Solid-state transformer power unit and substation

Abstract

The present application discloses a solid-state transformer power unit and a transformer substation, belonging to the field of electric power. The solid-state transformer power unit includes a separately packaged high-voltage input module, an intermediate isolation module and a low-voltage output module; the high-voltage input module includes a first housing, an air-cooled heat dissipation structure, a DC support capacitor group, a rectifier module, and an inverter module, the first input end and the second input end of the rectifier module extend from the first housing, and the first output end and the second output end of the inverter module extend from the first housing; the low-voltage output module has the same structure as the high-voltage input module; the intermediate isolation module is located between the high-voltage input module and the low-voltage output module, including a second housing, and a high-frequency transformer located in the second housing; the first input end, the second input end, the first output end and the second output end of the high-frequency transformer extend from the second housing. According to the embodiments of the present application, the difficulty of installing the solid-state transformer power unit can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of electric power, and in particular, relates to a solid-state transformer power unit and a substation. Background Art

[0002] With the development of power grid technology and the growth of demand for electric energy, the functional limitations of industrial frequency power transformers, as key equipment of the power grid, are becoming increasingly obvious, making it difficult to meet the development requirements of the power grid. Solid-state transformers are a new type of controllable power transformer that combines power electronic conversion technology with medium and high frequency electromagnetic coupling technology. They can interconnect transmission and distribution networks of different voltage levels and meet the development requirements of the power grid.

[0003] The solid-state transformer can be composed of multiple packaged power units. The high-voltage input stage circuit, the intermediate isolation stage circuit and the low-voltage output stage circuit are packaged into one power unit. Since there are many circuits in the power unit and the power unit is large in size, the installation and maintenance of the power unit are more difficult. Summary of the invention

[0004] The embodiments of the present application provide a solid-state transformer power unit and a substation, which can reduce the difficulty of installing and maintaining the solid-state transformer power unit and the solid-state transformer substation.

[0005] In a first aspect, an embodiment of the present application provides a solid-state transformer power unit, including a separately packaged high-voltage input module, an intermediate isolation module, and a low-voltage output module;

[0006] The high-voltage input module includes a first shell, an air-cooling heat dissipation structure located in the first shell, a DC support capacitor group located in the first shell, and a rectifier module and an inverter module connected in parallel and arranged on the back of the air-cooling heat dissipation structure, and the DC support capacitor group is connected in parallel with the rectifier module; the first input end and the second input end of the rectifier module extend from the first shell, and the first output end and the second output end of the inverter module extend from the first shell;

[0007] The low voltage output module has the same structure as the high voltage input module;

[0008] The intermediate isolation module is located between the high-voltage input module and the low-voltage output module, and the intermediate isolation module includes a second shell and a high-frequency transformer located in the second shell; the first input end, the second input end, the first output end and the second output end of the high-frequency transformer extend from the second shell, the first input end and the second input end of the high-frequency transformer are respectively electrically connected to the first output end and the second output end of the inverter module in the high-voltage input module, and the first output end and the second output end of the high-frequency transformer are respectively electrically connected to the first input end and the second input end of the rectifier module in the low-voltage output module.

[0009] In some possible embodiments, the air-cooling heat dissipation structure includes a heat dissipation base and a plurality of heat dissipation fins arranged on the heat dissipation base.

[0010] In some possible embodiments, an air inlet is provided on a first surface of the first housing opposite to the heat dissipation fins, and an air outlet is provided on a second surface opposite to the first surface.

[0011] In some possible embodiments, the high-voltage input module also includes a laminated busbar located in the first shell, the laminated busbar is arranged parallel to the heat dissipation base, the laminated busbar is connected to the DC support capacitor group, and the laminated busbar is also electrically connected to the rectifier module and the inverter module respectively.

[0012] In some possible embodiments, the rectifier submodule includes two half-bridge IGBT device groups, and the inverter submodule includes two half-bridge IGBT device groups.

[0013] In some possible embodiments, the high-voltage input module further includes a drive control circuit board group disposed on a side of the rectifier module and the inverter module facing away from the heat dissipation base.

[0014] In some possible embodiments, along the direction of the rectifier module and the inverter module facing away from the heat dissipation base, the drive control circuit board group includes a first drive circuit board, a second drive circuit board and a control circuit board that are stacked;

[0015] The first driving circuit board includes first circuits corresponding to the half-bridge IGBT device groups, and each first circuit is electrically connected to two first wiring terminals on the first driving circuit board;

[0016] The second driving circuit board includes isolation drivers corresponding to the half-bridge IGBT device groups, each isolation driver is electrically connected to two second wiring terminals and one third wiring terminal on the second driving circuit board, and is electrically connected to the first wiring terminal and the second wiring terminal corresponding to the same half-bridge IGBT device group;

[0017] The control circuit board includes a control circuit, four fourth terminals electrically connected to the control circuit, and a communication port connected to the control circuit. The fourth terminals are electrically connected to the third terminals in a one-to-one correspondence, and an opening corresponding to the communication port is provided on the first shell.

[0018] In some possible embodiments, the high voltage input module further includes a power supply, which is disposed adjacent to the drive control circuit board group, and is electrically connected to the laminated busbar and the control circuit board, respectively.

[0019] In some possible embodiments, the first input end and the second input end of the high-frequency transformer are provided with isolation sheds.

[0020] In a second aspect, an embodiment of the present application provides a solid-state transformer substation, comprising an outer shell, a supporting structure arranged in the outer shell, a three-phase reactor, a control cabinet, a three-phase power unit group arranged on the supporting structure, and a heat exchange fan; the heat exchange fan is arranged on a first surface of the outer shell opposite to the three-phase power unit group, and an air inlet is arranged on a second surface of the outer shell opposite to the first surface;

[0021] Each phase power unit group includes N solid-state transformer power units in the first aspect, where N is an integer greater than or equal to 2.

[0022] In some possible embodiments, the three-phase reactor, the first-phase power unit group, the second-phase power unit group, and the third-phase power unit group are arranged in sequence; and the solid-state transformer power units in each phase power unit group are arranged in two columns.

[0023] In some possible embodiments, in each phase power unit group, the first input end of the rectifier module in the first high-voltage input module is electrically connected to the corresponding one-phase reactor, the first input end of the rectifier module in the i-th high-voltage input module is electrically connected to the second input end of the rectifier module in the i-1-th high-voltage input module through a first connecting bar, 1<i≤N, the first output end of the inverter module in each low-voltage output module is electrically connected through a second connecting bar, and the second connecting bar is electrically connected to the corresponding one-phase low-voltage incoming line;

[0024] The second input end of the rectifier module in the Nth high-voltage input module of each phase power unit group is electrically connected through the third connecting bar, and the second output end of the inverter module in the low-voltage output module of each phase power unit group is electrically connected through the fourth connecting bar, and the fourth connecting bar is grounded.

[0025] In some possible embodiments, a fan mounting opening is provided on the first surface of the outer shell opposite to the three-phase power unit group, a heat exchange fan is installed at the fan mounting opening, an air guide cover is also provided at the fan mounting opening on the outside of the outer shell; and a shutter is installed at the air inlet.

[0026] In some possible embodiments, the supporting structure includes an upper support and a lower support, the high-voltage input module in the solid-state transformer power unit is arranged on the upper support, and the intermediate isolation module and the low-voltage input module in the solid-state transformer power unit are arranged on the lower support.

[0027] In some possible embodiments, the upper support is an insulating support.

[0028] In some possible embodiments, the support structure further includes a support base, and the support base supports the lower support.

[0029] In some possible embodiments, a plurality of bushings passing through the outer shell are provided on the outer shell, and each of the three-phase high-voltage incoming lines enters the outer shell through a bushing and is electrically connected to the corresponding single-phase inductor, and each of the three-phase low-voltage incoming lines enters the outer shell through a bushing and is electrically connected to the first output end of the inverter submodule in the low-voltage output module of the corresponding single-phase power unit group.

[0030] In some possible embodiments, the communication port in the high voltage input module in each phase power unit group is connected to the control cabinet via a first communication link, and the communication port in the low voltage output module in each phase power unit group is connected to the control cabinet via a second communication link.

[0031] The embodiment of the present application provides a solid-state transformer power unit and a transformer substation, wherein the solid-state transformer power unit includes a separately packaged high-voltage input module, an intermediate isolation module, and a low-voltage output module, wherein the first input end and the second input end of the rectifier module in the high-voltage input module extend from the first housing. The first output end and the second output end of the inverter module in the high-voltage input module extend from the first housing, and are respectively electrically connected to the first input end and the second input end of the high-voltage inverter in the intermediate isolation module. The low-voltage output module has the same structure as the high-voltage input module. The first input end and the second input end of the rectifier module in the low-voltage output module extend from the second housing, and are respectively electrically connected to the first output end and the second output end of the high-voltage inverter in the intermediate isolation module. The first output end and the second output end of the inverter module in the low-voltage output module extend from the second housing. The high-voltage input module, the intermediate isolation module, and the low-voltage output module are each separately packaged, thereby realizing the modular design of the solid-state transformer power unit and reducing the installation and maintenance difficulties of the solid-state transformer power unit and the solid-state transformer transformer substation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 A schematic diagram of the electrical structure of an embodiment of a solid-state transformer power unit provided by the present application;

[0034] Figure 2 A schematic diagram of the electrical structure of an embodiment of a three-phase solid-state transformer provided by the present application;

[0035] Figure 3 A schematic structural diagram of an embodiment of a solid-state transformer power unit provided by the present application;

[0036] Figure 4A structural schematic diagram of an example of at least a portion of the structure in the first housing of a high-voltage input module provided in an embodiment of the present application;

[0037] Figure 5 A structural schematic diagram of another example of at least a portion of the structure in the first housing of the high-voltage input module provided in an embodiment of the present application;

[0038] Figure 6 for Figure 5 A schematic structural diagram of at least a portion of the structure in the first housing of the high-voltage input module shown in another angle;

[0039] Figure 7 A structural block diagram of an example of a first driving circuit board, a second driving circuit board and a control circuit board provided in an embodiment of the present application;

[0040] Figure 8 A schematic diagram of the positions of an example of a first driver circuit board, a second driver circuit board, a control circuit board and a half-bridge IGBT device group provided in an embodiment of the present application;

[0041] Fig. 9 A schematic structural diagram of an example of an intermediate isolation module provided in an embodiment of the present application;

[0042] Fig.10 A structural schematic diagram of an embodiment of a solid-state transformer substation provided by the present application;

[0043] Fig.11 for Fig.10 The structural schematic diagram of the solid-state transformer substation from another angle is shown;

[0044] Fig.12 for Fig.10 and Fig.11 A cross-sectional structural diagram of a solid-state transformer substation is shown;

[0045] Fig.13 A schematic diagram of the structure of an example of a three-phase power unit group provided in an embodiment of the present application;

[0046] Fig.14 for Fig.13 A partial structural schematic diagram of a three-phase power unit group shown;

[0047] Fig.15 A schematic diagram of an example of connection of a solid-state transformer power unit in a three-phase power unit group provided in an embodiment of the present application;

[0048] Fig.16 A schematic structural diagram of an example of a support structure provided in an embodiment of the present application;

[0049] Fig.17A schematic diagram of an example of a fiber optic communication link between a fiber optic transceiver and a control cabinet provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0051] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0052] Solid-state transformers are a new type of controllable power transformer that combines power electronic conversion technology with medium and high frequency electromagnetic coupling technology. They can interconnect transmission and distribution networks of different voltage levels, and can also provide plug-and-play interfaces for distributed power sources and energy storage devices. Solid-state transformers can also realize continuous on-load voltage regulation, power quality control, two-level grid flexible connectors, grid decoupling control, short-circuit current blockers, high and low voltage double-sided static synchronous compensators (STATCOM), self-healing safety devices, safety and stability system execution terminals, new energy grid connection interfaces, and other functions. Due to the above advantages, the application scope of solid-state transformers is becoming more and more extensive.

[0053] Solid-state transformers can be composed of multiple packaged power units. The high-voltage input stage circuit, the intermediate isolation stage circuit, and the low-voltage output stage circuit are packaged into one power unit. However, due to the complex circuit structure and the large number of components, the power unit is large in size, making it difficult to install and maintain.

[0054] The present application provides a solid-state transformer power unit and a substation, in which a high-voltage input stage circuit, an intermediate isolation stage circuit and a low-voltage output stage circuit are separately packaged, that is, the solid-state transformer power unit is a separate structure, thereby reducing the difficulty of installation, maintenance and other aspects.

[0055] The following describes the electrical structure of the solid-state transformer power unit and the three-phase solid-state transformer. The three-phase solid-state transformer in the embodiment of the present application is an AC-AC solid-state transformer, and correspondingly, the solid-state transformer power unit is an AC-AC solid-state transformer power unit.

[0056] Figure 1 This is a schematic diagram of the electrical structure of an embodiment of a solid-state transformer power unit provided by the present application. Figure 1 As shown, the solid-state transformer power unit may include a high-voltage input stage circuit, an intermediate isolation stage circuit, and a low-voltage output stage circuit. The high-voltage input stage circuit is packaged as a high-voltage input module 11, the intermediate isolation stage circuit is packaged as an intermediate isolation module 12, and the low-voltage output stage circuit is packaged as a low-voltage output module 13. The internal structure of the low-voltage input stage circuit is the same as that of the high-voltage input stage circuit, but the parameters, models, etc. of the components in the low-voltage input stage circuit and the high-voltage input stage circuit are not limited here.

[0057] The high voltage input module 11 includes a rectifier module, an inverter module and a DC support capacitor group connected in parallel. The rectifier module 111 includes two half-bridge insulated gate bipolar transistor (IGBT) device groups 113. The inverter module 112 includes two half-bridge IGBT device groups 113. Each half-bridge IGBT device group 113 includes two IGBT devices connected in series. For example, Figure 1 As shown, the rectifier module 111 includes IGBT devices T1, T2, T3 and T4, and the inverter module 112 includes IGBT devices T5, T6, T7 and T8. The connection method of the IGBT devices in the rectifier module 111 and the inverter module 112 is as follows: Figure 1 The DC support capacitor group in the high voltage input module 11 may include more than one capacitor, and the number and capacitance of the capacitors in the DC support capacitor group are not limited here. Figure 1 As shown, the DC support capacitor group in the high-voltage input module 11 includes a capacitor C1.

[0058] The intermediate isolation module 12 includes a high-frequency transformer M1. The high-frequency transformer M1 can be a high-isolation high-frequency transformer M1. The isolation voltage level of the high-frequency transformer M1 can be determined according to the voltage level of the input side (i.e., the high-voltage side) of the high-voltage input module 11, which is not limited here. For example, the distribution network voltage on the input side of the high-voltage input module 11 is 10KV, i.e., 10 kilovolts. Correspondingly, the isolation voltage level of the high-frequency transformer M1 can be determined according to 10KV.

[0059] The structure of the low voltage output module 13 is the same as that of the high voltage input module 11. The low voltage output module 13 includes a rectifier module 131, an inverter module 132 and a DC support capacitor group connected in parallel. The rectifier module 131 includes two half-bridge IGBT device groups 133. The inverter module 132 includes two half-bridge IGBT device groups 133. Each half-bridge IGBT device group 133 includes two IGBT devices connected in series. For example, Figure 1 As shown, the rectifier module 131 includes IGBT devices T9, T10, T11 and T12, and the inverter module 132 includes IGBT devices T13, T14, T15 and T16. The connection method of the IGBT devices in the rectifier module 131 and the inverter module 132 is as follows: Figure 1 The DC support capacitor group in the low voltage output module 13 may include more than one capacitor, and the number and capacitance of the capacitors in the DC support capacitor group are not limited here. Figure 1 As shown, the DC support capacitor group in the low voltage output module 13 includes a capacitor C2.

[0060] Figure 2 This is a schematic diagram of the electrical structure of an embodiment of a three-phase solid-state transformer provided by the present application. Figure 2 As shown, the three-phase solid-state transformer may include a three-phase power unit group. Each phase power unit group includes more than two solid-state transformer power units.

[0061] like Figure 2 As shown, in a single-phase power unit group, the first input end of the first solid-state transformer power unit can be connected to a phase of the high-voltage side power grid through a reactor, the second input end of the first solid-state transformer power unit is connected to the first input end of the second solid-state transformer power unit, the second input end of the second solid-state transformer power unit is connected to the first input end of the third solid-state transformer power unit, and so on. In a single-phase power unit group, the first output end of each solid-state transformer power unit is connected and connected to a phase of the low-voltage power grid. For example, in Figure 2 In the first phase power unit group, the first input end of the first solid-state transformer power unit is connected to the first phase of the high-voltage side power grid through the first phase reactor L1. In the second phase power unit group, the first input end of the first solid-state transformer power unit is connected to the second phase of the high-voltage side power grid through the second phase reactor L2. In the third phase power unit group, the first input end of the first solid-state transformer power unit is connected to the third phase of the high-voltage side power grid through the third phase reactor L3.

[0062] The second input end of the last solid-state transformer power unit in each phase power unit group is connected to form a neutral point on the high voltage side. The second output ends of each solid-state transformer power unit in each phase power unit group are connected to form a neutral point on the low voltage side, and the neutral point on the low voltage side can be grounded to the low voltage side.

[0063] The input of the solid-state transformer power unit in the power unit group is connected in series, which can increase the voltage level of the three-phase solid-state transformer. The output of the solid-state transformer power unit in the power unit group is connected in parallel, which can increase the current level of the three-phase solid-state transformer. The number of solid-state transformer power units in the power unit group can be determined according to the voltage level of the solid-state transformer power unit and the voltage level of the grid side, and is not limited here.

[0064] The specific structure of the solid-state transformer power unit is introduced below. Figure 3 This is a schematic diagram of the structure of an embodiment of a solid-state transformer power unit provided by the present application. Figure 3 As shown, the solid-state transformer power unit includes a separately packaged high-voltage input module 11, an intermediate isolation module 12 and a low-voltage output module 13. The intermediate isolation module 12 is located between the high-voltage input module 11 and the low-voltage output module 13. In the installed state, the solid-state transformer power unit can be vertically installed in three layers. Among them, the high-voltage input module 11 is installed on the high layer, the low-voltage output module 13 is installed on the bottom layer, and the intermediate isolation module 12 is installed on the middle layer. The intermediate isolation module 12 is installed on the top of the low-voltage output module 13 to withstand mechanical force. The mechanical force of the high-voltage input module 11 can be borne by the support of the power cabinet in which the solid-state transformer power unit is installed. The intermediate isolation module 12 is connected to the high-voltage input module 11 and the low-voltage output module 13 respectively. The connection between the high-voltage input module 11, the intermediate isolation module 12, and the low-voltage output module 13 can be a detachable connection for easy maintenance.

[0065] Figure 4 This is a schematic diagram of an example of at least a portion of the structure in the first housing of the high-voltage input module provided in an embodiment of the present application. Figure 3 and Figure 4As shown, the high-voltage input module 11 includes a first housing 211, an air-cooling heat dissipation structure located in the first housing 211, a DC support capacitor group located in the first housing 211, and a rectifier module 111 and an inverter module 112 connected in parallel to the back of the air-cooling heat dissipation structure. The DC support capacitor group is connected in parallel to the rectifier module 111. The first input end 212 and the second input end 213 of the rectifier module 111 extend from the first housing 211, and the first input end 212 of the rectifier module 111 can be used as the first input end of the high-voltage input module 11, and the second input end 213 of the rectifier module 111 can be used as the second input end of the high-voltage input module 11. The first output end 214 and the second output end 215 of the inverter module 112 extend from the first housing 211, and the first output end 214 of the inverter module 112 can be used as the first output end of the high-voltage input module 11, and the second output end 215 of the inverter module 112 can be used as the second output end of the high-voltage input module 11. The first output end of the rectifier module 111 is connected to the first input end of the inverter module 112 , and the second output end of the rectifier module 111 is connected to the second input end of the inverter module 112 .

[0066] In some examples, the air-cooled heat dissipation structure includes a heat dissipation base 216 and a plurality of heat dissipation fins 217 disposed on the heat dissipation base 216. The heat generated by the rectifier module 111 and the inverter module 112 can be transferred to the heat dissipation fins 217 through the heat dissipation base 216, and the heat dissipation fins 217 expand the heat dissipation area and dissipate the heat into the air.

[0067] An air inlet 218 is disposed on a first surface of the first housing 211 opposite to the heat dissipation fins 217, and an air outlet (not shown in the figure) is disposed on a second surface opposite to the first surface. Specifically, the air inlet 218 on the first surface of the first housing 211 may include a plurality of fine openings arranged in an array, and the air outlet on the second surface of the first housing 211 may include a plurality of fine openings arranged in an array. Figure 3 The figure shows an air inlet 218 disposed on one side of the first housing 211, and an air outlet is disposed opposite to the side, which is not shown in the figure. In the installed state, the extension direction of the heat dissipation fins 217 is the horizontal direction. The wind entering from the air inlet 218 can blow through the heat dissipation fins 217, pass through the gaps between the heat dissipation fins 217, and take away the heat of the heat dissipation fins 217. The wind with heat is then guided out from the air outlet to take the heat away from the high-voltage input module 11. That is, the wind can successively pass through the air inlet 218, the gaps between the heat dissipation fins 217, and the air outlet to take the heat away from the high-voltage input module 11.

[0068] In some examples, the high voltage input module 11 further includes a laminated busbar 219 located in the first housing 211. The laminated busbar 219 may specifically include a laminated positive busbar and a negative busbar. The laminated busbar 219 is arranged in parallel with the heat sink 216. The laminated busbar 219 is connected to the DC support capacitor group 114, and may also be connected to the rectifier module 111 and the inverter module 112. The rectifier module 111, the inverter module 112, and the DC support capacitor group 114 are connected in parallel through the laminated busbar 219 to achieve a compact design.

[0069] Figure 5 A schematic structural diagram of another example of at least a portion of the structure within the first shell of the high-voltage input module provided in an embodiment of the present application. Figure 6 for Figure 5 A schematic structural diagram of at least a portion of the structure inside the first shell of the high-voltage input module from another angle is shown. Figure 6 The arrows in FIG. 2 show the direction in which wind passes through the heat sink fins 217. Figure 5 and Figure 6 As shown, the high-voltage input module 11 further includes a drive control circuit board group disposed on the side of the rectifier module 111 and the inverter module 112 facing away from the heat dissipation base 216. Specifically, along the direction of the rectifier module and the inverter module facing away from the heat dissipation base 216, the drive control circuit board group includes a first drive circuit board 221, a second drive circuit board 222, and a control circuit board 223 that are stacked.

[0070] The first driving circuit board 221 is electrically connected to the half-bridge IGBT device group 113 in the rectifier module 111 and the half-bridge IGBT device group 113 in the inverter module 112. The second driving circuit board 222 is electrically connected to the first driving circuit board 221. The control circuit board 223 is electrically connected to the second driving circuit board 222. The first driving circuit board 221, the second driving circuit board 222 and the control circuit board 223 jointly realize the driving, control and protection of the rectifier module 111, the inverter module 112 and the like.

[0071] In some examples, the first driving circuit board 221 can be welded to the auxiliary connection terminals of the half-bridge IGBT device group 113 in the rectifier module 111 and the half-bridge IGBT device group 113 in the inverter module 112 through the pads on the first driving circuit board 221 .

[0072] In order to facilitate the explanation of the structure and connection relationship of the first drive circuit board 221, the second drive circuit board 222 and the control circuit board 223, the structure block diagram of the first drive circuit board 221, the second drive circuit board 222 and the control circuit board 223 and their relative positions with the half-bridge IGBT device group are used for explanation. Figure 7This is a structural block diagram of an example of a first driving circuit board, a second driving circuit board and a control circuit board provided in an embodiment of the present application, wherein double arrows are used to indicate the connection relationship between the components. Figure 8 A schematic diagram of the positions of an example of a first driver circuit board, a second driver circuit board, a control circuit board and a half-bridge IGBT device group provided in an embodiment of the present application.

[0073] like Figure 7 and Figure 8 As shown, in the installed state, the first drive circuit board 221, the second drive circuit board 222 and the control circuit board 223 are installed vertically. They are arranged in order from near to far from the rectifier module 111 and the inverter module 112, namely the first drive circuit board 221, the second drive circuit board 222 and the control circuit board 223.

[0074] The first driving circuit board 221 includes first circuits 227 corresponding to the half-bridge IGBT device groups 113. Each first circuit 227 is electrically connected to two first terminals 228 on the first driving circuit board 221. That is, each half-bridge IGBT device group 113 in the high-voltage input module 11 corresponds to two first terminals 228. One of the two first terminals 228 is an upper bridge arm terminal, and the other is a lower bridge arm terminal. The upper bridge arm terminal is connected to the part of the first circuit 227 related to the upper bridge arm IGBT device in the half-bridge IGBT device group 113, and the lower bridge arm terminal is connected to the part of the first circuit 227 related to the lower bridge arm IGBT device in the half-bridge IGBT device group 113. The first circuit 227 and the corresponding first terminal 228 can be connected through the plate making circuit on the first driving circuit board 221. Other circuits can also be provided on the first driving circuit board 221, which are not limited here. The first driving circuit board 221 can be integrally welded to the half-bridge IGBT device group 113 in the rectifier module 111 and the half-bridge IGBT device group 113 in the inverter module 112 .

[0075] The second driving circuit board 222 includes an isolation driver 230 corresponding to each half-bridge IGBT device group 113. Each isolation driver 230 is electrically connected to two second wiring terminals 229 and one third wiring terminal 231 on the second driving circuit board 222. That is, each half-bridge IGBT device group 113 in the high-voltage input module 11 corresponds to two second wiring terminals 229 and one third wiring terminal 231. The first wiring terminal 228 and the second wiring terminal 229 corresponding to the same half-bridge IGBT device group 113 are electrically connected. One of the two second wiring terminals 229 corresponding to a half-bridge IGBT device group 113 is an upper bridge arm wiring terminal, and the other is a lower bridge arm wiring terminal. Corresponding to the same half-bridge IGBT device group 113, the upper bridge arm wiring terminal in the first driving circuit board 221 is electrically connected to the upper bridge arm wiring terminal in the second driving circuit board 222, and the lower bridge arm wiring terminal in the first driving circuit board 221 is electrically connected to the lower bridge arm wiring terminal in the second driving circuit board 222. The third wiring terminal 231 may include a horn terminal, which is not limited here. The isolation driver 230 on the second driving circuit board 222 can be connected to the corresponding second connection terminal 229 and third connection terminal 231 through the plate-making circuit on the second driving circuit board 222. Other circuits can also be arranged on the second driving circuit board 222, which are not limited here.

[0076] The control circuit board 223 includes a control circuit 233, four fourth wiring terminals 232 electrically connected to the control circuit 233, and a communication port connected to the control circuit 233. The fourth wiring terminals 232 are electrically connected to the third wiring terminals 231 mentioned above in a one-to-one correspondence. A power supply terminal 234 may also be provided on the control circuit board 223, and the power supply terminal 234 is used to connect to a power supply end, which may be specifically implemented as a power supply 226, which is not limited here. The control circuit board 223 may also include isolation drivers corresponding to each half-bridge IGBT device group 113 in the rectifier module 111 and each half-bridge IGBT device group 113 in the inverter module 112, which are not shown in the figure. An opening corresponding to the communication port may be provided on the first shell 211. As shown in FIG. Figure 3 , Figure 7 and Figure 8 As shown, the communication port may include a fiber optic transceiver 224 and other types of communication connectors 225, which are not limited here. The fiber optic transceiver 224 can be divided into a fiber optic receiver 224-1 and a fiber optic transmitter 224-2. The fiber optic transceiver 224 can exchange information with the control system. In the installed state, the fiber optic receiver 224-1 and the fiber optic transmitter 224-2 can be installed vertically and extend out of the first housing 211. The isolation driver, the fourth terminal 232, the communication interface and other structures on the control circuit board 223 can be connected through the plate-making circuit. Other circuits can also be set on the control circuit board 223, which are not limited here.

[0077] The circuits on the first driving circuit board 221 include driving circuits, protection circuits, detection circuits, etc. with strong anti-interference capabilities. The circuits on the second driving circuit board 222 include driving circuits, control circuits, feedback short-circuit designs, etc. with weak anti-interference capabilities. It should be noted that the strong and weak anti-interference here are relative. The separate design of the first driving circuit board 221 and the second driving circuit board 222 can effectively isolate strong and weak electricity, thereby improving the reliability of the operation of the IGBT devices in the half-bridge IGBT device group. Moreover, the distance between the first driving circuit board 221, the second driving circuit board 222 and the control circuit board 223 is short, the wiring is simple, the complexity of wiring is reduced, and the wiring process is optimized.

[0078] The rectifier module 111, the inverter module 112, the DC support capacitor group 114 and the first drive circuit board 221 in the above embodiment can be used as the power part in the high-voltage input module 11, and the second drive circuit board 222 and the control circuit board 223 can be used as the control part in the high-voltage input module 11.

[0079] In some examples, such as Figure 5 and Figure 6 As shown, the high-voltage input module 11 may also include a power supply 226. The power supply 226 is arranged adjacent to the drive control circuit board group. The power supply 226 is electrically connected to the laminated busbar 219 and the control circuit board 223, respectively. In the installed state, the power supply 226 is located above the drive control circuit board group. The power input of the power supply 226 comes from the laminated busbar 219, and takes power from the DC bus. The wiring between the power supply 226 and the laminated busbar 219 is short, and the reliability is high. The power supply 226 supplies power to the control circuit board 223, and can also supply power to other parts of the high-voltage input module 11 that need electricity through the control circuit board 223. The wiring between the power supply 226 and the control circuit board 223 is short, and the reliability is high.

[0080] Fig. 9 This is a schematic diagram of an example of the structure of the intermediate isolation module provided in the embodiment of the present application. Figure 3 and Fig. 9 As shown, the intermediate isolation module 12 includes a second housing 311 and a high-frequency transformer M1 located in the second housing 311 .

[0081] The first input end 312, the second input end 313, the first output end 314 and the second output end 315 of the high-frequency transformer M1 extend from the second housing 311. The first input end 312 and the second input end 313 of the high-frequency transformer M1 are the first input end and the second input end of the intermediate isolation module 12, and the first output end 314 and the second output end 315 of the high-frequency transformer M1 are the first output end and the second output end of the intermediate isolation module 12. The first input end 312 and the second input end 313 of the high-frequency transformer M1 are electrically connected to the first output end 214 and the second output end 215 of the inverter module 112 in the high-voltage input module 11, respectively. The first output end 314 and the second output end 315 of the high-frequency transformer M1 are electrically connected to the first input end and the second input end of the rectifier module 131 in the low-voltage output module 13, respectively. Specifically, the first input terminal 312 of the high-frequency transformer M1 is electrically connected to the first output terminal 214 of the inverter module 112 in the high-voltage input module 11, and the second input terminal 313 of the high-frequency transformer M1 is electrically connected to the second output terminal 215 of the inverter module 112 in the high-voltage input module 11. The first output terminal 314 of the high-frequency transformer M1 is electrically connected to the first input terminal of the rectifier module 131 in the low-voltage output module 13, and the second output terminal 315 of the high-frequency transformer M1 is electrically connected to the second input terminal of the rectifier module 131 in the low-voltage output module 13.

[0082] In some examples, such as Fig. 9 As shown, the first input terminal 312 and the second input terminal of the high-frequency transformer M1 are covered with an isolation shed 316. The first input terminal 312 and the second input terminal 313 of the high-frequency transformer M1 are connected to the high-voltage input module 11. The isolation shed 316 can increase the creepage distance between the circuit, wiring, etc. in the high-voltage input module 11 and the high-frequency transformer M1, and can also increase the creepage distance between the circuit, wiring, etc. in the high-voltage input module 11 and the second housing 311, thereby improving the safety and reliability of the solid-state transformer power unit.

[0083] The low voltage output module 13 has the same structure as the high voltage input module 11 . For the specific contents of the low voltage output module 13 , reference may be made to the relevant description of the high voltage input module 11 , which will not be described in detail here.

[0084] In the embodiment of the present application, the solid-state transformer power unit includes a separately packaged high-voltage input module 11, an intermediate isolation module 12, and a low-voltage output module 13. The first input end 212 and the second input end 213 of the rectifier module 111 in the high-voltage input module 11 extend from the first housing 211. The first output end 214 and the second output end 215 of the inverter module 112 in the high-voltage input module 11 extend from the first housing 211 and are electrically connected to the first input end 312 and the second input end 313 of the high-frequency transformer M1 in the intermediate isolation module 12. The low-voltage output module 13 has the same structure as the high-voltage input module 11. The first input end and the second input end of the rectifier module 131 in the low-voltage output module 13 extend from the first housing and are electrically connected to the first output end 314 and the second output end 315 of the high-frequency transformer M1 in the intermediate isolation module 12. The first output end and the second output end of the inverter module 132 in the low-voltage output module 13 extend from the first housing. The high voltage input module 11, the intermediate isolation module 12 and the low voltage output module 13 are each separately packaged, realizing the modular design of the solid-state transformer power unit, reducing the installation and maintenance difficulty of the solid-state transformer power unit, and also reducing the overall design difficulty of the solid-state transformer power unit. Moreover, the air-cooled heat dissipation structure can dissipate heat for the high voltage input module 11 and the low voltage output module 13 to improve the safety and reliability of the solid-state transformer power unit.

[0085] The solid-state transformer may include multiple solid-state transformer power units in the above-mentioned embodiment. The electrical connection between the multiple solid-state transformer power units can be seen in Figure 2 The solid-state transformer can be integrated in a solid-state transformer substation. The present application also provides a solid-state transformer substation. Fig.10 This is a schematic structural diagram of an embodiment of a solid-state transformer substation provided in the present application. Fig.11 for Fig.10 The structural diagram of the solid-state transformer substation from another angle is shown in FIG. Fig.10 and Fig.11 As shown, the solid-state transformer substation includes an outer shell 41. A series of components are arranged in the outer shell 41. A heat exchange fan (not shown in the figure) is arranged on the first surface of the outer shell 41. The number of heat exchange fans can be set according to the working scene and working requirements, and is not limited here. An air inlet 42 is arranged on the second surface of the outer shell 41. The number of air inlets 42 can be set according to the working scene and working requirements, and is not limited here. The first surface and the second surface of the outer shell 41 are two opposite surfaces. The wind used for cooling enters from the air inlet 42 and leaves from the heat exchange fan. Fig.10 The dotted arrow in the figure is the direction from which the wind enters.

[0086] In some examples, the air inlet is installed with a louver 421. A fan mounting port 432 is provided on the first surface of the outer shell 41, and the heat exchange fan is installed at the fan mounting port 432. An air guide 431 may also be provided at the fan mounting port 432 outside the outer shell 41. Specifically, the air guide 431 corresponds to the heat exchange fan one by one. The wind for cooling enters from the louver 421 of the air inlet 42, passes through the components in the outer shell 41, flows out from the heat exchange fan, and leaves along the air duct formed by the air guide 431. Fig.11 The dotted arrow in the figure is the direction in which the wind is drawn out.

[0087] A three-phase reactor and a three-phase power unit group are arranged in the outer shell 41. The first surface of the outer shell 41 provided with a heat exchange fan is opposite to one side of the three-phase power unit group. Correspondingly, the second surface of the outer shell 41 provided with an air inlet is opposite to the other side of the three-phase power unit group.

[0088] In some examples, multiple bushings passing through the outer shell 41 may be provided on the outer shell 41. The three-phase high-voltage incoming wires may each enter the outer shell 41 through a bushing and be electrically connected to the corresponding single-phase reactor. The three-phase low-voltage incoming wires may each enter the outer shell 41 through a bushing and be electrically connected to the first output end of the inverter submodule in the low-voltage output module 13 of the corresponding single-phase power unit group. The multiple bushings may be provided at the same level or may be dispersed, which is not limited here. For example, Fig.10 and Fig.11 As shown, the outer shell 41 is provided with bushings S1, S2, S3, S4, S5 and S6. Among them, the first-phase high-voltage incoming line can enter the outer shell 41 through the bushing S1 and be electrically connected to the first-phase reactor L1, and the first-phase reactor L1 is connected to the first-phase power unit group 461, and the first-phase low-voltage incoming line can enter the outer shell 41 through the bushing S4 and be connected to the first-phase power unit group 461. The second-phase high-voltage incoming line can enter the outer shell 41 through the bushing S2 and be electrically connected to the second-phase reactor L2, and the second-phase reactor L2 is connected to the second-phase power unit group 462, and the second-phase low-voltage incoming line can enter the outer shell 41 through the bushing S5 and be connected to the second-phase power unit group 462. The third-phase high-voltage incoming line can enter the outer shell 41 through the bushing S3 and be electrically connected to the third-phase reactor L3, and the third-phase reactor L3 is connected to the third-phase power unit group 463, and the third-phase low-voltage incoming line can enter the outer shell 41 through the bushing S6 and be connected to the third-phase power unit group 463.

[0089] Fig.12 for Fig.10 and Fig.11 The cross-sectional structure diagram of the solid-state transformer substation is shown in FIG. Fig.12As shown, the solid-state transformer substation may also include a support structure 44 disposed in the outer shell 41, a three-phase reactor, a control cabinet 45, a three-phase power unit group disposed on the support structure 44, and the above-mentioned heat exchange fan. Fig.12 In the figure, the three-phase reactor, the three-phase power unit group and the control cabinet 45 are arranged in sequence. The three-phase power unit group includes a first-phase power unit group 461, a second-phase power unit group 462 and a third-phase power unit group 463. Each phase power unit group includes N solid-state transformer power units in the above-mentioned embodiment, and N is an integer greater than or equal to 2. The three-phase reactor includes a first-phase reactor L1, a second-phase reactor L2 and a third-phase reactor L3 (the third-phase reactor L3 is blocked and not shown in the figure).

[0090] Fig.13 A schematic diagram of an example of a three-phase power unit group provided in an embodiment of the present application. The solid-state transformer power unit is vertically installed on the support structure 44, the high-voltage input module 11 is installed on the upper layer, the low-voltage output module 13 is installed on the lower layer, and the intermediate isolation module 12 is located between the high-voltage input module 11 and the low-voltage output module 13.

[0091] The solid-state transformer power units in each phase power unit group can be arranged in two columns. For example, the solid-state transformer power units in the first phase power unit group 461 are arranged in two columns, the solid-state transformer power units in the second phase power unit group 462 are arranged in two columns, and the solid-state transformer power units in the third phase power unit group 463 are arranged in two columns. The first column of solid-state transformer power units in the first phase power unit group 461, the first column of solid-state transformer power units in the second phase power unit group 462, and the first column of solid-state transformer power units in the third phase power unit group 463 can be located in the same column. The second column of solid-state transformer power units in the first phase power unit group 461, the second column of solid-state transformer power units in the second phase power unit group 462, and the second column of solid-state transformer power units in the third phase power unit group 463 can be located in the same column. The three-phase power unit groups are arranged in sequence, and the solid-state transformer power units in each phase power unit group are arranged in two columns, which can improve the integration of the three-phase power unit group.

[0092] Fig.14 for Fig.13 A partial structural schematic diagram of a three-phase power unit group is shown. Fig.14The dotted arrow in the figure is the flow direction of the cooling wind. Two solid-state transformers in the same row can share the air duct. The cooling wind enters from the air inlet 218 of the high-voltage input module 11 and the air inlet of the low-voltage output module 13 in the first column of the solid-state transformer power unit, passes through the air outlet of the high-voltage input module 11 and the air outlet of the low-voltage output module 13 in the first column of the solid-state transformer power unit, and enters the air inlet 218 of the high-voltage input module 11 and the air inlet of the low-voltage output module 13 in the second column of the solid-state transformer power unit. The hot wind is discharged from the air outlet of the high-voltage input module 11 and the air outlet of the low-voltage output module 13 in the second column of the solid-state transformer power unit.

[0093] Fig.15 The following is a schematic diagram of an example of the connection of a solid-state transformer power unit in a three-phase power unit group provided in an embodiment of the present application. Fig.15 As shown, in each phase power unit group, the first input end of the rectifier module in the first high-voltage input module 11 is electrically connected to the corresponding one-phase reactor. The first input end of the rectifier module in the i-th high-voltage input module 11 is electrically connected to the second input end of the rectifier module in the i-1-th high-voltage input module 11 through the first connecting row 471, 1<i≤N. The first connecting row 471 may include a straight row, a U-shaped row, etc., which is not limited here. The first output end of the inverter module in each low-voltage output module 13 is electrically connected through the second connecting row 472. The second connecting row 472 is electrically connected to the corresponding one-phase low-voltage incoming line. The second connecting row 472 can specifically be a U-shaped row, which is not limited here.

[0094] The second input end of the rectifier module in the Nth high-voltage input module 11 of each phase power unit group is electrically connected through the third connecting row 473. The third connecting row 473 is suspended and not grounded. The third connecting row 473 can be a straight row, which is not limited here. The second output end of the inverter module in the low-voltage output module 13 of each phase power unit group is electrically connected through the fourth connecting row 474, and the fourth connecting row 474 is grounded. The fourth connecting row 474 can be a U-shaped row, which is not limited here.

[0095] The number of connection rows in the above embodiments can be set according to the working scenario and working requirements, and is not limited here.

[0096] Fig.16 A schematic structural diagram of an example of a support structure provided in an embodiment of the present application. Fig.16 The support structure 44 shown is applicable to the three-phase power unit group in the above-mentioned embodiment. Fig.16As shown, the support structure 44 includes an upper support 443 and a lower support 442 , the high voltage input module 11 in the solid-state transformer power unit is arranged on the upper support 443 , and the intermediate isolation module 12 and the low voltage output module 13 in the solid-state transformer power unit are arranged on the lower support 442 .

[0097] In the installed state, a lower support 442 is provided on the support base 441, and an upper support 443 is provided above the lower support 442. The lower support 442 can be specifically divided into three support areas. The lower support 442 in each support area is used to support the low-voltage output module 13 in the corresponding one-phase power unit group. The upper support 443 can be specifically divided into six support sub-areas, and the lower support 442 can also be specifically divided into six support sub-areas. The six support sub-areas of the upper layer correspond one-to-one to the six support sub-areas of the lower layer. The upper support 443 of a support sub-area of ​​the upper layer can be used to support a column of high-voltage input modules 11 in the corresponding one-phase power unit group. The lower support 442 of a support sub-area of ​​the lower layer can be used to support a column of low-voltage output modules 13 in the corresponding one-phase power unit group.

[0098] The upper support 443 may be an insulating support to achieve high voltage safety isolation. The lower support 442 may be an insulating support or a metal support, which is not limited here. In order to ensure safety isolation, the vertical supports in the upper support 443 and the lower support 442 may be insulating supports. The support base 441 may include but is not limited to a stainless steel base.

[0099] In the above embodiment, the communication port in the high voltage input module 11 in each phase power unit group is connected to the control cabinet 45 through a first communication link, and the communication port in the low voltage output module 13 in each phase power unit group is connected to the control cabinet 45 through a second communication link. For example, the communication port includes a fiber optic transceiver 224. Fig.17 This is a schematic diagram of an example of a fiber optic communication link between a fiber optic transceiver and a control cabinet provided in an embodiment of the present application. Fig.17As shown, the optical fiber transceiver 224 of the high voltage input module 11 of each solid-state transformer power unit 10 in the first phase power unit group 461, the optical fiber transceiver 224 of the high voltage input module 11 of each solid-state transformer power unit 10 in the second phase power unit group 462, and the optical fiber transceiver 224 of the high voltage input module 11 of each solid-state transformer power unit 10 in the third phase power unit group 463 are connected to the control cabinet 45 through the first optical fiber communication link 511. The optical fiber transceiver 224 of the low voltage output module 13 of each solid-state transformer power unit 10 in the first phase power unit group 461, the optical fiber transceiver 224 of the low voltage output module 13 of each solid-state transformer power unit 10 in the second phase power unit group 462, and the optical fiber transceiver 224 of the low voltage output module 13 of each solid-state transformer power unit 10 in the third phase power unit group 463 are connected to the control cabinet 45 through the second optical fiber communication link 512. Information interaction with the control cabinet 45 is realized through the communication port.

[0100] In the embodiment of the present application, the three-phase reactor is integrated into the interior of the solid-state transformer substation through the integrated prefabricated design of the solid-state transformer substation, which reduces the design difficulty of the power cabinet, shortens the R&D and production time, and solves the problems of difficulty in connecting to the reactor and the large area occupied by the substation.

[0101] In the use environment of microgrid, there is no need to build a special installation room, which can shorten the construction period of microgrid, reduce the cost of microgrid construction and improve economy.

[0102] It should be clear that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. For the solid-state transformer substation embodiment, the relevant parts can refer to the description part of the solid-state transformer power unit embodiment. The present application is not limited to the specific structure described above and shown in the figures. Those skilled in the art can make various changes, modifications and additions after understanding the spirit of the present application. In addition, for the sake of brevity, a detailed description of the known technology is omitted here.

[0103] Those skilled in the art should understand that the above embodiments are exemplary rather than restrictive. Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Based on the study of the drawings, the specification and the claims, those skilled in the art should be able to understand and implement other variations of the disclosed embodiments. In the claims, the term "comprising" does not exclude other devices or steps; the quantifier "one" does not exclude multiple; the terms "first" and "second" are used to indicate names rather than to indicate any specific order. Any figure marks in the claims should not be understood as limiting the scope of protection. The functions of multiple parts appearing in the claims can be implemented by a single hardware or software module. The appearance of certain technical features in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.

Claims

1. A solid-state transformer power unit, characterized in that: It includes a separately packaged high voltage input module, an intermediate isolation module and a low voltage output module; The high-voltage input module includes a first shell, an air-cooling and heat dissipation structure located in the first shell, a DC support capacitor group located in the first shell, and a rectifier module and an inverter module connected in parallel and arranged on the back of the air-cooling and heat dissipation structure, wherein the DC support capacitor group is connected in parallel with the rectifier module; the first input end and the second input end of the rectifier module extend from the first shell, and the first output end and the second output end of the inverter module extend from the first shell; The low voltage output module has the same structure as the high voltage input module; The intermediate isolation module is located between the high voltage input module and the low voltage output module, and includes a second housing and a high frequency transformer located in the second housing; a first input terminal, a second input terminal, a first output terminal and a second output terminal of the high frequency transformer extend from the second housing; The first input terminal and the second input terminal of the high-frequency transformer are electrically connected to the first output terminal and the second output terminal of the inverter submodule in the high-voltage input module respectively; The first output terminal and the second output terminal of the high-frequency transformer are electrically connected to the first input terminal and the second input terminal of the rectifier module in the low-voltage output module respectively; In the installed state, the solid-state transformer power unit is vertically installed in three layers, the high-voltage input module is installed on the upper layer, the low-voltage output module is installed on the bottom layer, and the intermediate isolation module is installed on the middle layer. The connection between the high-voltage input module, the intermediate isolation module, and the low-voltage output module is a detachable connection.

2. The solid-state transformer power unit according to claim 1, characterized in that: The air-cooled heat dissipation structure comprises a heat dissipation base and a plurality of heat dissipation fins arranged on the heat dissipation base; An air inlet is provided on a first surface of the first housing opposite to the heat dissipation fins, and an air outlet is provided on a second surface opposite to the first surface; The high-voltage input module also includes a laminated busbar located in the first shell, the laminated busbar is arranged in parallel with the heat dissipation base, the laminated busbar is connected to the DC support capacitor group, and the laminated busbar is also electrically connected to the rectifier module and the inverter module respectively.

3. The solid-state transformer power unit according to claim 2, characterized in that: The rectifier module includes two half-bridge IGBT device groups, and the inverter module includes two of the half-bridge IGBT device groups; The high-voltage input module further includes a drive control circuit board group arranged on the side of the rectifier module and the inverter module facing away from the heat dissipation base; Along the direction of the rectifier module and the inverter module facing away from the heat dissipation base, the drive control circuit board group includes a first drive circuit board, a second drive circuit board and a control circuit board which are stacked; The first driving circuit board comprises first circuits corresponding to the half-bridge IGBT device groups, and each of the first circuits is electrically connected to two first wiring terminals on the first driving circuit board; The second driving circuit board comprises isolation drivers corresponding to the half-bridge IGBT device groups, each of the isolation drivers is electrically connected to two second wiring terminals and one third wiring terminal on the second driving circuit board, and is electrically connected to the first wiring terminal and the second wiring terminal corresponding to the same half-bridge IGBT device group; The control circuit board comprises a control circuit, four fourth wiring terminals electrically connected to the control circuit, and a communication port connected to the control circuit, the fourth wiring terminals are electrically connected to the third wiring terminals in a one-to-one correspondence, and the first housing is provided with an opening corresponding to the communication port; The high-voltage input module also includes a power supply, which is disposed adjacent to the drive control circuit board group and is electrically connected to the laminated busbar and the control circuit board, respectively.

4. The solid-state transformer power unit according to claim 1, characterized in that: The first input end and the second input end of the high-frequency transformer are provided with isolation sheds.

5. A solid-state transformer substation, characterized in that: It comprises an outer shell, a supporting structure arranged in the outer shell, a three-phase reactor, a control cabinet, a three-phase power unit group arranged on the supporting structure, and a heat exchange fan; the heat exchange fan is arranged on a first surface of the outer shell opposite to the three-phase power unit group, and an air inlet is arranged on a second surface of the outer shell opposite to the first surface; Each phase power unit group includes N solid-state transformer power units as described in any one of claims 1 to 4, where N is an integer greater than or equal to 2.

6. The solid-state transformer substation according to claim 5, characterized in that: The three-phase reactor, the first-phase power unit group, the second-phase power unit group, and the third-phase power unit group are arranged in sequence; the solid-state transformer power units in each phase power unit group are arranged in two columns; In each phase power unit group, the first input end of the rectifier module in the first high-voltage input module is electrically connected to the corresponding one-phase reactor, the first input end of the rectifier module in the i-th high-voltage input module is electrically connected to the second input end of the rectifier module in the i-1-th high-voltage input module through a first connecting bar, 1<i≤N, the first output end of the inverter module in each low-voltage output module is electrically connected through a second connecting bar, and the second connecting bar is electrically connected to the corresponding one-phase low-voltage incoming line; The second input end of the rectifier module in the Nth high-voltage input module of each phase power unit group is electrically connected through a third connecting bar, and the second output end of the inverter module in the low-voltage output module of each phase power unit group is electrically connected through a fourth connecting bar, and the fourth connecting bar is grounded.

7. The solid-state transformer substation according to claim 5, characterized in that: A fan mounting opening is arranged on a first surface of the outer shell opposite to the three-phase power unit group, the heat exchange fan is mounted on the fan mounting opening, and an air guide cover is also arranged on the outside of the outer shell at the fan mounting opening; The air inlet is equipped with a shutter.

8. The solid-state transformer substation according to any one of claims 5 to 7, characterized in that: The support structure comprises an upper support and a lower support, the high voltage input module in the solid-state transformer power unit is arranged on the upper support, and the intermediate isolation module and the low voltage output module in the solid-state transformer power unit are arranged on the lower support; The upper support is an insulating support; The support structure also includes a support base, and the support base supports the lower support.

9. The solid-state transformer substation according to any one of claims 5 to 7, characterized in that: The outer shell is provided with a plurality of bushings passing through the outer shell, and each of the three-phase high-voltage incoming lines enters the outer shell through one of the bushings and is electrically connected to the corresponding one-phase reactor, and each of the three-phase low-voltage incoming lines enters the outer shell through one of the bushings and is electrically connected to the first output end of the inverter submodule in the low-voltage output module of the corresponding one-phase power unit group.

10. The solid-state transformer substation according to any one of claims 5 to 7, characterized in that: The communication port in the high voltage input module in each phase power unit group is connected to the control cabinet via a first communication link, and the communication port in the low voltage output module in each phase power unit group is connected to the control cabinet via a second communication link.

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