Display substrate, display panel and manufacturing method

Abstract

The application provides a display substrate, a display panel and a preparation method. The display substrate comprises a first film layer, a second film layer, an electrode body and a soft conductive layer. The second film layer is arranged above the first film layer. The second film layer has a through hole, and the through hole forms an opening on the side of the second film layer away from the first film layer. The electrode body is arranged in the through hole. The soft conductive layer is connected with the electrode body, and the soft conductive layer protrudes from the side of the second film layer away from the first film layer. The display substrate can be stably connected with an LED device, and the yield is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display substrate, a display panel, and a method for manufacturing them. Background Technology

[0002] Currently, LED (Light Emitting Diode) devices are receiving widespread attention due to their high brightness, good luminous efficiency, low power consumption, and long lifespan.

[0003] LED devices mainly consist of a light-emitting element and solder pads connected to it. When an LED device is mounted on a display substrate, the electrodes on the display substrate need to be connected to the corresponding solder pads of the LED device. The display substrate provides the LED device with operating voltage and common voltage through electrodes to drive the light-emitting element of the LED device to emit light.

[0004] However, when LED devices are connected to the display substrate, the inconsistent lengths of the electrodes on the display substrate may cause unstable connections between the LED devices and the display substrate, resulting in display abnormalities. Summary of the Invention

[0005] This application provides a display substrate, a display panel, and a manufacturing method, wherein the display substrate can achieve a stable connection with LED devices, thereby improving the yield rate.

[0006] This application provides a display substrate, including:

[0007] First membrane layer;

[0008] A second membrane layer is disposed above the first membrane layer. The second membrane layer has a through hole, and the through hole forms an opening on the side of the second membrane layer away from the first membrane layer.

[0009] An electrode body is disposed in the through hole;

[0010] A flexible conductive layer is connected to the electrode body, and the flexible conductive layer protrudes from the side of the second film layer away from the first film layer.

[0011] In some embodiments, the flexible conductive layer extends to the side of the second film layer away from the first film layer.

[0012] In some embodiments, the flexible conductive layer protrudes from the side of the second film layer away from the first film layer by a distance of 0.5 mm to 4 mm.

[0013] In some embodiments, the cross-sectional area of ​​the via gradually increases from the array substrate to the second film layer.

[0014] This application embodiment also provides a display panel, including:

[0015] The aforementioned display substrate;

[0016] An LED device is disposed on the flexible conductive layer, and the LED device abuts against the flexible conductive layer.

[0017] In some embodiments, the display panel further includes solder paste disposed between the LED device and the display substrate.

[0018] This application also provides a method for preparing a display substrate, comprising:

[0019] Provide the first membrane layer;

[0020] A second film layer is formed on the first film layer, the second film layer having a plurality of through holes, the through holes forming openings on the side of the second film layer away from the first film layer;

[0021] An electrode body is formed in the through hole; and

[0022] A soft conductive layer is formed on the electrode body such that the soft conductive layer is connected to the electrode body and protrudes from the side of the second film layer away from the first film layer.

[0023] In some embodiments, forming an electrode body in the through-hole and forming a soft conductive layer on the electrode body includes:

[0024] A metal layer is formed on the side of the second film layer away from the first film layer;

[0025] A soft conductor is formed on the metal layer;

[0026] A patterned mask layer is formed on the side of the flexible conductor away from the first film layer;

[0027] The metal layer and the soft conductor are etched using the patterned mask layer as a mask to obtain the electrode body and the soft conductor layer.

[0028] In some embodiments, after forming a soft conductive layer on the electrode body, the method further includes:

[0029] The soft conductive layer is extended to the side of the second film layer away from the first film layer.

[0030] This application also provides a method for manufacturing a display panel, comprising:

[0031] The aforementioned display substrate;

[0032] An LED device is disposed on the flexible conductive layer such that the flexible conductive layer abuts against the LED device.

[0033] The display substrate provided in this application includes a first film layer, a second film layer disposed on the first film layer, an electrode body, and a flexible conductive layer. The second film layer has through-holes, the electrode body is disposed in the through-holes, and the flexible conductive layer is connected to the electrode body. The flexible conductive layer protrudes from the side of the second film layer away from the first film layer. Because the flexible conductive layer can change shape under force, when an LED device is mounted on the flexible conductive layer, the weight of the LED device or an external force compresses the flexible conductive layer, ensuring full contact between the LED device and the flexible conductive layer. This eliminates fitting problems caused by processing errors or assembly errors. Even if the electrode body is uneven, it will not affect the contact area during docking. Therefore, the display substrate can achieve a stable connection with the LED device, improving the yield rate. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this application.

[0036] Figure 2 This is a schematic diagram of a first structure of a display substrate and an LED device provided in an embodiment of this application.

[0037] Figure 3 This is a schematic diagram of a second structure of the display substrate and LED device provided in an embodiment of this application.

[0038] Figure 4 This is a schematic diagram of a third structure of a display substrate and LED device provided in an embodiment of this application.

[0039] Figure 5 This is a schematic diagram of a fourth structure of a display substrate and LED device provided in an embodiment of this application.

[0040] Figure 6 This is a fifth structural schematic diagram of the display substrate and LED device provided in the embodiments of this application.

[0041] Figure 7 This is a sixth structural schematic diagram of the display substrate and LED device provided in the embodiments of this application.

[0042] Figure 8 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application.

[0043] Figure 9 A schematic diagram of the process for fabricating a display substrate provided for the implementation of this application.

[0044] Figure 10 A schematic diagram of the process flow of the display substrate provided for the implementation of this application.

[0045] Figure 11 A schematic diagram of the manufacturing process of the display panel provided for the implementation of this application.

[0046] Figure 12 A schematic diagram of the manufacturing process of the display panel provided for the implementation of this application. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0048] Currently, LED (Light Emitting Diode) devices are receiving widespread attention due to their high brightness, good luminous efficiency, low power consumption, and long lifespan.

[0049] LED devices mainly consist of a light-emitting element and pads connected to it. When an LED device is mounted on a display substrate, the electrodes on the display substrate need to be connected to the corresponding pads of the LED device. The display substrate provides the LED device with operating voltage and a common voltage through the electrodes to drive the light-emitting element to emit light. Micro LED (Micro Light Emitting Diode) devices possess self-emissive display characteristics and offer advantages such as being all-solid-state, having a long lifespan, high brightness, low power consumption, small size, ultra-high resolution, and the ability to operate in extreme environments such as high temperatures or radiation. Furthermore, Micro LED devices are not only highly efficient and have a long lifespan, but are also less susceptible to environmental influences, resulting in stable lighting performance and avoiding image retention. They are widely used in display screens, backlights, and lighting applications, and are hailed as the next-generation display technology.

[0050] However, when LED devices are connected to the display substrate, the inconsistent lengths of the electrodes on the display substrate may cause unstable connections between the LED devices and the display substrate, resulting in display abnormalities.

[0051] This application provides a display substrate, a display panel, and a manufacturing method, wherein the display substrate can achieve a stable connection with LED devices, improving the yield rate. The following is a detailed description with reference to the accompanying drawings.

[0052] like Figure 1 , Figure 1 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this application.

[0053] This application provides a display substrate 10, which includes a first film layer 11, a second film layer 12, an electrode body 13, and a flexible conductive layer 14. The second film layer 12 is disposed above the first film layer 11 and has a through hole 121. The through hole 121 forms an opening on the side 122 of the second film layer 12 away from the first film layer 11. The electrode body 13 is disposed in the through hole 121. The flexible conductive layer 14 is connected to the electrode body 13 and protrudes from the side 122 of the second film layer 12 away from the first film layer 11.

[0054] The display substrate 10 not only serves as a support for the LED device 20, but also provides the LED device 20 with a working voltage (VDD) and a common voltage (VSS) through electrodes to drive the LED device 20 to emit light.

[0055] Please refer to Figure 2 , Figure 2 This is a schematic diagram of a first structure of a display substrate and an LED device provided in an embodiment of this application. The first film layer 11 may include a substrate 111 and a thin-film transistor 112 layer disposed on the substrate 111. The substrate 111 may be composed of glass, functional glass, or a flexible material. The functional glass is obtained by sputtering a transparent metal oxide conductive thin film onto ultra-thin glass and then subjecting it to high-temperature annealing. The flexible substrate may be an organic polymer or an organic-inorganic doped composite. For example, the organic polymer may be polyimide (PI) or polyethylene terephthalate (PET). The inorganic-organic doped composite may be polyimide, an organic polymer, doped with glass fibers. Because glass fibers have high toughness, they can significantly improve the flexibility of the flexible substrate, making it less prone to breakage and peeling when bent, thus effectively improving the service life of the flexible substrate.

[0056] In related technologies, the electrode body 13 is fabricated using an additive method, which is a selective metal deposition method. However, for high-precision electronic devices such as the display substrate 10, the additive method uses photoresist to create barrier walls for patterning. However, the uneven shape and density distribution of the barrier walls lead to inconsistent thicknesses of the deposited metal. Therefore, the length of the electrode body 13 fabricated using this method may be less than or greater than the depth of the via 121. When the length of the electrode body 13 is less than the depth of the via 121, it cannot be connected to the LED device 20; when the length of the electrode body 13 is greater than the depth of the via 121, it may push up one side of the LED device 20, causing the LED device 20 to deviate from its correct position. When electrode bodies 13 need to be fabricated simultaneously in multiple vias 121, there may be variations in the length of each electrode body 13.

[0057] Please refer to the embodiments in this application. Figure 1 as well as Figure 2 The electrode body 13 is disposed in the through hole 121, and there is a predetermined distance between the end of the electrode body 13 away from the first film layer 11 and the side 122 of the second film layer 12 away from the first film layer 11. The flexible conductive layer 14 can first fill the through hole 121, so that the flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11. Since the flexible conductive layer 14 is plastic, its shape will change when subjected to external force. When the LED device 20 is mounted on the display substrate 10, the weight of the LED device 20 compresses the flexible conductive layer 14. During the compression process, the contact area between the LED device 20 and the flexible conductive layer 14 increases, making the contact between the LED device 20 and the flexible conductive layer 14 more stable. In addition, a force can be applied to the LED device 20 to increase the contact area between the LED device 20 and the soft conductive layer 14. At the same time, the direction of the force applied to the LED device 20 can be adjusted to prevent the LED device 20 from deviating from the correct position.

[0058] The display substrate 10 provided in this embodiment includes a first film layer 11, a second film layer 12 disposed on the first film layer 11, an electrode body 13, and a flexible conductive layer 14. The second film layer 12 has a through-hole 121, the electrode body 13 is disposed in the through-hole 121, and the flexible conductive layer 14 is connected to the electrode body 13. The flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11. Because the flexible conductive layer 14 can change shape under force, when an LED device 20 is mounted on the flexible conductive layer 14, the weight of the LED device 20 can compress or exert a force on the flexible conductive layer 14, thus fixing the LED device 20 to the flexible conductive layer 14. The flexible conductive layer 14 is conductive, so when the LED device 20 is in full contact with the flexible conductive layer 14, the fitting problems caused by processing errors and assembly errors are eliminated. Even if the electrode body 13 is not flat, it will not affect the contact area during docking. Thus, the display substrate 10 can achieve a stable connection with the LED device 20 and improve the yield.

[0059] In some embodiments, please refer to Figure 3 , Figure 3 This is a schematic diagram of a second structure of a display substrate and an LED device provided in an embodiment of this application. The second film layer 12 may include a first passivation layer 124 and a planarization layer 123. Optionally, the first film layer 11 may also include a thin-film transistor 112 layer. The first film layer 11, the first passivation layer 124, and the planarization layer 123 are stacked, and the LED device 20 is disposed on the planarization layer 123. A through-hole 121 is provided in the second film layer 12, and the through-hole 121 forms an opening on the side of the planarization layer 123 away from the first film layer 11.

[0060] In one case, please refer to Figure 4 , Figure 4 This is a schematic diagram of a third structure of a display substrate and an LED device provided in an embodiment of this application. The display substrate 10 further includes a common electrode layer 15, which can be disposed between the first passivation layer 124 and the thin-film transistor 112 layer. The thin-film transistor 112 layer includes a gate layer, a source layer, and a drain layer. The LED device 20 layer has a positive electrode and a negative electrode. The positive electrode needs to be connected to the drain in the thin-film transistor 112 layer, and the negative electrode needs to be connected to the common electrode layer 15. Therefore, in this case, at least two types of vias 121 need to be provided in the second film layer 12, referred to as the first via 1211 and the second via 1212. The positive electrode of the LED device 20 disposed on the second film layer 12 can be connected to the drain through the first via 1211, and the negative electrode of the LED device 20 can be connected to the common electrode layer 15 through the second via 1212.

[0061] The electrode body 13 is disposed in the through hole 121, and the electrode body 13 is made of a material with good electrical conductivity, such as metal, carbon, or graphene. As mentioned above, the electrode body 13 is disposed in the first through hole 1211, and the electrode body 13 can be connected to the drain and the positive electrode; or, the electrode body 13 is disposed in the second through hole 1212, and the electrode body 13 can be connected to the common electrode and the negative electrode.

[0062] In another case, please refer to Figure 5 , Figure 5 This is a schematic diagram of a fourth structure for a display substrate and LED device provided in an embodiment of this application. The common electrode layer 15 can also be disposed above the second film layer 12, away from the array substrate. In this case, only one through-hole 121, referred to as the third through-hole 1213, needs to be provided in the second film layer 12. The positive electrode of the LED device 20 disposed on the second film layer 12 can be connected to the drain electrode through the third through-hole 1213, and the negative electrode of the LED device 20 is directly connected to the common electrode layer 15. It is understood that reducing the number of openings in the second film layer 12 reduces the process difficulty and improves the yield.

[0063] It is worth noting that, as described above, metal is deposited in the first via 1211 to form the first electrode 131, and metal is deposited in the second via 1212 to form the second electrode 132. During the metal deposition process, the distance between the first electrode 131 and the side 122 of the second film layer 12 away from the first film layer 11 may differ from the distance between the second electrode 132 and the side 122 of the second film layer 12 away from the first film layer 11. For example, the depth or diameter of the first via 1211 and the second via 1212 may be different, resulting in poor contact between the LED device 20 and the first electrode 131 or the second electrode 132. For example, if the distance between the first electrode 131 and the side 122 of the second film layer 12 away from the first film layer 11 is 0 mm, and the distance between the second electrode 132 and the side 122 of the second film layer 12 away from the first film layer 11 is 4 mm, when the LED device 20 is disposed on the side 122 of the second film layer 12 away from the first film layer 11, it may be possible for the LED device 20 to be able to contact the first electrode 131, but to have poor contact with the second electrode 132.

[0064] For more information on this phenomenon, please refer to [link / reference needed]. Figure 2This application allows for the connection of a flexible conductive layer 14 (denoted as first flexible conductive layer 141 and second flexible conductive layer 142) to the first electrode 131 and the second electrode 132, respectively. Both the first flexible conductive layer 141 and the second flexible conductive layer 142 protrude from the side 122 of the second film layer 12 away from the first film layer 11. When the LED device 20 is disposed above the first flexible conductive layer 141 and the second flexible conductive layer 142, it can be connected to the first flexible conductive layer 141 and the second flexible conductive layer 142, thereby further connecting to the first electrode 131 and the second electrode 132.

[0065] The display substrate 10 provided in this embodiment includes a first film layer 11, a second film layer 12 disposed on the first film layer 11, an electrode body 13, and a flexible conductive layer 14. The second film layer 12 has a through-hole 121, the electrode body 13 is disposed in the through-hole 121, and the flexible conductive layer 14 is connected to the electrode body 13. The flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11. Since the flexible conductive layer 14 can change shape under force, when an LED device 20 is mounted on the flexible conductive layer 14, the weight of the LED device 20 or an external force compresses the flexible conductive layer 14, ensuring sufficient contact between the LED device 20 and the flexible conductive layer 14. This eliminates fitting problems caused by processing errors or assembly errors. Even if the electrode body 13 is uneven, it will not affect the contact area during docking. Therefore, the display substrate 10 can achieve a stable connection with the LED device 20, improving the yield rate.

[0066] In some embodiments, please continue reading Figure 2 The soft conductive layer 14 is a flexible structure. Optionally, the soft conductive layer 14 is a non-metallic conductive material, capable of withstanding a current greater than 25A and a deformation greater than 10%. The non-metallic conductive material has the characteristics of good conductivity, low resistance, high current carrying capacity, good wear resistance, softness, and high elasticity. For example, the material of the soft conductive layer 14 is indium tin oxide (ITO) or graphene. Optionally, the soft conductive layer 14 is copper-plated silver conductive rubber, aluminum-plated zinc conductive rubber, glass-plated silver conductive rubber, or graphite-plated nickel conductive rubber.

[0067] In some embodiments, please continue reading Figure 3The display substrate 10 further includes a second passivation layer 16, which is disposed between the first passivation layer 124 and the thin-film transistor 112 layer. When the common electrode layer 15 is disposed between the first passivation layer 124 and the thin-film transistor 112, and the second film layer 12 has a first through-hole 121 and a second through-hole 121, the display substrate 10 further includes a first pin 17 and a second pin 18. The first pin 17 is connected to the drain, and the second pin 18 is connected to the common electrode layer 15. The first pin 17 and the second pin 18 are isolated from each other, and the first pin 17 and the second pin 18 are disposed between the first passivation layer 124 and the second passivation layer 16. The positive electrode of the LED device 20 disposed on the second film layer 12 can be connected to the first pin 17 through the first through hole 1211, and the negative electrode of the LED device 20 can be connected to the second pin 18 through the second through hole 1212. This allows the positive electrode of the LED device 20 disposed on the second film layer 12 to be connected to the drain electrode through the first through hole 1211, and the negative electrode of the LED device 20 to be connected to the common electrode layer 15 through the second through hole 1212. (See also...) Figure 6 , Figure 6 This is a fifth structural diagram of a display substrate and LED device provided in an embodiment of this application. When the common electrode layer 15 is disposed above the second film layer 12 away from the array substrate, and the second film layer 12 has a third through-hole 1213, the display substrate 10 further includes a third pin 19, which is connected to the drain. The third pin 19 is disposed between the first passivation layer 124 and the second passivation layer 16. The positive electrode of the LED device 20 disposed on the second film layer 12 can be connected to the third pin 19 through the third through-hole 1213, so that the positive electrode of the LED device 20 disposed on the second film layer 12 can be connected to the drain through the third through-hole 1213.

[0068] In some embodiments, please refer to Figure 7 , Figure 7 This is a sixth structural schematic diagram of a display substrate and LED device provided in an embodiment of this application. The flexible conductive layer 14 extends to the side 122 of the second film layer 12 away from the first film layer 11. For example, the flexible conductive layer 14 extends around the perimeter of the opening. The flexible conductive layer 14 extends 2 mm to 5 mm, for example, 3 mm, outward from the opening. It can be understood that after the flexible conductive layer 14 extends outward, when the LED device 20 is mated with the flexible conductive layer 14, the contact area between the LED device 20 and the flexible conductive layer 14 is larger, which is beneficial to the stable connection between the flexible conductive layer 14 and the LED device 20.

[0069] In some embodiments, the flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11 by a distance of 0.5 mm to 4 mm, for example, 2 mm. When the flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11 by a distance of 2 mm, on the one hand, it will not lead to an increase in the amount of flexible conductive layer 14 used, resulting in waste of raw materials; on the other hand, the flexible conductive layer 14 can be stably connected to the LED device 20.

[0070] In some embodiments, the cross-sectional area of ​​the via 121 gradually increases from the array substrate to the second film layer 12. For example, the via 121 can be horn-shaped, frustum-shaped, or pyramidal-shaped. For example, the via 121 can be a circular hole or a square hole; the shape of the via 121 is not limited in this embodiment. It is understood that when depositing metal into the via 121, the cross-sectional area of ​​the via 121 closer to the bottom is smaller, making it easier to deposit metal, less prone to dead zones, and also beneficial to improving the deposition rate.

[0071] Please see Figure 8 , Figure 8 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application.

[0072] This application embodiment also provides a display panel 100, which includes the above-mentioned display substrate 10 and LED device 20. The LED device 20 is disposed on the flexible conductive layer 14 and abuts against the flexible conductive layer 14.

[0073] When the LED device 20 is mounted on the flexible conductive layer 14, in some cases, the LED device 20 has a certain mass, causing its gravity to press against the flexible conductive layer 14, thus achieving contact between the LED device 20 and the flexible conductive layer 14. In other cases, a force can be applied to the LED device 20 to increase the contact area between the LED device 20 and the flexible conductive layer 14, making the connection between the LED device 20 and the flexible conductive layer 14 more secure. The flexible conductive layer 14 is conductive, so when the LED device 20 and the flexible conductive layer 14 are in full contact, fitting problems caused by processing errors and assembly errors are eliminated. Even if the electrode body 13 is not flat, it will not affect the contact area during connection, thereby enabling the display substrate 10 to achieve a stable connection with the LED device 20 and improving the yield rate.

[0074] In some embodiments, the display panel 100 further includes solder paste disposed between the LED device 20 and the display substrate 10. After the display substrate 10 is fabricated, surface mount technology (SMT) is typically used to connect the LED device 20 to the display substrate 10 via bonding traces, thereby enabling the LED device 20 to emit light. Specific steps include: placing a screen printing plate on the display substrate 10; applying solder paste to the locations on the display substrate 10 corresponding to the bonding traces of the LED device 20 using the screen printing plate; and finally fixing the light-emitting unit to the bonding traces of the light-emitting unit on the substrate using solder paste.

[0075] This application embodiment also provides a display device, which includes the above-mentioned display panel 100 and a motherboard connected to the display panel 100. The motherboard is capable of transmitting electrical signals to the display panel 100 to control the display panel 100.

[0076] The display device can be any device or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0077] Please see Figure 9 as well as Figure 10 , Figure 9 A schematic diagram of the process for fabricating a display substrate provided for the implementation of this application. Figure 10 A schematic diagram of the process flow of the display substrate provided for the implementation of this application.

[0078] This application embodiment also provides a method for preparing a display substrate 10, including:

[0079] Step 101: Provide the first film layer 11.

[0080] The first film layer 11 can be glass, functional glass, or a flexible substrate. Functional glass is obtained by sputtering a transparent metal oxide conductive thin film onto ultrathin glass and then subjecting it to high-temperature annealing. The flexible substrate can be an organic polymer or an organic-inorganic doped composite. For example, the organic polymer can be polyimide (PI) or polyethylene terephthalate (PET). The inorganic-organic doped composite can be polyimide doped with glass fibers. Because glass fibers have high toughness, they can significantly improve the flexibility of the flexible substrate, making it less prone to breakage and peeling when bent, thus effectively increasing the service life of the flexible substrate. The main preparation method for this flexible substrate typically involves forming the flexible substrate on a carrier substrate (e.g., a high-temperature resistant glass substrate). The side of the flexible substrate adjacent to the carrier substrate is generally called the bottom surface, and the opposite side is generally called the top surface. Electronic devices (e.g., thin-film transistors 112, resistors, capacitors, etc.) and other steps are then formed on the top surface of the flexible substrate. Finally, the flexible panel is peeled off from the carrier substrate.

[0081] Step 102: A second film layer 12 is formed on the first film layer 11. The second film layer 12 has a plurality of through holes 121, and the through holes 121 form an opening on the side 122 of the second film layer 12 away from the first film layer 11.

[0082] A second film layer 12 with multiple through holes 121 can be formed on the first film layer 11 by means of vapor deposition, etching or photolithography.

[0083] The second film layer 12 may include a first passivation layer 124 and a planarization layer 123. Optionally, the display substrate 10 may also include a thin-film transistor 112 layer, wherein the first film layer 11, the thin-film transistor 112 layer, the first passivation layer 124, and the planarization layer 123 are stacked, and the LED device 20 is disposed on the planarization layer 123. A through-hole 121 is provided in the second film layer 12, and the through-hole 121 forms an opening on the side of the planarization layer 123 away from the first film layer 11.

[0084] Step 103: Form an electrode body 13 in the through hole 121.

[0085] In this process, metal is deposited in the through-hole 121 to form the electrode body 13.

[0086] Step 104: Form a soft conductive layer 14 on the electrode body 13 such that the soft conductive layer 14 is connected to the electrode body 13 and protrudes from the side 122 of the second film layer 12 away from the first film layer 11.

[0087] Optionally, a soft electrode body 13 can be formed on the electrode body 13 by processes such as coating or deposition. When there is a preset distance between the end of the electrode body 13 away from the first film layer 11 and the side 122 of the second film layer 12 away from the first film layer 11, the soft conductive layer 14 can first fill the through hole 121, so that the soft conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11.

[0088] In some embodiments, the steps of forming an electrode body 13 in the through-hole 121 and forming a soft conductive layer 14 on the electrode body 13 specifically involve: forming a metal layer on the side 122 of the second film layer 12 away from the first film layer 11; forming a soft conductor on the metal layer; forming a patterned mask layer on the side 122 of the soft conductor away from the first film layer 11; and etching the metal layer and the soft conductor using the patterned mask layer as a mask to obtain the electrode body 13 and the soft conductive layer 14.

[0089] It is understandable that the same mask layer can be used for the electrode body 13 and the soft conductive layer 14. This mask layer has blank areas except for those corresponding to the via 121. The electrode body 13 and the soft conductive layer corresponding to the blank areas are etched to obtain the electrode body 13 and the soft conductive layer 14 at the same time. This achieves the sharing of the mask layer, which can save processes and further reduce production costs.

[0090] In some embodiments, after forming the soft conductive layer 14 on the electrode body 13, the method further includes extending the soft conductive layer 14 to the side 122 of the second film layer 12 away from the first film layer 11.

[0091] It is understood that a flexible electrode body 13 is formed on the electrode body 13 through processes such as coating and deposition, and the flexible electrode body 13 protrudes from the side 122 of the second film layer 12 away from the first film layer 11. Then, the flexible conductor is extended around the opening, for example, around the perimeter of the opening. The flexible conductor layer 14 extends 2 mm to 5 mm, for example, 3 mm, outward from the opening. It is understood that after the flexible conductor layer 14 extends outward, when the LED device 20 is mated with the flexible conductor layer 14, the contact area between the LED device 20 and the flexible conductor layer 14 is larger, which is beneficial to the stable connection between the flexible conductor layer 14 and the LED device 20.

[0092] Please see Figure 11 as well as Figure 12 , Figure 11 A schematic diagram of the manufacturing process of the display panel provided for the implementation of this application. Figure 12 A schematic diagram of the manufacturing process of the display panel provided for the implementation of this application.

[0093] This application also provides a method for manufacturing a display panel 100, including:

[0094] Step 201: Provide the above-mentioned display substrate 10;

[0095] Step 202: An LED device 20 is disposed on the flexible conductive layer 14 such that the flexible conductive layer 14 abuts against the LED device 20.

[0096] When the LED device 20 is mounted on the flexible conductive layer 14, in some cases, the LED device 20 has a certain mass, causing its gravity to compress the flexible conductive layer 14, thereby achieving a connection between the LED device 20 and the flexible conductive layer 14. In other cases, the user or assembler can apply a force to the LED device 20 to increase the contact area between the LED device 20 and the flexible conductive layer 14, making the connection between the LED device 20 and the flexible conductive layer 14 more secure. The flexible conductive layer 14 is conductive, so when the LED device 20 is in full contact with the flexible conductive layer 14, fitting problems caused by processing errors and assembly errors are eliminated. Even if the electrode body 13 is uneven, it will not affect the contact area during connection, thereby enabling the display substrate 10 to achieve a stable connection with the LED device 20 and improving the yield rate.

[0097] The display substrate 10 provided in this embodiment includes a first film layer 11, a second film layer 12 disposed on the first film layer 11, an electrode body 13, and a flexible conductive layer 14. The second film layer 12 has a through-hole 121, the electrode body 13 is disposed in the through-hole 121, and the flexible conductive layer 14 is connected to the electrode body 13. The flexible conductive layer 14 protrudes from the side 122 of the second film layer 12 away from the first film layer 11. Because the flexible conductive layer 14 can change shape under force, when an LED device 20 is mounted on the flexible conductive layer 14, the weight of the LED device 20 can compress or exert a force on the flexible conductive layer 14, thus fixing the LED device 20 to the flexible conductive layer 14. The flexible conductive layer 14 is conductive, so when the LED device 20 is in full contact with the flexible conductive layer 14, the fitting problems caused by processing errors and assembly errors are eliminated. Even if the electrode body 13 is not flat, it will not affect the contact area during docking. Thus, the display substrate 10 can achieve a stable connection with the LED device 20 and improve the yield.

[0098] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0099] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0100] The display substrate, display panel, and manufacturing method provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application, and the descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display substrate, characterized by, The display substrate comprises: a first film layer; a second film layer disposed above the first film layer, the second film layer having a through hole, the through hole forming an opening on a side of the second film layer away from the first film layer; an electrode body disposed in the through hole, the electrode body having a preset distance between an end of the electrode body away from the first film layer and the side of the second film layer away from the first film layer; a soft conductive layer, at least part of the soft conductive layer being disposed in the through hole, the soft conductive layer being connected with the electrode body, and the soft conductive layer protruding from the side of the second film layer away from the first film layer. 2.The display substrate of claim 1, wherein, The soft conductive layer extends to the side of the second film layer away from the first film layer.

3. The display substrate of claim 1, wherein, The distance by which the soft conductive layer protrudes from the side of the second film layer away from the first film layer is 0.5-4 mm.

4. The display substrate of claim 1, wherein, The cross-sectional area of the through hole gradually increases from the array substrate to the second film layer.

5. The display substrate of claim 1, wherein, The display substrate is used for mounting an LED device, and further comprises a common electrode layer disposed above the second film layer away from the first film layer. The LED device has an anode and a cathode, the soft conductive layer is used for being connected with the anode of the corresponding LED device, and the common electrode layer is used for being connected with the cathode of the corresponding LED device.

6. A display panel, characterized by, The display substrate comprises: The display substrate according to any one of claims 1-5; An LED device disposed on the soft conductive layer, the LED device being in abutment with the soft conductive layer.

7. The display panel of claim 6, wherein, Further comprising a tin paste disposed between the LED device and the display substrate.

8. A method for preparing a display substrate, characterized in that, The display substrate comprises: providing a first film layer; forming a second film layer on the first film layer, the second film layer having a plurality of through holes, the through holes forming openings on a side of the second film layer away from the first film layer; forming an electrode body in the through hole, the electrode body having a preset distance between an end of the electrode body away from the first film layer and the side of the second film layer away from the first film layer; and forming a soft conductive layer on the electrode body, at least part of the soft conductive layer being disposed in the through hole, so that the soft conductive layer is connected with the electrode body and protrudes from the side of the second film layer away from the first film layer.

9. The method of manufacturing the display substrate according to claim 8, wherein The forming of the electrode body in the through hole and the forming of the soft conductive layer on the electrode body comprise: forming a metal layer on the side of the second film layer away from the first film layer; forming a soft conductive body on the metal layer; forming a patterned mask layer on a side of the soft conductive body away from the first film layer; etching the metal layer and the soft conductive body with the patterned mask layer as a mask to obtain the electrode body and the soft conductive layer.

10. The method of manufacturing a display substrate according to claim 8, wherein After the forming of the soft conductive layer on the electrode body, the display substrate further comprises: extending the soft conductive layer to the side of the second film layer away from the first film layer.

11. A method for manufacturing a display panel, characterized by, The display substrate comprises: providing the display substrate according to any one of claims 1-5; disposing an LED device on the soft conductive layer, so that the soft conductive layer is in abutment with the LED device.

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