Wide bandgap semiconductor double-sided heat dissipation module packaging structure based on conductive metal band

A wide-bandgap semiconductor and conductive metal strip technology, applied in semiconductor devices, semiconductor/solid-state device components, and electrical solid-state devices, etc., can solve the problems of bond point connection failure, harsh heat dissipation environment, and large chip thermal resistance. Enhance current flow capacity, improve space utilization, reduce the effect of common source inductance

CN114649279APending Publication Date: 2022-06-21XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2022-06-21

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Abstract

The invention discloses a wide bandgap semiconductor double-sided heat dissipation module packaging structure based on a conductive metal band, semiconductor power chips of different bridge arms are arranged on different power substrates, the size of a module is reduced, and the power density of the module is greatly improved; the power gasket is arranged between the top power substrate and the bottom power substrate, plays a role in mechanical support and electrical connection, provides an additional heat dissipation path for each semiconductor power chip on the basis of double-sided heat dissipation, reduces the thermal coupling degree between the chips, achieves the chip temperature equalization effect, and improves the heat dissipation environment of the chips; the driving loop and the commutation loop are nearly vertical in space, the electromagnetic coupling degree between the loops is greatly reduced, and the reliability of the module is further improved; the commutation loop uses the conductive metal belt to complete electrical connection required by the chip, the parasitic inductance value of the module is greatly reduced, and the source electrode conductive metal belt is provided with a hole groove at the joint, so that the distribution uniformity of the parasitic inductance can be improved, and the current sharing effect of the chip is achieved.
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Description

technical field

[0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a wide-bandgap semiconductor double-sided heat dissipation module packaging structure based on conductive metal strips. Background technique

[0002] A power module is a module formed by repackaging several power semiconductor chips according to a certain functional combination. Compared with discrete power devices, power modules have a high degree of integration, so they have great advantages in electrical performance, thermal performance and economic considerations.

[0003] In recent years, with the rapid development of industries represented by new energy grid connection, high-voltage direct current transmission, electric vehicles, high-speed rail, aerospace, and pulse power, the performance requirements of power electronic systems for semiconductor power modules are increasing, which promotes the continuous improvement of power modules. It is dev...

Examples

Embodiment

[0067] see figure 1 , figure 2 , image 3 and Figure 4 , the package structure of this embodiment includes 2 power substrates, 2 groups of 6 wide bandgap power semiconductor chips, 4 power pads, 3 power terminals, 8 drive terminals and 6 groups of conductive metal strips.

[0068] The two power substrates are specifically the top power substrate 100 and the bottom power substrate 200 .

[0069] The six wide-bandgap power semiconductor chips 400 are specifically a first high-arm wide-bandgap power semiconductor chip 401, a second high-arm wide-bandgap power semiconductor chip 402, a third high-arm wide-bandgap power semiconductor chip 403, The first lower arm wide bandgap power semiconductor chip 404 , the second lower arm wide bandgap power semiconductor chip 405 and the third lower arm wide bandgap power semiconductor chip 406 .

[0070] The four power pads are specifically a DC side power pad 301 , an AC side main power pad 302 , an AC side auxiliary power pad 303 and ...