An automated system and method for feeding battery cells to a large carrier plate

Abstract

The application discloses a kind of automatic feeding battery piece to the caching system and method of big carrier plate, it is related to silicon wafer production equipment technical field, including caching face-changing transfer table and the grabbing device of configuration in caching face-changing transfer table side, big carrier plate and small carrier plate;Caching face-changing transfer table, big carrier plate and small carrier plate all have the placing groove for loading silicon wafer;Grabbing device can grab silicon wafer on big carrier plate and transfer to caching face-changing transfer table, can also grab silicon wafer on small carrier plate and transfer to big carrier plate.The beneficial effects of the application are that by increasing caching face-changing transfer table, silicon wafer can be cached to enable the next action of grabbing device, and by grabbing device from above, silicon wafer is placed under caching face-changing transfer table, and by another grabbing device, silicon wafer is grabbed from the bottom of caching face-changing transfer table, so that silicon wafer turning is completed.The system in the application is modularly designed and manufactured, has small floor space, simple structure and is easy to use.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer production equipment technology, specifically to an automated feeding system and method for feeding solar cells onto a large carrier plate. Background Technology

[0002] Monocrystalline silicon heterojunction solar wafers boast high conversion efficiency and are widely recognized in the photovoltaic industry as one of the key technologies for next-generation large-scale industrialization. One of the core pieces of equipment in CVD (Chemical Vapor Deposition) systems for producing heterojunction silicon wafers is the vertical HWCVD (Hot Filament Chemical Vapor Deposition) system. However, silicon wafers are fed into the vertical HWCVD system via a large carrier plate for coating. During the placement and removal of the wafers from the carrier plate, fragmentation and wear are common. Furthermore, when coating one side of a wafer, transferring it to another machine to coat the other side requires flipping the wafer, a difficult process that slows down the loading cycle. Summary of the Invention

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide an automated buffer system and method for feeding solar cells to a large carrier plate.

[0004] The technical solution of the present invention is as follows:

[0005] The first aspect of the present invention provides an automated feeding system for solar cells to a large carrier plate, including a buffer exchange transfer station, wherein a gripping device, a large carrier plate and a small carrier plate are configured on one side of the buffer exchange transfer station;

[0006] The buffer switching transfer station, the large carrier board, and the small carrier board all have placement slots for loading silicon wafers;

[0007] The gripping device can grip silicon wafers in the large carrier plate placement slot and transfer them to the placement slot on the buffer face-changing transfer platform. The gripping device can also grip silicon wafers in the small carrier plate placement slot and transfer them to the placement slot on the large carrier plate.

[0008] In one specific embodiment of the present invention, the gripping device is disposed between the buffer exchange transfer station and the large carrier board, and the small carrier board is disposed between the buffer exchange transfer station and the gripping device.

[0009] The placement slots on the large carrier plate are positioned facing the buffer exchange transfer station, and both the buffer exchange transfer station and the placement slots on the small carrier plate are positioned vertically upwards.

[0010] In one specific embodiment of the present invention, the cache switching relay station includes:

[0011] A placement plate, wherein the placement plate is provided with a plurality of through slots;

[0012] A plurality of first clamping mechanisms are provided. Each first clamping mechanism includes two oppositely arranged fixed plates and two driving devices. The fixed plates are provided with a plurality of sets of clamping rods. Each set of clamping rods consists of two rods, and the two clamping rods are located on two adjacent side walls of the fixed plates. One set of clamping rods on the fixed plate is diagonally arranged with another set of clamping rods on the opposite fixed plate. Each clamping rod has a first slot for clamping a silicon wafer. The driving devices are provided on the placement plate for driving the fixed plates to move horizontally.

[0013] In one specific embodiment of the present invention, the cache switching relay station further includes:

[0014] A plurality of first auxiliary support devices are provided for guiding and supporting the movement of the fixed plate. The first auxiliary support devices are disposed on the placement plate and include a first guide rail and a first moving block. The first moving block is slidably disposed on the first guide rail. The first guide rail is disposed on the placement plate and parallel to the driving device.

[0015] In one specific embodiment of the present invention, the grasping device includes:

[0016] Several second clamping mechanisms are provided, each second clamping mechanism including a first driving device and two opposing support members. Several sets of finger clamps are provided on the side wall of the support member near the buffer exchange turntable. Each set of finger clamps consists of two finger clamps, and the two finger clamps are located on two adjacent side walls of the support member. One set of finger clamps on the support member is diagonally arranged with another set of finger clamps on the opposing support member. The finger clamps are provided with second slots for clamping silicon wafers. The first driving device is provided on the bracket for driving the two support members to move away from or closer to each other.

[0017] In one specific embodiment of the present invention, the gripping device further includes:

[0018] Several second auxiliary support devices are provided for guiding and supporting the movement of the support member. Each second auxiliary support device includes a second guide rail, two second moving blocks, and a connecting plate. The second guide rail is disposed on the connecting plate, and the second moving blocks are slidably disposed on the second guide rail.

[0019] In one specific embodiment of the present invention, the gripping device further includes:

[0020] Several fixing devices for fixing silicon wafers to a large carrier plate, the fixing devices including metal pins and serrated blocks, the serrated blocks being disposed on the pins; the large carrier plate is provided with pin holes that mate with the pins, and magnets are disposed in the pin holes;

[0021] Several lifting devices are provided for driving the fixing device to move closer to or away from the large carrier plate. Each lifting device includes a second driving device, a connecting member, a sleeve rod, and an electromagnet. The second driving device is used to drive the connecting member to move up and down. The sleeve rod is disposed on the connecting member. The electromagnet is disposed inside the sleeve rod. The upper end of the pin is disposed inside the sleeve rod. The electromagnet can attract the pin when it is energized.

[0022] A second aspect of the present invention provides an automated method for feeding solar cells onto a large carrier plate, comprising the following steps:

[0023] S1. The large carrier board loaded with silicon wafers is conveyed to the gripping position of the gripping device via a conveying device;

[0024] S2. Activate the gripping device, grip the silicon wafer in the large carrier plate placement slot, and transfer the gripped silicon wafer to the placement slot on the cache exchange storage transfer platform.

[0025] S3. The small carrier board loaded with silicon wafers is conveyed to the gripping position of the gripping device via a conveyor.

[0026] S4. Activate the gripping device to grip the silicon wafer in the small carrier plate placement slot and transfer the gripped silicon wafer to the placement slot on the large carrier plate.

[0027] In one specific embodiment of the present invention, in step S4, the gripping device can place and fix the gripped silicon wafer in a placement slot on a large carrier plate.

[0028] In one specific embodiment of the present invention, in step S4, the silicon wafer can be clamped and placed in the placement slot on the large carrier plate by the second clamping mechanism on the gripping device. The lifting device on the gripping device can drive the fixing device to approach the large carrier plate. The pin on the fixing device can be attracted by the magnet on the large carrier plate. The side of the serrated pressure block set on the pin can contact the silicon wafer on the large carrier plate, thereby fixing the silicon wafer on the large carrier plate.

[0029] This invention has at least one of the following beneficial effects:

[0030] 1. This invention utilizes a buffer transfer station to buffer silicon wafers. The silicon wafers on a large carrier board are first placed on the buffer transfer station for buffering and flipping, allowing the gripping device to proceed to the next step. The gripping device places the silicon wafer from above under the buffer transfer station, and then another gripping device picks up the wafer from below, completing the wafer flipping process. The modular design and manufacturing of this invention allow for increased production efficiency and capacity simply by adding more modules to the system. The system has a small footprint and a simple structure.

[0031] 2. The buffer reversing transfer platform of this invention uses a simulated human finger method to fix the four corners of the silicon wafer to achieve the purpose of clamping the silicon wafer, while performing a correction action on the silicon wafer. When in contact with the silicon wafer, it minimizes wear on the silicon wafer, prevents contamination of the silicon wafer during gripping, and reduces the defect rate. Furthermore, the silicon wafer is gripped from above and placed under the buffer reversing transfer platform by a gripping device, and then the silicon wafer is gripped from below the buffer reversing transfer platform by another gripping device, thus completing the silicon wafer flipping.

[0032] 3. The gripping device of this invention reduces the contact area with the silicon wafer during gripping. It uses a method simulating human fingers to fix the four corners of the silicon wafer, dragging and clamping the edges and end faces of the silicon wafer, reducing the breakage rate and friction damage to the silicon wafer. At the same time, it can perform a correction action on the silicon wafer, so as not to cause contamination to the silicon wafer during gripping, reducing the defect rate. Furthermore, the fixing device and lifting device can fix the silicon wafer to the large carrier plate, so that the silicon wafer will not fall off the large carrier plate when the silicon wafer is vertically deposited. The serrated pressure block can reduce the area of ​​the silicon wafer being pressed, thereby increasing the overall coating area of ​​the silicon wafer. When it is necessary to remove the silicon wafer, the electromagnet is energized to attract the pin, and the pin can be pulled out from the pin hole on the large carrier plate. Then, the second clamping mechanism clamps the silicon wafer to remove it. It is convenient to use and reduces damage to the silicon wafer. Moreover, it can grip multiple wafers at once, which can greatly improve production efficiency. The positioning requirements for silicon wafer placement are much lower than those of suction cups, which reduces the difficulty of positioning and the dimensional accuracy requirements of the matching silicon wafer placement tray and other mechanisms. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the caching system in a preferred embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the overall structure of the cache switching relay station in a preferred embodiment of the present invention;

[0035] Figure 3 This is a partial structural schematic diagram of the cache switching relay in a preferred embodiment of the present invention;

[0036] Figure 4 yes Figure 3Enlarged view of a portion of point A in the middle;

[0037] Figure 5 This is a partial structural schematic diagram of the gripping device in a preferred embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of the connection between the bracket, clamping mechanism, fixing device and lifting device in a preferred embodiment of the present invention;

[0039] Figure 7 This is a schematic diagram of the connection between the bracket and the clamping mechanism in a preferred embodiment of the present invention;

[0040] Figure 8 yes Figure 7 A magnified view of a portion of the image;

[0041] Figure 9 This is a bottom view of the connection between the bracket and the clamping mechanism in a preferred embodiment of the present invention;

[0042] Figure 10 This is a perspective view of the connection between the sleeve rod, electromagnet, pin, and serrated pressure block in a preferred embodiment of the present invention;

[0043] Figure 11 This is a cross-sectional view of the pin in a preferred embodiment of the present invention;

[0044] Figure 12 This is a cross-sectional view of the sleeve rod in a preferred embodiment of the present invention;

[0045] Figure 13 This is a perspective view of the wire clamp in a preferred embodiment of the present invention.

[0046] Figure label:

[0047] 1. Buffer face-changing transfer table; 110. Profile frame; 12. Placement plate; 121. Through slot; 13. First clamping mechanism; 131. Fixing plate; 1311. Protrusion; 1312. Clearance slot; 132. Drive device; 133. Clamping rod; 1331. First slot; 14. First auxiliary support device; 141. First guide rail; 142. First moving block;

[0048] 2. Gripping device; 210. Connecting plate; 22. Bracket; 23. Second clamping mechanism; 231. First driving device; 232. Support member; 2321. First clearance groove; 2322. Second clearance groove; 233. Finger gripper; 2331. Second slot; 234. Second auxiliary support device; 2341. Second guide rail; 2342. Second moving block; 2343. Connecting plate; 24. Fixing device; 241. Pin; 2411. Upper positioning pin; 2412. Lower positioning pin; 242. Serrated pressure block; 25. Lifting device; 251. Second driving device; 252. Connecting member; 2521. Wire clamp; 253. Sleeve rod; 254. Electromagnet; 255. Slide rail; 256. Slider; 257. Connecting rod;

[0049] 3. Large carrier plate; 31. First placement slot;

[0050] 4. Small carrier plate; 41. Second placement slot;

[0051] 5. Silicon wafers. Detailed Implementation

[0052] The present invention will be further described in detail below with reference to specific embodiments, but the present invention is not limited to the following specific embodiments.

[0053] like Figure 1 As shown, this embodiment provides an automated buffer system for feeding solar cells to a large carrier plate, including a buffer exchange transfer station 1. A gripping device 2, a large carrier plate 3, and a small carrier plate 4 are configured on one side of the buffer exchange transfer station 1. The buffer exchange transfer station 1, the large carrier plate 3, and the small carrier plate 4 all have placement slots for loading silicon wafers 5. The gripping device 2 includes a gripper capable of gripping the silicon wafer 5 located in the placement slot of the large carrier plate 3 and transferring the gripped silicon wafer 5 to the placement slot on the buffer exchange transfer station 1. The gripper can also grip the silicon wafer 5 located in the placement slot of the small carrier plate 4 and transfer the gripped silicon wafer 5 to the placement slot on the large carrier plate 3.

[0054] In this embodiment, the gripping device 2 is disposed between the buffer exchange transfer platform 1 and the large carrier plate 3, and the small carrier plate 4 is disposed between the buffer exchange transfer platform 1 and the gripping device 2; the placement slot on the large carrier plate 3 is disposed facing the buffer exchange transfer platform 1, and the placement slot on the small carrier plate 4 is disposed vertically upward.

[0055] This embodiment utilizes a buffer transfer station 1 to buffer silicon wafers 5. First, the silicon wafers on the large carrier plate 3 are placed on the buffer transfer station 1 for buffering, allowing the gripping device 2 to perform the next action, such as placing the silicon wafer 5 from the small carrier plate 4 onto the large carrier plate 3, thus enabling operations like coating. Furthermore, the gripping device places the gripped silicon wafer from above under the buffer transfer station, and then another gripping device grips the wafer from below, completing the wafer flipping process. This embodiment features a modular system design and manufacturing; increasing cycle time and production capacity only requires adding more modules to the system. The system has a small footprint and a simple structure.

[0056] like Figure 1 As shown, the large carrier plate 3 has several first placement slots 31 on the side wall facing the buffer exchange transfer table 1. The silicon wafer 5 can be placed in the first placement slots 31. The large carrier plate 3 is also provided with pin holes, and magnets are provided in the pin holes. The silicon wafer is pressed by the magnets, which ensures that the silicon wafer 5 will not shake during operation, causing it to fall or be scratched.

[0057] like Figure 1 As shown, the upper surface of the small carrier plate 4 is provided with a plurality of second placement slots 41, and the silicon wafer 5 can be placed in the second placement slots 41.

[0058] like Figures 2-4 As shown, the cache swapping relay station 1 in this embodiment includes the following components:

[0059] Profile frame 110;

[0060] The placement plate 12 is mounted on the profile frame 110, and the placement plate 12 is provided with a plurality of through slots 121;

[0061] A plurality of first clamping mechanisms 13 include two opposing fixed plates 131 and two driving devices 132. Each fixed plate 131 has several sets of clamping rods 133, with two clamping rods in each set, located on two adjacent sides of the through slot 121. One set of clamping rods 133 on the fixed plate 131 is diagonally positioned to the other set on the opposing fixed plate 131, thus clamping the silicon wafer 5. Specifically, each clamping rod 133 has a first slot 1331 facing the silicon wafer 5. In this embodiment, the placement slots formed by the first slots 1331 on the diagonally positioned clamping rods 133 are square, allowing a square silicon wafer 5 to be placed within the first slot 1331. The driving devices 132 are mounted on the placement plate 12 at a certain angle to drive the fixed plates 131 to move. In this invention, the two fixing plates 131 are initially in an open state. When the external gripper picks up the silicon wafer and places it between the two fixing plates 131, the two driving devices 132 move the fixing plates 131 within the through slot 121, bringing the two fixing plates 131 closer together. A set of clamping rods 133 on one fixing plate 131 engages with a set of clamping rods 133 on the other fixing plate 131, and the first slot 1331 clamps the side of the silicon wafer, thus securing the silicon wafer with the cooperation of the four clamping rods 133. When it is necessary to remove the silicon wafer from the two fixing plates 131, another external gripper picks up the silicon wafer from the bottom of the profile frame 110, and the two driving devices 132 move the two fixing plates 131 away from each other, thereby removing the silicon wafer. Specifically, the drive device 132 is a cylinder, and the fixing plate 31 is detachably mounted on the cylinder by bolts; the placement plate 12 is divided into two areas by a partition; the clamping rod 133 is provided with a protective pad to minimize wear on the silicon wafer when in contact with it.

[0062] In this embodiment, the driving device 132 is at a 45-degree angle to the placement plate 12 in the horizontal direction. The two clamping rods 33 are a group and their first slots 1331 are perpendicular to each other. The driving device 132 drives the fixing plate 131 to move at a 45-degree angle relative to the placement plate 12, which can simultaneously make the first slots 1331 of the two clamping rods 133 engage with the side of the silicon wafer.

[0063] In this embodiment, the fixing plate 131 has an outwardly extending protrusion 1311 on one side, and a clamping rod 133 is provided on the protrusion 1311 so that the clamping rod 133 can fix the middle part near the silicon wafer so that the silicon wafer will not fall off.

[0064] In this embodiment, several first auxiliary support devices 14 are also included, which are disposed on the placement plate 12 to guide and support the movement of the fixed plate 131.

[0065] In this embodiment, the first auxiliary support device 14 includes a first guide rail 141 and a first moving block 142. The first moving block 142 is slidably disposed on the first guide rail 141, and the first guide rail 141 is disposed on the placement plate 12 at a certain angle. Specifically, the fixing plate 131 is detachably disposed on the placement plate 12 by bolts.

[0066] In this embodiment, the first guide rail 141 is at a 45-degree angle to the placement plate 12 in the horizontal direction.

[0067] In this embodiment, the fixing plate 131 is provided with a number of clearance grooves 1312, which facilitates the external gripper to grasp the silicon wafer without causing interference.

[0068] The buffer reversing transfer table of this invention uses a simulated human finger method to fix the four corners of the silicon wafer to achieve the purpose of clamping the silicon wafer, while performing a correction action on the silicon wafer. When in contact with the silicon wafer, it minimizes wear and tear, prevents contamination of the silicon wafer during gripping, and reduces the defect rate. Furthermore, the gripping device places the gripped silicon wafer from above under the buffer reversing transfer table, and then another gripping device grips the silicon wafer from below the buffer reversing transfer table, thus completing the silicon wafer flipping.

[0069] like Figures 5-13 As shown, the gripping device 2 in this embodiment includes a robot and a gripper. The gripper is mounted on the robot, and the robot can drive the gripper to move forward, backward, left, right, and up and down. The structure and principle of the robot are well known to those skilled in the art, and will not be described in detail in this embodiment.

[0070] The gripper in this embodiment includes the following components:

[0071] Connecting plate 210;

[0072] Several brackets 22 are arranged at intervals on the connecting plate 210;

[0073] Several second clamping mechanisms 23 are provided, each second clamping mechanism 23 being mounted on a bracket 22. Each second clamping mechanism 23 includes a first driving device 231, two opposing support members 232, and several second auxiliary support devices 234. Several sets of finger grippers 233 are provided on the sidewall of the support member 232 near the buffer exchange turntable 1. Each set of finger grippers 233 consists of two fingers, and the two finger grippers 233 are located on two adjacent sidewalls of the support member 232. In this embodiment, the two finger grippers 233 are located on two adjacent sidewalls of the support member 232 that are perpendicular to each other. The set of finger grippers 233 on the support member 232 is positioned opposite to the opposing support members 232. Another set of finger grippers 233 on the support member 232 are arranged diagonally. The finger grippers 233 are provided with second slots 2331 for gripping silicon wafers 5. The second slots 2331 on the two sets of diagonally arranged finger grippers 233 together form a placement slot, that is, the second slots 2331 on the four diagonally arranged finger grippers 233 together form a placement slot for gripping silicon wafers 5. In this embodiment, the four diagonally arranged finger grippers 233 are square. The first driving device 231 is inclined in the horizontal direction on the bracket 22 for driving the two support members 232 to move away from or towards each other. The second auxiliary support device 234 is used to guide and support the movement of the support members 232. In this invention, the connecting plate 210 is mounted on a robot composed of a robotic arm or modules. The second gripping mechanism 23 is controlled by a PLC. Both the large carrier plate 3 and the small carrier plate 4 are provided with clearance holes for the finger grippers 233. When the finger grippers 233 move with the connecting plate 210 into the placement slots of the carrier plate for placing silicon wafers, the first driving device 231 activates, simultaneously driving the two support members 232 to move. The two support members 232 move closer to each other, and the two finger grippers 233 with two mutually perpendicular second slots 2331 on the support member 232 form a group, so that the four sides of the silicon wafer are respectively gripped in the four slots. Within the second slot 2331 on the finger gripper 233, the connecting plate 210 moves to the right, causing the second gripping mechanism 23 to grasp the silicon wafer. The first driving device 231 is tilted on the bracket 22. When the first driving device 231 is activated, it can grip the silicon wafer in different directions with the two finger grippers 233 on the support member 232. When it is necessary to place the silicon wafer into the carrier plate, the second gripping mechanism 23 moves the silicon wafer into the carrier plate placement slot. The activation of the first driving device 231 simultaneously drives the two support members 232 to move, causing the two support members 232 to move away from each other, thus placing the silicon wafer into the carrier plate. Specifically, the first driving device 231 is a pneumatic gripper, which is tilted at a 45-degree angle to the bracket 22 in the horizontal direction.

[0074] In this embodiment, the support member 232 is provided with a first clearance groove 2321 and a second clearance groove 2322, and the finger clamp 233 is provided on the side of the first clearance groove 2321 and the second clearance groove 2322, so that the finger clamp 233 can fix the middle part near the silicon wafer, so that the silicon wafer will not fall off, and at the same time, the downward movement of the fixing device 24 will not interfere with the support member 232.

[0075] In this embodiment, the second auxiliary support device 234 is inclinedly mounted on the bracket 22. The second auxiliary support device 234 includes a second guide rail 2341, two second moving blocks 2342, and a connecting plate 2343. The second guide rail 2341 is mounted on the connecting plate 2343, and the moving blocks 242 are slidably mounted on the second guide rail 2341. The connecting plate 2343 is inclined at a 45-degree angle on the bracket 22. One end of the moving block 242 is connected to the support member 232, and one end of the second moving block 2342 slides on the second guide rail 2341.

[0076] In this embodiment, there are also several fixing devices 24 and several lifting devices 25. The fixing devices 24 are used to fix the silicon wafers gripped by the gripping device 2 from the small carrier plate 4 onto the large carrier plate 3. The lifting devices 25 are used to drive the fixing devices 24 to move closer to or away from the large carrier plate 3.

[0077] In this embodiment, the lifting device 25 includes several second driving devices 251, several connecting parts 252, several sleeve rods 253 and several electromagnets 254. The second driving devices 251 are used to drive the connecting parts 252 to move up and down. The sleeve rods 253 are disposed on the connecting parts 252 and the electromagnets 254 are disposed inside the sleeve rods 253. Specifically, the second driving device 251 is a cylinder, and there are two of them; the bracket 22, the second clamping mechanism 23, and the lifting device 25 are three in number. The lifting device 25 also includes several slide rails 255, several sliders 256, and connecting rods 257. The number of connecting parts 252 and connecting rods 257 in the lifting device 25 is determined according to the actual number of silicon wafers placed on the carrier. The left and right lifting devices 25 have two connecting parts 252 and zero connecting rods 257. The second driving device 251 is mounted on the bracket 22. The second driving device 251 drives the connecting parts 252 to move, which in turn drives the sleeve rod 253 to move. The middle lifting device 25 has three connecting parts 252 and one connecting rod 257. The connecting rod 257 connects the three connecting parts 252. The second driving device 251 drives the connecting rod 257 to move, which in turn drives the connecting parts 252 to move. The sliders 256 are mounted on the bracket 22, and the slide rails 255 are mounted on the connecting parts 252.

[0078] In this embodiment, the fixing device 24 includes a pin 241 made of metal and a serrated pressure block 242. The serrated pressure block 242 is disposed on the outer wall of the pin 241. Figure 10 As shown, the upper end of the pin 241 is set inside the sleeve 253 and is spaced a certain distance from the electromagnet 254. The serrated pressure block 242 is located outside the sleeve 253. The large carrier plate 3 is also provided with a pin hole, and a magnet is provided in the pin hole. The pin 241 is a stainless steel pin, so the pin 241 can be attracted by the magnet in the pin hole. When the silicon wafer needs to be placed into the large carrier plate 3, the lifting device 25 moves with the connecting plate 210, the second clamping mechanism 23 places the silicon wafer on the large carrier plate 3, the second driving device 251 moves the connecting piece 252 to the right, so that the pin 241 is inserted into the pin hole on the large carrier plate 3, the electromagnet 254 is de-energized, the sleeve rod 253 moves to the left with the connecting plate 210, the magnet in the pin hole attracts the pin 241, and the serrated pressure block 242 makes a small amount of side contact with the silicon wafer, so that the silicon wafer will not fall off the large carrier plate 3 when it is vertically coated, and the serrated pressure block 242 can reduce the area of ​​the silicon wafer being pressed, thereby increasing the overall coating area of ​​the silicon wafer. When it is necessary to remove the silicon wafer, the sleeve 253 moves to the right with the connecting plate 210, the electromagnet 254 is energized to attract the pin 241, the pin 241 is pulled out from the pin hole, and the second clamping mechanism 23 clamps the silicon wafer and moves to the left with the connecting plate 210 to remove the silicon wafer.

[0079] In this embodiment, the pin 241 is composed of an upper positioning pin 2411 and a lower positioning pin 2412. The upper positioning pin 2411 and the lower positioning pin 2412 are detachably connected by bolts. Both the upper positioning pin 2411 and the lower positioning pin 2412 are provided with annular grooves, and the serrated pressure block 242 is fitted inside the annular grooves.

[0080] In this embodiment, the connector 252 is provided with a plurality of wire clamps 2521 to centrally fix the wires of the plurality of electromagnets 254. The wire clamps 2521 are U-shaped and have through holes on both sides.

[0081] This embodiment uses a method simulating human fingers to fix the four corners of the silicon wafer to achieve the purpose of clamping, while simultaneously performing a correction action on the silicon wafer. When in contact with the silicon wafer, it minimizes wear and tear, prevents contamination of the silicon wafer during gripping, and reduces the defect rate. Multiple wafers can be gripped at once, which can greatly improve production efficiency. The positioning requirements for placing silicon wafers are much lower than those of suction cups, thus reducing the difficulty of positioning and the dimensional accuracy requirements of the accompanying silicon wafer placement trays and other mechanisms.

[0082] This embodiment also provides an automated method for feeding solar cells onto a large carrier plate, including the following steps:

[0083] S1. The large carrier plate 3 loaded with silicon wafers 5 is transported to the gripping position of the gripping device 2 by the conveying device.

[0084] S2. Activate the gripping device 2, grip the silicon wafer 5 in the placement slot of the large carrier board 3 through the gripping device 2, and transfer the gripped silicon wafer 5 to the placement slot on the buffer exchange storage transfer table 4.

[0085] S3. The small carrier plate 4 loaded with silicon wafer 5 is conveyed to the gripping position of the gripping device 2 by the conveyor.

[0086] S4. Activate the gripping device 2, grip the silicon wafer 5 in the small carrier plate 4 placement slot through the gripping device 2, and transfer the gripped silicon wafer 5 to the placement slot on the large carrier plate 3.

[0087] In this embodiment, in step S4, the gripping device 2 can place and fix the gripped silicon wafer 5 in the placement slot on the large carrier plate 3. Specifically, the second clamping mechanism 23 on the gripping device 2 can clamp the silicon wafer 5 and place it in the placement slot on the large carrier plate 3. The lifting device 25 on the gripping device 2 can drive the fixing device 24 to approach the large carrier plate 3. The pin 241 on the fixing device 24 can be attracted by the magnet on the large carrier plate 3. The side of the serrated pressure block 242 provided on the pin 241 can contact the silicon wafer 5 on the large carrier plate 3, thereby fixing the silicon wafer 5 on the large carrier plate 3.

[0088] The above are merely exemplary embodiments of the present invention and do not constitute any limitation on the scope of protection of the present invention. All technical solutions formed by equivalent exchange or substitution fall within the scope of protection of the present invention.

Claims

1. An automated system for feeding solar cells onto a large carrier plate, characterized in that, It includes a buffer exchange transfer station (1), and a gripping device (2), a large carrier plate (3) and a small carrier plate (4) are arranged on one side of the buffer exchange transfer station (1); The buffer switching transfer station (1), the large carrier plate (3) and the small carrier plate (4) all have placement slots for loading silicon wafers (5); The gripping device (2) can grip the silicon wafer (5) in the placement slot of the large carrier board (3) and transfer it to the placement slot on the buffer face-changing transfer table (1). The gripping device (2) can also grip the silicon wafer (5) in the placement slot of the small carrier board (4) and transfer it to the placement slot on the large carrier board (3). The cache face-changing relay station (1) includes: A placement plate (12) is provided with a plurality of through slots (121); A plurality of first clamping mechanisms (13) are provided. Each first clamping mechanism (13) includes two oppositely arranged fixed plates (131) and two driving devices (132). The fixed plates (131) are provided with a plurality of sets of clamping rods (133). Each set of clamping rods (133) consists of two rods, and the two clamping rods (133) are located on two adjacent side walls of the fixed plates (131). One set of clamping rods (133) on the fixed plates (131) is diagonally arranged with another set of clamping rods (133) on the opposite fixed plates (131). Each clamping rod (133) has a first slot (1331) for clamping a silicon wafer (5). The driving devices (132) are provided on the placement plate (12) for driving the fixed plates (131) to move in the horizontal direction. The cache face-changing relay station (1) also includes: A plurality of first auxiliary support devices (14) are provided for guiding and supporting the movement of the fixed plate (131). The first auxiliary support devices (14) are disposed on the placement plate (12). The first auxiliary support device (14) includes a first guide rail (141) and a first moving block (142). The first moving block (142) is slidably disposed on the first guide rail (141). The first guide rail (141) is disposed on the placement plate (12) and parallel to the driving device (132).

2. The automated feeding system for solar cells to a large carrier plate according to claim 1, characterized in that, The gripping device (2) is disposed between the buffer exchange transfer station (1) and the large carrier plate (3), and the small carrier plate (4) is disposed between the buffer exchange transfer station (1) and the gripping device (2); The placement slot on the large carrier plate (3) is set towards the buffer exchange transfer platform (1), and the placement slots on the buffer exchange transfer platform (1) and the small carrier plate (4) are both set upwards in the vertical direction.

3. The automated feeding system for solar cells to a large carrier plate according to claim 1, characterized in that, The gripping device (2) includes: Several second clamping mechanisms (23) are provided. Each second clamping mechanism (23) includes a first driving device (231) and two opposing support members (232). Several sets of finger clamps (233) are provided on the side wall of the support member (232) near the buffer exchange turntable (1). Each set of finger clamps (233) consists of two finger clamps, and the two finger clamps (233) are located on two adjacent side walls of the support member (232). One set of finger clamps (233) on the support member (232) is diagonally arranged with another set of finger clamps (233) on the opposing support member (232). The finger clamps (233) are provided with a second slot (2331) for clamping the silicon wafer (5). The first driving device (231) is provided on the bracket (22) for driving the two support members (232) to move away from or closer to each other.

4. The automated feeding system for solar cells to a large carrier plate according to claim 3, characterized in that, The gripping device (2) further includes: A plurality of second auxiliary support devices (234) are provided for guiding and supporting the movement of the support member (232). The second auxiliary support device (234) includes a second guide rail (2341), two second moving blocks (2342) and a connecting plate (2343). The second guide rail (2341) is disposed on the connecting plate (2343), and the second moving blocks (2342) are slidably disposed on the second guide rail (2341).

5. The automated feeding system for solar cells to a large carrier plate according to claim 4, characterized in that, The gripping device (2) further includes: Several fixing devices (24) for fixing silicon wafers (5) onto a large carrier plate (3) are provided. The fixing devices (24) include metal pins (241) and serrated blocks (242). The serrated blocks (242) are disposed on the pins (241). The large carrier plate (3) is provided with pin holes that cooperate with the pins (241). A magnet is disposed in the pin holes. Several lifting devices (25) are used to drive the fixing device (24) to move closer to or away from the large carrier plate (3). The lifting device (25) includes a second driving device (251), a connecting member (252), a sleeve rod (253) and an electromagnet (254). The second driving device (251) is used to drive the connecting member (252) to move up and down. The sleeve rod (253) is disposed on the connecting member (252). The electromagnet (254) is disposed inside the sleeve rod (253). The upper end of the pin (241) is disposed inside the sleeve rod (253). The electromagnet (254) can attract the pin (241) after being energized.

6. A method for automating the feeding of solar cells to a large carrier plate, using the buffer system described in claim 1, characterized in that, Includes the following steps: S1. The large carrier plate (3) loaded with silicon wafers (5) is transported to the gripping position of the gripping device (2) by the conveying device; S2. Turn on the gripping device (2), grip the silicon wafer (5) in the large carrier board (3) placement slot through the gripping device (2), and transfer the gripped silicon wafer (5) to the placement slot on the buffer exchange storage transfer table (1); S3. The small carrier plate (4) loaded with silicon wafers (5) is conveyed to the gripping position of the gripping device (2) by the conveyor. S4. Activate the gripping device (2), grip the silicon wafer (5) in the placement slot of the small carrier plate (4) through the gripping device (2), and transfer the gripped silicon wafer (5) to the placement slot on the large carrier plate (3).

7. The automated feeding method for solar cells onto a large carrier plate according to claim 6, characterized in that, In step S4, the gripping device (2) can place and fix the gripped silicon wafer (5) in the placement slot on the carrier plate (3).

8. The automated feeding method for solar cells onto a large carrier plate according to claim 7, characterized in that, In step S4, the silicon wafer (5) can be clamped by the second clamping mechanism (23) on the gripping device (2) and placed in the placement slot on the large carrier plate (3). The lifting device (25) on the gripping device (2) can drive the fixing device (24) to approach the large carrier plate (3). The pin (241) on the fixing device (24) can be attracted by the magnet on the large carrier plate (3). The side of the serrated pressure block (242) set on the pin (241) can contact the silicon wafer (5) on the large carrier plate (3), thereby fixing the silicon wafer (5) on the large carrier plate (3).

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