Component crimping device and component conveying method

Abstract

The present invention provides a component crimping device and a component conveying method, which can effectively utilize the space on the back side of the component crimping device. The component crimping device (1) comprises: a crimping head (75) for crimping a first component (91) or a second component (92) on a substrate (80); and a common conveying part (10) for conveying the first component or the second component to the crimping head. The common conveying part comprises: a head support part (15) for supporting a first holding head (11) and a second holding head (12) in a replaceable manner; and a common moving mechanism (16) for moving the head support part supporting either the first holding head or the second holding head toward the crimping head. The first holding head holds the first component supplied from a first direction (D1) from the upper surface side of the first component and conveys it to the crimping head. The second holding head holds the second component supplied from a second direction (D2) intersecting the first direction from the lower surface side of the second component and conveys it to the crimping head.

Description

Technical Field

[0001] The present invention relates to a component pressing device for pressing components on a substrate and a component conveying method for conveying components using the component pressing device. Background Art

[0002] Conventionally, component pressing devices for pressing electronic components such as IC chips onto the side edges of liquid crystal panels are known. As examples of mounting methods using such component pressing devices, Patent Document 1 discloses a method for mounting chip-shaped electronic components using a COG (Chip on Glass) method and a method for mounting film-shaped electronic components using a FOG (Film on Glass) method.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-317784

[0006] For example, when using a single component bonding machine for both COG and FOG mounting, a component supply device for the COG method and another component supply device for the FOG method must be installed on the back side (deeper side) of the component bonding machine. Therefore, a relatively large space is required on the back side of the component bonding machine, and in some cases, the dead space may increase. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] According to the present invention, an object is to provide a component crimping device or the like that can effectively utilize the space on the back side of the component crimping device.

[0009] Means for solving problems

[0010] The component crimping device according to one embodiment of the present invention comprises: a loading portion for loading a substrate; a crimping head portion for crimping a first component or a second component to the substrate loaded on the loading portion; and a common conveying portion for conveying the first component or the second component from a given delivery area to the crimping head portion, wherein the common conveying portion comprises: a head supporting portion for replaceably supporting a first holding head for holding the first component and a second holding head for holding the second component; and a common moving mechanism for moving the first holding head holding the first component and the second holding head holding the second component. The head supporting portion supported by either one of the second holding heads moves to the crimping head portion, and the first holding head holds the first component supplied from the first direction to the delivery area from the upper surface side of the first component and turns it upside down by being driven by the common moving mechanism, and transports it to the crimping head portion, and the second holding head holds the second component supplied from the second direction intersecting the first direction to the delivery area from the lower surface side of the second component by being driven by the common moving mechanism, and transports it to the crimping head portion.

[0011] One embodiment of the present invention relates to a component conveying method of a component crimping device, wherein the component crimping device comprises: a crimping head portion for crimping a first component or a second component on a substrate; and a common conveying portion for conveying the first component or the second component from a given handover area to the crimping head portion. In the component conveying method, the common conveying portion can replaceably support a first holding head for holding the first component or a second holding head for holding the second component, and can replace the first holding head for holding the first component and the second holding head for holding the second component. The first holding head is driven by the common conveying portion to hold the first component supplied to the intersection area from the first direction from the upper surface side of the first component and turn it upside down, and convey it to the crimping head; the second holding head is driven by the common conveying portion to hold the second component supplied to the intersection area from the second direction intersecting the first direction from the lower surface side of the second component, and convey it to the crimping head.

[0012] Effects of the Invention

[0013] According to the component crimping device and the like of the present invention, the space on the back side of the component crimping device can be effectively utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a plan view showing the component crimping device according to the embodiment.

[0015] Figure 2 It is from Figure 1 FIG. 1 is a diagram showing the component crimping device according to the embodiment as viewed in the direction of arrows indicated by line II.

[0016] Figure 3 It is from Figure 1 FIG. 1 is a diagram showing the component crimping device according to the embodiment as viewed in the direction of arrows indicated by line II-II.

[0017] Figure 4 It is a diagram showing a first path for conveying a first component.

[0018] Figure 5 It is a diagram showing a common path for conveying the first component.

[0019] Figure 6 It is a diagram showing the second path for conveying the second component.

[0020] Figure 7 It is a diagram showing a common path for conveying the second member.

[0021] Explanation of symbols

[0022] 1 Component crimping device

[0023] 5. Parts Supply Department

[0024] 10 Common conveying unit

[0025] 11. First holding head

[0026] 12 2nd holding head

[0027] 15 Head support

[0028] 16 Common Mobility Mechanism

[0029] 30 1st conveyor unit

[0030] 31 No. 1 workbench

[0031] 32 First moving mechanism

[0032] 40 Second conveyor unit

[0033] 41 No. 2 workbench

[0034] 42 Second moving mechanism

[0035] 43 Moving Head

[0036] 50 Camera Department

[0037] 51 Upper light source

[0038] 52 Light source on the lower side

[0039] 61 1st extraction unit

[0040] 62 Second extraction unit

[0041] 70 loading section

[0042] 75 crimping head

[0043] 80 substrate

[0044] 91 Part 1

[0045] 92 Part 2

[0046] 96 pallets

[0047] 97 component tape

[0048] 110 Board loading department

[0049] 120 Attachment

[0050] 130 Pre-pressing section

[0051] 140 Formal crimping department

[0052] 150 Board unloading section

[0053] 160 Transportation Department

[0054] 170 Control Department

[0055] D1 1st direction

[0056] D2 2nd direction

[0057] D3 3rd direction

[0058] m1 Mode 1

[0059] m2 Mode 2

[0060] P1, P2 positions

[0061] RA handover area

[0062] rc common path

[0063] r1 Path 1

[0064] r2 Path 2 DETAILED DESCRIPTION

[0065] Hereinafter, the embodiments of the present invention will be described in detail using the accompanying drawings. In addition, the embodiments described below each illustrate a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, configurations of constituent elements, connection methods, steps, and the order of steps shown in the following embodiments are examples, and their purpose is not to limit the present invention. Therefore, among the constituent elements in the following embodiments, the constituent elements that are not recorded in the independent claims representing the most advanced concept of the present invention are described as arbitrary constituent elements.

[0066] In addition, each figure is a schematic diagram and does not necessarily illustrate the exact figure. In addition, in each figure, the same structural members are marked with the same symbols.

[0067] In the following embodiments, the substrate conveying direction in the component crimping device is sometimes described as a first direction D1, and the depth direction of the component crimping device perpendicular to the first direction D1 is sometimes described as a second direction D2. Furthermore, the vertical direction is sometimes described as a third direction D3, the positive direction of the third direction D3 is sometimes described as upward, and the negative direction of the third direction D3 is sometimes described as downward.

[0068] (Implementation Method)

[0069] [1. Schematic Structure of Component Press-Welding Device]

[0070] While referring to Figure 1 , while describing the schematic structure of a component crimping device 1 according to an embodiment. The component crimping device 1 is a device for mounting electronic components on a substrate 80 and is used, for example, in the production of display panels such as liquid crystal panels and organic EL (electroluminescence) panels. Examples of electronic components mounted on the substrate 80 include the first component 91 and the second component 92, described below.

[0071] Figure 1 It is a plan view showing the component crimping device 1 according to the embodiment.

[0072] like Figure 1 As shown, the component bonding apparatus 1 includes a substrate loading unit 110, a bonding unit 120, a preliminary bonding unit 130, a final bonding unit 140, a substrate unloading unit 150, a conveying unit 160, and a control unit 170. Furthermore, the component bonding apparatus 1 includes a component supply unit 5, which is provided on the back side of the preliminary bonding unit 130 and connected to the preliminary bonding unit 130. The control unit 170 is connected to each of the devices, such as the bonding unit 120, the preliminary bonding unit 130, the final bonding unit 140, and the component supply unit 5, either wirelessly or by wired communication via a control line or the like, to control each of the devices.

[0073] The substrate carrying-in unit 110 , the attaching unit 120 , the preliminary pressing unit 130 , the final pressing unit 140 , and the substrate carrying-out unit 150 are connected in this order along the first direction D1 .

[0074] In the component crimping device 1, first, the substrate 80 is loaded into the substrate loading section 110. The substrate 80 loaded into the substrate loading section 110 is conveyed to the attaching section 120 by the conveying section 160. In the attaching section 120, an ACF (Anisotropic Conductive Film) as an anisotropic conductive member is attached to the area of ​​the substrate 80 where the electrode portion is formed. The substrate 80 with the ACF attached is conveyed to the pre-crimping section 130 by the conveying section 160. In the pre-crimping section 130, the electronic component supplied from the component supply section 5 is pre-crimped to the electronic component substrate 80 via the ACF. The substrate 80 with the electronic component pre-crimped is conveyed by the conveying section 160 to the final crimping section 140. In the final crimping section 140, the electronic component is final crimped to the substrate 80 via the ACF. Through this final crimping, the electronic component is electrically connected to the electrode portion of the substrate 80. The substrate 80 to which the electronic components are connected is conveyed by the conveying unit 160 to the substrate unloading unit 150 , and then unloaded from the substrate unloading unit 150 .

[0075] When the component crimping device 1 is viewed from above, the component crimping device 1 excluding the component supply unit 5 has a rectangular shape with its longitudinal side being the conveying direction of the substrate 80. In order to effectively utilize the space on the back side in the depth direction, the component crimping device 1 of this embodiment has the following structure in the preliminary crimping unit 130 and the component supply unit 5.

[0076] [2. Structure of the Pre-Compression Bonding Unit and Component Supply Unit]

[0077] Figure 2 It is from Figure 1 FIG. 1 is a diagram showing the component crimping device 1 viewed in the direction of arrows indicated by line II. Figure 3 It is from Figure 1 FIG. 1 is a diagram showing the component crimping device 1 viewed in the direction of arrows indicated by line II-II.

[0078] In the preliminary crimping section 130 of the component crimping apparatus 1, a first component 91 required for COG mounting and a second component 92 required for FOG mounting are supplied from the component supply section 5. The first component 91 is a chip-shaped electronic component, such as an IC (Integrated Circuit) component. The second component 92 is a film-shaped electronic component, such as a TCP (Tape Carrier Package) component.

[0079] like Figure 2 as well as Figure 3As shown, the preliminary crimping unit 130 includes a placement portion 70 on which the substrate 80 is placed, and a crimping head 75 disposed above the placement portion 70. The placement portion 70 includes a movable table that is movable in the first direction D1 and the second direction D2, and the crimping head 75 is movable in the third direction D3. The crimping head 75 receives and holds the first component 91 or the second component 92 fed from the component supply unit 5, and preliminarily crimps it to the substrate 80.

[0080] Alternatively, the placement portion 70 may include a backup portion, which is independently disposed below the crimping head portion 75 and supports the crimping portion provided at the side edge of the substrate 80 from below during preliminary crimping by the crimping head portion 75. In this case, the substrate 80 is placed on the movable table with the side edge of the substrate 80 protruding, and the movable table is moved to a position where the side edge of the substrate 80 is supported by the backup portion. The crimping head portion 75 then performs preliminary crimping with the crimping portion of the substrate 80 supported by the backup portion.

[0081] The component crimping device 1 has a first mode m1 for supplying the first component 91 to the preliminary crimping section 130, and a second mode m2 for supplying the second component 92 to the preliminary crimping section 130. The control unit 170 selects the first mode m1 when performing mounting using the COG method, for example, and selects the second mode m2 when performing mounting using the FOG method.

[0082] In the first mode ml, via Figure 1 as well as Figure 2 The first component 91 is transported along the first path r1 and the common path rc shown. In the second mode m2, the first component 91 is transported along the first path r1 and the common path rc shown. Figure 1 as well as Figure 3 The second path r2 and the common path rc shown convey the second component 92. In the common path rc, different components are conveyed depending on the difference in mode.

[0083] The first path r1 extends along the first direction D1. The second path r2 extends along the second direction D2 that intersects the first direction D1. Specifically, the second direction D2 is orthogonal to the first direction D1. The common path rc, like the second path r2, extends along the second direction D2.

[0084] In this embodiment, the first component 91 is conveyed along a first direction D1 along the first path r1, and the second component 92 is conveyed along a second direction D2 along the second path r2. The second direction D2 extends along the depth of the component crimping apparatus 1, while the first direction D1 extends along the longitudinal direction of the rectangular component crimping apparatus 1. Since the first direction D1, in which the first component 91 is conveyed, and the second direction D2, in which the second component 92 is conveyed, intersect, the space on the back side of the component crimping apparatus 1 can be effectively utilized.

[0085] Below, while referring to Figures 2 to 7 , while explaining the specific structure of the component supply unit 5.

[0086] like Figure 2 as well as Figure 3 As shown, the component supply unit 5 includes a first removal unit 61 and a first conveying unit 30 provided on the first path r1, a second removal unit 62 and a second conveying unit 40 provided on the second path r2, and a common conveying unit 10 provided on the common path rc. Furthermore, the component supply unit 5 includes an imaging unit 50 and a plurality of light sources 51 and 52 provided in the handover area RA (described later). Furthermore, in the first mode m1, the light source 52 is located at a position P1 different from the handover area RA.

[0087] First, refer to Figure 4 , while explaining the first path r1.

[0088] Figure 4 1 is a diagram showing a first path r1 for conveying the first component 91. Figure 4 As shown in (a) to (c) of FIG. 1 , a first take-out unit 61 and a first transport unit 30 are provided on the first path r1 .

[0089] The first take-out unit 61 is a tray supply device that takes out the first component 91 from the storage unit and supplies it to the first conveying unit 30. Figure 4 As shown in FIG. 1 (a), the first takeout unit 61 takes out a predetermined tray 96 from a plurality of trays 96 placed in a magazine rack and supplies the tray 96. A plurality of first components 91 are arranged in a matrix on the tray 96. The first takeout unit 61 supplies the tray 96 having the plurality of first components 91 to the first conveyor unit 30.

[0090] The first conveyor 30 includes a first table 31 that supports the first component 91 and a first moving mechanism 32 that moves the first table 31. The first table 31 holds the tray 96, for example, by suction. Thus, the first component 91 is indirectly supported from below by the first table 31. The first moving mechanism 32 is, for example, a linear-acting single-axis robot that can move the first table 31 in the first direction D1.

[0091] Specifically, if Figure 4 As shown in FIG. 5( b ), the first moving mechanism 32 moves the first stage 31 to the delivery area RA along the first direction D1. In this way, the first conveying unit 30 conveys the first component 91 along the first direction D1 and supplies it to the delivery area RA.

[0092] like Figure 2 as well as Figure 3 As shown, the transfer area RA is an area where the first member 91 is transferred between the first path r1 and the common path rc, and is an area where the second member 92 is transferred between the second path r2 and the common path rc.

[0093] An imaging unit 50 and an upper light source 51 are provided above the transfer area RA.

[0094] The upper light source 51 is, for example, a coaxial light source, and irradiates light from above to the first component 91 supported by the first stage 31 in the delivery area RA.

[0095] like Figure 4 As shown in (c), the imaging unit 50 uses light emitted from the upper light source 51 to capture an image of the first component 91 supported by the first work table 31 in the delivery area RA. This allows the first component 91 to be supplied to the common conveying unit 10 while its position coordinates are being recognized.

[0096] Next, refer to Figure 2 、 Figure 3 as well as Figure 5 , while explaining the common path rc.

[0097] like Figure 2 as well as Figure 3 As shown, a common transport section 10 is provided in the common path rc. The common transport section 10 is a common transport section for transporting the first component 91 and the second component 92, and conveys either the first component 91 or the second component 92 to the crimping head section 75.

[0098] The common transport unit 10 includes a head support unit 15 and a common moving mechanism 16 .

[0099] The head support portion 15 replaceably supports the first holding head 11 for holding the first component 91 and the second holding head 12 for holding the second component 92. In other words, the first holding head 11 and the second holding head 12 are attachable to and detachable from the head support portion 15. Specifically, the first holding head 11 is attached to the head support portion 15 in the first mode ml, and the second holding head 12 is attached to the head support portion 15 in the second mode m2. The first holding head 11 and the second holding head 12 can also be automatically attached to the head support portion 15, for example, using a tool replacement component (not shown) provided in the common conveying portion 10.

[0100] The co-moving mechanism 16 moves the head support 15, which is supporting either the first holding head 11 holding the first component 91 or the second holding head 12 holding the second component 92, to the crimping head 75. The co-moving mechanism 16 is, for example, a three-axis robot, and moves the head support 15 in the second direction D2 and the third direction D3, while rotating the head support 15 about an axis extending along the first direction D1. In this manner, the co-moving mechanism 16 can transport the component held by the first holding head 11 or the second holding head 12, and can also flip the component upside down.

[0101] Figure 5 1 is a diagram showing a common path rc for conveying the first member 91 .

[0102] like Figure 5 As shown in (a), the first holding head 11 holds the first component 91 supplied from the first direction D1 to the delivery area RA from the upper surface side of the first component 91 by the drive of the common moving mechanism 16. In addition, the first holding head 11 turns the first component 91 upside down by the drive of the common moving mechanism 16 (see FIG. Figure 5 (b)) and transported to the crimping head 75 (refer to Figure 5 (c)).

[0103] like Figure 5 As shown in FIG. 8 ( d ), the crimping head 75 receives and holds the first component 91 conveyed from the first holding head 11 , and preliminarily crimps the first component 91 to the substrate 80 .

[0104] Next, refer to Figure 6 , while explaining the second path r2.

[0105] Figure 6 This diagram illustrates the second path r2 for conveying the second component 92. The second removal unit 62 and the second conveying unit 40 are located on the second path r2. Furthermore, two second removal units 62 are provided in parallel to facilitate efficient product and batch changes. The following describes an example in which the second component 92 is supplied using either second removal unit 62.

[0106] The second take-out section 62 is a component tape supply device that takes out the second component 92 from the storage section and supplies it to the second conveying section 40. Figure 6 As shown in FIG. 8 ( a ), the second take-out unit 62 extracts and takes out the second component 92 from the belt-shaped component tape 97 including the plurality of second components 92 . The second take-out unit 62 supplies the taken-out second component 92 to the second transport unit 40 .

[0107] The second conveying unit 40 includes a second workbench 41 supporting the second component 92, a second moving mechanism 42, and a moving head 43. The second workbench 41 directly holds the second component 92 from the bottom side by suction, etc. The second moving mechanism 42 is, for example, an orthogonal two-axis robot that can move along the first direction D1 (see Figure 1 ) moves the second workbench 41. The moving head 43 directly holds the second component 92 from above, for example, by suction or the like. The moving head 43 is, for example, an orthogonal two-axis robot, and can transport the held second component 92 along the second direction D2.

[0108] Specifically, the second moving mechanism 42 moves the second worktable 41 along the first direction D1 and moves the second component 92 to a position intermediate between the two second removal portions 62. The moving head 43 holds the second component 92 on the second worktable 41 moved to the intermediate position from above and transports it to the delivery area RA along the second direction D2.

[0109] like Figure 6 As shown in FIG. 5( b ), the second holding head 12 waits in the delivery area RA, and the moving head 43 delivers the second component 92 to the second holding head 12 in the delivery area RA. In this way, the second conveying unit 40 conveys the second component 92 along the second direction D2 and supplies it to the delivery area RA.

[0110] like Figure 3 As shown in FIG, an imaging unit 50 is provided above the intersection region RA. Furthermore, a lower light source 52 is provided below the intersection region RA.

[0111] The lower light source 52 irradiates light from below in the delivery area RA toward the second component 92 held by the second holding head 12. The second holding head 12 is formed of a light-transmitting material that transmits light.

[0112] like Figure 6 As shown in (c) of FIG. , the imaging unit 50 uses light emitted from the lower light source 52 to capture an image of the contour of the second component 92. Thus, even if the second component 92, which is a film-like electronic component, is warped or distorted, the contour of the second component 92 can be captured without being affected by diffuse reflection caused by the warping or distorting, thereby enabling the position coordinates of the second component 92 held by the second holding head 12 to be recognized with high accuracy.

[0113] In addition, the lower light source 52 is arranged so as to be able to retreat from the delivery area RA when the first component 91 is supplied to the delivery area RA by the first conveying unit 30. For example, in the second mode m2, when viewed from the second component 92 supplied to the delivery area RA, the lower light source 52 is arranged at the position P2 on the opposite side of the imaging unit 50 (see FIG. Figure 3 ), but in the first mode m1, the lower light source 52 is arranged at a position P1 different from the position P2 (refer to Figure 2 In this embodiment, the lower light source 52 is disposed on a side surface of the first workbench 31. More specifically, when viewed from the center of the first workbench 31, the lower light source 52 is disposed on a side surface that is located in the positive direction of the first direction D1. Therefore, as the first workbench 31 moves, the lower light source 52 also moves. As a result, the lower light source 52 is configured so as not to interfere with the movement of the first conveyor unit 30.

[0114] Figure 7 1 is a diagram showing a common path rc for conveying the second member 92 .

[0115] like Figure 7 As shown in (a) , the second holding head 12 holds the second component 92 supplied to the delivery area RA from the second direction D2 from the lower surface side of the second component 92 by driving the common moving mechanism 16 and conveys it to the crimping head portion 75 .

[0116] like Figure 7 As shown in (b), the crimping head 75 receives and holds the second component 92 fed from the second holding head 12, and pre-crimps and bonds it to the substrate 80. Thus, in the component crimping device 1, the component supply section 5 supplies the first component 91 or the second component 92 from two mutually intersecting directions, and the pre-crimping section 130 receives the first component 91 or the second component 92 and pre-crimps and bonds it to the substrate 80.

[0117] (Summarize)

[0118] The component crimping device 1 according to this embodiment includes: a placement portion 70 for placing a substrate 80; a crimping head portion 75 for crimping a first component 91 or a second component 92 onto the substrate 80 placed on the placement portion 70; and a common transport portion 10 for transporting the first component 91 or the second component 92 from a predetermined delivery area RA to the crimping head portion 75. The common transport portion 10 includes: a head support portion 15 for replaceably supporting a first holding head 11 for holding the first component 91 and a second holding head 12 for holding the second component 92; and a common moving mechanism 16 for moving the head support portion 15 supporting either the first holding head 11 holding the first component 91 or the second holding head 12 holding the second component 92 to the crimping head portion 75. The first holding head 11 is driven by the common moving mechanism 16 to hold the first component 91 supplied to the delivery area RA from the first direction D1 from the upper surface side of the first component 91, turn the first component 91 upside down, and convey it to the crimping head portion 75. The second holding head 12 is driven by the common moving mechanism 16 to hold the second component 92 supplied to the delivery area RA from the second direction D2 intersecting the first direction D1 from the lower surface side of the second component 92, and convey it to the crimping head portion 75.

[0119] In this manner, the component crimping device 1 is configured such that the first direction D1 for conveying the first component 91 intersects the second direction D2 for conveying the second component 92. Therefore, for example, either the unit for conveying the first component 91 or the unit for conveying the second component 92 can be arranged along the back side of the component crimping device 1. Thus, the space on the back side of the component crimping device 1 can be effectively utilized. Furthermore, the first removal section 61 for removing the first component 91 and the second removal section 62 for removing the second component 92 can be arranged side by side. Therefore, when switching between the first component 91 and the second component 92 to be crimped by the component crimping device 1, there is no need to replace the removal section. Therefore, the time required to switch between component types can be shortened, and the type switching operation can be facilitated.

[0120] The component crimping device 1 further includes an imaging unit 50 disposed above the delivery area RA for capturing an image of the second component 92 held by the second holding head 12, and a lower light source 52 for irradiating light from below the second component 92 held by the second holding head 12 in the delivery area RA. The lower light source 52 may be configured to retract from the delivery area RA when the first component 91 is supplied to the delivery area RA.

[0121] Thus, since the lower light source 52 is provided so as to be retractable from the delivery area RA, for example, when the first component 91 is supplied to the delivery area RA, interference between the lower light source 52 and a unit that conveys the first component 91 can be prevented.

[0122] In addition, the component crimping device 1 may also include: a first conveying section 30, which supplies the first component 91 taken out from the first removal section 61 to the handover area RA, and the first conveying section 30 has: a workbench 31, which supports the first component 91; and a first moving mechanism 32, which moves the workbench 31 from the first removal section 61 to the handover area RA, and the lower light source 52 is arranged on the workbench 31.

[0123] By providing the lower light source 52 on the stage 31 in this manner, for example, when the first component 91 is supplied to the delivery area RA, interference between the lower light source 52 and the first transport unit 30 can be prevented.

[0124] The component crimping device 1 further includes an upper light source 51 for irradiating light from above in the transfer area RA onto the first component 91 supported by the work table 31. The imaging unit 50 may also capture an image of the first component 91 supported by the work table 31 in the transfer area RA using light emitted from the upper light source 51.

[0125] This allows the first component 91 and the second component 92 to be imaged separately using one imaging unit 50. Furthermore, the position coordinates of the first component 91 and the second component 92 can be recognized by the imaging unit 50, and the first component 91 or the second component 92 can be supplied.

[0126] The component crimping apparatus 1 further includes a first conveying unit 30 for supplying a first component 91 removed from the first removal unit 61 to the delivery area RA, and a second conveying unit 40 for supplying a second component 92 removed from the second removal unit 62 to the delivery area RA. Alternatively, the first conveying unit 30 may convey the first component 91 along the first direction D1 and supply it to the delivery area RA, while the second conveying unit 40 may convey the second component 92 along the second direction D2 and supply it to the delivery area RA.

[0127] Thus, either the first conveying unit 30 conveying the first component 91 or the second conveying unit 40 conveying the second component 92 can be arranged along the back surface of the component bonding apparatus 1. This allows the back surface space of the component bonding apparatus 1 to be effectively utilized.

[0128] The component crimping apparatus 1 further includes: a bonding section 120 for bonding the ACF to the substrate 80; a preliminary crimping section 130 having a placement section 70 and a crimping head section 75; and a conveying section 160 for conveying the substrate 80 from the bonding section 120 to the preliminary crimping section 130. The first direction D1 may be parallel to the conveying direction of the substrate 80 by the conveying section 160.

[0129] Thereby, for example, a unit for conveying the first component 91 in the first direction D1 can be arranged along the back surface of the component crimping apparatus 1. Thus, the space on the back surface side of the component crimping apparatus 1 can be effectively utilized.

[0130] Furthermore, the first component 91 may be an IC component, and the second component 92 may be a TCP component.

[0131] According to this, in the component bonding apparatus 1 for bonding IC components and TCP components to the substrate 80 by bonding, the space on the back side of the component bonding apparatus 1 can be effectively utilized.

[0132] The component conveying method according to this embodiment is a component conveying method for a component crimping apparatus 1. The component crimping apparatus 1 includes a crimping head 75 for crimping a first component 91 or a second component 92 onto a substrate 80, and a common conveying unit 10 for conveying the first component 91 or the second component 92 from a predetermined delivery area RA to the crimping head 75. The common conveying unit 10 interchangeably supports a first holding head 11 for holding the first component 91 or a second holding head for holding the second component 92, and moves toward the crimping head 75 while supporting either the first holding head 11 holding the first component 91 or the second holding head 12 holding the second component 92. The first holding head 11, driven by the common conveying unit 10, holds the first component 91 supplied from a first direction D1 to the delivery area RA from the upper surface side of the first component 91, flips the first component 91 vertically, and conveys the first component 91 to the crimping head 75. The second holding head 12 is driven by the common transport unit 10 to hold the second component 92 supplied to the delivery area RA from the second direction D2 intersecting the first direction D1 from the lower surface side of the second component 92 and transport it to the crimping head 75 .

[0133] In this component conveying method, the first direction D1 in which the first component 91 is conveyed intersects the second direction D2 in which the second component 92 is conveyed. Therefore, for example, either the method for conveying the first component 91 or the method for conveying the second component 92 can be performed along the back surface of the component crimping apparatus 1. This allows for efficient use of the space on the back surface of the component crimping apparatus 1.

[0134] (Other embodiments)

[0135] As mentioned above, although the component crimping device and the like according to the present embodiment have been described based on the above-mentioned embodiment, the present invention is not limited to the above-mentioned embodiment.

[0136] In the above embodiment, the first conveyor unit 30 conveys the first component 91 along the first direction D1, and the second conveyor unit 40 conveys the second component 92 along the second direction D2. However, the configuration in the orthogonal directions may be reversed. For example, the first conveyor unit 30 may convey the first component 91 along the second direction D2 and supply it to the delivery area RA, while the second conveyor unit 40 may convey the second component 92 along the first direction D1 and supply it to the delivery area RA.

[0137] In the above embodiment, the lower light source 52 is provided on the side of the first workbench 31. However, the means for retracting the lower light source 52 is not limited thereto. For example, the lower light source 52 may be mounted on another moving mechanism and moved to position P2 in the second mode m2 and to position P1 in the first mode m1.

[0138] Furthermore, various modifications conceived by those skilled in the art to the embodiments and any combinations of components and functions in the embodiments without departing from the spirit of the present invention are also encompassed by the present invention.

[0139] Industrial applicability

[0140] The present invention can be used in a component press-bonding device for producing display panels such as liquid crystal panels and organic EL (Electroluminescence) panels.

Claims

1. A component crimping device comprising: a mounting portion for mounting a substrate; a press-fitting head portion for press-fitting the first component or the second component to the substrate placed on the placement portion; and A common conveying section conveys the first component or the second component from a given delivery area to the crimping head section, The common conveying portion comprises: a head support portion that replaceably supports a first holding head for holding the first component and a second holding head for holding the second component; and The common moving mechanism moves the head support portion that supports either the first holding head holding the first component or the second holding head holding the second component to the crimping head portion. The first holding head is driven by the common moving mechanism to hold the first component supplied from the first direction to the delivery area from the upper surface side of the first component, turn it upside down, and transport it to the crimping head. The second holding head is driven by the common moving mechanism to hold the second component supplied to the delivery area from a second direction intersecting the first direction from the lower surface side of the second component and transport it to the crimping head.

2. The component crimping device according to claim 1, wherein: The component crimping device further comprises: an imaging unit disposed above the handover region and configured to capture an image of the second component held by the second holding head; and The lower light source irradiates light from below to the second component held by the second holding head in the handover region. The lower light source is provided so as to be able to retreat from the delivery area when the first member is supplied to the delivery area.

3. The component crimping device according to claim 2, wherein: The component crimping device further comprises: The first conveying unit supplies the first component taken out from the first taking-out unit to the delivery area. The first conveying unit includes: a workbench supporting the first component; and The first moving mechanism moves the workbench from the first removal portion to the delivery area. The lower light source is disposed on the workbench.

4. The component crimping device according to claim 3, wherein: The component crimping device further comprises: The upper light source irradiates light from above to the first component supported by the table in the handover region. The imaging unit uses light emitted from the upper light source to capture an image of the first component supported by the stage in the handover region.

5. The component crimping device according to claim 1, wherein: The component crimping device further comprises: a first conveying unit that supplies the first component taken out from the first taking-out unit to the delivery area; and The second conveying unit supplies the second component taken out from the second taking-out unit to the delivery area. The first conveying unit conveys the first component along the first direction and supplies the first component to the delivery area. The second conveying unit conveys the second component along the second direction and supplies the second component to the delivery area.

6. The component crimping device according to claim 1, wherein: The component crimping device further comprises: An attaching portion attaches an anisotropic conductive film (ACF) to the substrate; a preliminary crimping portion having the placement portion and the crimping head portion; and a conveying portion, which conveys the substrate from the attaching portion to the pre-pressing portion; The first direction is parallel to a conveying direction in which the conveying unit conveys the substrate.

7. The component crimping device according to any one of claims 1 to 6, wherein: The first component is an integrated circuit IC component, The second component is a tape carrier package TCP component.

8. A component conveying method of a component crimping device, the component crimping device comprising: a crimping head portion for crimping a first component or a second component onto a substrate; and a common conveying portion for conveying the first component or the second component from a predetermined handover area to the crimping head portion. In the component conveying method, The common conveying portion can replaceably support the first holding head for holding the first component or the second holding head for holding the second component, and moves to the crimping head portion while supporting either the first holding head holding the first component or the second holding head holding the second component. The first holding head is driven by the common conveying portion to hold the first component supplied from the first direction to the delivery area from the upper surface side of the first component, turn it upside down, and convey it to the crimping head portion. The second holding head is driven by the common conveying portion to hold the second component supplied to the delivery area from a second direction intersecting the first direction from the lower surface side of the second component and convey the second component to the crimping head portion.

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