Substrate processing apparatus and method for substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus and a method for a substrate processing apparatus. The substrate processing apparatus includes a processing vessel having a processing space for processing a substrate, a standby port positioned at a side of the processing vessel to allow a nozzle discharging a processing liquid to be standby, and a liquid supply unit moving between the processing vessel and the standby port and having the nozzle. The standby port includes a nozzle receiving member including a nozzle receiving unit having a receiving space formed inside to receive the nozzle and a cleaning liquid, and a discharge portion having a discharge port provided at a side of the nozzle cleaning unit to discharge the cleaning liquid to the nozzle. The discharge port is provided to overlap at least a portion of the nozzle when viewed from above.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0189124, filed on December 31, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Embodiments of the inventive concept described herein relate to a substrate processing apparatus and a method for a substrate processing apparatus. BACKGROUND

[0004] To manufacture a semiconductor device, various processes such as cleaning, deposition, photolithography, etching, and ion implantation processes need to be performed. Among the foregoing processes, the photolithography process includes a coating process of applying a photoresist liquid such as a photoresist / photolithography resist onto a substrate to form a photoresist layer on the substrate, an exposure process of transferring a circuit pattern onto a layer formed on the substrate, and a developing process of selectively removing an exposed area or an opposite area of the exposed area from the substrate.

[0005] In a liquid processing process, nozzles are positioned in a position facing a substrate to supply a processing liquid onto the substrate during the liquid processing process, and are on standby in a standby port before and after the liquid processing process. The standby port includes a common body including a receiving space, and a plurality of nozzles are received in the receiving space of the common body. The plurality of nozzles received in the receiving space discharge a cleaning liquid while on standby toward a discharge end of the nozzles, and the discharge end and a peripheral portion are cleaned together.

[0006] However, even if a region of the nozzles facing the port to discharge the cleaning liquid is cleaned, the opposite side of the region can not be smoothly cleaned.

[0007] In addition, the plurality of nozzles discharge a processing liquid such as a photoresist to the common body while on standby. A large amount of moisture generated during a process of discharging the processing liquid to the common body can contaminate surrounding nozzles.

[0008] In addition, since the plurality of nozzles received in the nozzle receiving space are cleaned at the same time, even nozzles that do not need to be cleaned are cleaned, so the cleaning liquid of the nozzles is used in excess. SUMMARY

[0009] Embodiments of the inventive concept provide a substrate processing apparatus capable of individually or selectively cleaning a plurality of nozzles.

[0010] Embodiments of the inventive concept provide a substrate processing apparatus capable of cleaning an entire surface of a nozzle.

[0011] Embodiments of the inventive concept provide a substrate processing apparatus capable of preventing a nozzle from being contaminated while the nozzle is to be used.

[0012] Embodiments of the inventive concept provide a substrate processing apparatus capable of preventing a cleaning liquid from leaking from a supply pipe, the supply pipe being used to supply a nozzle cleaning liquid into a to-be-used port.

[0013] Embodiments of the inventive concept provide a substrate processing apparatus capable of adjusting a water level of a cleaning liquid received in a to-be-used port and capable of preventing the cleaning liquid from flowing above the to-be-used port.

[0014] Embodiments of the inventive concept provide a substrate processing apparatus capable of preventing a lag of an ejection rate of a cleaning liquid when the cleaning liquid is ejected after cleaning a nozzle.

[0015] Embodiments of the inventive concept provide a method for processing a substrate capable of preventing a photoresist from being cured in a nozzle pipe.

[0016] The objects achieved in the inventive concept are not limited to the above objects, and other objects not mentioned will be understood by those skilled in the art.

[0017] The inventive concept discloses a substrate processing apparatus.

[0018] The substrate processing apparatus includes a process container having a process space for processing a substrate, a to-be-used port positioned at a side of the process container to allow a nozzle ejecting a process liquid to be used, and a liquid supply unit moving between the process container and the to-be-used port and having a nozzle. The to-be-used port includes a nozzle receiving member including a nozzle cleaning unit having a receiving space formed inside the nozzle cleaning unit to receive the nozzle and a cleaning liquid, and an ejection portion having an ejection port provided at a side of the nozzle cleaning unit to eject the cleaning liquid to the nozzle. The ejection port is disposed to overlap at least a portion of the nozzle when viewed from above.

[0019] The cleaning liquid supplied from the ejection port can rotate along an outer surface of the nozzle and a wall of the nozzle receiving unit.

[0020] The cleaning liquid ejected from the ejection port can rotate to a surface of an outer surface of the nozzle, the surface being positioned at an opposite side in an ejection direction of the cleaning liquid.

[0021] A plurality of nozzle cleaning units are disposed, positioned independent of each other, and arranged in one direction when viewed from above.

[0022] The standby port may include an overflow prevention orifice configured to communicate with the plurality of nozzle cleaning units in a direction perpendicular to the configuration direction of the plurality of nozzle cleaning units.

[0023] The standby port may include a pipe fixing member coupled to a nozzle receiving member to fix the cleaning liquid supply pipe to supply the cleaning liquid to the discharge port, and the pipe fixing port may include a pipe insertion hole into which the cleaning liquid supply pipe is inserted and a leak-proof groove structure formed in the pipe insertion hole.

[0024] The discharge port may include a coupling portion projecting from the side surface of the nozzle receiving member, to which a cleaning fluid supply tube is coupled. The coupling portion may include a first portion having a first width, and a second portion extending from the first portion and having a width less than the first width. The diameter of the tube insertion hole may be configured to be smaller than the width of the end of the second portion of the coupling portion.

[0025] The nozzle receiving member may include an anti-movement groove structure disposed in the bottom surface of the nozzle receiving member. The anti-movement groove structure may extend along the circumference of the nozzle cleaning unit and the overflow prevention orifice.

[0026] The nozzle receiving component may include a discharge portion positioned below the nozzle cleaning unit. The discharge portion may include a first port extending downward from the lower end of the nozzle cleaning unit, and a second port extending downward from the first port and having a width that increases in the direction away from the first port. The angle between the first port and the second port may be set to an obtuse angle.

[0027] The length of the first port in the vertical direction can be set to be smaller than the inner diameter of the nozzle's discharge end.

[0028] The treatment liquid may include photoresist, and the cleaning liquid may include thinner.

[0029] This invention discloses a substrate processing apparatus.

[0030] The substrate processing apparatus includes: a processing container having a processing space for processing a substrate; a standby port positioned on one side of the processing container to allow a nozzle for discharging processing liquid; and a liquid supply unit movable between the processing container and the standby port and having a nozzle. The standby port includes: a nozzle receiving member including a nozzle cleaning unit having a receiving space formed inside the nozzle cleaning unit to receive the nozzle and cleaning liquid; and a discharge portion having a discharge port disposed on one side of the nozzle cleaning unit to supply cleaning liquid to the nozzle. The discharge port is configured to overlap at least a portion of the nozzle and, when viewed from above, may be located on one side from the central axis of the nozzle.

[0031] The cleaning liquid supplied from the discharge port can rotate along the outer surface of the nozzle, and the cleaning liquid can rotate to a surface of the outer surface of the nozzle, the aforementioned surface being positioned at an opposite side in the discharge direction of the discharge port of the cleaning liquid.

[0032] The plurality of nozzle cleaning units are disposed, positioned to be independent of each other, and are arranged in one direction when viewed from above.

[0033] The standby port can include an anti-overflow hole disposed to communicate with the plurality of nozzle cleaning units in a direction perpendicular to the arrangement direction of the plurality of nozzle cleaning units, and an anti-movement groove structure provided in a bottom surface of the nozzle receiving member. The anti-movement groove structure can extend along the circumference of the nozzle cleaning unit and the anti-overflow hole.

[0034] The standby port can include a tube fixing member coupled to the nozzle receiving member to fix a cleaning liquid supply tube to supply the cleaning liquid to the discharge port, and the tube fixing port can include a tube insertion hole into which the cleaning liquid supply tube is inserted, and an anti-leakage groove structure formed in the tube insertion hole.

[0035] The process liquid can include a photoresist, and the cleaning liquid can include a thinner.

[0036] The present inventive concept discloses a method for processing a substrate by using a substrate processing apparatus.

[0037] The method for processing a substrate includes: forming a first gas layer at a discharge end of a nozzle as the nozzle sucks back a process liquid filled in the discharge end of the nozzle before moving to a standby port; cleaning the discharge end by inserting the discharge end into a receiving space in a state of forming the first gas layer; forming a liquid layer as the discharge end sucks back a cleaning liquid in a state of the discharge end being immersed in the cleaning liquid; and forming a second gas layer at the discharge end as the nozzle sucks back in a state of the cleaning liquid being discharged from the receiving space. In the cleaning of the discharge end, the cleaning liquid is discharged so that the cleaning liquid rotates to a surface of an outer surface of the nozzle, the aforementioned surface being positioned at an opposite side in the discharge direction of the discharge port.

[0038] In the cleaning of the discharge end, the discharge end is cleaned as the receiving space is filled with the cleaning liquid discharged through the nozzle. In the state of forming the first gas layer, the nozzle is inserted into the receiving space so that the discharge end is immersed in the cleaning liquid filled in the receiving space.

[0039] The process liquid can include a photoresist, and the cleaning liquid can include a thinner. BRIEF DESCRIPTION OF DRAWINGS

[0040] The above and other objects and features will become apparent from the following description, taken in conjunction with the accompanying drawings, wherein like reference numerals refer to similar parts throughout the various drawings, unless otherwise indicated.

[0041] Figure 1 A view schematically illustrating an apparatus for processing a substrate according to an embodiment of inventive concepts.

[0042] Figure 2 A cross-sectional view of a substrate processing apparatus, the aforementioned cross-sectional view illustrating Figure 1 a coating block or a developing block.

[0043] Figure 3 A plan view of a substrate processing apparatus illustrating Figure 1 .

[0044] Figure 4 A view of a handle of a transport unit illustrating Figure 3 .

[0045] Figure 5 A plan view schematically illustrating a thermal processing chamber Figure 3 .

[0046] Figure 6 A front view of a thermal processing chamber illustrating Figure 5 .

[0047] Figure 7 A view schematically illustrating a liquid processing chamber Figure 3 .

[0048] Figure 8 A perspective view of a nozzle illustrating Figure 7 .

[0049] Figure 9 A plan view of a liquid processing chamber illustrating Figure 7 .

[0050] Figure 10 A perspective view of a to-be-used port according to embodiments of inventive concepts.

[0051] Figure 11 An exploded perspective view of a to-be-used port according to embodiments of inventive concepts.

[0052] Figure 12 A cross-sectional view of a nozzle receiving member of Figure 10 , as viewed from one side;

[0053] Figure 13 A cross-sectional view of a nozzle receiving member of Figure 10 , as viewed from the opposite side.

[0054] Figure 14 AFigure 10 bottom view of the nozzle receiving member of

[0055] Figure 15 for illustrating Figure 10 cross-sectional view of the nozzle cleaning unit of the nozzle receiving member of

[0056] Figure 16 for illustrating Figure 10 view of the nozzle receiving member and the tube fixing member coupled to each other of

[0057] Figure 17 view of the procedure for illustratively showing Figure 16 the nozzle receiving member and the tube fixing member coupled to each other of

[0058] Figure 18 view for illustratively showing a process of cleaning a nozzle in a port to be used according to an embodiment of the inventive concept.

[0059] * List of reference signs

[0060] 1: substrate processing apparatus

[0061] 10: container

[0062] 12: first direction

[0063] 14: second direction

[0064] 16: third direction

[0065] 20: indexing module

[0066] 22: load port

[0067] 24: indexing frame

[0068] 30: processing module

[0069] 30a: coating block

[0070] 30b: developing block

[0071] 40: interface module

[0072] 50: external exposure device

[0073] 1000: liquid supply unit

[0074] 1100: nozzle

[0075] 2200: indexing robot

[0076] 2220, 3420: handle

[0077] 2300, 3249, 3300: guide rail

[0078] 3200: thermal treatment chamber

[0079] 3210, 3610: housing

[0080] 3220: cooling unit

[0081] 3222: cooling plate

[0082] 3224: cooling member

[0083] 3230: heating unit

[0084] 3232: heating plate

[0085] 3233: heater

[0086] 3234: lid

[0087] 3236, 3246: driver

[0088] 3238: lift pin

[0089] 3240: transfer plate

[0090] 3242: guide groove

[0091] 3244: notch

[0092] 3400: transfer chamber

[0093] 3422: transfer robot

[0094] 3428: base

[0095] 3429: support protrusion

[0096] 3600, 3602: liquid treatment chamber

[0097] 3604: rear liquid treatment chamber

[0098] 3620: cup portion

[0099] 3640: substrate support unit

[0100] 3670: fan filter unit

[0101] 3800: buffer chamber

[0102] 3802: front buffer

[0103] 3804: rear buffer

[0104] 4100: interface frame

[0105] 4200: additional process chamber

[0106] 4400: interface buffer

[0107] 4600: transfer member

[0108] 4602: first robotic arm

[0109] 4606: second robotic arm

[0110] 5000: standby port

[0111] 5002: cleaning liquid supply tube

[0112] 5200: nozzle receiving member

[0113] 5202: top surface

[0114] 5204: bottom surface

[0115] 5220: nozzle receiving unit

[0116] 5220a: nozzle cleaning unit

[0117] 5220b: discharge unit

[0118] 5221: receiving space

[0119] 5222: upper body portion

[0120] 5223: first inclined portion

[0121] 5224: discharge end receiving portion

[0122] 5225: second inclined portion

[0123] 5226: first port

[0124] 5227: second port

[0125] 5230: stepped portion

[0126] 5240: spill prevention aperture

[0127] 5260: movement prevention trench structure

[0128] 5280: discharge portion

[0129] 5282: discharge port

[0130] 5284: discharge fluid pathway

[0131] 5286: coupling portion

[0132] 5286a: first portion

[0133] 5286b: second portion

[0134] 5400: tube fixing member

[0135] 5420: tube insertion hole

[0136] 5440: leak prevention groove structure

[0137] 5442: first surface

[0138] 5444: second surface

[0139] 5600: discharge member

[0140] L: cleaning liquid

[0141] W: substrate

[0142] P1: point DETAILED DESCRIPTION

[0143] Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings to allow those skilled in the art to easily reproduce the inventive concept. However, the inventive concept can be embodied in various forms, and is not limited to the embodiments described herein. Also, in the following description of the inventive concept, detailed descriptions of well-known technologies or functions will not be considered to avoid unnecessarily obscuring the subject matter of the inventive concept. Also, throughout the drawings, parts performing similar functions and operations will be assigned the same reference numerals.

[0144] When a certain part "includes" a certain component, the certain part does not exclude other components, and can further include other components as long as there is no particular relative description. In more detail, it should be further understood that the term "comprise," "comprising," "include," "including," or "has" specifies the presence of stated features, numbers, steps, operations, components, parts, or combinations thereof, but does not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, and / or combinations thereof.

[0145] The singular form is intended to include the plural forms unless the context clearly indicates otherwise. Also, the shape and size of components in the drawings will be exaggerated for a clearer description.

[0146] The term "and / or" includes any one of the associated components and all combinations of one or more thereof. Also, in this specification, the word "connected" indicates not only a direct connection between members A and B, but also an indirect connection between members A and B through member C interposed therebetween.

[0147] Embodiments of the inventive concept can be modified in various forms, and the scope of the inventive concept should not be construed as being limited to the embodiments of the inventive concept described in the following content. Embodiments of the inventive concept are provided to more completely describe the inventive concept to those skilled in the art. Accordingly, the shape of components in the drawings and the like are exaggerated to emphasize a clear description.

[0148] A controller (not shown) can control the overall operation of the substrate processing apparatus. The controller (not shown) can include a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The CPU performs a desired process such as a liquid process or a dry process according to various recipes stored in a storage area. The recipes have a process time, a process pressure, a process temperature, and various gas flow rates, which are control information of the device for process conditions, which are input to the recipes. At the same time, the recipes indicating a program or a process condition can be memorized in a hard disk or a semiconductor memory. In addition, the recipes can be set at a specific location in the storage area, while being received in a portable computer readable storage medium such as a CD-ROM or a DVD.

[0149] The substrate processing apparatus according to embodiments of the inventive concept can be used to perform a lithography process, forming a circular substrate. In detail, according to embodiments of the inventive concept, the substrate processing apparatus can be used to connect to an exposure device to perform a coating process and a developing process. However, the technical spirit of the inventive concept is not limited thereto, but can be used in various types of processes of supplying a process liquid to a substrate while rotating the substrate. The following description will be made while focusing on a wafer being used as a substrate.

[0150] Hereinafter, embodiments of the inventive concept will be described with reference to Figures 1 to 18 .

[0151] Figure 1 is a perspective view schematically illustrating a substrate processing apparatus according to embodiments of the inventive concept; Figure 2 is a cross-sectional view of a substrate processing apparatus, the Figure 2 illustrated Figure 1 coating block or developing block; and Figure 3 is Figure 1 a plan view of a substrate processing apparatus.

[0152] Reference will now be made to Figures 1 to 3According to embodiments of the inventive concept, the substrate processing apparatus 1 comprises an indexing module 20, a processing module 30 and an interface module 40. According to embodiments, the indexing module 20, the processing module 30 and the interface module 40 are aligned in sequence in unison with each other. In the following, the direction in which the indexing module 20, the processing module 30 and the interface module 40 are configured will be referred to as the first direction 12, the direction perpendicular to the first direction 12 when viewed from above will be referred to as the second direction 14, and the direction perpendicular to all first directions 12 and second directions 14 will be referred to as the third direction 16.

[0153] The indexing module 20 transfers the substrates "W" from the containers 10 receiving the substrates "W" to the processing module 30, and the fully processed substrates "W" are received into the containers 10. The longitudinal direction of the indexing module 20 is disposed on the second direction 14. The indexing module 20 has a load port 22 and an indexing frame 24. The load port 22 is located at the opposite side of the processing module 30 based on the indexing frame 24. The containers 10 with the substrates "W" are placed on the load port 22. Multiple load ports 22 can be disposed and can be configured on the second direction 14.

[0154] The containers 10 can comprise containers 10 for sealing, such as front open unified pods (FOUPs). The containers 10 can be placed on the load port 22 by a transportation unit (not shown), such as an air transfer, an air conveyor or an automated guided vehicle or a worker.

[0155] An indexing robot 2200 is disposed inside the indexing frame 24. Guide rails 2300 having a longitudinal direction disposed on the second direction 14 can be disposed in the indexing frame 24, and the indexing robot 2200 can be disposed movable on the guide rails 2300. The indexing robot 2200 can comprise a hand 2220 that positions the substrates "W", and the hand 2220 can be disposed movable back and forth, rotatable around the third direction 16, and movable in the third direction 16.

[0156] The processing module 30 performs coating and developing processes with respect to the substrates "W". The processing module 30 has coating blocks (COTs) 30a and developing blocks (DEVs) 30b. The coating blocks 30a form coating processes with respect to the substrates "W", and the developing blocks 30b perform developing processes with respect to the substrates "W". Multiple coating blocks 30a are disposed and stacked on each other. Multiple developing blocks 30b are disposed and stacked on each other. According to embodiments, the coating blocks 30a and the developing blocks 30b are aligned in sequence in unison with each other. In the following, the direction in which the coating blocks 30a and the developing blocks 30b are configured will be referred to as the first direction 12, the direction perpendicular to the first direction 12 when viewed from above will be referred to as the second direction 14, and the direction perpendicular to all first directions 12 and second directions 14 will be referred to as the third direction 16. Figure 1In the embodiment, two coating blocks 30a are provided, and two developing blocks 30b are provided. The coating blocks 30a can be disposed below the developing blocks 30b. According to an example, the two coating blocks 30a can be subjected to the same process, and can be disposed in the same structure. In addition, the two developing blocks 30a can be subjected to the same process, and can be disposed in the same structure.

[0157] Referring to Figure 3 , the coating block 30a has a heat treatment chamber 3200, a transfer chamber 3400, a liquid treatment chamber 3600, and a buffer chamber 3800. The heat treatment chamber 3200 performs a heat treatment process with respect to the substrate "W". The heat treatment process can include a cooling process and a heating process. The liquid treatment chamber 3600 supplies a liquid onto the substrate "W" to form a liquid film. The liquid film can be a photoresist film or an anti-reflective film. The transfer chamber 3400 transfers the substrate "W" between the heat treatment chamber 3200 and the liquid treatment chamber 3600 inside the coating block 30a.

[0158] The transfer chamber 3400 has a longitudinal direction parallel to the first direction 12. A transfer robot 3422 is disposed in the transfer chamber 3400. The transfer robot 3422 transfers the substrate "W" between the heat treatment chamber 3200, the liquid treatment chamber 3600, and the buffer chamber 3800. According to an example, the transfer robot 3422 can include a hand 3420 in which the substrate "W" is positioned, and the hand 3420 can be disposed to be movable forward and backward, rotatable about the third direction 16, and movable in the third direction 16. A guide rail 3300 having a longitudinal direction parallel to the second direction 14 is disposed in the transfer chamber 3400, and the transfer robot 3422 can be disposed to be movable on the guide rail 3300.

[0159] Figure 4 is a view of a hand of a transfer unit. Figure 3

[0160] Referring to Figure 4 , the hand 3420 has a base 3428 and support protrusions 3429. The base 3428 can have a ring hole shape in which a portion of a circumference is curved. The base 3428 has an inner diameter that is greater than a diameter of the substrate "W". The support protrusions 3429 extend inwardly from the base 3428. A plurality of support protrusions 3429 are disposed to support an edge region of the substrate "W". According to an example, four support protrusions 3429 can be disposed at equal distances.

[0161] A plurality of heat treatment chambers 3200 are disposed. The heat treatment chambers 3200 are arranged in the first direction 12. The heat treatment chambers 3200 are positioned at one side of the transfer chamber 3400.

[0162] Figure 5 is a view schematically illustrating​Figure 3 a plan view of a thermal processing chamber of Figure 6 a front view of a thermal processing chamber of Figure 5 a plan view of a thermal processing chamber of

[0163] Referring to Figure 5 and Figure 6 The thermal processing chamber 3200 has a housing 3210, a cooling unit 3220, a heating unit 3230, and a transfer plate 3240.

[0164] The housing 3210 generally has a rectangular cuboid shape. The housing 3210 is formed with a sidewall having an inlet (not shown) for introducing or withdrawing the substrate "W". The inlet can be maintained in an open state. A door (not shown) can be provided to selectively open or close the inlet. The cooling unit 3220, the heating unit 3230, and the transfer plate 3240 are disposed in the housing 3210. The cooling unit 3220 and the heating unit 3230 are disposed side by side along the second direction 14. According to an embodiment, the cooling unit 3220 can be positioned closer to the transfer chamber 3400 than the heating unit 3230.

[0165] The cooling unit 3220 has a cooling plate 3222. The cooling plate 3222 can have a generally circular shape when viewed from above. The cooling plate 3222 has a cooling member 3224. According to an embodiment, the cooling member 3224 can be formed inside the cooling plate 3222 to function as a fluid passage through which a cooling fluid flows.

[0166] The heating unit 3230 has a heating plate 3232, a cover 3234, and a heater 3233. The heating plate 3232 can have a generally circular shape when viewed from above. The heating plate 3232 can have a diameter greater than that of the substrate "W". The heater 3233 is disposed in the heating plate 3232. The heater 3233 can be provided in the form of a heating resistor to which an electric current is applied. Lift pins 3238 are disposed on the heating plate 3232 to be vertically driven along the third direction 16. The lift pins 3238 receive the substrate "W" from the transfer unit outside the heating unit 3230 to place the substrate "W" on the heating plate 3232 or lift the substrate "W" from the heating plate 3232 to provide the substrate "W" to the transfer unit outside the heating unit 3230. According to an embodiment, three lift pins 3238 can be provided. The cover 3234 has an inner space having an open lower portion. The cover 3234 is positioned at an upper portion of the heating plate 3232 and is moved in a vertical direction by a driver 3236. When the cover 3234 is in contact with the heating plate 3232, a space enclosed by the cover 3234 and the heating plate 3232 is provided as a heating space for heating the substrate "W".

[0167] The transfer plate 3240 is provided in a shape of a substantially circular plate, and has a diameter corresponding to that of the substrate "W". A notch 3244 is formed in the edge of the transfer plate 3240. The notch 3244 can have a shape corresponding to the number of the protrusions 3429 formed on the handle 3420 of the transfer robot 3422. In addition, the notch 3244 can be provided in a number corresponding to the number of the protrusions 3429 formed in the handle 3420, and can be formed at positions corresponding to the protrusions 3429. When the vertical positions of the handle 3420 and the transfer plate 3240 are changed in a state that the handle 3420 and the transfer plate 3240 are aligned in the vertical direction, the substrate "W" is transferred between the handle 3420 and the transfer plate 3240. The transfer plate 3240 can be mounted on a guide rail 3249, and can be moved along the guide rail 3249 by a driver 3246. A plurality of guide grooves 3242 are provided in the transfer plate 3240 in a shape of a slit. The guide grooves 3242 extend from the end portion of the transfer plate 3240 to the inner portion of the transfer plate 3240. The longitudinal direction of the guide grooves 3242 is provided in the second direction 14, and the guide grooves 3242 are positioned to be spaced apart from each other in the first direction 12. The guide grooves 3242 prevent interference between the transfer plate 3240 and the lift pins 3238 when the substrate "W" is transferred between the transfer plate 3240 and the heating unit 3230.

[0168] The heating of the substrate "W" is achieved when the substrate "W" is directly placed on the heating plate 3232, and the cooling of the substrate "W" is achieved in a state that the transfer plate 3240 with the substrate "W" is in contact with the cooling plate 3222. The transfer plate 3240 is formed of a material having a higher heat transfer coefficient, so that heat is smoothly transferred between the cooling plate 3222 and the substrate "W". According to an embodiment, the transfer plate 3240 can be formed of a metal material.

[0169] The heating unit 3230 provided in some of the thermal processing chambers 3200 can improve the attachment rate of the photoresist to the substrate "W" during heating of the substrate "W" by feeding a gas. According to an example, the gas can include hexamethyldisilane gas.

[0170] A plurality of liquid processing chambers 3600 are provided. Some of the liquid processing chambers 3600 can be provided to be stacked with each other. The liquid processing chambers 3600 are positioned at one side of the transfer chamber 3400. The liquid processing chambers 3600 are aligned with each other in the first direction 12. Some of the liquid processing chambers 3600 are provided in positions close to the indexing module 20. Hereinafter, these liquid processing chambers 3602 are referred to as front liquid processing chambers. Other of the liquid processing chambers 3600 are provided in positions close to the interface module 40. Hereinafter, these liquid processing chambers are referred to as rear liquid processing chambers 3604.

[0171] A first liquid is applied to the substrate "W" in the front liquid treatment chamber 3602, and a second liquid is applied to the substrate "W" in the rear liquid treatment chamber 3604. The first liquid can be different from the second liquid. According to an embodiment, the first liquid is an anti-reflective liquid, and the second liquid is a photoresist. The photoresist can be applied to the substrate "W" with an anti-reflective film. Alternatively, the first liquid can be a photoresist, and the second liquid can be an anti-reflective liquid. In this case, the anti-reflective liquid can be coated on the substrate "W" which is coated with the photoresist. Alternatively, the first liquid and the second liquid can be the same type of liquid, and all the first liquid and the second liquid can be a photoresist.

[0172] Looking back Figure 2 and Figure 3 A plurality of buffer chambers 3800 are provided. Some of the buffer chambers 3800 are interposed between the indexing module 20 and the transfer chamber 3400. Hereinafter, the buffer chambers are referred to as front buffers 3802. A plurality of front buffers 3802 are arranged and stacked on each other in the vertical direction. Other buffer chambers of the buffer chambers 3800 are interposed between the transfer chamber 3400 and the interface module 40. The buffer chambers are referred to as rear buffers 3804. A plurality of front buffers 3802 are arranged and stacked on each other in the vertical direction. The front buffers 3802 and the rear buffers 3804 temporarily store a plurality of substrates "W". The substrates "W" stored in the front buffers 3802 are introduced and withdrawn by the indexing robot 2200, the transfer robot 3422, and the first robot 4602. The substrates "W" stored in the rear buffers 3804 are introduced and withdrawn by the transfer robot 3422.

[0173] The developing block 30b has the heat treatment chamber 3200, the transfer chamber 3400, and the liquid treatment chamber 3600. The heat treatment chamber 3200 and the transfer chamber 3400 in the developing block 30b have structures and configurations substantially similar to those of the heat treatment chamber 3200 and the transfer chamber 3400 in the coating block 30a, and thus the details thereof will be omitted.

[0174] All of the liquid treatment chambers 3600 in the developing block 30b supply the same developing liquid, so that the structure "W" is subjected to a developing process.

[0175] The interface module 40 connects the processing module 30 with the external exposure device 50. The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a transfer member 4600.

[0176] A fan filter unit can be provided on the upper end of the interface frame 4100 to form a downwardly inclined gas flow in the interface frame 4100. Additional process chambers 4200, interface buffers 4400, and transfer members 4600 are provided inside the interface frame 4100. A substrate "W" subjected to a process in the coating block 30a can be subjected to a certain additional process in the additional process chamber 4200 before being introduced into the exposure device 50. Alternatively, a substrate "W" subjected to a process in the exposure device 50 can be subjected to a predetermined additional process in the additional process chamber 4200 before being introduced into the developing block 30b. According to an embodiment, the additional process can be an edge exposure device to expose an edge region of the substrate "W", a top surface cleaning process to clean a top surface of the substrate "W", or a bottom surface cleaning process to clean a bottom surface of the substrate "W". A plurality of additional process chambers 4200 can be provided and can be provided to be stacked with each other. All of the additional process chambers 4200 can be provided to perform the same process. Alternatively, some of the additional process chambers 4200 can be provided to perform mutually different processes.

[0177] The interface buffer 4400 provides a space to temporarily reside a substrate "W" before being transferred between the interface buffer 4400, the coating block 30a, the additional process chamber 4200, the exposure device 50, and the developing block 30b. A plurality of interface buffers 4400 are provided and can be provided to be stacked with each other.

[0178] According to an embodiment, when viewed based on a line extending in the longitudinal direction of the transfer chamber 3400, the additional process chamber 4200 can be disposed at one side, and the interface buffer 4400 can be disposed at the opposite side.

[0179] The transfer member 4600 transfers a substrate "W" between the coating block 30a, the additional process chamber 4200, the exposure device 50, and the developing block 30b. The transfer member 4600 can have one robot arm or a plurality of robot arms. According to an embodiment, the transfer member 4600 has a first robot arm 4602 and a second robot arm 4606. The first robot arm 4602 can be provided to transfer a substrate "W" between the coating block 30a, the additional process chamber 4200, and the interface buffer 4400, and the second robot arm 4606 can be provided to transfer a substrate "W" between the interface buffer 4400 and the exposure device 50 or between the interface buffer 4400 and the developing block 30b.

[0180] The first robot arm 4602 and the second robot arm 4606 can include a hand on which a substrate "W" is placed, and the hand can be provided to be movable back and forth, rotatable about an axis parallel to the third direction 16, and movable in the third direction 16.

[0181] The handles of the indexing robot 2200, the first robot 4602, and the second robot 4606 can all have the same shape as the handle 3420 of the transfer robot 3422. Alternatively, the handles of the robots used to directly transfer and receive the substrate "W" with the transfer plate 3240 of the thermal processing chamber are provided in the same shape as the shape of the handle 3420 of the transfer robot 3422, and the handles of the remaining robots can be provided in a shape different from the aforementioned shape.

[0182] According to an embodiment, the indexing robot 2200 can be provided to directly transfer and receive the substrate "W" with the heating unit 3230 of the front thermal processing chamber 3200 provided in the coating block 30a.

[0183] Further, the transfer robot 3342 provided in the coating block 30a and the developing block 30b can be provided to directly exchange the substrate "W" with the transfer plate 3240 positioned in the thermal processing chamber 3200.

[0184] The following description will be made in detail with respect to the structure of a substrate processing apparatus according to the inventive concept, which processes a substrate by supplying a processing liquid to a substrate rotating in a process chamber. By way of example, the following description will be made with respect to a substrate processing apparatus being a device for coating a photoresist. However, the substrate processing apparatus can be a device for forming a film such as a protective film or an anti-reflective film while the substrate "W" is rotating. Alternatively, the substrate processing apparatus can be a device for supplying a processing liquid such as a developing liquid to the substrate "W".

[0185] Figure 7 A view of a liquid processing chamber is schematically illustrated in Figure 3 . A perspective view of a nozzle is illustrated in Figure 8 . A plan view of a liquid processing chamber is illustrated in Figure 7 . A plan view of a liquid processing chamber is illustrated in Figure 9 . A plan view of a liquid processing chamber is illustrated in Figure 7 .

[0186] Referring to Figure 7The liquid processing chamber 3600 has a housing 3610, a cup portion 3620, a substrate support unit 3640, a liquid supply unit 1000, and a standby port 5000. The housing 3610 has a substantially rectangular cuboid shape. The housing 3610 is formed with a sidewall having an inlet (not shown) for introducing or extracting a substrate "W". The inlet can be opened by a door (not shown). The cup portion 3620, the substrate support unit 3640, the liquid supply unit 1000, and the standby port 5000 are provided in the housing 3610. A fan filter unit 3670 can be provided on a top wall of the housing 3610 to form a downward airflow inside the housing 3610. The cup portion 3620 has a processing space having an open upper portion. The substrate support unit 3640 is provided in the processing space to support a substrate "W". The substrate support unit 3640 is provided so that the substrate "W" is rotatable during liquid processing. The liquid supply unit 1000 supplies a liquid to the substrate "W" supported by the substrate support unit 3640.

[0187] The liquid supply unit 1000 includes a plurality of nozzles 1100. Each of the plurality of nozzles 1100 supplies a different type of processing liquid. A mutually independent liquid supply tube is connected to the nozzles 1100. The nozzles 1100 move between a standby position and a process position to supply the processing liquid. The process position is a position in which the nozzles 1100 can discharge the processing liquid to the center of the substrate "W", and the standby position is a position in which the nozzles 1100 stand by in the standby port 5000. For example, the processing liquid can be a photosensitive liquid such as a photoresist.

[0188] The standby port 5000 provides a space for the nozzles 1100 to stand by at one side of the processing vessel. The nozzles 1100 stand by at the standby port 5000 before and after performing a liquid processing process. The standby port 5000 cleans the nozzles 1100 and prevents the processing liquid remaining in the discharge end of the nozzles 1100 from hardening while the nozzles 1100 are standing by.

[0189] Figure 10 A perspective view of a standby port according to an embodiment of the inventive concept, Figure 11 An exploded perspective view of a standby port according to an embodiment of the inventive concept, Figure 12 A cross-sectional view of a nozzle receiving member of Figure 10 A cross-sectional view of a nozzle receiving member of Figure 13 A cross-sectional view of a nozzle receiving member of Figure 10 A cross-sectional view of a nozzle receiving member of Figure 14 A bottom view of a nozzle receiving member of Figure 10 A bottom view of a nozzle receiving member of Figure 15 A cross-sectional view of a nozzle cleaning unit of a nozzle receiving member of Figure 10 A cross-sectional view of a nozzle cleaning unit of a nozzle receiving member of

[0190] Referring to Figure 7 and Figure 9 , a standby port 5000 is disposed in the housing 3610. The standby port 5000 is disposed outside the cup portion 3620 in the housing 3610. The standby port 5000 is provided at a position corresponding to the standby position of the nozzle 1100. The standby port 5000 can be positioned in a movement path via which the nozzle 1100 is moved between the process position and the standby position.

[0191] Referring to Figure 10 and Figure 11 , the standby port 5000 includes a nozzle receiving member 5200 and a tube fixing member 5400. In addition, the standby port 5000 can further include a drain member 5600. The nozzle receiving member 5200 receives the nozzle 1100 for standby. The nozzle receiving member 5200 cleans the nozzle 1100 that is being standby and prevents the process liquid remaining in the discharge end of the nozzle 1100 from solidifying.

[0192] Referring to Figure 12 and Figure 13 , the nozzle receiving member 5200 includes a nozzle receiving unit 5220, an anti-overflow hole 5240, and an anti-movement groove structure 5260.

[0193] The nozzle receiving unit 5220 is provided to receive the nozzle 1100. A plurality of nozzle receiving units 5220 is provided. For example, the nozzle receiving units 5220 can be provided in a one-to-one correspondence with the number of nozzles 1100. The nozzle receiving units 5220 are positioned independently of each other. Thus, it is possible to prevent particles generated from any one nozzle 1100 from affecting another nozzle 1100 or the entire nozzles 1100. When viewed from above, the nozzle receiving units 5220 can be positioned to be aligned with each other in one direction. For example, a plurality of nozzle receiving units 5220 can be aligned with each other along the longer side of the nozzle cleaning member 5200.

[0194] Referring to Figure 15A receiving space 5221 to receive the nozzle 1100 or the cleaning liquid "L" is formed inside the nozzle receiving unit 5220. The nozzle receiving unit 5220 has a shape of a cylinder facing the vertical direction. The nozzle receiving unit 5220 has a shape in which the width of the nozzle receiving unit 5220 narrows downward and widens again. The nozzle receiving unit 5220 has a nozzle cleaning unit 5220a and a discharge unit 5220b. The nozzle cleaning unit 5220a receives the nozzle 1100. The nozzle cleaning unit 5220a provides a space for cleaning the received nozzle 1100. In a state in which the cleaning liquid "L" fills the receiving space of the nozzle cleaning unit 5220a to a certain water level, or in a state in which the tip of the nozzle 1100 moves down into the receiving space (5221) and the cleaning liquid "L" fills to a certain water level, the tip of the nozzle 1100 is dipped into the cleaning liquid "L" to be cleaned.

[0195] A plurality of nozzle cleaning units 5220a are respectively provided in the plurality of nozzle receiving units 5220. The plurality of nozzle cleaning units 5220a are provided in a number corresponding one-to-one to the number of the plurality of nozzles 1100. The cleaning liquid "L" is filled in the nozzle cleaning unit 5220a corresponding to the nozzle 1100 to be cleaned, and the nozzle cleaning process is individually and selectively performed with respect to the individual nozzle 1100.

[0196] The nozzle cleaning unit 5220a includes an upper body portion 5222, a first inclined portion 5223, a discharge end receiving portion 5224, and a second inclined portion 5225. The upper body portion 5222, the first inclined portion 5223, the discharge end receiving portion 5224, and the second inclined portion 5225 are disposed to sequentially extend downward. The upper body portion 5222 is disposed as an upper region of the nozzle cleaning unit 5220a. The upper body portion 5222 is disposed to have a uniform width in the vertical direction. The upper body portion 5222 and a lower body portion 5228 to be described are disposed to have a width greater than the width of another portion.

[0197] A discharge port 5282 is formed on the inner surface of the upper body portion 5222. The discharge port 5282 functions as a hole to discharge the cleaning liquid "L" to the upper body portion 5222. A cleaning liquid supply tube 5002 is connected to the discharge port 5282, and the cleaning liquid supply tube 5002 supplies the cleaning liquid from a storage tank (not shown) to the discharge port 5282. For example, the cleaning liquid can be provided as a liquid for removing the processing liquid and an external substance attached to the discharge end and the peripheral portion of the nozzle 1100. The cleaning liquid can be a liquid including bubbles. The cleaning liquid can include a diluent. The discharge port 5282 is positioned to overlap the tip of the nozzle 1100 when viewed from above.

[0198] The first inclined portion 5223 has a shape of a cylinder extending downward from a lower end of the upper body portion 5222. The first inclined portion 5223 is provided to have a width gradually decreasing downward. The first inclined portion 5223 mainly guides the remaining liquid in the receiving space 5221 to flow downward.

[0199] The discharge-end receiving portion 5224 has a shape of a cylinder extending downward from a lower end of the first inclined portion 5223. The discharge-end receiving portion 5224 is provided to have a uniform width in the vertical direction. The discharge-end receiving portion 5224, which is a space for positioning the discharge end of the nozzle 1100, is provided to have a width greater than the width of the nozzle 1100.

[0200] The second inclined portion 5225 extends downward from a lower end of the discharge-end receiving portion 5224. The second inclined portion 5225 is provided to have a shape of a cylinder having a width gradually narrowing downward. The first inclined portion 5223 and the second inclined portion 5225 can be provided to have an inclination angle ranging from 30 degrees to 60 degrees from the ground, respectively.

[0201] The discharge unit 5220b is disposed below the nozzle cleaning unit 5220a. The discharge unit 5220b communicates with the nozzle cleaning unit 5220a. The discharge unit 5220b discharges the cleaning liquid downward after cleaning the nozzle in the nozzle cleaning unit 5220a. The discharge unit 5220b includes a first port 5226 and a second port 5227. The discharge unit 5220b can further include a lower body portion 5228. The first port 5226, the second port 5227, and the lower body portion 5228 extend downward in order.

[0202] The first port 5226 has a shape of a cylinder extending downward from a lower end of the second inclined portion 5225. The first port 5226 is provided to have a width smaller than the width of another portion. For example, the width of the first port 5226 can be provided to be greater than the inner diameter of the discharge end of the nozzle 1100. Also, the first port 5226 is provided to have a length smaller than the length of another portion in the vertical direction. For example, the length of the first port 5226 in the vertical direction can be provided to be smaller than the inner diameter of the discharge end of the nozzle 1100. The length of the first port 5226 can prevent the backflow of air bubbles through the first port 5226 and flowing upward.

[0203] The second port 5227 has a shape of a cylinder extending downward from the lower end of the first port 5226. The second port 5227 has a shape of a cylinder having a width that widens downward. The second port 5227 is formed to be inclined with respect to the extending direction of the first port 5226. In this case, the angle Θ between the first port 5226 and the second port 5227 can have a range greater than 90° and less than 180°. Thus, the air bubbles passing through the first port 5226 are broken, or become larger, to prevent backflow.

[0204] The lower body portion 5228 has a shape of a cylinder extending downward from the lower end of the second port 5227. The lower body portion 5228 is provided to have a uniform width in the vertical direction. For example, the lower body portion 5228 can have the same width as the width of the upper body portion 5222. A discharge line (not shown) is connected to the lower body portion 5228. The discharge line discharges the cleaning liquid delivered to the lower body portion 5228 to the outside. A valve is installed to the discharge line to open or close the discharge line.

[0205] A controller (not shown) controls the valve installed to the discharge line. The controller controls the valve to close the discharge line in the middle of discharging the cleaning liquid "L" so that the cleaning liquid "L" is filled in the receiving space 5221. Thus, the discharge end of the nozzle 1100 is dipped into the cleaning liquid "L" filled in the receiving space 5221 so that the discharge end is cleaned.

[0206] Referring to Figures 12 to 14 , the nozzle receiving member 5200 includes overflow prevention holes 5240. The overflow prevention holes 5240 are formed as the top surface 5202 of the nozzle receiving member 5200 is recessed. The overflow prevention holes 5240 have a cross-sectional area smaller than or similar to that of the nozzle receiving units 5220. The overflow prevention holes 5240 communicate with the nozzle cleaning units 5220a. A plurality of overflow prevention holes 5240 is provided. The plurality of overflow prevention holes 5240 is provided in a number corresponding one-to-one to the number of the plurality of nozzle receiving units 5220. The overflow prevention holes 5240 communicate with the plurality of nozzle cleaning units 5220a in a direction perpendicular to the arrangement direction of the plurality of nozzle cleaning units 5220a. The overflow prevention holes 5240 prevent the cleaning liquid and the photoresist filled in the receiving space 5221 from overflowing from the top of the receiving space 5221. In addition, the overflow prevention holes 5240 adjust the water level of the cleaning liquid "L" filled in the nozzle cleaning units 5220a. Thus, the overflow prevention holes 5240 are formed to have a length corresponding to the longitudinal direction of the nozzle cleaning units 5220a. The overflow prevention holes 5240 are provided at opposite sides of the discharge port 5282.

[0207] Referring to Figure 12A stepped portion 5230 is inserted between the anti-overflow hole 5240 and the nozzle receiving unit 5220. The stepped portion 5230 forms a passage for allowing the anti-overflow hole 5240 and the nozzle receiving unit 5220 to communicate with each other. The stepped portion 5230 forms a communication path between the upper body portion 5222 of the nozzle receiving unit 5220 and the anti-overflow hole 5240. When viewed from above, the stepped portion 5230 is disposed to protrude inward from the upper body portion 5222 and the anti-overflow hole 5240. The stepped portion 5230 is disposed to protrude upward from the portions connecting to each other of the upper body portion 5222 and the first inclined portion 5223. Thus, the cleaning liquid "L" discharged from the discharge port 5282 can be induced to be filled first in the nozzle cleaning unit 5220a.

[0208] The anti-movement groove structure 5260 is recessed upward from the bottom surface 5204 of the nozzle receiving member 5200. The anti-movement groove structure 5260 is formed to extend along the outer periphery of the nozzle receiving unit 5220 and the anti-overflow hole 5240. More specifically, the anti-movement groove structure 5260 extends along the lower body portion 5228 of the discharge unit 5220b and the periphery of the anti-overflow hole 5240. When the cleaning liquid "L" is discharged, the anti-movement groove structure 5260 prevents the cleaning liquid "L" from moving left and right, thereby preventing the discharge rate from lagging.

[0209] Figure 16 To illustrate Figure 10 the nozzle receiving member and the tube fixing member coupled to each other. Figure 17 To schematically illustrate Figure 16 the procedure in which the nozzle receiving member and the tube fixing member are coupled to each other.

[0210] Referring to Figure 16 , the nozzle receiving member 5200 includes a discharge portion 5280. The discharge portion 5280 is provided in the side surface of the nozzle receiving member 5200. The discharge portion 5280 protrudes from the side surface of the nozzle receiving member 5200. The cleaning liquid supply tube 5002 is coupled to the discharge portion 5280. The cleaning liquid flowing through the cleaning liquid supply tube 5002 is discharged to the receiving space 5221 through the discharge portion 5280.

[0211] The discharge portion 5280 includes a coupling portion 5286 into which the cleaning liquid supply tube 5002 is inserted and coupled to the tube fixing member 5400. The coupling portion 5286 protrudes from a side surface of the nozzle receiving member 5200. The coupling portion 5286 includes a first portion 5286a having a first width, and a second portion 5286b extending from the first portion 5286a and having a width smaller than the first width. The width of the second portion 5286b of the coupling portion 5286 decreases in a direction away from the first portion. A discharge fluid passage 5284 through which the cleaning liquid "L" discharged from the cleaning liquid supply tube 5002 flows is formed inside the coupling portion 5286. A discharge port 5282 is positioned in a distal end of the discharge fluid passage 5284. The discharge port 5282 is provided in a side surface of the nozzle cleaning unit 5220a. The discharge port 5282 is provided on an inner surface of the upper body portion 5222. The width of the discharge port 5282 is provided to overlap a portion of a distal end of the nozzle 1100 received in the nozzle receiving unit 5220. Accordingly, the cleaning liquid "L" discharged from the discharge port 5282 is rotated along an outer circumferential surface of the nozzle 1100 to move to a surface of the outer circumferential surface of the nozzle 1100 opposite to a discharge direction of the cleaning liquid "L". In this state, the entire surface of the nozzle 1100 can be uniformly cleaned.

[0212] Referring to Figure 16 and Figure 17 The tube fixing member 5400 is coupled to the nozzle receiving member 5200. The tube fixing member 5400 is coupled to one side of the nozzle receiving member 5200. The tube fixing member 5400 fixes the cleaning liquid supply tube 5002 to supply the cleaning liquid "L" to the nozzle receiving member 5200. The tube fixing member 5400 includes a tube insertion hole 5420 and a leak prevention groove structure 5440.

[0213] The tube insertion hole 5420 is formed through both side surfaces of the tube fixing member 5400. The cleaning liquid supply tube 5002 is inserted into the tube insertion hole 5420. The diameter of the tube insertion hole 5420 is equal to or slightly greater than the outer diameter of the cleaning liquid supply tube 5002. The diameter of the tube insertion hole 5420 is provided to be smaller than the diameter of the distal end of the second portion 5286b of the coupling portion 5286. The diameter of the tube insertion hole 5420 is provided to be smaller than the minimum width of the second portion 5286b of the coupling portion 5286. Accordingly, when the nozzle receiving member 5200 and the tube fixing member 5400 are completely coupled to each other, the distal end of the coupling portion 5286 is pressed into the tube insertion hole 5420 to prevent the cleaning liquid "L" from leaking.

[0214] A leak prevention groove structure 5440 is formed in the inner surface of the pipe insertion hole 5420. The leak prevention groove structure 5440 is formed in the portion of the inner surface of the pipe insertion hole 5420 to which the coupling portion 5286 is coupled. The leak prevention groove structure 5440 is provided to have a diameter larger than that of the pipe insertion hole 5420. The leak prevention groove structure 5440 can be provided to have a diameter smaller than or slightly larger than that of the first portion 5286a of the coupling portion 5286. The leak prevention groove structure 5440 can be provided to have a diameter larger than the maximum diameter of the second portion 5286b of the coupling portion 5286.

[0215] The leak prevention groove structure 5440 includes a first surface 5442 positioned outside the inner surface of the pipe insertion hole 5420, and a second surface 5444 for linking the inner surface of the pipe insertion hole 5420 to the first surface 5442. The first surface 5442 is provided to be parallel to the inner surface of the pipe insertion hole 5420, and the second surface 5444 is provided to be perpendicular to the inner surface of the pipe insertion hole 5420. When the nozzle receiving member 5200 and the pipe fixing member 5400 are coupled to each other, the point P1 at which the inner surface of the pipe insertion hole 5420 and the second surface 5444 are linked to each other is in contact with the coupling portion 5286, and is pressurized, thereby preventing the cleaning liquid "L" from leaking. When the nozzle receiving member 5200 and the pipe fixing member 5400 are coupled to each other, the point P1 at which the inner surface of the pipe insertion hole 5420 and the second surface 5444 are linked to each other is in contact with the cleaning liquid supply pipe 5002, thereby preventing the cleaning liquid "L" from leaking.

[0216] Figure 18 A view schematically illustrating a process of cleaning a nozzle in a port to be used according to an embodiment of the inventive concept.

[0217] Referring to Figure 18 The discharge port 5282 is positioned eccentrically from the center of the nozzle 1100. When viewed from above, the discharge port 5282 is provided to partially overlap the nozzle 1100. In this case, the cleaning liquid "L" discharged from the discharge port 5282 can flow along the outer circumferential surface of the nozzle 1100 to clean the entire surface of the nozzle 1100.

[0218] Hereinafter, a method for processing a substrate by using the above-described substrate processing apparatus 1 will be described.

[0219] Hereinafter, a method for processing a substrate by using the above-described substrate processing apparatus 1 will be described. The method for processing a substrate includes processing a liquid and cleaning the nozzle 1100. In the liquid processing, the nozzle 1100 is positioned to a process position to supply a processing liquid on the substrate. When the processing liquid is completely supplied, the nozzle 1100 stops supplying the processing liquid, and cleaning of the nozzle 1100 is performed.

[0220] The cleaning of the nozzle 1100 includes forming a first gas layer, cleaning the discharge end of the nozzle, forming a liquid layer, and forming a second gas layer. In forming the first gas layer, the process liquid positioned at the discharge end of the nozzle 1100 is sucked back before the nozzle 1100 is moved from the process position to the standby position, to move in a direction opposite to the discharge direction of the process liquid. When the tip of the process liquid is positioned higher than the discharge end of the nozzle 1100, the nozzle 1100 is moved to the standby position.

[0221] In the step of cleaning the discharge end, the discharge end of the nozzle 1100 is positioned to be inserted into the receiving space 5221, so that the discharge end of the nozzle 1100 is immersed in the cleaning liquid "L" filled in the receiving space 5221. In this state, the discharge line is maintained to be closed to prevent the water level of the cleaning liquid "L" from changing. The discharge end of the nozzle 1100 is cleaned by the cleaning liquid "L". Since the first gas layer is formed between the discharge end of the nozzle 1100 and the tip of the process liquid, the cleaning liquid "L" is prevented from being introduced into the nozzle 1100. When the discharge end of the nozzle 1100 and the peripheral portion of the nozzle 1100 are completely cleaned, forming a liquid layer is performed.

[0222] In forming the liquid layer, the cleaning liquid "L" received in the receiving space 5221 is sucked. Accordingly, the process liquid and the first gas layer provided in the nozzle 1100 are sucked back together, and the liquid layer is formed by the cleaning liquid "L" at a position separated from the process liquid. The liquid layer made of the cleaning liquid "L" can be partially evaporated to prevent the tip of the process liquid from being solidified.

[0223] When the forming of the liquid layer is completed, the discharge line is opened to discharge the cleaning liquid "L" filled in the receiving space 5221. When the cleaning liquid "L" is discharged, the inner portion of the nozzle 1100 is sucked to form a second gas layer. The second gas layer is formed between the discharge end of the nozzle 1100 and the liquid layer. Accordingly, the process liquid, the first gas layer, the liquid layer, and the second gas layer can be sequentially formed downward within the nozzle 1100.

[0224] According to the inventive concept, a plurality of nozzles can be individually and selectively cleaned.

[0225] Further, according to an embodiment of the inventive concept, the entire surface of the nozzle can be cleaned.

[0226] Further, according to an embodiment of the inventive concept, the nozzle can be prevented from being contaminated while the nozzle is in standby.

[0227] Further, according to an embodiment of the inventive concept, a cleaning liquid for the nozzle can be prevented from leaking from a supply pipe to supply the cleaning liquid to the standby port.

[0228] Furthermore, according to embodiments of the inventive concept, the water level of the cleaning liquid received in the port to be used can be adjusted, and overflow of the cleaning liquid from the port to be used can be prevented.

[0229] Furthermore, according to embodiments of the inventive concept, when the cleaning liquid is discharged after performing the cleaning process, the discharge rate can be prevented from lagging.

[0230] Furthermore, according to embodiments of the inventive concept, the photoresist in the nozzle tube can be prevented from being cured.

[0231] The effects generated in the inventive concept are not limited to the aforementioned effects, and any other effects not mentioned herein will be clearly understood by those skilled in the art from the detailed description and the attached drawings.

[0232] The above description has been made for illustrative purposes. Furthermore, the above-described content describes embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the range of technology or knowledge of those skilled in the art. The written embodiment descriptions describe the best state for implementing the technical spirit of the inventive concept, and various changes required in the detailed application fields and uses of the inventive concept can be made. The written embodiment descriptions describe the best state for implementing the technical spirit of the inventive concept, and various changes required in the detailed application fields and uses of the inventive concept can be made. Furthermore, it should be understood that the appended patent claims include other embodiments.

[0233] Although the inventive concept has been described with reference to embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A substrate processing apparatus comprising: a processing vessel having a processing space to process a substrate; A standby port, located on one side of the processing container, to allow a nozzle for discharging the processing liquid to be ready for use; and a liquid supply unit moving between the processing vessel and the standby port and having the nozzle, wherein the standby port includes: a nozzle receiving member including a nozzle cleaning unit having a receiving space formed inside the nozzle cleaning unit to receive the nozzle and a cleaning liquid, and a discharge unit to discharge the cleaning liquid; and a discharge portion having a discharge port provided at one side of the nozzle cleaning unit to discharge the cleaning liquid to the nozzle, and wherein the discharge port is disposed to overlap at least a portion of the nozzle when viewed from above; wherein the nozzle receiving member includes a movement preventing groove structure provided in a bottom surface of the nozzle receiving member, and wherein the movement preventing groove structure extends along a circumference of the nozzle cleaning unit to prevent the cleaning liquid from moving left and right when the cleaning liquid is discharged wherein the nozzle cleaning unit includes: an upper body portion having a discharge port formed on an inner surface thereof to discharge the cleaning liquid to the nozzle; a first inclined portion extending downward from a lower end of the upper body portion and having a width that gradually decreases downward; a discharge end receiving portion extending downward from a lower end of the first inclined portion, having a uniform width in a vertical direction, and positioning a discharge end of the nozzle; and a second inclined portion extending downward from a lower end of the discharge end receiving portion and having a width that gradually narrows downward; wherein the discharge port is disposed to overlap at least a portion of the nozzle when viewed from above; wherein the discharge unit is positioned below the nozzle cleaning unit, and includes: a first port extending downward from a lower end of the second inclined portion; and a second port extending downward from the first port and having a width that increases in a direction away from the first port, and a lower body portion connected with a discharge line to discharge the cleaning liquid to the outside; wherein an angle between the first port and the second port is set to an obtuse angle, and a length of the first port in a vertical direction is set to be smaller than an inner diameter of a discharge end of the nozzle.

2. The substrate processing apparatus according to claim 1, wherein the cleaning liquid supplied from the discharge port rotates along an outer surface of the nozzle and a wall of the nozzle receiving unit. ​ 3. The substrate processing apparatus according to claim 2, wherein the cleaning liquid discharged from the discharge port rotates to a surface of the outer surface of the nozzle, the surface being positioned at opposite sides in a direction of discharge of the cleaning liquid.

4. The substrate processing apparatus according to claim 1, wherein a plurality of the nozzle cleaning units are provided, positioned independent of each other, and arranged in one direction when viewed from above.

5. The substrate processing apparatus according to claim 4, wherein the standby port includes an anti-overflow hole provided to communicate with the plurality of nozzle cleaning units in a direction perpendicular to an arrangement direction of the plurality of nozzle cleaning units.

6. The substrate processing apparatus according to claim 1, wherein the standby port includes: a tube fixing member coupled to the nozzle receiving member to fix a cleaning liquid supply tube to supply the cleaning liquid to the discharge port, wherein the tube fixing member includes a tube insertion hole into which the cleaning liquid supply tube is inserted, and an anti-leakage groove structure formed in the tube insertion hole.

7. The substrate processing apparatus according to claim 6, wherein the discharge port includes: a coupling portion protruding from a side surface of the nozzle receiving member, wherein the cleaning liquid supply tube is coupled to the coupling portion, wherein the coupling portion includes: a first portion having a first width, and a second portion extending from the first portion and having a width smaller than the first width, and wherein a diameter of the tube insertion hole is provided to be smaller than a width of a tip of the second portion of the coupling portion.

8. The substrate processing apparatus according to claim 1, wherein a length of the first port in a vertical direction is provided to be smaller than an inner diameter of a discharge end of the nozzle.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein the processing liquid includes a photoresist, and the cleaning liquid includes a thinner.

10. A substrate processing apparatus comprising: a processing vessel having a processing space to process a substrate; and a liquid supply unit having the nozzle, which moves between the processing vessel and a standby port, wherein the standby port includes: a nozzle receiving member including a nozzle cleaning unit having a receiving space formed inside to receive the nozzle, and a cleaning liquid; the nozzle receiving member includes an anti-movement groove structure provided in a bottom surface of the nozzle receiving member, and wherein the anti-movement groove structure extends along a circumference of the receiving space of the nozzle cleaning unit to prevent cleaning liquid from moving left and right of the anti-movement groove structure when the cleaning liquid is discharged; the anti-movement groove structure is provided in the nozzle receiving member by being recessed upward from the bottom surface of the nozzle receiving member, and wherein the anti-movement groove structure extends along a circumference of the receiving space of the nozzle cleaning unit to prevent cleaning liquid from moving left and right when the cleaning liquid is discharged; wherein the nozzle cleaning unit includes: ​ ​ ​ ​ ​ ​ ​ ​ A standby port, located on one side of the processing container, to allow a nozzle for discharging the processing liquid to be ready for use; ​ ​ ​ ​ ​ ​ an upper body portion having a discharge port formed on an inner surface thereof to discharge a cleaning liquid to the nozzle; a first inclined portion extending downward from a lower end of the upper body portion and having a width that gradually decreases downward; a discharge end receiving portion extending downward from a lower end of the first inclined portion, having a uniform width in a vertical direction, and being used to position a discharge end of the nozzle; and a second inclined portion extending downward from a lower end of the discharge end receiving portion and having a width that gradually narrows downward; wherein the discharge port is disposed to overlap at least a portion of the nozzle and is disposed at a side of a central axis of the nozzle when viewed from above; wherein a discharge unit is positioned below the nozzle cleaning unit and includes: a first port extending downward from a lower end of the second inclined portion; and a second port extending downward from the first port and having a width that increases in a direction away from the first port, and a lower body portion connected with a discharge line that discharges the cleaning liquid to the outside; wherein an angle between the first port and the second port is set to an obtuse angle, and a length of the first port in a vertical direction is set to be smaller than an inner diameter of a discharge end of the nozzle.

11. The substrate processing apparatus of claim 10, wherein the cleaning liquid supplied from the discharge port rotates along an outer surface of the nozzle, and wherein the cleaning liquid rotates to a surface of the outer surface of the nozzle, the surface being positioned at an opposite side in a direction of the discharge port.

12. The substrate processing apparatus of claim 10, wherein a plurality of the nozzle cleaning units are disposed, positioned independent of each other, and arranged in one direction when viewed from above.

13. The substrate processing apparatus of claim 12, wherein the standby port includes: an anti-overflow hole disposed to communicate with a plurality of the nozzle cleaning units in a direction perpendicular to an arrangement direction of the plurality of the nozzle cleaning units; and wherein the anti-movement groove structure extends along a circumference of the anti-overflow hole.

14. The substrate processing apparatus of claim 10, wherein the standby port includes: a tube fixing member coupled to the nozzle receiving member to fix a cleaning liquid supply tube to supply the cleaning liquid to the discharge port, wherein the tube fixing member includes a tube insertion hole into which the cleaning liquid supply tube is inserted, and an anti-leakage groove structure formed in the tube insertion hole.

15. The substrate processing apparatus of any one of claims 10 to 14, wherein the processing liquid includes a photoresist, and the cleaning liquid includes a thinner.

16. A method for processing a substrate by using the substrate processing apparatus of claim 1, the method including the steps of: ​ a first gas layer is formed at the discharge end of the nozzle as the nozzle sucks back the treatment liquid filled in the discharge end of the nozzle before moving to the standby port; the discharge end is cleaned by inserting the discharge end into the receiving space in a state where the first gas layer is formed; a liquid layer is formed as the discharge end sucks back the cleaning liquid in a state where the discharge end is dipped into the cleaning liquid; and a second gas layer is formed at the discharge end as the nozzle sucks back in a state where the cleaning liquid is discharged from the receiving space, wherein in the cleaning of the discharge end, the cleaning liquid is discharged so that the cleaning liquid rotates to a surface of an outer surface of the nozzle, the surface being located at an opposite side in a discharge direction of the cleaning liquid.

17. The method according to claim 16, wherein in the cleaning of the discharge end, the receiving space is filled with the cleaning liquid discharged via the nozzle, and wherein in a state where the first gas layer is formed, the discharge end is cleaned as the nozzle is inserted into the receiving space so that the discharge end is dipped into the cleaning liquid filled in the receiving space.

18. The method according to claim 16 or 17, wherein the treatment liquid includes a photoresist, and the cleaning liquid includes a thinner.

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