A wafer detection device

Abstract

The present invention relates to a wafer detection device, which includes a base and a detection position slide rail 1, a pick-and-place slide rail for detection positions, a direction detection frame, and a dotting frame respectively arranged on the base; a detection position moving cylinder 1 is fixedly arranged on the detection position slide rail 1; a placement seat 1 is slidably arranged between the detection position slide rail 1 and the pick-and-place slide rail for detection positions; the detection position moving cylinder 1 is connected to the placement seat 1; a feeding device 1 is arranged on the placement seat 1 for placing a wafer and performing rotational positioning on the wafer; a pick-and-place device 1 is arranged on one side of the pick-and-place slide rail for detection positions for picking a wafer from a wafer cassette and placing the wafer into the placement device 1 or picking a wafer from the placement device 1 and placing the wafer into the wafer cassette; a direction detection camera 1 is arranged on one side of the direction detection frame; a defect detection camera is arranged on the other side of the direction detection frame; a dotting machine is arranged on the dotting frame. The present invention has the advantages of being convenient for detecting wafer defects and dotting and marking the detected defects, and improving production efficiency, etc.

Description

Technical Field:

[0001] The present invention relates to the field of chip technology, and particularly to a wafer detection device. Background Art:

[0002] During the production and manufacturing process of wafers, scratches often occur on the surface, and there will be surface stains during the production process. For such wafers with surface scratches or surface stains, when they are subsequently sliced into chips, the chips at the scratched or stained areas generally have poor quality. To avoid such bad phenomena, it is necessary to detect the wafers before slicing, eliminate the defective wafers, or mark the defective areas of the wafers. During slicing, the wafers at the marked areas are eliminated to avoid poor quality of the sliced chips. Currently, the detection of wafer scratches or stains generally adopts manual recognition, which has low efficiency and is prone to missed detection.

[0003] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention:

[0004] To achieve the above object, the present invention provides a wafer detection device, which includes a base and a detection position slide rail 1, a pick-and-place slide rail for detection position, a direction detection frame, and a dotting frame respectively arranged on the base; a detection position moving cylinder 1 is fixedly arranged on the detection position slide rail 1; a placement seat 1 is slidably arranged between the detection position slide rail 1 and the pick-and-place slide rail for detection position; the detection position moving cylinder 1 is connected to the placement seat 1 to drive the placement seat 1 to move between the detection position slide rail 1 and the pick-and-place slide rail for detection position; a feeding device 1 is arranged on the placement seat 1 for placing wafers and rotating and positioning the wafers; a pick-and-place device 1 is arranged on one side of the pick-and-place slide rail for detection position for taking wafers from a wafer cassette and placing the wafers into the placement device 1 or taking wafers from the placement device 1 and placing the wafers into the wafer cassette; a direction detection support 1 is slidably arranged on one side of the direction detection frame; a direction detection light source 1 and a direction detection camera frame 1 are respectively fixedly arranged and slidably arranged on the direction detection support 1; a direction detection camera 1 is arranged on the direction detection camera frame 1; a defect detection slide rail is arranged on the other side of the direction detection frame; a defect detection support is slidably arranged on the defect detection slide rail; a defect detection light source and a defect detection camera frame are respectively fixedly arranged and slidably arranged on the defect detection support; a defect detection camera is arranged on the defect detection camera frame; a dotting slide rail is arranged on the dotting frame; a dotting seat is slidably arranged on the dotting slide rail; and a dotting machine is arranged on the dotting seat.

[0005] Further, it also includes a detection position slide rail two provided on the base; a detection position moving cylinder two fixedly provided on the detection position slide rail two; a placement seat two slidably provided between the detection position slide rail two and the detection position pick-and-place slide rail; the detection position moving cylinder two is connected to the placement seat two to drive the placement seat two to move between the detection position slide rail two and the detection position pick-and-place slide rail; a feeding device two is provided on the placement seat two for placing a wafer and performing rotational positioning on the wafer; a pick-and-place device two is provided on the other side of the detection position pick-and-place slide rail for picking the wafer from the wafer cassette and placing the wafer into the placement device two or picking the wafer from the placement device two and placing the wafer into the wafer cassette; a direction detection support two is provided on the direction detection frame; a direction detection light source two and a direction detection camera frame two are respectively fixedly provided on the direction detection support two; a direction detection camera two is provided on the direction detection camera frame two; a defect detection cylinder is provided on the direction detection frame; the defect detection cylinder is connected to the defect detection support to drive the defect detection support to move on the defect detection slide rail; a dotting cylinder is provided on the dotting frame; the dotting cylinder is connected to the dotting seat to drive the dotting seat to move on the dotting slide rail.

[0006] Further, a back detection light source is provided on the base; a back detection slide rail is provided on the back of the base; a back detection camera frame is slidably provided on the back detection slide rail; a back detection camera is provided on the back detection camera frame.

[0007] Further, a back detection cylinder is provided on the back of the base; the back detection cylinder is connected to the back detection camera frame to drive the back detection camera frame to move on the back detection slide rail.

[0008] Further, the feeding device one and the feeding device two both include a feeding upper plate, a feeding lower plate rotatably provided on the placement seat one or the placement seat two, a gear clutch slider slidably provided on the placement seat one or the placement seat two, and a gear clutch cylinder, an alignment driving device, and an alignment pulley respectively fixedly provided on the placement seat one or the placement seat two; an adjustment distance screw is provided between the feeding upper plate and the feeding lower plate; a right-handed thread and a left-handed thread are respectively provided on the adjustment distance screw; the feeding upper plate and the feeding lower plate are respectively connected to the right-handed thread and the left-handed thread of the adjustment distance screw, and by rotating the adjustment distance screw, the feeding upper plate and the feeding lower plate are brought closer or separated; a tightening gear is provided on the adjustment distance screw; a driving gear set and a gear set driving device are provided on the gear clutch slider, and the gear set driving device drives the driving gear set to rotate; the gear clutch cylinder is connected to the gear clutch slider to drive the gear clutch slider to move on the placement seat one or the placement seat two, so that the driving gear set meshes with or disengages from the tightening gear; the alignment driving device is connected to the alignment pulley to drive the alignment pulley to rotate; an alignment belt is sleeved between the alignment pulley and the feeding lower plate.

[0009] Further, both the pick-and-place device 1 and the pick-and-place device 2 include a driving seat, a rotating seat, a rotating device respectively and fixedly arranged on the detection position slide rail, and a pick-and-place lifting cylinder slidably arranged on the detection position slide rail; a driving shaft is rotatably arranged on the driving seat; a driving wheel is arranged on the driving shaft; a rotating shaft is rotatably arranged on the rotating seat; a rotating wheel is arranged on the rotating shaft; a belt is sleeved between the driving wheel and the rotating wheel; the belt is connected to the pick-and-place lifting cylinder to drive the pick-and-place lifting cylinder to move on the detection position slide rail; the rotating device is belt-connected to the driving shaft to drive the driving shaft to rotate; a pick-and-place rack is arranged on the pick-and-place lifting cylinder, and the pick-and-place lifting cylinder drives the pick-and-place rack to rise or fall; a pick-and-place cylinder, a pick-and-place fixed clamp are respectively and fixedly arranged on the pick-and-place rack, and a pick-and-place sliding clamp is slidably arranged; the pick-and-place cylinder is connected to the pick-and-place sliding clamp to drive the pick-and-place sliding clamp to move on the pick-and-place rack to clamp or release the wafer.

[0010] Further, it further includes a central control unit, and the central control unit includes:

[0011] A positioning picture extraction module, which is used to extract the wafer positioning pictures taken by the direction detection camera 1 and the direction detection camera 2;

[0012] A positioning recognition module, which is used to analyze whether the wafer scratch direction in the wafer positioning picture meets the requirements;

[0013] A defect picture extraction module, which is used to extract the wafer pictures taken by the defect detection camera and the back detection camera;

[0014] A defect recognition module, which is used to detect the wafer defects on the wafer pictures;

[0015] A defect printing module, which is used to control the dotting machine to print the wafer defects detected by the defect recognition module onto the wafer;

[0016] A work scheduling module, which is used to control the work of the detection position moving cylinder 1, the detection position moving cylinder 2, the defect detection cylinder, the dotting cylinder, the back detection cylinder, the rotating device, the pick-and-place lifting cylinder, the pick-and-place cylinder, the gear clutch cylinder, the gear set driving device, and the orientation adjustment driving device.

[0017] Compared with the prior art, a wafer detection device of the present invention is provided with a slidable placement seat 1, and a feeding device 1 is arranged on the placement seat 1 for placing wafers, rotating and positioning the wafers. A picking and placing device 1 is also provided for picking wafers from a wafer cassette and placing the wafers into the placement device 1 or picking wafers from the placement device 1 and placing the wafers into the wafer cassette. A direction detection camera 1, a defect detection camera, and a dotting machine are further provided. The direction detection camera 1 takes pictures of the wafer notch direction, the feeding device 1 rotates and positions the wafers that do not meet the requirements, the defect detection camera takes pictures of the positioned wafers, identifies wafer defects from the wafer photos, and the dotting machine prints the defects on the wafers. Thus, the present invention has the advantages of being convenient for detecting wafer defects and dotting and marking the detected defects, improving production efficiency, etc. BRIEF DESCRIPTION OF THE DRAWINGS:

[0018] Figure 1 Left view schematic diagram of a wafer detection device of the present invention;

[0019] Figure 2 Right view schematic diagram of a wafer detection device of the present invention;

[0020] Figure 3 Bottom view of a wafer detection device of the present invention;

[0021] Figure 4 Schematic diagram of the picking and placing device of a wafer detection device of the present invention;

[0022] Figure 5 Schematic diagram of the feeding device 1 or feeding device 2 of a wafer detection device of the present invention;

[0023] Figure 6 Top view working process schematic diagram of a wafer detection device of the present invention;

[0024] The reference numerals are: 1 - base, 2 - picking and placing device I, 201 - driving seat, 202 - rotating seat, 203 - rotating device, 204 - rotating shaft, 205 - driving shaft, 206 - driving wheel, 207 - rotating wheel, 208 - belt, 209 - picking and placing lifting air cylinder, 210 - picking and placing rack, 211 - picking and placing air cylinder, 212 - picking and placing slide block clamp, 213 - picking and placing fixed clamp, 3 - placing seat I, 4 - detecting position moving air cylinder I, 5 - feeding device I, 501 - gear clutch air cylinder, 502 - gear set driving device, 503 - driving gear set, 504 - tensioning gear, 505 - lower feeding plate, 506 - upper feeding plate, 507 - aligning belt, 508 - aligning driving device, 509 - aligning belt pulley, 510 - gear clutch slide block, 6 - direction detecting frame, 7 - direction detecting support I, 8 - direction detecting camera support I, 9 - direction detecting camera I, 10 - direction detecting light source I, 11 - feeding device II, 12 - direction detecting light source II, 13 - direction detecting support II, 14 - direction detecting camera support II, 15 - direction detecting camera II, 16 - wafer cassette, 17 - defect detecting slide rail, 18 - defect detecting air cylinder, 19 - defect detecting support, 20 - defect detecting camera support, 21 - defect detecting camera, 22 - defect detecting light source, 23 - dotting frame, 24 - dotting slide rail, 25 - dotting seat, 26 - dotting machine, 27 - dotting air cylinder, 28 - backside detecting light source, 29 - backside detecting camera, 30 - backside detecting slide rail, 31 - backside detecting camera support, 32 - backside detecting air cylinder, 33 - detecting position picking and placing slide rail, 34 - detecting position slide rail I, 35 - detecting position slide rail II, 36 - placing seat II, 37 - detecting position moving air cylinder II, 38 - picking and placing device II. Detailed implementation manners:

[0025] The following describes the detailed implementation manners of the present invention in detail, but it should be understood that the protection scope of the present invention is not limited by the detailed implementation manners.

[0026] Unless otherwise clearly stated, in the whole specification and claims, the term "comprise" or its variations such as "comprising" or "including" etc. will be understood to include the stated elements or components, without excluding other elements or other components.

[0027] As Figures 1 to 3As shown in the figure, a wafer detection device is provided with a base 1. On the base 1, a first detection position slide rail 34, a pick-and-place slide rail 33 for the detection position, a direction detection frame 6, and a dotting frame 23 are respectively arranged. A first detection position moving cylinder 4 is fixedly arranged on the first detection position slide rail 34. A first placement seat 3 is slidably arranged between the first detection position slide rail 34 and the pick-and-place slide rail 33 for the detection position. The first detection position moving cylinder 4 is connected to the first placement seat 3, and the first detection position moving cylinder 4 drives the first placement seat 3 to move between the first detection position slide rail 34 and the pick-and-place slide rail 33 for the detection position. A first feeding device 5 is arranged on the first placement seat 3 for placing the wafer and performing rotational positioning on the wafer. A first pick-and-place device 2 is arranged on one side of the pick-and-place slide rail 33 for the detection position for picking the wafer from the wafer cassette and placing the wafer into the first placement device 5 or picking the wafer from the first placement device 5 and placing the wafer into the wafer cassette. A first direction detection support 7 is slidably arranged on one side of the direction detection frame 6. A first direction detection light source 10 is fixedly arranged on the first direction detection support 7, and a first direction detection camera frame 8 is slidably arranged. A first direction detection camera 9 is arranged on the first direction detection camera frame 8. A defect detection slide rail 17 is arranged on the other side of the direction detection frame 6. A defect detection support 19 is slidably arranged on the defect detection slide rail 17. A defect detection light source 22 is fixedly arranged on the defect detection support 19, and a defect detection camera frame 20 is slidably arranged. A defect detection camera 21 is arranged on the defect detection camera frame 20. A dotting slide rail 24 is arranged on the dotting frame 23. A dotting seat 25 is slidably arranged on the dotting slide rail 24. A dotting machine 26 is arranged on the dotting seat 25. The dotting machine 26 prints the detected wafer defects on the wafer. The dotting machine 26 uses three-axis fine adjustment in the prior art, clamps a dotting device, and the dotting device is driven by an electromagnet to drive a thin wire to move up and down to drive the ink in the ink fountain to the wafer. The size of the dot can be adjusted by controlling the retraction length or thickness of the thin wire to control the size of the ink dot.

[0028] Further, to improve the wafer detection efficiency, a second detection position slide rail 35 is also provided on the base 1, a second detection position moving cylinder 37 is fixedly provided on the second detection position slide rail 35, a second placement seat 36 is slidably provided between the second detection position slide rail 35 and the pick-and-place slide rail 33 for the detection position, the second detection position moving cylinder 37 is connected to the second placement seat 36, and the second detection position moving cylinder 37 drives the second placement seat 36 to move between the second detection position slide rail 35 and the pick-and-place slide rail 33 for the detection position. A second feeding device 11 is provided on the second placement seat 36 for placing the wafer and performing rotational positioning on the wafer. A second pick-and-place device 38 is provided on the other side of the pick-and-place slide rail 33 for the detection position for picking the wafer from the wafer cassette and placing the wafer into the second placement device 11 or picking the wafer from the second placement device 11 and placing the wafer into the wafer cassette. A second direction detection support 13 is provided on the direction detection frame 6, a second direction detection light source 12 is fixedly provided on the second direction detection support 13, a second direction detection camera frame 14 is slidably provided on the second direction detection support 13, and a second direction detection camera 15 is provided on the second direction detection camera frame 14. A defect detection cylinder 18 is provided on the direction detection frame 6, the defect detection cylinder 18 is connected to the defect detection support 19, and the defect detection cylinder 18 drives the defect detection support 19 to move on the defect detection slide rail 17. A dotting cylinder 27 is provided on the dotting frame 23, the dotting cylinder 27 is connected to the dotting seat 25, and the dotting cylinder 27 drives the dotting seat 25 to move on the dotting slide rail 24.

[0029] Further, to test the defects on the back side of the wafer, a back side detection light source 28 is provided on the base 1. Meanwhile, a back side slide rail 30 is provided on the back side of the base 1, a back side camera frame 31 is slidably provided on the back side slide rail 30, and a back side camera 29 is provided on the back side camera frame 31.

[0030] Further, to switch the moving back side camera 29, a back side cylinder 32 is provided on the back side of the base 1, the back side cylinder 32 is connected to the back side camera frame 31, and the back side cylinder 32 drives the back side camera frame 31 to move on the back side slide rail 30.

[0031] Further, the present invention provides specific embodiments of the first feeding device 5 and the second feeding device 11, such as Figure 5As shown, they all include a feeding upper plate 506, a feeding lower plate 505 rotatably arranged on the first placing seat 3 or the second placing seat 36, a gear clutch slider 510 slidably arranged on the first placing seat 3 or the second placing seat 36, and a gear clutch cylinder 501, an alignment driving device 508 and an alignment pulley 509 respectively fixedly arranged on the first placing seat 3 or the second placing seat 36. An adjusting distance screw is arranged between the feeding upper plate 506 and the feeding lower plate 505. A right-handed thread and a left-handed thread are respectively arranged on the adjusting distance screw. The feeding upper plate 506 and the feeding lower plate 505 are respectively connected to the right-handed thread and the left-handed thread of the adjusting distance screw. By rotating the adjusting distance screw, the feeding upper plate 506 and the feeding lower plate 505 are close to or separated from each other. A tensioning gear 504 is arranged on the adjusting distance screw. A driving gear set 503 and a gear set driving device 502 are arranged on the gear clutch slider 510. The gear set driving device 502 drives the driving gear set 503 to rotate. The gear clutch cylinder 501 is connected to the gear clutch slider 510. The gear clutch cylinder 501 drives the gear clutch slider 510 to move on the first placing seat 3 or the second placing seat 36, so that the driving gear set 503 meshes with or disengages from the tensioning gear 504. The alignment driving device 508 is connected to the alignment pulley 509 to drive the alignment pulley 509 to rotate. An alignment belt 507 is sleeved between the alignment pulley 509 and the feeding lower plate 506.

[0032] Furthermore, the present invention provides specific embodiments of the material taking and placing device one 2 and the material taking and placing device two 38, such as Figure 4As shown in the figure, they all include a driving seat 201, a rotating seat 202, a rotating device 203 respectively and fixedly arranged on the pick-and-place slide rail 33 at the detection position, and a pick-and-place lifting cylinder 209 slidably arranged on the pick-and-place slide rail 33 at the detection position. A driving shaft 205 is rotatably arranged on the driving seat 201, a driving wheel 206 is arranged on the driving shaft 205, a rotating shaft 204 is rotatably arranged on the rotating seat 202, a rotating wheel 207 is arranged on the rotating shaft 204, a belt 208 is sleeved between the driving wheel 206 and the rotating wheel 207, the belt 208 is connected with the pick-and-place lifting cylinder 209, driving the pick-and-place lifting cylinder 209 to move on the pick-and-place slide rail 33 at the detection position. The rotating device 203 is connected with the driving shaft 205 by a belt, driving the driving shaft 205 to rotate. A pick-and-place frame 210 is arranged on the pick-and-place lifting cylinder 209, and the pick-and-place lifting cylinder 209 drives the pick-and-place frame 210 to rise or fall. A pick-and-place cylinder 211, a pick-and-place fixed clamp 213 are respectively and fixedly arranged on the pick-and-place frame 210, and a pick-and-place sliding clamp 212 is slidably arranged. The pick-and-place cylinder 211 is connected with the pick-and-place sliding clamp 212, driving the pick-and-place sliding clamp 212 to move on the pick-and-place frame 210 to clamp or release the wafer. Specifically, when working, taking the wafer from the wafer cassette and placing it on the feeding device 1 (feeding device 2): the pick-and-place lifting cylinder 209 drives the pick-and-place frame 210 to descend -> the rotating device 203 drives the driving wheel 206 to rotate, driving the belt to move, moving the pick-and-place lifting cylinder 209 near the wafer cassette, making the wafer located between the pick-and-place sliding clamp 212 and the pick-and-place fixed clamp 213 -> the pick-and-place cylinder 211 drives the pick-and-place sliding clamp 212 to clamp the wafer -> the rotating device 203 drives the driving wheel 206 to rotate, driving the belt to move, moving the pick-and-place lifting cylinder 209 in front of the placing device 1 (placing device 2) -> the pick-and-place lifting cylinder 209 drives the pick-and-place frame 210 to rise -> the rotating device 203 drives the driving wheel 206 to rotate, driving the belt to move, moving the pick-and-place lifting cylinder 209 behind the placing device 1 (placing device 2). Because the pick-and-place frame 210 is raised, the wafer clamped by the pick-and-place sliding clamp 212 and the pick-and-place fixed clamp 213 of the pick-and-place frame 210 is also moved behind the placing device 1 (placing device 2) -> the pick-and-place lifting cylinder 209 drives the pick-and-place frame 210 to descend -> the rotating device 203 drives the driving wheel 206 to rotate, driving the belt to move, putting the wafer clamped on the pick-and-place frame 210 into the placing device 1 (placing device 2); taking the wafer from the feeding device 1 (feeding device 2) and placing it into the wafer cassette: the specific process is the reverse process of the process of taking the wafer from the wafer cassette and placing it on the feeding device 1 (feeding device 2).

[0033] Further, it further includes a central control unit, and the central control unit includes:

[0034] A positioning picture extraction module, which is used to extract the wafer positioning pictures taken by the direction detection camera 1 9 and the direction detection camera 2 15;

[0035] A positioning and recognition module, which is used to analyze whether the wafer notch direction in the wafer positioning picture meets the requirements; the positioning and recognition module can use a processor capable of running graphic recognition software;

[0036] A defect picture extraction module, which is used to extract the wafer pictures taken by the defect detection camera 21 and the backside detection camera 29;

[0037] A defect recognition module, which is used to detect wafer defects on the wafer pictures; the defect recognition module can use a processor capable of running graphic recognition software;

[0038] A defect printing module, which is used to control the dot peen machine 26 to print the wafer defects detected by the defect recognition module onto the wafer;

[0039] A work scheduling module, which is used to control the operation of the detection position moving cylinder 1, the detection position moving cylinder 2, the defect detection cylinder 18, the dot peen cylinder 27, the backside detection cylinder 32, the rotating device 203, the pick-and-place lifting cylinder 209, the pick-and-place cylinder 211, the gear clutch cylinder 501, the gear set driving device 502, and the orientation adjustment driving device 508.

[0040] The working process of the present invention is described in conjunction with Figure 6 as follows:

[0041] The detection displacement cylinder 1 moves the feeding device 1 to position A -> The rotating device of the picking and placing device 1 drives the drive shaft to drive the driving wheel to move the belt and drive the feeding slider to move, so that the wafer on the wafer cassette is between the picking and placing fixed clamp and the picking and placing sliding clamp -> The picking and placing cylinder drives the picking and placing sliding clamp to move to clamp the wafer -> The rotating device of the picking and placing device 1 drives the drive shaft to drive the driving wheel to move the belt and drive the feeding slider to move, so that the picking and placing device 1 clamping the wafer moves onto the feeding device 1 (including: the picking and placing lifting cylinder drives the picking and placing rack to rise (can cross the feeding device 1) and fall (lower the wafer height to the wafer position of the feeding device 1)) -> The picking and placing cylinder drives the picking and placing sliding clamp to move to place the wafer onto the feeding device 1 -> The gear clutch cylinder of the feeding device 1 drives the gear clutch slider to move, so that the driving gear set and the tensioning gear are engaged -> The gear set driving device drives the driving gear set to rotate, drives the tensioning gear to rotate, and the pitch screw connected to the tensioning gear rotates. Under the action of the positive and reverse threads of the pitch screw, the upper feeding plate and the lower feeding plate clamp the wafer -> The gear clutch cylinder drives the gear clutch slider to move to separate the driving gear set and the tensioning gear -> The direction detection camera 1 takes a picture of the wafer -> The positioning picture extraction module extracts the wafer photo, and the positioning recognition module judges the wafer notch direction of the wafer positioning picture. If it does not meet the requirements -> The orientation driving device drives the orientation pulley to rotate, drives the orientation belt to rotate, and makes the lower feeding plate rotate to perform orientation positioning on the wafer direction -> The detection displacement cylinder 1 moves the feeding device 1 to position B; at the same time, the picking and placing device 2 completes placing the wafer onto the feeding device 2, and the feeding device 2 completes clamping and rotation positioning of the wafer -> The defect detection cylinder moves the defect detection camera to position B; the back detection cylinder moves the back detection camera to position B -> The defect detection camera takes a picture of the front of the wafer; the back detection camera takes a picture of the back of the wafer -> The defect picture extraction module extracts the front picture and the back picture of the wafer -> The defect recognition module recognizes the defects in the front picture and the back picture of the wafer -> The detection displacement cylinder 1 moves the feeding device 1 to position C; at the same time, the detection displacement cylinder 2 moves the feeding device 2 to position B'; the defect detection cylinder moves the defect detection camera to position B'; the back detection cylinder moves the back detection camera to position B' -> The dotting cylinder drives the dotting machine to move to position C, and the defect printing module controls the dotting machine to print the wafer defects found by the defect recognition module on the wafer; at the same time, the defect detection camera and the back detection camera take pictures of the front and back of the wafer on the feeding device 2 and recognize the defects in the front and back pictures of the wafer -> The detection displacement cylinder 1 moves the feeding device 1 to position A; at the same time, the detection displacement cylinder 2 moves the feeding device 2 to position C';The dotting cylinder drives the dotting machine to move to position C' -> The gear clutch cylinder of the feeding device 1 drives the gear clutch slider to move, so that the driving gear set and the tensioning gear mesh -> The gear set driving device drives the driving gear set to rotate, drives the tensioning gear to rotate, and the distance adjustment screw rod connected to the tensioning gear rotates. Under the action of the right-handed thread and left-handed thread of the distance adjustment screw rod, the upper feeding plate and the lower feeding plate loosen the wafer -> The rotating device of the picking and feeding device 1 drives the driving shaft to drive the driving wheel to move the belt to drive the feeding slider to move, so that the wafer of the feeding device 1 is between the picking and placing fixed clamp and the picking and placing sliding clamp (including: the picking and placing lifting cylinder drives the picking and placing rack to descend) -> The picking and placing cylinder drives the picking and placing sliding clamp to move to clamp the wafer -> The rotating device of the picking and feeding device 1 drives the driving shaft to drive the driving wheel to move the belt to drive the feeding slider to move, so that the picking and feeding device 1 clamping the wafer moves to above the wafer cassette (including: the picking and placing lifting cylinder drives the picking and placing rack to ascend) -> The picking and placing cylinder drives the picking and placing sliding clamp to move to place the wafer into the wafer cassette (including: the picking and placing lifting cylinder drives the picking and placing rack to descend). At the same time, the dotting machine performs defect dotting marks on the wafer on the feeding device 2 at position C'. This cycle is repeated to complete the detection and defect dotting marks of the wafer.;

[0042] The foregoing description of the specific exemplary embodiments of the present invention is for purposes of illustration and exemplification. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many changes and variations are possible in light of the above teaching. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the invention and its practical applications, so that those skilled in the art can implement and utilize the various different exemplary embodiments of the present invention, as well as various different selections and changes. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A wafer inspection device, characterized in that: It includes a base (1), a first detection-position slide rail (34), a pick-and-place slide rail at the detection position (33), a direction detection frame (6), and a dotting frame (23) which are respectively arranged on the base (1); a first detection-position moving cylinder (4) is fixedly arranged on the first detection-position slide rail (34); a first placing seat (3) is slidably arranged between the first detection-position slide rail (34) and the pick-and-place slide rail at the detection position (33); the first detection-position moving cylinder (4) is connected to the first placing seat (3) to drive the first placing seat (3) to move between the first detection-position slide rail (34) and the pick-and-place slide rail at the detection position (33); a first feeding device (5) is arranged on the first placing seat (3) for placing a wafer and rotating and positioning the wafer; a first pick-and-place device (2) is arranged on one side of the pick-and-place slide rail at the detection position (33) for picking the wafer from a wafer cassette and placing the wafer into the first feeding device (5) or picking the wafer from the first feeding device (5) and placing the wafer into the wafer cassette. A direction detection support one (7) is slidably arranged on one side of the direction detection frame (6); a direction detection light source one (10) is fixedly arranged on the direction detection support one (7), and a direction detection camera support one (8) is slidably arranged; a direction detection camera one (9) is arranged on the direction detection camera support one (8); a defect detection slide rail (17) is arranged on the other side of the direction detection frame (6); a defect detection support (19) is slidably arranged on the defect detection slide rail (17); a defect detection light source (22) is fixedly arranged on the defect detection support (19), and a defect detection camera support (20) is slidably arranged; a defect detection camera (21) is arranged on the defect detection camera support (20); a dotting slide rail (24) is arranged on the dotting frame (23); a dotting seat (25) is slidably arranged on the dotting slide rail (24); a dotting machine (26) is arranged on the dotting seat (25); further included is a detection position slide rail two (35) arranged on the base (1); a detection position moving air cylinder two (37) is fixedly arranged on the detection position slide rail two (35); a placing seat two (36) slidably arranged between the detection position slide rail two (35) and the detection position pick - and - place slide rail (33); the detection position moving air cylinder two (37) is connected to the placing seat two (36) to drive the placing seat two (36) to move between the detection position slide rail two (35) and the detection position pick - and - place slide rail (33); a feeding device two (11) is arranged on the placing seat two (36) for placing a wafer and rotating and positioning the wafer; a pick - and - place device two (38) is arranged on the other side of the detection position pick - and - place slide rail (33) for picking a wafer from a wafer cassette and placing the wafer into the feeding device two (11) or picking a wafer from the feeding device two (11) and placing the wafer into the wafer cassette; a direction detection support two (13) is arranged on the direction detection frame (6); a direction detection light source two (12) is fixedly arranged on the direction detection support two (13), and a direction detection camera support two (14) is slidably arranged; a direction detection camera two (15) is arranged on the direction detection camera support two (14); a defect detection air cylinder (18) is arranged on the direction detection frame (6); the defect detection air cylinder (18) is connected to the defect detection support (19) to drive the defect detection support (19) to move on the defect detection slide rail (17); a dotting air cylinder (27) is arranged on the dotting frame (23); the dotting air cylinder (27) is connected to the dotting seat (25) to drive the dotting seat (25) to move on the dotting slide rail (24);The feeding device 1 (5) and the feeding device 2 (11) both include a feeding upper plate (506), a feeding lower plate (505) rotatably arranged on the placing seat 1 (3) or the placing seat 2 (36), a gear clutch slider (510) slidably arranged on the placing seat 1 (3) or the placing seat 2 (36), and a gear clutch cylinder (501), an alignment driving device (508) and an alignment pulley (509) respectively fixedly arranged on the placing seat 1 (3) or the placing seat 2 (36); an adjusting distance screw is arranged between the feeding upper plate (506) and the feeding lower plate (505); a right-handed thread and a left-handed thread are respectively arranged on the adjusting distance screw; the feeding upper plate (506) and the feeding lower plate (505) are respectively connected to the right-handed thread and the left-handed thread of the adjusting distance screw, and by rotating the adjusting distance screw, the feeding upper plate (506) and the feeding lower plate (505) are close to or separated from each other; a tensioning gear (504) is arranged on the adjusting distance screw; a driving gear set (503) and a gear set driving device (502) are arranged on the gear clutch slider (510), and the gear set driving device (502) drives the driving gear set (503) to rotate; the gear clutch cylinder (501) is connected to the gear clutch slider (510) and drives the gear clutch slider (510) to move on the placing seat 1 (3) or the placing seat 2 (36) so that the driving gear set (503) meshes with or disengages from the tensioning gear (504); the alignment driving device (508) is connected to the alignment pulley (509) and drives the alignment pulley (509) to rotate; an alignment belt (507) is sleeved between the alignment pulley (509) and the feeding lower plate (505).; 2. The wafer inspection device according to claim 1, characterized in that: A back detection light source (28) is arranged on the base (1), and a back detection slide rail (30) is arranged on the back of the base (1); a back detection camera frame (31) is slidably arranged on the back detection slide rail (30); a back detection camera (29) is arranged on the back detection camera frame (31).

3. The wafer inspection device according to claim 2, characterized in that: A back detection cylinder (32) is arranged on the back of the base (1); the back detection cylinder (32) is connected to the back detection camera frame (31) to drive the back detection camera frame (31) to move on the back detection slide rail (30).

4. A wafer inspection device according to claim 3, characterized in that: The first pick-and-place device (2) and the second pick-and-place device (38) both include a driving seat (201), a rotating seat (202), a rotating device (203) which are respectively fixedly arranged on the pick-and-place slide rail at the detection position (33), and a pick-and-place lifting cylinder (209) which is slidably arranged on the pick-and-place slide rail at the detection position (33); a driving shaft (205) is rotatably arranged on the driving seat (201); a driving wheel (206) is arranged on the driving shaft (205); a rotating shaft (204) is rotatably arranged on the rotating seat (202); a rotating wheel (207) is arranged on the rotating shaft (204); a belt (208) is sleeved between the driving wheel (206) and the rotating wheel (207); the belt (208) is connected to the pick-and-place lifting cylinder (209) to drive the pick-and-place lifting cylinder (209) to move on the pick-and-place slide rail at the detection position (33); the rotating device (203) is connected to the driving shaft (205) by a belt to drive the driving shaft (205) to rotate; a pick-and-place frame (210) is arranged on the pick-and-place lifting cylinder (209), and the pick-and-place lifting cylinder (209) drives the pick-and-place frame (210) to rise or fall; a pick-and-place cylinder (211), a pick-and-place fixed clamp (213) are respectively fixedly arranged on the pick-and-place frame (210), and a pick-and-place sliding clamp (212) is slidably arranged on the pick-and-place frame (210); the pick-and-place cylinder (211) is connected to the pick-and-place sliding clamp (212) to drive the pick-and-place sliding clamp (212) to move on the pick-and-place frame (210) to clamp or release the wafer.

5. The wafer inspection device according to claim 4, wherein: It further includes a central control unit, and the central control unit includes: a positioning picture extraction module for extracting the wafer positioning pictures taken by the first direction detection camera (9) and the second direction detection camera (15); a positioning recognition module for analyzing whether the wafer scratch direction in the wafer positioning picture meets the requirements; a defect picture extraction module for extracting the wafer pictures taken by the defect detection camera (21) and the backside detection camera (29); a defect recognition module for detecting the wafer defects on the wafer pictures; a defect printing module for controlling the dotting machine (26) to print the wafer defects detected by the defect recognition module onto the wafer; a work scheduling module for controlling the operation of the first detection position moving cylinder (4), the second detection position moving cylinder (37), the defect detection cylinder (18), the dotting cylinder (27), the backside detection cylinder (32), the rotating device (203), the pick-and-place lifting cylinder (209), the pick-and-place cylinder (211), the gear clutch cylinder (501), the gear set driving device (502), and the alignment driving device (508).

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