Luminous panel and manufacturing method thereof

Abstract

The present invention discloses a light-emitting panel and a manufacturing method thereof. The panel comprises a substrate, a plurality of electrodes, a plurality of connectors, and a plurality of light-emitting components; the plurality of electrodes are arranged on one side of the substrate; the plurality of connectors are arranged on the side of the substrate where the plurality of electrodes are arranged, and one connector is correspondingly connected to one electrode; the plurality of light-emitting components are arranged on the side of the substrate where the plurality of connectors are arranged, and one connector is correspondingly connected between one light-emitting component and one electrode; wherein each connector comprises a bonding portion and a transfer support portion, one end of a transfer support portion is connected to a corresponding electrode, and the other end is connected to the bonding portion, one end of the bonding portion is connected to the transfer support portion, and the other end is connected to a corresponding light-emitting component. The present invention can reduce the difficulty of manufacturing the bonding portion, improve the yield rate of the light-emitting panel, and realize a light-emitting panel with light-emitting components having a small pitch.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a light-emitting panel and a manufacturing method thereof. Background Art

[0002] LEDs (Light Emitting Diodes) play an irreplaceable role in the display field. Compared to traditional display technologies, micro-display technology based on Micro-LED micro-display array technology offers advantages such as fast response speed, active light emission, high contrast, and long service life.

[0003] During the preparation of the LED light board, multiple LED lamps need to be transferred to the light board. Figures 1A to 1E First, a plurality of electrode members 2 are formed on a substrate 1, and then a photoresist layer is formed on the substrate 1. A photoresist 3 is obtained through a photolithography process and is located between adjacent electrode members 2 and is in an inverted trapezoidal shape. Then, a metal layer is deposited on the substrate 1, and the metal layer is separated at the photoresist 3 to obtain a bonding metal 4 located on the electrode members 2 and a partition metal 5 located on the photoresist 3. Then, a solvent method is used to remove the photoresist 3 and the partition metal 5 together to obtain a plurality of bonding metals 4 located on the substrate 1 and on each electrode member 2. Then, the plurality of bonding metals 4 are welded to the positive and negative poles of the corresponding LED lamp members 6 to obtain an LED lamp board.

[0004] During the preparation of the bonding metal, since the lamp board may have a certain degree of warping and deformation, the bonding metal needs to have a larger thickness, generally about 10 microns. Furthermore, during the preparation of the bonding metal, the photoresist is also required to reach a certain thickness, generally 30 microns. However, the thicker the photoresist, the more difficult the photolithography process is and the worse the stability is, which can easily lead to a decrease in the yield of the bonding metal. Moreover, when the number of LED lamps increases and the distance between the bonding metals becomes smaller, due to the difficulty of the photolithography process and the limited selection of negative photoresists with small pitch and high aspect ratio, it will be difficult to meet the process requirements of an increasing number of LED lamps and a smaller pitch. Summary of the Invention

[0005] Embodiments of the present invention provide a light-emitting panel and a manufacturing method thereof, which can improve the bonding yield of light-emitting components in the light-emitting panel.

[0006] An embodiment of the present invention provides a light-emitting panel, comprising:

[0007] substrate;

[0008] a plurality of electrodes disposed on one side of the substrate;

[0009] A plurality of connecting members are provided on a side of the substrate where the plurality of electrodes are provided, and one connecting member is connected to one electrode correspondingly;

[0010] A plurality of light-emitting elements are provided on one side of the substrate where the plurality of connecting elements are provided, and one connecting element is correspondingly connected between one light-emitting element and one electrode;

[0011] Among them, each of the connecting parts includes a bonding part and a transfer support part, one end of the transfer support part is connected to a corresponding electrode, and the other end is connected to the bonding part, one end of the bonding part is connected to the transfer support part, and the other end is connected to a corresponding light-emitting part.

[0012] In one embodiment of the present invention, the transfer support portion includes a conductive sub-portion and an insulating sub-portion, the conductive sub-portion is connected between a corresponding electrode and a corresponding bonding portion, and the insulating sub-portion is arranged between a corresponding electrode and a corresponding bonding portion and around the conductive sub-portion.

[0013] In an embodiment of the present invention, in a direction away from the substrate, an area of each transition support portion cut along a direction parallel to the substrate gradually increases.

[0014] In one embodiment of the present invention, the orthographic projection of the electrode on the substrate is located within the coverage range of the orthographic projection of the side of the corresponding transfer support portion close to the substrate on the substrate.

[0015] In one embodiment of the present invention, the distance from one end of the conductive sub-portion away from the substrate to the substrate is greater than the distance from one end of the insulating sub-portion away from the substrate to the substrate, and one end of the bonding portion close to the transfer support portion covers the conductive sub-portion and the insulating sub-portion, and the other end is electrically connected to a corresponding one of the light-emitting components.

[0016] In one embodiment of the present invention, the light emitting panel further comprises a partition portion provided on the substrate and surrounding each of the transfer support portions, wherein the partition portion is spaced apart from the bonding portion;

[0017] In which, the bonding part includes a bonding metal layer and a functional metal layer that are stacked, and the functional metal layer is located between the bonding metal layer and the transfer support part. The partition part includes a first sublayer and a second sublayer that are stacked, and the second sublayer is located between the first sublayer and the substrate, and the material of the bonding metal layer is at least partially the same as the material of the first sublayer, and the material of the second sublayer is the same as the material of the functional metal layer.

[0018] In one embodiment of the present invention, the thickness of the bonding metal layer is smaller than the thickness of the first sub-layer, and the thickness of the functional metal layer is smaller than the thickness of the second sub-layer.

[0019] In an embodiment of the present invention, the light emitting panel further comprises a light shielding layer provided on a side of the partition portion away from the substrate, and the light shielding layer covers the partition portion and is provided around each of the transfer support portions.

[0020] According to the above object of the present invention, a method for manufacturing a light-emitting panel is further provided, which comprises the following steps:

[0021] providing a substrate;

[0022] forming a plurality of electrodes on one side of the substrate;

[0023] A plurality of connecting members are formed on one side of the substrate where the plurality of electrodes are provided, wherein one connecting member is connected to one electrode, and each connecting member includes a bonding portion and a transfer support portion, wherein one end of the transfer support portion is connected to the corresponding electrode, and the other end is connected to the bonding portion;

[0024] A plurality of light-emitting parts are formed on one side of the substrate where a plurality of connecting parts are provided, and one connecting part is correspondingly connected between one light-emitting part and one electrode, wherein one end of the bonding part is connected to the transfer support part, and the other end is connected to a corresponding light-emitting part.

[0025] In one embodiment of the present invention, forming a plurality of connectors on a side of the substrate provided with a plurality of electrodes comprises the following steps:

[0026] A plurality of conducting sub-portions are formed on one side of the substrate where the plurality of electrodes are provided, and one conducting sub-portion is provided on one of the electrodes;

[0027] A plurality of insulating sub-parts are formed on one side of the substrate where the plurality of conducting sub-parts are provided, and one of the insulating sub-parts is arranged around one of the conducting sub-parts to form a transfer support part;

[0028] A metal layer is formed on the side of the substrate where the transfer support portion is provided, and the metal layer is partitioned at each of the transfer support portions to form a bonding portion located on the side of the transfer support portion away from the substrate and a partition portion surrounding the transfer support portion, and the bonding portion and the partition portion are spaced apart.

[0029] Beneficial effects of the present invention: The present invention increases the distance from the bonding part to the electrode by arranging a transfer support part between the bonding part and the electrode. It can ensure that the bonding part is bonded to each light-emitting component even if the substrate may have a certain deformation. Therefore, the bonding part does not need to have a large thickness, which reduces the difficulty of making the bonding part and improves the yield rate of the bonding part. When the number of light-emitting components increases and the distance between the bonding parts becomes smaller, the present invention can also reduce the difficulty of making the bonding part to meet the needs of the light-emitting panel with light-emitting components having a small pitch, thereby improving the yield rate of the light-emitting panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0031] Figures 1A to 1E This is a structural diagram of the manufacturing process of an LED light board in the prior art;

[0032] Figure 2 A schematic structural diagram of a light-emitting panel provided in an embodiment of the present invention;

[0033] Figure 3 Another structural schematic diagram of a light-emitting panel provided in an embodiment of the present invention;

[0034] Figure 4 A flow chart of a method for manufacturing a light-emitting panel provided in an embodiment of the present invention;

[0035] Figures 5A to 5F A structural schematic diagram of the manufacturing process of the light-emitting panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0037] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0038] The embodiment of the present invention provides a light emitting panel, please refer to Figure 2 The light emitting panel includes a substrate 10 , a plurality of electrodes 20 , a plurality of connecting members 30 and a plurality of light emitting members 60 .

[0039] Among them, multiple electrodes 20 are arranged on one side of the substrate 10; multiple connecting parts 30 are arranged on the side of the substrate 10 where multiple electrodes 20 are provided, and one connecting part 30 is correspondingly connected to one electrode 20; multiple light-emitting parts 60 are arranged on the side of the substrate 10 where multiple connecting parts 30 are provided, and one connecting part 30 is correspondingly connected between one light-emitting part and one electrode.

[0040] Among them, each connecting part 30 includes a bonding part 32 and a transfer support part 31, one end of an transfer support part 31 is connected to a corresponding electrode 20, and the other end is connected to the bonding part 32, one end of the bonding part 32 is connected to the transfer support part 31, and the other end is connected to a corresponding light-emitting part 60.

[0041] During the implementation and application process, the present invention forms a transfer support portion 31 between the bonding portion 32 and the electrode 20, thereby increasing the distance between the bonding portion 32 and the substrate 10. Even if the substrate 10 may have a certain deformation, it can also ensure that the bonding portion 32 is bonded to each light-emitting component 60. Compared with the prior art, the bonding portion 32 does not need to have a large thickness, which reduces the difficulty of making the bonding portion 32 and improves the yield rate of the bonding portion 32. When the number of light-emitting components 60 increases and the distance between the bonding portions 32 becomes smaller, the present invention can also reduce the difficulty of making the bonding portion 32 and improve the yield rate of the light-emitting panel.

[0042] For details, please refer to Figure 2 The light-emitting panel provided by an embodiment of the present invention includes a substrate 10, a plurality of electrodes 20 arranged on one side of the substrate 10, a plurality of connecting members 30 arranged on the substrate 10 and connected to the plurality of electrodes 20, a partition portion 40 and a light-shielding layer 50 arranged on the substrate 10 and surrounding each connecting member 30, and a plurality of light-emitting members 60 arranged on the substrate 10 and connected to the plurality of connecting members 30.

[0043] Multiple electrodes 20 are distributed on the substrate 10, and structures such as driving circuits and signal lines are also distributed on the substrate 10 (not shown in the figure). The multiple electrodes 20 are electrically connected to the signal lines and driving circuits to realize the transmission of electrical signals, which can be implemented with reference to existing technologies and will not be repeated here.

[0044] Optionally, the material of the electrode 20 may be Al.

[0045] A plurality of connectors 30 are disposed on the substrate 10 and can be connected to the plurality of electrodes in a one-to-one correspondence, with one connector 30 correspondingly disposed on one electrode 20. Each connector 30 includes a transition support portion 31 and a bonding portion 32. The transition support portion 31 is located between the bonding portion 32 and the electrode 20, and the two ends of the transition support portion 31 are connected to the bonding portion 32 and the electrode 20, respectively.

[0046] Furthermore, each transfer support portion 31 includes a conductive sub-portion 311 and an insulating sub-portion 312 . The conductive sub-portion 311 is correspondingly connected between the bonding portion 32 and the electrode 20 , and the insulating sub-portion 312 is arranged between the bonding portion 32 and the electrode 20 and around each conductive sub-portion 311 .

[0047] In an embodiment of the present invention, the area of each transition support portion 31 parallel to the substrate 10 gradually increases in the direction away from the substrate 10, that is, the cross-sectional shape of the transition support portion 31 may be an inverted trapezoidal structure to facilitate the subsequent isolation of the metal layer.

[0048] Optionally, in a direction away from the substrate 10 , the area of the conducting sub-portion 311 cut in parallel with the substrate 10 remains unchanged, and the area of the insulating sub-portion 312 cut in parallel with the substrate 10 gradually increases.

[0049] Preferably, the orthographic projection of each electrode 20 on the substrate 10 is located within the coverage range of the orthographic projection of the corresponding adapter support portion 31 on the side close to the substrate 10 on the substrate 10, thereby effectively preventing short circuits between adjacent conductive sub-portions 311 and adjacent electrodes 20, thereby improving the yield and stability of the light-emitting panel.

[0050] Optionally, the height of the conducting sub-portion 311 may be equal to or different from the height of the insulating sub-portion 312 .

[0051] Preferably, the height of the conducting sub-portion 311 is greater than the height of the insulating sub-portion 312. Figure 3, the distance between the end of the conductive sub-part 311 away from the substrate 10 and the substrate 10 is greater than the distance between the end of the insulating sub-part 312 away from the substrate 10 and the substrate 10, and the end of the bonding part 32 close to the transfer support part 31 covers the conductive sub-part 311 and the insulating sub-part 312, and the other end is electrically connected to a corresponding light-emitting component 60. In this embodiment, the height of the conductive sub-part 311 is set to be greater than the height of the insulating sub-part 312, so that the side of the conductive sub-part 311 away from the substrate 10 protrudes relative to the insulating sub-part 312, and then when the bonding part 32 covers the side of the transfer support part 31 away from the substrate 10, the contact area between the bonding part 32 and the conductive sub-part 311 can be increased, thereby improving the electrical transmission effect.

[0052] Further optionally, the conducting sub-portion 311 may be a stacked structure of Ti—Al—Ti, and the insulating sub-portion 312 may be made of a highly elastic photoresist.

[0053] Please continue to refer to Figure 2 The light emitting panel further includes a partition portion 40 disposed on the substrate 10 and surrounding each transfer support portion 31 , and the partition portion 40 is spaced apart from the bonding portion 32 .

[0054] Specifically, the bonding portion 32 may include a stacked bonding metal layer 321 and a functional metal layer 322, and the functional metal layer 322 is located between the bonding metal layer 321 and the transfer support portion 31. The partition portion 40 includes a stacked first sublayer 41 and a second sublayer 42, wherein the second sublayer 42 is located between the first sublayer 41 and the substrate 10. In an embodiment of the present invention, the material of the bonding metal layer 321 is at least partially the same as the material of the first sublayer 41, and the material of the functional metal layer 322 is the same as the material of the second sublayer 42.

[0055] It is understood that the bonding portion 32 and the partition portion 40 can be integrally formed during the manufacturing process and partitioned at the inverted trapezoidal transition support portion 31 to separate the bonding portion 32 located on the transition support portion 31 and the partition portion 40 located on the substrate 10. Furthermore, since the bonding process of the bonding portion 32 with the light-emitting element 60 during the manufacturing process is primarily a eutectic process, byproducts may also be produced. Consequently, the material of the bonding metal layer 321 is at least partially the same as that of the first sub-layer 41, while the material of the functional metal layer 322 is the same as that of the second sub-layer 42. Furthermore, during the bonding process between the bonding portion 32 and the light-emitting element 60, the light-emitting element 60 may exert a certain degree of compression on the bonding portion 32, resulting in the thickness of the bonding metal layer 321 being less than that of the first sub-layer 41, while the thickness of the functional metal layer 322 being less than that of the second sub-layer 42.

[0056] Optionally, the material of the bonding metal layer 321 and the material of the first sub-layer 41 both include indium, and the material of the functional metal layer 322 and the material of the second sub-layer 42 both include gold, wherein the functional metal layer 322 is located between the bonding metal layer 321 and the conductive sub-section 311, which can increase the interface adhesion and improve the bonding stability.

[0057] In addition, the light-emitting panel provided by the embodiment of the present invention also includes a light-shielding layer 50 arranged on the substrate 10 and covering the partition part 40, and the light-shielding layer 50 is arranged around each adapter support part 31. Since the partition part 40 is made of metal material, it is easy to generate reflection to form stray light, and the light-shielding layer 50 provided by the embodiment of the present invention can play a light-shielding role, thereby improving the light-emitting effect of the light-emitting panel.

[0058] Optionally, the material of the light shielding layer 50 includes black ink.

[0059] Multiple light-emitting elements 60 are disposed on a side of the substrate 10 where multiple connectors 30 are disposed. Each light-emitting element 60 may include a light-emitting body 61, a first electrode 62 located on a side of the light-emitting body 61 closer to the substrate 10, and a second electrode 63. Each first electrode 62 is bonded to a corresponding bonding portion 32 in a connector 30, and each second electrode 63 is bonded to a corresponding bonding portion 32 in a connector 30. It is understood that one of the first electrode 62 and the second electrode 63 serves as the positive electrode of the light-emitting element 60, and the other serves as the negative electrode. Furthermore, by electrically connecting the positive and negative electrodes of the light-emitting element 60 to the electrodes 20 through the connectors 30, respectively, electrical signals are transmitted, thereby enabling each light-emitting element 60 to emit light.

[0060] Optionally, in an embodiment of the present invention, the distance between two adjacent connecting members 30 may be less than or equal to 10 micrometers.

[0061] In an embodiment of the present invention, a transfer support portion 31 is provided between the bonding portion 32 and the electrode 20 to increase the distance between the bonding portion 32 and the electrode 20. This ensures that the bonding portion 32 is bonded to each light-emitting component 60 even though the substrate 10 may be deformed to a certain extent. Compared with the prior art, the bonding portion 32 does not need to have a large thickness, thereby reducing the difficulty of manufacturing the bonding portion 32 and improving the yield rate of the bonding portion 32. When the number of light-emitting components 60 increases and the distance between the bonding portions 32 becomes smaller, the present invention can also reduce the difficulty of manufacturing the bonding portion 32 and improve the yield rate of the light-emitting panel.

[0062] In addition, the present invention also provides a method for manufacturing the light emitting panel described in the above embodiment. Figure 2 、 Figure 4 as well as Figures 5A to 5F The manufacturing method of the light emitting panel comprises the following steps:

[0063] S10, providing a substrate 10.

[0064] S20 , forming a plurality of electrodes 20 on one side of the substrate 10 .

[0065] A driving circuit and signal lines (not shown) are formed on the substrate 10 , and then a plurality of electrodes 20 are formed on the substrate 10 , and each electrode 20 is electrically connected to the signal lines and the driving circuit to achieve transmission of electrical signals.

[0066] Optionally, the material of the electrode 20 includes Al.

[0067] S30. A plurality of connectors 30 are formed on one side of the substrate 10 where a plurality of electrodes 20 are provided. One connector 30 is connected to one electrode 20 , and each connector 30 includes a bonding portion 32 and a transfer support portion 31 . One end of a transfer support portion 31 is connected to a corresponding electrode 20 , and the other end is connected to the bonding portion 32 .

[0068] A connection metal layer is formed on the substrate 10 by physical vapor deposition and patterned by dry etching to obtain a plurality of conductive sub-portions 311 distributed on the substrate 10 , with one conductive sub-portion 311 correspondingly located on one electrode 20 .

[0069] Optionally, the connection metal layer may be a stacked Ti-Al-Ti metal film, or other metals, which are not limited herein, and the height of the formed conducting sub-portion 311 may be about 3 microns.

[0070] A highly elastic photoresist is coated on the substrate 10, and an insulating portion 312 is formed around each conductive sub-portion 311 through a photolithography process. An insulating portion 312 is arranged around a conductive sub-portion 311 to form a transfer support portion 31, and the cross-sectional area of the transfer support portion 31 gradually increases in a direction away from the substrate 10, that is, the cross-sectional shape of the transfer support portion 31 is an inverted trapezoid.

[0071] In the embodiment of the present invention, the insulator portion 312 is elastic and can undergo a certain degree of shrinkage deformation during the subsequent bonding process with the light-emitting element 60 , thereby increasing tolerance to deformation caused by the substrate 10 .

[0072] A metal layer is formed on one side of the substrate 10 where the transfer support portion 31 is provided. The metal layer may include a stacked gold layer and an indium layer, and the gold layer is located between the indium layer and the substrate 10. Since the transfer support portion 31 has a certain height in the embodiment of the present invention, the thickness of the metal layer can be prepared to be thinner, and then the metal layer is separated at the transfer support portion 31 in an inverted trapezoidal shape to form a bonding portion 32 located on the side of the transfer support portion 31 away from the substrate 10 and a partition portion 40 located between adjacent transfer support portions 31, wherein the bonding portion 32 and the partition portion 40 are arranged at intervals, and the transfer support portion 31 and the bonding portion 32 constitute a connecting member 30.

[0073] Optionally, the thickness of the gold layer can be 500 angstroms, and the thickness of the indium layer can be 3000 angstroms. In the prior art, the thickness of the bonding metal generally needs to be about 10 microns, and thus the embodiment of the present invention can effectively reduce the thickness of the bonding metal layer 321. The material of the bonding metal layer 321 is indium, which is expensive. The embodiment of the present invention can reduce the use of metal indium, thereby effectively reducing production costs.

[0074] Among them, the bonding part 32 includes a bonding metal layer 321 made of indium and a functional metal layer 322 made of gold, and the partition part 40 includes a first sublayer 41 made of indium and a second sublayer 42 made of gold, and the functional metal layer 322 is gold, which can increase the adhesion between the bonding metal layer 321 and the conductive sub-part 311, thereby improving the yield and stability of the light-emitting panel.

[0075] Then, a light shielding layer 50 is formed on the side of the substrate 10 where the connector 30 is provided. The material of the light shielding layer 50 includes black ink and can be formed by inkjet printing or photolithography.

[0076] The shading layer 50 covers the partition part 40 and is arranged around each connecting part 30. Since the partition part 40 is made of metal material, it is easy to generate reflection to form stray light. The shading layer 50 provided in the embodiment of the present invention can play a shading role and improve the light output effect of the light-emitting panel.

[0077] S40. A plurality of light-emitting components 60 are formed on one side of the substrate 10 where a plurality of connecting components 30 are provided, and a connecting component 30 is correspondingly connected between a light-emitting component 60 and an electrode 20, wherein one end of the bonding portion 32 is connected to the transfer support portion 31, and the other end is connected to a corresponding light-emitting component 60.

[0078] The side of the carrier substrate 70 where the multiple light-emitting elements 60 are provided is aligned with the side of the substrate 10 where the multiple connectors 30 are provided. Each light-emitting element 60 includes a light-emitting body 61 and a first electrode 62 and a second electrode 63 provided on the side of the light-emitting body 61 away from the carrier substrate 70. The first electrode 62 and the second electrode 63 of each light-emitting element 60 are aligned, contacted, and connected to the corresponding connector 30. Overheating or laser welding can be used to bond the first electrode 62 and the second electrode 63 of each light-emitting element 60 to the corresponding connector 30. Each bonding metal layer 321 is eutectic-connected to the corresponding first electrode 62 or the corresponding second electrode 63 to achieve a bonding connection, thereby obtaining the light-emitting panel provided by the embodiment of the present invention.

[0079] It can be understood that in the process of bonding the light-emitting component 60 to the bonding part 32, the bonding part 32 and the transition support part 31 may be squeezed, so that the thickness of the bonding metal layer 321 is smaller than the thickness of the first sub-layer 41, the thickness of the functional metal layer 322 is smaller than the thickness of the second sub-layer 42, and the height of the transition support part 31 will also be reduced accordingly.

[0080] In summary, in the embodiment of the present invention, a plurality of conductive sub-portions 311 are formed on the electrode 20 by dry etching to form a plurality of transfer support portions 31. Compared with the prior art in which a photolithography process is performed on a high-thickness photoresist, the conductive sub-portions 311 in the embodiment of the present invention are formed by dry etching, and the morphology is easy to control, the precision is higher, and the arrangement is more regular, so that the spacing between two adjacent connectors 30 can be less than or equal to 10 microns, and the conductive sub-portion 311 is covered by the insulating sub-portion 312, thereby avoiding short circuits between adjacent conductive sub-portions 311 and adjacent electrodes 20; and the bonding portion 32 is formed on the transfer support portion 31, thereby increasing the bonding portion 31. 2 and the electrode 20, the thickness of the bonding metal layer 321 in the bonding portion 32 can be set very thin and can be naturally separated at the transfer support portion 31, reducing production costs. In addition, the partition portion 40 located on the substrate 10 does not need to be removed by a solvent method, nor does it need to be stripped by photoresist, thereby preventing chemical solutions from damaging the electrode 20, the driving circuit and signal lines on the substrate 10, and the bonding portion 32. The functional metal layer 322 and the bonding metal layer 321 can be formed in the same process, which not only reduces the number of process steps but also improves the adhesion of the bonding metal layer 321. The light shielding layer 50 can reduce the reflection of stray light to improve the contrast of the light-emitting panel.

[0081] In addition, an embodiment of the present invention also provides a display device, and the display device includes the light-emitting panel described in the above embodiment. The light-emitting panel can be directly used for display in the display device, or the light-emitting panel is used as a backlight source in the display device. The display device also includes a display panel arranged on the light-emitting side of the light-emitting panel.

[0082] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] The above is a detailed introduction to a light-emitting panel and a manufacturing method thereof provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light-emitting panel, characterized in that: include: substrate; a plurality of electrodes disposed on one side of the substrate; A plurality of connecting members are provided on a side of the substrate where the plurality of electrodes are provided, and one connecting member is connected to one electrode correspondingly; A plurality of light-emitting elements are provided on one side of the substrate where the plurality of connecting elements are provided, and one connecting element is correspondingly connected between one light-emitting element and one electrode; Each of the connecting members includes a bonding portion and a transfer support portion, one end of the transfer support portion is connected to a corresponding electrode, and the other end is connected to the bonding portion, and one end of the bonding portion is connected to the transfer support portion, and the other end is connected to a corresponding light-emitting member; The transfer support portion includes a conductive sub-portion and an insulating sub-portion, wherein the conductive sub-portion is connected between a corresponding electrode and a corresponding bonding portion, and the insulating sub-portion is disposed between a corresponding electrode and a corresponding bonding portion and surrounds the conductive sub-portion; The light-emitting panel also includes a partition portion arranged on the substrate and around each of the transition support portions, the partition portion is spaced apart from the bonding portion, the bonding portion includes a stacked bonding metal layer and a functional metal layer, the functional metal layer is located between the bonding metal layer and the transition support portion, the partition portion includes a stacked first sublayer and a second sublayer, the second sublayer is located between the first sublayer and the substrate, and the material of the bonding metal layer is at least partially the same as the material of the first sublayer, and the material of the second sublayer is the same as the material of the functional metal layer.

2. The light emitting panel according to claim 1, wherein: In a direction away from the substrate, an area of each transition support portion cut along a direction parallel to the substrate gradually increases.

3. The light emitting panel according to claim 2, wherein: The orthographic projection of the electrode on the substrate is located within the coverage range of the orthographic projection of the corresponding side of the transfer support portion close to the substrate on the substrate.

4. The light emitting panel according to claim 1, wherein: The distance between the end of the conductive sub-portion away from the substrate and the substrate is greater than the distance between the end of the insulating sub-portion away from the substrate and the substrate, and the end of the bonding portion close to the transfer support portion covers the conductive sub-portion and the insulating sub-portion, and the other end is electrically connected to a corresponding light-emitting component.

5. The light emitting panel according to claim 1, wherein: The thickness of the bonding metal layer is smaller than that of the first sub-layer, and the thickness of the functional metal layer is smaller than that of the second sub-layer.

6. The light emitting panel according to claim 1, wherein: The light emitting panel further includes a light shielding layer disposed on a side of the partition portion away from the substrate, and the light shielding layer covers the partition portion and is disposed around each of the transfer support portions.

7. A method for manufacturing a light-emitting panel, characterized in that: The following steps are involved: providing a substrate; forming a plurality of electrodes on one side of the substrate; A plurality of connecting members are formed on one side of the substrate where the plurality of electrodes are provided, wherein one connecting member is connected to one electrode, and each connecting member includes a bonding portion and a transfer support portion, wherein one end of the transfer support portion is connected to the corresponding electrode, and the other end is connected to the bonding portion; A plurality of light-emitting elements are formed on one side of the substrate where the plurality of connecting elements are provided, and one of the connecting elements is correspondingly connected between one of the light-emitting elements and one of the electrodes, wherein one end of the bonding portion is connected to the transfer support portion, and the other end is connected to a corresponding light-emitting element; The forming of a plurality of connecting members on a side of the substrate provided with a plurality of electrodes comprises the following steps: A plurality of conducting sub-portions are formed on one side of the substrate where the plurality of electrodes are provided, and one conducting sub-portion is provided on one of the electrodes; A plurality of insulating sub-parts are formed on one side of the substrate where the plurality of conducting sub-parts are provided, and one of the insulating sub-parts is arranged around one of the conducting sub-parts to form a transfer support part; A metal layer is formed on the side of the substrate where the transfer support portion is provided, and the metal layer is partitioned at each of the transfer support portions to form a bonding portion located on the side of the transfer support portion away from the substrate and a partition portion surrounding the transfer support portion, and the bonding portion and the partition portion are spaced apart.

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