Display substrate and manufacturing method thereof, and display device

Abstract

The embodiments of the present disclosure provide a display substrate, a preparation method thereof, and a display device. The display substrate includes: a substrate; a first metal trace, located on one side of the substrate; a first insulating layer, located on the side of the first metal trace away from the substrate; a second metal trace, located on the side of the first insulating layer away from the substrate, the extension direction of the second metal trace is not parallel to the extension direction of the first metal trace, and the orthographic projection of the second metal trace on the substrate and the orthographic projection of the first metal trace on the substrate have a first overlapping area; a second insulating layer, located on the side of the second metal trace away from the substrate; a first protective structure layer, located on the side of the second insulating layer away from the substrate, the orthographic projection of the first protective structure layer on the substrate at least partially overlaps with the first overlapping area. The technical solution disclosed in the present disclosure can better prevent the infiltration of water vapor and corrosive elements, thereby improving the reliability and service life of the product.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, and a display device. Background Art

[0002] A liquid crystal display panel may include a thin film transistor (TFT) substrate and a color filter substrate disposed opposite to each other. In the prior art, the border area of ​​the array substrate is prone to defects, which affects the reliability and service life of the product. Summary of the Invention

[0003] The embodiments of the present disclosure provide a display substrate and a method for manufacturing the same, and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display substrate, including:

[0005] substrate;

[0006] a first metal trace located on one side of the substrate;

[0007] a first insulating layer located on a side of the first metal trace facing away from the substrate;

[0008] a second metal trace located on a side of the first insulating layer facing away from the substrate, wherein an extension direction of the second metal trace is not parallel to an extension direction of the first metal trace, and an orthographic projection of the second metal trace on the substrate and an orthographic projection of the first metal trace on the substrate have a first overlapping region;

[0009] a second insulating layer, located on a side of the second metal trace facing away from the substrate;

[0010] The first protective structure layer is located on a side of the second insulating layer facing away from the substrate, and an orthographic projection of the first protective structure layer on the substrate at least partially overlaps with the first overlapping region.

[0011] In some possible implementations, an orthographic projection of the first protection structure layer on the substrate includes a first overlapping region.

[0012] In some possible implementations, a distance between a boundary of an orthographic projection of the first protection structure layer on the substrate and a boundary of the first overlapping region is greater than 2 μm.

[0013] In some possible implementations, the display substrate includes a display area and a border area located outside the display area, the first protective structure layer is located in the border area, the display substrate also includes an electrode layer located in the display area and on the side of the second insulating layer away from the substrate, and the first protective structure layer and the electrode layer are located on the same layer.

[0014] In some possible implementations, a second protective structure layer is further included, which is located on the side of the second insulating layer facing away from the substrate, and the orthographic projection of the second protective structure layer on the substrate, the orthographic projection of the first protective structure layer on the substrate and the first overlapping area at least partially overlap.

[0015] In some possible implementations, the second protective structure layer is located between the second insulating layer and the first protective structure layer, the orthographic projection of the second protective structure layer on the substrate includes the first overlapping area, and the orthographic projection of the first protective structure layer on the substrate includes the orthographic projection of the second protective structure layer on the substrate.

[0016] In some possible implementations,

[0017] The distance between the boundary of the orthographic projection of the second protective structure layer on the substrate and the boundary of the first overlapping region is greater than 2 μm; and / or,

[0018] A distance between a boundary of an orthographic projection of the first protection structure layer on the substrate and a boundary of an orthographic projection of the second protection structure layer on the substrate is greater than 2 μm.

[0019] In some possible implementations, the display substrate further includes:

[0020] a third metal trace, located on the same layer as the first metal trace;

[0021] a fourth metal trace, located on the same layer as the second metal trace;

[0022] a first via hole penetrating the second insulating layer and the first insulating layer and exposing the third metal trace;

[0023] a second via hole penetrating the second insulating layer and exposing the fourth metal trace;

[0024] a connecting line, located on a side of the second insulating layer facing away from the substrate, and connected to the third metal trace through the first via hole and connected to the fourth metal trace through the second via hole;

[0025] The third protective structure layer is located on the side of the second insulating layer away from the substrate, and the orthographic projection of the third protective structure layer on the substrate, the orthographic projection of the connecting line on the substrate, and the orthographic projection of the first via on the substrate at least partially overlap. The orthographic projection of the third protective structure layer on the substrate, the orthographic projection of the connecting line on the substrate, and the orthographic projection of the second via on the substrate at least partially overlap.

[0026] In some possible implementations, the connecting line and the first protection structure layer are located in the same layer.

[0027] In some possible implementations, the third protection structure layer is located between the second insulation layer and the connecting line, and the third protection structure layer and the second protection structure layer are located on the same layer.

[0028] In some possible implementations,

[0029] The thickness of the first protective structure layer is in the range of 600 angstroms to 1200 angstroms; and / or,

[0030] The thickness of the second protective structure layer is in the range of 1000 angstroms to 5000 angstroms; and / or,

[0031] The material of the first protective structure layer includes a transparent conductive material; and / or,

[0032] The second protective structure layer is made of metal material.

[0033] In some possible implementations, a thin film transistor is further included in the display area, and the material of the active layer of the thin film transistor includes oxide.

[0034] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a method for preparing a display substrate, comprising:

[0035] forming a first metal trace on one side of the substrate;

[0036] forming a first insulating layer on a side of the first metal trace facing away from the substrate;

[0037] forming a second metal trace on a side of the first insulating layer facing away from the substrate, wherein an extension direction of the second metal trace is not parallel to an extension direction of the first metal trace, and an orthographic projection of the second metal trace on the substrate and an orthographic projection of the first metal trace on the substrate have a first overlapping region;

[0038] forming a second insulating layer on a side of the second metal trace facing away from the substrate;

[0039] A first protection structure layer is formed on a side of the second insulating layer facing away from the substrate, and an orthographic projection of the first protection structure layer on the substrate at least partially overlaps with the first overlapping region.

[0040] In some possible implementations, forming a first protection structure layer on a side of the second insulating layer facing away from the substrate includes:

[0041] forming a first protective film on a side of the second insulating layer facing away from the substrate;

[0042] performing patterning on the first protective film to form a pattern of a first protective structure layer, wherein an orthographic projection of the pattern of the first protective structure layer on the substrate at least partially overlaps with the first overlapping region;

[0043] The pattern of the first protection structure layer is annealed to form the first protection structure layer.

[0044] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the display panel in the embodiments of the present disclosure.

[0045] According to the technical solution of the embodiment of the present disclosure, the first protective structure layer and the second insulating layer can jointly play the role of preventing water vapor, better preventing the infiltration of water vapor and corrosive elements, avoiding the second metal traces and the first metal traces from being corroded and burned by water vapor, and improving the reliability and service life of the product.

[0046] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0048] Figure 1a is a planar schematic diagram of a display substrate;

[0049] Figure 1b for Figure 1a AA cross-section diagram in;

[0050] Figure 1c for Figure 1a Another schematic cross-sectional view of the border region of the display substrate is shown;

[0051] Figure 2 is a schematic plan view of a display substrate in one embodiment of the present disclosure;

[0052] Figure 3 for Figure 2 The diagram shows a schematic BB cross-section of a substrate in one embodiment;

[0053] Figure 4 is a schematic plan view showing a substrate in another embodiment of the present disclosure;

[0054] Figure 5 for Figure 4 The diagram shows a schematic BB cross-section of a substrate in one embodiment;

[0055] Figure 6 for Figure 2 Another cross-sectional schematic diagram of the border area of ​​the display substrate is shown.

[0056] Description of reference numerals:

[0057] 11. Display area; 12. Frame area; 21. Substrate; 221. First metal trace; 221a. Hollowing out; 222. Third metal trace; 23. First insulating layer; 241. Second metal trace; 242. Fourth metal trace; 25. Second insulating layer; 251. First via; 252. Second via; 261. Connecting line; 262. First protective structure layer; 262a. First structural portion; 262b. Second structural portion; 271. Second protective structure layer; 272. Third protective structure layer. DETAILED DESCRIPTION

[0058] In the following, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined in any manner without conflict. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0059] Figure 1a is a schematic plan view of a display substrate. Figure 1b for Figure 1a AA cross-section diagram in the figure, Figure 1c for Figure 1a Another cross-sectional schematic diagram of the border area of ​​the display substrate is shown. Figure 1a and Figure 1b As shown, the display substrate may include a display area 11 and a frame area 12 located outside the display area 11. In the frame area, the display substrate includes a base 21, a first metal trace 221, a first insulating layer 23, a second metal trace 241, and a second insulating layer 25. The first metal trace 221 is located on one side of the base 21, the first insulating layer 23 is located on a side of the first metal trace 221 facing away from the base 21, the second metal trace 241 is located on a side of the first insulating layer 23 facing away from the base 21, and the second insulating layer 25 is located on a side of the second metal trace 241 facing away from the base 21. Among them, the extension direction of the first metal trace 221 can be the second direction Y, and the extension direction of the second metal trace 241 can be the first direction X. The first direction X is not parallel to the second direction Y. The orthographic projection of the second metal trace 241 on the substrate 21 and the orthographic projection of the first metal trace 221 on the substrate 21 have a first overlapping area. Therefore, the second metal trace 241 can cross the first metal trace 221, and the second metal trace 241 can be called a metal crossover line.

[0060] from Figure 1bAs can be seen, only the second insulating layer 25 is provided on the upper side of the second metal trace 241. The material of the second insulating layer 2525 can be one of silicon oxide, silicon nitride, or silicon oxynitride. The second insulating layer 25 has poor water vapor protection capabilities, and water vapor intrusion can easily cause metal trace corrosion. Especially when the first metal trace 221221 and the second metal trace 241 are in long-term operation, the intrusion of water vapor can easily cause the second metal trace 241 and the first metal trace 221 to burn and short-circuit, resulting in poor burn-in of the second metal trace 241 and the first metal trace 221, affecting the reliability and service life of the display substrate.

[0061] like Figure 1c As shown, in the border area 12, the display substrate may further include a third metal trace 222, a fourth metal trace 242, a first via 251, a second via 252, and a connecting wire 261. The third metal trace 222 and the first metal trace 221 are located on the same layer, and the fourth metal trace 242 and the second metal trace 241 are located on the same layer. The first via 251 penetrates the second insulating layer 25 and the first insulating layer 23, exposing the third metal trace 222. The second via 252 penetrates the second insulating layer 25 and exposes the fourth metal trace 242. The connecting wire 261 is located on the side of the second insulating layer 25 facing away from the substrate 21, and is connected to the third metal trace 222 through the first via 251, and is connected to the fourth metal trace 242 through the second via 252. Thus, the connecting wire 261 connects the third metal trace 222 and the fourth metal trace 242.

[0062] like Figure 1c As shown, at the positions of the first via 251 and the second via 252, there is only a connecting line 261 above the metal trace. The water vapor protection capability at the positions of the first via 251 and the second via 252 is poor, causing the third metal trace 222 and the fourth metal trace 242 to be easily corroded by water vapor, thereby reducing the reliability of the display substrate.

[0063] Figure 2 FIG1 is a schematic plan view of a display substrate in one embodiment of the present disclosure. Figure 3 for Figure 2 FIG. 1 is a schematic diagram of a BB cross-section of a substrate in one embodiment. Figure 2 and Figure 3As shown, the display substrate may include a base 21, a first metal trace 221, a first insulating layer 23, a second metal trace 241, a second insulating layer 25, and a first protective structure layer 262. The first metal trace 221 is located on one side of the base 21, the first insulating layer 23 is located on a side of the first metal trace 221 facing away from the base 21, the second metal trace 241 is located on a side of the first insulating layer 23 facing away from the base 21, the second insulating layer 25 is located on a side of the second metal trace 241 facing away from the base 21, and the first protective structure layer 262 is located on a side of the second insulating layer 25 facing away from the base 21.

[0064] like Figure 2 and Figure 3 As shown, the extension direction of the second metal trace 241 is not parallel to the extension direction of the first metal trace 221, and the orthographic projection of the second metal trace 241 on the substrate 21 and the orthographic projection of the first metal trace 221 on the substrate 21 have a first overlapping region. The orthographic projection of the first protection structure layer 262 on the substrate 21 at least partially overlaps with the first overlapping region.

[0065] In the display substrate of the disclosed embodiment, a first protective structure layer 262 is provided on the side of the second insulating layer 25 facing away from the second metal trace 241. The orthographic projection of the first protective structure layer 262 on the substrate 21 at least partially overlaps with the first overlapping area. Thus, the first protective structure layer 262 and the second insulating layer 25 can jointly play a role in preventing water vapor, better preventing the infiltration of water vapor and corrosive elements, avoiding corrosion and burns of the second metal trace 241 and the first metal trace 221 by water vapor, and improving the reliability and service life of the product.

[0066] For example, the substrate 21 may be a glass substrate 21, a flexible substrate 21, or the like. The first insulating layer 23 and the second insulating layer 25 may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multilayer, or a composite layer. The first insulating layer 23 may be referred to as a gate insulating (GI) layer, and the second insulating layer 25 may be referred to as a passivation (PVX) layer.

[0067] For example, the extension direction of the second metal trace 241 may be perpendicular to the extension direction of the first metal trace 221. For example, the second metal trace 241 may be connected to a clock signal (CLK) of a gate driving circuit (GOA circuit) of the display substrate.

[0068] In one embodiment, Figure 2 As shown, the orthographic projection of the first protective structure layer 262 on the substrate 21 may include the first overlapping region. Thus, the first protective structure layer 262 may protect the entire first overlapping region and better prevent water vapor from intruding.

[0069] In one embodiment, Figure 2 As shown, the distance d1 between the boundary of the orthographic projection of the first protective structure layer 262 on the substrate 21 and the boundary of the first overlapping region can be greater than 2 μm. This configuration can reduce the difficulty and cost of forming the first protective structure layer 262, and the first protective structure layer 262 can better cover the first overlapping region to prevent moisture intrusion.

[0070] In one embodiment, Figure 2 As shown, the display substrate includes a display area 11 and a border area 12 located outside the display area 11. A first protective structure layer 262 is located in the border area 12. The display substrate also includes an electrode layer located in the display area 11 and on the side of the second insulating layer 25 facing away from the substrate 21. The first protective structure layer 262 is located on the same layer as the electrode layer. By arranging the first protective structure layer 262 on the same layer as the electrode layer, the first protective structure layer 262 can be formed simultaneously with the electrode layer, without increasing the number of process steps for the display substrate and reducing costs.

[0071] Illustratively, the display substrate may include a thin film transistor structure layer located in the display area 11. The thin film transistor structure layer may be located on the side of the substrate 21 facing the first metal trace 221. A second insulating layer 25 is located in the border area 12 and the display area 11. In the display area 11, the second insulating layer 25 is located on the side of the thin film transistor structure layer facing away from the substrate 21. An electrode layer is located in the display area 11 and is located on the side of the second insulating layer 25 facing away from the substrate 21. Illustratively, the electrode layer may be a pixel electrode.

[0072] In one embodiment, the material of the first protection structure layer 262 may include a transparent conductive material. For example, the material of the first protection structure layer 262 may include at least one of transparent conductive materials such as indium tin oxide (ITO) and indium zinc oxide.

[0073] In one embodiment, the film thickness of the first protective structure layer 262 can range from 600 angstroms to 1200 angstroms (including the endpoint values). Exemplarily, the film thickness of the first protective structure layer 262 can be any value between 600 angstroms and 1200 angstroms. For example, the film thickness of the first protective structure layer 262 can be 600 angstroms, 800 angstroms, 1000 angstroms, or 1200 angstroms. When the first protective structure layer 262 is disposed in the same layer as the electrode layer of the display area 11, setting the film thickness of the first protective structure layer 262 to range from 600 angstroms to 1200 angstroms (including the endpoint values) can not only ensure that the first protective structure layer 262 is protected from water vapor, but also enable the electrode layer to have good electrical conductivity and transmittance.

[0074] Exemplarily, the thin film transistor structure layer may include a thin film transistor, and the thin film transistor may include an active layer, a gate electrode, a source electrode, and a drain electrode. The first metal trace 221 may be provided in the same layer as the gate electrode, and the second metal trace 241 may be provided in the same layer as the source electrode or the drain electrode. The material of the active layer of the thin film transistor may include an oxide. For example, the material of the active layer may be an oxide. For example, the active layer may be made of various oxide materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), and indium zinc tin oxide (IZTO). In other embodiments, the material of the active layer may be various materials such as amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, and polythiophene, which are not specifically limited here.

[0075] In one embodiment, Figure 2 As shown, the first metal trace 221 may have a hollow 221a, and the orthographic projection of the hollow 221a on the substrate 21 may have a second overlapping area with the orthographic projection of the second metal trace 241 on the substrate 21. This structure can reduce the overlapping area of ​​the orthographic projections of the first metal trace 221 and the second metal trace 241 on the substrate 21, reduce the parasitic capacitance between the two, and improve the performance of the display substrate.

[0076] For example, Figure 2 As shown, the dimension of the hollow 221a in the direction perpendicular to the extension of the second metal trace 241 can be greater than the width of the second metal trace 241. Thus, the first overlapping region can include a first sub-region and a second sub-region, with the first sub-region and the second sub-region respectively located at the two ends of the hollow 221a in the extension direction of the second metal trace 241. Correspondingly, the first protection structure layer 262 can also include a first structure portion 262a and a second structure portion 262b, with the first structure portion 262a and the second structure portion 262b corresponding to the first sub-region and the second sub-region, respectively.

[0077] Figure 4 FIG1 is a schematic plan view showing a substrate in another embodiment of the present disclosure. Figure 5 for Figure 4 FIG. 1 is a schematic diagram of a BB cross-section of a substrate in one embodiment. Figure 4 and Figure 5As shown, the display substrate may further include a second protective structure layer 271. The second protective structure layer 271 may be located on a side of the second insulating layer 25 facing away from the substrate 21. The orthographic projection of the second protective structure layer 271 on the substrate 21, the orthographic projection of the first protective structure layer 262 on the substrate 21, and the first overlapping region at least partially overlap. This structure, in which the second insulating layer 25, the first protective structure layer 262, and the second protective structure layer 271 are stacked, can further prevent moisture intrusion, further preventing moisture corrosion and burn damage to the second metal traces 241 and the first metal traces 221, thereby improving product reliability and service life.

[0078] In one embodiment, Figure 5 As shown, the second protective structure layer 271 is located between the second insulating layer 25 and the first protective structure layer 262. The orthographic projection of the second protective structure layer 271 on the substrate 21 includes the first overlapping region, and the orthographic projection of the first protective structure layer 262 on the substrate 21 includes the orthographic projection of the second protective structure layer 271 on the substrate 21. It should be noted that "A" includes "B", and the boundary of "A" can coincide with the boundary of "B", or the boundary of "A" can be located outside the boundary of "B".

[0079] For example, Figure 4 As shown, the second protection structure layer 271 may include two parts, the first protection part may correspond to the first structure part 262a, and the second protection part may correspond to the second structure part 262b.

[0080] It can be understood that in the display area 11 of the display substrate, the electrode layer is usually located on the upper side, and the second protective structure layer 271 is set to be located between the second insulating layer 25 and the first protective structure layer 262, which facilitates the setting of the first protective structure layer 262 and the electrode layer on the same layer, which is conducive to simplifying the process technology of the display substrate.

[0081] In addition, if the second protective structure layer 271 is disposed on the side of the first protective structure layer 262 facing away from the substrate 21, that is, the second protective structure layer 271 is formed after the first protective structure layer 262, then there is a risk of damaging the first protective structure layer 262 when forming the second protective structure layer 271. Arranging the second protective structure layer 271 between the second insulating layer 25 and the first protective structure layer 262 allows the first protective structure layer 262 to be formed after the second protective structure layer 271, thereby avoiding damage to the first protective structure layer 262.

[0082] It should be noted that, in other embodiments, the second protection structure layer 271 may be disposed on a side of the first protection structure layer 262 facing away from the substrate 21 .

[0083] In one embodiment, the second protective structure layer 271 may be made of a metal material. For example, the second protective structure layer 271 may be made of any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). The second protective structure layer 271 may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti.

[0084] In one embodiment, the second protective structure layer 271 has a thickness ranging from 1000 angstroms to 5000 angstroms (inclusive). For example, the second protective structure layer 271 may have a thickness of 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, or 5000 angstroms. The specific thickness of the second protective structure layer 271 may be set as needed.

[0085] By adding the second protective structure layer 271 , when water vapor penetrates the first protective structure layer 262 , the water vapor will preferentially react with the second protective structure layer 271 , thereby extending the time for water vapor to corrode the second metal trace 241 and the first metal trace 221 , further improving product reliability and service life.

[0086] In one embodiment, Figure 4 and Figure 5 As shown, a distance d2 between a boundary of an orthographic projection of the second protection structure layer 271 on the substrate 21 and a boundary of the first overlapping region is greater than 2 μm.

[0087] In one embodiment, Figure 4 and Figure 5 As shown, a distance d3 between a boundary of an orthographic projection of the first protection structure layer 262 on the substrate 21 and a boundary of an orthographic projection of the second protection structure layer 271 on the substrate 21 is greater than 2 μm.

[0088] Setting d2 to be greater than 2 μm and setting d3 to be greater than 2 μm can reduce the process difficulty of forming the second protective structure layer 271 and the first protective structure layer 262 and reduce costs. In addition, the second protective structure layer 271 can better cover the first overlapping area, and the first protective structure layer 262 can better cover the second protective structure layer 271 to prevent water vapor intrusion.

[0089] It should be noted that, in the display area 11, the metal layer where the gate electrode is located may be the first metal layer, and the metal layer where the source electrode and the drain electrode are located may be the second metal layer. In the case where a third metal layer exists, the second protective structure layer 271 may be located on the same layer as the third metal layer of the display area 11, thereby further reducing the process technology.

[0090] Figure 6 for Figure 2 Another schematic cross-sectional view of the border area of ​​the display substrate is shown. In one embodiment, the display substrate may further include a third metal trace 222, a fourth metal trace 242, a first via 251, a second via 252, a connecting wire 261, and a third protective structure layer 272. The third metal trace 222 and the first metal trace 221 are located on the same layer, and the fourth metal trace 242 and the second metal trace 241 are located on the same layer. The first via 251 penetrates the second insulating layer 25 and the first insulating layer 23, exposing the third metal trace 222. The second via 252 penetrates the second insulating layer 25 and exposes the fourth metal trace 242. The connecting wire 261 is located on the side of the second insulating layer 25 facing away from the substrate 21 and is connected to the fourth metal trace 242 through the second via 252 and to the third metal trace 222 through the first via 251. Thus, the connecting wire 261 connects the third metal trace 222 and the fourth metal trace 242. The third protective structure layer 272 is located on a side of the second insulating layer 25 facing away from the substrate 21. The orthographic projection of the third protective structure layer 272 on the substrate 21, the orthographic projection of the connecting line 261 on the substrate 21, and the orthographic projection of the first via 251 on the substrate 21 at least partially overlap; the orthographic projection of the third protective structure layer 272 on the substrate 21, the orthographic projection of the connecting line 261 on the substrate 21, and the orthographic projection of the first via 251 on the substrate 21 at least partially overlap.

[0091] By providing the third protective structure layer 272, there is not only the connecting line 261 but also the third protective structure layer 272 above the third metal trace 222 and the fourth metal trace 242. Therefore, the connecting line 261 and the third protective structure layer 272 can jointly prevent water vapor from invading the third metal trace 222 and the fourth metal trace 242, thereby improving the water vapor protection capability at the positions of the first via 251 and the second via 252.

[0092] In one embodiment, the connection line 261 may be located on the same layer as the first protection structure layer 262. This can further simplify the manufacturing process and reduce costs.

[0093] In one embodiment, the third protection structure layer 272 may be located between the second insulating layer 25 and the connecting line 261 , and the third protection structure layer 272 may be located on the same layer as the second protection structure layer 271 .

[0094] In one embodiment, the orthographic projection of the third protective structure layer 272 on the substrate 21 includes the orthographic projection of the first via 251 on the substrate 21, and the orthographic projection of the third protective structure layer 272 on the substrate 21 includes the orthographic projection of the second via 252 on the substrate 21. Thus, the third protective structure layer 272 can completely cover the third metal trace 222 exposed by the first via 251 and can completely cover the fourth metal trace 242 exposed by the second via 252, further preventing moisture from intruding into the third metal trace 222 and the fourth metal trace 242.

[0095] In one embodiment, the material of the third protective structure layer 272 can be different from the material of the connecting line 261. The material of the third protective structure layer 272 can be a metal material. This can reduce the connection resistance between the third metal trace 222 and the fourth metal trace 242, thereby improving the performance of the display substrate.

[0096] Exemplarily, the material of the third protective structure layer 272 can be any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc.

[0097] An embodiment of the present disclosure also provides a method for preparing a display substrate, which may include: forming a first metal trace on one side of the substrate; forming a first insulating layer on a side of the first metal trace facing away from the substrate; forming a second metal trace on a side of the first insulating layer facing away from the substrate, wherein an extension direction of the second metal trace is not parallel to an extension direction of the first metal trace, and an orthographic projection of the second metal trace on the substrate and an orthographic projection of the first metal trace on the substrate have a first overlapping area; forming a second insulating layer on a side of the second metal trace facing away from the substrate; and forming a first protective structure layer on a side of the second insulating layer facing away from the substrate, wherein the orthographic projection of the first protective structure layer on the substrate at least partially overlaps with the first overlapping area.

[0098] Can be Figure 2 and Figure 3 The embodiment shown illustrates a method for preparing a display substrate in detail.

[0099] A first metal trace 221 is formed on one side of the substrate 21. This step may include: forming a first metal film on one side of the substrate 21, and patterning the first metal film to form the first metal trace 221, such as Figure 3 shown.

[0100] A first insulating layer 23 is formed on the side of the first metal trace 221 away from the substrate 21. Figure 3 shown.

[0101] A second metal trace 241 is formed on the side of the first insulating layer 23 away from the substrate 21. This step may include: forming a second metal film on the side of the first insulating layer 23 away from the substrate 21, and patterning the second metal film to form the second metal trace 241, such as Figure 2 and Figure 3 As shown, the extension direction of the second metal trace 241 is not parallel to the extension direction of the first metal trace 221 , and the orthographic projection of the second metal trace 241 on the substrate 21 and the orthographic projection of the first metal trace 221 on the substrate 21 have a first overlapping area.

[0102] A second insulating layer 25 is formed on the side of the second metal trace 241 away from the substrate 21. Figure 3 shown.

[0103] A first protective structure layer 262 is formed on the side of the second insulating layer 25 away from the substrate 21. Figure 3 As shown, this step may include: forming a first protective film on the side of the second insulating layer 25 facing away from the substrate 21; patterning the first protective film to form a pattern of the first protective structure layer 262, the orthographic projection of the pattern of the first protective structure layer 262 on the substrate 21 at least partially overlapping with the first overlapping area; annealing the pattern of the first protective structure layer 262 to form the first protective structure layer 262.

[0104] The first protective film is composed of small particles and contains many holes and gaps. Annealing the pattern of the first protective structure layer 262 can increase the film density and make the film uniform and stable, thereby improving the water vapor protection capability of the first protective pattern. For example, the annealing temperature can be 220°C to 300°C (inclusive).

[0105] It can be understood that the "patterning" mentioned in this article, when the patterned material is an inorganic material or metal, "patterning" includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist; when the patterned material is an organic material, "patterning" includes processes such as mask exposure and development. The evaporation, deposition, coating, and coating mentioned in this article are all mature preparation processes in the relevant technology.

[0106] Based on the inventive concepts of the aforementioned embodiments, embodiments of the present disclosure further provide a display device comprising the display substrate of the aforementioned embodiments. The display device may be a liquid crystal display device. The display device may be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0107] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0108] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0109] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0110] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0111] The disclosure above provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, these are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0112] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this disclosure, and such modifications or substitutions should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display substrate, characterized in that: include: substrate; a first metal trace located on one side of the substrate; a first insulating layer, located on a side of the first metal trace facing away from the substrate; a second metal trace located on a side of the first insulating layer facing away from the substrate, the second metal trace extending in a direction that is not parallel to the first metal trace extending in a direction, and an orthographic projection of the second metal trace on the substrate and an orthographic projection of the first metal trace on the substrate forming a first overlapping region; a second insulating layer, located on a side of the second metal trace facing away from the substrate; a first protective structure layer, located on a side of the second insulating layer facing away from the substrate, wherein an orthographic projection of the first protective structure layer on the substrate at least partially overlaps with the first overlapping region; A second protective structure layer is located on a side of the second insulating layer facing away from the substrate, and an orthographic projection of the second protective structure layer on the substrate, an orthographic projection of the first protective structure layer on the substrate, and the first overlapping area at least partially overlap.

2. The display substrate according to claim 1, wherein: An orthographic projection of the first protection structure layer on the substrate includes the first overlapping area.

3. The display substrate according to claim 2, wherein: A distance between a boundary of an orthographic projection of the first protection structure layer on the substrate and a boundary of the first overlapping region is greater than 2 μm.

4. The display substrate according to claim 1, wherein The display substrate includes a display area and a frame area located outside the display area. The first protective structure layer is located in the frame area. The display substrate also includes an electrode layer located in the display area and on the side of the second insulating layer away from the substrate. The first protective structure layer and the electrode layer are located on the same layer.

5. The display substrate according to claim 1, wherein The second protective structure layer is located between the second insulating layer and the first protective structure layer, the orthographic projection of the second protective structure layer on the substrate includes the first overlapping area, and the orthographic projection of the first protective structure layer on the substrate includes the orthographic projection of the second protective structure layer on the substrate.

6. The display substrate according to claim 5, wherein: The distance between the boundary of the orthographic projection of the second protective structure layer on the substrate and the boundary of the first overlapping area is greater than 2 μm; and / or, A distance between a boundary of an orthographic projection of the first protection structure layer on the substrate and a boundary of an orthographic projection of the second protection structure layer on the substrate is greater than 2 μm.

7. The display substrate according to claim 1, wherein: Also includes: a third metal trace, located on the same layer as the first metal trace; a fourth metal trace, located on the same layer as the second metal trace; a first via hole penetrating the second insulating layer and the first insulating layer and exposing the third metal trace; a second via hole, penetrating the second insulating layer and exposing the fourth metal trace; a connecting line, located on a side of the second insulating layer facing away from the substrate, and connected to the third metal trace through the first via hole and connected to the fourth metal trace through the second via hole; A third protective structure layer is located on a side of the second insulating layer facing away from the substrate, and the orthographic projection of the third protective structure layer on the substrate, the orthographic projection of the connecting line on the substrate, and the orthographic projection of the first via on the substrate at least partially overlap. The orthographic projection of the third protective structure layer on the substrate, the orthographic projection of the connecting line on the substrate, and the orthographic projection of the second via on the substrate at least partially overlap.

8. The display substrate according to claim 7, wherein: The connecting line and the first protection structure layer are located on the same layer.

9. The display substrate according to claim 7, wherein: The third protection structure layer is located between the second insulation layer and the connecting line, and the third protection structure layer and the second protection structure layer are located in the same layer.

10. The display substrate according to claim 1, wherein The thickness of the first protective structure layer is in the range of 600 angstroms to 1200 angstroms; and / or, The thickness of the second protective structure layer is in the range of 1000 angstroms to 5000 angstroms; and / or, The material of the first protective structure layer includes a transparent conductive material; and / or, The second protective structure layer is made of metal.

11. The display substrate according to claim 4, wherein: It also includes a thin film transistor located in the display area, and the material of the active layer of the thin film transistor includes oxide.

12. A method for preparing a display substrate, characterized in that: include: forming a first metal trace on one side of the substrate; forming a first insulating layer on a side of the first metal trace facing away from the substrate; forming a second metal trace on a side of the first insulating layer facing away from the substrate, wherein an extension direction of the second metal trace is not parallel to an extension direction of the first metal trace, and an orthographic projection of the second metal trace on the substrate and an orthographic projection of the first metal trace on the substrate have a first overlapping region; forming a second insulating layer on a side of the second metal trace facing away from the substrate; forming a first protective structure layer on a side of the second insulating layer facing away from the substrate, wherein an orthographic projection of the first protective structure layer on the substrate at least partially overlaps with the first overlapping region; A second protection structure layer is formed on a side of the second insulating layer facing away from the substrate, and an orthographic projection of the second protection structure layer on the substrate, an orthographic projection of the first protection structure layer on the substrate, and the first overlapping region at least partially overlap.

13. The method according to claim 12, characterized in that A first protective structure layer is formed on a side of the second insulating layer facing away from the substrate, comprising: forming a first protective film on a side of the second insulating layer facing away from the substrate; performing patterning on the first protective film to form a pattern of the first protective structure layer, wherein an orthographic projection of the pattern of the first protective structure layer on the substrate at least partially overlaps with the first overlapping region; An annealing process is performed on the pattern of the first protection structure layer to form the first protection structure layer.

14. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 11.

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