Demolding device for semiconductor lead frame etching product manufacturing

Abstract

The application belongs to the technical field of semiconductor integrated circuit lead frame etching manufacturing, and particularly relates to a demolding device for manufacturing semiconductor lead frame etching products. The demolding device for manufacturing semiconductor lead frame etching products comprises sequentially connected water immersion washing slots, water spraying washing slots and a demolding mechanism. The water immersion washing slots are connected with an upper water filtering system, and the water immersion washing slots are connected with a mother tank self-circulation system. The water spraying washing slots comprise a slot body, an inner sub-slot arranged at the bottom of the slot body and an upper spraying pipe arranged at the upper part of the slot body. The demolding mechanism comprises a butt joint frame butt jointed with the water spraying washing slots, a rotating roller arranged in the butt joint frame and a rotating motor for driving the rotating roller to rotate. The demolding device for manufacturing semiconductor lead frame etching products has the effect of greatly reducing the phenomenon of etching product adhesion to foreign matters through jet infiltration, jet immersion and jet impact of the demolding device.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor integrated circuit leadframe etching manufacturing, specifically relating to a stripping device for manufacturing semiconductor leadframe etched products. Background Technology

[0002] In the field of semiconductor leadframe manufacturing technology, the use of etching technology to process metal materials into a variety of precision semiconductor electronic products required in high-tech fields has become a very important topic. For example, chip manufacturing technology, a crucial core technology of semiconductor integrated circuits, is an important foundation and core component of the development of cutting-edge science and technology; semiconductor leadframes, as the chip carrier of integrated circuits, are an important basic raw material in the electronic information industry; therefore, semiconductor leadframe manufacturing technology is an important basic material for manufacturing high-precision semiconductor integrated circuits.

[0003] In the modern electronics and information industry, semiconductor leadframe etching equipment is a crucial core technology in fundamental manufacturing. Currently, semiconductor leadframe etching equipment is a vital foundation affecting the manufacturing level of modern integrated circuit semiconductor leadframes. Only by continuously improving the process level and manufacturing precision of etching equipment can the manufacturing technology of semiconductor integrated circuit leadframes in the modern electronics and information industry continue to develop sustainably.

[0004] However, in actual industrial production using semiconductor lead frame etching equipment, there is an abnormal phenomenon in the stripping process where foreign matter adheres to the etched metal photosensitive film, causing unstable product quality. Utility Model Content

[0005] The purpose of this invention is to provide a stripping device for manufacturing semiconductor leadframe etched products, in order to solve the technical problem that foreign matter adheres to the etched metal photosensitive film material in the stripping process, resulting in unstable product quality. The invention aims to significantly reduce the phenomenon of foreign matter adhering to etched products through spray wetting, spray impregnation, and spray impact of the stripping device.

[0006] To address the aforementioned technical problems, this invention provides a stripping apparatus for manufacturing semiconductor leadframe etching products, comprising:

[0007] The immersion washing tank, the spray washing tank, and the demolding mechanism are connected in sequence.

[0008] The immersion washing tank is connected to a water supply filtration system, which uses a water pump for water delivery. The immersion washing tank is also connected to a mother tank self-circulation system.

[0009] The water spray washing tank includes a tank body, an inner sub-tank located at the bottom of the tank body, and an upper spray pipe located at the top of the tank body;

[0010] The film removal mechanism includes a docking frame that connects to the water spray washing tank, a rotating drum disposed within the docking frame, and a rotating motor for driving the rotating drum to rotate. The docking frame has a discharge port on the side away from the water spray washing tank, and a film removal spray pipe is disposed within the docking frame.

[0011] Furthermore, the immersion washing tank includes a first immersion washing tank and a second immersion washing tank connected in sequence.

[0012] Furthermore, the water filtration system includes several water filter cylinders connected to the immersion washing tank and a water pump for feeding water from the immersion washing tank into the water filter cylinders.

[0013] Furthermore, the mother tank self-circulation system includes a filter mother tank and a filter water pump installed on the filter mother tank.

[0014] Furthermore, a membrane recycling tank is provided below the discharge port.

[0015] Furthermore, a support mechanism is provided within the docking frame;

[0016] The supporting mechanism includes a supporting vertical plate located at the bottom of the docking frame and a supporting roller rotatably connected to the supporting vertical plate. The supporting roller is rotatably connected to the rotating drum.

[0017] The beneficial effects of this invention are:

[0018] 1. The etching equipment is equipped with a sequentially connected immersion washing tank, a spray washing tank, and a film removal mechanism.

[0019] The photosensitive dry film in the exposed area is removed by spray wetting, spray penetration, spray expansion and spray impact of the stripping solution, thereby obtaining an etched copper alloy material with the product structure pattern.

[0020] 2. The rotating drum can separate the membrane and the liquid, thereby improving automation.

[0021] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the stripping device for manufacturing semiconductor leadframe etching products according to the present invention.

[0024] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0025] Figure 3 This is a schematic diagram of the internal structure of the demolding mechanism of the present invention;

[0026] Figure 4 This is a schematic diagram of the spraying process of the present invention.

[0027] In the picture:

[0028] 1. Immersion washing tank; 11. First immersion washing tank; 12. Second immersion washing tank;

[0029] 2. Water spray washing of the upper tank; 21. Tank body; 22. Inner sub-tank; 23. Upper spray pipe;

[0030] 3. Demolding mechanism; 31. Docking frame; 32. Rotating roller; 33. Rotating motor; 34. Discharge port; 35. Demolding water spray pipe;

[0031] 4. Water supply and filtration system; 41. Water supply filter cartridge; 42. Water supply pump;

[0032] 5. Mother tank self-circulation system; 51. Filter mother tank; 52. Filter water pump;

[0033] 6. Membrane recovery tank;

[0034] 7. Supporting mechanism; 71. Supporting vertical plate; 72. Supporting roller. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example:

[0037] like Figures 1 to 3As shown, a stripping device for manufacturing semiconductor leadframe etching products includes: an immersion washing tank 1, a spray washing tank 2, and a stripping mechanism 3 connected in sequence. This allows the etched product to pass through the immersion washing tank 1, the spray washing tank 2, and the stripping mechanism 3, where the etching equipment undergoes spray wetting, spray penetration, spray expansion, and spray impact with a stripping solution, thereby removing the photosensitive dry film from the exposed areas. In this embodiment, the pressure and speed of spray wetting, spray penetration, spray expansion, and spray impact can be set and controlled separately, with a spray pressure range of 0.3-1.3 Pa and a spray speed range of 5.3-10.3 L / min. Furthermore, because the reaction between the developed and undeveloped dry film and the stripping solution differs significantly, the stripping solution needs to be composed of a strongly alkaline solution. The water spray washing tank 2 includes a tank body 21, an inner sub-tank 22 located at the bottom of the tank body 21, and an upper spray pipe 23 located at the top of the tank body 21. The upper spray pipe 23 can spray the etched products in the inner sub-tank 22, thereby improving the removal effect of the etched products.

[0038] In this embodiment, the immersion washing tank 1 includes a first immersion washing tank 11 and a second immersion washing tank 12 connected in sequence, thereby improving the demolding effect of the immersion washing tank 1.

[0039] like Figure 4 As shown, the etching product in this embodiment can use, but is not limited to, copper alloy material 150. The copper alloy material 150 runs horizontally at a speed of 2 m / min and continues the "three-stage stripping → four-stage water washing → acid activation → four-stage water washing →" film removal device processing system. Through the spray wetting, spray penetration, spray expansion and spray impact of the stripping solution, as well as the pressure control, flow rate control, automatic analysis and automatic replenishment of the concentration of each component of the stripping solution, and the synchronous operation of the stripped film and stripping solution under the automatic separation control device, a stripping and dissolution process of about 150-210 seconds is required to obtain the semiconductor lead frame etched product 160 with the photosensitive dry film of the exposed area removed.

[0040] The recommended spray pressure range for the stripping process is 0.3-1.5 Pa, with a better suitable range of 0.5-1.3 Pa and an optimal range of 0.7-1.2 Pa. The spray speed range for the stripping solution is 5.3-10.5 L / min, with a better suitable range of 5.5-10.3 L / min and an optimal range of 5.7-10.1 L / min.

[0041] like Figure 1As shown, the immersion washing tank 1 is connected to a water supply filtration system 4, which uses a water pump for water delivery. The water supply filtration system 4 includes several water supply filter cylinders 41 connected to the immersion washing tank 1 and a water supply pump 42 for pumping water from the immersion washing tank 1 into the water supply filter cylinders 41. The water supply pump 42 pumps the water from the immersion washing tank 1 into the several water supply filter cylinders 41, where each filter cylinder 41 performs filtration, thereby improving the filtration effect and enabling the membrane removal device to be reused, thus increasing its durability.

[0042] In this embodiment, the immersion washing tank 1 is connected to the mother tank self-circulation system 5. The mother tank self-circulation system 5 includes a filter mother tank 51 and a filter water pump 52 installed on the filter mother tank 51. The filter water pump 52 pumps the liquid in the immersion washing tank 1 into the filter mother tank 51. The liquid in the immersion washing tank 1 can be stored in the filter mother tank 51, thereby increasing the volume of the immersion washing tank 1 and increasing the total amount of liquid that can be circulated. With the increase in the total amount of liquid, the total usage time of the immersion washing tank 1 can be increased, thereby improving the automation level of the demolding device.

[0043] like Figure 1 and Figure 3 As shown, the film removal mechanism includes a docking frame 31 that connects to the water spray washing tank 2, a rotating roller 32 located within the docking frame 31, and a rotating motor 33 for driving the rotating roller 32 to rotate. A discharge port 34 is located on the side of the docking frame 31 away from the water spray washing tank 2, and a film recovery tank 6 is located below the discharge port 34. A film removal spray pipe 35 is located within the docking frame 31. Simultaneously, a support mechanism 7 is provided within the docking frame 31; the support mechanism 7 includes a receiving vertical plate 71 located at the bottom of the docking frame 31 and a supporting roller 72 rotatably connected to the receiving vertical plate 71. The supporting roller 72 is rotatably connected to the rotating roller 32, thereby improving the movement stability of the rotating roller 32.

[0044] In summary, through the sequentially connected immersion washing tank 1, spray washing tank 2, and stripping mechanism 3, the etching equipment can remove the photosensitive dry film from the exposed areas by spray wetting, spray penetration, spray expansion, and spray impact of the stripping solution, thereby obtaining etched copper alloy material with product structural patterns. The rotating drum 32 can separate the film and liquid, thus improving automation.

[0045] All the devices selected in this application are general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0046] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0047] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A stripping device for manufacturing semiconductor leadframe etched products, characterized in that, The device comprises: sequentially connected water immersion washing tank (1), water spraying washing tank (2) and demolding mechanism (3); the water immersion washing tank (1) is connected with upper water filtering system (4) which is delivered by water pump, and the water immersion washing tank (1) is connected with mother tank self-circulation system (5); the water spraying washing tank (2) comprises tank body (21), inner sub-tank (22) arranged at the bottom of the tank body (21) and upper spraying pipe (23) arranged at the upper part of the tank body (21); the demolding mechanism (3) comprises butt joint frame (31) butt joint with the water spraying washing tank (2), rotating drum (32) arranged in the butt joint frame (31) and rotating motor (33) for driving the rotating drum (32) to rotate, the butt joint frame (31) is provided with discharge port (34) away from the water spraying washing tank (2), and demolding water spraying pipe (35) is arranged in the butt joint frame (31); the water immersion washing tank (1) comprises first water immersion washing tank (11) and second water immersion washing tank (12) which are sequentially connected; the upper water filtering system (4) comprises a plurality of upper water filtering cylinders (41) connected with the water immersion washing tank (1) and upper water pump (42) for passing water in the water immersion washing tank (1) into the upper water filtering cylinders (41); the mother tank self-circulation system (5) comprises filtering mother tank (51) and filtering water pump (52) arranged on the filtering mother tank (51).

2. The demolding device for semiconductor lead frame etching product manufacturing according to claim 1, characterized in that, the discharge port (34) is provided with film recovery tank (6) below.

3. The demolding device for semiconductor lead frame etching product manufacturing according to claim 2, characterized in that, the butt joint frame (31) is provided with supporting mechanism (7); the supporting mechanism (7) comprises supporting vertical plate (71) arranged at the bottom of the butt joint frame (31) and supporting roller (72) rotatably connected to the supporting vertical plate (71), and the supporting roller (72) is rotatably connected with the rotating drum (32).

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