A mask device without a pellicle

Abstract

The application relates to the technical field of semiconductor manufacturing, and discloses a mask plate device without film skin, which comprises upper and lower distributed light sources and a mask plate, further comprises a clamp arranged beside the mask plate, the clamp is provided with electric charges, the clamp can clamp or release the mask plate, and the clamp can drive the mask plate to move when clamping the mask plate. The application solves the problems of poor quality and production capacity loss caused by the adsorption of film skin to fine particles in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing technology, and particularly relates to a mask plate device without a pellicle. BACKGROUND

[0002] The semiconductor field is always at war with particles. In particular, the management of particles on a mask plate used in a photolithography technology is important. For example, if one particle exists on one chip in a mask plate, 10 chips per slot have one chip, which is defective, and a 10% defective rate is generated.

[0003] At present, in order to reduce such a risk, a pellicle is installed on a chrome surface with a real pattern, and then used.

[0004] However, such a method has problems, such as capacity loss and potential quality problems. For example, haze appears on a PSM MAS, or capacity loss is caused by a long-term pellicle. SUMMARY

[0005] In order to overcome the defects of the prior art, the present application provides a mask plate device without a pellicle, which solves the problems of quality defects and capacity loss caused by the adsorption of particles by a pellicle in the prior art.

[0006] The technical scheme adopted by the present application to solve the above problems is as follows:

[0007] A mask plate device without a pellicle comprises an upper and lower light source and a mask plate, and further comprises a clamp provided beside the mask plate, wherein the clamp has an electric charge, the clamp can hold or release the mask plate, and the clamp can drive the mask plate to move when the clamp holds the mask plate.

[0008] As a preferred technical scheme, the mask plate device further comprises a blocking piece provided beside the mask plate, and the blocking piece has an electric charge.

[0009] As a preferred technical scheme, the blocking piece is movable.

[0010] As a preferred technical scheme, the number of the blocking pieces is one, and the one blocking piece is on the same plane.

[0011] As a preferred technical scheme, the electric charge of the blocking piece can be changed.

[0012] As a preferred technical scheme, the shape of the blocking piece is rod-shaped.

[0013] As a preferred technical solution, the blocking piece is located between the light source and the mask plate.

[0014] As a preferred technical solution, the clamp is a forceps.

[0015] As a preferred technical solution, the distance from the clamp to the mask plate is 4-5 cm.

[0016] As a preferred technical solution, the light source is a condenser lens.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] (1) The present application does not need to perform PM management without film skin, so it does not affect production; the present application uses a mask plate without film skin, which can avoid quality defects (repeated defects caused by fog) and production capacity loss caused by PM (preventive maintenance) of the mask plate. Thus, the problems of quality defects and production capacity loss caused by film skin adsorbing particles in the prior art are solved.

[0019] (2) The particles attached to the mask plate will be detached when the mask plate is scanned upward / downward (SCAN UP / DOWN); in addition, the particles accumulated on the blocking piece will be collected and discharged outward.

[0020] (3) The present application is convenient for dynamic adjustment following the movement of the mask plate.

[0021] (4) The present application is convenient for making particle adsorption more uniform.

[0022] (5) The present application can hinder the combination of chemical particles, so that the size cannot be enlarged, the cleaning period of the mask is prolonged, and the number of masks required for production can be greatly reduced.

[0023] (6) The shape of the blocking piece is rod-shaped, which is convenient to install, has good charge attachment effect, and is convenient to achieve good particle capture.

[0024] (7) The present application is convenient for further improving the effect of particle capture.

[0025] (8) The forceps of the present application are convenient for moving the mask plate, and the operation is convenient.

[0026] (9) The present application ensures that the clamp is convenient for clamping the mask plate, and saves space on the other hand.

[0027] (10) The condenser lens of the present application has good condensing effect, which is convenient for improving the effect of photolithography. BRIEF DESCRIPTION OF DRAWINGS

[0028] Fig. 1 This is one of the structural schematic diagrams of the present invention (a diagram showing the positional relationship between the fixture and the mask plate);

[0029] Fig. 2 This is the second structural schematic diagram of the present invention (positional relationship diagram of light source, mask plate, and blocking component);

[0030] Fig. 3 This is a schematic diagram illustrating the working principle of the blocking component capturing particles when the mask plate moves according to the present invention.

[0031] The attached diagram shows the following components and their corresponding names: 1. Light source, 2. Mask plate, 3. Fixture, 4. Blocking component. Detailed Implementation

[0032] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0033] Example 1

[0034] like Figs. 1-3 As shown, a maskless device includes a light source 1 and a mask 2 distributed vertically, and a clamp 3 disposed next to the mask 2. The clamp 3 is charged and can clamp or release the mask 2. When the clamp 3 clamps the mask 2, it can drive the mask 2 to move.

[0035] In use, the mask 2 is clamped on the step of the mask 2 with a clamp 3, and a positive charge is provided to the mask 2 which was originally negatively charged, so that the charge of the mask 2 becomes 0, which basically prevents the particles from being adsorbed and makes it electrically neutral.

[0036] The film coating on mask 2 requires periodic defect inspection or regular PM (Preventive Maintenance). Without the film coating, this management is unnecessary and therefore does not affect production. This invention uses a mask 2 without a film coating, avoiding quality defects (recurring defects caused by fogging) and production losses due to PM (Preventive Maintenance) of mask 2. This solves the problems of quality defects and production losses caused by the adsorption of particles by the film coating in existing technologies.

[0037] As a preferred technical solution, it also includes a blocking member 4 disposed next to the mask plate 2, the blocking member 4 being charged.

[0038] To remove particles adsorbed by the mask 2 during scan up / down scanning, a blocking element 4 is provided. When the mask 2 appears after the scan area, the particles attached to the mask 2 will detach. In addition, particles accumulated on the blocking element 4 will be collected and discharged outwards.

[0039] As a preferred technical solution, the blocking piece 4 can move.

[0040] This facilitates dynamic adjustment following the movement of the mask plate 2.

[0041] As a preferred technical solution, the number of the blocking piece 4 is 2, and the two blocking pieces 4 are in the same plane.

[0042] This facilitates more uniform adsorption of microparticles.

[0043] As a preferred technical solution, the blocking piece 4 has a charge polarity conversion function.

[0044] With the present application, the mask does not need to be cleaned, and the charge polarity conversion (preferably, periodic positive charge conversion) of the blocking piece 4 can hinder the combination between chemical particles, so that the size cannot be enlarged, the period of mask cleaning is prolonged, and the number of masks required in production can be greatly reduced.

[0045] As a preferred technical solution, the blocking piece 4 is in the shape of a rod.

[0046] The rod-shaped structure is convenient to install, and the charge adhesion effect is good, which facilitates better microparticle capture.

[0047] As a preferred technical solution, the blocking piece 4 is located between the light source 1 and the mask plate 2.

[0048] This facilitates further improvement of the effect of microparticle capture.

[0049] As a preferred technical solution, the clamp 3 is a tweezers.

[0050] The tweezers facilitate movement of the mask plate 2 and are convenient to operate.

[0051] As a preferred technical solution, the distance from the clamp 3 to the mask plate 2 is 4-5 cm.

[0052] Such a distance, on the one hand, ensures that the clamp 3 can conveniently hold the mask plate 2, and on the other hand, takes into account the saving of space.

[0053] As a preferred technical solution, the light source 1 is a condenser lens.

[0054] The condenser lens has a good condensing effect, which facilitates improvement of the photoetching effect.

[0055] Embodiment 2

[0056] As shown in Figs. 1-3 As a further optimization of embodiment 1, this embodiment contains all the technical features of embodiment 1, in addition to which, this embodiment further includes the following technical features:

[0057] The present invention is a mask device without a pellicle, in which a mask 2 is clamped by a clamp 3 at the step of the mask 2, and a positive charge is provided to the originally negatively charged mask 2, so that the charge of the mask 2 becomes 0, and the particles are basically unable to be adsorbed, so that the mask 2 becomes electrically neutralized.

[0058] Thereafter, in order to remove the particles adsorbed on the mask 2 when scanning upward / downward (SCAN UP / DOWN), a +, - charge with a repeatedly changing shape of a barrier (BAR, i.e., a blocking member 4) is provided. When the mask 2 appears after the scanning area, it passes through the repeatedly changing area. At this time, the particles attached to the mask 2 are detached. In addition, the particles gathered on the repeatedly changing BAR shape are collected and discharged outward.

[0059] Preferably, the present invention uses a technique for improving the mask 2-related defects in a photolithography process, and a device for implementing the technique includes a device for driving the mask 2 in the process and a device for fixing the mask 2.

[0060] Preferably, the present invention includes a clamp 3 for gripping the mask 2 and a device for applying a charge.

[0061] Preferably, the present invention can generate a sufficient positive charge to offset the negative charge generated when the mask 2 is scanned.

[0062] Fig. 1 In the scanning process, the clamp 3 can grip the mask 2 and move it.

[0063] In the present embodiment, the removal conditions (1) to (3) for removing the particles adsorbed on the mask 2 are as follows:

[0064] (1) The mask 2 has a negative charge in the scanning process of the mask 2;

[0065] (2) A positive charge is adsorbed on one side of the mask pattern;

[0066] (3) A positive charge is applied, and the positive charge on one side of the mask pattern is easily moved.

[0067] Particle capture:

[0068] 1) The particle capture includes the effects of a positive charge and a negative charge;

[0069] 2) The particle capture is repeated in (a) and emitted outside in (b).

[0070] The present invention uses a mask 2 without a pellicle, and thus can avoid quality defects (repetitive defects caused by fog) and production capacity loss caused by PM (Preventive Maintenance) of the mask 2.

[0071] The film attached to the mask plate 2 needs to be inspected for defects periodically or periodically PM'd. Without the film, this management is not required, so it does not affect production.

[0072] In existing technologies, static electricity is generated and connected to the surface of a mask quartz using a device. Positive charges are distributed throughout the mask quartz and the entire mask pattern, with the same static charge also distributed on the film surface. Most particles or chemical residues inside and outside the mask become negatively charged. Particles or chemicals with positive and opposite charges tend to approach the mask surface, while particles with the same charge move away. If the charge changes to the opposite positive charge within a short period, the opposite occurs: particles close to the mask surface move away. This periodic change in the polarity of the positive charge prevents particles from adhering to the mask or film surface, causing them to disperse in the space between the mask pattern and the film. Even if only particles larger than 1µm fall onto the mask surface, wafer defects can still occur.

[0073] To remove defects, this invention eliminates the need for mask cleaning. The periodic positive charge transformation hinders the bonding between chemical particles, preventing them from growing larger. The mask cleaning cycle is extended, and the number of masks required for production can be significantly reduced.

[0074] As described above, the present invention can be implemented well.

[0075] All features disclosed in all embodiments of this specification, or steps in all methods or processes implied in the disclosure, may be combined and / or extended or replaced in any way, except for mutually exclusive features and / or steps.

[0076] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Based on the technical essence of the present invention, any simple modifications, equivalent substitutions, and improvements made to the above embodiments within the spirit and principles of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A mask plate device without a membrane skin, characterized in that, The device includes a light source (1) distributed vertically, a mask (2), and a clamp (3) located next to the mask (2). The mask (2) is a structure without a membrane. The clamp (3) carries a charge and can hold or release the mask (2). When the clamp (3) holds the mask (2), it can move the mask (2). The charge on the clamp (3) is used to neutralize the charge on the mask (2), making the mask (2) neutral so that particles cannot be adsorbed. The mask device without a membrane also includes a blocking member (4) located next to the mask (2). The blocking member (4) carries a charge. The charge polarity of the blocking member (4) can change and its position can be dynamically adjusted as the mask (2) moves to capture particles in the scanning area.

2. The mask plate device without a film layer according to claim 1, characterized in that, The number of the blocking elements (4) is 2, and the 2 blocking elements (4) are on the same plane.

3. The maskless device according to claim 2, characterized in that, The blocking element (4) is rod-shaped.

4. The maskless device according to claim 3, characterized in that, The blocking element (4) is located between the light source (1) and the mask plate (2).

5. A maskless device according to any one of claims 1 to 4, characterized in that, The clamp (3) is tweezers.

6. The maskless device according to claim 5, characterized in that, The distance between the clamp (3) and the mask plate (2) is 4cm to 5cm.

7. A maskless device according to claim 6, characterized in that, The light source (1) is a condenser lens.

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