LED support and LED package structure

Abstract

The application discloses an LED support and an LED packaging structure, and the LED support comprises a cup body provided with a cup cavity and a base arranged at the bottom of the cup body; the base is provided with a first pad and a second pad for respectively connecting different polarities and a third pad for placing an LED chip; the first pad and the second pad are diagonally arranged in the cup cavity, and the third pad is located between the first pad and the second pad; a first isolation belt is arranged between the third pad and the first pad, and a second isolation belt is arranged between the third pad and the second pad. The application is provided with three pads, the first pad and the second pad are diagonally arranged in the cup cavity, the area for accommodating the LED chip is enlarged, a larger LED chip can be placed, and the light efficiency of the LED lamp bead is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED, in particular to an LED support and an LED packaging structure. BACKGROUND

[0002] In the current market, the cathode pad and the anode pad of the 2835 type LED lamp bead are arranged on the LED support according to a certain size ratio, and the two pads are separated by a single isolation belt. The LED chip is placed on the negative electrode pad with a larger size. When a larger LED chip is placed, the solderable area of the cathode pad is too small due to the too long size of the LED chip, which leads to difficult soldering. Therefore, it is difficult to continue to improve the light efficiency of the LED lamp bead by placing a larger size LED chip in the current 2835 LED packaging structure. SUMMARY

[0003] The technical problem to be solved by the present application is to provide an LED support and an LED packaging structure to solve the problem that the light efficiency of the LED lamp bead cannot be improved by placing a larger size LED chip.

[0004] To solve the above technical problems, the technical scheme adopted by the present application is:

[0005] An LED support, comprising: a cup body provided with a cup cavity, and a base provided at the bottom of the cup body;

[0006] The base is provided with a first pad and a second pad for connecting different polarities, respectively, and a third pad for placing an LED chip;

[0007] The first pad and the second pad are diagonally distributed in the cup cavity, and the third pad is located between the first pad and the second pad. A first isolation belt is arranged between the third pad and the first pad, and a second isolation belt is arranged between the third pad and the second pad.

[0008] Further, the base comprises: a first part, a second part and a third part connected to the cup body;

[0009] The first pad is arranged on the first part, the second pad is arranged on the second part, and the third pad is arranged on the third part.

[0010] Further, the periphery of the first part is provided with a first shoulder, the periphery of the second part is provided with a second shoulder, and the periphery of the third part is provided with a third shoulder. The first shoulder, the second shoulder and the third shoulder are all accommodated in the interior of the cup body.

[0011] Further, the first shoulder is provided with a first groove, the second shoulder is provided with a second groove, and the third shoulder is provided with a third groove, and the cup body is filled into the first groove, the second groove and the third groove.

[0012] Further, the third sub-body spans the cup cavity in the width direction of the cup cavity and extends to the inside of the cup body in two directions of the cup cavity width respectively.

[0013] Further, the third sub-body spans the cup cavity in the length direction of the cup cavity and extends to the inside of the cup body in two directions of the cup cavity length respectively.

[0014] Further, the area of the first pad is equal to the area of the second pad, and the ratio of the area of the first pad to the area of the third pad is 1:29.6.

[0015] Further, the third sub-body is a heat-conducting copper sheet.

[0016] An LED packaging structure, comprising: the LED support as claimed in any one of the preceding claims, and a first LED face-up chip and a second LED face-up chip arranged in the cup cavity, the anode of the first LED face-up chip and the anode of the second LED face-up chip are electrically connected with the first pad through a wire, the cathode of the first LED face-up chip and the cathode of the second LED face-up chip are electrically connected with the second pad through a wire, and the bottom of the first LED chip and the bottom of the second LED chip are connected with the third pad.

[0017] Another LED packaging structure, comprising: the LED support as claimed in any one of the preceding claims, and a first LED flip-chip and a second LED flip-chip arranged in the cup cavity, the anode of the first LED flip-chip is welded with the first pad, the cathode of the first LED flip-chip and the anode of the second LED flip-chip are welded with the third pad, and the cathode of the second LED flip-chip is welded with the second pad.

[0018] The present application has the beneficial effect that: by arranging three pads, the first pad and the second pad are arranged in the cup cavity in a diagonal distribution, the area for accommodating the LED chip is expanded, so that a larger LED chip can be placed, thereby improving the light efficiency of the LED lamp bead. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the prior art LED support;

[0020] Figure 2 It is a structural schematic diagram of the LED support of the embodiment of the present application;

[0021] Figure 3 Structure diagram of the base of the embodiment of the present application;

[0022] Figure 4 Bottom view of the base of the embodiment of the present application;

[0023] Figure 5 Detail A of Figure 4 Detail A of

[0024] Figure 6 Detail B of Figure 4 Detail B of

[0025] Figure 7 Structure diagram of the LED packaging structure of the embodiment of the present application;

[0026] Figure 8 Structure diagram of another LED packaging structure of the embodiment of the present application.

[0027] Figure 9 Bending force comparison between the LED support of the embodiment of the present application and the LED support of the prior art.

[0028] Label explanation:

[0029] 100, cup body; 110, cup cavity; 120, first isolation belt; 130, second isolation belt; 200, base; 210, first solder pad; 220, second solder pad; 230, third solder pad; 240, first part; 250, second part; 260, third part; 241, first shoulder; 251, second shoulder; 261, third shoulder; 2411, first groove; 2511, second groove; 2611, third groove; 300, first LED vertical chip; 400, second LED vertical chip; 500, first LED flip chip; 600, second LED flip chip; 700, cathode pad; 800, anode pad; 900, isolation belt. DETAILED DESCRIPTION

[0030] To make the technical content, the achieved purposes and effects of the present application clear, the following will be described in detail in combination with the embodiments and the accompanying drawings.

[0031] EMBODIMENTS

[0032] Please refer to Figure 1, the prior art 2835 model LED lamp bead, cathode pad 700 and anode pad 800 are arranged in cup cavity 110 according to certain proportional size, two pads are separated by single isolation band 900, LED chip is placed on the cathode pad 700 with larger size. When placing larger LED chip, due to the size of the LED chip is too long, the solderable area of the cathode pad 700 is small, which leads to soldering difficulty. Therefore, it is difficult to continue to improve the light efficiency of the LED lamp bead by placing larger size LED chip in the current 2835 LED packaging structure.

[0033] For the above problems, please refer to Figures 2 to 8 The application provides a LED support and LED packaging structure, and specific embodiments are as follows:

[0034] Please refer to Figure 2 The LED support includes cup body 100 provided with cup cavity 110, and base 200 provided at the bottom of cup body 100; base 200 is provided with first pad 210 and second pad 220 for respectively accessing different polarities, and third pad 230 for placing LED chip; first pad 210 and second pad 220 are diagonally distributed in cup cavity 110, third pad 230 is located between first pad 210 and second pad 220, first isolation band 120 is arranged between third pad 230 and first pad 210, and second isolation band 130 is arranged between third pad 230 and second pad 220.

[0035] The structure principle of the LED support in the embodiment is as follows: base 200 is provided with three pads in cup cavity 110, one of first pad 210 and second pad 220 accesses positive pole, and the other accesses negative pole, third pad 230 is used for placing LED chip, first pad 210 and second pad 220 are diagonally distributed, which is convenient for soldering of LED chip; in addition, the size of third pad 230 is increased in the case that the original size of cup cavity 110 does not change, which is convenient for placing larger size LED chip and does not affect the soldering operation of LED chip. The arrangement of first isolation band 120 and second isolation band 130 separates the three pads, avoids the existence of electrical connection between them, reduces abnormal conditions, and is beneficial to improve work stability.

[0036] It can be understood that when the LED package is carried out, the positive and negative poles of the LED chip correspond to the electrical connection with the first pad 210 and the second pad 220, and the cup cavity 110 can be placed in the LED chip in the area other than the diagonal area occupied by the first pad 210 and the second pad 220, so as to accommodate a larger size LED chip, thereby improving the light efficiency of the LED lamp bead. When the length of the selected LED chip is relatively long, the LED chip can also be placed in another pair of diagonal inclined positions of the cup cavity 110, so as to leave space for the first pad 210 and the second pad 220, which is beneficial to reduce the difficulty of wire bonding operation.

[0037] Please refer to Figure 3 , specifically, the base 200 includes: connecting the first part 240, the second part 250 and the third part 260 of the cup body 100; the first pad 210 is arranged on the first part 240, the second pad 220 is arranged on the second part 250, and the third pad 230 is arranged on the third part 260. In this embodiment, the first pad 210 is connected to the positive pole through the first part 240, and the second pad 220 is connected to the negative pole through the second part 250. It can be understood that the base 200 is divided into three parts in this embodiment, which is convenient for connecting the first pad 210 and the second pad 220 to different poles respectively, and is also beneficial to make the cup body 100 and the base 200 more closely combined during injection molding.

[0038] Please refer to Figure 4 , further, the periphery of the first part 240 is provided with a first shoulder 241, the periphery of the second part 250 is provided with a second shoulder 251, and the periphery of the third part 260 is provided with a third shoulder 261, the first shoulder 241, the second shoulder 251 and the third shoulder 261 are all accommodated in the interior of the cup body 100. It can be understood that the LED support further makes the cup body 100 and each part more closely connected by setting the shoulder on each part, and effectively avoids the falling of each part, which is beneficial to improve the structural stability. Please refer to Figure 4In the embodiment, the shoulder on the upper side of the first part 240 and the shoulder on the lower side of the second part 250 are both wide, and neither of them extends to the outside of the cup body 100. It can be understood that, by such arrangement, the strength of the upper side edge and the lower side edge of the bracket can be effectively improved, and after injection molding, the cup body 100 can limit the shoulder on the upper side of the first part 240 and the shoulder on the lower side of the second part 250, further avoiding the first part 240 and the second part 250 from falling off. The shoulders on the upper side and the lower side of the third part 260 are both wide, which also improves the strength of the upper side edge and the lower side edge of the bracket.

[0039] Please refer to Figure 5 and Figure 6 Furthermore, the first shoulder 241 is provided with a first groove 2411, the second shoulder 251 is provided with a second groove 2511, and the third shoulder 261 is provided with a third groove 2611, and part of the cup body 100 is filled into the first groove 2411, the second groove 2511 and the third groove 2611. It can be understood that, by arranging grooves on the first shoulder 241, the second shoulder 251 and the third shoulder 261, during injection molding, part of the cup body 100 is filled into the grooves, so that the cup body 100 and each part are combined more tightly, thereby facilitating to improve the air tightness of the bracket. In the embodiment, the openings of the first groove 2411, the second groove 2511 and the third groove 2611 all face the bottom surface of the bracket, and in other embodiments, they can also face the top surface of the bracket.

[0040] In the embodiment, the third part 260 is a heat-conducting copper sheet. It can be understood that, the LED chip generates heat when working, and in the embodiment, the heat-conducting copper sheet is used as the third part 260, so that the generated heat can be conducted away, to avoid the light-emitting efficiency of the LED lamp bead being reduced due to high temperature, and to facilitate to slow down the decay of the LED lamp bead and ensure the service life. Since the LED chip is placed on the third pad 230, the third pad 230 is only responsible for heat conduction, and the first pad 210 and the second pad 220 are separated from the third pad 230 by the first isolation belt 120 and the second isolation belt 130 respectively, therefore, the heat generated by the LED chip is difficult to be conducted to the first pad 210 and the second pad 220, avoiding the welding of the LED lamp bead from being invalid due to the temperature rise of the LED chip.

[0041] In the embodiment, the first pad 210 and the second pad 220 have equal areas, and the area ratio of the first pad 210 to the third pad 230 is 1:29.6. It can be understood that the area of the first pad 210 and the second pad 220 satisfies the welding requirement, and the area of the third pad 230 is as large as possible. On the one hand, a larger size LED chip can be accommodated to improve the light emitting efficiency of the LED lamp bead; on the other hand, the contact area of the LED chip and the third pad 230 is larger, which is more conducive to heat dissipation. In other embodiments, the area ratio between the first pad 210, the second pad 220 and the third pad 230 can be adjusted as required.

[0042] Please refer to Figure 1 , in the prior art 2835 model LED packaging structure, the two pads are respectively located on the two sides of the isolation belt in the length direction of the bracket, and are easily broken.

[0043] Please refer to Figure 2 In the embodiment, the third part 260 spans the cup cavity 110 in the width direction of the cup cavity 110 and extends to the inside of the cup body 100 in two directions of the width of the cup cavity 110. In the embodiment, the third part 260 spans the cup cavity 110 in the width direction of the cup cavity 110 and is partially located inside the cup body 100, and since the third part 260 is made of metal material, the strength of the bracket in the width direction can be effectively improved. Further, the third part 260 spans the cup cavity 110 in the length direction of the cup cavity 110 and extends to the inside of the cup body 100 in two directions of the length of the cup cavity 110. Similarly, in the embodiment, the third part 260 spans the cup cavity 110 in the length direction of the cup cavity 110 and is partially located inside the cup body 100, thereby improving the strength of the bracket in the length direction. Therefore, by such arrangement, the overall strength of the bracket is improved, and the breaking resistance is improved. Please refer to Figure 9 , the figure records the breaking force data comparison of the LED lamp bead of the embodiment and the 2835 model LED lamp bead in the prior art.

[0044] In the embodiment, the first isolation belt 120 and the second isolation belt 130 are L-shaped, and in other embodiments, the first isolation belt 120 and the second isolation belt 130 can also be arc-shaped or other shapes, and the shape of the first isolation belt 120 and the second isolation belt 130 can be set as required.

[0045] The LED packaging structure of the model 2835 in the prior art, if intending to adopt the scheme of double LED chips, the wire bonding is difficult, and if the length of the LED chip is too long, the wire bonding operation cannot be performed.

[0046] Therefore, referring to Figure 7 The embodiment further discloses an LED packaging structure adopting double LED chips, the LED chips comprising: the LED support as claimed in any one of the preceding embodiments, and a first LED forward chip 300 and a second LED forward chip 400 arranged in the cup cavity 110, the anode of the first LED forward chip 300 and the anode of the second LED forward chip 400 being electrically connected with the first bonding pad 210 through wires, the cathode of the first LED forward chip 300 and the cathode of the second LED forward chip 400 being electrically connected with the second bonding pad 220 through wires, and the bottom of the first LED chip and the bottom of the second LED chip being connected with the third bonding pad 230.

[0047] It can be understood that, since the first bonding pad 210 and the second bonding pad 220 are diagonally distributed in the cup cavity 110, the first LED forward chip 300 and the second LED forward chip 400 can be arranged side by side in the width direction of the cup cavity 110 and staggered in the length direction of the cup cavity 110, so as to leave more space for the wire bonding operation of the first bonding pad 210 and the second bonding pad 220.

[0048] Please refer to Figure 8 The embodiment further discloses another LED packaging structure, comprising: the LED support as claimed in any one of the preceding embodiments, and a first LED flip chip 500 and a second LED flip chip 600 arranged in the cup cavity 110, the anode of the first LED flip chip 500 being welded with the first bonding pad 210, the cathode of the first LED flip chip 500 and the anode of the second LED flip chip 600 being welded with the third bonding pad 230, and the cathode of the second LED flip chip 600 being welded with the second bonding pad 220.

[0049] In the embodiment, since the design of three bonding pads is adopted and the three bonding pads are independent of each other, the packaging scheme of high-voltage flip LED chips can also be adopted to realize the high-voltage flip series connection of double chips, which cannot be realized by the LED packaging structure of the model 2835 in the prior art.

[0050] In summary, the LED support provided by the application, by setting three soldering pads, the first soldering pad and the second soldering pad are arranged in a diagonal distribution in the cup cavity, which expands the area for accommodating the LED chip, so that a larger LED chip can be placed, thereby improving the light efficiency of the LED lamp bead. In addition, the third soldering pad is a heat-conducting copper sheet, which can conduct the generated heat away to avoid the light-emitting efficiency of the LED lamp bead being reduced due to high temperature, and is also conducive to slowing down the attenuation of the LED lamp bead and ensuring the service life.

[0051] In addition, corresponding shoulder portions are arranged on each of the sub-bases, so that each sub-base is prevented from falling off, and the third sub-base spans the cup cavity and extends to the inside of the cup body, which can further improve the strength of the LED support, thereby improving the anti-breaking ability and structural stability. The LED packaging structure provided by the application can accommodate a larger LED chip to improve the light-emitting efficiency of the LED lamp bead when a single LED chip scheme is adopted, and the welding operation is more convenient. When a double-LED chip normal mounting parallel scheme is adopted, the welding operation space is sufficient and the structure is stable. In addition, compared with the prior art, the double-LED chip high-voltage flip-chip series structure can also be realized, thereby increasing the diversity of the packaging structure.

[0052] The above description is only an embodiment of the application, and does not limit the patent scope of the application, and any equivalent transformation or direct or indirect application in the related technical field based on the content of the specification and drawings is also included in the patent protection scope of the application.

Claims

1. An LED holder, characterized by, The LED support comprises a cup body provided with a cup cavity and a base provided at the bottom of the cup body; The base is provided with a first pad and a second pad for accessing different polarities respectively, and a third pad for placing an LED chip; the base comprises a first part, a second part and a third part connected to the cup body; The first pad is provided on the first part, the second pad is provided on the second part, and the third pad is provided on the third part; the first pad accesses the positive pole through the first part, and the second pad accesses the negative pole through the second part; The first pad and the second pad are diagonally distributed in the cup cavity, and the third pad is located between the first pad and the second pad, and a first isolation belt is provided between the third pad and the first pad, and a second isolation belt is provided between the third pad and the second pad; The third part spans the cup cavity in the width direction of the cup cavity and extends to the inside of the cup body in two directions of the width of the cup cavity respectively; The third part spans the cup cavity in the length direction of the cup cavity and extends to the inside of the cup body in two directions of the length of the cup cavity respectively; The third part is a heat-conducting copper sheet.

2. The LED support of claim 1, wherein, The periphery of the first part is provided with a first shoulder, the periphery of the second part is provided with a second shoulder, and the periphery of the third part is provided with a third shoulder, and the first shoulder, the second shoulder and the third shoulder are accommodated in the inside of the cup body.

3. The LED support of claim 2, wherein, The first shoulder is provided with a first groove, the second shoulder is provided with a second groove, and the third shoulder is provided with a third groove, and part of the cup body is filled into the first groove, the second groove and the third groove.

4. The LED support of claim 1, wherein, The areas of the first pad and the second pad are equal, and the ratio of the area of the first pad to the area of the third pad is 1:29.

6.

5. An LED package structure, comprising: The LED support comprises a cup body provided with a cup cavity and a base provided at the bottom of the cup body; The base is provided with a first pad and a second pad for accessing different polarities respectively, and a third pad for placing an LED chip; the base comprises a first part, a second part and a third part connected to the cup body; The first pad is provided on the first part, the second pad is provided on the second part, and the third pad is provided on the third part; the first pad accesses the positive pole through the first part, and the second pad accesses the negative pole through the second part; The first pad and the second pad are diagonally distributed in the cup cavity, and the third pad is located between the first pad and the second pad, and a first isolation belt is provided between the third pad and the first pad, and a second isolation belt is provided between the third pad and the second pad; The third part spans the cup cavity in the width direction of the cup cavity and extends to the inside of the cup body in two directions of the width of the cup cavity respectively; The third part spans the cup cavity in the length direction of the cup cavity and extends to the inside of the cup body in two directions of the length of the cup cavity respectively; The third part is a heat-conducting copper sheet. The periphery of the first part is provided with a first shoulder, the periphery of the second part is provided with a second shoulder, and the periphery of the third part is provided with a third shoulder, and the first shoulder, the second shoulder and the third shoulder are accommodated in the inside of the cup body. The first shoulder is provided with a first groove, the second shoulder is provided with a second groove, and the third shoulder is provided with a third groove, and part of the cup body is filled into the first groove, the second groove and the third groove. The areas of the first pad and the second pad are equal, and the ratio of the area of the first pad to the area of the third pad is 1:29.6.

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