Potting Substrate, Current Conversion Module and Current Conversion Device

Abstract

The present invention discloses a potting substrate, a current conversion module and a current conversion device. The potting substrate includes: a first fixing portion for fixing a circuit board assembly; a second fixing portion for fixing a chassis; a potting chamber for accommodating at least one heating device of the circuit board assembly and a potting adhesive having insulation and thermal conductivity; wherein, the potting substrate is a heat-conducting substrate. The above potting substrate enables the chassis to not need to be adapted to the circuit board assembly. The cooperation of the potting substrate and the circuit board assembly realizes modularization of the circuit board assembly, so that the circuit board assembly can be applicable to different chassis, effectively improving the adaptability of the circuit board assembly to the chassis, thereby improving the mobility of the circuit board assembly; at the same time, the above potting substrate can dissipate heat from the heating device of the circuit board assembly through the potting adhesive and itself, effectively improving the heat dissipation effect; the potting adhesive has a buffering effect, improving the anti-vibration ability.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply products, and more specifically, to a potting substrate, a current conversion module, and a current conversion device. Background Art

[0002] In the power supply products of new energy vehicles, the in-vehicle DC conversion device is one of the important devices. The in-vehicle DC conversion device mainly includes a chassis and a circuit board assembly disposed therein.

[0003] During the operation of the above-mentioned in-vehicle DC conversion device, the circuit board assembly generates a large amount of heat, and heat dissipation is required. Usually, a heat dissipation structure is provided on the chassis. Therefore, the circuit board assembly and the chassis need to be mutually adapted, that is, the circuit board assembly needs to be installed on a specific chassis, resulting in poor adaptability of the circuit board assembly to the chassis and poor mobility of the circuit board assembly.

[0004] In summary, how to improve the adaptability of the circuit board assembly to the chassis to improve the mobility of the circuit board assembly is an urgent problem to be solved by those skilled in the art at present. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a potting substrate to improve the adaptability of the circuit board assembly to the chassis so as to improve the mobility of the circuit board assembly. Another object of the present invention is to provide a current conversion module including the above potting substrate and a current conversion device including the above current conversion module.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A potting substrate includes:

[0008] A first fixing portion for fixing a circuit board assembly;

[0009] A second fixing portion for fixing a chassis;

[0010] A potting chamber for accommodating at least one heat-generating device of the circuit board assembly and a potting adhesive having insulation and thermal conductivity;

[0011] Wherein, the potting substrate is a heat-conducting substrate.

[0012] Optionally, the potting substrate further includes:

[0013] A heat dissipation boss for supporting at least one heat-generating device of the circuit board assembly and being thermally and insulatively connected to the heat-generating device.

[0014] Optionally, at least one insulating layer and at least one heat-conducting layer are sequentially provided on the heat dissipation boss, and the heat-conducting layer is used for heat-conductively connecting with the heat-generating device; wherein, the sum of the thicknesses of all the insulating layers and all the heat-conducting layers is not greater than 1 mm.

[0015] Optionally, the heat dissipation boss has at least one heat dissipation cavity for accommodating a cooling medium, the heat dissipation cavity is used for communicating with the cooling channel of the chassis, and the potting substrate further includes a sealing surface for sealingly connecting with the chassis.

[0016] Optionally, the inner side wall of the potting chamber of the potting chamber includes at least one side wall of at least one of the heat dissipation bosses.

[0017] Optionally, the potting substrate further includes reinforcing ribs, and the reinforcing ribs are located inside and / or outside the potting chamber.

[0018] Optionally, the first fixing portion includes: a first fixing hole and a positioning structure for positioning the circuit board assembly;

[0019] And / or, the second fixing portion includes a second fixing hole.

[0020] Optionally, the potting substrate is of an integral structure.

[0021] The potting substrate provided by the present invention accommodates at least one heat-generating device of the circuit board assembly and potting glue through the potting chamber. Since the potting glue has heat conductivity and the potting substrate is a heat-conducting substrate, the heat-generating device is dissipated by the potting glue and the potting substrate, which can meet the heat dissipation requirements of the circuit board assembly without setting a heat dissipation structure adapted to the circuit board assembly in the chassis; at the same time, the circuit board assembly is fixed through the first fixing portion, and the chassis is fixed through the second fixing portion, so that the circuit board assembly can be indirectly fixed on the chassis through the above potting substrate without the chassis and the circuit board assembly being adapted. Therefore, the above potting substrate enables the chassis to be not adapted to the circuit board assembly, and the cooperation of the potting substrate and the circuit board assembly realizes the modularization of the circuit board assembly, so that the circuit board assembly can be applicable to different chassis, effectively improving the adaptability of the circuit board assembly to the chassis, thereby improving the mobility of the circuit board assembly.

[0022] At the same time, the above potting substrate can dissipate heat from the heat-generating device of the circuit board assembly through the potting glue and itself, effectively improving the heat dissipation effect; the potting glue has a buffering effect, improving the anti-vibration ability.

[0023] Based on the above-provided potting substrate, the present invention further provides a current conversion module, and the current conversion module includes: a circuit board assembly having a current conversion function and the potting substrate according to any one of the above.

[0024] Among them, the circuit board assembly is used to be fixed on the first fixing part of the potting substrate.

[0025] Optionally, the circuit board assembly includes: a circuit board, and a heating device mounted on the circuit board; among them, at least one of the heating devices is a magnetic component, at least one of the heating devices is a power tube and the power tube is laid flat on the circuit board.

[0026] Optionally, the magnetic component is used to be distributed in the potting chamber.

[0027] Optionally, at least one of the heating devices is one or a combination of at least two of an inductor, a transformer, a capacitor and a power tube;

[0028] Among them, the inductor, the transformer and the capacitor are all used to be distributed in the potting chamber, and the power tube is used to be distributed outside the potting chamber.

[0029] Optionally, if the potting substrate includes a heat dissipation boss, the heat dissipation boss supports the power tube, and the heat dissipation boss is thermally connected and insulated from the power tube.

[0030] Optionally, the circuit board assembly is used to be buckled on the potting substrate.

[0031] Optionally, the circuit board of the circuit board assembly is provided with at least one glue injection hole;

[0032] And / or, the circuit board assembly includes: a circuit board, an input stacked busbar connected to the input end of the circuit board, and an output busbar connected to the output end of the circuit board, wherein the output busbar is provided with a stress relief hole;

[0033] And / or, the circuit board assembly is used to be detachably fixed on the first fixing part.

[0034] Optionally, the current conversion module is a vehicle-mounted DC conversion module.

[0035] Based on the above-provided current conversion module, the present invention also provides a current conversion device, which includes: a chassis, and the current conversion module according to any one of the above; among them, the chassis is fixed on the second fixing part of the potting substrate.

[0036] Optionally, if the chassis is provided with a cooling channel, the chassis is further provided with an inlet and an outlet both communicating with the cooling channel.

[0037] Optionally, the circuit board of the circuit board assembly is provided with an avoidance structure for fixedly connecting the potting substrate and the chassis;

[0038] And / or, the chassis is detachably fixed on the second fixing part. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0040] Figure 1 Structural schematic diagram of the potting substrate provided by the embodiment of the present invention;

[0041] Figure 2 is Figure 1 Top view of the structure shown;

[0042] Figure 3 Structural schematic diagram of the potting substrate provided by the embodiment of the present invention in another direction;

[0043] Figure 4 Structural schematic diagram of the current conversion module provided by the embodiment of the present invention;

[0044] Figure 5 is Figure 4 Structural schematic diagram of the circuit board assembly in;

[0045] Figure 6 is Figure 5 Structural schematic diagram of the power board assembly in;

[0046] Figure 7 is Figure 4 Structural schematic diagram of the structure shown after removing the power board;

[0047] Figure 8 Structural schematic diagram of the current conversion device provided by the embodiment of the present invention;

[0048] Figure 9 Assembly schematic diagram of the current conversion device provided by the embodiment of the present invention;

[0049] Figure 10 is Figure 8 Structural schematic diagram of the structure shown after removing the power board;

[0050] Figure 11 Structural schematic diagram of the chassis in the current conversion device provided by the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0051] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0052] As Figure 1 shown, the potting substrate provided in the embodiment of the present invention is a heat-conducting substrate. Specifically, the above potting substrate includes: a first fixing part 2.6, a second fixing part 2.11, and a potting chamber 2.10.

[0053] The above first fixing part 2.6 is used to fix the circuit board assembly 1; the above second fixing part 2.11 is used to fix the chassis 3; the above potting chamber 2.10 is used to accommodate at least one heat-generating device of the circuit board assembly 1 and a potting adhesive having insulation and heat conductivity.

[0054] It can be understood that the above potting adhesive is used to pot the above potting chamber 2.10 to fix the heat-generating device in the potting chamber 2.10. Since the above potting chamber 2.10 is used to accommodate at least one heat-generating device of the circuit board assembly 1, the above circuit board assembly 1 is inverted on the potting substrate.

[0055] For the type of the above potting adhesive, it is selected according to actual needs as long as the insulation and heat conductivity are ensured. For the material of the above potting substrate, it is also selected according to actual needs. For example, the potting substrate is an aluminum alloy plate, and this embodiment does not make any limitations in this regard.

[0056] The number and type of heat-generating devices that the above potting chamber 2.10 can accommodate are selected according to actual needs, and this embodiment does not make any limitations in this regard. Correspondingly, for the size and shape of the potting chamber 2.10, they are designed according to the heat dissipation requirements, and this embodiment also does not make any limitations in this regard.

[0057] For the potting substrate provided in the above embodiments, at least one heat-generating device of the circuit board assembly 1 and potting glue are accommodated in the potting bin 2.10. Since the potting glue has thermal conductivity and the potting substrate is a heat-conducting substrate, heat dissipation is performed on the heat-generating device through the potting glue and the potting substrate, which can meet the heat dissipation requirements of the circuit board assembly 1, and there is no need to provide a heat dissipation structure adapted to the circuit board assembly 1 in the chassis 3. At the same time, the circuit board assembly 1 is fixed by the first fixing portion 2.6, and the chassis 3 is fixed by the second fixing portion 2.11. Then, the circuit board assembly 1 can be indirectly fixed on the chassis 3 through the above potting substrate, and there is no need for the chassis 3 and the circuit board assembly 1 to be adapted. Therefore, the above potting substrate enables the chassis 3 not to be adapted to the circuit board assembly 1. The potting substrate and the circuit board assembly 1 cooperate to modularize the circuit board assembly 1, so that the circuit board assembly 1 can be applicable to different chassis 3, effectively improving the adaptability of the circuit board assembly 1 to the chassis 3, and thus improving the mobility of the circuit board assembly 1.

[0058] At the same time, for the potting substrate provided in the above embodiments, heat dissipation can be performed on the heat-generating device of the circuit board assembly 1 through the potting glue and itself, effectively improving the heat dissipation effect; the potting glue has a buffering effect, improving the anti-vibration ability.

[0059] In the circuit board assembly 1, the heights of the heat-generating devices are different. In order to facilitate heat dissipation of the heat-generating devices with lower heights, the above potting substrate further includes heat dissipation bosses, and the heat dissipation bosses are used to support at least one heat-generating device of the circuit board assembly 1 and are thermally connected and insulated from the heat-generating device. It can be understood that the heat-generating device with a lower height refers to the heat-generating device with a lower height on the circuit board.

[0060] Since the above heat dissipation bosses are thermally connected to the heat-generating devices, heat dissipation of the heat-generating devices can be effectively performed, improving the heat dissipation effect. Therefore, the heat-generating devices with relatively large heat generation amounts and lower heights can be selected and distributed on the heat dissipation bosses.

[0061] For the number, height and shape of the above heat dissipation bosses, they are selected according to actual needs. As Figure 1 and Figure 2 shown, there are four heat dissipation bosses, namely heat dissipation boss a2.2, heat dissipation boss b2.3, heat dissipation boss c2.4, and heat dissipation boss d2.5.

[0062] Each heat dissipation boss can support one or two heat-generating devices; the same heat-generating device can be distributed on only one heat dissipation boss or on different heat dissipation bosses, which is selected according to actual needs, and this embodiment does not make any limitations in this regard.

[0063] To facilitate the insulated and thermally conductive connection between the heat dissipation boss and the heat generating device, at least one insulating layer and at least one thermally conductive layer are sequentially provided on the heat dissipation boss, and the thermally conductive layer is used for thermally conductive connection with the heat generating device. It can be understood that the insulating layer is located between the heat dissipation boss and the thermally conductive layer.

[0064] For the type of the above-mentioned insulating layer, it is selected according to actual needs. For example, the insulating layer is an insulating film, and this embodiment does not limit this. For the type of the above-mentioned thermally conductive layer, it is also selected according to actual needs, and this embodiment does not limit this.

[0065] The thickness and number of layers of the above-mentioned insulating layer and thermally conductive layer need to be reasonably set and should not be too large, otherwise it will affect the heat dissipation effect. Optionally, the sum of the thicknesses of all insulating layers and all thermally conductive layers is not greater than 1 mm. To facilitate the control of the sum of the thicknesses of all insulating layers and all thermally conductive layers, the height difference between the fixing surface of the first fixing portion 2.6 and the heat dissipation boss can be limited. It can be understood that the fixing surface of the first fixing portion 2.6 contacts the circuit board of the circuit board assembly 1.

[0066] In the above-mentioned embodiment, to further improve the heat dissipation effect, the heat dissipation boss has at least one heat dissipation cavity for accommodating a cooling medium, and the heat dissipation cavity is used for communicating with the cooling channel 3.3 of the chassis 3, and the potting substrate further includes a sealing surface 2.9 for sealing connection with the chassis 3.

[0067] It should be noted that the cooling medium flows through the cooling channel 3.3, and the cooling medium can be a liquid medium such as water or a gas medium such as air, and this is not limited in this article. If the chassis 3 has a cooling channel 3.3, the sealing surface 2.9 of the potting substrate is fitted and installed with the sealing groove surface of the chassis 3 to play a sealing role. The area where the sealing surface 2.9 cooperates with the chassis 3 is a plane with a relatively high flatness, and no other convex structures are allowed on this plane to facilitate ensuring the seal. Of course, the sealing surface 2.9 can also be selected as other structures, and this embodiment does not limit this. If the above-mentioned chassis 3 has no cooling channel 3.3, the potting substrate does not need to be sealed with the chassis 3.

[0068] The above-mentioned heat dissipation boss can have one heat dissipation cavity or more than two heat dissipation cavities, which is selected according to actual needs, and this embodiment does not limit this.

[0069] Specifically, as Figure 1 and Figure 2 shown, the four heat dissipation bosses are respectively the heat dissipation boss a2.2, the heat dissipation boss b2.3, the heat dissipation boss c2.4, and the heat dissipation boss d2.5; as Figures 1-3As shown, the heat dissipation boss a2.2 has a heat dissipation cavity 1a2.2.1 and a heat dissipation cavity 2a2.2.2, the heat dissipation boss b2.3 has a heat dissipation cavity b2.3.1, the heat dissipation boss c2.4 has a heat dissipation cavity c2.4.1, and the heat dissipation boss d2.5 has a heat dissipation cavity d2.5.1. Among them, the sizes of the heat dissipation cavity 1a2.2.1 and the heat dissipation cavity 2a2.2.2 can be the same or different. For example, the heat dissipation cavity 1a2.2.1 is larger than the heat dissipation cavity 2a2.2.2, which is selected according to actual needs, and this embodiment does not limit this.

[0070] It can be understood that the heat dissipation cavity 1a2.2.1, the heat dissipation cavity 2a2.2.2, the heat dissipation cavity b2.3.1, the heat dissipation cavity c2.4.1, and the heat dissipation cavity d2.5.1 are collectively referred to as the heat dissipation cavity.

[0071] In the above structure, by setting the heat dissipation cavity, the heat dissipation of the cooling medium to the heat dissipation boss and the heat generating device is strengthened, and the heat dissipation effect is improved.

[0072] For the convenience of production and manufacturing, it is possible to select the above potting substrate to protrude to one side to form a heat dissipation boss with a heat dissipation cavity.

[0073] In practical applications, the heat dissipation effect can also be improved by other means. Specifically, the inner side wall 2.1 of the potting chamber 2.10 of the above includes at least one side wall of at least one heat dissipation boss. It can be understood that one side wall can be an entire side wall or a part of a side wall.

[0074] Such as Figure 1 and Figure 2 As shown, the inner side wall 2.1 of the potting chamber includes: one side wall of the heat dissipation boss a2.2, a part of one side wall of the heat dissipation boss b2.3, two side walls of the heat dissipation boss c2.4, and two side walls of the heat dissipation boss d2.5.

[0075] In the above structure, the heat transfer efficiency between the potting glue and the heat dissipation boss is improved, and the heat dissipation effect is improved.

[0076] In practical applications, it is also possible to select that the inner side wall 2.1 of the above potting chamber does not include the side wall of the heat dissipation boss, and it is not limited to the above embodiment.

[0077] To improve the support strength of the potting substrate, the above potting substrate further includes a reinforcing rib. Specifically, the reinforcing rib is located inside and / or outside the potting chamber 2.10.

[0078] Such as Figure 1 and Figure 2As shown, the above-mentioned reinforcing ribs include a first reinforcing rib 2.12, which is located within the potting chamber 2.10. The distance between the first reinforcing rib 2.12 and the heating device meets the safety distance requirements. It can be understood that in order to facilitate meeting the safety distance requirements, the height of the heating device opposite to the first reinforcing rib 2.12 is relatively small, thus meeting the safety distance requirements. The height of the above-mentioned heating device is the height of the heating device on the circuit board.

[0079] As Figure 1 and Figure 2 shown, the above-mentioned reinforcing ribs include a second reinforcing rib 2.13, which is located outside the potting chamber 2.10. It can be understood that the first reinforcing rib 2.12 and the second reinforcing rib 2.13 are collectively referred to as reinforcing ribs.

[0080] For the specific positions, sizes, and shapes of the above-mentioned first reinforcing rib 2.12 and second reinforcing rib 2.13, they are selected according to actual needs, and this embodiment does not limit them.

[0081] For the above-mentioned potting substrate, by setting the reinforcing ribs, the overall strength and stiffness are effectively improved. If the above-mentioned chassis 3 has a cooling channel 3.3, the reinforcing ribs also improve the compressive stiffness of the potting substrate.

[0082] In the above-mentioned potting substrate, in order to facilitate the installation of the circuit board assembly 1, the first fixing portion 2.6 includes: a first fixing hole 2.6.1 and a positioning structure for positioning the circuit board assembly 1.

[0083] It should be noted that in order to ensure fixation, the above-mentioned circuit board assembly 1 is provided with a first mounting hole 1.1.18 corresponding to the first fixing hole 2.6.1. For the size, number, and distribution of the above-mentioned first fixing hole 2.6.1, they are selected according to actual needs, and this embodiment does not limit them.

[0084] In order to facilitate the setting of the first fixing hole 2.6.1, the above-mentioned first fixing portion 2.6 is a fixing post.

[0085] For the specific structure of the positioning structure, it is selected according to actual needs. For example, the above-mentioned positioning structure is a positioning pin, and the positioning pin can be one or more than two. As Figure 1 and Figure 2 shown, there are two positioning pins, namely positioning pin a 2.7 and positioning pin b 2.8. The above-mentioned positioning pin a 2.7 is located at one end of the potting substrate, and the positioning pin b 2.8 is located at the other end of the potting substrate to improve the positioning effect. It can be understood that as Figure 6 shown, the above-mentioned circuit board assembly 1 has: a positioning hole a 1.1.17 that cooperates with the positioning pin a 2.7 and a positioning hole b 1.1.15 that cooperates with the positioning pin b 2.8.

[0086] In practical applications, the above positioning pins can also be distributed in other ways, and the above positioning combination can also be selected as others. This embodiment does not limit this.

[0087] In the above potting substrate, in order to facilitate the installation of the chassis 3, the second fixing portion 2.11 includes a second fixing hole 2.11.1.

[0088] It can be understood that in order to ensure fixation, as Figure 11 shown, the above chassis 3 is provided with a second mounting hole 3.5 corresponding to the second fixing hole 2.11.1. For the size, number and distribution of the above second fixing holes 2.11.1, they are selected according to actual needs. This embodiment does not limit this.

[0089] In order to facilitate the setting of the second fixing hole 2.11.1, the second fixing portion 2.11 is a fixing plate.

[0090] In the above potting substrate, in order to facilitate the arrangement of the circuit board assembly 1 and the chassis 3, the fixing surface of the first fixing portion 2.6 for fixing the circuit board assembly 1 can be selected to be located at one end of the potting substrate and close to the top end of the potting chamber 2.10, and the fixing surface of the second fixing portion 2.11 for fixing the chassis 3 is located at the other end of the potting substrate and close to the bottom end of the potting chamber 2.10.

[0091] The above potting substrate can be an integral structure or a split structure. In order to facilitate manufacturing and simplify installation, the above potting substrate can be selected to be an integral structure.

[0092] The potting substrate provided in this embodiment has four functions: support and fixation, accommodation, heat conduction, and sealing. For support and fixation, first, the positioning structure provides guidance for the installation process of the circuit board assembly 1; second, the first fixing portion 2.6 can provide support and fixation for the circuit board assembly 1; finally, the heat dissipation boss can provide support for the insulating layer, heat conduction layer and circuit board assembly 1. For accommodation, first, the potting chamber 2.10 surrounds at least one heat-generating device on the circuit board assembly 1 with as small a planar area as possible, and then potting glue is injected into the surrounded area, serving as a role of accommodating the potting glue; second, the potting chamber 2.10 serves as a role of accommodating the heat-generating device; finally, the heat dissipation boss has a heat dissipation cavity to accommodate the cooling medium, enhancing the heat dissipation ability of the heat dissipation boss. For heat conduction, first, the potting substrate 2 has a heat conduction function; second, the potting glue in the potting chamber 2.10 has insulating and heat conduction functions; finally, the heat dissipation boss and the heat conduction layer thereon also have heat conduction functions. For sealing, the chassis 3 has a cooling channel 3.3, and the potting substrate 2 is hermetically connected to the chassis 3 to ensure that the cooling medium in the chassis 3 cools the potting substrate 2.

[0093] The function of the circuit board assembly 1 applicable to the above potting substrate is selected according to actual needs. For example, the circuit board assembly 1 has a current conversion function or other functions, etc., which is not limited in this embodiment.

[0094] Based on the potting substrate provided in the above embodiment, this embodiment also provides a current conversion module, as Figure 4 shown. The current conversion module includes: a circuit board assembly 1 with a current conversion function and the potting substrate 2 provided in the above embodiment. Among them, the above circuit board assembly 1 is used to be fixed on the first fixing portion 2.6 of the potting substrate 2.

[0095] Since the potting substrate provided in the above embodiment has the above technical effects, and the above current conversion module includes the above potting substrate, the above current conversion module also has corresponding technical effects, which will not be elaborated herein.

[0096] For the type of the above circuit board assembly 1, it is selected according to actual needs. Specifically, the above circuit board assembly 1 includes: a circuit board, and a heating device installed on the circuit board. In order to facilitate the setting of the heating device, it can be selected that the heating device is welded to the circuit board. Of course, the heating device can be installed on the circuit board by other means, which is not limited in this embodiment.

[0097] For the specific type and number of the heating devices, they are designed according to the function of the circuit board assembly 1, which is not limited in this embodiment.

[0098] Optionally, among the heating devices on the circuit board, at least one heating device is a magnetic component, and at least one heating device is a power tube and the power tube is laid flat on the circuit board. It can be understood that the power tube is a MOS tube. The Chinese abbreviation of MOS tube is metal-oxide-semiconductor field-effect transistor, and the English full spelling of MOS is Metal-Oxide-Semiconductor Field-Effect Transistor.

[0099] The above structure, compared with the existing flat structure, installs the power tube and the magnetic component on the circuit board uniformly, realizing small volume and modularization, and is convenient to make into a platform product for other projects to migrate and use.

[0100] In actual application, it can also be selected that the above power tube is installed on the circuit board by other means, not limited to the flat laying method.

[0101] In order to facilitate the heat dissipation of the magnetic component, it can be selected that the above magnetic component is used to be distributed in the potting chamber 2.10. The above magnetic component can be an inductor, a transformer 1.1.6, etc., which is not limited in this embodiment.

[0102] During the conversion process, the above-mentioned current conversion module generates a large amount of heat, which is mainly generated by magnetic components such as inductors and transformer 1.1.6, capacitors, and power transistors. To improve the heat dissipation effect, at least one of the heat-generating devices can be selected as one or a combination of at least two of the inductor, transformer 1.1.6, capacitor, and power transistor.

[0103] It can be understood that any one of the inductor, transformer 1.1.6, capacitor, and power transistor can be one or more than two, and it is selected according to actual needs. This embodiment does not make any limitations in this regard.

[0104] To reduce the use of potting glue and thus reduce the potting cost, only several heat-generating devices can be selected to be distributed in the potting chamber 2.10. Specifically, the above-mentioned inductor, transformer 1.1.6, and capacitor are all used to be distributed in the potting chamber 2.10, and the power transistor is used to be distributed outside the potting chamber 2.10.

[0105] Furthermore, if the above-mentioned potting substrate 2 includes heat dissipation bosses, select the heat dissipation bosses to support the power transistor, and the heat dissipation bosses are thermally and insulatively connected to the power transistor.

[0106] In the above structure, the inductor, capacitor, and transformer 1.1.6 can be cooled through the potting glue and the potting substrate 2, and the power transistor can be cooled through the potting substrate and its heat dissipation bosses, improving the heat dissipation effect.

[0107] As Figure 7 and Figure 10 shown, there are three inductors, namely inductor a1.1.1, inductor b1.1.3, and inductor c1.1.5; there is one transformer 1.1.6; there are three capacitors, namely capacitor a1.1.2, capacitor b1.1.4, and capacitor c1.1.7; there are four power transistors, namely power transistor a1.1.8, power transistor b1.1.9, power transistor c1.1.10, and power transistor d1.1.11. The above-mentioned inductor a1.1.1, inductor b1.1.3, inductor c1.1.5, transformer 1.1.6, capacitor a1.1.2, capacitor b1.1.4, and capacitor c1.1.7 are all located in the potting chamber 2.10, power transistor a1.1.8 is located on heat dissipation boss a2.2, power transistor b1.1.9 is located on heat dissipation boss b2.3, power transistor c1.1.10 is located on heat dissipation boss c2.4, and power transistor d1.1.11 is located on heat dissipation boss d2.5.

[0108] Regarding the connection relationships between the above-mentioned inductor, capacitor, transformer 1.1.6, and power transistor, they are technologies well-known to those skilled in the art, and will not be elaborated herein.

[0109] In practical applications, other methods can also be used to arrange the above-mentioned inductor, transformer 1.1.6, capacitor, and power transistor, and it is not limited to the above limitations.

[0110] In the above-mentioned current conversion module, the circuit board assembly 1 can be reversely buckled on the potting substrate 2 or can be installed upright on the potting substrate 2. If the entire circuit board assembly 1 is potted, the circuit board assembly 1 can be selected to be reversely buckled or installed upright on the potting substrate 2; if only a part of the circuit board assembly 1 is potted, only the circuit board assembly 1 can be selected to be reversely buckled on the potting substrate 2. In order to improve flexibility, the circuit board assembly 1 can be selected to be reversely buckled on the potting substrate 2. In this way, it is possible to select to perform full potting or partial potting on the circuit board assembly 1 according to needs.

[0111] It can be understood that the circuit board assembly 1 is used to be reversely buckled on the potting substrate 2, which means that the front side of the circuit board of the circuit board assembly 1 faces the potting chamber 2.10; the circuit board assembly 1 is used to be installed upright on the potting substrate 2, which means that the back side of the circuit board of the circuit board assembly 1 faces the potting chamber 2.10.

[0112] In the above-mentioned current conversion module, during the installation process, potting glue needs to be injected into the potting chamber 2.10. In order to facilitate potting, at least one glue injection hole is provided on the circuit board of the above-mentioned circuit board assembly 1.

[0113] In order to improve the potting efficiency and potting effect, it is preferable that the number of glue injection holes is at least two and they are distributed in sequence along the length direction of the potting chamber 2.10.

[0114] Specifically, as Figure 6 shown, the above-mentioned glue injection holes are three, namely glue injection hole a1.1.12, glue injection hole b1.1.13, and glue injection hole c1.1.14. Among them, the glue injection hole a1.1.12, the glue injection hole b1.1.13, and the glue injection hole c1.1.14 are distributed in sequence along the length direction of the potting chamber 2.10 to improve the potting efficiency and potting effect.

[0115] In practical applications, the number of glue injection holes can also be selected to be other numbers and distributed in other ways, not limited to the above embodiments.

[0116] The above-mentioned circuit board assembly 1 further includes an input component and an output component. The input component is connected to the input end of the circuit board, and the output component is connected to the output end of the circuit board. The above-mentioned input component and output component can be wires or others. In order to simplify installation and facilitate assembly, as Figure 4 and Figure 5 shown, the above-mentioned input component can be selected as the input laminated busbar 1.3.

[0117] Specifically, the pins of the above-mentioned input laminated busbar 1.3 are connected to the input devices on the circuit board assembly 1. Specifically, the pins of the input laminated busbar 1.3 and the input devices are subjected to wave soldering together. In this way, by using the input laminated busbar 1.3 instead of wires, the manual hole alignment and screw driving processes of traditional wires are omitted, and the input laminated busbar 1.3 has a smaller volume and smaller stray inductance.

[0118] It should be noted that the above input device is a heating device. For the type of the input device, it is selected according to actual needs, and this embodiment does not limit it.

[0119] Correspondingly, as Figure 4 and Figure 5 shown, the above output part is the output busbar 1.4. Optionally, as Figure 5 shown, the above output busbar 1.4 is provided with stress relief holes 1.4.1. In this way, the stress relief holes 1.4.1 increase the flexibility of the output busbar 1.4, making the output busbar 1.4 more easily deformed during the process of being tightened by screws, reducing the internal stress of the output busbar 1.4 and the acting force on the circuit board assembly 1, prolonging the service life of the output busbar 1.4 itself and the circuit board assembly 1, and also improving the vibration resistance ability.

[0120] For the specific structure of the above stress relief holes 1.4.1, it is selected according to actual needs. Specifically, the above stress relief holes 1.4.1 are strip-shaped holes. For example, the above stress relief holes 1.4.1 are waistline holes, etc., and this embodiment does not limit it.

[0121] For the number and distribution of the above stress relief holes 1.4.1, it is selected according to actual needs. In order to improve the stress relief effect, it can be selected that the above stress relief holes 1.4.1 are at least two.

[0122] In order to facilitate the maintenance of the circuit board assembly 1, the above circuit board assembly 1 is used to be detachably fixed to the first fixing part 2.6. Specifically, the circuit board assembly 1 is used to be detachably fixed to the first fixing part 2.6 through the first fastener 4. The above first fastener 4 can be a screw, and the first fixing part 2.6 is provided with a first fixing hole 2.6.1 for the screw to pass through, and the first fixing hole 2.6.1 is a threaded hole.

[0123] For the type of the above current conversion module, it is selected according to actual needs. Specifically, the above current conversion module is a DC conversion module. This DC conversion module has the function of converting high-voltage small-current direct current into low-voltage large-current direct current. The specific process is as follows: The high-voltage small-current direct current is input through the input laminated busbar 1.3, and after power conversion, it can be converted into low-voltage large-current direct current, and this direct current is output through the output copper bar 1.4.

[0124] Optionally, the above current conversion module is a vehicle-mounted DC conversion module. Of course, it can also be selected that the above current conversion module is applied to a photovoltaic power generation system, a wind power generation system, etc., and is not limited to new energy vehicles.

[0125] In the above current conversion module, the specific structure of the circuit board assembly 1 is selected according to actual needs. Specifically, the above circuit board assembly 1 includes: a power board assembly 1.1 for converting electrical energy and a control board assembly 1.2 for controlling the conversion. Among them, the control board assembly 1.2 is fixed to the power board assembly 1.1, and the power board assembly 1.1 is used to be fixed to the first fixing portion 2.6 of the potting substrate 2. The above circuit board assembly 1 includes: a power board 1.1.19 and a heating device mounted on the power board 1.1.19. At this time, the circuit board is the power board 1.1.19, and the potting chamber 2.10 is used to accommodate at least one heating device on the power board 1.1.19.

[0126] As Figure 6 shown, the previously mentioned first mounting holes 1.1.18, positioning holes a 1.1.17, positioning holes b 1.1.15, glue injection holes a 1.1.12, glue injection holes b 1.1.13, and glue injection holes c 1.1.14 are all provided on the power board 1.1.19 of the power board assembly 1.1.

[0127] In practical applications, the above circuit board assembly 1 can also be selected as other structures, not limited to the above embodiments.

[0128] Based on the current conversion module provided in the above embodiments, this embodiment also provides a current conversion device. As Figure 8 shown, the current conversion device includes: a chassis 3 and the current conversion module described in the above embodiments. Among them, the chassis 3 is fixed to the second fixing portion 2.11 of the potting substrate 2.

[0129] Since the current conversion module provided in the above embodiments has the above technical effects, and the above current conversion device includes the above current conversion module, the above current conversion device also has corresponding technical effects, which will not be elaborated herein.

[0130] For the type of the above chassis 3 and the application scenarios, they are selected according to actual needs, and this embodiment does not make any limitations.

[0131] The above chassis 3 can be a cooling chassis, that is, the chassis 3 has a cooling channel 3.3; the above chassis 3 can also be a non-cooling chassis, that is, the chassis 3 does not have a cooling channel 3.3. In order to improve the heat dissipation effect, the above chassis 3 can be selected to have a cooling channel 3.3. In this way, the entire current conversion device exchanges heat through the cooling medium in the potting substrate 2 and the chassis 3 to achieve heat dissipation and improve the heat dissipation effect.

[0132] As Figure 11As shown, if the chassis 3 is provided with a cooling channel 3.3, in order to improve the heat dissipation effect, the chassis 3 is also provided with an inlet 3.1 and an outlet 3.2 that are both connected to the cooling channel 3.3. In this way, the cooling medium enters the cooling channel 3.3 from the inlet 3.1, and the cooling medium flowing through the cooling channel 3.3 is discharged through the outlet 3.2, improving the fluidity of the cooling medium and thus enhancing the heat dissipation effect.

[0133] Furthermore, a flow dividing plate 3.4 is provided inside the above-mentioned cooling channel 3.3 to achieve the flow division of the cooling medium, accelerate the flow of the cooling medium, improve the distribution uniformity of the cooling medium, and thus enhance the uniformity of heat dissipation.

[0134] The above-mentioned inlet 3.1 and outlet 3.2 can be located at the same end of the chassis 3 or at different ends of the chassis 3, which is selected according to actual needs, and this embodiment does not make any limitations in this regard.

[0135] For the convenience of maintenance and repair, the above-mentioned chassis 3 is detachably fixed to the second fixing part 2.11. Specifically, the chassis 3 is detachably fixed to the second fixing part 2.11 through a second fastener 5. The above-mentioned second fastener 5 can be a screw, and the second fixing part 2.11 is provided with a second fixing hole 2.11.1, and the second fixing hole 2.11.1 is a threaded hole.

[0136] In the above-mentioned current conversion device, there are mainly two installation methods for the circuit board assembly 1, the potting substrate 2, and the chassis 3. As Figure 9 shown, the first one is: first assemble the circuit board assembly 1 and the potting substrate 2 together to form a current conversion module, and then assemble the current conversion module and the chassis 3 together; the second one is: first assemble the potting substrate 2 and the chassis 3 together, and then fix the circuit board assembly 1 on the potting substrate 2.

[0137] Taking the first one as an example below, a specific description is given. The assembly process of the above-mentioned current conversion device is: first, the circuit board assembly 1 is reversely assembled onto the potting substrate 2, and then the circuit board assembly 1 and the potting substrate 2 are assembled onto the chassis 3 as a component. The specific process is as follows: coat an insulating layer on the surface of the heat dissipation boss on the potting substrate 2 (this can also be completed during the production of the potting substrate 2), coat a heat-conducting layer on the insulating layer (this can also be completed during the production of the potting substrate 2); then reversely assemble the circuit board assembly 1 onto the potting substrate 2, and use a first fastener 4 to lock the circuit board assembly 1 and the potting substrate 2 (the first fastener 4 is finally locked in the first fixing hole 2.6.1 of the first fixing part 2.6); inject potting glue through a glue injection hole with equipment such as a glue gun; heat and cure the potting glue; and assemble the circuit board assembly 1 and the potting substrate 2 onto the chassis 3 as a component.

[0138] During the above installation process, during the installation of the potting substrate 2 and the chassis 3, it is relatively easy for the fastening of the second fastener 5 to be interfered by the circuit board of the circuit board assembly 1. At this time, the potting substrate 2 and the chassis 3 can be enlarged to avoid interference from the circuit board. However, this will result in a larger volume and higher cost of the entire device. To avoid interference and avoid increasing the volume and cost, as Figure 6 shown, the above circuit board can be selected to be provided with an avoidance structure 1.1.16 for fixedly connecting the potting substrate 2 and the chassis 3. In this way, it is also convenient to make the circuit board assembly 1 and the potting substrate 2 into an integrated module for convenient migration and use.

[0139] For the specific structure of the avoidance structure 1.1.16, it is selected according to actual needs. For example, the above avoidance structure 1.1.16 is an avoidance groove located at the edge of the circuit board, and this embodiment does not limit this.

[0140] It can be understood that when the above circuit board is the power board 1.1.19, the avoidance structure 1.1.16 is provided on the power board 1.1.19.

[0141] For the second installation method, reference can be made to the first installation method, and details are not described herein again.

[0142] The current conversion device provided in this embodiment adopts a circuit board assembly 1 with an integrated magnetic component, an inverted installation of the circuit board assembly 1, and a flat layout of power tubes in the circuit board assembly 1. Among them, by installing the magnetic component on the circuit board of the circuit board assembly 1 and then installing the circuit board assembly 1 upside down on the potting substrate 2, current conversion modularization is achieved.

[0143] The current conversion device provided in this embodiment, compared with the existing flat layout structure, installs the power tubes and magnetic components on the circuit board uniformly, achieving small volume and modularization, and being convenient to be made into a platform product for migration and use in other projects; moreover, the unique potting substrate 2 and potting measures enable both the magnetic component and the power tube to achieve good heat dissipation; by setting the input stacked busbar 1.3 and the output busbar 1.4, a wire-free setting is achieved, simplifying the assembly.

[0144] The current conversion device provided in this embodiment has better processability, lower cost, smaller height dimension, and modularization advantages compared with the existing vertical structure.

[0145] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A current conversion device, characterized in that, Comprising: A chassis and a current conversion module; Wherein, the current conversion module includes: a circuit board assembly with current conversion function, and a potting substrate; The potting substrate includes: a first fixing part for fixing the circuit board assembly; a second fixing part for fixing the chassis; a potting chamber for accommodating at least one heat generating device of the circuit board assembly and a potting compound with insulation and thermal conductivity; a heat dissipation boss for supporting at least one heat generating device of the circuit board assembly and being thermally and insulatingly connected to the heat generating device; The potting substrate is a heat conducting substrate; the potting substrate is located between the chassis and the circuit board assembly, and the chassis is provided with: a cooling channel, and an inlet and an outlet both communicating with the cooling channel, the cooling channel is used for the circulation of a liquid cooling medium, the heat dissipation boss has at least one heat dissipation cavity for accommodating the liquid cooling medium, the heat dissipation cavity communicates with the cooling channel, and the potting substrate further includes a sealing surface for sealing connection with the chassis.

2. The current conversion device according to claim 1, characterized in that The heat dissipation boss is sequentially provided with at least one insulating layer and at least one heat conducting layer, and the heat conducting layer is thermally connected to the heat generating device; wherein, the sum of the thicknesses of all the insulating layers and all the heat conducting layers is not greater than 1 mm.

3. The current conversion device according to claim 1, characterized in that, The inner side wall of the potting chamber of the potting chamber includes at least one side wall of at least one heat dissipation boss.

4. The current conversion device according to claim 1, characterized in that It further includes a reinforcing rib, and the reinforcing rib is located inside and / or outside the potting chamber.

5. The current conversion device according to claim 1, characterized in that The first fixing part includes: a first fixing hole, and a positioning structure for positioning the circuit board assembly; And / or, the second fixing part includes a second fixing hole.

6. The current conversion device according to any one of claims 1-5, characterized in that The potting substrate is of an integral structure.

7. The current conversion module according to any one of claims 1-5, characterized in that, The circuit board assembly includes: a circuit board, and heat generating devices mounted on the circuit board; wherein, at least one of the heat generating devices is a magnetic component, and at least one of the heat generating devices is a power tube and the power tube is laid flat on the circuit board.

8. The current conversion device according to claim 7, wherein The magnetic components are distributed in the potting chamber.

9. The current conversion device according to claim 7, characterized in that, At least one of the heat generating devices is one or a combination of at least two of an inductor, a transformer, a capacitor and a power tube; wherein, the inductor, the transformer and the capacitor are all distributed in the potting chamber, and the power tube is distributed outside the potting chamber.

10. The current conversion device according to claim 9, characterized in that, If the potting substrate includes a heat dissipation boss, the heat dissipation boss supports the power tube, and the heat dissipation boss is thermally and insulatingly connected to the power tube.

11. The current conversion device according to claim 10, characterized in that, The circuit board assembly is buckled on the potting substrate.

12. The current conversion device according to claim 10, characterized in that The circuit board of the circuit board assembly is provided with at least one glue injection hole; And / or, the circuit board assembly includes: a circuit board, an input stacked busbar connected to the input end of the circuit board, and an output busbar connected to the output end of the circuit board, wherein, the output busbar is provided with a stress relief hole; And / or, the circuit board assembly is detachably fixed to the first fixing part.

13. The current conversion device according to claim 10, characterized in that, The current conversion module is a vehicle-mounted DC conversion module.

14. The current conversion device according to any one of claims 1-5, characterized in that the circuit board of the circuit board assembly is provided with an avoidance structure for fixedly connecting the potting substrate and the chassis; and / or, the chassis is detachably fixed to the second fixing portion.

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