-accuracy detection.

[0004] The vacuum turret module directly takes materials from the wafer clamp arm, which affects the detection time and thus the running efficiency of the whole machine. Moreover, directly taking materials from the wafer clamp arm will cause the side of the chip sucked by the suction nozzle to be undetectable, affecting the reliability of detection. At the same time, using one chip visual appearance detection device to detect the 5 sides of the chip will increase the detection time, resulting in low efficiency of the whole machine.

[0005] The traditional vibrating disc feeding LED sorting machine is not suitable for the detection and testing of Mini LED chips, which will increase the degree of chip damage and cannot detect all the appearance defects of the chip, affecting the final yield of the product. SUMMARY

[0006] The present application discloses a die sorting device, which can solve the technical problems of low detection reliability and low running efficiency.

[0007] The application provides a kind of crystal grain sorting device, the crystal grain sorting device includes feeding assembly, clamping assembly, wafer table assembly, pin assembly, turnover assembly, detection assembly, turret assembly and receiving assembly, the wafer box is obtained by the feeding assembly, the wafer box is loaded with multiple wafers, the multiple wafers in the wafer box are clamped to the wafer table assembly by the clamping assembly, the wafer table assembly is expanded to the wafer, the pin assembly is lifted to the wafer on the wafer after expansion, the turnover assembly absorbs the crystal grain, the detection assembly includes first detection camera, the first detection camera is used to detect the first face of the crystal grain, the turnover assembly rotates and aligns the first face of the crystal grain to the turret assembly, so that the turret assembly absorbs the first face of the crystal grain, the detection assembly also includes second detection camera, third detection camera, fourth detection camera, fifth detection camera and sixth detection camera, respectively detects the second face, third face, fourth face, fifth face and sixth face of the crystal grain, and the turret assembly rotates the crystal grain that passes detection to the receiving assembly for receiving.

[0008] Optionally, the feeding assembly includes a feeding Z-axis displacement member, a first supporting plate and a second supporting plate. The feeding Z-axis displacement member is displaced up and down along the Z-axis direction, thereby driving the first supporting plate and the second supporting plate to be displaced up and down along the Z-axis direction. The first supporting plate is used to support a wafer box of a first specification, and the second supporting plate is used to support a wafer box of a second specification. The first specification is different from the second specification.

[0009] Optionally, the feeding assembly further includes a first sensor and a second sensor. When the first supporting plate supports the wafer box of the first specification, the first sensor generates a first electric signal. When the second supporting plate supports the wafer box of the second specification, the second sensor generates a second electric signal.

[0010] Optionally, the clamping assembly includes a clamping Y-axis displacement member and a clamping member. The clamping Y-axis displacement member is displaced forward and backward along the Y-axis direction, thereby driving the clamping member to be displaced forward and backward along the Y-axis direction. The clamping member is used to clamp a wafer from the wafer box.

[0011] Optionally, the wafer table assembly includes a wafer table X-axis displacement member, a wafer table Y-axis displacement member, a wafer table Z-axis displacement member and a wafer table T-axis rotating member. The wafer table X-axis displacement member is displaced left and right along the X-axis direction, thereby driving the wafer to be displaced left and right along the X-axis direction. The wafer table Y-axis displacement member is displaced forward and backward along the Y-axis direction, thereby driving the wafer to be displaced forward and backward along the Y-axis direction. The wafer table Z-axis displacement member is displaced up and down along the Z-axis direction, thereby driving the wafer to be displaced up and down along the Z-axis direction and pressing the wafer to expand the wafer. The wafer table T-axis rotating member is rotated, thereby driving the wafer to be rotated.

[0012] Optionally, the ejector assembly comprises an ejector X-axis displacement member, an ejector Y-axis displacement member, a first ejector Z-axis displacement member, a second ejector Z-axis displacement member, an ejector shaft and an ejector cap, the ejector X-axis displacement member displaces left and right along the X-axis direction, thereby driving the ejector cap to displace left and right along the X-axis direction; the ejector Y-axis displacement member displaces forward and backward along the Y-axis direction, thereby driving the ejector cap to displace forward and backward along the Y-axis direction; when the wafer is located directly above the ejector cap, the first ejector Z-axis displacement member displaces upward along the Z-axis direction, thereby driving the ejector cap to displace upward along the Z-axis direction and approach the blue film on the wafer; the second ejector Z-axis displacement member displaces upward along the Z-axis direction, thereby driving the ejector shaft to displace upward along the Z-axis direction and lift the die on the blue film.

[0013] Optionally, the turnover assembly comprises a pressing member, a turnover Y-axis displacement member, a turnover motor, a turnover vacuum member and a turnover suction nozzle, the pressing member displaces up and down along the Z-axis direction, thereby driving the turnover suction nozzle to displace up and down along the Z-axis direction, the turnover motor drives the turnover suction nozzle to rotate, the turnover vacuum member provides suction pressure or blowing pressure for the turnover suction nozzle, thereby achieving the carrying of the die.

[0014] Optionally, the die sorting device further comprises a correction assembly, the correction assembly comprises a correction X-axis displacement member, a correction Y-axis displacement member, a correction T-axis rotation member, a correction positioning camera, an XY-axis correction block and a T-axis correction block, the correction X-axis displacement member displaces left and right along the X-axis direction, thereby driving the XY-axis correction block to displace left and right along the X-axis direction; the correction Y-axis displacement member displaces forward and backward along the Y-axis direction, thereby driving the XY-axis correction block to displace forward and backward along the Y-axis direction; the correction T-axis rotation member rotates, thereby driving the T-axis correction block to rotate, so as to correct the die in the X-axis direction or the Y-axis direction; the center of the correction positioning camera and the center of the XY correction block are located on a straight line, when the XY correction block moves, the XY-axis correction block is driven to displace in the X-axis direction or the Y-axis direction, so as to correct the angle of the die.

[0015] Optionally, the turret assembly comprises a pick-and-place suction nozzle and a turret motor, the pick-and-place suction nozzle picks up the die on the turnover assembly, the turret motor drives the pick-and-place suction nozzle to rotate, thereby driving the die to rotate to the correction assembly, after the die is corrected, the turret motor continues to rotate, driving the die to rotate to the detection assembly for detection of the die.

[0016] Optionally, the material collecting assembly comprises a material collecting X-axis displacement member, a material collecting track, a first material collecting U-axis rotating member, a heat sealing Z-axis displacement member, a cover tape path, an upper cover tape, a cutting member, a second material collecting U-axis rotating member and a material collecting Y-axis displacement member. The material collecting X-axis displacement member and the material collecting Y-axis displacement member respectively drive the material collecting track to displace along the X-axis direction or the Y-axis direction, so that the detected die is collected into the tape; the rotation of the first material collecting U-axis rotating member drives the carrier tape in the material collecting track to move equidistantly; the heat sealing Z-axis displacement member displaces up and down along the Z-axis direction, thereby driving the heat sealing knife to displace up and down along the Z-axis direction, and the upper cover tape passing through the cover tape path reaches the cover tape on the material collecting track to be heat sealed. The second material collecting U-axis rotating member rotates, thereby driving the empty carrier tape disc to collect the tape, and when the collected die reaches a certain number, the cutting member cuts the carrier tape.

[0017] After the turnover assembly sucks the die, the first detection camera first completes detection on the first surface of the die, and then the turret assembly sucks the first surface of the die, and the remaining detection cameras in the detection assembly respectively complete detection on the remaining surfaces of the die, thereby increasing detection reliability and improving detection efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The schematic diagram of the die sorting device provided by an embodiment of the present application.

[0020] Figure 2 The top view schematic diagram of the die sorting device provided by an embodiment of the present application.

[0021] Figure 3 The schematic diagram of the material loading assembly provided by an embodiment of the present application.

[0022] Figure 4 The schematic diagram of the clamping assembly provided by an embodiment of the present application.

[0023] Figure 5 The schematic diagram of the wafer table assembly provided by an embodiment of the present application.

[0024] Figure 6 The schematic diagram of the top pin assembly provided by an embodiment of the present application.

[0025] Figure 7Fig. 1 is a schematic view of a flip assembly according to an embodiment of the present application.

[0026] Figure 8 Fig. 2 is a schematic view of a downer according to an embodiment of the present application.

[0027] Figure 9 Fig. 3 is a schematic view of a flip principle according to an embodiment of the present application.

[0028] Figure 10 Fig. 4 is a schematic view of a correction assembly according to an embodiment of the present application.

[0029] Figure 11 Fig. 5 is a schematic view of a turret assembly according to an embodiment of the present application.

[0030] Figure 12 Fig. 6 is a schematic view of a turret assembly station according to an embodiment of the present application.

[0031] Figure 13 Fig. 7 is a schematic view of a second detection camera according to an embodiment of the present application.

[0032] Figure 14 Fig. 8 is a schematic view of a third detection camera according to an embodiment of the present application.

[0033] Figure 15 Fig. 9 is a schematic view of a collection assembly according to an embodiment of the present application.

[0034] Explanation of reference numerals: grain sorting device 1, feeding assembly 11, feeding Z-axis displacement member 111, first supporting plate 112, second supporting plate 113, clamping assembly 12, clamping Y-axis displacement member 121, clamping member 122, wafer table assembly 13, wafer table X-axis displacement member 131, wafer table Y-axis displacement member 132, wafer table Z-axis displacement member 133, wafer table T-axis displacement member 134, ejector pin assembly 14, ejector pin X-axis displacement member 141, ejector pin Y-axis displacement member 142, first ejector pin Z-axis displacement member 143, second ejector pin Z-axis displacement member 144, ejector pin shaft 145, ejector pin cap 146, turnover assembly 15, pressing-down member 151, driving motor 1511, pressing-down Y-axis displacement member 1512, pressing-down block 1513, turnover Y-axis displacement member 152, turnover motor 153, turnover vacuum member 154, turnover suction nozzle 155, detection assembly 16, second X-axis displacement member 160, second photosensitive member 161, second lens 162, second corner light source 163, second area light source 164, third X-axis displacement member 165, third photosensitive member 166, third lens 167, third prism 168, third area light source 169, turret assembly 17, pick-and-place suction nozzle 171, turret motor 172, first pressing-down member 173, second pressing-down member 174, third pressing-down member 175, fourth pressing-down member 176, material collecting assembly 18, material collecting X-axis displacement member 181, material collecting track 182, first material collecting U-axis rotating member 183, heat-sealing Z-axis displacement member 184, cover tape path 185, upper cover tape 186, cutting member 187, second material collecting U-axis rotating member 188, material collecting Y-axis displacement member 189, correction assembly 19, correction X-axis displacement member 191, correction Y-axis displacement member 192, correction T-axis rotating member 193, correction positioning camera 194, XY-axis correction block 195, T-axis correction block 196 DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0036] The present application provides a grain sorting device 1, please refer to Figure 1 and Figure 2 , Figure 1 a schematic diagram of the grain sorting device provided by an embodiment of the present application; Figure 2A top view of a wafer sorting device according to an embodiment of the present application is provided. The wafer sorting device 1 comprises a feeding assembly 11, a clamping assembly 12, a wafer table assembly 13, a pin assembly 14 (see Figure 6 ), a flipping assembly 15, a detecting assembly 16, a turret assembly 17 and a collecting assembly 18. The feeding assembly 11 obtains a wafer box loaded with a plurality of wafers. The clamping assembly 12 clamps the plurality of wafers in the wafer box to the wafer table assembly 13. The wafer table assembly 13 expands the wafers. The pin assembly 14 lifts the dies on the expanded wafers. The flipping assembly 15 sucks the dies. The detecting assembly 16 comprises a first detecting camera for detecting a first surface of the dies. The flipping assembly 15 rotates and aligns the first surface of the dies to the turret assembly 17 so that the turret assembly 17 sucks the first surface of the dies. The detecting assembly 16 further comprises a second detecting camera, a third detecting camera, a fourth detecting camera, a fifth detecting camera and a sixth detecting camera for detecting a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface of the dies, respectively. The turret assembly 17 rotates the dies that pass the detection to the collecting assembly 18 for collection.

[0037] It is to be noted that the wafer box is usually placed on the feeding assembly 11 by human. The dies, i.e. chip circuits, are obtained by cutting and processing the wafers. Usually, the dies are cubic structures with six surfaces. Specifically, the first surface of the dies is first sucked by the flipping assembly 15, and then detected by the first detecting camera. After that, the first surface of the dies is rotated and aligned to the turret assembly 17 by the flipping assembly 15 so that the turret assembly 17 sucks the first surface of the dies. Under the rotation of the turret assembly 17, the detecting assembly 16 is further used to detect the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface of the dies. That is, the six surfaces of the dies are detected by the detecting assembly 16, which increases the reliability of the detection.

[0038] In the present embodiment, the detecting assembly 16 comprises the second detecting camera, the third detecting camera, the fourth detecting camera, the fifth detecting camera and the sixth detecting camera, which can detect the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface of the dies at one time, greatly improving the detection efficiency of the dies. It can be understood that in other possible embodiments, the number of the detecting cameras comprised by the detecting assembly 16 can also be other numbers, which are not limited in the present application.

[0039] Understandably, in this embodiment, after the flipping component 15 picks up the crystal, the first detection camera first completes the detection of the first side of the crystal, and then the turret component 17 picks up the first side of the crystal. The remaining detection cameras in the detection component 16 respectively complete the detection of the remaining sides of the crystal, which increases the detection reliability and improves the detection efficiency.

[0040] In one possible implementation, please refer to [the relevant documentation / reference]. Figure 3 , Figure 3 This is a schematic diagram of a loading assembly provided in one embodiment of this application. The loading assembly 11 includes a loading Z-axis displacement member 111, a first tray 112, and a second tray 113. The loading Z-axis displacement member 111 moves up and down along the Z-axis, thereby causing the first tray 112 and the second tray 113 to move up and down along the Z-axis. The first tray 112 is used to support a wafer cassette of a first specification, and the second tray 113 is used to support a wafer cassette of a second specification. The first specification and the second specification are different.

[0041] It should be noted that the wafer cassette has different dimensions to adapt to different manufacturing processes or equipment. Typically, the wafer cassette has an 8-inch or 12-inch size. In this embodiment, the first size is 12 inches and the second size is 8 inches. It is understood that in other possible embodiments, the first and second sizes can be other dimensions, and this application does not impose any limitations on this.

[0042] Specifically, after the wafer cassette is placed on the first tray 112 or the second tray 113 by manual means or other methods, the loading Z-axis displacement member 111 moves up and down along the Z-axis, causing the first tray 112 and the second tray 113 to move up and down along the Z-axis, thereby pushing the wafer cassette to the clamping assembly 12, so that the clamping assembly 12 can clamp the wafer from the wafer cassette.

[0043] In one possible implementation, the loading assembly 11 further includes a first sensor and a second sensor. When the first tray 112 carries a wafer cassette of the first specification, the first sensor generates a first electrical signal; when the second tray 113 carries a wafer cassette of the second specification, the second sensor generates a second electrical signal.

[0044] For details, please refer to the following document again. Figure 3The first tray 112 and the second tray 113 have a height difference in the Z-axis direction. In the embodiment, the first sensor and the second sensor are photoelectric sensors. When the first tray 112 carries the wafer box of the first specification, the first sensor is blocked by the wafer box of the first specification and does not block the second sensor. The first sensor responds and generates the first electric signal, and the second sensor does not respond. When the second tray 113 carries the wafer box of the second specification, the first sensor is blocked by the wafer box of the second specification and also blocks the second sensor. The second sensor generates the second electric signal, the first sensor responds, and the second sensor responds, so that the processor in the grain sorting device 1 can identify the feeding of wafer boxes of different specifications according to the presence or absence of the first electric signal.

[0045] It can be understood that in other possible embodiments, the first sensor and the second sensor can also be other types of sensors, or the feeding of wafer boxes of different specifications can also be realized in other embodiments, which are not limited in the present application.

[0046] In a possible embodiment, please refer to Figure 4 , Figure 4 The schematic diagram of the gripping assembly provided by the embodiment of the present application is shown. The gripping assembly 12 includes a gripping Y-axis displacement member 121 and a gripping member 122. The gripping Y-axis displacement member 121 displaces forward and backward along the Y-axis direction, thereby driving the gripping member 122 to displace forward and backward along the Y-axis direction. The gripping member 122 is used to grip a wafer from the wafer box.

[0047] Specifically, the gripping Y-axis displacement member 121 displaces forward and backward along the Y-axis direction, thereby driving the gripping member 122 to displace forward and backward along the Y-axis direction. When the gripping member 122 is coaxial with the wafer box in the Z-axis direction, the gripping Y-axis displacement member 121 stops displacement, and the feeding Z-axis displacement member 111 drives the wafer box to displace to the vicinity of the gripping member 122, so that the gripping member 122 can grip a wafer from the wafer box.

[0048] In the embodiment, the wafer table assembly 13 further comprises a wafer table X-axis displacement component 131, a wafer table Y-axis displacement component 132, a wafer table Z-axis displacement component 133 and a wafer table T-axis rotating component 134. The wafer table X-axis displacement component 131 is used to control the displacement of the wafer along the X-axis direction. The wafer table Y-axis displacement component 132 is used to control the displacement of the wafer along the Y-axis direction. The wafer table T-axis rotating component 134 is used to rotate the wafer. The wafer table Z-axis displacement component 133 is used to press the wafer and expand the film of the wafer.

[0049] In a possible implementation, please refer to Figure 5 , Figure 5 A wafer table assembly provided in an embodiment of the present application is shown in the figure. The wafer table assembly 13 comprises a wafer table X-axis displacement component 131, a wafer table Y-axis displacement component 132, a wafer table Z-axis displacement component 133 and a wafer table T-axis rotating component 134. The wafer table X-axis displacement component 131 is used to control the displacement of the wafer along the X-axis direction. The wafer table Y-axis displacement component 132 is used to control the displacement of the wafer along the Y-axis direction. The wafer table T-axis rotating component 134 is used to rotate the wafer. The wafer table Z-axis displacement component 133 is used to press the wafer and expand the film of the wafer.

[0050] Specifically, the wafer table X-axis displacement component 131 and the wafer table Y-axis displacement component 132 are respectively used to control the displacement of the wafer along the X-axis direction and the Y-axis direction. The wafer table T-axis rotating component 134 is used to correct the angle of the wafer. After the position and the angle of the wafer are corrected, the wafer table Z-axis displacement component 133 is used to press the wafer and expand the film of the wafer, so that the pin component 14 can lift the die on the wafer.

[0051] In a possible implementation, please refer to Figure 6 , Figure 6A schematic diagram of a top pin assembly is provided for an embodiment of the present application. The top pin assembly 14 includes a top pin X-axis displacement member 141, a top pin Y-axis displacement member 142, a first top pin Z-axis displacement member 143, a second top pin Z-axis displacement member 144, a top pin shaft 145, and a top pin cap 146. The top pin X-axis displacement member 141 displaces left and right along the X-axis direction, thereby driving the top pin cap 146 to displace left and right along the X-axis direction. The top pin Y-axis displacement member 142 displaces forward and backward along the Y-axis direction, thereby driving the top pin cap 146 to displace forward and backward along the Y-axis direction. When the wafer is located directly above the top pin cap 146, the first top pin Z-axis displacement member 143 displaces upward along the Z-axis direction, thereby driving the top pin cap 146 to displace upward along the Z-axis direction and approach the blue film on the wafer. The second top pin Z-axis displacement member 144 displaces upward along the Z-axis direction, thereby driving the top pin shaft 145 to displace upward along the Z-axis direction and lift the die on the blue film.

[0052] Specifically, the top pin X-axis displacement member 141 and the top pin Y-axis displacement member 142 are respectively used to control the displacement of the top pin cap 146 along the X-axis direction and the Y-axis direction. When the top pin cap 146 is located directly below the wafer on the wafer table assembly 13, the first top pin Z-axis displacement member 143 displaces upward along the Z-axis direction, thereby driving the top pin cap 146 to displace upward along the Z-axis direction and approach the blue film on the wafer.

[0053] It can be understood that, due to the vacuum state in the top pin cap 146, the cut die on the blue film of the wafer will be adsorbed on the top pin cap 146. At this time, the second top pin Z-axis displacement member 144 displaces upward along the Z-axis direction, thereby driving the top pin shaft 145 to displace upward along the Z-axis direction and lift the die on the blue film, so that the die can be sucked by the suction nozzle.

[0054] In a possible implementation, please refer to Figure 7 and Figure 8 , Figure 7 a schematic diagram of a turnover assembly is provided for an embodiment of the present application; Figure 8 A schematic diagram of a pressing member is provided for an embodiment of the present application. The turnover assembly 15 includes a pressing member 151, a turnover Y-axis displacement member 152, a turnover motor 153, a turnover vacuum member 154, and a turnover suction nozzle 155. The pressing member 151 displaces up and down along the Z-axis direction, thereby driving the turnover suction nozzle 155 to displace up and down along the Z-axis direction. The turnover motor 153 drives the turnover suction nozzle 155 to rotate. The turnover vacuum member 154 provides suction pressure or blowing pressure for the turnover suction nozzle 155, thereby achieving the handling of the die.

[0055] Specifically, the lower pressing member 151 comprises a driving motor 1511, a lower pressing Y-axis displacement member 1512, and a lower pressing block 1513. The lower pressing block 1513 is arranged on the lower pressing Y-axis displacement member 1512. The driving motor 1511 drives the lower pressing Y-axis displacement member 1512 to move up and down along the Z-axis direction, and drives the lower pressing block 1513 to move up and down along the Z-axis direction, thereby driving the turnover suction nozzle 155 to move up and down along the Z-axis direction, so that the turnover suction nozzle 155 approaches the wafer, and the purpose of sucking the die on the wafer is achieved.

[0056] Specifically, the turnover assembly 15 further comprises a positioning camera. After the wafer stage X-axis displacement member 131 and the wafer stage Y-axis displacement member 132 displace the wafer to be directly above the thimble cap 146, the positioning camera takes a photo of the single wafer for positioning, and the wafer stage T-axis rotating member 134 corrects the angle of the wafer. The driving motor 1511 drives the turnover suction nozzle 155 to move downward. At this time, the thimble cap 146 lifts the die, so that the turnover suction nozzle 155 sucks the die. Then, the wafer stage X-axis displacement member 131 and the wafer stage Y-axis displacement member 132 displace the next die to be below the turnover suction nozzle 155, and the cycle is repeated to suck each die on the wafer carrier.

[0057] It can be understood that, in the present embodiment, please refer to Figure 9 , Figure 9 for the turnover principle schematic diagram provided by the present application. The turnover suction nozzle 155 first sucks the die. At this time, the side of the die opposite to the turnover suction nozzle 155 is the first side of the die. The turnover suction nozzle 155 first rotates the die to the detection station, and the detection assembly 16 detects the first side of the die. After the detection assembly 16 completes the detection of the first side of the die, the turnover motor 153 drives the turnover suction nozzle 155 to rotate by 180°, so that the first side of the die is aligned with the turret assembly 17, thereby enabling the turret assembly 17 to suck the first side of the die, and completing the turnover of the die. If the first side of the die is detected to be unqualified, the turnover suction nozzle 155 is rotated to the defective product processing position, and the die is discarded.

[0058] It can be understood that, in other possible embodiments, the die can also be turned over in other embodiments, which are not limited by the present application.

[0059] In a possible embodiment, please refer to Figure 10 , Figure 10The schematic diagram of the correction assembly provided by an embodiment of the present application. The die sorting device 1 further comprises a correction assembly 19, which comprises a correction X-axis displacement member 191, a correction Y-axis displacement member 192, a correction T-axis rotating member 193, a correction positioning camera 194, an XY-axis correction block 195, and a T-axis correction block 196. The correction X-axis displacement member 191 displaces left and right along the X-axis direction, thereby driving the XY-axis correction block 195 to displace left and right along the X-axis direction. The correction Y-axis displacement member 192 displaces forward and backward along the Y-axis direction, thereby driving the XY-axis correction block 195 to displace forward and backward along the Y-axis direction. The correction T-axis rotating member 193 rotates, thereby driving the T-axis correction block 196 to rotate, so as to correct the die in the X-axis direction or the Y-axis direction. The center of the correction positioning camera 194 and the center of the XY correction block are located on a straight line. When the XY correction block moves, it drives the XY-axis correction block 195 to displace in the X-axis direction or the Y-axis direction, so as to correct the angle of the die.

[0060] In a possible implementation, please refer to Figure 11 , Figure 11 The schematic diagram of the turret assembly provided by an embodiment of the present application. The turret assembly 17 comprises a pick-and-place suction nozzle 171 and a turret motor 172. The pick-and-place suction nozzle 171 picks up the die on the turnover assembly 15, and the turret motor 172 drives the pick-and-place suction nozzle 171 to rotate, thereby driving the die to rotate to the correction assembly 19. After the die is corrected by the correction assembly 19, the turret motor 172 continues to rotate, thereby driving the die to rotate to the detection assembly 16 for detection.

[0061] In particular, please refer to Figure 12 , Figure 12 The schematic diagram of the work station of the turret assembly provided by an embodiment of the present application. After the pick-and-place suction nozzle 171 picks up the first face of the die by the turnover suction nozzle 155, the turret rotating motor drives the pick-and-place suction nozzle 171 to rotate, thereby carrying the die to rotate to the correction work station of the correction assembly 19. The correction positioning camera 194 is coaxial with the center of the XY-axis correction block 195. The XY-axis correction block 195 displaces along the X-axis direction and touches the die, so as to correct the die in the X-axis direction. The turret assembly 17 further comprises a first downward pressing member 173. The first downward pressing member 173 displaces downward along the Z-axis direction, thereby driving the pick-and-place suction nozzle 171 to displace downward along the Z-axis direction. The XY-axis correction block 195 displaces along the Y-axis direction and touches the die, so as to correct the die in the Y-axis direction. When the pick-and-place suction nozzle 171 is coaxial with the center of the correction positioning camera 194, the pick-and-place suction nozzle 171 moves downward, and the correction T-axis rotating member 193 rotates, thereby driving the die to rotate, so as to correct the angle of the die.

[0062] In this embodiment, such as Figure 12 As shown, when the die rotates to the bottom surface inspection station, the second inspection camera takes a picture of the second surface (bottom surface) of the die. Please refer to the following: Figure 13 , Figure 13 This is a schematic diagram of a second detection camera provided according to one embodiment of this application. The second detection camera includes a second X-axis displacement member 160, a second photosensitive element 161, a second lens 162, a second corner light source 163, and a second surface light source 164. It can be understood that the focal length can be changed by the displacement of the second X-axis displacement member 160 to accommodate the detection of grains of different sizes. The direction of light is changed by the prism in the second corner light source 163, thereby enabling the second photosensitive element 161 to detect the grain directly above the second surface light source 164, i.e., to detect the second surface of the grain.

[0063] Specifically, after the second side of the grain is inspected, the pick-and-place nozzle 171 continues to rotate to the side inspection station, where the third inspection camera inspects the third side (right side) of the grain. Please refer to the following: Figure 14 , Figure 14 This is a schematic diagram of a third detection camera provided in one embodiment of this application. The third detection camera includes a third X-axis displacement element 165, a third photosensitive element 166, a third lens 167, a third prism 168, and a third surface light source 169. It is understood that the focal length is changed by the displacement of the third X-axis displacement element 165 to accommodate the detection of grains of different sizes. The direction of light is changed by the third prism 168, thereby enabling the third photosensitive element 166 to detect the third surface of the grain. It is understood that, except that the light sources face four different directions and the four photosensitive elements have a certain height difference in the Z-axis direction, the working principles and structures of the fourth, fifth, and sixth detection cameras are similar to those of the third detection camera, and will not be described in detail here.

[0064] Understandably, when the crystal is located at different detection stations, it may be positioned above or below the light source, making it undetectable by the photosensitive element. In this case, the turret assembly 17 further includes a second pressing member 174, which moves up and down along the Z-axis, thereby causing the pick-and-place nozzle 171 to move up and down along the Z-axis, positioning the crystal within the light source and enabling it to be detected by the photosensitive element.

[0065] Specifically, when the six faces of the die are all detected, the pick-and-place nozzle 171 rotates the die to a tape-out station, and the material collection assembly 18 performs tape-out of the qualified die. In this embodiment, when one of the six faces of the die is a defective product, the pick-and-place nozzle 171 rotates the die to a reject station for rejection. The turret assembly 17 also has a cleaning station. When the pick-and-place nozzle 171 is at the cleaning station, it is cleaned by a nozzle cleaning assembly before entering the die loading station to pick up a die.

[0066] In one possible implementation, refer to Figure 15 , Figure 15 A schematic diagram of a material collection assembly according to an embodiment of the present application is shown in FIG. 8. The material collection assembly 18 includes a material collection X-axis displacement member 181, a material collection track 182, a first material collection U-axis rotation member 183, a heat-sealing Z-axis displacement member 184, a cover tape path 185, an upper cover tape 186, a cutting member 187, a second material collection U-axis rotation member 188, and a material collection Y-axis displacement member 189. The material collection X-axis displacement member 181 and the material collection Y-axis displacement member 189 respectively drive the material collection track 182 to displace along the X-axis direction or the Y-axis direction, so that the detected die is collected in the tape. The rotation of the first material collection U-axis rotation member 183 drives the carrier tape in the material collection track 182 to move by an equal distance. The heat-sealing Z-axis displacement member 184 displaces up and down along the Z-axis direction, thereby driving the heat-sealing knife to displace up and down along the Z-axis direction, and heat-sealing the cover tape 186 passing through the cover tape path 185 to the cover tape on the material collection track 182. The second material collection U-axis rotation member 188 rotates, thereby driving the empty carrier tape reel to collect the material. When the collected die reaches a certain number, the cutting member 187 cuts the carrier tape.

[0067] Specifically, a material collection positioning camera recognizes the tape on the material collection assembly 18 for positioning detection. The turret assembly 17 also includes a third downward pressing member 175, which displaces downward along the Z-axis direction, so that the pick-and-place nozzle 171 displaces downward along the Z-axis direction to a tape placement position of the material collection assembly 18. The pick-and-place nozzle 171 blows to place the die on the tape. The first material collection U-axis rotation member rotates, thereby driving the tape to move forward. When the tape moves to a tape detection position, a tape detection camera detects the placement of the die on the tape. If a defective product is detected, it is sucked to a defective product processing position by a vacuum nozzle. The material collection Y-axis displacement member 189 displaces the tape along the Y-axis direction, and the third downward pressing member 175 displaces the pick-and-place nozzle 171 downward along the Z-axis direction to place the next die for detection. The die placed on the tape continues to displace along the Y-axis direction by a certain distance, and the heat-sealing Z-axis displacement member 184 rotates to press the upper cover tape 186 and the tape, thereby realizing encapsulation of the die on the tape.

[0068] In addition, the grain sorting device 1 has a re-taping mode, that is, the upper tape of the packaged tape is scattered to expose the grains in the tape, the turret assembly 17 further comprises a fourth pressing piece 176, the fourth pressing piece 176 is displaced downward along the Z-axis direction, thereby driving the pick-and-place suction nozzle 171 to be displaced downward along the Z-axis direction, sucking the grains in the tape, and then sequentially passing through correction, detection of multiple surfaces of the grains, and tape collection, to complete the re-taping process.

[0069] In addition, the grain sorting device 1 has a performance test mode for the chip, and a test device can be added before the detection station according to the requirement to test the electrical performance of the chip.

[0070] It should be noted that in the present application, the needle assembly 14, the wafer table assembly 13 and the turnover suction nozzle 155 are coaxial, and the pick-and-place suction nozzle 171 is coaxial with the turnover suction nozzle 155.

[0071] The principles and implementation modes of the present application are described by applying specific examples in the present application, and the above implementation mode is only used to help understand the core idea of the present application; meanwhile, for those skilled in the art, the specific implementation mode and application range will be changed according to the idea of the present application, and the above description should not be understood as a limitation of the present application.

Claims

1. A die sorting apparatus, comprising: The grain sorting device comprises a feeding assembly, a clamping assembly, a wafer table assembly, a thimble assembly, a turnover assembly, a detection assembly, a turret assembly and a receiving assembly. The feeding assembly obtains a wafer box loaded with multiple wafers. The clamping assembly clamps the multiple wafers in the wafer box to the wafer table assembly respectively. The wafer table assembly expands the film of the wafers. The thimble assembly lifts the grains on the wafers after film expansion. The turnover assembly sucks the grains. The detection assembly comprises a first detection camera for detecting the first face of the grains. If the first face is unqualified, the turnover assembly directly rejects the grains. If the first face is qualified, the turnover assembly rotates the first face of the grains and aligns it with the turret assembly so that the turret assembly sucks the first face of the grains. The detection assembly further comprises a second detection camera, a third detection camera, a fourth detection camera, a fifth detection camera and a sixth detection camera for detecting the second face, the third face, the fourth face, the fifth face and the sixth face of the grains respectively. The turret assembly rotates the qualified grains to the receiving assembly for receiving. The feeding assembly comprises a feeding Z-axis displacement member, a first supporting plate and a second supporting plate. The feeding Z-axis displacement member moves up and down along the Z-axis direction, thereby driving the first supporting plate and the second supporting plate to move up and down along the Z-axis direction. The first supporting plate is used to support a wafer box of a first specification, and the second supporting plate is used to support a wafer box of a second specification. The first specification is different from the second specification. The feeding assembly further comprises a first sensor and a second sensor. When the first supporting plate supports the wafer box of the first specification, the first sensor generates a first electric signal. When the second supporting plate supports the wafer box of the second specification, the second sensor generates a second electric signal. The thimble assembly, the wafer table assembly, the turnover suction nozzle of the turnover assembly and the pick-and-place suction nozzle of the turret assembly are coaxially arranged.

2. The die sorting apparatus of claim 1, wherein The clamping assembly comprises a clamping Y-axis displacement member and a clamping member. The clamping Y-axis displacement member moves forward and backward along the Y-axis direction, thereby driving the clamping member to move forward and backward along the Y-axis direction. The clamping member is used to clamp wafers from the wafer box.

3. The die sorting apparatus of claim 1, wherein The wafer table assembly comprises a wafer table X-axis displacement member, a wafer table Y-axis displacement member, a wafer table Z-axis displacement member and a wafer table T-axis rotating member. The wafer table X-axis displacement member moves left and right along the X-axis direction, thereby driving the wafer to move left and right along the X-axis direction. The wafer table Y-axis displacement member moves forward and backward along the Y-axis direction, thereby driving the wafer to move forward and backward along the Y-axis direction. The wafer table Z-axis displacement member moves up and down along the Z-axis direction, thereby driving the wafer to move up and down along the Z-axis direction and pressing the wafer to expand the film of the wafer. The wafer table T-axis rotating member rotates, thereby driving the wafer to rotate.

4. The die sorting apparatus of claim 1, wherein The ejector assembly comprises an ejector X-axis displacement member, an ejector Y-axis displacement member, a first ejector Z-axis displacement member, a second ejector Z-axis displacement member, an ejector shaft and an ejector cap. The ejector X-axis displacement member displaces left and right along the X-axis direction, thereby driving the ejector cap to displace left and right along the X-axis direction. The ejector Y-axis displacement member displaces forward and backward along the Y-axis direction, thereby driving the ejector cap to displace forward and backward along the Y-axis direction. When the wafer is located directly above the ejector cap, the first ejector Z-axis displacement member displaces upward along the Z-axis direction, thereby driving the ejector cap to displace upward along the Z-axis direction and approach the blue film on the wafer. The second ejector Z-axis displacement member displaces upward along the Z-axis direction, thereby driving the ejector shaft to displace upward along the Z-axis direction and lift the die on the blue film.

5. The die sorting apparatus of claim 1, wherein The turnover assembly comprises a pressing member, a turnover Y-axis displacement member, a turnover motor, a turnover vacuum member and a turnover suction nozzle. The pressing member displaces up and down along the Z-axis direction, thereby driving the turnover suction nozzle to displace up and down along the Z-axis direction. The turnover motor drives the turnover suction nozzle to rotate. The turnover vacuum member provides suction pressure or blowing pressure for the turnover suction nozzle, thereby achieving the carrying of the die.

6. The die sorting apparatus of claim 1, wherein The die sorting device further comprises a correction assembly. The correction assembly comprises a correction X-axis displacement member, a correction Y-axis displacement member, a correction T-axis rotating member, a correction positioning camera, an XY-axis correction block and a T-axis correction block. The correction X-axis displacement member displaces left and right along the X-axis direction, thereby driving the XY-axis correction block to displace left and right along the X-axis direction. The correction Y-axis displacement member displaces forward and backward along the Y-axis direction, thereby driving the XY-axis correction block to displace forward and backward along the Y-axis direction. The correction T-axis rotating member rotates, thereby driving the T-axis correction block to rotate for the correction of the die in the X-axis direction or the Y-axis direction. The center of the correction positioning camera and the center of the XY correction block are located on a straight line. When the XY correction block moves, it drives the XY-axis correction block to displace in the X-axis direction or the Y-axis direction, thereby correcting the angle of the die.

7. The die sorting apparatus of claim 6, wherein The turret assembly comprises a pick-and-place suction nozzle and a turret motor. The pick-and-place suction nozzle picks up the die on the turnover assembly. The turret motor drives the pick-and-place suction nozzle to rotate, thereby driving the die to rotate to the correction assembly. After the correction of the die, the turret motor continues to rotate, thereby driving the die to rotate to the detection assembly for the detection of the die.

8. The die sorting apparatus of claim 1, wherein The collecting component comprises a collecting X-axis displacement member, a collecting track, a first collecting U-axis rotating member, a heat sealing Z-axis displacement member, a cover tape path, an upper cover tape, a cutting member, a second collecting U-axis rotating member and a collecting Y-axis displacement member. The collecting X-axis displacement member and the collecting Y-axis displacement member respectively drive the collecting track to displace along the X-axis direction or the Y-axis direction, so that the detected die is collected into the ribbon; the rotation of the first collecting U-axis rotating member drives the carrier tape in the collecting track to move equidistantly; the heat sealing Z-axis displacement member displaces up and down along the Z-axis direction, thereby driving the heat sealing cutter to displace up and down along the Z-axis direction, and the upper cover tape passing through the cover tape path reaches the cover tape on the collecting track to be heat sealed; the second collecting U-axis rotating member rotates, thereby driving the empty carrier tape reel to collect the ribbon, and when the collected die reaches a certain number, the cutting member cuts the carrier tape.

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