Light-emitting device, light-emitting module, method for manufacturing light-emitting device, and method for manufacturing light-emitting module

Abstract

The present invention provides a light-emitting device and a light-emitting module with a narrow spacing between light-emitting surfaces, and a method for manufacturing the light-emitting device and a method for manufacturing the light-emitting module. The light-emitting device (100) comprises: an element structure (15), which comprises a submount substrate (10), a light-emitting element (20) arranged on the submount substrate (10), a light-transmitting component (30) arranged on the light-emitting element (20), and a first covering component (50) covering the side surface of the light-emitting element (20) on the submount substrate (10); and a second covering component (60) covering the side surface of the element structure (15) to hold a plurality of element structures (15).

Description

Technical Field

[0001] The present invention relates to a light emitting device and a light emitting module, and a method for manufacturing the light emitting device and a method for manufacturing the light emitting module. Background Art

[0002] For example, Patent Document 1 discloses a light emitting device having a plurality of light emitting elements, a light transmissive member covering the upper surfaces of the light emitting elements, and a light reflective member integrally covering the side surfaces of the plurality of light emitting elements.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-27620

[0006] Problems to be Solved by the Invention

[0007] With regard to the high-density configuration of multiple light-emitting surfaces, there is still room for further improvement in the structure. Summary of the invention

[0008] An object of the embodiments of the present invention is to provide a light emitting device and a light emitting module having a narrow pitch between light emitting surfaces, and a method for manufacturing the light emitting device and a method for manufacturing the light emitting module.

[0009] The light-emitting device of an embodiment of the present invention comprises: an element structure, which has a sub-mounting substrate, a light-emitting element arranged on the sub-mounting substrate, a translucent component arranged on the light-emitting element, and a first covering component on the sub-mounting substrate that covers the side surface of the light-emitting element; and a second covering component that covers the side surface of the element structure and holds a plurality of the element structures.

[0010] A light emitting module according to an embodiment of the present invention includes: the light emitting device described above; and a module substrate on which the light emitting device is mounted so as to face the sub-mount substrate.

[0011] A method for manufacturing a light-emitting device according to an embodiment of the present invention includes: a process of preparing a plurality of element structures, wherein the element structures include: a submount substrate, a light-emitting element arranged on the submount substrate, a light-transmitting component arranged on the light-emitting element, and a first covering component on the submount substrate covering the side surfaces of the light-emitting element; a process of placing the plurality of element structures on the sheet component in a manner such that the submount substrate of the element structure faces the sheet component; and a process of forming a second covering component on the sheet component that covers the side surfaces of the plurality of element structures and holds the plurality of element structures.

[0012] The method for manufacturing a light emitting module according to an embodiment of the present invention includes: preparing a light emitting device using the method for manufacturing a light emitting device described above; and mounting the light emitting device so that the submount substrate faces the module substrate.

[0013] Effects of the Invention

[0014] The light emitting device according to the embodiment of the present invention can reduce the pitch between light emitting surfaces.

[0015] The light emitting module according to the embodiment of the present invention can reduce the pitch between light emitting surfaces.

[0016] The method for manufacturing a light emitting device according to the embodiment of the present invention can manufacture a light emitting device having a narrow pitch between light emitting surfaces.

[0017] The method for manufacturing a light emitting module according to the embodiment of the present invention can manufacture a light emitting module having a narrow pitch between light emitting surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A It is a perspective view schematically showing the structure of a light emitting module including the light emitting device according to the first embodiment.

[0019] Figure 1B It is a plan view schematically showing the structure of a light emitting module including the light emitting device according to the first embodiment.

[0020] Figure 1C yes Figure 1B Cross-sectional view of the IC-IC line.

[0021] Figure 1D yes Figure 1B Cross-sectional view of the ID-ID line.

[0022] Figure 1E It is a cross-sectional view schematically showing the structure of the light emitting device according to the first embodiment.

[0023] Figure 1F It is a bottom view schematically showing the structure of the light emitting device according to the first embodiment.

[0024] Figure 2 This is a flowchart of the method for manufacturing the light emitting device according to the first embodiment.

[0025] Figure 3 This is a flowchart of the method for manufacturing the light emitting module according to the first embodiment.

[0026] Figure 4A It is a cross-sectional view showing a step of placing a light-emitting element in the element structure preparation step of the method for manufacturing the light-emitting device according to the first embodiment.

[0027] Figure 4BIt is a cross-sectional view showing a step of providing a light-transmitting member in the element structure preparation step of the method for manufacturing the light-emitting device according to the first embodiment.

[0028] Figure 4C It is a cross-sectional view showing a step of forming a first covering member in the element structure preparation step of the method for manufacturing the light emitting device according to the first embodiment.

[0029] Figure 4D It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing the light emitting device according to the first embodiment.

[0030] Figure 4E It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing the light emitting device according to the first embodiment.

[0031] Figure 4F It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing the light emitting device according to the first embodiment.

[0032] Figure 4G This is a cross-sectional view showing a step of removing the sheet member in the method for manufacturing the light emitting device according to the first embodiment.

[0033] Figure 4H It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing the light-emitting module according to the first embodiment.

[0034] Figure 5A It is a plan view schematically showing the structure of a light emitting module including the light emitting device according to the second embodiment.

[0035] Figure 5B yes Figure 5A Cross-sectional view of the VB-VB line.

[0036] Figure 5C yes Figure 5A Cross-sectional view of the VC-VC line.

[0037] Figure 5D It is a cross-sectional view schematically showing the structure of a light emitting device according to a second embodiment.

[0038] Fig. 6A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a second embodiment.

[0039] Figure 6B It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the second embodiment.

[0040] Figure 6CIt is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the second embodiment.

[0041] Fig.6D It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing the light emitting device according to the second embodiment.

[0042] Fig. 6E It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the second embodiment.

[0043] Fig. 6F It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the second embodiment.

[0044] Fig. 7A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a third embodiment.

[0045] Figure 7B yes Fig. 7A Cross-sectional view along line VIIB-VIIB.

[0046] Figure 7C yes Fig. 7A Cross-sectional view of line VIIC-VIIC.

[0047] Fig.7D It is a cross-sectional view schematically showing the structure of a light emitting device according to a third embodiment.

[0048] Fig. 8A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a third embodiment.

[0049] Figure 8B It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the third embodiment.

[0050] Figure 8C It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the third embodiment.

[0051] Fig.8D It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the third embodiment.

[0052] Fig. 8E It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the third embodiment.

[0053] Figure 8FIt is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the third embodiment.

[0054] Fig.9A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a fourth embodiment.

[0055] Fig. 9B yes Fig.9A Cross-sectional view of line IXB-IXB.

[0056] Fig. 9C yes Fig.9A Cross-sectional view of the IXC-IXC line.

[0057] Fig.9D It is a cross-sectional view schematically showing the structure of a light emitting device according to a fourth embodiment.

[0058] Fig.10 This is a flowchart of a method for manufacturing a light emitting device according to a fourth embodiment.

[0059] Fig.11A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a fourth embodiment.

[0060] Fig. 11B It is a cross-sectional view showing a step of forming a third covering member in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment.

[0061] Fig. 11C It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment.

[0062] Fig.11D It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the fourth embodiment.

[0063] Fig.11E It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the fourth embodiment.

[0064] Fig.11F It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the fourth embodiment.

[0065] Fig.11G It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the fourth embodiment.

[0066] Fig.11HIt is a plan view showing a step of forming a groove in an element structure preparation step of a method for manufacturing a light emitting device according to a fourth embodiment.

[0067] Fig.11I It is a plan view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment.

[0068] Fig.11J It is a plan view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the fourth embodiment.

[0069] Figure 11K It is a plan view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the fourth embodiment.

[0070] Fig. 12A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a modification of the second embodiment.

[0071] Fig. 12B yes Fig. 12A Cross-sectional view along line XIIB-XIIB.

[0072] Fig.13A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a first modification example of the first embodiment.

[0073] Fig. 13B It is a cross-sectional view schematically showing the structure of a light emitting module including a light emitting device according to a second modification example of the first embodiment.

[0074] Fig.14A It is a plan view schematically showing the structure of a light emitting device according to a third modification example of the first embodiment.

[0075] Fig. 14B It is a bottom view schematically showing the structure of a light emitting device according to a third modification example of the first embodiment.

[0076] Fig. 14C It is schematically indicated Fig. 14B An enlarged view of the structure of the external connection electrodes of the light-emitting device.

[0077] Fig.14D It is a bottom view schematically showing the structure of a light emitting device according to a fourth modification example of the first embodiment.

[0078] Fig.14E It is a schematic representation of the loading Fig.14D A top view of the structure of a module substrate of a light-emitting device.

[0079] Fig.14F Yes means Fig.14E The module substrate and Fig.14D A top view of the positional relationship between the light-emitting devices.

[0080] Fig.15A It is a plan view schematically showing the structure of a light emitting device according to a fifth modification example of the first embodiment.

[0081] Fig. 15B It is a bottom view schematically showing the structure of a light emitting device according to a fifth modification example of the first embodiment.

[0082] Fig. 15C It is a bottom view schematically showing the structure of a light emitting device according to a sixth modification example of the first embodiment.

[0083] Fig.15D It is a schematic representation of the loading Fig. 15C A top view of the structure of a module substrate of a light-emitting device.

[0084] Fig.15E Yes means Fig.15D The module substrate and Fig. 15C A top view of the positional relationship between the light-emitting devices.

[0085] Fig.16A It is a plan view schematically showing the structure of a light emitting device according to a seventh modification example of the first embodiment.

[0086] Fig. 16B It is a bottom view schematically showing the structure of a light emitting device according to a seventh modification example of the first embodiment.

[0087] Fig. 16C It is a bottom view schematically showing the structure of a light emitting device according to an eighth modification example of the first embodiment.

[0088] Fig.16D It is a schematic representation of the loading Fig. 16C A top view of the structure of a module substrate of a light-emitting device.

[0089] Fig.16E Yes means Fig.16D The module substrate and Fig. 16C A top view of the positional relationship between the light-emitting devices.

[0090] Fig.17A This is a flowchart of another method for manufacturing the light emitting device according to the first embodiment.

[0091] Fig. 17B This is a flowchart of another method for manufacturing the light emitting device according to the fourth embodiment. DETAILED DESCRIPTION

[0092] The following describes the implementation mode with reference to the accompanying drawings. However, the following implementation mode is an example of a light-emitting device and a light-emitting module, as well as a method for manufacturing a light-emitting device and a method for manufacturing a light-emitting module for embodying the technical idea of ​​the present implementation mode, and is not limited to the following implementation mode. In addition, the size, material, shape, relative configuration, etc. of the constituent parts described in the implementation mode, unless there is a specific description, are not intended to limit the scope of the present invention to these, but are just simple examples. In addition, the size, positional relationship, etc. of the parts shown in the various drawings are sometimes exaggerated for the purpose of clarifying the description. In addition, in order to facilitate the understanding of the structure, the light-emitting elements shown in each figure are illustrated in the number set as an example.

[0093] (First Embodiment)

[0094] Figure 1A It is a perspective view schematically showing the structure of a light emitting module including the light emitting device according to the first embodiment. Figure 1B It is a plan view schematically showing the structure of a light emitting module including the light emitting device according to the first embodiment. Figure 1C yes Figure 1B Cross-sectional view of the IC-IC line. Figure 1D yes Figure 1B Cross-sectional view of the ID-ID line. Figure 1E It is a cross-sectional view schematically showing the structure of the light emitting device according to the first embodiment. Figure 1F It is a bottom view schematically showing the structure of the light emitting device according to the first embodiment.

[0095] The light emitting module 200 includes a light emitting device 100 and a module substrate 80 on which the light emitting device 100 is mounted.

[0096] [Light-emitting device]

[0097] First, the light emitting device 100 will be described.

[0098] The light emitting device 100 includes a plurality of light emitting surfaces on the upper surface as light extraction regions of the light emitting device 100 .

[0099] The light emitting device 100 includes: an element structure 15 including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmissive component 30 disposed on the light emitting element 20, and a first covering component 50 covering the side surfaces of the light emitting element 20 on the submount substrate 10; and a second covering component 60 covering the side surfaces of the element structure 15 to hold a plurality of element structures 15. The upper surface of the light transmissive component 30 is exposed from the second covering component 60, and constitutes a plurality of light emitting surfaces of the light emitting device 100.

[0100] In the light emitting device 100, a plurality of element structures 15 each having a light emitting surface is held by the second cover member 60. The second cover member 60 can hold the element structures 15 in a desired arrangement, so that a plurality of light emitting surfaces can be densely arranged at a narrower distance.

[0101] The light emitting device 100 mainly includes a submount substrate 10 , a light emitting element 20 , a protection element 25 , a light transmissive member 30 , a light guiding member 40 , a first covering member 50 , and a second covering member 60 .

[0102] Hereinafter, each structure of the light emitting device 100 will be described.

[0103] The submount substrate 10 is a member on which the light emitting element 20 and the protection element 25 are mounted. The submount substrate 10 is formed in a substantially rectangular shape in plan view, for example.

[0104] As the submount substrate 10, an insulating material is preferably used, and a material that is difficult to transmit light emitted from the light emitting element 20 or external light is preferably used. For example, ceramics such as alumina, aluminum nitride, and mullite; thermoplastic resins such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or liquid crystal polymers; and thermosetting resins such as epoxy resins, silicone resins, modified epoxy resins, polyurethane resins, or phenolic resins can be used. Among them, ceramics with excellent heat dissipation are preferably used.

[0105] The submount substrate 10 has wiring for electrically connecting to the light emitting element 20 or an external power source on the upper surface, the lower surface and the inside. The wiring can be formed using, for example, a metal such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, or an alloy containing at least one of them.

[0106] For example, as the submount substrate 10, there can be cited a substrate having an upper surface wiring 2 connected to the light emitting element 20 on the upper surface on which the light emitting element 20 is mounted, and an external connection electrode 3 (for example, an anode electrode 3a and a cathode electrode 3b) electrically connected to an external power source on the lower surface opposite to the upper surface on which the light emitting element 20 is mounted. In this case, the upper surface wiring 2 and the external connection electrode 3 may also be formed with a through hole 4 that penetrates both the upper surface and the lower surface, that is, penetrates the submount substrate 10. Thus, the upper surface wiring 2 and the external connection electrode 3 are electrically connected.

[0107] In the light-emitting device 100, the distance L1 between adjacent sub-mount substrates 10 is preferably greater than 0.05 mm and less than 0.2 mm. Thus, since the thickness of the second covering member 60 disposed between the sub-mount substrates 10 is greater than 0.05 mm and less than 0.2 mm, the adjacent sub-mount substrates 10 can be densely bonded to each other. In addition, in the light-emitting device 100 having a plurality of element structures 15, the plurality of element structures 15 respectively have a sub-mount substrate 10, and the second covering member 60 is disposed between the sub-mount substrates 10, thereby suppressing the influence of thermal stress caused by the expansion or contraction of the sub-mount substrate 10 caused by the heat generated by each element structure 15 and the thermal process when the light-emitting device is installed.

[0108] The light emitting element 20 is a semiconductor element that emits light when a voltage is applied. The shape and size of the light emitting element 20 can be any shape and size. As the light color of the light emitting element 20, a light color of any wavelength can be selected according to the application. For example, as a blue light emitting element 20 (light with a wavelength of 430 to 500 nm) or a green light emitting element 20 (light with a wavelength of 500 to 570 nm), a nitride semiconductor (Indium nitride) can be used. X Al Y Ga 1－X－Y As the red light emitting element 20 (light with a wavelength of 610 to 700 nm), in addition to the nitride-based semiconductor element, GaAlAs, AlInGaP, etc. can be used.

[0109] The light emitting element 20 preferably has positive and negative element electrodes on one surface, so that it can be flip-chip mounted on wiring on the submount substrate 10 using the conductive adhesive 8. The conductive adhesive 8 may be, for example, eutectic solder, conductive paste, or bumps.

[0110] The protection element 25 is, for example, a Zener diode and has positive and negative element electrodes on one surface, and is flip-chip mounted on wiring on the submount substrate 10 via a conductive adhesive 8. The light emitting device may not include the protection element 25.

[0111] The light-transmitting component 30 is a flat-plate-shaped component having an upper surface that becomes the main light-emitting surface of each element structure 15 and the light-emitting device 100 and a lower surface opposite to the upper surface. The light-transmitting component 30 is, for example, a light-transmitting component formed of resin, glass, an inorganic substance, etc. The light-transmitting component 30 is arranged on the light-emitting element 20. The light-transmitting component 30 preferably has an upper surface wider than the upper surface of the light-emitting element 20, and is preferably arranged to enclose the light-emitting element 20 in a plan view.

[0112] In the light-emitting device 100, the distance L2 between the translucent components 30 exposed on the upper surface of the light-emitting device 100 is preferably 0.2 mm or less. If the distance L2 between adjacent translucent components 30 is 0.2 mm or less, for example, when the light-emitting device 100 is used as a light source for a variable-light distribution headlamp (Adaptive Driving Beam: ADB (Adaptive High Beam System)) of a vehicle, the light source can be reduced, thereby reducing the size of the headlamp lens. Therefore, the main lens can be omitted in the optical system. In addition, the loss of light passing through the headlamp lens can be reduced. From the viewpoint of further reducing the light source, the distance L2 between adjacent translucent components 30 is more preferably 0.1 mm or less, and more preferably 0.05 mm or less. From the viewpoint of easy manufacturing of the light-emitting device 100, the distance L2 between the translucent components 30 is preferably 0.03 mm or more.

[0113] The planar shape of the light-transmitting member 30 may be various shapes such as a circle, an ellipse, a square, or a polygon such as a hexagon. Among them, a rectangle such as a square or a rectangle is preferred from the viewpoint of arranging a plurality of light-emitting surfaces close to each other, and a shape similar to the planar shape of the light-emitting element 20 is more preferred.

[0114] The light-transmitting component 30 may include a wavelength conversion component. As the wavelength conversion component, for example, a phosphor can be cited. The light-transmitting component 30 containing a phosphor can be, for example, a component containing a phosphor powder in a sintered body of the phosphor, a resin, a glass, a ceramic or other inorganic substance. In addition, the light-transmitting component 30 may also form a light-transmitting layer such as a resin layer containing a phosphor or a glass layer containing a phosphor on the surface of a light-transmitting plate as a molded body of resin, glass, ceramic or the like. In addition, the light-transmitting component 30 may also contain fillers such as diffusion materials according to the purpose. In addition, in the case of containing fillers such as diffusion materials, the light-transmitting component 30 may be a component containing fillers in resin, glass, ceramic or other inorganic substances, or a component forming a light-transmitting layer such as a resin layer containing fillers or a glass layer containing fillers on the surface of a light-transmitting plate as a molded body of resin, glass, ceramic or the like.

[0115] As the phosphor, a phosphor known in the art can be used. For example, as a phosphor emitting green light, yttrium aluminum garnet phosphors (such as Y3(Al, Ga) 5 O 12 :Ce), lutetium aluminum garnet phosphors (such as Lu 3 (Al, Ga) 5 O 12 :Ce), terbium aluminum garnet phosphors (such as Tb 3 (Al, Ga) 5 O 12:Ce), silicate phosphors (such as (Ba, Sr) 2 SiO 4 :Eu), chlorosilicate phosphors (such as Ca 8 Mg(SiO 4 ) 4 C l2 :Eu), β-sialon phosphors (such as Si 6－ z Al z O z N 8－z :Eu(0<z<4.2)), SGS series phosphors (for example, SrGa 2 S 4 :Eu) etc. As the phosphor emitting yellow light, α-sialon phosphors (such as Mz(Si,Al) 12 (O, N) 16 (where 0<z≤2, M is Li, Mg, Ca, Y, and lanthanoid elements other than La and Ce), etc. In addition, among the above-mentioned green light emitting phosphors, there are also yellow light emitting phosphors.

[0116] In addition, for example, yttrium aluminum garnet-based phosphors can shift the emission peak wavelength to the long wavelength side by replacing part of Y with Gd, and can emit yellow light. In addition, there are also fluorescent substances that can emit orange light. As phosphors that emit red light, nitrogen-containing calcium aluminosilicate (CASN or SCASN)-based phosphors (such as (Sr, Ca)AlSiN 3 :Eu), BSESN series phosphors (for example, (Ba, Sr, Ca) 2 Si 5 N 8 :Eu) etc. Manganese activated fluoride phosphor (formula (I) A 2 [M 1－a Mn a F 6 ] represented by a phosphor, (wherein, in the above general formula (I), A is selected from K, Li, Na, Rb, Cs and NH 4 At least one of the elements in the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0<a<0.2). As a representative example of the manganese-activated fluoride-based phosphor, a manganese-activated potassium fluorosilicate phosphor (e.g., K 2 SiF 6 :Mn).

[0117] As the diffusion material, a material known in the art can be used, for example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, etc. can be used.

[0118] When a resin is used as the light-transmitting component 30 or when a resin is used as a binder for a fluorescent substance or a diffusion material, examples of the resin material include thermosetting resins such as epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins.

[0119] The light guide member 40 is disposed between the light transmissive member 30 and the light emitting element 20, and is a member that joins the light emitting element 20 and the light transmissive member 30. In addition, the light guide member 40 is a member that easily extracts light from the light emitting element 20 and guides the light from the light emitting element 20 to the light transmissive member 30. The light guide member 40 can improve the extraction efficiency of the light beam and light. The light guide member 40 is preferably also provided on the side of the light emitting element 20.

[0120] The light guide member 40 covering the side surface of the light emitting element 20 can be formed by allowing an adhesive member bonding the light transmissive member 30 and the light emitting element 20 to wet and spread toward the side surface of the light emitting element 20 .

[0121] The light-guiding component 40 is formed into a triangular shape in such a way that the width of the component widens from the lower surface of the light-emitting element 20 (the side of the sub-mounting substrate 10) toward the translucent component 30 in a cross-sectional view. By adopting such a method, light traveling laterally from the light-emitting element 20 is easily reflected upward, so that the light beam and the light extraction efficiency are further improved. However, the cross-sectional shape of the outer side surface of the light-guiding component 40 is not limited to a straight line shape, but may also be a curved shape. For example, the curved shape of the light-guiding component 40 may be a curved shape that bulges toward the first covering component 50 side, or may be a curved shape that is recessed toward the light-emitting element 20 side.

[0122] The light guide member 40 only needs to cover the region including the light emitting portion of the side surface of the light emitting element 20 , but it is more preferable to cover substantially the entire side surface of the light emitting element 20 from the viewpoint of improving the light beam and light extraction efficiency.

[0123] As the light guide member 40, for example, a light-transmitting resin material can be used. In addition, the light guide member 40 can include, for example, a light-transmitting adhesive material such as a resin used for the light-transmitting member 30. In addition, the above-mentioned diffusion material can also be contained. In this way, light can be made to be incident on the light-transmitting member 30 more uniformly, and color unevenness of the light-emitting device 100 can be suppressed.

[0124] The first cover member 50 is provided on the submount substrate 10 and covers the side surfaces of the light emitting element 20. The first cover member 50 can improve the adhesion between the submount substrate 10 and the light emitting element 20. The first cover member 50 covers the side surfaces of the light emitting element 20 via the light guide member 40.

[0125] The first cover member 50 is formed, for example, in a triangular cross-sectional shape in such a manner that the width of the member increases from the light-transmitting member 30 side toward the sub-mount substrate 10 in a cross-sectional view. The cross-sectional shape of the outer side surface of the first cover member 50 is not limited to a straight line shape, but may also be a curved shape. For example, the curved shape of the first cover member 50 may be a curved shape that bulges toward the second cover member 60 side, or may be a curved shape that is recessed toward the light-emitting element 20 side.

[0126] As the first covering member 50, for example, a material containing a reflective material in a light-transmitting resin material can be used. As the resin material used for the first covering member 50, for example, silicone resin, epoxy resin, urea resin, etc. can be listed. In particular, silicone resin with excellent light resistance and heat resistance is preferably used. As the reflective material, for example, titanium oxide, silicon dioxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, silicon nitride, and boron nitride can be listed. Among them, from the viewpoint of light reflection, titanium oxide with a relatively high refractive index is preferably used.

[0127] The first covering member 50 only needs to cover at least a portion of the side surface of the light-emitting element 20. Preferably, the first covering member 50 covers the entire side surface of the light-emitting element 20. More preferably, it extends from the side surface of the light-emitting element 20 to cover at least a portion of the side surface of the light-transmitting member 30. Thus, in each element structure 15, it is possible to suppress the light from the side surface of the light-emitting element 20 from being directly emitted to the outside. Thus, in a light-emitting device 100 having a plurality of element structures 15, it is possible to suppress light leakage to adjacent element structures 15, and it is possible to form a light-emitting device 100 with less uneven light emission. In addition, as described later, when a sorting process is performed after each element structure 15 is singulated, it is easier to grasp the chromaticity coordinates of the element structure 15.

[0128] The first cover member 50 preferably covers the lower surface of the light emitting element 20. Thus, light traveling below the light emitting element 20 is incident on the first cover member 50, thereby further improving the luminous flux of the light emitting device 100. In addition, the bonding strength between the submount substrate 10 and the light emitting element 20 can be further improved.

[0129] The second covering member 60 is a member disposed around the plurality of element structures 15. The second covering member 60 is preferably made of a resin material. The second covering member 60 is formed, for example, by covering the side surfaces of the element structures 15 with a white resin containing a reflective material in a translucent resin material. That is, the second covering member 60 covers the side surfaces of the sub-mount substrate 10, the side surfaces of the first covering member 50, and the side surfaces of the translucent member 30. The second covering member 60 is also disposed between adjacent element structures 15, exposing the upper surface of the translucent member 30, and covering the outer peripheral side surfaces of each of the plurality of element structures 15.

[0130] The resin material used for the second cover member 60 may be the resin material exemplified as the resin material used for the first cover member 50. The reflective material contained in the resin used for the second cover member 60 may be the reflective material exemplified as the reflective material used for the first cover member 50.

[0131] The light emitting device 100 includes a plurality of element structures 15, each of which includes a first covering member 50 covering the side surface of the light emitting element 20, thereby preventing the light emitted from the light emitting element 20 from leaking laterally. As a result, the plurality of element structures 15 can be arranged closer together without reducing the light extraction efficiency of each element structure 15.

[0132] In the light emitting device 100, as an example, four element structures 15 arranged in a matrix of 2 rows and 2 columns are held by the second covering member 60. The element structures 15 are arranged so that the protection element 25 is located outside. Thus, the four light-transmitting members 30 can be arranged in a matrix at a narrower interval. The light emitting device can have 3 or less element structures 15, or 5 or more element structures 15.

[0133] [Light-emitting module]

[0134] Next, the light emitting module 200 will be described.

[0135] The light emitting module 200 includes: the light emitting device 100 having the structure described above; and a module substrate 80 on which the light emitting device 100 is mounted so as to face the sub-mount substrate 10 of the light emitting device 100 .

[0136] In addition, when the light emitting device 100 does not include the protection element 25 , it is preferable to configure the module substrate 80 side to include the protection element 25 . In addition, the module substrate 80 may be configured to include other electronic components besides the protection element 25 .

[0137] The light emitting device 100 has the above-described structure.

[0138] The module substrate 80 is a member on which the light emitting device 100 is mounted, and electrically connects the light emitting device 100 to the outside. The module substrate 80 is formed in a substantially rectangular shape in a plan view, for example.

[0139] As a material of the module substrate 80 , for example, the materials exemplified as the material for the sub-mount substrate 10 can be cited.

[0140] The module substrate 80 has wiring on its upper surface for electrical connection with the light emitting device 100. The wiring of the module substrate 80 may be made of the materials exemplified as the wiring of the submount substrate 10. Alternatively, a composite material of an insulating material and a metal member may be used.

[0141] The light emitting device 100 is mounted on the upper surface of the module substrate 80 so that the wiring of the submount substrate 10 and the wiring of the module substrate 80 are bonded via a conductive adhesive. As the conductive adhesive, for example, eutectic solder, conductive paste, bumps, etc. can be used.

[0142] [Operation of the light-emitting module]

[0143] When the light emitting module 200 is driven, current is supplied from an external power source to the light emitting element 20, and the light emitting element 20 emits light. Of the light emitted by the light emitting element 20, the light traveling upward is extracted to the outside above the light emitting device 100 via the light-transmitting component 30. In addition, the light traveling downward is reflected by the submount substrate 10, and is extracted to the outside of the light emitting device 100 via the light-transmitting component 30. In addition, the light traveling horizontally is reflected by the first covering component 50 and / or the second covering component 60, and is extracted to the outside of the light emitting device 100 via the light-transmitting component 30. At this time, by making the distance between the light-transmitting components 30 narrower (for example, less than 0.2 mm), for example, when the light emitting module 200 is used as a light source for a vehicle headlamp, the structure of the optical system can be made simple and small.

[0144] (Manufacturing method of first embodiment)

[0145] Figure 2 This is a flowchart of the method for manufacturing the light emitting device according to the first embodiment. Figure 3 This is a flowchart of the method for manufacturing the light emitting module according to the first embodiment. Figure 4A It is a cross-sectional view showing a step of placing a light-emitting element in the element structure preparation step of the method for manufacturing the light-emitting device according to the first embodiment. Figure 4B It is a cross-sectional view showing a step of providing a light-transmitting member in the element structure preparation step of the method for manufacturing the light-emitting device according to the first embodiment. Figure 4C It is a cross-sectional view showing a step of forming a first covering member in the element structure preparation step of the method for manufacturing the light emitting device according to the first embodiment. Figure 4D It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing the light emitting device according to the first embodiment. Figure 4E It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing the light emitting device according to the first embodiment. Figure 4FIt is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing the light emitting device according to the first embodiment. Figure 4G This is a cross-sectional view showing a step of removing the sheet member in the method for manufacturing the light emitting device according to the first embodiment. Figure 4H It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing the light-emitting module according to the first embodiment.

[0146] [Method for manufacturing light emitting device]

[0147] First, an example of a method for manufacturing the light emitting device 100 will be described.

[0148] The manufacturing method of the light-emitting device 100 includes: an element structure preparation step S101, which is a step of preparing a plurality of element structures 15, wherein the element structure 15 has a sub-mounting substrate 10, a light-emitting element 20 arranged on the sub-mounting substrate 10, a light-transmitting component 30 arranged on the light-emitting element 20, a light-guiding component 40 arranged on the side of the light-emitting element 20, and a first covering component 50 covering the side of the light-emitting element 20 on the sub-mounting substrate 10; an element structure placement step S102, which is a step of placing the plurality of element structures 15 on the sheet component 70 in such a manner that the sub-mounting substrate 10 of the element structure 15 faces the sheet component 70; a second covering component forming step S103, which is a step of forming a second covering component 60 on the sheet component 70 that covers the side of the plurality of element structures 15 and holds the plurality of element structures 15; and a sheet component removal step S104, which is a step of removing the sheet component 70.

[0149] The element structure preparation step S101 includes: an aggregate substrate preparation step S101a, which is a step of preparing an aggregate substrate 11, wherein the aggregate substrate 11 includes a plurality of sub-mounting areas 12 that become sub-mounting substrates 10 after the aggregate substrate 11 is divided; a light-emitting element placement step S101b, which is a step of placing light-emitting elements 20 in the plurality of sub-mounting areas 12; a light-transmitting component setting step S101c, which is a step of setting a light-transmitting component 30 on each light-emitting element 20; a light-guiding component setting step S101d, which is a step of setting a light-guiding component 40 on the side of each light-emitting element 20; a first covering component forming step S101e, which is a step of forming a first covering component 50 covering the side of each light-emitting element 20 on the aggregate substrate 11; and an element structure manufacturing step S101f, which is a step of dividing the aggregate substrate 11 according to each sub-mounting area 12 to manufacture a plurality of element structures 15.

[0150] In addition, the material and arrangement of each component are the same as those described in the above description of the light emitting device 100, and thus the description thereof will be appropriately omitted here.

[0151] (Element structure preparation process)

[0152] The element structure preparation step S101 is a step of preparing a plurality of element structures 15 including a submount substrate 10 , a light emitting element 20 , a light transmissive member 30 , a light guide member 40 , and a first cover member 50 .

[0153] In this step S101, steps including a collective substrate preparation step S101a, a light emitting element placement step S101b, a light transmissive member placement step S101c, a light guide member placement step S101d, a first covering member formation step S101e, and an element structure fabrication step S101f are performed.

[0154] (Assembly substrate preparation process)

[0155] The collective substrate preparation step S101 a is a step of preparing the collective substrate 11 including a plurality of sub-mount regions 12 that become sub-mount substrates 10 after the collective substrate 11 is divided.

[0156] The collective substrate 11 is a single substrate including a plurality of submounting regions 12 on which the light emitting elements 20 are mounted. Figure 4A In the figure, for convenience, the collective substrate 11 including two sub-mounting regions 12 is illustrated, but the number of the sub-mounting regions 12 can be adjusted appropriately.

[0157] (Light Emitting Element Mounting Step)

[0158] The light emitting element placement step S101 b is a step of placing the light emitting elements 20 on the plurality of sub-mounting regions 12 .

[0159] In step S101b, a plurality of light emitting elements 20 are mounted on a plurality of sub-mounting regions 12. The light emitting elements 20 are flip-chip mounted on wiring arranged in the sub-mounting regions 12 with the electrode forming surface as the mounting surface via the conductive adhesive 8.

[0160] This step S101b includes a step of placing the protection element 25 on the plurality of sub-mounting regions 12. That is, in this step S101b, the plurality of protection elements 25 are placed on the plurality of sub-mounting regions 12, respectively.

[0161] (Light-transmitting member installation step)

[0162] The light-transmitting member providing step S101 c is a step of providing the light-transmitting member 30 on each light-emitting element 20 .

[0163] In step S101 c , for example, a light-transmitting member 30 having a predetermined shape is bonded to the upper surface of the light-emitting element 20 opposite to the electrode-forming surface (that is, the main light extraction surface side).

[0164] In the step S101c, for example, a translucent component 30 is placed on the light-emitting element 20 on the upper surface of which an adhesive component is arranged. Thus, the translucent component 30 is bonded to the upper surface of the light-emitting element 20 via the adhesive component. As described later, the adhesive component is pressed by the translucent component 30 to form a light-guiding component 40 of a predetermined thickness. Preferably, the lower surface of the translucent component 30 is wider than the upper surface of the light-emitting element 20. Thus, the adhesive component easily extends to the side of the light-emitting element 20. In addition, after the adhesive component is arranged on the translucent component 30, the translucent component 30 can be placed on the light-emitting element 20 in such a manner that the adhesive component on the translucent component 30 is arranged on the upper surface of the light-emitting element 20.

[0165] When the light-transmitting member 30 is bonded to the light-emitting element 20 , the bonding may be performed by a direct bonding method without using an adhesive member.

[0166] (Light guide component installation process)

[0167] The light guide member installation step S101 d is a step of installing the light guide member 40 on the side surface of each light emitting element 20 .

[0168] In step S101 d , the amount of the adhesive member is adjusted so that the adhesive member provided between the light emitting element 20 and the light transmissive member 30 extends to the side surface of the light emitting element 20 , thereby forming the light guide member 40 as the adhesive member on the side surface of the light emitting element 20 .

[0169] In addition, a light guide member 40 as an adhesive member is arranged with a predetermined thickness between the upper surface (i.e., the main light extraction surface side) of the light emitting element 20 and the lower surface (the surface side opposite to the light extraction surface) of the light transmissive member 30. In addition, as long as the light emitting element 20 and the light transmissive member 30 can be bonded, the light guide member 40 between the upper surface of the light emitting element 20 and the lower surface of the light transmissive member 30 may be placed in an extremely thin state. In this way, through step S101c and step S101d, a step of placing the light transmissive member 30 on the upper surface of the light emitting element 20 and forming the light guide member 40 on the side surface of the light emitting element 20 is constituted.

[0170] In this way, when an adhesive member for bonding the light emitting element 20 and the light transmissive member 30 is used as the light guide member 40, the light transmissive member setting step and the light guide member setting step can be performed as the same step.

[0171] (First Covering Member Forming Step)

[0172] The first covering member forming step S101 e is a step of forming the first covering member 50 covering the side surfaces of each light emitting element 20 on the collective substrate 11 .

[0173] In this step S101e, a first covering member 50 is formed on the collective substrate 11 to cover the side surfaces of each light emitting element 20 via the light guide member 40 provided on the side surfaces of the light emitting element 20. In addition, the first covering member 50 may also be arranged between the light emitting element 20 and the collective substrate 11. In this step S101e, the first covering member 50 is preferably provided in a manner to cover the lower surface of each light emitting element 20.

[0174] In step S101e, an uncured resin material forming the first cover member 50 is placed on the collective substrate 11 by potting, spraying, etc. Then, the resin material is cured to form the first cover member 50.

[0175] (Element structure manufacturing process)

[0176] The element structure manufacturing step S101 f is a step of dividing the collective substrate 11 for each sub-mounting region 12 to manufacture a plurality of element structures 15 .

[0177] In this step S101 f , the element structures 15 are separated into individual pieces by dividing the collective substrate 11 at predetermined positions, thereby obtaining a plurality of element structures 15 .

[0178] The manufacturing method of the light emitting device 100 is to combine and manufacture a plurality of monolithic element structures 15. That is, since the sorting process can be performed after each element structure 15 is monolithic, element structures having light emission characteristics within a predetermined range can be sorted from the monolithic element structures 15 to form the light emitting device 100 in a desired combination. Thus, the light emitting device 100 with less color deviation and desired light emission color can be obtained.

[0179] In addition, by providing each element structure 15 with a first covering member 50, even when the luminous color of the element structure 15 is different from that of the light-emitting element 20, for example when the translucent member 30 includes a wavelength conversion member, elements having luminous characteristics within a specified range can be easily sorted.

[0180] In addition, in the case where a part of the element structure 15 is defective during the manufacturing process, only the defective element structure 15 can be discarded before the element structure 15 is placed on the sheet member 70. In the case of a light-emitting device in which a plurality of light-emitting elements are placed on a sub-mount substrate, if a part of the component is defective, the entire light-emitting device needs to be discarded. Therefore, the manufacturing method of the light-emitting device of this embodiment can reduce the number of components discarded when a defect occurs during the process.

[0181] (Element structure mounting step)

[0182] The element structure placing step S102 is a step of placing a plurality of element structures 15 on the sheet member 70 in a manner that the submount substrate 10 of the element structure 15 faces the sheet member 70. That is, the plurality of element structures 15 are placed on the sheet member 70 in a manner that the lower surface of the submount substrate 10 (i.e., the surface on the opposite side to the surface on which the light-emitting element 20 is placed) is in contact with the upper surface of the sheet member 70. The sheet member 70 is provided with an adhesive 72 on a support body 71. In addition, in the case where the element structure 15 has an external connection electrode 3 on the lower surface, it is preferred to arrange the element structure 15 on the sheet member 70 in a manner that the lower surface is pressed into the adhesive 72 so that the external connection electrode 3 is buried in the adhesive 72 of the sheet member 70. Thereby, in the second covering member forming step S103 described later, it is possible to suppress the second covering member 60 from spreading to the surface of the external connection electrode 3.

[0183] In step S102, the singulated element structures 15 are arranged on the sheet member 70. Therefore, when a blade is used for singulation, the element structures 15 can be arranged at a distance shorter than the width of the blade. Thus, the light emitting device 100 with a narrow pitch of light emitting surfaces can be formed.

[0184] Examples of the sheet member 70 include those known in the art, such as a heat-resistant resin sheet and a UV curing sheet.

[0185] (Second Covering Member Forming Step)

[0186] The second covering member forming step S103 is a step of forming the second covering member 60 which covers the side surfaces of the plurality of element structures 15 and holds the plurality of element structures 15 on the sheet member 70 .

[0187] In step S103, an uncured resin material for forming the second covering member 60 is placed on the sheet member 70 by potting, spraying, etc. Then, the resin material is cured to form the second covering member 60.

[0188] In step S103, the second covering member 60 is provided so as to cover the side surfaces of the element structure 15 (i.e., the side surfaces of the submount substrate 10, the side surfaces of the light emitting element 20, and the side surfaces of the light transmissive member 30) and expose the upper surface of the light transmissive member 30. Alternatively, the second covering member 60 may be provided so as to cover the upper surface of the light transmissive member 30, and then a part of the second covering member 60 may be removed by grinding, grinding, cutting, etc. so as to expose the upper surface of the light transmissive member 30.

[0189] Alternatively, the second covering member 60 may be formed by die molding, printing, or the like.

[0190] (Piece component removal process)

[0191] The sheet member removing step S104 is a step of removing the sheet member 70 .

[0192] In step S104 , the sheet member 70 on which the element structure 15 and the like are placed is peeled off, thereby forming the light emitting device 100 .

[0193] Since the light emitting device 100 obtained as described above has a narrow pitch between light emitting surfaces, it is easy to adjust the light distribution of an optical system such as a lens.

[0194] [Method for manufacturing light emitting module]

[0195] Next, an example of a method for manufacturing the light emitting module 200 will be described.

[0196] The manufacturing method of the light emitting module 200 includes: a light emitting device preparation step S11, which is a step of preparing the light emitting device 100 using the manufacturing method of the light emitting device 100; and a light emitting device placement step S12, which is a step of placing the light emitting device 100 in a manner such that the sub-mount substrate 10 and the module substrate 80 face each other.

[0197] In addition, the material, arrangement, etc. of each component are the same as those described in the above description of the light emitting module 200, and thus the description thereof will be appropriately omitted here.

[0198] (Light-emitting device preparation process)

[0199] The light emitting device preparation step S11 is a step of preparing the light emitting device 100 using the above-described method for manufacturing the light emitting device 100 .

[0200] In step S11 , the light emitting device 100 is manufactured by performing the above-mentioned steps S101 to S104 .

[0201] (Light Emitting Device Mounting Step)

[0202] The light emitting device placement step S12 is a step of placing the light emitting device 100 so that the sub-mount substrate 10 of the light emitting device 100 faces the module substrate 80 .

[0203] In step S12, the light emitting device 100 is placed on the upper surface of the module substrate 80. The light emitting device 100 is mounted on the upper surface of the module substrate 80 with the submount substrate 10 side as the mounting surface.

[0204] (Second Embodiment)

[0205] Figure 5A It is a plan view schematically showing the structure of a light emitting module including the light emitting device according to the second embodiment. Figure 5B yes Figure 5A Cross-sectional view of the VB-VB line. Figure 5Cyes Figure 5A Cross-sectional view of the VC-VC line. Figure 5D It is a cross-sectional view schematically showing the structure of a light emitting device according to a second embodiment.

[0206] The light emitting module 200A includes a light emitting device 100A and a module substrate 80 on which the light emitting device 100A is mounted.

[0207] [Light-emitting device]

[0208] First, the light emitting device 100A will be described.

[0209] The light emitting device 100A uses an element structure 15A instead of the element structure 15. The light emitting device 100A uses a second cover member 60A instead of the second cover member 60. Other matters are the same as those of the light emitting device 100 of the first embodiment, and the description thereof is appropriately omitted.

[0210] The first covering part 50 of the element structure 15A covers the side surface of the light-emitting element 20 and the side surface of the translucent part 30 on the sub-mount substrate 10. Specifically, the first covering part 50 covers the lower surface of the light-emitting element 20 and the side surface of the light-emitting element 20 via the light-guiding part 40. In addition, the first covering part 50 covers the side surface of the translucent part 30. By covering the side surface of the translucent part 30 with the first covering part 50, when measuring the optical characteristics of the element structure 15A, it is easy to grasp the chromaticity coordinates of the element structure 15A, and the measurement can be made more easily. In addition, the first covering part 50 is formed so that, in a cross-sectional view, the upper surface is curved into a concave shape in a manner that the height decreases as it moves away from the side surface of the translucent part 30. According to such a structure, on the upper surface of the light-emitting device 100A including the light-emitting surface, the distance between the translucent part 30 and the second covering part 60A surrounding the translucent part 30 can be shortened.

[0211] The second covering part 60A preferably uses a black resin or a gray resin. By providing the second covering part 60A of black resin or gray resin between the element structures 15A, it is possible to prevent the light from the element structures 15A from entering the adjacent element structures 15A. Therefore, it is possible to achieve a light-emitting device with a high contrast between the luminous area and the non-luminous area when individually lit and good "visual resolution". As black resin or gray resin, for example, a resin containing a coloring material such as carbon black or graphite can be cited. The concentration of a color such as black or gray can be adjusted by the amount of coloring material added, etc. Other materials, etc. are the same as the second covering part 60.

[0212] [Light-emitting module]

[0213] Next, the light emitting module 200A will be described.

[0214] The light emitting module 200A is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100A is used.

[0215] (Manufacturing method of the second embodiment)

[0216] Fig. 6A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a second embodiment. Figure 6B It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the second embodiment. Figure 6C It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the second embodiment. Fig.6D It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing the light emitting device according to the second embodiment. Fig. 6E It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the second embodiment. Fig. 6F It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the second embodiment.

[0217] [Method for manufacturing light emitting device]

[0218] First, an example of a method for manufacturing the light emitting device 100A will be described.

[0219] The method for manufacturing the light emitting device 100A includes steps S101 to S104 described in the method for manufacturing the light emitting device 100. Hereinafter, the method for manufacturing the light emitting device 100A will be described with respect to matters different from the method for manufacturing the light emitting device 100.

[0220] The method for manufacturing the light emitting device 100A prepares a plurality of element structures 15A in an element structure preparing step S101 . The first covering member 50 of the element structures 15A covers the side surfaces of the light emitting element 20 and the side surfaces of the light transmissive member 30 .

[0221] That is, in the manufacturing method of the light-emitting device 100A, in the first covering member forming step S101e, the first covering member 50 covering the side surfaces of each light-emitting element 20 and the side surfaces of each light-transmitting member 30 is formed on the collective substrate 11. The first covering member 50 covers the side surfaces of the light-transmitting member 30, and in order to reduce the volume after curing, an organic solvent with a high boiling point such as decane and dodecane is mixed in the resin material. In this step S101e, since the organic solvent evaporates when the resin material is cured, shrinkage depressions are easily generated on the upper surface of the first covering member 50. As a result, the first covering member 50 covers the side surfaces of the light-transmitting member 30 between adjacent light-transmitting members 30, and the upper surface of the first covering member 50 is easily formed into a concave shape in a cross-sectional view.

[0222] In the second covering member forming step S103 of the method for manufacturing the light emitting device 100A, the second covering member 60A covering the side surfaces of each element structure 15A is formed on the sheet member 70. At this time, the second covering member 60A also covers the upper surface of the first covering member 50.

[0223] [Method for manufacturing light emitting module]

[0224] Next, an example of a method for manufacturing the light emitting module 200A will be described.

[0225] The method for manufacturing the light emitting module 200A is the same as the method for manufacturing the light emitting module 200 of the first embodiment, except that the light emitting device 100A prepared by the method for manufacturing the light emitting device 100A is used.

[0226] (Third Embodiment)

[0227] Fig. 7A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a third embodiment. Figure 7B yes Fig. 7A Cross-sectional view along line VIIB-VIIB. Figure 7C yes Fig. 7A Cross-sectional view of line VIIC-VIIC. Fig.7D It is a cross-sectional view schematically showing the structure of a light emitting device according to a third embodiment.

[0228] The light emitting module 200B includes a light emitting device 100B and a module substrate 80 on which the light emitting device 100B is mounted.

[0229] [Light-emitting device]

[0230] First, the light emitting device 100B will be described.

[0231] The light emitting device 100B uses the element structure 15B instead of the element structure 15A. Other matters are the same as those of the light emitting device 100A of the second embodiment, and the description thereof will be omitted as appropriate.

[0232] In the cross-sectional view of the light emitting device 100B, the width of the element structure 15B is substantially the same from the lower surface of the submount substrate 10 to the upper surface of the translucent component 30. That is, in the cross-sectional view of the light emitting device 100B, the width of the submount substrate 10 is substantially the same as the width of the translucent component 30. Thus, the width of the second covering component 60A between the element structures 15B can be formed to be substantially the same from the lower surface to the upper surface of the element structure 15B. In addition, the first covering component 50 of the light emitting device 100B does not cover the side surface of the translucent component 30.

[0233] [Light-emitting module]

[0234] Next, the light emitting module 200B will be described.

[0235] The light emitting module 200B is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100B is used.

[0236] (Manufacturing method of the third embodiment)

[0237] Fig. 8A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a third embodiment. Figure 8B It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the third embodiment. Figure 8C It is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the third embodiment. Fig.8D It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the third embodiment. Fig. 8E It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the third embodiment. Figure 8F It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the third embodiment.

[0238] [Method for manufacturing light emitting device]

[0239] First, an example of a method for manufacturing the light emitting device 100B will be described.

[0240] The manufacturing method of the light emitting device 100B includes steps S101 to S104 described in the manufacturing method of the light emitting device 100. The following describes the manufacturing method of the light emitting device 100B, which is different from the manufacturing method of the light emitting device 100A. The main difference between the manufacturing method of the light emitting device 100B and the manufacturing method of the light emitting device 100A is that the element structure 15B is manufactured with the same width from the lower surface of the submount substrate 10 to the upper surface of the light-transmitting member 30 in cross-sectional view.

[0241] In the manufacturing method of the light emitting device 100B, in the element structure manufacturing step S101f, the collective substrate 11 is divided into each sub-mounting area 12 at the position of the side of the light-transmitting component 30. That is, the collective substrate 11 is divided so that the width of the sub-mounting substrate 10 is the same as the width of the light-transmitting component 30 in cross-sectional view. Thus, the first covering component 50 covering the side of the light-transmitting component 30 is removed. In this way, the element structure 15B having the same width from the upper surface to the lower surface in cross-sectional view is manufactured.

[0242] Since the width of the submount substrate 10 of the element structure 15B is the same as the width of the translucent member 30, the distance between the translucent members 30 can be further shortened when the element structure 15B is placed on the sheet member 70. Therefore, the light emitting device 100B can further reduce the distance between the light emitting surfaces.

[0243] In the second covering member forming step S103 of the method for manufacturing the light emitting device 100B, the second covering member 60A is formed on the sheet member 70 so as to cover the side surfaces of each element structure 15B.

[0244] [Method for manufacturing light emitting module]

[0245] Next, an example of a method for manufacturing the light emitting module 200B will be described.

[0246] The method for manufacturing the light emitting module 200B is the same as the method for manufacturing the light emitting module 200 of the first embodiment, except that the light emitting device 100B prepared by the method for manufacturing the light emitting device 100B is used.

[0247] (Fourth Embodiment)

[0248] Fig.9A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a fourth embodiment. Fig. 9B yes Fig.9A Cross-sectional view of line IXB-IXB. Fig. 9C yes Fig.9A Cross-sectional view of the IXC-IXC line. Fig.9D It is a cross-sectional view schematically showing the structure of a light emitting device according to a fourth embodiment.

[0249] The light emitting module 200C includes a light emitting device 100C and a module substrate 80 on which the light emitting device 100C is mounted.

[0250] [Light-emitting device]

[0251] First, the light emitting device 100C will be described.

[0252] The light emitting device 100C uses an element structure 15C instead of the element structure 15. Other matters are the same as those of the light emitting device 100 of the first embodiment, and the description thereof will be appropriately omitted.

[0253] The element structure 15C includes a third covering member 90 that covers the side surfaces of the light emitting element 20 and the side surfaces of the light transmissive member 30 with a thickness substantially equal to the width of the element structure 15C. The third covering member 90 covers the side surfaces of the light emitting element 20 via the light guide member 40 and the first covering member 50.

[0254] A resin material is preferably used for the third covering member 90. The third covering member 90 is formed by covering the side surfaces of the light emitting element 20 and the side surfaces of the light-transmitting member 30 with, for example, a white resin having light-reflecting properties.

[0255] The resin material used for the third cover member 90 may be the material exemplified as the resin material used for the first cover member 50 . The reflective material used for the third cover member 90 may be the reflective material exemplified as the reflective material used for the first cover member 50 .

[0256] It is preferable to use a white resin as the third covering member 90 , and it is preferable to use a black or gray resin as the second covering member 60A.

[0257] The third cover member 90 has a groove 95 formed along the side surface of the translucent member 30 between the light emitting element 20 and the protective element 25. The second cover member 60A is provided in the groove 95. According to such a structure, the translucent member 30 is surrounded by the second cover member 60A on the inner side of the protective element 25 in a plan view, so that the visual recognition of the light emitting device 100C is further improved.

[0258] The groove 95 is preferably formed from the upper surface side of the third cover member 90 along the thickness direction of the third cover member 90 to a depth of 1 / 3 or more of the thickness of the third cover member 90. If the depth of the groove 95 is 1 / 3 or more of the thickness of the third cover member 90, visual distinction can be ensured, and the flow of the second cover member 60A into the groove 95 becomes easy. In addition, from the viewpoint of ensuring the strength of the light-emitting device 100C, and in consideration of mechanical damage to other components when the groove is formed, the depth of the groove 95 is preferably 4 / 5 or less of the thickness of the third cover member 90. In addition, the groove 95 is formed in a triangular shape in cross-section, but the shape of the groove 95 in cross-section can be any shape. For example, it may be a quadrilateral shape or a shape with a curved bottom surface.

[0259] The second cover member 60A covers the side surfaces of the light emitting element 20 and the side surfaces of the light transmissive member 30 via the third cover member 90. The second cover member 60A of the light emitting device 100C is the same as the second cover member 60A of the light emitting device 100A.

[0260] In the cross-sectional view of the light emitting device 100C, the width of the element structure 15C is substantially the same from the lower surface of the submount substrate 10 to the upper surface of the light-transmitting member 30. In addition, in the cross-sectional view of the light emitting device 100C, the width of the submount substrate 10 is substantially the same as the width of the outer edge of the third cover member 90. Thus, the width of the second cover member 60A between the element structures 15C can be formed to be substantially the same from the lower surface to the upper surface of the element structure 15C.

[0261] [Light-emitting module]

[0262] Next, the light emitting module 200C will be described.

[0263] The light emitting module 200C is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100C is used.

[0264] (Manufacturing method of fourth embodiment)

[0265] Fig.10 This is a flowchart of a method for manufacturing a light emitting device according to a fourth embodiment. Fig.11A It is a cross-sectional view showing a step of forming a first covering member in an element structure preparation step of a method for manufacturing a light emitting device according to a fourth embodiment. Fig. 11B It is a cross-sectional view showing a step of forming a third covering member in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment. Fig. 11C It is a cross-sectional view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment. Fig.11DIt is a cross-sectional view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the fourth embodiment. Fig.11E It is a cross-sectional view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the fourth embodiment. Fig.11F It is a cross-sectional view showing a step of removing a sheet member in the method for manufacturing a light emitting device according to the fourth embodiment. Fig.11G It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the fourth embodiment. Fig.11H It is a plan view showing a step of forming a groove in an element structure preparation step of a method for manufacturing a light emitting device according to a fourth embodiment. Fig.11I It is a plan view showing a step of manufacturing an element structure in the element structure preparation step of the method for manufacturing a light emitting device according to the fourth embodiment. Fig.11J It is a plan view showing a step of placing an element structure in the method for manufacturing a light emitting device according to the fourth embodiment. Figure 11K It is a plan view showing a step of forming a second covering member in the method for manufacturing a light emitting device according to the fourth embodiment.

[0266] [Method for manufacturing light emitting device]

[0267] First, an example of a method for manufacturing the light emitting device 100C will be described.

[0268] The manufacturing method of the light emitting device 100C includes: an element structure preparation step S201, which is a step of preparing a plurality of element structures 15C, wherein the element structures 15C include: a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light-transmitting component 30 disposed on the light emitting element 20, a light-guiding component 40 disposed on the side of the light emitting element 20, a first covering component 50 covering the side of the light emitting element 20 on the submount substrate 10, and a light-transmitting component 30 covering the side of the light emitting element 20. a third covering part 90 for covering the side of the plurality of element structures 15C; an element structure placing process S202, which is a process of placing a plurality of element structures 15C on the sheet member 70 in such a manner that the sub-mounting substrate 10 of the element structure 15C faces the sheet member 70; a second covering part forming process S203, which is a process of forming a second covering part 60A on the sheet member 70 to cover the side of the plurality of element structures 15C and to hold the plurality of element structures 15C; a sheet member removing process S204, which is a process of removing the sheet member 70.

[0269] In the element structure 15C, the third covering member 90 covers the side surfaces of the light emitting element 20 via the first covering member 50 , and the second covering member 60A covers the side surfaces of the light emitting element 20 and the side surfaces of the light transmissive member 30 via the third covering member 90 .

[0270] The element structure preparation step S201 includes: a collective substrate preparation step S201a, which is a step of preparing a collective substrate 11, wherein the collective substrate 11 includes a plurality of sub-mounting regions 12 that become sub-mounting substrates 10 after the collective substrate 11 is divided; a light-emitting element placement step S201b, which is a step of placing light-emitting elements 20 in the plurality of sub-mounting regions 12; a light-transmitting component setting step S201c, which is a step of setting a light-transmitting component 30 on each light-emitting element 20; a light-guiding component setting step S201d, which is a step of setting a light-guiding component 40 on the side of each light-emitting element 20; a first covering component forming step S201e, which is a step of forming a light-transmitting component 30 on the collective substrate 11; A process of forming a first covering part 50 on the substrate 11 to cover the side surfaces of each light-emitting element 20; a third covering part forming process S201f, which is a process of forming a third covering part 90 on the collective substrate 11 to cover the side surfaces of each light-emitting element 20 and the side surfaces of each translucent part 30; a groove forming process S201g, which is a process of forming a groove 95 on the third covering part 90 along the side surfaces of the translucent part 30 between the light-emitting element 20 and the protective element 25 in a plan view; and an element structure manufacturing process S201h, which is a process of dividing the collective substrate 11 according to each sub-mounting area 12 to manufacture a plurality of element structures 15C.

[0271] In addition, the material and arrangement of each component are the same as those described in the above-mentioned description of the light emitting device 100C, and therefore the description thereof will be appropriately omitted here.

[0272] Steps S201 a to S201 e are respectively the same as steps S101 a to S101 e described in the method for manufacturing the light emitting device 100 .

[0273] (Third Covering Member Forming Step)

[0274] The third covering member forming step S201 f is a step of forming the third covering member 90 that covers the side surfaces of each light emitting element 20 and the side surfaces of each light-transmitting member 30 on the collective substrate 11 .

[0275] In step S201 f , the third covering member 90 is formed on the collective substrate 11 , and covers the side surfaces of the light emitting elements 20 and the side surfaces of the light transmissive members 30 via the light guide members 40 provided on the side surfaces of the light emitting elements 20 .

[0276] In step S201f, an uncured resin material for forming the third cover member 90 is placed on the collective substrate 11 by potting, spraying, etc. Then, the resin material is cured to form the third cover member 90.

[0277] In step S201f, the third covering member 90 is provided so as to cover the side surfaces of the light emitting element 20 and the side surfaces of the light transmissive member 30 and to expose the upper surface of the light transmissive member 30. Alternatively, the third covering member 90 may be provided so as to cover the upper surface of the light transmissive member 30 and then a portion of the third covering member 90 may be removed by grinding, grinding, cutting, or the like so as to expose the upper surface of the light transmissive member 30.

[0278] (Groove Forming Step)

[0279] The groove forming step S201g is a step of forming a groove 95 in the third covering member 90 along the side surface of the light-transmitting member 30 between the light-emitting element 20 and the protective element 25 in a plan view.

[0280] The light emitting device 100C includes the protection element 25, so in the absence of the groove 95, the distance between the side surface of the light-transmitting member 30 on the protection element 25 side and the second cover member 60A becomes longer. By forming the groove 95 between the light emitting element 20 and the protection element 25 and providing the second cover member 60A in the groove 95, the distance between the side surface of the light-transmitting member 30 on the protection element 25 side and the second cover member 60A becomes shorter. Therefore, the visual resolution of the light emitting device 100C is further improved.

[0281] Here, for example, the light-transmitting members 30 are arranged in two rows and four columns in a plan view. Then, in step S201g, grooves 95 are formed along the side surfaces of the light-transmitting members 30 between the light-emitting elements 20 and the protective elements 25 for each row.

[0282] The groove portion 95 can be formed, for example, by cutting with a blade or by etching a predetermined position using a mask.

[0283] (Element structure manufacturing process)

[0284] The element structure production step S201h is the same as the element structure production step S101f except that the collective substrate 11 is divided for each sub-mounting region 12 to produce a plurality of element structures 15C.

[0285] (Element structure mounting step)

[0286] The element structure placing step S202 is the same as the element structure placing step S102 except that a plurality of element structures 15C are placed on the sheet member 70 so that the sub-mount substrates 10 of the element structures 15C face the sheet member 70 .

[0287] (Second Covering Member Forming Step)

[0288] The second covering member forming step S203 is a step of forming the second covering member 60A covering the side surfaces of each element structure 15C on the sheet member 70 .

[0289] This step S203 includes a step of forming the second covering member 60A in the groove 95. In the step of forming the second covering member 60A in the groove 95, for example, an uncured resin material for forming the second covering member 60A is placed in the groove 95 by potting or spraying. Then, the resin material is cured to form the second covering member 60A.

[0290] The other matters are the same as those in the second covering member forming step S103.

[0291] (Piece component removal process)

[0292] The sheet member removing step S204 is the same as the sheet member removing step S104.

[0293] [Method for manufacturing light emitting module]

[0294] Next, an example of a method for manufacturing the light emitting module 200C will be described.

[0295] The method for manufacturing the light emitting module 200C includes a light emitting device preparation step S21 and a light emitting device placement step. In the light emitting device preparation step S21, the light emitting device 100C is manufactured by performing the above-mentioned steps S201 to S204.

[0296] The method for manufacturing the light emitting module 200C is the same as the method for manufacturing the light emitting module 200 of the first embodiment, except that the light emitting device 100C prepared by the method for manufacturing the light emitting device 100C is used.

[0297] In the above, the manufacturing method of the light-emitting device and the manufacturing method of the light-emitting module, and the light-emitting device and the light-emitting module are specifically described by the methods for implementing the invention, but the gist of the present invention is not limited to these descriptions and must be interpreted broadly based on the descriptions of the scope of the claims. In addition, various changes and modifications based on these descriptions are also included in the gist of the present invention.

[0298] (Variation Example)

[0299] Fig. 12A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a modification of the second embodiment. Fig. 12B yes Fig. 12A Cross-sectional view along line XIIB-XIIB. Fig.13A It is a plan view schematically showing the structure of a light emitting module including a light emitting device according to a first modification example of the first embodiment. Fig. 13BIt is a cross-sectional view schematically showing the structure of a light emitting module including a light emitting device according to a second modification example of the first embodiment.

[0300] The light-emitting device may be a structure in which multiple element structures have two or more element structures with different luminous colors. The luminous color of the element structure is the luminous color of light emitted from the upper surface of the translucent component. For example, the luminous color of the light-emitting element may be the same as the luminous color of the element structure.

[0301] First, refer to Fig. 12A , Fig. 12B A light emitting device and a light emitting module according to a modified example of the second embodiment will be described.

[0302] The light emitting module 200D includes the light emitting device 100D and a module substrate 80 .

[0303] The light emitting device 100D includes four types of element structures 16 that emit different luminescent colors. The other structures of the light emitting device 100D are the same as those of the light emitting device 100A.

[0304] The element structure 16 includes a red element structure 16a that emits red light, a white element structure 16b that emits white light, a green element structure 16c that emits green light, and a blue element structure 16d that emits blue light. Here, the element structures 16 are arranged in 2 rows and 2 columns, with the red element structure 16a and the blue element structure 16d arranged diagonally, and the white element structure 16b and the green element structure 16c arranged diagonally.

[0305] The light emitting device 100D uses the second covering member 60A made of black resin or gray resin. Therefore, it is possible to prevent light from the element structures 16 from entering adjacent element structures 16, thereby preventing color deviation from occurring.

[0306] As the red element structure 16a, for example, a structure including: a blue light-emitting element 20 and a translucent component 30 containing a red phosphor can be cited. As the white element structure 16b, for example, a structure including: a blue light-emitting element 20 and a translucent component 30 containing a yellow phosphor can be cited. As the green element structure 16c, for example, a structure including: a green light-emitting element 20 and a translucent component 30 containing a diffusion material can be cited. Alternatively, as the green element structure 16c, for example, a structure including: a blue light-emitting element 20 and a translucent component 30 containing a green phosphor can be cited. As the blue element structure 16d, for example, a structure including: a blue light-emitting element 20 and a translucent component 30 containing a diffusion material can be cited.

[0307] As the light-transmitting component 30 containing red phosphor, yellow phosphor, and green phosphor, a component in which a light-transmitting layer 32 such as a resin layer containing phosphor or a glass layer containing phosphor is formed on the surface of a light-transmitting plate 31 such as a glass plate can be used. In addition, as the light-transmitting component 30 containing a diffusion material, a component in which a light-transmitting layer 32 such as a resin layer containing diffusion material or a glass layer containing diffusion material is formed on the surface of a light-transmitting plate 31 such as a glass plate can be used.

[0308] When the luminous color of the light-emitting element is the same as the luminous color of the element structure, for example, by using a translucent component 30 having a resin layer containing a diffusion material provided on the surface of a glass plate, the height can be made the same as that of other element structures. As the element structure 16, when a plurality of element structures having different luminous colors are combined, the second covering member 60A can be suppressed from climbing up to the upper surface of the translucent component 30 by making the height of each element structure the same. In each element structure, when the amount of phosphor required to obtain the desired luminous color is different or the difference in the thickness of the resin layer caused by the presence or absence of the phosphor is different, it can be adjusted by the thickness of the glass plate supporting the resin layer.

[0309] The light emitting module 200D is a module in which the light emitting device 100D described above is mounted on a module substrate 80 .

[0310] The light emitting module 200D is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100D is used.

[0311] In the manufacturing method of the light emitting device 100D, in the element structure preparation step S101, a plurality of two or more element structures 16 having different luminous colors are prepared. In addition, in the element structure placement step S102, the two or more element structures 16 having different luminous colors are combined and placed on the sheet member 70. Other matters are the same as those of the manufacturing method of the light emitting device 100A of the second embodiment.

[0312] The method for manufacturing the light emitting module 200D is the same as the method for manufacturing the light emitting module 200 of the first embodiment, except that the light emitting device 100D prepared by the method for manufacturing the light emitting device 100D is used.

[0313] In addition, the light-emitting device may also include two or more element structures 16 selected from a red element structure 16a, a white element structure 16b, a green element structure 16c, and a blue element structure 16d. In addition, the light-emitting device may also be a structure in which the red element structure 16a, the white element structure 16b, the green element structure 16c, and the blue element structure 16d are alternately arranged in one row, or arranged in a row and column shape. In addition, the light-emitting device may also include a white element structure 16b and an element structure that emits amber light. In addition, the light-emitting device can use element structures that emit light of various colors other than red, green, blue, white, and amber by adjusting the wavelength of the light-emitting element 20 used, the type or mixing ratio of the phosphor contained in the light-transmitting component 30. Moreover, these element structures can be arranged in a desired combination.

[0314] Next, refer to Fig.13A A light emitting device and a light emitting module according to a first modified example of the first embodiment will be described.

[0315] The light emitting module 200E and the light emitting device 100E are arranged so that three element structures 15 form vertices of a triangle. The rest of the structure is the same as that of the light emitting module 200 and the light emitting device 100 of the first embodiment.

[0316] In this way, the number of rows and columns of the light-emitting module and the light-emitting device is not limited, and the number of element structures in each column and each row can also be appropriately adjusted according to the desired light distribution pattern. In addition, the combination of element structures with different sizes of light-emitting surfaces of the light-emitting module and the light-emitting device, or the configuration of the element structures, etc. can also be appropriately adjusted according to the light distribution pattern.

[0317] Next, refer to Fig. 13B A light emitting device and a light emitting module according to a second modified example of the first embodiment will be described.

[0318] The element structure 15D of the light emitting module 200F and the light emitting device 100F does not have a light guide member. The other structures are the same as those of the light emitting module 200 and the light emitting device 100 of the first embodiment. Thus, the light emitting device and the light emitting module may or may not have a light guide member.

[0319] Next, a light emitting device according to a third modified example of the first embodiment will be described. Fig.14A It is a plan view schematically showing the structure of a light emitting device according to a third modification example of the first embodiment. Fig. 14B It is a bottom view schematically showing the structure of a light emitting device according to a third modification example of the first embodiment. Fig. 14C It is schematically indicated Fig. 14B An enlarged view of the structure of the external connection electrodes of the light-emitting device.

[0320] The light emitting device 100G of the third modified example includes a third covering member 90 that covers the side surfaces of the light emitting element 20 and the side surfaces of the light-transmitting member 30 with a thickness that is substantially the same as the width of the element structure. In addition, the second covering member 60A is used as the second covering member. Furthermore, the structure of the electrode of the submount substrate 10 is different from that of the light emitting device 100 of the first embodiment. The other structures are the same as those of the light emitting device 100 of the first embodiment.

[0321] Specifically, the external connection electrode 3 of the light-emitting device 100 includes a pair of external connection electrodes 3 in a substantially rectangular shape extending along the long side direction of the sub-mount substrate 10 with substantially the same width, whereas the external connection electrode 3A of the light-emitting device 100G includes a pair of external connection electrodes 3A (for example, the anode electrode 3Aa and the cathode electrode 3Ab) extending along the long side direction of the sub-mount substrate 10, each of which has a local width having regions of different widths (thickness). In order to miniaturize the sub-mount substrate 10, the light-emitting device 100G forms the external connection electrode 3A into a more slender (long and narrow) shape. That is, the light-emitting device 100G can cope with the miniaturization of the element structure by narrowing the width of the external connection electrode 3A. Thus, Figure 1A to Figure 1F Compared with the light emitting device 100 shown in the figure, the distance between the light emitting surfaces can be made closer.

[0322] The anode electrode 3Aa of the external connection electrode 3A includes: a wide width portion 3Aa1 having a wide width (thick), a narrow width portion 3Aa2 having a narrow width (thin), and an intermediate width portion 3Aa3 between them. The width of the anode electrode 3Aa is in the order of width Wa1 of the wide width portion 3Aa1, width Wa3 of the intermediate portion 3Aa3, and width Wa2 of the narrow width portion 3Aa2. In addition, the narrow width portion 3Aa2 is a concave portion of the side surface of the anode electrode 3Aa that is concave in the width direction, and here, the narrow width portion 3Aa2 also includes the side surface of the concave portion (the portion inclined when viewed from above).

[0323] The cathode electrode 3Ab of the external connection electrode 3A includes a wide width portion 3Ab1 having a wide width, a narrow width portion 3Ab2 having a narrow width, and an intermediate width portion 3Ab3 having a wide width therebetween. The width of the cathode electrode 3Ab is in the order of width Wb1 of the wide width portion 3Ab1, width Wb3 of the intermediate width portion 3Ab3, and width Wb2 of the narrow width portion 3Ab2. The wide width portion 3Ab1 is a convex portion of the side surface of the cathode electrode 3Ab that protrudes in the width direction, and the wide width portion 3Ab1 also includes the side surface of the convex portion (the portion inclined when viewed from above).

[0324] In the light emitting device 100G, the submount substrate 10 included in each element structure includes a through hole 4 for connecting the upper surface wiring and the external connection electrode. When the external connection electrode 3A is viewed from the light emitting surface side, the wide portion 3Aa1 of the anode electrode 3Aa and the wide portion 3Ab1 of the cathode electrode 3Ab are arranged at a position directly below the through hole 4. In this way, by configuring the through hole 4 to overlap with the wide portions 3Aa1 and 3Ab1 when viewed from above, even in the elongated external connection electrode 3A, it is possible to easily perform alignment when the through hole 4 is formed.

[0325] In addition, the through hole 4 is preferably formed at a position that does not overlap the light emitting element 20 when viewed from the light emitting surface side. Thus, the mounting performance of the light emitting element 20 when placed on the submount substrate 10 is stable. For example, when the light emitting element 20 is bonded to the submount substrate 10 using a bump as a conductive adhesive material, the upper surface wiring just above the through hole 4 and the upper surface wiring just above the base have different components just below the wiring, so the distribution of stress applied to the wiring during mounting is different, and sometimes the bonding performance of the bump is different.

[0326] In the light emitting device 100G, in a plan view, the wide width portion 3Aa1, the narrow width portion 3Aa2, and the middle portion 3Aa3 of the anode electrode 3Aa are arranged opposite to the narrow width portion 3Ab2, the wide width portion 3Ab1, and the middle portion 3Ab3 of the cathode electrode 3Ab, respectively. That is, the anode electrode 3Aa and the cathode electrode 3Ab are arranged such that the wide width portion 3Aa1 of the anode electrode 3Aa and the narrow width portion 3Ab2 of the cathode electrode 3Ab, the narrow width portion 3Aa2 of the anode electrode 3Aa and the wide width portion 3Ab1 of the cathode electrode 3Ab, and the middle portion 3Aa3 of the anode electrode 3Aa and the middle portion 3Ab3 of the cathode electrode 3Ab are opposite. By adopting such a structure, the distance between the anode electrode 3Aa and the cathode electrode 3Ab can be made substantially the same width. Furthermore, by providing the longitudinally elongated external connection electrode 3A with mutually opposing concave portions (narrow width portions) and convex portions (wide width portions), when the light emitting device 100G is mounted on a module substrate, etc., it is possible to suppress the longitudinal displacement (in the long side direction of the submount substrate 10), and improve the self-alignment. That is, the external connection electrode 3A is provided with portions of different widths, thereby forming the side surfaces of the convex portions and the concave portions that are angled with respect to the long side direction of the electrode. Therefore, in the external connection electrode 3A, the side surfaces of the convex portions and the concave portions effectively function for self-alignment.

[0327] The anode electrode 3Aa and the cathode electrode 3Ab preferably have substantially the same area. Thus, when the light emitting device 100G is mounted on a module substrate, the conductive adhesive can be arranged at the same height, thereby suppressing the light emitting device 100G from tilting.

[0328] Next, a light emitting device according to a fourth modification example of the first embodiment will be described. Fig.14D It is a bottom view schematically showing the structure of a light emitting device according to a fourth modification example of the first embodiment. Fig.14E It is a schematic representation of the loading Fig.14D A top view of the structure of a module substrate of a light-emitting device. Fig.14F Yes means Fig.14E The module substrate and Fig.14D A top view of the positional relationship between the light-emitting devices.

[0329] The light emitting device 100H includes heat dissipation terminals 5 on the lower surface of the submount substrate 10 opposite to the upper surface on which the light emitting element 20 is mounted. Therefore, the length of the submount substrate 10 of the external connection electrode 3B of the light emitting device 100H in the longitudinal direction is shorter than the external connection electrode 3A of the light emitting device 100G.

[0330] The anode electrode 3Ba of the external connection electrode 3B includes: a wide width portion 3Ba1 with a wide width, a narrow width portion 3Ba2 with a narrow width, and an intermediate width portion 3Ba3 therebetween. In addition, the cathode electrode 3Bb of the external connection electrode 3B includes: a wide width portion 3Bb1 with a wide width, a narrow width portion 3Bb2 with a narrow width, and an intermediate width portion 3Bb3 therebetween.

[0331] The external connection electrode 3B is provided with a wide portion 3Ba1 and a wide portion 3Bb1 at a position directly below the through hole 4. In addition, in the light emitting device 100H, the wide portion 3Ba1, the narrow portion 3Ba2, and the middle portion 3Ba3 of the anode electrode 3Ba are respectively arranged opposite to the narrow portion 3Bb2, the wide portion 3Bb1, and the middle portion 3Bb3 of the cathode electrode 3Bb in a plan view. Furthermore, in a plan view, a substantially rectangular heat dissipation terminal 5 is provided opposite to the middle portion 3Ba3 side of the anode electrode 3Ba and the middle portion 3Bb3 of the cathode electrode 3Bb. The heat dissipation terminal 5 is provided directly below the light emitting element 20. Therefore, in the light emitting device 100H, a plurality of heat dissipation terminals 5 are concentrated in the central area of ​​the lower surface of the light emitting device 100H.

[0332] As the material of the heat dissipation terminal 5, there can be mentioned the materials exemplified as the material for the external connection electrode 3. The heat dissipation terminal 5 is insulated from the external connection electrode 3B.

[0333] The anode electrode 3Ba, cathode electrode 3Bb and heat dissipation terminal 5 in each element structure preferably have substantially the same area. Thus, when the light emitting device 100H is mounted on the module substrate 80A, the conductive adhesive can be arranged at the same height, thereby preventing the light emitting device 100H from tilting.

[0334] Other matters are the same as those of the light emitting device 100G.

[0335] When the external connection electrode 3B has a region with a locally different width, in order to further exert the above-mentioned self-alignment property, it is preferable that the wiring pattern on the module substrate also has a region with a locally different width.

[0336] The module substrate 80A on which the light emitting device 100H is mounted is formed so that the shape and position of the wiring connected to the light emitting device 100H are consistent with the shape and position of the external connection electrode 3B and the heat dissipation terminal 5. Specifically, the module substrate 80A has the upper surface wiring 6B having a shape that is substantially consistent with the shape of the anode electrode 3Ba and the cathode electrode 3Bb of the light emitting device 100H. Similarly, the module substrate 80A has the heat dissipation terminal 7 having a shape that is substantially consistent with the shape of the heat dissipation terminal 5 of the light emitting device 100H.

[0337] In the light emitting device 100H, a plurality of heat dissipation terminals 5 are concentratedly arranged in a central area of ​​the lower surface of the light emitting device 100H.

[0338] Here, the module substrate 80A has a heat dissipation pad of a size that can mount all of the plurality of heat dissipation terminals 5 of the light emitting device 100H. The heat dissipation pad includes a plurality of heat dissipation terminals 7, and the plurality of heat dissipation terminals 7 are divided by an insulating cover layer 85 such as a resist covering a portion of the surface of the heat dissipation pad. That is, the module substrate 80A forms a plurality of heat dissipation terminals 7 by arranging the openings of the cover layer 85 to be substantially consistent with the shape of the heat dissipation terminals 5 of the light emitting device 100H. Thus, the heat dissipation can be further improved.

[0339] Next, fifth to eighth modifications of the first embodiment will be described. Fig.15A It is a plan view schematically showing the structure of a light emitting device according to a fifth modification example of the first embodiment. Fig. 15B It is a bottom view schematically showing the structure of a light emitting device according to a fifth modification example of the first embodiment. Fig. 15C It is a bottom view schematically showing the structure of a light emitting device according to a sixth modification example of the first embodiment. Fig.15D It is a schematic representation of the loading Fig. 15C A top view of the structure of a module substrate of a light-emitting device. Fig.15E Yes means Fig.15D The module substrate and Fig. 15C A top view of the positional relationship between the light-emitting devices. Fig.16A It is a plan view schematically showing the structure of a light emitting device according to a seventh modification example of the first embodiment. Fig. 16B It is a bottom view schematically showing the structure of a light emitting device according to a seventh modification example of the first embodiment. Fig. 16C It is a bottom view schematically showing the structure of a light emitting device according to an eighth modification example of the first embodiment. Fig.16D It is a schematic representation of the loading Fig. 16C A top view of the structure of a module substrate of a light-emitting device. Fig.16E Yes means Fig.16D The module substrate and Fig. 16C A top view of the positional relationship between the light-emitting devices.

[0340] The light-emitting device 100I and the light-emitting device 100J are formed by joining the long sides of the rectangular element structures that are roughly rectangular in plan view to each other and arranging two in the same direction. Other matters are the same as the light-emitting device 100G and the light-emitting device 100H, except that the second covering part 60 is used as the second covering part. In addition, the module substrate 80B is used to mount the light-emitting device 100J so that the shape and position of the wiring are consistent with the shape and position of the external connection electrode 3B and the heat dissipation terminal 5. Other matters are the same as the module substrate 80A. The light-emitting device 100K is formed by arranging 6 element structures in a manner that two translucent parts 30 face each other. Other matters are the same as the light-emitting device 100G, except that the second covering part 60 is used as the second covering part. The light-emitting device 100L is formed by arranging 6 element structures in a manner that two heat dissipation terminals 5 face each other. Other matters are the same as the light-emitting device 100H. In addition, the module substrate 80C is provided with the light emitting device 100L so that the shape and position of the wiring coincide with the shape and position of the external connection electrode 3B and the heat dissipation terminal 5. Other matters are the same as those of the module substrate 80A.

[0341] In this way, the number of component structures can be 2, 6, or any other number.

[0342] The light emitting devices 100G to 100L may prepare element structures of these types in the element structure preparation step. The number of element structures in the light emitting devices may be adjusted according to the number of element structures placed on the sheet member in the element structure placement step.

[0343] The light emitting device and the light emitting module according to the above-described modified examples may be applied to each of the first to fourth embodiments, or may be applied to other embodiments.

[0344] The light emitting device and light emitting module described above may have a structure in which the first cover member covers the lower surface of the light emitting element or does not cover the lower surface of the light emitting element. In addition, the third cover member of the light emitting device and light emitting module may have a groove or may not have a groove.

[0345] In addition, each component such as the first covering component, the second covering component, the third covering component, and the light guiding component may contain various colorants, fillers, wavelength conversion components, etc. as additives for obtaining the desired luminous color, the desired component surface color, the desired light distribution characteristics, etc.

[0346] In addition, the submount substrate and the module substrate may be substantially square in plan view. The submount substrate and the module substrate may also be other shapes.

[0347] Furthermore, the method for manufacturing a light emitting device and the method for manufacturing a light emitting module may include other steps between or before and after the above steps within the range that does not adversely affect the above steps.

[0348] Fig.17A This is a flowchart of another method for manufacturing the light emitting device according to the first embodiment. Fig. 17B This is a flowchart of another method for manufacturing the light emitting device according to the fourth embodiment.

[0349] For example, in the method for manufacturing the light emitting device of the first embodiment, when a thermosetting resin material is used for the second covering member 60 in the second covering member forming step S103, a step of curing the adhesive resin, i.e., the adhesive 72 of the sheet member 70, i.e., the adhesive curing step S500 may be performed after the element structure mounting step S102 and before the second covering member forming step S103. Due to the thermal history when curing the resin material and / or the time until the resin material is cured, it may be difficult to peel the light emitting device 100 from the sheet member 70, or a part of the adhesive 72 of the sheet member 70 may adhere to the back surface of the light emitting device 100 after peeling. In particular, when the element structure 15 has the external connection electrode 3 on the lower surface of the submount substrate 10, if the adhesive 72 of the sheet member 70 adheres to the surface of the external connection electrode 3, electrical connection may not be possible during secondary mounting. Therefore, by curing the adhesive 72 of the sheet member 70 before forming the second covering member 60, it is possible to suppress the adhesive residue of the sheet member 70 in the external connection electrode 3 of the light-emitting device 100 after the sheet member 70 is removed. In addition, the curing conditions of the resin material are usually managed in a manner that does not cause the above-mentioned problem, but in order to more reliably suppress the adhesion of the adhesive 72, etc., an adhesive curing step S500 may be performed.

[0350] Similarly, in the method for manufacturing a light emitting device of the fourth embodiment, the adhesive curing step S500 may be performed after the element structure placement step S202 and before the second cover member formation step S203. In other methods for manufacturing a light emitting device, the adhesive curing step S500 may also be performed.

[0351] In addition, in the element structure placement process, the element structure is arranged on the sheet member 70 in such a manner that the external connection electrode 3 is buried in the adhesive 72 of the sheet member 70. However, the element structure may be arranged on the sheet member 70 in such a manner that the external connection electrode 3 is not buried in the adhesive 72 of the sheet member 70. At this time, in the second covering member forming process, the second covering member may also cover the lower surface of the sub-mounting substrate 10 and the side surface of the external connection electrode 3.

[0352] In addition, for example, a foreign matter removal step of removing foreign matter mixed in during the manufacturing process may be included.

[0353] In addition, in the element structure preparation process, after a plurality of light emitting elements 20 are mounted on the submount substrate 10, the light transmissive component 30 is provided on each light emitting element 20. However, the light transmissive component 30 may be provided on the light emitting element 20 and then mounted on the submount substrate 10. In addition, the light emitting element 20 and the light transmissive component 30 may be provided on the submount substrate 10 after the collective substrate 11 is divided.

[0354] Industrial Applicability

[0355] The light emitting device and the light emitting module of the embodiment of the present disclosure can be used for a variable light distribution headlamp light source. In addition, the light emitting device and the light emitting module of the embodiment of the present disclosure can be used for a backlight source of a liquid crystal display, various lighting fixtures, large displays, various display devices such as advertisements and destination guides, and can be used for image reading devices, projection devices, etc. in digital cameras, fax machines, copiers, scanners, etc.

[0356] Explanation of symbols

[0357] 2: Top surface wiring

[0358] 3. 3A, 3B: External connection electrodes

[0359] 3a, 3Aa, 3Ba: Anode electrode

[0360] 3b, 3Ab, 3Bb: cathode electrode

[0361] 3Aa1, 3Ab1: Wide section

[0362] 3Aa2, 3Ab2: Narrow width

[0363] 3Aa3, 3Ab3: middle part

[0364] 3Ba1, 3Bb1: Wide section

[0365] 3Ba2, 3Bb2: Narrow width

[0366] 3Ba3, 3Bb3: Middle part

[0367] 4: Through hole

[0368] 5: Heat dissipation terminal

[0369] 6B: Top surface wiring

[0370] 6Ba: Anode electrode side wiring

[0371] 6Bb: Cathode electrode side wiring

[0372] 7: Heat dissipation terminal

[0373] 8: Conductive adhesive material

[0374] 10: Submount substrate

[0375] 11: Collection substrate

[0376] 12: Sub-installation area

[0377] 15, 15A, 15B, 15C, 15D: Component structure

[0378] 16: Component structure

[0379] 16a: Red component structure

[0380] 16b: White component structure

[0381] 16c: Green component structure

[0382] 16d: Blue component structure

[0383] 20: Light-emitting element

[0384] 25: Protection element

[0385] 30: Translucent parts

[0386] 31: Translucent board

[0387] 32: Translucent layer

[0388] 40: Light guide components

[0389] 50: First covering member

[0390] 60, 60A: Second covering member

[0391] 70: Sheet parts

[0392] 71: Support body

[0393] 72: Adhesive

[0394] 80, 80A, 80B, 80C: Module base plate

[0395] 85: Overlay

[0396] 90: Third covering part

[0397] 95: Groove

[0398] 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I, 100J, 100K, 100L: Light emitting device

[0399] 200, 200A, 200B, 200C, 200D, 200E, 200F: Light emitting module

[0400] L1: Distance between adjacent sub-mount substrates

[0401] L2: Distance between adjacent light-transmitting components

[0402] Wa1: Width of the wide part of the anode electrode

[0403] Wa2: The width of the narrow part of the anode electrode

[0404] Wa3: The width of the middle part of the anode electrode

[0405] Wb1: Width of the wide portion of the cathode electrode

[0406] Wb2: Width of the narrow portion of the cathode electrode

[0407] Wb3: Width of the middle part of the cathode electrode

Claims

1. A light emitting device comprising: An element structure, comprising: a submount substrate, a light emitting element disposed on the submount substrate, a light-transmitting member disposed on the light emitting element, and a first covering member on the submount substrate covering a side surface of the light emitting element; A second covering member covers the side surfaces of the element structures and holds the plurality of element structures.

2. The light emitting device according to claim 1, in, The first covering member covers a lower surface of the light emitting element.

3. The light emitting device according to claim 1 or 2, in, The first covering member covers the side surfaces of the light emitting element and the side surfaces of the light transmissive member.

4. The light emitting device according to claim 1 or 2, in, The element structure includes a third covering member covering the side surfaces of the light emitting element and the side surfaces of the translucent member, the third covering member covers the side surfaces of the light emitting element via the first covering member, and the second covering member covers the side surfaces of the light emitting element and the side surfaces of the translucent member via the third covering member.

5. The light emitting device according to claim 4, in, A protection element is provided on the sub-mount substrate, The third cover member has a groove along a side surface of the light-transmitting member between the light-emitting element and the protection element, and the second cover member is provided in the groove.

6. The light emitting device according to claim 1 or 2, in, The second covering member is made of black resin or gray resin.

7. The light emitting device according to claim 1 or 2, in, The second covering member is made of white resin.

8. The light emitting device according to claim 1 or 2, in, The light-transmitting component includes a light-transmitting plate and a resin layer provided on a surface of the light-transmitting plate.

9. The light emitting device according to claim 1 or 2, in, The plurality of element structures include two or more types of element structures having different luminescent colors.

10. The light emitting device according to claim 1 or 2, in, The submount substrate includes: an upper surface wiring arranged on an upper surface on which the light emitting element is mounted, a pair of external connection electrodes arranged on a lower surface opposite to the upper surface, and a through hole connecting the upper surface wiring and the external connection electrodes. The pair of external connection electrodes each includes a wide width portion, a narrow width portion, and an intermediate width portion therebetween, and the wide width portion is disposed directly below the through hole.

11. The light emitting device according to claim 1 or 2, in, The submount substrate includes a heat dissipation terminal on a lower surface opposite to an upper surface on which the light emitting element is mounted.

12. A light emitting module comprising: The light emitting device according to any one of claims 1 to 11; A module substrate is provided on which the light emitting device is mounted so as to face the sub-mount substrate.

13. A method for manufacturing a light emitting device, include: A step of preparing a plurality of element structures, the element structures comprising: a submount substrate, a light emitting element disposed on the submount substrate, a light-transmitting member disposed on the light emitting element, and a first covering member on the submount substrate covering a side surface of the light emitting element; A step of placing a plurality of the element structures on the sheet member in such a manner that the sub-mount substrates of the element structures face the sheet member; and forming, on the sheet member, a second covering member that covers side surfaces of the plurality of element structures and holds the plurality of element structures.

14. The method for manufacturing a light emitting device according to claim 13, in, The step of preparing a plurality of the element structures is a step of preparing a plurality of the element structures in which the first covering member covers the lower surface of the light emitting element.

15. The method for manufacturing a light emitting device according to claim 13 or 14, in, The step of preparing a plurality of the element structures is a step of preparing a plurality of the element structures in which the first covering member covers the side surfaces of the light emitting element and the side surfaces of the light-transmitting member.

16. The method for manufacturing a light emitting device according to claim 13 or 14, in, The process of preparing a plurality of the element structures is a process of preparing a plurality of the element structures having a third covering component covering the side surfaces of the light-emitting element and the side surfaces of the light-transmitting component, wherein the third covering component covers the side surfaces of the light-emitting element via the first covering component, and the second covering component covers the side surfaces of the light-emitting element and the side surfaces of the light-transmitting component via the third covering component.

17. The method for manufacturing a light emitting device according to claim 13 or 14, in, The step of preparing a plurality of the element structures comprises: A step of preparing a collective substrate, the collective substrate comprising a plurality of sub-mounting regions which become the sub-mounting substrates after the collective substrate is divided; a step of placing the light emitting elements on a plurality of the sub-mounting regions; A step of providing a light-transmitting component on each of the light-emitting elements; forming the first covering member covering the side surfaces of each of the light emitting elements on the collective substrate; The step of dividing the collective substrate for each of the sub-mounting regions to produce a plurality of the device structures.

18. The method for manufacturing a light emitting device according to claim 16, in, The step of preparing a plurality of the element structures comprises: A step of preparing a collective substrate, the collective substrate comprising a plurality of sub-mounting regions which become the sub-mounting substrates after the collective substrate is divided; a step of placing the light emitting elements on a plurality of the sub-mounting regions; A step of providing a light-transmitting component on each of the light-emitting elements; forming the first covering member covering the side surfaces of each of the light emitting elements on the collective substrate; forming a third covering member on the collective substrate to cover the side surfaces of each of the light-emitting elements and the side surfaces of each of the light-transmitting members; The step of dividing the collective substrate for each of the sub-mounting regions to produce a plurality of the device structures.

19. The method for manufacturing a light emitting device according to claim 18, in, The step of placing the light emitting element includes placing a protection element on the plurality of sub-mounting regions. After forming the third cover member on the collective substrate and before dividing the collective substrate, a step of forming a groove on the third cover member along the side surface of the light-transmitting member between the light-emitting element and the protective element in a plan view is included. The step of forming the second covering member on the sheet member includes the step of forming the second covering member in the groove portion.

20. The method for manufacturing a light emitting device according to claim 13 or 14, in, The method further includes a step of removing the sheet member.

21. The method for manufacturing a light emitting device according to claim 13 or 14, in, The second covering member is made of black resin or gray resin.

22. The method for manufacturing a light emitting device according to claim 13 or 14, in, The second covering member is made of white resin.

23. The method for manufacturing a light emitting device according to claim 13 or 14, in, The light-transmitting component includes a light-transmitting plate and a resin layer provided on a surface of the light-transmitting plate.

24. The method for manufacturing a light emitting device according to claim 13 or 14, in, The step of preparing a plurality of the element structures is a step of preparing a plurality of element structures of two or more types having different luminescent colors. The step of placing the element structures on the sheet member is a step of combining two or more element structures having different luminescent colors and placing the combined components on the sheet member.

25. The method for manufacturing a light emitting device according to claim 13 or 14, in, The method includes a step of curing the adhesive resin of the sheet member after the step of placing the light emitting element and before the step of forming the second covering member.

26. A method for manufacturing a light emitting module, include: A step of preparing a light-emitting device using the method for manufacturing a light-emitting device according to any one of claims 13 to 25; and mounting the light emitting device so that the sub-mount substrate faces the module substrate.

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