Wafer ring taking and mounting device and wafer ring taking and mounting method

Abstract

The application provides a wafer ring taking and mounting device and a wafer ring taking and mounting method, which comprise a material storage assembly, a front section taking mechanism, a rear section taking mechanism and a mounting assembly. The technical effect of the present application is that the material storage assembly can stack multiple wafer rings and can conveniently take out the wafer rings one by one, thereby facilitating automation and improving the efficiency of feeding. The wafer ring in the material storage assembly is taken out by the front section taking mechanism and is once transferred to a transfer taking station, and the wafer ring on the front section taking mechanism is twice transferred by the rear section taking mechanism. The technical problem solved by the present application is that the taking mechanism in the prior art is difficult to directly transport the wafer ring in the material storage assembly to the mounting station. The present application effectively solves this technical problem by adopting the mode of arranging two taking mechanisms. The present application has the advantages of high transfer efficiency and strong adaptability. The mechanical transfer mode effectively improves the transfer precision, so that the position of the wafer ring is more accurate, and the mounting precision of the wafer ring is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing and processing technology, specifically to a wafer ring pick-up and mounting device and a wafer ring pick-up and mounting method. Background Technology

[0002] Wafers, also known as wafer rings, are the raw materials for manufacturing chips and LEDs. After multiple chips or LEDs are fabricated on a wafer, they need to be separated from the wafer one by one. For example, after MiniLEDs are fabricated, they need to be separated from the wafer one by one and mounted onto a glass panel. In existing technologies, manual mounting is usually used, which can easily increase the product defect rate, and the manual work is inefficient and costly. Therefore, there is a need to design a rapid mounting device to solve the problem of rapid mounting of wafer rings. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention discloses a wafer ring picking and placing device and a wafer ring picking and placing method, achieving automated and efficient placing operations. This solution stores wafer rings using a material storage component and places them using a placing component. Specifically, this invention uses a front-end picking mechanism to pick up and place wafer rings from the material storage component, and a rear-end picking mechanism to perform secondary transfer of the wafer rings from the front-end picking mechanism. The technical problem it solves is that existing picking mechanisms often struggle to directly transport wafer rings from the material storage component to the placing station. This solution effectively solves this problem by using two picking mechanisms, offering advantages such as high transfer efficiency and strong adaptability.

[0004] Specifically, this invention proposes a wafer ring pick-up and placement device, comprising:

[0005] Material storage assembly for holding wafer rings;

[0006] The front-end material handling mechanism is used to remove the wafer ring from the material storage assembly and transfer it to the intermediate material handling station;

[0007] The rear-end material handling mechanism is used to transfer the wafer rings transferred by the front-end material handling mechanism at the intermediate material handling station to the mounting station.

[0008] The mounting assembly has a mounting work section (a striking head in the example drawing) for mounting wafer rings transferred to the mounting station.

[0009] The technical advantage of this solution lies in the fact that the material storage component can stack multiple wafer rings and facilitate the individual removal of wafer rings, thereby improving automation and material loading efficiency. This invention uses a front-end picking mechanism to remove wafer rings from the material storage component and transfer them to a transfer picking station. A rear-end picking mechanism then performs a secondary transfer of the wafer rings from the front-end picking mechanism. The technical problem it solves is that existing picking mechanisms struggle to directly transport wafer rings from the material storage component to the mounting station. This solution effectively addresses this problem by using two picking mechanisms, offering advantages such as high transfer efficiency and strong adaptability. The mechanical transfer method effectively improves transfer accuracy, resulting in more accurate wafer ring positioning and thus improved wafer ring mounting accuracy. Furthermore, the front-end picking mechanism includes:

[0010] A first driving mechanism has a rotary driving part and a Y-axis linear motion driving part. The rotary driving part is connected to the Y-axis linear motion driving part in a transmission connection. The Y-axis linear motion driving part drives the rotary driving part to reciprocate along the Y-axis direction.

[0011] The first pick-up hand is mounted on the rotary drive unit. The rotary drive unit drives the first pick-up hand to rotate around the rotation axis of the rotary drive unit. The first pick-up hand is used to pick up and place wafer rings.

[0012] Furthermore, the downstream material handling mechanism includes:

[0013] The second drive mechanism has an X-axis module, a Y-axis module, and a Z-axis module; the X-axis module, Y-axis module, and Z-axis module are used to drive the second material handling hand to move on the X-axis, Y-axis, and Z-axis;

[0014] The second picker is used to transfer the wafer ring between the transfer picker station and the mounting station.

[0015] Furthermore, the second material handling hand includes:

[0016] A base plate, which is connected to the second drive mechanism, is provided with a mounting part, and the mounting part has a receiving opening;

[0017] Mounting base, which is rotatably disposed in the receiving opening;

[0018] A drive assembly, which is mounted on the base plate and is used to drive the mounting base to rotate;

[0019] A clamping mechanism is mounted on the bottom of the mounting base and is used to clamp the wafer ring.

[0020] Furthermore, the mounting base is annular and can rotate along its own axial direction.

[0021] Furthermore, the driving component includes:

[0022] A servo motor is mounted on the base plate, and a drive wheel is fixed on the output shaft of the servo motor.

[0023] A timing belt is disposed in the receiving opening and the timing belt drive is disposed on the drive wheel;

[0024] A timing pulley is fixed coaxially with the mounting base, and the timing pulley is driven on the timing belt.

[0025] Furthermore, the wafer ring pick-up and mounting apparatus also includes a glass panel streamline mechanism for sequentially conveying glass panels that serve as mounting substrates for the wafer ring.

[0026] Furthermore, the wafer ring pick-up and mounting device also includes a lifting and rotating mechanism for lifting the glass panel that has reached the mounting station.

[0027] Furthermore, the wafer ring pick-up and placement device also includes a loading hopper, a loading mini-flow line in the loading hopper, a pick-up station, a unloading station, an unloading hopper, an unloading mini-flow line in the unloading hopper, and a transfer flow line whose two ends are respectively connected to the loading mini-flow line and the unloading mini-flow line.

[0028] Furthermore, it also includes a transfer unloading station for the back-end material handling mechanism to transfer the assembled wafer rings and a second front-end material handling mechanism, the second front-end material handling mechanism including:

[0029] The third driving mechanism has a second rotary driving part and a second Y-axis linear motion driving part. The second rotary driving part is connected to the second Y-axis linear motion driving part in a transmission connection. The second Y-axis linear motion driving part drives the second rotary driving part to reciprocate along the Y-axis direction.

[0030] The third pick-up hand is mounted on the second rotary drive unit. The second rotary drive unit drives the third pick-up hand to rotate around the rotating shaft of the rotary drive unit. The third pick-up hand is used to transfer the completed wafer ring between the intermediate unloading station and the unloading station.

[0031] The present invention also provides a wafer ring pick-up and mounting method, comprising the following steps:

[0032] S1, transport the glass panel to the mounting station;

[0033] When it flows to the mounting station, a lifting and rotating mechanism is usually used to lift the glass panel to a suitable position in order to make the glass panel and the mounting assembly more suitable. In the subsequent mounting process, the glass panel will be rotated and adjusted appropriately according to the position of the wafer ring.

[0034] S2, a single transfer, uses the front-end material handling mechanism to remove the wafer ring and transfer it to the intermediate material handling station;

[0035] S3, Secondary transfer, using the rear-end material handling mechanism to transfer the wafer ring in the front-end material handling mechanism at the intermediate material handling station to the mounting station;

[0036] S4, Placement: Using the striking head of the placement assembly, the chips or LEDs on the wafer ring transferred to the placement station are placed onto the glass panel. During placement, the position of the striking head and the position of the full-load ring can be adjusted to ensure that all chips or LEDs on the wafer ring (a wafer ring that has not yet had chips or LEDs removed is called a full-load ring, and a wafer ring that has completed the removal and placement of all chips or LEDs is called an empty ring, the same below) are placed onto the glass panel.

[0037] Furthermore, in S3, the rear-end material handling mechanism drives the wafer ring to align with the glass panel.

[0038] Furthermore, it also includes the following steps:

[0039] S5, after the mounting is completed, the mounting work unit is reset, and the rear-end material handling mechanism (37) transfers the mounted wafer ring (21) to the intermediate unloading station; then the second front-end material handling mechanism (361) transfers the mounted wafer ring (21) to the unloading station. Through the second front-end material handling mechanism, a third relay is carried out, cooperating with the second material handling hand at the intermediate unloading station to transfer the empty ring to the material storage component for storing empty rings at the unloading station, so that the empty ring recycling work can be completed quickly and automatically.

[0040] This invention features an automated material storage component for stacking wafer rings, similar to the principle of a magazine, hence also called a magazine (in this article, the magazine is the material storage component). Before the operation begins, a magazine filled with full wafer rings is placed at the loading station, and an empty magazine is placed at the unloading station. When the operation begins, the full wafer rings are transferred one by one to the mounting station to be peeled and mounted, becoming empty rings, which are then transferred to the magazine at the unloading station. When all the full wafer rings in the magazine at the loading station are removed, the magazine at the unloading station is filled with empty rings.

[0041] At this point, magazines filled with wafer rings in the loading hopper are moved to the unloading station and positioned via the loading conveyor belt located in the loading hopper. Simultaneously, empty magazines at the loading station are transferred to the unloading station and positioned via the loading conveyor belt and transfer conveyor belt. Meanwhile, magazines filled with empty rings at the unloading station are transferred to the unloading hopper via the unloading conveyor belt for centralized transfer and processing. Through the loading hopper, the loading conveyor belt located in the loading hopper, the unloading station, the unloading station, the unloading hopper, the unloading conveyor belt located in the unloading hopper, and the transfer conveyor belt connecting to the loading and unloading conveyor belts at both ends, the automatic flow of magazines can be achieved, greatly improving work efficiency, extending the time cycle for manual intervention, and increasing the efficiency of manual operations.

[0042] In the initial stage of this invention, an empty magazine A and a magazine B containing a full material ring are sequentially placed into the wafer ring loading hopper. Because the small streamline in the loading hopper is connected to the transfer streamline, magazine A will be flowed to the unloading station on the transfer streamline and then positioned, and magazine B will be flowed to the picking station on the transfer streamline and then positioned; thus realizing the automatic operation and positioning of the magazines.

[0043] 1) "A" and "B" are only for easy distinction between the two magazines;

[0044] 2) The order of the above glass panel and magazine loading operations is not limited and should be performed according to the actual software control settings;

[0045] 3) Sensors for sensing incoming material information and lifting and positioning components can be installed at both the unloading and picking stations on the transfer line. The lifting and positioning components can be a combination of "lifting cylinder, lifting plate, and positioning pin (positioning method is not limited to positioning pin)" or a combination of "motor, lifting screw, lifting plate, and positioning pin", etc. The magazine can be lifted and positioned by the lifting and positioning components, so that the magazine can be separated from the transfer line.

[0046] However, it should be noted that in some embodiments, the magazine B at the material handling station will gradually rise under the drive of the lifting and positioning component, so as to cooperate with the front material handling mechanism to remove the full rings in the magazine B one by one; while the empty magazine A at the unloading station will be lifted to the highest position first and then gradually lowered, so as to cooperate with the second front material handling mechanism to remove the empty rings from the rear material handling mechanism and then put them into the empty magazine A.

[0047] In a specific embodiment, S2: the front material handling mechanism works, the first material handling hand first moves forward along the Y-axis direction, extends into the magazine B, catches a full material ring, and then the first material handling hand moves backward along the Y-axis direction and rotates to a transfer material handling station.

[0048] The first material handling hand can also be equipped with a laser sensor to sense the material.

[0049] In some embodiments, S3: The rear-end material handling mechanism operates, and the second material handling hand moves to the intermediate material handling station under the drive of the Y-axis module, X-axis module, and Z-axis module; the second material handling hand takes away the full material ring;

[0050] Subsequently, the second material handler moves to the mounting station under the drive of the main Y-axis module, main X-axis module, main Z-axis module, and auxiliary Y-axis module;

[0051] illustrate:

[0052] 1) In addition to the main Z-axis module A, the main X-axis module is also connected to the main Z-axis module B and the main Z-axis module C. The main Z-axis module B is used to drive the striking head, and the main Z-axis module C is used to drive the guiding detection mechanism.

[0053] 2) The guiding and testing mechanism includes a CCD camera, a barcode scanner, and a laser position sensor. The barcode scanner is used to scan and identify the QR code on the full material ring. The CCD camera and the laser position sensor can work together to guide and position the second material picker. S4: When the second material picker moves the full material ring to match the position of the glass panel, the striking head of the mounting mechanism works to mount the LED on the full material ring onto the glass panel.

[0054] During mounting, the position of the striking head and the position of the full material ring are adjusted to ensure that all LEDs on the full material ring are mounted onto the glass panel.

[0055] S5: After the mounting is completed, the striking head is reset, and the second material handling hand moves to a transfer unloading station under the drive of the main Y-axis module, main X-axis module, main Z-axis module and auxiliary Y-axis module.

[0056] When the second front-end material handling mechanism is working, the third material handling hand catches the empty ring, rotates it, and moves forward along the Y-axis to insert it into the magazine A. After placing the empty ring, it moves backward along the Y-axis to prepare for the next operation.

[0057] Explanation: When magazine A is full of empty rings, magazine A will flow into the wafer ring unloading hopper and then be manually removed; correspondingly, the original magazine B becomes an empty magazine and flows to the unloading station on the transfer line, where it is manually replenished into the wafer ring loading hopper. Attached Figure Description

[0058] Figure 1 This is a three-dimensional structural schematic diagram of a wafer ring picking and mounting device proposed in this embodiment;

[0059] Figure 2 This is a three-dimensional structural diagram of the rear material handling mechanism in this embodiment;

[0060] Figure 3 This is a schematic diagram of the operation between the front-end material handling mechanism and the material storage device in this embodiment;

[0061] Figure 4 yes Figure 3 A magnified schematic diagram of the local structure at point A;

[0062] Figure 5 This is a three-dimensional structural diagram of the front-end material handling mechanism in this embodiment.

[0063] Figure 6 This is a three-dimensional structural diagram of the second material handling hand in this embodiment;

[0064] Figure 7 This is a cross-sectional view of the second material handling hand in this embodiment;

[0065] Figure 8 This is a schematic diagram of the clamping mechanism in the second material handling hand in this embodiment;

[0066] Figure 9 This is a three-dimensional structural diagram of the braking mechanism in the second material handling hand in this embodiment;

[0067] Figure 10 This is a schematic diagram of the three-dimensional structure of the wafer in this embodiment;

[0068] Figure 11 This is a top-view structural diagram of the wafer in this embodiment.

[0069] The reference numerals used in the attached figures are as follows:

[0070] 11 Base plate; 12 Mounting section; 13 Receiving port; 14 Mounting base; 15 Drive assembly; 16 Clamping mechanism; 17 Servo motor; 18 Synchronous belt; 19 Synchronous pulley; 20 Mounting groove; 21 Wafer ring; 22 Engaging groove; 23 Clamping arm; 24 Limit pin; 25 Torsion spring; 26 Support protrusion; 27 Telescopic cylinder; 28 Connecting plate; 29 Braking component; 30 Guide rail assembly; 31 Sensor; 32 Worktable; 33 Worktable surface; 34 Loading hopper; 34 Discharging hopper; 35 Mounting assembly Front-end material handling mechanism 36; Second front-end material handling mechanism 361; Rear-end material handling mechanism 37; Rotary drive unit 38; Y-axis linear motion drive unit 39; First material handling hand 40; X-axis module 41; Y-axis module 42; Z-axis module 43; Z-axis drive mechanism 45; Magazine B 46; Magazine A 461; Transfer streamline 47; Loading station 48; Glass panel streamline mechanism 49; Glass panel 50; CCD camera 51; Scanner 52; Laser position sensor 53; Protrusion 54. Detailed Implementation

[0071] The present invention will now be described in further detail with reference to the accompanying drawings.

[0072] The present invention will now be described in further detail with reference to the accompanying drawings. Figure 1 The coordinate indicators in the diagram determine the directions of the X-axis, Y-axis, and Z-axis mentioned in this invention.

[0073] like Figures 1 to 5 As shown, a wafer ring pick-and-place apparatus includes:

[0074] The material loading hopper 34 is used to place the wafer ring 21;

[0075] The front-end material handling mechanism 36 is used to take out the wafer ring 21 from the loading hopper 34 and transfer it to the intermediate material handling station;

[0076] The rear-end material handling mechanism 37 is used to transfer the wafer ring 21 transferred by the front-end material handling mechanism 36 at the intermediate material handling station to the mounting station;

[0077] The mounting assembly 35 has a mounting work section (in the example drawing, a striking head, used for mounting operations on wafer rings 21 on which MiniLED arrays are fabricated), which is used to mount wafer rings 21 transferred to the mounting station.

[0078] The technical advantage of this solution lies in the fact that the material storage component can stack multiple wafer rings and facilitate the individual removal of each wafer ring, thereby improving automation and material loading efficiency. This invention uses a front-end picking mechanism to remove wafer rings from the material storage component and transfer them to a transfer picking station. A rear-end picking mechanism then performs a secondary transfer of the wafer rings from the front-end picking mechanism. The technical problem it solves is that existing picking mechanisms struggle to directly transport wafer rings from the material storage component to the placement station. This solution effectively addresses this problem by using two picking mechanisms, offering advantages such as high transfer efficiency and strong adaptability. The mechanical transfer method effectively improves transfer accuracy, resulting in more precise wafer ring positioning and thus improved wafer ring placement accuracy.

[0079] In some embodiments, the front-end material handling mechanism 36 includes: a first drive mechanism having a rotary drive unit 38 and a Y-axis linear motion drive unit 39, wherein the rotary drive unit 38 is convexly connected to the Y-axis linear motion drive unit 39, and the Y-axis linear motion drive unit 39 drives the rotary drive unit 38 to reciprocate along the Y-axis direction; and a first material handling hand 40, mounted on the rotary drive unit 38, wherein the rotary drive unit 38 drives the first material handling hand to rotate around the axis of the rotary drive unit 38, and the first material handling hand 40 is used to pick up and place the wafer ring 21. The front-end material handling mechanism innovatively uses only forward and backward movement along the Y-axis to acquire the wafer ring 21, and then quickly transfers the wafer ring 21 to the intermediate material handling station through rotation. It has the advantages of simple structure and high efficiency.

[0080] In practical applications, in order to cooperate with the front-end material handling mechanism 36 and to conveniently and quickly transfer the wafer ring 21 to the mounting station, the back-end material handling mechanism needs to perform displacement in three-dimensional space. This makes the robotic arm control complex and costly. To achieve the same purpose and reduce costs, in some embodiments, the back-end material handling mechanism 37 includes:

[0081] The second drive mechanism has an X-axis module 41, a Y-axis module 42, and a Z-axis module 43; the X-axis module 41, the Y-axis module 42, and the Z-axis module 43 are used to drive the second pick-up hand to move on the X-axis, Y-axis, and Z-axis; the second pick-up hand is used to transfer the wafer ring 21 between the transfer pick-up station and the mounting station.

[0082] The second material handling hand includes:

[0083] A base plate 11 is connected to the second drive mechanism. The base plate 11 is provided with a mounting part 12, and the mounting part 12 is provided with a receiving opening 13.

[0084] Mounting base 14, which is rotatably disposed in the receiving opening 13;

[0085] A drive assembly 15 is mounted on the base plate 11 and is used to drive the mounting base 14 to rotate.

[0086] A clamping mechanism 16 is mounted on the bottom of the mounting base 14 and is used to clamp the wafer ring 21.

[0087] The mounting base 14 is annular and rotates along its own axial direction.

[0088] In practical applications, the driving component 15 can adopt the following schemes, including:

[0089] Servo motor 17, the servo motor 17 is mounted on the base plate 11, and a drive wheel is fixed on the output shaft of the servo motor 17;

[0090] A timing belt 18 is disposed in the receiving port 13 and is driven on the drive wheel;

[0091] Synchronous pulley 19 is coaxially fixed to the mounting base 14 and is driven onto the synchronous belt 18. The servo motor 17 drives the synchronous pulley 19 to rotate, which in turn drives the wafer ring 21 to rotate horizontally, adjusting the wafer ring 21 to the optimal mounting angle to cooperate with the striking head.

[0092] In some embodiments, the wafer ring pick-and-place apparatus further includes a glass panel streamline mechanism 49 for sequentially conveying the glass panel 50, which serves as the mounting substrate for the wafer ring 21. Figure 1 In the example, the glass panel 50 enters the mounting station from the loading end from left to right, and then goes to the recycling end (discharging end).

[0093] To ensure the accuracy and reliability of the placement operation, the wafer ring pick-up and placement device also includes a lifting and rotating mechanism. Figure 1 Located below the glass panel 50 (at the placement station), this mechanism is used to lift the glass panel 50 to the placement station. It simultaneously functions as a support, lifting, and rotation unit. It can fix the glass panel 50, raise and lower its height to a suitable placement height, and rotate the glass panel 50 to match the angle of the wafer ring 21, achieving fast and accurate placement and improving placement precision and efficiency. In practical applications, the upper part of the lifting and rotating mechanism is a flat panel with multiple vacuum suction holes. This uses negative vacuum to firmly hold the glass panel 50 in place, preventing displacement and ensuring placement accuracy.

[0094] In the optimized solution, to extend the operation cycle of manual intervention, reduce labor intensity, and improve operation efficiency, the wafer ring pick-and-place device also includes a loading bin 34, a loading conveyor line located in the loading bin 34, a pick-up station (located at the magazine B46), a unloading station (magazine A461), an unloading bin 341, an unloading conveyor line located in the unloading bin 341, and a transfer conveyor line 47 with its two ends connected to the loading and unloading conveyors respectively. The loading bin 34 can pre-store one or more wafer rings filled with chips or LED arrays (with intact chips or LED arrays) ready for the placement process. Figure 1 The example shows one cartridge, plus cartridge B at the loading station, meaning there are two cartridges filled with wafer rings. This implies that one cycle requiring manual loading (or robotic loading) is the time it takes for the wafer rings in both cartridges to be mounted. If this cycle needs to be increased, the loading hopper 34 can be enlarged to pre-store more cartridges, and the unloading hopper can be adjusted accordingly. If the loading and unloading hoppers are connected to cartridge conveyor lines, cartridges can be continuously fed, delivering full-loaded wafer rings to the loading station while empty cartridges are delivered to the unloading station via transfer line 47. Simultaneously, cartridges filled with empty wafer rings are delivered to the unloading hopper, and cartridges filled with empty wafer rings in the unloading hopper are delivered to the recycling device, completing fully automated loading and unloading. When space is limited, this can be achieved using... Figure 1 Example: Magazines in the loading and unloading hoppers are loaded and retrieved in a timely manner by manual labor or robotic arms to ensure uninterrupted execution of the entire process.

[0095] To expedite the retrieval of empty rings and reduce the complexity of the front-end material handling mechanism, a transfer unloading station and a second front-end material handling mechanism 361, identical (or different) than the front-end material handling mechanism, are added. The transfer unloading station is used by the rear-end material handling mechanism 37 to transfer the completed wafer ring 21 (empty ring). The third hand of the second front-end material handling mechanism 361 receives the empty ring, rotates it to the position corresponding to the magazine A461, moves linearly along the Y-axis, extends into the magazine A461, and lowers the empty ring. The second front-end material handling mechanism 361 and the front-end material handling mechanism 36 adopt the same structure, including:

[0096] The third driving mechanism has a second rotary driving part and a second Y-axis linear motion driving part. The second rotary driving part is connected to the second Y-axis linear motion driving part in a transmission connection. The second Y-axis linear motion driving part drives the second rotary driving part to reciprocate along the Y-axis direction.

[0097] The third pick-up hand is mounted on the second rotary drive unit. The second rotary drive unit drives the third pick-up hand to rotate around the rotating shaft of the rotary drive unit. The third pick-up hand is used to transfer the completed wafer ring 21 between the intermediate unloading station and the unloading station.

[0098] The working principle of this invention and the wafer ring pick-up and mounting method include the following steps:

[0099] S1, transport the glass panel to the mounting station;

[0100] When it flows to the mounting station, a lifting and rotating mechanism is usually used to lift the glass panel to a suitable position in order to make the glass panel and the mounting assembly more suitable. In the subsequent mounting process, the glass panel will be rotated and adjusted appropriately according to the position of the wafer ring.

[0101] S2, one transfer, the front-end material handling mechanism 36 takes out the wafer ring 21 and transfers it to the intermediate material handling station;

[0102] S3, Secondary transfer, using the rear material handling mechanism (37), the wafer ring (21) in the front material handling mechanism (36) at the intermediate material handling station is transferred to the mounting station;

[0103] S4, Placement: Using the striking head of the placement assembly (35), the chips or LEDs on the wafer ring (21) transferred to the placement station are placed onto the glass panel. During placement, the position of the striking head and the position of the full-load ring can be adjusted to ensure that all LEDs on the wafer ring (a wafer ring that has not yet had chips or LEDs removed is called a full-load ring, and a wafer ring that has completed the removal and placement of all chips or LEDs is called an empty ring, the same below) are placed onto the glass panel.

[0104] Furthermore, in S3, the rear-end material handling mechanism (37) drives the wafer ring to match the position of the glass panel.

[0105] Furthermore, it also includes the following steps:

[0106] S5. After the placement is completed, the striking head is reset. The second pick-up hand, driven by the main Y-axis module, main X-axis module, main Z-axis module, and auxiliary Y-axis module, moves the wafer ring without chips or LEDs to the intermediate unloading station. The third pick-up hand of the second front pick-up mechanism catches the wafer ring, rotates it, and then moves forward along the Y-axis to the unloading station. After placing the wafer ring, it moves backward along the Y-axis to prepare for the next operation.

[0107] The second front-end material handling mechanism takes over for the third time, cooperating with the second material handling operator at the transfer and unloading station to transfer the empty ring to the material storage component where empty rings are stored at the unloading station. This allows for the rapid and automatic completion of the empty ring recycling process.

[0108] This invention features an automated material storage component for stacking wafer rings, similar to the principle of a magazine, hence also called a magazine (in this article, the magazine is the material storage component). Before the operation begins, a magazine filled with full wafer rings is placed at the loading station, and an empty magazine is placed at the unloading station. When the operation begins, the full wafer rings are transferred one by one to the mounting station to be peeled and mounted, becoming empty rings, which are then transferred to the magazine at the unloading station. When all the full wafer rings in the magazine at the loading station are removed, the magazine at the unloading station is filled with empty rings.

[0109] At this time, the magazines filled with wafer rings in the loading hopper are moved to the unloading station and positioned by the loading conveyor belt in the loading hopper. At the same time, the empty magazines at the loading station are transferred to the unloading station and positioned by the loading conveyor belt and the transfer conveyor belt. Meanwhile, the magazines filled with empty rings at the unloading station are transferred to the unloading hopper by the unloading conveyor belt for centralized transfer and processing.

[0110] The automatic circulation of magazines can be achieved through the feeding hopper, the feeding conveyor line in the feeding hopper, the picking station, the unloading station, the unloading hopper, the unloading conveyor line in the unloading hopper, and the transfer conveyor line that connects to the feeding conveyor line and the unloading conveyor line at both ends, which greatly improves work efficiency, extends the time cycle of manual intervention, and improves the efficiency of manual operation.

[0111] In the initial stage of this invention, an empty magazine A and a magazine B containing a full feed ring are sequentially placed into the wafer ring loading hopper. Because the small streamline in the loading hopper connects with the transfer streamline, magazine A is directed to the unloading station on the transfer streamline and then positioned, while magazine B is directed to the picking station on the transfer streamline and then positioned; thus achieving automatic magazine operation and positioning. The glass panel streamline mechanism 49, the loading streamline, the transfer streamline 47, and the unloading streamline in this invention can all employ magnetic wheel streamline mechanisms.

[0112] 1) "A" and "B" are only for easy distinction between the two magazines;

[0113] 2) The order of the above glass panel and magazine loading operations is not limited and should be performed according to the actual software control settings;

[0114] 3) Sensors for sensing incoming material information and lifting and positioning components can be installed at both the unloading and picking stations on the transfer line. The lifting and positioning components can be a combination of "lifting cylinder, lifting plate, and positioning pin (positioning method is not limited to positioning pin)" or a combination of "motor, lifting screw, lifting plate, and positioning pin", etc. The magazine can be lifted and positioned by the lifting and positioning components, so that the magazine can be separated from the transfer line.

[0115] However, it should be noted that in some embodiments, the magazine B at the material handling station will gradually rise under the drive of the lifting and positioning component, so as to cooperate with the front material handling mechanism to remove the full rings in the magazine B one by one; while the empty magazine A at the unloading station will be lifted to the highest position first and then gradually lowered, so as to cooperate with the second front material handling mechanism to remove the empty rings from the rear material handling mechanism and then put them into the empty magazine A.

[0116] In a specific embodiment, S2: the front material handling mechanism works, the first material handling hand first moves forward along the Y-axis direction, extends into the magazine B, catches a full material ring, and then the first material handling hand moves backward along the Y-axis direction and rotates to a transfer material handling station.

[0117] The first material handling hand can also be equipped with a laser sensor to sense the material.

[0118] In some embodiments, S3: The rear material handling mechanism operates, and the second material handling hand moves to the intermediate material handling station under the drive of the main Y-axis module, the main X-axis module, the main Z-axis module A, and the auxiliary Y-axis module; then, with the cooperation of the push rod mechanism, the second material handling hand takes away the full material ring;

[0119] Subsequently, the second material handler moves to the mounting station under the drive of the main Y-axis module, main X-axis module, main Z-axis module, and auxiliary Y-axis module;

[0120] Note: 1) In addition to the main Z-axis module A, the main X-axis module is also connected to the main Z-axis module B and the main Z-axis module C. The main Z-axis module B is used to drive the striking head, and the main Z-axis module C is used to drive the guiding detection mechanism.

[0121] 2) The guiding and testing mechanism includes a CCD camera, a barcode scanner, and a laser position sensor. The barcode scanner is used to scan and identify the QR code on the full material ring. The CCD camera and the laser position sensor can work together to guide and position the second material picker. S4: When the second material picker moves the full material ring to match the position of the glass panel, the striking head of the mounting mechanism works to mount the LED on the full material ring onto the glass panel.

[0122] During mounting, the position of the striking head and the position of the full material ring are adjusted to ensure that all LEDs on the full material ring are mounted onto the glass panel.

[0123] S5: After the mounting is completed, the striking head is reset, and the second material handling hand moves to a transfer unloading station under the drive of the Y-axis module, X-axis module and Z-axis module;

[0124] When the second front-end material handling mechanism is working, the third material handling hand catches the empty ring, rotates it, and moves forward along the Y-axis to insert it into the magazine A. After placing the empty ring, it moves backward along the Y-axis to prepare for the next operation.

[0125] Explanation: When magazine A is full of empty rings, magazine A will flow into the wafer ring unloading hopper and then be manually removed; correspondingly, the original magazine B becomes an empty magazine and flows to the unloading station on the transfer line, where it is manually replenished into the wafer ring loading hopper 34.

[0126] like Figure 1 As shown, in practical applications, it usually also includes a worktable 32, and the upper end of the worktable 32 is provided with a work surface 33;

[0127] The feeding bin 34 is disposed on the workbench 32, and the feeding bin 34 is used to pre-place at least one magazine filled with a full material ring;

[0128] The mounting assembly 35 is set on the workbench 33. The mounting assembly 35 has a striking head, which is used to remove the chip or MiniLED on the wafer ring 21 from the wafer ring and mount it onto the glass panel 50 or other carrier to complete the mounting operation.

[0129] The front-end material handling mechanism 36 is set on the workbench 33 and is used to clamp and transfer the wafer ring 21 in the magazine A461 at the loading station to the intermediate material handling station.

[0130] The rear-end material handling mechanism 37 is used to transfer the wafer ring 21 in the front-end material handling mechanism 36 to the placement station of the placement assembly 35.

[0131] As one implementation method of this embodiment, such as Figure 5 As shown, the front-end material handling mechanism 36 includes:

[0132] The first drive mechanism has a rotary drive unit 38 and a Y-axis linear motion drive unit 39. The Y-axis linear motion drive unit 39 is disposed on the worktable surface 33, and the rotary drive unit 38 is disposed on the output end of the Y-axis linear motion drive unit 39.

[0133] The first pick-up handle 40 is used to pick up and place the wafer ring 21, and the first pick-up handle 40 is disposed on the output end of the rotary drive unit 38.

[0134] The technical advantages of this solution are as follows: the Y-axis linear motion drive is used to drive the first material handling hand 40 to extend into the material loading bin 34; the rotary drive unit 38 is used to drive the first material handling hand 40 to rotate, thereby facilitating the effective transfer of the wafer ring 21.

[0135] In practical applications, the Y-axis linear motion drive unit 39 can be a linear motor; or the linear motion drive unit can be a KK module, which is driven by a servo motor.

[0136] As one implementation method of this embodiment, such as Figure 2 As shown, the rear material handling mechanism 37 includes:

[0137] The second drive mechanism has an X-axis module 41, a Y-axis module 42 and a Z-axis module 43. The Y-axis module 42 is mounted on the worktable 33 by a support. The X-axis module 41 is mounted on the output end of the Y-axis module 42 and the Z-axis module 43 is mounted on the output end of the X-axis module 41.

[0138] The second material handler is located on the output end of the Z-axis module 43.

[0139] The third material handler has a rotatable structure and is identical to the first material handler 40. This reduces the need for spare parts and lowers production and maintenance costs.

[0140] The technical advantage of this solution is that it enables secondary transfer of the wafer ring 21.

[0141] Furthermore, the second material handler is mounted on the output end of the Z-axis module 43 via a Y-axis drive mechanism. Figure 2 Because the Y-axis drive mechanism is obscured, it cannot be clearly shown in the attached diagram.

[0142] The technical advantage of this solution is that it can control the second pick-up hand to move along the Y direction, thereby facilitating the receiving and transfer of wafer ring 21 on the first pick-up hand 40.

[0143] As one implementation method of this embodiment, such as Figure 2 As shown, a Z-axis drive mechanism 45 is also provided on the output end of the X-axis module 41, and a mounting component 35 is provided on the output end of the Z-axis drive mechanism 45.

[0144] The technical advantage of this solution is that it facilitates the control of the vertical position of the mounting component 35, thereby making the mounting component 35 work more accurately.

[0145] In one embodiment, the worktable 33 is further equipped with one or more combinations of a CCD camera 51, a scanning gun 52, and a laser position sensor 53. The CCD camera 51, scanning gun 52, and laser position sensor 53 are arranged according to specific design requirements. For example, the CCD camera 51 and laser position sensor 53 can be used to guide the second picker to grasp the wafer rings. The scanning gun 52 can be used to guide the first picker to grasp and transfer the wafer rings in the magazine B46. Alternatively, existing positioning and control methods can be used to control the operation of the picker.

[0146] The technical advantage of this solution is that it facilitates the position detection of the wafer ring 21 and adjusts the position of the wafer ring 21 by driving the second pick-up hand through the control program, thereby facilitating the placement assembly 35 to perform operations on the wafer ring 21.

[0147] As one implementation method of this embodiment, such as Figures 6 to 11 As shown, the second material handler includes:

[0148] A base plate 11 is provided with a mounting part 12, and a receiving opening 13 is provided in the mounting part 12.

[0149] Mounting base 14 is rotatably disposed in receiving port 13;

[0150] Drive assembly 15 is mounted on base plate 11 and is used to drive mounting base 14 to rotate.

[0151] The clamping mechanism 16 is installed at the bottom of the mounting base 14 and is used to clamp the wafer ring 21. Generally, the side of the wafer ring 21 is selected for clamping.

[0152] The technical effect of this solution is that it proposes a technical solution for clamping the edge of the wafer ring 21, thereby realizing the picking and placing of the wafer ring 21. At the same time, by setting the driving component 15 to drive the mounting base 14 to rotate, the position adjustment of the wafer ring 21 is realized.

[0153] As one implementation method of this embodiment, such as Figure 6 and Figure 7 As shown, the mounting base 14 is annular and rotates along its own axial direction. The technical advantage of this solution is that by setting the mounting base 14 to annular shape, it is easy for the mounting base 14 to rotate in the receiving port 13, and it requires less space for movement.

[0154] As one implementation method of this embodiment, such as Figure 6 As shown, the drive component 15 includes:

[0155] Servo motor 17 is mounted on base plate 11, and a drive wheel is fixed on the output shaft of servo motor 17; the drive wheel is not visible in the figure and is covered by synchronous belt 18.

[0156] A timing belt 18 is disposed in the receiving port 13 and the timing belt 18 is driven on the drive wheel;

[0157] Synchronous pulley 19 is coaxially fixed with mounting base 14, and the synchronous pulley 19 is driven on synchronous belt 18.

[0158] The working principle of this solution is as follows: When the servo motor 17 is working, the drive wheel drives the synchronous wheel 19 to rotate through the synchronous belt 18, which in turn drives the mounting base 14 to rotate, thereby adjusting the angle of the wafer ring 21.

[0159] As one implementation method of this embodiment, such as Figure 6 and Figure 7 As shown, a mounting groove 20 is provided between the upper and lower surfaces of the mounting base 14, and a locking groove 22 for locking the wafer ring 21 is provided on the lower surface of the mounting base 14. The locking groove 22 and the mounting groove 20 are connected, and the clamping mechanism 16 is provided in the mounting groove 20.

[0160] As one implementation method of this embodiment, such as Figure 7 and Figure 8 As shown, the clamping mechanism 16 includes:

[0161] The clamping arm 23 is rotatably disposed in the limiting pin 24 of the mounting groove 20 at one end away from the engaging groove 22, and a torsion spring 25 is provided between the clamping arm 23 and the limiting pin 24.

[0162] The pushing mechanism has a pushing end that moves in a vertical direction, which passes through the mounting groove 20 and is used to push the clamping arm 23 to rotate.

[0163] The pushing mechanism, not shown in the attached drawings, can be in the form of a cylinder or an electric push rod, with a push block on the output end of the cylinder or electric push rod. Alternatively, the pushing mechanism includes a drive unit with an output end that moves vertically, and a push rod that can be inserted into the mounting slot 20. The drive unit can be mounted on a gantry on the worktable, or a three-axis module mechanism can be added to the worktable, with the drive unit mounted on the corresponding three-axis module. This part is not shown in the attached drawings.

[0164] Working principle: The pushing end of the pushing mechanism passes through the mounting groove 20 and pushes the clamping arm 23 to rotate a certain angle. At this time, the lower end of the clamping arm 23 moves away from the engagement groove 22. After the engagement groove 22 engages with the side of the wafer ring 21, the pushing mechanism resets. At this time, under the action of the torsion spring 25, the clamping arm 23 moves towards the engagement groove 22 and clamps the wafer ring 21. As one embodiment of this invention, as follows... Figure 8 As shown, a support protrusion 26 is provided at the bottom of the clamping arm 23 near the engaging groove 22. The technical advantage of this solution is that the support protrusion 26 is used to support the bottom of the wafer ring 21 and to prevent the wafer ring 21 from falling off.

[0165] As one implementation method of this embodiment, such as Figure 6 As shown, the receiving port 13 is equipped with a braking mechanism for braking the mounting base 14. The technical advantage of this solution is that it can effectively control the rotation angle of the mounting base 14 by braking the mounting base 14.

[0166] As one implementation method of this embodiment, such as Figure 9 As shown, the braking mechanism includes a telescopic cylinder 27. One end of the telescopic cylinder 27 is fixed to the base plate 11 via a connecting plate 28, and the other end of the telescopic cylinder 27 is fixed with a braking component 29.

[0167] The technical advantage of this solution is that by extending and retracting the telescopic cylinder 27 to drive the brake component 29 to move, the mounting seat 14 can be effectively braked, which has the advantage of high braking efficiency.

[0168] As one implementation method of this embodiment, such as Figure 9 As shown, the brake component 29 is mounted on the base plate 11 via the guide rail assembly 30, and the track direction of the guide rail assembly 30 is the same as the extension and retraction direction of the telescopic cylinder 27.

[0169] The technical effect of this solution is that it provides guidance for the movement of the brake component 29, making the movement trajectory of the brake component 29 straight, and effectively improving the service life of the brake component 29.

[0170] As one embodiment of this invention, the receiving port 13 is also provided with a sensor 31 for detecting the rotation angle of the mounting base 14.

[0171] During operation, firstly, driven by the rear-end material handling mechanism 37, the mounting base 14 of the second material handling hand moves to a certain height directly above the wafer ring 21. Then, the rear-end material handling mechanism 37 drives the second material handling hand to continue descending to a suitable height above the wafer ring 21, so that the wafer ring 21 falls into the locking groove 22. During the descent, the pushing mechanism operates, and its pushing end presses down to push multiple clamping arms 23, causing the multiple clamping arms 23 to deflect away from the locking groove 22. Subsequently, the pushing mechanism resets upward, and the multiple clamping arms 23 elastically reset under the action of the torsion spring 25, thereby clamping and fixing the wafer ring 21 in the locking groove 22. Then, the pushing end of the pushing mechanism moves upward, and under the action of the torsion spring 25, the clamping arms 23 rotate toward the locking groove 22, thereby clamping the wafer ring 21. The servo motor 17 can drive the wafer ring 21 to rotate at a certain angle through the synchronous belt 18 and synchronous pulley 19; the sensor 31 is used to sense the rotation angle of the mounting base 14, and then feeds it back to the control system to facilitate the control of the entire equipment.

[0172] The worktable 33 is also equipped with a glass panel streamline mechanism 49 for conveying glass panels 50, which serve as substrates for mounting chips or miniLEDs separated from the wafer ring 21. The glass panels 50 are conveyed sequentially via the glass panel streamline mechanism 49, and the mounting assembly 35 separates the chips or miniLEDs from the wafer ring 21 and mounts them onto the glass panels 50. The structure of the wafer ring 21 is as follows: Figure 10 and Figure 11 As shown. The glass panel streamline mechanism 49 is preferably a wheel streamline, and more preferably a magnetic wheel streamline, which has the advantages of good applicability, smooth transmission, high reliability, no dust or noise generated during transmission, and long service life; it is particularly suitable for semiconductor device processing.

[0173] The loading hopper 34 has a pull-out hopper with a loading streamline inside. However, this streamline is obscured by the hopper in the attached diagram and is not directly visible. A magazine B46 for storing the wafer ring 21 is placed on the flow transport line. The unloading hopper 341 can have the same structure, with an unloading streamline inside. The pull-out drive of both the loading and unloading hoppers 344 and 341 is achieved through a motor and a lead screw module. These motors and lead screw modules are existing technology and will not be described in detail here.

[0174] The wafer ring 21 is placed in the slot of the magazine B46.

[0175] During operation, at the initial stage, an empty magazine A461 is placed at the unloading station on the transfer line of workbench 32. The magazine B46, fully loaded with wafer rings 21, is manually placed on the loading conveyor in the loading hopper 34. The motor drives the lead screw module to retract the hopper, making the flow transmission line flush with the transfer line 47. Both the loading conveyor and the transfer line 47 are roller conveyors. The fully loaded magazine B46 is driven to the loading station 48 via the loading conveyor and the transfer line 47. The loading station 48 is equipped with a lifting module for raising and lowering the magazine B46. The upper surface of the first picking hand 40 is provided with multiple protrusions 54 for limiting the circumference of the wafer ring 21. As the magazine B46 moves vertically, the wafer ring 21 falls into the inside of the protrusions 54, making it easier for the first picking hand 40 to pick up the wafer ring 21. As one implementation scheme for the lifting module, a combination of a motor, a lifting screw module, and a lifting plate can be used. This drives the magazine B46 to gradually rise, completing the sequential picking of wafer rings 21 by the first picker 40. After the front-end picking mechanism 36 and the rear-end picking mechanism 37 transfer the wafer rings 21, the striking head on the mounting assembly 35 strikes and separates the chips or miniLEDs from the wafer rings 21. The second front-end picking mechanism 361 works in conjunction with the rear-end picking mechanism 37 to take away the empty wafer rings 21 and send them into the empty magazine A461. The specific structure of the second front-end picking mechanism 361 is the same as that of the front-end picking mechanism 36. Additionally, a lifting module is also installed at the unloading station to drive the empty magazine A461 to gradually descend. When the empty magazine A461 is filled with wafer rings 21, it will flow into the unloading hopper 341 via the transfer flow line 47. The structure of the loading hopper 34 is preferably the same as that of the unloading hopper 341.

[0176] The technical advantages of this solution are as follows: In MiniLED transfer technology, this solution stores the wafer ring 21 using a loading bin 34 and performs the mounting operation on the wafer ring 21 using a mounting assembly 35. Specifically, this invention uses a front-end picking mechanism 36 to pick up and place the wafer ring 21 from the loading bin 34, and a rear-end picking mechanism 37 to perform secondary transfer of the wafer ring 21 from the front-end picking mechanism 36. The technical problem it solves is that existing picking mechanisms have difficulty directly transporting the wafer ring 21 from the loading bin 34 to the mounting station. This solution effectively solves this problem by using two picking mechanisms, offering advantages such as high transfer efficiency and strong adaptability. The mechanical transfer method effectively improves transfer accuracy, resulting in more accurate positioning of the wafer ring 21 and thus improving the mounting accuracy of the wafer ring 21.

[0177] For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this invention, and these all fall within the protection scope of this invention.

Claims

1. A wafer ring pick-up and mounting device, characterized in that, include: The loading hopper is used to place the wafer ring (21); The front-end material handling mechanism (36) is used to take out the wafer ring (21) in the loading bin of the material handling station and transfer it to the intermediate material handling station; The rear-end material handling mechanism (37) is used to transfer the wafer ring (21) transferred by the front-end material handling mechanism (36) at the intermediate material handling station to the mounting station; The mounting assembly (35) has a mounting work section for mounting wafer rings (21) transferred to the mounting station; The wafer ring pick-up and placement device also includes a loading hopper, a loading mini-flow line in the loading hopper, a pick-up station, a unloading station, an unloading hopper, an unloading mini-flow line in the unloading hopper, and a transfer flow line whose two ends are respectively connected to the loading mini-flow line and the unloading mini-flow line; At this time, the magazines filled with wafer rings in the loading hopper are moved to the unloading station and positioned through the loading conveyor in the loading hopper. Meanwhile, the empty magazines at the loading station are transferred to the unloading station and positioned through the loading conveyor and transfer conveyor. At the same time, the magazines filled with empty rings at the unloading station are transferred to the unloading hopper through the unloading conveyor for centralized transfer and processing. It also includes a transfer unloading station for the back-end material handling mechanism (37) to transfer the assembled wafer ring (21) and a second front-end material handling mechanism (361), the second front-end material handling mechanism (361) including: The third driving mechanism has a second rotary driving part and a second Y-axis linear motion driving part. The second rotary driving part is connected to the second Y-axis linear motion driving part in a transmission connection. The second Y-axis linear motion driving part drives the second rotary driving part to reciprocate along the Y-axis direction. The third pick-up hand is installed on the second rotary drive unit. The second rotary drive unit drives the third pick-up hand to rotate around the rotating shaft of the rotary drive unit. The third pick-up hand is used to transfer the completed wafer ring (21) between the intermediate unloading station and the unloading station. The front-end material handling mechanism (36) includes: The first driving mechanism has a rotary driving part (38) and a Y-axis linear motion driving part (39). The rotary driving part (38) is connected to the Y-axis linear motion driving part (39) in a transmission connection. The Y-axis linear motion driving part (39) drives the rotary driving part (38) to reciprocate along the Y-axis direction. The first pick-up hand (40) is mounted on the rotary drive unit (38). The rotary drive unit (38) drives the first pick-up hand to rotate around the rotating shaft of the rotary drive unit (38). The first pick-up hand (40) is used to pick up and place wafer rings (21). The rear material handling mechanism (37) includes: The second drive mechanism has an X-axis module (41), a Y-axis module (42), and a Z-axis module (43); the X-axis module (41), the Y-axis module (42), and the Z-axis module (43) are used to drive the second material handling hand to move on the X-axis, Y-axis, and Z-axis; The second picker is used to transfer the wafer ring (21) between the transfer picker station and the mounting station.

2. The wafer ring pick-and-place apparatus according to claim 1, characterized in that, The second material handler includes: A base plate (11) is connected to the second drive mechanism. The base plate (11) is provided with a mounting part (12) and a receiving opening (13) is provided in the mounting part (12). Mounting base (14), which is rotatably disposed in the receiving opening (13); A drive assembly (15) is mounted on the base plate (11) and is used to drive the mounting base (14) to rotate. A clamping mechanism (16) is mounted on the bottom of the mounting base (14) and is used to clamp the wafer ring (21).

3. The wafer ring pick-and-place apparatus according to claim 2, characterized in that, The mounting base (14) is annular and rotates along its own axial direction.

4. The wafer ring pick-and-place apparatus according to claim 3, characterized in that, The driving component (15) includes: A servo motor (17) is mounted on the base plate (11), and a drive wheel is fixed on the output shaft of the servo motor (17). A timing belt (18) is disposed in the receiving port (13) and the timing belt (18) is driven on the drive wheel; Synchronous pulley (19) is coaxially fixed with the mounting base (14) and the synchronous pulley (19) is driven on the synchronous belt (18).

5. The wafer ring pick-and-place apparatus according to claim 1, characterized in that, The wafer ring pick-up and mounting device also includes a glass panel streamline mechanism for sequentially conveying the glass panel, which serves as the mounting substrate for the wafer ring (21).

6. The wafer ring pick-and-place apparatus according to claim 5, characterized in that, The wafer ring pick-up and mounting device also includes a lifting and rotating mechanism for lifting the glass panel that has reached the mounting station.

7. A wafer ring pick-up and mounting method, characterized in that, The wafer ring pick-and-place apparatus according to any one of claims 1 to 6 includes the following steps: S1, transport the glass panel to the mounting station; S2, one transfer, the front-end material handling mechanism (36) is used to take out the wafer ring (21) and transfer it to the intermediate material handling station; S3, Secondary transfer: The wafer ring (21) transferred by the front-end material handling mechanism (36) at the intermediate material handling station is transferred to the mounting station using the rear-end material handling mechanism (37); S4, Placement: The placement work section of the placement assembly (35) places the chip or LED on the wafer ring (21) transferred to the placement station onto the glass panel.

8. The wafer ring pick-up and mounting method according to claim 7, characterized in that, In S3, the rear material handling mechanism (37) drives the wafer ring to match the position of the glass panel.

9. The wafer ring pick-up and mounting method according to claim 8, characterized in that, It also includes the following steps: S5, after the mounting is completed, the mounting work unit is reset, and the rear picking mechanism (37) transfers the mounted wafer ring (21) to the intermediate unloading station; then the second front picking mechanism (361) is used to transfer the mounted wafer ring (21) to the unloading station.

Images