Mounting method of semiconductor

Abstract

The application relates to the technical field of production, and discloses a semiconductor mounting method based on a semiconductor mounting device, wherein the semiconductor mounting device comprises a base, an adsorption plate and a control module; the adsorption plate is movably connected to the base; a plurality of vacuum holes for sucking carriers are arranged on the adsorption plate; and a telescopic supporting part is arranged on the outer side wall of the adsorption plate; and the control module is used for controlling the adsorption plate to drive the carriers to move to a semiconductor mounting position. The carriers are sucked through the vacuum holes on the adsorption plate, so that the carriers can be firmly adsorbed on the adsorption plate during movement, manual carrier feeding is not needed, and the work efficiency is improved. In addition, the telescopic supporting part arranged on the outer side wall of the adsorption plate can be suitable for carriers of different sizes, so that the application range of the semiconductor mounting device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of production, in particular to a semiconductor mounting method. BACKGROUND

[0002] At present, in the process of production and manufacturing, semiconductor components need to be assembled on a carrier for unified processing of other processes. In the prior art, a carrier is generally manually transported for mounting. However, this manual feeding operation mode seriously affects the work efficiency. SUMMARY

[0003] The purpose of the embodiment of the present application is to provide a semiconductor mounting method which can improve work efficiency.

[0004] In order to solve the above technical problems, the present application provides a semiconductor mounting method, comprising a base, a suction plate and a control module, the control module is used for controlling the suction plate movably connected to the base; a plurality of vacuum holes for sucking carriers are arranged on the suction plate, and a retractable support part is arranged on the outer side wall of the suction plate; the control module is used for controlling the suction plate to move the carrier to a semiconductor mounting position.

[0005] As a preferred scheme, the semiconductor mounting device comprises a first transmission assembly and a second transmission assembly, the first transmission assembly comprises a first clamp, the second transmission assembly comprises a second clamp, and the first clamp and the second clamp are both provided with a suction plate, and the first clamp and the second clamp are movably connected to the base respectively.

[0006] As a preferred scheme, the first transmission assembly further comprises a first guide rail assembly, the second transmission assembly further comprises a second guide rail assembly, and the control module is electrically connected with the first guide rail assembly and the second guide rail assembly respectively; the first clamp is movably connected to the base through the first guide rail assembly, the second clamp is movably connected to the base through the second guide rail assembly, and the first guide rail assembly and the second guide rail assembly are arranged side by side.

[0007] As a preferred scheme, the center lines of the suction plate on the first clamp and the suction plate on the second clamp are coincident in the orthographic projection on the base.

[0008] As a preferred scheme, the first clamp comprises a first driving device, the second clamp comprises a second driving device, the first driving device is used for driving the suction plate on the first clamp to move up and down, and the second driving device is used for driving the suction plate on the second clamp to move left and right.

[0009] As a preferred solution, the adsorption plate is further provided with an outer frame for fixing the carrier, and the outer frame is connected to the support part.

[0010] As a preferred solution, the semiconductor mounting device is further provided with a fixing frame and a pre-pressing device, and when the adsorption plate drives the carrier to move to a semiconductor mounting position, the pre-pressing device presses the carrier against the fixing frame.

[0011] As a preferred solution, the semiconductor mounting device further comprises a semiconductor feeding device for mounting the semiconductor on the carrier.

[0012] The embodiment of the present application has the following beneficial effects:

[0013] The embodiment of the present application provides a semiconductor mounting method based on a semiconductor mounting device, wherein the semiconductor mounting device comprises a base, an adsorption plate and a control module, the adsorption plate is movably connected to the base, the adsorption plate is provided with a plurality of vacuum holes for sucking a carrier, and an extensible support part is arranged on the outer side wall of the adsorption plate; the semiconductor mounting method comprises the following steps: the control module controls the adsorption plate to drive the carrier to move to a semiconductor mounting position. The carrier is sucked by the vacuum holes on the adsorption plate, so that the carrier can be firmly adsorbed on the adsorption plate during movement, manual carrier feeding is not needed, and the work efficiency is improved. In addition, the extensible support part arranged on the outer side wall of the adsorption plate can be suitable for carriers of different sizes, so that the application range of the semiconductor mounting device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 FIG. 1 is a structural schematic diagram of a semiconductor mounting device in the embodiment of the present application;

[0015] Figure 2 FIG. 2 is a working principle diagram of the semiconductor mounting device in the embodiment of the present application;

[0016] Figure 3 FIG. 3 is a structural schematic diagram of an adsorption plate in the embodiment of the present application;

[0017] Figure 4 FIG. 4 is an assembly schematic diagram of the adsorption plate and an outer frame in the embodiment of the present application;

[0018] Figure 5 FIG. 5 is a structural schematic diagram of a clip mounting device in the embodiment of the present application;

[0019] Wherein, 1, base; 2, adsorption plate; 21, vacuum hole; 22, support part; 3, outer frame; 4, first clamp; 41, first driving device; 5, first guide rail assembly; 6, second clamp; 61, second driving device; 7, second guide rail assembly; 8, carrier; 10, pre-pressing device; 11, vibration disc. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] In combination Figures 1 to 3 As shown in the drawings, the semiconductor mounting method in the embodiments of the present application is based on a semiconductor mounting device, which comprises a base 1, an adsorption plate 2 and a control module, the adsorption plate 2 is movably connected to the base 1, a plurality of vacuum holes 21 for sucking the carrier 8 are arranged on the adsorption plate 2, and a telescopic support part 22 is arranged on the outer side wall of the adsorption plate 2. The semiconductor mounting method comprises: the control module controls the adsorption plate 2 to drive the carrier 8 to move to a semiconductor mounting position.

[0022] In the embodiments of the present application, the semiconductor mounting device comprises a base 1, an adsorption plate 2 and a control module, the adsorption plate 2 is movably connected to the base 1, a plurality of vacuum holes 21 for sucking the carrier 8 are arranged on the adsorption plate 2, and a telescopic support part 22 is arranged on the outer side wall of the adsorption plate 2. The semiconductor mounting method comprises: the control module controls the adsorption plate 2 to drive the carrier 8 to move to a semiconductor mounting position; the carrier 8 is sucked through the vacuum holes 21 on the adsorption plate 2, so that the carrier 8 can be firmly adsorbed on the adsorption plate 2 during movement, manual carrier feeding is not needed, and the work efficiency is improved. In addition, the support part 22 arranged on the outer side wall of the adsorption plate 2 is telescopic, which can be suitable for carriers 8 of different sizes, so as to improve the application range of the semiconductor mounting device.

[0023] Please refer to Figure 4 As shown in the drawings, in order to fix the carrier 8, the adsorption plate 2 in the embodiments further comprises an outer frame 3 for fixing the carrier 8, and the outer frame 3 is connected to the support part 22. When fixing the carrier 8, the outer frame 3 is first fixed on the adsorption plate 2, and then the carrier 8 is fixed on the outer frame 3. Specifically, the carrier 8 is a plate-shaped structure such as a copper plate.

[0024] In combination Figure 1 and Figure 2As shown in the figure, in an optional embodiment, the semiconductor mounting device comprises a first conveying assembly and a second conveying assembly, the first conveying assembly comprises a first clamp 4, the second conveying assembly comprises a second clamp 6, the first clamp 4 and the second clamp 6 are both provided with an adsorption plate, and the first clamp 4 and the second clamp 6 are movably connected to the base 1 respectively.

[0025] Specifically, the first conveying assembly further comprises a first guide rail assembly 5, the second conveying assembly 7 further comprises a second guide rail assembly, and the control module is electrically connected to the first guide rail assembly 5 and the second guide rail assembly 7 respectively; the first clamp 4 is movably connected to the base 1 through the first guide rail assembly 5, the second clamp 6 is movably connected to the base 1 through the second guide rail assembly 7, and the first guide rail assembly 5 and the second guide rail assembly 7 are arranged side by side, so that the first clamp 4 and the second clamp 6 can be conveniently fed, and the two clamps do not interfere with each other.

[0026] Please refer to Figure 1 As shown in the figure, the center lines of the adsorption plates 2 on the first clamp 4 and the second clamp 6 are coincident in the orthographic projection on the base 1, so as to facilitate the transfer of the carrier 8 between the two clamps, such as by a mechanical hand or the like.

[0027] In an optional embodiment, the first clamp 4 comprises a first driving device 41, and the second clamp 6 comprises a second driving device 61, the first driving device 41 is used to drive the adsorption plate 2 on the first clamp 4 to move up and down, and the second driving device 61 is used to drive the adsorption plate 2 on the second clamp 6 to move left and right.

[0028] In a specific implementation, the carrier 8 can be fixed on the adsorption plate 2 of the first clamp 4, the up-and-down position of the carrier 8 is adjusted by the up-and-down movement of the first clamp 4, so as to facilitate the transmission of the carrier 8 on the first clamp 4 to the adsorption plate 2 on the second clamp 6 by a mechanical hand or the like, for example, the height of the carrier 8 on the first clamp 4 can be adjusted to be close to the height of the adsorption plate 2 on the second clamp 6, and the left-and-right position of the carrier 8 is adjusted by the left-and-right movement of the second clamp 6, so as to ensure that the carrier 8 can accurately reach the target position.

[0029] In an optional embodiment, the semiconductor mounting device is further provided with a fixing frame (not shown in the figure) and a pre-pressing device 10, when the adsorption plate 2 drives the carrier 8 to move to a semiconductor mounting position, the pre-pressing device 10 presses the carrier 8 tightly on the fixing frame, so as to facilitate the clip mounting. Specifically, the pre-pressing device 10 comprises an elastic member, which can be a spring or the like.

[0030] Referring to Figure 5 As shown, the semiconductor mounting device further comprises a semiconductor feeding device for mounting the semiconductor on the carrier 8.

[0031] The semiconductor feeding device comprises a vibrating plate 11 through which the semiconductor is transmitted to the semiconductor mounting position, and two vibrating plates 11 are respectively arranged on the two sides of the carrier 8; of course, the semiconductor can also be transmitted to the semiconductor mounting position in combination with a straight vibration structure and the like, and the specific mounting mode of the semiconductor will not be described here.

[0032] To sum up, the embodiment of the present application provides a semiconductor mounting method based on a semiconductor mounting device, wherein the semiconductor mounting device comprises a base 1, an adsorption plate 2 and a control module, the adsorption plate 2 is movably connected to the base 1, a plurality of vacuum holes 21 for adsorbing the carrier 8 are arranged on the adsorption plate 2, and a telescopic support part 22 is arranged on the outer side wall of the adsorption plate 2; the semiconductor mounting method comprises: the control module controls the adsorption plate 2 to drive the carrier 8 to move to the semiconductor mounting position, and the carrier 8 is adsorbed through the vacuum holes 21 on the adsorption plate 2, so that the carrier 8 can be firmly adsorbed on the adsorption plate 2 during the movement process, and manual carrier feeding is not required, thereby improving the work efficiency. In addition, the telescopic support part 22 arranged on the outer side wall of the adsorption plate 2 can be suitable for carriers 8 of different sizes, so as to improve the application range of the semiconductor mounting device.

[0033] The above only describes the preferred embodiments of the present application, and it should be noted that those skilled in the art can make some improvements and replacements without departing from the technical principles of the present application, and these improvements and replacements should also be considered as the protection scope of the present application.

Claims

1. A mounting method of a semiconductor, characterized by, The semiconductor mounting method is based on a semiconductor mounting device, the semiconductor mounting device comprises a base, a suction plate and a control module, the suction plate is movably connected to the base; a plurality of vacuum holes for sucking carriers are arranged on the suction plate, and a retractable support part is arranged on the outer side wall of the suction plate; an outer frame for fixing the carriers is further arranged on the suction plate and connected to the support part; The semiconductor mounting device comprises a first transmission assembly and a second transmission assembly, the first transmission assembly comprises a first clamp and a first guide rail assembly, the first clamp is movably connected to the base through the first guide rail assembly, the second transmission assembly comprises a second clamp, and suction plates are arranged on the first clamp and the second clamp; the second clamp is movably connected to the base; the central lines of the suction plates on the first clamp and the second clamp in the direction of the first guide rail assembly are coincident in the orthographic projection on the base; the first clamp comprises a first driving device, and the second clamp comprises a second driving device; the first driving device is used for driving the suction plate on the first clamp to move up and down, and the second driving device is used for driving the suction plate on the second clamp to move left and right. The semiconductor mounting method comprises the following steps: the control module controls the suction plate to move the carriers to a semiconductor mounting position; Wherein, the carriers are fixed on the suction plate of the first clamp, the up-down position of the carriers is adjusted by the up-down movement of the first clamp, so that the carriers on the first clamp are transmitted to the suction plate on the second clamp by the mechanical hand, the left-right position of the carriers is adjusted by the left-right movement of the second clamp, so that the carriers can accurately reach the target position.

2. The mounting method of a semiconductor according to Claim 1, wherein The second transmission assembly further comprises a second guide rail assembly, and the control module is electrically connected to the first guide rail assembly and the second guide rail assembly; the second clamp is movably connected to the base through the second guide rail assembly, and the first guide rail assembly and the second guide rail assembly are arranged side by side.

3. The mounting method of a semiconductor according to claim 1 or 2, wherein The semiconductor mounting device further comprises a fixing frame and a pre-pressing device, when the suction plate moves the carriers to the semiconductor mounting position, the pre-pressing device presses the carriers tightly on the fixing frame.

4. The mounting method of a semiconductor according to claim 1 or 2, wherein The semiconductor mounting device further comprises a semiconductor feeding device, which is used for mounting the semiconductor on the carriers.

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