A power module

Abstract

The present invention relates to the field of integrated circuit technology, and more particularly to a power module comprising an epoxy resin substrate, a power device, a passive device, and a packaging housing; the power device is mounted on the upper surface of the epoxy resin substrate, and the passive device is mounted on the lower surface of the epoxy resin substrate; the epoxy resin substrate, the power device, and the passive device are all encapsulated within the packaging housing; and the power device is located proximate to the upper surface of the packaging housing. The present invention has efficient heat dissipation performance and can effectively improve the stability and service life of the power module.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a power module. Background Art

[0002] The power device, or Modular Intelligent Power System (MIPS), integrates power switching devices and driver circuits. It also features built-in fault detection circuits for overvoltage, overcurrent, and overheating, sending detection signals to the CPU or DSP for interrupt processing. Furthermore, it incorporates high-speed, low-power die, optimized gate-level driver circuits, and fast protection circuits. This ensures that the MIPS itself remains intact even in the event of a load failure or improper use.

[0003] In the existing MIPS modular intelligent power system, low-voltage control circuits such as IC drive control circuit, MIPS sampling amplifier circuit and PFC current protection circuit and inverter circuit composed of high-voltage power devices are arranged on the same board. At the same time, the existing MIPS modular intelligent power system only integrates a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been realized. Faced with the market competition of miniaturization and low cost, higher requirements are placed on the high integration and high heat dissipation technology of MIPS modular intelligent power system. Summary of the Invention

[0004] The object of the present invention is to provide a power module with high-efficiency heat dissipation performance, which can effectively improve the stability and service life of the power module.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A power module includes an epoxy resin substrate, a power device, a passive device and a packaging shell;

[0007] The power device is mounted on the upper surface of the epoxy resin substrate, and the passive device is mounted on the lower surface of the epoxy resin substrate;

[0008] The epoxy resin substrate, power devices and passive devices are all packaged inside the packaging shell;

[0009] The power device is close to the upper surface of the packaging shell.

[0010] Preferably, it further comprises a copper foil layer, wherein the copper foil layer is provided between the lower surface of the epoxy resin substrate and the passive device, and the copper foil layer forms a circuit wiring;

[0011] The epoxy resin substrate is provided with a through hole, and conductive copper is arranged in the through hole;

[0012] The power device and the passive device are electrically connected through the circuit wiring and the through hole.

[0013] Preferably, the circuit wiring is formed by using an etching process on the copper foil layer.

[0014] Preferably, the power device is provided with a flip-chip solder joint, the flip-chip solder joint faces the epoxy resin substrate, and the power device is soldered to the through hole on the upper surface of the epoxy resin substrate using a flip-chip process.

[0015] Preferably, the device further comprises pins, wherein the pins are welded to the circuit wiring and are electrically connected to the power device and the passive device through the circuit wiring and the through-hole.

[0016] Preferably, the thickness of the epoxy resin substrate is 0.5 mm, the thickness of the copper foil layer is 0.035 mm, the aperture of the through hole is 0.2 mm, the maximum thickness of the power device is 0.2 mm, the maximum thickness of the passive device is 0.4 mm, the distance between the power device and the upper surface of the packaging shell is 1 mm, and the thickness of the packaging shell is 3.2 mm.

[0017] Compared with the prior art, the above technical solution has the following beneficial effects: the present invention distributes high-heat-generating power devices and passive devices on the upper and lower surfaces of the epoxy resin substrate, respectively, and the power devices are close to the upper surface of the packaging shell, isolating the heat conduction between the power devices and the passive devices. At the same time, the external heat sink is arranged on one side of the power device and facing away from the power device, so that the power device and the external heat sink are close to each other. As a result, the heat generated by the power device is only transferred to the heat sink through the packaging shell, and the heat propagation path is short, so that the heat generated by the power device can be effectively conducted and dissipated. Therefore, compared with conventional technologies, the present invention has efficient heat dissipation performance and can effectively improve the stability and service life of the power module. In addition, there is no need to have an aluminum substrate and heat sink inside the power module, which saves material costs and allows the power module to be made very thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the power module of the present invention;

[0019] Figure 2 It is a structural diagram of a power module in the prior art;

[0020] In the figure: epoxy resin substrate 1, power device 2 / 10, passive device 3, heat sink 4 / 50, package shell 5 / 40, through hole 6, copper foil layer 7, pin 8, heat sink 20, aluminum substrate 30. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0025] A power module includes an epoxy resin substrate 1, a power device 2, a passive device 3 and a packaging shell 5;

[0026] The power device 2 is mounted on the upper surface of the epoxy resin substrate 1, and the passive device 3 is mounted on the lower surface of the epoxy resin substrate 1;

[0027] The epoxy resin substrate 1, power device 2 and passive device 3 are all packaged inside the packaging shell 5;

[0028] The power device 2 is close to the upper surface of the packaging shell 5 .

[0029] like Figure 2 As shown, the heat generated by the power device 10 in the existing power module during operation needs to be dissipated through multiple layers of materials such as the heat sink 20, the aluminum substrate 30, the packaging shell 40 and the heat sink 50 in sequence, resulting in the heat generated by the power device 10 during operation being unable to be effectively conducted and dissipated. To this end, the present invention proposes a new power module, such as Figure 1 As shown, the present invention distributes the high-heat-generating power device 2 and the passive device 3 on the upper and lower surfaces of the epoxy resin substrate 1, respectively, and the power device 2 is close to the upper surface of the packaging shell 5, isolating the heat conduction between the power device 2 and the passive device 3. At the same time, the external heat sink 4 is arranged on one side of the power device 2 and facing away from the power device 2, so that the power device 2 and the external heat sink 4 are close to each other. As a result, the heat generated by the power device 2 is only transferred to the heat sink 4 through the packaging shell 5. The heat propagation path is short, so that the heat generated by the power device 2 can be effectively conducted and dissipated. Therefore, compared with conventional technologies, the present invention has efficient heat dissipation performance and can effectively improve the stability and service life of the power module. In addition, there is no need to have an aluminum substrate and heat sink inside the power module, which saves material costs and allows the power module to be made very thin.

[0030] Further explanation, it also includes a copper foil layer 7, which is provided between the lower surface of the epoxy resin substrate 1 and the passive device 3, and the copper foil layer 7 forms a circuit wiring;

[0031] The epoxy resin substrate 1 is provided with a through hole 6, and a conductive copper is provided in the through hole 6;

[0032] The power device 2 and the passive device 3 are electrically connected via the circuit wiring and the through-hole 6 .

[0033] To further explain, the circuit wiring is formed on the copper foil layer 7 by using an etching process.

[0034] To further explain, the power device 2 is provided with a flip-chip solder joint, which faces the epoxy resin substrate 1 , and the power device 2 is soldered to the through hole 6 on the upper surface of the epoxy resin substrate 1 using a flip-chip process.

[0035] The present invention adopts a flip-chip power device 2 to achieve electrical connection with the passive device 3 through circuit wiring and through-holes 6, thereby solving the problem that when the power device 2 and the passive device 3 need to be electrically connected through metal wires, wire punching is easily caused during the process of plastic-sealing the power module using the packaging shell 5, thereby causing the safety hazard of short circuit or open circuit of the power module. At the same time, the power module can be made very thin and easy to dissipate heat.

[0036] Further explanation, it also includes a pin 8, which is soldered to the circuit wiring and electrically connected to the power device 2 and the passive device 3 through the circuit wiring and the through hole 6. The pin 8 is electrically connected to the power device 2 and the passive device 3 by soldering with solder paste on the circuit wiring.

[0037] For further explanation, the epoxy resin substrate 1 has a thickness of 0.5 mm, the copper foil layer 7 has a thickness of 0.035 mm, the through-hole 6 has a diameter of 0.2 mm, the power device 2 has a maximum thickness of 0.2 mm, the passive device 3 has a maximum thickness of 0.4 mm, the distance between the power device 2 and the top surface of the package 5 is 1 mm, and the package 5 has a thickness of 3.2 mm. Testing has shown that the power module with this size has efficient heat dissipation, effectively improving operational stability and service life, while achieving miniaturization and low cost.

[0038] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific embodiments of the present invention without inventive effort, and such equivalent variations or substitutions are intended to be encompassed within the scope of the claims of this application.

Claims

1. A power module, characterized in that: Including epoxy resin substrate, power devices, passive devices and packaging shell; The power device is mounted on the upper surface of the epoxy resin substrate, and the passive device is mounted on the lower surface of the epoxy resin substrate; The epoxy resin substrate, power devices and passive devices are all packaged inside the packaging shell; The power device is close to the upper surface of the packaging shell; It also includes a copper foil layer, the copper foil layer is provided between the lower surface of the epoxy resin substrate and the passive device, and the copper foil layer is formed with circuit wiring; The epoxy resin substrate is provided with a through hole, and conductive copper is arranged in the through hole; The power device and the passive device are electrically connected via the circuit wiring and the through hole; The circuit wiring is formed by using an etching process on the copper foil layer; The power device is provided with a flip-chip solder joint, the flip-chip solder joint faces the epoxy resin substrate, and the power device is soldered to the through hole on the upper surface of the epoxy resin substrate using a flip-chip process; Also included are pins, the pins being soldered to the circuit wiring and being electrically connected to the power device and the passive device through the circuit wiring and the through-hole; An external heat sink is arranged on one side of the power device and faces away from the power device.

2. A power module according to claim 1, characterized in that: The thickness of the epoxy resin substrate is 0.5 mm, the thickness of the copper foil layer is 0.035 mm, the aperture of the through hole is 0.2 mm, the maximum thickness of the power device is 0.2 mm, the maximum thickness of the passive device is 0.4 mm, the distance between the power device and the upper surface of the packaging shell is 1 mm, and the thickness of the packaging shell is 3.2 mm.

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