Electromagnetic compatibility rectification method applied to image processor

Abstract

The application provides an electromagnetic compatibility rectification method applied to an image processor, which comprises an electromagnetic compatibility scheme for a signal line of the image processor, electromagnetic compatibility rectification for an in-machine signal connecting line, an electromagnetic compatibility scheme for an aviation seat connecting the image processor and a handle, an electromagnetic compatibility scheme for a handle line, an electromagnetic compatibility scheme for a front plastic panel of the image processor and a rear plastic panel of the image processor, and an electromagnetic compatibility scheme for an exposed metal interface of a mainboard of the image processor. The electromagnetic compatibility rectification scheme realizes radiation suppression in radiation emission testing, improves image quality in a conducted disturbance immunity test and an electrical fast transient burst immunity test of a radio frequency field induction, reduces ripples and screen flicker phenomena, effectively improves the compliance rate of the image processor in the electromagnetic compatibility test, and makes the image processor pass the electromagnetic compatibility test faster and better.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of medical devices, and particularly relates to an electromagnetic compatibility rectification method applied to an image processor. BACKGROUND

[0002] In recent years, electronic mirror endoscope image processors are widely applied to various endoscopic treatment schemes, and the application of the electronic mirror endoscope image processor guarantees the image quality collected by the endoscope and facilitates observation by doctors.

[0003] The electronic endoscope generally comprises a camera and an electronic mirror endoscope image processor connected with the camera through a signal line. After the image signal is collected from the camera, the image signal sequentially passes through a handle line, a metal aviation socket and an in-machine signal line, and enters the mainboard of the image processor.

[0004] During the detection of the electronic mirror endoscope image processor, electromagnetic compatibility testing is required. However, there are many problems in the electromagnetic compatibility testing, such as excessive radiation, signal transmission quality, signal anti-interference and the like. The common method is to paste copper foil inside the image processor or add a magnetic ring on the signal transmission cable. These methods not only complicate the production steps, but also increase the production cost. SUMMARY

[0005] Technical problem: In order to solve the above technical problems, the present application is aimed at the technical problems in the background art, and realizes the radiation suppression in the radiation emission test, the image quality improvement in the conductive disturbance immunity test of the radio frequency field induction and the electric fast transient impulse group immunity test, reduces the wave and screen phenomenon, and effectively improves the pass rate of the image processor in the electromagnetic compatibility test, so that the electromagnetic compatibility test can be passed faster and better.

[0006] Technical scheme: The electromagnetic compatibility rectification method applied to the image processor is that the in-machine signal connection line connecting the mainboard of the image processor and the handle line is as follows: the in-machine signal connection line comprises a set of signal lines covered by a sleeve, and each signal line in the set of signal lines comprises a wire core of a single signal line and an outer shielding braid covering the wire core.

[0007] As a specific embodiment of the present application, the in-machine signal connection line connecting the mainboard of the image processor and the handle line is as follows: the in-machine signal connection line comprises a set of signal lines covered by a sleeve, and each signal line in the set of signal lines comprises a wire core of a single signal line and an outer shielding braid covering the wire core; the sleeve covering comprises tightly fixing a heat shrink sleeve outside the whole set of signal lines first, then sleeving a shielding braid outside the heat shrink sleeve, and then tightly fixing a heat shrink sleeve outside the shielding braid.

[0008] As a specific embodiment of the present application, the fixing method is thermal shrinkage fixing, and the group of signal lines includes but is not limited to a clock signal line, an SDA data signal line, a VDD voltage signal line, and an LED signal line.

[0009] As a specific embodiment of the present application, the handle wire includes a group of signal lines covered by a sleeve, and each signal line in the group of signal lines includes a single signal line core and an outer shielding braid; in particular, the signal line is individually grounded or analog grounded.

[0010] The material of the shielding braid is tin-plated copper, and the tin-plated copper wires are combined into a cylindrical net in a braided form.

[0011] The image processor is an electronic endoscope image processor.

[0012] The inner side of the front plastic panel of the image processor and the inner side of the rear plastic panel of the image processor are respectively sprayed with conductive paint, the face of the front plastic panel of the image processor is not sprayed with conductive paint around the jack, and the front plastic panel of the image processor, the rear plastic panel of the image processor, and the metal upper and lower cover plates and the metal bottom shell form a closed whole.

[0013] The front panel aviation seat grounding connection scheme of the image processor is that the front panel aviation seat metal pad and the front panel aviation seat circuit board grounding pin are connected by a yellow-green grounding wire of the aviation seat, and the shielding braid of the group of signal connection lines and the front panel aviation seat circuit board grounding pin are connected by a yellow-green grounding wire of the connection line.

[0014] The signal connection line connection scheme is that the group of signal lines are respectively installed on the main board of the image processor, the shielding braid of the signal connection line and the cold-pressed terminal are respectively connected by the yellow-green grounding wire of the connection line through welding, and the cold-pressed terminal is locked to the metal bottom plate of the image processor by an internal hexagonal screw.

[0015] The exposed metal interface connection scheme of the main board of the image processor is that the exposed metal interface of the main board of the image processor is connected with the inner side of the front plastic panel or the inner side of the rear plastic panel of the image processor which is sprayed with conductive paint by double-sided conductive adhesive, so that the exposed metal interface of the main board of the image processor is grounded.

[0016] The main board HDMI seat circuit signal input and / or output of the image processor is provided with one or more filter capacitors, preferably with a capacitance value of 10-25 PF, and preferably one or more filter capacitors are installed in the middle position of the connection line of the TMDS+ clock signal line and / or the TMDS- clock signal line, preferably with a capacitance value of 10-25 PF.

[0017] As another specific embodiment of the present application, the electromagnetic compatibility rectification method applied to the image processor comprises:

[0018] (1) The electromagnetic compatibility scheme for the image processor signal line: the image processor signal line is covered by a total outer shielding braid of a group of signal lines and a GND signal ground line, and each signal line in the group of signal lines comprises an outer shielding braid and a core of a single signal line, and the total outer shielding braid and the outer shielding braid of the single signal line are respectively connected to different grounding pins of the signal adapter plate independently;

[0019] (2) The electromagnetic compatibility scheme for the in-machine signal connection line: the in-machine signal connection line comprises a group of signal lines covered by a sleeve, and each signal line in the group of signal lines comprises an outer shielding braid and a core of a single signal line;

[0020] (3) The electromagnetic compatibility scheme for the aviation seat connecting the image processor and the handle: the yellow-green ground line is used to connect the front panel aviation seat metal pad and the front panel aviation seat circuit board grounding pin, and the yellow-green ground line is used to connect the shielding braid of the signal connection line and the front panel aviation seat circuit board grounding pin;

[0021] (4) The electromagnetic compatibility scheme for the handle line: the handle line comprises a group of signal lines covered by a sleeve, and each signal line in the group of signal lines comprises an outer shielding braid and a core of a single signal line;

[0022] (5) The electromagnetic compatibility scheme for the front plastic panel of the image processor and the rear plastic panel of the image processor: the inner side of the front plastic panel of the image processor and the inner side of the rear plastic panel of the image processor are respectively sprayed with conductive paint, and the face of the jack on the inner side of the front plastic panel of the image processor is not sprayed with conductive paint, so that the front plastic panel of the image processor, the rear plastic panel of the image processor, and the metal upper and lower cover plates and the metal bottom shell form a closed whole;

[0023] (6) The electromagnetic compatibility scheme for the exposed metal interface of the image processor mainboard: the exposed metal interface of the image processor mainboard is connected to the inner side of the front plastic panel sprayed with conductive paint or the inner side of the rear plastic panel of the image processor by using double-sided conductive tape, so that the exposed metal interface of the image processor mainboard is grounded.

[0024] In step (1), the image processor signal line includes a signal line outer shielding woven covering CLK signal line 5, SDA signal line 5, VDD signal line 5 and GND signal ground line 2, the CLK signal line 5, the SDA signal line 5, the VDD signal line 5 respectively include outer shielding woven and wire core; the wire core of the CLK signal line 5 is connected to the CLK pin of the signal adapter plate 2, the outer shielding woven of the CLK signal line 5 is connected to the GND1 pin of the signal adapter plate 2 (126); the wire core of the SDA signal line 5 is connected to the SDA pin of the signal adapter plate 2, the outer shielding woven of the SDA signal line 5 is connected to the GND2 pin of the signal adapter plate 2; the wire core of the VDD signal line 5 is connected to the VDD pin of the signal adapter plate 2, the outer shielding woven of the VDD signal line 5 is connected to the GND3 pin of the signal adapter plate 2; the GND signal ground line 2 is connected to the GND pin of the signal adapter plate 2, and the signal line outer shielding woven is connected to the AGND pin of the signal adapter plate 2.

[0025] In step (2) and / or step (4), the sleeve is a heat-shrinkable sleeve, or includes an inner layer heat-shrinkable sleeve, a shielding woven mesh tube and an outer layer heat-shrinkable sleeve arranged in sequence from inside to outside.

[0026] In step (2), the shielding woven mesh tube is connected to the image processor metal bottom plate through the connecting line yellow-green ground wire.

[0027] In step (2), the in-machine signal connection line includes a group of signal lines CLK clock signal line 2, SDA data signal line 2, VDD voltage signal line 2 and LED signal line 2 covered by a sleeve.

[0028] In step (5), the image processor front plastic panel, the image processor rear plastic panel, the recessed part around the contact with the metal upper and lower cover plate and the screw hole are respectively sprayed with conductive paint.

[0029] In step (7), the high-frequency signal clutter filtering processing of the image processor HDMI seat circuit is further included: a filter capacitor is independently arranged on the TMDS+ clock signal line and the TMDS- clock signal line of the image processor HDMI seat circuit, for high-frequency signal clutter filtering processing.

[0030] Preferably, the capacitance of the capacitor is 10-25 PF.

[0031] Preferably, an exposed metal ground connection is arranged on the mainboard of the image processor, and the metal aviation seat front panel and the in-machine signal line are arranged as ground connections.

[0032] Preferably, the image processor signal line total outer layer shielding braid, single signal line outer layer shielding braid, shielding braid of signal connecting line are respectively independently plated tin copper structure, which is formed into a reticular structure by weaving plated tin copper wires.

[0033] Advantages: Compared with the prior art, the device has the following advantages and advantages:

[0034] 1. Reduce the radiation value in the radiation disturbance test. Since the rectification scheme filters the signal at the HDMI signal source on the mainboard, and the components are well grounded, it can effectively reduce the radiation value of the image processor.

[0035] 2. Improve the image quality when testing the conducted disturbance immunity of the radio frequency field induction. Since the rectification scheme is well grounded as a whole and each component, the image quality is significantly improved when testing the conducted disturbance immunity of the radio frequency field induction.

[0036] 3. Improve the image quality when testing the conducted disturbance immunity of the radio frequency field induction. The rectification scheme shields the signal line during signal transmission, effectively reducing external interference and mutual interference, and improving the image quality when testing the conducted disturbance immunity of the radio frequency field induction.

[0037] 4. Improve the image quality of the image processor and reduce the phenomenon of screen tearing and water marks. After using the rectification scheme, the signal transmission quality is improved, effectively reducing the interference on the image signal, and improving the image quality. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 Signal connection line schematic diagram.

[0039] Figure 2 Signal connection line internal structure schematic diagram.

[0040] Figure 3 Front and rear plastic panel conductive paint spraying schematic diagram.

[0041] Figure 4 Radiation leakage schematic diagram before front and rear plastic panel conductive paint spraying.

[0042] Figure 5 Radiation leakage schematic diagram after front and rear plastic panel conductive paint spraying.

[0043] Figure 6 Front panel aviation seat grounding schematic diagram.

[0044] Figure 7 Signal connection line grounding schematic diagram.

[0045] Figure 8 Image processor grounding schematic diagram.

[0046] Figure 9 Exposed metal interface grounding diagram of image processor back panel.

[0047] Figure 10 HDMI circuit modification diagram.

[0048] Figure 11 Internal structure diagram of image processor signal line before modification.

[0049] Figure 12 Internal structure diagram of image processor signal line after modification.

[0050] In the figure: 11-CLK clock signal line 1, 110-IPEX signal line core, 111-IPEX signal line outer shield, 12-SDA data signal line 1, 13-VDD voltage signal line 1, 14-LED signal line 1, 15-heat shrink sleeve, 21-CLK clock signal line 2, 22-SDA data signal line 2, 23-VDD voltage signal line 2, 24-LED signal line 2, 25-inner heat shrink sleeve, 26-shielded braided tube, 27-outer heat shrink sleeve, 31-image processor front plastic panel, 310-surface-mounted jack, 32-image processor rear plastic panel, 61-yellow-green grounding wire of aviation seat, 62-metal gasket of front panel aviation seat, 63-grounding pin of front panel aviation seat circuit board, 64-shielded braid of signal connection wire, 65-yellow-green grounding wire of connection wire, 71-CLK clock signal line 3, 72-SDA data signal line 3, 73-VDD voltage signal line 3, 74-LED signal line 3, 75-signal connection wire, 76-yellow-green grounding wire of connection wire, 77-cold-pressed terminal, 78-internal hexagonal screw, 81-outer shield of handle wire, 82-metal aviation plug female seat of handle wire, 83-metal aviation plug male seat of in-machine connection wire, 84-outer shield of in-machine connection wire, 85-metal shell of image processor, 91-image processor rear plastic panel sprayed with conductive paint, 92-double-sided conductive adhesive tape, 93-CVBS output interface, 94-TF card insertion interface, 95-DVI output interface, 96-HDMI output interface, 97-USB data interface, 101-HDMI seat circuit of image processor mainboard, 102-TMDS+ clock signal line, 103-TMDS- clock signal line, 104-filter capacitor 1, 105-filter capacitor 2, 131-CLK signal line 4, 132-SDA signal line 4, 133-VDD signal line 4, 134-GND signal ground wire 1, 135-outer shield braid of signal line, 136-signal adapter plate 1, 121-CLK signal line 5, 122-SDA signal line 5, 123-VDD signal line 5, 124-GND signal ground wire 2, 125-outer shield braid of signal line, 126-signal adapter plate 2. DETAILED DESCRIPTION

[0051] The specific embodiments of the present application are described in further detail below in conjunction with the examples. The following examples are used to illustrate the present application but are not used to limit the scope of the present application.

[0052] The electromagnetic compatibility rectification method applied to the image processor is to connect the mainboard and the handle wire by using a special internal signal scheme to avoid signal interference, to add shielding braid outside the connecting wire to avoid external interference, to spray conductive paint inside the plastic front and rear panels to isolate radiation overflow, to make each component fully grounded, to ground the front panel aviation seat and the signal wire, to connect the exposed metal interfaces of the mainboard and the conductive paint of the rear panel by using conductive tape, that is, to ground the exposed metal interfaces of the mainboard, to add capacitors with fixed capacitance at the signal output of the HDMI signal driving circuit of the mainboard, and to add shielding braid to the three signal wires of the handle wire, and to separate the shielding braid from each other. Through the above scheme, after the image signal is collected from the camera, it is transmitted to the mainboard through the handle wire, the metal aviation socket and the internal signal wire. In the signal transmission process, all transmission parts are wrapped by external shielding which is mutually conductive and grounded, which prevents external interference and suppresses external radiation.

[0053] The special connection scheme uses four separate IPEX signal wires to make a special signal wire, and the four separate IPEX signal wires are connected to the CLK, VDD and SDA three signal wires of the mainboard and the signal wire and the LED connecting wire to avoid mutual interference between signals.

[0054] The shielding braid added outside the special connecting wire is made of tinned copper, and the tinned copper wires are combined into a cylindrical net in a woven form to cover the outside of the connecting wire to avoid external interference.

[0055] The conductive paint sprayed inside the plastic front and rear panels connects the plastic parts and the metal parts through the conductive paint, realizes a closed loop similar to a metal shell, enhances the isolation capability, and makes each component fully grounded.

[0056] The front panel aviation seat and the signal wire are grounded to make the outer shielding of the signal wire and the handle wire fully grounded to form a closed whole to better protect the transmission of the signal.

[0057] The exposed metal interfaces of the mainboard and the conductive paint of the rear panel are connected by using conductive tape to make the ground of the exposed metal interfaces of the mainboard conductive with the analog ground of the host computer to avoid external interference of the exposed metal interfaces and better protect the transmission of the signal.

[0058] The resistance capacitor added at the signal output of the mainboard HDMI signal driving circuit is a capacitor with a specific capacitance value added to the transmission path of the mainboard HDMI signal line to filter unnecessary signals and reduce radiation value.

[0059] The three signal lines of the handle line are respectively added with shielding braid, and are separately connected to analog ground.

[0060] The application will be further described below with reference to the drawings.

[0061] Embodiment 1

[0062] The electromagnetic compatibility rectification scheme of the connection between the mainboard and the handle line of the image processor is specifically described with reference to the drawings.

[0063] As shown in Figure 1 , it is a kind of application in image processor's connection mainboard and handle line's machine internal signal connection scheme, this scheme uses four IPEX signal lines to make, 11-CLK clock signal line 1 is used to transmit the CLK clock signal of handle line and mainboard, 12-SDA data signal line 1 is used to transmit the SDA data signal of handle line and mainboard, 13-VDD voltage signal line 1 is used to transmit the VDD voltage signal of handle line and mainboard, 14-LED signal line 1 is used to transmit the LED signal of handle line and mainboard, wherein, 11-CLK clock signal line 1 structure can be divided into 110-IPEX signal line core and 111-IPEX signal line outer shielding, 12-SDA data signal line 1, 13-VDD voltage signal line 1 and 14-LED signal line 1 structure are consistent with 11-CLK clock signal line 1, this structure separates the 110-IPEX signal line core and the 111-IPEX signal line outer shielding of transmission signal, and does not conduct to each other, protects signal transmission from external interference, prevents signal radiation overflow at the same time, at the same time, 4 signal lines use 15-heat shrink sleeve to heat shrink fixation, this structure can guarantee that four signal lines do not interfere with each other, all have separate signal transmission channel and have separate coaxial shielding.

[0064] As shown in Figure 2 , it is another kind of application in image processor's connection mainboard and handle line's machine internal signal connection scheme, this scheme and Figure 1Similar to the previous method, the main difference lies in the additional shielding structure on the four IPEX signal lines. Specifically, there are four IPEX coaxial lines inside the connector: 21-CLK clock signal line 2, 22-SDA data signal line 2, 23-VDD voltage signal line 2, and 24-LED signal line 2. These four IPEX signal lines are tightly secured together using 25-inner heat-shrink tubing. Then, a 26-shielding braided mesh is placed over the 25-inner heat-shrink tubing. The 26-shielding braided mesh is made by braiding tinned copper wire into a cylindrical mesh and covering the connector. Finally, a 27-outer heat-shrink tubing is placed over the 26-shielding braided mesh for further securing, shrinking, and protection.

[0065] Actual testing revealed that the above modifications effectively improved image quality, reduced image fluctuations during testing, and stabilized image transmission in both conducted interference immunity tests and electrical fast transient / burst immunity tests induced by the RF field. Furthermore, they also improved the image quality of the image processor. Since separate coaxial shielded cables were used for the CLK, SDA, and VDD signal lines, mutual interference between signals was reduced, thus mitigating vertical stripes and power supply noise floor stripes in the image.

[0066] Example 2

[0067] The accompanying drawings provide a detailed explanation of the electromagnetic compatibility (EMC) rectification schemes for the front and rear plastic panels of the image processor.

[0068] like Figure 3 As shown, the front plastic panel of the 31-image processor and the rear plastic panel of the 32-image processor are shown. Conductive paint is sprayed onto the inside of the front plastic panel of the 31-image processor. Figure 3 In the shaded area, special attention should be paid to the fact that conductive paint should not be applied around the 310-faceplate connector to prevent the faceplate interface from becoming conductive with the image processor housing. If conductive paint is applied, the faceplate interface will become conductive with the image processor housing, causing sparks during the withstand voltage test and resulting in faceplate failure. Simultaneously, conductive paint should also be applied to the recessed areas and screw holes around the contact points between the 31-image processor's front plastic panel and the metal upper and lower covers. Conductive paint should also be applied to the 32-image processor's rear plastic panel. Figure 3 In the shaded areas, conductive paint is also sprayed around the recesses and screw holes where the plastic panel of the 32-image processor contacts the metal upper and lower covers. This makes the front plastic panel of the 31-image processor, the rear plastic panel of the 32-image processor, the metal upper and lower covers, and the metal bottom shell form a closed whole, which can fully shield the internal components and effectively reduce the leakage of radiation.

[0069] Before the conductive paint is applied to the front and rear plastic panels of the image processor, radiation leakage cannot be effectively prevented. The overall shielding effect of the front and rear plastic panels of the image processor before the conductive paint is applied is as follows: Figure 4 As shown, only the top and bottom metal covers provide radiation shielding. Radiation emitted from the internal radiation source is emitted to the outside of the image processor through the front and rear plastic panels. After the front and rear plastic panels of the image processor are coated with conductive paint, radiation leakage can be effectively suppressed. The overall shielding effect of the image processor is as follows: Figure 5 As shown, it can form a closed space, similar to a metal box, which can significantly reduce radiation leakage during radiation emission tests.

[0070] Example 3

[0071] The accompanying drawings provide a detailed explanation of the electromagnetic compatibility (EMC) rectification plan for the aircraft mount used to connect the image processor and the handle.

[0072] like Figure 6 As shown, one end of the 61-aircraft seat yellow-green grounding wire is soldered to the 62-front panel aircraft seat metal pad, and the other end of the 61-aircraft seat yellow-green grounding wire is soldered to the 63-front panel aircraft seat circuit board grounding pin. At the same time, one end of the 65-connecting wire yellow-green grounding wire is soldered to the 64-signal connecting wire shield braid, and the other end of the 65-connecting wire yellow-green grounding wire is soldered to the 63-front panel aircraft seat circuit board grounding pin.

[0073] like Figure 7 As shown, this is a further optimized electromagnetic compatibility (EMC) rectification scheme for the other end of the connection cable between the aircraft seat and the image processor (i.e., the internal signal connection cable): Install the 71-CLK clock signal line 3, 72-SDA data signal line 3, 73-VDD voltage signal line 3, and 74-LED signal line 3 onto the image processor motherboard respectively. At the same time, solder one end of the 76-connector yellow-green ground wire to the shield braid of the 75-signal connection line, and solder the other end of the 76-connector yellow-green ground wire to the 77-cold-pressed terminal. Finally, use the 78-Hex socket screw to lock the 77-cold-pressed terminal onto the metal base plate of the image processor.

[0074] Through the multi-faceted shielding and grounding described above, the image processor's shielding forms a closed loop during image signal transmission, such as... Figure 8As shown, the electronic mirror image signal is first transmitted through the handle line after collection is completed. During signal transmission, the 81-handle line outer shield surrounds the image signal. After passing through the handle line, the image signal is transmitted to the in-machine connection line through the 82-handle line metal aviation plug female seat and the 83-in-machine connection line metal aviation plug male seat. During signal transmission, the 84-in-machine connection line outer shield surrounds the image signal. Finally, the 84-in-machine connection line outer shield is connected to the 85-image processor metal shell in the above manner. During the entire image signal transmission process, all shields are tightly connected together to form a complete closure, effectively preventing external environmental interference on the signal and reducing internal radiation overflow, which can significantly reduce radiation overflow during radiation emission testing.

[0075] Embodiment 4

[0076] The electromagnetic compatibility rectification scheme for the exposed metal interface of the image processor mainboard is specifically described with reference to the accompanying drawings.

[0077] As shown in Figure 9 , the exposed metal interface of the image processor mainboard includes a 93-CVBS output interface, a 94-TF card insertion interface, a 95-DVI output interface, a 96-HDMI output interface, and a 97-USB data interface. The above-mentioned metal interfaces are exposed outside through the holes of the image processor rear plastic panel, and have the risk of transmission failure during electrostatic discharge testing. The 92-double-sided conductive adhesive tape is used to connect the 93-CVBS output interface, the 94-TF card insertion interface, the 95-DVI output interface, the 96-HDMI output interface, and the 97-USB data interface 5 metal interfaces with the 91-image processor rear plastic panel coated with conductive paint inside, so that the 5 metal interfaces are fully connected and better protect the signal transmission.

[0078] As shown in Figure 10 , there are two clock signal lines, a 102-TMDS+ clock signal line and a 103-TMDS- clock signal line, on the 101-image processor mainboard HDMI seat circuit. A 104-filter capacitor 1 with a capacitance of 15PF is welded to the ground at the connection line of the 102-TMDS+ clock signal line. A 105-filter capacitor 2 with a capacitance of 15PF is welded to the ground at the connection line of the 103-TMDS- clock signal line. Through the frequency characteristic curve of the capacitor, high-frequency signal noise of 180MHZ-270MHZ is filtered to the ground to prevent radiation from exceeding the standard.

[0079] After testing, the above rectification has obvious inhibitory effect on the radiation overflow of the image processor during the radiation disturbance test. Before rectification, the most serious radiation exceeding standard was at the 297 MHz frequency point, with an exceeding standard value of 12.67 dB. After rectification, the radiation margin at the 297 MHz frequency point of the image processor radiation disturbance test was 11.64 dB. The radiation values before and after rectification differed by 24.31 dB, and the rectification effect was quite obvious.

[0080] Embodiment 5

[0081] The electromagnetic compatibility rectification scheme for the signal line of the image processor is described in detail in combination with the drawings.

[0082] As shown in Figure 11 , it is a schematic diagram of the signal line of the image processor before rectification. There are 4 lines inside the signal line, which are 131-CLK signal line 4, 132-SDA signal line 4, 133-VDD signal line 4 and 134-GND signal ground line 1. The internal structures of 131-CLK signal line 4, 132-SDA signal line 4 and 133-VDD signal line 4 are all divided into outer shielding braid and wire core. The outer shielding is used to isolate the interference of external signals to the transmission of wire core and prevent the radiation overflow of the transmission of wire core. The 134-GND signal ground line has no outer shielding. Before rectification, the wire core of 131-CLK signal line is connected to the CLK pin of 136-signal adapter board 1, the wire core of 132-SDA signal line 4 is connected to the SDA pin of 136-signal adapter board 1, and the wire core of 133-VDD signal line 4 is connected to the VDD pin of 136-signal adapter board 1. At the same time, 131-CLK signal line 4, 132-SDA signal line 4 and 133-VDD signal line 4, as well as 134-GND signal ground line 1 and 135-signal line outer shielding braid are all connected to the GND signal ground pin of 136-signal adapter board 1. If this connection mode is adopted, when there is external signal interference, it will affect the signal transmission waveform inside the 3 signal lines, and further affect the image quality.

[0083] As shown in Figure 11As shown, the internal structure of the signal line of the rectified image processor, the signal line has 4 lines in total, which are 121-CLK signal line 5, 122-SDA signal line 5, 123-VDD signal line 5 and 124-GND signal ground line 2, wherein the internal structure of 121-CLK signal line 5, 122-SDA signal line 5 and 123-VDD signal line 5 is divided into outer shielding braid and wire core, and 124-GND signal ground line 2 has no outer shielding. After rectification, the wire core of 121-CLK signal line 5 is connected to the CLK pin of 126-signal adapter plate 2, the wire core of 122-SDA signal line is connected to the SDA pin of 126-signal adapter plate 2, the wire core of 123-VDD signal line 5 is connected to the VDD pin of 126-signal adapter plate 2, and at the same time, 124-GND signal ground line 2 is connected to the GND pin of 126-signal adapter plate 2, the outer shielding braid of 121-CLK signal line 5 is connected to the GND1 pin of 126-signal adapter plate 2, the outer shielding braid of 122-SDA signal line 5 is connected to the GND2 pin of 126-signal adapter plate 2, the outer shielding braid of 123-VDD signal line 5 is connected to the GND3 pin of 126-signal adapter plate 2, and the outer shielding braid of 125-signal line is connected to the AGND pin of 126-signal adapter plate 2. If the connection mode is adopted, when there is signal interference from the outside, the separate shielding braid can protect the signal transmission waveform of the three signal lines, and reduce the influence on the image quality.

[0084] Through tests, the above rectification can effectively improve the image quality, reduce the image water wave and screen phenomenon during the test, and stabilize the image transmission when the 4MHz multiple frequency of the electric fast transient impulse group immunity test is used. At the same time, the image quality of the image processor is also improved. Since the three signal lines of CLK, SDA and VDD use separate coaxial shielding lines, the mutual interference between the signals is reduced, and the image vertical stripe and power supply bottom noise stripe are also reduced.

[0085] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An electromagnetic compatibility rectification method applied to an image processor, characterized in that, The internal signal connection scheme for connecting the image processor motherboard and the controller cable is as follows: The internal signal connection cable includes a set of signal wires covered by a sheath. Each signal wire in this set of signal wires includes a single signal wire core and an outer layer of shielding braid that covers the wire core. Conductive paint is sprayed on the inner side of the front plastic panel and the inner side of the rear plastic panel of the image processor. The area around the faceplate socket on the inner side of the front plastic panel of the image processor is not sprayed with conductive paint, so that the front plastic panel, the rear plastic panel, the upper and lower metal covers, and the metal bottom shell of the image processor form a closed whole. The grounding scheme of the exposed metal interface of the motherboard of the image processor is as follows: double-sided conductive tape is used to connect the exposed metal interface of the motherboard of the image processor to the inner side of the front plastic panel or the inside of the rear plastic panel of the image processor that has been sprayed with conductive paint, so that the exposed metal interface of the motherboard of the image processor is grounded. The high-frequency signal noise filtering solution is as follows: Solder a filter capacitor to ground on the TMDS+ clock signal line of the HDMI circuit signal on the motherboard of the image processor, and solder a filter capacitor to ground on the TMDS- clock signal line of the HDMI circuit signal on the motherboard of the image processor. The image processor signal line consists of a group of signal lines and a GND signal ground line, all covered by the overall outer shield braid of the image processor signal line. Each signal line in the group includes a single signal line outer shield braid and a wire core. The overall outer shield braid of the image processor signal line and the single signal line outer shield braid are independently connected to different ground pins of the signal adapter board.

2. The method of claim 1, characterized by, The internal signal connection scheme for the image processor's motherboard and controller cable is as follows: The internal signal connection cable includes a set of signal wires covered by a sheath. Each signal wire in this set of signal wires includes a single signal wire core and an outer layer of shielding braid covering the wire core. The sheathing process involves first using heat shrink tubing to tightly fix the entire set of signal wires, then covering the heat shrink tubing with a layer of shielding braid, and then covering the shielding braid with another layer of heat shrink tubing for tight fixation.

3. The method of claim 2, wherein, The fixing method is heat shrink fixing, and the set of signal lines includes, but is not limited to, clock signal lines, SDA data signal lines, VDD voltage signal lines, and LED signal lines.

4. The method of claim 1, wherein, The handle cable includes a set of signal lines covered by a sheath, each of which consists of a single signal wire core and an outer braided shield.

5. The method of claim 4, wherein, The signal line should be grounded separately or connected to analog ground.

6. The method of claim 2, wherein, The material of the shielding braided mesh tube is tin-plated copper.

7. The method according to any one of claims 1-3, characterized in that, The image processor is an electronic endoscope image processor.

8. The method according to any one of claims 1-3, characterized in that, The connection scheme for grounding the front panel aircraft mount of the image processor is as follows: the aircraft mount yellow-green grounding wire is used to connect the front panel aircraft mount metal pad and the grounding pin of the front panel aircraft mount circuit board, and the signal connection wire yellow-green grounding wire is used to connect the shield braid of the signal connection wire and the grounding pin of the front panel aircraft mount circuit board.

9. The method according to any one of claims 1-3, characterized in that, The grounding scheme for the signal connection lines is as follows: the group of signal lines are installed on the motherboard of the image processor, and the yellow-green grounding wires of the connection lines are connected to the shielding braid and cold-pressed terminals of the signal connection lines by soldering. The cold-pressed terminals are then tightened to the metal base plate of the image processor with hex screws.

10. The method according to claim 1, characterized in that, The capacitance of the filter capacitor is 10-25pF.

11. An electromagnetic compatibility rectification method applied to an image processor, characterized in that: (1) Electromagnetic compatibility scheme for image processor signal lines: The image processor signal line consists of a group of signal lines and a GND signal ground line, which are covered by the overall outer shield braid of the image processor signal line. Each signal line in the group of signal lines includes a single signal line outer shield braid and a wire core. The overall outer shield braid of the image processor signal line and the single signal line outer shield braid are independently connected to different grounding pins of the signal adapter board. (2) Electromagnetic compatibility scheme for internal signal connection lines: The internal signal connection lines consist of a set of signal lines covered by a sheath, and each signal line in the set of signal lines consists of a single signal line outer shield braid and a wire core; (3) Electromagnetic compatibility scheme for the aircraft mount connecting the image processor and the handle: Use the yellow-green grounding wire of the aircraft mount to connect the metal pad of the front panel aircraft mount and the grounding pin of the front panel aircraft mount circuit board, and use the yellow-green grounding wire of the connecting wire to connect the shielding braid of the signal connecting wire and the grounding pin of the front panel aircraft mount circuit board; (4) Electromagnetic compatibility scheme for the handle cable: The handle cable consists of a set of signal lines covered by a sheath. Each signal line in the set of signal lines includes a single signal line outer shield braid and a wire core. (5) Electromagnetic compatibility scheme for the front plastic panel and the rear plastic panel of the image processor: conductive paint is sprayed on the inner side of the front plastic panel and the inner side of the rear plastic panel of the image processor respectively. The area around the surface-mount socket on the inner side of the front plastic panel of the image processor is not sprayed with conductive paint, so that the front plastic panel, the rear plastic panel of the image processor, the upper and lower metal covers and the metal bottom shell form a closed whole. (6) Electromagnetic compatibility solution for the exposed metal interface of the image processor motherboard: Use double-sided conductive tape to connect the exposed metal interface of the image processor motherboard to the inside of the front plastic panel or the inside of the rear plastic panel of the image processor that has been sprayed with conductive paint, so that the exposed metal interface of the image processor motherboard is grounded. (7) High-frequency signal noise filtering of the HDMI socket circuit of the image processor: filter capacitors are set independently on the TMDS+ clock signal line (102) and TMDS- clock signal line (103) of the HDMI socket circuit of the image processor to filter out high-frequency signal noise; the capacitance value is 10-25pF.

12. The electromagnetic compatibility rectification method for an image processor according to claim 11, characterized in that: In step (1), the image processor signal lines include CLK signal line 5 (121), SDA signal line 5 (122), VDD signal line 5 (123), and GND signal ground line 2 (124), all covered by an outer layer of shielding braid (125). CLK signal line 5 (121), SDA signal line 5 (122), and VDD signal line 5 (123) each include an outer layer of shielding braid and a core. The core of CLK signal line 5 (121) is connected to the CLK pin of signal adapter board 2 (126), and the outer layer of shielding braid of CLK signal line 5 (121) is connected to the GND1 pin of signal adapter board 2 (126). The core of SDA signal line 5 (122) is connected to the SDA pin of signal adapter board 2 (126), and the core of SDA signal line 5 (122) is connected to the SDA pin of signal adapter board 2 (126). The outer shield braid is connected to the GND2 pin of the signal adapter board 2 (126); the core of the VDD signal line 5 (123) is connected to the VDD pin of the signal adapter board 2 (126), and the outer shield braid of the VDD signal line 5 (123) is connected to the GND3 pin of the signal adapter board 2 (126); the GND signal ground line 2 (124) is connected to the GND pin of the signal adapter board 2 (126), and the outer shield braid of the signal line (125) is connected to the AGND pin of the signal adapter board 2 (126).

13. The electromagnetic compatibility rectification method for an image processor according to claim 11, characterized in that: In step (2) and / or step (4), the sleeve is a heat shrinkable sleeve (15), or includes an inner heat shrinkable sleeve (25), a shielded braided mesh sleeve (26), and an outer heat shrinkable sleeve (27) arranged sequentially from the inside to the outside.

14. The electromagnetic compatibility rectification method for an image processor according to claim 13, characterized in that: In step (2), the shielded braided mesh tube (26) is connected to the metal base plate of the image processor via a connecting wire and a yellow-green ground wire.

15. The electromagnetic compatibility rectification method for an image processor according to claim 11, characterized in that: In step (2), the internal signal connection line includes a set of signal lines covered by a sleeve: CLK clock signal line 2 (21), SDA data signal line 2 (22), VDD voltage signal line 2 (23) and LED signal line 2 (24).

16. The electromagnetic compatibility rectification method for an image processor according to claim 11, characterized in that: In step (5), conductive paint is sprayed onto the recessed areas and screw holes around the contact points between the front plastic panel and the rear plastic panel of the image processor and the upper and lower metal covers.

17. The electromagnetic compatibility rectification method applied to an image processor according to claim 11, characterized in that: The capacitance value is 10-25pF.

18. The electromagnetic compatibility rectification method applied to an image processor according to claim 11, characterized in that: The image processor's motherboard has an exposed metal grounding connection, and the metal aircraft seat front panel and internal signal lines are grounded.

19. The electromagnetic compatibility rectification method applied to an image processor according to claim 11, characterized in that: The overall outer shielding braid of the image processor signal lines, the outer shielding braid of individual signal lines, and the shielding braid of the signal connection lines are all independently tin-plated copper structures, which are formed by braiding tin-plated copper wires into a mesh structure.

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