A vibration sensor

Abstract

The present specification provides a vibration sensor, comprising: a vibration receiver comprising a shell and a vibration unit, the vibration unit being located in an acoustic cavity and separating the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the shell is configured to generate vibration based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal; the vibration unit comprises a mass element and an elastic element, the area of the side of the mass element facing away from the acoustic transducer is smaller than the area of the side of the mass element close to the acoustic transducer, and the elastic element surrounds the side wall connected to the mass element. The present specification increases the contact area of the mass element and the elastic element, improves the connection strength between the elastic element and the mass element, and improves the structural stability of the vibration sensor.

Description

[0001] Priority information

[0002] This specification requires the international specification with specification number PCT / CN2020 / 140180 filed on December 28, 2020 and the international specification with specification number PCT / CN2021 / 107978 filed on July 22, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This specification relates to the field of acoustic technology, and in particular to a vibration sensor. Background Art

[0004] A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. Currently, vibration sensors can be used as bone conduction microphones. They can detect the vibration signals transmitted through the skin when a person speaks, thereby detecting speech signals while being immune to interference from external noise. However, the structural instability of the vibration components in current vibration sensors leads to low product yields during production and low sensitivity during operation.

[0005] Therefore, it is desired to provide a vibration sensor with stronger structural stability and higher sensitivity. Summary of the Invention

[0006] One of the embodiments of this specification provides a vibration sensor, which includes: a vibration receiver, including a shell and a vibration unit, the shell forming an acoustic cavity, the vibration unit is located in the acoustic cavity and separates the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer, acoustically connected to the first acoustic cavity, wherein: the shell is configured to generate vibration based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal; the vibration unit includes a mass element and an elastic element, the area of ​​the mass element facing away from the acoustic transducer is smaller than the area of ​​the mass element close to the acoustic transducer, and the elastic element is connected to the side wall of the mass element.

[0007] One of the embodiments of this specification also provides a vibration sensor, including a vibration receiver, including a shell and a vibration unit, the shell forming an acoustic cavity, the vibration unit being located in the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer acoustically connected to the first acoustic cavity, wherein: the shell is configured to generate vibration based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal; the vibration unit includes a mass element and an elastic element, the mass element includes a groove, and the groove is located on the side of the mass element along its vibration direction.

[0008] Compared with the prior art, the beneficial effects of this specification are as follows:

[0009] (1) In the embodiments of this specification, the area of ​​the mass element on the side facing away from the acoustic transducer is smaller than the area of ​​the mass element on the side facing the acoustic transducer. Under the condition that the thickness of the mass element along the vibration direction is the same, the contact area between the mass element and the elastic element is increased relative to the contact area between the columnar (for example, cylindrical or prismatic) mass element and the elastic element. The increased connection area between the elastic element and the mass element can improve the connection strength between the elastic element and the mass element, improve the structural stability of the vibration sensor, and improve the product yield. (2) By improving the connection strength between the elastic element and the mass element, the sealing of the first acoustic cavity can be improved, and the formation of gaps at the connection between the elastic element and the mass element can be effectively prevented, thereby avoiding leakage of gas in the first acoustic cavity and making the sound pressure change of the first acoustic cavity in response to the vibration of the shell more sensitive, thereby improving the sensitivity of the vibration sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0011] Figure 1 is an exemplary framework diagram of a vibration sensor according to some embodiments of this specification;

[0012] Figure 2A is an exemplary structural diagram of a vibration sensor according to some embodiments of this specification;

[0013] Figure 2B is a schematic structural diagram of a mass element according to some embodiments of this specification;

[0014] Figure 3 is a schematic structural diagram of a vibration unit according to some embodiments of this specification;

[0015] Figure 4 is a schematic structural diagram of a vibration unit according to some embodiments of this specification;

[0016] Figure 5 A schematic structural diagram of a mass element according to some embodiments of this specification;

[0017] Figure 6A A schematic structural diagram of a vibration unit according to some embodiments of this specification;

[0018] Figure 6B A schematic structural diagram of a vibration unit according to some embodiments of this specification;

[0019] Figure 6C A schematic structural diagram of a vibration unit according to some embodiments of this specification;

[0020] Figure 6D Schematic diagram of the structure of the vibration unit shown in some embodiments of this specification. DETAILED DESCRIPTION

[0021] To more clearly illustrate the technical solutions of the embodiments of this specification, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this specification. Those skilled in the art can apply this specification to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0022] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are a method for distinguishing different components, elements, parts, portions, or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0023] The words "first", "second" and similar terms used in this specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not indicate a quantitative limitation, but rather indicate the presence of at least one. Unless otherwise indicated, words such as "front", "back", "lower" and / or "upper" are used for ease of description only and are not limited to one position or one spatial orientation. Generally speaking, the terms "include" and "comprising" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements.

[0024] The embodiments of this specification describe a vibration sensor. In some embodiments, the vibration sensor may include a vibration receiver and an acoustic transducer. In some embodiments, the vibration receiver may include a shell and a vibration unit, the shell may form an acoustic cavity, the vibration unit may be located in the acoustic cavity, and the acoustic cavity may be separated into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The shell may be configured to generate vibrations based on an external vibration signal (for example, a signal generated by vibrations of bones, skin, etc. when the user speaks). The vibration unit may change the sound pressure of the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal.

[0025] In some embodiments, the vibration unit may include a mass element and an elastic element. Wherein, the area of ​​the mass element away from the acoustic transducer is smaller than the area of ​​the mass element close to the acoustic transducer. Under the same thickness conditions, the contact area between the mass element and the elastic element in the embodiment of this specification is increased relative to the contact area between the columnar (for example, cylindrical or prismatic) mass element and the elastic element. When the elastic element is connected to the mass element around the mass element, the connection area between the elastic element and the mass element increases, thereby improving the connection strength between the elastic element and the mass element, improving the stability of the vibration component structure, and improving the product yield. Furthermore, by increasing the connection strength between the elastic element and the mass element and improving the sealing of the first acoustic cavity, it is possible to effectively prevent the appearance of a gap at the connection between the elastic element and the mass element, so that the gas in the first acoustic cavity leaks to the second acoustic cavity, thereby making the sound pressure change of the first acoustic cavity in response to the vibration of the shell more sensitive, thereby improving the sensitivity of the vibration sensor.

[0026] Figure 1 FIG. 1 is an exemplary frame diagram of a vibration sensor 100 according to some embodiments of the present specification. Figure 1 As shown, the vibration sensor 100 may include a vibration receiver 110 and an acoustic transducer 120. In some embodiments, the vibration receiver 110 and the acoustic transducer 120 may be physically connected. The physical connection in this specification may include welding, clamping, gluing, or integral molding, or any combination thereof.

[0027] In some embodiments, the vibration sensor 100 can be used as a bone conduction microphone. When used as a bone conduction microphone, the vibration sensor 100 can receive vibration signals generated by bones, skin, and other tissues when the user speaks, and convert the vibration signals into electrical signals containing sound information. Since almost no sound (or vibration) in the air is collected, the vibration sensor 100 can be immune to the influence of ambient noise (for example, the voices of other people talking around, the noise generated by passing vehicles) to a certain extent, and is suitable for use in noisy environments to collect voice signals when the user speaks. By way of example only, noisy environments may include noisy restaurants, conference halls, streets, near roads, fire scenes, and the like. In some embodiments, the vibration sensor 100 can be applied to headphones (for example, air conduction headphones and bone conduction headphones), hearing aids, hearing aids, glasses, helmets, augmented reality (AR) devices, virtual reality (VR) devices, etc., or any combination thereof. For example, the vibration sensor 100 can be applied to headphones as a bone conduction microphone.

[0028] The vibration receiver 110 can be configured to receive and transmit vibration signals. In some embodiments, the vibration receiver 110 includes a shell and a vibration unit. The shell can be a hollow structure, and some components of the vibration sensor 100 (e.g., the vibration unit) can be located inside the shell. For example, the shell can form an acoustic cavity, and the vibration unit can be located in the acoustic cavity. In some embodiments, the vibration unit can be located in the acoustic cavity and separate the acoustic cavity formed by the shell into a first acoustic cavity and a second acoustic cavity. The acoustic cavity can be acoustically connected to the acoustic transducer 120. Acoustic communication can be a communication method that can transmit sound pressure, sound waves, or vibration signals.

[0029] The acoustic transducer 120 can generate an electrical signal containing sound information based on the sound pressure change in the first acoustic cavity. In some embodiments, the vibration signal can be received via the vibration receiver 110 and cause the air pressure inside the first acoustic cavity to change, and the acoustic transducer 120 can generate an electrical signal based on the air pressure change inside the first acoustic cavity. In some embodiments, when the vibration sensor 100 is working, the shell can vibrate based on an external vibration signal (for example, a signal generated by the vibration of the bones, skin, etc. when the user speaks). The vibration unit can vibrate in response to the vibration of the shell and transmit the vibration to the acoustic transducer 120 through the first acoustic cavity. For example, the vibration of the vibration unit can cause a volume change of the first acoustic cavity, thereby causing a change in the air pressure in the first acoustic cavity, and converting the change in the air pressure in the cavity into a change in the sound pressure in the cavity. The acoustic transducer 120 can detect the sound pressure change in the first acoustic cavity and generate an electrical signal based on this. For example, the acoustic transducer 120 may include a diaphragm. The sound pressure in the first acoustic cavity changes and acts on the diaphragm, causing the diaphragm to vibrate (or deform). The acoustic transducer 120 converts the vibration of the diaphragm into an electrical signal. Figures 2A-6D Detailed description.

[0030] It should be noted that the above description of vibration sensor 100 and its components is for illustration and purposes only and does not limit the scope of this specification. Those skilled in the art will appreciate the various modifications and variations that can be made to vibration sensor 100 under the guidance of this specification. In some embodiments, vibration sensor 100 may further include other components, such as a power supply to provide electrical energy to acoustic transducer 120. Such modifications and variations remain within the scope of this specification.

[0031] Figure 2A FIG. 2 is an exemplary structural diagram of a vibration sensor 200 according to some embodiments of this specification. Figure 2A As shown, the vibration sensor 200 may include a vibration receiver 210 and an acoustic transducer 220 , wherein the vibration receiver 210 may include a housing 211 and a vibration unit 212 .

[0032] The housing 211 may be a hollow structure. In some embodiments, the housing 211 may be connected to the acoustic transducer 220 to form a structure having an acoustic cavity. The housing 211 and the acoustic transducer 220 may be physically connected. In some embodiments, the vibration unit 212 may be located within the acoustic cavity, and the vibration unit 212 may separate the acoustic cavity into a first acoustic cavity 213 and a second acoustic cavity 214. In some embodiments, the vibration unit 212 may form a first acoustic cavity 213 with the acoustic transducer 220, and the vibration unit 212 may form a second acoustic cavity 214 with the housing 211.

[0033] The vibration sensor 200 can convert an external vibration signal into an electrical signal. As an example only, the external vibration signal can include a vibration signal when a person speaks, a vibration signal generated by the skin moving with the human body or by the operation of other devices close to the skin (such as a speaker), and a vibration signal generated by an object or air in contact with the vibration sensor 200, or any combination thereof. When the vibration sensor 200 is working, the external vibration signal can be transmitted to the vibration unit 212 through the shell 211. The mass element 2121 of the vibration unit 212 vibrates in response to the vibration of the shell 211 under the drive of the elastic element 2122. The vibration of the mass element 2121 can cause a change in the volume of the first acoustic cavity 213, thereby causing a change in the air pressure in the first acoustic cavity 213, and converting the change in the air pressure in the cavity into a change in the sound pressure in the cavity. The acoustic transducer 220 can detect the change in the sound pressure of the first acoustic cavity 213 and convert it into an electrical signal. For example, the acoustic transducer 220 may include a sound pickup hole 2221, and the sound pressure change in the first acoustic cavity 213 may act on the diaphragm of the acoustic transducer 220 through the sound pickup hole 2221, causing the diaphragm to vibrate (or deform) to generate an electrical signal. Further, the electrical signal generated by the acoustic transducer 220 can be transmitted to an external electronic device. As an example only, the acoustic transducer 220 may include an interface 223. The interface may be wired (e.g., electrically connected) or wirelessly connected to the internal components (e.g., a processor) of the external electronic device. The electrical signal generated by the acoustic transducer 220 may be transmitted to the external electronic device through the interface in a wired or wireless manner. In some embodiments, the external electronic device may include a mobile device, a wearable device, a virtual reality device, an augmented reality device, etc., or any combination thereof. In some embodiments, the mobile device may include a smartphone, a tablet computer, a personal digital assistant (PDA), a gaming device, a navigation device, etc., or any combination thereof. In some embodiments, the wearable device may include a smart bracelet, headphones, hearing aids, a smart helmet, a smart watch, smart clothing, a smart backpack, a smart accessory, etc., or any combination thereof. In some embodiments, the virtual reality device and / or augmented reality device may include a virtual reality helmet, virtual reality glasses, a virtual reality patch, an augmented reality helmet, augmented reality glasses, an augmented reality patch, or the like, or any combination thereof. For example, the virtual reality device and / or augmented reality device may include Google Glass, Oculus Rift, Hololens, Gear VR, or the like.

[0034] In some embodiments, the shape of the shell 211 can be a three-dimensional structure of regular or irregular shape such as a cuboid, a cylinder, or a truncated cone. In some embodiments, the material of the shell can include metal (e.g., copper, stainless steel), alloy, plastic, etc. or any combination thereof. In some embodiments, the shell can have a certain thickness to ensure sufficient strength, so as to better protect the components of the vibration sensor 100 (e.g., the vibration unit 212) disposed in the shell. In some embodiments, the first acoustic cavity 213 can be acoustically connected to the acoustic transducer 220. As an example only, the acoustic transducer 220 can include a pickup hole 2221, and the acoustic transducer 220 can be acoustically connected to the first acoustic cavity 213 through the pickup hole 2221. It should be noted that, as Figure 2A The depiction of a single sound pickup hole 2221 is for illustration only and is not intended to limit the scope of the present invention. It should be understood that the vibration sensor 200 may include more than one sound pickup hole 2221. For example, the vibration sensor 200 may include multiple sound pickup holes arranged in an array, wherein the sound pickup holes may be located at any position of the acoustic transducer 220 corresponding to the first acoustic cavity 213.

[0035] In some embodiments, the vibration unit 212 may include a mass element 2121 and an elastic element 2122. In some embodiments, the mass element 2121 and the elastic element 2122 may be physically connected, such as by gluing. For example, the elastic element 2122 may be made of a material with a certain degree of viscosity and directly bonded to the mass element 2121.

[0036] In some embodiments, the elastic element 2122 can be made of a high-temperature resistant material, allowing the elastic element 2122 to maintain its performance during the manufacturing process of the vibration sensor 200. In some embodiments, the Young's modulus and shear modulus of the elastic element 2122 remain unchanged or change very little (e.g., within 5%) when exposed to temperatures between 200°C and 300°C. The Young's modulus can be used to characterize the elastic element 2122's ability to deform under tension or compression, while the shear modulus can be used to characterize the elastic element 2122's ability to deform under shear. In some embodiments, the elastic element 2122 can be made of a material with good elasticity (i.e., easily elastically deformable) so that the vibration unit 212 can vibrate in response to the vibration of the housing 211. By way of example only, the material of the elastic element 2122 can include silicone rubber, silicone gel, silicone sealant, or any combination thereof. To ensure good elasticity of the elastic element 2122, in some embodiments, the Shore hardness of the elastic element 2122 can be less than 50HA. Preferably, the Shore hardness of the elastic element 2122 can be less than 45HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 40 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 35 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 30 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 25 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 20 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 15 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 10 HA. More preferably, the Shore hardness of the elastic element 2122 may be less than 5 HA.

[0037] In some embodiments, the material of the mass element 2121 may be a material with a density greater than a certain density threshold (e.g., 6 g / cm 3) material, such as metal. As an example only, the material of the mass element 2121 may include metals or alloys such as lead, copper, silver, tin, stainless steel, and stainless iron, or any combination thereof. At the same mass, the higher the density of the material of the mass element 2121, the smaller the size. Therefore, using a material with a density greater than a certain density threshold to make the mass element 2121 can reduce the size of the vibration sensor 200 to a certain extent. In some embodiments, the material density of the mass element 2121 has a significant impact on the resonance peak and sensitivity of the frequency response curve of the vibration sensor 200. At the same volume, the greater the density of the mass element 2121 and the greater its mass, the resonance peak of the vibration sensor 200 shifts to a lower frequency. Since the frequency of the vibration signal (e.g., bone conduction sound) is low, by increasing the mass of the mass element 2121, the sensitivity of the vibration sensor 200 in the lower frequency band (e.g., 20 Hz-6000 Hz) can be improved. In some embodiments, the material density of the mass element 2121 is greater than 6 g / cm 3 In some embodiments, the material density of mass element 2121 is greater than 7 g / cm 3 In some embodiments, the material density of the mass element 2121 is 7 to 20 g / cm 3 Preferably, the material density of the mass element 2121 is 7 to 15 g / cm 3 More preferably, the material density of the mass element 2121 is 7-10 g / cm 3 More preferably, the material density of the mass element 2121 is 7-8 g / cm 3 In some embodiments, the mass element 2121 and the elastic element 2122 can be made of different materials and assembled (e.g., glued) together to form the vibration unit 212. In some embodiments, the mass element 2121 and the elastic element 2122 can also be made of the same material and formed into an integral part to form the vibration unit 212.

[0038] In order to ensure that the connection area between the mass element 2121 and the elastic element 2122 is large and improve the structural stability, the mass element 2121 is connected to the elastic element 2122 along its vibration direction (such as Figure 2AThe thickness of the mass element 2121 (as shown) should not be too thin. In some embodiments, the thickness of the mass element 2121 along its vibration direction may be greater than 60 μm. If the mass element 2121 is too thick, it may contact the substrate or housing 211 of the acoustic transducer 220 during vibration, thereby affecting the acoustic conversion effect of the vibration sensor 20. Therefore, the thickness of the mass element 2121 along its vibration direction should not be too thick. In some embodiments, the thickness of the mass element 2121 along its vibration direction may be less than 1150 μm. In some embodiments, to improve the structural stability of the vibration sensor 200 and ensure the acoustic conversion effect, the thickness of the mass element 2121 along its vibration direction may be 70 μm-900 μm. In some embodiments, to further increase the contact area between the mass element 2121 and the elastic element 2122, the thickness of the mass element 2121 along its vibration direction may be 90 μm-700 μm. In some embodiments, to further facilitate the processing and manufacturing of the mass element 2121, the thickness of the mass element 2121 along its vibration direction may be 100 μm-150 μm.

[0039] In some embodiments, the elastic element 2122 can be connected to the circumferential surface of the mass element 2121 in a surrounding manner. For example, when the mass element 2121 is a columnar structure (cylinder or prism), the circumferential surface of the mass element 2121 is the side surface of the columnar structure. For another example, when the mass element 2121 is two columnar structures of different sizes (e.g., a first mass element 21211 and a second mass element 21212), the circumferential surface of the mass element 2121, in addition to the side surfaces of the first mass element 21211 and the second mass element 21212, also includes an area of ​​the second mass element 21212 not covered by the first mass element 21211 in a direction perpendicular to the vibration direction of the mass element 2121. In this way, the connection area between the two columnar mass elements 2121 of different sizes and the elastic element 2122 is larger than that between the mass element 2121 and the elastic element 2122 of a single columnar structure. The side of the mass element 2121 facing away from the acoustic transducer 220 and the side of the mass element 2121 proximal to the acoustic transducer 220 are approximately perpendicular to the vibration direction and are used to define the second acoustic cavity 214 and the first acoustic cavity 213, respectively. Because the elastic element 2122 is connected to the circumferential surface of the mass element 2121 in a circumferential manner, during the vibration of the vibration unit 212 along the vibration direction, the momentum of the mass element 2121 is converted into a force acting on the elastic element 2122, causing the elastic element 2122 to undergo shear deformation. Compared to tensile and compressive deformation, shear deformation reduces the spring constant of the elastic element 2122, which lowers the resonant frequency of the vibration sensor 200, thereby increasing the vibration amplitude of the mass element 2121 in a lower frequency range (e.g., 20 Hz-6000 Hz) during the vibration of the vibration unit 212, thereby improving the sensitivity of the vibration sensor 200. In some embodiments, the elastic element 2122 fits tightly against the peripheral surface of the mass element 2121, which can ensure the sealing of the first acoustic cavity 213, so that the air pressure change in the first acoustic cavity 213 is only related to the vibration amplitude of the vibration unit 212, thereby making the sound pressure change in the first acoustic cavity 213 more obvious and effective.

[0040] In some embodiments, the elastic element 2122 may have a tubular structure. Accordingly, the inner wall shape of the tubular elastic element 2122 may be adapted to the shape of the lateral surface of the mass element 2121. This means that at different heights along the vibration direction, the inner wall of the elastic element 2122 and the mass element 2121 have the same cross-sectional shape. The inner wall of the elastic element 2122 refers to the side wall where the tubular structure and the mass element 2121 meet. For example, if the mass element 2121 has a stepped shape, the connection between the elastic element 2122 and the mass element 2121 may have a stepped shape that matches the mass element 2121. In some embodiments, the cross-section of the mass element 2121 perpendicular to its vibration direction may have a regular or irregular shape, such as a triangle, a quadrilateral, a circle, an ellipse, a sector, a rounded rectangle, or the like. This specification does not limit the shape of the outer wall of the tubular structure of the elastic element 2122; the outer wall of the elastic element 2122 may be the side wall facing away from the inner wall where the elastic element 2122 meets the mass element 2121. For example, the shape of the outer wall of the tubular structure of the elastic element 2122 may include a cylindrical shape, an elliptical cylindrical shape, a conical shape, a rounded rectangular cylindrical shape, a rectangular cylindrical shape, a polygonal cylindrical shape, an irregular cylindrical shape, etc. or any combination thereof.

[0041] In some embodiments, the elastic element 2122 may extend toward and connect to the acoustic transducer 220. For example, Figure 2A As shown, one end of the elastic element 2122 extending toward the acoustic transducer 220 may be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 may be connected physically, for example, by gluing or welding. In some embodiments, the elastic element 2122 may also be connected to the acoustic transducer 220 by a connector ( Figure 2A The connector is connected to the acoustic transducer 220, wherein one end of the connector is connected to the elastic element 2122, and the other end of the connector is connected to the acoustic transducer 220. In some embodiments, the elastic element 2122 and the housing 211 may be in direct contact or spaced apart. For example, Figure 2A As shown, a gap may exist between the elastic element 2122 and the housing 211. The size of the gap between the elastic element 2122 and the housing 211 can be adjusted by the designer based on the size of the vibration sensor 200. Compared to direct contact between the elastic element 2122 and the housing 211, the presence of a gap between the elastic element 2122 and the housing 211 can reduce the equivalent stiffness of the elastic element 2122 and increase the elasticity of the elastic element 2122, thereby increasing the vibration amplitude of the mass element 2121 in a lower frequency range (e.g., 20 Hz-6000 Hz) during the vibration of the vibration unit 212, thereby improving the sensitivity of the vibration sensor 200.

[0042] In some embodiments, the area of ​​the side of the mass element 2121 facing away from the acoustic transducer 220 is smaller than the area of ​​the side of the mass element 2121 facing closer to the acoustic transducer 220. In some embodiments, the areas of multiple cross sections of the mass element 2121 perpendicular to the vibration direction can be different. For example, the mass element 2121 can have a stepped structure. To increase the connection area between the elastic element 2122 and the peripheral surface of the mass element 2121, thereby increasing the connection strength between the elastic element 2122 and the mass element 2121, in some embodiments, the areas of multiple cross sections of the mass element 2121 perpendicular to the vibration direction gradually increase from the side of the mass element 2121 facing away from the acoustic transducer 220 to the side of the mass element 2121 facing closer to the acoustic transducer 220. In some embodiments, the areas of multiple cross sections of the mass element 2121 perpendicular to the vibration direction can be partially the same. For example, the peripheral side of the mass element 2121 can have a stepped structure. When the thickness of the mass element 2121 along its vibration direction is constant, the areas of multiple cross sections on the mass element 2121 perpendicular to the vibration direction are different, which can increase the circumferential surface area of ​​the mass element 2121, thereby increasing the connection area between the elastic element 2122 and the mass element 2121, improving the connection strength between the elastic element 2122 and the mass element 2121, improving the structural stability, strengthening the sealing of the first acoustic cavity, and making the sound pressure change of the first acoustic cavity in response to the vibration of the shell more significant, thereby improving the sensitivity of the vibration sensor.

[0043] In some embodiments, the peripheral surface of the mass element 2121 may have at least one stepped structure. Figure 2B FIG. 2 is a schematic diagram of the structure of the mass element 2121 according to some embodiments of this specification. Figure 2A and Figure 2BThe mass element 2121 may include a first mass element 21211 and a second mass element 21212. The second mass element 21212 is located near the acoustic transducer 220. The first mass element 21211 is located on the side of the second mass element 21212 facing away from the second mass element 21212. The cross-sectional area of ​​the first mass element 21211 perpendicular to the vibration direction of the mass element 2121 is smaller than the cross-sectional area of ​​the second mass element 21212 perpendicular to the vibration direction of the mass element 2121. This creates a stepped structure around the outer edges of the first and second mass elements 21211 and 21212. For illustrative purposes only, the lateral surface of the mass element 2121 may include sidewall a of the first mass element 21211, region b of the second mass element 21212, and sidewall c. Sidewall a, region b, and sidewall c form a stepped structure. The stepped structure can increase the area of ​​the lateral surface of the mass element 2121. Accordingly, the area of ​​the connection between the elastic element 2122 and the side wall of the mass element 2121 is larger, which is conducive to the close fit between the mass element 2121 and the elastic element 2122, thereby achieving a good seal between the elastic element 2122 and the mass element 2121, which is conducive to ensuring the sealing of the first acoustic cavity 213, so that the air pressure changes in the first acoustic cavity 213 are not affected by the sealing. In some embodiments, the first mass element 21211 and the second mass element 21212 can be connected and fixed by physical means, for example, by gluing (using a viscous colloid such as epoxy glue, silicone sealant, etc.), or they can be integrally formed. In some embodiments, the side of the first mass element 21211 close to the acoustic transducer 220 and the side of the second mass element 21212 away from the acoustic transducer 220 can be physically connected and fixed.

[0044] In some embodiments, the side surface of the first mass element 21211 away from the acoustic transducer 220 is perpendicular to the vibration direction thereof, and the side surface of the second mass element 2121 close to the acoustic transducer 220 is perpendicular to the vibration direction thereof. In some embodiments, the closer to the second mass element 2121, the larger the area of ​​the cross section of the first mass element 21211 perpendicular to the vibration direction thereof, and the closer to the acoustic transducer 220, the larger the area of ​​the cross section of the second mass element 21212 perpendicular to the vibration direction thereof. In some embodiments, the first mass element 21211 can be arranged concentrically with the second mass element 21212, or can be arranged non-concentrically with the second mass element 21212. In some embodiments, the sidewall shape (i.e., the cross section perpendicular to the vibration direction) of the first mass element 21211 and / or the second mass element 21212 can include a cylindrical shape, an elliptical cylindrical shape, a trapezoidal shape, a rounded rectangular column (e.g., Figure 2BAs shown in FIG), a rectangular column, a polygonal column, an irregular column (for example, a column with multiple stepped surfaces), etc. or any combination thereof. In some embodiments, the sidewall shape of the first mass element 21211 and the second mass element 21212 can be the same, for example, Figure 2B As shown, the sidewalls of the first mass element 21211 and the second mass element 21212 are both formed into rounded rectangular columns. In some embodiments, the sidewalls of the first mass element 21211 and the second mass element 21212 may have different shapes. For example, the sidewalls of the first mass element 21211 may be cylindrical, while the sidewalls of the second mass element 21212 may be rounded rectangular columns. In some embodiments, the material of the first mass element 21211 and the second mass element 21212 may be the same or different. By way of example only, the materials of the first mass element 21211 and the second mass element 21212 may include metals or alloys such as lead, copper, silver, tin, stainless steel, and ferrous iron, or any combination thereof. In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 may be greater than 6 g / cm 3 In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 can be greater than 7 g / cm 3 .

[0045] In some embodiments, the first mass element 21211 is located in the middle region of the second mass element 21212, such that a specific distance d (e.g., 10 μm to 1000 μm) is defined between the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212. Specifically, a specific distance d is defined between the side edge of the first mass element 21211 proximal to the acoustic transducer 220 and the side edge of the second mass element 21212 distal to the acoustic transducer 220. In some embodiments, the distance d between the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212 can be uniform throughout. For example, when the first mass element 21211 and the second mass element 21212 are concentrically arranged, the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212 are both cylindrical structures, and the distance d between the sidewalls of the first mass element 21211 and the sidewalls of the second mass element 21212 is uniform throughout. In some embodiments, the distance d between the sidewalls of the first mass element 21211 and the second mass element 21212 may not be uniform throughout. For example, if the sidewalls of the first mass element 21211 are cylindrical and the sidewalls of the second mass element 21212 are rectangular, the distance between the edge of the sidewall of the second mass element 21212 and the sidewall of the first mass element 21211 may not be uniform. In some embodiments, to ensure the connection area between the elastic element and region b of the second mass element 21212 and enhance structural stability, the specific distance d may be greater than 10 μm. In some embodiments, to increase the mass of the first mass element 21211 and enhance the sensitivity of the vibration sensor 200, the specific distance d may be less than 500 μm. In some embodiments, to ensure the connection area between the elastic element and region b of the second mass element 21212, while preventing the mass of the first mass element 21211 from being too small, thereby reducing the sensitivity of the vibration sensor 200, the specific spacing d may be 20 μm to 450 μm. More preferably, the specific spacing d may be 30 μm to 400 μm. More preferably, the specific spacing d may be 40 μm to 350 μm. More preferably, the specific spacing d may be 50 μm to 300 μm. More preferably, the specific spacing d may be 60 μm to 250 μm. More preferably, the specific spacing d may be 70 μm to 200 μm. More preferably, the specific spacing d may be 80 μm to 150 μm. More preferably, the specific spacing d may be 90 μm to 100 μm.

[0046] In some embodiments, the thickness of the first mass element 21211 along its vibration direction can be greater than the thickness of the second mass element 21212 along its vibration direction. Increasing the thickness of the first mass element 21211 not only increases the overall mass of the mass element 2121, but also increases the connection area between the elastic element 2122 and the sidewall a of the first mass element 21211, thereby improving the connection strength between the elastic element 2122 and the mass element 2121. In some embodiments, the thickness of the first mass element 21211 along its vibration direction can be 50 μm to 1000 μm, and the thickness of the second mass element 21212 along its vibration direction can be 10 μm to 150 μm. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 200 μm to 400 μm, and the thickness of the second mass element 21212 along its vibration direction can be 60 μm to 90 μm.

[0047] It should be noted that the mass element 2122 is not limited to Figure 2A and Figure 2B The structure shown includes the first mass element 21211 and the second mass element 21212, and may further include a third mass element, a fourth mass element, or more mass elements. When the mass element 2122 includes two or more mass elements, a stepped structure may be formed between the sidewalls of each two mass elements.

[0048] In some embodiments, the elastic element 2122 may include a first elastic portion 21221 and a second elastic portion 21222. The first elastic portion 21221 surrounds and connects to the sidewall of the first mass element 21211, while the second elastic portion 21222 surrounds and connects to the sidewall of the second mass element 21212. The first elastic portion 21221 and the second elastic portion 21222 may be physically connected, such as by gluing or welding. In some embodiments, the first elastic portion 21221 and the second elastic portion 21222 may be integrally formed. In some embodiments, the first elastic portion 21221 closely aligns with the sidewall of the first mass element 21211, while the second elastic portion 21222 closely aligns with the sidewall of the second mass element 21212, with the first elastic portion 21221 and the second elastic portion 21222 being hermetically connected. In some embodiments, the first elastic portion 21221 may have its ends connected to the sidewall of the first mass element 21211 and the second elastic portion 21222, respectively. In some embodiments, the ends of the first elastic portion 21221 can be sealedly connected to the sidewall of the first mass element 21211 and the second elastic portion 21222, respectively. The first elastic portion 21221 can include a first side surface 21221a and a second side surface 21221b. The first side surface 21221a is connected to the sidewall of the first mass element 21211, and the second side surface 21221b is connected to the surface of the second mass element 21212 exposed to the second acoustic cavity 214. The second side surface 21221b of the first elastic portion 21221 can be connected to the stepped surface (i.e., region b) of the second mass element 21212. The stepped surface of the second mass element 21212 provides support for the first elastic portion 21221. The support provided by the stepped surface of the second mass element 21212 and the first elastic portion 21221 can ensure a tighter connection between the first elastic portion 21221 and the second mass element 21212, thereby increasing the connection strength between the first elastic portion 21221 and the second mass element 21212. The second side surface 21221b of the first elastic portion 21221 can be connected to the second elastic portion 21222. The sidewall of the second mass element 21212 is connected to the second elastic portion 21222. In some embodiments, the second elastic portion 21222 extends toward the acoustic transducer 220 and is connected to the acoustic transducer 220 (e.g., the substrate 222). In some embodiments, the ends of the second elastic portion 21222 can be connected to the sidewall of the second mass element 21212 and the acoustic transducer 220, respectively. One end of the second elastic portion 21222 connected to the sidewall of the second mass element 21212 can also be connected to the first elastic portion 21221.In some embodiments, the shape of the first side surface 21221a of the first elastic portion 21221 is adapted to the side wall shape of the first mass element 21211. For example, the cross-sectional shape of the first mass element 21211 perpendicular to its vibration direction can be a triangle, a quadrilateral, a circle, an ellipse, a fan-shaped, a rounded rectangle, or other regular or irregular shapes. At each height along the vibration direction of the first mass element 21211, the cross-sectional shape of the first side surface 21221a perpendicular to the vibration direction of the first mass element 21211 is the same as the cross-sectional shape of the first mass element 21211. In some embodiments, the side shape of the second elastic portion 21222 near the side wall of the second mass element 21212 is adapted to the side wall shape of the second mass element 21212. For example, the cross-sectional shape of the second mass element 21212 perpendicular to its vibration direction can be a triangle, quadrilateral, circle, ellipse, sector, rounded rectangle, or other regular or irregular shape. At each height in the vibration direction, the cross-sectional shape of the side of the second elastic portion 21222 near the side wall of the second mass element 21212 perpendicular to the vibration direction is the same as the cross-sectional shape of the side wall of the second mass element 21212 perpendicular to the vibration direction. This specification does not limit the side shape of the first elastic portion 21221 away from the side wall of the first mass element 21211 or the side shape of the second elastic portion 21222 away from the side wall of the second mass element 21212. For example, their side shapes can include a cylinder, an elliptical cylinder, a cone, a rounded rectangular cylinder, a rectangular cylinder, a polygonal cylinder, an irregular cylinder, or any combination thereof. In some embodiments, the materials of the first elastic part 21221 and the second elastic part 21222 may be the same or different. As an example only, the material of the first elastic part 21221 or the second elastic part 21222 may include silicone rubber, silicone gel, silicone sealant, etc. or any combination thereof.

[0049] In some embodiments, the mass element 2121 may further include a first hole portion 21213, which connects the first acoustic cavity 213 and the second acoustic cavity 214. The first hole portion 21213 may penetrate the mass element 2121 and allow the gas in the first acoustic cavity 213 and the second acoustic cavity 214 to circulate, thereby balancing the pressure changes in the first acoustic cavity 213 and the second acoustic cavity 214 caused by temperature changes during the preparation process of the vibration sensor 200 (for example, during reflow soldering), thereby reducing or preventing damage to the components of the vibration sensor 200 caused by the pressure changes, such as cracking, deformation, etc.

[0050] In some embodiments, the first hole 21213 can be a single hole. To reduce the damping generated by the gas inside the second acoustic cavity 214 and the resistance to vibration of the vibration unit 212, in some embodiments, the diameter of the single hole can be greater than 1 μm. To prevent the first hole 21213 from being too large, which would affect the air pressure changes within the first and second acoustic cavities 213 and 214 and thus affect the sensitivity of the vibration sensor 200, in some embodiments, the diameter of the single hole can be less than 50 μm. To reduce the damping generated by the gas inside the second acoustic cavity 214 and the resistance to vibration of the vibration unit 212, while ensuring the sensitivity of the vibration sensor 200, in some embodiments, the diameter of the single hole can be 2-45 μm. In some embodiments, to further facilitate processing, the diameter of the single hole can be 3-40 μm. More preferably, the diameter of the single hole can be 7-10 μm. In some embodiments, the first hole 21213 can be an array of a certain number of microholes. By way of example only, the number of microholes can be 2-10. In order to reduce the damping generated by the gas inside the second acoustic cavity 214 and reduce the resistance when the vibration unit 212 vibrates, in some embodiments, the diameter of each microhole can be greater than 0.1um. In order to prevent the size of the first hole portion 21213 from being too large, affecting the air pressure changes inside the first acoustic cavity 213 and the second acoustic cavity 214, and thus affecting the sensitivity of the vibration sensor 200, in some embodiments, the diameter of each microhole can be less than 25um. In some embodiments, in order to reduce the damping generated by the gas inside the second acoustic cavity 214 and reduce the resistance when the vibration unit 212 vibrates, while ensuring the sensitivity of the vibration sensor 200, the diameter of each microhole can be 0.5-20um. In some embodiments, in order to further facilitate processing, the diameter of each microhole can be 0.5-15um.

[0051] In some embodiments, the mass element 2121 may not be provided with the first hole portion 21213. In some embodiments, when the mass element 2121 is not provided with the first hole portion 21213, the connection strength between the mass element 2121 and the elastic element 2122 can be improved (for example, the bonding strength of the glue between the mass element 2121 and the elastic element 2122 is enhanced), thereby preventing damage to components of the vibration sensor 200 due to changes in air pressure within the first acoustic cavity 213.

[0052] In some embodiments, at least one third hole portion 2111 may be provided on the shell 211, and the third hole portion 2111 passes through the shell 211. The structure of the third hole portion 2111 is the same as or similar to the structure of the first hole portion 21213. For details, please refer to the description of the first hole portion 21213, which will not be repeated here. The third hole portion 2111 can allow the second acoustic cavity 214 to circulate with the outside gas, thereby balancing the air pressure changes inside the second acoustic cavity 214 caused by temperature changes during the preparation process of the vibration sensor 200 (for example, during the reflow soldering process), reducing or preventing damage to the components of the vibration sensor 200 caused by the air pressure changes, such as cracking, deformation, etc. In addition, when the mass element 2121 vibrates, the third hole portion 2111 can be used to reduce the damping generated by the gas inside the second acoustic cavity 214.

[0053] In some embodiments, air-conducted sound in the environment may affect the performance of vibration sensor 200. To reduce the impact of air-conducted sound in the environment, after vibration sensor 200 is manufactured, for example, after reflow soldering, the third hole 2111 in the housing can be sealed with a sealing material. By way of example only, the sealing material can include epoxy glue, silicone sealant, or any combination thereof. In some embodiments, housing 211 may not have third hole 2111.

[0054] In some embodiments, the acoustic transducer 220 may include a substrate 222. The substrate 222 may be used to secure and / or support the vibration receiver 210. In some embodiments, the substrate 222 may be disposed on the acoustic transducer 220, with the housing 211 and the substrate 222 physically connected to form an acoustic cavity. In some embodiments, the end of the elastic element 2122 extending toward the acoustic transducer 220 may be connected to the substrate 222, which may be used to secure and support the vibration unit 212. The provision of the substrate 222 allows the vibration receiver 210 to be processed, manufactured, and sold as an independent component. The vibration receiver 210 with the substrate 222 may be directly physically connected (e.g., glued) to the acoustic transducer 220 to obtain the vibration sensor 200, which simplifies the production process of the vibration sensor 200 and increases the process flexibility of the vibration sensor 200. In some embodiments, the thickness of the substrate 222 may be between 10 μm and 300 μm. Preferably, the thickness of the substrate 222 may be between 20 μm and 280 μm. More preferably, the thickness of the substrate 222 may be 30 μm to 270 μm. More preferably, the thickness of the substrate 222 may be 40 μm to 250 μm. More preferably, the thickness of the substrate 222 may be 80 μm to 90 μm. In some embodiments, the material of the substrate 222 may include metal (e.g., iron, copper, stainless steel, etc.), alloy, non-metal (plastic, rubber, resin), etc., or any combination thereof.

[0055] In some embodiments, the sound pickup hole 2221 may be located on the substrate 222 and pass through the substrate 222 along the vibration direction. The sound pressure change in the first acoustic cavity 213 may act on the acoustic transducer 220 through the sound pickup hole 2221 to generate an electrical signal.

[0056] It should be noted that the above description of vibration sensor 200 and its components is for illustration and purpose only and does not limit the scope of application of this specification. Persons skilled in the art will be able to make various modifications and alterations to vibration sensor 200 under the guidance of this specification. For example, vibration sensor 200 may include at least one first hole 21213, which may be provided through elastic element 2122. Such modifications and alterations are still within the scope of this specification.

[0057] In order to ensure that the elastic element and the mass element have a larger connection area, thereby improving the connection strength between the elastic element and the mass element, the mass element can also have other structures to meet the requirement that the area of ​​the side of the mass element facing away from the acoustic transducer is smaller than the area of ​​the side of the mass element close to the acoustic transducer. Figure 3 Schematic diagram of the structure of the vibration unit 312 according to some embodiments of this specification. Figure 3 As shown, the area of ​​the side of the mass element 3121 away from the acoustic transducer is smaller than the area of ​​the side of the mass element 3121 close to the acoustic transducer. Figure 3 In the cross section shown in FIG, the side surface connecting the edge of the mass element 312 facing away from the acoustic transducer and the edge of the mass element 312 facing closer to the acoustic transducer is an inclined surface, and the elastic element 3122 is connected to the inclined surface connecting the side of the mass element 312 facing away from the acoustic transducer and the side of the mass element 312 facing closer to the acoustic transducer, ensuring that the elastic element 3122 and the mass element 3121 have a larger connection area, thereby improving the connection strength between the elastic element 3122 and the mass element 3121.

[0058] In some embodiments, the side surface of the mass element 3121 that connects the side facing away from the acoustic transducer and the side facing the acoustic transducer can be a smooth, inclined surface. When the thickness of the mass element 3121 is the same, the inclined circumferential surface has a larger connection area with the elastic element 3122 than a circumferential surface that is perpendicular (nearly perpendicular) to the vibration direction of the mass element 3121. The inclined circumferential surface also provides support for the elastic element 3122, which in turn provides a tighter connection between the mass element 3121 and the elastic element 3122 and a higher connection strength. In some embodiments, the side surface of the mass element 3121 that connects the side facing away from the acoustic transducer and the side facing the acoustic transducer can be an inclined surface having multiple concave and convex surfaces. For example, the surface of the inclined surface can have a wavy or serrated structure. When the thickness of the mass element 3121 is the same, the inclined surface having multiple concave and convex surfaces has a larger connection area with the elastic element 3122 and provides a greater support than a smooth inclined surface. In some embodiments, in a cross section of the mass element 3121 along its vibration direction, a line connecting the edge of the mass element 3121 on the side facing away from the acoustic transducer and the edge of the mass element 3121 on the side facing the acoustic transducer forms an angle c with the vibration direction of the mass element 3121. This angle c can be 10°-80°. Setting the value range of this angle c can avoid the situation where the angle c is too small, resulting in a poor optimization effect on the connection strength between the elastic element 3122 and the mass element 3121. It can also avoid the situation where the angle c is too large, resulting in an excessively small area on the side of the mass element 3121 facing away from the acoustic transducer, thereby causing the mass of the mass element 3121 to be too small. Preferably, the angle c can be 20°-70°. More preferably, the angle c can be 30°-60°. More preferably, the angle c can be 40°-50°.

[0059] In some embodiments, the elastic element 3122 surrounds and connects to the side of the mass element 3121 that connects the side facing away from the acoustic transducer and the side of the mass element 3121 that connects to the acoustic transducer. In some embodiments, one end of the elastic element 3122 is connected to the inclined surface of the mass element 3121, and the other end of the elastic element 3122 is connected to the acoustic transducer. A first acoustic cavity 313 is formed between the side of the mass element 3121 that is close to the acoustic transducer, the elastic element 3122, and the acoustic transducer. In some embodiments, the shape of the end face where the elastic element 3122 connects to the inclined surface of the mass element 3121 is adapted to the shape of the inclined surface of the mass element 3121. For example, the edge of the connected side face is a wavy or jagged curve, and the outer edge of the end face where the elastic element 3122 connects to the connected side face is also a wavy or jagged curve. This specification does not limit the shape of the side surface of the elastic element 3122 exposed to the second acoustic cavity. For example, in the cross section of the mass element 3121 along its vibration direction, the edge of the elastic element 3122 exposed to the second acoustic cavity can be an irregular curve with multiple bumps.

[0060] In some embodiments, the mass element 3121 may further include a first hole portion 31213 that extends through the mass element 3121, allowing gas flow between the first acoustic cavity 313 and the second acoustic cavity. In some embodiments, the first hole portion 31213 may be a single hole. In some embodiments, the first hole portion 31213 may be an array of a certain number of microholes. By way of example only, the number of microholes may range from 2 to 10.

[0061] In some embodiments, the substrate 322 can be used to fix and / or support the vibration unit 312. In some embodiments, the end of the elastic element 3122 connected to the acoustic transducer can be connected to the substrate 322, so that the substrate 322 can be used to fix and support the vibration unit 312. In some embodiments, the substrate 322 can include a sound pickup hole 2221 for acoustically connecting the first acoustic cavity 313 to the acoustic transducer.

[0062] It should be noted that the above description of vibration unit 312 and its components is for illustration and purpose only and does not limit the scope of application of this specification. Those skilled in the art will appreciate the various modifications and variations to vibration unit 312 that can be made under the guidance of this specification. For example, vibration sensor 200 may include at least two elastic elements, with the elastic elements connected to one another, the elastic element proximate to the mass element connected to the mass element, and the mass element proximate to the acoustic transducer connected to the acoustic transducer. Such modifications and variations remain within the scope of this specification.

[0063] In the process of opening the first hole portion on the mass element, some components of the acoustic transducer (for example, the substrate) may be damaged. In order to prevent the opening of the first hole portion from causing damage to the acoustic transducer, in some embodiments, the mass element may include one or more second hole portions (also referred to as grooves), and the first hole portion is connected to the second hole portion. Figure 4 Schematic diagram of the structure of the vibration unit 412 according to some embodiments of this specification. Figure 4 As shown, the two ends of the elastic element 4122 are respectively connected to the side wall of the mass element 4121 and the acoustic transducer by physical means, such as gluing, and a first acoustic cavity 413 is formed between a side of the mass element 4121 close to the acoustic transducer, the elastic element 4122 and the acoustic transducer.

[0064] When the mass element 4121 is required to have a first hole 41213, machining the first hole 41213 is inconvenient due to the large overall thickness of the mass element 4121 along its vibration direction. In some embodiments, the mass element 4121 may be provided with a second hole 41214, with the first hole 41213 communicating with the second hole 41214. In some embodiments, the mass element 4121 may include one or more second holes 41214. The provision of the second holes 41214 thins the local structure of the mass element 4121, facilitating the creation of the first hole 41213 therein. This also facilitates controlling the machining force of the first hole 41213, thereby preventing damage to other components of the vibration sensor (e.g., the substrate 422 or the acoustic transducer) during machining. In some embodiments, the second hole 41214 is located on the side of the mass element 4121 along its vibration direction. For example, the second hole 41214 can be located on a side of the mass element 4121 close to or away from the substrate 422. In some embodiments, the first hole 41213 and the second hole 41214 are arranged along the vibration direction of the mass element 4121, wherein the first hole 41213 and the second hole 41214 pass through the mass element 4121. In some embodiments, the second hole 41214 can be arranged concentrically with the mass element 4121, or not. In some embodiments, the first hole 41213 can be arranged concentrically with the second hole 41214, or not.

[0065] In some embodiments, the second hole portion 41214 and / or the first hole portion 41213 may be a square hole, a polygonal hole, a circular hole, an irregular hole, or any combination thereof. This specification does not limit the hole shapes of the second hole portion 41214 and the first hole portion 41213. In some embodiments, the hole shapes of the first hole portion 41213 and the second hole portion 41214 may be the same or different. In some embodiments, both the first hole portion 41213 and the second hole portion 41214 may be single-hole structures. In some embodiments, the second hole portion 41214 may be a single-hole structure, and the first hole portion 31213 may be an array consisting of a certain number of micropores.

[0066] In some embodiments, the size of the second hole 41214 is larger than that of the first hole 41213, facilitating machining of the first hole 41213 within the second hole 41214. In some embodiments, the cross-sectional area of ​​the second hole 41214 perpendicular to the vibration direction of the mass element 4121 is larger than the cross-sectional area of ​​the first hole 41213 perpendicular to the vibration direction of the mass element 4121. When both the second hole 41214 and the first hole 41213 are circular, the diameter of the second hole 41214 can be 100 to 1600 μm, and the diameter of the first hole 41213 can be 1 to 50 μm. To facilitate the creation of the first and second holes 41213 and 41214, the diameter of the second hole 41214 can be 140 to 800 μm. More preferably, the diameter of the second hole 41214 can be 200 to 400 μm, and the diameter of the first hole 41213 can be 10 to 15 μm.

[0067] Figure 5 yes Figure 4 As shown in the structural schematic diagram of the mass element 4121, the second hole portion 41214 is arranged on the side of the mass element 4121 close to the acoustic transducer, and the first hole portion 41213 is arranged on the side of the mass element 4121 away from the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 are arranged through the mass element 4121.

[0068] Figure 6A Schematic diagram of the structure of the vibration unit 412 according to some embodiments of this specification. Figure 6A As shown, the second hole portion 41214 can also be located on the side of the mass element 4121 away from the acoustic transducer, and the first hole portion 41213 is provided on the side of the mass element 4121 close to the acoustic transducer, and the second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121. In some embodiments, the depth of the first hole portion 41213 along the vibration direction of the mass element 4121 can be greater than, less than, or equal to the depth of the second hole portion 41214 along the vibration direction of the mass element 4121, for example only. Figure 6BSchematic diagram of the structure of the vibration unit 412 according to some embodiments of this specification. Figure 6B As shown, the second hole portion 41214 is located on the side of the mass element 4121 away from the acoustic transducer, and the first hole portion 41213 is located on the side of the mass element 4121 close to the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121, and the depth of the first hole portion 41213 along the vibration direction of the mass element 4121 is greater than the depth of the second hole portion 41214 along the vibration direction of the mass element 4121. Figure 6C Schematic diagram of the structure of the vibration unit 412 according to some embodiments of this specification. Figure 6C As shown, in some embodiments, the mass element 4121 is provided with a second hole portion 41214 on both sides close to and away from the acoustic transducer, and the second hole portions 41214 on both sides of the mass element 4121 are connected through the first hole portion 41213. In some embodiments, the vibration unit 412 may include multiple stacked mass elements 4121, and the materials of the multiple layers of mass elements 4121 may be the same, not completely the same, or completely different. The first hole portion 41213 is provided through part of the mass element 4121, and the second hole portion 41214 is provided through part of the mass element 4121, and the first hole portion 41213 is connected to the second hole portion 41214. This is only an example. Figure 6D Schematic diagram of the structure of the vibration unit 412 according to some embodiments of this specification. Figure 6D As shown, the vibration unit 412 may include two layers of stacked mass elements 4121, the materials of the two layers of mass elements 4121 are different, the first hole portion 41213 is set through the mass element 4121 away from the acoustic transducer, and the second hole portion 41214 is set through the mass element 4121 close to it, and the first hole portion 41213 is connected to the second hole portion 41214.

[0069] It should be noted that the above description of the vibration unit 412 and its components is for illustration and explanation only and does not limit the scope of application of this specification. For those skilled in the art, various modifications and changes can be made to the vibration unit 412 under the guidance of this specification. For example, the second hole portion 41214 and the first hole portion 41213 can be set through the side wall of the mass element 4121. Such modifications and changes are still within the scope of this specification. It should be noted that Figure 4-6D The second hole portion 41214 shown can also be used for Figure 2A In the vibration sensor 200 shown. In addition, Figure 4-6D The mass element 4121 is only used as an example. Its specific shape and structure can be referred to Figure 2A and 2B The content will not be further elaborated here.

[0070] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

[0071] This specification also uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification may be appropriately combined.

[0072] In addition, it will be understood by those skilled in the art that various aspects of this specification may be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product or combination of substances, or any new and useful improvements thereto. Accordingly, various aspects of this specification may be performed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software may be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". In addition, various aspects of this specification may be represented as a computer product located in one or more computer-readable media, which includes computer-readable program code.

[0073] A computer storage medium may include a propagated data signal embodying the computer program code, for example, in baseband or as part of a carrier wave. The propagated signal may be in a variety of forms, including electromagnetic, optical, or any suitable combination thereof. A computer storage medium may be any computer-readable medium other than a computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to communicate, propagate, or transfer the program for use. The program code on the computer storage medium may be transmitted via any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of these.

[0074] The computer program code required for the operation of the various parts of this specification can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages. The program code can be run entirely on the user's computer, or as a stand-alone software package on the user's computer, or partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user's computer via any network, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0075] In addition, unless expressly stated in the claims, the order of the processing elements and sequences, the use of alphanumeric characters, or the use of other names described in this specification are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the spirit and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0076] Similarly, it should be noted that, in order to simplify the presentation of this specification and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this specification sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of this specification requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single disclosed embodiment.

[0077] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0078] Each patent, patent specification, patent specification publication, and other materials, such as articles, books, specifications, publications, and documents, cited in this specification is hereby incorporated by reference in its entirety. This includes historical documents that are inconsistent with or conflict with the content of this specification, as well as documents (currently or subsequently appended to this specification) that limit the broadest scope of the claims of this specification. It should be noted that if the descriptions, definitions, and / or terminology used in the accompanying materials are inconsistent with or conflict with the content of this specification, the descriptions, definitions, and / or terminology used in this specification will control.

[0079] Finally, it should be understood that the embodiments described in this specification are intended only to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly described and illustrated in this specification.

Claims

1. A vibration sensor comprising: A vibration receiver, comprising a housing and a vibration unit, wherein the housing forms an acoustic cavity, and the vibration unit is located in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; as well as an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: The housing is configured to vibrate based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing, so that the acoustic transducer generates an electrical signal; The vibration unit includes a mass element and an elastic element, and the area of ​​a first region formed by the edge of the mass element facing away from the acoustic transducer is smaller than the area of ​​a second region formed by the edge of the mass element facing closer to the acoustic transducer, so that the projection of the first region along the vibration direction of the mass element can fall within the second region, and the elastic element is connected to the side wall of the mass element.

2. The vibration sensor according to claim 1, wherein The mass element includes a first mass element and a second mass element, the second mass element is close to the acoustic transducer, the first mass element is located on the side of the second mass element facing away from the acoustic transducer, and the cross-sectional area of ​​the first mass element perpendicular to the vibration direction of the mass element is smaller than the cross-sectional area of ​​the second mass element perpendicular to the vibration direction of the mass element.

3. The vibration sensor according to claim 2, wherein The first mass element is located in a central area of ​​the second mass element, and a side wall of the first mass element is spaced apart from a side wall of the second mass element.

4. The vibration sensor according to claim 3, wherein A distance between a sidewall of the first mass element and a sidewall of the second mass element is 10 um to 500 um.

5. The vibration sensor according to claim 3, wherein The elastic element includes a first elastic portion and a second elastic portion. Two ends of the first elastic portion are respectively connected to the side wall of the first mass element and the second elastic portion. The second elastic portion extends toward the acoustic transducer and is connected to the acoustic transducer. The vibration sensor according to claim 5 , wherein: The first elastic portion includes a first side surface and a second side surface, the first side surface is connected to the side wall of the first mass element, and the second side surface is connected to a surface of the second mass element exposed in the second acoustic cavity.

7. The vibration sensor according to claim 6, wherein A side wall of the second mass element is connected to the second elastic portion.

8. The vibration sensor according to claim 5, wherein The acoustic transducer includes a substrate, the second elastic element extends toward the substrate and is connected to the substrate, and the substrate, the second mass element, and the second elastic element form the first acoustic cavity.

9. The vibration sensor according to claim 2, wherein: Along the vibration direction of the mass element, the thickness of the first mass element is 50 um to 1000 um, and the thickness of the second mass element is 10 um to 150 um.

10. The vibration sensor according to claim 9, wherein Along a vibration direction of the mass element, a thickness of the first mass element is greater than a thickness of the second mass element.

11. The vibration sensor according to claim 1, wherein In a cross section of the mass element taken along its vibration direction, a line connecting an edge of the mass element facing away from the acoustic transducer and an edge of the mass element close to the acoustic transducer forms an angle with the vibration direction of the mass element, and the angle ranges from 10° to 80°.

12. The vibration sensor according to claim 1, wherein The mass element includes a first hole portion, and the first hole portion communicates with the first acoustic cavity and the second acoustic cavity.

13. The vibration sensor according to claim 12, wherein The radius of the first hole portion is 1 um to 50 um. 14 . The vibration sensor according to claim 1 , wherein the housing comprises a third hole, and the second acoustic cavity is connected to the outside through the third hole. 15 . The vibration sensor according to claim 1 , wherein the mass element comprises a groove located on a side of the mass element in a vibration direction thereof.

16. The vibration sensor according to claim 15, wherein The mass element includes a first hole portion, the first hole portion communicating with the first acoustic cavity and the second acoustic cavity, and the first hole portion is located at the groove.

17. The vibration sensor according to claim 16, wherein The size of the groove is larger than that of the first hole portion.

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