Endoscope camera and endoscope camera system

By setting conductive parts and heat insulation parts in the endoscope camera, an electrostatic shielding circuit and thermal energy isolation is formed, the problem of the imaging module being affected by static electricity is solved, and the chip protection and comfortable grip of the handle are achieved.

CN114680794BActive Publication Date: 2025-08-05SHENZHEN MINDRAY BIO MEDICAL ELECTRONICS CO LTD
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Patent Information

Application Number
CN202011607201.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-30
Publication Date
2025-08-05
Estimated Expiration
2040-12-30

AI Technical Summary

Technical Problem

The imaging module of the endoscopic camera is susceptible to static electricity during use, which may lead to chip damage, and the existing connection methods cannot form an effective electrostatic shielding circuit.

Method used

A first conductive member is provided between the imaging module and the front cover, and a second conductive member is provided between the front cover and the handle to form a complete electrostatic shielding circuit, and a heat insulating member is provided between the front cover and the handle to prevent heat energy transfer.

Benefits of technology

Effectively shield the impact of static electricity on the imaging module, prevent chip damage, and at the same time block the transfer of heat energy to the handle, improving grip experience and imaging stability.

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Abstract

An endoscopic camera head and endoscopic camera system include a handle, a front cover, an imaging module, and a conductive member. The conductive member includes a first conductive member and a second conductive member. The first conductive member is disposed between the imaging module and the front cover, and the second conductive member is disposed between the front cover and the handle. Because the first conductive member is disposed between the imaging module and the front cover, and the second conductive member is disposed between the front cover and the handle, the imaging module, the front cover, and the handle form a complete and effective electrostatic shielding circuit, effectively shielding the imaging module from static electricity and protecting it.
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Description

Technical Field

[0001] The present invention relates to an in-vivo detection device, and in particular to an endoscopic camera head and an endoscopic camera system. Background Art

[0002] In endoscopic minimally invasive surgery, the rigid tube endoscope serves as an intracavitary observation system that can clearly image the intracavitary structure and transmit the image outside the cavity for observation. It is widely used in non-invasive or minimally invasive diagnosis, auxiliary treatment or non-open intracavitary surgery.

[0003] The endoscopic camera includes a handle and an imaging module. The imaging module is located inside the handle. The ordinary connection between the imaging module and the handle cannot form a good electrostatic shielding circuit. During use, the imaging components in the handle are easily affected by static electricity, which may even damage the chip in the imaging module. Summary of the Invention

[0004] In one embodiment, an endoscopic camera head is provided, comprising:

[0005] The handle has a receiving cavity, and one end of the receiving cavity has an opening;

[0006] A front cover is provided on the opening of the handle, the front cover is connected to the handle, and a through hole is provided in the middle of the front cover;

[0007] An imaging module, configured to convert optical signals into image signals, wherein a portion of the imaging module is disposed within the accommodating cavity of the handle, and a portion of the imaging module passes through the through hole of the front cover and out of the accommodating cavity of the handle, and the imaging module is connected to the front cover; and

[0008] The conductive member includes a first conductive member and a second conductive member, wherein the first conductive member is arranged between the imaging module and the front cover, and the second conductive member is arranged between the front cover and the handle.

[0009] In one embodiment, the first conductive member is a sheet-like structure, the imaging module has an axial end surface facing the front cover, and the first conductive member is located between the axial end surface of the imaging module and the inner side surface of the front cover.

[0010] In one embodiment, the axial end surface of the imaging module and the inner side surface of the front cover are both exposed substrate surfaces, and the first conductive member is connected to the substrates of the imaging module and the front cover respectively.

[0011] In one embodiment, the second conductive member is an annular ring structure, the front cover has a first annular step surface facing the handle, the handle has a second annular step surface adapted to the first annular step surface, and the second conductive member is located between the first annular step surface and the second annular step surface.

[0012] In one embodiment, the first annular step surface of the front cover and the second annular step surface of the handle are both exposed substrate surfaces, and the second conductive member is connected to the substrates of the front cover and the handle, respectively.

[0013] In one embodiment, the first conductive member and the second conductive member are thermally insulating conductive members.

[0014] In one embodiment, a heat insulating member is further provided between the front cover and the handle.

[0015] In one embodiment, the thermal insulation member is an annular ring structure, the edge of the front cover has a third annular step surface facing the handle, the handle has a fourth annular step surface adapted to the third annular step surface, and the thermal insulation member is located between the third annular step surface and the fourth annular step surface.

[0016] In one embodiment, a plurality of bosses are provided on the inner side surface of the front cover, and the front cover is connected to the handle and the imaging module respectively through the bosses.

[0017] In one embodiment, an endoscopic camera head is provided, comprising:

[0018] The handle has a receiving cavity, and one end of the receiving cavity has an opening;

[0019] A front cover is provided on the opening of the handle, the front cover is connected to the handle, and a through hole is provided in the middle of the front cover;

[0020] An imaging module, configured to convert optical signals into image signals, wherein a portion of the imaging module is disposed within the accommodating cavity of the handle, and a portion of the imaging module passes through the through hole of the front cover and out of the accommodating cavity of the handle, and the imaging module is connected to the front cover; and

[0021] A heat insulating member is provided between the front cover and the handle.

[0022] In one embodiment, an endoscopic camera system is provided, including a light source, a light guide, an endoscope, an optical mount, an endoscope camera connection cable, a display, a video connection cable, a host and the endoscopic camera of the aforementioned embodiment, wherein the optical module of the light source is connected to the endoscope through the light guide, one end of the endoscopic camera is connected to the endoscope through the optical mount, the other end of the endoscopic camera is connected to the host through the endoscopic camera connection cable, and the host is connected to the display through the video connection cable.

[0023] According to the endoscopic camera head and endoscopic camera system of the above-mentioned embodiment, since a first conductive member is provided between the imaging module and the front cover, and a second conductive member is provided between the front cover and the handle, the imaging module, the front cover and the handle form a complete and effective electrostatic shielding circuit, which can effectively shield the influence of static electricity on the imaging module and protect the imaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is an axial cross-sectional view of an endoscope camera head in one embodiment;

[0025] Figure 2 for Figure 1 A partial enlarged view of middle A;

[0026] Figure 3 An axial exploded view of an endoscope camera head in one embodiment;

[0027] Figure 4 Schematic diagram of the structure of an endoscope camera system in one embodiment. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions, and for those skilled in the art, it is not necessary to describe these related operations in detail. They will fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0029] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0030] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0031] An endoscopic camera is provided in one embodiment. The endoscopic camera is an endoscopic camera used to image internal tissues of the human body to determine lesions.

[0032] Please refer to Figures 1 to 3 In this embodiment, the endoscope camera mainly includes a handle 1, a front cover 2 and an imaging module 3. The imaging module 3 includes an optical module 31 and a chip module 32. The endoscope camera is also provided with a conductive part 4 and a heat insulating part 5 for achieving heat insulation and electrostatic shielding of the endoscope camera.

[0033] In this embodiment, the handle 1 has the functions of accommodating components and holding. The handle 1 has a accommodating cavity 11. Both ends of the handle 1 have openings connected to the accommodating cavity 11. The openings at both ends of the handle 1 are used to connect cables and optical modules 31 respectively.

[0034] The front cover 2 has a through hole. The front cover 2 is mounted on the opening of the handle 1 . The front cover 2 is used to install the chip module 32 and the optical module 31 in the accommodating cavity 11 of the handle 1 .

[0035] One end of the optical module 31 passes through a through-hole in the front cover 2 and connects to the chip module 32. The end of the optical module 31 that penetrates the through-hole in the front cover 2 is fixedly connected to the front cover 2, and the end of the optical module 31 that is away from the chip module 32 is connected to the optical mount. The optical module 31 is used to transmit optical signals to the chip module 32, which converts the optical signals into electrical signals to form image signals.

[0036] The chip module 32 is located within the housing 11 of the handle 1. One end of the chip module 32 is fixedly connected to the front cover 2. The chip module 32 includes components such as a sensor and a processor. The sensor is an optical sensor that converts light signals into electrical signals. The sensor is used to amplify and filter the electrical signals output by the sensor. The processor transmits the processed electrical signals via a cable to the host computer for further processing. One end of the chip module 32 is the light input port. The chip module 32 also has a wire hole, which allows cables to pass through the chip module 32 and connect to the processor.

[0037] In this embodiment, the conductive member 4 includes a first conductive member 41 and a second conductive member 42, both of which are made of conductive rubber. The first conductive member 41 is disposed between the optical module 31 and the front cover 2, while the second conductive member 42 is disposed between the front cover 2 and the handle 1. The first and second conductive members 41, 42 are made of rubber and have an impedance value of less than 0.5Ω in the thickness direction, indicating good electrical conductivity.

[0038] The optical module 31 has a radial connecting plate 311 at one end facing the chip module 32. The optical module 31 is connected to the front cover 2 via the connecting plate 311, which is positioned between the front cover 2 and the chip module 32. The connecting plate 311 is provided with a clearance hole, allowing the front cover 2 to be connected to the chip module 32 and the handle 1 respectively via screws.

[0039] The side of the front cover 2 facing the handle 1 is the inner side surface, and an annular connecting portion 21 is provided around the edge of the inner side surface of the front cover 2. A first conductive member 41 is provided between the inner side surface within the annular connecting portion 21 and the connecting plate 311. The first conductive member 41 is a sheet-like structure, and the first conductive member 41 is distributed all over the inner side surface within the annular connecting portion 21 of the front cover 2, thereby increasing the contact area between the first conductive member 41 and the front cover 2 as much as possible, thereby increasing the conductive area between the optical module 31 and the front cover 2.

[0040] The inner side of the handle 1 and the surface of the connecting plate 311 facing the handle 1 are both substrate surfaces, with the original material exposed and uncoated. The first conductive member 41 is connected to the substrate surfaces of the handle 1 and the connecting plate 311, respectively, to improve the stability of the electrical connection between the first conductive member 41 and the handle 1 and the connecting plate 311, respectively.

[0041] The annular connecting portion 21 is provided with a first annular stepped surface 22, and the opening of the handle 1 is provided with a second annular stepped surface 12 corresponding to the first annular stepped surface 22. The first annular stepped surface 22 of the annular connecting portion 21 and the second annular stepped surface 12 of the handle 1 are butted against each other. The second conductive member 42 is an annular structure and is disposed between the first annular stepped surface 22 and the second annular stepped surface 12. The second conductive member 42 is used to conduct electricity between the front cover 2 and the handle 1.

[0042] The first annular step surface 22 and the second annular step surface 12 are also base material surfaces, so as to improve the stability of the second conductive member 42 conducting electricity with the front cover 2 and the handle 1 respectively.

[0043] In this embodiment, conductive connections are formed between the optical module 31, the front cover 2 and the handle 1 through the first conductive member 41 and the second conductive member 42 respectively. The optical module 31 is conductively connected to the chip module 32, and the handle 1 is connected to the host through a cable, thereby forming an electrostatic shielding loop. When the endoscope camera is exposed to static electricity, the static electricity is transferred to other components through the electrostatic shielding loop, and even penetrates the bottom surface, which can prevent the chip module 32 from being damaged by high-voltage static electricity.

[0044] In this embodiment, a third annular stepped surface 23 is provided at the outermost side of the annular connecting portion 21 of the front cover 2, and a fourth annular stepped surface 13 corresponding to the third annular stepped surface 23 is provided at the outermost edge of the opening of the handle 1. The heat insulator 5 is an annular structure and is made of a material such as plastic, which has good thermal insulation. The heat insulator 5 is disposed between the third annular stepped surface 23 and the fourth annular stepped surface 13 and is used to block heat transfer between the front cover 2 and the handle 1.

[0045] In this embodiment, the chip module 32 serves as a heat source, and the heat energy generated by the chip module 32 is transferred to the optical module 31. To prevent the optical module 31 from transferring heat energy to the handle 1, the first conductive member 41 and the second conductive member 42 are configured as heat-insulating conductive members. Conductive rubber has both heat-insulating and conductive functions, and the first conductive member 41 and the second conductive member 42 are made of conductive rubber. The first conductive member 41 can prevent the optical module 31 from transferring heat energy to the front cover 2, and the second conductive member 42 can prevent the front cover 2 from transferring heat energy to the handle 1. The double barrier formed by the first conductive member 41 and the second conductive member 42 can effectively prevent heat energy from being transferred from the conductive connection to the handle 1.

[0046] The thermal insulator 5, first conductive member 41, and second conductive member 42 prevent heat from the chip module 32 from being transferred to the handle 1. The handle 1 and front cover 2 are connected only by the thermal insulator 5 and second conductive member 42, leaving a gap between the handle 1 and the rest of the front cover 2. This prevents the handle 1 from getting hot, providing a better grip. This endoscope camera has been tested and found to meet the highest test temperature, with a maximum temperature rise of no more than 13°C within 2 hours.

[0047] In this embodiment, four bosses 24 are provided on the inner side of the front cover 2. The bosses 24 are lower than the annular connecting portion 21 and are provided with through holes or threaded holes. Threaded holes corresponding to the bosses 24 are provided on the connecting plate 311 of the optical module 31 and the chip module 32, as well as within the cavity of the handle 1. The front cover 2 is fixedly connected to the optical module 31 and the chip module 32 via screws and two of the bosses 24, respectively. The front cover 2 is also fixedly connected to the handle 1 via screws and the other two bosses 24. The provision of the bosses 24 reduces the contact area between the front cover 2 and the connecting plate 311, thereby reducing the efficiency of heat transfer between the two.

[0048] The endoscope camera head of this embodiment has both heat insulation and electrostatic shielding functions, which can prevent the heat energy generated by the chip module 32 from being transferred to the handle 1, and can also form electrostatic conduction between the chip module 32 and the handle 1, forming electrostatic shielding protection for the chip module 32.

[0049] In one embodiment, a conductive heat insulating sheet is provided on the end surface of the boss 24. The conductive heat insulating sheet is located between the boss 24 and the connecting plate 311, and between the boss 24 and the chip module 32, to further achieve the functions of conduction and heat insulation.

[0050] In one embodiment, an endoscopic camera is provided. This differs from the endoscopic camera in the above-described embodiment in that a heat insulating member 5 is provided and the conductive member 4 is omitted. Compared to conventional endoscopic cameras, the endoscopic camera with the heat insulating member 5 has better thermal insulation, and the handle 1 does not get hot, providing a better hand-holding experience.

[0051] In one embodiment, an endoscopic camera is provided. This differs from the endoscopic camera in the aforementioned embodiment in that it includes a conductive member 4 and eliminates the heat insulating member 5. Compared to conventional endoscopic cameras, the endoscopic camera with the conductive member 4 has a better electrostatic shielding effect, thereby preventing damage to the chip module 31.

[0052] Please refer to Figure 4 In one embodiment, an endoscopic camera system 1000 is provided, which includes the endoscopic camera head 50 in the above embodiment, as well as a light source 10, a light guide 20, a rigid tube endoscope 30, an optical mount 40, a camera connection cable 81, a host 60, a display 70 and a video connection cable 82.

[0053] The host 60 is connected to the endoscopic camera 50 via a camera connection line 81 , and the image signal obtained by the endoscopic camera 50 is transmitted to the host 60 via the camera connection line 81 for processing.

[0054] In some embodiments, the camera connection line 81 may be an optical communication cable, such as an optical fiber, or the camera connection line 81 may be an electrical communication cable, such as an electrical wire.

[0055] The endoscope camera 50 converts the image signal (electrical signal) into an optical signal, which is transmitted to the host 60 via the camera connection cable 81. The host 60 then converts the optical signal into an electrical signal. The host 60 is connected to the display 70 via the video connection cable 82, which is used to send the video signal to the display 70 for display.

[0056] The light source 10 is used to provide an illumination source to the part to be observed 100 , including laser illumination and white light illumination.

[0057] In this embodiment, the light source 10 includes a visible light source and a laser light source corresponding to the fluorescent reagent. The visible light source is an LED light source. In one embodiment, the visible light source can provide a plurality of monochromatic lights of different wavelength ranges, such as blue light, green light, red light, etc. In other embodiments, the visible light source can also provide a combination of the plurality of monochromatic lights, or a wide-spectrum white light source. The wavelength range of the monochromatic light is approximately 400nm to 700nm. The laser light source is used to generate laser light. The laser is, for example, near infrared light (NIR). The peak wavelength of the laser takes at least one value within the range of 780nm or 808nm.

[0058] Since the light source 10 can simultaneously provide continuous white light and laser light corresponding to the fluorescent agent to the part to be observed, the efficiency of the endoscope camera 50 in collecting visible light image signals and fluorescent image signals reflected by the part to be observed 100 is improved.

[0059] Before imaging using the endoscopic camera system 1000, a contrast agent, such as indocyanine green (ICG), is introduced into the part to be observed 100 by intravenous or subcutaneous injection, so as to image tissue structures and functions (such as blood / lymph / bile in blood vessels) that are not easily visible using standard visible light imaging technology. The part to be observed 100 includes, but is not limited to, the circulatory system, the lymphatic system, and tumor tissue. ICG is commonly known as indocyanine green, diagnostic green needle, and indocyanine green. It is a contrast agent currently commonly used in the clinical diagnosis of cardiovascular diseases and is widely used in choroidal and retinal vascular imaging. When the contrast agent in the part to be observed 100 absorbs the laser light generated by the laser light source corresponding to the fluorescent agent, fluorescence can be generated.

[0060] In this embodiment, since the endoscope camera 50 is provided with a conductive part 4 and a heat insulating part 5, the endoscope camera has both the functions of heat insulation and electrostatic shielding, which can prevent the heat energy generated by the chip module 32 from being transferred to the handle 1, and can also form electrostatic conduction between the chip module 32 and the handle 1, thereby forming electrostatic shielding protection for the chip module 32.

[0061] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art can make several simple deductions, modifications or substitutions based on the concept of the present invention.

Claims

1. An endoscope camera head, characterized in that: include: The handle has a receiving cavity, and one end of the receiving cavity has an opening; A front cover is provided on the opening of the handle, the front cover is connected to the handle, and a through hole is provided in the middle of the front cover; An imaging module, configured to convert optical signals into image signals, wherein a portion of the imaging module is disposed within the accommodating cavity of the handle, and a portion of the imaging module passes through the through hole of the front cover and out of the accommodating cavity of the handle, and the imaging module is connected to the front cover; as well as The conductive member includes a first conductive member and a second conductive member, wherein the first conductive member is arranged between the imaging module and the front cover and is electrically connected to the imaging module and the front cover, and the second conductive member is arranged between the front cover and the handle and is electrically connected to the front cover and the handle.

2. The endoscope camera head according to claim 1, wherein: The first conductive member is a sheet-like structure. The imaging module has an axial end surface facing the front cover. The first conductive member is located between the axial end surface of the imaging module and the inner side surface of the front cover.

3. The endoscope camera head according to claim 2, wherein: The axial end surface of the imaging module and the inner side surface of the front cover are both exposed substrate surfaces, and the first conductive component is connected to the substrates of the imaging module and the front cover respectively.

4. The endoscope camera head according to claim 1, wherein: The second conductive member is an annular ring structure, the front cover has a first annular step surface facing the handle, the handle has a second annular step surface adapted to the first annular step surface, and the second conductive member is located between the first annular step surface and the second annular step surface.

5. The endoscope camera head according to claim 4, wherein: The first annular step surface of the front cover and the second annular step surface of the handle are both exposed substrate surfaces, and the second conductive member is connected to the substrates of the front cover and the handle respectively.

6. The endoscope camera head according to claim 1, wherein: The first conductive member and the second conductive member are heat-insulating conductive members.

7. The endoscope camera head according to claim 6, wherein: A heat insulating member is further provided between the front cover and the handle.

8. The endoscope camera head according to claim 7, wherein: The thermal insulation member is an annular ring structure, the edge of the front cover has a third annular step surface facing the handle, the handle has a fourth annular step surface adapted to the third annular step surface, and the thermal insulation member is located between the third annular step surface and the fourth annular step surface.

9. The endoscope camera head according to claim 6, wherein: The inner side surface of the front cover is provided with a plurality of bosses, and the front cover is connected to the handle and the imaging module respectively through the bosses.

10. The endoscope camera head according to claim 6, wherein: The first conductive member and the second conductive member are made of conductive rubber material.

11. An endoscope camera system, characterized in that: It includes a light source, a light guide, an endoscope, an optical mount, an endoscope camera connection cable, a display, a video connection cable, a host and an endoscope camera as described in any one of claims 1 to 10, the optical module of the light source is connected to the endoscope through the light guide, one end of the endoscope camera is connected to the endoscope through the optical mount, the other end of the endoscope camera is connected to the host through the endoscope camera connection cable, and the host is connected to the display through the video connection cable.

Citation Information

Patent Citations

  • Endoscope camera and endoscope imaging system

    CN215272602U