Component crimping device and component conveying method

Abstract

This invention provides a component crimping apparatus and a component conveying method to prevent interference between a moving device supplying a first component and a light source for imaging a second component. The component crimping apparatus includes: a common conveying unit (10) for conveying a first component or a second component to a crimping head (75); an imaging unit (50) for imaging the first component or the second component supplied to the junction area; a lower light source (52) for irradiating the second component supplied to the junction area from below; and a first conveying unit (30) capable of moving the lower light source. In a first mode, the common conveying unit holds the first component from the upper surface side and conveys it to the crimping head; in a second mode, it holds the second component from the lower surface side and conveys it to the crimping head. In the second mode, the first conveying unit positions the lower light source at a position below the junction area (P2); in the first mode, it retracts the lower light source to a position different from the position (P2) (P1).

Description

Technical Field

[0001] The present invention relates to a component pressing apparatus for pressing components on a substrate and a component conveying method for conveying components by means of the component pressing apparatus. Background Technology

[0002] Conventionally, component pressing devices are known for pressing electronic components such as IC chips onto the side edges of liquid crystal panels. As an example of a mounting method using such a component pressing device, Patent Document 1 discloses a method for mounting chip-shaped electronic components using COG (Chip on Glass) and a method for mounting film-shaped electronic components using FOG (Film on Glass).

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-317784

[0006] For example, when mounting chip-shaped electronic components and film-shaped electronic components using a single component pressing device, it is necessary to use a camera and a light source to photograph each of the two electronic components to identify their positions. However, depending on the configuration of the light source, there is a problem where the moving device supplying one electronic component interferes with the light source used to photograph the other electronic component. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] The object of the present invention is to provide a moving device for preventing electronic components of one party from moving and a component pressing device for interfering with a light source for photographing electronic components of another party.

[0009] Methods for solving problems

[0010] One aspect of the present invention relates to a component pressing apparatus comprising: a mounting section for mounting a substrate; a pressing section for pressing a first component or a second component onto the substrate mounted on the mounting section; a conveying section for conveying the first component or the second component from a given junction area to the pressing section; an imaging section disposed above the junction area for imaging the first component or the second component supplied to the junction area; a lower light source for irradiating the second component supplied to the junction area from below; and a moving device capable of moving the lower light source, wherein the conveying section... In the first mode of conveying the first component, the conveying unit conveys the first component supplied to the junction area from the upper surface side of the first component to the crimping unit while holding it in place. In the second mode of conveying the second component, the conveying unit conveys the second component supplied to the junction area from the lower surface side of the second component to the crimping unit while holding it in place. In the second mode, the moving device positions the lower light source at a position below the junction area. In the first mode, the lower light source is moved to a position different from the position mentioned above.

[0011] One aspect of the present invention relates to a component conveying method of a component pressing apparatus, the component pressing apparatus comprising: a pressing head portion for pressing a first component or a second component onto a substrate; a conveying head portion for conveying the first component or the second component from a given junction area to the pressing head portion; an imaging head portion disposed above the junction area for imaging the first component or the second component supplied to the junction area; a lower light source for irradiating light from below onto the second component supplied to the junction area; and a moving device capable of moving the lower light source. In a first mode, the conveying head portion conveys the first component supplied to the junction area from its upper surface side to the pressing head portion while holding it in place. In a second mode, the conveying head portion conveys the second component supplied to the junction area from its lower surface side to the pressing head portion while holding it in place. In the second mode, the moving device positions the lower light source at a position below the junction area. In the first mode, the lower light source is moved to a position different from the previously stated position.

[0012] Invention Effects

[0013] According to the component crimping device of the present invention, interference can be prevented between the moving device supplying one electronic component and the light source used to photograph the other electronic component. Attached Figure Description

[0014] Figure 1 This is a top view showing the component crimping device according to the embodiment.

[0015] Figure 2 From Figure 1 The arrow in line II indicates the direction of observation of the component crimping device involved in the embodiment.

[0016] Figure 3 From Figure 1 The arrows along line II-II indicate the direction of observation of the component crimping device involved in the embodiment.

[0017] Figure 4 This is a diagram showing the first path and the light source when the first component is conveyed in the first mode of the component crimping device.

[0018] Figure 5 This is a diagram showing the common path when conveying the first component in the first mode of the component crimping device.

[0019] Figure 6 This is a diagram showing the second path and the light source when conveying the second component in the second mode of the component crimping device.

[0020] Figure 7 This is a diagram showing the common path when conveying the second component in the second mode of the component crimping device.

[0021] Symbol Explanation

[0022] 1. Component crimping device

[0023] 5. Component Supply Department

[0024] 10. Common Conveying Department (An example of a conveying department)

[0025] 11. Keep the head in place.

[0026] 12 Second Keep Head

[0027] 15-head support section

[0028] 16. Joint Mobility Agency

[0029] 30 First Conveying Unit (An Example of a Moving Device)

[0030] 31 Workbench 1

[0031] 32. First moving mechanism (an example of a moving mechanism)

[0032] 40. Second Conveyor Section

[0033] 41. Workbench No. 2

[0034] 42 Second moving mechanism

[0035] 43 Moving head

[0036] 50 Camera Department

[0037] 51. The light source on the upper side

[0038] 52. Light source on the lower side

[0039] 61 First extraction section

[0040] 62 Second extraction section

[0041] 70 mounting section

[0042] 75 Crimping section

[0043] 80 substrate

[0044] 91 Part 1

[0045] 92 Part 2

[0046] 96 pallets

[0047] 97 components

[0048] 110 Board loading department

[0049] 120 Attachment Section

[0050] 130 Pre-compression joint

[0051] 140 Formal crimping section

[0052] 150 Board unloading section

[0053] 160. Moving Department

[0054] 170 Control Department

[0055] D1 Direction 1

[0056] D2 Direction 2

[0057] D3 3rd direction

[0058] m1 Mode 1

[0059] m2 Mode 2

[0060] Positions P1 and P2

[0061] RA junction area

[0062] rc common path

[0063] r1 Path 1

[0064] r2 Path 2 Detailed Implementation

[0065] Hereinafter, embodiments of the present invention will be described in detail using the accompanying drawings. Furthermore, the embodiments described below are all specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangements and connection methods of constituent elements, steps, and sequences of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Consequently, constituent elements in the following embodiments that are not described in the independent claims representing the highest concept of the present invention will be described as arbitrary constituent elements.

[0066] Furthermore, the figures are schematic diagrams and may not be strictly illustrative. Also, the same symbols are used to label the same structural components in all figures.

[0067] Furthermore, in the following embodiments, the transport direction of the substrate in the component pressing apparatus is sometimes referred to as the first direction D1, and the depth direction of the component pressing apparatus orthogonal to the first direction D1 is sometimes referred to as the second direction D2. Additionally, the vertical direction is sometimes referred to as the third direction D3, with the positive direction of the third direction D3 described as upward and the negative direction of the third direction D3 described as downward. Furthermore, both the first direction D1 and the second direction are directions included in the horizontal direction.

[0068] (Implementation Method)

[0069] [1. Schematic structure of the component crimping device]

[0070] While referring to Figure 1 The general structure of the component pressing device 1 according to the embodiment will be described below. The component pressing device 1 is an apparatus for mounting electronic components on a substrate 80, and is used, for example, for manufacturing display panels such as liquid crystal panels and organic EL (electroluminescence) panels. Examples of electronic components mounted on the substrate 80 include the first component 91 and the second component 92, which will be described later.

[0071] Figure 1 This is a top view showing the component crimping device 1 according to the embodiment.

[0072] like Figure 1 As shown, the component crimping apparatus 1 includes a substrate loading section 110, an attachment section 120, a pre-crimping section 130, a final crimping section 140, a substrate unloading section 150, a transport section 160, and a control section 170. Furthermore, the component crimping apparatus 1 includes a component supply section 5, which is disposed on the back side of the pre-crimping section 130 and connected to it. The control section 170 can be wirelessly connected to each of the attachment section 120, pre-crimping section 130, final crimping section 140, and component supply section 5 via a control line or the like, and controls each of these components.

[0073] The substrate loading section 110, the attachment section 120, the pre-pressing section 130, the formal pressing section 140, and the substrate unloading section 150 are connected in this order along the first direction D1.

[0074] In the component pressing apparatus 1, firstly, a substrate 80 is fed into the substrate loading section 110. The substrate 80 fed into the substrate loading section 110 is then transported by the transport section 160 to the attachment section 120. In the attachment section 120, an anisotropic conductive film (ACF) is attached to the area of ​​the substrate 80 where electrode portions are formed. The substrate 80 with the attached ACF is then transported by the transport section 160 to the pre-pressing section 130. In the pre-pressing section 130, an imaging section 50 and light sources 51 and 52 (see reference) are used. Figure 2 as well as Figure 3 After photographing the electronic component (first component 91 or second component 92) supplied from the component supply unit 5, the electronic component is pre-pressed onto the substrate 80 via an ACF (Acoustic Coating Form). The substrate 80 with the pre-pressed electronic component is transported by the transport unit 160 to the formal pressing unit 140. In the formal pressing unit 140, the electronic component is formally pressed onto the substrate 80 via the ACF. Through this formal pressing, the electronic component is electrically connected to the electrode portion of the substrate 80. After the substrate 80 with the connected electronic component is transported by the transport unit 160 to the substrate removal unit 150, it is removed from the substrate removal unit 150.

[0075] In order to prevent interference between the moving device supplying the first component 91 and the light source used to photograph the second component 92, the pre-pressing part 130 and the component supply part 5 of the component pressing device 1 in this embodiment have the following structure.

[0076] [2. Structure of the pre-pressed joint and component supply section]

[0077] Figure 2 From Figure 1 The arrow in line II indicates the direction of the crimping device 1. Figure 3 From Figure 1 The arrow in line II-II indicates the direction of the crimping device 1.

[0078] In the pre-pressing section 130 of the component pressing device 1, a first component 91 required for COG type mounting and a second component 92 required for FOG type mounting are supplied from the component supply section 5. The first component 91 is a chip-shaped electronic component, such as an IC (Integrated Circuit) component. The second component 92 is a film-shaped electronic component, such as a TCP (Tape Carrier Package) component.

[0079] like Figure 2 as well as Figure 3 As shown, the pre-pressing section 130 includes a mounting section 70 for mounting the substrate 80 and a pressing section 75 disposed above the mounting section 70. The mounting section 70 has a movable worktable that can move in the first direction D1 and the second direction D2, and the pressing section 75 can move in the third direction D3. The pressing section 75 receives and holds the first component 91 or the second component 92 conveyed from the component supply section 5 and pre-presses it onto the substrate 80.

[0080] Alternatively, the mounting section 70 may also include a support section, which is independently positioned below the crimping section 75 along with the movable worktable. During pre-crimping performed by the crimping section 75, the crimping portion provided on the side edge of the substrate 80 is supported from below the substrate 80. In this case, the substrate 80 is placed on the movable worktable with the side edge of the substrate 80, which serves as the crimping portion, protruding. The movable worktable moves towards the position where the side edge of the substrate 80 is supported by the support section, and the crimping section 75 performs pre-crimping with the crimping portion of the substrate 80 supported by the support section.

[0081] The component crimping device 1 has a first mode m1 for supplying a first component 91 to the pre-crimping section 130 and a second mode m2 for supplying a second component 92 to the pre-crimping section 130. The control unit 170 selects the first mode m1, for example, when performing COG-based installation, and selects the second mode m2 when performing FOG-based installation.

[0082] In mode 1 m1, via Figure 1 as well as Figure 2 The first path r1 and the common path rc shown transport the first component 91. In the second mode m2, via... Figure 1 as well as Figure 3 The second path r2 and the common path rc shown transport the second component 92. In the common path rc, different components are transported according to the differences in the mode.

[0083] Path r1 is a path extending along direction D1. Path r2 is a path extending along direction D2, which intersects direction D1. Specifically, direction D2 is orthogonal to direction D1. The common path rc, like path r2, extends along direction D2.

[0084] In this embodiment, the first component 91 is conveyed along the first direction D1 in the first path r1, and the second component 92 is conveyed along the second direction D2 in the second path r2. The second direction D2 is the direction extending along the depth of the component crimping device 1, and the first direction D1 is along the long side of the rectangular component crimping device 1. Because the first direction D1 for conveying the first component 91 intersects with the second direction D2 for conveying the second component 92, the space on the back side of the component crimping device 1 can be effectively utilized.

[0085] The following is a reference. Figures 2-7 Meanwhile, the specific structure of the component supply unit 5 will be explained.

[0086] like Figure 2 as well as Figure 3 As shown, the component supply unit 5 includes a first take-out unit 61 and a first conveying unit 30 provided on the first path r1, a second take-out unit 62 and a second conveying unit 40 provided on the second path r2, and a common conveying unit 10 provided on the common path rc. Furthermore, the component supply unit 5 includes a camera unit 50 and multiple light sources 51 and 52 provided in the transfer area RA, which will be described later. Additionally, the light sources 52 are positioned at a different location P1 than the transfer area RA in the first mode m1. The light sources 51 and 52 will be described in detail later.

[0087] First, refer to Figure 4 Meanwhile, the first path r1 is explained.

[0088] Figure 4 This diagram illustrates the first path r1 and light sources 51 and 52 when the first component 91 is conveyed in the first mode m1 of the component pressing device 1. Figure 4 As shown in (a) to (c), a first extraction unit 61 and a first conveying unit 30 are provided in the first path r1.

[0089] The first extraction unit 61 is a tray supply device that extracts the first component 91 from the storage unit and supplies it to the first conveying unit 30. For example... Figure 4 As shown in (a), the first extraction unit 61 extracts a given pallet 96 from a plurality of pallets 96 placed in the magazine rack and supplies it. On the pallet 96, a plurality of first components 91 are arranged in a matrix. The first extraction unit 61 supplies the pallet 96 having the plurality of first components 91 to the first conveying unit 30.

[0090] The first conveying unit 30 is an example of a "moving device". The first conveying unit 30 includes a first worktable 31 supporting the first component 91 and a first moving mechanism 32 for moving the first worktable 31. The first worktable 31 holds the tray 96, for example, by suction. Thus, the first component 91 is indirectly supported from below by the first worktable 31. The first moving mechanism 32 is, for example, a linear single-axis robot, capable of moving the first worktable 31 in a first direction D1. The first moving mechanism 32 is an example of a "moving mechanism".

[0091] Specifically, such as Figure 4 As shown in (b), the first moving mechanism 32 moves the first worktable 31 along the first direction D1 to the transfer area RA. In this way, the first conveying unit 30 conveys the first component 91 along the first direction D1 and supplies it to the transfer area RA.

[0092] like Figure 2 as well as Figure 3 As shown, the handover area RA is the area where the first component 91 is handed over between the first path r1 and the common path rc, and the area where the second component 92 is handed over between the second path r2 and the common path rc.

[0093] A camera unit 50 and a light source 51 are provided above the junction area RA.

[0094] The upper light source 51 is, for example, coaxial illumination, which illuminates the first component 91 supported by the first worktable 31 from above in the junction area RA.

[0095] The camera unit 50 is, for example, a camera, such as... Figure 4 As shown in (c), light emitted from the upper light source 51 is used to image the first component 91 supported by the first worktable 31 in the junction area RA. This allows the first component 91 to be supplied to the common transport unit 10 while its position coordinates are identified.

[0096] Next, while referring to Figure 2 , Figure 3 as well as Figure 5 On the one hand, the common path rc is explained.

[0097] like Figure 2 as well as Figure 3 As shown, a common transport unit 10 is provided in the common path rc. The common transport unit 10 is a shared transport unit for transporting the first component 91 and the second component 92, and transports either the first component 91 or the second component 92 to the crimping unit 75. The common transport unit 10 is an example of a "transport unit".

[0098] The common transport unit 10 has a head support unit 15 and a common moving mechanism 16.

[0099] The head support 15 can interchangeably support a first retaining head 11 for retaining the first component 91 and a second retaining head 12 for retaining the second component 92. That is, the first retaining head 11 and the second retaining head 12 can be attached to and detached from the head support 15. Specifically, the first retaining head 11 is installed in the head support 15 in the first mode m1 and the second retaining head 12 is installed in the second mode m2. The installation of the first retaining head 11 and the second retaining head 12 onto the head support 15 can also be performed automatically, for example, by using a tool changer (not shown) provided in the common transport section 10.

[0100] The common movement mechanism 16 moves the head support portion 15, which is supported by either the first holding head 11 holding the first component 91 or the second holding head 12 holding the second component 92, to the crimping head portion 75. The common movement mechanism 16, for example, is a three-axis robot that moves the head support portion 15 along the second direction D2 and the third direction D3, and rotates the head support portion 15 about an axis along the first direction D1. Thus, the common movement mechanism 16 can transport components held by the first holding head 11 or the second holding head 12, and can also tilt the components vertically.

[0101] Figure 5 This is a diagram showing the common path rc when the first component 91 is conveyed in the first mode m1 of the component crimping device 1.

[0102] like Figure 5 As shown in (a), the first holding head 11 holds the first component 91, which is supplied from the first direction D1 to the junction area RA, from the upper surface side of the first component 91 by a drive implemented by the common movement mechanism 16. Furthermore, the first holding head 11 causes the first component 91 to flip vertically by a drive implemented by the common movement mechanism 16 (see reference). Figure 5 (b)) and conveyed to the crimping section 75 (refer to) Figure 5 (c)).

[0103] like Figure 5 As shown in (d), the crimping head 75 receives and holds the first component 91 conveyed from the first holding head 11 and pre-presses it onto the substrate 80.

[0104] Next, while referring to Figure 6 Meanwhile, the second path r2 will be explained.

[0105] Figure 6This diagram shows the second path r2 and light sources 51 and 52 when the second component 92 is conveyed in the second mode m2 of the component crimping device 1. A second take-out section 62 and a second conveying section 40 are arranged in the second path r2. Furthermore, to efficiently perform product and batch changes, two second take-out sections 62 are arranged side-by-side. The following description illustrates an example of supplying the second component 92 using either one of the second take-out sections 62.

[0106] The second extraction unit 62 is a component belt supply device that extracts the second component 92 from the storage unit and supplies it to the second conveying unit 40. For example... Figure 6 As shown in (a), the second extraction unit 62 extracts the second component 92 from the strip-shaped component belt 97 that includes a plurality of second components 92. The second extraction unit 62 supplies the extracted second component 92 to the second conveying unit 40.

[0107] The second conveying unit 40 includes a second worktable 41 supporting the second component 92, a second moving mechanism 42, and a moving head 43. The second worktable 41 holds the second component 92 directly from below, for example, by means of suction. The second moving mechanism 42 is, for example, an orthogonal two-axis robot, capable of moving along a first direction D1 (see reference). Figure 1 The second worktable 41 is moved. The moving head 43 holds the second part 92 directly from above, for example, by suction. The moving head 43 is, for example, an orthogonal two-axis robot, capable of conveying the held second part 92 along the second direction D2.

[0108] Specifically, the second moving mechanism 42 moves the second worktable 41 along the first direction D1 and moves the second component 92 to the middle position of the two second take-out parts 62. The moving head 43 holds the second component 92 on the second worktable 41 that has moved to the middle position from above and transports it to the transfer area RA along the second direction D2.

[0109] like Figure 6 As shown in (b), the second holding head 12 is in standby position in the transfer area RA, and the moving head 43 transfers the second component 92 to the second holding head 12 in the transfer area RA. In this way, the second conveying section 40 conveys the second component 92 along the second direction D2 and supplies it to the transfer area RA.

[0110] like Figure 3 As shown, a camera unit 50 is provided above the junction area RA. In addition, a lower light source 52 is provided below the junction area RA.

[0111] The lower light source 52, with its optical axis along the third direction D3, illuminates the second component 92 held by the second holding head 12 from below in the junction area RA. The second holding head 12 is formed of a light-transmitting material that allows light to pass through.

[0112] like Figure 6 As shown in (c), the imaging unit 50 uses light emitted from the light source 52 at the bottom to image the outline of the second component 92. Therefore, even if the second component 92, being a film-like electronic component, is flexed or warped, its shape can be imaged without being affected by diffuse reflection caused by the flex or warping. This allows for high-precision identification of the position coordinates of the second component 92 held by the second holding head 12.

[0113] In this embodiment, the lower light source 52 is configured to be able to retract from the junction area RA when the first component 91 is supplied to the junction area RA via the first conveying unit 30. For example, in the second mode m2, when viewed from the second component 92 supplied to the junction area RA, the lower light source 52 is positioned at position P2 opposite to the imaging unit 50 (see reference). Figure 3 In mode 1 m1, the lower light source 52 is configured at a different position P1 than position P2 (see reference). Figure 2 Position P2 is, for example, within the junction area RA, while other positions P1 are, for example, outside the movement range of the first worktable 31. Furthermore, the position of the light source 52 refers to the position of the optical axis of the light source 52 in the first direction D1 and the second direction D2.

[0114] Furthermore, the lower light source 52 is disposed on the side of the first worktable 31. More specifically, viewed from the center of the first worktable 31, the lower light source 52 is disposed on the side facing the first direction D1. Therefore, as the first worktable 31 moves horizontally, the lower light source 52 also moves. Thus, the lower light source 52 is configured not to obstruct the movement of the first conveying unit 30.

[0115] Figure 7 This is a diagram showing the common path rc when the second component 92 is conveyed in the second mode m2 of the component crimping device 1.

[0116] like Figure 7 As shown in (a), the second holding head 12 is driven by the common moving mechanism 16 to hold the second component 92 supplied from the second direction D2 to the junction area RA from the lower surface side of the second component 92 and convey it to the crimping head 75.

[0117] like Figure 7 As shown in (b), the crimping head 75 receives and holds the second component 92 conveyed from the second holding head 12 and pre-presses it onto the substrate 80. Thus, in the component crimping apparatus 1, the first component 91 or the second component 92 is supplied from two intersecting directions in the component supply section 5, and the first component 91 or the second component 92 is received and pre-pressed onto the substrate 80 in the pre-pressing section 130.

[0118] (Summarize)

[0119] The component pressing device 1 according to this embodiment includes: a mounting section 70 for mounting a substrate 80; a pressing section 75 for pressing a first component 91 or a second component 92 onto the substrate 80 mounted on the mounting section 70; a common transport section (an example of a transport section) 10 for transporting the first component 91 or the second component 92 from a given junction area RA to the pressing section 75; an imaging section 50 disposed above the junction area RA for imaging the first component 91 or the second component 92 supplied to the junction area RA; a lower light source 52 for irradiating light from below onto the second component 92 supplied to the junction area RA; and a first transport section (an example of a moving device) 30 capable of moving the lower light source 52. In the first mode m1 of conveying the first component 91, the common conveying unit 10 conveys the first component 91, which is supplied to the transfer area RA, from the upper surface side of the first component 91 to the crimping unit 75 while holding it. In the second mode m2 of conveying the second component 92, the common conveying unit 30 conveys the second component 92, which is supplied to the transfer area RA, from the lower surface side of the second component 92 to the crimping unit 75 while holding it. In the second mode m2, the first conveying unit 30 positions the lower light source 52 at position P2 below the transfer area RA. In the first mode m1, the lower light source 52 is moved to a different position P1 than position P2.

[0120] Thus, by relocating the lower light source 52 to another position P1, interference can be prevented between the unit transporting the first component 91 and the lower light source 52 used for imaging the second component 92 when the first component 91 is supplied to the transfer area RA in the first mode m1. That is, interference can be prevented between the moving device supplying one electronic component (the first component 91) and the light source 52 used for imaging the other electronic component (the second component 92).

[0121] Alternatively, the first conveying unit 30 may have: a worktable 31 supporting the first component 91 taken out from the first take-out unit 61; and a first moving mechanism (an example of a moving mechanism) 32 that moves the worktable 31 from the first take-out unit 61 to the transfer area RA, with a light source 52 on the lower side provided on the worktable 31.

[0122] Thus, by placing the lower light source 52 on the worktable 31, interference between the first conveying section 30 that conveys the first component 91 and the lower light source 52 that captures images of the second component 92 can be reliably prevented when the first component 91 is supplied to the transfer area RA.

[0123] Alternatively, in the first mode m1, the first conveying unit 30 can move the lower light source 52 to another position P1 by moving the worktable 31 in the horizontal direction.

[0124] Thus, in the first mode m1, by moving the worktable 31 in the horizontal direction to avoid interference between the first conveyor section 30 and the lower light source 52, it is easy to prevent interference.

[0125] In addition, other positions P1 can also be located outside the movement range of the worktable 31.

[0126] Thus, since other positions P1 are outside the movement range of the worktable 31, interference between the first conveying section 30 and the lower light source 52 can be reliably prevented when the first component 91 is supplied to the transfer area RA.

[0127] Alternatively, the component pressing device 1 may also include: an upper light source 51 that illuminates the first component 91 supported by the worktable 31 in the junction area RA from above, and an imaging unit 50 that uses the light emitted from the upper light source 51 to capture an image of the first component 91 supported by the worktable 31 in the junction area RA.

[0128] Accordingly, a single camera unit 50 can be used to capture images of the first component 91 and the second component 92 respectively. Furthermore, the camera unit 50 can identify the position coordinates of the first component 91 and the second component 92, and then provide the coordinates to the first component 91 or the second component 92.

[0129] Alternatively, the first component 91 could be an IC (Integrated Circuit) component, and the second component 92 could be a TCP (Tape Carrier Package) component.

[0130] Accordingly, in the component pressing device 1 used to press IC components and TCP components onto the substrate 80, interference can be prevented between the unit that transports the first component 91 and the light source 52 on the lower side.

[0131] The component transport method involved in this embodiment is a component transport method of component pressing device 1. Component pressing device 1 includes: a pressing head 75 for pressing a first component 91 or a second component 92 onto a substrate 80; a common transport unit (an example of a transport unit) 10 for transporting the first component 91 or the second component 92 from a given junction area RA to the pressing head 75; an imaging unit 50 disposed above the junction area RA for imaging the first component 91 or the second component 92 supplied to the junction area RA; a lower light source 52 for irradiating light from below onto the second component 92 supplied to the junction area RA; and a first transport unit (an example of a moving device) 30 capable of moving the lower light source 52. In the first mode m1, the common transport unit 10 transports the first component 91, which is supplied to the transfer area RA, from the upper surface side of the first component 91 to the crimping unit 75 while holding it. In the second mode m2, the common transport unit 30 transports the second component 92, which is supplied to the transfer area RA, from the lower surface side of the second component 92 to the crimping unit 75 while holding it. In the second mode m2, the first transport unit 30 positions the lower light source 52 at position P2 below the transfer area RA. In the first mode m1, the lower light source 52 is moved to a different position P1 than position P2.

[0132] Thus, by relocating the lower light source 52 to another position P1, interference can be prevented between the unit that transports the first component 91 and the lower light source 52 used to photograph the second component 92 when the first component 91 is supplied to the junction area RA in the first mode m1.

[0133] (Other implementation methods)

[0134] The component crimping device and the like involved in this embodiment have been described above based on the above embodiments, but the present invention is not limited to the above embodiments.

[0135] In the above embodiment, an example is shown where the first conveying unit 30 conveys the first component 91 along the first direction D1 and the second conveying unit 40 conveys the second component 92 along the second direction D2, but the orthogonal configuration can also be reversed. For example, the first conveying unit 30 may convey the first component 91 along the second direction D2 and supply it to the transfer area RA, while the second conveying unit 40 may convey the second component 92 along the first direction D1 and supply it to the transfer area RA.

[0136] In the above embodiment, an example is shown where the lower light source 52 is disposed on the side of the first worktable 31, but the unit that retracts the lower light source 52 is not limited to this. For example, it may be configured such that the lower light source 52 is mounted on another moving mechanism, moving to position P2 in the second mode m2 and to position P1 in the first mode m1.

[0137] Furthermore, the present invention includes any modifications conceived by those skilled in the art in implementing the various embodiments, and any implementation methods achieved by arbitrarily combining the constituent elements and functions of the various embodiments without departing from the spirit of the present invention.

[0138] Industrial availability

[0139] This invention can be used in component pressing devices for manufacturing display panels such as liquid crystal panels and organic EL (Electroluminescence) panels.

Claims

1. A component press-contacting apparatus comprising: a placement section that places a substrate; a press-contacting section that press-contacts a component to the substrate placed on the placement section; a conveying section that conveys the component from a given handover region to the press-contacting section; and an imaging section that is disposed above the handover region and images the component supplied to the handover region, the component press-contacting apparatus having a first mode in which a first component is mounted as the component on the substrate and a second mode in which a second component is mounted as the component on the substrate, the component press-contacting apparatus further comprising: a lower light source that irradiates light from a lower side with respect to the second component supplied to the handover region; and a moving apparatus that is capable of moving the lower light source, the conveying section conveys the first component supplied to the handover region to the press-contacting section in a manner that the first component is held from an upper surface side of the first component and is flipped upside down in the first mode, and conveys the second component supplied to the handover region to the press-contacting section in a manner that the second component is held from a lower surface side of the second component in the second mode, the moving apparatus configures the lower light source at a position below the handover region in the second mode, and causes the lower light source to retreat to another position different from the position in the first mode.

2. The component press-contacting apparatus according to claim 1, wherein the moving apparatus has: a work table that supports the first component taken out from a first taking-out section; and a moving mechanism that moves the work table from the first taking-out section to the handover region, the lower light source is provided to the work table.

3. The component press-contacting apparatus according to claim 2, wherein the moving mechanism causes the lower light source to retreat to the other position by moving the work table in a horizontal direction in the first mode.

4. The component press-contacting apparatus according to claim 3, wherein the other position is outside a moving range of the work table.

5. The component press-contacting apparatus according to any one of claims 2 to 4, further comprising: an upper light source that irradiates light from an upper side with respect to the first component supported by the work table in the handover region, the imaging section images the first component supported by the work table in the handover region using the light emitted from the upper light source.

6. The component press-contacting apparatus according to any one of claims 1 to 4, wherein the first component is an integrated circuit (IC) component, and the second component is a tape carrier package (TCP) component. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 7. A component conveying method of a component press bonding apparatus, the component press bonding apparatus having: a press bonding head that press bonds a component to a substrate; a conveying section that conveys the component to the press bonding head from a given handover region; and an imaging section that is disposed above the handover region and images the component supplied to the handover region, the component press bonding apparatus having a first mode in which a first component is mounted as the component to the substrate and a second mode in which a second component is mounted as the component to the substrate, the component press bonding apparatus further having: a lower light source that irradiates light from a lower side with respect to the second component supplied to the handover region; and a moving device that is capable of moving the lower light source, in the component conveying method, the conveying section conveys the first component supplied to the handover region to the press bonding head in a manner that the first component is held from an upper surface side of the first component and is flipped upside down in the first mode, and conveys the second component supplied to the handover region to the press bonding head in a manner that the second component is held from a lower surface side of the second component in the second mode, the moving device configures the lower light source at a position below the handover region in the second mode, and causes the lower light source to retreat to another position different from the position in the first mode.

Images