Apparatus and method for preparing pixel definition layer

Abstract

The application provides a preparation device and a preparation method of a pixel definition layer. The preparation device comprises a conveying unit for conveying a substrate, wherein the substrate comprises a pixel definition layer photoresist on a side of the substrate away from the conveying unit; and a stamping mold arranged on the side of the substrate away from the conveying unit and used for stamping the pixel definition layer photoresist to obtain a groove corresponding to a pixel opening. By using the preparation device and the preparation method provided in the embodiments of the application, the pixel definition layer required can be prepared on the substrate through only four processes of coating, stamping, curing and etching. Compared with the prior art which needs to go through a multi-channel manufacturing process of coating, curing, exposure, developing and etching and needs to use a precise exposure device and a precise mask, the application saves the cost of equipment and materials in the preparation process of the pixel definition layer and improves the production efficiency of the pixel definition layer.

Description

Technical Field

[0001] This application relates to the field of display, and more particularly to an apparatus and method for preparing a pixel definition layer. Background Technology

[0002] Solution printing technology for manufacturing organic light-emitting diode (OLED) and quantum dot light-emitting diode (QLED) displays offers advantages such as low cost, high throughput, and ease of achieving large sizes, making it an important direction for future display technology development. During the printing process, the pixel delimiting layer is crucial for the printing yield of the display material and the uniformity of subsequent film deposition.

[0003] Currently, the manufacturing process for pixel definition layers involves first coating the pixel definition layer material, then exposing and developing it through a mask, and finally etching it to obtain the desired pixel definition layer structure. This process requires sophisticated exposure equipment and sophisticated mask fabrication, which increases manufacturing costs. In addition, it requires multiple manufacturing processes such as coating, curing, exposure, development, and etching, which reduces production efficiency. Summary of the Invention

[0004] This invention provides a pixel definition layer preparation apparatus and preparation method to save equipment and material costs in the pixel definition layer preparation process and improve the production efficiency of pixel definition layers.

[0005] To solve the above problems, the technical solution provided by the present invention is as follows:

[0006] This invention provides an apparatus for fabricating a pixel definition layer, the pixel definition layer including pixel openings, the fabrication apparatus comprising:

[0007] A transmission unit for transmitting a substrate, the substrate including a pixel definition layer photoresist located on the side of the substrate opposite to the transmission unit;

[0008] An imprinting mold is disposed on the side of the substrate away from the conveying unit, and is used to imprint the photoresist of the pixel definition layer to obtain a groove corresponding to the pixel opening.

[0009] Optionally, in some embodiments of the present invention, the embossing mold includes an outer mold and an inner mold, wherein the outer mold is fitted over the inner mold.

[0010] Optionally, in some embodiments of the present invention, the outer mold includes a rigid roller and at least two mold teeth, the mold teeth being disposed on the side of the rigid roller opposite to the inner mold, the mold teeth being used to imprint the photoresist of the pixel definition layer to obtain a groove corresponding to the pixel opening.

[0011] Optionally, in some embodiments of the present invention, the inner mold is a hollow elastic roller, and the hollow space of the elastic roller can be inflated.

[0012] Optionally, in some embodiments of the present invention, the conveying unit includes a conveying wheel and a conveyor belt, the conveyor belt being sleeved on the outer periphery of the conveying wheel, and the conveying wheel being used to drive the conveyor belt to convey the substrate.

[0013] Optionally, in some embodiments of the present invention, the conveying unit further includes a pressure adjusting roller, the conveyor belt is sleeved outside the pressure adjusting roller, the line connecting the center of the embossing mold and the center of the pressure adjusting roller is perpendicular to the conveyor belt, and the pressure adjusting roller can move toward or away from the embossing mold.

[0014] Optionally, in some embodiments of the present invention, the conveyor wheel includes a drive roller and a conveyor belt tensioning roller, the drive roller being used to convey the conveyor belt, and the conveyor belt tensioning roller being movable along the conveying plane of the conveyor belt to adjust the tension of the conveyor belt.

[0015] Optionally, in some embodiments of the present invention, the transmission roller includes one active transmission roller and two driven transmission rollers. The active transmission roller is located at the starting end of the conveyor belt, the conveyor belt tensioning roller is located at the ending end of the conveyor belt, and the driven transmission roller is located between the active transmission roller and the conveyor belt tensioning roller.

[0016] Accordingly, the present invention also provides a method for preparing a pixel definition layer, the method comprising:

[0017] A substrate is provided, the substrate including electrodes located on the surface of the substrate;

[0018] A pixel definition layer photoresist is coated on the substrate, and the pixel definition layer photoresist covers the electrode;

[0019] The substrate is pressed to obtain a groove corresponding to the pixel opening using the fabrication apparatus described in any embodiment of the present invention;

[0020] The photoresist in the pixel definition layer is cured;

[0021] The photoresist in the pixel definition layer is etched and thinned to obtain the pixel opening, which exposes the electrode.

[0022] Optionally, in some embodiments of the present invention, the operation of curing the photoresist of the pixel definition layer is completed within 10 minutes after the groove imprinting is completed.

[0023] This invention provides a pixel definition layer fabrication apparatus and method. By using the fabrication apparatus and method provided in this embodiment, the required pixel definition layer can be fabricated on a substrate through only four steps: coating, imprinting, curing, and etching. Compared with the prior art, which requires multiple manufacturing processes such as coating, curing, exposure, development, and etching, and necessitates the use of precision exposure equipment and precision photomasks, this invention saves equipment and material costs in the pixel definition layer fabrication process and improves the production efficiency of pixel definition layers. Attached Figure Description

[0024] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the structure of the pixel definition layer preparation device provided in an embodiment of the present invention;

[0026] Figure 2 A flowchart illustrating the method for preparing a pixel definition layer according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the pixel definition layer preparation method provided in an embodiment of the present invention. Detailed Implementation

[0028] The technical solutions in the embodiments and / or examples of the present invention will be clearly and completely described below with reference to specific implementation schemes. Obviously, the embodiments and / or examples described below are only a part of the embodiments and / or examples of the present invention, and not all of them. Based on the embodiments and / or examples of the present invention, all other embodiments and / or examples obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0029] The directional terms used in this invention, such as [up], [down], [left], [right], [front], [back], [inside], [outside], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding this invention, and not for limiting it. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0030] This invention provides a pixel definition layer preparation apparatus and a method for preparing a pixel definition layer using the apparatus, thereby solving the problems of high cost, complex process flow and low production efficiency in existing pixel definition layer processes.

[0031] Please refer to Figure 1 , Figure 1 A schematic diagram of a pixel definition layer fabrication apparatus provided in an embodiment of the present invention is shown. The present invention provides a pixel definition layer fabrication apparatus for fabricating a pixel definition layer of a display panel. The pixel definition layer includes pixel openings that penetrate the pixel definition layer and expose electrodes covered by the pixel definition layer. The fabrication apparatus includes:

[0032] A transmission unit for transmitting a substrate, the substrate including a pixel definition layer photoresist located on the side of the substrate opposite to the transmission unit;

[0033] A bank imprinting mold is located on the side of the substrate away from the transfer unit, and is used to imprint the photoresist of the pixel definition layer to obtain a groove corresponding to the pixel opening.

[0034] Specifically, the Bank embossing mold includes an outer mold and an inner mold, with the outer mold fitted over the inner mold and the center of the outer mold coinciding with the center of the inner mold.

[0035] The outer mold includes a rigid roller and at least two mold teeth, which are evenly spaced on the rigid roller and located on the side of the rigid roller facing away from the inner mold. The gap between adjacent mold teeth is determined by the distance between adjacent pixels of the substrate to be imprinted, i.e., the unfolded distance of adjacent mold teeth is the same as the distance between adjacent grooves; the shape and size of the mold teeth correspond to the size and shape of the pixels, i.e., the shape and size of the mold teeth correspond to the shape and size of the grooves, respectively; the height of the mold teeth is 30-80 micrometers, i.e., the distance from the surface of the mold teeth facing away from the rigid roller to the rigid roller is 30-80 micrometers. The rigid roller is a seamlessly spliced ​​nickel alloy roller, with an inner diameter of 20-100 cm and a thickness of 300-800 micrometers. The rigid roller and the mold teeth are integrally formed, and the material of the mold teeth is also nickel alloy.

[0036] The inner mold is a hollow elastic roller, preferably a hollow rubber roller, with an outer diameter of 20-100 cm. The hollow space of the elastic roller can be inflated to allow the inner mold to expand, thereby supporting and fixing the outer mold.

[0037] The conveying unit includes a conveyor wheel and a conveyor belt. The conveyor belt is fitted around the outer circumference of the conveyor wheel and is used to convey the substrate. The conveyor wheel drives the conveyor belt. The conveyor wheel includes a drive roller and a conveyor belt tensioning roller. The drive roller is used to convey the conveyor belt, and the conveyor belt tensioning roller is used to adjust the tension of the conveyor belt. In one embodiment, there is only one drive roller, and the drive roller and the conveyor belt tensioning roller are located at opposite ends of the conveyor belt. The drive roller is located at the beginning of the conveyor belt, and the conveyor belt tensioning roller is located at the end of the conveyor belt. The drive shaft of the drive roller is a fixed drive shaft, and the drive shaft of the conveyor belt tensioning roller is a movable drive shaft, allowing the conveyor belt tensioning roller to move along the conveying plane of the conveyor belt. In another embodiment, the transmission roller includes one driving transmission roller and two driven transmission rollers. The driving transmission roller is located at the starting end of the conveyor belt, the conveyor belt tensioning roller is located at the ending end of the conveyor belt, and the driven transmission rollers are located between the driving transmission roller and the conveyor belt tensioning roller. The outer diameters of the driving transmission roller, the two driven transmission rollers, and the conveyor belt tensioning roller are equal, and their centers are located on the same straight line. The drive shaft of the driving transmission roller is a fixed drive shaft, the drive shaft of the conveyor belt tensioning roller is a movable drive shaft, and the conveyor belt tensioning roller can move along the conveying plane of the conveyor belt. The drive shaft of the driven transmission roller can be either a fixed drive shaft or a movable drive shaft.

[0038] Furthermore, the conveying unit also includes a pressure adjusting roller, which is located inside the conveyor belt, with the conveyor belt sleeved over the pressure adjusting roller. The line connecting the center of the Bank imprinting mold and the center of the pressure adjusting roller is perpendicular to the conveyor belt. The pressure adjusting roller can move toward or away from the Bank imprinting mold to adjust the distance between the Bank imprinting mold and the conveyor belt, thereby adjusting the force exerted by the mold teeth on the imprinting substrate. Furthermore, the pressure adjusting roller is located in the middle of the conveying unit, that is, the Bank imprinting mold is located directly above the conveying unit.

[0039] Accordingly, the present invention provides a method for preparing a pixel definition layer, wherein the pixel definition layer is prepared using the preparation apparatus provided in any embodiment of the present invention, please refer to... Figure 2 and Figure 3 The preparation method includes:

[0040] Step S1: Provide a substrate, the substrate including electrodes located on the surface of the substrate; please refer to... Figure 3 (a)

[0041] Step S2: Coat a pixel definition layer photoresist on the substrate, the pixel definition layer photoresist covering the electrode; please refer to... Figure 3 (b) Preferably, the photoresist of the pixel definition layer is made of a UV-curable adhesive with poor flowability.

[0042] Step S3: The substrate is passed through the fabrication apparatus to imprint grooves corresponding to the pixel openings; please refer to... Figure 3 (c)

[0043] Specifically, after completing step S2, firstly, the substrate with the pixel definition layer photoresist is placed on the conveyor belt. The pixel definition layer photoresist is located on the side of the substrate facing away from the conveyor belt. Driven by the active drive roller, the conveyor belt moves the substrate forward. During this process, the driven drive roller assists in conveying the substrate, and the conveyor belt tensioning roller adjusts the tension of the conveyor belt as needed. Then, as the substrate is conveyed to the area directly below the Bank imprinting mold, the pressure of the Bank imprinting mold on the substrate is adjusted by adjusting the pressure adjusting roller, causing the substrate to contact the Bank imprinting mold. The Bank imprinting mold rotates as the substrate is conveyed, thereby driving the die teeth to imprint the pixel definition layer photoresist, forming a groove corresponding to the pixel opening after the substrate leaves the Bank imprinting mold. Finally, the conveyor belt continues to transport the substrate, leaving the fabrication apparatus.

[0044] Step S4: Curing the photoresist in the pixel definition layer.

[0045] Specifically, to ensure the accuracy of the pixel opening and prevent changes in the shape of the groove in the pixel definition layer photoresist flow assembly due to prolonged placement, the step S4, which involves curing the pixel definition layer photoresist, must be completed within 10 minutes after the groove imprinting is finished, following step S3. Curing the pixel definition layer photoresist specifically involves irradiating it with UV light to cure it.

[0046] Step S5: The photoresist of the pixel definition layer is etched and thinned to obtain the pixel opening, which exposes the electrode; please refer to... Figure 3 (d)

[0047] Specifically, the etching and thinning process for the pixel definition layer involves etching the entire pixel definition layer photoresist. Since the thickness of the pixel definition layer photoresist at the groove location is smaller, while the thickness of the pixel definition layer photoresist outside the groove is larger, by controlling the etching process parameters, the pixel definition layer photoresist at the bottom of the groove is etched away to form the pixel opening, while the pixel definition layer photoresist outside the groove is retained, thus obtaining the final required pixel definition layer.

[0048] In summary, the embodiments of the present invention provide a pixel definition layer preparation apparatus and preparation method. By using the preparation apparatus and preparation method provided in the embodiments of the present invention, the required pixel definition layer can be prepared on the substrate through only four process steps: coating, imprinting, curing, and etching. Compared with the prior art, which requires multiple manufacturing processes such as coating, curing, exposure, development, and etching, and requires precision exposure equipment and precision photomasks, the present invention saves equipment and material costs in the pixel definition layer preparation process and improves the production efficiency of pixel definition layers.

[0049] The preparation apparatus and method for the pixel definition layer provided in the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. An apparatus for fabricating a pixel definition layer, the pixel definition layer comprising pixel openings, characterized in that, include: A conveying unit is used to convey a substrate, the substrate including a pixel definition layer photoresist located on the side of the substrate opposite to the conveying unit; the conveying unit includes a conveying wheel and a conveyor belt, the conveyor belt being sleeved on the outer periphery of the conveying wheel, and the conveying wheel being used to drive the conveyor belt to convey the substrate. An imprinting mold is disposed on the side of the substrate away from the conveying unit, and is used to imprint the photoresist of the pixel definition layer to obtain a groove corresponding to the pixel opening; The embossing mold is located directly above the conveying unit; The embossing mold includes an outer mold and an inner mold, with the outer mold sleeved over the inner mold; the outer mold includes a rigid roller and at least two mold teeth, with the mold teeth located on the side of the rigid roller away from the inner mold, and the mold teeth are used to emboss the photoresist of the pixel definition layer to obtain a groove corresponding to the pixel opening; The inner mold is a hollow elastic roller, and the hollow space of the elastic roller can be inflated to support and fix the outer mold. The conveying unit includes a pressure regulating roller, and the line connecting the center of the embossing mold and the center of the pressure regulating roller is perpendicular to the conveyor belt. The pressure regulating roller is configured to move toward or away from the embossing mold to dynamically adjust the embossing pressure.

2. The preparation apparatus according to claim 1, characterized in that, The conveyor belt is fitted over the pressure regulating roller.

3. The preparation apparatus according to claim 1, characterized in that, The conveyor wheel includes a drive roller and a conveyor belt tensioning roller. The drive roller is used to convey the conveyor belt, and the conveyor belt tensioning roller can move along the conveying plane of the conveyor belt to adjust the tension of the conveyor belt.

4. The preparation apparatus as described in claim 3, characterized in that, The transmission roller includes one driving transmission roller and two driven transmission rollers. The driving transmission roller is located at the starting end of the conveyor belt, the conveyor belt tensioning roller is located at the ending end of the conveyor belt, and the driven transmission rollers are located between the driving transmission roller and the conveyor belt tensioning roller.

5. A method for preparing a pixel definition layer, characterized in that, include: A substrate is provided, the substrate including electrodes located on the surface of the substrate; A pixel definition layer photoresist is coated on the substrate, and the pixel definition layer photoresist covers the electrode; The substrate is pressed into a groove corresponding to the pixel opening by the fabrication apparatus as described in any one of claims 1 to 4; The photoresist in the pixel definition layer is cured; The photoresist in the pixel definition layer is etched and thinned to obtain the pixel opening, which exposes the electrode.

6. The preparation method according to claim 5, characterized in that, The operation of curing the photoresist of the pixel definition layer is completed within 10 minutes after the groove imprinting is completed.

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