Bonding conveying mechanism and bonding machine

Abstract

The present application is applicable to the field of crystal bonding technology, and proposes a crystal bonding machine, including a machine platform, and also including a hopper lifting assembly, two groups of loading robots, two groups of chip platforms, two groups of bracket platforms, and a crystal bonding connecting platform arranged on the machine platform, wherein: the hopper lifting assembly is used to provide chips; the two groups of loading robots are arranged on both sides of the hopper lifting assembly, and are used to take materials from the hopper lifting assembly; the two groups of chip platforms are respectively arranged on one side of the two groups of loading robots; the two groups of bracket platforms are respectively located on one side of the two groups of chip platforms, and are used to transport the brackets, and the chip platforms remove the wafers from the corresponding loading robots and fix them to the adjacent brackets; the crystal bonding connecting platform is used to transport the brackets to another adjacent bracket platform; the present application has a simple structure, and is provided with a hopper lifting assembly and two groups of loading robots, which improves the efficiency of loading and taking materials while reducing the vibration of the machine platform, thereby improving production efficiency and the service life of the machine, and is highly practical.

Description

Technical Field

[0001] The present application belongs to the field of crystal bonding technology, and in particular relates to a crystal bonding conveying mechanism and a crystal bonding machine. Background Art

[0002] At present, in the die bonding process, a single die bonding swing arm mechanism usually drives the suction nozzle to reciprocate between the die supply position and the die bonding position, and the holder transfer mechanism is combined to adjust the holder position, thereby achieving die bonding at different positions of the holder.

[0003] Since a single crystal bonding swing arm mechanism can only perform crystal bonding operations on one position of the bracket at a time, the time interval for manual loading of the equipment is long, which cannot better improve labor efficiency, resulting in low crystal bonding efficiency. The one-to-one mode of equipment mechanism cannot better improve the utilization rate of the mechanism; and the single-equipment single-swing arm mode easily leads to instability of the machine and causes shaking.

[0004] Application Contents

[0005] In response to the above technical problems, the present application provides a crystal bonding conveying mechanism and a crystal bonding machine, which at least solves the problems in the prior art of the crystal bonding machine in which the long time interval for manual loading leads to low work efficiency and the single swing arm mode easily leads to machine instability.

[0006] The die bonding conveying mechanism provided in the present application includes a machine platform, a hopper lifting assembly connected to the machine platform, two sets of loading manipulators, two sets of wafer platforms, two sets of support platforms, and a die bonding docking platform, wherein:

[0007] The silo lifting assembly is used to provide wafers;

[0008] Two groups of loading manipulators are arranged on both sides of the silo lifting assembly and are used to take materials from the silo lifting assembly;

[0009] The two groups of wafer platforms are respectively arranged on one side of the two groups of loading robots, and are used to carry the wafers grasped by the adjacent loading robots;

[0010] The two groups of support platforms are respectively located on one side of the two groups of wafer platforms, and the wafer platforms transport the wafers to one side of the support platforms;

[0011] One of the two stent platforms is used to transport the stent and deliver the stent to the die-bonding docking platform, and the die-bonding docking platform is used to transport the stent to the other adjacent stent platform.

[0012] In one embodiment, the silo lifting assembly includes a mounting base, a loading tray connected to the mounting base, and a rocking tray basket silo, wherein:

[0013] The loading tray includes a bottom plate lifting assembly and a silo lifting bottom plate connected to the bottom plate lifting assembly; the bottom plate lifting assembly is used to drive the silo lifting bottom plate to rise and fall;

[0014] The rocking tray basket silo is connected to the silo lifting bottom plate and includes multiple chip rocking trays and positioning parts; the chip rocking trays contain the wafers, and the multiple chip rocking trays are stacked and spaced apart in the longitudinal direction; the positioning parts are used to place the chip rocking trays in a preset position.

[0015] In one embodiment, the loading tray further includes an inductive switch component and an optical fiber amplifier electrically connected to the inductive switch component, wherein:

[0016] The inductive switch assembly includes a plurality of inductive switches, and each inductive switch is respectively arranged on one side of each chip rocker.

[0017] In one embodiment, the rocker basket silo also includes a supporting frame and a plurality of sliding pads connected to the supporting frame, and the plurality of chip rockers are stacked longitudinally and spaced apart within the supporting frame, each of the sliding pads is respectively arranged under each of the chip rockers, and the chip rockers are supported against the corresponding sliding pads.

[0018] In one embodiment, the loading robot comprises a robot base and a loading mechanism connected to the robot base, wherein:

[0019] The loading mechanism includes a transporting cross arm and a first cylinder, a second cylinder, an upper plate of the clamp and a lower plate of the clamp provided on the transporting cross arm; the upper plate of the clamp is connected to the first cylinder, and the lower plate of the clamp is connected to the second cylinder, and the first cylinder and the second cylinder can drive the upper plate of the clamp and the lower plate of the clamp to move closer to or away from each other.

[0020] In one embodiment, the manipulator base further includes a transport motor, a screw and a screw nut seat connected to the manipulator base;

[0021] One end of the screw rod is connected to the transport motor, the other end of the screw rod passes through the screw rod nut seat and is threadedly engaged with the screw rod nut seat, and the screw rod nut seat is connected to the manipulator base along the axial sliding of the screw rod; the transport cross arm is connected to the screw rod nut seat.

[0022] In one embodiment, the wafer platform includes a first platform, a second platform, a rotation assembly, and a rocker positioning assembly, wherein:

[0023] The second platform is slidably connected to the first platform, and the rotating assembly is slidably connected to the second platform. The sliding direction of the first platform is perpendicular to the sliding direction of the second platform, and the sliding direction of the second platform is perpendicular to the rotation axis of the rotating assembly.

[0024] The rocking plate positioning assembly is connected to the rotating assembly, and the rotating assembly is used to drive the rocking plate positioning assembly to rotate.

[0025] In one embodiment, the rocker positioning assembly includes a rocker positioning frame and a plurality of rocker positioning cylinders connected to the rocker positioning frame;

[0026] The plurality of rocking plate positioning cylinders are extended to clamp the chip rocking plate to the rocking plate positioning frame.

[0027] The present application also provides a crystal bonding machine, comprising the crystal bonding conveying mechanism, and two groups of crystal bonding components connected to the machine platform, wherein the two groups of crystal bonding components are respectively arranged above the two groups of support platforms.

[0028] In one embodiment, the die-fixing assembly includes a column and a double swing arm assembly connected to the column, a die-taking lens assembly, and a die-fixing lens assembly;

[0029] The crystal retrieval lens assembly and the crystal fixing lens assembly are respectively located on both sides of the double swing arm assembly.

[0030] This application addresses the problems in prior art of die bonders, such as long manual loading intervals leading to low work efficiency and the instability of the machine caused by the single swing arm mode, by providing an improved design with the following beneficial effects:

[0031] 1. Set up a silo lifting assembly and set a loading manipulator on each side of the silo lifting assembly to improve the efficiency of loading and retrieving, reduce the retrieving interval time, and improve work efficiency;

[0032] 2. Two sets of loading robots are set to operate simultaneously to make the machine more balanced as a whole, the operation of the die bonder more stable, and the machine vibration less;

[0033] The present application has a simple structure, and is equipped with a hopper lifting assembly and two sets of loading manipulators. While improving the efficiency of loading and retrieving materials, it also reduces the vibration of the machine, thereby increasing production efficiency and the service life of the machine, and is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 A three-dimensional schematic diagram of a die bonding machine provided in an embodiment of the present application.

[0036] Figure 2 for Figure 1 The three-dimensional schematic diagram of the hopper lifting assembly in the crystal bonding machine is shown.

[0037] Figure 3 for Figure 1 The three-dimensional schematic diagram of the loading robot in the die bonding machine is shown.

[0038] Figure 4 for Figure 1 A three-dimensional schematic diagram of the adjustment platform in the die bonder is shown.

[0039] Figure 5 for Figure 1 A partial enlarged view of the die bonder is shown.

[0040] Figure 6 for Figure 1 The three-dimensional schematic diagram of the die bonding docking platform in the die bonding machine shown.

[0041] Figure 7 for Figure 1 The three-dimensional schematic diagram of the die bonding assembly in the die bonding machine is shown.

[0042] The meanings of the marks in the figure are:

[0043] 1. Machine;

[0044] 2. Hopper lifting assembly; 21. Mounting base; 22. Loading tray; 221. Bottom plate lifting assembly; 222. Hopper lifting bottom plate; 223. Induction switch assembly; 224. Fiber optic amplifier;

[0045] 23. Rocking tray basket silo; 231. Chip rocking tray; 232. Positioning piece; 233. Sliding pad; 234. Carrying frame;

[0046] 3. Loading robot; 31. Robot base; 311. Handling motor; 312. Screw; 313. Screw nut seat; 314. Cross arm pressing plate;

[0047] 32. Loading mechanism; 321. Carrying cross arm; 322. First cylinder; 323. Second cylinder; 324. Connecting plate; 325. Upper clamping plate; 326. Lower clamping plate;

[0048] 4. Wafer platform; 41. First platform; 42. Second platform; 43. Rotating assembly; 44. Rocker positioning assembly; 441. Rocker positioning frame; 442. Rocker positioning cylinder;

[0049] 5. Bracket platform; 51. Horizontal conveying platform; 52. Vertical conveying platform; 53. Bracket conveying platform;

[0050] 6. Crystal fixing assembly; 61. Column; 62. Double swing arm assembly; 63. Crystal removal lens assembly; 64. Crystal fixing lens assembly;

[0051] 7. Solid crystal connection platform; 71. Platform foundation; 72. Connection and conveying mechanism. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the following further describes this application in detail with reference to the accompanying drawings, i.e., embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0053] In the description of this application, it should be understood that the terms "length", "width", "up", "down", etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0055] In order to illustrate the technical solution described in this application, the following description is given with reference to specific drawings and embodiments.

[0056] Example 1

[0057] The solid crystal conveying mechanism provided in Example 1 of the present application is equipped with a hopper lifting assembly and a loading robot to improve the efficiency of loading and retrieving materials; at the same time, two groups of loading robots and two groups of chip platforms, two groups of support platforms, and two groups of solid crystal assemblies are arranged to ensure the balance and stability of the machine and reduce the vibration of the machine during operation.

[0058] refer to Figure 1 This embodiment provides a crystal bonding machine, including a machine platform 1, a hopper lifting assembly 2, two sets of loading manipulators 3, two sets of wafer platforms 4, two sets of support platforms 5, and a crystal bonding connecting platform 7.

[0059] The machine 1 is used to provide a fixed foundation for the silo lifting assembly 2, two sets of loading robots 3, two sets of chip platforms 4, two sets of bracket platforms 5, and the solid crystal connection platform 7. The silo lifting assembly 2, two sets of loading robots 3, two sets of chip platforms 4, two sets of bracket platforms 5, and the solid crystal connection platform 7 are all connected to the machine 1.

[0060] The hopper lifting assembly 2 is used for feeding materials, that is, providing wafers.

[0061] Two groups of loading manipulators 3 are respectively arranged on both sides of the silo lifting assembly 2 , and are used to take materials from the silo lifting assembly 2 and place them on the wafer platform 4 .

[0062] The two groups of wafer platforms 4 are respectively arranged on one side of the two groups of loading robots 3. The loading robots 3 place the wafers on the wafer platforms 4. The wafer platforms 4 are used to carry the wafers grasped by the connected loading robots 3 and transport the wafers to the side of the support platform 5, and fine-tune the position of the wafers.

[0063] The two groups of support platforms 5 are respectively arranged on one side of the two groups of wafer platforms 4 , and are used to provide supports and transport the supported supports after wafer bonding to the wafer bonding connecting platform 7 .

[0064] The die-bonding connecting platform 7 is located between two groups of support platforms 5 . One group of support platforms 5 transports the support after die-bonding to the die-bonding connecting platform 7 , and the die-bonding connecting platform 7 transports the support after die-bonding to the other group of support platforms 5 .

[0065] The action process of this embodiment is as follows: two groups of loading robots 3 take the chips from the hopper lifting assembly 2 and place them on two groups of chip platforms 4 respectively; the two groups of chip platforms 4 transport the chips to the adjacent bracket platforms 5 respectively; the bracket platform 5 on one side transports the bracket; when the chip is fixed in half of the bracket area, half of the crystal bonding work is completed, and then the bracket platform 5 transports the bracket after crystal bonding to the crystal bonding connecting platform 7; the crystal bonding connecting platform 7 transports the bracket with half of the crystal bonded to the other bracket platform 5 to complete the remaining crystal bonding work. After the crystal bonding work is completed, the corresponding bracket platform 5 sends the bracket to the next process, which completes a crystal bonding cycle.

[0066] During the die bonding operation, the wafer on the wafer platform 4 needs to be bonded to a designated area of ​​the holder on the holder platform 5, thereby forming a thermal path or an electrical path to provide conditions for subsequent wire bonding.

[0067] In the first half of a crystal bonding cycle, the chip is fixed in the preset half area of ​​the bracket, which is the half area of ​​the bracket close to the crystal bonding docking platform 7; as the bracket is transported to the other side of the base 1, the crystal bonding operation enters the second half cycle, at this time the chip is fixed in the remaining blank half area of ​​the bracket.

[0068] The beneficial effects of this embodiment are: a hopper lifting component 2 is provided, and a loading robot 3 is provided on each side of the hopper lifting component 2 to improve the efficiency of loading and taking materials; two groups of bracket platforms 5 are provided to divide the crystal bonding operation into two and a half bracket crystal bonding operations, and the two bracket platforms 5 perform crystal bonding operations on the same bracket in succession, and when the latter bracket platform 5 is working, the former bracket platform 5 can perform crystal bonding operations on the next bracket, thereby reducing the loading time interval and improving labor efficiency and crystal bonding operation efficiency; setting two groups of loading robots 3 to act simultaneously can make the crystal bonding machine run more stably and the machine 1 vibrate less.

[0069] refer to Figure 1 Optionally, two sets of loading robots 3 are arranged on opposite sides of the silo lifting assembly 2, so that the machine 1 is more balanced, so as to better reduce vibration.

[0070] refer to Figure 2 In one embodiment, the silo lifting assembly 2 includes a mounting seat 21 and a loading tray 22 and a rocking basket silo 23 provided on the mounting seat 21 .

[0071] The mounting seat 21 is used to provide a fixed foundation for the loading tray 22 and the rocking plate basket silo 23. The mounting seat 21 is fixedly connected to the machine 1, and the loading tray 22 and the rocking plate basket silo 23 are connected to the mounting seat 21.

[0072] The loading tray 22 includes a bottom plate lifting assembly 221 and a silo lifting bottom plate 222 connected to the bottom plate lifting assembly 221 ; the bottom plate lifting assembly 221 is used to drive the silo lifting bottom plate 222 to rise and fall.

[0073] The base plate lifting assembly 221 can be various types of lifting components, such as a linear telescopic cylinder, a ball screw, or a belt transmission structure.

[0074] The rocking tray basket silo 23 is connected to the silo lifting base plate 222, and includes a supporting frame 234, multiple chip rocking trays 231 and positioning parts 232, and the multiple chip rocking trays 231 are stacked in the longitudinal direction; specifically, the supporting frame 234 is connected to the silo lifting base plate 222, and the multiple chip rocking trays 231 are stacked in the supporting frame 234 respectively, and the chip rocking trays 231 are used to accommodate chips.

[0075] The positioning member 232 is used to locate the chip rocking plate 231 at a preset position; the positioning member 232 is connected to the supporting frame 234 , and each chip rocking plate 231 corresponds to at least one positioning member 232 .

[0076] Optionally, the positioning member 232 is a magnet, and each chip rocker 231 is provided with a magnet fixing plate fixedly connected to the supporting frame 234, and the magnet is connected to the magnet fixing plate; the preset position is the edge position, and when the chip rocker 231 is placed on the supporting frame 234, the magnet attracts the chip rocker 231 to the edge to facilitate the loading robot 3 to grab it.

[0077] Optionally, the loading tray 22 also includes an induction switch component 223 and an optical fiber amplifier 224.

[0078] The sensing switch assembly 223 includes multiple sensing switches, each of which is respectively arranged on one side of each chip rocker 231. Specifically, the sensing switch is fixedly connected to the supporting frame 234. The sensing switch is used to sense whether the chip rocker 231 is close to the edge and whether there is a chip rocker 231 at the corresponding position.

[0079] The inductive switch may be any type of inductive switch, such as a light inductive switch, a microwave inductive switch, an ultrasonic inductive switch, a piezoelectric inductive switch, or an electromagnetic inductive switch.

[0080] The optical fiber amplifier 224 is electrically connected to each sensor switch. The optical fiber amplifier 224 can amplify the position signal sensed by the sensor switch and transmit it to the external device so as to accurately sense whether the chip rocker 231 is close to the edge. The external device can issue an alarm through the signal transmitted by the optical fiber amplifier 224.

[0081] The chip rocking tray 231 is positioned to the side to ensure that each chip rocking tray 231 is positioned the same, so that the loading robot 3 can grab the same position when grabbing each chip rocking tray 231 .

[0082] Optionally, the rocking tray basket hopper 23 also includes a plurality of sliding pads 233, each sliding pad 233 is respectively arranged under each chip rocking tray 231, and the chip rocking tray 231 is supported by the corresponding sliding pad 233, that is, a sliding pad 233 fixedly connected to the supporting frame 234 is provided under each chip rocking tray 231, and the setting of the sliding pad 233 can play a lubricating role, so that the chip rocking tray 231 can be smoothly placed in the supporting frame 234 or the chip rocking tray 231 can be smoothly removed from the supporting frame 234, thereby reducing friction loss.

[0083] Optionally, the multiple sensing switches are respectively multiple opposing fiber optic sensors and multiple photoelectric sensors, wherein each chip shaker 231 is provided with a opposing fiber optic sensor and a photoelectric sensor on the side thereof, wherein the opposing fiber optic sensor is used to detect whether the chip shaker 231 is close to the edge, and the photoelectric sensor is used to detect whether the chip shaker 231 exists.

[0084] The action process of this embodiment is as follows: after the loading robot 3 removes the chip shaking tray 231 from the supporting frame 234, the bottom plate lifting assembly 221 controls the supporting frame 234 to rise or fall, so that the loading robot 3 can grab the chip shaking tray 231 next time; the staff places the new chip shaking tray 231 on the empty space of the supporting frame 234, and the magnet on the positioning member 232 attracts the chip shaking tray 231 to the edge; the sensing switch assembly 223 is used to detect whether the chip shaking tray 231 is against the edge and whether there is a chip shaking tray 231. If a chip shaking tray 231 is not against the edge, the corresponding sensing switch is triggered, and the signal is sent to the external device through the optical fiber amplifier 224, and the staff is alerted by the external device; if the chip shaking tray 231 is not placed on a certain layer of the supporting frame 234, the corresponding sensing switch is triggered, and the signal is sent to the external device through the optical fiber amplifier 224, and the staff is alerted by the external device.

[0085] The beneficial effects of this embodiment are: providing a specific structure of a hopper lifting assembly 2 to facilitate the loading robot 3 to pick up materials, and by setting the induction switch assembly 223 and the positioning member 232, each chip rocker 231 can be located at the same determined position, so that the loading robot 3 can better pick up materials, and can ensure that the loading robot 3 picks up materials at the same position each time, so that the loading robot 3 can easily place the chip rocker 231 on the wafer platform 4.

[0086] refer to Figure 3 In one embodiment, the loading robot 3 includes a robot base 31 and a loading mechanism 32 .

[0087] The manipulator base 31 is used to provide a fixed foundation for the loading mechanism 32 , and the loading mechanism 32 is connected to the manipulator base 31 .

[0088] The loading mechanism 32 is used to take the rocking plate from the silo lifting assembly 2 , and the loading mechanism 32 includes a transport cross arm 321 , a first cylinder 322 , a second cylinder 323 , a clamping jaw upper plate 325 and a clamping jaw lower plate 326 .

[0089] The transport cross arm 321 is used to provide a fixed foundation for the first cylinder 322 , the second cylinder 323 , the clamping jaw upper plate 325 and the clamping jaw lower plate 326 , and the transport cross arm 321 is connected to the manipulator base 31 .

[0090] The upper plate 325 of the clamp and the lower plate 326 of the clamp are arranged opposite to each other, and the upper plate 325 of the clamp is connected to the first cylinder 322, and the lower plate 326 of the clamp is connected to the second cylinder 323; the first cylinder 322 can drive the upper plate 325 of the clamp to move toward or away from the lower plate 326 of the clamp, and the second cylinder 323 can drive the lower plate 326 of the clamp to move toward or away from the upper plate 325 of the clamp. Under the action of the first cylinder 322 and the second cylinder 323, the upper plate 325 of the clamp and the lower plate 326 of the clamp can approach each other and clamp the chip rocking plate 231, and the upper plate 325 of the clamp and the lower plate 326 of the clamp can also move away from each other and put down the chip rocking plate 231.

[0091] Optionally, the feeding mechanism 32 further includes a connecting plate 324 , one end of which is connected to the first cylinder 322 , and the other end of the connecting plate 324 is connected to the clamping upper plate 325 , and when the first cylinder 322 is extended or retracted, the clamping upper plate 325 is driven to move synchronously through the connecting plate 324 .

[0092] Optionally, the manipulator base 31 further includes a transport motor 311 , a screw 312 and a screw nut seat 313 .

[0093] The transport motor 311 is fixedly connected to the manipulator base 31 , the screw rod 312 is rotatably connected to the manipulator base 31 , and the screw rod nut seat 313 is slidably connected to the manipulator base 31 .

[0094] The transport motor 311 may be various types of motors, such as a servo motor or a stepping motor.

[0095] One end of the screw rod 312 is connected to the transport motor 311, and the transport motor 311 can drive the screw rod 312 to rotate; the other end of the screw rod 312 passes through the screw rod nut seat 313 and cooperates with its thread. Specifically, a through hole is opened on the screw rod nut seat 313, and an internal thread is provided on the inner wall of the through hole. The screw rod 312 passes through the through hole and cooperates with the internal thread. The rotation of the screw rod 312 can drive the screw rod nut seat 313 to slide on the manipulator base 31, thereby driving the loading mechanism 32 to move.

[0096] Furthermore, a cross arm clamping plate 314 is fixedly connected to the screw nut seat 313, and the cross arm clamping plate 314 presses and fixes the transport cross arm 321 to the screw nut seat 313. The fixing connection method of the cross arm clamping plate 314 can be a bolt connection, a snap connection, or various other types of fixed connection methods.

[0097] The operation process of this embodiment is as follows: when it is necessary to take the material, the transport motor 311 is started, and the feeding mechanism 32 is driven to move toward the hopper lifting assembly 2 through the screw rod 312 and the screw rod nut seat 313, and the upper plate 325 and the lower plate 326 of the clamping jaws enter the hopper lifting assembly 2 and are respectively located on the upper and lower sides of the target chip rocking plate 231; then the first cylinder 322 and the second cylinder 323 are started, driving the upper plate 325 and the lower plate 326 of the clamping jaws to move closer to each other and the chip rocking plate 231 1 is clamped; then the transport motor 311 is started, and the feeding mechanism 32 is driven to move away from the hopper lifting assembly 2 through the screw rod 312 and the screw rod nut seat 313, thereby removing the chip rocking plate 231; when the chip rocking plate 231 moves above the wafer platform 4, the first cylinder 322 and the second cylinder 323 are started, driving the clamping jaw upper plate 325 and the clamping jaw lower plate 326 to move away from each other and loosen the chip rocking plate 231, thereby placing the chip rocking plate 231 on the wafer platform 4.

[0098] The beneficial effects of this embodiment are: providing a specific structure of a loading robot 3, so that the loading robot 3 can smoothly take out the chip rocker 231 from the hopper lifting assembly and place it on the chip platform 4; driving the upper plate 325 and the lower plate 326 of the clamp to move synchronously, which can ensure that the chip rocker 231 is stably clamped.

[0099] refer to Figure 4 In one embodiment, the wafer platform 4 includes a first platform 41 , a second platform 42 , a rotating assembly 43 and a rocker positioning assembly 44 .

[0100] The first platform 41 is fixedly connected to the frame, the second platform 42 is slidably connected to the first platform 41, the rotating component 43 is slidably connected to the second platform 42, and the chip rocker 231 is placed on the rotating component 43. The sliding direction of the first platform 41 is perpendicular to the sliding direction of the second platform 42, and the sliding direction of the second platform 42 is perpendicular to the rotation axis of the rotating component 43. Specifically, the second platform 42 can move along the Y-axis direction on the first platform 41, and the rotating component 43 can move along the X-axis direction on the second platform 42 to facilitate the adjustment of the position of the rotating component 43 so as to facilitate the transport of the chip rocker 231 to the side of the solid crystal component 6.

[0101] The rocking plate positioning assembly 44 is connected to the rotating assembly 43 . The rotating assembly 43 can drive the rocking plate positioning assembly 44 to rotate. The rocking plate positioning assembly 44 is used to carry the chip rocking plate 231 .

[0102] The rotating assembly 43 can be a rotary cylinder, a rotary motor with a reducer, a belt drive structure, or other various common rotating structures.

[0103] Optionally, the first platform 41 and the second platform 42 are both three-rail or four-rail platforms, thereby reducing vibration, improving stability, and improving conveying accuracy.

[0104] Optionally, the rocker positioning assembly 44 includes a rocker positioning frame 441 and a plurality of rocker positioning cylinders 442 .

[0105] The rocker positioning frame 441 is used to support the chip rocker 231. Multiple rocker positioning cylinders 442 are extended to clamp the chip rocker 231 to the rocker positioning frame 441. Specifically, a positioning groove is provided on the chip rocker 231. When the rocker positioning cylinder 442 is extended, the piston rod of the rocker positioning cylinder 442 enters the corresponding positioning groove, thereby clamping the chip rocker 231 to the rocker positioning frame 441.

[0106] The positioning groove may be provided on the bottom surface of the chip rocking tray 231 or on the side surface of the chip rocking tray 231 .

[0107] The action process of this embodiment is as follows: after the loading robot 3 places the chip rocker 231 on the rocker positioning frame 441, multiple rocker positioning cylinders 442 extend and fix the chip rocker 231 at the center of the rocker positioning frame 441; then the first platform 41 and the second platform 42 transport the chip rocker 231 to the side of the crystal fixing component 6, and the rotating component 43 drives the rocker positioning component 44 to rotate and fine-tune.

[0108] The beneficial effects of this embodiment are: providing a specific structure of a chip platform 4 to facilitate the accurate and stable transportation of the chip rocker 231 to the side of the die bonding component 6; and providing a rocker positioning frame 441 and a rocker positioning cylinder 442 so that each chip rocker 231 can be in the same determined position within the rocker positioning frame 441.

[0109] refer to Figure 5 In one embodiment, the support platform 5 can move in two mutually perpendicular directions, so as to transport the support to the bottom of the die-bonding assembly 6 or to the die-bonding connecting platform 7 .

[0110] Specifically, the bracket platform 5 includes a transverse conveying platform 51, a longitudinal conveying platform 52 and a bracket conveying platform 53; the bracket conveying platform 53 is slidably connected to the longitudinal conveying platform 52, the longitudinal conveying platform 52 is slidably connected to the transverse conveying platform 51, and the transverse conveying platform 51 is connected to the machine 1; the longitudinal conveying platform 52 can drive the bracket conveying platform 53 to move along the X-axis direction, and the transverse conveying platform 51 can drive the longitudinal conveying platform 52 to move along the Y-axis direction.

[0111] The transverse conveying platform 51 , the longitudinal conveying platform 52 , and the bracket conveying platform 53 can all be various types of conveying structures, such as a belt conveying structure, a trackless cylinder, a telescopic cylinder with a slide rail, and the like.

[0112] refer to Figure 6 In one embodiment, the solid crystal docking platform 7 is used to transfer the bracket on one bracket platform 5 to another adjacent bracket platform 5. Specifically, the solid crystal docking platform 7 includes a platform base 71 connected to the machine 1 and a docking conveying mechanism 72 provided on the platform base 71. The docking conveying mechanism 72 is used to transport the bracket from one bracket platform 5 to another bracket platform 5; the docking conveying mechanism 72 can be various types of conveying structures, such as a belt conveying structure, a trackless cylinder, a telescopic cylinder with a slide rail, etc.

[0113] Example 2

[0114] refer to Figure 1 Based on the first embodiment, this embodiment provides a crystal bonding machine including a crystal bonding conveying mechanism.

[0115] The die bonding machine also includes two sets of die bonding components 6 connected to the machine 1. The two sets of die bonding components 6 are respectively located above the two sets of support platforms 5. The wafer platform 4 can transport the wafer to the side of the die bonding component 6, and the support platform 5 transports the support to the bottom of the die bonding component 6. The die bonding component 6 removes the wafer from the wafer platform 4 and bonds it to the support.

[0116] refer to Figure 7 In one embodiment, the crystal fixing assembly 6 includes a column 61 , a double swing arm assembly 62 , a crystal taking lens assembly 63 , and a crystal fixing lens assembly 64 .

[0117] The column 61 is used to provide a fixed foundation for the double swing arm assembly 62 , the crystal retrieval lens assembly 63 , and the crystal fixing lens assembly 64 . The double swing arm assembly 62 , the crystal retrieval lens assembly 63 , and the crystal fixing lens assembly 64 are all connected to the column 61 .

[0118] The double swing arm assembly 62 is used for taking out the crystal and bonding the crystal respectively, thereby improving the bonding efficiency. The double swing arm assembly 62 is now widely used in the crystal bonding machine in the prior art, so it will not be described in detail here.

[0119] The crystal retrieval lens assembly 63 and the crystal fixing lens assembly 64 are respectively located on opposite sides of the double swing arm assembly 62 and are used to detect and correct the position of the chip to facilitate crystal retrieval and crystal fixing by the double swing arm assembly 62 .

[0120] The action process of the present application is as follows: two groups of loading manipulators 3 take the chip rocking plate 231 from the hopper lifting assembly 2 and place them on two groups of wafer platforms 4 respectively. Specifically, the transport motor 311 is started, and the loading mechanism 32 is driven to move toward the hopper lifting assembly 2 through the screw rod 312 and the screw rod nut seat 313, and the upper plate 325 and the lower plate 326 of the clamping claw enter the hopper lifting assembly 2 and are respectively located on the upper and lower sides of the target chip rocking plate 231; then the first cylinder 322 and the second cylinder 323 are started, driving the upper plate 325 and the lower plate 326 of the clamping claw to move to the upper and lower sides of the target chip rocking plate 231; The lower plates 326 of the clamping jaws move closer to each other and clamp the chip rocking plate 231; then the transport motor 311 is started, and the feeding mechanism 32 is driven to move away from the hopper lifting assembly 2 through the screw rod 312 and the screw rod nut seat 313, thereby removing the chip rocking plate 231; when the chip rocking plate 231 moves above the wafer platform 4, the first cylinder 322 and the second cylinder 323 are started, driving the upper plate 325 and the lower plate 326 of the clamping jaws away from each other and releasing the chip rocking plate 231, thereby placing the chip rocking plate 231 on the wafer platform 4;

[0121] The two sets of wafer platforms 4 respectively transport the wafers to the adjacent support platforms 5. Specifically, after the loading robot 3 places the chip rocking plate 231 on the rocking plate positioning frame 441, multiple rocking plate positioning cylinders 442 extend and fix the chip rocking plate 231 at the center of the rocking plate positioning frame 441; then the first platform 41 and the second platform 42 transport the chip rocking plate 231 to the side of the die bonding assembly 6, and the rotating assembly 43 drives the rocking plate positioning assembly 44 to rotate and fine-tune;

[0122] The support platform 5 on one side transports the support, and the die bonding assembly 6 takes the wafer from the chip rocking plate 231 and bonds the wafer on the support. At this time, the wafer is fixed on one side of the support, and the die bonding work on the support is half completed.

[0123] Afterwards, the support platform 5 transports the crystal-bonded support to the crystal bonding docking platform 7; the crystal bonding docking platform 7 transports the half-bonded support to another support platform 5, and another crystal bonding component 6 takes the crystal from the adjacent chip rocker 231 and completes the remaining crystal bonding work. After that, the support platform 5 transports the support to the next process.

[0124] The beneficial effects of this application are:

[0125] 1. Set up a silo lifting component 2, and set a loading manipulator 3 on each side of the silo lifting component 2 to improve the efficiency of loading and unloading;

[0126] 2. Setting two groups of loading robots 3 to operate simultaneously can make the die bonder run more stable and the machine 1 shake less;

[0127] 3. The loading robot 3 adopts the form of dual cylinder synchronous movement and clamping, making the chip rocking plate 231 clamped more firmly;

[0128] 4. Two groups of support platforms 5 are set up, and the two groups of support platforms 5 perform half of the crystal bonding work respectively. The two support platforms 5 perform crystal bonding operations on the same support in succession, and when the latter support platform 5 is working, the previous support platform 5 can perform crystal bonding operations on the next support, thereby improving the crystal bonding efficiency.

[0129] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A die bonding machine, characterized in that: The invention comprises a solid crystal conveying mechanism, wherein the solid crystal conveying mechanism comprises a machine platform (1), and is characterized in that it further comprises a hopper lifting component (2) connected to the machine platform (1), two groups of loading manipulators (3), two groups of wafer platforms (4), two groups of support platforms (5), and a solid crystal connecting platform (7), wherein: The silo lifting assembly (2) is used to provide wafers; Two groups of loading manipulators (3) are arranged on both sides of the silo lifting assembly (2) to balance the force on the machine (1), and the loading manipulators (3) are used to grab the wafers from the silo lifting assembly (2); The two groups of wafer platforms (4) are respectively arranged on one side of the two groups of loading manipulators (3) and are used to carry the wafers grasped by the adjacent loading manipulators (3); The two groups of support platforms (5) are respectively located on one side of the two groups of wafer platforms (4) to balance the force on the machine (1), and the wafer platforms (4) transport the wafers to one side of the support platforms (5); The solid crystal docking platform (7) is arranged between the two support platforms (5), wherein one of the support platforms (5) is used to provide a support and transport the support to the solid crystal docking platform (7); the solid crystal docking platform (7) is used to transport the support to the other support platform (5), and the two groups of wafer platforms (4) are respectively located on both sides of the solid crystal docking platform (7) to balance the force on the machine (1); The crystal bonding machine further comprises two groups of crystal bonding components (6) connected to the machine (1). The two groups of crystal bonding components (6) are respectively arranged above the two groups of support platforms (5) and are respectively located on both sides of the crystal bonding connection platform (7) to balance the force applied to the machine (1).

2. The die bonder according to claim 1, wherein: The silo lifting assembly (2) comprises a mounting seat (21) provided on the machine platform (1), a loading tray (22) connected to the mounting seat (21), and a rocking tray basket silo (23), wherein: The loading tray (22) comprises a bottom plate lifting assembly (221) and a silo lifting bottom plate (222) connected to the bottom plate lifting assembly (221); the bottom plate lifting assembly (221) is used to drive the silo lifting bottom plate (222) to rise and fall; The rocking tray basket silo (23) is connected to the silo lifting bottom plate (222) and comprises a plurality of chip rocking trays (231) and positioning members (232); the chip rocking trays (231) contain the wafers, and the plurality of chip rocking trays (231) are stacked and spaced apart in the longitudinal direction; the positioning members (232) are used to position the chip rocking trays (231) at a preset position.

3. The die bonder according to claim 2, wherein: The loading tray (22) further includes a sensing switch component (223) and an optical fiber amplifier (224) electrically connected to the sensing switch component (223), wherein: The inductive switch assembly (223) includes a plurality of inductive switches, each of which is respectively arranged on one side of each chip rocker (231).

4. The die bonder according to claim 2, wherein: The rocking tray basket silo (23) further comprises a supporting frame (234) and a plurality of sliding pads (233) connected to the supporting frame (234); a plurality of chip rocking trays (231) are stacked longitudinally and spaced apart within the supporting frame (234); each sliding pad (233) is respectively arranged below each chip rocking tray (231), and the chip rocking tray (231) is supported by the corresponding sliding pad (233).

5. The die bonder according to any one of claims 1 to 4, characterized in that: The loading manipulator (3) comprises a manipulator base (31) and a loading mechanism (32) provided on the manipulator base (31), wherein: The loading mechanism (32) comprises a transport cross arm (321) and a first cylinder (322), a second cylinder (323), a clamping upper plate (325), and a clamping lower plate (326) arranged on the transport cross arm (321); the clamping upper plate (325) is connected to the first cylinder (322), and the clamping lower plate (326) is connected to the second cylinder (323); the first cylinder (322) and the second cylinder (323) can drive the clamping upper plate (325) and the clamping lower plate (326) to move closer to or farther away from each other.

6. The die bonder according to claim 5, characterized in that: The manipulator base (31) further comprises a transport motor (311), a screw rod (312) and a screw rod nut seat (313) connected to the manipulator base (31); One end of the screw rod (312) is connected to the transport motor (311), and the other end of the screw rod (312) passes through the screw rod nut seat (313) and is threadedly engaged with the screw rod nut seat (313); the screw rod nut seat (313) is slidably connected to the manipulator base (31) along the axial direction of the screw rod (312); and the transport cross arm (321) is connected to the screw rod nut seat (313).

7. The die bonder according to claim 2, wherein: The wafer platform (4) comprises a first platform (41), a second platform (42), a rotating assembly (43) and a rocking plate positioning assembly (44), wherein: The first platform (41) is arranged on the machine (1), the second platform (42) is slidably connected to the first platform (41), the rotating assembly (43) is slidably connected to the second platform (42), the sliding direction of the first platform (41) is perpendicular to the sliding direction of the second platform (42), and the sliding direction of the second platform (42) is perpendicular to the rotation axis of the rotating assembly (43); The rocking plate positioning assembly (44) is connected to the rotating assembly (43), and the rotating assembly (43) is used to drive the rocking plate positioning assembly (44) to rotate.

8. The die bonder according to claim 7, wherein: The rocking plate positioning assembly (44) includes a rocking plate positioning frame (441) and a plurality of rocking plate positioning cylinders (442) connected to the rocking plate positioning frame (441); The plurality of rocking plate positioning cylinders (442) are extended to clamp the chip rocking plate (231) to the rocking plate positioning frame (441).

9. The die bonder according to claim 1, wherein: The crystal fixing assembly (6) comprises a column (61), a double swing arm assembly (62) connected to the column (61), a crystal taking lens assembly (63), and a crystal fixing lens assembly (64); The crystal-taking lens assembly (63) and the crystal-fixing lens assembly (64) are respectively located on both sides of the double-swing arm assembly (62).

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