Electronic device and method of manufacturing the same

Abstract

This invention provides an electronic device comprising: a substrate, a plurality of conductive pads, an adhesive layer, and a first diode unit, a second diode unit, a third diode unit, and a fourth diode unit disposed on the substrate; the adhesive layer has a plurality of patterned conductive particles, the plurality of conductive particles corresponding to the arrangement of the plurality of conductive pads, and the distance between the area where the plurality of conductive particles are disposed and the outer edge of at least one of the plurality of conductive pads is between 0 μm and 30 μm; the first diode unit, the second diode unit, the third diode unit, and the fourth diode unit are electrically connected to the plurality of conductive pads through the plurality of conductive particles; wherein a first spacing between the first diode unit and the second diode unit is different from a second spacing between the third diode unit and the fourth diode unit; wherein the adhesive layer has a first height, the first diode unit has a second height, and the second height is greater than the first height.

Description

[0001] This case is a divisional application of Chinese patent application number "201810820379.9", filed on July 24, 2018. Technical Field

[0002] This invention relates to an electronic device and a method for manufacturing the same, and particularly to a process for replacing a light-emitting unit in an electronic device. Background Technology

[0003] With the booming development of electronic products, consumers have higher requirements and expectations for the quality and functionality of these products. Light-emitting diodes (LEDs) are expected to be used in future electronic product applications. Micro LED technology is an emerging electronic device technology characterized by miniaturization (or arraying). However, due to the extremely small size of micro LEDs, they are generally transferred to the target substrate (array substrate) in batches during the manufacturing process. When an LED is determined to be non-compliant with the design after performance testing (including optical and electrical testing), it needs to be replaced with a tiny micro LED, which presents considerable technical challenges.

[0004] Therefore, developing an effective method for replacing (or repairing) micro LEDs is one of the current research topics being pursued by the industry. Summary of the Invention

[0005] In some embodiments, the present invention provides an electronic device, characterized in that it includes: a substrate; a plurality of conductive pads disposed on the substrate; an adhesive layer disposed on the substrate and having a plurality of patterned conductive particles, wherein the plurality of conductive particles correspond to the arrangement of the plurality of conductive pads, and the distance between a region where the plurality of conductive particles are disposed and an outer edge of at least one of the plurality of conductive pads is between 0 μm and 30 μm; and a first diode unit, a second diode unit, a third diode unit, and a fourth diode unit disposed on the substrate and electrically connected to the plurality of conductive pads respectively through the plurality of conductive particles; wherein The second diode unit is adjacent to the first diode unit along a first direction, the fourth diode unit is adjacent to the third diode unit along the first direction, the third diode unit is adjacent to the first diode unit along a second direction perpendicular to the first direction, and the fourth diode unit is adjacent to the second diode unit along the second direction. A first spacing between the first diode unit and the second diode unit is different from a second spacing between the third diode unit and the fourth diode unit. The adhesive layer has a first height, the first diode unit has a second height, and the second height is greater than the first height.

[0006] In some embodiments, the present invention provides an electronic device, characterized in that it includes: a substrate; a plurality of conductive pads disposed on the substrate; a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, and a fourth light-emitting unit disposed on the substrate; and a plurality of conductive particles, wherein the first light-emitting unit, the second light-emitting unit, the third light-emitting unit, and the fourth light-emitting unit are electrically connected to the plurality of conductive pads through the plurality of conductive particles, and the distance between a region where the plurality of conductive particles are disposed and an outer edge of at least one of the plurality of conductive pads is between 0 μm and 30 μm; wherein the second light-emitting unit is adjacent to the first light-emitting unit along a first direction, the fourth light-emitting unit is adjacent to the third light-emitting unit along the first direction, the third light-emitting unit is adjacent to the first light-emitting unit along a second direction perpendicular to the first direction, and the fourth light-emitting unit is adjacent to the second light-emitting unit along the second direction, wherein a first spacing between the first light-emitting unit and the second light-emitting unit is different from a second spacing between the third light-emitting unit and the fourth light-emitting unit.

[0007] To make the features or advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0008] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0009] Figure 1 A flowchart of a method for manufacturing an electronic device is shown according to some embodiments of the present invention;

[0010] Figures 2A to 2H This diagram shows a cross-sectional view of an electronic device at an intermediate stage of the manufacturing process, according to some embodiments of the present invention.

[0011] Figures 3A to 3H This diagram shows a cross-sectional view of an electronic device at an intermediate stage of the manufacturing process, according to some other embodiments of the present invention.

[0012] Figure 4A A cross-sectional schematic diagram of an electronic device is shown according to some embodiments of the present invention;

[0013] Figure 4B The display corresponds to Figure 4A A top view of area A shown;

[0014] Figure 5 A top view schematic diagram of an electronic device according to some embodiments of the present invention is shown;

[0015] Figure 6A top view schematic diagram of an electronic device according to some embodiments of the present invention is shown;

[0016] Figure 7 The diagram shows a top view of an electronic device according to some embodiments of the present invention.

[0017] Symbol Explanation

[0018] 10 Manufacturing methods for electronic devices

[0019] 100A, 100B, 100C, 100D, 100E Electronic devices;

[0020] 102, 102' First substrate;

[0021] 104 Supporting substrate;

[0022] 200U, 200U1, 200U2, 200U3 First light-emitting unit;

[0023] 200U' The first light-emitting unit to be replaced;

[0024] 202 First semiconductor layer;

[0025] 204 Second semiconductor layer;

[0026] 206 quantum well layers;

[0027] 208 First electrode;

[0028] 210 Second electrode;

[0029] 302 Second substrate;

[0030] 304 adhesive layer;

[0031] 304m substrate;

[0032] 304p conductive particles;

[0033] 306 device;

[0034] 308 conductive pad;

[0035] 308E edge;

[0036] Top surface of 200S, 302S, and 304S;

[0037] CL cleaning process;

[0038] d1 Distance;

[0039] H1 First Altitude;

[0040] H2 Second Height;

[0041] LO removal process;

[0042] P1 First spacing;

[0043] P2 Second spacing;

[0044] P3 Third spacing;

[0045] P4 Fourth spacing;

[0046] S1 interface;

[0047] Steps S11, S13, S14, S15, S17, S19, S21

[0048] R region;

[0049] T-detection

[0050] VC space is empty. Detailed Implementation

[0051] The structure and manufacturing method of the electronic device of the present invention are described in detail below. The following description provides many different embodiments for implementing different variations of the invention. The specific components and arrangements described below are merely for simple and clear description of some embodiments of the invention, and are intended to be illustrative rather than limiting the invention. Repeated reference numerals or designations may be used in different embodiments, merely for simple and clear description of some embodiments of the invention, and do not represent any relationship between the different embodiments and / or structures discussed. When a first material layer is described as being disposed on or above a second material layer, this includes the case where the first material layer and the second material layer are in direct contact. Alternatively, there may be a case where one or more other material layers are spaced apart, in which case the first material layer and the second material layer may not be in direct contact.

[0052] It should be understood that the components or devices in the accompanying drawings may exist in various forms well known to those skilled in the art. Furthermore, relative terms such as "lower," "bottom," "higher," or "top" may be used in the embodiments to describe the relative relationship of one component of the drawings to another. It is understood that if the devices in the drawings are flipped upside down, the component described as being on the "lower" side will become the component on the "higher" side. Embodiments of the present invention may be used in conjunction with the accompanying drawings. Figure 1 It should be understood that the accompanying drawings of this invention are also considered part of the description of the invention. It should be understood that the drawings of this invention are not drawn to scale, and in fact, the dimensions of components may be arbitrarily enlarged or reduced in order to clearly show the features of the invention, and in the specification and drawings, the same or similar components will be represented by similar symbols.

[0053] Understandably, while terms such as "first," "second," and "third" may be used to describe various components, parts, or components, these terms are only used to distinguish different components, parts, or components and should not be used to limit them.

[0054] Here, the terms "about," "approximately," and "substantially" generally mean within 20%, preferably 10%, more preferably 5%, or 3%, or 2%, or 1%, or 0.5% of a given value or range. The quantities given here are approximate quantities, meaning that the meanings of "about," "approximately," and "substantially" may be implied even without specific mention of them.

[0055] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. These terms, for example, as defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with the relevant art and the background or context of this invention, and shall not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0056] In some embodiments of the present invention, the terms "joining" and "electrical connection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, wherein another structure is disposed between the two structures. Furthermore, the terms "joining" and "electrical connection" may also include cases where both structures are movable or both structures are fixed.

[0057] According to some embodiments of the present invention, a method for manufacturing an electronic device is provided, which allows for the batch replacement (or repair) of light-emitting units. The step of replacing light-emitting units can involve replacing multiple light-emitting units simultaneously or sequentially; the present invention is not limited in this regard. The manufacturing method of the present invention is not limited by the size of the light-emitting units and can replace light-emitting units of various sizes. The method can improve the replacement efficiency, quality, or yield of smaller-sized light-emitting units.

[0058] According to some embodiments of the present invention, an electronic device is provided, which includes light-emitting units that have been replaced (or repaired) by the above method, wherein the spacing of the replaced light-emitting units may be different from the spacing of other light-emitting units that have not been replaced.

[0059] Figure 1This diagram illustrates a flowchart of a method 10 for manufacturing an electronic device according to some embodiments of the present invention. In some embodiments, additional operational steps may be provided before, during, and / or after the method 10 for manufacturing the electronic device. In different embodiments, some stages (or steps) may be deleted or replaced, or the order of steps may be interchanged as appropriate. In different embodiments, some features of the electronic device described below may be replaced or deleted, or additional features may be added to the electronic device. Figures 2A to 2H This illustrates, according to some embodiments of the present invention, the use of Figure 1 A cross-sectional schematic diagram of the electronic device 100A formed by the manufacturing method 10 shown in the figure at an intermediate stage of the process.

[0060] First, please refer to Figure 1 and Figure 2A In some embodiments, the method 10 for manufacturing an electronic device includes step S11, detecting a plurality of first light-emitting units 200U disposed on a first substrate 102 (i.e., performing detection T) to select the first light-emitting unit 200U' to be replaced. Figure 2A As shown, a first substrate 102 may be disposed on a carrier substrate 104, for example. In some embodiments, a plurality of first substrates 102 may be disposed on the carrier substrate 104, for example. In some embodiments, the first substrate 102 may be, for example, the native substrate (or mother substrate) of the first light-emitting unit 200U or a non-native substrate (non-mother substrate), but the present invention is not limited thereto. In some embodiments, the first substrate 102 may comprise a sapphire substrate, a glass substrate, a red light substrate, other suitable substrates or combinations thereof, but the present invention is not limited thereto. The material of the first substrate 102 may comprise, for example, silicon carbide (SiC), gallium arsenide (GaAs), gallium phosphide (GaP), other suitable compounds or combinations thereof, but the present invention is not limited thereto. In some embodiments, the carrier substrate 104 may comprise silicon, glass, a polymer compound, metal or ceramic or a combination thereof, but the present invention is not limited thereto. The polymer substrate may comprise polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET) or rubber, but the present invention is not limited thereto.

[0061] The first light-emitting unit 200U may include, for example, a light-emitting diode (LED), a micro light-emitting diode, or a mini light-emitting diode, but the present invention is not limited thereto. In some embodiments, the chip size of the LED is approximately 300 micrometers (μm) to 10 millimeters (mm), the chip size of the mini LED is approximately 100 micrometers (μm) to 300 micrometers (μm), and the chip size of the micro LED is approximately 1 micrometer (μm) to 100 micrometers (μm), but the present invention is not limited thereto.

[0062] In some embodiments, the first light-emitting unit 200U may, for example, include a first semiconductor layer 202, a second semiconductor layer 204, a quantum well layer 206 disposed between the first semiconductor layer 202 and the second semiconductor layer 204, and a first electrode 208 and a second electrode 210 electrically connected to the first semiconductor layer 202 and the second semiconductor layer 204, respectively. The first semiconductor layer 202 and the second semiconductor layer 204 may have opposite conductivity characteristics. For example, in some embodiments, the first semiconductor layer 202 is a p-type semiconductor and the second semiconductor layer 204 is an n-type semiconductor. In other embodiments, the first semiconductor layer 202 is an n-type semiconductor and the second semiconductor layer 204 is a p-type semiconductor.

[0063] In some embodiments, the first semiconductor layer 202 or the second semiconductor layer 204 may be formed of gallium nitride (GaN), but is not limited thereto. In some embodiments, the quantum well layer 206 may comprise a single quantum well (SQW) or a multiple quantum well (MQW), and the material of the quantum well layer 206 may comprise indium gallium nitride (InGaN), gallium nitride (GaN), or a combination thereof, but is not limited thereto. In some embodiments, the first electrode 208 and the second electrode 210 may serve as the p-electrode / n-electrode of the light-emitting unit 200U. In some embodiments, the first electrode 208 and the second electrode 210 may be formed of a metallic conductive material, a transparent conductive material, or a combination thereof. The metallic conductive material may comprise copper, aluminum, tungsten, titanium, gold, platinum, nickel, other suitable metallic conductive materials, the alloys described above, or combinations thereof, but is not limited thereto. Transparent conductive materials may include transparent conductive oxides (TCOs), such as indium tin oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), other suitable transparent conductive materials, or combinations thereof, but are not limited thereto.

[0064] Although the light-emitting unit depicted in the icon is a flip-chip type light-emitting diode, the invention is not limited thereto. In other embodiments, the light-emitting unit may also be a vertical type light-emitting diode.

[0065] The aforementioned detection T can be used to test whether the quality or performance of the first light-emitting unit 200U meets the design specifications. In some embodiments, detection T can be used to test the photoelectric characteristics of the first light-emitting unit 200U, but the present invention is not limited thereto. Detection T can be carried out using suitable methods known in the art, as needed. In some embodiments, the first light-emitting unit 200U' to be replaced can be selected based on the test results of detection T. For example, the first light-emitting unit 200U' to be replaced may be a light-emitting unit whose photoelectric properties do not meet the design specifications or are abnormal, but the present invention is not limited thereto. For example, the light-emitting unit to be replaced (or abnormal) may be one that flickers, emits light continuously or emits a small amount of light when the induced current or the driving circuit provides a shut-off signal, or one that flickers, emits a small amount of light or fails to emit light when the induced current or the driving circuit provides an open signal. Alternatively, in some embodiments, the light-emitting unit to be replaced (or abnormal) may represent a light-emitting unit whose emitted light brightness, wavelength, or voltage does not meet the design values, but the present invention is not limited thereto. In some embodiments, the light-emitting unit to be replaced (or the abnormal one) may be, for example, a light-emitting unit with obvious damage or deformation in appearance. It should be understood that although only one first light-emitting unit 200U' to be replaced is shown in the figure, in reality, the first substrate 102 may have, for example, multiple first light-emitting units 200U' to be replaced.

[0066] Next, please continue to refer to Figure 1 and Figure 2A In step S13, the first light-emitting unit 200U' to be replaced is removed from the first substrate 102. A removal process LO can be performed to remove the first light-emitting unit 200U' from the first substrate 102. Figure 2B As shown, after removing the first light-emitting unit 200U' to be replaced, a vacancy VC is formed on the first substrate 102. In some embodiments, the removal process LO may include a laser lift-off (LLO) process, dry (or wet) chemical etching, laser bombardment, or other suitable processes or combinations thereof, but the invention is not limited thereto. The removal process LO may, for example, peel off the interface S1 between the first substrate 102 and the first light-emitting unit 200U'.

[0067] Next, please refer to Figure 1 and Figures 2C to 2DIn step S15, the second light-emitting unit 200R is transferred to the second substrate 302. The position of the second light-emitting unit 200R corresponds to the empty space VC on the first substrate 102 (i.e., the first light-emitting unit 200U' to be replaced). Specifically, if there is no first light-emitting unit 200U' to be replaced on the first substrate 102, the first light-emitting unit 200U' on the first substrate 102 can be transferred to the second substrate 302 (e.g., the target substrate). This process may include, for example, aligning the first substrate 102 and the second substrate 302 (e.g., using alignment marks, but the invention is not limited thereto). However, if there is a first light-emitting unit 200U' to be replaced on the first substrate 102, the first light-emitting unit 200U' to be replaced can be removed from the first substrate 102. After removal, the first substrate 102 will have (or form) an empty space VC. Subsequently, the first light-emitting unit 200U' that is not replaced (i.e., does not need to be replaced) on this first substrate 102... The first light-emitting unit 200U' will be transferred to the second substrate 302 (e.g., the target substrate), and the second light-emitting unit 200R (which is used to replace the removed first light-emitting unit 200U') on another first substrate 102' will also be transferred to the second substrate 302. The transfer process may require, for example, aligning the first substrate 102 or the other first substrate 102' with the second substrate 302. Therefore, to improve the ease of transfer or reduce the mutual interference between the first light-emitting unit 200U' or the second light-emitting unit 200R transferred to the second substrate 302, the position of the second light-emitting unit 200R on the first substrate 102' can be pre-aligned with the position of the empty space VC on the first substrate 102. For example, if the empty space VC on the first substrate 102 is located at the second position, the second light-emitting unit 200R at the second position on the first substrate 102' can be transferred. The present invention does not limit the requirement to first transfer the unreplaced first light-emitting unit 200U on the first substrate 102 to the second substrate 302, or to first transfer the second light-emitting unit 200R on another first substrate 102' to the second substrate 302. Details will be described in the following description.

[0068] In some embodiments, the first substrate 102' may have at least one second light-emitting unit 200R. The first light-emitting unit 200U' to be replaced and the second light-emitting unit 200R may be light-emitting units emitting substantially the same wavelength (e.g., including one of the blue, green, or red bands, but the invention is not limited thereto). In some embodiments, the spacing between the second light-emitting units 200R on the first substrate 102' is substantially the same as the spacing between the first light-emitting units 200U on the first substrate 102. In some embodiments, the size of the second light-emitting unit 200R on the first substrate 102' is substantially the same as the size of the first light-emitting unit 200U on the first substrate 102. In some embodiments, the second light-emitting units 200R formed on the first substrate 102' can be used as an array of light-emitting units specifically for replacement (or repair). In some embodiments, the second light-emitting units 200R on the first substrate 102' may have been, for example, previously tested by a test (T) to confirm that their performance meets design specifications.

[0069] In some embodiments, a second light-emitting unit 200R corresponding to a vacancy VC on the first substrate 102' can be removed by a removal process LO, and transferred to the second substrate 302. In some embodiments, the removal process LO may include a laser lift-off (LLO) process, dry (or wet) chemical etching, laser bombardment or other suitable processes or combinations thereof, but the invention is not limited thereto.

[0070] It should be understood that although the illustrated embodiment shows only the removal or replacement of one light-emitting unit, in other embodiments, multiple light-emitting units can be removed or replaced simultaneously. That is, multiple vacant VCs can be formed on the first substrate 102, and replaced by multiple second light-emitting units 200Rs on another first substrate 102' corresponding to the vacant VCs.

[0071] In addition, such as Figure 2C and 2DAs shown, in some embodiments, the method 10 for manufacturing the electronic device further includes step S14, that is, before transferring the second light-emitting unit 200R to the second substrate 302 (step S15), an adhesive layer 304 may be formed on the second substrate 302, for example. The adhesive layer 304 may be used, for example, to temporarily position the second light-emitting unit 200R on the second substrate 302. In some embodiments, the material of the adhesive layer 304 may include, for example, a photocurable material, a thermocurable material, a photothermal curable material, a moisture-curable material, other suitable materials, or combinations thereof, but the invention is not limited thereto. In some embodiments, the second light-emitting unit 200R may, for example, be partially embedded in the adhesive layer 304. In some embodiments, the adhesive layer 304 may, for example, have micro-adhesion before curing, which can moderately adjust the position of the second light-emitting unit 200R disposed thereon, reducing the occurrence of contact or short circuit problems between different light-emitting units.

[0072] In some embodiments, the material of the adhesive layer 304 may include, for example, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), non-conductive film (NCF), non-conductive paste (NCP), photoresist, or a combination thereof, but the invention is not limited thereto. The anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) may contain a polymer material and conductive particles (as shown in 304p). The conductive particles may, for example, provide an electrical connection between the light-emitting unit and a conductive pad on the target substrate (e.g., an array substrate, but the invention is not limited thereto). In embodiments using non-conductive film (NCF), non-conductive paste (NCF), or photoresist as the adhesive layer 304, the unreplaced first light-emitting unit 200U and second light-emitting unit 200R can be bonded or electrically connected to the target substrate (e.g., an array substrate) via a eutectic bonding process. Figures 3A to 3H (As shown). Furthermore, in some embodiments, the adhesive layer 304 may be provided, for example, by coating, spraying, screen printing, attaching, transferring, photolithography, other suitable methods, or combinations thereof, but the invention is not limited thereto. In some embodiments, the adhesive layer 304 may be, for example, a single-layer or multi-layer material.

[0073] Next, please refer to Figure 1 and Figure 2E In step S17, the unreplaced first light-emitting unit 200U on the first substrate 102 is transferred to the second substrate 302. In other words, the first light-emitting unit 200U that has not been replaced is transferred to the second substrate 302. Figure 2BThe first light-emitting unit 200U on the first substrate 102 with vacant VC is transferred to the second substrate 302. Specifically, in some embodiments, the first substrate 102 with vacant VC may be removed from the carrier substrate 104 first, and then the device 306 is used to grasp or transfer the first substrate 102 (with vacant VC) and transfer the first light-emitting unit 200U on the first substrate 102 to the second substrate 302. In some embodiments, the first substrate 102 may be aligned with the second substrate 302 first, and then the first light-emitting unit 200U on the first substrate 102 may be transferred to the second substrate 302. For example, alignment can be performed optically or mechanically, but the invention is not limited thereto, and the alignment step is not mandatory. In some embodiments, the device 306 may grasp the first substrate 102 by means of vacuum, electrostatic force, magnetic force, or van der Waals force, but the invention is not limited thereto. Furthermore, as... Figure 2E As shown, the first light-emitting unit 200U may, for example, avoid the position where the second light-emitting unit 200R is transferred to the second substrate 302 and be temporarily positioned in the adhesive layer 304. In some embodiments, the first light-emitting unit 200U may also be partially embedded in the adhesive layer 304.

[0074] Furthermore, in some embodiments, the second substrate 302 may be, for example, an array substrate (or a target substrate), but the present invention is not limited thereto. The material of the second substrate 302 may be, for example, glass, quartz, sapphire, plastic, polymer, other suitable materials, or combinations thereof, but the present invention is not limited thereto. For example, the second substrate 302 may serve as a driving substrate for the electronic device 100A. More specifically, the second substrate 302 may, for example, include a driving circuit (not shown), which may be, for example, an active driving circuit or a passive driving circuit. The driving circuit may, for example, include transistors (e.g., switching transistors, driving transistors, or other transistors), data lines, scan lines, conductive pads, or dielectric layers or other lines, but the present invention is not limited thereto. The switching transistor may, for example, be used to control the switching of the first light-emitting unit 200U or the second light-emitting unit 200R. In some embodiments, the driving circuit may control the first light-emitting unit 200U or the second light-emitting unit 200R by means of an external integrated circuit (IC) or microchip. In some embodiments, the second substrate 302 may be, for example, an intermediate substrate that temporarily supports the first light-emitting unit 200U or the second light-emitting unit 200R (e.g., Figures 3A to 3H (As shown in the embodiments).

[0075] In some embodiments, the order of the aforementioned steps S15 and S17 can be interchanged. That is, the first light-emitting unit 200U on the first substrate 102 can be transferred to the second substrate 302 first, and then the second light-emitting unit 200R on the first substrate 102' can be transferred to the second substrate 302. It should be noted that the first light-emitting unit 200U and the second light-emitting unit 200R should avoid overlapping on the second substrate 302. That is, the first light-emitting unit 200U and the second light-emitting unit 200R are electrically connected to different conductive pads on the second substrate 302 (not shown, but will be described later).

[0076] Next, please refer to Figure 1 and Figure 2F In step S19, the first substrate 102 can be removed by a removal process LO. In some embodiments, the removal process LO is performed as described above. For example, the first substrate 102 can be directly etched away by dry (or wet) chemical etching in the removal process LO. The removal process LO can, for example, peel off the interface S1 between the first substrate 102 and the first light-emitting unit 200U or the second light-emitting unit 200R.

[0077] Furthermore, in some embodiments, before removing the first substrate 102 (step S19), a curing process may be performed on the adhesive layer 304 to fix the first light-emitting unit 200U and the second light-emitting unit 200R in the adhesive layer. In some embodiments, when the adhesive layer 304 comprises a thermosetting material, a heating step may be performed on the adhesive layer 304 to perform the curing process. In some embodiments, the temperature range of the heating step is about 100°C to 400°C, but the invention is not limited thereto. In some embodiments, the pressure range of the curing process is about 1 MPa to 80 MPa, but the invention is not limited thereto. In some embodiments, when the adhesive layer 304 comprises a photocurable material, a curing step may be performed by irradiating the adhesive layer 304 with light of a specific wavelength, such as UV light or general visible light. In some embodiments, the adhesive layer 304 may be left to stand for a long period of time to perform the curing step. Furthermore, in some embodiments, the adhesive layer 304 may be patterned on the second substrate 302, for example. In some embodiments, the adhesive layer 304 may, for example, simultaneously function as an underfill for the bottom of the light-emitting unit. The underfill can reduce the probability of short circuits between adjacent light-emitting units or reduce the conductive pad (e.g., see reference). Figure 4A Corrosion of conductive pad 308.

[0078] Next, please refer to Figure 1 and Figure 2GIn some embodiments, the method 10 for manufacturing an electronic device further includes step S21, performing a cleaning process CL on the light-emitting surface of the first light-emitting unit 200U or the second light-emitting unit 200R. In some embodiments, the light-emitting surface may be, for example, the top surface of the first semiconductor layer 202 of the first light-emitting unit 200U or the second light-emitting unit 200R. In some embodiments, the energy during removal may roughen the top surface (interface S1) of the first semiconductor layer 202 of the first light-emitting unit 200U or the second light-emitting unit 200R. In some embodiments, the roughness of the top surface (interface S1) of the first semiconductor layer 202 of the first light-emitting unit 200U or the second light-emitting unit 200R ranges from about 0.1 μm to 2 μm. In some embodiments, the roughness of the top surface (interface S1) of the first semiconductor layer 202 of the first light-emitting unit 200U or the second light-emitting unit 200R ranges from about 0.1 μm to 0.5 μm.

[0079] Furthermore, in some embodiments, the light-emitting surface of the first light-emitting unit 200U or the second light-emitting unit 200R can be cleaned by an etching step, thereby changing the roughness of the light-emitting surface of the first light-emitting unit 200U or the second light-emitting unit 200R and changing or adjusting the light emission path. In some embodiments, the etching process includes a wet etching process, but the present invention is not limited thereto.

[0080] Thus, the electronic device 100A is roughly completed, such as... Figure 2H As shown, the first light-emitting unit 200U or the second light-emitting unit 200R is disposed on the second substrate 302, and the first light-emitting unit 200U or the second light-emitting unit 200R is fixed by the adhesive layer 304. In addition, in some embodiments, for example, the assembled electronic device 100A can be subjected to a test T (not shown) to test whether the performance of the first light-emitting unit 200U or the second light-emitting unit 200R is normal.

[0081] Next, please refer to Figures 3A to 3H , Figures 3A to 3H This diagram shows a cross-sectional view of an electronic device 100B formed using the manufacturing method 20 of an electronic device at an intermediate stage of the process, according to some embodiments of the present invention. It should be understood that components or components that are the same or similar to those described above will be indicated by the same or similar reference numerals in the following text, and their materials and functions are the same or similar to those described above; therefore, this part will not be repeated in the following text. Figures 3A to 3H The manufacturing method 20 of the electronic device shown Figures 2A to 2H The manufacturing method of the electronic device shown is similar to 10, except that, in Figures 3A to 3HIn the illustrated embodiment, the first light-emitting units 200U disposed on different first substrates 102 can be replaced (or repaired) simultaneously. In other words, the first light-emitting units 200U on multiple first substrates 102 can be replaced simultaneously.

[0082] Specifically, such as Figure 3A As shown, firstly, a plurality of first light-emitting units 200U disposed on the first substrate 102 can be detected by a detection T to select the first light-emitting unit 200U' to be replaced. Specifically, for example, the first light-emitting unit 200U' disposed on different first substrates 102 can be selected based on the result obtained by the detection T. Next, for example, a removal process LO can be performed to remove the first light-emitting unit 200U' to be replaced from the first substrate 102, thus, for example, a vacancy VC corresponding to the first light-emitting unit 200U' to be replaced can be formed on different first substrates 102 (e.g., ...). Figure 3B (As shown).

[0083] Next, as Figure 3C and 3D As shown, the second light-emitting units 200R on the first substrate 102' are transferred simultaneously or in batches to the second substrate 302. The positions of the second light-emitting units 200R correspond, for example, to the empty spaces VC of the first light-emitting units 200U' to be replaced on the first substrate 102. Specifically, in this embodiment, the second light-emitting units 200R on the same first substrate 102' can, for example, be used to simultaneously or in batches replace the first light-emitting units 200U on different first substrates 102. In some embodiments, the first light-emitting units 200U on two or more first substrates 102 can be replaced simultaneously or in batches, but the invention is not limited thereto. Furthermore, in this embodiment, for example, an adhesive layer 304 can be formed on the second substrate 302 before the second light-emitting units 200R are transferred to the second substrate 302. In some embodiments, the adhesive layer 304 on the second substrate 302 can be continuous or discontinuous (i.e., patterned adhesive layer 304), which can be adjusted according to subsequent process requirements.

[0084] Next, as Figure 3E As shown, the first light-emitting unit 200U that has not been replaced on the first substrate 102 can, for example, be transferred to the second substrate 302. Figure 3E As shown, the first light-emitting unit 200U will avoid the position of the second light-emitting unit 200R and will be temporarily positioned in the adhesive layer 304. The first light-emitting unit 200U and the second light-emitting unit 200R can, for example, be partially embedded in the adhesive layer 304. Then, as... Figure 3FAs shown, the first substrate 102 can be removed, for example, by a removal process LO. The removal process LO can, for example, peel off the interface S1 between the first substrate 102 and the first light-emitting unit 200U or the second light-emitting unit 200R. In some embodiments, after the aforementioned removal process LO, a cleaning process CL can also be performed on the light-emitting surfaces of the first light-emitting unit 200U and the second light-emitting unit 200R. Then, as... Figure 3G As shown, the first light-emitting unit 200U and the replaced second light-emitting unit 200R can be temporarily fixed to the second substrate 302, for example, by means of an adhesive layer 304. In some embodiments, the adhesive layer 304 or the second substrate 302 may have flexible characteristics, and the spacing between the first light-emitting unit 200U and the second light-emitting unit 200R formed on the second substrate 302 can be adjusted by stretching the adhesive layer 304 or the second substrate 302, thereby improving the quality of the electronic device and reducing the probability of short circuits caused by the light-emitting units being too close to each other.

[0085] In this embodiment, the second substrate 302 may serve as an intermediate substrate, for example, to temporarily support a first light-emitting unit 200U from a different first substrate 102 or a second light-emitting unit 200R that needs to be replaced. Then, as... Figure 3H As shown, the second substrate 302 can be removed, for example, and the adhesive layer 304 and the first light-emitting unit 200U or the second light-emitting unit 200R temporarily fixed on the second substrate 302 can be transferred to the third substrate 402. In this embodiment, the third substrate 402 can be, for example, an array substrate. For example, the third substrate 402 can serve as a driving substrate for an electronic device. In detail, the third substrate 402 can, for example, include a driving circuit (not shown), and the description of the driving substrate is repeated here as described above. In some embodiments, the aforementioned adhesive layer 304 and the first light-emitting unit 200U and the second light-emitting unit 200R formed thereon can be transferred to different third substrates 402 or the same third substrate 402.

[0086] In this embodiment, the unreplaced first light-emitting unit 200U or second light-emitting unit 200R can be bonded to the third substrate 402, for example, via a eutectic bonding process. Specifically, the first light-emitting unit 200U or second light-emitting unit 200R can be electrically connected to the third substrate 402, for example, via a eutectic bonding process. In some embodiments, the formed electronic device 100B can be, for example, a tiled display, and the first light-emitting unit 200U and the replaced second light-emitting unit 200R can be, for example, disposed on different third substrates 402 adjacent to each other, but the invention is not limited thereto.

[0087] Next, please refer to Figure 4A , Figure 4A This diagram shows a cross-sectional view of an electronic device 100A according to some embodiments of the present invention. As for the foregoing, in some embodiments, the material of the adhesive layer 304 may comprise anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). More specifically, in some embodiments, the adhesive layer 304 may, for example, comprise a polymeric material as a matrix 304m and conductive particles 304p distributed therein. In some embodiments, the polymeric material may, for example, comprise organic materials, but the invention is not limited thereto. Organic materials may, for example, comprise epoxy resins, acylic resins such as polymethyl methacrylate (PMMA), benzocyclobutene (BCB), polyimide, polyester, polydimethylsiloxane (PDMS), other suitable materials, or combinations thereof, but the invention is not limited thereto. Furthermore, in some embodiments, the conductive particles 304p may, for example, be a polymer surface with compressible properties coated with a conductive material, solder balls, or combinations thereof, but the invention is not limited thereto. The conductive material may, for example, include nickel (Ni), gold (Au), platinum (Pt), silver (Ag), copper (Cu), iron (Fe), nickel (Ni), tin (Sn), aluminum (Al), magnesium (Mg), palladium (Pd), iridium (Ir), rhodium (Rh), ruthenium (Ru), zinc (Zn), other suitable conductive materials, alloys of the above, or combinations thereof, but the invention is not limited thereto. In some embodiments, the particle size of the conductive particles 304p ranges from about 1 μm to 30 μm, but the invention is not limited thereto. In some embodiments, the particle size of the conductive particles 304p ranges from about 1 μm to 10 μm.

[0088] like Figure 4A As shown, in some embodiments, conductive particles 304p in the adhesive layer 304 may, for example, be disposed between the electrodes (e.g., the first electrode 208 and the second electrode 210) of the first light-emitting unit 200U or the second light-emitting unit 200R and the conductive pads 308 on the second substrate 302. Here, the second substrate 302 may, for example, serve as an array substrate, and the conductive pads 308 may, for example, be electrically connected to a driving circuit disposed on the second substrate 302. The conductive particles 304p may, for example, contact the electrodes (e.g., the first electrode 208 and the second electrode 210) of the first light-emitting unit 200U or the second light-emitting unit 200R and the conductive pads 308, to electrically connect the first light-emitting unit 200U with the conductive pads 308 on the second substrate 302 and the second light-emitting unit 200R with the conductive pads 308 on the second substrate 302. Furthermore, as... Figure 4AAs shown, most of the conductive particles 304p can be disposed, for example, between the first light-emitting unit 200U and the conductive pad 308 on the second substrate 302, or between the second light-emitting unit 200R and the conductive pad 308 on the second substrate 302.

[0089] In some embodiments, the conductive pad 308 may comprise, for example, a metallic conductive material, a transparent conductive material, or a combination thereof. The metallic conductive material may, for example, comprise copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), copper alloys, aluminum alloys, molybdenum alloys, tungsten alloys, gold alloys, chromium alloys, nickel alloys, other suitable materials, or combinations thereof, but the invention is not limited thereto. The transparent conductive material may, for example, comprise indium tin oxide (ITO), tin oxide (SnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), other suitable materials, or combinations thereof, but the invention is not limited thereto.

[0090] In addition, such as Figure 4A As shown, the adhesive layer 304 may have a first height H1, for example, and the first light-emitting unit 200U or the second light-emitting unit 200R may have a second height H2. The first height H1 may be defined, for example, as the maximum distance between the top surface 302S of the second substrate 302 and the top surface 304S of the adhesive layer 304 in the normal direction (along the Z direction) of the second substrate 302, and the second height H2 may be defined, for example, as the maximum distance between the top surface 302S of the second substrate 302 and the top surface 200S of the first light-emitting unit 200U or the second light-emitting unit 200R in the normal direction (along the Z direction) of the second substrate 302. In some embodiments, the second height H2 may be, for example, greater than the first height H1. The adhesive layer 304 may include, for example, a light-shielding or light-absorbing material, that is, the adhesive layer 304 may serve as a light-shielding layer for the first light-emitting unit 200U or the second light-emitting unit 200R, and therefore may not be necessary to additionally provide a light-shielding layer on the second substrate 302.

[0091] Next, please refer to Figure 4B , which corresponds to Figure 4A The diagram shows a top view of region A (a top view in the XY plane). It should be understood that... Figure 4B Some components, such as the first light-emitting unit 200U, are omitted to clearly illustrate the conductive particles 304p and the conductive pad 308. For example... Figure 4BAs shown, the adhesive layer 304 may, for example, have patterned conductive particles 304p. Specifically, the conductive particles 304p may, for example, be arranged corresponding to the positions of the conductive pad 308, and the conductive particles 304p may, for example, be arranged corresponding to the positions of the electrodes (e.g., the first electrode 208 and the second electrode 210) of the light-emitting unit. In other words, most of the conductive particles 304p and the conductive pad 308 or the electrodes (first electrode 208 and the second electrode 210) of the light-emitting unit may, for example, overlap in the normal direction of the substrate 304m. In some embodiments, the conductive particles 304p may, for example, surround the conductive pad 308, and the area where the conductive particles 304p are disposed or distributed may be defined as region R. In some embodiments, the distance d1 between region R and the outer edge 308E of the conductive pad 308 may, for example, be between about 0 μm and 30 μm. As mentioned above, the patterned arrangement of conductive particles 304p can, for example, reduce the amount of conductive particles 304p used in the adhesive layer 304, thereby reducing the risk of short circuits caused by conductive particles 304p on different conductive pads 308 being too close to each other. In some embodiments, the adhesive layer 304 may, for example, have a matrix arrangement of conductive particles (not shown), meaning that the conductive particles are regularly disposed in the adhesive layer 304. In some embodiments, the conductive particles in the adhesive layer 304 may, for example, be unpatterned, and the conductive particles may be randomly distributed in the adhesive layer 304.

[0092] Furthermore, it should be understood that the shape of the conductive pad 308 is not limited to the circle shown in the figure. In other embodiments, the conductive pad 308 may have any suitable shape according to actual needs, such as a rectangle or a polygon, but the present invention is not limited thereto.

[0093] Next, please refer to Figure 5 , Figure 5 This diagram shows a top view (top view in the XY plane) of an electronic device 100C according to some embodiments of the present invention. In some embodiments, the electronic device 100C is an electronic device formed by the aforementioned electronic device manufacturing method 10. In some embodiments, since the first light-emitting units 200U originally disposed on the first substrate 102 are manufactured or arranged, for example by photolithography, the error in the spacing between the first light-emitting units 200U originally disposed on the first substrate 102 is small (e.g., less than about ±5 μm, but the present invention is not limited thereto). On the other hand, the replaced second light-emitting units 200R can be placed, for example, by means of device 306. Since the spacing error that the machine tool of device 306 itself can control may be large (e.g., less than about ±15 μm, but the present invention is not limited thereto), in some embodiments, the spacing between the first light-emitting units 200U and the second light-emitting units 200R on the second substrate 302 may be different from the spacing between the first light-emitting units 200U.

[0094] As used herein, the term "spacing" can be defined as the distance between the center point of a region (pixel) of a light-emitting unit and the center point of a region (pixel) of another adjacent light-emitting unit. Alternatively, "spacing" can be defined as the distance between the left edge of the left edge of a region (pixel) of a light-emitting unit and the left edge of the center point of the region (pixel) of another adjacent light-emitting unit. It should be noted that the two light-emitting units must emit the same color of light (e.g., red, green, or blue light, but the invention is not limited thereto). Furthermore, the region of a light-emitting unit can be defined, for example, in a top-view direction, by the boundary of the first semiconductor layer 202 of the light-emitting unit structure.

[0095] In some embodiments, a first light-emitting unit 200U (denoted as 200U1 for ease of description) and another first light-emitting unit 200U (denoted as 200U2) adjacent thereto along the first direction (Y direction) have a first spacing P1. The first spacing P1 is defined as the distance between the center point of the first light-emitting unit 200U1 and the center point of the first light-emitting unit 200U2 in the first direction (Y direction), or, the first spacing P1 is defined as the distance between the left edge of the first light-emitting unit 200U1 and the left edge of the first light-emitting unit 200U2 in the first direction (Y direction). In some embodiments, a first light-emitting unit 200U (denoted as 200U3) and a second light-emitting unit 200R adjacent thereto along the first direction (Y direction) have a second spacing P2. The second spacing P2 is defined as the distance between the center point of the first light-emitting unit 200U3 and the center point of the second light-emitting unit 200R in the first direction (Y direction). Alternatively, the second spacing P2 is defined as the distance between the left edge of the first light-emitting unit 200U3 and the left edge of the second light-emitting unit 200R in the first direction (Y direction). In some embodiments, the first spacing P1 and the second spacing P2 may be different, for example. In some embodiments, the difference between the first spacing P1 and the second spacing P2 may range from approximately 0.1 μm to 20 μm. In some embodiments, the difference between the first spacing P1 and the second spacing P2 may range from approximately 1 μm to 20 μm, but the present invention is not limited thereto.

[0096] Furthermore, in some embodiments, a first light-emitting unit 200U (labeled as 200U) 1)A third spacing P3 exists between a first light-emitting unit 200U (denoted as 200U3) and another first light-emitting unit 200U1 adjacent to it along the second direction (X direction). The third spacing P3 is the distance in the second direction (X direction) between the center point of the first light-emitting unit 200U1 and the center point of the first light-emitting unit 200U3, or alternatively, the third spacing P3 is defined as the distance in the second direction (X direction) between the upper edges of the first light-emitting unit 200U1 and the upper edges of the first light-emitting unit 200U3. In some embodiments, a fourth spacing P4 exists between a first light-emitting unit 200U (denoted as 200U2) and a second light-emitting unit 200R adjacent to it along the second direction. The fourth spacing P4 is defined as the distance in the second direction (X direction) between the center point of the first light-emitting unit 200U2 and the center point of the second light-emitting unit 200R, or alternatively, the fourth spacing P4 is defined as the distance in the second direction (X direction) between the upper edges of the first light-emitting unit 200U2 and the upper edges of the second light-emitting unit 200R. In some embodiments, the third spacing P3 and the fourth spacing P4 may be different, for example. In some embodiments, the difference between the third spacing P3 and the fourth spacing P4 may, for example, be between about 0.1 μm and 20 μm or between 1 μm and 20 μm.

[0097] At Figure 5 In the illustrated embodiment, the comparison between the first spacing P1 and the second spacing P2, or the third spacing P3 and the fourth spacing P4, requires selecting the first light-emitting unit 200U (including the first light-emitting units 200U1 to 200U3) and the second light-emitting unit 200R. These units may, for example, emit light of the same color, such as blue light, but the invention is not limited thereto. In some embodiments, the first light-emitting unit 200U (including the first light-emitting units 200U1 to 200U3) and the second light-emitting unit 200R may, for example, emit red light or green light. In some embodiments, the first light-emitting unit 200U (including the first light-emitting units 200U1 to 200U3) or the second light-emitting unit 200R emits blue light, for example. A wavelength conversion layer (e.g., quantum dot or organic fluorescent material, but the invention is not limited thereto) is additionally disposed above the first light-emitting unit 200U (including the first light-emitting units 200U1 to 200U3) or the second light-emitting unit 200R. The blue light is excited through the wavelength conversion layer to generate light of other colors, such as red light or green light, but the invention is not limited thereto.

[0098] Next, please refer to Figure 6 According to some embodiments of the present invention, a top view (top view in the XY plane) of the electronic device 100D is shown. Figure 6In the illustrated embodiment, the first light-emitting unit 200U and the second light-emitting unit 200R of the electronic device 100D may, for example, emit light of different colors. For instance, some of the first light-emitting units 200U or the second light-emitting units 200R may emit red light, some may emit green light, and some may emit blue light. The first light-emitting units 200U or the second light-emitting units 200R depicted with the same dots in the illustration may, for example, have the same color.

[0099] Similarly, in this embodiment, a first light-emitting unit 200U (labeled 200U1) and another first light-emitting unit 200U (labeled 200U2) adjacent thereto along the first direction have a first spacing P1. In some embodiments, a first light-emitting unit 200U (labeled 200U3) and a second light-emitting unit 200R adjacent thereto along the first direction have a second spacing P2. In some embodiments, the first spacing P1 and the second spacing P2 may be different, for example. In some embodiments, the difference between the first spacing P1 and the second spacing P2 may range from, for example, 0.1 μm to about 20 μm or from about 1 μm to about 20 μm.

[0100] Furthermore, in some embodiments, a first light-emitting unit 200U and (marked as 200U1) and its adjacent first light-emitting unit 200U (marked as 200) along the second direction. U3 A third spacing P3 exists between the first light-emitting unit 200U (denoted as 200U2) and a second light-emitting unit 200R adjacent thereto along the second direction. In some embodiments, the third spacing P3 and the fourth spacing P4 may be different, for example. In some embodiments, the difference between the third spacing P3 and the fourth spacing P4 may range, for example, from about 0.1 μm to 20 μm or from 1 μm to 20 μm.

[0101] Next, please refer to Figure 7 , Figure 7 This diagram shows a top view (viewed in the XY plane) of an electronic device 100E according to some embodiments of the present invention. Figure 7 The illustrated embodiments and Figure 5 The embodiments shown are similar, except that... Figure 7 The electronic device 100E in the text is a modular electronic device. For example... Figure 7 As shown, the first light-emitting unit 200U and the second light-emitting unit 200R are disposed on adjacent but different third substrates 402.

[0102] In summary, the manufacturing method for electronic devices provided in some embodiments of the present invention can replace (or repair) light-emitting units in batches. Specifically, the method can replace multiple light-emitting units simultaneously and can be applied to light-emitting units of various sizes, for example, without being limited by the size of the light-emitting units. The manufacturing method helps to improve the replacement efficiency or yield of light-emitting units in micro LED devices.

[0103] While the embodiments and advantages of the present invention have been described above, it should be understood that any person skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Any process, machine, manufacturing, material composition, apparatus, method, and step developed in the present invention can be understood from the disclosure of the present invention, and can be used according to the present invention as long as it can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of various claims and embodiments. The scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized by comprising: The display device comprises: a substrate; a plurality of conductive pads disposed on the substrate; an adhesive layer disposed on the substrate and having a plurality of conductive particles arranged in a pattern, wherein the plurality of conductive particles correspond to the arrangement of the plurality of conductive pads, and a distance between an area where the plurality of conductive particles are disposed and an outer edge of at least one of the plurality of conductive pads is between 0 μm and 30 μm; and a first diode unit, a second diode unit, a third diode unit, and a fourth diode unit disposed on the substrate and electrically connected to the plurality of conductive pads and the plurality of conductive particles respectively; wherein the second diode unit is adjacent to the first diode unit along a first direction, the fourth diode unit is adjacent to the third diode unit along the first direction, the third diode unit is adjacent to the first diode unit along a second direction perpendicular to the first direction, and the fourth diode unit is adjacent to the second diode unit along the second direction, wherein a first spacing between the first diode unit and the second diode unit is different from a second spacing between the third diode unit and the fourth diode unit, wherein the adhesive layer has a first height, the first diode unit has a second height, and the second height is greater than the first height. 2.The electronic device of claim 1, wherein, wherein a third spacing between the first diode unit and the third diode unit is different from a fourth spacing between the second diode unit and the fourth diode unit. 3.The electronic device of claim 1, wherein, wherein a difference between the first spacing and the second spacing is between 0.1 μm and 20 μm. 4.The electronic device of claim 2, wherein, wherein a difference between the third spacing and the fourth spacing is between 0.1 μm and 20 μm.

5. An electronic device, comprising: The display device comprises: a substrate; a plurality of conductive pads disposed on the substrate; a first light emitting unit, a second light emitting unit, a third light emitting unit, and a fourth light emitting unit disposed on the substrate; and a plurality of conductive particles, wherein the first light emitting unit, the second light emitting unit, the third light emitting unit, and the fourth light emitting unit are electrically connected to the plurality of conductive pads and the plurality of conductive particles respectively, and a distance between an area where the plurality of conductive particles are disposed and an outer edge of at least one of the plurality of conductive pads is between 0 μm and 30 μm; wherein the second light emitting unit is adjacent to the first light emitting unit along a first direction, the fourth light emitting unit is adjacent to the third light emitting unit along the first direction, the third light emitting unit is adjacent to the first light emitting unit along a second direction perpendicular to the first direction, and the fourth light emitting unit is adjacent to the second light emitting unit along the second direction, wherein a first spacing between the first light emitting unit and the second light emitting unit is different from a second spacing between the third light emitting unit and the fourth light emitting unit. ​

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