Substrate processing device and method

Abstract

The present invention provides a substrate processing device and method capable of improving productivity by efficiently cleaning the surface and back of a substrate. The substrate processing device includes: a processing module including a substrate support portion for supporting a substrate, a flip portion for flipping the substrate, and a processing portion for processing the substrate; and a conveying module for conveying the substrate to the processing module, wherein the conveying module introduces a substrate with a first surface facing upward into the processing module and places it on the flip portion, the flip portion flips the substrate so that a second surface faces upward and provides the flipped substrate to the substrate support portion, the processing portion performs a first process on the second surface of the substrate placed on the substrate support portion, the flip portion flips the substrate after the first process so that the first surface faces upward, the conveying module removes the substrate with the first surface facing upward from the processing module, and reintroduces the substrate with the first surface facing upward into the processing module and places it on the substrate support portion, and the processing portion performs a second process on the first surface of the substrate placed on the substrate support portion.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and method. Background Art

[0002] When manufacturing semiconductor devices or display devices, various processes are performed, including photolithography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions are used in each process, and contaminants and particles may be generated during the process. To address this, cleaning processes are performed before and after each process to remove these contaminants and particles.

[0003] Prior art literature:

[0004] Patent Document 1: Japanese Patent Publication No. JP2009-146975A (July 2, 2009) Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a substrate processing device and method that can improve productivity by efficiently and quickly cleaning the surface and back surface of a substrate.

[0006] The technical problems of the present invention are not limited to the above technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0007] An aspect of the substrate processing device of the present invention for solving the above-mentioned technical problems includes: a processing module, including a substrate supporting part for supporting a substrate, a flipping part for flipping the substrate, and a processing part for processing the substrate; and a conveying module for conveying the substrate to the processing module, wherein the conveying module introduces the substrate with the first side facing up into the processing module and places it on the flipping part, the flipping part flips the substrate so that the second side faces up, and provides the flipped substrate to the substrate supporting part, the processing part performs a first processing on the second side of the substrate placed on the substrate supporting part, the flipping part flips the substrate after the first processing so that the first side faces up, the conveying module takes out the substrate with the first side facing up from the processing module, and introduces the substrate with the first side facing up into the processing module again and places it on the substrate supporting part, and the processing part performs a second processing on the first side of the substrate placed on the substrate supporting part.

[0008] Another aspect of the substrate processing device of the present invention for solving the above-mentioned technical problems includes: a first processing module; a second processing module; and a conveying module for conveying a substrate to the first processing module and the second processing module, wherein the conveying module provides the first substrate to the first processing module, the first processing module performs a first processing on the first surface of the first substrate, the conveying module takes the first substrate after the first processing out of the first processing module, and then provides the first substrate to the first processing module again, and the first processing module performs a second processing on the second surface of the first substrate.

[0009] One aspect of the substrate processing method of the present invention for solving the above-mentioned technical problems includes the following steps: providing a substrate processing device, the substrate processing device including: a processing module, including a substrate supporting part for supporting a substrate, a flipping part for flipping the substrate, and a processing part for processing the substrate; and a conveying module for conveying the substrate to the processing module; the conveying module introduces the substrate with the first side facing up into the processing module and places it on the flipping part; the flipping part flips the substrate so that the second side of the substrate faces up, and provides the flipped substrate to the substrate supporting part; the processing part performs a first processing on the second side of the substrate placed on the substrate supporting part; the flipping part flips the substrate after the first processing so that the first side faces up; the conveying module takes out the substrate with the first side facing up from the processing module, and introduces the substrate with the first side facing up into the processing module again and places it on the substrate supporting part; and the processing part performs a second processing on the first side of the substrate placed on the substrate supporting part.

[0010] Details of other embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a conceptual diagram for explaining a substrate processing apparatus according to some embodiments of the present invention.

[0012] Figure 2 Is used to illustrate Figure 1 A perspective view of an exemplary configuration of a flip portion is shown.

[0013] Figure 3 is a flowchart for illustrating a substrate processing method according to several embodiments of the present invention.

[0014] Figures 4 to 11 Is used to illustrate Figure 3 View of an intermediate step in a substrate processing method.

[0015] Figure 12 is a conceptual diagram for explaining a substrate processing method according to another embodiment of the present invention.

[0016] Figures 13 to 16 1 and 2 are views for explaining effects of substrate processing methods according to some embodiments of the present invention.

[0017] Description of Reference Signs

[0018] 1: Processing module 10: Substrate support

[0019] 20: Reversing part 21: Buffer

[0020] 22: Clamping arm 25: Driving unit

[0021] 30: Third processing unit 31: Cleaning nozzle

[0022] 40: First processing part 41: Brush

[0023] 50: Second processing unit 51: Sonic nozzle

[0024] 90: Chamber 91: First opening

[0025] 92: Second opening 99: Transmission module DETAILED DESCRIPTION

[0026] Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention and methods for achieving these advantages and features will be described in detail with reference to the accompanying drawings. Figure 1 The present invention will become clear from the detailed description of the embodiments below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of different forms. These embodiments are provided only to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the invention. The present invention is limited only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0027] When an element or layer is referred to as being “on” or “over” another element or layer, it includes not only being directly over the other element or layer but also including the case where other layers or other elements are interposed. In contrast, when an element is referred to as being “directly on” or “over” another element, it indicates that there are no other elements or layers interposed.

[0028] In order to easily describe the relationship between one element or constituent element and another element or constituent element as shown in the figure, the spatial relative terms "below", "beneath", "lower", "above", "upper", etc. can be used. It should be understood that, in addition to the directions shown in the figures, spatial relative terms are terms that also include different directions of the elements when in use or operation. For example, when the elements shown in the figures are turned over, the element described as "below" or "beneath" another element can be located "above" another element. Therefore, the exemplary term "below" can include both below and above directions. The elements can also be oriented in another direction, whereby the spatial relative terms can be interpreted according to the orientation.

[0029] Although the terms "first," "second," etc. are used to describe various elements, constituents, and / or parts, these elements, constituents, and / or parts are clearly not limited by these terms. These terms are only used to distinguish one element, constituent, and / or part from another element, constituent, and / or part. Therefore, the first element, first constituent, or first part mentioned below may also be the second element, second constituent, or second part within the technical concept of the present invention.

[0030] The terms used in this specification are intended to illustrate the embodiments and are not intended to limit the present invention. In this specification, unless otherwise specified in a sentence, the singular also includes the plural. The use of "comprises" and / or "comprising" in the specification does not exclude the presence or addition of one or more other constituent elements, steps, operations and / or elements in addition to the mentioned constituent elements, steps, operations and / or elements.

[0031] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with the meanings commonly understood by those skilled in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries shall not be interpreted ideally or excessively unless specifically defined otherwise.

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are denoted by identical reference numerals regardless of the reference numerals, and repeated description thereof will be omitted.

[0033] Figure 1 is a conceptual diagram for explaining a substrate processing apparatus according to some embodiments of the present invention. Figure 2 Is used to illustrate Figure 1A perspective view of an exemplary configuration of a flip portion is shown.

[0034] Reference Figure 1 , a substrate processing apparatus according to some embodiments of the present invention includes a processing module 1 and a transfer module 99 .

[0035] The transfer module 99 introduces the substrate W into the process module 1 or takes the substrate W out of the process module 1. The transfer module 99 may be in the form of a robot arm, but is not limited thereto.

[0036] The processing module 1 receives the substrate W from the transfer module 99 to process (e.g., clean) the substrate W. According to the substrate processing apparatus of some embodiments of the present invention, both the first side (i.e., the upper surface or the front surface) and the second side (i.e., the rear surface or the back surface) of the substrate W are processed in one processing module 1 (i.e., one chamber 90).

[0037] The processing module 1 includes a chamber 90 , a substrate support portion 10 , a turning portion 20 , and at least one processing portion 30 , 40 , 50 .

[0038] The substrate W may be placed on the substrate support portion 10 and may be selectively rotated by the power supply of the driving portion 11 .

[0039] For example, at least one treatment part 30, 40, 50 may include a first treatment part 40 performing physical cleaning using a brush, a second treatment part 50 performing cleaning using ultrasonic waves, and a third treatment part 30 spraying a rinse liquid to perform cleaning, but is not limited thereto.

[0040] The first processing unit 40 may include a brush 41 that contacts the first surface US or the second surface BS of the substrate W to physically clean the substrate W, and a driving unit 45 for rotating the brush 41 and moving the position of the brush 41. For example, the brush 41 may be a roller brush, but is not limited thereto. The brush 41 contacts the substrate W with a predetermined pressure and rotates at a predetermined speed, thereby scrubbing the substrate W. The rotation speed of the brush 41 is correlated with the rotation speed of the substrate support 10, so the rotation speed of the brush 41 can be changed according to the rotation speed of the substrate support 10. The surface of the brush 41 may be formed with protrusions of different shapes along the length direction, or the outer diameter of the brush 41 may vary along the length direction of the brush 41, thereby achieving uniform cleaning on the entire surface of the substrate W. The overall length of the brush 41 may also vary according to the design.

[0041] The second processing unit 50 may include a sonic nozzle 51 for providing ultrasonic waves to the first surface US or the second surface BS of the substrate W, and a drive unit 55 for causing the sonic nozzle 51 to generate acoustic energy and move the position of the sonic nozzle 51. As shown in the figure, the sonic nozzle 51 may have a cylindrical structure with a unit cross-section that widens downward. Alternatively, the sonic nozzle 51 may be perpendicular to the surface of the substrate support 10 or may be inclined. The sonic nozzle 51 may be provided with at least one piezoelectric element for generating acoustic energy.

[0042] The third processing unit 30 may include a cleaning nozzle 31 for supplying a chemical liquid (e.g., a cleaning liquid) to the first surface US or the second surface BS of the substrate W, a chemical liquid storage unit 35 for supplying the chemical liquid to the cleaning nozzle 31, and a driving unit (not shown) for moving the position of the cleaning nozzle 31. When the cleaning nozzle 31 is a movable nozzle, the cleaning nozzle 31 can wait at a waiting position and then move to a chemical liquid supply position (e.g., in the upper direction of the substrate W) to spray the chemical liquid onto the substrate W. Different from this, the cleaning nozzle 31 may be a fixed nozzle set at a specific position in the chamber 90. The chemical liquid may be pure water (DIW), ozone water (O3DIW), diluted HF (DHF: Diluted HF), SPM (a mixture of H2SO4 and H2O2), DSP (a mixture of H2SO4, HF, and H2O2), etc., but is not limited thereto.

[0043] The turning unit 20 includes a buffer 21 for placing the substrate W, a clamping arm 22 arranged around the edge of the buffer 21 to clamp the side of the substrate W placed on the buffer 21 at multiple positions, and a driving unit 25 for driving the buffer 21 and the clamping arm 22. Figure 2 An exemplary configuration of the reversing portion 20 will be described.

[0044] When the transfer module 99 places the substrate W on the buffer 21, the clamping arm 22 clamps and fixes the side of the substrate W. Next, the flipping section 20 rotates (i.e., the buffer 21 and the clamping arm 22 rotate together with the substrate W) to flip the substrate W. As a result of the flipping, the second side (back side) BS of the substrate W faces upward. The flipping section 20 moves downward to place the flipped substrate W on the substrate support 10. Next, the flipping section 20 moves upward and waits while the processing sections 30, 40, and 50 process the substrate W. When the processing of the substrate W is completed, the flipping section 20 moves downward so that the clamping arm 22 clamps the side of the substrate W. Next, the flipping section 20 moves upward and rotates again (i.e., the buffer 21 and the clamping arm 22 rotate together with the substrate W) to flip the substrate W. As a result of the flipping, the first side (surface) US of the substrate W faces upward. The transfer module 99 takes the substrate W from the buffer 21.

[0045] Furthermore, the substrate support unit 10, the reversing unit 20, and the processing units 30, 40, and 50 are provided in a chamber 90. The chamber 90 is provided with a first opening 91 and a second opening 92 that are different from each other.

[0046] The transfer module 99 can directly transfer the substrate W to the reversing unit 20 through the first opening 91. Furthermore, the first-processed substrate W on the reversing unit 20 can be removed from the chamber 90 through the first opening 91. The first-processed substrate W can be a substrate W whose second side (e.g., backside) has been cleaned or etched. Furthermore, the transfer module 99 can directly transfer the substrate W to the substrate support unit 10 through the second opening 92. Furthermore, the second-processed substrate W on the substrate support unit 10 can be removed from the chamber 90 through the second opening 92. The second-processed substrate W can be a substrate W whose first side (e.g., front side) has been cleaned.

[0047] The first treatment and the second treatment may be cleaning processes. For example, the first treatment may be brush cleaning performed by the first treatment unit 40, and the second treatment may be ultrasonic cleaning performed by the second treatment unit 50, but are not limited thereto.

[0048] Alternatively, the first treatment may be an etching process, and the second treatment may be a cleaning process. For example, when a deposition process is performed on the substrate W, an unnecessary film may be formed not only on the surface but also on the back surface. In this case, the unnecessary film formed on the back surface may be etched away (etching process), and then impurities formed on the back surface may be removed (cleaning process).

[0049] Reference here Figure 2 The flipping section 20 includes a processor 110 that flips the substrate W to clean the back side of the substrate W, sensors 120, 122 that send and receive at least one optical signal in a direction horizontal to the substrate W to sense the placement status of the substrate W placed on the processor 110, a driving section 104 that rotates or moves the processor 110 up and down, and a control section (not shown) that determines whether the placement status of the substrate W is normal or abnormal through the optical signals sensed by the sensors 120, 122.

[0050] As shown in the figure, the processor 110 includes a buffer 108 for placing a substrate W, a clamping arm 112 having clamping blocks 114 and 116 at multiple positions for clamping the substrate W placed on the buffer 108, and a head 106 coupled to one side of the buffer 108 and the clamping arm 112 to drive the clamping arm 112 to clamp the substrate W placed on the buffer 108.

[0051] For example, the drive unit 104 includes guides, guide rails, motors, cylinders, cams, gears, belts, pulleys, and the like, and rotates and moves the head 106, thereby rotating or sliding the handler 110 up and down. The drive unit 104 rotates the head 106 to flip the handler 110, and moves the handler 110 to load or unload a substrate W onto or from the substrate support. Furthermore, the drive unit 104 includes a support frame 102 disposed on a lower base frame (not shown) to secure the flip unit 20 within the chamber.

[0052] The sensors 120 and 122 include a light emitting portion 120 that generates at least one optical signal, and a light receiving portion 122 that receives each optical signal corresponding to the light emitting portion 120, and the light emitting portion 120 and the light receiving portion 122 are disposed on the clamping arm 112 so as to face each other. Therefore, the sensors 120 and 122 transmit and receive optical signals horizontally relative to the substrate W placed on the buffer 108. To this end, the light emitting portion 120 includes at least one light emitting element (not shown) that generates at least one optical signal, and the light receiving portion 122 includes at least one light receiving element (not shown) that receives at least one optical signal. For example, the light emitting portion 120 maintains a certain distance (e.g., approximately less than 1 mm) from the lower surface of the substrate W placed on the buffer 108 (i.e., the front surface of the wafer) to horizontally generate one optical signal. As another example, the light emitting portion 120 maintains a certain distance (e.g., approximately less than 1 mm) from several locations, i.e., the upper and lower surfaces of the substrate W placed on the buffer 108, to horizontally generate multiple optical signals. Therefore, the sensors 120 and 122 can accurately sense whether the substrate W placed on the buffer 108 is in a normal state or an abnormal state by emitting and receiving optical signals at the side of the substrate W.

[0053] With this configuration of the reversing unit 20 , the reversing unit 20 can place the reversed substrate W on the substrate support 10 . That is, since the reversing unit 20 reverses the substrate W and places it on the substrate support 10 , the second surface (back surface) BS of the substrate W faces upward.

[0054] However, after the substrate W is placed on the buffer 21, the turning unit 20 cannot load the substrate W onto the substrate support 10 without turning the substrate W. That is, when the substrate W is placed on the buffer 21 with its first surface (surface) US facing upward, the substrate W cannot be loaded onto the substrate support 10 with its first surface US facing upward. This is because the buffer 21 is located below the substrate W and cannot be moved to be separated from the substrate W.

[0055] Therefore, if one wants to process both the first side US and the second side BS of a substrate W in one transfer module 99, one can use Figures 3 to 11 The substrate processing method is described.

[0056] Figure 3 is a flowchart for illustrating a substrate processing method according to several embodiments of the present invention. Figures 4 to 11 Is used to illustrate Figure 3 View of an intermediate step in a substrate processing method.

[0057] Reference Figure 3 and Figure 4 The substrate W with the first surface US facing upward is introduced into the process module (ie, the chamber 90 ) and placed on the turning part 20 ( S210 ).

[0058] Specifically, the transfer module 99 places the substrate W with the first surface US facing upward on the buffer 21 of the reversing unit 20 through the first opening 91 of the chamber 90. The gripping arms 22 of the reversing unit 20 grip and fix the side surfaces of the substrate W.

[0059] Reference Figure 3 and Figure 5 The substrate W is turned over so that the second surface BS faces upward, and the turned substrate W is placed on the substrate supporting portion 10 ( S220 ).

[0060] Specifically, since the clamping arm 22 holds the substrate W, the buffer 21 and the clamping arm 22 rotate to flip the substrate W (see reference numeral M1). The flipped substrate W faces its first surface US toward the substrate support 10, and its second surface BS faces upward. Next, the flipping unit 20 (i.e., the buffer 21 and / or the clamping arm 22) moves downward (see reference numeral M2) and places the flipped substrate W on the substrate support 10.

[0061] Reference Figure 3 and Figure 6 , a first process is performed on the second surface BS of the substrate W ( S230 ).

[0062] Specifically, the reversed substrate W is placed on the substrate support 10 with the second surface BS of the substrate W facing upward.

[0063] The reversing portion 20 (ie, the buffer 21 and / or the gripping arm 22 ) moves upward (refer to reference symbol M3 ) and waits while the substrate W is processed by the first processing portion 40 .

[0064] The brush 41 of the first processing unit 40 moves onto the second surface BS of the substrate W. The brush 41 contacts the second surface BS of the substrate W with a predetermined pressure and rotates at a predetermined speed, thereby performing the first processing (scrubbing) on ​​the substrate W.

[0065] Reference Figure 3 and Figure 7 , the first-processed substrate W is turned over so that the first surface US faces upward ( S240 ).

[0066] Specifically, when the first process (e.g., scrubbing) of the substrate W is completed, the turning portion 20 (i.e., the buffer 21 and / or the clamping arm 22) moves downward, and the clamping arm 22 clamps the side surface of the substrate W. Next, the turning portion 20 (i.e., the buffer 21 and / or the clamping arm 22) moves upward (see reference numeral M4).

[0067] Next, the reversing unit 20 (ie, the buffer 21 and / or the gripping arm 22 ) rotates together with the substrate W to reverse the substrate W (see reference numeral M5 ). As a result of the reversal, the first surface US of the substrate W on the buffer 21 faces upward.

[0068] Reference Figure 3 and Figure 8 The substrate W with the first surface US facing upward is carried out from the processing module 99 (S250).

[0069] Specifically, the transfer module 99 carries out the substrate W with the first surface US facing upward from the processing module (ie, the chamber 90 ) through the first opening 91 (see reference numeral F2 ).

[0070] Next, the transfer module 99 moves the substrate W to a position corresponding to the second opening 92 (eg, downward direction) (see reference numeral F3 ).

[0071] Reference Figure 3 and Figure 9 The substrate W with the first surface US facing upward is introduced into the processing module 1 again and placed on the substrate support 10 (S260). Specifically, the transfer module 99 places the substrate W with the first surface US facing upward on the substrate support 10 through the second opening 92 of the chamber 90 (see reference numeral F4).

[0072] Reference Figure 3 and Figure 10 , a second process is performed on the first surface US of the substrate W ( S270 ).

[0073] For example, a substrate W is placed on the substrate support 10 with the first surface US of the substrate W facing upward. The sonic nozzle 51 of the second processing unit 50 moves onto the first surface US of the substrate W. The sonic nozzle 51 generates acoustic energy to perform the second processing (ultrasonic cleaning) on ​​the substrate W.

[0074] Reference Figure 3 and Figure 11 , the substrate W that has undergone the second processing is carried out from the processing module 1 ( S280 ).

[0075] Specifically, when the second treatment (eg, ultrasonic cleaning) of the substrate W is completed, the transfer module 99 carries the second-treated substrate W out of the process module 1 (ie, the chamber 90 ) through the second opening 92 (see reference numeral F5 ).

[0076] Figure 12 This is a conceptual diagram for illustrating a substrate processing method according to another embodiment of the present invention. Figures 1 to 11 The contents described are substantially the same.

[0077] Reference Figure 12 , including a plurality of process modules PM1, PM2, PM3, and PM4. Each of the plurality of process modules 1 processes both the front surface and the back surface of the substrate W.

[0078] For example, the transfer module 99 provides the first substrate to the first process module PM1 (see reference numeral ①), the first process module PM1 performs a first process on the second surface (e.g., the back surface) of the first substrate, the transfer module 99 removes the first substrate from the first process module PM1 after the first process (see reference numeral ②), and then provides the first substrate to the first process module PM1 again (see reference numeral ③), the first process module PM1 performs a second process on the first surface (e.g., the front surface) of the first substrate. The transfer module 99 removes the first substrate from the first process module PM1 after the second process (see reference numeral ④).

[0079] As described above, the first process module PM1 may include a chamber having a first opening and a second opening different from each other. The transfer module 99 takes the first processed first substrate out of the first process module PM1 through the first opening, and then provides the first substrate to the first process module PM1 through the second opening.

[0080] The first treatment and the second treatment may both be cleaning processes.

[0081] Alternatively, the first process may be an etching process, and the second process may be a cleaning process.

[0082] Similarly, the transfer module 99 provides a second substrate different from the first substrate to the second processing module PM2, and the second processing module PM2 performs a first process on the second surface (for example, the back surface) of the second substrate. The transfer module 99 takes the second substrate that has undergone the first process out of the second processing module PM2, and then provides the second substrate to the second processing module PM2 again, and the second processing module PM2 performs a second process on the first surface (for example, the surface) of the second substrate.

[0083] Each of the plurality of process modules 1 processes both the front and back surfaces of the substrate W. This processing method (i.e., a method in which one process module 1 processes both the front and back surfaces) is more efficient than a method in which two process modules 1 are configured as a processing pair (i.e., a method in which one process module only processes the back surface and the other process module only processes the surface). Figures 13 to 16 Explain why it is more efficient.

[0084] Figures 13 to 16 1 and 2 are views for explaining effects of substrate processing methods according to some embodiments of the present invention.

[0085] Figure 13 and Figure 15 It shows a situation where a processing module PM1, PM2 processes both the surface and the back, and Figure 14 and Figure 16 A method is shown in which one process module PM11 performs only backside processing and another process module PM12 performs only surface processing.

[0086] First, refer to Figure 13 and Figure 14 , assuming that the time for performing each back surface treatment BS1 to BS6 is t, and the time for performing each surface treatment US1 to US6 is t. That is, the case where the back surface treatment time (for example, BS1) and the surface treatment time (for example, US1) are substantially the same is illustrated. Figure 13 and Figure 14 In FIG. 1 , for ease of comparison, only the time required for substrate processing is shown, without showing the time required for moving the substrate.

[0087] like Figure 13 As shown, the processing module PM1 continuously processes three substrates, that is, it continuously performs back surface treatment BS1 and surface treatment US1 on the first substrate, back surface treatment BS2 and surface treatment US2 on the second substrate, and back surface treatment BS3 and surface treatment US3 on the third substrate.

[0088] The other processing module PM2 also continuously processes the three substrates, that is, continuously performs backside processing BS4 and surface processing US4 on the first substrate, backside processing BS5 and surface processing US5 on the second substrate, and backside processing BS6 and surface processing US6 on the third substrate.

[0089] Therefore, the time required for the two process modules PM1 and PM2 to process a total of six substrates is 6t.

[0090] On the contrary, Figure 14 As shown, it is assumed that the process module PM11 performs only backside processing of the substrate, and the process module PM12 performs only surface processing of the backside processed substrate.

[0091] Processing modules PM11 and PM12 process six substrates in succession. That is, processing module PM11 processes only the back surfaces (BS1, BS2, BS3, BS4, BS5, BS6) of the six substrates. Processing module PM12 processes only the top surfaces (US1, US2, US3, US4, US5, US6) of the six substrates.

[0092] However, the time required for the two process modules PM1 and PM2 to process a total of six substrates is 7t. This is because while the process module PM11 is processing the back side of the first substrate (see BS1), the process module PM12 is waiting because there is no substrate to be processed.

[0093] exist Figure 15 and Figure 16 In FIG, it is assumed that the time for performing each back surface treatment BS1 to BS6 is t, and the time for performing each surface treatment US1 to US6 is 2t. That is, the case where the back surface treatment time (for example, BS1) and the surface treatment time (for example, US1) are different from each other is illustrated. Figure 15 and Figure 16 In FIG. 1 , for ease of comparison, only the time required for substrate processing is shown, without showing the time required for moving the substrate.

[0094] like Figure 15 As shown, the processing module PM1 continuously processes three substrates, that is, it continuously performs back surface treatment BS1 and surface treatment US1 on the first substrate, back surface treatment BS2 and surface treatment US2 on the second substrate, and back surface treatment BS3 and surface treatment US3 on the third substrate.

[0095] The other processing module PM2 also continuously processes the three substrates, that is, continuously performs backside processing BS4 and surface processing US4 on the first substrate, backside processing BS5 and surface processing US5 on the second substrate, and backside processing BS6 and surface processing US6 on the third substrate.

[0096] Therefore, the time required for the two process modules PM1 and PM2 to process a total of six substrates is 9t (=t+2t+t+2t+t+2t).

[0097] On the contrary, Figure 16 As shown, it is assumed that the process module PM11 only performs backside processing of the substrate, and the process module PM12 only performs surface processing of the backside processed substrate.

[0098] Processing modules PM11 and PM12 process six substrates in succession. That is, processing module PM11 processes only the back surfaces (BS1, BS2, BS3, BS4, BS5, BS6) of the six substrates. Processing module PM12 processes only the top surfaces (US1, US2, US3, US4, US5, US6) of the six substrates.

[0099] However, the time required for two process modules (PM11 and PM12) to process a total of six substrates is 13t (=t + 2t + 2t + 2t + 2t + 2t). While process module PM11 is processing the back side of the first substrate (see BS1), process module PM12 is waiting because there are no substrates to process. Furthermore, because the surface processing time 2t is longer than the surface processing time t, process module PM11 is idle and waiting.

[0100] Therefore, the substrate processing method according to some embodiments of the present invention (i.e., a method in which one processing module PM1, PM2 processes both the surface and the back surface) is faster and more efficient than the method in which two processing modules PM11, PM12 are configured as a processing pair (i.e., a method in which one processing module PM11 only performs back surface processing and the other processing module PM12 only performs surface processing).

[0101] Furthermore, in a method in which two processing modules PM11 and PM12 are configured as a processing pair, when an abnormality occurs in one processing module (eg, PM11 ) in the processing pair, the operation of the other processing module PM12 is also interrupted.

[0102] In contrast, in the substrate processing methods according to some embodiments of the present invention, since all process modules PM1 and PM2 operate independently, an abnormality in one process module (eg, PM1 ) does not affect another process module (eg, PM2 ).

[0103] While the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not restrictive.

Claims

1. A substrate processing device comprising: a processing module comprising a substrate supporting portion for supporting a substrate, a turning portion for turning over the substrate, and a processing portion for processing the substrate, wherein the turning portion is disposed in a chamber of the processing module; and a conveying module, conveying the substrate to the processing module, in, The conveying module introduces the substrate with the first surface facing upward into the processing module and places it on the turning part. The turning portion turns over the substrate so that the second surface of the substrate faces upward, and places the turned substrate on the substrate supporting portion. The processing unit performs a first process on the second surface of the substrate placed on the substrate support unit. The turning portion takes the substrate subjected to the first processing from the substrate supporting portion and turns the substrate subjected to the first processing so that the first surface faces upward. The transfer module takes the substrate with the first side facing upward out of the process module, and introduces the substrate with the first side facing upward back into the process module and places it on the substrate support, and The processing portion performs a second process on the first surface of the substrate placed on the substrate support portion.

2. The substrate processing apparatus according to claim 1, wherein: The chamber has a first opening and a second opening different from each other, and the substrate support portion and the processing portion are provided in the chamber.

3. The substrate processing apparatus according to claim 2, wherein: The transfer module takes the first-side-up substrate out of the process module through the first opening, and introduces the first-side-up substrate into the process module through the second opening and places it on the substrate support.

4. The substrate processing apparatus according to claim 1, wherein: The turning portion includes a buffer for seating the substrate and clamping arms arranged around an edge of the buffer to clamp a side surface of the substrate seated on the buffer at a plurality of locations.

5. The substrate processing apparatus according to claim 1, wherein: A first time when the first process is performed is different from a second time when the second process is performed. The substrate processing apparatus according to claim 1 , wherein: The first treatment and the second treatment are cleaning processes.

7. The substrate processing apparatus according to claim 6, wherein: The first treatment is brush cleaning, and the second treatment is ultrasonic cleaning.

8. The substrate processing apparatus according to claim 1, wherein: The first process is an etching process, and the second process is a cleaning process.

9. A substrate processing device comprising: a first processing module; a second processing module; as well as a transfer module for transferring a substrate to the first processing module and the second processing module, wherein the first processing module and the second processing module include a substrate supporting portion for supporting the substrate and a flipping portion for flipping the substrate, wherein the flipping portion is disposed in a chamber of the first processing module; The conveying module provides a first substrate to the first processing module, the flipping unit flips the substrate so that the first surface of the substrate faces upward, and places the flipped substrate on the substrate supporting unit, and the first processing module performs a first process on the first surface of the first substrate. The turning portion takes the substrate subjected to the first processing from the substrate supporting portion and turns the substrate subjected to the first processing so that the second surface faces upward, and The transfer module takes the first substrate having undergone the first process out of the first processing module, and then provides the first substrate to the first processing module again. The first processing module performs a second process on the second surface of the first substrate.

10. The substrate processing apparatus according to claim 9, wherein: The chamber has a first opening and a second opening that are different from each other, and The transfer module takes the first substrate, which has undergone the first process, out of the first processing module through the first opening, and then provides the first substrate to the first processing module again through the second opening.

11. The substrate processing apparatus according to claim 9, wherein: The transfer module provides a second substrate different from the first substrate to the second processing module, and the second processing module performs the first processing on the third surface of the second substrate. The transfer module takes the second substrate that has undergone the first processing out of the second processing module and then provides the second substrate to the second processing module again, and the second processing module performs the second processing on the fourth surface of the second substrate.

12. The substrate processing apparatus according to claim 11, wherein: A first time when the first process is performed is different from a second time when the second process is performed.

13. The substrate processing apparatus according to claim 11, wherein: The first treatment and the second treatment are cleaning processes.

14. The substrate processing apparatus according to claim 11, wherein: The first process is an etching process, and the second process is a cleaning process.

15. A substrate processing method comprising the following steps: A substrate processing apparatus is provided, comprising: a processing module comprising a substrate supporting portion for supporting a substrate, a turning portion for turning over the substrate, and a processing portion for processing the substrate, wherein the turning portion is disposed in a chamber of the processing module; and a conveying module, for conveying the substrate to the processing module; The conveying module introduces the substrate with the first surface facing upward into the processing module and places the substrate on the turning part; The turning portion turns over the substrate so that the second surface of the substrate faces upward, and places the turned substrate on the substrate supporting portion; The processing unit performs a first process on the second surface of the substrate placed on the substrate support unit; The turning portion takes the substrate subjected to the first processing from the substrate supporting portion and turns the substrate subjected to the first processing so that the first surface faces upward; The conveying module takes the substrate with the first side facing upward out of the processing module, and introduces the substrate with the first side facing upward back into the processing module and places it on the substrate support; and The processing portion performs a second process on the first surface of the substrate placed on the substrate support portion.

16. The substrate processing method according to claim 15, wherein: The chamber has a first opening and a second opening different from each other, and the substrate support portion and the processing portion are provided in the chamber, and The transfer module takes the first-side-up substrate out of the process module through the first opening, and introduces the first-side-up substrate into the process module through the second opening and places it on the substrate support.

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