A power unit and a highly integrated device having the same

Abstract

The present application discloses a power unit and a highly integrated device having the same, wherein the power unit comprises: a heat dissipation module, wherein the upper side of the heat dissipation module integrates a DC copper bus and an AC copper bus to realize the current input of the motor controller; a power module, wherein the power module is fixed to the side surface of the heat dissipation module, and the power module realizes heat dissipation through the heat dissipation module; a sensor module, wherein the sensor module is installed on the side of the heat dissipation module through a bracket to detect the current; and a driving circuit board, wherein the driving circuit board is placed on the lower side of the heat dissipation module and can receive the current signal of the sensor module to realize the control of the motor by the motor controller. The present application solves the technical problems in the prior art that the power module heat sink occupies a large space, and the DC bus capacitor passively dissipates heat through air, resulting in poor heat dissipation performance and bulky volume, which in turn causes the motor controller to be bulky, heavy, not highly integrated, and low in power density.

Description

Technical Field

[0001] The present application relates to the technical field of powertrain, and in particular to a power unit and a highly integrated device having the same. Background Art

[0002] As a core component of new energy vehicles, the performance of the motor controller directly affects the comfort, reliability and energy consumption of the entire vehicle. Power semiconductor devices are the core components of motor controllers. Traditional motor controller main circuit inverters mostly use silicon-based insulated gate bipolar transistors (IGBT) solutions. In recent years, third-generation power semiconductor materials represented by SiC have been widely used in the field of new energy vehicles.

[0003] At the same time, integration, high efficiency, miniaturization, lightweight, low cost and high reliability are the development trends of motor controllers, especially miniaturization and lightweight, which are important goals for the next step of development. The purpose is to improve the integration of motor controllers and adopt high-performance SiC power modules, while continuously reducing the volume and weight of motor controllers. While increasing the peak power, from the perspective of motor controller design, improving power density and having high-power performance that matches the entire vehicle means providing greater heat dissipation capabilities in a more compact structural size.

[0004] At present, motor controllers using SiC power modules generally use two or more layers of heat sinks to cool the SiC power modules. The heat dissipation structure generally occupies a large internal space. In addition, the DC bus capacitor is generally cooled by air through a plastic casing, which causes the DC bus capacitor to require a larger volume. How to conduct high-integration research on SiC power modules is still the main research direction.

[0005] However, in the prior art, there are technical problems that the power module heat sink occupies a large space, and the DC bus capacitor passively dissipates heat through air, resulting in poor heat dissipation performance and bulky size, which in turn causes the motor controller to be large in size, heavy, low in integration, and low in power density. Summary of the invention

[0006] The technical purpose to be achieved by the embodiments of the present application is to provide a power unit and a highly integrated device having the same, which is used to solve the technical problems in the prior art that the power module heat sink occupies a large space, the DC bus capacitor passively dissipates heat through the air, resulting in poor heat dissipation performance and large size, which in turn causes the motor controller to be large in size, heavy in weight, low in integration, and low in power density.

[0007] In order to solve the above problems, the embodiment of the present application provides a power unit and a highly integrated device having the same. The power unit includes: a heat dissipation module, the heat dissipation module is used for heat dissipation; a DC copper busbar, the DC copper busbar is integrated on the upper side of the heat dissipation module, and the DC copper busbar is used to realize the DC input of the motor controller; an AC copper busbar, the AC copper busbar is integrated on the upper side of the heat dissipation module, and the AC copper busbar is used to realize the AC input of the motor; a power module, the power module is fixed to the side surface of the heat dissipation module, and the power module realizes heat dissipation through the heat dissipation module; a sensor module, the sensor module is connected to the heat dissipation module through a bracket, and is used to detect the current of the AC copper busbar; a driving circuit board, the driving circuit board is placed on the lower side of the heat dissipation module, connected to the power module, and can receive the current signal transmitted by the sensor module to realize the control of the motor by the motor controller.

[0008] Preferably, the heat dissipation module comprises:

[0009] Capacitor core;

[0010] A shell having a housing space for encapsulating the capacitor core, and a cooling water channel of the heat dissipation module is embedded in a side surface of an outer wall of the shell;

[0011] A water channel cover plate is used to seal the cooling water channel arranged on the outer wall of the shell.

[0012] Preferably, the waterway cover plate further comprises:

[0013] A first opposing cover plate, wherein the first opposing cover plate is welded to a first opposing side surface of the shell, and a first water inlet and a first water outlet are provided on the first opposing cover plate to realize the inflow and outflow of the coolant;

[0014] A second opposing cover plate is welded to a second opposing side surface of the shell, wherein the first opposing side surface does not overlap with the second opposing side surface.

[0015] Preferably, the power modules are respectively fixed to the surfaces of the second opposing cover plates through elastic pressing plates.

[0016] Preferably, the power module further comprises: a DC terminal, an AC terminal and a signal pin;

[0017] Wherein, the DC terminal is connected to the output DC terminal of the heat dissipation module to realize the DC output of the power module;

[0018] The AC terminal is connected to the AC copper busbar to realize AC power input to the motor;

[0019] The signal pin is welded on the driving circuit board to realize driving control of the power module.

[0020] Preferably, one end of the DC copper busbar is connected to the input DC terminal of the heat dissipation module, and the other end is connected to a battery to realize the DC input of the motor controller.

[0021] Another preferred embodiment of the present application provides a highly integrated device, comprising: an integrated housing and the power unit as described above;

[0022] The integrated housing and the power unit are detachably assembled to realize a power assembly.

[0023] Preferably, the high-integration device as described above is characterized in that the integrated housing further comprises:

[0024] a second water inlet, the second water inlet being connected to the first water inlet;

[0025] A second water outlet, wherein the second water outlet is connected to the first water outlet.

[0026] Preferably, the high-integration device as described above is characterized in that the high-integration device further comprises:

[0027] A DC connector is connected to the DC copper bus to realize DC power input of the power unit.

[0028] Preferably, the high-integration device as described above is characterized in that the high-integration device further comprises:

[0029] An external signal connector is connected to the signal connector of the driving circuit board to realize the control signal interaction between the vehicle controller and the power unit.

[0030] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0031] The present application provides a power unit and a highly integrated device having the same. The device includes: a heat dissipation module, the heat dissipation module is used for heat dissipation; a DC copper busbar, the DC copper busbar is integrated on the upper side of the heat dissipation module, and the DC copper busbar is used to realize the DC input of the motor controller; an AC copper busbar, the AC copper busbar is integrated on the upper side of the heat dissipation module, and the AC copper busbar is used to realize the AC input of the motor; a power module, the power module is fixed to the side surface of the heat dissipation module, and the power module realizes heat dissipation through the heat dissipation module; a sensor module, the sensor module is connected to the heat dissipation module through a bracket, and is used to detect the current of the AC copper busbar; a driving circuit board, the driving circuit board is placed on the lower side of the heat dissipation module, connected to the power module, and can receive the current signal transmitted by the sensor module to realize the control of the motor by the motor controller. The technical problem that the power module heat sink occupies a large space in the prior art, the DC bus capacitor passively dissipates heat through air, resulting in poor heat dissipation performance and bulky volume, and then causes the motor controller to be large in volume, heavy, low in integration, and low in power density is solved. The technical effect of achieving miniaturization and compactness by optimizing the layout and heat dissipation structure for integrated design has been achieved, thereby reducing the volume of the DC bus capacitor and improving the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the front structure of the power unit in the embodiment of the present application.

[0033] Figure 2 This is a schematic diagram of the back structure of the power unit in the embodiment of the present application;

[0034] Figure 3 Schematic diagram of the cross-sectional structure of the power unit in the embodiment of the present application;

[0035] Figure 4 This is a schematic diagram of the heat dissipation module structure of the power unit in an embodiment of the present application;

[0036] Figure 5 This is a schematic diagram of the assembly structure of the power unit and the integrated housing according to an embodiment of the present application;

[0037] Figure 6 Schematic diagram of the structure of a highly integrated device having the above-mentioned power unit in an embodiment of the present application.

[0038] [Description of Reference Numerals]

[0039] 110, heat dissipation module 110; 111, shell; 112, first opposing cover plate; 113, second opposing cover plate; 1121, first water inlet; 1122, first water outlet; 115, capacitor core; 101, power module; 1011, DC terminal; 1012, AC terminal; 1013, signal pin; 102, elastic pressure plate; 103, DC copper bus; 104, AC copper bus; 105, sensor module; 106, bracket; 120, drive circuit board; 121, signal connector; 200 integrated shell; 201, second water inlet; 202, second water outlet; 208, DC connector; 209, external signal connector. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and advantages to be solved by the application clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the application. In addition, for clarity and brevity, the description of known functions and structures has been omitted.

[0041] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present application. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0042] In the various embodiments of the present application, it should be understood that the size of the serial numbers of the following processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0043] It should be understood that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] In the embodiments provided in the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0046] The present application provides a power unit and a highly integrated device having the same, which solves the technical problems in the prior art that the power module heat sink occupies a large space, the DC bus capacitor passively dissipates heat through the air, resulting in poor heat dissipation performance and large size, which in turn causes the motor controller to be large in size, heavy in weight, low in integration and low in power density.

[0047] In response to the above technical problems, the overall idea of ​​the technical solution provided by this application is as follows:

[0048] The technical solution in the present application provides a power unit and a highly integrated device having the same, wherein the power unit includes: a heat dissipation module, the heat dissipation module is used for heat dissipation; a DC copper busbar, the DC copper busbar is integrated on the upper side of the heat dissipation module, the DC copper busbar is used to realize the DC power input of the motor controller; an AC copper busbar, the AC copper busbar is integrated on the upper side of the heat dissipation module, the AC copper busbar is used to realize the AC power input of the motor; a power module, the power module is fixed to the side surface of the heat dissipation module, and the power module realizes heat dissipation through the heat dissipation module; a sensor module, the sensor module is connected to the heat dissipation module through a bracket, and is used to perform current detection on the AC copper busbar; a drive circuit board, the drive circuit board is placed on the lower side of the heat dissipation module, connected to the power module, and can receive the current signal transmitted by the sensor module to realize the control of the motor by the motor controller. The technical effect of reducing the volume of DC bus capacitors and improving heat dissipation performance by optimizing the layout and heat dissipation structure for integrated design has been achieved, solving the technical problem that the power module heat sink occupies a large space, the DC bus capacitor passively dissipates heat through the air, resulting in poor heat dissipation performance and large volume, which in turn causes the motor controller to be large in volume, heavy, low in integration, and low in power density. The miniaturization and compact design of the powertrain and clean assembly are achieved, and the control quality of the motor controller is improved.

[0049] Example 1

[0050] like Figure 1As shown, the embodiment of the present application provides a power unit and a highly integrated device having the same, wherein the power unit is preferably a SiC power unit, comprising: a heat dissipation module 110, the heat dissipation module 110 is used for heat dissipation; a DC copper bus 103, the DC copper bus 103 is integrated on the upper side of the heat dissipation module 110, the DC copper bus 103 is used to realize the DC input of the motor controller; an AC copper bus 104, the AC copper bus 104 is integrated on the upper side of the heat dissipation module 110, the AC copper bus 104 is used to realize the AC input of the motor; a power module 101, the power module 101 is fixed to the side surface of the heat dissipation module 110 through an elastic pressure plate, and the power module 101 realizes heat dissipation through the heat dissipation module 110; the sensor module 105, the sensor module 105 is connected to the heat dissipation module 110 through a bracket 106, and is used to detect the current of the AC copper bus 104; the driving circuit board 120, the driving circuit board 120 is placed on the lower side of the heat dissipation module 110, connected to the power module 101, and can receive the current signal transmitted by the sensor module to realize the control of the motor by the motor controller.

[0051] Specifically, the present application proposes a new type of power unit. Furthermore, the power unit achieves heat dissipation of two groups of power modules by directly encapsulating the capacitor core in the shell and designing cooling water channels on the front, rear, left and right sides of the shell; at the same time, the DC bus capacitor integrates the DC copper bus and AC copper bus on the upper side, the drive control integrated circuit board is arranged on the lower side, and the triple current sensor is installed on the side through a bracket, thereby realizing a highly integrated modular power unit. Figure 1 As shown, the heat dissipation module 110 is a heat dissipation structure module based on the integrated arrangement of the DC bus capacitor. The heat dissipation module 110 includes a packaged DC bus capacitor and a corresponding cooling water channel, so that the heat dissipation module 110 has a miniaturized heat dissipation structure to avoid the large volume of the heat dissipation structure affecting the integration. The power module 101 is a SiC power module, and is fixed to the waterway cover 113 through an elastic pressure plate 102. The sensor module 105 is a sensor module with an integrated sensor arrangement. Preferably, the sensor in the sensor module 105 is a triple current sensor, and the sensor module 105 is installed on the waterway cover 112 of the heat dissipation module 110 through a bracket 106 to detect the current size of the AC copper bus 104 and transmit the signal to the driver circuit board 120, wherein the driver circuit board 120 can be arranged above or to the side of the heat dissipation module 110 according to the selection of the power module 101 to achieve a similar integrated structure. Preferably, as Figure 2As shown, in this application, the driver circuit board is arranged below the heat dissipation module and connected to the power module 101, and the motor controller controls the motor by adjusting the current signal. The DC copper bus 103 and the AC copper bus 104 are integrated on the upper side of the heat dissipation module 110, the driver circuit board 120 is arranged on the lower side, and the sensor module 105 is installed on the side through the bracket 106, realizing a highly integrated modular assembly structure.

[0052] Furthermore, the heat dissipation module 110 includes: a capacitor core 115; a shell 111, the shell 111 has a accommodating space for encapsulating the capacitor core 115, and the cooling water channel of the heat dissipation module 110 is embedded in the side surface of the outer wall of the shell 111; and a water channel cover plate, the water channel cover plate is used to seal the cooling water channel set on the outer wall of the shell 111.

[0053] Furthermore, the water channel cover plate also includes: a first opposing cover plate 112, the first opposing cover plate 112 is welded to the first opposing side surface of the shell 111, and the first opposing cover plate 112 is provided with a first water inlet 1121 and a first water outlet 1122 to realize the inflow and outflow of the coolant; a second opposing cover plate 113, the second opposing cover plate 113 is welded to the second opposing side surface of the shell 111, wherein the first opposing side surface does not overlap with the second opposing side surface.

[0054] Specifically, the heat dissipation module 110 has a cooling effect during the use of the motor controller. Based on the high requirements for the appearance and structural design of the motor controller, the structure of the heat dissipation module is also required to be high. At present, the heat dissipation structure in the motor controller will occupy a large internal space, and the packaged DC bus capacitor will also be cooled by air through the shell. Therefore, Figure 3 As shown, in the heat dissipation module 110 of the present application, the capacitor core 115 is encapsulated in the housing 111 by epoxy resin, and the housing 111 is a hollow structure, and the housing 111 can be made of different materials, such as metal, plastic, etc. Preferably, the housing 111 is made of metal material, which can improve the heat dissipation performance of the heat dissipation module 110. The internal accommodation space of the housing 111 has the same size as the capacitor core used for packaging, such as Figure 4As shown, the cooling water channel of the outer wall of the shell 111 is an embedded structure all around, and the water channel structure design of the shell 111 includes the design of the water outlet and the water inlet, and then when the hollow cooling water channel is sealed, a first water inlet 1121 and a second water inlet 1122 need to be designed accordingly, and water channel covers are welded on the four sides of the shell 111, front, back, left, and right. Further, the first opposing covers 112, i.e., the front and back side water channel covers, are welded to the shell 111 by stir friction welding or vacuum brazing; the second opposing covers 113, i.e., the left and right side water channel covers, are also welded to the shell 111 by stir friction welding or vacuum brazing. Since the first pair of covers 112 and the second opposing covers are designed to be opposed to each other according to the four side surfaces of the shell 111.

[0055] Specifically, the coolant from the first water inlet 1121 in the first opposing cover plate 112 flows evenly into the pin-fin structure on the inner side of the waterway cover plate 113, squeezes the power module 101 thereon for heat exchange, and then takes away the heat through the first water outlet 1122 of the waterway cover plate 112. At the same time, the heat dissipated by the capacitor core 115 can also be heat exchanged with the coolant at the same time, thereby improving the heat dissipation performance of the capacitor core and reducing the volume of the capacitor core.

[0056] Furthermore, the power modules 101 are respectively fixed to the surfaces of the second opposing cover plates 113 through elastic pressing plates 102 .

[0057] Specifically, the power module 101 uses SiC as a semiconductor material, has high performance, and can increase peak power while continuously reducing the volume and weight of the motor controller. Therefore, the power module 101 adopts a SiC power module, and the power module 101 is fixed to the surface of the second opposing cover plate 113 through an elastic pressure plate 102. Since the first opposing cover plate 112 and the second opposing cover plate 113 are arranged in opposition, the first opposing cover plate 112 may be the front and rear sides, or the left and right sides; on the other hand, the second opposing cover plate may be the left and right sides, or the front and rear sides. When the first opposing cover plate 112 is provided with a water inlet and a water outlet, the power module 101 needs to be fixed to the second opposing cover plate 113, and the fixing method is set according to the elastic pressure plate 102. When the coolant from the first water inlet 1121 flows evenly into the pin-fin structure on the inner side of the waterway cover plate, the power module 101 thereon is squeezed by the elastic pressure plate 102 for heat exchange, and then the heat is taken away through the first water outlet 1122. The fixing method based on the elastic pressure plate can give full play to the elastic heat dissipation between the heat dissipation module 110 and the power module 101, thereby achieving the technical effect of improving the heat dissipation performance by optimizing the layout and heat dissipation structure.

[0058] Furthermore, the power module 101 also includes: a DC terminal, an AC terminal and a signal pin; wherein the DC terminal is connected to the output DC terminal of the heat dissipation module to realize the DC output of the power module 101; the AC terminal is connected to the AC copper busbar to realize the AC power input of the motor; the signal pin is welded on the driving circuit board to realize the driving control of the power module 101.

[0059] Furthermore, one end of the DC copper busbar is connected to the input DC terminal of the heat dissipation module, and the other end is connected to the battery to realize the DC input of the motor controller.

[0060] Specifically, if Figure 1 As shown, the input DC terminal on the upper side of the heat dissipation module 110 is connected to the DC copper bus 103 by bolts, and the other side of the DC copper bus 103 is connected to the battery through a DC connector to realize the DC input of the motor controller. The output DC terminal on the upper side of the DC bus capacitor assembly 110 is connected to the DC terminal 1011 of the power module 101 by bolts to realize the DC output of the power module. The AC terminal of the power module 101 is connected to the AC copper bus 104 by bolts, and the other side of the AC copper bus 104 is connected to the motor three-phase line to realize the AC input of the motor. The drive circuit board 120 is arranged on the DC bus capacitor assembly, that is, below the heat dissipation module 110. Further, the signal pin 1013 of the power module 101 is welded on the drive circuit board 120, and the drive circuit board 120 is a main control drive integrated circuit board to realize the drive control of the power module 101. A plurality of signal connectors 121 are designed on the main control drive integrated circuit board 120, which are connected to the external signal connector of the current sensor, the motor resolver and the temperature sensor and the motor controller through a signal harness.

[0061] Example 2

[0062] See also Figure 5 and 6 , the present application also provides a highly integrated device, comprising: an integrated housing 200 and the power unit as described above;

[0063] The integrated housing 200 and the power unit are detachably assembled to realize a power assembly.

[0064] Furthermore, the integrated shell 200 also includes: a second water inlet 201, which is connected to the first water inlet 1121; a second water outlet 202, which is connected to the first water outlet 1122; a DC connector 208, which is connected to the DC copper bus 103 to realize the DC power input of the power unit; and an external signal connector 209, which is connected to the signal connector of the driving circuit board 120 to realize the interaction of control signals between the vehicle controller and the power unit.

[0065] Specifically, the modular power unit can also be installed in the integrated housing 200 of the power assembly in an assembled manner, so as to realize the miniaturization, compact design and clean assembly of the power assembly. This embodiment is the assembly of the power unit and the integrated housing 200. Figure 5 As shown, the integrated housing 200 is obtained by integrating the three independent housings of the motor controller, the motor, and the reducer, thereby forming a highly integrated housing structure that can be formed by a die-casting process. The integrated housing 200 can save the connecting bolts, sealing rings, connecting water pipes and other structures of the original three independent housings through integrated design, and at the same time reduce the volume of the power assembly. In the power assembly assembly line, the power unit can be first installed in the integrated housing 200 in a clean environment to prevent impurities from entering components such as circuit boards, and then the internal parts of the motor and reducer can be assembled. When assembling the integrated housing 200 and the power unit, the first water inlet 1121 in the power unit is connected to the second water inlet 201 in the integrated housing 200, and the first water outlet 1122 in the power unit is connected to the second water outlet 202 in the integrated housing 200.

[0066] Further, such as Figure 6As shown, a highly integrated powertrain is realized by the integrated housing 200 and the power unit. An integrated chamber is surrounded by the integrated housing 200 and the motor controller cover 205, the motor cover 206, and the reducer cover 207, wherein the power unit is installed in the motor controller chamber. The powertrain water inlet pipe 203 enters the power unit heat dissipation channel through the water inlet 201 of the integrated shell inside the integrated shell, and the powertrain water outlet pipe 204 flows out of the power unit heat dissipation channel through the water outlet 202 of the integrated shell inside the integrated shell. The integrated shell 200 is also equipped with a DC connector 208, which is directly connected to the DC copper bus 103 to realize the DC input of the power unit; the integrated shell 200 is also equipped with an external signal connector 209, which is connected to the signal connector 121 through a low-voltage wiring harness to realize the interaction of the vehicle controller and the power unit control signal, solving the technical problem in the prior art that the power module 101 radiator occupies a large space, the DC bus capacitor passively dissipates heat through the air, resulting in poor heat dissipation performance and large volume, and then causing the motor controller to be large in volume, heavy, low in integration, and low in power density. The technical effect of miniaturization and compactness is achieved by optimizing the layout and heat dissipation structure for integrated design, thereby reducing the volume of the DC bus capacitor and improving the heat dissipation performance.

[0067] Example 3

[0068] In order to more clearly explain the technical solution of a power unit and a highly integrated device having the same, the embodiment of the present application provides a method for using a power unit and a highly integrated device having the same, which is specifically as follows:

[0069] The present application encapsulates the capacitor core 115 in the heat dissipation module 110, designs the basic shell 111 of the heat dissipation structure, seals the cooling water channel designed on the outer wall side surface of the shell 111 with a water channel cover plate, seals the first opposing cover plate 112 on the first opposing side (front and rear sides) of the shell 111, and designs a water inlet and a water outlet to realize the inflow and outflow of the motor controller coolant, seals the second opposing cover plate 113 on the second opposing side (left and right sides) of the shell, and fixes the power module 101 to the second opposing cover plate 112 through the elastic pressure plate 102. 13, thereby constructing elastic heat dissipation of the heat dissipation module and the power module 101. Further, by integrating the DC copper bus 103 and the AC copper bus 104 on the upper side, arranging the drive circuit board 120 on the lower side, and installing the sensor module 105 on the side through the bracket 106 at the same time, a highly integrated modular assembly structure is realized. Based on the connected power unit, further, a highly integrated power assembly is realized according to the integrated shell 200 and the power unit, that is, an integrated chamber is formed by the integrated shell 200 and three cover plates, wherein the power unit is installed in the motor controller chamber. The power assembly water inlet pipe enters the power unit heat dissipation water channel through the second water inlet 201 in the integrated shell 200 inside the integrated shell, and the power assembly water outlet pipe 204 flows out of the power unit heat dissipation water channel through the water outlet 202 of the above-mentioned integrated shell inside the integrated shell. Thereby, efficient utilization of the heat dissipation water channel is realized, miniaturization and compactness are realized, and the heat dissipation performance is improved while reducing the volume of the DC bus capacitor.

[0070] The technical solution provided in this application has at least the following technical effects or advantages:

[0071] The power unit proposed in the present application directly seals the capacitor core in a metal shell, and designs cooling water channels on the front, rear, left and right sides of the shell to achieve heat dissipation of two groups of SiC power modules; the cooling water channel design of the capacitor metal shell can simultaneously improve the heat dissipation performance of the capacitor core, thereby reducing the volume of the capacitor core.

[0072] The power unit proposed in the present application has a DC copper bus and an AC copper bus integrated on the upper side of the DC bus capacitor, a drive control integrated circuit board arranged on the lower side, and a triple current sensor installed on the side through a bracket, thereby realizing a highly integrated modular assembly structure.

[0073] The power unit proposed in the present application can also be installed in an integrated housing of a powertrain in an assembled manner, thereby achieving miniaturization, compact design and clean assembly of the powertrain.

[0074] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0075] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0076] The above is a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A power unit, characterized in that: include: A heat dissipation module, wherein the heat dissipation module is used for dissipating heat; A DC copper busbar, which is integrated on the upper side of the heat dissipation module and is used to realize the DC power input of the motor controller; An AC copper busbar, which is integrated on the upper side of the heat dissipation module and is used to realize AC power input of the motor; A power module, wherein the power module is fixed to a side surface of the heat dissipation module, and the power module dissipates heat through the heat dissipation module; A sensor module, which is connected to the heat dissipation module through a bracket and is used to detect the current of the AC copper busbar; A driving circuit board, which is placed at the lower side of the heat dissipation module, connected to the power module, and capable of receiving the current signal transmitted by the sensor module to realize the control of the motor by the motor controller; The heat dissipation module comprises: Capacitor core; A shell having a housing space for encapsulating the capacitor core, and a cooling water channel of the heat dissipation module is embedded in a side surface of an outer wall of the shell; A water channel cover plate, the water channel cover plate is used to seal the cooling water channel provided on the outer wall of the shell; The waterway cover plate also includes: A first opposing cover plate, wherein the first opposing cover plate is welded to a first opposing side surface of the shell, and a first water inlet and a first water outlet are provided on the first opposing cover plate to realize the inflow and outflow of the coolant; A second opposing cover plate is welded to a second opposing side surface of the shell, wherein the first opposing side surface does not overlap with the second opposing side surface.

2. The power unit according to claim 1, characterized in that: The power modules are respectively fixed to the surfaces of the second opposing cover plates through elastic pressing plates.

3. The power unit according to claim 2, characterized in that: The power module further comprises: a DC terminal, an AC terminal and a signal pin; Wherein, the DC terminal is connected to the output DC terminal of the heat dissipation module to realize the DC output of the power module; The AC terminal is connected to the AC copper busbar to realize AC power input to the motor; The signal pin is welded on the driving circuit board to realize driving control of the power module.

4. The power unit according to claim 3, characterized in that: One end of the DC copper busbar is connected to the input DC terminal of the heat dissipation module, and the other end is connected to the battery to realize the DC input of the motor controller.

5. A highly integrated device, characterized in that: include: An integrated housing and a power unit as claimed in any one of claims 1 to 4; The integrated housing and the power unit are detachably assembled to realize a power assembly.

6. The highly integrated device according to claim 5, characterized in that: The integrated housing further comprises: a second water inlet, the second water inlet being connected to the first water inlet; A second water outlet, wherein the second water outlet is connected to the first water outlet.

7. The highly integrated device according to claim 5, characterized in that: The highly integrated device further comprises: A DC connector is connected to the DC copper bus to realize DC power input of the power unit.

8. The highly integrated device according to claim 5, characterized in that: The highly integrated device further comprises: An external signal connector is connected to the signal connector of the driving circuit board to realize the control signal interaction between the vehicle controller and the power unit.

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