Display panel and manufacturing method thereof

Abstract

The present application provides a display panel and a manufacturing method thereof, which relates to the field of display technology, and aims to solve the technical problem that the encapsulation layer is easily damaged in the process of tearing off the protective film, thereby causing encapsulation failure. The display panel includes an array substrate and a light-emitting layer and an encapsulation layer stacked on the array substrate; the encapsulation layer is provided with a protective film covering it, and an adhesive layer is provided between the protective film and the encapsulation layer; the bonding area between the adhesive layer and the encapsulation layer is smaller than the projected area of ​​the encapsulation layer on the array substrate. The display panel provided by the present application has an adhesive layer that is bonded to part of the encapsulation layer, which reduces the bonding area between the adhesive layer and the encapsulation layer, reduces the bonding force between the adhesive layer and the encapsulation layer, makes the adhesive layer easier to detach from the encapsulation layer, can reduce or avoid the phenomenon of surface damage of the encapsulation layer, and improves the encapsulation effect.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] The display device includes an array substrate, a light-emitting layer formed on the array substrate, etc.; the manufacturing process is as follows: after the light-emitting layer is formed on the array substrate, the light-emitting layer needs to be encapsulated to form an encapsulation layer on the surface of the light-emitting layer to prevent water vapor from corroding the light-emitting device, so as to increase the service life of the light-emitting layer.

[0003] In order to prevent foreign particles from contaminating the encapsulation layer, a protective film needs to be attached to the outer surface of the encapsulation layer. In the subsequent manufacturing process of the display device (for example, the process of attaching a polarizer on the surface of the encapsulation layer), the protective film is torn off. However, the encapsulation layer is easily damaged in the process of tearing off the protective film, thus causing encapsulation failure. Summary of the invention

[0004] In view of the above problems, the embodiments of the present application provide a display panel and a method for manufacturing the same, so as to reduce or even avoid the phenomenon of damaging the encapsulation layer during the process of tearing off the protective film, thereby improving the encapsulation effect.

[0005] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0006] A first aspect of an embodiment of the present application provides a display panel, which includes an array substrate and a light-emitting layer and a packaging layer stacked on the array substrate; the packaging layer is provided with a protective film covering it, and an adhesive layer is provided between the protective film and the packaging layer; the bonding area between the adhesive layer and the packaging layer is smaller than the projection area of ​​the packaging layer on the array substrate.

[0007] In a possible implementation, the encapsulation layer includes a first area and a second area, the first area is located outside the second area and is used to bond with the array substrate located outside the light-emitting layer, and the second area covers the light-emitting layer; the adhesive layer includes at least one circle of a first colloid arranged in the first area; preferably, the bonding force between the protective film and the adhesive layer is greater than the bonding force between the adhesive layer and the encapsulation layer.

[0008] In a possible implementation, the adhesive layer includes multiple circles of the first colloid; the multiple circles of the first colloid are arranged in a U-shape on the packaging layer, part of the first colloid is arranged in the first area, and part of the first colloid is arranged in the second area.

[0009] In a possible implementation manner, the first colloid includes a plurality of discontinuous colloid segments, and the plurality of discontinuous colloid segments are arranged along a circumference of the packaging layer.

[0010] In a possible implementation manner, the first colloid is provided with gaps to form the plurality of discontinuous colloid segments; and the gaps of the first colloid in two adjacent circles are arranged alternately.

[0011] In a possible implementation manner, the first area is a rectangular area, and the first colloid disposed in the first area includes colloid segments disposed at each corner of the first area; and a plurality of the colloid segments are arranged in a dotted manner in the first area.

[0012] In a possible implementation, the array substrate is provided with a recess; the recess is located within the projection of the adhesive layer on the array substrate; a portion of the packaging layer opposite to the recess is adhered to the recess and is not bonded to the adhesive layer.

[0013] In a possible implementation manner, the recess is arranged in a ring shape on the array substrate outside the light-emitting layer.

[0014] A second aspect of an embodiment of the present application provides a method for manufacturing a display panel, comprising the following steps:

[0015] forming a light emitting layer on the array substrate;

[0016] forming an encapsulation layer on the light-emitting layer;

[0017] forming an adhesive layer on the light-emitting layer, wherein the bonding area between the adhesive layer and the encapsulation layer is smaller than the projection area of ​​the encapsulation layer on the array substrate;

[0018] A protective film is formed on the adhesive layer, and the protective film covers the adhesive layer.

[0019] In a possible implementation, the encapsulation layer includes a first region and a second region, the first region is located at the periphery of the second region and is used to be attached to the array substrate located outside the light-emitting layer, and the second region covers the light-emitting layer;

[0020] The step of “forming an adhesive layer on the light-emitting layer” specifically includes:

[0021] forming at least one annular first colloid on the first area to form the adhesive layer;

[0022] Preferably, before the step of "forming an encapsulation layer on the light-emitting layer", the method further comprises:

[0023] A recess is formed in the array substrate, and the recess is located within the projection of the adhesive layer on the array substrate, so that part of the packaging layer is attached to the recess and is not bonded to the adhesive layer.

[0024] Compared with the related art, the display panel and the manufacturing method thereof provided by the embodiment of the present application have the following advantages:

[0025] The display panel and the manufacturing method thereof provided in the embodiments of the present application, wherein the display panel includes an encapsulation layer and a protective film arranged on the encapsulation layer, an adhesive layer is arranged between the protective film and the encapsulation layer, and the bonding area between the adhesive layer and the encapsulation layer is smaller than the projection area of ​​the encapsulation layer on the array substrate, that is, the adhesive layer contacts the surface of part of the encapsulation layer.

[0026] Compared with the related art in which the protective film is fully bonded to the surface of the encapsulation layer through its bonding surface, the adhesive layer in the embodiment of the present application is bonded to part of the encapsulation layer, which reduces the bonding area between the adhesive layer and the encapsulation layer, reduces the bonding force between the adhesive layer and the encapsulation layer, makes it easier for the adhesive layer to detach from the encapsulation layer, and can reduce or avoid surface damage of the encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 Schematic diagram of the arrangement of the adhesive layer on the packaging layer provided in Example 1 of the present application Figure 1 ;

[0029] Figure 2 for Figure 1 Middle AA section view;

[0030] Figure 3 Schematic diagram of the arrangement of the adhesive layer on the packaging layer provided in Example 1 of the present application Figure 2 ;

[0031] Figure 4 Schematic diagram of the arrangement of the first colloid on the encapsulation layer provided in Example 1 of the present application Figure 1 ;

[0032] Figure 5 Schematic diagram of the arrangement of the first colloid on the encapsulation layer provided in Example 1 of the present application Figure 2 ;

[0033] Figure 6Schematic diagram of the arrangement of the first colloid on the encapsulation layer provided in Example 1 of the present application Figure 3 ;

[0034] Figure 7 Schematic diagram of the arrangement of the first colloid on the encapsulation layer provided in Example 1 of the present application Figure 4 ;

[0035] Figure 8 for Figure 1 Middle BB cutaway diagram;

[0036] Fig. 9 Schematic diagram of the process of manufacturing a display panel provided in the second embodiment of the present application Figure 1 ;

[0037] Fig.10 Schematic diagram of the process of manufacturing a display panel provided in the second embodiment of the present application Figure 2 .

[0038] Description of reference numerals:

[0039] 10-array substrate;

[0040] 11- annular depression;

[0041] 20-light emitting layer;

[0042] 30-encapsulation layer;

[0043] 31- first area; 32- second area;

[0044] 40-first colloid;

[0045] 41-colloid segment; 42-gap;

[0046] 50-protective film;

[0047] 100-Display panel. DETAILED DESCRIPTION

[0048] As described in the background technology, in the manufacturing process of the display device in the related art, there is a problem that the encapsulation layer is easily damaged, resulting in encapsulation failure. The inventors have found that the reason for this problem is that in the manufacturing process of the display device, in order to prevent foreign particles from contaminating the encapsulation layer, a protective film needs to be attached to the outer surface of the encapsulation layer of the display panel. The protective film is bonded to the surface of the encapsulation layer in a fully bonded manner through the bonding surface, and the bonding area of ​​the two is large. In the subsequent manufacturing process of the display device (for example, the process of attaching the polarizer to the encapsulation layer), the protective film needs to be torn off; however, the encapsulation layer is easily damaged in the process of tearing off the protective film, thereby causing encapsulation failure.

[0049] In view of the above technical problems, the embodiment of the present application provides a display panel and a manufacturing method thereof, wherein the display panel includes an encapsulation layer and a protective film, the protective film is attached to the encapsulation layer through an adhesive layer, and the bonding area between the adhesive layer and the encapsulation layer is smaller than the projected area of ​​the encapsulation layer on the array substrate. In this way, in the embodiment of the present application, the adhesive layer is only arranged on the surface of part of the encapsulation layer, which reduces the bonding area between the adhesive layer and the encapsulation layer, reduces the bonding force between the adhesive layer and the encapsulation layer, makes it easier for the adhesive layer to detach from the encapsulation layer, and reduces the probability of surface damage of the encapsulation layer.

[0050] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of this application.

[0051] Embodiment 1

[0052] like Figure 1 and Figure 2 As shown, the display panel 100 provided in the embodiment of the present application can be an organic light-emitting diode (OLED) display panel. The OLED display panel includes an array substrate 10, a light-emitting layer 20, an encapsulation layer 30 and a protective film 50, wherein the array substrate 10 is composed of a substrate and a functional layer formed on the substrate, the light-emitting layer 20 is arranged in the display area of ​​the array substrate 10, the encapsulation layer 30 includes a first area 31 and a second area 32, and the first area 31 is located at the periphery of the second area 32, the first area 31 is bonded to the non-display area of ​​the array substrate 10, and the second area 32 covers the light-emitting layer 20, which can provide protection for the light-emitting devices in the light-emitting layer 20 to prevent water vapor erosion and extend the service life of the light-emitting devices.

[0053] Before laminating the polarizer to the encapsulation layer 30, a protective film 50 needs to be laminarized on the outer surface of the encapsulation layer 30. The protective film 50 and the encapsulation layer 30 are bonded together by an adhesive layer. The protective film 50 can provide protection for the encapsulation layer 30 to prevent foreign particles from contaminating the encapsulation layer 30 or scratching the surface of the encapsulation layer 30 during the transfer of the encapsulated display panel 100. It should be noted that before laminating the polarizer to the display panel 100, the protective film 50 on the surface of the encapsulation layer 30 needs to be torn off, and then the polarizer is laminarized to the encapsulation layer 30.

[0054] In order to prevent the packaging layer 30 from being damaged and the edge of the packaging layer 30 from being lifted during the process of tearing off the protective film 50, thereby affecting the packaging effect, the bonding area between the adhesive layer and the packaging layer 30 in the embodiment of the present application is smaller than the projected area of ​​the packaging layer 30 on the array substrate 10, that is, the adhesive layer is only bonded to a portion of the surface of the packaging layer 30.

[0055] Such a configuration reduces the bonding area between the adhesive layer and the encapsulation layer 30, and reduces the bonding force between the adhesive layer and the encapsulation layer 30, so that when the protective film 50 is torn off, the adhesive layer can be more easily separated from the surface of the encapsulation layer 30, thereby reducing the probability of damage to the surface of the encapsulation layer 30.

[0056] Furthermore, the bonding force between the protective film 50 and the adhesive layer in the embodiment of the present application is greater than the bonding force between the adhesive layer and the encapsulation layer 30. Such a configuration allows the protective film 50 and the adhesive layer to be detached from the encapsulation layer 30 together when the protective film 50 is torn off, thereby preventing the adhesive layer from remaining on the surface of the encapsulation layer 30, so as to facilitate the subsequent bonding of the polarizer to the surface of the encapsulation layer 30.

[0057] The adhesive layer in the embodiment of the present application can be selectively arranged in the first area 31 and / or the second area 32 of the encapsulation layer 30, and the arrangement form of the adhesive layer on the surface of the encapsulation layer 30 is various. The present application describes the arrangement position and arrangement form of the adhesive layer on the encapsulation layer 30 respectively.

[0058] like Figure 3 See Figure 2 The adhesive layer in the embodiment of the present application includes at least one circle of the first colloid 40 disposed on the first area 31. Exemplarily, the adhesive layer includes a circle of the first colloid 40 arranged along the circumference of the encapsulation layer 30, and the first colloid 40 is disposed around the periphery of the second area 32 and is located in the first area 31.

[0059] For example, the encapsulation layer 30 includes a rectangular second region 32, the first region 31 is arranged around the second region 32, and a circle of rectangular first colloid 40 is provided in the first region 31, one side of the first colloid 40 is bonded to the encapsulation layer 30, and the other side of the first colloid 40 is bonded to the protective film 50, so that the first protective film 50 is bonded to the surface of the encapsulation layer 30 through the first colloid 40, and protects the encapsulation layer 30. In this arrangement, since the first region 31 has high adhesion to the array substrate 10, it is not easy to lift the edge of the encapsulation layer 30 when the protective film 50 is torn off, thereby improving the sealing performance between the encapsulation layer 30 and the array substrate 10.

[0060] The adhesive layer in the embodiment of the present application includes multiple circles of first colloid 40, which are arranged on the encapsulation layer 30 at intervals, so that the multiple circles of first colloid 40 are arranged in a U-shaped pattern on the encapsulation layer 30. Among the multiple circles of first colloid 40, part of the first colloid 40 is arranged in the first area 31, and part of the first colloid 40 is arranged in the second area 32.

[0061] Exemplarily, the adhesive layer includes a plurality of first colloids 40 arranged in a rectangular shape on the encapsulation layer 30, with a gap between two adjacent first colloids 40, and the plurality of first colloids 40 are arranged in a U-shaped pattern. One of the first colloids 40 is arranged in the first area 31, and the remaining first colloids 40 are arranged in the second area 32; such a configuration reduces the bonding area between the adhesive layer and the encapsulation layer 30, ensuring that the adhesive layer is more easily detached from the surface of the encapsulation layer 30 when the protective film 50 is torn off; and also improves the stability of the protective film 50 connected to the encapsulation layer 30.

[0062] It should be noted that the first colloid 40 in the adhesive layer in the above embodiment is a continuous colloid. In order to further reduce the bonding area between the adhesive layer and the encapsulation layer 30, in other embodiments, the first colloid 40 includes a plurality of discontinuous colloid segments 41, and the plurality of colloid segments 41 are arranged along the circumference of the encapsulation layer 30. It can also be said that a plurality of notches 42 are provided in each of the above continuous first colloids 40, so that each first colloid 40 includes a plurality of discontinuous colloid segments 41. The present embodiment does not limit the position of the notch 42.

[0063] In the embodiment of the present application, a notch 42 may be selectively provided on one or more continuous first colloids 40, so that each first colloid 40 includes a plurality of discontinuous colloid segments 41. Figure 4 As shown, for example, a plurality of gaps 42 may be selectively provided in the first colloid 40 disposed on the second region 32 , so that the first colloid 40 disposed on the second region 32 includes a plurality of discontinuous colloid segments 41 .

[0064] Or, if Figure 5 and Figure 6 As shown, the first colloid 40 arranged on the first area 31 may be provided with a plurality of notches 42, so that the first colloid 40 arranged on the first area 31 includes a plurality of discontinuous colloid segments 41. For example, the first area 31 is provided with a circle of rectangular first colloid 40, the first colloid 40 includes four discontinuous colloid segments 41, and each colloid segment 41 is arranged in a dot shape in the first area 31, and each colloid segment 41 is arranged at a corner of the first area 31. In this arrangement, since the first area 31 has a high adhesion to the array substrate 10, it is not easy to lift the edge of the encapsulation layer 30 when the protective film 50 is torn off; and when the protective film 50 is torn off, the adhesive layer is more easily detached from the surface of the encapsulation layer 30.

[0065] like Figure 7 As shown, in the embodiment of the present application, multiple gaps 42 can be optionally provided for all continuous first colloids 40 arranged on the encapsulation layer 30, so that all first colloids 40 have multiple discontinuous colloid segments 41. Such a setting not only reduces the bonding area between the adhesive layer and the encapsulation layer 30, but also ensures the stability of the protective film 50 and the encapsulation layer 30.

[0066] Continue reading Figure 7 In the embodiment of the present application, the notches 42 in the two adjacent circles of the first colloid 40 are staggered, that is, the notches 42 in the two adjacent circles of the first colloid 40 are not on the same straight line; such a setting can further enhance the bonding strength between the adhesive layer and the encapsulation layer 30, so that when the protective film 50 is torn off, the adhesive layer can be more easily separated from the encapsulation layer 30, thereby avoiding damage to the encapsulation layer 30 and lifting the encapsulation layer 30.

[0067] On the basis of the above-mentioned embodiments, a depression is provided on the array substrate 10 in the embodiment of the present application, and the depression is located within the projection of the adhesive layer on the array substrate 10, and the portion of the encapsulation layer 30 opposite to the depression can be fitted with the wall surface of the depression, so that the portion of the encapsulation layer 30 is separated from the adhesive layer and not bonded, which can reduce the bonding area between the encapsulation layer 30 and the adhesive layer, thereby reducing the bonding force between the adhesive layer and the encapsulation layer 30, so that when the protective film 50 is torn off, the adhesive layer can be more easily separated from the surface of the encapsulation layer 30, which can reduce the probability of damage to the surface of the encapsulation layer 30.

[0068] Exemplarily, the recess in the embodiment of the present application is arranged in the projection area of ​​the second area 32 of the encapsulation layer 30 on the array substrate 10 ; or, the recess is arranged in the projection area of ​​the first area 31 of the encapsulation layer 30 on the array substrate 10 .

[0069] Preferably, a recess is set in the area of ​​the array substrate 10 covered by the first area 31 of the packaging layer 30; in this way, since the thickness of the first area 31 of the packaging layer 30 is thinner than the thickness of the second area 32, the packaging layer 30 located in the first area 31 can fit more easily in the recess, so that this part of the packaging layer 30 can be more easily separated from the adhesive layer.

[0070] like Figure 8 As shown, combined with Figure 1, the depression is arranged in an annular shape on the array substrate 10 located outside the light-emitting layer 20, that is, the array substrate 10 is provided with an annular depression 11 in the area covered by the first area 31 of the encapsulation layer 30. The first area 31 may be surrounded by a circle of continuous first colloid 40, the projection of the first colloid 40 on the array substrate 10 covers the annular depression 11, part of the encapsulation layer 30 is attached to the annular depression 11, and the part of the encapsulation layer 30 opposite to the annular depression 11 is separated from the first colloid 40, that is, part of the first colloid 40 is bonded to the first area 31. In this way, the bonding area between the first colloid 40 and the encapsulation layer 30 can be further reduced, thereby reducing the bonding force between the bonding adhesive layer and the encapsulation layer 30, so that when the protective film 50 is torn off, the bonding adhesive layer is more easily separated from the surface of the encapsulation layer 30.

[0071] Embodiment 2

[0072] like Fig. 9 As shown, the embodiment of the present application provides a method for manufacturing a display panel 100, comprising the following steps:

[0073] Step S100: forming a light-emitting layer 20 on the array substrate 10, that is, forming a light-emitting layer 20 in the display area of ​​the array substrate 10, and the light-emitting layer 20 may include a plurality of light-emitting devices; for example, the plurality of light-emitting devices include red light-emitting devices, green light-emitting devices and blue light-emitting devices.

[0074] After the light emitting layer 20 is formed on the array substrate 10 , step S200 is performed: forming an encapsulation layer 30 on the light emitting layer 20 .

[0075] Specifically, an encapsulation layer 30 covering each light-emitting device is formed on the light-emitting layer 20, and the encapsulation layer 30 includes a first region 31 and a second region 32, wherein the first region 31 is located at the periphery of the second region 32, that is, the first region 31 is an edge region of the encapsulation layer 30. The first region 31 is attached to the non-display region of the array substrate 10, and the second region 32 covers the light-emitting layer 20, and can provide protection for each light-emitting device in the light-emitting layer 20.

[0076] After the encapsulation layer 30 is formed on the light emitting layer 20 , step S300 is performed: forming an adhesive layer on the encapsulation layer 30 , wherein the bonding area between the adhesive layer and the encapsulation layer 30 is smaller than the projection area of ​​the encapsulation layer 30 on the array substrate 10 .

[0077] For example, after the encapsulation layer 30 is formed, glue may be selectively dispensed on the surface of a portion of the encapsulation layer 30 to form an adhesive layer on the surface of the encapsulation layer 30, and the adhesive layer is used to bond the protective film 50; in this way, the bonding area between the adhesive layer and the encapsulation layer 30 is smaller than the projected area of ​​the encapsulation layer 30 on the array substrate 10. For example, the adhesive layer may cover a portion of the first region 31, that is, the adhesive layer is formed in the peripheral region of the encapsulation layer 30 located at the light-emitting layer 20.

[0078] After forming the adhesive layer on the encapsulation layer 30 , step S400 is performed: forming a protective film 50 on the adhesive layer.

[0079] Specifically, the protective film 50 can cover the entire encapsulation layer 30 , and the protective film 50 is bonded to the adhesive layer, that is, the protective film 50 is bonded to the encapsulation layer 30 through the adhesive layer and can cover the entire encapsulation layer 30 , thereby providing effective protection for the encapsulation layer 30 .

[0080] Furthermore, the bonding force between the protective film 50 and the adhesive layer is greater than the bonding force between the adhesive layer and the encapsulation layer 30, so that when the protective film 50 needs to be torn off in the subsequent process (when the polarizer is pasted on the encapsulation layer 30), the protective film 50 and the adhesive layer are separated from the encapsulation layer 30 together.

[0081] The manufacturing method of the display panel provided in the embodiment of the present application sets the adhesive layer only in a partial area of ​​the encapsulation layer 30, thereby reducing the bonding area between the adhesive layer and the encapsulation layer 30, reducing the bonding force between the adhesive layer and the encapsulation layer 30, making it easier for the adhesive layer to detach from the encapsulation layer 30, and reducing the probability of surface damage to the encapsulation layer 30 when tearing off the protective film 50.

[0082] In addition, the first region 31 of the encapsulation layer 30 has high adhesion to the array substrate 10 , and during the process of tearing off the protective film 50 , the edge of the encapsulation layer 30 can be prevented from being lifted, thereby improving the sealing effect between the encapsulation layer 30 and the array substrate 10 .

[0083] In some embodiments, the above step S300 of “forming an adhesive layer on the encapsulation layer 30 ” specifically includes: forming at least one annular first colloid 40 on the first region 31 to form an adhesive layer.

[0084] Specifically, glue is dispensed around the circumference of the first region 31 to form at least one annular circle of the first glue 40 in the first region 31 , that is, the adhesive layer includes at least one annular circle of the glue formed in the first region 31 .

[0085] For example, Figure 1 As shown, a ring-shaped first colloid 40 is formed in the first area 31 . The first colloid 40 can be a rectangular ring-shaped colloid. One side of the ring-shaped colloid is attached and bonded to the first area 31 of the encapsulation layer 30 , and the other side of the ring-shaped colloid is used to bond the protective film 50 .

[0086] In some other embodiments, step S300: "forming an adhesive layer on the encapsulation layer 30" specifically includes: forming a plurality of colloid segments 41 arranged at intervals on the first area 31, and the plurality of colloid segments 41 form at least one circle along the circumference of the first area 31 to form an adhesive layer.

[0087] Specifically, the adhesive layer includes at least one continuous circle of first colloid 40 formed in the first area 31, and two adjacent circles of first colloid 40 are arranged at intervals on the first area 31, and each first colloid 40 is provided with a notch 42, so that each first colloid 40 includes a plurality of colloid segments 41 to form a discontinuous first colloid 40.

[0088] For example, Figure 5 As shown, a plurality of strip-shaped first colloids 40 are arranged along the circumference of the first region 31, the plurality of first colloids 40 form a circle, and a certain interval is maintained between two adjacent first colloids 40; and a plurality of notches 42 are arranged for each first colloid 40, so that the first colloid 40 includes a plurality of colloid segments 41. Such an arrangement can reduce the bonding area between the adhesive layer and the first region 31, thereby reducing the bonding force between the adhesive layer and the encapsulation layer 30, and preventing the encapsulation layer 30 from being lifted or damaged when the protective film 50 is torn off.

[0089] Furthermore, if Figure 6 As shown, glue is dispensed at each corner of the first area 31 to form a dot-shaped colloid segment 41, that is, a dot-shaped colloid is provided at each of the four corners of the first area 31, and a discontinuous (broken line) first colloid 40 is formed; the first colloid 40 forms an adhesive layer, and one side of the first colloid 40 is attached and bonded to the first area 31, and the other side of the first colloid 40 is used to be attached and bonded to the protective film 50.

[0090] It should be noted that in step S300 of “forming an adhesive layer on the encapsulation layer 30 ”, not only is the first colloid 40 disposed on the first region 31 to form an adhesive layer, but at least one circle of the first colloid 40 is disposed on the second region 32 to form an adhesive layer.

[0091] like Figure 3 As shown, dispensing is performed around the circumference of the second region 32 to form at least one annular ring of the first colloid 40 in the second region 32. For example, multiple annular rings of the first colloid 40 are formed in the second region 32, and the multiple rings of the first colloid 40 can be arranged in a U-shaped pattern on the second region 32 of the encapsulation layer 30, and a certain interval is maintained between two adjacent rings of the first colloid 40.

[0092] Furthermore, if Figure 4As shown, the step of "forming an adhesive layer on the encapsulation layer 30" further includes: forming a plurality of spaced apart colloid segments 41 on the second region 32, wherein the plurality of colloid segments 41 form at least one circle along the circumference of the second region 32 to form an adhesive layer.

[0093] Specifically, a plurality of notches 42 are respectively provided for each continuous first colloid 40 formed in the second region 32, so that each first colloid 40 includes a discontinuous colloid segment 41. Such a configuration can reduce the bonding area between the adhesive layer and the first region 31, thereby reducing the bonding force between the adhesive layer and the encapsulation layer 30, and preventing the encapsulation layer 30 from being lifted or damaged when the protective film 50 is torn off.

[0094] like Fig.10 As shown, on the basis of the above-mentioned embodiments, the manufacturing method of the display panel 100 provided in the embodiment of the present application further includes step S110 before step S200 "forming the encapsulation layer 30 on the light-emitting layer 20": "a depression is formed on the array substrate 10, and the depression is located within the projection of the adhesive layer on the array substrate 10, so that part of the encapsulation layer 30 fits in the depression and is not bonded to the adhesive layer".

[0095] Specifically, after the light emitting layer 20 is formed on the array substrate 10, etching is performed on the array substrate 10 to form a recess on the surface of the array substrate 10 facing the encapsulation layer 30. In this embodiment, the recess may be located in a region of the array substrate 10 covered by the light emitting layer 20, and may be disposed on the array substrate 10 outside the light emitting layer 20.

[0096] The recess is opposite to the adhesive layer subsequently formed on the encapsulation layer 30, that is, the recess is located within the projection of the adhesive layer on the array substrate 10. With such a configuration, after the encapsulation layer 30 is formed on the array substrate 10, part of the encapsulation layer 30 is filled in the recess and adheres to the recess, so that the adhesive layer opposite to the recess is not bonded to the part of the encapsulation layer 30, thereby achieving the purpose of reducing the bonding area between the adhesive layer and the encapsulation layer 30.

[0097] like Figure 7 As shown, combined with Figure 2 In the embodiment of the present application, an annular recess 11 is formed in the area of ​​the array substrate 10 covered by the first area 31 , and the annular recess 11 can be covered by the first colloid 40 subsequently formed in the first area 31 .

[0098] An annular recess 11 is formed in the first region 31 of the encapsulation layer 30 . The annular recess 11 is disposed around the circumference of the first region 31 . The annular recess 11 is disposed opposite to the first colloid 40 , and the first colloid 40 covers the annular recess 11 .

[0099] Such a configuration can reduce the bonding area between the first colloid 40 and the first region 31, thereby reducing the bonding force between the first colloid 40 and the encapsulation layer 30, so that when the protective film 50 is torn off, the first colloid 40 and the first region 31 of the encapsulation layer 30 can be separated smoothly to avoid lifting or damaging the encapsulation layer 30. It should be noted that the number of the annular recesses 11 can be the same as the number of the first colloids 40.

[0100] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0101] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0102] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0103] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0104] The term "substrate" as used herein refers to the material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned, or may remain unpatterned. In addition, the substrate may include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).

[0105] As used herein, the term "layer" may refer to a portion of a material that includes an area having a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have an extent that is smaller than the extent of the underlying or overlying structure. In addition, a layer may be a region of a continuous structure, whether homogeneous or inhomogeneous, whose thickness is less than the thickness of the continuous structure.

[0106] For example, a layer may be located between the top and bottom surfaces of the continuous structure or between any paired transverse planes at the top and bottom surfaces. A layer may extend laterally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: It comprises an array substrate, and a light-emitting layer and a packaging layer stacked on the array substrate; The encapsulation layer is provided with a protective film covering it, and an adhesive layer is provided between the protective film and the encapsulation layer; The bonding area between the adhesive layer and the encapsulation layer is smaller than the projection area of ​​the encapsulation layer on the array substrate; The array substrate is provided with a recess; wherein the recess is provided in a projection area of ​​the first area of ​​the encapsulation layer on the array substrate; the first area is bonded to a non-display area of ​​the array substrate; The recess is located within the projection of the adhesive layer on the array substrate; a portion of the packaging layer opposite to the recess is adhered to the recess and is not adhered to the adhesive layer.

2. The display panel according to claim 1, characterized in that: The encapsulation layer further includes a second region, the first region is located at the periphery of the second region and is used to be attached to the array substrate located outside the light-emitting layer, and the second region covers the light-emitting layer; The adhesive layer includes at least one circle of a first colloid disposed in the first area; The bonding force between the protective film and the bonding adhesive layer is greater than the bonding force between the bonding adhesive layer and the encapsulation layer.

3. The display panel according to claim 2, characterized in that: The adhesive layer includes a plurality of circles of the first colloid; A plurality of circles of the first colloid are arranged in a U-shaped pattern on the packaging layer, a portion of the first colloid is arranged in the first region, and a portion of the first colloid is arranged in the second region.

4. The display panel according to claim 3, characterized in that: The first colloid includes a plurality of discontinuous colloid segments, and the plurality of discontinuous colloid segments are arranged along a circumference of the packaging layer.

5. The display panel according to claim 4, characterized in that: The first colloid is provided with notches to form the plurality of discontinuous colloid segments; The gaps of the first colloid in two adjacent circles are arranged alternately.

6. The display panel according to claim 3, characterized in that: The first area is a rectangular area, and the first colloid disposed in the first area includes colloid segments disposed at each corner of the first area; A plurality of the colloid segments are arranged in the first region in a dotted manner.

7. The display panel according to claim 1, characterized in that: The recess is arranged in a ring shape on the array substrate outside the light emitting layer.

8. A method for manufacturing a display panel, characterized in that: The following steps are involved: forming a light emitting layer on the array substrate; forming an encapsulation layer on the light-emitting layer; forming an adhesive layer on the light-emitting layer, wherein the bonding area between the adhesive layer and the encapsulation layer is smaller than the projection area of ​​the encapsulation layer on the array substrate; forming a protective film on the adhesive layer, wherein the protective film covers the adhesive layer; Before forming an encapsulation layer on the light-emitting layer, the method further comprises: A recess is formed on the array substrate, and the recess is arranged within a projection area of ​​the first area of ​​the encapsulation layer on the array substrate; The first region is bonded to the non-display region of the array substrate, so that a portion of the encapsulation layer is adhered to the recess and is not bonded to the adhesive layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The encapsulation layer includes a first region and a second region, the first region is located at the periphery of the second region and is used to be attached to the array substrate located outside the light-emitting layer, and the second region covers the light-emitting layer; The step of "forming an adhesive layer on the light-emitting layer" specifically includes: At least one annular first colloid is formed on the first area to form the adhesive layer.

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