Wafer carrier apparatus and semiconductor process equipment

Abstract

The application provides a wafer carrying device and a semiconductor process equipment, the tray of the wafer carrying device is provided with a plurality of edge carrying holes; a lifting driving mechanism is in transmission connection with a base assembly; the base comprises a carrying surface for carrying the tray, and the carrying surface is provided with a plurality of edge assembly through holes; a transmission assembly is arranged in the interior of the base, a plurality of edge carrying components are arranged above the carrying surface and correspond to the plurality of edge assembly through holes and the plurality of edge carrying holes one by one, the edge carrying components are in transmission connection with the transmission assembly through the edge assembly through holes, and the transmission assembly is in transmission connection with a rotary driving source; when the base assembly rises and enters the edge carrying holes, the edge carrying components are used for lifting the wafers carried in the edge carrying holes and driving the wafers to rotate. The wafer carrying device and the semiconductor process equipment provided by the application can improve the thickness uniformity of the thin film deposited on the wafer and improve the process result.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more specifically, to a wafer carrier device and semiconductor process equipment. Background Technology

[0002] In physical vapor deposition (PVD) equipment, the pedestal used to carry wafers for PVD processes is typically designed for processing larger wafers (e.g., 8-inch or 12-inch). If smaller wafers (e.g., 2-inch, 4-inch, or 6-inch) need to be processed, a tray is required to carry the wafers, and the tray and the wafers on it are transferred together to the pedestal for processing.

[0003] Existing pallets typically have multiple carrier slots spaced apart, each carrying one wafer. This causes some or all wafers to deviate from the center of the base, i.e., from the center of the process chamber, when the pallet is placed on the substrate (generally, in equipment for processing a single wafer, the base, pallet, and process chamber are concentrically arranged). In the existing physical vapor deposition (PVD) process environment, uneven plasma distribution may occur due to factors such as uneven distribution of process gases and / or uneven distribution of electric fields. This may cause the thickness of the film deposited by the PVD process to gradually decrease from the center to the edge of the process chamber. Consequently, the thickness of the film deposited on wafers deviating from the center of the process chamber may gradually decrease from the side closer to the center of the process chamber to the side closer to the edge of the process chamber, resulting in non-uniformity of the film thickness deposited on the wafer. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer carrier device and semiconductor process equipment, which can improve the thickness uniformity of thin films deposited on wafers and improve process results.

[0005] To achieve the purpose of this invention, a wafer carrier device is provided, comprising a base assembly, a tray, and a lifting drive mechanism, wherein the tray has a plurality of edge carrier holes for carrying the wafer;

[0006] The lifting drive mechanism is connected to the base assembly for driving the base assembly to lift.

[0007] The base assembly includes a base, a rotating mechanism, and a rotating drive source. The base includes a bearing surface for supporting the tray, and the bearing surface has multiple edge mounting through holes. The rotating mechanism includes a transmission assembly and multiple edge bearing components. The transmission assembly is disposed inside the base, and the edge bearing components are disposed above the bearing surface. The multiple edge bearing components are correspondingly arranged with the multiple edge mounting through holes. The edge bearing components are driven to the transmission assembly through the edge mounting through holes. The transmission assembly is driven to the rotating drive source to drive the edge bearing components to rotate. The multiple edge bearing components are correspondingly arranged with the multiple edge bearing holes. The edge bearing components are used to lift the wafers carried in the edge bearing holes and drive the wafers to rotate when the base assembly rises and enters the edge bearing holes.

[0008] Optionally, the transmission assembly includes a transmission shaft, a central rotating shaft, a central gear, multiple edge rotating shafts, and multiple edge gears. The transmission shaft is connected to the rotary drive source, the central rotating shaft is connected to the transmission shaft, the central gear is connected to the central rotating shaft and meshes with all the edge gears to drive all the edge gears to rotate, and the multiple edge rotating shafts are connected to the multiple edge gears one-to-one and pass through the edge mounting through holes one-to-one to connect with the edge bearing component.

[0009] Optionally, the tray is further provided with a central support hole, which is located at the center of the tray and is used to support the wafer. A plurality of edge support holes are arranged around the outer side of the central support hole.

[0010] Optionally, the rotating mechanism further includes a central support component, which is correspondingly disposed with respect to the central support hole. The central support component is fixed on the support surface and is used to enter the central support hole to lift the wafer supported in the central support hole.

[0011] Optionally, the rotating mechanism further includes a central support component, and a central mounting through hole is provided on the support surface. The central support component is disposed above the support surface and is connected to the transmission assembly through the central mounting through hole. The transmission assembly is used to drive the central support component to rotate. The central support component is correspondingly disposed to the central support hole, and the central support component is used to enter the central support hole to lift the wafer carried in the central support hole and drive the wafer to rotate.

[0012] Optionally, the edge bearing hole includes a first upper hole segment and a first lower hole segment from top to bottom. The radial dimension of the first upper hole segment is greater than the radial dimension of the first lower hole segment. The radial dimension of the first upper hole segment is greater than the radial dimension of the wafer. The radial dimension of the first lower hole segment is greater than the radial dimension of the edge bearing component and less than the radial dimension of the wafer.

[0013] Optionally, the central support hole includes a second upper hole section and a second lower hole section from top to bottom. The radial dimension of the second upper hole section is greater than the radial dimension of the second lower hole section. The radial dimension of the second upper hole section is greater than the radial dimension of the wafer. The radial dimension of the second lower hole section is greater than the radial dimension of the central support component and smaller than the radial dimension of the wafer.

[0014] Optionally, the wafer carrier further includes a support mechanism for supporting the tray when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray from the base assembly.

[0015] Optionally, the radial dimension of the tray is larger than the radial dimension of the base;

[0016] The support mechanism includes a support base and multiple support components. The multiple support components are disposed on the support base and spaced around the base assembly. The multiple support components are used to support the tray when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray from the base assembly. The support components are provided with limiting protrusions, which are used to limit the position of the tray.

[0017] Optionally, the support base is annular, the support member is columnar, the limiting protrusion is disposed on the top of the columnar support member, and the support member can move radially along the annular support base to adjust the spacing between the plurality of support members.

[0018] The present invention also provides a semiconductor process apparatus, including a chamber body and a wafer carrier device as provided in the present invention, wherein the wafer carrier device is partially disposed within the chamber body for carrying the wafer.

[0019] The present invention has the following beneficial effects:

[0020] The wafer carrier device provided by this invention has multiple edge support holes on the tray for supporting wafers. The base assembly includes a base, a rotating mechanism, and a rotating drive source. Multiple edge mounting through holes are formed on the support surface of the base for supporting the tray. Multiple edge support components of the rotating mechanism are disposed on the support surface and correspond one-to-one with the multiple edge mounting through holes and the multiple edge support holes. The transmission component of the rotating mechanism is disposed inside the base and is connected to the multiple edge support components through the multiple edge mounting through holes. The rotating drive source is connected to the transmission component, and can drive the multiple edge support components to rotate by driving the transmission component. This structure allows for efficient connection with the base. The lifting drive mechanism connected to the base assembly allows each edge support component to rise and enter the corresponding edge support hole when the base assembly is raised. This lifts the wafer supported in the edge support hole, separating the wafer from the tray and enabling the wafer to rotate. This allows wafers located off the center of the tray and at the edge of the tray to rotate continuously, periodically approaching the center of the tray. This reduces the impact of uneven plasma distribution within the semiconductor process equipment chamber on the thickness of the thin film deposited on the wafer, thereby improving the uniformity of the thin film thickness deposited on the wafer and improving the process results.

[0021] The semiconductor process equipment provided by the present invention, by partially placing the wafer carrier device provided by the present invention within the chamber body, can carry the wafer with the help of the wafer carrier device provided by the present invention, thereby improving the thickness uniformity of the thin film deposited on the wafer and improving the process results. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a wafer carrier device and semiconductor process equipment provided in a preferred embodiment of the present invention, showing the wafer being carried on a base.

[0023] Figure 2 This is a schematic diagram of the structure of a wafer carrier device and semiconductor process equipment provided in a preferred embodiment of the present invention, showing the wafer being carried on a tray.

[0024] Figure 3 This is a schematic diagram of the structure of a wafer carrier device and semiconductor process equipment provided in another preferred embodiment of the present invention, showing the wafer being carried on a base.

[0025] Figure 4 This is a three-dimensional structural diagram of the wafer carrier device provided in an embodiment of the present invention, showing the cooperation between the tray, the edge carrier component, and the center carrier component.

[0026] Figure 5 A top view of the wafer carrier device provided in an embodiment of the present invention, showing the cooperation between the tray, the edge carrier component, and the center carrier component;

[0027] Explanation of reference numerals in the attached figures:

[0028] 1-Base; 11-Assembly cavity; 12-First bellows; 2-Tray; 21-Edge bearing hole;

[0029] 211 - First upper hole section; 212 - First lower hole section; 22 - Central bearing hole; 221 - Second upper hole section;

[0030] 222-Second lower hole section; 3-Wafer; 41-Edge bearing component; 42-Drive shaft; 43-Central rotating shaft; 44-Central gear; 45-Edge rotating shaft; 46-Edge gear; 47-Central bearing component; 48-Drive bearing; 49-Central bearing; 51-Edge bearing; 52-Coupling; 6-Rotation drive source; 7-Support mechanism; 71-Support base; 721-Support component; 722-Limiting protrusion; 73-Second bellows; 8-Cavity body; 91-Flange; 92-Ceramic ring; 93-Target material; 94-Inner liner; 95-Pressure ring. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions of the present invention, the wafer carrier device and semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0032] like Figures 1-5 As shown in the figure, this embodiment of the invention provides a wafer carrier device, including a base assembly, a tray 2, and a lifting drive mechanism (not shown in the figure). The tray 2 has multiple edge-carrying holes 21 for carrying wafers 3. The lifting drive mechanism is connected to the base assembly for driving the base assembly to lift. The base assembly includes a base 1, a rotation mechanism, and a rotation drive source 6. The base 1 includes a bearing surface for carrying the tray 2, and multiple edge mounting through holes are formed on the bearing surface. The rotation mechanism includes a transmission component and multiple edge-carrying components 41. The transmission component is disposed inside the base 1. An edge support component 41 is disposed above the support surface. Multiple edge support components 41 are configured one-to-one with multiple edge mounting through holes. The edge support component 41 is connected to the transmission assembly through the edge mounting through holes. The transmission assembly is connected to the rotation drive source 6 to drive the edge support component 41 to rotate. Multiple edge support components 41 are configured one-to-one with multiple edge support holes 21. The edge support component 41 is used to lift the wafer 3 carried in the edge support hole 21 and drive the wafer 3 to rotate when the base assembly rises and enters the edge support hole 21.

[0033] The wafer carrier device provided in this embodiment of the invention has multiple edge support holes 21 on the tray 2 for supporting wafers 3. The base assembly includes a base 1, a rotating mechanism, and a rotating drive source 6. Multiple edge mounting through holes are provided on the support surface of the base 1 for supporting the tray 2. Multiple edge support components 41 of the rotating mechanism are disposed on the support surface and correspond one-to-one with the multiple edge mounting through holes and the multiple edge support holes 21. The transmission component of the rotating mechanism is disposed inside the base 1 and is connected to the multiple edge support components 41 through the multiple edge mounting through holes. The rotating drive source 6 is connected to the transmission component and can drive the multiple edge support components 41 to rotate by driving the transmission component. This structure allows the lifting drive mechanism, which is connected to the base assembly, to rotate the base assembly. During the lifting process, each edge support component 41 can rise and enter the corresponding edge support hole 21 to lift the wafer 3 supported in the edge support hole 21, separating the wafer 3 from the tray 2. This allows the wafer 3 to rotate, enabling the wafer 3 located off the center of the tray 2 and at the edge of the tray 2 (i.e., off the center of the chamber body 8 of the semiconductor process equipment) to rotate continuously and periodically approach the center of the tray. This reduces the impact of uneven plasma distribution within the chamber body 8 of the semiconductor process equipment on the thickness of the thin film deposited on the wafer 3, thereby improving the uniformity of the thin film thickness deposited on the wafer 3 and improving the process results.

[0034] like Figures 1-3 As shown, optionally, a retractable first bellows 12 can be provided at the bottom of the base 1. The first bellows 12 is sealed to the bottom of the base 1 and the bottom wall of the chamber body 8 respectively. The first bellows 12 is used to seal between the base 1 and the chamber body 8 at all times when the lifting drive mechanism drives the base assembly to lift.

[0035] like Figures 1-3 As shown, optionally, the base 1 may have an assembly cavity 11 inside, and the transmission component may be installed in the assembly cavity 11.

[0036] Optionally, multiple edge mounting through holes can be configured one-to-one with multiple edge bearing holes 21, and each edge mounting through hole can be coaxially configured with the corresponding edge bearing hole 21 (that is, the axis of the edge mounting through hole can be collinear with the axis of the edge bearing hole 21).

[0037] Optionally, the edge support member 41 supports the wafer 3 carried in the edge support hole 21, so that the distance between the wafer 3 and the tray 2 can be 0.5mm-2mm. This design can, on the one hand, avoid the wafer 3 scraping against the tray 2 when the edge support member 41 rotates due to the distance between the wafer 3 and the tray 2 being too small, and on the other hand, avoid the thin film being deposited on the devices below the wafer 3 (e.g., the side and bottom of the edge support member 41 and the support surface of the base 1) due to the distance between the wafer 3 and the tray 2 being too large.

[0038] like Figure 4 and Figure 5 As shown, optionally, the edge support member 41 can be frustum-shaped.

[0039] Optionally, the base 1 can be disc-shaped.

[0040] Optionally, the rotary drive source 6 may include an electric component or a pneumatic component.

[0041] Optionally, the rotation drive source 6 can provide rotational driving force continuously or intermittently. This allows the wafer 3 to be driven by the edge support component 41 to rotate continuously or intermittently, thereby improving the flexibility of the wafer support device.

[0042] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the transmission assembly may include a transmission shaft 42, a central rotating shaft 43, a central gear 44, multiple edge rotating shafts 45 and multiple edge gears 46. The transmission shaft 42 is connected to the rotary drive source 6, the central rotating shaft 43 is connected to the transmission shaft 42, the central gear 44 is connected to the central rotating shaft 43 and meshes with all the edge gears 46 to drive all the edge gears 46 to rotate, and the multiple edge rotating shafts 45 are connected to the multiple edge gears 46 one by one, and are connected to the edge bearing component 41 through the edge mounting through holes one by one.

[0043] In practical applications, multiple edge shafts 45 are connected one-to-one with multiple edge gears 46. Multiple edge shafts 45 pass through multiple edge mounting through holes one-to-one and are connected one-to-one with multiple edge support components 41. A central shaft 43 and a central gear 44 are located at the center of the base 1. Multiple edge gears 46 are arranged around the outer side of the central gear 44, spaced apart, and all mesh with the central gear 44. When the edge support component 41 lifts the wafer 3 supported in the edge support hole 21, and the rotation drive source 6 provides rotational driving force, the rotational driving force from the rotation drive source 6 drives the transmission shaft 42 to rotate. The rotation of the transmission shaft 42 drives the central shaft 43 to rotate, the rotation of the central shaft 43 drives all the edge gears 46 to rotate, the rotation of each edge gear 46 drives each edge shaft 45 to rotate, the rotation of each edge shaft 45 drives each edge support component 41 to rotate, and the rotation of each edge support component 41 drives each wafer 3 to rotate.

[0044] Optionally, the number of teeth of the center gear 44 and the number of teeth of the peripheral gear 46 can be the same or different.

[0045] Optionally, the drive shaft 42 and the central rotating shaft 43 can be connected by a coupling 52.

[0046] Optionally, the central shaft 43 and the central gear 44 can be keyed together.

[0047] Optionally, the edge pivot 45 and the edge gear 46 can be keyed.

[0048] However, the type of transmission component is not limited to gear transmission; for example, the transmission component can also be a belt transmission.

[0049] like Figures 1-5 As shown, in a preferred embodiment of the present invention, a central support hole 22 may also be provided on the tray 2. The central support hole 22 is located at the center of the tray 2 and is used to support the wafer 3. Multiple edge support holes 21 are arranged around the outer side of the central support hole 22.

[0050] In other words, the central support hole 22 is located at the center of the tray 2, that is, the axis of the central support hole 22 is collinear with the axis of the tray 2, and multiple edge support holes 21 are arranged around the outside of the central support hole 22, that is, each edge support hole 21 is offset from the center of the tray 2 (the axis of each edge support hole 21 is offset from the axis of the tray 2), and multiple edge support holes 21 are spaced apart. Both the central support hole 22 and each edge support hole 21 are used to support the wafer 3.

[0051] Since the central support hole 22 is located at the center of the tray 2, when the wafer 3 is supported in the central support hole 22, the wafer 3 is located at the center of the tray 2. Thus, when the tray 2 is supported on the base 1, the wafer 3 is located at the center of the base 1. Therefore, regardless of whether the wafer 3 supported in the central support hole 22 rotates, all parts of the surface of the wafer 3 supported in the central support hole 22 are always located at the same radial position within the chamber body 8 of the semiconductor process equipment in the semiconductor process. In other words, the thickness of the thin film deposited on the wafer 3 supported in the central support hole 22 will not change due to whether the wafer 3 supported in the central support hole 22 rotates or not. Therefore, the wafer 3 can be supported in the central support hole 22 of the tray 2 without rotation.

[0052] However, the structure of the pallet 2 used in the embodiments of the present invention is not limited to this. For example, the pallet 2 used in the embodiments of the present invention may not have a central bearing hole 22, but only an edge bearing hole 21. For another example, the pallet 2 used in the embodiments of the present invention may also have multiple edge bearing hole groups. Each edge bearing hole group may include one or more edge bearing holes 21. The edge bearing holes 21 of different edge bearing hole groups are located on the circumference of different radial dimensions of the pallet 2.

[0053] like Figures 3-5 As shown, in a preferred embodiment of the present invention, the rotating mechanism may further include a central support component 47, which is correspondingly disposed with the central support hole 22. The central support component 47 is fixed on the support surface and is used to enter the central support hole 22 to lift the wafer 3 carried in the central support hole 22.

[0054] In this way, in the semiconductor process, when the tray 2 is supported on the base 1, the central support component 47 can enter the central support hole 22 to lift the wafer 3 supported in the central support hole 22, so that the wafer 3 is separated from the tray 2 and supported. In other words, similar to how the wafer 3 supported in the edge support hole 21 is no longer supported in the edge support hole 21, the wafer 3 supported in the central support hole 22 is no longer supported in the central support hole 22, but is supported by the central support component 47, similar to how the wafer 3 located at the edge is supported by the edge support component 41.

[0055] It should be noted that in this structure, the central rotating shaft 43 is not connected to the central supporting component 47. The rotation of the central rotating shaft 43 will not cause the central supporting component 47 to rotate, nor will it cause the wafer 3 supported by the central supporting component 47 to rotate.

[0056] Optionally, the central bearing component 47 can be an integral structure with the base 1, so that the central bearing component 47 can be fixed on the bearing surface of the base 1.

[0057] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in another preferred embodiment of the present invention, the rotating mechanism may further include a central bearing component 47, and a central mounting through hole may be provided on the bearing surface. The central bearing component 47 is disposed above the bearing surface and is connected to the transmission assembly through the central mounting through hole. The transmission assembly is used to drive the central bearing component 47 to rotate. The central bearing component 47 is correspondingly disposed with the central bearing hole 22. The central bearing component 47 is used to enter the central bearing hole 22 to lift the wafer 3 carried in the central bearing hole 22 and drive the wafer 3 to rotate.

[0058] In this way, in the semiconductor process, when the tray 2 is supported on the base 1, the central mounting through hole and the central support hole 22 are correspondingly set (optionally, the central mounting through hole can be coaxial with the central support hole, that is, the axis of the central mounting through hole can be collinear with the axis of the central support hole 22). The central support component 47 can enter the central support hole 22 to lift the wafer 3 supported in the central support hole 22, so that the wafer 3 is separated from the tray 2. Since the central support component 47 is connected to the transmission component, the central support component 47 can drive the wafer 3 to rotate.

[0059] Optionally, the central support component 47 lifts the wafer 3 supported in the central support hole 22, so that the distance between the wafer 3 and the tray 2 can be 0.5mm-2mm. This design can, on the one hand, avoid the wafer 3 scraping against the tray 2 when it is rotated by the central support component 47 due to the distance between the wafer 3 and the tray 2 being too small, and on the other hand, avoid the thin film being deposited on the devices below the wafer 3 (e.g., the side and bottom of the central support component 47 and the support surface of the base 1) due to the distance between the wafer 3 and the tray 2 being too large.

[0060] like Figures 1-3 As shown, optionally, the central rotating shaft 43 can pass through the central mounting through hole and connect to the central bearing component 47, so that the central bearing component 47 can be connected to the transmission assembly through the central mounting through hole. The rotation of the central rotating shaft 43 can drive the central bearing component 47 to rotate, and the rotation of the central bearing component 47 can drive the wafer 3 carried in the central bearing component 47 to rotate.

[0061] like Figures 1-3As shown, in a preferred embodiment of the present invention, the transmission assembly may further include a transmission bearing 48, a central bearing 49, and a plurality of edge bearings 51. The transmission bearing 48 is fixed in the assembly cavity 11 and sleeved around the transmission shaft 42. The central bearing 49 is fixed in the assembly cavity 11 and sleeved around the central rotating shaft 43. The plurality of edge bearings 51 are fixed in the assembly cavity 11 and are correspondingly sleeved on the outside of the plurality of edge rotating shafts 45.

[0062] In other words, the drive shaft 42 is rotatably mounted in the assembly cavity 11 via the drive bearing 48, the central shaft 43 is rotatably mounted in the assembly cavity 11 via the central bearing 49, and the edge shaft 45 is rotatably mounted in the assembly cavity 11 via the edge bearing 51. Figure 2 As shown, in a preferred embodiment of the present invention, the edge bearing hole 21 may include a first upper hole segment 211 and a first lower hole segment 212 from top to bottom. The radial dimension of the first upper hole segment 211 is greater than the radial dimension of the first lower hole segment 212. The radial dimension of the first upper hole segment 211 is greater than the radial dimension of the wafer 3. The radial dimension of the first lower hole segment 212 is greater than the radial dimension of the edge bearing component 41 and less than the radial dimension of the wafer 3.

[0063] This allows the wafer 3 to be supported in the first upper hole section 211, and allows the edge support member 41 to pass through the first lower hole section 212 and enter the first upper hole section 211 to lift the wafer 3 supported in the first upper hole section 211 and drive the wafer 3 to rotate.

[0064] In practical applications, the edge support component 41 can be made to have a height on the base 1 greater than the axial length of the first lower hole section 212, so that when the tray 2 is supported on the base 1, the edge support component 41 can pass through the first lower hole section 212 and enter the first upper hole section 211 to support the wafer 3 supported in the first upper hole section 211.

[0065] like Figure 2 As shown, in a preferred embodiment of the present invention, the central support hole 22 may include a second upper hole section 221 and a second lower hole section 222 from top to bottom. The radial dimension of the second upper hole section 221 is greater than the radial dimension of the second lower hole section 222. The radial dimension of the second upper hole section 221 is greater than the radial dimension of the wafer 3. The radial dimension of the second lower hole section 222 is greater than the radial dimension of the central support component 47 and less than the radial dimension of the wafer 3.

[0066] This allows the wafer 3 to be supported in the second upper aperture section 221, and allows the central support component 47 to pass through the second lower aperture section 222 and enter the second upper aperture section 221 to lift the wafer 3 supported in the second upper aperture section 221 and / or drive the wafer 3 to rotate.

[0067] In practical applications, the height of the central support component 47 on the base 1 can be made greater than the axial length of the second lower hole section 222, so that when the tray 2 is supported on the base 1, the central support component 47 can pass through the second lower hole section 222 and enter the second upper hole section 221 to support the wafer 3 supported in the second upper hole section 221.

[0068] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the radial dimension of the edge bearing member 41 can be smaller than the radial dimension of the wafer 3.

[0069] This allows the edge support component 41 to be completely shielded by the wafer 3, preventing the deposition of a thin film on the edge support component 41 and thus improving the service life of the edge support component 41.

[0070] Optionally, the radial dimension of the edge bearing component 41 can be 2mm-10mm smaller than the radial dimension of the wafer 3.

[0071] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the radial dimension of the central support component 47 can be smaller than the radial dimension of the wafer 3.

[0072] This allows the central carrier component 47 to be completely shielded by the wafer 3, preventing the deposition of a thin film on the central carrier component 47 and thus improving the service life of the edge carrier component 41.

[0073] Optionally, the radial dimension of the central support component 47 can be 2mm-10mm smaller than the radial dimension of the wafer 3.

[0074] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the wafer carrier device may further include a support mechanism 7, which is used to support the tray 2 when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray 2 from the base assembly.

[0075] By using the support mechanism 7 to support the pallet 2 when the lifting drive mechanism drives the base assembly to descend, the pallet 2 is separated from the base 1, thus enabling the transfer of the pallet 2.

[0076] In practical applications, the support mechanism 7 can be height-adjustable. Before the semiconductor process begins, a robotic arm carries a tray 2 containing a wafer 3 into the chamber body 8. The support mechanism 7 rises, lifting the wafer 3 on the robotic arm and separating the tray 2 from the robotic arm. At this time, the wafer 3 can be placed in the central support hole 22 and / or the edge support hole 21. Subsequently, the robotic arm exits the chamber body 8, and the lifting drive mechanism drives the base assembly to rise. The base 1 lifts the tray 2 on the support mechanism 7, separating the tray 2 from the support mechanism 7. At this time, the wafer 3 can be placed on the central support component 47 and / or the edge support component 41. Then, the wafer 3 can be processed. Semiconductor processing is performed, and the wafer 3 can be rotated during the semiconductor process using the central support component 47 and / or the edge support component 41. After the semiconductor process is completed, the lifting drive mechanism lowers the base assembly, causing the tray 2 supported on the base 1 to fall onto the support mechanism 7. The support mechanism 7 lifts the tray 2, separating it from the base 1. At this point, the wafer 3 can be placed in the central support hole 22 and / or the edge support hole 21. Subsequently, the robot enters the semiconductor processing equipment, the support mechanism 7 lowers, and the tray 2 supported on the support mechanism 7 falls onto the robot. The robot then carries the tray 2 carrying the wafer 3 out of the semiconductor processing equipment. By making the support mechanism 7 liftable, the flexibility of tray 2 transport can be improved.

[0077] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the radial dimension of the tray 2 can be larger than the radial dimension of the base 1; the support mechanism 7 may include a support base 71 and a plurality of support components 721, the plurality of support components 721 are disposed on the support base 71 and spaced around the base assembly, the plurality of support components 721 are used to support the tray 2 when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray 2 from the base assembly; the top of the support component 721 may be provided with a limiting protrusion 722, the limiting protrusion 722 is used to limit the position of the tray 2.

[0078] By making the radial dimension of tray 2 larger than that of base 1, multiple support components 721 can engage with the edge of tray 2 to support it. This avoids interference between the support components 721 and the transmission components located inside base 1, thereby improving the operational stability of the wafer carrier device. In other words, when the support mechanism 7 supports tray 2, multiple support components 721 contact the edge of tray 2 to support it. By providing limiting protrusions 722 on the support components 721, when multiple support components support tray 2, the limiting protrusions 722 can block the edge of tray 2, thereby limiting the radial position of tray 2 on the multiple support components 721 and preventing tray 2 from slipping off the multiple support components 721, thus improving the operational stability of the wafer carrier device.

[0079] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the support base 71 may be annular, the support member 721 may be columnar, the limiting protrusion 722 is disposed on the columnar support member 721, and the support member 721 may move radially along the annular support base 71 to adjust the spacing between the multiple support members 721.

[0080] By adjusting the spacing between multiple support components 721, trays 2 of different radial dimensions can be supported by multiple support components 721, thereby improving the flexibility of the wafer carrier device.

[0081] Optionally, the number of support components 721 can be two, three, or more.

[0082] Optionally, the multiple support members 721 may be evenly spaced around the base assembly or unevenly spaced around the base assembly.

[0083] Optionally, a second bellows 73 may be provided at the bottom of the support mechanism 7. The second bellows 73 is sealed to the bottom of the support mechanism 7 and the bottom wall of the chamber body 8 respectively. The second bellows 73 is used to seal between the support mechanism 7 and the chamber body 8 at all times when the support mechanism 7 is raised and lowered.

[0084] like Figures 1-3 As shown, this embodiment of the invention also provides a semiconductor process apparatus, including a chamber body 8 and a wafer carrier device as provided in this embodiment of the invention. The wafer carrier device is partially disposed within the chamber body 8 and is used to carry the wafer 3.

[0085] The semiconductor process equipment provided in this embodiment of the invention, by partially placing the wafer carrier device provided in this embodiment of the invention inside the chamber body 8, can carry the wafer 3 with the help of the wafer carrier device provided in this invention, thereby improving the thickness uniformity of the thin film deposited on the wafer 3 and improving the process results.

[0086] like Figures 1-3 As shown, in a preferred embodiment of the present invention, the semiconductor process equipment may further include a flange 91, a ceramic ring 92, a target 93, an inner liner 94, and a pressure ring 95. The flange 91 is annularly disposed on the chamber body 8, the ceramic ring 92 is annularly disposed on the chamber body 8, and the target 93 is disposed on the ceramic ring 92. The chamber body 8, flange 91, ceramic ring 92, and target 93 form a sealed space, providing a vacuum process environment for the semiconductor process. The inner liner 94 is annularly assembled in the flange 91, and the pressure ring 95 is annularly overlapped on the inner liner 94. In the semiconductor process, the pressure ring 95 can press against the edge of the tray 2 and can form a labyrinth structure with the inner liner 94.

[0087] Before the semiconductor process begins, the pressure ring 95 overlaps the inner liner 94. During the process of the base assembly rising to support the tray 2, the tray 2 rises with the base assembly and lifts the pressure ring 95 overlapping the inner liner 94, so that the pressure ring 95 presses against the edge of the tray 2 and forms a labyrinth structure with the pressure ring 95 and the inner liner 94. Then the semiconductor process is carried out. In the semiconductor process, process gases including inert gases and reactive gases can be introduced into the chamber body 8. DC or radio frequency power is applied to the target 93 to excite the process gases to form plasma and bombard the target 93. The bombarded target 93 particles are deposited on the wafer surface to form a thin film. The inner liner 94 and the pressure ring 95 can prevent the target 93 particles from depositing on the inner peripheral wall of the chamber body 8, as well as on the base assembly below the tray 2 and the inner wall of the chamber body 8.

[0088] In summary, the wafer carrier device and semiconductor process equipment provided in the embodiments of the present invention can improve the thickness uniformity of the thin film deposited on the wafer 3 and improve the process results.

[0089] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer carrier device, characterized in that, It includes a base assembly, a tray, and a lifting drive mechanism, wherein the tray has multiple edge support holes for supporting the wafer; The lifting drive mechanism is connected to the base assembly for driving the base assembly to lift. The base assembly includes a base, a rotating mechanism, and a rotating drive source. The base includes a bearing surface for supporting the tray, and the bearing surface has multiple edge mounting through holes. The rotating mechanism includes a transmission assembly and multiple edge bearing components. The transmission assembly is disposed inside the base, and the edge bearing components are disposed above the bearing surface. The multiple edge bearing components are correspondingly arranged with the multiple edge mounting through holes. The edge bearing components are driven to the transmission assembly through the edge mounting through holes. The transmission assembly is driven to the rotating drive source to drive the edge bearing components to rotate. The multiple edge bearing components are correspondingly arranged with the multiple edge bearing holes. The edge bearing components are used to lift the wafers carried in the edge bearing holes when the base assembly rises and enters the edge bearing holes, and drive the wafers to rotate continuously and periodically move closer to the center of the tray. The tray is also provided with a central support hole, which is located at the center of the tray and is used to support the wafer. Multiple edge support holes are arranged around the outer side of the central support hole.

2. The wafer carrier device according to claim 1, characterized in that, The transmission assembly includes a transmission shaft, a central rotating shaft, a central gear, multiple edge rotating shafts, and multiple edge gears. The transmission shaft is connected to the rotary drive source, the central rotating shaft is connected to the transmission shaft, the central gear is connected to the central rotating shaft and meshes with all the edge gears to drive all the edge gears to rotate. The multiple edge rotating shafts are connected to the multiple edge gears one-to-one and pass through the edge mounting through holes one-to-one to connect with the edge bearing component.

3. The wafer carrier device according to claim 1, characterized in that, The rotating mechanism further includes a central support component, which is correspondingly disposed with the central support hole. The central support component is fixed on the support surface and is used to enter the central support hole to lift the wafer supported in the central support hole.

4. The wafer carrier device according to claim 1, characterized in that, The rotating mechanism further includes a central support component, and a central mounting through hole is provided on the support surface. The central support component is disposed above the support surface and is connected to the transmission assembly through the central mounting through hole. The transmission assembly is used to drive the central support component to rotate. The central support component is correspondingly disposed to the central support hole. The central support component is used to enter the central support hole to lift the wafer carried in the central support hole and drive the wafer to rotate.

5. The wafer carrier device according to claim 1, characterized in that, The edge support hole comprises a first upper hole section and a first lower hole section from top to bottom. The radial dimension of the first upper hole section is greater than the radial dimension of the first lower hole section. The radial dimension of the first upper hole section is greater than the radial dimension of the wafer. The radial dimension of the first lower hole section is greater than the radial dimension of the edge support component and smaller than the radial dimension of the wafer.

6. The wafer carrier device according to claim 3 or 4, characterized in that, The central support hole includes a second upper hole section and a second lower hole section from top to bottom. The radial dimension of the second upper hole section is greater than the radial dimension of the second lower hole section. The radial dimension of the second upper hole section is greater than the radial dimension of the wafer. The radial dimension of the second lower hole section is greater than the radial dimension of the central support component and smaller than the radial dimension of the wafer.

7. The wafer carrier device according to claim 1, characterized in that, The wafer carrier further includes a support mechanism for supporting the tray when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray from the base assembly.

8. The wafer carrier device according to claim 7, characterized in that, The radial dimension of the tray is larger than the radial dimension of the base; The support mechanism includes a support base and multiple support components. The multiple support components are disposed on the support base and spaced around the base assembly. The multiple support components are used to support the tray when the lifting drive mechanism drives the base assembly to descend, so as to separate the tray from the base assembly. The support components are provided with limiting protrusions, which are used to limit the radial position of the tray.

9. The wafer carrier device according to claim 8, characterized in that, The support base is annular, the support component is columnar, the limiting protrusion is disposed on the top of the columnar support component, and the support component can move radially along the annular support base to adjust the spacing between the multiple support components.

10. A semiconductor process apparatus, characterized in that, It includes a chamber body and a wafer carrier device as described in any one of claims 1-9, wherein the wafer carrier device is partially disposed within the chamber body for carrying the wafer.

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