Apparatus for picking up semiconductor devices and test handler comprising the same

Abstract

Disclosed is a device for picking up a semiconductor device and a test handler including the same. The semiconductor device pickup device includes a vacuum pickup for vacuum-sucking the semiconductor device, and a vertical driving unit for moving the vacuum pickup in a vertical direction. The vertical driving unit includes a cylinder having an internal space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the internal space of the cylinder, and a piston rod extending downward from the piston through the lower cover and coupled to the vacuum pickup, and air is provided at a predetermined pressure between the lower cover and the piston rod to prevent foreign matter from being introduced into the internal space of the cylinder.

Description

Technical Field

[0001] This invention relates to an apparatus for picking up semiconductor devices and a test processor including the apparatus. More specifically, this invention relates to a semiconductor device picking apparatus for transferring semiconductor devices during electrical testing of semiconductor devices, and a test processor including the semiconductor device picking apparatus. Background Technology

[0002] The electrical testing process determines whether a semiconductor device manufactured using semiconductor manufacturing processes is a good or defective product. This testing process can be performed using a test processor that processes the semiconductor device and a test instrument that provides test signals to perform electrical tests on the semiconductor device.

[0003] The testing process can be performed after the semiconductor device is housed in the test tray and electrically connected to the insertion assembly of the tester. The test processor may include: a chamber module for performing the testing process, a loader module for housing the semiconductor device in the test tray and loading the test tray into the chamber module, and an unloader module for unloading the test tray from the chamber module after the testing process and classifying the semiconductor device according to the test results.

[0004] The loader module and unloader module may include a semiconductor device picking device for picking up semiconductor devices. Figure 1 This is an exemplary cross-sectional view illustrating a conventional semiconductor device pickup device. Figure 2 It is a diagrammatic explanation, as follows Figure 1 An exemplary cross-sectional view of the operation of the semiconductor device pickup device shown.

[0005] Reference Figure 1 and Figure 2 A conventional semiconductor device pickup device 100 may include a vacuum nozzle 102 for vacuum picking up semiconductor devices and a vertical drive unit 110 for vertically moving the vacuum nozzle 102. The vertical drive unit 110 may be constructed in the form of a pneumatic cylinder and may include a cylinder 112, a piston 114 disposed in the cylinder 112, and a piston rod 116 extending downward from the piston 114.

[0006] The vacuum nozzle 102 may have a rod shape that extends downward through the rod cap 118 of the vertical drive unit 110. A first head 120 may be mounted on the lower part of the piston rod 116, and a second head 122 may be mounted on the upper part of the vacuum nozzle 102. The first head 120 and the second head 122 may be disposed in the cylinder 112, and an elastic member 130 (e.g., a coil spring) for resiliently supporting the vacuum nozzle 102 in the vertical direction may be disposed between the first head 120 and the second head 122.

[0007] Additionally, a vacuum chamber 140 connected to a vacuum supply unit (not shown, such as a vacuum pump) may be formed in the rod cap 118, and the vacuum chamber 140 may be defined by sealing members 124 and 126 respectively installed on the upper and lower parts of the rod cap 118. A vacuum nozzle 102 may extend vertically through the sealing members 124 and 126 and the vacuum chamber 140, and may have a vacuum port 104 connected to the vacuum chamber 140. That is, the vacuum port 104 of the vacuum nozzle 102 may be connected to the vacuum supply unit through the vacuum chamber 140.

[0008] When compressed air is supplied to the upper space of piston 114, piston 114 and vacuum nozzle 102 can move downward. In particular, when vacuum nozzle 102 is in close contact with semiconductor device, the impact force acting on semiconductor device can be absorbed by elastic member 130.

[0009] However, impurities can be introduced into the vacuum chamber 140 through the vacuum port 104 of the vacuum nozzle 102, and the vertical movement of the vacuum nozzle 102 will be uneven due to the impurities. Specifically, even when the piston 114 moves vertically, the vacuum nozzle 102 cannot move due to the impurities and the elastic member 130. In particular, even when the vacuum nozzle 102 moves, the distance it moves may differ from the distance the piston 114 moves. That is to say, the vertical driving force provided by the compressed air is not sufficiently transmitted to the vacuum nozzle, and therefore it is difficult to control the height of the vacuum nozzle 102. Summary of the Invention

[0010] Embodiments of the present invention provide a semiconductor device pickup device capable of smoothly moving a vacuum nozzle in the vertical direction, and a test processor including the semiconductor device pickup device.

[0011] According to one aspect of the invention, an apparatus for picking up semiconductor devices may include a vacuum pickup for vacuum adsorption of semiconductor devices and a vertical drive unit for moving the vacuum pickup in a vertical direction. Specifically, the vertical drive unit may include a cylinder having an internal space, a lower cover connected to the lower part of the cylinder, a piston disposed in the internal space of the cylinder, and a piston rod extending downward from the piston through the lower cover and connected to the vacuum pickup, and may provide air at a predetermined pressure between the lower cover and the piston rod to prevent impurities from being introduced into the internal space of the cylinder.

[0012] According to some embodiments of the invention, the lower cover may have a through hole into which a piston rod is inserted, and a sleeve member for guiding the piston rod in the vertical direction may be disposed in the through hole.

[0013] According to some embodiments of the invention, air may be supplied to the gap between the lower cover and the piston rod below the sleeve member.

[0014] According to some embodiments of the present invention, the internal space of the cylinder may include a lower internal space located below the piston and an upper internal space located above the piston, and a first air passage for supplying air to the lower internal space and a second air passage for supplying air to the upper internal space may be formed through the cylinder.

[0015] According to some embodiments of the present invention, a third air passage and a fourth air passage for supplying air between the lower cover and the piston rod can be connected to the first air passage and the second air passage, respectively, through the lower cover and the cylinder.

[0016] According to some embodiments of the present invention, the lower cover may have a through hole into which a piston rod is inserted, a circular annular groove may be formed in the inner surface portion of the through hole, and a third air passage and a fourth air passage may be connected to the groove.

[0017] According to some embodiments of the present invention, the apparatus may further include: a valve unit connected to a first air passage and a second air passage and configured to selectively supply air to the first air passage or the second air passage, and an air supply unit connected to the valve unit and configured to supply air.

[0018] According to some embodiments of the invention, the device may further include a pressure regulator for maintaining the air pressure at a predetermined pressure.

[0019] According to some embodiments of the invention, the device may further include an upper extension extending upward from the piston. In this case, an upper insertion hole for inserting the upper extension may be formed in the upper part of the cylinder.

[0020] According to some embodiments of the present invention, a first vacuum channel may be connected to an upper insertion hole via the upper part of the cylinder, and a second vacuum channel for connecting the first vacuum channel to a vacuum pickup may be formed via an upper extension, a piston, and a piston rod.

[0021] According to some embodiments of the present invention, the vacuum pickup may include a pickup body coupled to a piston rod and a vacuum nozzle mounted on the pickup body. In this case, the piston rod may be connected to the vacuum nozzle via the pickup body.

[0022] According to some embodiments of the invention, the vacuum pickup may also include a holding pad that is mounted on the lower part of the vacuum nozzle and is made of a flexible material.

[0023] According to some embodiments of the present invention, the apparatus may further include a valve unit connected to a first vacuum channel and a vacuum supply unit connected to the valve unit and providing a vacuum to pick up semiconductor devices.

[0024] According to some embodiments of the present invention, the piston may include a lower piston connected to the piston rod, an upper piston disposed above the lower piston, and an elastic member disposed between the lower piston and the upper piston.

[0025] According to some embodiments of the invention, the piston may further include a lower extension extending downward from the upper piston. In this case, a lower insertion hole for inserting the lower extension may be formed in the lower piston.

[0026] According to some embodiments of the invention, the piston may further include an upper extension extending upward from the upper piston. In this case, an upper insertion hole for inserting the upper extension may be formed in the upper part of the cylinder body.

[0027] According to some embodiments of the present invention, a first vacuum channel may be connected to an upper insertion hole via the upper part of the cylinder, and a second vacuum channel for connecting the first vacuum channel to a vacuum pickup may be formed via an upper extension, an upper piston, a lower extension, a lower piston, and a piston rod.

[0028] According to some embodiments of the present invention, the device may further include sealing members disposed between the upper extension and the upper insertion hole, and between the lower extension and the lower insertion hole.

[0029] According to another aspect of the invention, the test processor may include: a chamber module for electrically testing semiconductor devices housed in a test tray; a loader module for transferring semiconductor devices from a customer tray to a test tray and loading the test tray into the chamber module; and an unloader module for unloading the test tray from the chamber module and transferring the semiconductor devices from the test tray to at least one customer tray after testing the semiconductor devices. In this case, the loader module may include a vacuum pickup for transferring semiconductor devices, vertical drive units for moving the vacuum pickup in a vertical direction, and horizontal drive units for moving the vacuum pickup in a horizontal direction. Each vertical drive unit may include: a cylinder having an internal space, a lower cover connected to the lower part of the cylinder, a piston disposed in the internal space of the cylinder, and a piston rod extending downward from the piston through the lower cover and connected to the vacuum pickup, and air may be supplied between the lower cover and the piston rod at a predetermined pressure to prevent impurities from being introduced into the internal space of the cylinder.

[0030] According to another aspect of the invention, the test processor may include: a chamber module for performing electrical tests on semiconductor devices housed in a test tray; a loader module for transferring semiconductor devices from a customer tray to a test tray and loading the test tray into the chamber module; and an unloader module for unloading the test tray from the chamber module and transferring the semiconductor devices from the test tray to at least one customer tray after testing the semiconductor devices. In this case, the unloader module may include: a vacuum pickup for transferring semiconductor devices; a vertical drive unit for moving the vacuum pickup in a vertical direction; and a horizontal drive unit for moving the vacuum pickup in a horizontal direction. Each vertical drive unit may include: a cylinder having an internal space; a lower cover connected to the lower part of the cylinder; a piston disposed in the internal space of the cylinder; and a piston rod extending downward from the piston through the lower cover and connected to the vacuum pickup, and may provide air at a predetermined pressure between the lower cover and the piston rod to prevent impurities from being introduced into the internal space of the cylinder.

[0031] According to the embodiments of the present invention described above, air can be continuously supplied between the lower cover and the piston rod at a predetermined pressure, thus effectively preventing impurities from being introduced between the lower cover and the piston rod. As a result, the inflow of impurities into the internal space of the cylinder is prevented, and therefore the vertical movement of the vacuum pickup can be performed more smoothly. Furthermore, the performance of the semiconductor device pickup device can be greatly improved, and its lifespan can be significantly extended.

[0032] The above overview of the invention is not intended to describe the embodiments illustrated in the figures or each example of the invention. The detailed description and the following claims illustrate these embodiments in more detail. Attached Figure Description

[0033] The exemplary embodiments can be understood in more detail based on the following description and in conjunction with the accompanying drawings, wherein:

[0034] Figure 1 This is an exemplary cross-sectional view illustrating a conventional semiconductor device pickup device;

[0035] Figure 2 It is a diagrammatic explanation, as follows Figure 1 An exemplary cross-sectional view of the operation of a conventional semiconductor device pickup device shown;

[0036] Figure 3 This is an exemplary plan view illustrating a test processor according to one embodiment of the present invention;

[0037] Figure 4 and Figure 5 It is a diagrammatic explanation, as follows Figure 1 A schematic cross-sectional view of the semiconductor device pickup device shown;

[0038] Figure 6 It is a diagrammatic explanation, as follows Figure 4 and Figure 5 An exemplary enlarged cross-sectional view of the lower cover and piston rod shown;

[0039] Figure 7 It is a diagrammatic explanation, as follows Figure 4 and Figure 5 A block diagram showing the air supply unit and the vacuum supply unit connected to the vertical drive unit; and

[0040] Figure 8 It is a diagrammatic explanation, as follows Figure 6 An exemplary enlarged cross-sectional view of another example of the third and fourth air passages shown.

[0041] While various embodiments may have various modifications and alternatives, details have been revealed by example in the accompanying drawings and will be described in detail. However, it should be understood that the intention is not to limit the patent-claiming invention to the specific embodiments described. Rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims. Detailed Implementation

[0042] In the following description, embodiments of the invention will be described in more detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described below and is practiced in various other forms. The following embodiments are intended to fully accomplish the invention, but not to fully convey the scope of the invention to those skilled in the art.

[0043] In this specification, when a component is referred to as being on or connected to another component or layer, it may be directly on or connected to that other component or layer, or there may be an intermediate component or layer. Conversely, it should be understood that when a component is referred to as being directly on or connected to another component or layer, this means there is no intermediate component. Furthermore, while the terms such as the first, second, and third are used to describe various regions and layers in the various embodiments of the invention, these regions and layers are not limited to these terms.

[0044] The terminology used below is for describing specific embodiments only and does not limit the invention. Furthermore, unless otherwise defined herein, all terms (including technical or scientific terms) may have the same meaning as commonly understood by those skilled in the art.

[0045] Embodiments of the invention will be described with reference to exemplary drawings of preferred embodiments. Therefore, variations and / or tolerances in the manufacturing process can be anticipated from the various forms of the drawings. Consequently, embodiments of the invention are not described as limited to specific forms or regions in the drawings, and deviations from these forms are included. These regions can be entirely exemplary, and their various forms do not describe or depict the exact form or structure in any given region, and are not intended to limit the scope of the invention.

[0046] Figure 3 This is an exemplary plan view illustrating a test processor according to one embodiment of the present invention. Figure 4 and Figure 5 It is a diagrammatic explanation, as follows Figure 1 A schematic cross-sectional view of the semiconductor device pickup device shown.

[0047] Reference Figure 3 According to one embodiment of the present invention, a semiconductor device pickup device 200 and a test processor 10 including the semiconductor device pickup device 200 can be used to perform electrical testing on a semiconductor device 2. For example, the test processor 10 may include: a chamber module 40 for performing electrical testing on the semiconductor device 2 housed in a test tray 20; a loader module 60 for transferring the semiconductor device 2 from a customer tray 30 to the test tray 20 and loading the test tray 20 into the chamber module 40; and an unloader module 70 for unloading the test tray 20 from the chamber module 40 and transferring the semiconductor device 2 from the test tray 20 to at least one customer tray 32 after testing the semiconductor device 2.

[0048] Each module of the loader module 60 and the unloader module 70 may include a semiconductor device transfer unit 80 for transferring the semiconductor device 2. The semiconductor device transfer unit 80 may include a plurality of semiconductor device pick-up devices 200 and a horizontal drive member 82 for moving the semiconductor device pick-up devices 200 in the horizontal direction.

[0049] Although not shown in detail, test tray 20 may include an insertion assembly (not shown) for receiving semiconductor device 2. Loader module 60 may transfer semiconductor device 2 from customer tray 30, in which semiconductor device 2 is received, to test tray 20, and then test tray 20 may be transferred to chamber module 40. After the testing process is completed, unloader module 70 may transfer semiconductor device 2 received in test tray 20 to customer tray 32, and then test tray 20 may be transferred to loader module 60.

[0050] The chamber module 40 may include a test chamber 42 that provides space for electrical testing of the semiconductor device 2, and the test chamber 42 may be connected to a tester 50 that provides test signals for electrical testing of the semiconductor device 2. An immersion chamber 44 for adjusting the temperature of the semiconductor device 2 housed in the test tray 20 to a predetermined test temperature may be provided on one side of the test chamber 42, and a de-immersion chamber 46 for restoring the temperature of the semiconductor device 2 to room temperature after testing may be provided on the other side of the test chamber 42.

[0051] Reference Figure 4 and Figure 5 The semiconductor device pickup device 200 may include: a vacuum pickup 210 for vacuum pickup of the semiconductor device 2, and a vertical drive unit 220 connected to the vacuum pickup 210 and configured to move the vacuum pickup 210 in the vertical direction.

[0052] For example, a pneumatic cylinder can be used as a vertical drive unit 220, and a vacuum pickup 210 can be connected to the piston rod 290 of the pneumatic cylinder 220. For example, the vertical drive unit 220 may include: a cylinder body 230 disposed in a vertical direction and having an internal space 232, a lower cover 250 connected to the lower part of the cylinder body 230, a piston 270 disposed in the internal space 232 of the cylinder body 230, and a piston rod 290 extending downward through the lower cover 250, and the vacuum pickup 210 can be connected to the lower part of the piston rod 290.

[0053] Figure 6 It is a diagrammatic explanation, as follows Figure 4 and Figure 5 An exemplary enlarged cross-sectional view of the lower cover and piston rod shown.

[0054] Reference Figure 6 According to one embodiment of the invention, air is supplied at a predetermined pressure between the lower cover 250 and the piston rod 290 to prevent impurities from being introduced into the internal space 232 of the cylinder 230. Specifically, air can be continuously supplied into the gap 252 between the lower cover 250 and the piston rod 290 to maintain a constant predetermined pressure. Furthermore, air can be discharged downwards from the gap 252. As a result, impurities can be prevented from being introduced into the gap 252 by the flow of air.

[0055] For example, the lower cover 250 may have a through hole 254 into which the piston rod 290 is inserted, and a sleeve member 256 that guides the piston rod 290 in the vertical direction may be disposed in the through hole 254. Air is supplied to the gap 252 between the lower cover 250 and the piston rod 290 below the sleeve member 256.

[0056] Refer again Figure 4 and Figure 5The internal space 232 of the cylinder body 230 may include a lower internal space 234 located below the piston 270 and an upper internal space 236 located above the piston 270. The cylinder body 230 may have a first air passage 240 for supplying air to the lower internal space 234 and a second air passage 242 for supplying air to the upper internal space 236. That is, the first air passage 240 may be formed through the cylinder body 230 to connect to the lower internal space 234, and the second air passage 242 may be formed through the cylinder body 230 to connect to the upper internal space 236, such as... Figure 4 and Figure 5 As shown in the image.

[0057] Furthermore, the third air passage 258 and the fourth air passage 260, used to supply air to the gap 252 between the lower cover 250 and the piston rod 290, can be connected to the first air passage 240 and the second air passage 242 via the lower cover 250 and the cylinder 230, respectively. For example, when air is supplied to the lower internal space 234 via the first air passage 240 to lift the vacuum pickup 210 (e.g., ... Figure 4 When (as shown in the diagram), air can be supplied through a third air channel 258 connected to the first air channel 240 to the gap 252 between the lower cover 250 and the piston rod 290. Furthermore, while the vacuum pickup 210 remains in the raised state, air can be supplied through the first air channel 240 and the third air channel 258 to the gap 252 between the lower cover 250 and the piston rod 290.

[0058] Reference Figure 5 When the vacuum pickup 210 is lowered by supplying air to the upper internal space 236 through the second air channel 242, air can be supplied through the fourth air channel 260 connected to the second air channel 242 to the gap 252 between the lower cover 250 and the piston rod 290. Furthermore, when the vacuum pickup 210 is in the lowered state, air can be supplied through both the second air channel 242 and the fourth air channel 260 to the gap 252 between the lower cover 250 and the piston rod 290.

[0059] Specifically, such as Figure 6As shown, a circular annular groove 262 can be formed in the inner surface portion of the through hole 254, and the third air channel 258 and the fourth air channel 260 can be connected to the groove 262. As a result, air supplied through the third air channel 258 or the fourth air channel 260 can be uniformly supplied between the lower cover 250 and the piston rod 290 via the groove 262. Therefore, it is possible to sufficiently prevent impurities from being introduced between the lower cover 250 and the piston rod 290. Furthermore, as described above, because air can always be supplied through the third air channel 258 or the fourth air channel 260, it is possible to sufficiently prevent impurities from being introduced between the lower cover 250 and the piston rod 290.

[0060] Refer again Figure 4 and Figure 5 The semiconductor device pickup device 200 may include an upper extension 278 extending upward from the piston 270, and an upper insertion hole 244 into which the upper extension 278 is inserted may be formed in the upper part of the cylinder 230. Furthermore, a first vacuum channel 246 may be connected to the upper insertion hole 244 via the upper part of the cylinder 230, and a second vacuum channel 248 for connecting the first vacuum channel 246 to the vacuum pickup device 210 may be formed via the upper extension 278, the piston 270, and the piston rod 290.

[0061] According to one embodiment of the present invention, the piston 270 may include a lower piston 272 connected to the piston rod 290 and an upper piston 274 disposed above the lower piston 272, and an elastic member 276 may be disposed between the lower piston 272 and the upper piston 274. As an example, a coil spring may be used as the elastic member 276.

[0062] Furthermore, piston 270 may include a lower extension 280 extending downward from upper piston 274. In this case, upper extension 278 may extend upward from upper piston 274. Additionally, a lower insertion hole 282 for inserting lower extension 280 may be formed in lower piston 272, and a second vacuum channel 248 may be formed through upper extension 278, upper piston 274, lower extension 280, lower piston 272, and piston rod 290. In this case, upper extension 278 and lower extension 280 may have a tubular shape, and upper piston 274 and piston rod 290 may each have a through hole for forming the second vacuum channel 248.

[0063] Meanwhile, to prevent vacuum leakage, sealing members 284 and 286 can be respectively disposed between the upper extension 278 and the upper insertion hole 244 and between the lower extension 280 and the lower insertion hole 282.

[0064] Figure 7 It is a diagrammatic explanation, as follows Figure 4 and Figure 5The block diagram shows the air supply unit and the vacuum supply unit connected to the vertical drive unit.

[0065] Reference Figure 7 The semiconductor device pickup device 200 may include: a first valve unit 300 connected to a first air passage 240 and a second air passage 242 and configured to selectively supply air to either the first air passage 240 or the second air passage 242; and an air supply unit 302 connected to the first valve unit 300 and configured to supply air. Furthermore, a pressure regulator 304 for maintaining the air pressure constant at a predetermined pressure may be disposed between the first valve unit 300 and the air supply unit 302. The first valve unit 300 may include a first valve (not shown) connected to the first air passage 240 and a second valve (not shown) connected to the second air passage 242. For example, safety valves may be used as the first and second valves to maintain a constant air pressure in the gap 252 between the lower cover 250 and the piston rod 290. The air supply unit 302 may include, for example, a compressed air tank and an air pump connected to the compressed air tank.

[0066] Specifically, the first valve unit 300 can always connect either the first air passage 240 or the second air passage 242 to the air supply unit 302. Therefore, a constant air pressure can always be maintained between the lower cover 250 and the piston rod 290, thus effectively preventing impurities from being introduced between the lower cover 250 and the piston rod 290.

[0067] At the same time, such as Figure 4 As shown, when air is supplied to the lower internal space 234 through the first air passage 240, the lower piston 272 can be raised, and the elastic member 276 (i.e., the coil spring) can be compressed. In this case, a sealing member 288 can be disposed between the lower piston 272 and the inner surface of the cylinder 230.

[0068] Reference Figure 5 When air is supplied to the upper internal space 236 through the second air passage 242, the lower piston 272 descends. At this time, although not shown in detail, the upper internal space 236 and the intermediate internal space 238 in which the elastic member 276 is disposed can communicate with each other, and air can be supplied to the intermediate internal space 238 via the upper internal space 236. For example, air can be supplied from the upper internal space 236 to the intermediate internal space 238 through the gap between the upper piston 274 and the inner surface of the cylinder 230. Specifically, as... Figure 5 As shown, the lower extension 280 may have a smaller outer diameter than the upper extension 278 so that the piston 272 can be lowered.

[0069] Refer again Figure 7 The semiconductor device pickup device 200 may include a second valve unit 310 connected to the first vacuum channel 246, and a vacuum supply unit 312 connected to the second valve unit 310 and providing vacuum to pickup the semiconductor device 2. For example, the second valve unit 310 may include an on / off valve, and the vacuum supply unit 312 may include a vacuum pump or a vacuum ejector. Furthermore, a vacuum regulator 314 for maintaining a constant vacuum pressure may be disposed between the second valve unit 310 and the vacuum supply unit 312.

[0070] Refer again Figure 4 and Figure 5 The vacuum pickup 210 may include a pickup body 212 connected to the lower part of the piston rod 290 and a vacuum nozzle 214 mounted on the pickup body 212. Specifically, the vacuum pickup 210 may be detachably mounted to the lower part of the piston rod 290. For example, the lower part of the piston rod 290 may be connected to the vacuum nozzle 214 via the pickup body 212. In this case, the pickup body 212 may have a through hole into which the lower part of the piston rod 290 is inserted, and a sealing member 216 for preventing vacuum leakage may be disposed between the through hole of the pickup body 212 and the lower part of the piston rod 290.

[0071] Alternatively, a holding pad 218 made of a flexible material (such as rubber or silicone resin) can be mounted on the lower part of the vacuum nozzle 214. Although not shown, when the vacuum pickup 210 is lowered using the vertical drive unit 220, the lower surface of the holding pad 218 can come into close contact with the upper surface of the semiconductor device 2, and the semiconductor device 2 can be vacuum-adsorbed onto the holding pad 218 using the vacuum pressure applied to the inside of the vacuum nozzle 214 through the first and second vacuum channels 246 and 248.

[0072] Figure 8 It is a diagrammatic explanation, as follows Figure 6 An exemplary enlarged cross-sectional view of another example of the third and fourth air passages shown.

[0073] Reference Figure 8 The lower cover 250 may have a plurality of third air channels 320 and a plurality of fourth air channels 322. For example, the lower cover 250 may have a pair of third air channels 320 connected to the first air channel 240 and a pair of fourth air channels 322 connected to the second air channel 242. The third air channels 320 and the fourth air channels 322 may be arranged at 90° intervals, such as... Figure 8 As shown in the diagram. Therefore, air can be supplied more evenly between the lower cover 250 and the piston rod 290.

[0074] According to the embodiment of the invention described above, air can be continuously supplied between the lower cover 250 and the piston rod 290 at a predetermined pressure, thus effectively preventing impurities from being introduced between the lower cover 250 and the piston rod 290. As a result, inflow of impurities into the internal space 232 of the cylinder 230 is prevented, and thus the vertical movement of the vacuum pickup 210 can be performed more smoothly. Furthermore, the performance of the semiconductor device pickup device 200 can be greatly improved, and its lifespan can be significantly extended.

[0075] Although exemplary embodiments of the invention have been described with reference to specific implementations, they are not limited thereto. Therefore, those skilled in the art will readily understand that various modifications and alterations may be made therein without departing from the spirit and scope of the appended claims.

Claims

1. An apparatus for picking up semiconductor devices, the apparatus comprising: a vacuum picker for vacuum-sucking semiconductor devices; and a vertical driving unit for moving the vacuum picker in a vertical direction, wherein the vertical driving unit includes a cylinder having an internal space, a lower cover coupled to a lower portion of the cylinder, a piston disposed in the internal space of the cylinder, and a piston rod extending downward from the piston through the lower cover and coupled to the vacuum picker, and air is provided between the lower cover and the piston rod at a predetermined pressure to prevent foreign matter from being introduced into the internal space of the cylinder, wherein the internal space of the cylinder includes a lower internal space located below the piston and an upper internal space located above the piston, and wherein a first air passage for supplying air into the lower internal space and a second air passage for supplying air into the upper internal space are formed through the cylinder, wherein a third air passage for supplying air between the lower cover and the piston rod is connected to the first air passage through the lower cover and the cylinder, wherein a fourth air passage for supplying air between the lower cover and the piston rod located on opposite sides of the third air passage is connected to the second air passage through the lower cover and the cylinder.

2. The apparatus of claim 1, wherein the lower cover has a through-hole into which the piston rod is inserted, and a sleeve member for guiding the piston rod in the vertical direction is disposed in the through-hole.

3. The apparatus of claim 2, wherein the air is supplied to a gap between the lower cover and the piston rod below the sleeve member.

4. The apparatus of claim 1, wherein the lower cover has a through-hole into which the piston rod is inserted, a circular annular groove is formed in an inner surface portion of the through-hole, and the third air passage and the fourth air passage are connected to the groove.

5. The apparatus of claim 1, further comprising: a valve unit connected to the first air passage and the second air passage and configured to selectively supply air to the first air passage or the second air passage; and an air supply unit connected to the valve unit and configured to supply air.

6. The apparatus of claim 5, further comprising a pressure regulator for constantly maintaining the pressure of air at the predetermined pressure.

7. The apparatus of claim 1, further comprising an upper extension extending upward from the piston, wherein an upper insertion hole into which the upper extension is inserted is formed in an upper portion of the cylinder.

8. The apparatus of claim 7, wherein a first vacuum passage is connected to the upper insertion hole through an upper portion of the cylinder, and a second vacuum passage for connecting the first vacuum passage with the vacuum picker is formed through the upper extension, the piston, and the piston rod.

9. The apparatus of claim 8, wherein the vacuum picker includes a picker body coupled to the piston rod and a vacuum suction nozzle mounted on the picker body, and The piston rod is connected to the vacuum suction nozzle through the picker body.

10. The apparatus of claim 9, wherein the vacuum picker further comprises a suction pad mounted on a lower portion of the vacuum suction nozzle and made of a flexible material.

11. The apparatus of claim 8, further comprising: a valve unit connected to the first vacuum passage; and a vacuum providing unit connected to the valve unit and providing a vacuum to pick up the semiconductor device.

12. The apparatus of claim 1, wherein the piston comprises: a lower piston connected to the piston rod; an upper piston disposed above the lower piston; and a resilient member disposed between the lower piston and the upper piston.

13. The apparatus of claim 12, wherein the piston further comprises a lower extension portion extending downward from the upper piston, and a lower insertion hole into which the lower extension portion is inserted is formed in the lower piston.

14. The apparatus of claim 13, wherein the piston further comprises an upper extension portion extending upward from the upper piston, and an upper insertion hole into which the upper extension portion is inserted is formed in an upper portion of the cylinder.

15. The apparatus of claim 14, wherein a first vacuum passage is connected to the upper insertion hole through the upper portion of the cylinder, and a second vacuum passage for connecting the first vacuum passage with the vacuum picker is formed through the upper extension portion, the upper piston, the lower extension portion, the lower piston, and the piston rod.

16. The apparatus of claim 15, further comprising sealing members respectively disposed between the upper extension portion and the upper insertion hole, and between the lower extension portion and the lower insertion hole.

17. A test handler comprising: a chamber module for electrically testing semiconductor devices housed in test trays; a loader module for transferring the semiconductor devices from customer trays to the test trays and loading the test trays into the chamber module; and an unloader module for unloading the test trays from the chamber module after testing the semiconductor devices and transferring the semiconductor devices from the test trays to at least one customer tray, wherein the loader module comprises vacuum pickers for transferring the semiconductor devices, vertical drive units for respectively moving the vacuum pickers in a vertical direction, and horizontal drive units for moving the vacuum pickers in a horizontal direction, each of the vertical drive units comprises a cylinder having an internal space, a lower cap coupled to a lower portion of the cylinder, a piston disposed in the internal space of the cylinder, and a piston rod extending downward from the piston through the lower cap and coupled to the vacuum pickers, and air is provided between the lower cap and the piston rod at a predetermined pressure to prevent impurities from being introduced into the internal space of the cylinder, wherein the internal space of the cylinder comprises a lower internal space below the piston and an upper internal space above the piston, and the lower internal space is connected to the upper internal space through a passage formed in the lower cap. wherein a first air passage for supplying air into the lower inner space and a second air passage for supplying air into the upper inner space are formed through the cylinder, wherein a third air passage for supplying air between the lower cap and the piston rod is connected to the first air passage through the lower cap and the cylinder, wherein a fourth air passage for supplying air between the lower cap and the piston rod is connected to the second air passage through the lower cap and the cylinder, on the opposite side of the third air passage.

18. A test handler comprising: a chamber module for electrically testing semiconductor devices housed in test trays; a loader module for transferring the semiconductor devices from customer trays to the test trays and loading the test trays into the chamber module; and a unloader module for unloading the test trays from the chamber module after testing the semiconductor devices and transferring the semiconductor devices from the test trays to at least one customer tray, wherein the unloader module includes vacuum pickers for transferring the semiconductor devices, vertical drive units for moving the vacuum pickers in a vertical direction, respectively, and horizontal drive units for moving the vacuum pickers in a horizontal direction, each of the vertical drive units includes a cylinder having an inner space, a lower cap coupled to a lower portion of the cylinder, a piston disposed in the inner space of the cylinder, and a piston rod extending downward from the piston through the lower cap and coupled to the vacuum pickers, and air is provided between the lower cap and the piston rod at a predetermined pressure to prevent foreign matter from being introduced into the inner space of the cylinder, wherein the inner space of the cylinder includes a lower inner space below the piston and an upper inner space above the piston, and wherein a first air passage for supplying air into the lower inner space and a second air passage for supplying air into the upper inner space are formed through the cylinder, wherein a third air passage for supplying air between the lower cap and the piston rod is connected to the first air passage through the lower cap and the cylinder, wherein a fourth air passage for supplying air between the lower cap and the piston rod is connected to the second air passage through the lower cap and the cylinder, on the opposite side of the third air passage. ​

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