Devices, systems, and methods including magnetic structures

Abstract

The present disclosure relates to devices, systems, and methods including magnetic structures. A magnetic device can include a magnetic structure, a device structure, and associated circuitry. The magnetic structure can include a patterned material layer having a predetermined magnetism. The patterned layer can be configured to, for example, provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure can be another structure that is physically connected to or arranged relative to the magnetic structure to, for example, structurally support, enable the operation of the magnetic structure, or otherwise be incorporated into the magnetic device, etc. The associated circuitry can be electrically connected to the magnetic structure to receive, provide, condition, or process signals of the magnetic device.

Description

[0001] This application is a divisional application of the invention patent application with the application date of December 16, 2016, the application number of 201611163539.4, and the invention name of "Devices, Systems and Methods Comprising Magnetic Structures". Technical Field

[0002] The present invention relates to devices, systems and methods comprising magnetic structures Background Art

[0003] Many applications utilize magnetic structures to perform sensing, actuation, communication, etc. in devices such as integrated circuits, sensors, and microelectromechanical devices. These devices may include magnetic structures in place of other elements or in addition to other elements, such as electronic structures.

[0004] However, problems arise when integrating magnetic structures into various devices. Fabrication materials with specific magnetic properties (e.g., generating a magnetic field or having electrical properties that vary according to a magnetic field) typically involve specific requirements, such as those related to temperature or contaminants during the fabrication process. These requirements often conflict with or unduly limit the fabrication of other materials (such as semiconductors, dielectrics, and metals) in the same device.

[0005] Devices comprising magnetic structures typically also require specific operating conditions, such as those related to the path of a magnetic field, which sometimes conflict with or unduly constrain the operating conditions of other elements included in the same device, such as those related to other electrical, magnetic, or electromagnetic fields.

[0006] Accordingly, there is a need for magnetic devices, systems, and corresponding methods that integrate magnetic structures in an improved manner. Summary of the Invention

[0007] The devices, systems, and methods of the described technology each have several aspects, none of which alone is responsible for their desired attributes. Without limiting the scope of the claims, some of the prominent features of the present disclosure will now be briefly described.

[0008] One aspect of the present invention is a magnetic device comprising a magnetic structure including a patterned material layer having a selected magnetism; a device structure physically coupled to the magnetic structure; and a circuit electrically coupled to the magnetic structure.

[0009] Another aspect of the present invention is a magnetic device comprising a cover mounted on a substrate; a micro - mechanical structure on the substrate and a magnetic structure vertically disposed relative to the cover and below the cover, the magnetic structure including a patterned material layer having magnetism; and a circuit electrically coupled to the magnetic structure.

[0010] Another aspect of the present invention is a magnetic device comprising: a magnetic sensor comprising a patterned magnetoresistive material; a circuit electrically coupled to the magnetic sensor; and a magnetic flux concentrator for transmitting and / or concentrating magnetic flux of a magnetic field to the magnetic sensor, the magnetic flux concentrator comprising a patterned layer of magnetic material on a substrate and having magnetic properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order that the features of the present invention may be understood, a number of drawings are described below. However, the drawings illustrate only certain embodiments of the present invention and are therefore not to be considered limiting of its scope, as the present invention may include other equally effective embodiments.

[0012] Figure 1 is a schematic diagram depicting an embodiment of a magnetic device.

[0013] Figure 2(a) - 2(k) 2(a) depicts an embodiment of a patterned layer of material having selected magnetic properties. FIG. 2(b) depicts an embodiment of a patterned layer having a cross shape. FIG. 2(c) depicts an embodiment of a patterned layer having a square or rectangular shape. FIG. 2(d) depicts an embodiment of a patterned layer having portions arranged in a pattern, wherein subsets of the portions are arranged facing each other. FIG. 2(e) depicts an embodiment of a patterned layer having portions arranged in an array, wherein there is a characteristic spacing between them. FIG. 2(f) depicts an embodiment of a patterned layer having a plurality of separate portions forming concentric rings. FIG. 2(g) depicts an embodiment of a patterned layer having a plurality of individual portions forming a rectangular shape with aligned centers. FIG. 2(h) depicts an embodiment of a patterned layer having a plurality of individual arcuate segments arranged to outline a ring. FIG. 2(i) depicts an embodiment of a patterned layer having a plurality of segments arranged to outline a square or rectangle. FIG. 2(j) depicts an embodiment of a patterned layer having a plurality of linear portions connected together to form a single integral segment that follows a forward and backward path. FIG. 2( k ) depicts an embodiment of a patterned layer having a spiral shape.

[0014] Figure 3(a) - 3(c) are cross-sectional side views depicting embodiments of patterned material layers. FIG3(a) depicts an embodiment of a patterned layer having a substantially constant height in a direction perpendicular to a plane defining a shape of the layer along an axis parallel to the plane defining the shape. FIG3(b) depicts an embodiment of a patterned layer having a height that varies from substantially zero to a predetermined height. FIG3(c) depicts an embodiment of a patterned layer having a height that varies from a first predetermined height to a second predetermined height.

[0015] Figure 4(a) - 4(d)Perspective and cross-sectional side views depicting embodiments of a composite layer including a patterned material layer are shown. Figure 4(a) depicts a perspective view of an embodiment of a patterned material layer formed integrally with another material layer. Figure 4(b) shows a cross-sectional view of the embodiment of Figure 4(a). Figure 4(c) depicts a cross-sectional top view of another embodiment of the composite layer. Figure 4(d) shows a cross-sectional side view of another embodiment of the composite layer.

[0016] Figure 5(a) - 5(d) A cross-sectional side view depicting an embodiment of a patterned material layer having a selected magnetism is shown. Figure 5(a) shows a cross-sectional view of a material layer having a top surface with a plurality of protrusions and recesses. In Figure 5(b), the protrusions of the patterned layer may include portions exposed above the top surface of the second material layer. In Figure 5(c), the protrusions of the patterned layer and the top surface of the second material layer may be located at substantially the same level. In Figure 5(d), the second layer of material may completely surround the protrusions of the patterned layer.

[0017] Figure 6(a) - 6(d) A top view depicting an embodiment of a patterned material layer is shown. Figure 6(a) depicts an embodiment of a patterned layer including a plurality of separated portions arranged in a two-dimensional array, each separated portion having a magnetic pole axis aligned in the same direction. Figure 6(b) depicts an embodiment of a patterned layer including a first plurality of separated portions and a second plurality of separated portions. Figure 6(c) depicts another embodiment of a patterned layer including a first plurality of separated portions and a second plurality of separated portions. Figure 6(d) depicts an embodiment of a patterned layer including first and second pluralities of separated portions and third and fourth separated portions.

[0018] Figure 7 A schematic diagram showing an embodiment of a magnetic device as a substrate-based magnetic device is shown.

[0019] Figure 8(a) - 8(d) A perspective view depicting an embodiment of a magnetic device in a manufacturing stage to form a magnetic structure on a substrate is shown. Figure 8(a) and 8(b) show an embodiment of a magnetic device after providing a substrate including one or more regions without active circuitry and one or more regions having or for planning active circuitry, in a first stage of a method of manufacturing a magnetic device. Figure 8(c) and 8(d) depict an embodiment of a magnetic device in a second stage of a manufacturing method, where a patterned material layer is formed on the substrate in one or more regions without active circuitry.

[0020] Figure 9(a) - 9(c)is a bottom view of an embodiment of a semiconductor wafer depicting a manufacturing stage of forming a magnetic structure on the wafer. FIG. 9(a) depicts an embodiment of the bottom view of a semiconductor wafer from which multiple integrated circuits or other substrate devices can ultimately be separated after processing. FIG. 9(b) depicts an embodiment of the bottom view of the wafer of FIG. 9(a) at a manufacturing stage after a layer of material having a selected magnetism has been formed on substantially the entire back surface of the wafer. FIG. 9(c) depicts at a further manufacturing stage, after the layer has been patterned to form a patterned layer shape on the back surface of the wafer, Figure 9(a) and 9(b) an embodiment of the bottom view of the wafer.

[0021] Figure 10(a) - 10(b) is a perspective view depicting an embodiment of a magnetic structure. FIG. 10(a) depicts an embodiment of a patterned layer formed as a separate structure. FIG. 10(b) depicts an embodiment of a patterned layer formed as a separate structure on a corresponding substrate.

[0022] Figure 11 is a perspective view depicting an embodiment of a magnetic structure on a substrate.

[0023] Figure 12 is a top view depicting an embodiment of a magnetic structure and a conductive coil.

[0024] Figure 13 is a perspective view showing an embodiment of a magnetic device including a magnetic structure and a conductive coil on a substrate.

[0025] Figure 14(a) - 14(d) Depicts a top view, a side view, and a bottom view of an embodiment of a magnetic device that includes a magnetic structure and a conductive coil on a substrate. FIG. 14(a) shows a top view of the magnetic device, showing the conductive coil formed as a layer on a first side of the substrate. FIG. 14(b) shows a side cross-sectional view of the magnetic device. FIG. 14(c) shows a bottom view of the magnetic device. FIG. 14(d) shows a side cross-sectional view of another embodiment of a magnetic device similar to FIGS. 14(a)-(c).

[0026] Figure 15 is a perspective view depicting an embodiment of a magnetic structure on a substrate.

[0027] Figure 16(a) - 16(c)It is a cross-sectional side view depicting an embodiment of a magnetic device during the manufacturing stage to form a magnetic structure on a substrate. Figure 16(a) shows a cross-sectional side view of an embodiment of the magnetic device at the first stage of the method after providing the substrate. Figure 16(b) shows a cross-sectional side view of the magnetic device at the second stage of the method after forming a patterned layer on the substrate. Figure 16(c) shows a cross-sectional side view of an embodiment of the magnetic device at the third stage of the method after forming holes through the patterned layer and the substrate.

[0028] Figure 17(a) - 17(b) It is a top view and a cross-sectional side view showing an embodiment of a magnetic device including a magnetic flux concentrator and a magnetic sensor on a substrate. Figure 17(a) shows a top view of an embodiment of the magnetic device configured to provide a magnetic flux concentrator. Figure 17(b) shows a cross-sectional side view of an embodiment of the magnetic device taken along the axis shown in Figure 17(a).

[0029] Figure 18(a) - 18(b) It is a top view and a cross-sectional side view showing an embodiment of a magnetic device including a magnetic flux concentrator and a magnetic sensor on a substrate.

[0030] Figure 19 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor.

[0031] Figure 20(a) - 20(e) It is a cross-sectional side view and a top view showing an embodiment of a magnetic device including a magnetic sensor with a magnetic shield on a substrate. Figure 20(a) shows a cross-sectional side view of a magnetic structure that can be used to implement the magnetic sensor. Figure 20(b) depicts a cross-sectional top view of an embodiment of the magnetic sensor of Figure 20(a), showing more details of an embodiment of the second patterned layer. Figure 20(c) depicts a cross-sectional top view of an embodiment of the magnetic sensor of Figure 20(a), showing more details of an embodiment of the first patterned layer. Figure 20(d) shows a cross-sectional side view of another embodiment of the magnetic sensor. Figure 20(e) shows a top view of another embodiment of the second patterned layer of the magnetic sensor. Figure 20(f) shows a top view of another embodiment of the first patterned layer of the magnetic sensor.

[0032] Figure 21 It is a side view depicting an embodiment of a magnetic device including a plurality of stacked magnetic structures.

[0033] Figure 22(a) - 22(d)is a perspective view depicting embodiments of a magnetic device during a manufacturing stage to form a magnetic structure in one or more recesses in a substrate. FIG. 22(a) depicts an embodiment of the magnetic device in a first manufacturing stage. FIG. 22(b) shows another embodiment of the magnetic device in the first manufacturing stage. FIG. 22(c) depicts an embodiment of the magnetic device of FIG. 22(a) in a second manufacturing stage. FIG. 22(d) depicts an embodiment of the magnetic device of FIG. 22(b) in the second manufacturing stage.

[0034] Figure 23(a) - 23(d) is a cross-sectional side view depicting embodiments of a magnetic device during a manufacturing stage to form a magnetic structure coating a plurality of recesses on a substrate. FIG. 23(a) depicts an embodiment of the magnetic device in a first manufacturing stage. FIG. 23(b) depicts an embodiment of the magnetic device in a second manufacturing stage. FIG. 23(c) depicts another embodiment of the magnetic device in the second manufacturing stage. FIG. 23(d) shows another embodiment of the magnetic device in the second manufacturing stage.

[0035] Figure 24(a) - 24(i) is a perspective view depicting embodiments of a magnetic device during a manufacturing stage to form a magnetic structure and conductive wiring in and around one or more recesses in a substrate. FIG. 24(a) depicts an embodiment of the magnetic device in a first manufacturing stage. FIG. 24(b) depicts an embodiment of the magnetic device in the first manufacturing stage. FIG. 24(c) shows an embodiment of the magnetic device in the first manufacturing stage. FIG. 24(d) depicts an embodiment of the magnetic device of FIG. 24(a) in a second manufacturing stage. FIG. 24(e) depicts an embodiment of the magnetic device of FIG. 24(b) in a second manufacturing stage. FIG. 24(f) depicts an embodiment of the magnetic device of FIG. 24(c) in a second manufacturing stage. FIG. 24(g) depicts an embodiment of the magnetic devices of FIGS. 24(a) and 24(d) in a third manufacturing stage. FIG. 24(h) depicts an embodiment of the magnetic devices of FIGS. 24(b) and 24(e) in a third manufacturing stage. FIG. 24(i) shows an embodiment of the magnetic devices of FIGS. 24(c) and 24(f) in a third manufacturing stage.

[0036] Figure 25(a) - 25(d) is a cross-sectional side view depicting embodiments of a magnetic device during a manufacturing stage to form a magnetic structure in and around a recess in a substrate. FIG. 25(a) shows a top view of an embodiment of the magnetic device in a first manufacturing stage. FIG. 25(b) shows a cross-sectional side view of the embodiment of the magnetic device of FIG. 25(a) in a first manufacturing stage. FIG. 25(c) shows a top view of the magnetic device of FIG. 25(a) in a second manufacturing stage. FIG. 25(d) shows a cross-sectional side view of the magnetic device of FIG. 25(b) in a second manufacturing stage.

[0037] Figure 26(a) - 26(d) is a cross-sectional side view depicting an embodiment of a magnetic device during a manufacturing stage to form a magnetic structure in and around a recess in a substrate. Figure 26(a) shows a top view of an embodiment of a magnetic device during a first manufacturing stage. Figure 26(b) depicts a cross-sectional side view of the magnetic device of Figure 26(a) during a first stage of manufacturing. Figure 26(c) depicts a side cross-sectional view of the magnetic device of Figures 26(a) and 26(b) during a second manufacturing stage. Figure 26(d) shows a side cross-sectional view of the magnetic device during a third stage of manufacturing. Figure 26(a) - 26(c)

[0038] Figure 27(a) - 27(c) are a cross-sectional top view and a side view depicting an embodiment of a magnetic structure on different layers of a substrate. Figure 27(a) shows a top view of an embodiment of a magnetic device including a patterned layer having a plurality of individual arcuate segments arranged to outline a loop. Figure 27(b) depicts a cross-sectional side view of the magnetic device of Figure 27(a) taken along a first axis passing through a first subset of segments. Figure 27(c) shows a cross-sectional side view of the magnetic device of Figure 27(a) taken along a second axis passing through a second subset of segments.

[0039] Figure 28(a) - 28(b) is a cross-sectional side view depicting an embodiment of a magnetic device including a magnetic flux concentrator and a magnetic sensor in and around a recess in a substrate. Figure 28(a) shows a cross-sectional side view of an embodiment of the magnetic flux concentrator device of Figure 17(a). Figure 28(b) shows a cross-sectional side view of another embodiment of the magnetic device of Figure 28(a).

[0040] Figure 29 is a cross-sectional side view depicting an embodiment of a magnetic structure in a recess on the back side of a substrate.

[0041] Figure 30(a) - 30(b) are a cross-sectional side view and a top view respectively, showing an embodiment of a magnetic structure formed on an inclined wall of a recess formed in a substrate.

[0042] Figure 31(a) - 31(b) are a cross-sectional side view and a top view respectively, depicting an embodiment of a magnetic structure formed on a plurality of angled walls of a recess formed in a substrate.

[0043] Figure 32 is a top view depicting an embodiment of a magnetic structure formed on inclined walls of a plurality of recesses in a substrate.

[0044] Figure 33(a) - 33(d) ​are a perspective view and a cross-sectional side view depicting an embodiment of a magnetic device that includes a magnetic structure on a cover over a substrate. FIG. 33(a) shows a perspective view of an embodiment of the magnetic device. FIG. 33(b) depicts a cross-sectional side view of the magnetic device of FIG. 33(a). FIG. 33(c) depicts a cross-sectional side view of an embodiment of a magnetic device similar to the embodiments of FIGS. 33(a) and 33(b). FIG. 33(d) depicts a cross-sectional side view of another embodiment of a magnetic device similar to the embodiments of FIGS. 33(a) and 33(b).

[0045] Figure 34(a) - 34(b) are respectively a perspective view and a cross-sectional side view depicting an embodiment of a magnetic device that includes a magnetic structure on and over a cover over a substrate.

[0046] Figure 35 is a perspective view of an embodiment of a magnetic device showing a magnetic structure and a coil on a cover over a substrate.

[0047] Figure 36(a) - 36(b) is a cross-sectional side view of an embodiment of a magnetic device that includes a magnetic sensor and a magnetic flux concentrator, with the magnetic sensor and the magnetic flux concentrator located in, on, and around a cover over a substrate. FIG. 36(a) shows an embodiment of a magnetic device that includes a first magnetic structure forming a magnetic flux concentrator and one or more second magnetic structures forming one or more magnetic sensors in and around a cover mounted on a substrate. FIG. 36(b) depicts another embodiment of a magnetic device similar to the embodiment of FIG. 36(a).

[0048] Figure 37(a) - 37(c) is a cross-sectional side view of an embodiment of a magnetic device that includes a magnetic structure that includes at least a portion of a micromechanical structure. FIG. 37(a) depicts an embodiment of a magnetic device that includes a magnetic structure having a patterned layer forming a micromechanical beam suspended from a substrate. FIG. 37(b) depicts another embodiment of the magnetic device, but where the patterned layer may form only a portion of the micromechanical device. FIG. 37(c) depicts another embodiment of a magnetic device similar to the embodiment shown in FIG. 37(a).

[0049] Figure 38(a) - 38(b) is a top view showing an embodiment of a magnetic structure that includes at least a portion of a plurality of micromechanical structures. FIG. 38(a) is a top view showing an embodiment of a magnetic structure that includes a plurality of micromechanical structures. FIG. 38(b) is a top view showing another embodiment of a magnetic structure that includes a plurality of micromechanical structures.

[0050] Figure 39(a) - 39(b) are respectively a top view and a side view of an embodiment of a magnetic structure that includes at least a portion of a micromechanical structure.

[0051] Figure 40It is a top view showing an embodiment of a magnetic structure depicting at least a part of a plurality of micro-mechanical structures.

[0052] Figure 41(a) - 41(b) It is a cross-sectional side view of an embodiment of a magnetic structure including at least a part of a micro-mechanical structure. Figure 41(a) is a cross-sectional side view of an embodiment of a magnetic structure including at least a part of a micro-mechanical structure. Figure 41(b) is a cross-sectional side view of another embodiment of a magnetic structure including at least a part of a micro-mechanical structure.

[0053] Figure 42(a) - 42(c) It is a cross-sectional side view of an embodiment of a magnetic structure formed on a micro-mechanical structure. Figure 42(a) is a cross-sectional side view of an embodiment in which a patterned layer partially fills a recess. Figure 42(b) is a cross-sectional side view of an embodiment in which a patterned layer completely fills a recess. Figure 42(c) is a cross-sectional side view of an embodiment in which a patterned layer overflows a recess.

[0054] Figure 43(a) - 43(b) They are respectively a top view and a bottom view of an embodiment of a magnetic structure formed on a micro-mechanical structure.

[0055] Figure 44(a) - 44(c) It is a cross-sectional side view of an embodiment of a magnetic structure formed on a micro-mechanical structure. Figure 44(a) is a cross-sectional view of a magnetic structure on a rotatable platform in a stationary state. Figure 44(b) is a cross-sectional side view of a magnetic structure rotatably rotating about a first axis. Figure 44(c) is a cross-sectional side view of a magnetic structure on a rotatable platform rotating about a second axis.

[0056] Figure 45 It is a schematic diagram showing an embodiment of a magnetic device as an encapsulated magnetic device.

[0057] Figure 46 It is a cross-sectional side view depicting an embodiment of an encapsulated magnetic device.

[0058] Figure 47(a) - 47(c) It is a cross-sectional side view describing an embodiment of an encapsulated magnetic device. Figure 47(a) shows a cross-sectional view of another embodiment of an encapsulated magnetic device. Figure 47(b) depicts a cross-sectional view of an embodiment similar to the encapsulated magnetic device shown in Figure 47(a). Figure 47(c) depicts a cross-sectional view of an embodiment similar to the encapsulated magnetic device shown in Figure 47(a).

[0059] Figure 48 It is a schematic diagram showing an embodiment of a magnetic device as a magnetic module.

[0060] Figure 49(a) - 49(d)are a perspective view and a cross-sectional side view depicting an embodiment of a magnetic module. FIG. FIG. 49(a) shows a perspective view of an embodiment of the module. FIG. 49(b) shows a cross-sectional side view of the module shown in FIG. 49(a). Figure 49(c) and 49(d) show a cross-sectional side view of an embodiment of a magnetic module similar to that shown in FIGS. 49(a) and 49(b).

[0061] Figure 50(a) - 50(b) are an exploded perspective view and a side view of a magnetic structure aligned with holes in a plurality of substrates, respectively.

[0062] Figure 51(a) - 51(d) are a perspective view and a cross-sectional side view depicting an embodiment of a magnetic module that includes a magnetic structure aligned with holes in a plurality of substrates. The magnetic structure can also be physically aligned with one or more holes in the module. Figure 51(a) and 51(b) show a perspective view and a cross-sectional side view of an embodiment of a magnetic module, respectively. FIG. 51(c) is a cross-sectional side view of another embodiment of a magnetic module describing an embodiment similar to that shown in FIG. 51(b). FIG. 51(d) is a perspective view of another embodiment of a magnetic module identical to the embodiment shown in Figure 51(a) and 51(b) shown.

[0063] Figure 52(a) - 52(c) are a cross-sectional side view depicting an embodiment of a magnetic structure formed around a fluid channel, and a cross-sectional side view of a magnetic device including a magnetic structure formed around a fluid channel. In FIG. 52(a), the patterned layer can include a hard magnetic material that generates a permanent magnetic field. FIG. 52(b) is a cross-sectional side view of another embodiment of a portion of a magnetic device including a microfluidic channel and a magnetic structure and a conductive coil as shown in FIG. 52(a). FIG. 52(c) depicts an embodiment of a magnetic device including a microfluidic and magnetic structure as shown in Figure 52(a) and 52(b) shown, as one or more layers in a multilayer structure.

[0064] Figure 53 is a schematic view depicting an embodiment of a magnetic device as a magnetic system or as part of a magnetic system.

[0065] Figure 54(a) - 54(b) are an exploded perspective view and a non-exploded perspective view describing an embodiment of a magnetic structure, respectively.

[0066] Figure 55(a) - 55(b) are an exploded perspective view and a non-exploded perspective view depicting an embodiment of a magnetic structure, respectively.

[0067] Figure 56It is a circuit schematic diagram depicting an embodiment of a magnetic structure and a circuit for receiving and processing signals from the magnetic structure.

[0068] Figure 57 It is a circuit schematic diagram depicting an embodiment of a magnetic structure and a circuit for generating an electrical signal to the magnetic structure.

[0069] Figure 58 It is a circuit schematic diagram depicting an embodiment of a circuit for generating an electrical signal and providing it to a conductive coil.

[0070] Figure 59 It is a circuit schematic diagram depicting an embodiment of a magnetic structure and a circuit for transmitting a signal based on an electrical signal from the magnetic structure.

[0071] Figure 60 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and an amplifier circuit to provide an output representing a magnetic field sensed by the magnetic sensor.

[0072] Figure 61 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and an amplifier circuit to provide an output representing a magnetic field sensed by the magnetic sensor.

[0073] Figure 62 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and an amplifier circuit to provide an output representing a magnetic field sensed by the magnetic sensor.

[0074] Figure 63 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and an amplifier circuit to provide an output representing a magnetic field sensed by the magnetic sensor.

[0075] Figure 64 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and an amplifier circuit to provide an output representing a magnetic field sensed by the magnetic sensor.

[0076] Figure 65 It is a circuit schematic diagram depicting an embodiment of a magnetic sensor and a driver circuit that can be used to drive the magnetic sensor. Detailed Description

[0077] Embodiments of magnetic devices can incorporate magnetic structures in an improved manner to provide one or more improvements in device area utilization, manufacturability, reliability, performance, or cost. Magnetic devices can include magnetic structures, other device structures, and associated circuits.

[0078] The magnetic structure can interact magnetically with the environment of the magnetic device. The magnetic structure can include a layer of material having a selected magnetism, such as generating a magnetic field or responding to a magnetic field. The layer can be patterned to provide one or more individual layer portions having a selected shape and can be combined with other layers to provide the selected magnetism. The magnetic structure can provide functions such as magnetic sensing, flux channels, flux concentration, magnetic shielding, magnetically actuated motion, etc.

[0079] The device structure can be another structure of the device that is physically connected to the magnetic structure or arranged relative to the magnetic structure in a predetermined manner to, for example, structurally support such that the magnetic structure can be operated or more advantageously integrated into the magnetic device. The device structure can include, for example, a substrate, layers on the substrate, recesses or holes in the substrate, or a cover on the substrate, etc. The device structure can also optionally be a magnetic device that interacts with the magnetic structure and / or the environment. For example, the device structure can include a conductive coil to generate a magnetic field. The device structure can also include packaging and module elements.

[0080] The associated circuit can be electrically connected to one or both of the magnetic structure and other device structures to provide functions such as receiving, providing, conditioning, or processing signals of the magnetic device. The circuit can include one or more of an amplifier circuit, an analog-to-digital converter, a digital-to-analog converter, a driver circuit, a processor, a controller, etc. The circuit can be integrated with the magnetic structure on the same substrate or disposed on another substrate. The circuit can also be provided as a separate component in a device such as a packaged device or module.

[0081] Figure 1 An embodiment of a magnetic device 20 is depicted that incorporates a magnetic structure 24 in an improved manner to provide one or more of improved device area utilization, manufacturability, reliability, performance, or cost. The magnetic device 20 can include a magnetic structure 24, another device structure 28, and an associated circuit 32. The magnetic structure 24 can interact magnetically with the environment of the magnetic device 20. The device structure 28 can be another structure 20 of the device that is physically connected to the magnetic structure 24 or arranged relative to the magnetic structure 24 in a predetermined manner. The device structure 28 can also optionally interact with the environment 29 of the magnetic device 20. The associated circuit 32 can be electrically connected 27, 31 to one or both of the magnetic structure 24 and other device structures 28 to provide one or more functions, such as providing, receiving, conditioning, or processing signals. The circuit 32 can also be electrically connected 33 outside the magnetic device to receive or provide data to or from the magnetic device.

[0082] The magnetic structure can include a layer of material having a selected magnetism, such as generating a magnetic field or generating a response to a magnetic field.

[0083] For example, a material can generate a temporary or permanent magnetic field. Materials that generate a temporary magnetic field can be referred to as soft magnetic materials, and materials that generate a permanent magnetic field can be referred to as hard magnetic materials. Soft magnetic materials can include, for example, ferromagnetic materials, ferrimagnetic materials, etc. Ferromagnetic materials can include, for example, iron, nickel, cobalt, gadolinium, etc. Ferromagnetic materials can include, for example, manganese, copper, nickel, iron, etc. Hard magnetic materials can include Alnico, SmCo, NdFeB, etc.

[0084] The material can have a selected magnetic permeability to a magnetic field, such as a magnetic permeability higher than a predetermined threshold. Magnetic materials having a selected magnetic permeability to a magnetic field (such as a magnetic permeability higher than a predetermined threshold) can include soft magnetic materials, etc.

[0085] The material can generate a response to a magnetic field by having electrical properties that vary as a function of the magnetic field experienced by the material. Such materials can include magnetoresistive materials having a resistance that varies as a function of a magnetic field. Magnetoresistive materials can include, for example, anisotropic magnetoresistive materials, giant magnetoresistive materials, etc. Anisotropic magnetoresistive materials can include, for example, nickel iron, etc. Giant magnetoresistive materials can include, for example, manganese perovskite oxides, etc. One or more layers of magnetoresistive materials can also be arranged with one or more layers of other materials to form a composite magnetoresistive structure. Such composite magnetoresistive structures can include, such as giant magnetoresistive structures, tunneling magnetoresistive structures, etc.

[0086] The magnetic structure of any embodiment of the magnetic devices discussed herein can include a material having any of the magnetic properties discussed herein, such as generating a magnetic field or responding to a magnetic field as discussed herein, as well as other properties. In some embodiments, the magnetic device can provide a selected function by specifically utilizing materials having certain selected magnetic properties.

[0087] The material layer can be patterned to impart a perimeter, boundary, or shape to the layer to provide a specific magnetism of the magnetic structure. Specific magnetic properties can include the ability to generate or respond to a magnetic field along a specific spatial direction or orientation.

[0088] Figure 2(a) - 2(k) A top view of a layer patterned to provide a selected perimeter, boundary, or shape is depicted. Figure 2(a) - 2(c) Embodiments of patterned layers having cross-shaped, circular, and square or rectangular shapes 40, 44, 48, respectively, are depicted. Figure 2(d) - 2(e) Embodiments of patterned layers having a plurality of separated rectangles, squares, or linear portions 52, 56 arranged in a pattern or array are depicted, such as having a subset of portions arranged facing each other, as shown in FIG. 2(d), or in an array having a characteristic spacing therebetween, as shown in FIG. 2(e). Figure 2(f) - 2(g)Embodiments of patterned layers having multiple separate portions forming concentric rings 60, as shown in FIG. 2(f), or having center-aligned rectangular or square strips 64, as shown in FIG. 2(g), are depicted. Figure 2(g) - 2(h) An embodiment of a patterned layer having a plurality of individual arcuate segments 68 arranged to outline a loop, as shown in FIG2(g), or a plurality of L-shaped or T-shaped segments 72 arranged to outline a square or rectangle, as shown in FIG2(h) is depicted. FIG2(j) depicts an embodiment of a patterned layer having a plurality of linear portions 76 connected together to form a single integral segment that follows a forward and backward path. FIG2(k) shows an embodiment of a patterned layer having a spiral shape 80.

[0089] Further embodiments of the patterned layer may include other arrangements of one or more layer portions. The patterned material layer may include Figure 2(a) - 2(k) An arrangement of a plurality of any of the exemplary shapes depicted in or other shapes. For example, the patterned layer may include a plurality of shapes arranged in a one-dimensional or two-dimensional array with characteristic periodic spacing between instances of the shapes in one or two dimensions. Additional embodiments may include only: Figure 2(f) - 2(g) A single ring or strip in the shape of Figure 2(h) - 2(i) One or more arcuate, T-shaped or L-shaped sections; or similar Figure 2(e) and 2(j) Multiple linear segments or other segments of are connected to follow different paths.

[0090] The patterned material layer may also have selected height characteristics perpendicular to the plane in which the perimeter, boundary or shape of the layer is defined. The selected height characteristics may provide specific magnetic properties of the magnetic structure, such as the ability to generate or respond to a magnetic field along a specific spatial direction or orientation.

[0091] Figure 3(a) - 3(c) A cross-sectional side view of an embodiment of a patterned layer having selected height features perpendicular to a plane in which a perimeter, boundary, or shape of the layer is defined is shown. The depicted cross section may represent a slice of the patterned layer taken along an axis parallel to the plane in which a perimeter, boundary, or shape of the layer is defined, such as along Figure 2(c) and 2(e) Depicted along axis AA or BB, or along Figure 2(a) - 2(k) Figure 3(a) depicts an embodiment of a patterned layer having a substantially constant height 81 in a direction perpendicular to the plane defining the shape of the layer along an axis 82 parallel to the plane defining the shape. The substantially constant height can provide substantially constant magnetic properties of the patterned layer along the axis.

[0092] Figure 3(b) - 3(c)Depicts an embodiment of a patterned layer whose height in a direction perpendicular to the plane defining the shape of the layer varies along an axis parallel to the plane defining the shape. In FIG. 3(b), the patterned layer can have a height varying from substantially zero to a predetermined height 83, and in FIG. 3(c), the patterned layer can have a height varying from a first predetermined height 86 to a second predetermined height 87 different from the first predetermined height. The height of the patterned layer can also vary according to a selected function of the distance along axes 85, 89. In Figure 3(b) - 3(c) , the height can vary as a linear function of the distance along axes 85, 89. In other embodiments, the height can vary according to other functions of the distance along axes 85, 89, such as a non-linear function, a step function, etc. The varying height can provide correspondingly varying magnetic properties of the patterned layer along the axis. For example, embodiments with varying height can be used to generate or respond to a magnetic field along the axis to provide position detection or current sensing of an object along the axis.

[0093] The patterned material layer can be formed integrally with one or more other layers to form a composite layer. Figure 4(a) - 4(b) Perspective and cross-sectional side views of an embodiment of a patterned material layer formed integrally with another material layer are shown, respectively. The patterned material layer can include a plurality of discrete portions 84 embedded in another material 88 such that the other material 88 occupies the space between the discrete portions 84 of the magnetic layer. The patterned material layer can optionally include a first set of surfaces 92 exposed at the first surface or boundary of the composite layer and a second set of surfaces 96 covered by the other material 88 within the composite layer. The other layer of material 88 can be a material with a selected magnetic property or another type of material.

[0094] The composite layer can provide specific magnetic, electrical, or structural properties. In embodiments where the second material 88 is also a material with a selected magnetic property, the second material 88 can alter (e.g., increase, decrease, or otherwise set) the magnetic properties of the patterned material layer 84 to provide a composite layer with specific magnetic properties. In embodiments where the second material 88 is another type of material, the second material 88 can also alter the magnetic properties of the patterned material layer 84 to provide specific magnetic properties of the composite layer, or alternatively can provide structural or electrical property composite layers.

[0095] The embedded portions of the patterned layer can also have a selected cross-sectional area. In Figure 4(a) - 4(b) , the embedded portions can have a circular or semi-circular cross-sectional area. In other embodiments, the embedded portions can have other cross-sectional areas, such as one or more of a square, rectangular, or trapezoidal cross-sectional area, etc.

[0096] The cross-sectional area of the embedded portion can also have a selected constancy along the axis. In FIGS. 4(a)-4(b), the embedded portion can have a substantially constant cross-sectional area along the longitudinal axis 94 and be partially aligned with the longitudinal axis 94. FIG. 4(c) shows a cross-sectional top view of another embodiment of the composite layer, where the embedded portion can have a cross-sectional area with a width 95 that varies in a predetermined manner, such as linearly, along the longitudinal axis 97. FIG. 4(d) shows a cross-sectional side view of another embodiment of the composite layer, where the embedded portion can have a cross-sectional area with a height 99 that varies in a predetermined manner, such as linearly, along the longitudinal axis 101.

[0097] The material layer having the selected magnetism can include a surface with a selected topography. The selected topography can provide specific magnetic, electrical, or structural properties to the layer. FIG. 5(a) shows a cross-sectional view of a material layer 102 having a top surface 100 with a plurality of protrusions 104 and recesses 108. The plurality of protrusions 104 can be formed as an array with a characteristic periodic spacing therebetween, and can be a plurality of recesses 108. The protrusions 104 and recesses 108 can be staggered with each other. The material layer having the selected topography can also be formed integrally with one or more additional layers to form a composite layer, as described above. Figure 5(b) - 5(d) A cross-sectional view showing a patterned material layer having a selected topography formed integrally with another material layer. In FIG. 5(b), the protrusions 104 of the patterned layer 102 can include portions 116 that are exposed above the top surface 120 of the second material layer 118. In FIG. 5(c), the protrusions 104 of the patterned layer 102 and the top surface 128 of the second material layer 124 can be located at substantially the same level. In FIG. 5(d), the second material layer 132 can completely surround the protrusions 104 of the patterned layer.

[0098] The material layer having the selected magnetism can include a plurality of individual portions having magnetic polarities arranged according to a selected configuration to provide specific magnetism. Figure 6(a) - 6(d) A top view depicting an embodiment of a patterned layer including a plurality of separated portions with aligned magnetic polarities. FIG. 6(a) depicts an embodiment of a patterned layer including a plurality of individual portions 136 arranged in a two-dimensional array, each individual portion 136 having a magnetic pole axis aligned in the same direction. Figure 6(b) - 6(c)Illustrates an embodiment of a patterned layer that includes a first plurality of discrete portions 140, 148 arranged in an array, each having a magnetic pole axis aligned in the same first direction, and a second plurality of discrete portions 144, 152 also arranged in an array, each magnetic pole having a magnetic pole axis aligned in the same second direction, the first and second directions being perpendicular to each other. FIG. 6(d) illustrates an embodiment of a patterned layer that includes a first and a second plurality of discrete portions 156, 160 having magnetic pole axes aligned in first and second perpendicular directions, respectively, and a third and a fourth discrete portions 164, 168 having magnetic pole axes aligned in third and fourth perpendicular directions, respectively.

[0099] The magnetic structure of any embodiment of the magnetic devices discussed herein can include a patterned layer having any of the properties of the patterned layers discussed herein, such as any of the properties of the patterned layers discussed with respect to any one of FIGS. 2-6 and their various subfigures (i.e., (a), (b), etc.) and other properties.

[0100] The magnetic structure can be incorporated into the magnetic device in a predetermined manner, at least in part, by its physical connection or arrangement relative to another structure of the magnetic device, to structurally support, enable operation, or otherwise integrate into the magnetic structure of the magnetic device.

[0101] The magnetic structure can be connected to or arranged relative to the structure of a substrate. Figure 7 Illustrates an embodiment of a magnetic device 161 as a substrate-based magnetic device having a magnetic structure connected to or arranged relative to the structure of a substrate. The magnetic device 161 can include one or more substrates 167, a magnetic structure 163, and associated circuitry 169.

[0102] The substrate can include one or more substrate structures 165, such as one or more of a surface, a recess, a side, etc. The magnetic structure can be physically connected to or arranged relative to the one or more substrate structures in a predetermined manner.

[0103] The magnetic device can also optionally include one or more other structures 171, such as coils, caps, microelectromechanical structures, antennas, etc. The magnetic structure can be physically connected to or arranged relative to the other structures in a predetermined manner.

[0104] The circuitry can be electrically connected to one or both of the magnetic structure and other device structures to provide, receive, condition, or process signals of the magnetic structure or other device structures. The circuitry can also provide or receive electrical signals external to the magnetic device in order to receive one or more of data for controlling components of the magnetic device, in order to provide a magnetic field to set or change the magnetic field in the magnetic structure, or to transmit data from components of the magnetic device in order to transmit data based on electrical signals generated by the magnetic structure.

[0105] The substrate may include semiconductors. For example, the substrate may be a semiconductor substrate such as those used for manufacturing integrated circuits. In some such embodiments, the magnetic device may be part of an integrated circuit. Alternatively or additionally, the substrate may include other types of materials, such as one or more of insulators, glass, ceramics, etc. For example, the substrate may include an insulator, such as for manufacturing silicon-on-insulator circuits, glass such as for manufacturing displays and other devices, or ceramics for manufacturing hybrid circuits.

[0106] The magnetic device may include a single substrate on or around which a magnetic structure and circuitry are formed. For example, in one embodiment, the magnetic device may be a single integrated circuit that includes a magnetic structure and associated circuitry. Alternatively, the magnetic device may include more than one substrate. For example, the magnetic device may include a first substrate 167a on or around which a magnetic structure is formed and a second substrate 167b on or around which circuitry is formed.

[0107] Any embodiment of the magnetic device discussed herein may include one or more substrates according to any embodiment of the substrate discussed herein.

[0108] The magnetic structure may include a patterned material layer having a selected magnetism formed on the substrate in a predetermined manner relative to other circuitry that may be formed on the substrate. In an embodiment, the patterned layer may be formed on one or more regions of the substrate that do not have active circuitry. Figure 8(a) - 8(b) An embodiment of a magnetic device depicting the first stage of a method of manufacturing a magnetic device, after providing substrates 172, 174, which include one or more regions 176, 178, or more regions 180, 182, for which active circuitry is planned. The active circuitry may include active integrated circuit devices such as transistors. One or more regions 176, 178 that do not have active circuitry may have the same shape as or contain the shape of the patterned material layer. Substrates 172, 174 may be processed to produce one or more regions 176, 178 that do not have active circuitry, for example by removing layers on top of the substrate or otherwise conditioning the region to more effectively receive the patterned material layer. FIGS. 8(c)-8(d) illustrate an embodiment of a magnetic device in the second stage of a manufacturing method, in which patterned material layers 186, 188 have been formed on Figure 8(a) - 8(b) the substrate in one or more regions that do not have active circuitry. Layers 186, 188 may assume various shapes as described above. Layers 186, 188 may be formed in the regions that do not have active circuitry at separate times as active circuitry, in separate processing apparatuses or both, to prevent or reduce cross-contamination of the magnetic material with the materials of the active circuitry.

[0109] In other embodiments, the patterned layer may be formed in the same area on the substrate as the active circuit. For example, the patterned layer may be formed as a layer above or below one or more layers including the active circuit formed on the substrate.

[0110] The patterned layer may also be formed on the back surface of the substrate. The back surface of the substrate may not include the active circuit. The patterned layer may be formed simultaneously on the back surface of the substrate wafer for multiple integrated circuits or other substrate devices. FIG. 9(a) depicts an embodiment of a bottom view of a semiconductor wafer 192 from which multiple integrated circuits or other substrate devices may be ultimately separated after processing. FIG. 9(b) depicts an embodiment of a bottom view of the wafer of FIG. 9(a), showing a manufacturing stage after a layer 196 of material having a selected magnetic property has been formed on substantially the entire back surface of the wafer. FIG. 9(c) depicts Figure 9(a) - 9(b) an embodiment of a bottom view of the wafer at a further stage of manufacture, after the layer has been patterned to form a patterned layer shape 200 on the back surface of the wafer, and each wafer of the multiple integrated circuits or other substrate devices may be separated.

[0111] The magnetic structure may be formed as a separate structure that can be attached to the substrate. FIG. 10(a) depicts an embodiment of a patterned layer 204 formed as a separate structure. The separate structure may be formed as a separate structure by one or more of stamping, casting, electroplating, rolling, or depositing a magnetic layer, etc. The layer may also be formed as a separate structure on a corresponding substrate. FIG. 10(b) depicts an embodiment of a patterned layer 208 formed on a corresponding substrate 212 as a separate structure. The substrate 212 may have the same or corresponding boundaries or shape as the layer 208. The substrate 212 may also provide structural support for the layer 208 and facilitate the manufacture of the layer 208.

[0112] The magnetic device may include a separate magnetic structure attached to a substrate. Figure 11 FIG. depicts an embodiment of a magnetic device that may include a separate magnetic structure attached to a substrate 216.

[0113] The magnetic structure may also be physically connected to or arranged relative to other device structures. In an embodiment, the other device structure may be a conductive coil. The magnetic structure may be positioned relative to the conductive coil in a predetermined manner to provide one or more of magnetic, electrical, or structural interactions between the magnetic structure and the conductive coil. For example, the conductive coil may be operated to provide a magnetic field to set or change the magnetic field in the magnetic structure. The conductive coil may also be used as a transmitter to transmit data based on an electrical signal generated by the magnetic structure, such as transmitting data representing a magnetic field or current sensed by the magnetic structure.

[0114] Figure 12A top view depicting an embodiment of a magnetic structure 220 and a conductive coil 224 is shown. The magnetic structure 220 can be positioned relative to a portion 228 of the conductive coil 224 in a predetermined manner. For example, the magnetic structure 220 can be located above or below a portion 228 of the conductive coil 224. The portion 228 of the conductive coil 224 can include a plurality of conductive segments 232 where current flows in substantially the same direction. The conductive coil 224 can include a layer of conductive material (such as metal) formed in a pattern such as a spiral or other wound pattern to create a portion having a plurality of conductive segments where current flows in substantially the same direction.

[0115] A magnetic device can include a magnetic structure and a conductive coil incorporated on the same side of a substrate such as a semiconductor or other substrate. Figure 13 An embodiment of a magnetic device is depicted, which can include a magnetic structure 220 and a conductive coil 224 formed on a first side of a substrate 236.

[0116] The magnetic structure and the conductive coil can also be incorporated into different regions or sides of the substrate. FIGS. 6 and 14(a)-14(c) show another embodiment of a magnetic device in which a magnetic structure 240 and a conductive coil 244 are incorporated on opposite sides of a substrate 248. FIG. 14(a) shows a top view of the magnetic device, showing the conductive coil 244 formed as a layer on the first side of the substrate 248. FIG. 14(c) shows a bottom view of the magnetic device, showing the magnetic structure 240 formed as a patterned layer on the second side of the substrate 248. FIG. 14(b) depicts a side cross-sectional view of the magnetic device, showing the conductive coil 244 as a layer on the first side of the substrate 248 and the magnetic layer 240 on the second side of the substrate 248. The substrate 248 can optionally also include a region including an active circuit 252, such as on the first side or the second side of the substrate. In FIG. 14(c), the region including the active circuit 252 can include a region separated from the region including the magnetic layer 240 on the second side of the substrate 248.

[0117] The conductive coil can optionally be formed as multiple layers. FIG. 14(d) shows a side cross-sectional view of another embodiment of a magnetic device similar to FIGS. 14(a)-14(c), but showing the conductive coil 256 formed as multiple layers extending from the first side of the substrate 260 to the second side of the substrate 260.

[0118] Embodiments in which the magnetic structure is located above or below a portion of the conductive coil (such as, for example Figure 12 FIGS. 3 and 14(a)-14(d)) can be used to provide a magnetic field for operations to set or change the magnetic field in the magnetic structure. Embodiments in which the magnetic structure can be located in different regions or on different sides of the substrate and the conductive coil (such as, for example Figure 14(a) - 14(d)And 34 (discussed below)) can be used to operate a conductive coil as a transmitter that transmits data based on an electrical signal generated by a magnetic structure. Alternatively, the magnetic device can include structures and / or circuits other than the conductive coil to operate as a transmitter to convey data based on an electrical signal generated by the magnetic structure, such as an antenna, a transmitter circuit, and so on.

[0119] The magnetic device can incorporate the magnetic structure in a predetermined manner such that it is physically aligned with an aperture in a device structure such as a substrate structure or other device structure. Figure 15 An embodiment of a magnetic device depicting a patterned layer 264 formed on a substrate 268 is shown. Each of the patterned layer 264 and the substrate 268 can include extending from the top surface to the bottom of the layer 264 or the substrate 268. Additionally, the patterned layer 264 can be positioned relative to the substrate 268 such that the holes 272 in the patterned layer 264 are aligned with the holes 274 in the substrate 268. The holes 272, 274 can create a travel path for another component or device to pass through the holes 272, 274 from one side of the magnetic device to the other side.

[0120] The alignment of the magnetic structure and the holes in another device structure can be achieved as a result of the manufacturing process for the magnetic device. Figure 16(a) - 16(c) Embodiments of the magnetic device at various stages of a method of manufacturing a magnetic device are depicted. Fig. 16(a) shows a cross-sectional side view of an embodiment of the magnetic device at the first stage of the method after providing the substrate 268. Fig. 16(b) depicts a cross-sectional side view of the magnetic device at the second stage of the method after the patterned layer 264 is formed on the substrate 268. The patterned layer 264 can be formed in different ways, such as by one or more depositions, electroplating, or growth, etc. Fig. 16(c) shows a cross-sectional side view of an embodiment of the magnetic device at the third stage of the method after the holes 272, 274 are formed through the patterned layer 264 and the substrate 268. The holes 272, 274 can be formed in the patterned layer 264 and the substrate 268 by the same process, such as by etching, drilling, or otherwise removing material to form one or more holes. Forming the holes 272, 274 through the patterned layer 264 and the substrate 268 using the same process can provide an efficient method of forming the holes 272, 274 and an accurate alignment of the holes 272, 274 in the patterned layer 264 and the substrate 268.

[0121] The magnetic device may also include one or more magnetic structures arranged relative to each other to provide selected magnetic and other functions. In an embodiment, the magnetic device may include one or more magnetic structures arranged to provide a magnetic flux concentrator to selectively direct or concentrate magnetic flux. Such a magnetic structure may include one or more patterned layers having a plurality of individual portions of materials with different distributions, the materials having selected magnetic properties to selectively direct or concentrate magnetic flux. For example, the magnetic structure may include one or more patterned layers to transfer or concentrate magnetic flux from a first flux concentration at a first flux surface to a second flux density different from the first flux density at a second flux surface, the second flux surface having a different distribution or area than the first flux surface.

[0122] FIG. 17(a) shows a top view of an embodiment of a magnetic device configured to provide a magnetic flux concentrator, and FIG. 17(b) shows a cross-sectional side view of an embodiment of the magnetic device taken along the axis in FIG. 17(a). The magnetic device may include a magnetic flux concentrator 278, a magnetic sensor 282, and a substrate 286. The magnetic flux concentrator 278 may include a plurality of patterned layers having one or more of different distributions of materials having selected magnetic properties along a selected dimension, or different flux surface areas. The first patterned layer 290 may include an outer concentric ring, and the second patterned layer 294 may include an inner concentric ring. The outer concentric ring may be formed on the substrate 286 to a first height, and the inner concentric ring may be formed on the substrate 286 to a second height less than the first height. As a result, the outer concentric ring may have a different material distribution in the vertical direction and have a different flux surface area than the inner concentric ring. The material of the patterned layers of the magnetic flux concentrator may be a material having a relatively high magnetic permeability to a magnetic field, such as a magnetic permeability above a predetermined threshold.

[0123] The magnetic sensor 282 may also include a magnetic structure including a patterned material layer 298. The patterned material layer 298 of the magnetic sensor 282 may be formed on the substrate 286 at a position between the first and second patterned layers 290, 294. The magnetic sensor 282 may also include electrical interconnections and other components as described below. The material of the magnetic sensor may be a magnetoresistive material.

[0124] In operation, Figure 17(a) - 17(b)The flux concentrator can direct and / or concentrate the magnetic flux in the environment of the magnetic device in a predetermined manner such that the magnetic flux passes through the magnetic sensor 282 along a selected direction and a selected concentration is achieved. FIG. 17(b) shows an exemplary path of the magnetic flux 302 in the space surrounding and passing through the magnetic device. Above and below the magnetic device, the magnetic flux can be oriented substantially in the vertical direction. When the magnetic flux passes through the flux concentrator 278, due to the relative arrangement of the patterned layers 290, 294, the magnetic flux can deviate along the depicted path, which can provide a preferred path for the magnetic flux based on magnetic properties. This can cause the magnetic flux to bend such that when it passes through the magnetic sensor 282, it takes a substantially or at least more horizontal path. The channeling and / or concentration of the magnetic flux along the selected direction can provide a number of advantages, including one or more being that the magnetic sensor 282 can be configured to have an operating sensitivity to a magnetic field along the horizontal direction rather than the vertical direction, which is advantageous for manufacturing the sensor 282 and enables the sensing of both vertical and horizontal magnetic fields.

[0125] Embodiments of magnetic devices for providing a flux concentrator can include a magnetic structure having a patterned layer including other shapes. Similar to Figure 17(a) - 17(b) magnetic devices can include a flux concentrator and a magnetic sensor, each having a respective patterned layer, including Figure 2(a) - 2(k) any of the shapes depicted in. For example, the flux concentrator can include cooperating layers having first and second aligned rectangles, as shown in FIG. 2(g), similar to Figure 2(h) and 2(i) segmented concentric rings or aligned squares, etc.

[0126] Embodiments of magnetic devices for providing a flux concentrator can also include a magnetic structure having a patterned layer including varying heights. Similar to Figure 17(a) - 17(b) magnetic devices can include one or more of the flux concentrator or magnetic sensors in FIGS. 17(a)-(b), such as those described in FIGS. 3(b)-3(c). For example, the flux concentrator can include a patterned layer having an outer portion with a height that varies between a first height at a first location (such as the outermost location of the outer portion) and a second height less than the first height at a second location (such as the innermost location of the outer). Similarly, the magnetic sensor can also include a patterned layer having a height that varies between a first height at a first location and a second height different from the first height at a second location.

[0127] Magnetic devices can provide other embodiments of flux concentrators to selectively direct or concentrate the magnetic flux along different paths. Figure 18(a) - 18(b)Top and side cross-sectional views depicting an embodiment of a magnetic device including a magnetic structure that provides another magnetic flux concentrator 306. The magnetic device may include a first magnetic structure and a second magnetic structure, a substrate 310, or a layer on the substrate. The first magnetic structure may include a first patterned material layer 314 that includes one or more individual segments that provide a magnetic flux concentrator 306 to concentrate or direct magnetic flux for the second magnetic structure. The second magnetic structure may provide a magnetic sensor 318. The material of the magnetic flux concentrator may be a material having a relatively high magnetic permeability with respect to a magnetic field, such as a magnetic permeability above a predetermined threshold, and the material of the magnetic sensor may be a magnetoresistive material.

[0128] The first patterned layer 314 may provide a magnetic flux channel or concentration by providing a reduced surface area for magnetic flux travel. For example, the first patterned layer may include segments 322 that direct or concentrate magnetic flux that is initially concentrated at a first flux concentration at a flux inlet region 326 to a second flux concentration that is greater than the first flux concentration at a flux outlet region 332 that is smaller than the flux inlet region 326. The first patterned layer may also include segments 336 that direct or concentrate magnetic flux from a flux inlet region 340 to a fourth flux concentration that is smaller than a third flux density at a flux outlet region 344 that is greater than the flux at the flux outlet region 344.

[0129] In other embodiments, the magnetic device may provide additional configurations of magnetic flux concentrators. For example, the magnetic device may include magnetic structures similar to those discussed above with respect to Figure 17(a) - 17(b) or FIGS. 18(a)-18(b), but arranged to direct or concentrate magnetic flux as the magnetic flux travels in various different selected directions, such as one or more that are concentrated in a single direction, such as a vertical direction, a horizontal direction, or another direction; or when it changes direction from a first direction to a second direction (e.g., a change in direction from a horizontal to a vertical direction, from a vertical to a horizontal direction, or from any first predetermined direction to any second different predetermined direction).

[0130] In the above and other embodiments, the magnetic device may include a magnetic structure arranged to operate as a magnetic sensor. The magnetic sensor may include a plurality of resistors electrically interconnected between one or more predetermined voltages and one or more output terminals, for example, in a bridge configuration. At least one resistor may be a magnetoresistor formed from a patterned layer of a magnetoresistive material. The magnetoresistor may be a variable resistor having a resistance that varies in accordance with the magnetic field to which the sensor is exposed. The electrical structure of the sensor may provide an output voltage at the output terminal as a function of the variable resistor.

[0131] Figure 19It is a schematic diagram depicting an electrical representation of an embodiment of a magnetic sensor. The magnetic sensor may include two pairs of resistors R1, R2, R3, R4 arranged in a bridge configuration between a power supply voltage VS and ground, where the first and second output terminals are located in the middle of two branches of the bridge. One or more resistors, such as one resistor R2 in the upper half of one branch of the bridge and another resistor R3 in the lower half of the other branch, may be magnetoresistors. In operation, due to the change in the resistance values of the variable resistors R2, R3 as a function of the magnetic field experienced by the sensor, the bridge may become unbalanced and provide a corresponding output voltage VO between the output terminals.

[0132] An embodiment of a magnetic structure arranged to operate as a magnetic sensor may include one or more standard resistors formed of a resistive material, such as a polysilicon layer or a diffused region formed in a substrate, and one or more magnetoresistors formed of a patterned layer of magnetoresistive material.

[0133] Alternatively, an embodiment of a magnetic structure arranged to operate as a magnetic sensor may include one or more standard resistors formed of a patterned layer of magnetoresistive material and a patterned layer of magnetic shielding material, and one or more magnetoresistors formed of a patterned layer of magnetoresistive material.

[0134] Figure 20(a) - 20(f) An embodiment of a magnetic structure configured to provide a magnetic sensor such as Figure 19 is depicted. FIG. 20(a) shows a cross-sectional side view of a magnetic structure that can be used to implement a magnetic sensor. The magnetic structure may include a first patterned material layer 348 formed on the first surface of a layer formed on a substrate and a second patterned material layer 352 formed on the second surface of a second layer formed on the substrate. The first surface and the second surface may be shown perpendicular to each other.

[0135] The first patterned layer 348 may be used to implement the resistors of the magnetic sensor. FIG. 20(c) depicts a cross-sectional top view of an embodiment of the magnetic sensor of FIG. 20. FIG. 20(a) shows more details of an embodiment of the first patterned layer 348. The first patterned layer 348 may include a plurality of individual segments 350, each individual segment 350 implementing a different resistor of the magnetic sensor. The first patterned magnetic layer 348 may include a first material such as a magnetoresistive material.

[0136] The second patterned layer 352 can be used as a magnetic shield to eliminate, reduce, or otherwise alter the magnetic field in the environment near selected portions of the first patterned layer 348. FIG. 20(b) depicts a cross-sectional top view of an embodiment of the magnetic sensor of FIG. 20. FIG. 20(a) shows more details of an embodiment of the second patterned layer 352. The second patterned layer 352 can also include a plurality of segments 354. Each segment 354 can correspond to one of a subset of segments. Each segment 354 can direct or focus magnetic flux to shield the corresponding segment of the first patterned layer 348 from the magnetic field. The second patterned magnetic layer 352 can include a second material having a relatively high magnetic permeability to the magnetic field, such as a magnetic permeability higher than a predetermined threshold, for example, a soft magnetic material. To provide more effective shielding for those segments of the first patterned layer, the segments of the second patterned layer can occupy a larger surface area when viewed from the top or bottom view angles of the corresponding segments of the first patterned layer.

[0137] Thus, the magnetic structure can be used to provide regular and magnetoresistors from the same patterned material layer. Although including materials such as magnetoresistive materials, a first subset of the first patterned layer 348 that is aligned with the segments of the second patterned layer 352 can provide corresponding resistors in the magnetic sensor, such as, for example, Figure 19 the first and fourth resistors R1, R4 in. Due to the magnetic shielding provided by the second patterned layer. A second subset of the segments of the first patterned layer 348 that is not aligned with the segments of the second patterned layer 352 can provide magnetoresistors that are sensitive to the magnetic field in the magnetic sensor, such as Figure 19 the second and third resistors R2, R3 in. Since it includes materials such as magnetoresistive materials and there is no magnetic shielding provided by the second patterned layer. Providing regular and magnetoresistors from the same patterned material layer can simplify the manufacture of magnetic devices by eliminating the need for a second resistive material and the corresponding additional manufacturing steps.

[0138] The different layers of patterned material can be provided in different stacking orders. FIG. 20(d) shows a cross-sectional side view of another embodiment of the magnetic sensor, which has a first patterned material layer 348 formed on the surface of a layer formed on a substrate, and a second patterned material layer 352 formed on another layer on the substrate.

[0139] The first and second patterned layers can also include different shapes and geometries, such as any of the shape configurations shown in FIGS. 2(a)-2(k), and various alignments of the first and second patterned layers relative to each other. Figure 20(e) - 20(f) Depicts similar to Figure 20(a) - 20(d)Top view of another embodiment of the first and second patterned layers 355, 357 of the magnetic sensor of the embodiment, but where the first and second patterned layers can have different shapes and geometries. In FIG. 20(f), the first patterned layer 355 can have a shape similar to that of FIG. 2(d), where a first subset of the rectangular portions is arranged in a first array in a first orientation and a second subset of the rectangular portions is arranged in a second array in a second orientation rotated 90° relative to the first orientation. In FIG. 20(e), the second patterned layer 357 can have a single shape covering the entire subset of the rectangular portions.

[0140] The magnetic sensor can include other elements, such as the conductors shown schematically in FIG. 20(c), as well as conductive stripes to enhance or select the sensitivity direction. Embodiments of the magnetic sensor can also include different electrical configurations.

[0141] The magnetic device can include a first patterned layer and a second patterned layer arranged relative to each other, similar to that shown in FIG. 20(a), but producing other selectable magnetic functions. The first patterned layer can include a material having a selected magnetism, such as a magnetoresistive material or a material that generates a temporary or permanent magnetic field. The second patterned layer can include a magnetic shielding material, such as a material having a magnetic permeability higher than a predetermined threshold for a magnetic field. Each of the first and second patterned layers can have any of the patterned layer properties discussed herein, such as any of the patterned layer shapes discussed with respect to Figure 2(a) - 2(k) any of the patterned layer shapes discussed. Additionally, one or both of the first or second patterned layers can have an inversion of such a shape, i.e., can only occupy the regions outside of these shapes. Different combinations of the first and second patterned layers can produce different selectable magnetic functions. For example, in an embodiment similar to that shown in FIG. 20(a), the first patterned layer can include a specific patterned layer shape and the second patterned layer can include a subset of substantially the same shape or scaled larger or smaller to a predetermined degree. Such an embodiment can be used to provide magnetic and other functions using the same first patterned layer. In other embodiments, the first patterned layer can include a specific patterned layer shape and the second patterned layer can include a reverse shape. Such an embodiment can be used to allow a magnetic field to reach the first patterned layer rather than other components, such as a circuit that can be adjacent to, between, or have some other spatial relationship with the first patterned layer.

[0142] The magnetic device can also include a plurality of magnetic structures stacked on top of each other on a substrate. Figure 21A side view of an embodiment of a magnetic device including a plurality of stacked magnetic structures is shown. The magnetic device may include a first magnetic structure 358 stacked on top of a second magnetic structure 362. The stacked first and second magnetic structures 358, 362 may be stacked on top of another device structure such as a substrate 366. The stacked magnetic structures 358, 362 may be separated by one or more insulating or shielding layers 370, 374. Each of the stacked magnetic structures 358, 362 may include a material layer 378, 382 having a selected magnetic property formed on substrates 386, 390.

[0143] The magnetic device may also include a magnetic structure formed in a recess in the substrate or at least partially formed in a recess in the substrate or in a recess in one or more of the layers on the substrate. FIGS. 22(a)-22(b) depict an embodiment of the magnetic device at a first stage of manufacture, after substrates 394, 398 are provided, the substrates 394, 398 including one or more recesses 402, 406 formed in the substrates 394, 398 or in one or more of them, and additional layers on the substrates 394, 398. The one or more recesses 402, 406 may be shaped to have the same shape as the magnetic layer or to enclose the shape of the magnetic layer. The substrates 394, 398 may be processed to produce the one or more recesses 402, 406 by removing material from the substrates 394, 398 or the layers on the substrates, for example, by one or more of etching, sputtering, etc. FIGS. 22(c)-22(d) show an embodiment of the magnetic device at a second stage of manufacture after patterned layers 410, 414 of a material having a selected magnetic property have been formed in the one or more recesses shown in FIGS. 22(a)-22(b). The shape of the patterned layers 410, 414 may be the same as the shape of the recesses. Alternatively, the recesses may enclose layers having different shapes or layers having multiple shapes.

[0144] The magnetic structure can also conformally coat or at least partially conformally coat one or more recesses. FIG. 23(a) depicts an embodiment of a magnetic device in a first stage of fabrication, where a plurality of recesses 415 are formed in a substrate or in one or more layers on the substrate. The plurality of recesses can be separated from each other by non-recessed surfaces 417, for example, according to a periodic spacing distance. FIG. 23(b) depicts an embodiment of a magnetic device in a second stage of fabrication, where a patterned layer 419 has been formed to conformally coat the region including the recesses and the separating surfaces. Optionally, the patterned layer can coat only a partial portion of the region including the recesses and the separating surfaces. FIG. 23(c) shows another embodiment of a magnetic device in the second stage of fabrication, where a patterned layer 421 has been formed to conformally coat a partial portion of the region including the recesses and the separating surfaces. This partial coating can be formed by forming the coating only in a partial region, or by forming the coating as shown in FIG. 23(b) and then removing a partial portion of the coating. The patterned layer can also coat only a portion of the recesses. FIG. 23(d) shows another embodiment of a magnetic device in the second stage of fabrication, where a patterned layer 423 has been formed to conformally coat a partial portion of the recesses, such as the bottom surface of the recesses. This partial conformal coating can be formed directly by forming the coating only in a partial region, or by forming the coating as shown in FIG. 23(b) and then removing a partial portion of the coating.

[0145] The magnetic device can include conductive wiring disposed around the patterned layer formed in the recess. The conductive wiring can provide a conductive coil or other conductive interconnection around the magnetic layer. The conductive wiring can include one or more of a conductive layer or a through-silicon (or other substrate) via (TSV). The conductive layer can include one or more of a horizontal conductive layer or a vertical conductive layer.

[0146] Figure 24(a) - 24(c) An embodiment of a magnetic device in a first stage of fabrication is shown, having substrates 418, 422, 426, where one or more recesses 430, 434, 438 are formed, and one or more TSVs 442, 446, 450 are formed around the recesses 430, 434, 438. Figure 24(d) - 24(f) An embodiment of the magnetic device of FIGS. 24 and 26 is depicted. In Figures 24(a) - 24(c) the second stage of fabrication, where patterned layers 454, 458, 462 have been formed in one or more recesses 430, 434, 438. Figures 24(g) - 24(i)Depicts an embodiment of the magnetic device of FIGS. 24(a)-24(f) in a third stage of fabrication, where one or more conductive layers 466, 470, 474 have been formed between TSVs 442, 446, 450 on materials 454, 458, 462 in one or more recesses 430, 434, 438. Another conductive layer may be formed on the lower or back side of the substrate to complete the interconnection of the conductive wiring, such as forming a conductive coil around materials 454, 458, 462.

[0147] The conductive wiring around the patterned material layer can form conductive coils with various configurations and for various purposes. The conductive coil around the material can be used to generate or enhance the magnetic field in the material. The conductive coil around the patterned layer can also be used to set the initialization or change the direction of magnetization of the material (e.g., for magnetizing the anisotropic magnetoresistive material of a magnetoresistor). The conductive coil can include one or more windings around one or more individual segments of the patterned layer at one or more positions of the segment. For example, as shown in FIG. 24(g), the conductive coil can include multiple windings 478 around a single individual segment of the patterned layer. In FIG. 24(h), the conductive coil can include multiple windings 482, 484 around each of multiple separate segments of the patterned layer. In FIG. 24(i), the conductive coil can include a first plurality of windings 488 at a first position of a single continuous segment of the patterned layer and a second plurality of windings 492 at a second position 482 of the single continuous segment of the patterned layer. The first and second pluralities of windings 488, 492 can optionally be used to provide magnetic fields to the first and second positions of the segment in different directions. The first and second positions of the single segment of the patterned layer can optionally be used to generate, conduct, channel, or concentrate magnetic flux in different directions.

[0148] One or more patterned material layers having a selected magnetism can be formed at multiple levels in and around the recesses. Figures 25(a) - 25(b) Shows a top view and a cross-sectional side view of an embodiment of the magnetic device in a first stage of fabrication, where recesses 496 having multiple levels 500 are formed in a substrate 504. Each of the multiple levels 500 of the recesses 496 can include a surface. Each surface can be parallel to the main plane of the substrate 504. Each surface can also be offset from other horizontal planes by an interlayer distance. Figures 25(c) - 25(d) Depicts a top view and a cross-sectional side view of the magnetic device of FIGS. 25 and 26. In Figures 25(a) - 25(b)In the second manufacturing stage, multiple patterned material layers are formed in and around the recess 496. The patterned layers may include one or more patterned layers 508 formed on the surface of one of the recesses 500 inside the recess 496. FIGS. 25(c)-25(d) depict a single patterned layer at a single level 500 inside the recess 496, but other embodiments may include multiple patterned layers, each patterned layer at a different level 500 inside the recess 496. Include patterned layers 512 formed on the surface adjacent to or surrounding the boundary of the recess 496. The patterned layers 508, 512 may have the same shape as the recess 496 or the height of the recess 496 on or around which they are formed. The patterned layers 508, 512 may be offset from each other according to the interlayer distance between the layers on which they are formed.

[0149] Embodiments of the magnetic device may provide functionality based on the presence of patterned layers at different levels. For example, multiple layers disposed on different levels offset from each other by an interlayer distance may be used to provide magnetic sensing as a function of the axis along which the levels are offset. For example, the magnetic device in FIG. 25(d) may provide magnetic sensing as a function of the central axis 516 of the recess 496. This may be used to sense the properties of an object that may enter the recess 496, such as the position axis of the object relative to the center 516 or the presence or level of a current associated with the object relative to the central axis 516.

[0150] Different types of magnetic structures may be formed in and around the recess. Figures 26(a) - 26(b) A top view and a cross-sectional side view of an embodiment of the magnetic device in the first manufacturing stage are shown, where a recess 520 having multiple levels 524 is formed in the substrate 528. FIG. 26(c) shows Figures 26(a) - 26(b) a side cross-sectional view of the magnetic device, where a patterned material layer 532 having a selected magnetism is formed at the level 524 in the recess 520. FIG. 26(d) shows Figures 26(a) - 26(c) a side cross-sectional view of the magnetic device, where a magnetic structure 536 is located at another horizontal level 524 in the recess 520. The magnetic structure 536 may include a patterned layer 540 formed on a substrate 544. In FIG. 26(d), the patterned layer 532 formed on the horizontal level 524 of the recess 520 may be formed at the same vertical height as the patterned layer 540 formed on the substrate 544 placed in the recess 520. However, in other embodiments, the layer 532 on the layer 524 in the recess 520 may be at a vertical height different from the vertical height of the patterned layer 540 on the substrate 544 in the recess 520.

[0151] The magnetic structure can include different shapes or portions of the shape of patterned layers formed at different levels. FIG. 27(a) shows a top view of an embodiment of a magnetic device including patterned layers 548, 552 having a plurality of individual arcuate segments arranged to outline a loop. FIG. 27(b) depicts a cross-sectional side view of the magnetic device of FIG. 27(a) taken along a first axis passing through a first subset of segments 556. The first subset of segments 556 can be formed as a first patterned layer 548 on a first surface of a substrate or a layer on the substrate. FIG. 27(c) shows a cross-sectional side view of the magnetic device of FIG. 27(a) taken along a second axis passing through a second subset of segments 560. The second subset of segments 560 can be formed as a second patterned layer 552 at a second level in a recess in the substrate or on a layer of the substrate. Forming different shapes or partial shapes of the patterned layers at different levels can provide specific functions of the magnetic device, such as specific magnetic sensing properties resulting from distributing the geometry to different levels.

[0152] The magnetic structure can also be arranged around a recess to provide a magnetic flux concentrator. FIG. 28(a) shows a cross-sectional side view of an embodiment of the magnetic flux concentrator device of FIG. 17(a), where at least one of the patterned layers of the magnetic flux concentrator can be formed on a level inside the recess 564. Another of the patterned layers of the magnetic flux concentrator can be formed in the recess 564. In FIG. 28(a), a magnetic sensor can also be formed on the surface around the recess 564. However, in other embodiments, the magnetic sensor can also be formed on the surface of a plane inside the recess 564. FIG. 28(b) shows a cross-sectional side view of another embodiment of the magnetic device of FIG. 17(a), similar to FIG. 28(a), but where the magnetic sensor can be formed on a level inside the recess 564. Other embodiments can include further variations in the distribution of components of the magnetic flux concentrator and the magnetic sensor, at different levels and different levels around it.

[0153] Other magnetic devices discussed herein can also be configured in and around one or more recesses. For example, Figures 18(a) - 18(b) one or more patterned layers of the magnetic concentrator device can be formed in one or more recesses. Similarly, Figures 20(a) - 20(f) one or more patterned layers of an embodiment of the magnetic sensor device can be formed in one or more recesses.

[0154] The magnetic structure can be located on the back side of the substrate or in a depression on the back side of the substrate. Figure 29A cross-sectional side view of a magnetic device including one or more magnetic structures 568 is shown, with each magnetic structure 568 located in a respective recess 572 in the back surface of a substrate 576. Each magnetic structure 568 may include a patterned layer 580, and the magnetic device may further include one or more TSVs 588 that electrically connect the magnetic structures to the front side of the substrate, which may include an integrated circuit 592.

[0155] The magnetic structure may further include a patterned material layer having a selected magnetism formed on an angled surface. The angled surface may be the surface of the wall of the recess. Forming the patterned layer on the angled surface may provide a function of selection as a function of the surface angle, for example, achieving one or more vertical or three-dimensional sensitivities for a magnetic sensor formed by these layers.

[0156] FIG. 30(a) shows a cross-sectional side view of an embodiment of a magnetic device including a patterned layer 596 on an angled surface 600 of the wall of a recess 604 formed in a substrate 608. The surface 600 may be configured to have a predetermined angle relative to the main plane of the substrate 608 or the surface of a layer on the substrate 608. FIG. 30(b) depicts a top view of the embodiment of the magnetic device shown in FIG. 30(a). The layer 596 may be patterned to form, for example, a magnetic sensor. The recess 604 may have the same shape as the patterned layer 596 or surround the patterned layer 596. As in other embodiments discussed herein, the patterned layer 596 may have any of the patterned layer properties discussed herein, such as any of the patterned layer shapes discussed with respect to FIGS. 2(a)-2(k).

[0157] The magnetic structure may further include patterned layers formed on a plurality of different angled surfaces. FIG. 31(a) shows a cross-sectional side view of an embodiment of a magnetic device including a plurality of patterned layers 612, 616, each patterned layer 612, 616 formed on a different angled surface 620, 624 of the wall of a recess 628 in a substrate 632. Each of the surfaces 620, 624 may be configured to have a corresponding predetermined angle relative to the main plane of the substrate 632 or the surface of a layer on the substrate 632. The predetermined angle of each wall may optionally be different from that of the other walls. FIG. 31(b) depicts a top view of the embodiment of the magnetic device shown in FIG. 31(a). The layers 612, 616 may be patterned to form, for example, magnetic sensors. The recess 628 may be shaped to have the same shape as the patterned magnetic layers 612, 616 or surround the patterned magnetic layers 612, 616.

[0158] Multiple patterned layers may be formed on a plurality of different angled surfaces of a plurality of different recesses. Figure 32A top view of another embodiment of a magnetic device including a plurality of patterned layers 636, 640, 644, 648 is shown, with each patterned layer 636, 640, 644, 648 formed on different inclined surfaces 652, 656, 660, 664 that form the walls of different recesses. Each patterned layer 636, 640, 644, 648 may include a plurality of individual segments oriented in different directions.

[0159] The magnetic structure may also be formed on a cap mounted on a substrate. Figures 33(a) - 33(b) A perspective view and a cross-sectional side view of an embodiment of a magnetic device having a magnetic structure formed on a cap 668 mounted on a substrate 672 are depicted. The magnetic structure may include a patterned material layer 676 having a selected magnetism formed on the top surface or in a recess of the cap 668. The cap 668 may be mounted on the substrate 672 above a substrate structure 680 to partially or completely surround the substrate structure 680. The cap 668 may include a top portion located above the substrate structure 680 and side walls extending from the top portion to the substrate 672. The cap 668 may optionally be a capping substrate formed of another substrate. The substrate structure 680 may be located below the cap 668. The substrate structure 680 may include one or more of an integrated circuit, a micromechanical structure, a sensor structure, or another magnetic structure, etc.

[0160] The magnetic device may further include conductive lines to electrically interconnect the magnetic structure on the cap with the circuit structure under the cap. FIG. 33(c) shows a cross-sectional side view of an embodiment of a magnetic device similar to Figures 33(a) - 33(b) the embodiment shown, but which includes one or more through-silicon vias (TSVs) 684 that extend through the cap from the top surface of the cap to the substrate under the cap. The TSVs 684 (optionally together with one or more conductive layers) may electrically interconnect the magnetic structure with the substrate structure under the cap. FIG. 33(d) depicts a cross-sectional side view of another embodiment of a magnetic device similar to the embodiments of FIGS. 33(a)-33(b), but which may include one or more wire bonds 688 that extend from the top surface of the cap to the substrate to electrically connect the magnetic structure on the cap to the substrate structure under the cap.

[0161] Magnetic structures can also be formed at multiple different horizontal levels on and around the lid. FIGS. 34(a)-34(b) show a perspective view and a cross-sectional side view of an embodiment of a magnetic device having magnetic structures formed at multiple different horizontal levels on and around a cap 692 mounted on a substrate 696. A first patterned layer 700 formed at a first level on the cap 692 may be included, as discussed above with respect to FIGS. 33(a)-(d). A second magnetic structure may include a second patterned layer 704 formed at a second level on or in a recess in the substrate 696 surrounding the cap 692. The first level may be offset from the second level by a predetermined distance. The first and second magnetic layers 700, 704 may have a common shape, such as concentric rings or aligned square or rectangular shapes. The second layer 704 may partially or completely surround the cap 692.

[0162] As with other embodiments discussed herein, the patterned layer formed on the cap may have a selected magnetic property to provide a selected magnetic function. In an embodiment, the patterned layer may include magnetoresistive material arranged to form a magnetic sensor. In other embodiments, the patterned layer may include a material that generates a temporary or permanent magnetic field. In other embodiments, the patterned layer may include a magnetic shielding material, such as a material having a magnetic permeability above a predetermined threshold for a magnetic field.

[0163] In addition to the magnetic structures, other structures may be formed on the lid. Figure 35 An embodiment of a magnetic device is depicted that includes a magnetic structure 708 and a conductive coil 712 formed on a cap 716 mounted on a substrate 720. The conductive coil 712 may be formed in an area separate from the magnetic structure 708, as Figure 35 shown, or may be formed below or above the magnetic structure. The conductive coil formed in a separate area may provide, for example, a radio frequency identification structure. The conductive coil formed below or above the magnetic structure may be used to provide a magnetic field to set or modify the magnetic properties of the magnetic structure.

[0164] The magnetic device may also provide a magnetic flux concentrator on or in the lid. FIG. 36(a) shows an embodiment of a magnetic device including a first magnetic structure forming a magnetic flux concentrator and one or more second magnetic structures forming one or more magnetic sensors in and around a lid mounted on a substrate. The magnetic flux concentrator may include a patterned layer of material 717 deposited in the sidewall of the cap. The patterned layer may extend substantially to the top and bottom of the sidewall or to a predetermined distance within the top and bottom. The patterned layer of the magnetic flux concentrator may be formed along a substantially vertical plane. The one or more magnetic sensors may include patterned material layers 715, 719 formed on the cap and / or the substrate. The patterned layer may be formed within a predetermined distance of the end of the patterned layer of the magnetic flux concentrator. The patterned layer of the magnetic sensor may be formed along a substantially horizontal plane. The patterned layer of the magnetic flux concentrator may include a material having a relatively high magnetic permeability to a magnetic field, such as a magnetic permeability higher than a predetermined threshold, and the patterned layer of the magnetic sensor may include a magnetoresistive material.

[0165] In operation, when the magnetic flux concentrator travels into the patterned layer in the vertical direction 721 in the regions above and below the patterned layer, the magnetic flux concentrator may direct or concentrate the magnetic flux. This directing or concentrating may produce a local translation of the magnetic flux from the vertical direction or a similar direction to the horizontal direction or a similar direction 723 near the end where the magnetic sensor of the magnetic flux concentrator is located. The channeling and / or concentration of the magnetic flux may enable the magnetic sensor to sense a vertical magnetic field using the operating sensitivity to a magnetic field along the horizontal direction rather than the vertical direction.

[0166] FIG. 36(b) depicts another embodiment of a magnetic device similar to the embodiment of FIG. 36(a), but in which the magnetic flux concentrator may include a patterned layer of material 725 deposited on the surface of the sidewall of the cap.

[0167] Additionally, the magnetic structure may be formed on the lid according to any of the embodiments of the magnetic structure formed on a substrate discussed herein, such as with respect to Figure 7 FIGS. 1 to 44 and their various subfigures (i.e., (a), (b), etc.), where the lid is the substrate and has corresponding substrate structures.

[0168] The magnetic structure may also include a patterned layer formed on or as part of a micro - mechanical structure. The micro - mechanical structure may include one or more of a variety of different structures, including one or more of beams, plates, combs, diaphragms, or gears, etc. The patterned layer may form part of all or a mechanically active portion of the micro - mechanical structure.

[0169] Figure 37(a) depicts an embodiment of a magnetic device that includes a magnetic structure having a patterned layer forming a micromechanical beam 724 suspended over a substrate 728. The beam 724 can be a cantilever that includes an anchor portion 732 connecting the beam 724 to the substrate 728 and a suspension portion 736 suspended over another portion of the substrate 728. The suspension portion 736 of the beam 724 can be flexible and can be configured to bend toward and away from the substrate in response to a stimulus. The patterned layer can include a material that generates a permanent or temporary magnetic field. The patterned layer can form substantially the entire beam 724, including the anchor portion 732 and the suspension portion 736, as shown in FIG. 37(a). However, the patterned layer of the magnetic structure can alternatively form only a part of the micromechanical device. FIG. 37(b) depicts another embodiment of a magnetic device similar to the embodiment shown in FIG. 37(b), but in which the patterned layer can form only a part of the micromechanical device, such as a patterned layer 740 on the suspension portion of the beam, which can be formed of another material, such as an oxide, polysilicon, or other material.

[0170] The magnetic device can also optionally include another magnetic structure that includes a patterned layer 744 formed on, in, or in a recess of the substrate 728 beneath the micromechanical structure. The patterned layer can include a material that generates a permanent or temporary magnetic field. The second magnetic structure can interact magnetically with the magnetic structure of the micromechanical structure 724. Other embodiments can omit the second magnetic structure 744 formed beneath the micromechanical structure 724.

[0171] The magnetic device can also include a cap 748 mounted on the substrate 728 around the micromechanical structure 724. The cap 748 can partially or completely surround the micromechanical structure 724 to protect the micromechanical structure 724 from the environment surrounding the magnetic device.

[0172] The magnetic device can also include conductive wiring to electrically interconnect the micromechanical structure to other device components. The conductive wiring can include a conductive layer 752 that electrically interconnects the magnetic structure to other locations on the same side of the substrate 728 as the micromechanical structure 724, as shown in FIG. 37(a). The conductive wiring can also include one or more conductive layers and TSVs that interconnect the micromechanical device to locations on the opposite side of the substrate. FIG. 37(c) depicts another embodiment of a magnetic device similar to the embodiment shown in FIG. 37(a), but in which the magnetic device can include one or more conductive layers 756 and TSVs 770 that interconnect the micromechanical device to locations on the opposite side of the substrate.

[0173] In operation, Figures 37(a) - 37(c)The micro - mechanical beam structure shown in [Figure] can provide various functions, such as operating as a switch, a sensor, etc. For example, the micro - mechanical beam structure can operate as a magnetic switch, such as a reed relay, in response to an external stimulus such as a magnetic field, for the interconnection between the conductive contact 764 at the free end of the beam 724 and the second conductive contact 768 on the substrate 728 below the free end of the beam 724. The micro - mechanical beam structure can also be used to detect an external magnetic field based on the deflection of the beam structure in response to such a field. The micro - mechanical beam structure can also be used to generate a selectively varying magnetic field by moving the beam structure in response to a stimulus such as a magnetic field or acceleration. The selectively varying magnetic field can be used in various applications, such as implementing an isolated data link.

[0174] Magnetic devices can include a plurality of micro - mechanical structures formed partially or wholly from magnetic structures. Figures 38(a) - 38(b) A top view of an embodiment of a magnetic device is shown, which includes a plurality of micromachined beams 771, 772 formed from a patterned layer similar to that shown in FIGS. 37(a) - 37(b). In FIG. 38(a), the plurality of beams 771 can be arranged adjacent to each other in a one - dimensional array with the same spatial orientation. In FIG. 38(b), the plurality of beams 772 can be arranged to have spatial orientations that are angled with respect to each other, such as at an angle of 90° or 180°. The plurality of micro - mechanical structures can be arranged relative to each other to implement various devices, such as an interconnection array of magnetic switches. For example, the embodiment of FIG. 38(a) can be used to detect or provide a function as a function of the variation of a magnetic field along the beam array. The embodiment of FIG. 38(b) can be used to detect or otherwise provide a function as a function of the directionality of the magnetic field relative to the beam array as a whole.

[0175] The micro - mechanical beam structure formed from a magnetic structure can also be configured to bend laterally instead of or in addition to bending towards and away from the substrate. The micro - mechanical beam can be configured to bend in a particular direction by positioning the beam below a predetermined thickness in that direction to allow the beam to bend. Figures 39(a) - 39(b) A top view and a side view of an embodiment of a magnetic device are shown, which includes a micromachined beam 773 formed from a patterned layer, similar to Figures 37(a) - 37(b) that shown, but wherein the beam can be configured to bend laterally from one side to the other in a direction parallel to the main plane of the substrate, rather than towards and away from the substrate. The magnetic device can also include one or more elements positioned laterally on one or more sides of the beam. The lateral elements can be or include one or more of a motion - limiting structure, an electrical contact, or a secondary magnetic structure.

[0176] Magnetic devices can include a plurality of micro - mechanical beams formed from magnetic structures and configured to move laterally. Figure 40A top view of an embodiment of a magnetic device including a plurality of micromachined beams 777 is shown, the plurality of micromachined beams 777 being formed by a patterned layer similar to Figures 39(a) - 39(b) shown. The plurality of beams may be arranged in a spatial orientation that is angled with respect to each other, such as at an angle of 90° or 180°. In other embodiments, the plurality of beams may be arranged adjacent to each other in a one-dimensional array in the same spatial direction, such as similar to that shown in FIG. 38(a). As described above, the plurality of micromachined structures may be arranged relative to each other to implement various devices. For example, Figure 40 embodiments may also be used to detect or otherwise provide as a function of the directionality of the magnetic field with respect to the beam array as a whole.

[0177] The micromachined beams formed by the magnetic structure may take forms other than the cantilever beams shown in FIGS. 37-40. Figures 41(a) - 41(b) A side view of an additional embodiment of a micromachined beam structure that may be formed by a magnetic structure is shown. In FIG. 41(a), the beam structure 776 may include first and second anchoring portions 780, 784 at opposite ends of the structure 776 that connect the structure 776 to the substrate 786, and a suspended portion 788 that is suspended over the substrate 786. In FIG. 41(b), the beam structure 792 may include a central anchor portion 796 that connects the structure 792 to the substrate 800 and first and second suspended portions 804, 808 that are suspended over the substrate 800. In each case, the suspended portion of the beam may be flexible and bend in response to magnetic stimulation.

[0178] FIGS. 38-41 show beam structures formed entirely by a patterned layer, but in other embodiments, these micromachined beam structures may be formed entirely or in part by a patterned layer, Figures 37(a) - 37(b) . Additionally, although FIGS. 38-41 show essentially only a plurality of micromachined structures for clarity of illustration, the magnetic device may also include other components to implement and / or enhance the functionality of these structures, such as one or more of a cap, electrical connections, a second magnetic structure, etc., similar to Figures 37(a) - 37(c) shown.

[0179] The magnetic structure may also be formed on or as part of other types of micromachined structures. For example, the magnetic structure may be formed on or as part of a micromachined vibrating membrane. Figures 42(a) - 42(c)FIG. 0 shows a cross-sectional side view of a magnetic device including a magnetic structure formed on a micromachined diaphragm formed on a substrate 803. The diaphragm may include one or more anchoring portions 805 connected to the substrate and a suspension portion 807 suspended over an area of the substrate. The suspension portion may be flexible and may be configured to bend towards and away from the substrate in response to a stimulus. The suspension portion may include one or more recesses 809 in which patterned layers 811, 815, 817 may be formed. The patterned layer may partially fill the recess, as shown in FIG. 42(a), completely fill the recess, as shown in FIG. 42(b), or overflow the recess, as shown in FIG. 42(c). The patterned layer may include a material that generates a permanent or temporary magnetic field.

[0180] The lids shown in FIGS. 33-37 may also be configured to be such as Figures 42(a) - 42(c) the micromachined diaphragm shown.

[0181] The magnetic structure may also be formed on or as part of other types of micromachined structures. For example, the magnetic structure may be formed on or as part of a micromachined scanner. Figures 43(a) - 43(b) FIGS. 10 depict top and bottom views of a magnetic device including a magnetic structure formed on a micromachined scanner. The micromachined scanner may include a rotatable platform 819, an inner actuation ring 821, and an outer actuation ring 823. The micromachined scanner may be formed by one or more substrates on a substrate.

[0182] The rotatable platform may include a top surface on which a material layer having a selected reflectivity may be formed, a patterned material layer 825 having a selected magnetism on the bottom surface and a set of electrical contacts 829 connected thereto may form a patterned layer, and a set of electrostatic actuator components 827, such as drive combs. The rotatable platform may be connected to the inner actuation ring by one or more torsion springs 831. The inner actuation ring may include first and second sets of electrostatic actuator components 832, 833, such as drive combs. The inner actuation ring may be connected to the outer actuation ring by one or more torsion springs 835. The outer actuation ring may include a set of electrostatic actuator components 837, such as drive comb-like objects and a set of electrical contacts 839. The electrical contacts of the rotatable platform may be electrically connected to the electrical contacts of the outer actuator ring by a set of bonding wires 841. Although shown in the figure Figures 43(a) - 43(b) as having a substantially square profile, the rotatable platform, inner actuation ring, and outer actuation ring may be formed to have other profiles, such as rectangular, circular, or oval profiles, etc.

[0183] The patterned layer may include a magnetoresistive material arranged to form a magnetic sensor. For clarity of illustration, the patterned layer is shown in FIG. 43(b) as a single square region, but may alternatively include any of the patterned layer shape configurations discussed herein, such as one or more patterned layer shapes that are electrically interconnected and arranged to form a magnetic sensor.

[0184] In operation, the rotatable platform can rotate about a first axis 843 in response to an electrical signal being applied to the electrostatic actuator components of the platform and the inner actuator ring. Similarly, the rotatable platform can rotate about a second axis 845 in response to an electrical signal being applied to the electrostatic actuator components of the inner actuator ring and the outer actuator ring. Figures 44(a) - 44(c) A cross-sectional front view of the magnetic device taken along an axis offset from the torsion spring is shown. In FIG. 44(a), the rotatable platform can be in a stationary state without rotating about either axis. In FIG. 44(b), the rotatable platform can rotate about the first axis. In FIG. 44(c), the rotatable platform can rotate about the second axis. The reflective layer can scan a light source (e.g., a laser) directed onto the rotatable platform in a corresponding two-dimensional pattern. The magnetic sensor can provide an output signal representative of the orientation of the rotatable platform by sensing a magnetic field in the environment of the magnetic device, and the magnetic device can have a known orientation relative to the overall magnetic device. For clarity of illustration, the bond wires 841 are omitted in Figures 44(a) - 44(c) However, they can be configured to have sufficient size and flexibility to accommodate rotation of the platform about both axes while still maintaining an electrical connection between the electrical contact 829 and the electrical contact 839 on the rotatable platform.

[0185] Any embodiment of the magnetic device discussed herein may include a magnetic structure having a patterned layer having any physical connection or arrangement relative to the substrate discussed herein, such as with respect to any Figure 7 of FIGS. 44 and its various subfigures (i.e., (a), (b), etc.), as well as other connections and arrangements.

[0186] The magnetic device may include a magnetic structure connected to or arranged relative to the structure of the package. Figure 45 An embodiment of a magnetic device 801 as a packaged magnetic device is described, having a magnetic structure connected to or arranged relative to the structure of the package. The magnetic device may include a package 803, a magnetic structure 805, one or more substrates 807, and associated circuitry 809.

[0187] The package may include one or more package structures 811, such as one or more of holes, housings, etc. The magnetic structure may be physically connected or arranged relative to the one or more package structures in a predetermined manner.

[0188] The magnetic structure, substrate, substrate structure 815, and circuitry of the encapsulated magnetic device can include any embodiments of these components and their interconnections and arrangements discussed above for any other embodiments of the magnetic device, such as those discussed with respect to FIGS. 7 - 44 and their various sub - figures (i.e., (a), (b), etc.).

[0189] Figure 46 Embodiments of an encapsulated magnetic device are depicted. The encapsulated magnetic device can include a magnetic structure, an encapsulation, and corresponding circuitry. The magnetic structure can include a patterned layer 856 formed on a substrate 860. The associated circuitry can include an integrated circuit 864 formed on one or more additional substrates. The magnetic structure and its substrate can be attached to the integrated circuit to form a substrate stack.

[0190] The encapsulation can include a housing 868 to selectively expose a portion of the magnetic structure while surrounding other portions of the device. The housing can include holes 857 to expose a portion of the magnetic structure (e.g., the surface of the patterned layer or the coated surface of the patterned layer) to the environment external to the encapsulation, and surrounding portions 859 that surround one or more of another portion of the magnetic structure or the circuitry to provide a barrier to the external environment. Exposing the magnetic structure to the external environment can enhance the magnetic properties of the magnetic structure by providing selective access to the magnetic structure by a magnetic field. Enclosing another portion of the magnetic structure or the integrated circuit can improve the electrical properties of the magnetic structure or other portions of the integrated circuit by selectively preventing entry or exit of magnetic, electric, or electromagnetic fields into or out of the magnetic structure, or provide other types of protection from the external environment. The encapsulation can also include a conductive lead frame and lead bonds to provide electrical connections between the terminals of the encapsulation and one or more of the magnetic structures or integrated circuits.

[0191] In other embodiments, the encapsulated magnetic device can include a magnetic structure and circuitry formed together on a single substrate, e.g., on the same or different sides of such a substrate, similar to the encapsulation shown in FIG. 42.

[0192] FIG. 47(a) depicts a cross-sectional view of another embodiment of an encapsulated magnetic device that includes a magnetic structure formed on or as part of a micromachined scanner, as shown in FIGS. 43 and 44. The encapsulated magnetic device may include a housing 965, a substrate 967 that includes the micromachined scanner 969, such as shown in FIGS. 43 and 44, an encapsulation substrate 971, a lens 973, and one or more electrical interconnections 975. For clarity of illustration, the micromachined scanner 969 is shown as a single schematic entity, however it may include all of the components shown in FIGS. 43 - 44. The housing may include a hole 977 for positioning the lens and allowing light to enter the scanner and a portion 978 for receiving the scanner and positioning the scanner relative to the hole and the lens. Electrical connections, which may include bond wires, may electrically connect the scanner to the encapsulation substrate. As discussed above with respect to FIGS. 43 and 44, a patterned layer of magnetoresistive material 979 that forms a magnetic sensor may be formed on the scanner.

[0193] The encapsulated magnetic device may also include a second patterned layer. The second patterned layer may include a material that provides a predetermined permanent or temporary magnetic field. Figure 47(b) and 47(c) FIG. depicts a cross-sectional view of an embodiment of an encapsulated magnetic device similar to that shown in FIG. 47(a), but including a second patterned layer. In FIG. 47(b), the second patterned layer 981 may be formed on a portion of the encapsulation housing or encapsulation substrate. In operation, the second patterned layer may provide a predetermined magnetic field around the scanner, and the magnetic sensor formed by the first patterned layer may provide an output representing the rotational position of the scanner based on the magnetic field sensed by the sensor. In FIG. 47(c), the nature of the patterned layers may be reversed, where a first patterned layer 983 that includes a material that provides a predetermined magnetic field is formed on the scanner and a second patterned layer 985 is formed on the encapsulation housing or encapsulation substrate, the magnetoresistive material forming the magnetic sensor. Such an embodiment may operate on a similar principle as the embodiment of FIG. 47(b), but performs the generation and sensing of the magnetic field at interchanged positions.

[0194] The magnetic device may include a magnetic structure that is connected to or relative to a structural arrangement of a module incorporating a plurality of substrates. Figure 48 FIG. depicts an embodiment of a magnetic device 817 as a module-based magnetic device. The magnetic device may include a plurality of substrates 819, a magnetic structure 821, and associated circuitry 823. The magnetic device may also optionally include one or more other structures 825, such as coils, caps, micromachined structures, antennas, etc.

[0195] The magnetic structure can be physically connected or arranged relative to one or more structures 827 of one or more module substrates. For example, the magnetic structure can be relative to one or more of the structures in a module substrate according to any embodiment of the magnetic structure and the substrate, as well as their interconnections and arrangements relative to substrate-based magnetic devices, such as those discussed above with respect to FIGS. 7 to 44 and their various subfigures (i.e., (a), (b), etc.). In an embodiment, the magnetic structure can be formed on a substrate according to any of these embodiments, and a plurality of substrates can include additional substrates connected to the first substrate relative to the magnetic structure and arranged as described below.

[0196] The magnetic structure, substrate, circuit, and other structures of a module magnetic device can include any embodiment of these components, as well as their interconnections and arrangements discussed above with respect to other magnetic device embodiments.

[0197] FIG. 49(a) depicts a perspective view of an embodiment of a module 812 that can include one or more magnetic structures (or magnetic structures on a substrate) 816 and a substrate structure having a plurality of substrates 820. FIG. 49(b) shows a cross-sectional side view of the module shown in FIG. 49(a). The substrate structure can include a plurality of substrates 820 laminated on top of each other. In an embodiment, the substrate structure can be a laminated substrate structure including a plurality of laminated layers.

[0198] One or more magnetic structures can be attached to the substrates of the substrate structure. The magnetic structure 816 can be attached to the substrates of the substrate structure such that the magnetic structure is completely embedded within the substrate structure, as Figure 1 shown in FIG. 49(b). Alternatively, the magnetic structure can be attached to the substrates of the substrate structure such that the magnetic structure is exposed at the outer surface of the module. Figures 49(c) - 49(d) A cross-sectional side view showing an embodiment of a magnetic module similar to that shown in FIG. 24 is presented. Referring Figures 49(a) - 49(b) thereto, but wherein the magnetic structure can be attached to the substrates of the substrate structure such that the magnetic structure, such as the surface of a patterned layer or the coated surface of a patterned layer, is exposed at the outer surface of the module. In FIG. 49(c), a plurality of magnetic structures 824 can be attached to the substrates of the substrate structure such that the magnetic structures (such as the surface of a patterned layer or the coated surface of a patterned layer) are on the outer surface of the same side of the module. In FIG. 49(d), a plurality of magnetic structures 828 can be attached to the substrates of the substrate structure such that the magnetic structures (such as the surface of a patterned layer or the coated surface of a patterned layer) are exposed on different outer surfaces, such as opposite sides of the module.

[0199] In addition to the magnetic structure, the module can also include one or more components attached to the substrates of the substrate structure. The components can be electrically connected to the magnetic structure through one or more conductive traces or vias laid along or through the substrate.

[0200] The magnetic structure can be physically aligned with holes in a plurality of substrates. FIG. 50(a) shows an exploded view of an embodiment of a magnetic device that includes a patterned layer 832 of a magnetic structure having holes aligned with holes in a plurality of substrates 836, 840 of a substrate structure. The substrate structure can include a plurality of substrates stacked on top of each other, such as in a module. The patterned layer can be located between two substrates such that the holes in the patterned layer are aligned with the holes in each substrate. As discussed above with respect to Figure 1 and 2. As Figure 15 - 1 shown in FIG. 6, the alignment of the holes can create a travel path for another component or device from one side of the magnetic device to the other side of the magnetic device. FIG. 50(b) shows a side view of an embodiment of the magnetic device shown in FIG. 50(a). The patterned layer can optionally be located within recesses formed in one or more substrates to allow for a more compact encapsulation of the substrates into a stacked substrate structure.

[0201] The magnetic structure can also be physically aligned with one or more holes in a module. Figures 51(a) - 51(b) FIGS. show a perspective view and a cross-sectional side view of an embodiment of a magnetic module 844 that can include one or more magnetic structures aligned with holes 845 in a substrate structure having a plurality of substrates 848. The holes can extend from one side of the module through the plurality of substrates to the other side. The magnetic structures 852 can be connected to one or more substrates at the sides of the holes such that the magnetic structures are exposed to the holes. FIG. 51(c) is a cross-sectional side view depicting another embodiment of a magnetic module similar to the embodiment shown in FIG. 51(b). However, where the holes can extend from one side of the module through the plurality of substrates and terminate inside the module, and the magnetic structures 853 can be connected to one or more substrates at the bottom such that the magnetic structures are exposed to the holes. FIG. 51(d) is a perspective view representing another embodiment of a magnetic module identical to the embodiment shown in Figures 51(a) - 51(b) but where additional holes 855 can extend from a third side of the module through the plurality of substrates to a fourth side of the module and the additional holes intersect the first holes.

[0202] The magnetic structure can also be provided in association with a microfluidic structure. FIG. 52(a) is a cross-sectional side view depicting an embodiment of a portion of a magnetic device including a microfluidic channel 857 and a magnetic structure 859. The channel can include an inlet 861 to receive fluid inflow into a first channel portion 863, a channel structure 865 for dividing the channel into a plurality of second channel portions 867, and a plurality of outlets for providing fluid flowing out of the second channel portions. The magnetic structure can include one or more patterned layers formed around a portion of the channel, such as a patterned layer formed to connect or adjacent to at least a portion of the wall forming the channel. For example, as shown in FIG. 52(a), the magnetic structure can include a first patterned layer formed to connect to or adjacent to at least a portion of the first wall forming the channel, such as a layer 869 formed on top of the top wall of the channel, and a second patterned layer formed to connect to or adjacent to at least a portion of the second wall forming the channel, such as a layer 871 formed below at least a portion of the bottom wall forming the channel.

[0203] The patterned layer can include a material that generates a magnetic field. In an embodiment, the patterned layer can include a material that generates a permanent magnetic field. In FIG. 52(a), the patterned layer can include a hard magnetic material that generates a permanent magnetic field. In other embodiments, the patterned layer can include a material that generates a temporary magnetic field. In such an embodiment, the magnetic device can also include a coil connected or arranged relative to the patterned layer in a predetermined manner to set and / or change the magnetic field in the material. FIG. 52(b) is a cross-sectional side view depicting another embodiment of a portion of a magnetic device including a microfluidic channel and a magnetic structure and conductive coils 873, 875 as shown in FIG. 52(a). The magnetic structure can include a patterned layer including a soft magnetic material that generates a temporary magnetic field. The conductive coils can be driven by associated circuitry of the magnetic device to generate a magnetic field to set and / or supplement the magnetic field generated by the material, such as providing one or more of a static magnetic field with a single field orientation, or a varying magnetic field with a varying field orientation.

[0204] In operation, the fluid flowing into the channel at the inlet can include a variety of different types of particles that have different responses to a magnetic field, and the magnetic structure can be used to provide a magnetic field to separate the different types of particles into different second channel portions. For example, as Figures 52(a) - 52(b)As described, the fluid flowing into the inlet of the flow channel can include a first type of particle 877 that can move in a first direction towards the first of the second channel portions in response to a selected applied magnetic field, and a second type of particle 879 that can move in a second direction towards the first channel portion in the second channel portion in response to the selected applied magnetic field. Different types of particles can exhibit different responses to the magnetic field due to their own magnetism. In other embodiments, the fluid or particles added to the fluid can exhibit a response to the magnetic field, creating properties of the fluid flow, such as a density gradient, that can separate different types of particles based on their density.

[0205] Magnetic devices can incorporate microfluidics and magnetic structures, such as as Figures 52(a) - 52(b) shown. FIG. 52(c) depicts an embodiment of a magnetic device that includes microfluidics and magnetic structures as Figures 52(a) - 52(b) shown, as one or more layers in a multi-layer structure. The layers 881 of the multi-layer structure can take various forms. In an embodiment, the layers of the multi-layer structure can be layers formed on a substrate. In other embodiments, the layers of the multi-layer structure can include the substrates of a multi-substrate structure, such as a magnetic module.

[0206] Magnetic devices can include magnetic structures that are connected to or arranged relative to the structures of a system. Figure 53 An embodiment of a magnetic device 883 is shown as or as part of a system having a magnetic structure connected to or arranged relative to the structures of a system. The magnetic device can include a magnetic structure 885, a system structure 887, and an associated circuit 889. The system structure can include any structure that is connected to or arranged relative to the magnetic structure discussed with respect to any other embodiment of the magnetic device. The magnetic structure, system structure, and circuit can include any embodiment of these components and their interconnections and arrangements in any embodiment of the magnetic device discussed herein.

[0207] Magnetic devices can also include magnetic structures that include a plurality of aligned patterned layers. FIG. 54(a) depicts an exploded view of an embodiment of a magnetic structure that includes a plurality of patterned layers 872 in a stacked arrangement. Each patterned layer can include holes that are aligned with the holes of other magnetic structures in the stack. Each patterned layer can also optionally include boundaries or shapes that are aligned with the boundaries or shapes of other magnetic structures in the stack. The patterned layers can each be separately formed patterned layers, such as those discussed above with respect to Figures 10(a) - 10(b) shown. FIG. 54(b) depicts a non-exploded perspective view of the magnetic structure shown in FIG. 54(a).

[0208] The magnetic structure may also include a plurality of aligned patterned layers arranged in combination with other layers. FIG. 55(a) depicts an exploded view of an embodiment of a magnetic structure including a plurality of patterned layers 876 arranged in combination with other layers 880 in a stack. Each patterned layer and other layer may include holes aligned with the holes of other layers in the stack. Each patterned layer may also optionally include a boundary or shape aligned with the boundary or shape of other magnetic structures in the stack. The patterned layers may each be individually formed patterned layers, such as with or without a corresponding substrate, as described above. The other layers may include non-magnetic materials, such as a substrate on which the patterned layers may be formed or a separate spacer. FIG. 55(b) shows an un-exploded perspective view of the magnetic structure shown in FIG. 55(a).

[0209] As described above, the magnetic device may include circuitry that may be electrically connected to one or more of the magnetic structure and other device structures to provide functions, such as providing, receiving, conditioning, and processing signals of the magnetic structure, as well as other device structures.

[0210] The magnetic device may incorporate the circuitry on the same substrate as the magnetic structure. For example, the magnetic device may combine the circuitry and the magnetic structure on the same side of the substrate, each in a separate region or in the same region. Alternatively, the magnetic device may incorporate the circuitry on a different substrate side from the magnetic structure. The magnetic device may also incorporate the circuitry on a substrate different from the substrate including the magnetic structure.

[0211] The magnetic device may include circuitry that performs one or more of the following operations: receiving and manipulating electrical signals from the magnetic structure of the magnetic device, generating and providing electrical signals to the magnetic structure, generating electrical signals and providing the electrical signals to a conductive coil, or generating and providing electrical signals to a transmitter, etc.

[0212] For example, the magnetic device may include circuitry for receiving and manipulating electrical signals from the magnetic structure. Figure 56An embodiment of a magnetic structure and a circuit that can be used to receive and manipulate an electrical signal from a magnetic structure is shown. The circuit may include an amplifier circuit 900, an analog-to-digital converter (ADC) 904, and a processor or controller 908. The amplifier circuit 900 may be electrically coupled to the magnetic structure to receive the output of the magnetic structure and perform one or more buffering or amplifying of the signal received from the magnetic structure. The amplifier circuit 900 may include one or more operational amplifiers to perform buffering or amplifying. The ADC 904 may be electrically coupled to the amplifier circuit to receive the output of the amplifier circuit 900 and convert the received signal from an analog to a digital representation. The ADC 904 may include one or more of a flash ADC, a pipelined ADC, a Σ-Δ ADC, a successive approximation ADC, etc. The processor or controller 908 may be electrically coupled to the ADC 904 to receive the output of the ADC 904 and perform one or more of processing the received digitized signal to extract information from the digitized signal or generating a control signal based on the digitized signal.

[0213] The magnetic device may also include a circuit that generates an electrical signal and provides it to the magnetic structure. Figure 57 An embodiment of a magnetic structure and a circuit that can be used to generate an electrical signal and provide it to the magnetic structure is shown. The circuit may include a processor or controller 916, a digital-to-analog converter (DAC) 920, and a driver circuit 924. The processor or controller 916 may generate a control signal representing the electrical signal to be provided to the magnetic structure. The processor or controller 916 may generate the control signal as a function of a digitized signal representing a signal output by the magnetic structure or another signal. The DAC 920 may be electrically coupled to the processor or controller to receive the control signal output by the processor or controller 916 and convert the control signal from a digital representation to an analog representation. The DAC 920 may include one or more of an R-2R ladder DAC, an oversampling DAC, a hybrid DAC, etc. The driver circuit 924 may be electrically coupled to the DAC 920 to receive the analog signal output from the DAC 920 and provide a corresponding drive signal to the magnetic structure. The driver circuit 924 may perform one or more of buffering or amplifying the signal from the DAC 920. The driver circuit 924 may include one or more transistors to perform buffering or amplifying.

[0214] The magnetic device may also include a circuit that generates an electrical signal and provides it to a conductive coil. The conductive coil may be used to generate a magnetic field to set or change the properties of the magnetic structure or otherwise be used in association with the magnetic structure. Figure 58An embodiment of a circuit that can be used to generate an electrical signal and provide it to a conductive coil is depicted. The circuit may include a processor or controller 932, a digital-to-analog converter (DAC) 936, and a driver circuit 940. The processor or controller 932 may generate a control signal representing the electrical signal to be provided to the conductive coil. The processor or controller 932 may generate the control signal as a function of a digitized signal representing a signal output by a magnetic structure or another signal. The DAC 936 may be electrically coupled to the processor or controller to receive the control signal output by the processor or controller 932 and convert the control signal from a digital representation to an analog representation. The DAC 936 may include one or more of an R-2R ladder DAC, an oversampling DAC, a hybrid DAC, etc. The driver circuit 940 may be electrically coupled to the DAC 936 to receive the analog signal output by the DAC 936 and provide a corresponding drive signal to the conductive coil. The driver circuit 940 may perform one or more of buffering or amplifying the signal from the DAC 936. The driver circuit 940 may include one or more transistors to perform buffering or amplifying.

[0215] The magnetic device may also include a circuit for generating and providing an electrical signal for transmission based on a signal from a magnetic structure (e.g., representing a magnetic field or current sensed by the magnetic structure). Figure 59 An embodiment of a magnetic sensor and a circuit that can be used to generate an electrical signal and provide it to a transmitting element is depicted. The circuit may include an amplifier circuit 945 and an ADC 947, a transmitter 949, and a transmitting element 951 such as a conductive coil, an antenna, etc. The amplifier circuit and the ADC may be as described above with respect to the circuit of FIG. 49. The transmitter circuit may be electrically coupled to the ADC to receive the digital signal output by the ADC and provide a corresponding transmit drive signal to the transmitting element.

[0216] In embodiments where the magnetic structure forms a magnetic sensor (e.g., an anisotropic magnetoresistive sensor or other magnetoresistive sensor), several embodiments of the amplification and driver circuits may be provided. Figure 60 An embodiment of a magnetic sensor 960 and an amplifier circuit 964 is depicted to provide an output representing the sensed magnetic field. The amplifier circuit may include a single operational amplifier, and the magnetic sensor may include a single magnetoresistor 968. Figure 61 An embodiment of a magnetic sensor 968 and an amplifier and linearization circuit 972 is depicted to provide a linearized output representing the sensed magnetic field. The amplifier and linearization circuit may include a single operational amplifier, and the magnetic sensor may include a single magnetoresistor. Figure 62 Another embodiment of a magnetic sensor 976, an amplifier circuit 980, and a linearization circuit 984 is shown to provide a linearized output representing the sensed magnetic field. The amplifier and linearization circuits may each include an operational amplifier, and the magnetic sensor may include a single magnetoresistor.Figure 63 Depicts an embodiment of a magnetic sensor 988 and an amplification and linearization circuit 992 to provide an output representative of the sensed magnetic field. The amplification and linearization circuit may include a single operational amplifier, and the magnetic sensor may include a pair of magnetoresistors. Figure 64 Depicts an embodiment of a magnetic sensor 996, an amplification circuit 1000, and a linearization circuit 1004 to provide a linearized output representative of the sensed magnetic field. The amplification and linearization circuits may each include an operational amplifier, and the magnetic sensor may include a pair of magnetoresistors. In other embodiments, the amplification circuit that provides an output representative of the sensed magnetic field may include one or more operational transconductance amplifiers.

[0217] The magnetic sensor may also be driven to bias, drive, or modulate the signal of the sensor. Figure 65 Depicts an embodiment of a magnetic sensor 1008 and a driver circuit 1012 that may be used to bias, drive, or modulate the signal of a magnetic sensor. Figure 65 The magnetic sensor and driver circuit may also be used with embodiments of an amplification circuit, such as Figures 60 - 64 any of the embodiments of the amplification and / or linearization circuits in

[0218] Embodiments of the circuits of the magnetic device may include any subset or combination of the components of any of the circuits discussed herein. For example, the circuit may include one or more components of any of the circuits discussed herein. The circuit may also include one or more components of one or more of the circuits discussed herein arranged in any order (such as an order different from that shown in the exemplary figures). The circuit may also include components in addition to or in place of any subset of the components of the circuits discussed herein.

[0219] The signals between and among the circuits and subcircuits discussed above may be single-ended signals or differential signals.

[0220] The patterned layers discussed herein may be formed as thin films, such as layers fabricated through integrated circuit substrate processing. Alternatively, the patterned layers discussed herein may be relatively thick films, such as layers produced through screen printing or other thick film processes.

[0221] Any feature of any embodiment of the magnetic devices described herein may optionally be used in any other embodiment of the magnetic devices. For example, an embodiment of a magnetic device may include any combination of any embodiment of the magnetic structures discussed herein, any embodiment of other device structures discussed herein, and any embodiment of the circuits discussed herein. Additionally, an embodiment of a magnetic device may optionally include any subset of the components or features of the magnetic devices discussed herein. For example, an embodiment of a magnetic device may optionally include any combination of any embodiment of the magnetic structures discussed herein and any embodiment of other device structures discussed herein, while omitting the circuits.

Claims

1. A magnetic device, comprising: A microfluidic channel embedded in a multilayer structure, the microfluidic channel including an inlet configured to receive a fluid comprising different types of microparticles; And A magnetic structure embedded in the multilayer structure, the magnetic structure being located near the microfluidic channel and being configured to generate a magnetic field such that the different types of microparticles in the fluid are separated in the microfluidic channel, Wherein an integrated circuit is integrated with the magnetic device.

2. The magnetic device according to claim 1, wherein, The magnetic structure includes patterned layers on opposite sides of the microfluidic channel, the patterned layers including a material configured to generate a magnetic field.

3. The magnetic device according to claim 2, further comprising a conductive coil electrically connected to the patterned layer.

4. The magnetic device according to claim 1, wherein, The multilayer structure includes multiple layers on a substrate.

5. The magnetic device according to claim 1, wherein, The multilayer structure includes multiple substrates.

6. The magnetic device according to claim 1, wherein, The microfluidic channel is configured to receive a fluid in a first channel portion, wherein the microfluidic channel includes a channel structure that separates the microfluidic channel into multiple second channel portions, and wherein the second channel portions are configured to receive a respective type of the different types of microparticles.

7. The magnetic device according to claim 1, wherein, The magnetic structure includes a hard magnetic material.

8. The magnetic device according to claim 1, wherein The magnetic structure includes a soft magnetic material.

9. The magnetic device according to claim 1, wherein, The inlet is the only inlet of the microfluidic channel.

10. The magnetic device according to claim 1, further comprising a hole, wherein the magnetic structure is physically aligned with the hole.

11. The magnetic device according to claim 1, further comprising a second magnetic structure, wherein the multilayer structure includes a cap, and wherein the second magnetic structure is located on the cap.

12. A method for separating microparticles, the method comprising: Receiving a fluid through an inlet of a microfluidic channel embedded in a multilayer structure, wherein the fluid includes different types of microparticles; Applying a magnetic field to the fluid in the microfluidic channel by a magnetic structure located near the microfluidic channel and embedded in the multilayer structure; And In response to applying the magnetic field, separating the different types of microparticles in the fluid into respective different channel portions of the microfluidic channel; Wherein a magnetic device including the microfluidic channel and the magnetic structure is integrated with an integrated circuit.

13. The method according to claim 12, further comprising driving a conductive coil electrically connected to the magnetic structure to affect the magnetic field.

14. The method according to claim 12, wherein, The magnetic structure includes two patterned layers on opposite sides of the microfluidic channel.

15. A magnetic device, comprising: A microfluidic channel including an inlet configured to receive a fluid comprising different types of microparticles; A magnetic structure including a patterned layer located near the microfluidic channel, the patterned layer including a material configured to generate a magnetic field such that the different types of microparticles in the fluid are separated in the microfluidic channel, wherein the microfluidic channel and the magnetic structure are embedded in a multilayer structure, and A conductive coil electrically connected to the patterned layer; Wherein the magnetic device is connected to or integrated with an integrated circuit.

16. The magnetic device according to claim 15, wherein, The multilayer structure includes multiple layers on a substrate.

17. The magnetic device according to claim 15, further comprising a second conductive coil, wherein the magnetic structure comprises a second patterned layer electrically connected to the second conductive coil, and wherein the patterned layer and the second patterned layer are located on opposite sides of the microfluidic channel.

18. The magnetic device according to claim 15, further comprising a circuit configured to drive the conductive coil to affect the magnetic field.

19. The magnetic device according to claim 15, further comprising a hole, wherein the magnetic structure is physically aligned with the hole.

20. The magnetic device according to claim 15, further comprising a cap and a second magnetic structure on the cap.

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